Pseudo-ceramic structure, method of manufacturing same, and electronic device housing

A ceramic-like structure with optimized refractive index layers addresses the issue of color variation in conventional glass covers, replicating ceramic reflectance and tactile appeal at varying angles, thus improving the ceramic-like effect.

JP2025532852APending Publication Date: 2025-10-03BYD CO LTD
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Patent Information

Application Number
JP2025517849
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-09-26
Filing Date
2023-08-16
Publication Date
2025-10-03

AI Technical Summary

Technical Problem

Conventional ceramic-like glass back covers lack a true ceramic-like effect due to significant color changes with varying observation angles and do not replicate the tactile appeal of genuine ceramics.

Method used

A ceramic-like structure is formed by laminating specific high and low refractive index material layers between a transparent substrate and an ink layer, with refractive indices and thicknesses optimized to mimic ceramic reflectance and maintain color consistency across angles.

Benefits of technology

The structure achieves a ceramic-like effect with consistent color and reflectance similar to genuine ceramics, reducing production costs while enhancing tactile appeal.

✦ Generated by Eureka AI based on patent content.

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Abstract

A pseudo-ceramic structure includes a transparent substrate material, a pseudo-ceramic film layer, and an ink layer, the pseudo-ceramic film layer being disposed between the transparent substrate material and the ink layer, the pseudo-ceramic film layer being made from a first high refractive index material layer, a first low refractive index material layer, a second high refractive index material layer, and a second low refractive index material layer, the first high refractive index material layer, the first low refractive index material layer, the second high refractive index material layer, and the second low refractive index material layer being stacked in this order. Additionally, the present application further discloses a method for manufacturing the pseudo-ceramic structure and an electronic device housing including the pseudo-ceramic structure.
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Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims priority to and the benefit of Chinese Patent Application No. 202211176255.4, filed on September 26, 2022. The entire contents of the above-referenced application are incorporated herein by reference.

[0002] FIELD OF THE DISCLOSURE The present disclosure relates to the field of electronic device housing technology, and more particularly to ceramic-like structures, methods of manufacturing the same, and electronic device housings. [Background technology]

[0003] Currently, there is scientific technology for forming ceramic-like glass back covers using a coating process or a combination of a film and a coating process. However, regardless of whether a coating process or a combination of a film and a coating process is used, the resulting color effects are mainly flashy, gradient, or monochrome, and often lack tactile appeal. On the other hand, the light reflectivity of ceramic-like glass back covers obtained by conventional processes is still different from that of ceramic back covers. On the other hand, although ceramic-like glass back covers obtained by conventional processes can exhibit a true ceramic-like effect when observed from the front, the color of the glass back cover obtained by such processes changes significantly when the observation angle, i.e., the angle of light incidence, is changed. In contrast, the color of a genuine ceramic back cover is relatively uniform when observed at different angles and does not change as much as a conventional ceramic-like glass back cover. The main reasons are as follows: Conventional coating processes have a certain degree of visual color variation (the visual effect of the color changes with different observation angles). In addition, some ceramic-like glass back covers also have an ultraviolet (UV) texture layer to achieve a ceramic-like effect on the front, but the UV texture layer also has the problem of color change with changes in viewing angle, so conventional ceramic-like glass back covers do not achieve a true ceramic-like effect. Summary of the Invention

[0004] To solve the problem that conventional ceramic-like glass back covers cannot provide a true ceramic-like effect, the present disclosure provides a ceramic-like structure, a manufacturing method thereof, and an electronic device housing.

[0005] To solve the above technical problems, the following technical scheme is used in this disclosure.

[0006] In one aspect, the present disclosure provides a method for treating a cancer cell comprising: Transparent substrate, an ink layer, and a ceramic-like film layer; the ceramic-like film layer is disposed between the transparent substrate and the ink layer, and the ceramic-like film layer is formed by a first high refractive index material layer, a first low refractive index material layer, a second high refractive index material layer, and a second low refractive index material layer, and the first high refractive index material layer, the first low refractive index material layer, the second high refractive index material layer, and the second low refractive index material layer are laminated in order; A ceramic-like structure is provided in which the refractive index of the first high refractive index material layer and the second high refractive index material layer is greater than 2.3, and the refractive index of the first low refractive index material layer and the second low refractive index material layer is less than 1.6.

[0007] Optionally, the reflectivity of the ceramic-like structure is in the range of 25% to 30%.

[0008] Optionally, the first layer of high refractive index material is in contact with the transparent substrate.

[0009] Optionally, the first and second low refractive index material layers are each independently selected from one or more of SiO2 and MgF2.

[0010] Optionally, the first and second low refractive index material layers are selected from SiO2.

[0011] Optionally, the first and second high refractive index material layers are each independently selected from one or more of Nb2O5, Ti3O5, and TiO2.

[0012] Optionally, the first and second high refractive index material layers are selected from Nb2O5.

[0013] Optionally, the thickness of the first high refractive index material layer is in the range of 53.8 nm to 105.8 nm, the thickness of the second high refractive index material layer is in the range of 1 nm to 16 nm, the thickness of the first low refractive index material layer is in the range of 32.4 nm to 86.4 nm, and the thickness of the second low refractive index material layer is in the range of 44.6 nm to 90.6 nm.

[0014] Optionally, the transparent substrate is glass.

[0015] Optionally, the ceramic-like structure further comprises a drop-resistant layer, the drop-resistant layer being disposed between the transparent substrate and the ceramic-like film layer, the drop-resistant layer being an organosiloxane material.

[0016] Optionally, the organosiloxane material is obtained by polymerization of low molecular weight siloxanes, including one or more of dialkoxysilanes containing organic groups, trialkoxysilanes containing organic groups, and tetraalkoxysilanes, wherein the organic groups are selected from the group consisting of alkyl groups, phenyl groups, epoxy groups, amino groups, isocyanate groups, ester groups, and combinations thereof.

[0017] Optionally, the thickness of the drop resistant layer is in the range of 100 nm to 2000 nm.

[0018] In another aspect, the present disclosure provides a method for producing a method for manufacturing a device comprising the steps of: providing a transparent precursor comprising a transparent substrate; coating a first high refractive index material layer, a first low refractive index material layer, a second high refractive index material layer, and a second low refractive index material layer on the transparent precursor in sequence to form a ceramic-like film layer on the surface of the transparent precursor; and applying ink to the surface of the formed ceramic-like film layer to obtain a ceramic-like structure; a method for producing the ceramic structure, comprising:

[0019] Optionally, the surface of the transparent substrate is covered with a silicate-based material to form a drop-resistant layer to obtain a transparent precursor; a ceramic-like film layer is formed on the surface of the drop-resistant layer.

