Hot melt adhesive foam dispensing system incorporating a heat exchanger and method of implementing the hot melt adhesive foam dispensing system

Abstract

The dispensing system (101) includes an impeller device (160) configured to receive the hot melt adhesive; a pump (111) having a first input (118) configured to receive the hot melt adhesive and a second input (191) configured to receive a gas, the pump configured to mix the hot melt adhesive and the gas to form a solution and pump the solution at a volumetric flow rate; a valve (194) configured to control the amount of gas supplied to the pump (111) through the second input (191); and a dispenser (195) configured to receive the solution from the pump (111) and dispense the solution to form a hot melt adhesive foam.

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims the benefit of U.S. Provisional Application No. 63 / 427,248, filed November 22, 2022, the disclosure of which is incorporated by reference into this application for all purposes as if fully set forth herein.

[0002] (Technical field) The present disclosure relates generally to a hot melt adhesive foam dispensing system. The present disclosure further relates generally to a hot melt adhesive foam dispensing system implementing a heat exchanger. The present disclosure further relates generally to a method of implementing a hot melt adhesive foam dispensing system. The present disclosure further relates generally to a method of implementing a hot melt adhesive foam dispensing system implementing a heat exchanger. [Background technology]

[0003] Hot melt thermoplastic adhesives are used in many applications, such as packaging and product assembly. In a conventional hot melt adhesive foam dispensing system, a pump delivers a solution of adhesive and gas to an adhesive dispenser, called a gun. The gun includes a valve at the outlet nozzle through which the solution is dispensed to atmospheric pressure. As the solution is dispensed, gas is released from the solution and trapped within the adhesive, forming a foam on the substrate to which the adhesive is applied. During operation of a conventional hot melt adhesive foam dispensing system, it is desirable to maintain a consistent quality of the hot melt adhesive foam applied to the substrate so that the foamed substrate meets specific product specifications.

[0004] In this regard, it is desirable to increase the output of current systems. However, attempts to increase the system's output have resulted in poor performance. Furthermore, current systems utilize density control devices implemented as electromechanical on-off control systems. In this regard, electromechanical on-off control systems utilize a slug and a spring. The slug is typically in communication with a pressurized portion of the system, which pressurizes the slug and compresses the spring. In this regard, increasing the gas content reduces the pump efficiency and decreases the flow rate. This reduces the slug force and decreases the compression of the spring. In response, gas is injected when the slug is compressed enough to make electrical contact with a manually adjustable contact. The gas is turned off when the electrical contact is broken due to the reduced slug force.

[0005] Additionally, current systems also utilize density control devices (DCs). In this regard, users must select the appropriate slug, such as a one-hole slug, a two-hole slug, or a four-hole slug, based on the viscosity of the material. In this regard, density control devices are sensitive to flow rate and viscosity. Furthermore, changes in pump speed and / or temperature affect the density control setting. Therefore, the interdependence of pump speed and temperature makes it difficult for users to set the control to the desired operating point. Furthermore, density control devices are typically difficult and costly to automate, such as motorized control or position control. Furthermore, current systems also utilize pressure control valves (PCVs). In this regard, pressure control valves (PCVs) do not control pressure well, especially in the presence of gas. Furthermore, pressure control valves (PCVs) tend to drift or stick.

[0006] Therefore, there is a need for a hot melt adhesive foam dispensing system with improved performance. In some aspects, there is a need for a hot melt adhesive foam dispensing system with improved performance that addresses the above-mentioned shortcomings. Summary of the Invention

[0007] In one general aspect, a dispensing system includes an impeller device configured to receive a hot melt adhesive; a pump having a first input configured to receive the hot melt adhesive and a second input configured to receive a gas, the pump configured to mix the hot melt adhesive and the gas to form a solution and pump the solution at a volumetric flow rate; a valve configured to control the amount of gas supplied to the pump through the second input; and a dispenser configured to receive the solution from the pump and dispense the solution to form a hot melt adhesive foam.

[0008] In one general aspect, a method includes receiving a hot melt adhesive from a hot melt adhesive supply into an impeller device. The method further includes receiving a gas from a gas supply. The method further includes mixing the hot melt adhesive and the gas to form a solution. The method also includes pumping the solution from a pump to a dispenser at a volumetric flow rate. The method further includes dispensing the solution to form a hot melt adhesive foam.

[0009] In one general aspect, the dispensing system includes a heat exchanger and / or manifold disposed within the manifold, the dispensing system further including a pump having a first input configured to receive a hot melt adhesive and a second input configured to receive a gas, the pump configured to mix the hot melt adhesive and the gas to form a solution and pump the solution at a volumetric flow rate, a valve configured to control the amount of gas provided to the pump through the second input, and a dispenser configured to receive the solution from the pump and dispense the solution to form a hot melt adhesive foam.

[0010] In one general aspect, a method includes receiving a hot melt adhesive from a hot melt adhesive supply into an impeller device. The method further includes receiving a gas from a gas supply. The method further includes mixing the hot melt adhesive and the gas to form a solution. The method also includes pumping the solution from a pump to a dispenser at a volumetric flow rate, reducing the temperature of the hot melt adhesive with a heat exchanger disposed within a manifold and / or a manifold, and dispensing the solution to form a hot melt adhesive foam.

[0011] The foregoing summary, as well as the following detailed description, will be better understood when read in conjunction with the appended drawings. The drawings illustrate exemplary aspects of the present disclosure. It should be understood, however, that the application is not limited to the precise configurations and devices shown. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a schematic diagram of a dispensing system according to an aspect of the present disclosure. [Figure 2] 1 is a perspective view of an exemplary embodiment of a dispensing system according to aspects of the present disclosure; [Figure 3] FIG. 3 is a front view of the exemplary embodiment of the dispensing system of FIG. 2. [Figure 4A] FIG. 1 is a top view of an exemplary embodiment of an impeller according to aspects of the present disclosure; [Figure 4B] FIG. 1 is a top view of an exemplary embodiment of an impeller according to aspects of the present disclosure; [Figure 4C] FIG. 1 is a top view of an exemplary embodiment of an impeller according to aspects of the present disclosure; [Figure 5A] FIG. 5 is a front perspective view of an exemplary embodiment of the impeller of FIG. 4 . [Figure 5B] FIG. 5 is a front perspective view of an exemplary embodiment of the impeller of FIG. 4 . [Figure 5C] FIG. 5 is a front perspective view of an exemplary embodiment of the impeller of FIG. 4 . [Figure 5D] FIG. 5 is a front perspective view of an exemplary embodiment of the impeller of FIG. 4 . [Figure 5E]FIG. 5 is a front perspective view of an exemplary embodiment of the impeller of FIG. 4 . [Figure 6] FIG. 1 is a perspective view of an exemplary embodiment of a discharge system showing details of a heat exchanger according to aspects of the present disclosure. [Figure 7] FIG. 7 is an interior perspective view of an exemplary embodiment of a discharge system showing details of the heat exchanger of FIG. 6. [Figure 8] 1 is a cross-sectional view of an exemplary embodiment of a heat exchanger according to aspects of the present disclosure. [Figure 9] FIG. 10 illustrates the temperature of a solution in a heat exchanger according to an aspect of the present disclosure. [Figure 10] FIG. 1 is a perspective view of an exemplary embodiment of a dispensing system showing details of a temperature sensor according to aspects of the present disclosure. [Figure 11] FIG. 11 is a front view of an exemplary embodiment of a dispensing system showing details of the temperature sensor of FIG. 10 . [Figure 12] 1 is a cross-sectional view of an exemplary embodiment of a dispenser valve according to aspects of the present disclosure. [Figure 13] FIG. 2 is a cross-sectional view of an exemplary embodiment of a first stage according to aspects of the present disclosure. [Figure 14] FIG. 2 is a cross-sectional view of an exemplary embodiment of a second stage according to aspects of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0013] Aspects of the dispensing system disclosed herein are configured to provide satisfactory scaling of the pump size. In this regard, initial attempts to scale the pump size were found to result in dispensing systems that exhibited inadequate performance. After further investigation, it was determined that the problems associated with scaling the pump size were not due to improper mixing, but rather due to overheating of the adhesive. Specifically, in exemplary embodiments of the current dispensing system, heat rises of up to 50°F (27.8°C) were observed. This heat rise easily overheated the outlet hose and other components of the dispensing system.

