Heat dissipation devices, heat dissipation systems and optical module heat dissipation equipment

Abstract

The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device, a heat dissipation system, and an optical module heat dissipation device. One or more a partition assembly; One or more a first heat dissipation structure; One or moreOne or more and a first heat transfer structure, the case including a receiving cavity; One or more The partition assembly is located within the storage cavity, and the one or more partition assemblies divide the storage cavity into a first sub-storage cavity. One or more a second sub-accommodating cavity, and a side of the first heat dissipation structure facing the bottom plate of the case is located in the second sub-accommodating cavity; one end of the first heat transfer structure is connected to the first heat dissipation structure; and the other end of the first heat transfer structure penetrates the case to connect to a heat exchange device. 。

Description

[Technical Field]

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device, a heat dissipation system and an optical module heat dissipation device. [Background technology]

[0002] In the prior art, when dissipating heat from an optical module, the two insertion terminals of the optical module must be inserted into a heat dissipation cage to dissipate heat, but in this installation method, the insertion terminals located at the bottom generate a large amount of heat. Summary of the Invention [Problem to be solved by the invention]

[0003] The present application provides a heat dissipation device, a heat dissipation system and an optical module heat dissipation device, in which the heat in the first heat dissipation structure can be dissipated through the first heat transfer structure, improving the heat dissipation capability of the first heat dissipation structure and further ensuring that the heat generated from the insertion terminal inserted into the second sub-accommodating cavity can be dissipated in a timely manner. [Means for solving the problem]

[0004] In order to achieve the above object, according to a first aspect, the present application provides a heat dissipation device, the heat dissipation device including a case, at least one partition assembly, at least one first heat dissipation structure, and at least one first heat transfer structure; the case includes a bottom plate, a top plate, and a side plate; the side plate is used to connect the top plate and the bottom plate; the top plate, the bottom plate, and the side plate surround an accommodating cavity having an open end; the at least one partition assembly is located within the accommodating cavity; the at least one partition assembly is used to divide the accommodating cavity into a first sub-accommodating cavity and at least one second sub-accommodating cavity; the side of the first heat dissipation structure facing the bottom plate is located within the second sub-accommodating cavity; one end of the first heat transfer structure is connected to the first heat dissipation structure, and the other end of the first heat transfer structure is used to connect to a heat exchange device.

[0005] In this embodiment, the partition assembly divides the housing cavity into a first sub-cavity and at least one second sub-cavity, and the second heat dissipation structure dissipates heat for the terminals inserted into the first sub-cavity. The heat absorbed by the first heat dissipation structure is transferred to the heat exchange device via the first heat transfer structure, allowing the heat absorbed by the first heat dissipation structure to be rapidly dissipated. This further improves the heat dissipation rate of the terminals inserted into the second sub-cavity, prevents the temperature of the terminals inserted into the second sub-cavity from becoming too high, and extends the service life of the optical module.

[0006] In one embodiment, the other end of the first heat transfer structure passes through the side plate and is connected to the heat exchange device.

[0007] In one embodiment, the first heat transfer structure includes a flattened first heat conduction pipe, one end of which is connected to the first heat dissipation structure, and the other end of which is used to connect to the heat exchange device. In one embodiment, the other end of the first heat conduction pipe penetrates the side plate to connect to the heat exchange device.

[0008] In one embodiment, the first heat transfer structure includes a heat transfer substrate and a first heat transfer pipe, the first heat transfer pipe is flat, the heat transfer substrate is connected to the first heat dissipation structure, one end of the first heat transfer pipe is fixedly connected to the heat transfer substrate, and the other end of the first heat transfer pipe is used to connect to a heat exchange device.

[0009] In one embodiment, the first heat transfer pipe includes a first pipe body and a second pipe body that are connected to each other, the first pipe body and the heat transfer substrate are installed in parallel, the first pipe body and the heat transfer substrate are fixedly connected, the second pipe body and the first pipe body are installed at an angle, and the second pipe body is used to connect to a heat exchange device.

[0010] In one embodiment, the first heat transfer pipe includes a first tube, a flexible connecting tube, and a second tube, the flexible connecting tube is used to connect the first tube and the second tube, the first tube is used to fix and connect to the heat transfer substrate, and the second tube is used to connect to the heat exchange device.

[0011] In one embodiment, each of the partition assemblies is used to mount one of the first heat dissipation structures.

[0012] In one embodiment, the heat dissipation device includes a second heat dissipation structure connected to a side of the top plate facing away from the bottom plate.

[0013] In one embodiment, the heat dissipation device includes a second heat transfer structure connected to the second heat dissipation structure.

[0014] In one embodiment, the second heat transfer structure includes a second heat conduction pipe, one end of the second heat conduction pipe is connected to the second heat dissipation structure, and the other end of the second heat conduction pipe is used to connect to the heat exchange device.

[0015] In one embodiment, the second heat transfer tube is flattened.

