Increased data throughput using metal brackets

Abstract

Aspects of the present disclosure configure a memory subsystem processor to improve heat dissipation and increase data transfer rates using a triangular-shaped metal bracket. The triangular-shaped metal bracket is physically attached to an edge of a PCB at the base of the triangular-shaped metal bracket. The triangular-shaped metal bracket, along with heat spreaders on the primary and secondary sides (top and bottom) of the bracket, is thermally coupled to the set of memory components and a processing device of the PCB through the base. The triangular-shaped metal bracket is configured to dissipate heat from the processing device and set of memory components to at least a host device through the apex of the triangular-shaped metal bracket.

Description

[Technical Field]

[0001] Priority application This application claims the benefit of priority to U.S. Application No. 18 / 385,191, filed October 30, 2023, which in turn claims the benefit of priority to Indian Patent Application No. 202241067040, filed November 22, 2022, all of which are incorporated herein by reference in their entirety.

[0002] FIELD Embodiments of the present disclosure relate generally to memory subsystems, and more particularly to providing thermal management and heat dissipation. [Background technology]

[0003] The memory subsystem may be a storage system, such as a solid-state drive (SSD), and may include one or more memory components that store data. The memory components may be, for example, non-volatile memory components and volatile memory components. In general, a host system may utilize the memory subsystem to store data in and retrieve data from the memory components.

[0004] The present disclosure will be more fully understood from the following detailed description and accompanying drawings of various embodiments of the disclosure. [Brief explanation of the drawings]

[0005] [Figure 1] FIG. 1 is a block diagram illustrating an exemplary computing environment including a memory subsystem, in accordance with some embodiments of the present disclosure. [Figure 2] 1 is a diagram of an exemplary physical assembly of a memory subsystem with a triangular metal bracket according to some embodiments of the present disclosure. [Figure 3]1A-1C are block diagrams of different views of an exemplary physical assembly of a memory controller with a triangular-shaped metal bracket, according to some embodiments of the present disclosure. [Figure 4A] FIG. 1 is a flow diagram of an exemplary method for performing data throughput management and heat dissipation in accordance with some embodiments of the present disclosure. [Figure 4B] FIG. 1 is a flow diagram of an exemplary method for manufacturing a physical assembly of a memory subsystem with a triangular-shaped metal bracket, according to some embodiments of the present disclosure. [Figure 5] FIG. 1 is a block diagram illustrating a diagrammatic representation of a machine in the form of a computer system upon which a set of instructions can be executed to cause the machine to perform any one or more of the methods described herein, according to some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0006] Aspects of the present disclosure configure a system component, e.g., a memory subsystem processor or controller such as a power management unit or module, to control data throughput (e.g., transferring data between a host and a memory component mounted on a motherboard) based on heat dissipated through a triangular-shaped metal bracket. In response to detecting that the temperature of the processor or memory exceeds a threshold or reference temperature, the memory subsystem processor or controller adjusts (e.g., throttles or reduces) the data throughput (the rate at which data is exchanged with a host or sent from the processor to an external component) to reduce the temperature. When the temperature no longer exceeds the threshold or reference temperature, the processor or controller increases the data throughput (e.g., increases the rate at which data is exchanged). The temperature can be controlled (e.g., minimized or reduced) to extend the time period during which data throughput is throttled or adjusted not only using a triangular-shaped metal bracket thermally coupled to one of the memory subsystem components, such as a memory controller, memory component, and / or memory cell, but also through one or more heat spreaders thermally coupled to the triangular-shaped metal bracket and the memory subsystem component. The triangular metal bracket can be coupled via the ground plane of a printed circuit board (PCB) and configured to dissipate heat to a host device such as a motherboard using screws, similar to a heat sink. This ensures that memory system performance remains optimal and avoids significant throttling or degradation of data throughput with minimal additional hardware. This improves the overall efficiency of the memory subsystem's operation and implementation.

[0007] A memory subsystem can be a storage device, a memory module, or a hybrid of a storage device and a memory module. Examples of storage devices and memory modules are described below in connection with FIG. 1. In general, a host system can utilize a memory subsystem that includes one or more memory components, such as a memory device (e.g., a memory die) that stores data. The host system can send access requests (e.g., write commands, read commands) to the memory subsystem to store data in the memory subsystem, read data from the memory subsystem, etc. Data (or sets of data) specified by the host are hereinafter referred to as “host data,” “application data,” or “user data.”

[0008] The memory subsystem may initiate media management operations, such as write operations, on host data stored on the memory device. For example, firmware in the memory subsystem may rewrite previously written host data from a location on the memory device to a new location as part of a garbage collection management operation. The rewritten data, e.g., when initiated by firmware, is hereinafter referred to as "garbage collection data." "User data" may include host data and garbage collection data. Hereinafter, "system data" refers to data created and / or maintained by the memory subsystem to perform operations in response to host requests and for media management. Examples of system data include, but are not limited to, system tables (e.g., logical-to-physical address mapping tables), data from logging, scratch pad data, etc.

[0009] Many different media management operations can be performed on a memory device. For example, media management operations can include different scan speeds, different scan frequencies, different wear leveling, different read disturb management, different near-miss error correction (ECC), and / or different dynamic data refresh. Wear leveling ensures that all blocks in a memory component approach their defined erase cycle budget at the same time, rather than some blocks approaching their defined erase cycle budget earlier than others. Read disturb management counts all read operations to a memory component. If a certain threshold is reached, the surrounding area is refreshed. Near-miss ECC refreshes all data read by an application that exceeds a set threshold of errors. Dynamic data refresh scan reads all data and identifies the error status of all blocks as a background operation. This scan-read triggers a refresh operation if a certain threshold of errors per block or ECC unit is exceeded.

[0010] The memory device may be a non-volatile memory device. A non-volatile memory device is a package of one or more dies. Each die may consist of one or more planes. For some types of non-volatile memory devices (e.g., NAND devices), each plane consists of a set of physical blocks. In some memory devices, a block is the smallest area that can be erased. Each block consists of a set of pages. Each page consists of a set of memory cells that store bits of data. The memory device may be a raw memory device (e.g., NAND) that is externally managed, for example, by an external controller. The memory device may be a managed memory device (e.g., managed NAND), which is a raw memory device combined with a local embedded controller for memory management within the same memory device package.

