Semiconductor element test socket device

Abstract

The present invention relates to a semiconductor device testing socket device used for testing semiconductor devices, comprising: a contact module (100) on which a semiconductor device is mounted and including a plurality of contacts (110) for electrically connecting terminals of the semiconductor device with terminals of a PCB; and a pusher module (200) having a latch (211) and fitted to the upper part of the contact module (100) to pressurize the semiconductor device, the pusher module (200) having a lead frame (210) on which the latch is rotatably mounted, and two floating hinge shafts (C21, C22) parallel to each other, and assembled with the lead frame (210); The device includes pressure units (220, 230) that are elastically supported on the lead frame (210) and can move up and down to elastically pressurize the semiconductor element, a first camshaft (240) and a second camshaft (250) that are provided on each of the floating hinge shafts (C1, C2) and adjust the vertical height of the pressure units (220, 230) according to the rotation angle, a handle (260) that is fixed integrally with the first camshaft (240) and can rotate, a lever (270) that is fixed integrally with the second camshaft (250) and can rotate, and a link (280) whose both ends are rotatably connected to the handle (260) and the lever (270).

Description

[Technical Field]

[0001] The present invention relates to a semiconductor element testing socket device used for testing semiconductor elements. [Background technology]

[0002] Generally, IC sockets are installed on a test board or burn-in board, and are used in a series of IC testing systems by connecting a burn-in chamber or its peripheral devices to a separate test device for measuring IC characteristics, which allows the power supply and electrical signals required to operate the IC to be input and output through the I / O terminals (input / output terminals) formed on the board (test board, burn-in board).

[0003] Among the most widely used ICs, BGA (Ball Grid Array) type ICs are innovative in reducing the size and thickness of ICs by arranging IC terminals, i.e. balls, across the entire bottom surface of the IC.

[0004] On the other hand, an LGA (Land Grid Array) type IC is a BGA type IC in which no balls are attached to the pads (or lands). Recently, various LGA type or BGA and LGA hybrid ICs have been produced, and a socket for testing an LGA type or hybrid IC has a plurality of contacts with a predetermined elastic force in the vertical direction, and the lower terminals of the contacts are connected to the PCB by contact or soldering.

[0005] Here, the upper terminals of the contacts are formed to contact the terminals of the IC loaded into the socket, and the socket must be equipped with a pressure device that presses the IC downward to ensure stable electrical contact. For reference, the physical force applied per contact can be calculated by dividing the physical force applied by the pressure device to the top surface of the IC by the number of contacts. More specifically, the physical force applied to the contacts is approximately 10 gf per contact, and if, for example, an IC has 500 terminals, it is understood that a strong physical force of approximately 5.0 kgf must be applied.

[0006] Therefore, a socket for testing an IC requires a pressure means capable of effectively applying the above-mentioned strong physical force to the IC. Recently and in the future, the number of IC leads has increased, the lead pitch has narrowed, and ICs have become thinner. In particular, when a burn-in test is performed for a long time at high temperature, a socket with a pressure means capable of applying strong pressure while keeping the entire surface of the IC horizontal in response to the upward contact force applied to the IC leads is required.

[0007] As an example of such prior art, Patent Document 1 discloses a semiconductor inspection device that has a rotary type handle mechanism on the top of the inspection device that allows for rotational operation. However, such a rotary type inspection device makes it difficult to add a heat generating package such as a heat sink or a heat dissipation fan. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Korean Patent Publication No. 10-2022-0020718 (Publication Date: February 21, 2022) Summary of the Invention [Problem to be solved by the invention]

[0009] The present invention relates to a socket device for testing semiconductor devices used in testing semiconductor devices, and aims to provide a socket device that can prevent damage to the semiconductor device by applying a uniform pressure to the entire top surface of the semiconductor device during the loading process of the semiconductor device. Another object of the present invention is to provide a socket device that is easy to install a heat generating package such as a heat sink or a heat dissipation fan, as well as a pressure mechanism that applies pressure to a semiconductor device during the loading process of the semiconductor device. [Means for solving the problem]

