Semiconductor device and shaft adjustment method

Abstract

The present invention provides a semiconductor device including a base for placing a wafer, a shaft connected to the base, and a detection member disposed at the end of the shaft for detecting an external force acting on the shaft due to deviation from the center line, and a method for adjusting the shaft. The semiconductor device provided by the present invention is provided with a detection member that can detect an external force acting on the shaft when it deviates from the center line, thereby providing convenience when adjusting the position of the shaft.

Description

[Technical Field]

[0001] The present invention relates to the field of semiconductor equipment, and in particular to a sensing element for the shaft of a semiconductor equipment. [Background technology]

[0002] In the semiconductor industry, semiconductor process results are closely related to the process gas flow conditions within the process chamber of semiconductor equipment. Take epitaxial growth processes as an example. When a wafer is placed on a base in an epitaxial growth chamber, process gases related to the epitaxial layer to be grown must be passed through the chamber, and the corresponding epitaxial layer must be grown on the wafer's surface under a specific temperature and pressure environment. To improve wafer quality and utilization, the epitaxial layer grown on the wafer's surface must achieve maximum uniformity. However, one of the issues with uniformity is irregular eccentricity in the thickness of the epitaxial layer on the wafer's surface. This eccentricity occurs because the axis connected to the base is offset from the center of the chamber. During the base rotation process, the gap between the preheat ring and the base changes randomly, causing unstable process gas flow fields and further affecting film deposition uniformity.

[0003] Therefore, in the prior art, engineers use an adjustment device to move the axis of the semiconductor equipment to align with the center of the chamber, but in the prior art, there are the following problems when using the adjustment device:

[0004] In the prior art, during the process of using the adjustment device, the technician determines whether the axis has reached the desired position by observation alone, which inevitably leads to an over-adjustment situation. This phenomenon may cause excessive stress on the lower dome of the chamber installed around the axis, and in more serious cases, may cause cracks in the lower dome.

[0005] In summary, it is necessary to provide a device in the semiconductor device that can determine whether the adjustment device has been correctly installed. Summary of the Invention

[0006] The object of the present invention is to provide a semiconductor equipment and an axis adjustment method, in which the semiconductor equipment is provided with a detection element, which can detect the external force that the axis receives when it deviates from the center line, so that when adjusting the position of the axis, the external force detected by the detection element can be used to confirm whether the axis has reached the desired position, and at the same time, excessive stress caused by excessive adjustment on the lower dome of the chamber of the semiconductor equipment arranged around the axis can be avoided.

[0007] To achieve the above object, the present invention is realized by the following technical solutions.

[0008] A semiconductor device comprising: a base for placing the wafer; a shaft directly or indirectly connected to the base; and a detection member disposed at the end of the shaft for detecting an external force applied to the shaft due to deviation from the center line.

[0009] The semiconductor device further includes a base having a fixed position relative to a chamber of the semiconductor device, and a positioning member that is installed on the base, is used to adjust the position of the axis on a horizontal plane, and is connected to the detection member, The positioning member includes a fixing member for fixing the detection member to the positioning member.

[0010] Furthermore, the fixing member is provided above the detection member.

[0011] Furthermore, the detection member is annular and includes through holes that penetrate the upper and lower surfaces of the annular member.

[0012] Furthermore, the end face of the shaft is provided within the through hole and is interposed between the upper and lower surfaces of the detection member.

[0013] Furthermore, the end face of the shaft passes through the through hole and exceeds the annular lower surface.

[0014] Furthermore, the end surface of the shaft is provided on the fixed member, and the end surface of the shaft is located above the upper surface of the detection member.

[0015] Furthermore, the fixing member has a hole for positioning the shaft.

[0016] Furthermore, the holes may be through holes or blind holes.

[0017] Furthermore, the diameter of the shaft is the same as the diameter of the through hole of the detection member, and the diameter of the shaft is the same as the diameter of the hole of the fixing member.

[0018] Furthermore, the fixing member is connected to the positioning portion via a screw thread, a bolt, or a screw.

[0019] Furthermore, the positioning member includes a first direction positioning portion and a second direction positioning portion located on a horizontal plane, the first direction positioning portion and the second direction positioning portion are arranged to intersect, and the angle between the first direction and the second direction is α.