[0011] In the case of high-temperature memory devices and / or memory controllers, efficiently managing or executing media management operations on a typical memory device can be challenging. Specifically, a typical memory subsystem is implemented on a PCB and distributes components on the PCB in a manner that minimizes heat buildup in certain components. In some cases, specialized hardware, such as heat sinks physically attached to corresponding components, can be used to improve component heat dissipation and cooling. If a memory device / controller becomes too hot (e.g., reaches a temperature above a threshold temperature), the typical device may begin throttling or reducing data transfer rates and slowing certain operations in an attempt to reduce operating temperatures. While these systems and approaches generally work well, the need to add these large heat sinks to reduce power can consume a large amount of physical real estate on the PCB and may exceed the maximum allowable dimensions that the PCB and components on the PCB are allowed to reach in order to properly mate and connect to a host device, such as a motherboard. As a result, fewer memory components can be added, and because heat sinks are not always included, components reach threshold temperatures very quickly, reducing the overall data throughput and speed at which the memory subsystem can operate.

[0012] Aspects of the present disclosure address the above and other shortcomings by providing a triangular metal bracket that can improve heat dissipation and function as a heat sink, thermally coupled to one or more memory components, such as a memory processor and / or memory die or cells, without violating any specifications, such as maximum height, width, and length limits or PCB space constraints. The triangular metal bracket can collect heat dissipated by the memory components by being coupled through the PCB's ground layer and transfer the heat to the air and to a host device, such as a motherboard, to which the triangular metal bracket is screwed and to which the memory components are connected, such as through an interface (e.g., an M.2 interface). This provides heat sinks to various components on the PCB without requiring heat sinks to be placed directly on each individual component, which would violate certain specifications and constraints. In this way, the operating temperature of the memory system can be maintained at a relatively low level (e.g., below a threshold temperature) for a longer period of time than typical systems, which can prolong, delay, or prevent throttling of data throughput and degradation of the memory system's performance. This can improve the efficiency with which the memory system operates and reduce the amount of physical resources consumed by the memory subsystem.

[0013] Furthermore, the triangular metal bracket can be physically coupled to the PCB and shaped to ensure that the PCB mounting the memory component meets the physical specifications of the underlying host device and reduces the number of mounting holes in the motherboard. For example, the triangular metal bracket can be formed from a fixed length to extend the length of the PCB to meet the minimum length of the corresponding slot in the host device. That is, the host device may include an 80-millimeter memory slot, but the PCB is only 30 millimeters or 42 millimeters long. In such cases, the triangular metal bracket can be formed to 50 millimeters or 38 millimeters and attached flush to the PCB to ensure that the PCB and triangular metal bracket securely fit properly within the 80-millimeter memory slot. In addition to providing heat dissipation to the host device, the triangular metal bracket can reduce shock to the PCB by absorbing some of the shock, further increasing the rigidity of the PCB and improving the overall reliability of the memory component mounted on the PCB.

[0014] In some examples, a system is provided that includes a PCB that mounts a set of memory components of a memory subsystem and a processing device operably coupled to the set of memory components. The system includes a triangular metal bracket having a base and an apex. The triangular metal bracket is physically attached to an edge of the PCB at the base and thermally coupled to the set of memory components and the processing device of the PCB via the base. The triangular metal bracket is configured to dissipate heat from the processing device and the set of memory components to at least the host device via the apex, for example, by one or more screws connecting the triangular metal bracket to the host device. The processing device is configured to perform operations, including measuring a temperature of at least one of the processing device or the set of memory components and adjusting a data transfer rate based on the measured temperature of the processing device or the set of memory components.

[0015] In some examples, the PCB includes an M.2 interface through which the set of memory components and the processing device communicate with the host device, the M.2 interface being mounted on the PCB on an edge opposite the edge of the PCB to which the triangular-shaped metal bracket is physically attached. In some examples, the PCB includes multiple layers with a ground layer. Both the set of memory components and the processing device are coupled to the triangular-shaped metal bracket through the ground layer. In some examples, the triangular-shaped metal bracket is physically attached to the edge of the PCB using thermal epoxy.

[0016] In some examples, the edge of the PCB includes a rounded recess and the base of the triangular-shaped metal bracket includes a rounded protrusion configured to securely fit within the rounded recess to physically attach the triangular-shaped metal bracket to the edge of the PCB. In some examples, the size of the base of the triangular-shaped metal bracket corresponds to the width of the PCB measured from first and second sides of the PCB adjacent the edge of the PCB.

[0017] In some examples, the length of the PCB, measured between another edge of the PCB opposite the edge of the PCB, corresponds to a first length that is smaller than the minimum length associated with the slot in the host device. In some embodiments, the height of the triangular metal bracket, measured between the base and the apex when combined with the length of the PCB, corresponds to the minimum length associated with the slot. That is, the sum of the height of the triangular metal bracket and the length of the PCB matches the length associated with the memory slot on the motherboard. In some examples, the minimum length is 80 millimeters, and the length of the PCB is 30 millimeters or 42 millimeters.

[0018] In some examples, the apex portion is configured to be physically attached to the host device by a screw and configured to dissipate heat to the host device by the screw. In some embodiments, the triangular-shaped metal bracket is configured to increase the rigidity of the PCB and absorb shock. In some embodiments, the triangular-shaped metal bracket includes a heat sink. In some examples, a heat spreader is thermally coupled to one or more components of the PCB and is thermally coupled to the triangular-shaped metal bracket through the base. In some embodiments, the heat spreader is thermally coupled to one or more components of the PCB through the top of the PCB. In some embodiments, the heat spreader is a first heat spreader. In such cases, a second heat spreader is thermally coupled to the bottom of the PCB and is thermally coupled to the triangular-shaped metal bracket through the base.

[0019] In some examples, the techniques described herein relate to a method for manufacturing a PCB including a memory system. The method includes placing a processing device on a first portion of the PCB and placing a set of memory components of the memory system on a second portion of the PCB. The method includes physically attaching a triangular metal bracket to the PCB by fitting a rounded protrusion at a base of the triangular metal bracket into a rounded recess in the PCB, the triangular metal bracket being configured to dissipate heat from the processing device and the set of memory components to at least a host device through an apex of the triangular metal bracket. The method also includes coupling the processing device and the set of memory components to the triangular metal bracket via a ground layer of the PCB.

[0020] Although various embodiments are described herein as being implemented in relation to a memory subsystem (e.g., a controller of a memory subsystem), some or all of the portions of an embodiment may be implemented in relation to a host system, such as a software application or operating system of the host system.

