Cleaning device for a mold for encapsulating electronic components, molding system, and method for encapsulating electronic components

Abstract

The present invention relates to a cleaning device for a mold for sealing electronic components, the cleaning device having a carriage movable back and forth, an elongated extraction space perpendicular to the movement of the carriage, an elongated skirt parallel to the elongated extraction space, and a suction opening in the elongated extraction space, the elongated skirt having two parallel protruding raised edges with a shielded space disposed therebetween. The present invention also provides a molding system including such a cleaning device, as well as a method for sealing electronic components using such a molding system.

Description

[Technical Field]

[0001] The present invention relates to a cleaning device for a mold for encapsulating electronic components, a molding system for encapsulating electronic components mounted on a carrier, and a method for encapsulating electronic components mounted on a carrier using such a molding system. [Background technology]

[0002] Electronic components are used extensively and may be formed, for example, by diodes (e.g., light-emitting diodes, or LEDs), transistors, integrated circuits (ICs / chips), chip-based sensors for detecting force, pressure, fingerprints, light, and images, and chip-based actuators (MEMS: Micro-Electro-Mechanical Systems), and / or other types of semiconductors. Electronic components may typically be attached to a carrier, also referred to as a substrate. The carrier may be formed, without limitation, by a wafer, a lead frame, or a (printed circuit) board.

[0003] When incorporating electronic components using carriers into electronic devices, it is often necessary to at least partially shield (encapsulate) the electronic components, which is why a housing may be molded around the electronic components. The encapsulants used to mold the electronic components are usually made of (thermosetting) polymers such as epoxy resins, optionally with a filler or silicone-based encapsulant. The electronic components may be completely embedded in such molded housings (encapsulations), but it is also possible that the functionality of the electronic components, for example to allow access to the electronic components for detection purposes and / or to cool the electronic components during use, may require the encapsulated components to be at least partially unencapsulated. Encapsulated electronic components are subject to continuous size reduction, and the requirements set for the precision of the packaging of these electronic components are becoming more stringent (up to the micron level (μm) in terms of geometries).

[0004] During the encapsulation process, an encapsulant (package) is placed around the electronic component, and the electronic component is at least partially surrounded by the encapsulant. For encapsulation, a mold or press having at least two mold sections is typically used, with at least one, but usually multiple, mold cavities recessed in at least one of the mold sections. After the carrier with the electronic component is placed between the mold sections, the mold sections are moved toward each other until one or more mold cavities assume a closed position surrounding the electronic component for encapsulation. The one or more mold cavities are then filled with the encapsulant, which is typically done using transfer molding, for which the encapsulant may first be heated to a liquid state. Alternatively, the encapsulant can also be placed around the entire periphery of the electronic component using compression molding. In that case, the encapsulant is introduced into the mold cavity before the mold sections are closed. After the encapsulant has at least partially (chemically) hardened, the press is opened, and the carrier with the encapsulated electronic component is removed from the mold. Following this, the encapsulated electronic components can be separated from each other, for example, in a further process.

[0005] Before the start of a new production cycle, it is important that the mold parts, in particular the mold part or parts comprising at least one mold cavity, are cleaned of contaminants such as residual encapsulant particles, since these contaminants may disrupt the controlled sealing of the electronic components in the new production cycle. According to the prior art, the mold parts are cleaned for this purpose with cleaning implements, which may include brushes, that suck out contaminants such as residual encapsulant particles, in an open and unloaded state between two subsequent production cycles.

[0006] A problem with prior art electronic component molding processes of the type identified above is that cleaning mold sections with suction cleaning tools to remove contaminants such as residual encapsulant particles is not always as effective as desired. Depending on the type of mold cavity (usually multiple mold cavities) in the mold section, such as the depth and shape of one or more cavities, some residual encapsulant particles or other contaminants may remain in or on the mold section. Such particles or other contaminants may disrupt the proper molding of electronic components in subsequent molding cycles. Summary of the Invention [Problem to be solved by the invention]

[0007] Therefore, it is a goal of the present invention to overcome these disadvantages and provide an improved cleaning apparatus for a mold for encapsulating electronic components, an improved molding system, and an improved method for encapsulating electronic components, allowing for better mold section cleaning, resulting in improved quality of the resulting encapsulated electronic components. [Means for solving the problem]

