Optical integrated confinement system

Abstract

The optically integrated confinement device system comprises a confinement device chip having a confinement device formed thereon and at least one device optical element disposed and / or formed thereon.

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to U.S. Application No. 18 / 475,479, filed September 27, 2023, which claims priority to U.S. Application No. 63 / 378,124, filed October 3, 2022, the entire contents of which are incorporated herein by reference.

[0002] Various embodiments relate to devices, systems and methods related to optically integrated confinement devices, quantum processors comprising optically integrated confinement devices, quantum computers comprising optically integrated confinement devices, and / or the like. One example embodiment relates to an optically integrated confinement device system comprising a confinement device chip having at least one optical element disposed and / or formed thereon and / or therein. [Background technology]

[0003] When using ion traps to perform quantum computing, quantum computer gates and other functions are performed by applying laser beams to ions confined within the ion trap. Delivering these laser beams to large-scale quantum computers is a significant challenge due to the low ion height above the trap, the Rayleigh range of the laser beam, and the amount of laser power that must be delivered to the ions in the trap to perform the functions of the quantum computer. Through a commitment of effort, ingenuity, and innovation, many of the deficiencies of prior laser beam application techniques have been overcome by developing solutions structured in accordance with embodiments of the present invention, many examples of which are described in detail herein. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] U.S. Application Serial No. 16 / 717,602 [Patent Document 2] U.S. Application No. 17 / 533587 [Patent Document 3] U.S. Application No. 17 / 810,082 [Patent Document 4] U.S. Application No. 63 / 200,263 [Patent Document 5] U.S. Patent Application No. 63 / 363,506 [Patent Document 6] U.S. Application Serial No. 17 / 653,979 Summary of the Invention [Means for solving the problem]

[0005] Example embodiments provide various systems comprising at least one optically integrated confinement device, including apparatus, systems, and corresponding methods for optically integrated confinement devices, quantum processors (e.g., quantum charge-coupled device (QCCD)-based quantum processors) and / or quantum computers comprising at least one optically integrated confinement device. In various embodiments, the optically integrated confinement device system comprises a confinement device chip on which electrical components are disposed and / or formed. The electrical components include electrodes configured to define a confinement region within which the quantum object may be confined. In various embodiments, the quantum object is a neutral or ionic atom, a neutral, ionic, or multipolar molecule, a quantum particle, a quantum dot, and / or other object having a quantum state that can be manipulated and / or controlled.

[0006] In various embodiments, the confinement device chip further includes one or more optical elements disposed and / or formed thereon. In various embodiments, the one or more optical elements are configured to provide respective optical manipulation signals to respective object locations defined within the confinement region of the confinement device and / or to receive / detect respective optical signals emitted by respective quantum objects located at the respective object locations. In various embodiments, the one or more optical elements include passive and / or active optical elements.

[0007] In various embodiments, the confinement device chip defines a device plane. In various embodiments, the optically integrated confinement device system includes one or more bridge chips, each defining a respective bridge plane. The respective bridge planes are coplanar with the device plane. Each of the one or more bridge chips may have one or more optical elements disposed thereon and / or formed therein. In various embodiments, the optically integrated confinement device system includes one or more delivery chips. In various embodiments, the delivery chip may be disposed within or external to the cryogenic and / or vacuum chamber within which the confinement device chip is disposed. An example of a delivery chip is a cloud chip. In various embodiments, the optically integrated confinement device system includes one or more cloud chips, each defining a respective cloud plane that is parallel to but not coplanar with the device plane. Each of the one or more cloud chips may have one or more optical elements disposed thereon and / or formed therein.

[0008] According to one aspect of the present disclosure, an optically integrated confinement device system is provided. In one example embodiment, the optically integrated confinement device system comprises a confinement device chip having a confinement device formed thereon and at least one device optical element disposed and / or formed thereon.

[0009] In an example embodiment, the at least one device optical element comprises at least one of a diffractive optical element, a passive metasurface, an active metasurface, an optical modulator, a low-loss waveguide, an amplifier, a laser, a photodetector, a grating coupler, a beam splitter, an edge coupler, an optical local oscillator, a taper, a reference cavity, an optical absorbing structure, an anti-reflective coating, an optical wiring element, or a resonant structure.

[0010] In one example embodiment, the optical integrated confinement device system further comprises at least one of (a) a bridge chip having at least one bridge optical element disposed and / or formed thereon or (b) a delivery chip having at least one delivery optical element disposed and / or formed thereon.

[0011] In an example embodiment, the at least one bridge optical element and / or the at least one delivery optical element comprises at least one of a diffractive optical element, a passive metasurface, an active metasurface, an optical modulator, a low-loss waveguide, an amplifier, an on-chip laser, a photodetector, a grating coupler, an optical splitter, an edge coupler, an optical local oscillator, a taper, a reference cavity, an optical absorbing structure, an anti-reflection coating, an optical interconnect element, or a resonant structure.

[0012] In one example embodiment, the delivery chip is a cloud chip.

[0013] In one example embodiment, the optical integrated confinement device system is configured for operation under cryogenic and / or ultra-high vacuum conditions.

[0014] In an example embodiment, at least one of (a) the at least one device optical element, (b) the at least one bridge optical element, or (c) the at least one delivery optical element is configured to be coupled to an optical fiber configured to provide an operating signal to at least one of (a) the at least one device optical element, (b) the at least one bridge optical element, or (c) the at least one delivery optical element that is generated outside of a cryogenic and / or vacuum chamber within which the optical integrated confinement device system is located.

[0015] In one example embodiment, at least one of (a) the at least one device optical element, (b) the at least one bridge optical element, or (c) the at least one delivery optical element is configured to be coupled to an optical fiber via a fiber block.

[0016] In one example embodiment, the optical integrated confinement device system is fabricated at least in part using pick and place techniques.

[0017] According to one aspect, a quantum processor is provided. In one example embodiment, the quantum processor comprises a cryogenic and / or vacuum chamber and an optically integrated confinement device system disposed within the cryogenic and / or vacuum chamber. The optically integrated confinement device system comprises a confinement device chip having a confinement device formed thereon and at least one device optical element disposed and / or formed thereon.

[0018] According to one aspect, a quantum computer is provided. In one example embodiment, the quantum computer includes a quantum processor and a controller. The controller is configured to control one or more active optical elements disposed on at least one of a confinement device chip, a bridge chip, or a cloud chip. The quantum processor includes a cryogenic and / or vacuum chamber and an optically integrated confinement device system disposed within the cryogenic and / or vacuum chamber. The optically integrated confinement device system includes a confinement device chip having a confinement device formed thereon and at least one device optical element disposed and / or formed thereon.

[0019] According to another aspect, a QCCD-based quantum system is provided. In one example embodiment, the QCCD-based quantum system comprises a confinement device (a) defining a plurality of locations, (b) operable to confine quantum objects, and (c) formed on a confinement device chip. The confinement device is operable to confine each quantum object at a respective one of the plurality of locations and to provide transport of each quantum object between each of the plurality of locations. The QCCD-based quantum system further comprises a signal manipulation system configured to provide an optical signal to at least one of the respective locations. The signal manipulation system comprises at least one device optical element disposed and / or formed on the confinement device chip.

[0020] In an example embodiment, the at least one device optical element comprises at least one of a diffractive optical element, a passive metasurface, an active metasurface, an optical modulator, a low-loss waveguide, an amplifier, a laser, a photodetector, a grating coupler, a beam splitter, an edge coupler, an optical local oscillator, a taper, a reference cavity, an optical absorbing structure, an anti-reflective coating, an optical wiring element, or a resonant structure.

[0021] In one example embodiment, the signal management system further comprises at least one of (a) a bridge tip having at least one bridge optical element disposed and / or formed thereon or (b) a delivery tip having at least one delivery optical element disposed and / or formed thereon.

[0022] In an example embodiment, the at least one bridge optical element and / or the at least one delivery optical element comprises at least one of a diffractive optical element, a passive metasurface, an active metasurface, an optical modulator, a low-loss waveguide, an amplifier, an on-chip laser, a photodetector, a grating coupler, an optical splitter, an edge coupler, an optical local oscillator, a taper, a reference cavity, an optical absorbing structure, an anti-reflection coating, an optical interconnect element, or a resonant structure.

[0023] In one example embodiment, the delivery chip is a cloud chip.