[0014] Thus, the disclosed embodiments of the dispensing system implement the disclosed heat exchanger to reduce the temperature of the adhesive, resulting in a higher maximum operational revolutions per minute (RPM) of the pump and a higher output speed of the dispensing system. Simulations have shown that various embodiments of the heat exchanger operate reliably to cool the adhesive by at least 20°F (11.1°C) at exemplary flow rates of adhesive through the dispensing system.

[0015] Additionally, it has been found that as the current embodiment operates to compress the gas in the current recirculation stream, pump efficiency is dramatically reduced. In a typical 50% density reduction scenario, the pump can act as a gas compressor, similar to a typical hot melt volumetric pump (40-45% efficiency). In this regard, compressing the gas generates a large amount of heat. The disclosed heat exchanger addresses this heat generation.

[0016] Furthermore, earlier embodiments of the heat exchanger utilizing multiple parallel tube heat exchangers were found to be largely ineffective at the high flow rates expected of embodiments of the dispensing system of the present disclosure. In laminar flows typical of hot melt systems, the tube radius is considered to eliminate from the heat transfer equation, and only the length and number of parallel tubes are important. Even in heat exchanger embodiments utilizing 10 parallel tubes throughout the entire length of the manifold, the temperature was found to drop by less than 2.8°C (5°F).

[0017] In this regard, the present disclosure embodies, for example, a heat exchanger having two parallel 1.5 inch diameter holes with inserts that create a fluid layer of 0.060 to 0.080 inches, which provides an acceptable pressure drop and can reduce adhesive temperatures from 375°F to a range of 360°F-365°F.

[0018] FIG. 1 is a schematic diagram of a dispensing system according to an embodiment of the present disclosure.

[0019] Referring initially to FIG. 1, a dispensing system 101 for dispensing hot melt adhesive foam onto a substrate according to an embodiment of the present disclosure can include an impeller device 160, a pump 111, and / or the like.

[0020] The impeller device 160 can include a first input 152 configured to receive hot melt adhesive. Specifically, the hot melt adhesive can be supplied to the impeller device 160 through the first input 152 from a hot melt adhesive supply source 117. The hot melt adhesive supply source 117 can be a conventional adhesive melter (melter) or the like configured to store solid adhesive, melt the solid adhesive into hot melt adhesive, and selectively supply the hot melt adhesive to the impeller device 160. However, the hot melt adhesive supply source 117 can be any conventional hot melt adhesive supply source, as desired. Additionally, the impeller device 160 can output the hot melt adhesive to the pump 111.

[0021] In some aspects, the impeller device 160 may be configured within the dispensing system 101 to improve the efficiency of the dispensing system 101, to generate a higher output rate of the dispensing system 101, and / or otherwise. Additionally, some aspects of the impeller device 160 may be configured to improve the operation of the dispensing system 101, including capturing gas from the recirculation system of the dispensing system 101. In this regard, if too much gas is supplied to the dispensing system 101, embodiments of the dispensing system 101 without the impeller device 160 may take longer to recover without dispensing adhesive.

[0022] In some embodiments, the impeller device 160 may be configured and / or implemented as a semi-open impeller driven by a common idler shaft 193. In some embodiments, the impeller device 160 may be configured and / or implemented to generate positive pressure at the inlet port of the pump 111 under all operating conditions throughout the dispensing system 101. The impeller device 160 may be disposed between the adhesive source 117 and the second recirculation flow path 129. In this manner, the impeller device 160 may be configured to recirculate the gas under constant pressure, minimizing compression and increasing the efficiency of the pump 111 for the same gas content. In some embodiments, the pump 111 may be configured to maintain this flow above atmospheric pressure.

[0023] The impeller device 160 may be implemented as a pump inlet priming impeller. In some embodiments, the impeller device 160 increases the mixing energy within the dispensing system 101, thereby improving foam quality at low to medium pumping speeds of the pump 111. Additionally, the impeller device 160 is configured to reduce heat buildup due to increased pump efficiency from better gas mixing. Additionally, the impeller device 160 may be configured to reduce foaming within the tank that may be associated with the adhesive supply 117.

[0024] Pump 111 may be a gear pump or any other suitable pump, such as, but not limited to, a two-stage pump having a first stage 192 and a second stage 113. In some embodiments, pump 111 may be implemented with multiple sets of double-stacked gears.

[0025] In some embodiments, the first stage 192 can include a counter-rotating, meshing gear pair, and the second stage 113 can include a counter-rotating, meshing gear pair. For example, the first stage 192 of the pump 111 can include a first gear 170 and a second gear 172. In this regard, the first gear 170 and the second gear 172 can rotate in opposite directions and mesh with each other. Similarly, the second stage 113 of the pump 111 can include a first gear 180 and a second gear 182. In this regard, the first gear 180 and the second gear 182 can rotate in opposite directions and mesh with each other. In one embodiment, the first gear 170 of the first stage 192 and the first gear 180 of the second stage 113 can be drive gears coupled to a common drive shaft 114. Thus, first gear 170 of first stage 192 and first gear 180 of second stage 113 can rotate in the same direction because they are connected to a common drive shaft 114. In this embodiment, second gear 172 of first stage 192 and second gear 182 of second stage 113 can be idler gears connected to a common idler shaft 193. Thus, second gear 172 of first stage 192 and second gear 182 of second stage 113 can rotate in the same direction because they are connected to a common idler shaft 193.

[0026] The common drive shaft 114 can be driven by a motor 168. The motor 168 can include a motor controller 169. The motor controller 169 can control the revolutions per minute (RPM) of the pump 111 and / or the revolutions per minute (RPM) of the motor 168.

[0027] Once the hot melt adhesive is received by the pump 111 from the impeller device 160, the hot melt adhesive may be fed into an inlet 118 of a first stage 192 of the pump 111. The first stage 192 may also include an outlet 119, and the first stage 192 may deliver the hot melt adhesive to the outlet 119 at a metered, controlled rate.

[0028] After exiting the outlet 119 of the first stage 192, the hot melt adhesive may flow at a metered controlled rate and be introduced into the inlet 121 of the second stage 113 of the pump 111. In addition to the hot melt adhesive, gas may be supplied from a gas source 122 into the second input 191 of the pump 111.

[0029] Specifically, gas may flow from gas source 122, through gas line 123, through second input 191, and into inlet 121 of second stage 113. The gas may be, for example, nitrogen, air, carbon dioxide, and / or the like, although other gases are contemplated.

[0030] The discharge system 101 may also include a gas valve 194 in fluid communication with the gas line 123 between the gas source 122 and the second input 191. The gas valve 194 may be configured to control the amount of gas supplied to the pump 111 through the second input 191.

[0031] After being received through the inlet 121 of the second stage 113, the gas from the gas source 122 and the hot melt adhesive from the outlet 119 of the first stage 192 are mixed in the second stage 113 of the pump 111. The pump 111 can be configured to mix the gas with the hot melt adhesive under pressure such that the gas goes into solution with the molten adhesive. The pump 111 can then pump the solution at a volumetric flow rate out the outlet 126 of the second stage 113 of the pump 111.

[0032] A temperature sensor 156 in fluid communication with the solution can be configured to detect the temperature of the solution after it leaves the outlet 126. In the illustrated embodiment, the temperature sensor 156 can be located adjacent the outlet 126 of the second stage 113, although other locations are contemplated.

[0033] Additionally, a heat exchanger 157 can be disposed adjacent to the outlet 126, where the heat exchanger 157 can be configured to selectively reduce the temperature of the solution exiting the outlet 126. The solution can then flow through the filter 127 to the gear flow meter 100. As such, the filter 127 can be fluidly disposed between the pump 111 and the gear flow meter 100. In other embodiments, the dispensing system 101 can be implemented without the gear flow meter 100. And, in this embodiment, the solution can flow through the filter 127 directly to the dispenser 195 and / or through intervening components. The filter 127 can be configured to separate hardened particles of hot melt adhesive that solidified during passage through the pump 111 or that were not melted by the hot melt adhesive source 117.

[0034] Gear flow meter 100 can be configured to measure the volumetric flow rate of the solution pumped by pump 111. Thus, gear flow meter 100 can be implemented as a volumetric flow meter. In some examples, gear flow meter 100 can be implemented as a gear flow meter. However, it will be understood that other suitable flow meters may be used.

[0035] After flowing through gear flow meter 100, the solution can be delivered to a dispenser 195, which can include a valved adhesive dispensing gun and / or the like. Dispenser 195 can be configured to receive the solution from gear flow meter 100 and dispense the solution onto a substrate, where gas contained in the solution is released from the solution and trapped in the adhesive, creating a hot melt adhesive foam.