[0008] In order to solve these problems, the present invention provides a cleaning device for a mold for sealing electronic components, comprising a carriage that can move back and forth, an elongated extraction space arranged perpendicular to the direction of the carriage's reciprocating movement and connected to the carriage, elongated skirts protruding from the carriage and arranged parallel to the elongated extraction space on opposing longitudinal surfaces of the elongated extraction space, the elongated skirts extending in a direction from the carriage toward the mold surface to be cleaned, and at least one suction opening connected to the elongated extraction space. The cleaning device has an elongated skirt on at least one of the longitudinal faces of the elongated extraction space, which has at least two parallel-projecting raised edges, and a shielding space closed at its top surface is placed between the raised parallel-projecting edges, and the at least two parallel-projecting raised edges of the elongated skirt on the longitudinal face of the elongated extraction space are connected to each other on their lateral faces with raised lateral edges. In this regard, the top surface should be understood to be the surface of the shielded space facing away from the mold portion to be cleaned. Extending in a direction from the carriage toward the mold surface to be cleaned should be understood as the direction of extension of the elongated skirt, which may typically be perpendicular to the upper surface of the mold surface to be cleaned, i.e., the elongated skirt and the upper surface of the mold enclose an angle of about 90 degrees. However, this enclosed angle may also be greater or less than 90 degrees. The direction is defined when the cleaning device is positioned above or slightly above the mold surface during operation of the cleaning device. Gas is extracted from the elongated extraction space via the suction opening. The gas extraction extracts particles and other contaminants detached from the mold part to be cleaned, thus cleaning the mold part with at least one mold cavity. This results in a lower pressure in the elongated extraction space, so gas (usually ambient air) is replenished through the opening between the parallel-projecting raised edge and the mold part to be cleaned, since there are no (substantial) other or further openings to the elongated extraction space through which gas can be supplied. The gas is then directed into the elongated extraction space via the (slot-like) opening between the two projecting edges of the elongated skirt and delivered toward the mold part to be cleaned. The gas replenishment is thereby guided along the mold part to be cleaned in a passively regulated flow path. In this flow path, the supplied gas first flows through a first opening between the first parallel-projecting raised edge facing away from the elongated extraction space and the mold part to be cleaned. After passing through this first opening, the gas flow moves at least partially away from the mold part to be cleaned and enters the (higher, closed) space between the raised parallel-projecting edges. The raised edges may alternatively be referred to as "flanges." This at least partial upward flow path in the space between the raised parallel-projecting edges enhances the cleaning properties of the gas flow. The gas flow is then directed toward the mold part to be cleaned where the second raised parallel-projecting edge forms the boundary of the space between the raised edges. After passing through a second (slot-like) opening between the second protruding edge of the elongated skirt (facing toward the elongated extraction space) and the mold part to be cleaned, the gas flow is again moved away from the mold part to be cleaned within the longitudinal extraction space. The "wave-shaped" gas flow pattern imposed by the present invention substantially improves the cleaning ability of the gas flow, resulting in better cleaning of the mold section (and more particularly, the mold cavity(ies) in that mold section) than provided by prior art cleaning devices. A further advantage is that the improved cleaning ability of the cleaning device according to the present invention can limit cleaning time, thus saving time for the production cycle, which can improve the productivity of molds for encapsulating electronic components.

[0009] In order to improve the effectiveness of the cleaning properties of the cleaning device according to the invention, the elongated skirt on both longitudinal sides of the elongated extraction space has at least two parallel protruding raised edges, so that the flow channels on both longitudinal sides of the elongated extraction space provide an improved cleaning effect.

[0010] A guide rail may be provided to guide the carriage, which can reciprocate back and forth, as well as a drive for moving the carriage (along the guide). In the case of an elongated element, an element in this context should be understood as an element (or space) that is elongated, i.e., has a length greater than its width. It is preferred that the suction opening(s) in the elongated extraction space are distributed such that even a small flow occurs across the width of the cleaning device. Typically, the height of the opening between the parallel-projecting raised edge and the mold part to be cleaned is between 0.5 and 5 mm.