[0024] In one example embodiment, at least a portion of the confinement device and signal management system is configured for operation under cryogenic and / or ultra-high vacuum conditions.

[0025] In an example embodiment, at least one of (a) the at least one device optical element, (b) the at least one bridge optical element, or (c) the at least one delivery optical element is configured to be coupled to an optical fiber configured to provide an operating signal to at least one of (a) the at least one device optical element, (b) the at least one bridge optical element, or (c) the at least one delivery optical element that is generated outside of a cryogenic and / or vacuum chamber within which the optical integrated confinement device system is located.

[0026] In one example embodiment, at least one of (a) the at least one device optical element, (b) the at least one bridge optical element, or (c) the at least one delivery optical element is configured to be coupled to an optical fiber via a fiber block.

[0027] In one example embodiment, at least one of (a) the at least one device optical element, (b) the at least one bridge optical element, or (c) the at least one delivery optical element is part of a photonic integrated circuit disposed and / or formed on one of the (i) device chip, (ii) bridge chip, or (iii) delivery chip, and the at least one photonic integrated circuit disposed and / or formed on one of the (i) device chip, (ii) bridge chip, or (iii) delivery chip is at least partially fabricated using pick-and-place techniques.

[0028] In one example embodiment, the plurality of locations defines an array of locations, and the signal management system is configured to selectively provide optical signals to set locations within the array of locations.

[0029] In one example embodiment, the signal management system is configured to selectively provide optical signals to set locations within an array of locations substantially simultaneously.

[0030] According to another aspect, a quantum processor is provided. In one example embodiment, the quantum processor comprises a cryogenic and / or vacuum chamber and a QCCD-based quantum system disposed within the cryogenic and / or vacuum chamber.

[0031] According to yet another aspect, a quantum computer is provided. In one example embodiment, the quantum computer comprises a quantum processor and a controller configured to control one or more active optical elements disposed on at least one of the confinement device chip, the bridge chip, or the delivery chip.

[0032] Having thus described the invention in general terms, reference will now be made to the accompanying drawings, which are not necessarily drawn to scale. [Brief explanation of the drawings]

[0033] [Figure 1] FIG. 1 is a schematic diagram illustrating an example quantum computing system including an optical integrated confinement device, according to an example embodiment. [Figure 2] 1 is a schematic top view of a portion of an optical integrated confinement device, according to an example embodiment. [Figure 3] 1 is a schematic cross-sectional view of an optical integrated confinement device, according to an example embodiment; [Figure 4] FIG. 1 is a schematic diagram of an example controller of a quantum computer configured to control the operation of one or more active optical elements of an optical integrated confinement device, according to various embodiments. [Figure 5] FIG. 1 is a schematic diagram of example computational entities of a quantum computer system that may be used in accordance with an example embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0034] The present invention will now be described more fully hereinafter with reference to the accompanying drawings, which illustrate some, but not all, embodiments of the invention. Indeed, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. The term "or" (also written " / ") is used herein in both a disjunctive and conjunctive sense unless otherwise indicated. The terms "exemplary" and "illustrative" are used for examples without an indication of a level of quality. The terms "substantially," "about," and "approximately" refer to within workmanship and / or manufacturing tolerances and / or user measurement capabilities, unless otherwise indicated. Like numbers refer to like elements throughout.

[0035] Example embodiments provide various systems comprising at least one optically integrated confinement device, including apparatus, systems, and corresponding methods for optically integrated confinement devices, quantum processors (e.g., quantum charge-coupled device (QCCD)-based quantum processors) and / or quantum computers comprising at least one optically integrated confinement device. In various embodiments, the optically integrated confinement device system comprises a confinement device chip on which electrical components are disposed and / or formed. The electrical components include electrodes configured to define a confinement region within which a quantum object may be confined.

[0036] In various embodiments, the optically integrated confinement device system is a QCCD-based quantum system that includes a confinement device configured to confine quantum objects, and a signal management system, at least a portion of which (e.g., at least one device optical element) is located on the same substrate and / or chip as the electrical components (e.g., electrodes) of the confinement device. As used herein, the term device optical element refers to an optical element formed and / or located on the confinement device chip.

[0037] In various embodiments, the confinement device chip further includes one or more optical elements disposed and / or formed thereon. In various embodiments, the one or more optical elements are configured to provide respective optical manipulation signals to respective object locations defined within the confinement region of the confinement device and / or to receive / detect respective optical signals emitted by respective quantum objects located at the respective object locations. In various embodiments, the one or more optical elements include passive and / or active optical elements.

[0038] In various embodiments, the confinement device chip defines a device plane. In various embodiments, the optical-integrated confinement device system includes one or more bridge chips, each defining a respective bridge plane. The respective bridge planes are coplanar with the device plane. Each of the one or more bridge chips may have one or more bridge optical elements disposed and / or formed thereon and / or therein. As used herein, a bridge optical element is an optical element formed and / or disposed on the bridge chip. In various embodiments, the bridge chip includes zero or more inputs and one or more outputs. In various embodiments, the bridge chip is configured to provide operating and / or other optical signals to one or more optical elements disposed on the confinement device chip. In various embodiments, the bridge chip may span a region with varying temperatures and / or pressures (e.g., within a cryogenic and / or vacuum chamber within which the confinement device chip is disposed).

[0039] In various embodiments, the optically integrated confinement device system includes one or more delivery tips. In various embodiments, the delivery tips are configured to provide operational and / or other optical signals to one or more optical elements, one or more bridge chips, and / or defined locations of the confinement device disposed on the confinement device tip. For example, in various embodiments, the delivery tip includes one or more delivery optical elements. As used herein, a delivery optical element is an optical element disposed and / or formed on the delivery tip.

[0040] In various embodiments, the delivery tip may be located within or external to the cryogenic and / or vacuum chamber within which the confinement device tip is located. In various embodiments, the delivery tip may be configured in various physical orientations. For example, the delivery tip defines a delivery tip plane that may be located in various orientations relative to the device plane. For example, in one example embodiment, the delivery tip is attached to a wall and / or shielding surface of the cryogenic and / or vacuum chamber within which the confinement device tip is located.

[0041] An example of a delivery tip is a cloud tip. In various embodiments, an optically integrated confinement device system comprises one or more cloud tips, each defining a respective cloud plane that is parallel to but not coplanar with the device plane. Each of the one or more cloud tips may have one or more optical elements disposed and / or formed thereon and / or within it.

[0042] In various embodiments, the bridge tip and / or delivery tip may be located in a region of substantially constant temperature and / or pressure conditions. For example, the bridge tip and / or delivery tip may be located within the working region of the cryogenic and / or vacuum chamber such that the bridge tip and / or delivery tip are operated under cryogenic and / or ultra-high vacuum conditions. In various embodiments, the confinement device tip is located within the working region of the cryogenic and / or vacuum chamber and configured to be operated under cryogenic and / or ultra-high vacuum conditions. The bridge tip and / or delivery tip may be located in an intermediate region of the cryogenic and / or vacuum chamber (e.g., within the cryogenic and / or vacuum chamber but in an intermediate region thereof that experiences an intermediate temperature and / or pressure between the ambient temperature and / or pressure outside the cryogenic and / or vacuum chamber and the extremely low cryogenic temperature and ultra-high vacuum conditions within the working region of the cryogenic and / or vacuum chamber). In one example embodiment, the delivery tip may be located outside the cryogenic and / or vacuum chamber. In various embodiments, the bridge tip and / or delivery tip may be partially disposed in and / or extend across one or more regions of the cryogenic and / or vacuum chamber. As used herein, a region of the cryogenic and / or vacuum chamber includes the working region of the cryogenic and / or vacuum chamber (e.g., having cryogenic temperature and ultra-high vacuum conditions), the intermediate region of the cryogenic and / or vacuum chamber (e.g., having intermediate temperature and intermediate pressure), and the ambient region (e.g., having ambient / room temperature and / or ambient / atmospheric pressure) directly outside the cryogenic and / or vacuum chamber. For example, a portion of the bridge tip and / or delivery tip may be disposed in the working region of the cryogenic and / or vacuum chamber, and a portion of the bridge tip may be disposed in the intermediate region of the cryogenic and / or vacuum chamber.