[0020] Optionally, the transparent substrate is subjected to a surface cleaning treatment before the drop-resistant layer is formed.

[0021] Optionally, a first high refractive index material layer, a first low refractive index material layer, a second high refractive index material layer, and a second low refractive index material layer are coated in sequence on the transparent precursor by vacuum coating.

[0022] In another aspect, the present disclosure provides an electronic device housing comprising the ceramic-like structure described above.

[0023] Through numerous experiments, it has been found that by forming a ceramic-like film layer using a specific number and order of first high-refractive index material layers, first low-refractive index material layers, second high-refractive index material layers, and second low-refractive index material layers between a transparent substrate and an ink layer, a ceramic-like effect can be achieved on the surface of a transparent substrate, thereby replacing ceramic to a certain extent. In addition, the material and processing costs of conventional transparent substrates are low, resulting in an effective reduction in production costs. In particular, compared with conventional ceramic-like structures, the ceramic-like structure obtained by the present disclosure has a surface reflectance similar to that of existing genuine ceramic structures, and its color does not change with the viewing angle. When the ceramic-like structure is observed at different viewing angles under light incident at different angles, the observed color difference is small, and there is no visual color change effect. Therefore, the ceramic-like structure obtained by the present disclosure can better imitate the true tactile appeal of ceramic structures. [Brief explanation of the drawings]

[0024] [Figure 1] 1 is a schematic structural diagram of a ceramic-like structure according to the present disclosure. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0025] In order to make the technical problems, technical solutions, and beneficial effects to be solved by the present disclosure more comprehensible, the present disclosure will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific examples described herein are used only to illustrate the present disclosure and are not intended to limit the present disclosure.

[0026] 1 , an embodiment of the present disclosure provides a ceramic-like structure including a transparent substrate 1, a ceramic-like film layer 3, and an ink layer 4. The ceramic-like film layer 3 is disposed between the transparent substrate 1 and the ink layer 4. The ceramic-like film layer 3 is formed by a first high refractive index material layer 31, a first low refractive index material layer 32, a second high refractive index material layer 33, and a second low refractive index material layer 34. The first high refractive index material layer 31, the first low refractive index material layer 32, the second high refractive index material layer 33, and the second low refractive index material layer 34 are laminated in order.

[0027] The refractive index of the first high refractive index material layer 31 and the second high refractive index material layer 33 is greater than 2.3, and the refractive index of the first low refractive index material layer 32 and the second low refractive index material layer 34 is less than 1.6.

[0028] Through numerous experiments, it was found that by forming a ceramic-like film layer 3 using a specific number and order of first high-refractive index material layers 31, first low-refractive index material layers 32, second high-refractive index material layers 33, and second low-refractive index material layers 34 between the transparent substrate 1 and the ink layer 4, a ceramic-like effect can be achieved on the surface of the transparent substrate 1, thereby replacing ceramic to a certain extent. In addition, the material and processing costs of the conventional transparent substrate 1 are low, resulting in an effective reduction in production costs. In particular, compared with conventional ceramic-like structures, the ceramic-like structure obtained by the present disclosure has a surface reflectance similar to that of existing authentic ceramic structures, and its color does not change with the viewing angle. When the ceramic-like structure is observed at different viewing angles under light incident at different angles, the observed color difference is small, and there is no visual color change effect. Therefore, the ceramic-like structure obtained by the present disclosure can better imitate the authentic tactile appeal of ceramic structures.

[0029] It should be noted that the terms "first high refractive index material layer 31," "second high refractive index material layer 33," "first low refractive index material layer 32," and "second low refractive index material layer 34" are relative concepts and indicate that the refractive indexes of the "first high refractive index material layer 31" and "second high refractive index material layer 33" are higher than those of the "first low refractive index material layer 32" and "second low refractive index material layer 34."

[0030] The stacking of high and low refractive index material layers can adjust the light reflection, and together with the transparent substrate 1 and the ink layer 4, affect the surface gloss of the ceramic-like structure. Notably, different numbers and orders of high and low refractive index material layers in the stacking have a significant impact on the gloss and reflectance in different directions. In this disclosure, the small color difference characteristics of the ceramic-like structure under different observation conditions under light incident at different angles are directly related to the number and order of high and low refractive index material layers in the stacking, and any change in the number and order of high and low refractive index material layers in the stacking will cause a change in the presented effect, resulting in the loss of the tactile appeal of true ceramic that is to be realized in this disclosure.

[0031] In some instances, the reflectivity of the ceramic-like structure is in the range of 25% to 30%.

[0032] Controlling the surface reflectance of the ceramic-like structure to a range of 25% to 30% can better mimic the gloss of ceramic and better meet the requirements for mimicking ceramic. Specifically, the reflectance of the ceramic-like film layer 3 can be adjusted by selecting the refractive indices of the first high-refractive index material layer 31, the second high-refractive index material layer 33, the first low-refractive index material layer 32, and the second low-refractive index material layer 34 and controlling their film thicknesses.

[0033] In some examples, the first high refractive index material layer 31 is in contact with the transparent substrate, i.e., the first high refractive index material layer 31, the first low refractive index material layer 32, the second high refractive index material layer 33, and the second low refractive index material layer 34 are stacked in order in a direction away from the transparent substrate 1. Alternatively, the second low refractive index material layer 34 is in contact with the transparent substrate, i.e., the first high refractive index material layer 31, the first low refractive index material layer 32, the second high refractive index material layer 33, and the second low refractive index material layer 34 are stacked in order in a direction away from the ink layer 4.

[0034] Additionally, placing the first high refractive index material layer 31 in contact with the transparent substrate, compared to the case where the second low refractive index material layer 34 is in contact with the transparent substrate, helps to improve the bonding strength between the film layers so as to improve the wear resistance of the ceramic-like structure.

[0035] In some examples, the first low refractive index material layer 32 and the second low refractive index material layer 34 are each independently selected from at least one of SiO 2 and MgF 2 .

[0036] In some examples, the first low refractive index material layer 32 and the second low refractive index material layer 34 are selected from SiO2.

[0037] In some examples, first high refractive index material layer 31 and second high refractive index material layer 33 are each independently selected from at least one of Nb2O5, Ti3O5, and TiO2.

[0038] In some examples, the first high refractive index material layer 31 and the second high refractive index material layer 33 are selected from Nb2O5.