[0011] To further improve the effectiveness of the cleaning properties of the cleaning device according to the invention, at least one brush protruding from the carriage may be arranged in the elongated extraction space. Such a brush may also be used to physically contact (impact) particles / contaminants on the mold so as to improve the effectiveness of removing particles / contaminants from the mold part to be cleaned. Such a brush is preferably elongated and arranged parallel to the elongated extraction space so that the entire surface to be cleaned can be covered by the brush. However, as an alternative, the brush may also be an assembly of several smaller brushes. In a further alternative, the brush(s) may be movable relative to the carriage (e.g., intermittently or rotationally, like an electric toothbrush). The cleaning device may also include a brush cleaning device and / or a means for suctioning contaminants / particles collected in or on the brush and / or for providing a dedicated (gas) flow through the brush (bristles) to minimize brush contamination.

[0012] In yet another preferred embodiment, at least two parallel-projecting raised edges of the elongated skirt on the longitudinal faces of the elongated extraction space may be connected to each other on their lateral faces with raised lateral edges. Such additional raised lateral edges prevent gas from flowing from the short faces of the elongated skirt into the shielded space between the raised parallel-projecting edges. This results in an improved gas flow (higher speed) where a cleaning effect is required. The same applies to providing the elongated skirt on the short faces of the longitudinal extraction space.

[0013] To further influence the gas flow pattern within the shielded space between the at least two parallel-projecting raised edges, the closed top surface of the space may be lower on the side facing away from the elongated extraction space than on the side facing towards the elongated extraction space, such a design can widen the wave-shaped gas flow pattern and thus stimulate the cleaning effect of the cleaning device in a positive way.

[0014] The parallel protruding raised edges of the elongated skirt on one longitudinal face of the elongated extraction space may have substantially the same height. Alternatively or additionally, substantially the same height of at least one of the skirts on both opposing faces of the elongated extraction space is also optional, thus creating a balanced gas flow between the multiple protruding raised edges.

[0015] At least a portion of the protruding raised edge may be made of a solid material, such as metal and / or hard plastic. However, at least a portion of the protruding raised edge can also be made of a flexible material, such as (silicone) rubber or flexible plastic. A raised edge made of a flexible material allows a cleaning device to smoothly pass over pins or other elements protruding from the mold part to be cleaned.

[0016] The elongated skirt surrounding the elongated extraction space, the suction opening, and optional brushes are assembled to one or more frame parts that are vertically displaceable onto the carriage. In such an embodiment, the carriage can be displaced relative to the mold parts (toward and away from the mold part to be cleaned) without any problems and without the possibility of contact, while the functional parts can be kept at a greater distance from the mold parts. Only when cleaning begins can the frame parts be moved toward the mold part to be cleaned. Such movement of the frame parts can be in a direction perpendicular to the reciprocating movement of the carriage and perpendicular to the longitudinal extraction space. A further advantage of assembling optional brushes on one or more of such movable frame parts is that brush wear can be compensated for by correcting the trajectory of the frame parts.

[0017] For the extraction of gas, the cleaning device preferably also comprises a suction device connected to the suction opening, and since the cleaning device is movable, the connection between the suction device and the rest of the cleaning device is a flexible connection.

[0018] To position the cleaning device relative to the mold section to be cleaned, to prevent the cleaning device from getting too close to the mold section to be cleaned (e.g., to prevent a protruding edge from damaging the mold section), and to ensure optimal suction between the elongate skirt and the mold, the cleaning device may be provided with at least one guide for supporting the cleaning device relative to the mold section to be cleaned, thereby resulting in a controlled relative position of the cleaning device. Such a guide may be formed, for example, by one or more contact rollers.

[0019] The present invention also provides a molding system for encapsulating an electronic component mounted on a carrier, the molding system comprising: at least one mold with at least two mold sections displaceable relative to one another, at least one of the mold sections having a recessed mold cavity at a contact surface configured to engage with the mold cavity around the electronic component to be encapsulated; and a cleaning device according to the present invention, movable from at least one position between the mold sections of the at least one mold when the mold sections are spaced apart and from a position spaced apart from the mold sections when the mold sections are in contact. The advantages of the cleaning device have already been made clear above and are now incorporated with respect to the molding system according to the present invention. While the cleaning device may interact with a single mold, it is also possible for a single cleaning device to service two or more molds, in which case the cleaning device is movable relative to the mold. The one or more molds are typically assembled to fix their orientation relative to one another. Such an assembly of one or more molds and the cleaning device are often shielded with a bonding container to shield the assembly and promote safety.