[0020] Furthermore, the semiconductor device an adjustment assembly connected to the base and the positioning member, The adjustment assembly includes a first direction adjustment portion and a second direction adjustment portion located on a horizontal plane, the first direction adjustment portion being used to adjust the position of the first direction positioning portion relative to the base, and the second direction adjustment portion being used to adjust the position of the second direction positioning portion relative to the base.

[0021] Furthermore, the adjustment assembly further includes a connecting portion, which is provided on a base and used to fix the adjustment assembly to the base, and the first direction adjustment portion and the second direction adjustment portion are both micrometers, which are fixed to the connecting portion and have one end connected to the first direction positioning portion and the second direction positioning portion.

[0022] Furthermore, the positioning member further includes a locking member for fixing the positioning member to the base at the adjusted position.

[0023] Furthermore, the base includes a central hole, the locking member includes a plate and a bolt, the plate is disposed below the base, and the plate is provided with a screw hole that matches the bolt, and after the positioning member is adjusted, the bolt passes through the central hole of the positioning member and the base and connects to the screw hole on the plate.

[0024] Furthermore, the shapes of the first direction positioning portion and the second direction positioning portion are both "[" shapes, wherein a convex ring facing the direction of the base is provided in the middle portion of the second direction positioning portion, a storage groove matching the convex ring is provided in the middle portion of the first direction positioning portion, the convex ring is inserted into the storage groove, and the first direction positioning portion and the second direction positioning portion can rotate opposite to each other with the center of the convex ring as the center of a circle.

[0025] Furthermore, the diameter of the inner hole of the convex ring is equal to or larger than the diameter of the through hole of the detection member.

[0026] Furthermore, when the end face of the shaft passes through the through hole and exceeds the lower surface of the annular shape, the diameter of the inner hole of the convex ring is larger than the diameter of the through hole of the detection member.

[0027] Furthermore, the detection member is a shear force sensor.

[0028] Furthermore, the angle α is greater than 0° and less than 180°.

[0029] The present invention further provides the above-mentioned semiconductor device and shaft adjustment method, Step S1 of adjusting the position of the axis relative to the center line; Step S2: determining whether the force detected by the detecting member exceeds a predetermined threshold value, and if so, returning to step S1; if not, executing step S3; and step S3 of locking the position of said axis.

[0030] Compared with the prior art, the present invention has the following advantages:

[0031] 1. The semiconductor equipment provided by the present invention is provided with a detection element, which can detect the external force that the axis receives when it deviates from the center line. Therefore, when adjusting the position of the axis, the external force detected by the detection element can be used to determine whether the axis has been adjusted to the desired position, thereby improving reproducibility and convenience.

[0032] 2. At the same time, it avoids the problem of cracks in the lower dome caused by excessive stress due to excessive adjustment of the axis.

[0033] 3. In addition, the detection member is provided at the end of the shaft, and the fixing member is connected to the shaft, providing more sensitive force detection. [Brief explanation of the drawings]

[0034] In order to more clearly describe the technical solution of the present invention, the accompanying drawings used in the description will be briefly described below. Obviously, the drawings described below are only one embodiment of the present invention, and those skilled in the art can derive other drawings from these drawings without expending any creative efforts. [Figure 1] 1 is a structural schematic diagram of a semiconductor device provided by the present invention; [Figure 2] 1 is a top view of an axis adjustment device provided by the present invention; [Figure 3]4 is a cross-sectional view of an axis adjusting device in a second direction provided by the present invention. FIG. [Figure 4] 1 is a structural schematic diagram of one of the shafts, positioning members and detection members provided by the present invention; [Figure 5] FIG. 2 is another structural schematic diagram of the shaft, positioning member and detection member provided by the present invention; [Figure 6] 1 is another structural schematic diagram of the shaft, positioning member and detection member provided by the present invention; FIG. DETAILED DESCRIPTION OF THE INVENTION

[0035] The solutions provided by the present invention will now be described in more detail with reference to the drawings and detailed description of the preferred embodiments. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are very simplified and all are inaccurate in proportion, and are used only to assist in conveniently and clearly illustrating the objectives of the embodiments of the present invention. To make the objectives, features, and advantages of the present invention clearer and easier to understand, reference should be made to the drawings. The structures, ratios, sizes, etc. shown in the drawings accompanying this specification are used only to assist in the interpretation of the contents of the specification and are intended for those skilled in the art to understand and read. They are not requirements for limiting the implementation of the present invention and therefore have no substantial technical significance. Any changes in the structures, ratios, or sizes will not affect the effects and objectives that can be achieved by the present invention and should still be within the scope of the technical content revealed by the present invention.

