Sheet fixing method

Abstract

To fix an object to be processed to a frame through a sheet in the state of removing the foreign matter of the frame in a method for fixing the sheet.SOLUTION: A method of fixing a sheet (130) includes a temporary fixing step S11 (S21) of fixing the sheet (130) to a frame (120), a peeling step S11 (S22) of peeling the sheet (130) from the frame (120) after the temporary fixing step S12, a main fixing step S12 (S11) of fixing a second region (132) different from a first region (131) fixed in the temporary fixing step S14 of the sheet (130) to the frame (120) after the peeling step S24, and an integrating step () of holding an object to be processed (wafer 110) in an opening (121) of the frame (120) inside the second region (132) of the sheet (130). S15 S24.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a method for fastening a seat. [Background technology]

[0002] BACKGROUND ART Conventionally, a sheet fixing method is known in which a sheet is fixed to an annular frame, and an object to be processed, such as a semiconductor wafer or a package substrate, is fixed in an opening of the frame by the sheet (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-060969 Summary of the Invention [Problem to be solved by the invention]

[0004] However, when the object to be processed is fixed to the frame via the sheet as described above, the sheet may be fixed to the frame with foreign matter adhering to the fixing surface of the frame, which may cause problems such as the sheet peeling off from the foreign matter in a later process.

[0005] An object of the present invention is to provide a method for fixing a sheet that can fix an object to be processed to a frame via a sheet in a state where foreign matter on the frame has been removed. [Means for solving the problem]

[0006] In one aspect, the method for fixing a sheet includes a temporary fixing step of fixing the sheet to a frame, a peeling step of peeling the sheet from the frame after the temporary fixing step, a main fixing step of fixing a second region of the sheet, which is different from the first region fixed in the temporary fixing step, to the frame after the peeling step, and an integration step of holding the object to be processed in the opening of the frame inside the second region of the sheet. [Effects of the Invention]

[0007] According to this aspect, the object to be processed can be fixed to the frame via the sheet in a state where foreign matter on the frame has been removed. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a front view showing a fixing device according to one embodiment. [Figure 2] FIG. 2 is a bottom view showing the seat according to the embodiment. [Figure 3] FIG. 2 is a perspective view showing a wafer unit according to an embodiment. [Figure 4] 1A to 1C are process diagrams illustrating a method for fixing a sheet according to an embodiment. [Figure 5A] FIG. 10 is an explanatory diagram (part 1) for explaining a temporary fixing step according to an embodiment. [Figure 5B] FIG. 10 is a second explanatory diagram for explaining the temporary fixing step according to the embodiment. [Figure 6A] FIG. 1 is an explanatory diagram (part 1) for explaining a peeling step in one embodiment. [Figure 6B] FIG. 10 is a second explanatory diagram for explaining the peeling step in one embodiment. [Figure 7] FIG. 10 is an explanatory diagram for explaining a collecting step in one embodiment. [Figure 8A] FIG. 10 is an explanatory diagram (part 1) for explaining a main fixing step in one embodiment. [Figure 8B] FIG. 10 is a second explanatory diagram for explaining the main fixing step according to the embodiment. [Figure 9A] FIG. 1 is an explanatory diagram (part 1) for explaining an integration step in one embodiment. [Figure 9B] FIG. 10 is a second explanatory diagram for explaining the integration step according to an embodiment. [Figure 9C]FIG. 10 is a third explanatory diagram for explaining the integration step according to an embodiment. [Figure 10] 10A to 10C are process diagrams illustrating a method for fixing a sheet according to a modified example of the embodiment. [Figure 11] FIG. 10 is an explanatory view for explaining a main fixing and integration step in a modified example of the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A seat fixing method according to an embodiment of the present invention will be described below with reference to the drawings.

[0010] FIG. 1 is a front view showing a fixing device 1 according to the present embodiment.

[0011] 1 and later-described Figures 2, 3, 5A to 9C, and 11, the X, Y, and Z directions are, for example, horizontal directions that are orthogonal to each other, and the Z direction is a vertical direction. These directions may be referred to as the X direction as the front-to-back direction, the Y direction as the left-to-right direction, and the Z direction as the up-to-down direction, but this is just an example for convenience of explanation.