[0016] In one embodiment, the first heat transfer structure includes a first supply pipe and a first outlet pipe, one end of the first supply pipe passing through the side panel and communicating with the first heat dissipation structure, the other end of the first supply pipe being used to communicate with the heat exchange device, one end of the first outlet pipe passing through the case and communicating with the first heat dissipation structure, the other end of the first outlet pipe being used to communicate with the heat exchange device, the second heat transfer structure includes a second supply pipe and a second outlet pipe, one end of the second supply pipe being connected to the second heat dissipation structure, the other end of the second supply pipe being used to communicate with the heat exchange device, one end of the second outlet pipe being connected to the second heat dissipation structure, and the other end of the second supply pipe being connected to the first heat dissipation structure.

[0017] In one embodiment, the first heat transfer structure includes a first supply pipe and a first drain pipe, and the second heat transfer structure includes a second supply pipe and a second drain pipe; One end of the second liquid supply pipe is connected to the second heat dissipation structure, and the other end of the second liquid supply pipe is used to connect to the heat exchange device, one end of the second liquid outlet pipe is connected to the second heat dissipation structure, the other end of the second liquid outlet pipe is connected to one end of the first liquid supply pipe, the other end of the first liquid supply pipe is connected to the first heat dissipation structure, one end of the first liquid outlet pipe passes through the case and connects to the first heat dissipation structure, and the other end of the first liquid outlet pipe is used to connect to the heat exchange device.

[0018] In one embodiment, the first heat transfer structure includes a first supply pipe and a first outlet pipe, and the second heat transfer structure includes a second supply pipe and a second outlet pipe, one end of the first supply pipe passes through the side panel and communicates with the first heat dissipation structure, the other end of the first outlet pipe passes through the case and communicates with the first heat dissipation structure, the other end of the first outlet pipe communicates with the second heat dissipation structure, one end of the second supply pipe communicates with the second heat dissipation structure, and the other end of the second supply pipe is used to communicate with the heat exchange device, one end of the second outlet pipe communicates with the second heat dissipation structure, and the other end of the second outlet pipe communicates with the heat exchange device.

[0019] In one embodiment, the case is plural, and the second heat dissipation structure is fixedly connected to the top plate included in the plural cases.

[0020] In one embodiment, the second heat dissipation structure can move relative to the top plate toward or away from the bottom plate, and the first heat dissipation structure can move relative to the partition assembly toward or away from the bottom plate.

[0021] According to a second aspect, the present application further provides a heat dissipation system, the heat dissipation system including a heat exchanger and a heat dissipation device, the plurality of heat dissipation devices are arranged in sequence at intervals, and the first and second heat transfer structures included in each heat dissipation device are both connected to the heat exchanger. In the heat dissipation system according to the present application, when the insertion terminals of the optical module are inserted into each heat dissipation device, the second and first heat dissipation structures in each heat dissipation device can both be moved, thereby ensuring that the heat dissipation system can be applied to optical modules with insertion terminals of different sizes, and further improving the applicability of the heat dissipation system.

[0022] According to a third aspect, the present application further provides an optical module heat dissipation device, the optical module heat dissipation device including the above-mentioned heat dissipation device and at least one optical module, the optical module including a body and a terminal connected to the body, the terminal being inserted into the first and second sub-accommodating cavities included in the heat dissipation device, In this manner, heat generated from the terminal of the optical module can be quickly dissipated, thereby improving the service life of the optical module. [Brief explanation of the drawings]

[0023] [Figure 1] 1 is a heat dissipation device according to an embodiment of the present application. [Figure 2] FIG. 2 is an exploded view of FIG. 1. [Figure 3] FIG. 2 is another exploded view of FIG. 1. [Figure 4] 1 is a structural schematic diagram of a partition assembly in a heat dissipation device according to an embodiment of the present application; [Figure 5] FIG. 10 is another structural schematic diagram of a partition assembly in a heat dissipation device according to an embodiment of the present application. [Figure 6] 1 is a schematic diagram of the local structure of a case in a heat dissipation device according to an embodiment of the present application; [Figure 7] 1 is a structural schematic diagram of a first heat dissipation structure in a heat dissipation device according to an embodiment of the present application; [Figure 8]1 is a structural schematic diagram of the connection between a first heat-dissipating structure and a first heat-transfer structure in a heat-dissipating device according to an embodiment of the present application; [Figure 9] 10 is another structural schematic diagram of the connection between the first heat-dissipating structure and the first heat-transfer structure in the heat-dissipating device according to an embodiment of the present application; FIG. [Figure 10] 10 is another structural schematic diagram of the connection between the first heat-dissipating structure and the first heat-transfer structure in the heat-dissipating device according to an embodiment of the present application; FIG. [Figure 11a] 1 is a structural schematic diagram of a first heat conduction pipe according to an embodiment of the present application; [Figure 11b] FIG. 10 is another structural schematic diagram of the first heat conduction pipe according to an embodiment of the present application; [Figure 12] FIG. 2 is another structural schematic diagram of a heat dissipation device according to an embodiment of the present application; [Figure 13] FIG. 2 is another structural schematic diagram of a heat dissipation device according to an embodiment of the present application; [Figure 14] FIG. 2 is another structural schematic diagram of a heat dissipation device according to an embodiment of the present application; [Figure 15] FIG. 2 is another structural schematic diagram of a heat dissipation device according to an embodiment of the present application; DETAILED DESCRIPTION OF THE INVENTION

[0024] In order to make the purpose, technical solution and advantages of the present application clearer, the following describes the present application in more detail in conjunction with the drawings.