[0039] In some examples, the thickness of the first high refractive index material layer 31 is in the range of 53.8 nm to 105.8 nm, the thickness of the second high refractive index material layer 33 is in the range of 1 nm to 16 nm, the thickness of the first low refractive index material layer 32 is in the range of 32.4 nm to 86.4 nm, and the thickness of the second low refractive index material layer 34 is in the range of 44.6 nm to 90.6 nm.

[0040] The thicknesses of the first high refractive index material layer 31, the second high refractive index material layer 33, the first low refractive index material layer 32, and the second low refractive index material layer 34 have a significant impact on the ceramic-like effect of the ceramic-like structure. When the thicknesses of the first high refractive index material layer 31, the second high refractive index material layer 33, the first low refractive index material layer 32, and the second low refractive index material layer 34 are within the above-mentioned ranges, the consistency of the surface reflectance of the ceramic-like structure and the true ceramic effect can be ensured, and the display difference caused by excessively small or large thicknesses can be avoided.

[0041] In some examples, the transparent substrate 1 can be a single layer of transparent material or a laminate of multiple layers of transparent material.

[0042] The shape of the ceramic-like structure is mainly determined by the structure of the transparent substrate 1. The shape of the transparent substrate 1 can be adjusted according to different application fields. For example, the transparent substrate 1 can be in the shape of a flat plate, a three-dimensional structure, or an irregular structure, and its size can be selected according to actual conditions. For example, when the ceramic-like structure is the backplane of a mobile phone, the area and thickness of the ceramic-like structure can be adjusted according to the specific shape of the mobile phone.

[0043] In some examples, the transparent substrate 1 is at least one of a transparent plastic material and glass.

[0044] In some examples, the transparent substrate 1 is glass.

[0045] Compared with using a transparent plastic material as the transparent substrate material 1, using glass as the transparent substrate material 1 has the characteristics of high hardness, high transparency, and low haze, and can better present tactile quality and glossy texture similar to ceramic.

[0046] In some examples, the ceramic-like structure further includes a drop-resistant layer 2, the drop-resistant layer 2 being disposed between the transparent substrate 1 and the ceramic-like film layer 3, the drop-resistant layer 2 being an organosiloxane material.

[0047] Organosiloxane materials have good deformation adaptability, and by using an organosiloxane material as the drop-resistant layer 2 between the glass and the ceramic-like film layer 3, it can fill microcracks on the glass, thereby reinforcing the glass and improving its impact resistance. In addition, the drop-resistant layer 2 can effectively buffer the stress generated by the ceramic-like film layer 3, solving the problem of stress mismatch between the ceramic-like layer and the glass, and effectively improving the strength and impact resistance of the ceramic-like structure.

[0048] In some examples, the organosiloxane material is obtained by polymerization of low molecular weight siloxanes, including one or more of dialkoxysilanes containing organic groups, trialkoxysilanes containing organic groups, and tetraalkoxysilanes, where the organic groups are selected from the group consisting of alkyl groups, phenyl groups, epoxy groups, amino groups, isocyanate groups, ester groups, and combinations thereof.

[0049] The drop-resistant layer 2 can be obtained by vapor deposition onto the transparent substrate 1 using organosiloxane as a target material, or by directly coating the transparent substrate 1 with a low molecular weight siloxane followed by polymerization and curing.

[0050] In some examples, the thickness of the drop resistant layer 2 ranges from 100 nm to 2000 nm.

[0051] When the thickness of the drop-resistant layer 2 is within the above range, a good buffering effect can be provided to improve the impact resistance of the ceramic-like structure, and the thickness of the drop-resistant layer 2 can be prevented from being too large to affect the optical display effect of the ceramic-like structure.

[0052] In some examples, the ink layer 4 can be ink layers of different colors, for example, the ink layer 4 can be red, yellow, blue, green, black, or a mixture thereof.

[0053] In some examples, the ink layer 4 is black.

[0054] In some instances, the ceramic-like structure may also include other functional layers that do not affect its ceramic-like effect, such as hardening layers, anti-fingerprint layers, and the like.

[0055] Another example of the present disclosure provides a method of manufacturing the ceramic structure described above, comprising the following operations.

[0056] A transparent precursor including a transparent substrate 1 is provided.

[0057] A first high refractive index material layer 31, a first low refractive index material layer 32, a second high refractive index material layer 33, and a second low refractive index material layer 34 are coated in sequence on the transparent precursor to form a ceramic-like film layer 3 on the surface of the transparent precursor.

[0058] Ink is applied to the surface of the formed ceramic-like film layer 3 to obtain a ceramic-like structure.

[0059] In some examples, the surface of a transparent substrate 1 is covered with a silicate-based material to form a drop-resistant layer 2 to obtain a transparent precursor; and a ceramic-like film layer 3 is formed on the surface of the drop-resistant layer 2.

[0060] In some examples, the transparent substrate 1 is subjected to a surface cleaning treatment before the drop-resistant layer 2 is formed.

[0061] The surface cleaning treatment of the transparent substrate 1 includes one or more of cleaning with deionized water, cleaning with a surfactant, and ultrasonic cleaning.

[0062] The surface cleaning treatment is beneficial for removing impurities such as dust on the surface of the transparent substrate 1 and preventing the impurities on the surface of the transparent substrate 1 from affecting the bonding effect and optical properties of the ceramic-like film layer 3.

[0063] In some examples, a first high refractive index material layer 31, a first low refractive index material layer 32, a second high refractive index material layer 33, and a second low refractive index material layer 34 are coated in sequence on a transparent precursor by vacuum coating.

[0064] The first high refractive index material layer 31, the first low refractive index material layer 32, the second high refractive index material layer 33, and the second low refractive index material layer 34 can be fabricated by physical vapor deposition, evaporation coating, or magnetron sputtering.

[0065] Specifically, depending on the selected material, a corresponding target material can be irradiated with an ion source to form a sputtering source for deposition in a vacuum or inert gas atmosphere, and an auxiliary gas source such as oxygen or nitrogen can be added if necessary. For example, if the first low-refractive-index material layer 32 and the second low-refractive-index material layer 34 are selected from SiO2, silicon can be used as the target material, and oxygen can be introduced as an auxiliary gas to form the SiO2 layer. If the first high-refractive-index material layer 31 and the second high-refractive-index material layer 33 are selected from Nb2O5, metallic niobium can be used as the target material, and oxygen can be introduced as an auxiliary gas to form the Nb2O5 layer.

[0066] In some examples, the ink layer 4 can be produced by spray coating, shower coating, roll coating, or screen printing.