[0036] During normal operation of the dispensing system 101, solution flowing from the outlet 126 of the second stage 113 of the pump 111 is fluidly coupled to the inlet 118. For example, the dispensing system 101 can include a first recirculation flow path 135 and a second recirculation flow path 129 configured to selectively direct solution from the dispenser 195 to the pump 111.

[0037] The dispenser 195 can include a dispenser valve 132 configured to move between an open position in which the dispenser 195 dispenses at least a portion of the solution and a closed position in which the dispenser 195 does not dispense the solution.

[0038] When dispenser valve 132 is in the open position and dispenser 195 is dispensing solution, a portion of the solution, such as 75% of the solution, is recirculated through first recirculation flow path 135 and second recirculation flow path 129. Similarly, the remaining 25% of the solution flow from pump 111 can be dispensed by dispenser 195. While specific percentages of solution are listed, this is exemplary only, and the solution can be divided in different proportions as needed. For example, when dispenser valve 132 is in the open position, any percentage between 1% and 100% of the solution can be dispensed from dispenser 195. When dispenser valve 132 is closed, all of the solution flowing from outlet 126 of second stage 113 of pump 111 can be recirculated through second recirculation flow path 129.

[0039] The dispensing system 101 may include a translucent panel 143 connected to the dispenser 195. The translucent panel 143 may include a window through which an operator of the dispensing system 101 can view the solution. In particular, the translucent panel 143 may allow a user to view air bubbles in the solution as the solution flows into the first recirculation flow path 135.

[0040] While it can be difficult to objectively measure the quality of the hot melt adhesive foam applied to a substrate using various measurement devices, the translucent panel 143 allows an operator to easily monitor the quality of the solution and accordingly adjust the operation of the dispensing system 101. The operator can also monitor the quality of the hot melt adhesive foam dispensed from the dispenser 195 and accordingly adjust the operation of the dispensing system 101.

[0041] Because the amount of solution flowing through the first recirculation flow path 135 and the second recirculation flow path 129 can vary as described above during operation of the dispensing system 101, the pressure of the solution in the dispenser 195 can be affected by the pressure of the material flowing through the first recirculation flow path 135 and the second recirculation flow path 129. As such, the dispensing system 101 can include a device for controlling the pressure of the solution flowing through the first recirculation flow path 135 and the second recirculation flow path 129.

[0042] In one aspect, the dispensing system 101 can include a pressure regulator 131 in fluid communication with the first recirculation flow path 135 and the second recirculation flow path 129, where the pressure regulator 131 is configured to control the pressure of the solution flowing through the first recirculation flow path 135. While the pressure regulator 131 is shown connected to the first recirculation flow path 135, in other aspects, the pressure regulator 131 can be connected to the second recirculation flow path 129. The pressure regulator 131 can be controlled by a transducer 149, such as an electro-pneumatic (E / P) transducer, configured to selectively operate the pressure regulator 131. However, any conventional device for controlling the operation of the pressure regulator 131 can alternatively be utilized.

[0043] The dispensing system 101 can also include a pressure sensor 144 in fluid communication with the first recirculation flow path 135, where the pressure sensor 144 is configured to measure the pressure of the solution flowing through the first recirculation flow path 135 upstream of the pressure regulator 131. The pressure sensor 144 can be a pressure transducer, although other conventional pressure measurement devices can be utilized. Both the transducer 149 and the pressure sensor 144 can be in signal communication with a controller 148, which is configured to receive a signal from the pressure sensor 144 indicative of the pressure of the solution flowing through the first recirculation flow path 135. The controller 148 can use this signal to control the transducer 149 and, therefore, the pressure regulator 131, and can direct the transducer 149 to operate the pressure regulator 131 based on the pressure measured by the pressure sensor 144. As a result, the dispensing system 101 can maintain a substantially constant pressure of the solution in the dispenser 195.

[0044] In one embodiment, the controller 148 may be a PID controller. However, the controller 148 may also be a proportional controller or any other type of controller capable of controlling the transducer 149 based on the signal received from the pressure sensor 144. Additionally, the controller 148 may be configured to receive user input from an operator of the dispensing system 101 to set a desired pressure for the solution flowing through the first recirculation flow path 135.

[0045] In some embodiments, the PID controller implemented in the controller 148 may implement a control loop mechanism that employs feedback, such as the pressure measured by the pressure sensor 144. In this regard, the PID controller implemented in the controller 148 may continuously calculate an error value as the difference between a desired set point and a measured process variable, such as the pressure measured by the pressure sensor 144, and apply a correction value based on proportional, integral, and derivative terms. In another embodiment, the controller 148 may include a proportional controller. However, the controller 148 may include any suitable computing device configured to provide software applications for monitoring and controlling various operations of the dispensing system 101, as described herein.

[0046] During operation of the dispensing system 101, solution may become blocked within various components of the system. For example, solution may become blocked when flowing through the outlet 126 of the second stage 113 of the pump 111 to the filter 127, the dispenser 195, or the like. Such blockage may result in an increase in pressure at the outlet 126, and thus, adversely affect the operation of the dispensing system 101. To prevent this, the dispensing system 101 may include a pressure relief passage 134 that communicates with the outlet 126 of the second stage 113 of the pump 111 and extends to the second recirculation flow path 129. A pressure relief valve 133 may be connected to the pressure relief passage 134 and configured to open when the pressure of the fluid flowing from the outlet 126 reaches a predetermined threshold. When the pressure of the solution reaches the predetermined threshold, the opening of the pressure relief valve 133 allows the solution to escape to the second recirculation flow path 129 and flow to the inlet 118 of the pump 111. Thus, pressure relief valve 133 and pressure relief passage 134 can prevent over-pressurized solution from building up at outlet 126 of second stage 113 of pump 111 .

[0047] To control the various components of the dispensing system 101, the dispensing system 101 may include a controller 137. In one aspect, the controller 137 may include a proportional-integral-derivative controller (PID controller or three-term controller). In some aspects, the PID controller implemented in the controller 137 may implement a control loop mechanism employing feedback. In this regard, the PID controller implemented in the controller 137 may continuously calculate an error value as the difference between a desired set point and a measured process variable and apply a correction value based on the proportional, integral, and derivative terms. In another aspect, the controller 137 may include a proportional controller. However, the controller 137 may include any suitable computing device configured to provide software applications for monitoring and controlling various operations of the dispensing system 101, as described herein.

[0048] It will be appreciated that the controller 137 can include any suitable computing device, including a processor, a desktop computing device, a server computing device, or a portable computing device such as a laptop, tablet, or smartphone. Specifically, the controller 137 can include memory 140 and a human-machine interface (HMI) or HMI device 141. The memory 140 can be volatile (such as some types of RAM), non-volatile (such as ROM, flash memory, etc.), or a combination thereof. The controller 137 can include additional storage (e.g., removable and / or non-removable storage), including, but not limited to, tape, flash memory, smart cards, CD-ROMs, digital versatile disks (DVDs) or other optical storage devices, magnetic tape, magnetic disk storage devices or other magnetic storage devices, universal serial bus (USB) compatible memory, or any other medium that can be used to store information and is readable by the controller 137. The HMI device 141 can include inputs that provide the ability to control the controller 137 via, for example, buttons, softkeys, a mouse, voice-activated controls, a touchscreen, movement of the controller 137, visual cues (e.g., waving a hand in front of a camera on the controller 137), etc. The HMI device 141 can provide outputs including visual information, such as a visual display of the current pressure values ​​of the gas, hot melt adhesive, and / or solution, as well as tolerances for these parameters, via a graphical user interface. Other outputs can include audio information (e.g., via a speaker), mechanical (e.g., via a vibration mechanism), or a combination thereof. In various configurations, the HMI device 141 can include a display, a touchscreen, a keyboard, a mouse, a motion detector, a speaker, a microphone, a camera, or any combination thereof. The HMI device 141 can further include any suitable device for inputting biometric information, such as fingerprint information, retinal information, voice information, and / or facial recognition information, so as to require specific biometric information for accessing the control device 137.

[0049] The controller 137 may be in signal communication with, and may receive signals from and / or issue commands to, various components of the dispensing system 101. The controller 137 may be in signal communication with the gear flow meter 100 via a first signal connection 196, the gas valve 194 via a second signal connection 197, the pump 111 via a third signal connection 198, and the temperature sensor 156 via a fourth signal connection 199. Each of the first signal connection 196, the second signal connection 197, the third signal connection 198, and the fourth signal connection 199 may include a wired connection and / or a wireless connection.