[0010] a pusher module having a latch and fitted on top of the contact module to apply pressure to the semiconductor element; a lead frame on which the latch is rotatably mounted; a pressure unit having two parallel floating hinge shafts, assembled with the lead frame, elastically supported by the lead frame so as to be movable up and down, and elastically applying pressure to the semiconductor element; first and second cam shafts provided on the floating hinge shafts, respectively, for adjusting the vertical height of the pressure unit according to the rotation angle; a rotatable handle fixed integrally with the first cam shaft; a rotatable lever fixed integrally with the second cam shaft; and a link rotatably connected at both ends to the handle and the lever.

[0011] Preferably, the pressing unit includes a heat sink frame that is assembled to the lead frame via the first and second camshafts with a first elastic body interposed therebetween, and a pusher block that is provided with a second elastic body, is elastically supported relative to the heat sink frame, and has a pressing surface that elastically presses the semiconductor element.

[0012] More preferably, each of the first camshaft and the second camshaft includes a first section having a circular cross section that is rotatably assembled with the lead frame, and a second section that extends from the first section and has a cam surface that has a flat surface in the axial direction formed on part of its outer circumferential surface, and is assembled with the heat sink frame.

[0013] More preferably, the heat sink frame includes a floating hinge portion having floating hinge holes through which the first camshaft and the second camshaft are respectively inserted, and the floating hinge holes have a flat surface that comes into surface contact with the cam surface.

[0014] Preferably, the heat sink frame and the pusher block each have a first opening and a second opening at their centers, a plurality of heat dissipation fins, and a heat sink having a pressure surface that is inserted into the first opening and the second opening to apply pressure to the semiconductor device. More preferably, the heat sink further includes a third elastic body and is elastically assembled with the heat sink frame. More preferably, the heat sink further includes a cooling fan for cooling.

[0015] Next, a pusher device for testing semiconductor devices according to the present invention is a pusher device for pressurizing a semiconductor device, assembled with a contact module for electrically connecting terminals of the semiconductor device and terminals of a PCB, the pusher device including: a lead frame on which a latch for fitting to an upper part of the contact module is rotatably provided; a pressure unit having two parallel floating hinge shafts, assembled to the lead frame, elastically supported on the lead frame so as to be able to float up and down, and elastically pressurizing the semiconductor device; first and second cam shafts provided on the floating hinge shafts, respectively, for adjusting the vertical height of the pressure unit according to the rotation angle; a rotatable handle fixed integrally with the first cam shaft; a rotatable lever fixed integrally with the second cam shaft; and a link rotatably connected at both ends to the handle and the lever. [Effects of the Invention]