[0067] Another example of the present disclosure provides an electronic device housing including the ceramic-like structure described above.

[0068] In some examples, the electronic device housing is a mobile phone, a tablet computer, a watch, or other wearable electronic device, or a home appliance. [Example]

[0069] The present disclosure will now be further illustrated with reference to examples.

[0070] Example 1 This example is used to illustrate the ceramic-like structure disclosed in the present disclosure and the method for manufacturing the same, which includes the following operations:

[0071] 1) Cleaning: To remove the dust and dirt residues on the surface of the glass substrate, the glass substrate was cleaned in a nine-cell ultrasonic cleaner for 1 hour.

[0072] 2) Drop-resistant coating: a. The untreated portion of the cleaned glass substrate was covered with a protective film, and then the cleaned glass substrate was secured to the coater canopy to complete the feeding.

[0073] b. The coating machine was started to coat a drop-resistant layer onto the glass substrate by vapor deposition using organosiloxane as the film material.

[0074] 3) Ceramic-like film coating: SiO2 was obtained by coating with a sputtering Si target, and Nb2O5 was obtained by sputtering with a Nb target.

[0075] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0076] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0077] c. The ion source was turned on and the oxygen supply for the ion source was started, and at the same time, the sputtering power supply for the Nb target was turned on with a power of 10 KW and the thickness was set to 54.8 nm, thus completing the coating of Nb2O5.

[0078] d. The sputtering power supply for the Nb target was turned off, the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 84.4 nm, thus completing the coating.

[0079] e. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer having a thickness of 9 nm, thus completing the coating.

[0080] f. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 45.6 nm, thus completing the coating.

[0081] After coating was completed, the sputtering power supply for the Si target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled. The freezer then began to defrost. Finally, air was introduced into the coating chamber to return the pressure in the chamber to atmospheric pressure, after which the coated glass substrate was removed.

[0082] 4) The coated glass substrate was silkscreen printed with black ink and baked at 120°C for 90 minutes.

[0083] Example 2 This example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0084] 3) In ceramic-like film coating: SiO2 was obtained by coating with a sputtering Si target, and Nb2O5 was obtained by sputtering with a Nb target.

[0085] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0086] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0087] c. The ion source was turned on and the oxygen supply for the ion source was started, and at the same time, the sputtering power supply for the Nb target was turned on with a power of 10 KW and the thickness was set to 95.3 nm, thus completing the coating of Nb2O5.

[0088] d. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 35.1 nm, thus completing the coating.

[0089] e. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer having a thickness of 2.7 nm, thus completing the coating.

[0090] f. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 87.7 nm, thus completing the coating.

[0091] After coating was completed, the sputtering power supply for the Si target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled. The freezer then began to defrost. Finally, air was introduced into the coating chamber to return the pressure in the chamber to atmospheric pressure, after which the coated glass substrate was removed.

[0092] Example 3 This example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0093] 3) In ceramic-like film coating: SiO2 was obtained by coating with a sputtering Si target, and Nb2O5 was obtained by sputtering with a Nb target.

[0094] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0095] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0096] c. The ion source was turned on and the oxygen supply for the ion source was started, and at the same time, the sputtering power supply for the Nb target was turned on with a power of 10 KW and the thickness was set to 84.2 nm, thus completing the coating of Nb2O5.

[0097] d. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 34.5 nm, thus completing the coating.

[0098] e. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer having a thickness of 15.3 nm, thus completing the coating.

[0099] f. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 46.3 nm, thus completing the coating.

[0100] After coating was completed, the sputtering power supply for the Si target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled. The freezer then began to defrost. Finally, air was introduced into the coating chamber to return the pressure in the chamber to atmospheric pressure, after which the coated glass substrate was removed.

[0101] Example 4 This example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0102] 3) In ceramic-like film coating: SiO2 was obtained by coating with a sputtering Si target, and Nb2O5 was obtained by sputtering with a Nb target.

[0103] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0104] b. The coating chamber vacuum is 3 x 10 -3When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0105] c. The ion source was turned on and the oxygen supply for the ion source was started, and at the same time, the sputtering power supply for the Nb target was turned on with a power of 10 KW and the thickness was set to 75.3 nm, thus completing the coating of Nb2O5.

[0106] d. The sputtering power supply for the Nb target was turned off, the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 56.3 nm, thus completing the coating.

[0107] e. The sputtering power supply for the Si target was turned off, the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer having a thickness of 6.2 nm, thus completing the coating.

[0108] f. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 75.1 nm, thus completing the coating.

[0109] After coating was completed, the sputtering power supply for the Si target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled. The freezer then began to defrost. Finally, air was introduced into the coating chamber to return the pressure in the chamber to atmospheric pressure, after which the coated glass substrate was removed.

[0110] Example 5 This example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0111] 3) In ceramic-like film coating: SiO2 was obtained by coating with a sputtering Si target, and Nb2O5 was obtained by sputtering with a Nb target.

[0112] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0113] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0114] c. The ion source was turned on and the oxygen supply for the ion source was started, and at the same time, the sputtering power supply for the Nb target was turned on with a power of 10 KW and the thickness was set to 26 nm, thus completing the coating of Nb2O5.

[0115] d. The sputtering power supply for the Nb target was turned off, the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 84.4 nm, thus completing the coating.

[0116] e. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer with a thickness of 9 nm, thus completing the coating.

[0117] f. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 45.6 nm, thus completing the coating.

[0118] After coating was completed, the sputtering power supply for the Si target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled. The freezer then began to defrost. Finally, air was introduced into the coating chamber to return the pressure in the chamber to atmospheric pressure, after which the coated glass substrate was removed.

[0119] Example 6 This example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0120] 3) In ceramic-like film coating: SiO2 was obtained by coating with a sputtering Si target, and Nb2O5 was obtained by sputtering with a Nb target.

[0121] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0122] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0123] c. The ion source was turned on and the oxygen supply for the ion source was started, and at the same time, the sputtering power supply for the Nb target was turned on with a power of 10 KW and the thickness was set to 118 nm, thus completing the coating of Nb2O5.

[0124] d. The sputtering power supply for the Nb target was turned off, the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 84.4 nm, thus completing the coating.

[0125] e. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer with a thickness of 9 nm, thus completing the coating.

[0126] f. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 45.6 nm, thus completing the coating.

[0127] After coating was completed, the sputtering power supply for the Si target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled. The freezer then began to defrost. Finally, air was introduced into the coating chamber to return the pressure in the chamber to atmospheric pressure, after which the coated glass substrate was removed.

