Bellows seal for low penetration force actuation of temperature probes across vacuum interfaces

Abstract

An actuator assembly for actuating a plasma conditioning ring in a processing chamber includes an actuator, a rod, a bellows, and a vacuum seal. The actuator is located outside the processing chamber. The processing chamber is under vacuum. The actuator is at atmospheric pressure. The rod is coupled to the actuator and to the plasma conditioning ring in the processing chamber. The bellows is located outside the processing chamber between the actuator and the processing chamber. The rod enters the processing chamber through the bellows. Vacuum seals are located between the bellows and the actuator and between the bellows and the processing chamber to seal the vacuum in the processing chamber from atmospheric pressure outside the processing chamber.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 409,422, filed September 23, 2022. The entire disclosure of the above application is incorporated herein by reference. [Technical Field]

[0002] FIELD OF THE DISCLOSURE The present disclosure relates generally to substrate processing systems, and more particularly to a bellows seal for low penetration force actuation of a temperature probe across a vacuum interface. [Background technology]

[0003] The background description provided herein is intended to present the contents of the present disclosure generally. Work by the presently named inventors within the scope of what is described in this Background section, as well as aspects of the description that may not otherwise be considered prior art at the time of filing, are not admitted, expressly or impliedly, as prior art against the present disclosure.

[0004] Plasma etching processes are typically performed on substrates in a vacuum processing chamber. Within the processing chamber, a top edge ring (TER) surrounds the substrate, which is positioned on a substrate support. The TER is moved in and out of the processing chamber by a robot. An adjustable edge sheath (TES) ring is positioned below the TER. The TES ring includes electrodes that couple radio frequency (RF) power to the TER to adjust the shape of the plasma near the edge of the substrate. The RF power can be adjusted to improve etch uniformity across the substrate. Because the TES ring is used to adjust the shape of the plasma near the edge of the substrate, the TES ring is also commonly referred to as a plasma conditioning ring. Summary of the Invention

[0005] An actuator assembly for actuating a plasma conditioning ring in a processing chamber includes an actuator, a rod, a bellows, and a vacuum seal. The actuator is located outside the processing chamber. The processing chamber is under vacuum. The actuator is at atmospheric pressure. The rod is coupled to the actuator and to the plasma conditioning ring in the processing chamber. The bellows is located outside the processing chamber between the actuator and the processing chamber. The rod enters the processing chamber through the bellows. Vacuum seals are located between the bellows and the actuator and between the bellows and the processing chamber to seal the vacuum in the processing chamber from atmospheric pressure outside the processing chamber.

[0006] In a further feature, the bellows comprises a polymer.

[0007] In a further feature, the vacuum seal does not impede movement of the rod through the bellows.

[0008] In a further feature, the vacuum seal comprises an O-ring.

[0009] In a further feature, the system includes an actuator assembly, further including a substrate support, an edge ring, and a temperature sensing assembly. The substrate support is disposed in the processing chamber and supports the substrate. The plasma conditioning ring is disposed on the substrate support. The edge ring is disposed around the substrate proximate to the plasma conditioning ring during substrate processing. The temperature sensing assembly is configured to sense a temperature of the edge ring. The temperature sensing assembly includes a spring assembly, a second bellows, and a temperature probe. The spring assembly is disposed outside the processing chamber. The second bellows is disposed outside the processing chamber between the spring assembly and the processing chamber. The temperature probe is coupled to the spring assembly. The temperature probe passes through the second bellows and the plasma conditioning ring. The spring assembly maintains contact between the temperature probe and the edge ring.

[0010] In a further feature, the second bellows comprises a polymer.

[0011] In a further feature, the system further comprises a second vacuum seal disposed between the second bellows and the spring assembly and between the second bellows and the processing chamber, sealing a vacuum within the processing chamber.

[0012] In a further feature, the second vacuum seal does not impede movement of the temperature probe through the second bellows.

[0013] In a further feature, the second vacuum seal comprises an O-ring.

[0014] In a further feature, the actuator is configured to move the plasma conditioning ring away from the edge ring when the edge ring clamps to the substrate support.

[0015] In a further feature, the actuator is configured to move the plasma conditioning ring into contact with the edge ring after the edge ring is clamped to the substrate support.

[0016] In a further feature, the temperature probe moves with the plasma conditioning ring when the actuator actuates the plasma conditioning ring.

[0017] In a further feature, the plasma conditioning ring comprises an electrode that supplies radio frequency power to the edge ring, and an actuator configured to move the plasma conditioning ring and maintain coupling between the plasma conditioning ring and the edge ring during substrate processing.

[0018] In a further feature, the temperature probe includes a temperature sensor attached to an end of the temperature probe proximate the plasma conditioning ring, and a spring assembly configured to maintain contact between the temperature sensor and the edge ring.

[0019] In a further feature, the plasma conditioning ring includes an electrode that supplies radio frequency power to the edge ring, and the temperature probe passes through the electrode and contacts the edge ring.

[0020] In a further feature, the spring assembly includes a spring and a sealant. The spring is disposed around the holder. The temperature probe passes through the holder. The sealant is disposed around the temperature probe to seal a vacuum within the processing chamber. The sealant extends from the holder through the second bellows, the substrate support, and the plasma conditioning ring.

[0021] In a further feature, the sealant comprises an epoxy material.

[0022] In a further feature, the temperature sensing assembly further comprises a second seal disposed around the temperature probe in the plasma conditioning ring to prevent erosion of the temperature probe and the sealant.

[0023] In a further feature, the second seal comprises an O-ring.