[0016] The socket device for semiconductor element testing of the present invention includes a contact module and a pusher module that is fitted onto the top of the contact module to apply pressure to the semiconductor element. The pusher module includes a lead frame, a pressure unit that has two floating hinge shafts C21 and C22 and is assembled with the lead frame, is elastically supported on the lead frame so as to be able to float up and down, and elastically applies pressure to the semiconductor element, a first camshaft and a second camshaft that are provided on each of the floating hinge shafts C1 and C2 and that adjust the vertical height of the pressure unit according to the rotation angle, a rotatable handle that is fixed integrally with the first camshaft, a rotatable lever that is fixed integrally with the second camshaft, and links whose both ends are rotatably connected to the handle and the lever, thereby providing a uniform pressing force and applying pressure to the semiconductor element, thereby preventing damage to the semiconductor element. Furthermore, the socket device for testing semiconductor elements of the present invention has the advantage that it is easy to install heat generating means such as a heat sink or a cooling fan above the pressure applying portion. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. 1 is a perspective view of a socket device for testing semiconductor elements according to an embodiment of the present invention. [Figure 2] 2(a) and 2(b) are respectively a plan view and a side view of a socket device for testing semiconductor elements according to an embodiment of the present invention. [Figure 3] FIG. 3 is an exploded perspective view of the socket device for testing semiconductor elements according to an embodiment of the present invention. [Figure 4] FIG. 4 is a cross-sectional view taken along the line BB in FIG. [Figure 5] FIG. 5 is an exploded perspective view of the contact module of the socket apparatus for testing semiconductor elements according to the embodiment of the present invention. [Figure 6]6(a) and 6(b) are cross-sectional structural views for explaining the operation before and after pressure application for the cross section taken along the line AA in FIG. [Figure 7] FIG. 7 is a perspective view of a socket apparatus for testing semiconductor elements according to another embodiment of the present invention. [Figure 8] FIG. 8 is a plan view showing the configuration of a socket apparatus for testing semiconductor elements according to another embodiment of the present invention. [Figure 9] FIG. 9 is an exploded perspective view of a socket apparatus for testing semiconductor elements according to another embodiment of the present invention. [Figure 10] FIG. 10 is a cross-sectional view taken along line CC in FIG. [Figure 11] FIG. 11 is a cross-sectional view taken along the line DD in FIG. [Figure 12] FIG. 12 is a cross-sectional view taken along the line EE in FIG. [Figure 13] FIG. 13 is a perspective view of a socket apparatus for testing semiconductor elements according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0018] First, the terms and words used in this specification and claims should not be interpreted in a limited way to their ordinary or dictionary meanings, but should be interpreted in a way that is consistent with the technical idea of ​​the present invention, based on the principle that an inventor can appropriately define the concept of a term in order to best explain his or her invention. Therefore, the embodiment described in this specification and the configurations shown in the drawings are merely the most preferred embodiment of the present invention and do not represent the entire technical idea of ​​the present invention, so it should be understood that there may be various equivalents and modifications that can replace them at the time of this application. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the size of certain components may be exaggerated relative to one another to facilitate understanding of the invention, and when multiple identical components do not need to be clearly distinguished, only one may be shown as a representative.

[0019] Figure 1 is an oblique configuration diagram of a socket device for testing semiconductor elements according to an embodiment of the present invention, Figures 2(a) and 2(b) are a plan configuration diagram and a side configuration diagram, respectively, of a socket device for testing semiconductor elements according to an embodiment of the present invention, Figure 3 is an exploded oblique configuration diagram of a socket device for testing semiconductor elements according to an embodiment of the present invention, Figure 4 is a cross-sectional view along line AA in Figure 3, and Figure 5 is an exploded oblique configuration diagram of a contact module of a socket device for testing semiconductor elements according to an embodiment of the present invention.

[0020] 1 to 5, the socket device according to this embodiment includes a contact module 100 having a plurality of contacts 110, and a pusher module 200 having a latch 211 and fitted onto the top of the contact module 100 to apply pressure to a semiconductor element. Referring particularly to FIG. 5, the contact module 100 is a module on which a semiconductor element (hereinafter also abbreviated as "IC") is mounted and which electrically connects the terminals of the IC to the terminals of a PCB, and includes a lower body 120 and an upper body 130, and further includes a floating plate 140 and a base frame 150. Each lower body 120 and upper body 130 has an approximately square structure and has holes 121, 131 into which contacts 110 are inserted. Each contact 110 is housed and fixed between the lower body 120 and the upper body 130, thereby electrically connecting the terminals of the IC and the terminals of the PCB.