[0043] In various embodiments, the confinement device chip defines a plurality and / or an array of defined locations. For example, the confinement device chip may be configured such that application of appropriate voltage signals to its electrical components (e.g., electrodes) generates electrical potentials configured to confine quantum objects at the defined locations. In various embodiments, subarrays of defined locations may be configured to perform specific functions (e.g., readout functions, performing single-qubit or multi-qubit (e.g., two-qubit) gates, and / or others). In various embodiments, optical elements disposed on the confinement device chip, bridge chip, and / or delivery chip configured to perform specific functions are arranged on their respective chips / substrates accordingly.

[0044] In various embodiments, the optically integrated confinement device system is part of a system (e.g., a quantum processor, a quantum computer, and / or other atomic and / or quantum system) that includes a signal management system. For example, in various embodiments, a QCCD-based quantum system is provided that includes a confinement device and a signal management system, one or more optical elements of which are formed and / or disposed on the confinement device chip on which the confinement device is formed and / or disposed. For example, the system may include a signal management system configured to generate, provide, or control parameters (e.g., wavelength, intensity, phase, polarization, and / or other) of electromagnetic signals applied to one or more locations within the optically integrated confinement device system for the purpose of controlling the quantum states of one or more quantum objects confined by the optically integrated confinement device. In various embodiments, one or more of the components (active and / or passive components) of the signal management system are formed and / or disposed on the confinement device chip itself, the bridge chip, and / or the cloud chip.

[0045] For example, the signal management system comprises active and / or passive optical elements configured to generate, provide, collect / detect, and / or control parameters of the operating signals applied to various locations defined by the optical integrated confinement device. In various embodiments, the optical elements of the signal management system comprise one or more diffractive optical elements, passive metasurfaces, active metasurfaces, optical modulators, low-loss waveguides, amplifiers, on-chip lasers, photodetectors, grating couplers, beam splitters, edge couplers, optical local oscillators, tapers, reference cavities, optical absorbing structures, anti-reflective coatings, optical interconnect elements, resonant structures, and / or the like. In various embodiments, various optical elements of the signal management system have electronic components associated therewith (e.g., the optical elements may be active optical elements with electrically controlled aspects), while other optical elements of the signal management system do not have electronic components associated therewith (e.g., the optical elements may be passive optical elements and / or active elements controlled via techniques other than electrical signal-based control).

[0046] In various embodiments, the quantum object is a neutral or ionic atom, a neutral, ionic, or multipolar molecule, a quantum particle, a quantum dot, and / or other object having a quantum state that can be manipulated and / or controlled. The quantum object may be a qubit quantum object of a quantum object crystal comprising two or more quantum objects, and in one example embodiment, the two or more quantum objects of the quantum object crystal are composed of ions of at least two different atomic numbers, for example. In one example embodiment, the optically integrated confinement device system is an ion trap (e.g., a surface ion trap, a Paul trap, and / or others) integrated with one or more optical elements. For example, the ion trap may be formed, defined, and / or disposed on a confinement device chip. The confinement device chip may be associated with one or more bridge chips and / or one or more cloud chips. The device chip, bridge chip, and / or cloud chip may have one or more optical elements formed and / or disposed thereon.

[0047] Conventionally, laser beams are provided to locations within an ion trap through the use of external lasers and free-space optics configured to provide the laser beam to specific locations within the ion trap. However, the amount of space required for such beam paths is significant (e.g., several square meters) even to provide a laser beam to a relatively small number of defined locations within the ion trap. Additionally, the precision with which a laser beam can be provided to locations within the ion trap through such conventional means may limit the density of defined locations in the ion trap. Furthermore, ion traps are typically utilized within cryogenic and / or vacuum chambers. As such, the laser beam must pass through the cryogenic and / or vacuum chamber and any radiation and / or thermal shielding therein. Thus, technical challenges exist regarding how to provide operating signals to quantum object confinement devices that are efficient and accurately scalable to the size and / or dimensions of the quantum object confinement device. These technical challenges are exacerbated as the size of quantum object confinement devices is scaled up (e.g., as the number of locations defined for the quantum object confinement device increases).

[0048] Various embodiments provide technical solutions to these technical problems. In particular, in various embodiments, optical elements of the signal management system are incorporated into and / or integrated into the optically integrated confinement device. For example, one or more optical elements of the signal management system are disposed within a cryogenic and / or vacuum chamber. For example, one or more optical components of the signal management system are disposed on the confinement device chip (including the confinement device and electrical elements defining its position), one or more bridge chips, and / or one or more cloud chips of the optically integrated confinement device. These one or more optical elements include passive and / or active optical elements. For example, in one example embodiment, the operating signal is generated by an on-chip laser and / or other element formed on the confinement device chip, bridge chip, and / or cloud chip. In various embodiments, one or more elements formed and / or disposed on and / or in the confinement device chip, bridge chip, and / or cloud chip reduce the space requirements for the free-space optical beam path configuration, the number of cryogenic and / or vacuum chamber pass-throughs, and / or other elements. Furthermore, the configuration of the optically integrated confinement device system of the various embodiments eliminates the additional technical problem of signal management systems for larger confinement devices. Thus, the various embodiments provide a technical solution to the technical problem of how to provide operational signals to defined locations such that the operational signals are provided efficiently and effectively to the defined locations even when the defined locations of an array of confinement devices form a two or three dimensional array.

[0049] Example of a quantum computing system with an atomic object confinement device 1 provides a schematic diagram of an example quantum computing system 100 including an optically integrated confinement device system 200, according to an example embodiment. In various embodiments, the optically integrated confinement device system 200 includes a confinement device chip 210, one or more bridge chips 205, one or more cloud chips, and / or others. In various embodiments, the optically integrated confinement device system 200 is disposed within a cryogenic and / or vacuum chamber 40. For example, the confinement device chip 210, one or more bridge chips 205, and / or one or more delivery chips are disposed within the cryogenic and / or vacuum chamber 40. In various embodiments, the electrical elements defining and / or forming the confinement device 212 are formed and / or disposed on the confinement device chip 210.

[0050] In various embodiments, the confinement device chip 210 defines a device plane. In various embodiments, the optical-integrated confinement device system includes one or more bridge chips, each defining a respective bridge plane. The respective bridge planes are coplanar with the device plane. Each of the one or more bridge chips may have one or more optical elements disposed and / or formed thereon. In various embodiments, the optical-integrated confinement device system includes one or more cloud chips, each defining a respective cloud plane that is parallel to the device plane but not coplanar with the device plane. Each of the one or more cloud chips may have one or more optical elements disposed and / or formed thereon.

[0051] In various embodiments, quantum computing system 100 comprises a signal management system. In various embodiments, the signal management system comprises one or more optical elements formed and / or disposed on and / or in device chip 210, bridge chip 205, and / or delivery chip 215. In various embodiments, the signal management system further comprises optical elements formed and / or disposed on and / or in one or more external chips 300 that are external to cryogenic and / or vacuum chamber 40. For example, one or more optical elements formed and / or disposed on and / or in one or more external chips 300 are, in various embodiments, coupled to the respective optical elements formed and / or disposed on and / or in device chip 210, bridge chip 205, and / or delivery chip 215 via optical fibers 86 and / or free-space optics.

[0052] In various embodiments, quantum computing system 100 comprises computational entity 10 and quantum computer 110. In various embodiments, quantum computer 110 comprises controller 30 and quantum processor 115. In various embodiments, the quantum processor comprises a cryogenic and / or vacuum chamber 40 that encloses optically integrated confinement device system 200 (e.g., an ion trap), one or more external chips 300 that comprise components of a signal management system, and one or more voltage sources 50 configured to provide voltage signals to electrical components of optically integrated confinement device system 200.

[0053] In various embodiments, the cryogenic and / or vacuum chamber 40 is a temperature and / or pressure controlled chamber. For example, the quantum computer system 100 may include vacuum and / or temperature control components operatively coupled to the cryogenic and / or vacuum chamber 40.

[0054] In various embodiments, quantum computer 110 comprises one or more voltage sources 50. For example, voltage source 50 may comprise multiple voltage drivers and / or voltage sources and / or at least one RF driver and / or voltage source. Voltage source 50, in an example embodiment, may be electrically coupled to corresponding electrode elements (e.g., electrodes) of confinement device 212. For example, electric and / or electromagnetic fields formed at least in part by applying voltage signals generated by voltage source 50 to electrical elements of the confinement device cause and / or form a confinement region of the confinement device.