[0024] In still other features, a system includes a substrate support, an edge ring, a plasma conditioning ring, and an actuator assembly. The substrate support is disposed in a processing chamber under vacuum to support the substrate. The edge ring is disposed on the substrate support around the substrate. The plasma conditioning ring is disposed on the substrate support adjacent to the edge ring. The actuator assembly is configured to actuate the plasma conditioning ring. The actuator assembly includes an actuator, a rod, a bellows, and a vacuum seal. The actuator is coupled to the exterior of the processing chamber. The actuator is at atmospheric pressure. The rod is coupled to the actuator and the plasma conditioning ring. The bellows is disposed outside the processing chamber between the actuator and the processing chamber. The rod passes through the bellows. Vacuum seals are disposed between the bellows and the actuator and between the bellows and the processing chamber to seal the vacuum within the processing chamber from atmospheric pressure outside the processing chamber.

[0025] In a further feature, the vacuum seal does not impede movement of the rod through the bellows.

[0026] In a further feature, the system further includes a temperature sensing assembly including a spring assembly, a second bellows, and a temperature probe. The spring assembly is coupled to an exterior of the processing chamber. The second bellows is positioned exterior of the processing chamber between the spring assembly and the processing chamber. The temperature probe is coupled to the spring assembly. The temperature probe passes through the second bellows and the plasma conditioning ring. The spring assembly maintains contact between the temperature probe and the edge ring.

[0027] In a further feature, the system further comprises a second vacuum seal disposed between the second bellows and the spring assembly and between the second bellows and the processing chamber to seal a vacuum within the processing chamber.

[0028] In a further feature, the second vacuum seal does not impede movement of the temperature probe through the second bellows.

[0029] In a further feature, the actuator is configured to move the plasma conditioning ring away from the edge ring when the edge ring clamps to the substrate support.

[0030] In a further feature, the actuator is configured to move the plasma conditioning ring into contact with the edge ring after the edge ring is clamped to the substrate support.

[0031] In a further feature, the temperature probe moves with the plasma conditioning ring when the actuator actuates the plasma conditioning ring.

[0032] In a further feature, the plasma conditioning ring comprises an electrode that supplies radio frequency power to the edge ring, and an actuator configured to move the plasma conditioning ring and maintain coupling between the plasma conditioning ring and the edge ring during substrate processing.

[0033] In a further feature, the temperature probe includes a temperature sensor attached to an end of the temperature probe proximate the plasma conditioning ring, and a spring assembly configured to maintain contact between the temperature sensor and the edge ring.

[0034] In a further feature, the plasma conditioning ring includes an electrode that supplies radio frequency power to the edge ring, and the temperature probe passes through the electrode and contacts the edge ring.

[0035] Further areas of applicability of the present disclosure will become apparent from the detailed description, claims, and drawings. The detailed description and specific examples are for purposes of illustration only and are not intended to limit the scope of the present disclosure. [Brief explanation of the drawings]

[0036] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:

[0037] [Figure 1] FIG. 1 illustrates an example substrate processing system including a bellows-based adjustable edge sheath (TES) ring actuator and a bellows-based temperature probe according to the present disclosure.

[0038] [Figure 2] FIG. 2 shows a substrate support in more detail along with a bellows-based TES actuator and a bellows-based temperature probe.

[0039] [Figure 3] FIG. 3 shows the TES actuator and bellows in more detail. [Figure 4] FIG. 4 shows the TES actuator and bellows in more detail.

[0040] [Figure 5] FIG. 5 shows the temperature probe and bellows in more detail. [Figure 6] FIG. 6 shows the temperature probe and bellows in more detail.

[0041] In the drawings, reference numbers may be reused to refer to similar and / or identical elements. DETAILED DESCRIPTION OF THE INVENTION

[0042] A top edge ring (TER) is clamped to the substrate support during substrate processing. An adjustable edge sheath (TES) ring must move downward to allow the TER to clamp to the substrate support. After the TER is clamped to the substrate support, the TES ring must rise to contact the TER during substrate processing. At least three actuation assemblies are used to move the TES ring up and down. For example, three actuation assemblies are spaced 120 degrees apart from each other. Each actuation assembly includes a rod coupled to an actuator. The three rods, spaced 120 degrees apart from each other, are inserted through the substrate support into the TES ring. The distal ends of the rods are coupled to respective actuators located below the substrate support. The actuators move the rods, which move the TES ring up and down relative to the TER.

[0043] Additionally, at least three temperature probes are inserted through the substrate support and TES ring to sense the temperature of the TER. For example, the three temperature probes are also spaced 120 degrees apart from one another and radially offset from the rod. The temperature probes also need to move away from the TER to allow the TER to clamp to the substrate support. Additionally, the temperature probes also need to maintain contact with the TER to sense the temperature of the TER during substrate processing. The force used to actuate the temperature probes needs to be sufficient to bring the temperature probes into contact with the TER, but not excessive enough to dislodge the TER.

[0044] While the TER, TES ring, rod, and temperature probe are under vacuum in the processing chamber, the actuator is not under vacuum but is instead at atmospheric pressure. Therefore, O-rings are typically used as static seals around the rod and temperature probe to maintain the vacuum in the processing chamber. However, the O-rings limit (i.e., damp) the movement of the rod and temperature probe. Furthermore, the O-rings deteriorate over time. As a result, the frictional force between the O-ring and the rod and temperature probe fluctuates. This frictional force variation complicates controlling the movement of the rod and temperature probe. This frictional force variation also complicates maintaining repeatable RF coupling between the TES ring and TER. Furthermore, this frictional force variation complicates determining the amount of force required to maintain contact between the temperature probe and TER.