[0036] 1 shows a schematic structural diagram of a semiconductor device provided by the present invention. As shown in FIG. 1, the present invention provides a semiconductor device. Optionally, the semiconductor device is at least one of an epitaxial growth device and a rapid thermal processing device. The present invention takes the epitaxial growth device as an example, and the epitaxial growth device is used to deposit an epitaxial growth layer on a surface of a wafer. The epitaxial growth layer may be a silicon epitaxial growth layer, a silicon germanium epitaxial growth layer, or a doped silicon germanium epitaxial growth layer.

[0037] 1, the semiconductor device 100 provided by the present invention mainly comprises a chamber and an adjustment device 200. The chamber is formed by sealingly connecting an upper dome 104, a lower dome 107, and a sidewall 106. The chamber 100 is installed symmetrically along a centerline 130 of the chamber, and the base is generally rotated about the centerline 130. The upper dome 104 is approximately convex and circular, and includes a circular transparent portion and a flange disposed around the periphery of the transparent portion. The lower dome 107 is approximately umbrella-shaped and both are made of quartz. The upper dome 104 is fixed to the sidewall 106 via an upper flange 103. An upper group of heating lamps 102 is provided above the chamber, and a lower group of heating lamps 108 is provided below the chamber. An inlet 116 is provided at one end of the chamber, and an exhaust port 105 is provided at the other end opposite the inlet 116. When a required process is performed in the chamber, process gas flows into the chamber from the inlet 116 and reaches the surface of a wafer 118. The upper group of heating lamps 102 and the lower group of heating lamps 108 heat the wafer 118 to the required temperature to react with the process gas, and the reacted process gas is exhausted from the chamber via the exhaust port 105. In the horizontal plane, vertically to the connecting line between the inlet and exhaust ports, the chamber is further provided with a wafer transfer port for transferring the wafer 118 into and out of the chamber. In order to easily adjust the process temperature and to easily understand the process temperature status of the wafer 118 in the chamber, the chamber is provided with an upper thermometer 101 and a lower thermometer 112 that measure the process temperature of the wafer 118 in real time through the upper dome 104 and the lower dome 107, respectively.

[0038] 1 , the semiconductor equipment further includes a base 117 for supporting a wafer 118, a rotary support shaft 114, support pins 115, a support frame 113, a shaft 120, and a rotation mechanism 109. The base 117 is connected to the rotary support shaft 114, and through the rotation of the rotary support shaft 114 and the up-down movement of the base 117, the base 117 and the wafer 118 are driven to rotate around a center line 130 or to move the base 117 up and down. The wafer support pins 115 are movably mounted in pin holes in the base. After the rotary support shaft 114 drives the support pins 115 to move downward, the support frame 113 pushes up the support pins 115 to separate the wafer from the base 117. The rotation mechanism 109 is connected to the rotary support shaft 114 to rotate the rotary support shaft 114 during processing.

[0039] The shaft 120 is directly or indirectly connected to a base, and optionally, the shaft 120 is connected to a base 117 via the rotation mechanism 109 and the rotation support shaft 114 .

[0040] The adjustment device 200 includes a detection member 301, which is provided at the end of the shaft 120 as shown in FIG. 1 and is used to detect the external force that the shaft 120 receives when it is displaced from the center line 130.

[0041] The detection member provided by the present invention can detect the external force that the shaft 120 receives when it deviates from the center line 130. Therefore, when adjusting the shaft 120 using the adjustment device 200, the external force detected by the detection member can be used to determine whether the shaft 120 has been adjusted to the desired position, thereby avoiding instability and time-waste caused by adjusting the shaft position based on experience.

[0042] FIG. 2 shows a top view of an adjustment device 200 provided by the present invention. FIG. 3 shows a cross-sectional view of the adjustment device 200 provided by the present invention in a second direction. As shown in FIGS. 2 and 3, the adjustment device 200 further includes a base 205 and a positioning member. The position of the base is fixed relative to the position of a chamber of a semiconductor device. Optionally, the base 205 is fixedly connected to the chamber of the semiconductor device, or the base 205 is fixedly connected to a member fixed at another position. The positioning member is mounted on the base 205 and used to adjust and position the shaft 120 in a horizontal plane. The detection member is connected to the positioning member. Optionally, the positioning member is mounted above the base 205. At the same time, the detection member 301 is mounted on the positioning member. Optionally, the detection member 301 is mounted on the upper surface of the positioning member, and the shaft 120 is mounted on the upper or upper part of the positioning member. The positioning member includes a fixing member 240 for fixing the detection member 301 to the positioning member, optionally the fixing member 240 is disposed above the detection member 301, the fixing member 240 is detachably connected to the positioning member, optionally the fixing member 240 is further used to position the shaft 120, and optionally the fixing member 240 is further used to bear the force of the shaft 120 when it is displaced relative to the center line 130.