[0055] In various embodiments, computational entity 10 is configured to allow a user to provide input to quantum computer 110 (e.g., via a user interface of computational entity 10) and receive, view, and / or otherwise enable output from quantum computer 110. Computational entity 10 may be in communication with a controller 30 of quantum computer 110 via one or more wired or wireless networks 20 and / or via direct wired and / or wireless communication. In an example embodiment, computational entity 10 may convert, organize, format, and / or otherwise translate information / data, quantum computing algorithms and / or circuits, and / or otherwise into a computational language, executable instructions, command set, and / or otherwise that controller 30 can understand and / or implement.

[0056] In various embodiments, controller 30 is configured to control and / or be in electrical communication with voltage source 50, the cryogenic and / or vacuum system controlling the temperature and / or pressure within cryogenic and / or vacuum chamber 40, manipulation source 60, photodetector 70, and / or other systems controlling various environmental conditions (e.g., temperature, pressure, and / or other) within cryogenic and / or vacuum chamber 40, and / or is configured to manipulate and / or effect the controlled evolution of the quantum states of one or more quantum objects within the confinement device. For example, controller 30 may cause a quantum circuit and / or algorithm to be executed by the controlled evolution of the quantum states of one or more quantum objects within the confinement device. For example, controller 30 may cause a readout procedure, including coherent shelving, possibly as part of executing the quantum circuit and / or algorithm. In various embodiments, quantum objects confined within the confinement device are used as qubits in quantum processor 115 and / or quantum computer 110.

[0057] Example of an optical integrated confinement device In various embodiments, the optically integrated confinement device system 200 includes a confinement device 212. The confinement device 212 includes a plurality of electrical elements, such as electrodes in one example embodiment, configured to generate a confinement potential. In various embodiments, the plurality of electrodes of the confinement device 212 are formed and / or disposed on the confinement device chip 210. For example, the controller 30 may control the voltage source 50 to provide electrical signals to the electrodes of the confinement device 212 such that the electrodes generate a confinement potential. The confinement potential is configured to confine the plurality of quantum objects within a confinement volume defined by the confinement device 212. For example, in one example embodiment, the confinement device 212 is a surface ion trap, and the confinement volume is a volume located proximate to the surface of the surface ion trap. In various embodiments, the electrodes and / or the confinement potential are configured to define a plurality of defined positions within the confinement volume.

[0058] In various embodiments, the defined locations are arranged in a one-dimensional or two-dimensional layout. For example, in one example embodiment, the defined locations are arranged along axes of a linear configuration of electrical elements of the optically integrated confinement device. In another example embodiment, the defined locations are arranged in a two-dimensional array or layout defined by a two-dimensional configuration of electrical elements of the optically integrated confinement device. Although example confinement devices with linear configurations of electrical elements are described in U.S. Application No. 16 / 717,602, filed December 17, 2019, various other confinement devices having linear electrical element configurations may be used in various embodiments. Although several example confinement devices having two-dimensional electrical element configurations are described in U.S. Application No. 17 / 533,587, filed November 23, 2021, and U.S. Application No. 17 / 810,082, filed June 30, 2022, various other confinement devices having two-dimensional electrical element configurations may be used in various embodiments. The entire contents of U.S. Application No. 16 / 717,602, filed December 17, 2019, U.S. Application No. 17 / 533587, filed November 23, 2021, and U.S. Application No. 17 / 810,082, filed June 30, 2022, are incorporated herein by reference.

[0059] In various embodiments, voltage source 50 provides a respective electrical signal to each electrical element of confinement device 212 (e.g., each electrode in the series of electrodes 220) such that a confinement potential is formed. Based on the contour and time evolution of the confinement potential (controlled by controller 30 via controlling the operation of voltage source 50), one or more quantum objects are confined to respective defined locations 225 (e.g., 225A, 225C), moved between defined locations, and / or the like. When the quantum objects are located at the defined locations, one or more functions (e.g., quantum computing functions) may be performed on the quantum objects. One example function that may be performed on a quantum object is photoionization of the quantum object. For example, an operation signal 61 (e.g., 61A, 61B) may be applied to a quantum object (e.g., an atom or molecule) to photoionize the quantum object.

[0060] Another example of a function that can be performed on a quantum object is state preparation of the quantum object. For example, one or more manipulation signals 61 may be applied to the quantum object to prepare it into a particular quantum state. For example, the particular quantum state may be a state within a defined qubit space used by a quantum computer such that the quantum object can be used as a qubit in the quantum computer.

[0061] Another example function that can be performed on a quantum object is to read out the quantum state of the quantum object. For example, an operating signal 61 (e.g., a readout signal) may be applied to the quantum object. When the wave function of the quantum object collapses to a first state in qubit space, the quantum object will fluoresce in response to the readout signal being applied to it. When the wave function of the quantum object collapses to a second state in qubit space, the quantum object will not fluoresce in response to the readout signal being applied to it. Photodetectors 70 (e.g., 70A, 70C) configured to receive signals emitted by the quantum objects located at respective defined locations 225 may then detect whether the quantum objects have fluoresced so that the quantum state of the quantum objects can be determined.

[0062] Another example function that can be performed on quantum objects is cooling a quantum object or a quantum object crystal comprising the quantum objects. The quantum object crystal is a pair or set of quantum objects, at least one of the quantum objects in the quantum object crystal is a qubit quantum object used as a qubit in a quantum computer, and at least one quantum object in the quantum object crystal is used to perform cooperative cooling of the qubit quantum objects. For example, an operation signal 61 (e.g., a cooling signal or cooperative cooling signal) may be applied to the quantum object or quantum object crystal to cool the (qubit) quantum object (e.g., reduce the vibrational and / or other kinetic energy of the (qubit) quantum object).

[0063] Another example function that can be performed on a quantum object is shelving the quantum object. In various embodiments, a quantum object in a second state in qubit space may be shelved during a readout function. For example, the shelving operation may include evolving the quantum state of the quantum object in the second state in qubit space to at least a metastable state outside of qubit space while the readout operation is performed. An example shelving process is described by U.S. Application No. 63 / 200,263, filed February 25, 2021, although various other shelving processes may be used in various embodiments. In various embodiments, shelving of the quantum object is performed by applying one or more operating signals to the quantum object while the quantum object is in the second state in qubit space to evolve the quantum state of the quantum object to at least a metastable state outside of qubit space.

[0064] Another example function that can be performed on a quantum object is (optical) repumping of the quantum object. In various embodiments, repumping of the quantum object involves applying one or more operating signals 61 to the quantum object to evolve the quantum state of the quantum object to an excited state.

[0065] Another example function that can be performed on a quantum object is to cause the quantum object to perform a single-qubit gate. For example, one or more operation signals 61 may be applied to the quantum object to cause the quantum object to perform a single-qubit quantum gate (e.g., a single-qubit logic function).

[0066] Another example function that can be performed on a quantum object is to cause the quantum object to perform a two-qubit gate. For example, one or more operation signals 61 may be applied to a pair or set of quantum objects that includes a quantum object to cause the quantum object and at least one other quantum object to perform a two-qubit (or three or more) quantum gate (e.g., a multi-qubit logic function).

[0067] FIG. 2 provides a top view of at least a portion of the optical integrated confinement device system 200, and FIG. 3 provides a cross-sectional view of at least a portion of the optical integrated confinement device system 200 taken along line AA shown in FIG.

[0068] 2, optically integrated confinement device system 200 comprises confinement device chip 210. In various embodiments, confinement device chip 210 is a substrate comprising electrical elements, such as a series of electrodes 220 (e.g., 220A, 220B), configured to generate a confinement potential for optically integrated confinement device system 200. As noted above, in various embodiments, the series of electrodes may be configured to define a one-dimensional or two-dimensional confinement region that defines a plurality of defined locations 225 (e.g., 225A, 225C).

[0069] In various embodiments, the confinement device chip 210 further comprises at least one optical element disposed and / or formed on and / or in the confinement device chip 210. For example, as illustrated in Figure 2, one or more manipulation sources 60 (e.g., 60B), amplifiers 62, beam splitters 64 (e.g., 64A, 64B), optical modulators 66 (e.g., 66A, 66B), signal manipulation elements 68 (e.g., 68A, 68B), photodetectors 70, waveguides 80, grating couplers, edge couplers, tapers, reference cavities, optical absorbing structures, anti-reflection coatings, wiring elements, resonant structures, and / or other optical elements are formed and / or disposed on and / or in the confinement device chip 210.