[0045] To solve the above problems, the present disclosure uses a bellows as a dynamic / movable seal for the rod and temperature probe. To maintain a vacuum in the processing chamber, O-ring seals are used above and below the bellows, but not around the rod and temperature probe. The O-rings above and below the bellows maintain the vacuum in the processing chamber, allowing the rod and temperature probe to move freely up and down through the bellows. As the rod and temperature probe move up and down through the bellows, the bellows flexes up and down like an accordion. The O-rings above and below the bellows do not surround the rod and temperature probe. Therefore, the movement of the rod and temperature probe is not damped by the frictional forces described above.

[0046] The bellows act as a seal, not a spring. That is, the bellows do not add or subtract force to the movement of the rod and temperature probe. The force applied to the bottom of the rod by each actuator is approximately equal to the force applied by the rod to the TES ring. The force applied to the bottom of the temperature probe by each compression spring (described below) is approximately equal to the force applied by the rod to the TES ring. Therefore, no additional force is required to overcome frictional forces, and the movement of the rod and temperature probe can be precisely controlled with minimal force from the actuator. During substrate processing, the coupling between the TER and the TES ring and temperature probe can be maintained. In addition, the TES ring and temperature probe retract before the TER clamps, so the TES ring and temperature probe do not interfere with the clamping of the TER.

[0047] Thus, the bellows and O-ring not only maintain the vacuum within the processing chamber but also simplify the actuation and movement of the TES ring and temperature probe. The flexibility of the bellows helps maintain the bond between the TES ring and the TER while ensuring proper clamping of the TER. The flexibility of the bellows also helps maintain the bond between the temperature probe and the TER while ensuring proper clamping of the TER. Furthermore, the bellows is made of a material such as a polymer (e.g., polytetrafluoroethylene (PTFE)). The material does not erode or deform during substrate processing, and does not arc. These and other features of the present disclosure are described in further detail below.

[0048] This disclosure is organized as follows: First, an example of a substrate processing system is described using FIG. 1 to illustrate where bellows are used in a substrate processing system. The TER, TES ring, rod, and bellows-using actuator for the TER, as well as the temperature probe using the bellows, are more clearly shown in FIG. 2. The bellows used with the actuator for actuating the TES ring are shown and described in more detail in FIGS. 3 and 4. The bellows used with the temperature probe are shown and described in more detail in FIGS. 5 and 6.

[0049] Substrate Processing System 1 illustrates an example of a substrate processing system 100 for processing a substrate. The substrate processing system 100 includes a processing chamber 102 for processing a substrate using a process such as plasma etching. The processing chamber 102 includes a substrate support 104 and a showerhead 106. For example, the substrate support 104 includes an electrostatic chuck (ESC), although other types of substrate supports can be used instead. A substrate 108 is disposed on the substrate support 104 during processing.

[0050] Figure 2 shows the substrate support 104 separately. Some of the elements of the substrate support 104 shown in Figure 1 have been omitted in Figure 2 to more clearly show other elements. The following description will refer to both Figures 1 and 2. Figure 2 will be referenced when describing other elements that are more clearly visible in Figure 2 than in Figure 1.

[0051] 1 , the showerhead 106 includes a base portion 109 and a stem portion 110. The base portion 109 is generally cylindrical and extends radially outward toward the sidewall of the processing chamber 102. The stem portion 110 is also cylindrical and has a smaller diameter than the base portion 109. One end of the stem portion 110 is attached to the center of the base portion 109. The other end of the stem portion 110 is attached to the top plate of the processing chamber 102.

[0052] The base portion 109 of the showerhead 106 includes a plurality of through-holes (not shown) on the substrate-facing side of the base portion 109. The showerhead 106 receives one or more gases from a gas delivery system (described below). The gases are distributed to the processing chamber 102 through the through-holes in the base portion 109. As described below, a plasma 112 can be impinged between the showerhead 106 and the substrate 108 during substrate processing.

[0053] 1 and 2, the substrate support 104 includes a ceramic plate 103 disposed on a metal base plate 105. The ceramic plate 103 includes an electrode 118 that electrostatically clamps the substrate 108 to the substrate support 104 during substrate processing. A top edge ring (TER) 120 is disposed on the substrate support 104 along the periphery of the substrate support 104. The TER 120 surrounds the substrate 108 as shown. The TER 120 is also electrostatically clamped to the ceramic plate of the substrate support 104 during substrate processing.

[0054] A tunable edge sheath (TES) ring 122 is positioned adjacent to and below the TER 120 on the ceramic plate 103 of the substrate support 104. The TES ring 122 includes an electrode 124 that supplies RF power to the TER 120. The RF power is used to adjust the shape of the plasma 112 near the edge of the substrate 108. The RF power can be adjusted to control the etch uniformity on the substrate 108. Multiple additional edge rings 126, 128 are positioned around the periphery of the substrate support 104.

[0055] An actuator assembly 130 is used to actuate the TES ring 122. Although only one actuator assembly 130 is shown, at least three actuator assemblies 130 are used to actuate the TES ring 122. For example, three actuator assemblies 130 are positioned 120 degrees apart from one another around the periphery of the substrate support 104 and are used to actuate the TES ring 122. The actuator assemblies 130 are described in further detail below with reference to FIGS. 3 and 4.

[0056] Briefly, the actuator assembly 130 includes an actuator 132, a bellows 134, and a rod 136. The actuator 132 and the bellows 134 are attached to the bottom of the substrate support 104 (i.e., the bottom of the processing chamber 102). The bellows 134 is disposed between the actuator 132 and the bottom of the processing chamber 102. One end of the rod 136 is coupled to the actuator 132 through the bellows 134. The distal end of the rod 136 passes through the substrate support 104 and is inserted into and fixed to the TES ring 122.