[0021] In this embodiment, the contact 110 is composed of an upper contact pin 111, a lower contact pin 112, and a spring 113. The upper contact pin 2 and the lower contact pin 4 are assembled so as to be vertically slidable, and the spring 113 is elastically supported between the upper contact pin 111 and the lower contact pin 112. The upper contact pin 111 includes an upper head portion 111a having an upper tip portion formed thereon. In this contact 110, the elastic force of the spring 113 presses the upper head portion 111a toward the IC terminal and the lower contact pin 112 toward the PCB terminal, thereby electrically connecting the IC and PCB terminals. However, the present invention is not limited to this contact, and various well-known socket contacts can be used as long as they can electrically connect the IC terminals and the PCB terminals. Preferably, the floating plate 140 is elastically supported on the upper body 130 by interposing a spring 142 therebetween, and an IC for testing is mounted on the floating plate 140. A plurality of ball terminal receiving holes 141 for receiving (ball) terminals of the IC may be formed in the IC mounting surface of the floating plate 140, and the upper heads 111a of the contacts 110 pass through the ball terminal receiving holes 141. The ball terminal receiving holes 141 may be omitted depending on the IC terminal type (Land Grid Array, LGA). While only one spring 142 is shown in FIG. 5 to elastically support the upper body 130 and the floating plate 140, a plurality of springs may be disposed between the upper body 130 and the floating plate 140 within a range that allows the floating plate 140 to be elastically supported horizontally.

[0022] The base frame 150 includes an opening 151 through which an IC can pass and a latch fixing protrusion 152 to which a latch of a pusher module is fixed. The base frame 150 has a lower body 120 and an upper body 130 fixed in order by fastening members such as bolts, and a floating plate 140 disposed on the upper body 130 is assembled to the base frame 150 so as to be movable up and down. The base frame 150 may include mounting holes or mounting pins for assembly to a PCB.

[0023] Referring again to FIGS. 1 to 4, pusher module 200 includes lead frame 210, pressure members 220, 230, first and second camshafts 240, 250, handle 260, lever 270, and link 280.

[0024] The lead frame 210 includes openings 212 formed so that the pressing portions 220 and 230 are positioned therethrough, and latches 211 that can be fixed to the contact module 100. In this embodiment, the latches 211 are provided on two opposing sides of the four sides of the lead frame 210, and are hingedly assembled to the lead frame 210 to be fixed to the latch fixing protrusions 152 of the contact module 100. Preferably, the latches 211 are provided with an elastic body (spring) to provide an operating force for applying pressure in a fixing direction with the latch fixing protrusions 152 of the contact module 100, and can be elastically fixed to the latch fixing protrusions 152. The lead frame 210 has four sides, and hinge blocks 213 and 214 for assembling the pressure members 220 and 230 are provided on the remaining two opposing sides, excluding the side on which the latch 211 is disposed. The hinge blocks 213 and 214 include a first hinge block 213 and a second hinge block 214, and each hinge block 213 and 214 has a circular shaft hole 214a therethrough. Reference numerals C11 and C12 denote hinge axes of the shaft holes of the first hinge block 213 and the second hinge block 214, respectively. The second hinge block 214 may be provided with handle fixing members 215 and 215a integrally extending from its upper portion. In this embodiment, the handle fixing members 215 and 215a include a handle fixing block 215 and a handle fixing protrusion 215a protruding from an outer wall of the handle fixing block 215.

[0025] The pressure units 220 and 230 have two parallel floating hinge shafts C21 and C22, are assembled with the lead frame 210, are elastically supported relative to the lead frame 210, and are capable of floating up and down, thereby elastically pressing the semiconductor device. Preferably, the pressure units 220, 230 include a heat sink frame 220 that is assembled to the lead frame 210 via a first camshaft 240 and a second camshaft 250 and has a first elastic body S1 interposed therebetween, and a pusher block 230 that is installed below the heat sink frame 220 and elastically presses the semiconductor device using a second elastic body S2. The first elastic body S1 and the second elastic body S2 may be implemented by well-known compression springs, but are not limited thereto. The first elastic body S1 provides a reaction force that returns the heat sink frame 220 to its initial position when the pressing force against the IC is released, and the second elastic body S2 provides a pressing force against the IC.

[0026] The first elastic body S1 is interposed between the lead frame 210 and the heat sink frame 220 to elastically support the heat sink frame 220 upward, and the second elastic body S2 is interposed between the heat sink frame 220 and the pusher block 230 to elastically support the pusher block 230 downward, thereby providing a pressing force for the pusher block 230 to press against the IC.