[0070] As illustrated in FIGS. 2 and 3 , the optically integrated confinement device system 200 further comprises one or more bridge chips 205 in various embodiments. In various embodiments, the confinement device chip 210 defines a device plane. Each bridge chip 205 defines a respective bridge plane that is coplanar with the device plane. Each of the one or more bridge chips 205 has one or more optical elements disposed and / or formed thereon and / or within it. For example, FIG. 2 illustrates a manipulation source 60A formed on the bridge chip 205. In various embodiments, one or more optical elements are formed and / or disposed on and / or within the one or more bridge chips 205, including one or more manipulation sources 60, amplifiers 62, beam splitters 64, optical modulators 66, signal manipulation elements 68, photodetectors 70, waveguides 80, grating couplers, edge couplers, tapers, reference cavities, optical absorbing structures, anti-reflective coatings, wiring elements, resonant structures, and / or other optical elements.

[0071] As shown in FIG. 3, in various embodiments, the optically integrated confinement device system 200 further includes one or more delivery tips 215. An example delivery tip 215 illustrated is a cloud tip. In various embodiments, each cloud tip is a delivery tip 215 that defines a cloud plane that is substantially parallel to, but not coplanar with, the device plane. The delivery tip 215 has one or more optical elements disposed and / or formed thereon. For example, FIG. 3 illustrates a coupler 84 (e.g., a grating coupler, edge coupler, and / or other) and a signal manipulation element 68 (e.g., 68C) formed on the delivery tip 215. In various embodiments, one or more optical elements are formed and / or disposed on and / or in one or more delivery tips 215, including one or more manipulation sources 60, amplifiers 62, beam splitters 64, optical modulators 66, signal manipulation elements 68, photodetectors 70, waveguides 80, grating couplers, edge couplers, tapers, reference cavities, optical absorbing structures, anti-reflective coatings, wiring elements, resonant structures, and / or other optical elements.

[0072] In an example embodiment, the signal management system includes one or more manipulation sources 60 (e.g., 60C) formed and / or disposed on one or more external chips 300 located outside the cryogenic and / or vacuum chamber 40. Manipulation signals 61 (e.g., 61C) generated by the manipulation sources 60 formed and / or disposed on the external chips 300 may be provided to defined locations 225 located within the cryogenic and / or vacuum chamber 40 via free-space optics and / or optical fibers 86 (or other waveguides 80) through windows or pass-throughs 46 formed in the cryogenic and / or vacuum chamber 40. In various embodiments, the optical fibers 86 are coupled to the delivery chip 215, the bridge chip 205, and / or the confinement device 212 via a fiber block 82. In various embodiments, the fiber block 82 secures the optical fibers 86 to each chip of the optical-integrated confinement device system 200 and aligns the cores of the optical fibers 86 with the optical paths of the optical-integrated confinement device. For example, fiber block 82 aligns optical fibers 86 with respective couplers 84 of delivery tip 215 .

[0073] In various embodiments, one or more manipulation sources 60 (formed and / or disposed on and / or within confinement device chip 210, bridge chip 205, delivery chip 215, and / or external chip 300) comprise one or more lasers (e.g., optical lasers, microwave sources, and / or the like). In various embodiments, each manipulation source 60 is configured to generate a manipulation signal 61 having a respective characteristic wavelength in the microwave, infrared, visible, or ultraviolet portion of the electromagnetic spectrum. For example, each characteristic wavelength is configured to effect and / or control one or more particular quantum state evolutions of the quantum objects. In various embodiments, one or more manipulation signals 61 are configured to manipulate and / or effect controlled quantum state evolutions of one or more quantum objects confined by optically integrated confinement device system 200. For example, in one example embodiment, one or more manipulation sources 60 comprise one or more lasers, which may provide one or more laser beams at defined locations where the respective quantum objects are positioned.

[0074] For example, manipulation source 60 generates manipulation signals 61 that are provided to one or more defined locations 225 via respective beam splitters 64, waveguides 80, signal manipulation elements 68, and / or the like. In one example embodiment, one or more optical modulators 66 are configured to control which of the one or more defined locations 225 the manipulation signals 61 are incident on.

[0075] In various embodiments, manipulation source 60 comprises one or more on-chip lasers, stimulated Brillouin scattering (SBS) lasers, external cavity lasers, and / or others. For example, manipulation source 60 may include one or more lasers configured to be disposed within cryogenic and / or vacuum chamber 40, as described by U.S. Patent Application No. 63 / 363,506, filed April 25, 2022, the entire contents of which are incorporated herein by reference. For example, in one example embodiment, manipulation source 60 uses injection locking or injection seeding using an incident laser beam (e.g., generated by a laser external to cryogenic and / or vacuum chamber 40) to ensure a narrow linewidth and / or precise frequency of the resulting manipulation signal 61.

[0076] In various embodiments, one or more amplifiers 62 (formed and / or disposed on and / or in the confinement device chip 210, the bridge chip 205, the delivery chip 215, and / or the external chip 300) comprise one or more cavity resonators, reflective semiconductor optical amplifiers (RSOAs), on-chip amplifiers, harmonic generators, and / or other optical amplifiers. In various embodiments, the amplifiers 62 may be positioned upstream and / or downstream of the respective beam splitters 64.

[0077] In various embodiments, one or more beam splitters 64 (formed and / or disposed on and / or in the confinement device chip 210, bridge chip 205, delivery chip 215, and / or external chip 300) comprise a 1:N beam splitter, where N is a positive integer determined depending on the application. In various embodiments, the beam splitter 64 is configured to process optical beams of sufficient power to perform the respective functions of the quantum computer while exhibiting minimal power absorption. In one example embodiment, the one or more beam splitters 64 include a multimode interferometer (MMI) splitter.

[0078] In various embodiments, the one or more optical modulators 66 (formed and / or disposed on and / or within the confinement device chip 210, the bridge chip 205, the delivery chip 215, and / or the external chip 300) comprise one or more on-chip modulators, modulators with integrated detectors configured to stabilize optical beam parameters such as intensity, phase, and / or frequency, and / or other optical modulators. In an example embodiment, the one or more modulators 66 operate in response to exploitation of the thermal, stress-optic, acousto-optic, or electro-optic effect. In an example embodiment, the one or more modulators 66 provide a SiN-based modulator using the electro-optic effect of lithium niobate (LiNbO) or similar materials. In various embodiments, at least one of the one or more modulators 66 is a switching modulator that exhibits high extinction (e.g., greater than 60 dB or greater than 90 dB) when in the off state. Moreover, the modulators 66 are capable of processing optical beams of sufficient power to perform the respective functions of the quantum computer while exhibiting minimal power absorption.

[0079] In various embodiments, one or more signal manipulation elements 68 (formed and / or disposed on and / or in the confinement device chip 210, bridge chip 205, delivery chip 215, and / or external chip 300) comprise one or more diffractive optical elements (DOEs), passive metamaterial arrays, active metamaterial arrays, and / or other elements, such as lenses, mirrors, and / or the like. For example, the one or more signal manipulation elements may be similar to those described by U.S. Application No. 17 / 653,979, filed March 8, 2022, and / or U.S. Application No. 63 / 363,506, filed April 25, 2022, the entire contents of which are incorporated herein by reference. For example, a signal manipulation element such as a metamaterial array (also known as a metasurface) may be configured to control, for example, one or more of the wavelength, focus, polarization, phase, propagation direction, and / or intensity of a guided beam resulting from a laser beam incident thereon. In one example embodiment, the signal manipulation elements are configured to focus the manipulation signal 61 to the defined location 225 such that the optical intensity supplied to the quantum object located at the defined location 225 is sufficient to perform the corresponding function of the quantum computer while reducing the power density in one or more corresponding waveguides 80 configured to supply the manipulation signal 61 to each signal manipulation element 68.

[0080] In various embodiments, one or more photodetectors 70 are formed and / or disposed on and / or within the confinement device chip 210, bridge chip 205, or delivery chip 215 of the optical-integrated confinement device system 200. For example, the photodetectors 70 are configured to detect one or more photons emitted by quantum objects located at respective defined locations of the optical-integrated confinement device system 200. In various embodiments, the photodetectors 70 may be photodiodes, photomultiplier tubes, charge-coupled device (CCD) sensors, complementary metal-oxide semiconductor (CMOS) sensors, microelectromechanical systems (MEMS) sensors, and / or other photodetectors capable of sensing light at the expected fluorescence wavelengths of the qubits and / or quantum objects of a quantum computer. In various embodiments, the photodetectors 70 are in electronic communication with the controller 30 via one or more A / D converters 425 (see FIG. 4 ) and / or otherwise. For example, a quantum object being read out and / or whose quantum state is being determined may emit an emission signal, at least a portion of which is incident on a photodetector 70 (e.g., formed and / or disposed on and / or in a surface of the confinement device chip 210) of the signal management system. The emission signal incident on the photodetector 70 causes the photodetector 70 to generate an electrical signal that is passed to the controller 30.