[0020] The present invention also provides a method for encapsulating electronic components mounted on a carrier using a molding system according to the present invention, comprising the steps of: A) positioning a carrier carrying one or more electronic components between two mold halves with the electronic components facing the mold cavities; B) moving the mold halves toward each other to clamp the carrier between the mold halves, at least one mold cavity surrounding an electronic component to be encapsulated; C) delivering molding material into the mold cavities; and D) moving the mold halves away from each other. and removing the carrier with the molded electronic component from the mold section. After process step D), during process step E), a cleaning device is moved between the mold sections and an elongated extraction space is moved along the mold section containing the mold cavities, whereby the elongated extraction space cleans at least one mold cavity while simultaneously extracting gas with the detached particles via a suction opening connected to the elongated extraction space, thereby supplying ambient gas to the suction opening through an opening between the parallel-projecting raised edge and the mold section to be cleaned. The advantages of the cleaning device and molding system according to the present invention have already been made clear above and will now be incorporated with respect to the method for sealing electronic components according to the present invention. The method is easy to automate and results in better-cleaned mold sections after process step E) is completed. The method may be used to clean only one mold section, preferably containing one or more mold cavities, although cleaning (two) opposing mold sections is also possible. In the latter situation, both mold sections may contain one or more mold cavities, although it is also possible for both mold sections to contain one or more mold cavities. Processing step E) may also be combined with the supply of encapsulant (e.g., in pellet form) to the mold sections.

[0021] The gas is supplied in a gas flow via a first opening between the parallel-projecting raised edges facing away from the elongated extraction space and the mold part to be cleaned, and after passing through the first opening, the gas flow moves at least partially away from the mold part to be cleaned and enters the space between the raised parallel-projecting edges. The gas flow "moving at least partially away" from the mold part to be cleaned causes contaminants / loose particles to be carried away from the mold part, which is desired during cleaning.

[0022] When gas is supplied in the gas flow through the first opening between the first parallel-projecting raised edge and the mold part to be cleaned, and when gas is supplied through the second opening between the second parallel-projecting raised edge and the mold part to be cleaned, the gas flow at both locations has at least one component directed toward the mold part to be cleaned before passing through the first and second openings. In the described locations, the gas flow is directed at least partially toward the mold part to be cleaned, which supports the feature of moving contaminants / particles away from the mold parts at two locations and also leads to more effective cleaning of the mold parts.

[0023] In a further preferred embodiment of the method according to the invention, the cleaning device may additionally inject a gas flow from at least one position towards the mould part to be cleaned during process step E). An additional gas flow directed towards the mould part to be cleaned can further support improved cleaning.

[0024] The invention will be further explained on the basis of non-limiting exemplary embodiments shown in the following drawings, in which corresponding elements are designated with corresponding reference numerals, in which: [Brief explanation of the drawings]

[0025] [Figure 1] 1 is a schematic perspective view of a cleaning device according to the present invention disposed between two mold halves of a molding system for encapsulating electronic components; [Figure 2A] 1 is a schematic perspective cross-sectional view of a cleaning device according to the present invention; [Figure 2B] FIG. 2B is a side cross-sectional view of the cleaning device shown in FIG. 2A. [Figure 3] FIG. 10 is a bottom perspective view of a further embodiment of a cleaning device according to the present invention. [Figure 4A] 10 is a schematic perspective cross-sectional view of an alternative skirt incorporated in an alternative embodiment of a cleaning device according to the present invention; FIG. [Figure 4B] 10 is a schematic perspective cross-sectional view of an alternative skirt incorporated in an alternative embodiment of a cleaning device according to the present invention; FIG. [Figure 4C] 10 is a schematic perspective cross-sectional view of an alternative skirt incorporated in an alternative embodiment of a cleaning device according to the present invention; FIG. DETAILED DESCRIPTION OF THE INVENTION

[0026] 1 shows a schematic perspective view of a cleaning device 1 that is moved back and forth (arrow P1) along a guide 2 between a position remote from the mould parts (so that the mould parts 3, 4 can be closed on the carrier with the electronic components) and a working path between the upper mould part 3 and the lower mould part 4 when the mould parts 3, 4 are separated (as shown). The cleaning device 1 will be explained in more detail in the subsequent figures, but in this figure 1 one can clearly see the flexible coupling 5, which is connected on one side to a suction device (not shown here) and on the other side (facing the cleaning implement) to an extraction pipe 6 that leads to a suction opening in the cleaning device 1.