[0021] FIG. 1 illustrates an exemplary computing environment 100 including a memory subsystem 110, according to some examples of the present disclosure. The memory subsystem 110 can include media such as memory components 112A-112N (hereinafter also referred to as “memory devices”). The memory components 112A-112N can be volatile memory devices, non-volatile memory devices, or a combination of the same. The memory components 112A-112N can be implemented by individual dies, such that the first memory component 112A can be implemented by a first memory die (or a first collection of memory dies) and the second memory component 112N can be implemented by a second memory die (or a second collection of memory dies). These individual dies can be coupled together on an integrated circuit or can be arranged on a PCB as separate or combined components.

[0022] In some embodiments, memory subsystem 110 is a storage system. Memory subsystem 110 can be a storage device, a memory module, or a hybrid of a storage device and a memory module. Examples of storage devices include solid-state drives (SSDs), flash drives, universal serial bus (USB) flash drives, embedded multimedia controller (eMMC) drives, universal flash storage (UFS) drives, and hard disk drives (HDDs). Examples of memory modules include dual in-line memory modules (DIMMs), small outline DIMMs (SO-DIMMs), and non-volatile dual in-line memory modules (NVDIMMs).

[0023] The computing environment 100 may include a host system 120 (e.g., a motherboard) coupled to a memory system. The memory system may include one or more memory subsystems 110. In some implementations, the host system 120 is coupled to different types of memory subsystems 110. FIG. 1 illustrates an example of a host system 120 coupled to one memory subsystem 110. The host system 120 uses the memory subsystem 110, for example, to write data to and read data from the memory subsystem 110. As used herein, "coupled to" generally refers to a connection between components, which may be an indirect or direct communication connection (e.g., without intervening components), whether wired or wireless, including electrical, optical, magnetic, etc., connection.

[0024] The host system 120 may be a computing device, such as a desktop computer, a laptop computer, a network server, a mobile device, an embedded computer (e.g., one included in a vehicle, industrial equipment, or a networked commercial device), a motherboard, or any such computing device that includes memory and processing devices. The host system 120 may include or be coupled to the memory subsystem 110 so that the host system 120 can read data from or write data to the memory subsystem 110. The host system 120 may be coupled to the memory subsystem 110 via a physical host interface. Examples of physical host interfaces include, but are not limited to, a Serial Advanced Technology Attachment (SATA) interface, a Peripheral Component Interconnect Express (PCIe) interface, a Universal Serial Bus (USB) interface, a Fibre Channel interface, a Serial Attached SCSI (SAS) interface, an M.2 SSD interface, etc. The M.2 SSD interface may have certain minimum physical size specifications to connect a memory slot to a host device. The minimum physical size may be 22 x 80 millimeters.

[0025] The physical host interface can be used to transfer data between the host system 120 and the memory subsystem 110. When the memory subsystem 110 is coupled to the host system 120 via a PCIe interface and / or an M.2 SSD interface, the host system 120 can further utilize an NVM Express (NVMe) interface to access the memory components 112A-112N. The physical host interface can provide an interface for passing control signals, address signals, data signals, and other signals between the memory subsystem 110 and the host system 120. The memory subsystem 110 can be implemented on a PCB that is coupled to the host system 120 via a designated interface, such as an M.2 SSD interface. In some cases, the PCB on which the memory subsystem 110 is implemented is smaller in length than the memory slot of the M.2 SSD interface of the host device. In such cases, a triangular-shaped metal bracket can be physically attached to the PCB to extend the length of the PCB to fit closely and securely within the memory slot of the M.2 SSD interface of the host device. In addition to allowing smaller form factor memory systems implemented on a PCB to be coupled to a host device, the triangular metal bracket also aids in heat dissipation from the PCB to the host device and in PCB durability. By being shaped like a triangle, heat is collected from the base where it is coupled to the PCB and distributed and concentrated on the apex or vertex of the triangle where the triangular metal bracket connects to the host device. This maximizes heat dissipation to the specific physical point configured to receive the greatest heat dissipation.

[0026] The memory components 112A-112N may include any combination of various types of non-volatile and / or volatile memory components. An example of a non-volatile memory component includes a non-and (NAND) flash memory. Each of the memory components 112A-112N may include one or more arrays of memory cells, such as single-level cell (SLC) or multi-level cell (MLC) (e.g., TLC or QLC) memory cells. In some embodiments, a particular memory component 112 may include both SLC and MLC portions of memory cells. Each of the memory cells may store one or more bits of data (e.g., a block) for use by the host system 120. While non-volatile memory components such as NAND flash memory are described, the memory components 112A-112N may be based on any other type of memory, such as volatile memory. In some embodiments, the memory components 112A-112N can be, but are not limited to, random access memory (RAM), read-only memory (ROM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), phase change memory (PCM), magnetoresistive random access memory (MRAM), negative-or (NOR) flash memory, electrically erasable programmable read-only memory (EEPROM), and cross-point arrays of non-volatile memory cells.

[0027] A cross-point array of nonvolatile memory cells, in combination with a stackable cross-grid data access array, can perform bit storage based on changes in bulk resistance. Furthermore, in contrast to many flash-based memories, cross-point nonvolatile memories can perform in-place write operations, which allow the nonvolatile memory cells to be programmed without first erasing them. Furthermore, the memory cells of memory components 112A-112N can be grouped into memory pages or blocks, which can refer to units of memory component 112 used to store data.

[0028] Memory subsystem controller 115 can communicate with memory components 112A-112N to perform memory operations such as reading data, writing data, or erasing data in memory components 112A-112N, and other such operations. Memory subsystem controller 115 can communicate with memory components 112A-112N to perform various memory management operations, such as different scan speeds, different scan frequencies, different wear leveling, different read disturb management, different near-miss ECC operations, and / or different dynamic data refresh.

[0029] The memory subsystem controller 115 may include hardware such as one or more integrated circuits and / or discrete components, a throughput management unit 122, a metal bracket 130 (e.g., a triangular-shaped metal bracket), a buffer memory, and / or combinations thereof. The memory subsystem controller 115 may be a microcontroller, a special-purpose logic circuit (e.g., a field programmable gate array (FPGA), an application-specific integrated circuit (ASIC), etc.), or another suitable processor. The memory subsystem controller 115 may include a processor (processing device) 117 configured to execute instructions stored in a local memory 119. In the illustrated example, the local memory 119 of the memory subsystem controller 115 includes an embedded memory configured to store instructions for executing routines that control the operation of the memory subsystem 110, including handling various processes, operations, logic flows, and communications between the memory subsystem 110 and the host system 120. In some embodiments, the local memory 119 may include memory registers that store memory pointers, fetched data, etc. Local memory 119 may also include read-only memory (ROM) for storing microcode, such as firmware, containing instructions for execution by memory subsystem controller 115. While the example memory subsystem 110 of FIG. 1 is shown as including a memory subsystem controller 115, in other embodiments of the present disclosure, memory subsystem 110 may not include a memory subsystem controller 115 and may instead rely on external control (e.g., provided by an external host or by a processor 117 or controller separate from memory subsystem 110).