[0050] FIG. 2 is a perspective view of an exemplary embodiment of a dispensing system according to aspects of the present disclosure.

[0051] FIG. 3 is a front view of the exemplary embodiment of the dispensing system of FIG.

[0052] In particular, Figures 2 and 3 may include any other embodiment of the dispensing system 101 shown and / or described herein. Additionally, the embodiments shown in Figures 2 and 3 may be implemented in any other embodiment of the dispensing system 101 described in this disclosure. Additionally, Figures 2 and 3 illustrate exemplary arrangements of the motor 168, adhesive supply 117, impeller device 160, pump 111, heat exchanger 157, and / or others that may be implemented in the dispensing system 101 disclosed herein.

[0053] FIG. 4, which comprises FIGS. 4A, 4B, and 4C, is a top view of an exemplary embodiment of an impeller according to aspects of the present disclosure.

[0054] FIG. 5, which comprises FIGS. 5A, 5B, 5C, 5D, and 5E, is a front perspective view of an exemplary embodiment of the impeller of FIG.

[0055] In particular, Figures 4 and 5 may include any other aspect of the discharge system 101 shown and / or described herein. Additionally, the aspects illustrated in Figures 4 and 5 may be implemented in any other aspect of the discharge system 101 described in this disclosure. Additionally, Figures 4 and 5 show exemplary embodiments of an impeller device 160 and / or the like that may be implemented in the discharge system 101 disclosed herein.

[0056] As shown in FIG. 4, the impeller device 160 may include an impeller 162. The impeller 162 may be disposed within an impeller housing 164. Further, the impellers 162 may be operably attached to a common idler shaft 193. Furthermore, the impellers 162 of the impeller device 160 may be driven by the common idler shaft 193. In particular, FIG. 4A illustrates the impeller device 160 with the impeller housing 164 attached. FIG. 4B illustrates the impeller device 160 with the impeller housing 164 shown as transparent. FIG. 4C illustrates the impeller device 160 with the impeller housing 164 removed for ease of understanding.

[0057] Referring to FIG. 5, an impeller device 160 including an impeller housing 164 can be disposed on the pump 111. More specifically, FIG. 5A shows the external configuration of the impeller device 160. FIG. 5B shows the external configuration of the impeller device 160 with the impeller housing 164 shown as transparent. FIG. 5C shows the external configuration of the impeller device 160 with the impeller housing 164 removed for ease of understanding. FIG. 5D shows the external configuration of the impeller device 160 with the impeller housing 164 removed and the housing of the pump 111 removed for ease of understanding. FIG. 5E shows the external configuration of the impeller device 160 with the impeller housing 164 removed, the housing of the pump 111 removed, and the gears of the pump 111 removed for ease of understanding.

[0058] FIG. 6 is a perspective view of an exemplary embodiment of a discharge system showing details of a heat exchanger according to aspects of the present disclosure.

[0059] FIG. 7 is an internal perspective view of an exemplary embodiment of a discharge system showing details of the heat exchanger of FIG.

[0060] In particular, Figures 6 and 7 may include any other aspect of the discharge system 101 shown and / or described herein. Additionally, the aspects illustrated in Figures 6 and 7 may be implemented with any other aspect of the discharge system 101 described in this disclosure. Additionally, Figures 6 and 7 show an exemplary embodiment of a heat exchanger 157.

[0061] 6, the heat exchanger 157 can be disposed in the lower portion of the discharge system 101. Additionally, the heat exchanger 157 can be disposed within and / or include a manifold. Additionally, the heat exchanger 157 can include lower heat dissipation fins 202. Additionally, the heat exchanger 157 can include side heat dissipation fins 204.

[0062] 7 , the heat exchanger 157 may include a heat exchanger inlet 206 configured and arranged to receive hot melt adhesive from the pump 111 or other component of the dispensing system 101. The heat exchanger 157 may also include a heat exchanger outlet 208 configured and arranged to output the hot melt adhesive to the filter 127 or other component of the dispensing system 101. The heat exchanger 157 may further include at least one heat exchange tube 212. In some aspects, the heat exchanger 157 is implemented with two embodiments of the at least one heat exchange tube 212. However, it is contemplated by the present disclosure that any number of embodiments of the at least one heat exchange tube 212 may be implemented in the heat exchanger 157.

[0063] Further, the heat exchanger 157 may include a first heat exchanger conduit 210 extending from the heat exchanger inlet 206 to a first end 214 of the at least one heat exchange tube 212. Thus, the hot melt adhesive received from the pump 111 may enter the heat exchanger inlet 206 and be guided by the first heat exchanger conduit 210 to the first end 214 of the at least one heat exchange tube 212. The hot melt adhesive may then be guided from the first end 214 of the at least one heat exchange tube 212 to the second end 216 of the at least one heat exchange tube 212. During the movement of the hot melt adhesive from the first end 214 to the second end 216 within the at least one heat exchange tube 212, heat may be transferred from the hot melt adhesive through the at least one heat exchange tube 212 to the lower heat dissipation fin 202 and / or the side heat dissipation fin 204.

[0064] When the hot melt adhesive reaches the second end 216 of the at least one heat exchange tube 212, the hot melt adhesive may enter a second heat exchanger conduit 218. The hot melt adhesive may then be guided by the second heat exchanger conduit 218 to the heat exchanger outlet 208. From the heat exchanger outlet 208, the hot melt adhesive may then be guided to the filter 127 or other component of the discharge system 101.

[0065] FIG. 8 is a cross-sectional view of an exemplary embodiment of a heat exchanger according to aspects of the present disclosure.

[0066] In particular, Figure 8 may include any other aspect of the dispensing system 101 shown and / or described herein. Additionally, the aspects shown in Figure 8 may be implemented in any other aspect of the dispensing system 101 described in this disclosure. Additionally, Figure 8 illustrates an exemplary embodiment of a heat exchanger 157.

[0067] 8 , at least one heat exchange tube 212 of the heat exchanger 157 can include a heat exchange tube outer wall 220 and a heat exchange inner wall 222. In this regard, the hot melt adhesive can flow between the heat exchange tube outer wall 220 and the heat exchange inner wall 222. In this regard, minimizing the area for the hot melt adhesive to flow, in this case the area between the heat exchange tube outer wall 220 and the heat exchange inner wall 222, can increase the transfer of heat from the hot melt adhesive to the heat exchanger 157. Furthermore, the heat exchange tube outer wall 220 and the heat exchange inner wall 222 can transfer heat from the hot melt adhesive to the lower heat dissipation fins 202 and / or the side heat dissipation fins 204 of the heat exchanger 157.

[0068] In some embodiments, the heat exchange tube outer wall 220 and the heat exchange inner wall 222 can increase the heat transfer surface relative to the flow rate of the solution therethrough. In some embodiments, the heat exchange inner wall 222 can be formed as an insert that is inserted into 212. In some embodiments, the heat exchange inner wall 222 can be formed as a cylindrical insert that is disposed within 212.

[0069] In some aspects, the at least one heat exchange tube 212 and / or the heat exchange tube outer wall 220 can have a diameter of 0.5 inches to 4.0 inches, 1.0 inches to 2.0 inches, 1.2 inches to 1.7 inches, 2.0 inches to 3.0 inches, or 3.0 inches to 4.0 inches. The diameter of the at least one heat exchange tube 212 and / or the heat exchange tube outer wall 220 can provide more effective and / or more efficient transfer of heat from the hot melt adhesive to the heat exchanger 157. In some aspects, the transfer of heat from the hot melt adhesive to the disclosed embodiments of the heat exchanger 157 was unexpected and surprising.

[0070] In some aspects, the distance between the heat exchange inner wall 222 and the heat exchange tube outer wall 220 may be 0.02 inches to 0.15 inches, 0.02 inches to 0.05 inches, 0.05 inches to 0.9 inches, 0.9 inches to 0.10 inches, or 0.10 inches to 0.15 inches. The distance between the heat exchange inner wall 222 and / or the heat exchange tube outer wall 220 can provide more effective and / or more efficient transfer of heat from the hot melt adhesive to the heat exchanger 157. In some aspects, the transfer of heat from the hot melt adhesive to the disclosed embodiments of the heat exchanger 157 was unexpected and surprising.

[0071] FIG. 9 is a diagram illustrating the temperature of a solution in a heat exchanger according to an embodiment of the present disclosure.