[0012] 1 includes a frame table 10, a feeding section 20, a winding section 30, a release paper winding section 40, a drawing section 51, a driven section 52, guide sections 53 and 54, a fixing section 60, a peeling section 70, a control section 80, and a cutting section 90 (see FIG. 8B). In this embodiment, the drawing section 51, the driven section 52, the guide sections 53 and 54, the fixing section 60, and the peeling section 70 are rollers.

[0013] An annular frame 120 (only the frame 120 is shown in cross section) is placed on the frame table 10. The holding surface of the frame table 10 may have a positioning block or a suction mechanism against which the frame 120 abuts to prevent misalignment of the frame 120. The frame table 10 and the fixing device 1 (a portion excluding the frame table 10) are preferably arranged so that they can be separated from each other to avoid interference between the loading / unloading device and the sheet 130 when loading / unloading the frame 120. The fixing device 1 may not necessarily have the frame table 10.

[0014] The delivery unit 20 delivers the rolled sheet R, which is made by bonding together a sheet 130 and a release paper P. The delivery unit 20 has a delivery shaft 21 that supports the rolled sheet R at the central axis of the rolled sheet R, and a support unit (not shown) that supports the delivery shaft 21. The delivery unit 20 can also be called an unwinder, sheet unwinder, rolled sheet unwinder, feeder, sheet feeder, rolled sheet feeder, etc. Since the delivery shaft 21 supports the rolled sheet R, it can be said that the sheet 130 is fixed to the delivery unit 20.

[0015] The winding unit 30 winds up the sheet 130 that has been fed from the feeding unit 20 and separated from the release paper P. The winding unit 30 has a winding shaft 31 that winds up the sheet 130, a drive unit (not shown) that drives the winding shaft 31, and a support unit (not shown) that supports the winding shaft 31. The winding unit 30 can also be called a winder, a sheet winder, or the like. Since the winding shaft 31 winds up the sheet 130, it can be said that the sheet 130 is fixed to the winding unit 30.

[0016] The release paper winding unit 40 winds up the release paper P that has been fed from the feeding unit 20 and separated from the sheet 130. The release paper winding unit 40 has a release paper winding shaft 41 that winds up the release paper P, a drive unit (not shown) that drives this release paper winding shaft 41, and a support unit (not shown) that supports the release paper winding shaft 41. The release paper winding unit 40 can also be called a winder, a release paper winder, or the like.

[0017] The pull-out portion 51 and the driven portion 52 hold the rolled sheet R. The driven portion 52 rotates in accordance with the rotation of the pull-out portion 51, which is, for example, a drive roller. Of the rolled sheet R, the sheet 130 is pulled out along the pull-out portion 51, and the release paper P is pulled out along the driven portion 52. As a result, the sheet 130 and the release paper P are separated.

[0018] The guide portions 53 and 54 guide the sheet 130. For example, the guide portions 53 and 54 are rollers that guide the sheet 130, and are preferably arranged to be movable in order to adjust the tension of the sheet 130.

[0019] The fixing unit 60 fixes the sheet 130 to the frame 120. The fixing unit 60 is arranged so as to be movable in the Y and Z directions. The fixing unit 60 is not limited to a roller, and may be of any shape such as a plate or a block. The fixing unit 60 may also be called a press, a sheet press, or the like.

[0020] The peeling unit 70 is, for example, a peeling roller that peels the sheet 130 from the frame 120, and is arranged to be movable in the Y direction. The peeling unit 70 is installed on the opposite side of the sheet 130 from the fixed unit 60 (below the sheet 130). Note that the peeling unit 70 is not limited to a roller, and may be of any shape, such as a plate or block. The peeling unit 70 may also be called a scraper, a sheet scraper, or the like.

[0021] The control unit 80 has a processor (e.g., a central processing unit (CPU)) that functions as an arithmetic processing device that controls the operation of each part of the fixing device 1, and a memory. This memory may be, for example, a read-only semiconductor memory (ROM) in which a predetermined control program is pre-recorded, or a random access memory (RAM) that is a semiconductor memory that can be written and read at any time and is used as a working storage area as needed when the processor executes various control programs. For example, the processor reads and executes a predetermined program to control the drive of multiple drive units (actuators such as motors) that are arranged to drive the winding unit 30, the release paper winding unit 40, the drawing unit 51, the fixing unit 60, the peeling unit 70, the cutting unit 90 (rotation drive unit 93), etc. In this way, the control unit 80 controls each part of the fixing device 1.