[0025] In the prior art, when heat is dissipated from an optical module, the two terminals of the optical module must be inserted into a heat dissipation cage to dissipate heat. In this installation method, the lower terminals generate a large amount of heat. However, the heat dissipation cage cannot dissipate the heat generated by the lower terminals in a timely manner, which causes the terminals to become too hot, affecting the performance and service life of the optical module.

[0026] Therefore, there is an urgent need for a new heat dissipation device to solve the above technical problems.

[0027] The terminology used in the following examples is for the purpose of describing particular examples only and is not intended to limit the present application. As used in the specification and appended claims of this application, the singular terms "a," "one," "one kind," "the," "the," "the," and "this" are intended to include terms such as "one or more," unless the context clearly dictates otherwise.

[0028] References herein to "one embodiment" or "some embodiments," etc., mean that one or more embodiments of the present application include the particular feature, structure, or characteristic described in connection with the embodiment. Thus, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in other embodiments," etc. appearing in various places throughout the specification are not necessarily all referring to the same embodiment and, unless expressly emphasized otherwise, mean "one or more, but not all embodiments." The terms "comprise," "include," "includes," "having," and variations thereof mean "including, but not limited to," unless expressly emphasized otherwise.

[0029] FIG. 1 illustrates a heat dissipation device according to an embodiment of the present application, and FIGS. 2 and 3 are exploded views of FIG. 1. Referring to FIGS. 1 to 3, the heat dissipation device includes a case 10, at least one partition assembly 30, at least one first heat dissipation structure 40, and at least one first heat transfer structure 70. In one embodiment, the partition assembly 30 and the first heat transfer structure 70 are installed in a one-to-one correspondence, and the first heat transfer structure 70 and the first heat dissipation structure 40 are installed in a one-to-one correspondence. The case 10 includes a top plate 12, a bottom plate 11, and a side plate 13. The side plate 13 connects the top plate 12 and the bottom plate 11, and the side plate 13, the top plate 12, and the bottom plate 11 surround a receiving cavity with one end open. Here, the top plate 12 and the bottom plate 11 may be rectangular, circular, or polygonal. Generally speaking, for ease of arrangement, both the top plate 12 and the bottom plate 11 are rectangular. The side plates 13 may include two first side plates 130 and one second side plate 131, where the two first side plates 130 are spaced apart along the first direction X, and the second side plate 131 connects the two first side plates 130. Specifically, the second side plate 131 and the first side plate 130 may be connected in a locking manner, which facilitates assembly of the case 10.

[0030] 1 to 3, at least one partition assembly 30 is located within the receiving cavity, and the at least one partition assembly 30 may be connected to two first side plates 130. The at least one partition assembly 30 divides the receiving cavity into a first sub-cavity 14 and at least one second sub-cavity 15. The side of the first heat dissipation structure 40 facing the bottom plate 11 is located within the second sub-cavity 15. In this embodiment, the first sub-cavity 14 and the second sub-cavity 15 are used to insert terminals of an optical module, and the terminals located within the second sub-cavity 15 exchange heat with the first heat dissipation structure 40 to achieve heat dissipation for the optical module. Here, the heat absorbed by the first heat dissipation structure 40 is continuously transferred to the heat exchange device via the first heat transfer structure 70, ensuring that the first heat dissipation structure 40 is at a relatively low temperature, thereby improving the heat dissipation capability of the first heat dissipation structure 40 and further ensuring that the heat generated from the insertion terminal inserted into the second sub-accommodating cavity 15 can be released in a timely manner.

[0031] Here, the heat exchange device may be a cold plate or a liquid-cooled structure.

[0032] In one embodiment, the heat dissipation device may include one, two, or three partition assemblies 30. When there is one partition assembly 30, the partition assembly 30 is located between the bottom plate 11 and the top plate 12, and the one partition assembly 30 divides the storage cavity into one first sub-storage cavity 14 and one second sub-storage cavity 15. When there are two partition assemblies 30, two partition assemblies 30 are installed between the top plate 12 and the bottom plate 11 at a distance from each other, and the two partition assemblies 30 divide the storage cavity into one first sub-storage cavity 14 and two second sub-storage cavities 15. When there are three partition assemblies 30, three partition assemblies 30 are installed between the top plate 12 and the bottom plate 11 at a distance from each other, and the three partition assemblies 30 divide the storage cavity into one first sub-storage cavity 14 and three second sub-storage cavities 15.

[0033] Continuing to refer to Figures 1 to 3, in some embodiments, the heat dissipation device includes a second heat dissipation structure 20, which is located on the side of the top plate 12 away from the bottom plate 11, and the top plate 12 is connected to the second heat dissipation structure 20, and the insertion terminals located in the first sub-accommodating cavity 14 and the second heat dissipation structure 20 exchange heat to ensure that the heat generated from the insertion terminals located in the first sub-accommodating cavity 14 can be dissipated in a timely manner.