[0027] 2A shows a schematic perspective cross-sectional view of a cleaning device 10 acting on a mold section 11 containing multiple molding cavities 12, while FIG. 2B shows the same cleaning device but in side cross-section. The cleaning device 10 comprises an elongated extraction space 13, which in this embodiment is provided with brushes 14, although an embodiment without brushes 14 is also part of the invention. The elongated extraction space 13 is connected to a carriage 15 and is closed on its top surface 16 except for a suction opening 17, through which air is extracted via a flexible connection (hose) 18 leading to a suction device (pump) (not shown) to achieve a negative pressure in the elongated extraction space 13. On both longitudinal sides of the elongated extraction space 13, elongated skirts 19 protrude from the carriage 15 and parallel to the elongated extraction space 13, further closing the elongated extraction space 13. Both elongated skirts 19 have (in this embodiment) two parallel-projecting raised edges 20, 21, between which is located a shielded space 22 that is closed by a top surface 23. The negative pressure in the elongated extraction space 13 results in a supply of ambient gas through the (slot-like) openings 24, 25 between the parallel-projecting raised edges 20, 21, cleaning the mould sections 11. The (passive) influence of the gas flow through the through (slot-like) openings 24, 25 and the shielded space 22 towards the suction openings 17 in the elongated extraction space 13 generates a wave-shaped flow pattern that helps to detach particles 26 from the mould sections 11 (and out of the mould cavity 12).

[0028] FIG. 3 shows a bottom perspective view of a cleaning device 30 according to the invention, in which an elongated extraction space 31 has three slot-like suction openings 32 (although, unlike the embodiment shown in FIGS. 2A and 2B, there are no brushes here). Again, parallel elongated skirts 33 are provided on both longitudinal sides of the elongated extraction space 31, each with two parallel protruding raised edges 34, 35, between which a shielded space 36 is located. On the lateral sides of the shielded space 36, raised lateral edges 37 are provided, further closing the shielded space 36 and forcing most of the sucked-in external air to pass through the raised edges 34, 35. Also visible on the lateral sides is the elongated extraction space 31, which is similarly provided with lateral extraction space edges 38. On the lateral sides, the cleaning device 30 also has four guide rollers 39 for supporting the cleaning device 30 against the mold part to be cleaned.

[0029] 4A-4C show schematic cross-sectional views of alternative skirt embodiments 40, 41, and 42 for a cleaning apparatus according to the present invention. The skirt embodiment 40 shown in FIG. 4A has a first raised edge 43 on the side facing away from the elongated extraction space and a second raised edge 44, both of which bound a shielded space 45. In this embodiment, the shielded space 45 is lower on the side facing away from the elongated extraction space than on the side facing toward the elongated extraction space. The flow path of the sucked air is illustrated by arrows P2, P3, and P4. External air is initially sucked toward a passage 46 below the first raised edge 43, thereby partially directing the air flow toward the mold section 47 to be cleaned (see arrow P2). After passing through the passage 46, the air flow enters the shielded space 45, causing the air flow to move partially away (upward in the drawing) from the mold section 47 to be cleaned (see arrow P3). The airflow is then drawn towards the passage 48 beneath the second raised edge 44, which again partially directs the airflow towards the mold section 47 to be cleaned (see arrow P4). The result is a "wave-shaped" flow pattern.

[0030] An alternative skirt 41 embodiment shown in Figure 4B has three protruding raised edges 49, 50, 51 that add additional "waves" to the inlet airflow pattern. Embodiment 42, also shown in Figure 4C, has three protruding raised edges 52, 53, 54, but now the intermediate shielded spaces 55, 56 have curved peaks 57, 58 that make the peaks lower on the "inlet side" than on the "outlet side."

Claims

1. 1. A cleaning device for a mold for sealing electronic components, comprising: a carriage that can move back and forth; an elongated extraction space disposed perpendicular to the direction of reciprocation of the carriage and connected to the carriage; elongated skirts protruding from the carriage and arranged on opposing longitudinal sides of the elongated extraction space, parallel to the elongated extraction space, the elongated skirts extending from the carriage in a direction toward the mold surface to be cleaned; at least one suction opening connected to said elongated extraction space; Equipped with the elongated skirt on at least one of the longitudinal sides of the elongated extraction space has at least two parallel-projecting raised edges, between which is located a shielded space closed by a top surface; the at least two parallel protruding raised edges of the elongated skirt on the longitudinal faces of the elongated extraction space are connected to each other on their lateral faces with raised lateral edges; Cleaning equipment.