[0081] In various embodiments, one or more waveguides 80 (e.g., low-loss waveguides) are formed and / or disposed on and / or in the confinement device chip 210, the bridge chip 205, the delivery chip 215, and / or the external chip 300. In various embodiments, the waveguides 80 are low-loss waveguides in that they exhibit an optical loss of about 5 dB / cm or less at the respective wavelengths of the optical beams to be transmitted along the respective waveguides. For example, in various embodiments, the waveguides 80 are formed from specially formed SiN and / or Al2O3 films configured to have low optical loss at short wavelengths (e.g., blue, violet, and / or ultraviolet wavelengths). In one example embodiment, one or more of the waveguides 80 include a 90° circular bend with a bend radius of only 20 μm. In one example embodiment, the waveguides 80 include an offset between the straight and bent portions of the waveguide 80 to achieve better mode overlap at the junction between the straight and bent portions. In various embodiments, waveguide 80 includes an Euler bend, an inverted 90° bend, and / or the like. In various embodiments, waveguide 80 is configured to transmit an optical beam (e.g., steering signal 61) between various optical elements of a signal management system.

[0082] In various embodiments, the one or more optical elements formed and / or disposed on and / or in the confinement device chip 210, bridge chip 205, delivery chip 215 include one or more couplers 84. In various embodiments, the coupler 84 comprises one or more grating couplers, edge couplers, tapers, and / or the like. In an example embodiment, a grating coupler, edge coupler, and / or taper is used to couple the steering signal into one or more waveguides 80. In an example embodiment, a grating coupler is used to decouple the steering signal 61 toward the defined location 225. In various embodiments, the grating coupler may include one or more of a uniform grating coupler, an apodized focusing grating coupler, a two-dimensional grating coupler, and / or the like.

[0083] In various embodiments, an apodized focusing grating coupler is designed to provide a focused beam at a respective wavelength, angle, and polarization (e.g., transverse electric (TE) or transverse magnetic (TM)) to each defined location 225. For example, the grating coupler may focus the manipulation signal 61 to the defined location such that the optical intensity provided to the quantum object located at the defined location 225 is sufficient to perform the corresponding function of the quantum computer while reducing the power density in one or more corresponding waveguides 80 configured to provide the manipulation signal 61 to the coupler 84. In one example embodiment, the apodized focusing grating coupler is configured to allow both forward and backward emission. In one example embodiment, the apodized focusing grating coupler includes a bottom reflector. In one example embodiment, the coupler 84 is a two-layer apodized focusing grating coupler that is only capable of emitting the manipulation signal 61 in a direction toward each defined location 225.

[0084] In various embodiments, coupler 84 includes a two-dimensional grating coupler capable of providing circular polarization manipulation signal 61 to defined location 225. In various embodiments, the two-dimensional grating coupler includes two TE gratings with a 90° phase offset and a bottom reflector. In an example embodiment, the two-dimensional grating coupler includes one or more photonic metasurfaces. In an example embodiment, the one or more photonic metasurfaces are configured to convert linearly polarized light to circularly polarized light. In an example embodiment, the one or more photonic metasurfaces are configured to rotate the polarization direction of the linearly polarized light. In various embodiments, the one or more photonic metasurfaces are configured to generate and / or effect any polarization conversion, generate a phase profile of the light emitted from / output by the coupler, act as a focusing element, and / or provide angle correction to split the decoupled light.

[0085] In one example embodiment, the couplers 84 include angle-adjusting couplers that use index-tuned or tunable encapsulants to control the beam steering of the steering signals decoupled by each coupler 84. For example, the index of refraction of the encapsulant of the couplers 84 may be adjusted to fine-tune and / or optimize the delivery of each steering signal 61 to each defined location 225, to compensate for manufacturing or design errors and / or the like.

[0086] In various embodiments, coupler 84 comprises an edge coupler for coupling steering signal 61 from one or more optical fibers 86 into waveguide 80 .

[0087] In various embodiments, various other optical elements may be formed and / or disposed on and / or in the confinement device chip 210, the bridge chip 205, and / or the delivery chip 215. For example, an optical local oscillator, a reference cavity, and / or the like may be formed and / or disposed on and / or in the confinement device chip 210, the bridge chip 205, and / or the delivery chip 215.

[0088] In various embodiments, one or more optical elements disposed and / or formed on and / or in the confinement device chip 210, the bridge chip 205 and / or the delivery chip 215 are configured for use in performing one or more functions on one or more quantum objects disposed at respective defined locations.

[0089] In various embodiments, each of the optical elements of the optically integrated confinement device system 200 (e.g., disposed on and / or in the confinement device chip 210, the bridge chip 205, and / or the delivery chip 215) is configured to operate under cryogenic (e.g., temperatures below 120 K) and / or ultra-high vacuum (e.g., pressures below 100 nanopascals) conditions.

[0090] In various embodiments, the confinement device chip 210, the bridge chip 205, the cloud chip 210, and / or the external chip 300 are fabricated at least in part using pick-and-place techniques.

[0091] Technical Advantages Various embodiments provide technical solutions to accurately and efficiently delivering manipulation signals to quantum objects and / or collecting signatures of emission signals emitted by quantum objects. These various solutions are scalable to provide signal delivery and / or collection for large one- or multi-dimensional (e.g., two-dimensional) confinement devices.

[0092] Conventionally, laser beams are provided to locations within an ion trap through the use of external lasers and free-space optics configured to provide the laser beam to specific locations within the ion trap. However, the amount of space required for such beam paths is significant (e.g., several square meters) even to provide a laser beam to a relatively small number of defined locations within the ion trap. Additionally, the precision with which a laser beam can be provided to locations within the ion trap through such conventional means may limit the density of defined locations in the ion trap. Furthermore, ion traps are typically utilized within cryogenic and / or vacuum chambers. As such, the laser beam must pass through the cryogenic and / or vacuum chamber and any radiation and / or thermal shielding therein. Thus, technical challenges exist regarding how to provide operating signals to quantum object confinement devices that are efficient and accurately scalable to the size and / or dimensions of the quantum object confinement device. These technical challenges are exacerbated as the size of quantum object confinement devices is scaled up (e.g., as the number of locations defined for the quantum object confinement device increases).

[0093] Various embodiments provide technical solutions to these technical problems. In particular, in various embodiments, optical elements of the signal management system are incorporated into and / or integrated into the optically integrated confinement device. For example, one or more optical elements of the signal management system are disposed within a cryogenic and / or vacuum chamber. For example, one or more optical components of the signal management system are disposed on the confinement device chip (including the confinement device and electrical elements defining its position), one or more bridge chips, and / or one or more cloud chips of the optically integrated confinement device. These one or more optical elements include passive and / or active optical elements. For example, in one example embodiment, the operating signal is generated by an on-chip laser and / or other element formed on the confinement device chip, bridge chip, and / or cloud chip. In various embodiments, one or more elements formed and / or disposed on and / or in the confinement device chip, bridge chip, and / or cloud chip reduce the space requirements for the free-space optical beam path configuration, the number of cryogenic and / or vacuum chamber pass-throughs, and / or other elements. Furthermore, the configuration of the optically integrated confinement device system of the various embodiments eliminates the additional technical problem of signal management systems for larger confinement devices. Thus, the various embodiments provide a technical solution to the technical problem of how to provide operational signals to defined locations such that the operational signals are provided to the defined locations efficiently and effectively even when the defined locations of the confinement device form a two or three dimensional array.

[0094] Illustrative Controller In various embodiments, optically integrated confinement device system 200 is incorporated into a system (e.g., quantum computer 110) that includes controller 30. In various embodiments, controller 30 is configured to control various elements of the system (e.g., quantum computer 110). For example, controller 30 may be configured to control voltage source 50, a cryogenic and / or vacuum system that controls the temperature and pressure within cryogenic and / or vacuum chamber 40, manipulation source 60, a refrigeration system, and / or other systems that control environmental conditions (e.g., temperature, humidity, pressure, and / or other) within cryogenic and / or vacuum chamber 40, and / or to manipulate and / or effect the controlled evolution of the quantum states of one or more quantum objects confined by optically integrated confinement device system 200. In various embodiments, controller 30 may be configured to receive signals from one or more photodetectors 70.