[0030] Generally, the memory subsystem controller 115 can receive commands or operations from the host system 120 and translate the commands or operations into instructions or appropriate commands to achieve desired access to the memory components 112A-112N. The memory subsystem controller 115 can be responsible for other memory management operations, such as wear leveling operations, garbage collection operations, error detection and error correction code (ECC) operations, encryption operations, caching operations, initialization of the memory components 112A-112N, and / or address translation. The memory subsystem controller 115 can further include a host interface circuit for communicating with the host system 120 via a physical host interface. The host interface circuit can translate commands received from the host system 120 into command instructions to access the memory components 112A-112N and translate responses associated with the memory components 112A-112N into information for the host system 120. The memory subsystem controller 115 can include a memory interface for communicating with the memory components 112A-112N. Any component included as part of the memory subsystem controller 115 may be included in the memory interface, and vice versa.

[0031] Memory subsystem 110 may also include additional circuits or components not shown, such as capacitors, resistors, transistors, and various other active or passive devices. In some embodiments, memory subsystem 110 may include a cache or buffer (e.g., DRAM or other temporary storage location or device) and address circuitry (e.g., row decoder and column decoder) that can receive addresses from memory subsystem controller 115 and decode the addresses to access memory components 112A-112N.

[0032] The memory devices can be raw memory devices (e.g., NAND) that are externally managed, for example, by an external controller (e.g., memory subsystem controller 115). The memory devices can be managed memory devices (e.g., managed NAND), which are raw memory devices combined with a local embedded controller (e.g., a local media controller) for memory management within the same memory device package. Any one of memory components 112A-112N can include a media controller (e.g., media controller 113A and media controller 113N) that can communicate with memory subsystem controller 115 and manage the memory cells of the memory component (e.g., perform one or more memory management operations) to fulfill memory requests (e.g., read or write) received from memory subsystem controller 115.

[0033] The memory subsystem controller 115 may include a throughput management unit 122 coupled to a metal bracket 130. In some cases, the throughput management unit 122 may be a separate physical component from the components of the memory subsystem controller 115. In some cases, the throughput management unit 122 and the components of the memory subsystem controller 115 are implemented by the same physical device or integrated circuit. The metal bracket 130 is a separate physical device from the throughput management unit 122 and / or the memory subsystem controller 115. The metal bracket 130 is physically and thermally connected to and coupled to the PCB on which the memory subsystem 110 is implemented. For example, the metal bracket 130 may be triangular in shape, with the base of the triangle being sized to correspond to or match the width of the PCB and connecting flush to the edge of the PCB. The metal bracket 130 includes an apex or vertex at the end opposite the base of the triangle, and screws bond or physically attach the metal bracket 130 to the host system 120 (e.g., a motherboard). A heat sink (which may be an active or passive heat sink) is mounted to the metal bracket 130 and configured to draw or receive heat from one of the components of the memory subsystem 110 via one or more screws connecting the metal bracket 130 to the host system 120 and dissipate such heat to at least air or other fluid or gas to cool the components of the memory subsystem 110 and / or the host system 120.

[0034] In one example, the metal bracket 130 can be implemented by a triangular-shaped metal bracket that is coupled to the ground layer of the PCB on which the memory subsystem 110 is mounted. Heat can be transferred to the metal bracket 130 through the ground layer and dissipated to the host system 120 and / or an external fluid or gas. In this way, the metal bracket 130 acts as a remote heat sink, and the temperature of the memory subsystem 110 can be reduced or maintained at a relatively low level to prevent the throughput management unit 122 from reducing the throughput of the memory subsystem 110 in response to detecting that the temperature of one or more components of the memory subsystem 110 exceeds a temperature threshold or reference temperature. This allows the data rate to continue operating at an optimal or maximum level, improving the overall efficiency and functionality of the device. In some examples, the metal bracket 130 can collect heat dissipated by the memory subsystem controller 115 and / or one or more components of the memory subsystem 110, such as memory components 112A-112N, and can collect the dissipated heat, convert it into electrical energy or power, and return the power to one or more devices or components. This increases the efficiency with which the memory system operates and reduces the amount of physical resources consumed by the memory subsystem.

[0035] Depending on the embodiment, throughput management unit 122 may include logic (e.g., a set of temporary or non-temporary machine instructions, such as firmware) or one or more components that cause throughput management unit 122 to perform the operations described herein. Throughput management unit 122 may include tangible or intangible units capable of performing the operations described herein.

[0036] For example, the throughput management unit 122 can be configured to access a reference temperature to control the data transfer throughput (data transfer rate between the host and the memory subsystem). The throughput management unit 122 measures the temperature of at least one of the processing device or the set of memory components using a temperature sensor (not shown). Heat associated with at least one of the components of the memory subsystem 110 can be at least partially dissipated through a metal bracket 130 (which may include one or more heat spreaders) thermally coupled to the processing device and the set of memory components. The throughput management unit 122 adjusts or decreases the data transfer throughput in response to determining that the measured temperature exceeds the reference temperature. The throughput management unit 122 adjusts or increases the data transfer throughput in response to determining that the measured temperature no longer exceeds or cannot exceed the reference temperature.

[0037] In some examples, a PCB is provided on which the set of memory components, the processing device (and various other components of memory subsystem 110) are mounted. In some examples, the PCB includes multiple layers, each accessible through one or more vias, and the multiple layers include a ground layer. A metal bracket 130 is external to the PCB and is coupled to the PCB to aid in heat dissipation and to ensure that the PCB fits properly and closely into a memory slot of host system 120 by adding length to the PCB within an amount corresponding to the length or height of metal bracket 130. Both the set of memory components and the processing device are coupled to metal bracket 130 via the ground layer, and heat is dissipated to metal bracket 130 via the ground layer.

[0038] In some examples, the metal bracket 130 is coupled to the ground layer through one or more vias, such as thermal vias or holes drilled in the PCB. In some aspects, the throughput management unit 122 is implemented by a physical chip having a specified height relative to the top layer of the PCB. The height of the metal bracket 130 can be equal to or less than the specified height of the physical chip. In some examples, the set of memory components is implemented by a physical chip having a specified height relative to the top layer of the PCB. The height of the metal bracket 130 can be equal to or less than the specified height of the physical chip. In some examples, the specified height includes 1.5 millimeters or less.