[0043] 2 and 3, the positioning member includes a first direction positioning portion 211 and a second direction positioning portion 209 located on a horizontal plane, the first direction positioning portion 211 and the second direction positioning portion 209 are arranged to intersect with each other, the first direction positioning portion 211 extends along a first direction, the second direction positioning portion 209 extends along a second direction, and the angle between the first direction and the second direction is α. The positioning member can drive the shaft 120 to move in the first direction or the second direction, and can fix and position the shaft at a desired position.

[0044] Optionally, the adjustment device 200 further includes an adjustment assembly, which is respectively connected to the base 205 and the positioning member, and which includes a first direction adjustment portion 203 and a second direction adjustment portion 207 located on a horizontal plane, wherein the first direction adjustment portion 203 is used to adjust the position of the first direction positioning portion 211 relative to the base 205, and the second direction adjustment portion 207 is used to adjust the position of the second direction positioning portion 209 relative to the base 205.

[0045] Optionally, the adjustment assembly further includes a connecting portion, which is provided on the base and used to fix the adjustment assembly to the base 205, and the first direction adjustment portion 203 and the second direction adjustment portion 207 are both micrometers, which are fixed to the connecting portion and have one end connected to the first direction positioning portion 211 and the second direction positioning portion 209. Optionally, the connection portion includes a first connection portion 204 and a second connection portion 206, the first direction adjustment portion 203 is connected to the first connection portion 204, and one end thereof is connected to the first direction positioning portion 211, the micrometer of the first direction adjustment portion 203 can be screwed in to drive the first direction positioning portion 211 so as to move relative to the first connection portion in a first direction, and during movement, it rotates slightly around the center 202 of the first connection portion, the second direction adjustment portion 207 is fixed to the second connection portion 206, and one end thereof is connected to the second direction positioning portion 209, the micrometer of the second direction adjustment portion 207 can be screwed in to drive the second direction positioning portion 209 so as to move relative to the second connection portion in a second direction, and during movement, it rotates slightly around the center 208 of the second connection portion. Here, the first direction positioning portion 211 and the second direction positioning portion 209 are both "[" shaped.

[0046] Optionally, the positioning member further comprises a locking member for fixing the positioning member relative to the base 205 in an adjusted position.

[0047] Optionally, the base 205 includes a central hole 212, the locking member includes a plate 221 and a bolt 219, the plate 221 is disposed below the base 205, and the plate 221 is provided with a threaded hole corresponding to the bolt 219, and after the positioning member is adjusted, the bolt 219 passes through the central hole 212 of the positioning member and the base and connects to the threaded hole on the plate.

[0048] Optionally, a convex ring 210 facing the base 205 is provided in the middle of the second direction positioning portion 209, and a storage groove 225 matching the convex ring 210 is provided in the middle of the first direction positioning portion 211, the convex ring is inserted into the storage groove, and the first direction positioning portion 211 and the second direction positioning portion 209 can rotate opposite to each other with the center of the convex ring 210 as the center of a circle.