[0128] Example 7 This example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0129] 3) In ceramic-like film coating: SiO2 was obtained by coating with a sputtering Si target, and Nb2O5 was obtained by sputtering with a Nb target.

[0130] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0131] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0132] c. The ion source was turned on and the oxygen supply for the ion source was started, and at the same time, the sputtering power supply for the Nb target was turned on with a power of 10 KW and the thickness was set to 54.8 nm, thus completing the coating of Nb2O5.

[0133] d. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 14 nm, thus completing the coating.

[0134] e. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer having a thickness of 9 nm, thus completing the coating.

[0135] f. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 45.6 nm, thus completing the coating.

[0136] After coating was completed, the sputtering power supply for the Si target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled. The freezer then began to defrost. Finally, air was introduced into the coating chamber to return the pressure in the chamber to atmospheric pressure, after which the coated glass substrate was removed.

[0137] Example 8 This example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0138] 3) In ceramic-like film coating: SiO2 was obtained by coating with a sputtering Si target, and Nb2O5 was obtained by sputtering with a Nb target.

[0139] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0140] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0141] c. The ion source was turned on and the oxygen supply for the ion source was started, and at the same time, the sputtering power supply for the Nb target was turned on with a power of 10 KW and the thickness was set to 54.8 nm, thus completing the coating of Nb2O5.

[0142] d. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 97 nm, thus completing the coating.

[0143] e. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer having a thickness of 9 nm, thus completing the coating.

[0144] f. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 45.6 nm, thus completing the coating.

[0145] After coating was completed, the sputtering power supply for the Si target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled, after which the freezer began to defrost. Finally, air was introduced into the coating chamber to bring the pressure in the coating chamber to atmospheric pressure, after which the coated glass substrate was removed.

[0146] Example 9 This example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0147] 3) In ceramic-like film coating: SiO2 was obtained by coating with a sputtering Si target, and Nb2O5 was obtained by sputtering with a Nb target.

[0148] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0149] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0150] c. The ion source was turned on and the oxygen supply for the ion source was started, and at the same time, the sputtering power supply for the Nb target was turned on with a power of 10 KW and the thickness was set to 54.8 nm, thus completing the coating of Nb2O5.

[0151] d. The sputtering power supply for the Nb target was turned off, the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 84.4 nm, thus completing the coating.

[0152] e. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer having a thickness of 0.5 nm, thus completing the coating.

[0153] f. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 45.6 nm, thus completing the coating.

[0154] After coating was completed, the sputtering power supply for the Si target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled, after which the freezer began to defrost. Finally, air was introduced into the coating chamber to bring the pressure in the coating chamber to atmospheric pressure, after which the coated glass substrate was removed.

[0155] Example 10 This example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0156] 3) In ceramic-like film coating: SiO2 was obtained by coating with a sputtering Si target, and Nb2O5 was obtained by sputtering with a Nb target.

[0157] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0158] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0159] c. The ion source was turned on and the oxygen supply for the ion source was started, and at the same time, the sputtering power supply for the Nb target was turned on with a power of 10 KW and the thickness was set to 54.8 nm, thus completing the coating of Nb2O5.

[0160] d. The sputtering power supply for the Nb target was turned off, the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 84.4 nm, thus completing the coating.

[0161] e. The sputtering power supply for the Si target was turned off, the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer having a thickness of 38 nm, thus completing the coating.

[0162] f. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 45.6 nm, thus completing the coating.

[0163] After coating was completed, the sputtering power supply for the Si target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled, after which the freezer began to defrost. Finally, air was introduced into the coating chamber to bring the pressure in the coating chamber to atmospheric pressure, after which the coated glass substrate was removed.

[0164] Example 11 This example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0165] 3) In ceramic-like film coating: SiO2 was obtained by coating with a sputtering Si target, and Nb2O5 was obtained by sputtering with a Nb target.

[0166] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0167] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0168] c. The ion source was turned on and the oxygen supply for the ion source was started, and at the same time, the sputtering power supply for the Nb target was turned on with a power of 10 KW and the thickness was set to 54.8 nm, thus completing the coating of Nb2O5.

[0169] d. The sputtering power supply for the Nb target was turned off, the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 84.4 nm, thus completing the coating.

[0170] e. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer having a thickness of 9 nm, thus completing the coating.

[0171] f. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 20 nm, thus completing the coating.

[0172] After coating was completed, the sputtering power supply for the Si target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled, after which the freezer began to defrost. Finally, air was introduced into the coating chamber to bring the pressure in the coating chamber to atmospheric pressure, after which the coated glass substrate was removed.

[0173] Example 12 This example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0174] 3) In ceramic-like film coating: SiO2 was obtained by coating with a sputtering Si target, and Nb2O5 was obtained by sputtering with a Nb target.

[0175] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0176] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0177] c. The ion source was turned on and the oxygen supply for the ion source was started, and at the same time, the sputtering power supply for the Nb target was turned on with a power of 10 KW and the thickness was set to 54.8 nm, thus completing the coating of Nb2O5.

[0178] d. The sputtering power supply for the Nb target was turned off, the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 84.4 nm, thus completing the coating.

[0179] e. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer having a thickness of 9 nm, thus completing the coating.

[0180] f. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 152 nm, thus completing the coating.

[0181] After coating was completed, the sputtering power supply for the Si target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled, after which the freezer began to defrost. Finally, air was introduced into the coating chamber to bring the pressure in the coating chamber to atmospheric pressure, after which the coated glass substrate was removed.

[0182] Example 13 This example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0183] 3) In ceramic-like film coating: MgF2 was obtained by sputtering MgF2 film material, and Nb2O5 was obtained by sputtering Nb2O5 film material.

[0184] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0185] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0186] c. The ion source was turned on and the oxygen supply for the ion source was started, and at the same time, the evaporation power supply for the Nb2O5 film material was turned on with a power of 7KW and the thickness was set to 66.6nm, thus completing the coating of Nb2O5.

[0187] d. The rotating frame was rotated to the MgF2 film material position to deposit a MgF2 film layer with a thickness of 58.1 nm, thus completing the coating.

[0188] e. The rotating frame was rotated to the Nb2O5 film material position, and oxygen was supplied at 40 sccm to deposit a Nb2O5 film layer with a thickness of 9.4 nm, thus completing the coating.

[0189] f. The rotating frame was rotated to the MgF2 film material position to deposit a MgF2 film layer with a thickness of 38.2 nm, thus completing the coating.