[0027] The heat sink frame 220 has two floating hinge shafts C21 and C22 and is assembled with the lead frame 210. These floating hinge shafts C21 and C22 are movable up and down within a certain height range relative to the lead frame 210. In the following description, since the two floating hinge shafts C21 and C22 have the same structure and function, the following description of related embodiments will use the reference numeral for only one floating hinge shaft without distinction, and when distinction is necessary, they will be referred to as the first floating hinge shaft C21 and the second floating hinge shaft C22. Specifically, the heat sink frame 220 includes floating hinge portions 221 and 222 that correspond to the hinge blocks 213 and 214 of the lead frame 210 and are assembled using the first and second camshafts 240 and 250 as intermediates. Each floating hinge portion 221 and 222 has a floating hinge hole 221a through which the camshafts 240 and 250 are inserted. The camshaft 240 includes a first section L1 having a circular cross section and a second section L2 that extends from the first section L1 and has a cam surface 241 that forms a flat surface in the axial direction on part of its outer circumferential surface. The first section L1 is inserted into the circular shaft hole 214a of the lead frame 210, and the second section L2 is inserted into the hinge hole 221a of the heat sink frame 220. Therefore, the second section L2 in which the cam surface 241 is formed on the camshaft 240 is determined approximately by the position of the floating hinge portion 221 of the heat sink frame 220.

[0028] Next, the upper part of hinge hole 221a of floating hinge portion 221 has an arcuate surface with approximately the same curvature as camshaft 240, while the lower part has a flat surface that comes into surface contact with the cam surface. Therefore, heat sink frame 220 can move up and down within a certain height range according to the rotation angles of camshafts 240, 250 provided on floating hinge shafts C21, C22, respectively.

[0029] The pusher block 230 is disposed below the heat sink frame 220 and elastically presses the semiconductor device via the second elastic body S2. Preferably, the pusher block 230 includes a flat pressing surface 233 on its lower portion, which is in direct surface contact with the top surface of the IC. The pusher block 230 has one or more stopper grooves 231 formed along approximately its lower edge. The stopper grooves 231 are engaged by bolt heads 232a of stopper bolts 232 fastened to the heat sink frame 220, thereby limiting the downward movement range of the pusher block 230. Preferably, metal materials with excellent thermal conductivity can be used for the heat sink frame 220 and the pusher block 230. In addition, a heat generating unit or a heating unit is additionally installed on the heat sink frame 220, so that the IC to be tested can be heated or cooled to an appropriate temperature for testing.

[0030] The handle 260, lever 270 and link 280 are provided in pairs symmetrically on the left and right sides of the socket device to form a handle unit, and operation of the handle unit generates a pressing force that presses the IC. Handle 260 and lever 270 are fixed to and rotate integrally with the rotation axes of first camshaft 240 and second camshaft 250, respectively, and a link 280 is connected between handle 260 and lever 270. Therefore, the operating force generated by operating handle 260 is transmitted to lever 270 via link 280, and first camshaft 240 and second camshaft 250 rotate in conjunction with each other by the same angle according to the operating angle of handle 260. Handle 260 is fixed in a closed state by forming a fixing hole 261 that is fitted and fixed to handle fixing protrusion 215a, which is a handle fixing member.

[0031] 6(a) and 6(b) are cross-sectional views illustrating the operation of a semiconductor device testing socket device according to an embodiment of the present invention before and after pressure application. (a) shows a state in which the handle is closed and a pressure is applied to the IC, and (b) shows a state in which the handle is open and the pressure is removed from the IC. As described above, the first and second camshafts rotate by the same angle in synchronization with the operation of the handle. Therefore, the following description will focus on the first camshaft.

[0032] The open / close operation position (vertical / horizontal) of the handle 260 is performed within a range of approximately 90°, and the cam surface 241 of the first camshaft 240, which is interlocked with this, also rotates within a range of approximately 90°.