[0049] The connection method between the shaft and the positioning member is as follows: Specifically, an installation groove is formed on the upper surface of the positioning member, the illustrated detection member 301 and fixing member 240 are installed in the illustrated installation groove, the shape of the illustrated installation groove corresponds to the outer shape of the illustrated detection member 301 and fixing member 240, the illustrated installation groove is a cylindrical groove with a step formed in the cylindrical groove, the detection member 301 is annular, and the annular detection member 301 further includes through holes penetrating the upper and lower surfaces of the annular shape. Optionally, the fixing member 240 has an annular or similar shape, the lower surface of the fixing member 240 is attached to the upper surface of the detection member 301, the fixing member 240 includes a hole, and the shaft 120 is installed in the hole to position the shaft, the hole being a through hole or a blind hole. The detection member 301 is provided at the bottom of the cylindrical groove, and the fixing member 240 is provided at the stepped portion of the cylindrical groove. Preferably, the radius of the fixing member 240 is larger than that of the detection member 301 to provide a more stable stress contact surface. Of course, optionally, the radius of the fixing member 240 can be the same as that of the detection member 301. Preferably, the upper surface of the fixing member 240 is higher than the upper surface of the positioning portion to allow the detection member 301 to detect force. Of course, optionally, the upper surface of the fixing member 240 can be at the same height as or lower than the upper surface of the positioning portion. To allow for force detection, the diameter of the shaft 120 is the same as the diameter of the through hole of the detection member, and the diameter of the shaft 120 is the same as the diameter of the hole of the fixing member to position the shaft 120. A vertical hole is drilled at the bottom of the mounting groove, and the diameter of the vertical hole is equal to or greater than the diameter of the shaft 120. Optionally, the vertical hole is located at the convex ring, i.e., forms the inner hole of the convex ring. Of course, optionally, the vertical hole can be located not in the convex ring but at another position on the positioning member. In this solution, the convex ring is a protrusion, which is specifically as follows:

[0050] 4 to 6 respectively show structural schematic diagrams of various embodiments of the shaft, positioning member and detection member provided by the present invention.

[0051] 4, the end surface of the shaft 120 is disposed within the through-hole and is interposed between the annular upper and lower surfaces, and the hole of the fixing member 240 is a through-hole. The end surface of the shaft 120 first passes through the hole of the fixing member 240 and then extends downward into the through-hole of the detection member 301. In this embodiment, the hole of the fixing member 240 can position the shaft 120 within the hole, the inner surface of the through hole of the detection member 301 contacts the shaft 120, and at the same time, the inner surface of the hole of the fixing member 240 also contacts the illustrated shaft 120, and when the shaft 120 deviates from the center line 130, the shaft simultaneously applies a force in the horizontal plane to the inner surface of the hole of the fixing member 240 and the inner surface of the through hole of the detection member 301, and the illustrated detection member 301 can detect the force received by the shaft when it deviates from the center line, and the greater the deviation of the shaft 120 from the center line, the greater the detection value of the illustrated detection member 301.

[0052] 5, the end face of the shaft 120 passes through the through hole and extends beyond the bottom surface of the annular ring, and the hole in the fixing member 240 is a through hole. Here, the diameter of the vertical hole at the bottom of the mounting groove is larger than the diameter of the through hole in the detection member, i.e., the diameter of the inner hole in the convex ring is larger than the diameter of the through hole in the detection member. The end face of the shaft first passes through the hole in the fixing member 240, then extends downward and passes through the through hole in the detection member 301 until the end face of the shaft 120 is lower than the bottom surface of the detection member 301. In this embodiment, the hole in the fixing member 240 can position the shaft 120 within the hole, and the inner surface of the through-hole of the detection member 301 and the inner surface of the hole in the fixing member 240 contact the shaft 120. When the shaft 120 is misaligned with the center line 130, the shaft simultaneously applies a horizontal force to the inner surface of the hole in the fixing member 240 and the inner surface of the through-hole in the detection member 301. The illustrated detection member 301 can detect the force received by the shaft when it is misaligned with the center line. The greater the misalignment of the shaft 120 with the center line, the greater the detection value of the illustrated detection member 301. In this embodiment, because the shaft extends deeper, the hole in the positioning member can better position the shaft. In addition, because the diameter of the vertical hole (the inner hole of the convex ring) is larger than the diameter of the shaft, the shaft does not contact the inner surface of the vertical hole, and the detection member 301 can detect larger and more sensitive forces.

[0053] In another embodiment, as shown in Fig. 6, the end face of the shaft is provided on the fixed member 240, and the end face of the shaft is located above the upper surface of the detection member. Specifically, the shaft is located in a hole in the fixed member 240 and is interposed between the upper and lower surfaces of the fixed member 240. In this embodiment, the hole in the fixed member 240 may be a through hole or a blind hole. The end face of the shaft 120 first penetrates the upper surface of the fixed member 240 and then extends downward into the hole in the fixed member 240. In this embodiment, the hole of the fixing member 240 allows the shaft 120 to be positioned within the hole, and the inner surface of the hole of the fixing member 240 contacts the shaft 120, but the inner surface of the detection member 301 does not contact the shaft 120, and when the shaft 120 is misaligned with the center line 130, the shaft will apply a force in a horizontal plane to the inner surface of the hole of the fixing member 240, and due to the balance of forces and the interaction of forces, the detection member 301 will receive a force from the fixing member 240, so the illustrated detection member 301 can detect the force received by the shaft when it is misaligned with the center line, and the greater the misalignment of the shaft 120 with the center line, the greater the detection value of the illustrated detection member 301.