[0072] In particular, FIG. 9 illustrates the temperature of the solution within a heat exchanger 157 implemented in accordance with the present disclosure. In this regard, FIG. 9 illustrates that the temperature of the solution at the heat exchanger inlet 206 approached 193°C (379°F), and that the solution output from the heat exchanger outlet 208 approached 177°C (350°F). In this regard, other configurations of the dispensing system 101 implementing different settings may have similar temperature reduction amounts. In some embodiments, a heat exchanger 157 implemented in accordance with the present disclosure may reduce the temperature by at least 5.6°C (10°F), 11.1°C (20°F), 16.7°C (30°F), or 22.2°C (40°F).

[0073] FIG. 10 is a perspective view of an exemplary embodiment of a dispensing system showing details of a temperature sensor according to aspects of the present disclosure.

[0074] FIG. 11 is a front view of an exemplary embodiment of a dispensing system showing details of the temperature sensor of FIG.

[0075] In particular, Figures 10 and 11 may include any other aspect of the dispensing system 101 shown and / or described herein. Additionally, the aspects shown in Figures 10 and 11 may be implemented in any other aspect of the dispensing system 101 described in this disclosure. Additionally, Figures 10 and 11 illustrate an exemplary embodiment of the dispensing system 101, showing details of the temperature sensor 156.

[0076] In this regard, the solution after exiting the outlet 126 of the dispensing system 101 can enter a manifold, which can be part of a heat exchanger 157. A temperature sensor 156 can be disposed between the outlet 126 and the heat exchanger 157. The temperature sensor 156 can thus be in fluid communication with the solution and configured to detect the temperature of the solution. In the illustrated embodiment, the temperature sensor 156 can be disposed adjacent to the outlet 126 of the second stage 113, although other locations are contemplated. Furthermore, the temperature sensor 156 can be configured and arranged to control the heat rise within the dispensing system 101 to within a few degrees of a set value with the aid of a manifold heat sink and / or forced convection cooling of the heat exchanger 157. Accordingly, the dispensing system 101 can further include a forced convection cooling device. In particular, the forced convection cooling device can be implemented in the dispensing system 101 in association with the temperature sensor 156.

[0077] FIG. 12 is a cross-sectional view of an exemplary embodiment of a dispenser valve according to aspects of the present disclosure.

[0078] In particular, Figure 12 may include any other aspect of the dispensing system 101 shown and / or described herein. Additionally, the aspects shown in Figure 12 may be implemented in any other aspect of the dispensing system 101 described in this disclosure. Additionally, Figure 12 illustrates an exemplary embodiment of a dispenser valve 132.

[0079] 12, dispenser valve 132 can be implemented as a pressure-controlled valve. Dispenser valve 132 can provide greater adjustment capabilities than current file systems. Furthermore, dispenser valve 132 can be implemented as a pneumatically controlled valve. Furthermore, dispenser valve 132 has demonstrated six times the performance of conventional valves.

[0080] In some embodiments, the dispenser valve 132 can include a pneumatic connection 302 configured to receive air for operation of the dispenser valve 132. Further, the dispenser valve 132 can include a diaphragm 304 that moves in response to air received from the pneumatic connection 302. Movement of the diaphragm 304 results in movement of the valve stem 306 and, subsequently, movement of the plunger 308. Further, the dispenser valve 132 can include a spring 310 and a valve element 312. The spring 310 can be disposed between the plunger 308 and the valve element 312. Thus, the dispenser valve 132 can operate to receive air from the pneumatic connection 302 and move the diaphragm 304, the valve stem 306, the plunger 308, and the valve element 312.

[0081] FIG. 13 is a cross-sectional view of an exemplary embodiment of a first stage according to aspects of the present disclosure.

[0082] In particular, Figure 13 may include any other aspect of the dispensing system 101 shown and / or described herein. Additionally, the aspects shown in Figure 13 may be implemented in any other aspect of the dispensing system 101 described in this disclosure. Additionally, Figure 13 illustrates an exemplary embodiment of a first stage 192.

[0083] 13 , the first stage 192 can be mounted in a housing between the impeller device 160 and the second stage 113. The housing can support the first gear 170 and the second gear 172. In particular, the housing can receive the common drive shaft 114, and the first gear 170 can rotate in conjunction with the rotation of the common drive shaft 114. Additionally, the housing can receive the common idler shaft 193, and the second gear 172 can rotate in conjunction with the rotation of the common idler shaft 193.

[0084] FIG. 14 is a cross-sectional view of an exemplary embodiment of a second stage according to aspects of the present disclosure.

[0085] In particular, Figure 14 may include any other aspect of the dispensing system 101 shown and / or described herein. Additionally, the aspects shown in Figure 14 may be implemented in any other aspect of the dispensing system 101 described in this disclosure. Additionally, Figure 14 illustrates an exemplary embodiment of the second stage 113.

[0086] 14 , the second stage 113 can be mounted in a housing below the first stage 192. The housing can support the first gear 180 and the second gear 182. In particular, the housing can receive a common drive shaft 114, and the first gear 180 can rotate in conjunction with the rotation of the common drive shaft 114. Additionally, the housing can receive a common idler shaft 193, and the second gear 182 can rotate in conjunction with the rotation of the common idler shaft 193.

[0087] Accordingly, the present disclosure provides a hot melt adhesive foam dispensing system with improved performance.Furthermore, the present disclosure provides a hot melt adhesive foam dispensing system with improved performance that addresses the above-mentioned shortcomings.

[0088] Below are several non-limiting examples of aspects of the present disclosure.

[0089] One example includes a dispensing system including an impeller device configured to receive a hot melt adhesive; a pump having a first input configured to receive the hot melt adhesive and a second input configured to receive a gas, the pump configured to mix the hot melt adhesive and the gas to form a solution and pump the solution at a volumetric flow rate; a valve configured to control the amount of gas supplied to the pump through the second input; and a dispenser configured to receive the solution from the pump and dispense the solution to form a hot melt adhesive foam.

[0090] The above-described embodiments may further include any one or more combinations of the following embodiments: The discharge system of the above-described embodiments, wherein the impeller device is configured to improve efficiency; The discharge system of the above-described embodiments, wherein the impeller device is configured to improve the output speed of the discharge system; The discharge system of the above-described embodiments, wherein the impeller device is configured to improve trapped gas from the recirculation system; The discharge system of the above-described embodiments, wherein the impeller device is configured and / or implemented as a semi-open impeller driven by a common idler shaft; The discharge system of the above-described embodiments, wherein the impeller device is configured to be implemented as a pump inlet pre-start warm-up impeller; The discharge system of the above-described embodiments, wherein the impeller device is configured to increase mixing energy; The discharge system of the above-described embodiments, wherein the impeller device is configured to reduce heat rise due to increased pump efficiency; The discharge system of the above-described embodiments, wherein the impeller device can include an impeller; The discharge system of the above-described embodiments, wherein the impeller is disposed within an impeller housing; The discharge system of the above-described embodiments, wherein the controller can include a PID controller; The discharge system of the above-described embodiments, wherein the controller can include a proportional controller. The dispensing system of any of the above embodiments, which may include a hot melt adhesive supply source configured to supply hot melt adhesive to the first input. The dispensing system of any of the above embodiments, which may include a gas supply source configured to supply gas to the second input. The dispensing system of any of the above embodiments, which may include a filter arranged to pass fluid between the pump and a flow meter. The dispensing system of any of the above embodiments, which may include a recirculation flow path configured to selectively direct solution from the dispenser to the pump. The dispensing system of any of the above embodiments, which may include a temperature sensor arranged between the outlet and the heat exchanger. The dispensing system of any of the above embodiments, wherein the temperature sensor is constructed and arranged to control heat rise within the dispensing system. The dispensing system of any of the above embodiments, which may include a heat exchanger and / or manifold arranged within the manifold. The dispensing system of any of the above embodiments, wherein the heat exchanger includes bottom heat dissipation fins and wherein the heat exchanger includes side heat dissipation fins. The dispensing system of any of the above embodiments, wherein the heat exchanger includes bottom heat dissipation fins. The dispensing system of any of the above embodiments, wherein the heat exchanger includes side heat dissipation fins.The discharge system of the above-mentioned embodiments, wherein the heat exchanger can include a heat exchanger inlet, the heat exchanger inlet constructed and arranged to receive hot melt adhesive from a pump or other component of the discharge system. The discharge system of the above-mentioned embodiments, wherein the heat exchanger can include at least one heat exchange tube. The discharge system of the above-mentioned embodiments, wherein the heat exchanger implements two embodiments of the at least one heat exchange tube. The discharge system of the above-mentioned embodiments, wherein the heat exchanger can include a first heat exchanger conduit extending from the heat exchanger inlet to a first end of the at least one heat exchange tube. The discharge system of the above-mentioned embodiments, wherein at least one heat exchange tube of the heat exchanger can include an outer heat exchange tube wall and an inner heat exchange wall. The discharge system of the above-mentioned embodiments, wherein the hot melt adhesive can flow between the outer heat exchange tube wall and the inner heat exchange wall. The discharge system of the above-mentioned embodiments, wherein the inner heat exchange wall is formed as a cylindrical insert. The discharge system of the above-mentioned embodiments, wherein the outlet can include a temperature sensor disposed between the outlet and the heat exchanger. The discharge system of the above-mentioned embodiments, wherein the heat exchanger can include a heat exchanger outlet, the heat exchanger outlet constructed and arranged to output hot melt adhesive to a filter or other component of the discharge system. The dispensing system of any of the above embodiments may include a dispenser valve configured to be implemented as a pneumatically controlled valve.The dispensing system of any of the above embodiments may include a pneumatic connection configured to receive air for operating the dispenser valve.The dispensing system of any of the above embodiments may include a diaphragm that moves in response to air received from the pneumatic connection.