[0033] Before assembling the contact module 100 and the pusher module 200, an IC is loaded into the contact module 100. Thereafter, the pusher module 200 is attached to the top of the contact module 100, and the contact module 100 and the pusher module 200 are fixed together by engaging the latch 211 of the pusher module 200 with the latch fixing protrusion 152 of the contact module 100. Thereafter, as shown in Fig. 6(a), by rotating the handle 260 by 90°, a pressing force is generated on the IC.

[0034] 6(a) shows a state in which a pressing force is generated on the IC when the handle 260 is closed, with the cam surface 241 of the first camshaft 240 facing left, and the pusher block 230 presses the upper end of the IC by the first camshaft 240, which is hingedly assembled between both ends of the lead frame 210 and the heat sink frame 220. Meanwhile, when a pressing force is generated on the IC, the hinge axes C11 and C12 of the lead frame 210 and the hinge axes C21 and C22 of the heat sink frame 220 are positioned on the same axis C (C11 = C21) (C12 = C22). Reference symbol D indicates the diameter of the circular cross-sectional section of the first camshaft 240, and reference symbol d indicates the step in the cam surface 241 section. When the handle 260 is in the closed state, the first elastic body S1 interposed between the lead frame 210 and the heat sink frame 220 and the second elastic body S2 (see Figure 3) interposed between the heat sink frame 220 and the pusher block 230 are both compressed to their maximum displacement.

[0035] 6(b) shows a state in which the handle 260 is in an open state and the pressing force against the IC is released. Rotating the handle 260 rotates the first camshaft 240 counterclockwise, causing the cam surface 241 to come into surface contact with the lower flat surface of the first floating hinge hole 221a. The reaction force of the first elastic body S1 moves the heat sink frame 220 upward by a certain height h, and the second elastic body S2 (see FIG. 3) interposed between the heat sink frame 220 and the pusher block 230 also relaxes, thereby removing the pressing force. With the handle in this open state, the hinge axis C21 of the heat sink frame 220 is offset by a step d caused by the cam surface 241 from the hinge axis C11 of the lead frame 210. The magnitude of this offset is approximately the same as the upward movement height (d) of the heat sink frame 220 (d≈h).

[0036] In the socket device of the present invention configured as described above, when the handle 260 is rotated, the pressure units 220 and 230 are assembled with both ends of the lead frame 210 by the floating hinge shafts, causing them to move up and down. As a result, the pressure units 220 and 230 move up and down while maintaining a horizontal state, and a uniform pressing force is generated on the entire top surface of the IC.

[0037] Fig. 7 is a perspective view of a semiconductor device testing socket device according to another embodiment of the present invention, Fig. 8 is a plan view of a semiconductor device testing socket device according to another embodiment of the present invention, Fig. 9 is an exploded perspective view of a semiconductor device testing socket device according to another embodiment of the present invention, Fig. 10 is a cross-sectional view taken along line CC in Fig. 8, Fig. 11 is a cross-sectional view taken along line DD in Fig. 8, and Fig. 12 is a cross-sectional view taken along line EE in Fig. 8. Figs. 7 to 12 show the handle in a closed state, and the IC is not shown. In the following description, the same reference numerals are used for the same components as in the previous embodiment, redundant description is omitted, and differences will be mainly described.

[0038] 7 to 12, a socket device according to another embodiment of the present invention includes a contact module 100 and a pusher module 300, and the contact module 100 is the same as in the above-described embodiment.

[0039] The pusher module 300 includes a lead frame 210, pressure applying portions 320, 330, first and second camshafts, a handle 260, a lever 270, and a link 280, and the pressure applying portions 320, 330, 340 may include a heat sink frame 320, a pusher block 330, and a heat sink 340.