[0095] As shown in FIG. 4 , in various embodiments, the controller 30 may include various controller elements, including a processing element 405, a memory 410, a driver controller element 415, a communication interface 420, an analog-to-digital converter element 425, and / or others. For example, the processing element 405 may be comprised of a programmable logic device (CPLD), a microprocessor, a coprocessing entity, an application-specific instruction set processor (ASIP), an integrated circuit, an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a programmable logic array (PLA), a hardware accelerator, other processing devices and / or circuitry, and / or others, and / or controllers. The term circuitry may refer to an entirely hardware embodiment or a combination of hardware and a computer program product. In one example embodiment, the processing element 405 of the controller 30 includes and / or communicates with a clock.

[0096] For example, memory 410 may be comprised of non-transitory memory such as volatile and / or non-volatile memory storage such as one or more of a hard disk, ROM, PROM, EPROM, EEPROM, flash memory, MMC, SD memory card, memory stick, CBRAM, PRAM, FeRAM, RRAM, SONOS, racetrack memory, RAM, DRAM, SRAM, FPM DRAM, EDO DRAM, SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, RDRAM, RIMM, DIMM, SIMM, VRAM, cache memory, register memory, and / or others. In various embodiments, memory 410 may store a queue of commands to be executed (e.g., an executable queue) to cause quantum algorithms and / or circuits to run, qubit records corresponding to qubits in a quantum computer (e.g., in a qubit record data store, qubit record database, qubit record table, and / or other), calibration tables, computer program code (e.g., in one or more computer languages, dedicated controller languages, and / or other), and / or other. In an example embodiment, execution of at least a portion of the computer program code stored in memory 410 (e.g., by processing element 405) causes controller 30 to perform one or more steps, operations, processes, procedures and / or the like described herein to provide operational signals to atomic object locations and / or collect, detect, capture and / or measure indicia of emission signals emitted by quantum objects located at corresponding defined locations of optical integrated confinement device system 200.

[0097] In various embodiments, driver controller element 415 may include one or more drivers and / or controller elements each configured to control one or more drivers. In various embodiments, driver controller element 415 may comprise a driver and / or a driver controller. For example, a driver controller may be configured to operate one or more corresponding drivers according to executable instructions, commands, and / or the like scheduled and executed by controller 30 (e.g., by processing element 405). In various embodiments, driver controller element 415 may enable controller 30 to operate voltage source 50, manipulation source 60, cooling system, and / or the like. In various embodiments, a driver may be a laser driver configured to operate one or more manipulation sources 60 to generate manipulation signals, a vacuum component driver, a driver for controlling the flow of current and / or voltage applied to electrodes used to maintain and / or control the trapping potential of optical-integrated confinement device system 200 (and / or other driver for providing driver action sequences to potential-generating elements of the optical-integrated confinement device), a cryogenic and / or vacuum system component driver, a cooling system driver, and / or the like. In various embodiments, the controller 30 comprises means for communicating and / or receiving signals from one or more optical receiver components (e.g., optical detector 70). For example, the controller 30 may comprise one or more analog-to-digital converter elements 425 configured to receive signals from one or more optical receiver components (e.g., optical detectors of a light collection system), calibration sensors, and / or the like.

[0098] In various embodiments, controller 30 may comprise a communications interface 420 for interfacing and / or communicating with computational entity 10. For example, controller 30 may comprise a communications interface 420 for receiving executable instructions, command sets, and / or the like from computational entity 10, and for providing to computational entity 10 outputs received from quantum computer 110 (e.g., from a light-collecting system) and / or results of processing the outputs. In various embodiments, computational entity 10 and controller 30 may communicate via a direct wired and / or wireless connection and / or via one or more wired and / or wireless networks 20.

[0099] Illustrative Computational Entities 5 provides an illustrative schematic diagram depicting an example computational entity 10 that can be used in conjunction with embodiments of the present invention. In various embodiments, computational entity 10 is configured to enable a user to provide input to quantum computer 110 (e.g., via a user interface of computational entity 10) and receive, display, analyze, and / or otherwise process output from quantum computer 110.

[0100] 5, computing entity 10 may include an antenna 512, a transmitter 504 (e.g., wireless), a receiver 506 (e.g., wireless), and a processing element 508 that respectively provides signals to transmitter 504 and receives signals from receiver 506. The signals respectively provided to transmitter 504 and received from receiver 506 may include signal information / data according to an air interface standard of an applicable wireless system for communicating with various entities, such as controller 30, other computing entities 10, and / or others. In this regard, computing entity 10 may be capable of operating with one or more air interface standards, communication protocols, modulation types, and access types. For example, computing entity 10 may be configured to receive and / or provide communications using a wired data transmission protocol, such as Fiber Distributed Data Interface (FDDI), Digital Subscriber Line (DSL), Ethernet, Asynchronous Transfer Mode (ATM), Frame Relay, Data Over Cable Service Interface Specification (DOCSIS), or any other wired transmission protocol.Similarly, the computing entity 10 may be configured to support General Packet Radio Service (GPRS), Universal Mobile Telecommunications System (UMTS), Code Division Multiple Access 2000 (CDMA2000), CDMA2000 The mobile station may be configured to communicate over a wireless external communications network using any of a variety of protocols, such as 1X (1xRTT), Wideband Code Division Multiple Access (WCDMA), Global System for Mobile Communications (GSM), Enhanced Data Rates for GSM Evolution (EDGE), Time Division Synchronous Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), Evolved Universal Terrestrial Radio Access Network (E-UTRAN), Evolution Data Optimized (EVDO), High Speed ​​Packet Access (HSPA), High Speed ​​Downlink Packet Access (HSDPA), IEEE 802.11 (Wi-Fi), Wi-Fi Direct, 802.16 (WiMAX), Ultra Wideband (UWB), Infrared (IR) protocol, Near Field Communication (NFC) protocol, Wibree, Bluetooth protocol, Wireless Universal Serial Bus (USB) protocol, and / or any other wireless protocol. Computing entity 10 may communicate using such protocols and standards, including Border Gateway Protocol (BGP), Dynamic Host Configuration Protocol (DHCP), Domain Name System (DNS), File Transfer Protocol (FTP), Hypertext Transfer Protocol (HTTP), HTTP over TLS / SSL / Secure, Internet Message Access Protocol (IMAP), Network Time Protocol (NTP), Simple Mail Transfer Protocol (SMTP), Telnet, Transport Layer Security (TLS), Secure Sockets Layer (SSL), Internet Protocol (IP), Transmission Control Protocol (TCP), User Datagram Protocol (UDP), Datagram Congestion Control Protocol (DCCP), Stream Control Transmission Protocol (SCTP), Hypertext Markup Language (HTML), and / or others.

[0101] Through these communication standards and protocols, computing entity 10 can communicate with various other entities using concepts such as Unstructured Supplementary Service Information / Data (USSD), Short Message Service (SMS), Multimedia Message Service (MMS), Dual Tone Multifrequency Signaling (DTMF), and / or Subscriber Identity Module Dialer (SIM Dialer). Computing entity 10 can also download, for example, changes, add-ons, and updates to its firmware, software (including, for example, executable instructions, applications, program modules), and operating system.

[0102] In various embodiments, computational entity 10 may comprise a network interface 520 for interfacing and / or communicating with, for example, controller 30. For example, computational entity 10 may comprise a network interface 520 for providing executable instructions, command sets, and / or the like for receipt by controller 30 and / or for receiving outputs provided by quantum computer 110 and / or results of processing the outputs. In various embodiments, computational entity 10 and controller 30 may communicate via a direct wired and / or wireless connection and / or via one or more wired and / or wireless networks 20.