[0091] One embodiment includes a method, the method including receiving a hot melt adhesive from a hot melt adhesive supply into an impeller device. The method further includes receiving a gas from a gas supply. The method further includes mixing the hot melt adhesive and the gas to form a solution. The method also includes pumping the solution from a pump to a dispenser at a volumetric flow rate. The method further includes dispensing the solution to form a hot melt adhesive foam.

[0092] The above-described embodiments may further include any one or more combinations of the following embodiments: The method of the above-described embodiments, wherein the impeller device is configured to improve efficiency; The method of the above-described embodiments, wherein the impeller device is configured to improve the output speed of the discharge system; The method of the above-described embodiments, wherein the impeller device is configured to improve trapped gas from the recirculation system; The method of the above-described embodiments, wherein the impeller device is configured and / or implemented as a semi-open impeller driven by a common idler shaft; The method of the above-described embodiments, wherein the impeller device is configured to be implemented as a pump inlet pre-start warm-up impeller; The method of the above-described embodiments, wherein the impeller device is configured to increase mixing energy; The method of the above-described embodiments, wherein the impeller device is configured to reduce heat rise due to increased pump efficiency; The method of the above-described embodiments, wherein the impeller device may include an impeller; The method of the above-described embodiments, wherein the impeller is disposed within an impeller housing.

[0093] One embodiment includes a dispensing system, the dispensing system including a heat exchanger disposed within the manifold and / or including the manifold, the dispensing system further including a pump having a first input configured to receive a hot melt adhesive and a second input configured to receive a gas, the pump configured to mix the hot melt adhesive and the gas to form a solution and pump the solution at a volumetric flow rate, a valve configured to control an amount of gas provided to the pump through the second input, and a dispenser configured to receive the solution from the pump and dispense the solution to form a hot melt adhesive foam.

[0094] The above-described embodiments may further include any one or more combinations of the following embodiments: the discharge system of the above-described embodiments, wherein the heat exchanger includes a lower heat dissipation fin and the heat exchanger includes a side heat dissipation fin; the discharge system of the above-described embodiments, wherein the heat exchanger includes a lower heat dissipation fin; the discharge system of the above-described embodiments, wherein the heat exchanger includes a side heat dissipation fin; the discharge system of the above-described embodiments, wherein the heat exchanger may include a heat exchanger inlet, the heat exchanger inlet constructed and arranged to receive hot melt adhesive from a pump or other component of the discharge system; the discharge system of the above-described embodiments, wherein the heat exchanger may include at least one heat exchange tube; the discharge system of the above-described embodiments, wherein the heat exchanger implements two embodiments of the at least one heat exchange tube; the discharge system of the above-described embodiments, wherein the heat exchanger may include a first heat exchanger conduit extending from the heat exchanger inlet to a first end of the at least one heat exchange tube; the discharge system of the above-described embodiments, wherein the at least one heat exchange tube of the heat exchanger may include an outer heat exchange tube wall and an inner heat exchange wall. The dispensing system of any of the above embodiments, wherein the hot melt adhesive is capable of flowing between the heat exchange tube outer wall and the heat exchange inner wall. The dispensing system of any of the above embodiments, wherein the heat exchange inner wall is formed as a cylindrical insert. The dispensing system of any of the above embodiments, wherein the hot melt adhesive can include a temperature sensor disposed between the outlet and the heat exchanger. The dispensing system of any of the above embodiments, wherein the temperature sensor is constructed and arranged to control heat rise within the dispensing system. The dispensing system of any of the above embodiments, wherein the dispenser valve is configured to be implemented as a pneumatically controlled valve. The dispensing system of any of the above embodiments, wherein the dispenser valve can include a pneumatic connection configured to receive air for operating the dispenser valve. The dispensing system of any of the above embodiments, wherein the dispenser valve can include a diaphragm that moves in response to air received from the pneumatic connection. The dispensing system of any of the above embodiments, wherein movement of the diaphragm results in movement of the valve stem and subsequent movement of the plunger. The dispensing system of any of the above embodiments, wherein the dispenser valve can include a spring and a valve element. The dispensing system of any of the above embodiments, wherein the dispenser valve can include an impeller device configured to receive hot melt adhesive. The dispensing system of any of the above embodiments, wherein the impeller device is configured to improve efficiency.The discharge system of the above-mentioned embodiments, wherein the impeller device is configured to increase the output rate of the discharge system. The discharge system of the above-mentioned embodiments, wherein the impeller device is configured to increase trapped gas from the recirculation system. The discharge system of the above-mentioned embodiments, wherein the impeller device is configured and / or embodied as a semi-open impeller driven by a common idler shaft. The discharge system of the above-mentioned embodiments, wherein the impeller device is configured to be embodied as a pump inlet pre-start warm-up impeller. The discharge system of the above-mentioned embodiments, wherein the impeller device is configured to increase mixing energy. The discharge system of the above-mentioned embodiments, wherein the impeller device is configured to reduce heat rise due to increased pump efficiency. The discharge system of the above-mentioned embodiments, wherein the impeller device can include an impeller. The discharge system of the above-mentioned embodiments, wherein the impeller is disposed within the impeller housing. The discharge system of the above-mentioned embodiments, wherein the heat exchanger can include a heat exchanger outlet, the heat exchanger outlet configured and arranged to output the hot melt adhesive to a filter or other component of the discharge system. The discharge system of the above-mentioned embodiments, wherein the controller can include a PID controller. The discharge system of the above-mentioned embodiments, wherein the controller can include a proportional controller. The dispensing system of any of the above embodiments may include a hot melt adhesive supply source configured to supply hot melt adhesive to the first input. The dispensing system of any of the above embodiments may include a gas supply source configured to supply gas to the second input. The dispensing system of any of the above embodiments may include a filter disposed in fluid communication between the pump and the flow meter. The dispensing system of any of the above embodiments may include a recirculation flow path configured to selectively direct solution from the dispenser to the pump.

[0095] One embodiment includes a method, the method including receiving a hot melt adhesive from a hot melt adhesive supply source into an impeller device. The method further includes receiving a gas from a gas supply source. The method further includes mixing the hot melt adhesive and the gas to form a solution. The method also includes pumping the solution from a pump to a dispenser at a volumetric flow rate, reducing a temperature of the hot melt adhesive with a heat exchanger disposed within and / or including a manifold, and dispensing the solution to form a hot melt adhesive foam.

[0096] The above-described embodiments may further include any one or more combinations of the following embodiments: The method of the above-described embodiments, wherein the heat exchanger includes a bottom heat dissipation fin and the heat exchanger includes a side heat dissipation fin; The method of the above-described embodiments, wherein the heat exchanger includes a bottom heat dissipation fin; The method of the above-described embodiments, wherein the heat exchanger includes a side heat dissipation fin; The method of the above-described embodiments, wherein the heat exchanger may include a heat exchanger inlet, the heat exchanger inlet constructed and arranged to receive hot melt adhesive from a pump or other component; The method of the above-described embodiments, wherein the heat exchanger may include at least one heat exchange tube; The method of the above-described embodiments, wherein the heat exchanger implements two embodiments of the at least one heat exchange tube; The method of the above-described embodiments, wherein the heat exchanger may include a first heat exchanger conduit extending from the heat exchanger inlet to a first end of the at least one heat exchange tube; The method of the above-described embodiments, wherein the at least one heat exchange tube of the heat exchanger may include an outer heat exchange tube wall and an inner heat exchange wall; The method of the above-described embodiments, wherein the hot melt adhesive may flow between the outer heat exchange tube wall and the inner heat exchange wall. The method of any preceding embodiment, wherein the heat exchanger inner wall is formed as a cylindrical insert. The method of any preceding embodiment, wherein the heat exchanger can include a heat exchanger outlet, the heat exchanger outlet constructed and arranged to output the hot melt adhesive to a filter or other component.