[0190] g. After coating was completed, the deposition power supply was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled, after which the freezer began to defrost. Finally, air was introduced into the coating chamber to bring the pressure in the coating chamber to atmospheric pressure, and then the coated glass substrate was removed.

[0191] Example 14 This example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0192] 3) In ceramic-like film coating: SiO2 was obtained by coating with a sputtering Si target, and TiO2 was obtained by sputtering with a Ti target.

[0193] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0194] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0195] c. The ion source was turned on, and the oxygen supply for the ion source was started; at the same time, the sputtering power supply for the Ti target was turned on with a power of 10 KW and the thickness was set to 56.9 nm, thus completing the coating of TiO2.

[0196] d. The sputtering power supply for the Ti target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 38.6 nm, thus completing the coating.

[0197] e. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Ti target was turned on, and oxygen was supplied at 200 sccm to deposit a TiO2 film layer with a thickness of 3.3 nm, thus completing the coating.

[0198] f. The sputtering power supply for the Ti target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 122.8 nm, thus completing the coating.

[0199] After coating was completed, the sputtering power supply for the Si target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled, after which the freezer began to defrost. Finally, air was introduced into the coating chamber to bring the pressure in the coating chamber to atmospheric pressure, after which the coated glass substrate was removed.

[0200] Example 15 This example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences: The "coat a drop-resistant layer" operation was not performed.

[0201] Example 16 This example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0202] 3) In ceramic-like film coating: a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0203] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0204] c. The ion source was turned on, the oxygen supply for the ion source was started, the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 45.6 nm, thus completing the coating.

[0205] d. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer having a thickness of 9 nm, thus completing the coating.

[0206] e. The sputtering power supply for the Nb target was turned off, the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 84.4 nm, thus completing the coating.

[0207] f. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer having a thickness of 54.8 nm, thus completing the coating.

[0208] After coating was completed, the sputtering power supply for the Nb target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled, after which the freezer began to defrost. Finally, air was introduced into the coating chamber to bring the pressure in the coating chamber to atmospheric pressure, after which the coated glass substrate was removed.

[0209] (Comparative Example 1) This comparative example provides a black ceramic structure.

[0210] (Comparative Example 2) This comparative example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0211] 3) In ceramic-like film coating: SiO2 was obtained by coating with a sputtering Si target, and Nb2O5 was obtained by sputtering with a Nb target.

[0212] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0213] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0214] c. The ion source was turned on and the oxygen supply for the ion source was started, and at the same time, the sputtering power supply for the Nb target was turned on with a power of 10 KW and the thickness was set to 54.8 nm, thus completing the coating of Nb2O5.

[0215] d. The sputtering power supply for the Nb target was turned off, the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 84.4 nm, thus completing the coating.

[0216] e. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer having a thickness of 9 nm, thus completing the coating.

[0217] After coating was completed, the sputtering power supply for the Nb target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled, after which the freezer began to defrost. Finally, air was introduced into the coating chamber to bring the pressure in the coating chamber to atmospheric pressure, after which the coated glass substrate was removed.

[0218] (Comparative Example 3) This comparative example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0219] 3) In ceramic-like film coating: SiO2 was obtained by coating with a sputtering Si target, and Nb2O5 was obtained by sputtering with a Nb target.

[0220] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0221] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0222] c. The ion source was turned on and the oxygen supply for the ion source was started, and at the same time, the sputtering power supply for the Nb target was turned on with a power of 10 KW and the thickness was set to 54.8 nm, thus completing the coating of Nb2O5.

[0223] d. The sputtering power supply for the Nb target was turned off, the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 84.4 nm, thus completing the coating.

[0224] e. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer having a thickness of 9 nm, thus completing the coating.

[0225] f. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 45.6 nm, thus completing the coating.

[0226] g. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer having a thickness of 36 nm, thus completing the coating.

[0227] h. After coating was completed, the sputtering power supply for the Nb target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled, after which the freezer began to defrost. Finally, air was introduced into the coating chamber to bring the pressure in the coating chamber to atmospheric pressure, and the coated glass substrate was then removed.

[0228] Comparative Example 4 This comparative example is used to illustrate the ceramic-like structure disclosed in the present disclosure and its manufacturing method, which includes most of the steps in Example 1, with the following differences:

[0229] 3) In ceramic-like film coating: Al2O3 was obtained by coating with sputtering an Al target, SiO2 was obtained by coating with sputtering a Si target, and Nb2O5 was obtained by sputtering a Nb target.

[0230] a. The glass substrate was attached to the jig of the sputtering machine, and the machine was evacuated.

[0231] b. The coating chamber vacuum is 3 x 10 -3 When the pressure reached 10 Pa, Ar gas was introduced and stabilized.

[0232] c. The ion source was turned on, and the oxygen supply for the ion source was started, and at the same time, the sputtering power supply for the Al target was turned on with a power of 10 KW, and the thickness was 46 nm, thus completing the coating of Al2O3.

[0233] d. The sputtering power supply for the Al target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer having a thickness of 54.8 nm, thus completing the coating.

[0234] e. The sputtering power supply for the Nb target was turned off, the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 84.4 nm, thus completing the coating.

[0235] f. The sputtering power supply for the Si target was turned off, and the sputtering power supply for the Nb target was turned on, and oxygen was supplied at 200 sccm to deposit a NbO film layer with a thickness of 9 nm, thus completing the coating.

[0236] g. The sputtering power supply for the Nb target was turned off, and the sputtering power supply for the Si target was turned on, and oxygen was supplied at 150 sccm to deposit a SiO2 film layer having a thickness of 45.6 nm, thus completing the coating.

[0237] h. After coating was completed, the sputtering power supply for the Si target was turned off, and the power supply for the ion source was turned off. The argon and oxygen supplies were then turned off, the rotation of the rotating frame was stopped, and the workpiece was cooled, after which the freezer began to defrost. Finally, air was introduced into the coating chamber to bring the pressure in the coating chamber to atmospheric pressure, after which the coated glass substrate was removed.

[0238] Performance Test 1. The ceramic-like structures produced in Examples 1 to 16 and Comparative Examples 2 to 4, and the true ceramic structure obtained in Comparative Example 1, were subjected to the following tests.