[0039] In some examples, the PCB includes an M.2 interface through which the set of memory components and throughput management unit 122 communicate with the host system 120. A metal bracket 130 can be connected to the PCB on an end opposite the M.2 interface, as shown in more detail below in Figures 2 and 3. In some examples, the metal bracket 130 includes a heat sink.

[0040] 2 is a diagram of an example physical assembly 200 including a metal bracket 130 and a PCB 201 on which a memory subsystem 110 is mounted, according to some embodiments of the present disclosure. The PCB 201 includes an interface 220 (e.g., an M.2 interface), a control component 210, and a memory component 230. The metal bracket 130, which is part of the physical assembly 200, can be triangular in shape with a base 250 physically coupled to the PCB 201 at an edge of the PCB 201. The metal bracket 130 includes an apex or vertex 251 where a screw can be connected to the underlying host system 120 at point 252.

[0041] The control component 210 may include a physical chip or integrated circuit package on which any one of the components of the memory subsystem 110, such as the memory subsystem controller 115, may be implemented. The memory component 230 may include one or more physical chips or integrated circuit packages on which any one of the memory components 112 may be implemented. The memory subsystem 110 communicates with the host system 120 via the interface 220. In some cases, the memory subsystem 110 communicates with the host system 120 at a first throughput or data rate. When the throughput management unit 122 determines that the temperature of the control component 210 and / or the memory component 230 reaches or exceeds a temperature threshold or reference temperature, the throughput management unit 122 may throttle or reduce the data rate such that the memory subsystem 110 communicates with the host system 120 at a second throughput or data rate. This allows the throughput management unit 122 to reduce the operating temperature of the memory subsystem 110 so that it continues to operate without having to shut down any components.

[0042] To increase the amount of time it takes for memory subsystem 110 to reach a temperature threshold or reference temperature from ambient temperature, PCB is connected to metal bracket 130. Metal bracket 130 is thermally coupled via recessed connection 254 to one or more of control component 210, memory component 230, and / or interface 220, physically via the PCB's ground layer or other internal metal layer.

[0043] In some examples, the recessed connection 254 can be formed by placing a notch in a rounded edge of the PCB 201 to form a semicircular connection having a specified diameter. The recessed connection 254 can be electrically connected to one or more ground layers of the PCB 201. The metal bracket 130 can include a protrusion 253 that is rounded in shape to form a semicircular connection having a specified diameter. The diameter of the protrusion 253 can match the diameter of the recessed connection 254, allowing the metal bracket 130 to make a flush, tight, and fixed connection to the PCB 201. Once the metal bracket 130 is physically attached to the PCB 201, thermal epoxy is placed on the protrusions 253 and 254 to fixedly attach the metal bracket 130 to the PCB 201.

[0044] In some examples, physical assembly 200 includes first heat spreader 260 and second heat spreader 261. First heat spreader 260 can be disposed on PCB 201 such that first heat spreader 260 is in physical contact with one or more physical components of PCB 201 that are on the top layer of PCB 201. First heat spreader 260 is also thermally coupled to metal bracket 130, such as via the tops of protrusions 253. This further enables components on PCB 201 to dissipate heat and transfer the heat through first heat spreader 260 to metal bracket 130 and then to host system 120. In this manner, heat can be dissipated electrically through the ground plane, thermally through PCB 201, and by physical external contact with first heat spreader 260.

[0045] The second heat spreader 261 can be disposed on the bottom of the PCB 201 such that it physically contacts one or more physical components of the PCB 201 from the bottom. The second heat spreader 261 is also thermally coupled to the metal bracket 130, such as via the bottom of the protrusions 253. This further enables the components on the PCB 201 to dissipate heat and transfer the heat through the second heat spreader 261 to the metal bracket 130 and then to the host system 120. In this manner, heat can be dissipated electrically through the ground plane, thermally through the PCB 201, and by physical external contact with the second heat spreader 261.

[0046] 3 is a block diagram of different views 300 of an exemplary physical assembly 200 of a memory controller with a triangular-shaped metal bracket 130, according to some embodiments of the present disclosure. FIG. 3 shows a top view 301 of the physical assembly 200, a side view 302 of the physical assembly 200, a bottom view 303 of the physical assembly 200, a top perspective view 305 of the physical assembly 200, a bottom perspective view 304 of the physical assembly 200, and a cross-sectional view 306 of the physical assembly 200.

[0047] As shown in top view 301, physical assembly 200 includes PCB 320 (corresponding to PCB 201 from FIG. 2 ), first heat spreader 330 (corresponding to first heat spreader 260), and triangular-shaped metal bracket 310 (corresponding to metal bracket 130). As shown in side view 302, first heat spreader 330 physically couples to triangular-shaped metal bracket 310 via apex 340 of protrusion 253 ( FIG. 2 ). PCB 320 includes an interface at an end opposite the edge or point where PCB 320 is coupled to triangular-shaped metal bracket 310 for electronically coupling PCB 320 to host system 120.

[0048] As shown in bottom view 303, physical assembly 200 includes second heat spreader 350 (corresponding to second heat spreader 261) and triangular-shaped metal bracket 310 (corresponding to metal bracket 130). Second heat spreader 350 is coupled to triangular-shaped metal bracket 310 via the bottom of protrusion 253 (FIG. 2). First heat spreader 330 and second heat spreader 350 can cover only a portion or less than the entire PCB 320.

[0049] The PCB 320 can be of a particular width measured from a first side 321 and a second side 322 of the PCB 320 adjacent to an edge 323 of the PCB 320 where the PCB 320 connects to the triangular-shaped metal bracket 310. That is, the width of the PCB 320 is the distance between the first and second sides 321 / 322 and corresponds to the width of the base of the triangular-shaped metal bracket 310. The length of the PCB 320 is measured between another opposing edge 324 of the PCB (where the interface of the PCB 320 is located) and the edge 323 of the PCB that connects to the triangular-shaped metal bracket 310. The length of the PCB 320 can be a first length that is less than a minimum length associated with a slot in the host system 120. For example, the first length can be 30 millimeters or 42 millimeters, and the minimum length associated with a slot in the host system 120 can be 80 millimeters.