[0097] Terms such as first, second, etc. may be used herein to describe various elements, but it will be understood that these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, a first element could be referred to as a second element, and similarly, a second element could be referred to as a first element, without departing from the scope of the present disclosure. As used herein, the term "and / or" includes any and all combinations of any one or more of the associated listed items.

[0098] When an element, such as a layer, region, or substrate, is referred to as being "on" or "extending onto" another element, it can be directly on or extending directly onto the other element, or intervening elements may be present. In contrast, when an element is referred to as being "directly on" or "extending directly onto" another element, there are no intervening elements. Similarly, when an element, such as a layer, region, or substrate, is referred to as being "on" or "extending onto" another element, it can be directly on or extending directly onto the other element, or intervening elements may be present. In contrast, when an element is referred to as being "directly on" or "extending directly onto" another element, there are no intervening elements. Also, when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or intervening elements may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements.

[0099] Relative terms such as "lower" or "upper" or "top" or "lower" or "horizontal" or "vertical" may be used herein to describe the relationship of one element, layer, or region to another element, layer, or region as shown in the figures. It will be understood that these terms and those described above are intended to encompass different orientations of the device in addition to the orientation shown in the figures.

[0100] The terminology used herein is for the purpose of describing particular aspects only and is not intended to be limiting of the disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprising," "having," "including," and / or "comprising" as used herein specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0101] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Terms used herein should be interpreted to have a meaning consistent with their meaning in the context of the present specification and related art, and will be further understood not to be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0102] While various inventive aspects, concepts, and features of the present invention may be described and illustrated herein as being implemented in combination in exemplary embodiments, these various aspects, concepts, and features may be used in many alternative embodiments, either individually or in various combinations and subcombinations thereof. Unless expressly excluded herein, all such combinations and subcombinations are intended to be within the scope of the present invention. Furthermore, although various alternatives for various aspects, concepts, and features of the present invention (e.g., alternative materials, structures, configurations, methods, circuits, devices, and components, software, hardware, control logic, form, compatibility, and function alternatives, etc.) may be described herein, such descriptions are not intended to be a complete or exhaustive listing of all available alternatives, whether currently known or later developed. Furthermore, although some features, concepts, or aspects of the present invention may be described herein as being preferred arrangements or methods, such descriptions are not intended to imply that such features are required or necessary unless explicitly stated. Furthermore, example or representative values ​​and ranges may be included to aid in understanding the present disclosure. However, such values ​​and ranges should not be construed in a limiting sense, and are intended to be significant values ​​or ranges only when expressly recited as such. Moreover, while various aspects, features, and concepts may be expressly identified herein as being inventive or forming part of the invention, such identification is not intended to be exclusive; rather, there may be inventive aspects, concepts, and features that are fully described herein without being explicitly identified as such or as part of a particular invention. Instead, the scope of the invention is set forth in the accompanying claims or the claims of any related or continuing application. Descriptions of exemplary methods or processes are not limited to the inclusion of every step required in all cases, nor is the order in which steps are described construed as required or necessary unless expressly so recited.For example, although method steps are described with reference to a sequential series of reference numerals and progression of blocks in a figure, the method can be performed in any particular order if desired.

[0103] The many features and advantages of the present disclosure are apparent from the detailed specification, and it is, therefore, intended by the appended claims to cover all such features and advantages of the present disclosure that fall within the true spirit and scope of the present disclosure. Further, because numerous modifications and variations will readily occur to those skilled in the art, it is not desired to limit the disclosure to the exact construction and operation illustrated and described, but rather, resort may be had to all suitable modifications and equivalents that are within the scope of the present disclosure.

Claims

1. 1. A dispensing system for dispensing a hot melt adhesive foam onto a substrate, comprising: an impeller device configured to receive a hot melt adhesive; a pump having a first input configured to receive the hot melt adhesive and a second input configured to receive a gas, the pump configured to mix the hot melt adhesive and the gas to form a solution and pump the solution at a volumetric flow rate; a valve configured to control the amount of gas supplied to the pump through the second input; a dispenser configured to receive the solution from the pump and dispense the solution to create the hot melt adhesive foam; A discharge system comprising:

2. The discharge system of claim 1 , wherein the impeller device is configured for improved efficiency.

3. The discharge system of claim 1 , wherein the impeller device is configured to increase the output velocity of the discharge system.

4. The discharge system of claim 1 , wherein the impeller device is configured to enhance entrapment of gas from a recirculation system.

5. 10. The discharge system of claim 1, wherein the impeller arrangement is configured and / or implemented as a semi-open impeller driven by a common idler shaft.

6. The discharge system of claim 1 , wherein the impeller device is configured to be implemented as a pump inlet pre-start prime impeller.

7. The discharge system of claim 1 , wherein the impeller device is configured to increase mixing energy.

8. The discharge system of claim 1 , wherein the impeller device is configured to reduce heat rise due to increased pump efficiency.

9. The discharge system of claim 1 , wherein the impeller device comprises an impeller.

10. The dispensing system of claim 9 , wherein the impeller is disposed within an impeller housing.

11. The dispensing system of claim 1 , further comprising a flow meter configured to measure the volumetric flow rate of the solution pumped by the pump.

12. The dispensing system of claim 11 , further comprising a controller in signal communication with the valve and the flow meter.

13. The dispensing system of claim 12 , wherein the controller comprises a PID controller.

14. The dispensing system of claim 12 , wherein the controller comprises a proportional controller.

15. The dispensing system of claim 1 , further comprising a hot melt adhesive supply configured to supply the hot melt adhesive to the first input.

16. The discharge system of claim 1 , further comprising a gas supply configured to supply the gas to the second input.

17. The dispensing system of claim 1 , further comprising a filter fluidly disposed between the pump and the flow meter.

18. The dispensing system of claim 1 , further comprising a recirculation flow path configured to selectively direct the solution from the dispenser to the pump.

19. The discharge system of claim 1 , further comprising a temperature sensor disposed between the outlet and the heat exchanger.

20. The discharge system of claim 1 , further comprising a heat exchanger disposed within and / or including the manifold.

21. 21. The discharge system of claim 20, wherein the heat exchanger comprises bottom heat dissipation fins and the heat exchanger comprises side heat dissipation fins.

22. The discharge system of claim 20 , wherein the heat exchanger comprises a lower heat dissipation fin.

23. The discharge system of claim 20 , wherein the heat exchanger comprises side heat dissipation fins.

24. 21. The dispensing system of claim 20, wherein the heat exchanger comprises a heat exchanger inlet, the heat exchanger inlet constructed and arranged to receive hot melt adhesive from the pump or other component of the dispensing system.

25. 21. The dispensing system of claim 20, wherein the heat exchanger comprises a heat exchanger outlet constructed and arranged to output the hot melt adhesive to a filter or other component of the dispensing system.

26. 25. The discharge system of claim 24, wherein the heat exchanger comprises at least one heat exchange tube.

27. 27. The discharge system of claim 26, wherein the heat exchanger implements two embodiments of the at least one heat exchange tube.

28. 27. The discharge system of claim 26, wherein the heat exchanger comprises a first heat exchanger conduit extending from the heat exchanger inlet to a first end of the at least one heat exchange tube.

29. 27. The discharge system of claim 26, wherein the at least one heat exchange tube of the heat exchanger comprises an outer heat exchange tube wall and an inner heat exchange wall.

30. 30. The dispensing system of claim 29, wherein the hot melt adhesive is capable of flowing between the outer heat exchange tube wall and the inner heat exchange tube wall.

31. 30. The discharge system of claim 29, wherein the inner heat exchange wall is formed as a cylindrical insert.

32. 30. The discharge system of claim 29, further comprising a temperature sensor disposed between the outlet and the heat exchanger.

33. 20. The dispensing system of claim 19, wherein the temperature sensor is constructed and arranged to control heat buildup within the dispensing system.

34. The dispensing system of claim 1 , further comprising a dispenser valve configured to be implemented as a pneumatically controlled valve.