[0022] The cutting unit 90 shown in FIG. 8B has a cutter 91, an arm 92, and a rotation drive unit 93, and cuts the sheet 130 in a second region 132 (see FIG. 2) fixed to the frame 120 or at the periphery of this second region 132. The cutter 91 is fixed to the arm 92, and cuts the sheet 130 at its lower end. The arm 92 is rotated by the rotation drive unit 93 with the Z direction as its center of rotation. This allows the cutter 91 to cut the sheet 130 along the shape of the annular frame 120.

[0023] The wafer unit 100 shown in FIG. 3 is an example of a processing object unit, and includes a wafer 110, a frame 120, and a sheet .

[0024] The wafer 110 is an example of a processing object held by the sheet 130, and is a disk-shaped substrate made of a material such as silicon (Si), on whose surface 111 a chip 113, which is a device such as an IC (Integrated Circuit), is formed. The chip 113 is divided by planned division lines 112 formed in a grid pattern. The processing object may be a package substrate or the like, and is not limited to the wafer 110.

[0025] The wafer 110 is held in a circular opening 121 of an annular frame 120 by a sheet 130 attached to the frame 120 .

[0026] The sheet 130 includes a flexible, non-adhesive base layer and a flexible, adhesive adhesive layer (fixing surface) laminated on the base layer. The sheet 130 may be made of a thermoplastic resin without an adhesive layer. Alternatively, if the sheet 130 is made of multiple layers, only the layer of the sheet 130 that serves as the fixing surface to the frame 120 or the wafer 110 may be made of a thermoplastic resin without an adhesive layer. Alternatively, only a portion of the fixing surface of the sheet 130 (for example, in the case where the processing object is a wafer having a device region where devices are formed and a peripheral excess region surrounding the device region, at least the region fixed to the device region) may be made of a thermoplastic resin without an adhesive layer. In this way, if the sheet 130 does not have an adhesive layer even in at least a portion of the region (device region) where the sheet 130 is fixed to the wafer 110, the region where the sheet 130 is fixed to the wafer 110 can be considered to have no adhesive layer. The sheet 130 without an adhesive layer is not limited to one made of a thermoplastic resin, but when the sheet 130 is made of a thermoplastic resin, for example, a polyolefin sheet, a polyethylene sheet, a polypropylene sheet, a polystyrene sheet, or the like is preferred, and it is preferable that the sheet 130 be fixed to the frame 120 or the wafer 110 by thermocompression bonding. In this case, the release paper P may be omitted. Furthermore, when the sheet 130 is made of a material having ultraviolet curing characteristics, an irradiation unit that irradiates the sheet with ultraviolet light is disposed in the fixing device 1.

[0027] As shown in FIG. 2 , the sheet 130 is fixed to the common frame 120 in an annular first region 131 (shown as a dotted portion indicated by a two-dot chain line) that is temporarily fixed to the annular frame 120 and an annular second region 132 (shown as a dotted portion indicated by a two-dot chain line) that is permanently fixed to the annular frame 120. The wafer 110 (shown as a two-dot chain line) is fixed inside the second region 132 that is permanently fixed to the frame 120 and cut. The second region 132 is different from the first region 131. However, even if a portion of the first region 131 and a portion of the second region 132 overlap, the first region 131 and the second region 132 can be considered to be different regions. However, it is preferable that the first region 131 and the second region 132 are separated and do not overlap. The frame 120 may be rectangular and annular. In this case, the first region 131 and the second region 132 also have rectangular and annular shapes. In this way, the frame 120, the sheet 130, the wafer 110, etc. can have any shape.

[0028] FIG. 4 is a process diagram showing a method for fixing the sheet 130 according to this embodiment.

[0029] As shown in FIG. 4, the method for fixing the sheet 130 according to this embodiment includes a temporary fixing step S11 (FIGS. 5A and 5B), a peeling step S12 (FIGS. 6A and 6B), a recovery step S13 (FIG. 7), a permanent fixing step S14 (FIGS. 8A and 8B), and an integration step S15 (FIGS. 9A to 9C).