[0050] The size of the base of the triangular metal bracket 310 that connects to the PCB 320 can be the same as the width of the PCB 320. The top of the triangular metal bracket 310 can correspond to the apex or vertex of the triangular metal bracket 310, which can be smaller than the size of the base. The distance between the point 252 and the base 250 of the triangular metal bracket 310 can be specified to allow the PCB 320 to have a length sufficient to fit into a slot in the host system 120, which can be 80 millimeters. That is, the height of the triangular metal bracket 310 can be made to match the size of the slot in the host system 120 when combined with the length of the PCB 320.

[0051] FIG. 4A is a flow diagram of an exemplary method for performing data throughput management and heat dissipation according to some embodiments of the present disclosure. Method 400 may be performed by processing logic, which may include hardware (e.g., a processing device, circuitry, dedicated logic, programmable logic, microcode, device hardware, integrated circuits, etc.), software (e.g., instructions executed or performed by a processing device), or a combination thereof. In some embodiments, method 400 is performed by throughput management unit 122 of FIG. 1. Although processes are shown in a particular sequence or order, unless otherwise specified, the order of processes can be modified. Therefore, the illustrated embodiment should be understood as an example only, and the depicted processes can be performed in a different order, and some processes can be performed in parallel. Furthermore, in various embodiments, one or more processes can be omitted. Thus, not all processes are required in all embodiments. Other process flows are possible.

[0052] 4A , method (or process) 400 begins with operation 410, in which throughput management unit 122 of a memory subsystem (e.g., memory subsystem 110) measures the temperature of at least one of a set of processing devices or memory components mounted on a PCB having a triangular-shaped metal bracket physically attached to the edge of the PCB at the base of the triangular-shaped metal bracket. The triangular-shaped metal bracket is thermally coupled to the set of memory components and the processing device on the PCB via the base and configured to dissipate heat from the set of memory components and the processing device to at least one host device (e.g., a motherboard) via the apex of the triangular-shaped metal bracket. Next, in operation 415, throughput management unit 122 adjusts the data transfer rate based on the measured temperature, for example, by comparing the measured temperature to a reference temperature and by reducing the data transfer rate in response to determining that the temperature exceeds the reference temperature (by more than a specified amount).

[0053] 4B is a flow diagram of an exemplary method for fabricating a physical assembly of a memory subsystem with a triangular-shaped metal bracket, according to some embodiments of the present disclosure. Method 401 can be performed by processing logic, which can include hardware (e.g., a processing device, circuitry, dedicated logic, programmable logic, microcode, device hardware, integrated circuits, etc.), software (e.g., instructions executed or performed by a processing device), or a combination thereof. Although processes are shown in a particular sequence or order, unless otherwise specified, the order of the processes can be modified. Therefore, the illustrated embodiment should be understood as an example only, and the depicted processes can be performed in a different order, and some processes can be performed in parallel. Furthermore, in various embodiments, one or more processes can be omitted. Therefore, not all processes are required in all embodiments. Other process flows are possible.

[0054] 4B , method (or process) 401 begins with operation 406, in which a processing device is placed on a first portion of a PCB, and operation 411, in which a set of memory components 112 is placed on a second portion of the PCB. Next, operation 416, metal bracket 130 is physically attached to the PCB by fitting a rounded protrusion at the base of metal bracket 130 into a rounded recess in the PCB. Metal bracket 130 is configured to dissipate heat from the processing device and the set of memory components to at least a host device through the apex of the triangular-shaped metal bracket. In operation 421, the processing device and the set of memory components are coupled to metal bracket 130 via the ground layer of the PCB.

[0055] In view of the above disclosure, various embodiments are presented below. It should be noted that one or more features of the embodiments may be considered alone or in combination within the disclosure of the present application.

[0056] Example 1. A system comprising: a printed circuit board (PCB) including a set of memory components of a memory subsystem and a processing device operably coupled to the set of memory components; and a triangular-shaped metal bracket including a base and an apex portion, wherein the triangular-shaped metal bracket is physically attached to an edge of the PCB at the base, the triangular-shaped metal bracket is thermally coupled to the set of memory components and the processing device of the PCB via the base, the triangular-shaped metal bracket is configured to dissipate heat from the processing device and the set of memory components to at least a host device via the apex portion, and the processing device is configured to perform operations, the operations including measuring a temperature of at least one of the processing device or the set of memory components, and adjusting a data transfer rate based on the measured temperature of the at least one of the processing device or the set of memory components.

[0057] Example 2. The system described in Example 1, wherein the PCB includes an M.2 interface through which the set of memory components and the processing device communicate with the host device, and the M.2 interface is implemented on the PCB on an end opposite the edge of the PCB to which the triangular-shaped metal bracket is physically attached.

[0058] Example 3. A system described in any one of Examples 1 to 2, wherein the PCB includes multiple layers, the multiple layers including a ground layer, and both the set of memory components and the processing device are coupled to the triangular-shaped metal bracket via the ground layer.

[0059] Example 4. The system of any one of Examples 1-3, wherein the triangular-shaped metal bracket is physically attached to the edge of the PCB using thermal epoxy.

[0060] Example 5. A system described in any one of Examples 1 to 4, wherein the edge of the PCB includes a rounded recess and the base of the triangular-shaped metal bracket includes a rounded protrusion, the rounded protrusion configured to fit into the rounded recess to physically attach the triangular-shaped metal bracket to the edge of the PCB.

[0061] Example 6. The system of Example 5, wherein the size of the base of the triangular-shaped metal bracket corresponds to the width of the PCB measured from a first side and a second side of the PCB adjacent to the edge of the PCB.

[0062] Example 7. A system described in any one of Examples 5-6, wherein the length of the PCB measured between another edge of the PCB opposite the edge of the PCB and the edge of the PCB corresponds to a first length that is less than a minimum length associated with a slot of the host device.

[0063] Example 8. The system of Example 7, wherein the height of the triangular metal bracket measured between the base and the apex when combined with the length of the PCB corresponds to the minimum length associated with the slot.

[0064] Example 9. The system of any one of Examples 7-8, wherein the minimum length is 80 millimeters and the length of the PCB is 30 millimeters or 42 millimeters.

[0065] Example 10. A system described in any one of Examples 1 to 9, wherein the apex portion is configured to be physically attached to the host device by a screw and configured to dissipate heat to the host device by the screw.

[0066] Example 11. The system of any one of Examples 1 to 10, wherein the triangular metal bracket is configured to increase the rigidity of the PCB and absorb shock.

[0067] Example 12. The system of any one of Examples 1 to 11, wherein the triangular-shaped metal bracket includes a heat sink.

[0068] Example 13. The system of any one of Examples 1-12, including a heat spreader thermally coupled to one or more components of the PCB and thermally coupled to the triangular-shaped metal bracket via the base.