35. 35. The dispensing system of claim 34, wherein the dispenser valve comprises a pneumatic connection configured to receive air for operating the dispenser valve.

36. 36. The dispensing system of claim 35, wherein the dispenser valve comprises a diaphragm that moves in response to air received from the pneumatic connection.

37. 1. A method for dispensing a hot melt adhesive foam onto a substrate, comprising: receiving hot melt adhesive from a hot melt adhesive supply into an impeller device; receiving gas from a gas source; mixing the hot melt adhesive with the gas to form a solution; pumping the solution through a pump to a dispenser at a volumetric flow rate; dispensing the solution to form the hot melt adhesive foam; A method for providing the above.

38. 38. The method of claim 37, wherein the impeller device is configured for improved efficiency.

39. 38. The method of claim 37, wherein the impeller device is configured to increase the output velocity of a discharge system.

40. 38. The method of claim 37, wherein the impeller device is configured to enhance entrapment of gas from a recirculation system.

41. 38. The method of claim 37, wherein the impeller arrangement is configured and / or implemented as a semi-open impeller driven by a common idler shaft.

42. 38. The method of claim 37, wherein the impeller device is configured to be implemented as a pump inlet pre-start prime impeller.

43. 38. The method of claim 37, wherein the impeller device is configured to increase mixing energy.

44. 38. The method of claim 37, wherein the impeller device is configured to reduce heat rise due to increased pump efficiency.

45. 38. The method of claim 37, wherein the impeller device comprises an impeller.

46. 46. ​​The method of claim 45, wherein the impeller is disposed within an impeller housing.

47. 46. ​​The method of claim 45, further comprising measuring the volumetric flow rate of the solution with a flow meter.

48. 1. A dispensing system for dispensing a hot melt adhesive foam onto a substrate, comprising: a heat exchanger disposed within the manifold and / or including the manifold; a pump having a first input configured to receive a hot melt adhesive and a second input configured to receive a gas, the pump configured to mix the hot melt adhesive and the gas to form a solution and pump the solution at a volumetric flow rate; a valve configured to control the amount of gas supplied to the pump through a second input; a dispenser configured to receive the solution from the pump and dispense the solution to create the hot melt adhesive foam; A discharge system comprising:

49. 49. The discharge system of claim 48, wherein the heat exchanger comprises bottom heat dissipation fins and the heat exchanger comprises side heat dissipation fins.

50. 49. The discharge system of claim 48, wherein the heat exchanger comprises a lower heat dissipation fin.

51. 49. The discharge system of claim 48, wherein the heat exchanger comprises side heat dissipation fins.

52. 49. The dispensing system of claim 48, wherein the heat exchanger comprises a heat exchanger inlet, the heat exchanger inlet constructed and arranged to receive hot melt adhesive from the pump or other component of the dispensing system.

53. 49. The dispensing system of claim 48, wherein the heat exchanger includes a heat exchanger outlet constructed and arranged to output the hot melt adhesive to a filter or other component of the dispensing system.

54. 53. The discharge system of claim 52, wherein the heat exchanger comprises at least one heat exchange tube.

55. 55. The discharge system of claim 54, wherein the heat exchanger implements two embodiments of the at least one heat exchange tube.

56. 55. The discharge system of claim 54, wherein the heat exchanger comprises a first heat exchanger conduit extending from the heat exchanger inlet to a first end of the at least one heat exchange tube.

57. 55. The discharge system of claim 54, wherein the at least one heat exchange tube of the heat exchanger comprises an outer heat exchange tube wall and an inner heat exchange wall.

58. 58. The dispensing system of claim 57, wherein the hot melt adhesive is capable of flowing between the outer heat exchange tube wall and the inner heat exchange tube wall.

59. 58. The discharge system of claim 57, wherein the inner heat exchange wall is formed as a cylindrical insert.

60. 58. The discharge system of claim 57, further comprising a temperature sensor disposed between the outlet and the heat exchanger.

61. 61. The dispensing system of claim 60, wherein the temperature sensor is constructed and arranged to control heat buildup within the dispensing system.

62. 55. The dispensing system of claim 54, further comprising a flow meter configured to measure the volumetric flow rate of the solution pumped by the pump.

63. 55. The dispensing system of claim 54, further comprising an impeller device configured to receive a hot melt adhesive.

64. 64. The discharge system of claim 63, wherein the impeller device is configured for improved efficiency.

65. 64. The discharge system of claim 63, wherein the impeller device is configured to increase the output velocity of the discharge system.

66. 64. The discharge system of claim 63, wherein the impeller device is configured to enhance entrapment of gas from a recirculation system.

67. 64. A discharge system as claimed in claim 63, wherein said impeller arrangement is configured and / or embodied as a semi-open impeller driven by a common idler shaft.

68. 64. The discharge system of claim 63, wherein the impeller device is configured to be implemented as a pump inlet pre-start prime impeller.

69. 64. The discharge system of claim 63, wherein the impeller device is configured to increase mixing energy.

70. 64. The discharge system of claim 63, wherein the impeller device is configured to reduce heat rise due to increased pump efficiency.

71. 64. The discharge system of claim 63, wherein the impeller device comprises an impeller.

72. 72. The discharge system of claim 71, wherein the impeller is disposed within an impeller housing.

73. 58. The dispensing system of claim 57, further comprising a dispenser valve configured to be implemented as a pneumatically controlled valve.

74. 74. The dispensing system of claim 73, wherein the dispenser valve includes a pneumatic connection configured to receive air for operating the dispenser valve.

75. 75. The dispensing system of claim 74, wherein the dispenser valve comprises a diaphragm that moves in response to air received from the pneumatic connection.

76. 76. The dispensing system of claim 75, wherein movement of the diaphragm results in movement of the valve stem and subsequent movement of the plunger.

77. 74. The dispensing system of claim 73, wherein the dispenser valve comprises a spring and a valve element.

78. 49. The dispensing system of claim 48, further comprising a controller in signal communication with the valve and flow meter.

79. 79. The dispensing system of claim 78, wherein the controller comprises a PID controller.

80. 79. The dispensing system of claim 78, wherein the controller comprises a proportional controller.

81. 49. The dispensing system of claim 48, further comprising a hot melt adhesive supply configured to supply the hot melt adhesive to the first input.

82. 49. The discharge system of claim 48, further comprising a gas source configured to supply the gas to the second input.

83. 49. The discharge system of claim 48, further comprising a filter fluidly disposed between the pump and the flow meter.

84. 49. The dispensing system of claim 48, further comprising a recirculation flow path configured to selectively direct the solution from the dispenser to the pump.

85. 1. A method for dispensing a hot melt adhesive foam onto a substrate, comprising: receiving hot melt adhesive from a hot melt adhesive supply into an impeller device; receiving gas from a gas source; mixing the hot melt adhesive with the gas to form a solution; pumping the solution through a pump to a dispenser at a volumetric flow rate; reducing the temperature of the hot melt adhesive with a heat exchanger disposed within and / or including a manifold; dispensing the solution to form the hot melt adhesive foam; A method for providing the above.

86. 86. The method of claim 85, wherein the heat exchanger comprises bottom heat dissipation fins and the heat exchanger comprises side heat dissipation fins.

87. 86. The method of claim 85, wherein the heat exchanger comprises a lower heat dissipation fin.

88. 86. The method of claim 85, wherein the heat exchanger comprises side heat dissipation fins.

89. 86. The method of claim 85, wherein the heat exchanger comprises a heat exchanger inlet, the heat exchanger inlet constructed and arranged to receive hot melt adhesive from a pump or other component.

90. 86. The method of claim 85, wherein the heat exchanger comprises a heat exchanger outlet, the heat exchanger outlet constructed and arranged to output the hot melt adhesive to a filter or other component.

91. 90. The method of claim 89, wherein the heat exchanger comprises at least one heat exchange tube.

92. 92. The method of claim 91, wherein the heat exchanger implements two embodiments of the at least one heat exchange tube.

93. 92. The method of claim 91, wherein the heat exchanger comprises a first heat exchanger conduit extending from the heat exchanger inlet to a first end of the at least one heat exchange tube.

94. 92. The method of claim 91, wherein the at least one heat exchange tube of the heat exchanger comprises an outer heat exchange tube wall and an inner heat exchange wall.

95. 95. The method of claim 94, wherein the hot melt adhesive is capable of flowing between the outer heat exchange tube wall and the inner heat exchange tube wall.

96. 95. The method of claim 94, wherein the inner heat exchange wall is formed as a cylindrical insert.

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