[0057] Bellows 134 is shown and described in more detail below with reference to FIG. 3. TER 120, TES ring 122, and rod 136 are in processing chamber 102 under vacuum, while actuator 132 and bellows 134 are at atmospheric pressure. Thus, O-ring seals used above and below bellows 134 maintain the vacuum within processing chamber 102. O-ring seals are shown and described in more detail below with reference to FIG. 3.

[0058] In use, the actuator 132 moves the rod 136 up and down through the bellows 134, causing the TES ring 122 to move up and down relative to the TER 120. As the actuator 132 moves the rod 136 up and down, the bellows 134 flexes (e.g., compresses and expands) like an accordion. When the TER 120 clamps to the substrate support 104, the actuator 132 and rod 136 move the TES ring 122 downward, causing the bellows 134 to expand. Thus, the TES ring 122 does not interfere with the clamping of the TER 120. During substrate processing, after the TER 120 is clamped, the actuator 132 and rod 136 move the TES ring 122 upward, causing the bellows 134 to compress and bring the TES ring 122 into contact with the TER 120. During substrate processing, electrodes 124 in the TES ring 122 supply RF power to the TER 120 to adjust the shape of the plasma 112 near the edge of the substrate 108. The RF power can be adjusted to control the etch uniformity on the substrate 108.

[0059] A temperature sensing assembly 140 is used to measure the temperature of the TES ring 122. Although only one temperature sensing assembly 140 is shown, at least three temperature measurement assemblies 140 are disposed around the substrate support 104 and used to measure the temperature of the TES ring 122. For example, the three temperature measurement assemblies 140 are spaced 120 degrees apart from one another and radially offset from the three actuator assemblies 130. The temperature sensing assemblies 140 are described in further detail below with reference to FIGS. 5 and 6.

[0060] Briefly, the temperature sensing assembly 140 includes a temperature probe 142 and a temperature sensor 143. The temperature sensor 143 is mounted (i.e., attached) on one end of the temperature probe 142 and senses the temperature of the TES ring 122. The temperature sensing assembly 140 further includes a bellows 144 and a spring assembly 146. The bellows 144 and the spring assembly 146 are mounted to the bottom of the substrate support 104 (i.e., the bottom of the processing chamber 102). The bellows 144 is disposed between the spring assembly 146 and the bottom of the processing chamber 102. The distal end of the temperature probe 142 passes through the substrate support 104 and the bellows 144 and is coupled to the spring assembly 146.

[0061] Bellows 144 and spring assembly 146 are shown and described in further detail below with reference to Figure 5. Bellows 144 and spring assembly 146 are at atmospheric pressure, while temperature probe 142 and temperature sensor 143 are in processing chamber 102 under vacuum. Therefore, O-ring seals are used above and below bellows 144 to maintain the vacuum within processing chamber 102. O-ring seals are shown and described in further detail below with reference to Figure 5.

[0062] In use, as the TES ring 122 is moved up and down, the temperature probe 142 also moves freely up and down through the bellows 144, as will be described in more detail below with reference to FIG. 5. As the temperature probe 142 moves up and down, the bellows 144 flexes (e.g., compresses and expands) like an accordion. Thus, the temperature probe 142 does not interfere with the clamping of the TER 120. Additionally, as the TES ring 122 is moved up and down, the spring assembly 146 provides the necessary force to keep the temperature sensor 143 in contact with the TER 120, as will be described in more detail below with reference to FIGS. 5 and 6. Thus, the temperature of the TER 120 can be accurately sensed.

[0063] 1, the substrate support 104 further includes a heater 150 and cooling channels 152. The heater 150 is disposed on the ceramic plate 103 of the substrate support 104 below the electrode 118. The heater 150 heats the substrate 108 during substrate processing. The cooling channels 152 are disposed in the base plate 105 of the substrate support 104. A coolant supply 160 circulates coolant through the cooling channels 152 to control the temperature of the substrate support 104 and the substrate 108 during substrate processing.

[0064] A temperature controller 162 receives the temperature of the substrate support 104 from a temperature sensor (not shown) disposed on the substrate support 104. The temperature controller 162 also receives the temperature of the TER 120 from the temperature sensor 144 of the temperature measurement assembly 140. Based on the temperatures of the substrate support 104 and the TER 120, the temperature controller 162 controls the heater 150 and the supply of coolant from the coolant supply 160 through the cooling channels 152.

[0065] The substrate processing system 100 further includes a gas delivery system 170 that supplies various gases (e.g., process gases, purge gases, cleaning gases, etc.) to the processing chamber 102. The gas delivery system 170 includes a gas source 172, a valve 174, and a mass flow controller (MFC) 176. The gas source 172 supplies various gases to the MFC 176 through the valve 174. The MFC 176 controls the flow rates of the gases. The MFC 176 supplies the gases at the controlled flow rates to a mixing manifold 182.

[0066] Additionally, gas delivery system 170 includes a vapor delivery system 178 that delivers one or more vaporized precursors used in some processes. Vapor delivery system 178 delivers the vaporized precursors through valve 180 to a mixing manifold 182. The gas (or gas mixture) from mixing manifold 182 is delivered to showerhead 106 via a valve system 184 that is attached to showerhead 106.

[0067] The substrate processing system 100 further includes an RF power supply 186 that supplies RF power to the showerhead 106 to generate a plasma 112 during substrate processing. The RF power supply 186 includes an RF generator 188 and a matching circuit 190. The RF generator 188 generates RF power. The matching circuit 190 performs impedance matching and outputs the RF power to the showerhead 106. When a process gas is supplied to the showerhead 106, the RF power supply 186 supplies RF power to the showerhead 106 to generate the plasma 112.