[0069] Example 14. The system of Example 13, wherein the heat spreader is thermally coupled to the one or more components of the PCB through a top portion of the PCB.

[0070] Example 15. The system of Example 14, wherein the heat spreader is a first heat spreader thermally coupled to the bottom of the PCB and includes a second heat spreader thermally coupled to the triangular-shaped metal bracket via the base.

[0071] Example 16. A method comprising measuring a temperature of at least one of a processing device or a set of memory components mounted on a printed circuit board (PCB), wherein a triangular-shaped metal bracket is physically attached to an edge of the PCB at a base of the triangular-shaped metal bracket, the triangular-shaped metal bracket is thermally coupled to the set of memory components and the processing device on the PCB via the base, and the triangular-shaped metal bracket is configured to dissipate heat from the processing device and the set of memory components to at least a host device via an apex of the triangular-shaped metal bracket; and adjusting a data transfer rate based on the measured temperature of the at least one of the processing device or the set of memory components.

[0072] Example 17. The method of Example 16, wherein the PCB includes an M.2 interface, through which the set of memory components and the processing device communicate with the host device, and the M.2 interface is mounted on the PCB on an end opposite the edge of the PCB to which the triangular-shaped metal bracket is physically attached.

[0073] Example 18. The method of any one of Examples 16 to 17, wherein the PCB includes multiple layers, the multiple layers including a ground layer, and both the set of memory components and the processing device are coupled to the triangular-shaped metal bracket via the ground layer.

[0074] Example 19. The method of any one of Examples 16-18, wherein the triangular-shaped metal bracket is physically attached to the edge of the PCB using thermal epoxy.

[0075] Example 20. A method for manufacturing a PCB including a memory system, the method comprising: placing a processing device on a first portion of the PCB; placing a set of memory components of the memory system on a second portion of the PCB; physically attaching the triangular-shaped metal bracket to the PCB by fitting a round protrusion at a base of the triangular-shaped metal bracket into a round recess in the PCB, the triangular-shaped metal bracket being configured to dissipate heat from the processing device and the set of memory components to at least a host device through an apex of the triangular-shaped metal bracket; and coupling the processing device and the set of memory components to the triangular-shaped metal bracket via a ground layer of the PCB.

[0076] A method and computer-readable storage medium comprising instructions for carrying out any one of the above embodiments.

[0077] FIG. 5 illustrates an exemplary machine in the form of a computer system 500, in which a set of instructions can be executed to cause the machine to perform any one or more of the methods described herein. In some embodiments, computer system 500 may correspond to a host system (e.g., host system 120 of FIG. 1) that includes, is coupled to, or utilizes a memory subsystem (e.g., memory subsystem 110 of FIG. 1) or can be used to perform operations of a controller (e.g., to run an operating system to perform operations corresponding to throughput management unit 122 of FIG. 1). In alternative embodiments, the machine can be connected (e.g., networked) to other machines in a local area network (LAN), an intranet, an extranet, and / or the Internet. The machine can operate in the function of a server or a client machine in a client-server network environment, as a peer machine in a peer-to-peer (or distributed) network environment, or as a server or client machine in a cloud computing infrastructure or environment.

[0078] The machine may be a personal computer (PC), tablet PC, set-top box (STB), personal digital assistant (PDA), mobile phone, web appliance, server, network router, network switch, network bridge, or any machine capable of executing (serially or otherwise) a set of instructions that specify actions to be taken by that machine. Further, although a single machine is shown, the term "machine" shall also be taken to include any collection of machines that individually or jointly execute a set (or sets) of instructions to perform any one or more of the methodologies described herein.

[0079] The exemplary computer system 500 includes a processing device 502, a main memory 504 (e.g., read-only memory (ROM), flash memory, dynamic random access memory (DRAM), such as synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM)), a static memory 506 (e.g., flash memory, static random access memory (SRAM)), and a data storage device 518, which communicate with each other via a bus 530.

[0080] Processing device 502 represents one or more general-purpose processing devices, such as a microprocessor, a central processing unit, or the like. More specifically, processing device 502 may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a processor implementing other instruction sets, or a processor implementing a combination of instruction sets. Processing device 502 may also be one or more special-purpose processing devices, such as an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal processor (DSP), a network processor, or the like. Processing device 502 is configured to execute instructions 526 to perform the operations and steps described herein. Computer system 500 may further include a network interface device 508 for communicating over network 520.

[0081] The data storage device 518 may include a machine-readable storage medium 524 (also known as a computer-readable medium) having stored thereon one or more sets of instructions 526 or software that embody any one or more of the methods or functions described herein. The instructions 526 may also reside, completely or partially, within the main memory 504 and / or within the processing unit (device) 502 during execution by the computer system 500, the main memory 504, and the processing unit (device) 502, which constitute the machine-readable storage medium. The machine-readable storage medium 524, the data storage device 518, and / or the main memory 504 may correspond to the memory subsystem 110 of FIG. 1.

[0082] In one embodiment, instructions 526 implement functionality corresponding to throughput management unit 122 of Figure 1. While machine-readable storage medium 524 is shown in the exemplary embodiment to be a single medium, the term "machine-readable storage medium" should be interpreted to include a single medium or multiple media that store one or more sets of instructions. The term "machine-readable storage medium" should also be interpreted to include any medium that can store or encode a set of instructions for execution by a machine, causing the machine to perform any one or more of the methods of the present disclosure. Accordingly, the term "machine-readable storage medium" should be interpreted to include, but is not limited to, solid-state memory, optical media, and magnetic media.

[0083] Some portions of the preceding detailed descriptions are presented in terms of algorithms and symbolic representations of operations on data bits within a computer memory. These algorithmic descriptions and representations are the means used by those skilled in the data processing arts to most effectively convey the substance of their work to others skilled in the art. An algorithm is here, and generally, conceived to be a self-consistent sequence of operations leading to a desired result. The operations require physical manipulations of physical quantities. Usually, though not necessarily, these quantities take the form of electrical or magnetic signals capable of being stored, combined, compared, and otherwise manipulated. It has proven convenient at times, principally for reasons of common usage, to refer to these signals as bits, values, elements, symbols, characters, terms, numbers, or the like.

[0084] It should be recognized, however, that all of these and similar terms are to be associated with the appropriate physical quantities and are merely convenient labels applied to these quantities. This disclosure may refer to the operations and processes of a computer system, or similar electronic computing device, that manipulate and convert data represented as physical (electronic) quantities in the computer system's registers and memory into other data also represented as physical quantities in the computer system's memory or registers or such information storage system.