[0054] Alternatively, the fixing member 240 may be connected to the positioning member via threads, bolts, or screws. Specifically, the fixing member 240 may have a male thread on its side wall and a matching female thread in the mounting groove of the positioning member to realize a detachable connection between the fixing member 240 and the positioning member. Alternatively, the fixing member 240 may have drilled or tapped holes around its periphery or other locations, and bolts or screws may be threaded into the drilled or tapped holes to detachably fasten the fixing member to the positioning member. The connection methods are merely examples and are not specifically limited.

[0055] Optionally, the sensing element 301 is a shear force sensor.

[0056] Optionally, the angle α between the first direction and the second direction is greater than 0° and less than 180°, preferably the angle α is greater than 80° and less than 100°.

[0057] In addition, the semiconductor equipment further includes a controller and an interactive terminal, the controller is electrically connected to the detection element, the controller is electrically connected to the interactive terminal, the detection element transmits a signal related to stress to the controller, the controller processes the received signal and transmits the processed signal to the interactive terminal, the interactive terminal displays the processed signal, and an engineer can check the processed signal through the interactive terminal. Optionally, the controller is a host machine, and the illustrated interactive terminal is a display.

[0058] The present invention further provides a method for adjusting the axis of the semiconductor device.

[0059] S1, adjusting the position of the axis relative to the centerline.

[0060] Specifically, the first direction adjustment unit 203 and / or the second direction adjustment unit 207 are controlled, i.e., the micrometer is twisted to adjust the position of the first direction positioning unit 211 and the second direction positioning unit 209 relative to the base 205, thereby moving and driving the axis in the first direction and / or the second direction until the axis 120 overlaps with the center line.

[0061] S2: Determine whether the force detected by the detecting member exceeds a predetermined threshold value. If it does, return to step S1; if it does not, execute the next step S3.

[0062] Specifically, the controller compares the force received by the axis when it deviates from the center line detected by the detection member with a predetermined threshold value, and by observing the processing result displayed on the interactive terminal, if the force received by the axis still exceeds the predetermined force threshold value, it continues to perform step S1, i.e., continues to adjust the position of the axis, and if the force received by the axis does not exceed the predetermined force threshold value, it stops the adjustment.

[0063] S3, lock the position of said axis.

[0064] Specifically, after the adjustment is completed, a bolt 219 is passed through the central hole 212 of the positioning member and the base and connected to a screw hole in the plate, which is used to fix the positioning member to the base 205, i.e., to fix the position of the shaft 120 to the position of the base 205.

[0065] The semiconductor device provided by the present invention is provided with a detection element that detects the force that the shaft receives when it deviates from the center line. Therefore, when adjusting the position of the shaft, the external force detected by the detection element can be used to determine whether the shaft has been adjusted to the desired position, which improves convenience and avoids the problem of cracks in the lower dome caused by excessive stress due to over-adjustment.

[0066] It should be noted that relational terms such as "first" and "second" are used herein solely to distinguish one entity or operation from another and do not necessarily require or imply any actual relationship or order between those entities or operations. Furthermore, the use of "comprise," "contain," or any other variation of these terms is intended to cover a non-exclusive inclusion, such that a process, method, article, or device that includes a set of elements includes not only those elements but also other elements not expressly listed or other elements inherent in such process, method, article, or device. Absent further limitations, an element qualified by a "comprising a..." statement does not exclude the presence of other identical elements in the process, method, article, or device that includes said element. Furthermore, the term "connected" in this specification means that A and B are directly connected, or A and B are indirectly connected, and an indirect connection, such as A and B, is connected through C, or through more elements, such as C and D, and the connection between A and B may be integral, separate, detachable, or fixed. The term "optionally" in this document means that the technical feature can be combined or not combined with any of the features in the text.

[0067] Although the contents of the present invention have been described in detail in accordance with preferred embodiments, it should be appreciated that the above description should not be construed as a limitation on the present invention. After reading the above content, those skilled in the art will understand various modifications and alternatives to the present invention. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. a base for placing the wafer; a shaft directly or indirectly connected to the base; a detection member disposed at an end of the shaft for detecting an external force applied to the shaft due to deviation from the center line.