[0034] For ease of understanding, in this application, the first direction X is the arrangement direction of the two first side plates 130, the second direction Y is the direction in which the open ends of the first and second sub-cavities 14 and 15 extend toward the bottom, and the third direction Z is the arrangement direction of the bottom plate 11 and the top plate 12. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other. It should be noted that the perpendicular relationship defined in the embodiments of this application is not limited to an absolute 90-degree intersection angle. It allows for a relationship that is not an absolute perpendicular intersection due to factors such as assembly tolerances, design tolerances, and the influence of structural flatness, and allows for a small angular range of error. For example, an angle of 80 to 100 degrees may be understood as a perpendicular relationship within the assembly error range.

[0035] The following description will be given taking as an example a case in which one partition assembly is installed in a case included in a heat dissipation device.

[0036] 4 is a structural schematic diagram of a partition assembly in a heat dissipation device according to an embodiment of the present application, and FIG. 5 is another structural schematic diagram of a partition assembly in a heat dissipation device according to an embodiment of the present application. Referring to FIGS. 3 to 5, each partition assembly 30 is used to mount one first heat dissipation structure 40. The partition assembly 30 includes a partition plate 31 and two partition side plates 32. The two partition side plates 32 are installed opposite each other along the first direction X, and the two partition side plates 32 are connected to the sides of the partition plate 31 facing the bottom plate 11. Here, the partition side panel 32 includes a connecting plate 320 and a mounting plate 321 connected to the connecting plate 320, the mounting plate 321 being located between the two connecting plates 320 and spaced apart along the first direction X, the first heat dissipation structure 40 being mounted on the partition assembly 30 via the gap between the two connecting plates 320 along the first direction X, and the two mounting plates 321 being used to mount the first heat dissipation structure 40. When the first heat dissipation structure 40 is installed within the partition assembly 30 via the partition side panel 32, a portion of the first heat dissipation structure 40 can enter the second sub-accommodating cavity 15 through the gap between the two mounting plates 321, ensuring that the insertion terminals of the optical module can contact the first heat dissipation structure 40 when inserted into the second sub-accommodating cavity 15.

[0037] In one embodiment, the partition plate 31 includes at least one first opening 310, which is used to install one first elastic member 311, and which extends to one side of the mounting plate 321. When the first heat dissipation structure 40 is installed in the partition assembly 30, the first elastic member 311 can abut against the first heat dissipation structure, allowing the first heat dissipation structure 40 to move along the third direction Z, and the second sub-accommodating cavities 15 to accommodate insertion terminals of different sizes. In this case, it may be understood that the first heat dissipation structure 40 is installed in the partition assembly and can move toward or away from the bottom plate relative to the partition assembly. In some embodiments, the partition plate 31 includes one first opening 310, and one first elastic member 311 is disposed in the first opening 310, or multiple first elastic members 311 are disposed in the first opening 310. In some embodiments, the partition plate 31 includes multiple first openings 310, and one first elastic member 311 is disposed in each first opening 310, and the multiple first openings 310 are distributed in an array on the partition plate 31.

[0038] In some embodiments, the partition plate 31 includes a first plate 312, a second plate 313, and a third plate 314 connected in sequence, with the first opening 310 and the first elastic member 311 both located on the first plate 312. The first plate 312 and the third plate 314 may be arranged parallel to each other, with the connecting plate 320 located between the second plate 313 and the second side plate. Here, the length of the connecting plate 320 being shorter than the length of the partition plate 31 along the second direction Y may be understood as the length of the connecting plate 320 being shorter than the length of the first plate 312 along the second direction Y. Thus, after the first heat dissipation structure 40 is mounted on the partition assembly 30, the first heat dissipation structure 40 can be connected to the heat transfer structure through the side of the partition assembly 30. In addition, the third plate 314 and the mounting plate 321 are on the same plane and can both be used to mount the first heat dissipation structure 40, and the second plate 313 can limit the movement of the first heat dissipation structure 40 along the second direction Y.

[0039] It should be noted that a plurality of openings may be provided on the second plate 313, thereby allowing gas to easily enter the case through the openings and improving the heat dissipation capability of the first heat dissipation structure. At least one connecting plate 320 includes a stopper opening 322 extending along the third direction Z. The stopper opening 322 is connected to the first heat dissipation structure 40 to ensure the stability of the first heat dissipation structure 40 when it is raised and lowered along the third direction. The number of stopper openings 322 may be adjusted according to actual circumstances.

[0040] FIG. 6 is a schematic diagram of the local structure of a case in a heat dissipation device according to an embodiment of the present application. Referring to FIG. 6, in the above embodiment, at least one set of first elastic clamping members 50 and at least one set of second elastic clamping members 60 are further installed in the case 10. Here, the set of first elastic clamping members 50 includes two first elastic clamping members 50, and the set of second elastic clamping members 60 includes two second elastic clamping members 60. At least one set of first elastic clamping members 50 is installed in the first sub-accommodating cavity, and at least one set of second elastic clamping members 60 is installed in the second sub-accommodating cavity. Specifically, at least one first elastic clamping member 50 is installed on each first side plate 130, and the installation of the first elastic clamping members 50 can limit the movement of the insertion terminals of the optical module in the first sub-accommodating cavity along the first direction X. Similarly, at least one second elastic clamping member 60 is further installed on each first side plate 130, and the installation of the second elastic clamping member 60 can restrict the movement of the insertion terminal of the optical module in the second sub-receiving cavity along the first direction X. Here, the first elastic clamping member 50, the second elastic clamping member 60 and the first elastic member may all be an elastic piece or other elastic structural member.