[0040] The lead frame 210 includes a latch 211 fixed to the contact module 100, and the heat sink frame 320 has two floating hinge shafts C21 and C22, is assembled to the lead frame 210 via a pair of camshafts 240 and 250, and is elastically supported on the upper part of the lead frame 210 by a first elastic member S1, allowing it to move up and down, similar to the previous embodiment. Also, the vertical movement of the heat sink frame 320 by operating a handle 360 ​​including a handle 260 and a lever 270 fixed to the floating hinge shafts C21 and C22, respectively, and a link 280 connecting the handle 260 and the lever 270, is similar to the previous embodiment.

[0041] Preferably, in this embodiment, the heat sink frame 320 and the pusher block 330 each have a first opening 320a and a second opening 330a approximately at their centers, respectively. The heat sink 340 is disposed on the upper portion of the heat sink frame 320 and includes a pressure surface 341 that is inserted into the first opening 320a and the second opening 330a to directly press the upper portion of the IC. The heat sink 340 includes a plurality of heat dissipation fins 342 for enhancing the cooling effect, and is assembled to the upper portion of the heat sink frame 320 by a screw 344 through a screw assembly hole 343. Preferably, the screw 344 has a third elastic body S3 inserted therein, which maintains the heat sink 340 and the heat sink frame 320 in close contact with each other and stably maintains the pressing force on the IC during IC testing. Meanwhile, in the embodiment of the present invention, the first, second, and third elastic bodies S1, S2, and S3 are described as compression coil springs, but are not limited thereto. In addition, each of the elastic bodies S1, S2, and S3 is provided in plural numbers and is arranged symmetrically left and right and / or up and down to apply a uniform pressure to the IC.

[0042] In the socket device of this embodiment, as in the previous embodiment, the pressure applying parts, the heat sink frame 220, the pusher block 330 and the heat sink 340, move upward above the lead frame 210 in conjunction with the opening / closing rotation operation of the handle 260, providing a pressing force to the IC. This embodiment is particularly effective for IC packages that have a step between the center and periphery of the top surface. 10 to 12, when the handle is closed, the first elastic body S1 inserted between the lead frame 210 and the heat sink frame 320 is compressed to its maximum displacement with an upward reaction force. Also, as described in the previous embodiment, when the handle is closed, the heat sink frame 320 moves downward, and the compression elastic forces of the second elastic body S2 and the third elastic body S3 cause the pressure surface 341 of the heat sink 340 to press the top of the IC, providing a pressing force to the IC. 11 and 12, in particular, when the handle is in the closed state, the pressure surface 341 of the heat sink 340 presses the center of the upper surface of the IC. At this time, the heat sink 340 is lifted upward relative to the heat sink frame 320, causing a separation. Due to this separation height g1, the third elastic body S3 inserted into the screw 344 is compressed, and the third elastic body S3 applies a pressing force to the center of the upper surface of the IC.

[0043] Meanwhile, the pusher block 330 presses the peripheral portion of the top surface of the IC, which has a step relative to the center of the top surface. At this time, the pusher block 330 is lifted upward relative to the bolt head 232a of the stopper bolt 232 fastened to the heat sink frame 320, causing a separation, and the second elastic body S2 is compressed by the separation height g2, so that the second elastic body S2 applies a pressing force to the peripheral portion of the top surface of the IC. For reference, as described in the previous embodiment (see FIG. 6), when the handle is closed, the heat sink frame 320 is positioned below the lead frame 210 by a certain height h, and the second elastic body S2 is compressed by the downward displacement h of the heat sink frame 320 and the upward displacement g2 of the pusher block 330, thereby pressing the peripheral portion of the top surface of the IC.

[0044] FIG. 13 is a perspective view of a socket apparatus for testing semiconductor devices according to another embodiment of the present invention, in which a cooling fan 400 can be added to the top of a heat sink 340. In FIG.