2. 2. Cleaning device according to claim 1, characterized in that the elongated skirt on both longitudinal sides of the elongated extraction space has at least two parallel projecting raised edges.

3. 3. The cleaning device according to claim 1, wherein at least one brush is arranged in the elongated extraction space and protrudes from the carriage.

4. 4. The cleaning device according to claim 3, wherein the brush is elongated and arranged parallel to the elongated extraction space.

5. 5. The cleaning device according to claim 1, wherein the closed top surface of the shielded space between the at least two parallel protruding raised edges is lower on the side facing away from the elongated extraction space than on the side facing towards the elongated extraction space.

6. 6. Cleaning device according to any one of claims 1 to 5, characterized in that the parallel projecting raised edges of the elongated skirt on one longitudinal side of the elongated extraction space have substantially the same height.

7. Cleaning device according to any one of the preceding claims, characterized in that at least part of the protruding raised edge is made from a solid material.

8. Cleaning device according to any one of the preceding claims, characterized in that at least part of the protruding raised edge is made from a flexible material.

9. 9. The cleaning device according to claim 1, wherein the elongated skirt surrounding the elongated extraction space and the suction opening are assembled to a frame part, the frame part being vertically displaceable onto the carriage.

10. 10. Cleaning device according to any one of the preceding claims, characterized in that the cleaning device comprises a suction device connected to the suction opening.

11. 11. The cleaning device according to any one of claims 1 to 10, characterized in that the cleaning device comprises at least one guide for supporting the cleaning device relative to the mould part to be cleaned in order to keep the cleaning device at a controlled distance from the mould part.

12. 1. A molding system for encapsulating an electronic component mounted on a carrier, comprising: at least one mold with at least two mold parts displaceable relative to one another, at least one of the mold parts having a recessed mold cavity in a contact surface, the mold part configured to engage the mold cavity around the electronic component to be encapsulated; 12. A cleaning device according to any one of claims 1 to 11, which is movable from at least one position between the mold parts of the at least one mold when the mold parts are spaced apart, and from a position spaced apart from the mold parts when the mold parts are in contact. A molding system comprising:

13. 13. A method for encapsulating an electronic component mounted on a carrier using the molding system of claim 12, comprising: A) positioning a carrier carrying one or more electronic components between two mold halves with the electronic components facing the mold cavity; B) moving the mold parts toward each other to clamp the carrier between the mold parts, the at least one mold cavity surrounding the electronic component to be encapsulated; C) delivering molding material into the mold cavity; D) moving the mold parts away from each other and removing the carrier with molded electronic components from the mold parts; Including, After process step D), during process step E), a cleaning device is moved between the mold parts and an elongated extraction space is moved along the mold part containing the mold cavity, whereby, while the elongated extraction space cleans the at least one mold cavity, gas with the detached particles is extracted via a suction opening connected to the elongated extraction space, and ambient gas is supplied to the suction opening through an opening between the parallel-projecting raised edge and the mold part to be cleaned. A method for encapsulating electronic components.

14. 14. The method for sealing electronic components according to claim 13, characterized in that the gas is supplied in a gas flow via a first opening between a parallel-projecting raised edge facing away from the elongated extraction space and the mold part to be cleaned, and after passing through the first opening, the gas flow moves at least partially away from the mold part to be cleaned and enters the space between the raised parallel-projecting edges.

15. 15. The method for sealing electronic components according to claim 13 or 14, characterized in that when the gas is supplied in a gas flow through a first opening between a first parallel-projecting raised edge and the mold part to be cleaned, and when the gas is supplied through a second opening between a second parallel-projecting raised edge and the mold part to be cleaned, the gas flow at both points has at least one component that is directed towards the mold part to be cleaned before passing through the first and second openings.

16. 16. The method for sealing electronic components according to any one of claims 13 to 15, characterized in that during process step E), the cleaning device also injects a gas flow from at least one position onto the mold part to be cleaned.

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