[0041] The heat dissipation device includes an engagement assembly 90, which can fix the top plate 12 and the second heat dissipation structure 20. When the second heat dissipation structure 20 is specifically connected to the top plate 12, an opening for accommodating the second heat dissipation structure 20 may be provided on the top plate 12, a portion of the second heat dissipation structure 20 may be provided in the opening of the top plate 12, and the engagement assembly may engage the second heat dissipation structure 20 with the top plate 12. A gap may exist between the engagement assembly and the second heat dissipation structure 20, allowing the second heat dissipation structure 20 to move toward or away from the bottom plate relative to the top plate 12. Here, the engagement assembly 90 may specifically be a pressing structure, and the pressing may be a spring, an elastic piece, a fastener, or the like.

[0042] In the above embodiments, the second heat dissipation structure 20 includes a second heat dissipation motherboard 21, which is connected to the top plate 12 and used to dissipate heat for the insertion terminals inserted into the first sub-accommodating cavity. In some other embodiments, the second heat dissipation structure 20 further includes a plurality of second heat dissipation fin groups 22, which are spaced apart along the second direction Y and disposed on the side of the second heat dissipation motherboard 21 away from the top plate 12.

[0043] 7 is a structural schematic diagram of a first heat dissipation structure in a heat dissipation device according to an embodiment of the present application. Referring to FIG. 7, the first heat dissipation structure 40 includes a first heat dissipation motherboard 41, a contact plate 42, and a stopper block. The contact plate 42 is installed on the side of the first heat dissipation motherboard 41 facing the bottom plate. The contact plate 42 is used to abut against the terminals inserted into the second sub-accommodating cavity and dissipate heat from the terminals. The stopper block is connected to the side of the first heat dissipation motherboard 41 and is fitted with the stopper opening to ensure that the first heat dissipation structure can move along the third direction when abutting against the terminals. The first heat dissipation structure 40 includes a first heat dissipation fin group 43, and the multiple first heat dissipation fin groups 43 are installed on the side facing the top plate of the first heat dissipation motherboard 41, and are used to improve the heat dissipation capacity of the first heat dissipation motherboard 41.

[0044] FIG. 8 is a structural schematic diagram of the connection between the first heat dissipation structure and the first heat transfer structure in a heat dissipation device according to an embodiment of the present application. Referring to FIG. 8, the first heat transfer structure 70 includes a first heat conduction pipe 72, which is flattened to increase the contact area between the first heat conduction pipe 72 and the first heat dissipation structure 40. One end of the first heat conduction pipe 72 is connected to the first heat dissipation structure 40, and the other end of the first heat conduction pipe 72 passes through the case to connect to the heat exchange device. In this case, the heat exchange device may be a cold plate, and the cold plate and the first heat conduction pipe 72 exchange heat, and the first heat conduction pipe 72 and the first heat dissipation structure 40 exchange heat. The first heat conduction pipe 72 can also pass through the side panel to connect to the heat exchange device.

[0045] 9 is another structural schematic diagram of the connection between the first heat dissipation structure and the first heat transfer structure in a heat dissipation device according to an embodiment of the present application. Referring to FIG. 9, the first heat transfer structure 70 includes a heat transfer substrate 71 and a first heat conduction pipe 72. The heat transfer substrate 71 is used to connect with the first heat dissipation structure 40, and the first heat conduction pipe 72 has a flat shape to improve the contact area between the first heat conduction pipe 72 and the first heat dissipation structure 40. Specifically, the heat transfer substrate 71 is installed on the outside of the side plate 13 and fixed to the side plate 13. In this case, the side plate 13 is the first side plate. The heat transfer substrate 71 penetrates the first side plate and is connected to the first heat dissipation structure 40. One end of the first heat conduction pipe 72 is fixedly connected to the side of the heat transfer substrate 71 facing or facing away from the side plate 13, and the other end of the first heat conduction pipe 72 is used to connect to a heat exchange device. This ensures that the heat absorbed by the first heat dissipation structure 40 is transferred to the external heat exchange device via the first heat conduction pipe 72.

[0046] 10 is another structural schematic diagram of the connection between the first heat dissipation structure and the first heat transfer structure in a heat dissipation device according to an embodiment of the present application. Referring to FIG. 10, in one embodiment, the first heat dissipation structure 40 may further include a liquid-cooled heat sink 44, which is installed between the first heat dissipation motherboard 41 and the first heat dissipation fin group 43. One end of the first heat conduction pipe 72 is fixed to the heat transfer substrate 71, and the first heat conduction pipe 72 can be bonded to the liquid-cooled heat sink 44, thereby improving the heat dissipation capacity of the first heat dissipation structure 40.

[0047] 11a is a structural schematic diagram of a first heat conduction pipe according to an embodiment of the present application. Continuing to refer to FIGS. 9, 10, and 11a, the first heat conduction pipe 72 includes a first pipe 720 and a second pipe 721 connected to each other, where the first pipe 720 and the heat transfer substrate 71 are arranged parallel to each other, the second pipe 721 and the first pipe 720 are arranged at an angle to each other, and at least a portion of the second pipe 721 and the bottom plate are arranged parallel to each other. Specifically, the second pipe 721 and the first pipe 720 may be arranged perpendicular to each other. In this installation method, when there are multiple cases, the installation method of the first pipe body 720 can reduce the distance between two adjacent cases, and the installation method of the second pipe body 721 can reduce the convenience of connecting the second pipe body 721 to the heat exchange device, and can also improve the flexibility of floating of the second pipe body 721 along the third direction Z.