[0239] 1.1. Lab Color Detection: Lab color detection under various light incidence angles was performed using a colorimeter on the ceramic-like structures produced in Examples 1 to 16 and Comparative Examples 2 to 4, as well as the true ceramic structure obtained in Comparative Example 1. L, a, and b represent the L, a, and b values ​​in the Lab color space, respectively. The L value represents lightness. A larger L value means higher lightness (or whiter color). A smaller L value indicates lower lightness (or darker color). The L value can range from 0 to 100. This value represents the color value. A positive a value represents red, and a larger a value represents a redder color. A negative a value represents green, and a smaller a value represents a greener color. The value ranges from -120 to 120. The b value represents the color value. A positive b value represents yellow, and a larger b value represents a yellower color. A negative b value represents blue, and a smaller b value represents a bluer color. The b value ranges from -120 to 120.

[0240] 1.2. Reflectance Test: Using a UV-2800 spectrophotometer from Shimadzu Corporation, Japan, reflectance tests were performed on the ceramic-like structures produced in Examples 1 to 16 and Comparative Examples 2 to 4, as well as the true ceramic structure obtained in Comparative Example 1. The parameter settings of the UV-2800 spectrophotometer were as follows: 1) Spectral width: 4nm 2) Wavelength range: 190nm-1100nm 3) Wavelength accuracy: ±0.5nm 4) Wavelength repeatability: 0.3nm 5) Wavelength resolution: 0.1nm

[0241] The test results are shown in Table 1.

[0242] [Table 1-1] [Table 1-2]

[0243] From the test results in Table 1, it can be seen that the color values ​​of the ceramic-like structure manufactured by the manufacturing method provided by the present disclosure are similar to those of the true ceramic structure of Comparative Example 1 at various light incident angles, and the light reflectance of the ceramic-like structure manufactured by the manufacturing method provided by the present disclosure is also close to that of the true ceramic structure of Comparative Example 1, which indicates that the ceramic-like structure provided by the present disclosure has no obvious color difference with true ceramic when viewed at different angles, and achieves a good ceramic-like effect.

[0244] The test results of Examples 1 to 4 and Examples 5 to 12 show that when the thicknesses of the first high refractive index material layer, the second high refractive index material layer, the first low refractive index material layer, and the second low refractive index material layer are each within the ranges specified in the present disclosure, the ceramic-like effect can be further improved.

[0245] The test results of Comparative Examples 1 to 4 show that changes in the number of ceramic-like film layers or the order of ceramic-like film layers in the stack cause significant differences in the color of the ceramic-like structure, and the ceramic-like structure has significant color differences from true ceramic, especially at different light incident angles, and has color change problems.

[0246] 2. Impact resistance tests were conducted on the ceramic-like structures produced in Examples 1 to 4 and Example 15, as well as on untreated glass substrates. The test conditions were as follows: a 110 g ball was dropped from a height of 5 cm to impact the four R corners of the ceramic-like structure or glass substrate, impacting each point five times. If the ceramic-like structure or glass substrate is not broken, the height was increased by another 5 cm, and the ball impact was repeated according to the above method until the ceramic-like structure or glass substrate was broken, and the height was recorded. The test results are shown in Table 2.

[0247] [Table 2]

[0248] From the test results in Table 2, it can be seen that the placement of the drop-resistant layer between the glass substrate and the ceramic-like film layer can effectively avoid the problem of the impact resistance of the glass substrate being reduced due to the stress generated by the ceramic-like film layer, and improve the drop-resistant performance of the ceramic-like structure.

[0249] 3. The following tests were performed on the ceramic-like structures produced in Examples 1 and 16.

[0250] A. Boiling and cross-cut test conditions: 1) An appropriate amount of pure water was added to a constant temperature water tank and heated to a boiling temperature of 100°C. Then, the product was placed in the constant temperature water tank. The product should not come into contact with the wall of the boiling water tank. After boiling for 1 hour, the product was removed.

[0251] 2) After drying with a dust-free cloth, the product was left at room temperature for at least 2 hours. The appearance of the product was observed and compared with that of a normal sample.

[0252] 3) Cross-cut: A sharp blade was used to cut a 10x10 grid of 1mm x 1mm squares into the surface area. Every cut resulted in a scratch on the glass. 3M610 adhesive tape was applied to the cross-cut area. Air was squeezed out between the adhesive tape and the cross-cut area. The adhesive tape was statically pressed for at least 5 seconds. While holding the product stationary, the adhesive tape was rapidly pulled from one side perpendicular to the surface. This process was repeated three times.

[0253] Test criteria: Adhesion must not be lower than 4B, there must be no abnormalities in appearance, and there must be no peeling coating or ink layer.

[0254] B. High temperature and high humidity test conditions: 1) Temperature: 65±1℃; Humidity: 91-95%RH; Test time: 96 hours.

[0255] 2) After the specified time in the experiment was reached, the product was removed and left under natural conditions for at least 2 hours. The appearance of the product was observed and compared with that of a normal sample.

[0256] 3) Cross-cut: A sharp blade was used to cut a 10x10 grid of 2mm x 2mm squares into the surface area. Every cut resulted in a scratch on the glass. 3M610 adhesive tape was applied to the cross-cut area. Air was squeezed out between the adhesive tape and the cross-cut area. The adhesive tape was statically pressed for at least 5 seconds. While holding the product stationary, the adhesive tape was rapidly pulled from one side perpendicular to the surface. This process was repeated three times.

[0257] Test criteria: Adhesion must not be lower than 4B, there must be no abnormalities in appearance, and there must be no peeling coating or ink layer.

[0258] C: Cosmetic testing conditions: 1) First, the surface of the product was wiped clean with a cotton cloth. NIVEA Sunscreen Oil (SPF30) and NIVEA Hand Cream were applied to the front of the product. Each type of cosmetic was applied to two samples. Note that more cosmetic was applied to the edges and holes of the product than to other areas of the product.

[0259] 2) Temperature: 55±1℃; Humidity: 93±2%RH; Test time: 96 hours.

[0260] 3) After the specified time in the experiment was reached, the product was removed. The product was left under natural conditions for at least 2 hours. The appearance of the product was observed and compared with that of a normal sample. 4) Cross-cut: 3M610 adhesive tape was attached to the ink surface. The air between the adhesive tape and the cross-cut area was squeezed out. The adhesive tape was pressed statically for at least 5 seconds. While holding the product still, the adhesive tape was quickly pulled from one side perpendicular to the surface. This process was repeated three times.

[0261] Test criteria: Adhesion must not be lower than 4B, there must be no abnormalities in appearance, and there must be no peeling coating or ink layer.

[0262] D. Artificial sweat test conditions: 1) The solution was prepared according to the "Artificial Sweat Preparation Guide," pH = 4.6 ± 0.1.