[0068] The substrate processing system 100 further includes a vacuum pump 192 connected to the processing chamber 102 via a valve 194. The vacuum pump 192 maintains a vacuum within the processing chamber 102. The vacuum pump 192 also evacuates reactants from the processing chamber 102. The substrate processing system 100 further includes a controller 196. The controller 196 controls the operation of all of the components of the substrate processing system 100 described above and below.

[0069] TES Actuator Assembly Figures 3 and 4 show the actuator assembly 130 in more detail. Figure 3 shows the lower portion of the actuator assembly 130. Figure 4 shows the upper portion of the actuator assembly 130. Figure 3 shows a cross-sectional view of the bellows 134. Figure 4 shows a cross-sectional view of the rod 136 and the TES ring 122.

[0070] 3, bellows 134 includes elements 200, 202, and 204. Elements 200, 202, and 204 are made of a polymer (e.g., polytetrafluoroethylene (PTFE)). The material does not erode or deform during substrate processing in processing chamber 102, and arcing does not occur. Elements 200, 202, and 204 of bellows 134 are fabricated as a single, integrated, monolithic structure rather than as separate elements. Element 202 is flexible and extends between elements 200 and 204. Element 202 expands and compresses like an accordion. Elements 200 and 204 are described in further detail below.

[0071] The bellows 134 is generally cylindrical in shape with a hollow volume along its center through which the rod 136 passes. The rod 136 is coupled to the actuator 132 (shown in FIGS. 1 and 2) by a shaft (also called a peak rod) 206. The shaft 206 is inserted into the center of the rod 132 through the lower end of the rod 136. A nut 208 at the lower end of the shaft 206 secures the shaft 206 to the rod 132. The lower end of the shaft 206 is connected to the actuator 132.

[0072] Bellows 134 is housed in a hollow, cylindrical casing 210. Casing 210 can be made of a plastic material or another type of material. Casing 210 includes a vertical portion 211 and a base portion 213. Vertical portion 211 surrounds element 202. The top end of vertical portion 211 is attached to the bottom of element 200. The bottom end of vertical portion 211 is attached to the radially outer and bottom portions of element 204 of bellows 134 and base portion 213 of casing 210. Base portion 213 has a larger diameter than vertical portion 211 and forms a flange 212 extending radially outward. Flange 212 is attached to the body of actuator 132 (shown in FIGS. 1 and 2).

[0073] Element 204 of bellows 134 includes a flat portion 214 at the bottom of element 204 and a wedge-shaped portion 216 on the inside of element 204. Flat portion 214 rests on nut 208. Wedge-shaped portion 216 tapers radially inward from the top of element 204 toward bottom flat portion 214.

[0074] The element 200 of the bellows 134 comprises a flat portion 218 at the bottom of the element 200. The element 200 of the bellows 134 comprises a wedge-shaped portion 220 on the outside of the element 200. The flat portion 218 of the element 200 rests on the upper end of the vertical portion 211 of the casing 210. The wedge-shaped portion 220 tapers radially outward from the top of the flat portion 218. The upper end of the wedge-shaped portion 220 is flat. The upper end of the wedge-shaped portion 220 is attached to the bottom of the base plate 105 of the substrate support 104 (i.e., the bottom of the processing chamber 102).

[0075] An O-ring 222 is disposed around wedge-shaped portion 216 of element 204. An O-ring 224 is disposed around wedge-shaped portion 220 of element 200. O-rings 222 and 224 provide a seal that maintains a vacuum within processing chamber 102 while actuator 132 moves rod 136 freely up and down through element 202. O-rings 222 and 224 do not surround rod 136 and therefore do not drag it.

[0076] The element 202 flexes up and down like an accordion when the actuator 132 moves the rod 136 freely up and down through the element 202, moving the TES ring 122 before and after clamping the TER 120. Therefore, the movement of the rod 136 is not damped by friction. The actuator 132 can precisely control the movement of the rod 136 with minimal force, since no additional force is required to overcome the friction. During substrate processing, the coupling between the TER 120 and the TES ring 122 can be maintained. Additionally, the clamping of the TER 120 is not impeded by the TES ring 122. Therefore, the bellows 134 and the O-rings 222 and 224 not only maintain the vacuum within the processing chamber 102 but also simplify the actuation and movement of the TES ring 122. The flexibility of the element 202 helps maintain the coupling between the TES ring 122 and the TER 120 while ensuring proper clamping of the TER 120.

[0077] FIG. 4 illustrates the coupling between the rods 136 and the TES ring 122 in more detail. The upper ends of the rods 136 are flared radially outward as shown. Alternatively, the upper ends of the rods 136 can include flanges extending radially outward. The upper ends of the rods 136 are configured such that the upper ends of the rods 136 are rigidly attached to the TES ring 122. Thus, the upper ends of the rods 136 can precisely move the TES ring 122 vertically up and down relative to the TER 120 when the actuator 132 actuates the rods 136 in a controlled manner. The precise movement of the TES ring 122 ensures that the TES ring 122 does not interfere with the TER 120 when the TER 120 is clamped to the substrate support 104. Additionally, the precise movement of the TES ring 122 ensures coupling between the TES ring 122 and the TER 120 during substrate processing.

[0078] Temperature Sensing Assembly Figures 5 and 6 show details of the temperature sensing assembly 140. Figure 5 shows a cross-sectional view of the lower portion of the temperature sensing assembly 140. Figure 6 shows a cross-sectional view of the upper portion of the temperature sensing assembly 140.

[0079] 5, like bellows 134, bellows 144 includes elements 200, 202, and 204. While some of the following description of bellows 144 is similar to the description of bellows 134, because the structure of temperature sensing assembly 140 differs from the structure of actuator assembly 130, bellows 144 will again be described in detail for clarity.