[0048] 11b is a schematic diagram of another structure of a first heat transfer pipe according to an embodiment of the present application. The first heat transfer pipe includes a first pipe 720, a flexible connecting pipe 722, and a second pipe 721. The flexible connecting pipe 722 connects the first pipe 720 and the second pipe 721, and the first pipe 720 is connected to a heat transfer substrate. Specifically, when the heat transfer substrate is installed on the outer side of the side plate, the first pipe 720 is fixedly connected to the side of the heat transfer substrate facing or facing away from the side plate, and the second pipe 721 is connected to a heat exchange device. In this installation mode, when the first pipe 720 is connected to the heat transfer substrate, the first pipe 720 and the heat transfer substrate are installed in parallel, which can increase heat transfer efficiency. The bonding area between the second pipe 721 and the heat exchange device is large. This increases the heat transfer efficiency of the first heat transfer pipe.

[0049] 12 is a schematic diagram of another structure of a heat dissipation device according to an embodiment of the present application. Referring to FIG. 12, the heat dissipation device includes a second heat transfer structure 80. The second heat transfer structure 80 includes a second heat conduction pipe 81, one end of which is connected to the second heat dissipation structure 20, and the other end of which is connected to the heat exchange device. Here, the second heat conduction pipe 81 is flattened to improve the heat dissipation ability of the second heat transfer structure 80 for the second heat dissipation structure 20. The first heat transfer structure 70 includes a first heat conduction pipe 72, one end of which is connected to the first heat dissipation structure 40 and the other end of which is connected to the heat exchange device through the second side panel 131, and the other end of the first heat conduction pipe 72 and the other end of the second heat conduction pipe 81 are arranged on opposite ends of the heat exchange device along the third direction, or the other end of the first heat conduction pipe 72 and the other end of the second heat conduction pipe 81 are arranged on the same side of the heat exchange device.

[0050] 13 is a schematic diagram of another structure of a heat dissipation device according to an embodiment of the present application. Referring to FIG. 13, a first heat transfer structure 70 includes a first liquid supply pipe 73 and a first liquid outlet pipe 74. One end of the first liquid supply pipe 73 passes through the case and communicates with the first heat dissipation structure, the other end of the first liquid supply pipe 73 is used to communicate with the heat exchange device, and one end of the first liquid outlet pipe 74 passes through the case and communicates with the first heat dissipation structure. Specifically, one end of the first liquid supply pipe 73 can pass through a side plate (the side plate is the first side plate 130) and communicate with the first heat dissipation structure, the side plate (the side plate is the first side plate 130) of the first liquid outlet pipe 74 communicates with the first heat dissipation structure, and the other end of the first liquid outlet pipe 74 is used to communicate with the heat exchange device. The second heat-transfer structure 80 includes a second liquid supply pipe 82 and a second liquid outlet pipe 83, one end of the second liquid supply pipe 82 communicates with the second heat-dissipating structure 20, the other end of the second liquid supply pipe 82 is used to communicate with the heat exchange device, one end of the second liquid outlet pipe 83 communicates with the second heat-dissipating structure 20, and the other end of the second liquid supply pipe 82 communicates with the first heat-dissipating structure 40. In this manner, the second heat-dissipating structure 20 and the first heat-dissipating structure are connected to the heat exchange device via the second heat-transfer structure 80 and the first heat-transfer structure 70, respectively, and the second heat-transfer structure 80 and the first heat-transfer structure 70 both allow the refrigerant to flow into the second heat-dissipating structure 20 and the first heat-dissipating structure through the pipes, thereby improving the heat-dissipating efficiency of the second heat-dissipating structure 20 and the first heat-dissipating structure.

[0051] FIG. 14 is another structural schematic diagram of a heat dissipation device according to an embodiment of the present application. Referring to FIG. 14, the first heat transfer structure 70 includes a first liquid supply pipe 73 and a first liquid outlet pipe 74, and the second heat transfer structure 80 includes a second liquid supply pipe 82 and a second liquid outlet pipe 83. One end of the second liquid supply pipe 82 is connected to the second heat dissipation structure 20, and the other end of the second liquid supply pipe 82 is used to connect to the heat exchange device, one end of the second liquid outlet pipe 83 is connected to the second heat dissipation structure 20, the other end of the second liquid outlet pipe 83 is connected to one end of the first liquid supply pipe 73, the other end of the first liquid supply pipe 73 is connected to the first heat dissipation structure, one end of the first liquid outlet pipe 74 is connected to the first heat dissipation structure, and the other end of the first liquid outlet pipe 74 is used to connect to the heat exchange device. In this configuration, the first and second heat dissipation structures are connected in series via the second outlet pipe 83 and the first supply pipe 73, and the refrigerant flows back to the heat exchanger through the second supply pipe 82, the second heat dissipation structure 20, the second outlet pipe 83, the first supply pipe 73, the first heat dissipation structure, and the first outlet pipe 74, completing the heat dissipation for the second and first heat dissipation structures. Specifically, the first outlet pipe 74 and the first supply pipe 73 can both pass through the side panel and communicate with the first heat dissipation structure.