[0263] 2) The sample was placed on a dust-free cloth soaked in the solution, sealed in a sealed plastic bag, and stored in a chamber with constant temperature and humidity for the time specified in the experiment (temperature: 55±1°C; humidity: 93±2%RH; test time: 96 hours).

[0264] 3) The appearance of the product was observed and compared with that of a normal sample.

[0265] 4) Cross-cut: A sharp blade was used to cut a 10x10 grid of 2mm x 2mm squares into the surface area. Every cut resulted in a scratch on the glass. 3M610 adhesive tape was applied to the ink surface. Air was squeezed out between the adhesive tape and the cross-cut area. The adhesive tape was statically pressed for at least 5 seconds. While holding the product stationary, the adhesive tape was rapidly pulled from one side perpendicular to the surface. This process was repeated three times.

[0266] Test criteria: Adhesion must not be lower than 4B, there must be no abnormalities in appearance, and there must be no peeling coating or ink layers.

[0267] The test results are shown in Table 3.

[0268] [Table 3]

[0269] The test results show that, compared with a stack of a first high refractive index material layer, a first low refractive index material layer, a second high refractive index material layer, and a second low refractive index material layer in that order in a direction away from the transparent substrate, a stack of a first high refractive index material layer, a first low refractive index material layer, a second high refractive index material layer, and a second low refractive index material layer in that order in a direction away from the transparent substrate can effectively increase the bonding strength between the film layer and the transparent substrate and the ink layer.

[0270] The above description is merely a preferred example of the present disclosure, and is not intended to limit the present disclosure. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present disclosure falls within the protection scope of the present disclosure. [Explanation of symbols]

[0271] 1. Transparent substrate 2 Drop-resistant layer 3. Ceramic-like film layer 31 First high refractive index material layer 32 First low refractive index material layer 33 Second high refractive index material layer 34 Second low refractive index material layer 4 ink layers

Claims

1. A transparent substrate (1), an ink layer (4), and a ceramic-like film layer (3), The ceramic-like film layer (3) is disposed between the transparent substrate (1) and the ink layer (4), and the ceramic-like film layer (3) is formed by a first high refractive index material layer (31), a first low refractive index material layer (32), a second high refractive index material layer (33), and a second low refractive index material layer (34), and the first high refractive index material layer (31), the first low refractive index material layer (32), the second high refractive index material layer (33), and the second low refractive index material layer (34) are laminated in this order; A ceramic-like structure, wherein the refractive index of the first high refractive index material layer (31) and the second high refractive index material layer (33) is greater than 2.3, and the refractive index of the first low refractive index material layer (32) and the second low refractive index material layer (34) is less than 1.

6.

2. The ceramic-like structure of claim 1 , wherein the reflectivity of the ceramic-like structure is in the range of 25% to 30%.

3. 3. The ceramic-like structure according to claim 1 or 2, wherein the first layer of high refractive index material (31) is in contact with the transparent substrate (1).

4. The first low refractive index material layer (32) and the second low refractive index material layer (34) are each independently made of SiO 2 and MgF 2 The ceramic-like structure according to any one of claims 1 to 3, wherein the ceramic-like structure is selected from at least one of the following:

5. The first low refractive index material layer (32) and the second low refractive index material layer (34) are made of SiO 2 5. The ceramic-like structure of claim 4, wherein the ceramic-like structure is selected from:

6. The first high refractive index material layer (31) and the second high refractive index material layer (33) are each independently made of Nb 2 O 5 , Ti 3 O 5 , and TiO 2 The ceramic-like structure according to any one of claims 1 to 5, wherein the ceramic-like structure is selected from at least one of the following:

7. The first high refractive index material layer (31) and the second high refractive index material layer (33) are made of Nb 2 O 5 7. The ceramic-like structure of claim 6, wherein the ceramic-like structure is selected from:

8. 8. The ceramic-like structure according to claim 1, wherein the thickness of the first high refractive index material layer (31) is in the range of 53.8 nm to 105.8 nm, the thickness of the second high refractive index material layer (33) is in the range of 1 nm to 16 nm, the thickness of the first low refractive index material layer (32) is in the range of 32.4 nm to 86.4 nm, and the thickness of the second low refractive index material layer (34) is in the range of 44.6 nm to 90.6 nm.

9. A ceramic-like structure according to any one of claims 1 to 8, wherein the transparent substrate (1) is glass.

10. 10. The ceramic-like structure according to any one of claims 1 to 9, further comprising a drop-resistant layer (2), said drop-resistant layer (2) being disposed between said transparent substrate (1) and said ceramic-like film layer (3), said drop-resistant layer (2) being an organosiloxane material.

11. 11. The ceramic-like structure of claim 10, wherein the organosiloxane material is obtained by polymerization of low molecular weight siloxanes, the low molecular weight siloxanes comprising at least one of dialkoxysilanes containing organic groups, trialkoxysilanes containing organic groups, and tetraalkoxysilanes, the organic groups being selected from the group consisting of alkyl groups, phenyl groups, epoxy groups, amino groups, isocyanate groups, ester groups, and combinations thereof.

12. The ceramic-like structure according to claim 10, wherein the thickness of the drop resistant layer (2) is in the range of 100 nm to 2000 nm.

13. A method for producing a ceramic-like structure according to any one of claims 1 to 12, comprising the steps of: Providing a transparent precursor comprising the transparent substrate (1); coating the first high refractive index material layer (31), the first low refractive index material layer (32), the second high refractive index material layer (33), and the second low refractive index material layer (34) on the transparent precursor in order to form the ceramic-like film layer (3) on the surface of the transparent precursor; and applying ink to the surface of the formed ceramic-like film layer (3) to obtain the ceramic-like structure; A method for manufacturing a ceramic-like structure, comprising:

14. 14. The method for producing a ceramic-like structure according to claim 13, comprising: covering the surface of the transparent substrate (1) with a silicate-based material, forming a drop-resistant layer (2), obtaining the transparent precursor, and forming the ceramic-like film layer (3) on the surface of the drop-resistant layer (2).

15. 15. A method for manufacturing a ceramic-like structure according to claim 13 or 14, wherein the transparent substrate (1) is subjected to a surface cleaning treatment before forming the drop-resistant layer (2).

16. 16. A method for producing a ceramic-like structure according to any one of claims 13 to 15, wherein the first high refractive index material layer (31), the first low refractive index material layer (32), the second high refractive index material layer (33), and the second low refractive index material layer (34) are coated in this order on the transparent precursor by vacuum coating.

17. An electronic device housing comprising the ceramic-like structure according to any one of claims 1 to 12.

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