[0080] Like bellows 134, elements 200, 202, and 204 are made of a polymer (e.g., polytetrafluoroethylene (PTFE)). The material does not erode or deform, and does not arc, during substrate processing within processing chamber 102. Like bellows 134, elements 200, 202, and 204 of bellows 144 are fabricated as a single, integrated, monolithic structure.

[0081] Bellows 144 includes element 202 extending between elements 200 and 204. Element 202 expands and compresses like an accordion. Bellows 144 is generally cylindrical in shape with a hollow volume along the center through which temperature probe 142 passes. Bellows 144 is housed in a hollow cylindrical casing 230. Casing 230 can be made of a plastic material or another type of material. Casing 230 is described in more detail below.

[0082] Element 204 of bellows 144 includes a flat portion 214 at the bottom of element 204 and a wedge-shaped portion 216 on the inside of element 204. Flat portion 214 rests on nut 208. Wedge-shaped portion 216 tapers radially inward from the top of element 204 toward bottom flat portion 214.

[0083] The element 200 of the bellows 144 includes a flat portion 218 at the bottom of the element 200. The element 200 of the bellows 134 includes a wedge-shaped portion 220 on the outside of the element 200. The flat portion 218 of the element 200 rests on the top end of the casing 230. The wedge-shaped portion 220 tapers radially outward from the top of the flat portion 218. The top end of the wedge-shaped portion 220 is flat. The top end of the wedge-shaped portion 220 is attached to the bottom of the base plate 105 of the substrate support 104 (i.e., the bottom of the processing chamber 102).

[0084] The casing 230 encloses the bellows 144 and the spring assembly 146. The spring assembly 146 includes a spring 250 and a holder 234. For example, the spring 250 is a compression spring. The spring 250 is wound around the holder 234. A flanged ring or nut 232 is inserted into the bottom end of the casing 230. The holder 234 is inserted through the center of the nut 232 into a hollow area in the center of the casing 230. The holder 234 extends through the hollow area of ​​the casing 230 toward the nut 208. The lower portion of the temperature probe 142 passes through the holder 234. The holder 234 holds the lower portion of the temperature probe 142.

[0085] The holder 234 is cylindrical and includes an upper portion 236 and a lower portion 238. The upper portion 236 has a larger diameter than the lower portion 238. Accordingly, a flange 239 is formed at the junction of the upper and lower portions 236, 238. The outer diameter of the upper portion 236 is smaller than the inner diameter of the casing 230. The upper and lower portions 236, 238 are not separate elements. Instead, the upper and lower portions 236, 238 are manufactured as a single, integrated piece, making the holder 234 monolithic. A spring 250 is held between the nut 232 and the flange 239. The spring 250 expands and compresses between the nut 232 and the flange 239 as the holder 234 moves up and down in response to the temperature probe 142 moving up and down with the TES ring 122.

[0086] In some types of temperature probes, a conduit 243 is disposed from near the top of the holder 234 through the bellows 144 and the substrate support 104. The conduit 243 extends to the top of the TES ring 122. The temperature probe 142 passes through the conduit 243. A sealant 240 is disposed around the conduit 243 in the hollow volume between the conduit 243 and the bellows 144. For example, the sealant 240 comprises an epoxy material. A nut 208 at the bottom of the element 204 of the bellows 144 is secured to the sealant 240. The sealant 240 extends downward, under the bellows 144 and under the nut 208, toward the top of the holder 234. The sealant 240 then extends upward around the conduit 243 through the bellows 144 and the substrate support 104, and reaches the top of the TES ring 122 (see FIG. 6 ). The sealant 240 provides a seal against the vacuum used in the processing chamber 102 .

[0087] A spring 250 is disposed between a flange 239 of the holder 234 and the upper end of the nut 232. The spring 250 surrounds a lower portion 236 of the holder 234. When the TES ring 122 is moved downward before clamping the TER 120, the temperature probe 142 and the holder 234 push (i.e., compress) the spring 250 downward, thereby preventing the temperature sensor 143 from interfering with the clamping of the TER 120. After the TER 120 is clamped, when the TES ring 122 is moved upward and contacts the TER 120, the spring 250 expands and pushes the holder 234 and the temperature probe 142 upward, thereby causing the temperature sensor 143 to contact the TER 120 during substrate processing (see FIG. 6 ).

[0088] The element 202 of the bellows 144 flexes up and down like an accordion as the holder 234 and the temperature probe 142 move freely up and down under the control of the spring 250 before and after the TER 120 is clamped. Therefore, the movement of the temperature probe 142 is not damped by friction. The spring 250 can precisely control the movement of the temperature probe 142 with minimal force, since no additional force is required to overcome the friction. Contact between the temperature probe 142 and the TER 120 can be maintained during substrate processing. In addition, the temperature probe 142, which moves freely through the bellows 144 under the control of the spring 250, does not interfere with the clamping of the TER 120.

[0089] Thus, bellows 144 and O-rings 222 and 224 not only maintain the vacuum within processing chamber 102, but also simplify movement of temperature probe 142. As TES ring 122 is moved up and down, the flexibility of element 202 and the force of spring 250 help maintain contact between temperature sensor 143 and TER 120 while ensuring proper clamping of TER 120 without interference from temperature probe 142.

[0090] An O-ring 222 is disposed around wedge-shaped portion 216 of element 204. An O-ring 224 is disposed around wedge-shaped portion 220 of element 200. O-rings 222 and 224 and sealant 240 provide a seal that maintains a vacuum within processing chamber 102 while temperature probe 142 is free to move up and down through element 202. O-rings 222 and 224 do not surround temperature probe 142 and therefore do not drag (i.e., interfere with) the movement of temperature probe 142 or sealant 240 surrounding temperature probe 142.