[0052] 15 is a schematic diagram of another structure of a heat dissipation device according to an embodiment of the present application. Referring to FIG. 15, a first heat transfer structure 70 includes a first supply pipe 73 and a first outlet pipe 74, and a second heat transfer structure 80 includes a second supply pipe 82 and a second outlet pipe 83. One end of the first supply pipe 73 passes through the side panel and communicates with the first heat dissipation structure, the other end of the first supply pipe 73 communicates with the second heat dissipation structure 20, one end of the first outlet pipe 74 communicates with the first heat dissipation structure, and the other end of the first outlet pipe 74 communicates with the second heat dissipation structure 20. One end of the second supply pipe 82 communicates with the second heat dissipation structure 20, and the other end of the second supply pipe 82 is used to communicate with the heat exchange device. One end of the second outlet pipe 83 communicates with the second heat dissipation structure 20, and the other end of the second outlet pipe 83 communicates with the heat exchange device. In this manner, the refrigerant enters the second heat dissipation structure 20 through the second supply pipe 82. The first supply pipe 73 communicates with the second heat dissipation structure 20 and transports the refrigerant to the first heat dissipation structure. The first outlet pipe 74 returns the refrigerant that has absorbed heat in the first heat dissipation structure to the second heat dissipation structure 20, and then returns to the heat exchange device through the second outlet pipe 83.

[0053] In some embodiments, the second heat dissipation structure may be large in size, and each second heat dissipation structure may be connected to the top plate of multiple cases, and the multiple cases may be arranged at intervals, and the first heat dissipation structure in each case is connected to the second heat dissipation structure 20 via one first supply pipe 73 and one first outlet pipe 74.

[0054] In one embodiment, the first inlet pipe 73, the first outlet pipe 74, the second inlet pipe 82 and the second outlet pipe 83 may all be hoses.

[0055] The present application further provides a heat dissipation system, including a heat exchanger and a plurality of heat dissipation devices, the plurality of heat dissipation devices being spaced apart in sequence, with the first and second heat transfer structures of each heat dissipation device being connected to the heat exchanger. In this installation method, when the terminals of an optical module are inserted into the heat dissipation devices, the second and first heat dissipation structures of each heat dissipation device can be moved, ensuring that the heat dissipation system can be applied to optical modules with terminals of different sizes, further improving the applicability of the heat dissipation system.

[0056] The present application further provides a heat dissipation system, which includes a heat dissipation device and at least one optical module, the optical module including a body and a terminal connected to the body, the terminal being inserted into a first sub-accommodating cavity and a second sub-accommodating cavity included in the heat dissipation device, in such a manner that heat generated from the terminal of the optical module can be quickly dissipated, thereby improving the service life of the optical module.

[0057] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present application without departing from the spirit and scope of the embodiments of the present invention. Thus, if these modifications and variations of the embodiments of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include these modifications and variations. [Explanation of symbols]

[0058] 10 - case, 11 - bottom plate, 12 - top plate, 13 - side plate, 130 - first side plate, 131 - second side plate, 14 - first sub-accommodating cavity, 15 - second sub-accommodating cavity, 20 - second heat dissipation structure, 21 - second heat dissipation motherboard, 22 - second heat dissipation fin group, 30 - partition assembly, 31 - partition plate, 310 - first opening, 311 - first elastic member, 312 - first plate body, 313 - second plate body, 314 - third plate body, 32 - partition side plate, 320 - connecting plate, 321 - mounting plate, 322 - stopper opening , 40 - first heat dissipation structure, 41 - first heat dissipation motherboard, 42 - contact plate, 43 - first heat dissipation fin group, 44 - liquid-cooled radiator, 50 - first elastic clamping member, 60 - second elastic clamping member, 70 - first heat transfer structure, 71 - heat transfer substrate, 72 - first heat conduction pipe, 720 - first pipe body, 721 - second pipe body, 722 - flexible connecting pipe body, 73 - first liquid supply pipe, 74 - first liquid outlet pipe, 80 - second heat transfer structure, 81 - second heat conduction pipe, 82 - second liquid supply pipe, 83 - second liquid outlet pipe, 90 - engagement assembly.

Claims

1. A heat dissipation device, comprising: a case; at least one partition assembly; at least one first heat dissipation structure; and at least one first heat transfer structure; the case includes a bottom plate, a top plate, and a side plate, the side plate being used to connect the top plate and the bottom plate, the top plate, the bottom plate, and the side plate surrounding a storage cavity having an open end, the at least one partition assembly being located within the storage cavity, the at least one partition assembly being used to divide the storage cavity into a first sub-storage cavity and at least one second sub-storage cavity; a side of the first heat dissipation structure facing the bottom plate is located within the second sub-accommodation cavity; A heat dissipation device, wherein one end of the first heat transfer structure is connected to the first heat dissipation structure, and the other end of the first heat transfer structure passes through the case to connect to a heat exchange device.

2. The heat dissipation device according to claim 1 , wherein the other end of the first heat transfer structure passes through the side plate and is connected to the heat exchange device.