[0045] As described above, the present invention has been described using limited embodiments and drawings, but the present invention is not limited thereto, and it is obvious that various modifications and variations can be made by a person having ordinary knowledge in the technical field to which the present invention pertains within the technical spirit of the present invention and the equivalent scope of the following claims. [Explanation of symbols]

[0046] 100 Contact Module 110 Contacts 120 Lower Body 130 Upper Body 140 Floating Plate 141 Ball terminal receiving hole 142 Spring 150 base frame 152 Latch fixing protrusion 200, 300 Pusher Module 210 Lead Frame 211 Latch 220, 320 heat sink frame 221 First floating hinge part 221a Floating hinge hole 222 Second floating hinge part 230, 330 pusher block 232 Stopper bolt 240 First camshaft 241 Cam surface 250 second camshaft 260 Handle 270 Lever 280 Links 340 Heatsink 342 Heat dissipation fin 400 cooling fan S1 First elastic body S2 Second elastic body S3 Third elastic body

Claims

1. a contact module having a semiconductor element mounted thereon and including a plurality of contacts that electrically connect terminals of the semiconductor element to terminals of a PCB; a pusher module having a latch and fitted to an upper portion of the contact module to pressurize the semiconductor device; The pusher module includes: a lead frame on which the latch is rotatably mounted; a pressure unit having two floating hinge shafts parallel to each other, assembled with the lead frame, elastically supported by the lead frame so as to be able to float up and down, and elastically pressurizing the semiconductor element; a first camshaft and a second camshaft provided on each of the floating hinge shafts, the first camshaft and the second camshaft adjusting the vertical height of the pressure applying portion in accordance with a rotation angle; a rotatable handle integrally fixed to the first camshaft; a lever fixed integrally with the second camshaft and rotatable; A socket device for testing semiconductor elements, comprising the handle and a link pivotally connected at both ends to the lever.

2. The pressure applying unit is a heat sink frame assembled with the lead frame via the first and second camshafts with a first elastic body interposed therebetween; 2. The socket device for testing semiconductor elements according to claim 1, further comprising: a pusher block provided with a second elastic body, the pusher block being elastically supported relative to the heat sink frame and having a pressure surface for elastically pressing the semiconductor element.

3. 3. The socket device for testing semiconductor elements as described in claim 2, wherein each of the first camshaft and the second camshaft includes a first section having a circular cross section that is rotatably assembled with the lead frame, and a second section extending from the first section and having a cam surface with a flat surface in the axial direction formed on a portion of its outer circumferential surface that is assembled with the heat sink frame.

4. 4. The socket device for semiconductor element testing according to claim 3, wherein the heat sink frame includes a floating hinge portion having floating hinge holes through which the first camshaft and the second camshaft are inserted, and the floating hinge holes have a flat surface that makes surface contact with the cam surface.

5. The heat sink frame and the pusher block each have a first opening and a second opening at their centers, 3. The socket device for testing semiconductor elements according to claim 2, further comprising a heat sink having a plurality of heat dissipation fins, the heat sink being provided on the upper part of the heat sink frame and having a pressure surface that is inserted into the first opening and the second opening to apply pressure to the semiconductor element.

6. 6. The socket device for testing semiconductor devices according to claim 5, wherein the heat sink is provided with a third elastic body and is elastically assembled with the heat sink frame.

7. 6. The socket apparatus for testing semiconductor devices according to claim 5, wherein the heat sink further includes a cooling fan for cooling.

8. 1. A pusher device for applying pressure to a semiconductor element, the pusher device being assembled with a contact module for electrically connecting a terminal of the semiconductor element to a terminal of a PCB, the pusher device comprising: a lead frame on which a latch for fitting onto an upper portion of the contact module is rotatably provided; a pressure unit having two floating hinge shafts parallel to each other, assembled with the lead frame, elastically supported by the lead frame so as to be able to float up and down, and elastically pressurizing the semiconductor element; a first camshaft and a second camshaft provided on each of the floating hinge shafts, the first camshaft and the second camshaft adjusting the vertical height of the pressure applying portion in accordance with a rotation angle; a handle that is integrally fixed to the first camshaft and is rotatable; a lever fixed integrally with the second camshaft and rotatable; The pusher device for testing semiconductor elements includes the handle and a link whose opposite ends are rotatably connected to the lever.

Images