[0091] FIG. 6 shows the connection between the temperature probe 142 and the TES ring 122 in more detail. The electrode 124 in the TES ring 122 has been omitted to simplify the illustration of other elements. As shown in FIGS. 1 and 2 , the temperature probe 142 passes through an opening in the electrode 124 toward the TER 120. A cavity 260 exists between the conduit 243 of the temperature probe 142 and the sealant 240 near the top of the temperature probe 142, where the temperature sensor 143 is attached to the temperature probe 142. An O-ring 262 is disposed in the cavity 260 around the conduit 243. The O-ring 262 prevents erosion within the temperature probe 142 from chemicals used in the processing chamber 102. The O-ring 262 also prevents erosion of the sealant 240 from chemicals used in the processing chamber 102. The O-ring 262 does not drag (i.e., interfere with) the movement of the temperature probe 142.

[0092] The foregoing description is merely exemplary in nature and is not intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure can be embodied in a variety of forms. Accordingly, while the disclosure includes specific examples, the true scope of the disclosure should not be limited to such examples, as other modifications will become apparent upon review of the drawings, the specification, and the following claims.

[0093] It should be understood that one or more steps in a method may be performed in a different order (or simultaneously) without altering the principles of the present disclosure. Moreover, while each embodiment is described above as having certain features, any one or more of these features described with respect to any embodiment of the present disclosure may be implemented in other embodiments and / or combined with any features of other embodiments (even if such combination is not explicitly described). In other words, the described embodiments are not mutually exclusive, and it is within the scope of the present disclosure to interchange one or more embodiments.

[0094] Spatial and functional relationships between elements (e.g., modules, circuit elements, semiconductor layers, etc.) are described using various terms such as "connected," "engaged," "coupled," "adjacent," "next to," "on," "above," "below," and "disposed." Also, when a relationship between a first element and a second element is described in the above disclosure, unless expressly described as "direct," the relationship may be a direct relationship where no other intervening elements exist between the first element and the second element, or an indirect relationship where one or more intervening elements (spatial or functional) exist between the first element and the second element. As used herein, the phrase "at least one of A, B, and C" should be interpreted in the sense of a logical (A or B or C) using a non-exclusive logical OR, and not in the sense of "at least one of A, at least one of B, and at least one of C."

[0095] In some embodiments, the controller is part of a system, and such a system may be part of the examples described above. Such a system may include semiconductor processing equipment, including one or more processing tools, one or more chambers, one or more processing platforms, and / or specific processing components (such as a wafer pedestal, gas flow system, etc.). These systems may be integrated with electronics for controlling system operation before, during, and after processing of a semiconductor wafer or substrate. Such electronics may be referred to as a "controller" and may control various components or subcomponents of one or more systems.

[0096] The controller may be programmed to control any of the processes disclosed herein depending on the processing requirements and / or type of system, including process gas delivery, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and motion settings, wafer transfer to and from tools and other transport tools connected or interfaced with a particular system, and / or wafer transfer to and from load locks.

[0097] Broadly, a controller may be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receives instructions, issues instructions, controls operations, enables cleaning operations, enables endpoint measurements, etc. Integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors, i.e., microcontrollers, that execute program instructions (e.g., software).

[0098] Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files) that define operational parameters for performing a particular process on or for a semiconductor wafer or for a system. The operational parameters may, in some embodiments, be part of a recipe defined by a process engineer to accomplish one or more processing steps in the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or wafer dies.

[0099] The controller, in some embodiments, may be part of, coupled to, or a combination of a computer that is integrated with, coupled to, or otherwise networked to the system. For example, the controller may be in the "cloud" or all or part of a fab host computer system, allowing remote access of wafer processing. The computer may provide remote access to the system to monitor the current progress of a fabrication operation, review the history of past fabrication operations, review trends or performance criteria from multiple fabrication operations, modify parameters of a current process, set up processing steps following the current process, or initiate a new process.

[0100] In some examples, a remote computer (e.g., a server) can provide a process recipe to the system over a network. Such a network may include a local network or the Internet. The remote computer may include a user interface that allows entry or programming of parameters and / or settings, which are then communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data. Such data identifies parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process being performed and the type of tool the controller is configured to interface with or control.

[0101] Thus, as discussed above, the controller may be distributed, for example, by having one or more individual controllers networked together and cooperating toward a common purpose (such as the processes and controls described herein). An example of a distributed controller for such a purpose would include one or more integrated circuits on the chamber that communicate with one or more integrated circuits located remotely (e.g., at the platform level or as part of a remote computer) and coupled to control the processes in the chamber.

[0102] Exemplary systems may include, but are not limited to, a plasma etch chamber or module, a deposition chamber or module, a spin rinse chamber or module, a metal plating chamber or module, a cleaning chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a tracking chamber or module, and any other semiconductor processing system that may be associated with or used in the fabrication and / or manufacturing of semiconductor wafers.

[0103] As noted above, depending on the process step or steps being performed by the tool, the controller may communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby tools, tools located throughout the factory, a main computer, another controller, or tools used in material transport to and from tool locations and / or load ports in a semiconductor fabrication factory.

Claims

1. 1. An actuator assembly for actuating a plasma conditioning ring in a processing chamber, comprising: an actuator disposed outside the processing chamber, the processing chamber being under vacuum and the actuator being at atmospheric pressure; a rod coupled to the actuator and to the plasma conditioning ring in the processing chamber; a bellows disposed outside the processing chamber between the actuator and the processing chamber, and the rod passes through the bellows and enters the processing chamber; vacuum seals disposed between the bellows and the actuator and between the bellows and the processing chamber, sealing the vacuum within the processing chamber from the atmospheric pressure outside the processing chamber; An actuator assembly comprising:

2. 10. The actuator assembly of claim 1, The actuator assembly, wherein the bellows comprises a polymer.