[0085] The present disclosure also relates to an apparatus for performing the operations herein. This apparatus may include a general-purpose computer, which may be specially constructed for an intended purpose, or which is selectively activated or reconfigured by a computer program stored in the computer. Such a computer program may be stored on any type of computer-readable storage medium, including, but not limited to, a floppy disk, an optical disk, a CD-ROM, and a magneto-optical disk, a read-only memory (ROM), a random access memory (RAM), an erasable programmable read-only memory (EPROM), an EEPROM, a magnetic or optical card, or any type of medium suitable for storing electronic instructions, each of which may be coupled to a computer system bus.

[0086] The algorithms and displays presented herein are not inherently related to any particular computer or other apparatus. Various general-purpose systems can be used with programs in accordance with the teachings herein, or it may prove convenient to construct more specialized apparatus to perform the methods. The structure of a variety of these systems appears as set forth in the description above. Additionally, the present disclosure is not described with reference to any particular programming language. It will be understood that a variety of programming languages ​​can be used to implement the teachings of the present disclosure as described herein.

[0087] The present disclosure can be manifested as a computer program product or software, which can include a machine-readable medium having stored thereon instructions that can be used to program a computer system (or other electronic device) to perform a method according to the present disclosure. A machine-readable medium includes any mechanism for storing information in a form readable by a machine (e.g., a computer). In some embodiments, the machine-readable (e.g., computer-readable) medium includes a machine-readable (e.g., computer-readable) storage medium such as read-only memory (ROM), random access memory (RAM), magnetic disk storage media, optical storage media, flash memory components, and the like.

[0088] In the foregoing specification, embodiments of the present disclosure have been described with reference to certain exemplary embodiments thereof. It will be apparent that various changes may be made therein without departing from the broader spirit and scope of the embodiments of the present disclosure as set forth in the following claims. The specification and drawings are, therefore, to be regarded in an illustrative rather than a restrictive sense.

Claims

1. 1. A printed circuit board (PCB), comprising: a set of memory components of a memory subsystem; and a processing device operably coupled to the set of memory components; the PCB including: a metal bracket including a base and an apex; A system comprising: the metal bracket is physically attached to an edge of the PCB at the base, the metal bracket is thermally coupled to the set of memory components and the processing device of the PCB through the base, and the metal bracket is configured to dissipate heat from the processing device and the set of memory components through the apex; The processing device is configured to perform operations, the operations including: measuring a temperature of at least one of the processing device or the set of memory components; adjusting a data transfer rate based on the measured temperature of the at least one of the processing device or the set of memory components; The system comprising:

2. 2. The system of claim 1, wherein the PCB includes an M.2 interface through which the set of memory components and the processing device communicate with a host device, the M.2 interface being mounted on the PCB on an end opposite the edge of the PCB to which the metal bracket is physically attached.

3. 2. The system of claim 1, wherein the PCB includes multiple layers, the multiple layers including a ground layer, and wherein the set of memory components and the processing device are both coupled to the metal bracket via the ground layer.

4. 10. The system of claim 1, wherein the metal bracket is a triangular shaped metal bracket, and wherein the triangular shaped metal bracket is physically attached to the edge of the PCB using thermal epoxy.

5. 2. The system of claim 1, wherein the edge of the PCB includes a rounded recess and the base of the metal bracket includes a rounded protrusion configured to fit into the rounded recess to physically attach the metal bracket to the edge of the PCB.

6. 6. The system of claim 5, wherein a size of the base of the metal bracket corresponds to a width of the PCB measured from first and second sides of the PCB adjacent the edges of the PCB.

7. 6. The system of claim 5, wherein a length of the PCB measured between another edge of the PCB opposite the edge of the PCB and the edge of the PCB corresponds to a first length that is less than a minimum length associated with a slot in a host device.

8. 8. The system of claim 7, wherein a height of the metal bracket measured between the base and the apex when combined with the length of the PCB corresponds to the minimum length associated with the slot.

9. 8. The system of claim 7, wherein the minimum length comprises 80 millimeters and the length of the PCB comprises 30 millimeters or 42 millimeters.

10. The system of claim 1 , wherein the apex is configured to be physically attached to a host device by a screw and configured to dissipate heat to the host device by the screw.

11. The system of claim 1 , wherein the metal bracket is configured to increase stiffness and absorb shocks to the PCB.

12. The system of claim 1 , wherein the metal bracket comprises a heat sink.

13. The system of claim 1 , comprising a heat spreader thermally coupled to one or more components of the PCB and thermally coupled to the metal bracket through the base.

14. The system of claim 13 , wherein the heat spreader is thermally coupled to the one or more components of the PCB through a top portion of the PCB.

15. 15. The system of claim 14, wherein the heat spreader is a first heat spreader thermally coupled to a bottom portion of the PCB and includes a second heat spreader thermally coupled to the metal bracket through the base.

16. measuring a temperature of at least one of a processing device or a set of memory components mounted on a printed circuit board (PCB), wherein a metal bracket is physically attached to an edge of the PCB at a base of the metal bracket, the metal bracket being thermally coupled to the set of memory components and the processing device on the PCB through the base, and the metal bracket is configured to dissipate heat from the processing device and the set of memory components through an apex of the metal bracket; adjusting a data transfer rate based on the measured temperature of the at least one of the processing device or the set of memory components; A method comprising:

17. 17. The method of claim 16, wherein the PCB includes an M.2 interface through which the set of memory components and the processing device communicate with a host device, the M.2 interface being mounted on the PCB on an end opposite the edge of the PCB to which the metal bracket is physically attached.

18. 17. The method of claim 16, wherein the PCB includes multiple layers, the multiple layers including a ground layer, and wherein the set of memory components and the processing device are both coupled to the metal bracket through the ground layer.

19. 17. The method of claim 16, wherein the metal bracket comprises a triangular shaped metal bracket, the triangular shaped metal bracket being physically attached to the edge of the PCB using thermal epoxy.

20. 1. A method of manufacturing a printed circuit board (PCB) including a memory system, comprising: disposing a processing device on a first portion of the PCB; disposing a set of memory components of the memory system on a second portion of the PCB; physically attaching a metal bracket to the PCB by fitting a rounded protrusion at a base of the metal bracket into a rounded recess in the PCB, the metal bracket being configured to dissipate heat from the processing device and the set of memory components through apexes of the metal bracket; coupling the processing device and the set of memory components to the metal bracket via a ground layer of the PCB; The method comprising:

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