[0103] Computing entity 10 may also include user interface devices comprising one or more user input / output interfaces (e.g., a display 516 and / or speakers / speaker drivers coupled to processing element 508, as well as a touchscreen, keyboard, mouse, and / or microphone coupled to processing element 508). For example, the user output interface may be configured to run on and / or be accessible via computing entity 10 and provide a display or audible presentation of information / data and to provide an application, browser, user interface, interface, dashboard, screen, web page, page, and / or similar terms used interchangeably herein for interaction therewith via one or more user input interfaces. The user input interface may consist of any of several devices that allow computing entity 10 to receive data, such as a keypad 518 (hard or soft), a touch display, a voice / language or motion interface, a scanner, reader, or other input device. In embodiments including a keypad 518, the keypad 518 may include (or provide a representation of) conventional numeric (0-9) and related keys (#, *), as well as other keys used to operate the computing entity 10, and may include a set of alphabetic keys, or a set of keys that can be activated to provide a set of alphanumeric keys. In addition to providing input, the user input interface may be used to activate or deactivate certain functions, such as, for example, a screen saver and / or sleep mode. Through such input, the computing entity 10 may collect information / data, user interaction / input, and / or other information / data.

[0104] Computational entity 10 may also include volatile storage or memory 522 and / or non-volatile storage or memory 524, which may be embedded and / or removable. For example, the non-volatile memory may be ROM, PROM, EPROM, EEPROM, flash memory, MMC, SD memory card, memory stick, CBRAM, PRAM, FeRAM, RRAM, SONOS, racetrack memory, and / or the like. The volatile memory may be RAM, DRAM, SRAM, FPM DRAM, EDO DRAM, SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, RDRAM, RIMM, DIMM, SIMM, VRAM, cache memory, registered memory, and / or the like. The volatile and non-volatile storage or memory may store databases, database instances, database management system entities, data, applications, programs, program modules, scripts, source code, object code, byte code, compiled code, interpreted code, machine code, executable instructions, and / or the like to implement the functionality of computational entity 10.

[0105] conclusion Many modifications and other embodiments of the inventions set forth herein will come to mind to one skilled in the art to which these inventions pertain having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. It is to be understood, therefore, that the invention is not limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation. [Explanation of symbols]

[0106] 10 Computational Entities 20 Network 30 Controllers 40 Cryogenic and / or Vacuum Chambers 46 Pass-Through 50 Voltage Source 60 Operation source 61 Operation Signal 62 Amplifier 64 Beam Splitter 66 Optical Modulator 68 Signal Control Element 70 Photodetector 80 Waveguide 82 Fiber Block 84 Combiner 86 Optical Fiber 100 Quantum Computing System 110 Quantum Computer 115 Quantum Processor 200 Optical Integrated Confinement Device System 205 Bridge Chip 210 Confinement Device Chip 212 Confinement Device 215 Delivery Chip 220 electrode 225 Definition Position 300 external chips 405 Processing Elements 410 memory 415 Driver Controller Elements 420 Communication Interface 425 Analog-to-Digital Converter Elements 504 Transmitter 506 Receiver 508 Processing Elements 512 Antenna 516 Display 518 keypad 520 Network Interface 522 Volatile Memory 524 Non-volatile memory

Claims

1. An optically integrated confinement device system comprising a confinement device chip having a confinement device formed thereon and at least one device optic disposed and / or formed thereon.

2. 10. The optical integrated confinement device system of claim 1, wherein the at least one device optical element comprises at least one of a diffractive optical element, a passive metasurface, an active metasurface, an optical modulator, a low-loss waveguide, an amplifier, a laser, a photodetector, a grating coupler, a beam splitter, an edge coupler, an optical local oscillator, a taper, a reference cavity, an optical absorbing structure, an anti-reflective coating, an optical wiring element, or a resonant structure.

3. 10. The optical integrated confinement device system of claim 1, further comprising at least one of: (a) a bridge chip having at least one bridge optical element disposed and / or formed thereon; or (b) a delivery chip having at least one delivery optical element disposed and / or formed thereon.

4. 4. The optical integrated confinement device system of claim 3, wherein the at least one bridge optical element and / or the at least one delivery optical element comprises at least one of a diffractive optical element, a passive metasurface, an active metasurface, an optical modulator, a low-loss waveguide, an amplifier, an on-chip laser, a photodetector, a grating coupler, an optical splitter, an edge coupler, an optical local oscillator, a taper, a reference cavity, an optical absorbing structure, an anti-reflection coating, an optical interconnect element, or a resonant structure.

5. The optical integrated confinement device system of claim 3 , wherein the delivery chip is a cloud chip.

6. The optical integrated confinement system of claim 1 , wherein the optical integrated confinement system is configured for operation under cryogenic and / or ultra-high vacuum conditions.

7. 7. The optical-system integrated confinement system of claim 6, wherein at least one of (a) the at least one device optical element, (b) the at least one bridge optical element, or (c) the at least one delivery optical element is configured to be coupled to an optical fiber configured to provide an operating signal to the at least one of (a) the at least one device optical element, (b) the at least one bridge optical element, or (c) the at least one delivery optical element that is generated outside of a cryogenic and / or vacuum chamber within which the optical-system integrated confinement system is disposed.

8. 8. The optical integrated confinement device system of claim 7, wherein the at least one of (a) the at least one device optical element, (b) the at least one bridge optical element, or (c) the at least one delivery optical element is configured to be coupled to the optical fiber via a fiber block.

9. The optical-system integrated confinement system of claim 1 , wherein the optical-system integrated confinement system is fabricated at least in part using pick-and-place techniques.

10. a confinement device (a) defining a plurality of locations; (b) operable to confine quantum objects; and (c) a confinement device formed on a confinement device chip, the confinement device operable to confine each quantum object at each of the plurality of locations and to provide transport of each quantum object between each of the plurality of locations; a signal manipulation system configured to provide an optical signal to at least one of said respective locations, said signal manipulation system comprising at least one device optical element disposed and / or formed on said confinement device chip; A QCCD-based quantum system comprising:

11. 11. The quantum system of claim 10, wherein the at least one device optical element comprises at least one of a diffractive optical element, a passive metasurface, an active metasurface, an optical modulator, a low-loss waveguide, an amplifier, a laser, a photodetector, a grating coupler, a beam splitter, an edge coupler, an optical local oscillator, a taper, a reference cavity, an optical absorbing structure, an anti-reflective coating, an optical wiring element, or a resonant structure.

12. 11. The quantum system of claim 10, wherein the signal management system further comprises at least one of: (a) a bridge chip having at least one bridge optical element disposed and / or formed thereon; or (b) a delivery chip having at least one delivery optical element disposed and / or formed thereon.

13. 13. The quantum system of claim 12, wherein the at least one bridge optical element and / or the at least one delivery optical element comprises at least one of a diffractive optical element, a passive metasurface, an active metasurface, an optical modulator, a low-loss waveguide, an amplifier, an on-chip laser, a photodetector, a grating coupler, an optical splitter, an edge coupler, an optical local oscillator, a taper, a reference cavity, an optical absorption structure, an anti-reflection coating, an optical wiring element, or a resonant structure.

14. 13. The quantum system of claim 12, wherein the delivery chip is a cloud chip.

15. 11. The quantum system of claim 10, wherein at least a portion of the confinement device and the signal management system are configured to operate under cryogenic and / or ultra-high vacuum conditions.

16. 16. The quantum system of claim 15, wherein at least one of (a) the at least one device optical element, (b) the at least one bridge optical element, and (c) the at least one delivery optical element is configured to be coupled to an optical fiber configured to provide an operating signal generated outside of a cryogenic and / or vacuum chamber, and wherein an optical integrated confinement device system is disposed within the cryogenic and / or vacuum chamber for the at least one of (a) the at least one device optical element, (b) the at least one bridge optical element, and (c) the at least one delivery optical element.

17. 17. The quantum system of claim 16, wherein the at least one of (a) the at least one device optical element, (b) the at least one bridge optical element, or (c) the at least one delivery optical element is configured to be coupled to the optical fiber via a fiber block.

18. 11. The quantum system of claim 10, wherein at least one of (a) the at least one device optical element, (b) the at least one bridge optical element, or (c) the at least one delivery optical element is part of a photonic integrated circuit disposed and / or formed on a respective one of (i) the device chip, (ii) bridge chip, or (iii) delivery chip, and wherein the at least one photonic integrated circuit disposed and / or formed on the respective one of (i) the device chip, (ii) bridge chip, or (iii) delivery chip is fabricated at least in part using pick-and-place techniques.

19. 11. The quantum system of claim 10, wherein the plurality of locations define an array of locations, and wherein the signal management system is configured to selectively provide optical signals to set locations within the array of locations.

20. 20. The quantum system of claim 19, wherein the signal management system is configured to selectively provide the optical signals to the set locations within the array of locations substantially simultaneously.

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