3. 10. The actuator assembly of claim 1, The actuator assembly, wherein the vacuum seal does not impede movement of the rod through the bellows.

4. 10. The actuator assembly of claim 1, The actuator assembly, wherein the vacuum seal comprises an O-ring.

5. 10. A system comprising the actuator assembly of claim 1, further comprising: a substrate support disposed in the processing chamber and configured to support a substrate; and the plasma conditioning ring disposed on the substrate support; an edge ring positioned adjacent to the plasma conditioning ring around the substrate during substrate processing; a temperature sensing assembly for sensing a temperature of the edge ring, the temperature sensing assembly comprising: a spring assembly disposed external to the processing chamber; a second bellows disposed external to the processing chamber between the spring assembly and the processing chamber; a temperature probe coupled to the spring assembly, the temperature probe passing through the second bellows and the plasma conditioning ring, the spring assembly maintaining contact between the temperature probe and the edge ring.

6. 6. The system of claim 5, The system, wherein the second bellows comprises a polymer.

7. 6. The system of claim 5, further comprising: a second vacuum seal disposed between the second bellows and the spring assembly and between the second bellows and the processing chamber, the second vacuum seal sealing the vacuum within the processing chamber.

8. 8. The system of claim 7, The system wherein the second vacuum seal does not impede movement of the temperature probe through the second bellows.

9. 8. The system of claim 7, The system wherein the second vacuum seal comprises an O-ring.

10. 6. The system of claim 5, The actuator is configured to move the plasma conditioning ring away from the edge ring when the edge ring clamps to the substrate support.

11. 6. The system of claim 5, The actuator is configured to move the plasma conditioning ring into contact with the edge ring after the edge ring is clamped to the substrate support.

12. 6. The system of claim 5, The system, wherein the temperature probe moves with the plasma conditioning ring when the actuator actuates the plasma conditioning ring.

13. 6. The system of claim 5, the plasma conditioning ring comprises an electrode that supplies radio frequency power to the edge ring, and the actuator is configured to move the plasma conditioning ring during substrate processing and maintain coupling between the plasma conditioning ring and the edge ring.

14. 6. The system of claim 5, the temperature probe comprises a temperature sensor attached to an end of the temperature probe proximate the plasma conditioning ring, and the spring assembly is configured to maintain contact between the temperature sensor and the edge ring.

15. 6. The system of claim 5, The system further comprises an electrode that supplies radio frequency power to the edge ring, and the temperature probe passes through the electrode and contacts the edge ring.

16. 6. The system of claim 5, the spring assembly includes a spring disposed around a holder, and the temperature probe passes through the holder; a sealant disposed around the temperature probe, the sealant extending from the holder through the second bellows, the substrate support, and the plasma conditioning ring to seal the vacuum within the processing chamber; Equipped with system.

17. 17. The system of claim 16, The system, wherein the sealant comprises an epoxy material.

18. 17. The system of claim 16, The temperature sensing assembly further comprises a second seal disposed around the temperature probe in the plasma conditioning ring to prevent erosion of the temperature probe and the sealant.

19. 20. The system of claim 18, The system wherein the second seal comprises an O-ring.

20. a substrate support disposed within the processing chamber under vacuum and supporting a substrate; an edge ring disposed around the substrate on the substrate support; a plasma conditioning ring disposed adjacent to the edge ring on the substrate support; an actuator assembly for actuating the plasma conditioning ring, the actuator assembly comprising: an actuator coupled to an exterior of the processing chamber, the actuator being at atmospheric pressure; a rod coupled to the actuator and the plasma adjustment ring; a bellows disposed outside the processing chamber between the actuator and the processing chamber, the rod passing through the bellows; and vacuum seals disposed between the bellows and the actuator and between the bellows and the processing chamber to seal the vacuum within the processing chamber from the atmospheric pressure outside the processing chamber.

21. 21. The system of claim 20, The system wherein the vacuum seal does not impede movement of the rod through the bellows.

22. 21. The system of claim 20, further comprising: a spring assembly coupled to an exterior of the processing chamber; a second bellows disposed external to the processing chamber between the spring assembly and the processing chamber; a temperature probe coupled to the spring assembly, the temperature probe passing through the second bellows and the plasma conditioning ring, the spring assembly maintaining contact between the temperature probe and the edge ring. ,system.

23. 23. The system of claim 22, The system further comprises a second vacuum seal disposed between the second bellows and the spring assembly and between the second bellows and the processing chamber to seal the vacuum within the processing chamber.

24. 24. The system of claim 23, The system wherein the second vacuum seal does not impede movement of the temperature probe through the second bellows.

25. 21. The system of claim 20, The actuator is configured to move the plasma conditioning ring away from the edge ring when the edge ring clamps to the substrate support.

26. 21. The system of claim 20, The actuator is configured to move the plasma conditioning ring into contact with the edge ring after the edge ring is clamped to the substrate support.

27. 23. The system of claim 22, The system, wherein the temperature probe moves with the plasma conditioning ring when the actuator actuates the plasma conditioning ring.

28. 21. The system of claim 20, the plasma conditioning ring comprises an electrode that supplies radio frequency power to the edge ring, and the actuator is configured to move the plasma conditioning ring during substrate processing and maintain coupling between the plasma conditioning ring and the edge ring.

29. 23. The system of claim 22, the temperature probe comprises a temperature sensor attached to an end of the temperature probe proximate the plasma conditioning ring, and the spring assembly is configured to maintain contact between the temperature sensor and the edge ring.

30. 23. The system of claim 22, The system further comprises an electrode that supplies radio frequency power to the edge ring, and the temperature probe passes through the electrode and contacts the edge ring.

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