3. 3. The heat dissipation device according to claim 1, wherein the first heat transfer structure includes a first heat conduction pipe having a flat shape, one end of the first heat conduction pipe being connected to the first heat dissipation structure, and the other end of the first heat conduction pipe being used to connect to a heat exchange device.

4. 2. The heat dissipation device of claim 1, wherein the first heat transfer structure includes a heat transfer substrate and a first heat conduction pipe, the first heat conduction pipe is flat, the heat transfer substrate is connected to the first heat dissipation structure, one end of the first heat conduction pipe is fixedly connected to one side of the heat transfer substrate, and the other end of the first heat conduction pipe is used to connect to a heat exchange device.

5. 5. The heat dissipation device of claim 4, wherein the first heat conduction pipe includes a first pipe body and a second pipe body that are connected to each other, the first pipe body and the heat transfer substrate are installed in parallel and fixedly connected to each other, the second pipe body and the first pipe body are installed at an angle, and the second pipe body is used to connect to the heat exchange device.

6. 5. The heat dissipation device of claim 4, wherein the first heat conduction pipe includes a first pipe, a flexible connecting pipe, and a second pipe, the flexible connecting pipe being used to connect the first pipe and the second pipe, the first pipe being used to fix and connect to the heat transfer substrate, and the second pipe being used to connect to the heat exchange device.

7. The heat dissipation device according to claim 1 , wherein each of the partition assemblies is used to mount one of the first heat dissipation structures.

8. The heat dissipation device of claim 1 , further comprising a second heat dissipation structure connected to the top plate on a side thereof facing away from the bottom plate.

9. The heat dissipation device of claim 1 , wherein the heat dissipation device includes a second heat transfer structure connected to the second heat dissipation structure.

10. the first heat transfer structure includes a first liquid supply pipe and a first liquid outlet pipe, one end of the first liquid supply pipe passes through a side plate and communicates with the first heat dissipation structure, and the other end of the first liquid supply pipe is used to communicate with a heat exchange device, one end of the first liquid outlet pipe passes through the case and communicates with the first heat dissipation structure, and the other end of the first liquid outlet pipe is used to communicate with the heat exchange device; 10. The heat dissipation device of claim 9, wherein the second heat transfer structure includes a second supply pipe and a second outlet pipe, one end of the second supply pipe communicates with the second heat dissipation structure, and the other end of the second supply pipe is used to communicate with a heat exchange device, and one end of the second outlet pipe communicates with the second heat dissipation structure, and the other end of the second supply pipe communicates with the first heat dissipation structure.

11. the first heat transfer structure includes a first liquid supply pipe and a first liquid outlet pipe, and the second heat transfer structure includes a second liquid supply pipe and a second liquid outlet pipe; 10. The heat dissipation device according to claim 9, wherein one end of the second liquid supply pipe is connected to the second heat dissipation structure and the other end of the second liquid supply pipe is used to connect to a heat exchange device, one end of the second liquid outlet pipe is connected to the second heat dissipation structure and the other end of the second liquid outlet pipe is connected to one end of the first liquid supply pipe and the other end of the first liquid supply pipe is connected to the first heat dissipation structure, one end of the first liquid outlet pipe passes through the case and connects to the first heat dissipation structure and the other end of the first liquid outlet pipe is used to connect to a heat exchange device.

12. the first heat transfer structure includes a first liquid supply pipe and a first liquid outlet pipe, and the second heat transfer structure includes a second liquid supply pipe and a second liquid outlet pipe; one end of the first liquid supply pipe passes through the case and communicates with the first heat dissipation structure, the other end of the first liquid supply pipe passes through the case and communicates with the second heat dissipation structure, one end of the first liquid outlet pipe passes through the case and communicates with the first heat dissipation structure, and the other end of the first liquid outlet pipe passes through the case and communicates with the second heat dissipation structure, 10. The heat dissipation device according to claim 9, wherein one end of the second liquid supply pipe is connected to the second heat dissipation structure, and the other end of the second liquid supply pipe is used to connect to a heat exchange device, and one end of the second liquid outlet pipe is connected to the second heat dissipation structure, and the other end of the second liquid outlet pipe is connected to a heat exchange device.

13. 13. The heat dissipation device of claim 9, wherein the first heat dissipation structure can move relative to the partition assembly toward or away from the bottom plate, and the second heat dissipation structure can move relative to the top plate toward or away from the bottom plate.

14. The heat dissipation device according to claim 9 , wherein the case is plural, and the second heat dissipation structure is connected to top plates included in the plural cases.

15. 14. A heat dissipation system comprising: a heat exchange device; and a plurality of heat dissipation devices according to any one of claims 1 to 13, wherein the plurality of heat dissipation devices are arranged in sequence and spaced apart, and a first heat transfer structure and a second heat transfer structure included in each of the heat dissipation devices are both connected to the heat exchange device.

16. An optical module heat dissipation device, comprising: a heat dissipation device according to any one of claims 1 to 14; and at least one optical module, wherein the optical module comprises a main body and an insertion terminal connected to the main body, and the insertion terminal is inserted into a first sub-accommodating cavity and a second sub-accommodating cavity included in the heat dissipation device.

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