2. a base in a fixed position relative to the position of a chamber of a semiconductor device; a positioning member that is installed on the base, is used to adjust the position of the shaft on a horizontal plane, and is connected to the detection member; 2. The semiconductor device according to claim 1, wherein the positioning member further comprises a fixing member for fixing the detection member to the positioning member.

3. 3. The semiconductor device according to claim 2, wherein the fixing member is provided above the detection member.

4. 4. The semiconductor device according to claim 3, wherein the detection member is annular, and the annular member includes through holes that penetrate the upper and lower surfaces of the annular member.

5. 5. The semiconductor device according to claim 4, wherein an end face of the shaft is provided within the through hole and is interposed between the upper and lower faces of the detection member.

6. 5. The semiconductor device according to claim 4, wherein an end face of the shaft passes through the through hole and exceeds the annular lower surface.

7. 5. The semiconductor device according to claim 4, wherein an end face of the shaft is provided on the fixing member, and the end face of the shaft is positioned above an upper surface of the detection member.

8. 8. The semiconductor device according to claim 7, wherein the fixing member has a hole for positioning the shaft.

9. 9. The semiconductor device according to claim 8, wherein the hole is a through hole or a blind hole.

10. 10. The semiconductor device according to claim 9, wherein the diameter of the shaft is the same as the diameter of the through-hole of the detection member, and the diameter of the shaft is the same as the diameter of the hole of the fixing member.

11. 11. The semiconductor device according to claim 2, wherein the fixing member is connected to the positioning member via a screw thread, a bolt, or a screw.

12. The semiconductor device according to any one of claims 2 to 10, characterized in that the positioning member includes a first direction positioning portion and a second direction positioning portion located on a horizontal plane, the first direction positioning portion and the second direction positioning portion are arranged to intersect, and the angle between the first direction and the second direction is α.

13. The semiconductor device includes: further comprising an adjustment assembly connected to the base and the positioning member, 13. The semiconductor device of claim 12, wherein the adjustment assembly includes a first direction adjustment portion and a second direction adjustment portion located on a horizontal plane, the first direction adjustment portion being used to adjust the position of the first direction positioning portion relative to the base, and the second direction adjustment portion being used to adjust the position of the second direction positioning portion relative to the base.

14. 14. The semiconductor device of claim 13, wherein the adjustment assembly further comprises a connecting portion, the connecting portion being provided on a base and used to fix the adjustment assembly to the base, the first direction adjustment portion and the second direction adjustment portion both being micrometers, the micrometers being fixed to the connecting portion and having one end connected to the first direction positioning portion and the second direction positioning portion.

15. 15. The semiconductor device according to claim 14, wherein the positioning member further comprises a locking member for fixing the positioning member relative to the base at the adjusted position.

16. 16. The semiconductor device of claim 15, wherein the base includes a central hole, the locking member includes a plate and a bolt, the plate is disposed below the base, and the plate is provided with a screw hole that matches the bolt, and after the positioning member is adjusted, the bolt passes through the central hole of the positioning member and the base and connects to the screw hole on the plate.

17. The semiconductor device of claim 12, wherein the first direction positioning portion and the second direction positioning portion are both shaped like a "[ ", wherein a convex ring facing the base is provided in the middle of the second direction positioning portion, a storage groove matching the convex ring is provided in the middle of the first direction positioning portion, the convex ring is inserted into the storage groove, and the first direction positioning portion and the second direction positioning portion can rotate opposite to each other with the center of the convex ring as the center of a circle.

18. 18. The semiconductor device according to claim 17, wherein the diameter of the inner hole of said convex ring is equal to or larger than the diameter of the through hole of said detection member.

19. 19. The semiconductor device of claim 18, wherein when the end face of the shaft passes through the through hole and exceeds the lower surface of the annular shape, the diameter of the inner hole of the convex ring is larger than the diameter of the through hole of the detection member.

20. 11. The semiconductor device according to claim 1, wherein the detection member is a shear force sensor.

21. 13. The semiconductor device of claim 12, wherein the angle α is greater than 0° and less than 180°.

22. Step S1 of adjusting the position of the axis relative to the center line; Step S2: determining whether the force detected by the detecting member exceeds a predetermined threshold value, and if so, returning to step S1; if not, executing step S3; and a step S3 of locking the position of the axis.

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