[0030] First, in temporary fixing step S11, as shown in FIG. 5A, sheet 130 is guided by drawer 51, guides 53 and 54, etc. between feed-out unit 20 and wind-up unit 30, so that the region between feed-out unit 20 and wind-up unit 30 is positioned facing frame 120. In this state, fixing unit 60 descends and fixes sheet 130 to frame 120. Then, as shown in FIG. 5B, fixing unit 60 moves in the positive Y direction and fixes sheet 130 (first region 131 shown in FIG. 2) over the entire frame 120. Note that, in cases where temporary fixing is performed by raising frame table 10, fixing unit 60 may be omitted, and frame table 10 may also serve as the fixing unit. Here, the temporary fixation differs from the permanent fixation described below in that it is sufficient for the sheet 130 to be adhered to the frame 120 to an extent that foreign matter F (see FIG. 6B) adhering to the frame 120 can be removed, and therefore it can be said that the sheet 130 does not need to be firmly fixed to the frame 120. By not firmly fixing the sheet 130 to the frame 120 in the temporary fixation step, it is possible to prevent adhesive residue from being left on the frame 120 after the sheet 130 is peeled off in the peeling step S12 (S22).

[0031] Next, in the peeling step S12, as shown in FIG. 6A, after the fixing unit 60 retreats upward, the peeling unit 70 moves in the positive Y direction to peel off the sheet 130 from the frame 120. As a result, as shown in FIG. 6B, foreign matter F adhering to the frame 120 is removed by the sheet 130 (first region 131). Note that the peeling step S12 may be performed by moving the peeling unit 70 relative to the frame 120, and the movement of the peeling unit 70 in the positive Y direction is merely an example. Furthermore, in cases where peeling is performed by lowering the frame table 10, the peeling unit 70 may be omitted, and the frame table 10 may also serve as the peeling unit.

[0032] Next, in the recovery step S13, in order to have the sheet 130 face the frame 120 in the second region 132, which is different from the first region 131 that was temporarily fixed to the frame 120, the sheet 130 is wound up by the winding unit 30 to a position where the first region 131 no longer faces the frame 120, as shown in Fig. 7. This makes it possible to prevent the foreign matter F removed by the sheet 130 from adhering to the frame 120 again.

[0033] Next, in the permanent fixing step S14, as shown in FIG. 8A , similar to the temporary fixing step S11 described above, the sheet 130 is fixed to the frame 120 using the fixing unit 60. During the permanent fixing, the second region 132 is fixed to the frame 120. Then, as shown in FIG. 8B , the cutting unit 90 cuts the sheet 130 in the second region 132 or the periphery of the second region 132. Note that if the sheet 130 is pre-cut in the second region 132, cutting of the sheet 130 by the cutting unit 90 can be omitted. In this case, a mechanism for separating the pre-cut second region 132 from the rest of the sheet 130 is provided. Furthermore, in an embodiment in which the first region 131 is pre-cut, in addition to the mechanism for separating the first region 131 from the sheet 130, a peeling mechanism for peeling off the pre-cut first region 131 is also provided.

[0034] Next, in the integration step S15, the transfer device 200 shown in FIG. 9A transfers the frame 120, to which the sheet 130 is fixed as described above, above the wafer table 300 that supports the wafer 110. The transfer device 200 may transfer the frame 120 while holding the frame 120 by suction, for example. Then, as shown in FIG. 9B, the transfer device 200 descends, and the wafer 110 is held inside the second region 132 of the sheet 130 (see FIGS. 2 and 3). This allows the formation of a wafer unit 100 including the wafer 110, the frame 120, and the sheet 130, as shown in FIG. 9C. Note that the wafer 110 and the sheet 130 are preferably attached in a vacuum to prevent air bubbles from entering the attachment surfaces.

[0035] In the above description, the sheet 130 is fed by the feeding unit 20 and taken up by the take-up unit 30, but the configuration for supplying and discharging the sheet 130 is not limited to the above example. For example, after the second region 132 of the sheet 130 is fully fixed, the sheet 130 may be fed and cut on the upstream side of the second region 132 in the feeding direction, eliminating the need to take up the sheet 130.

[0036] FIG. 10 is a process diagram showing a method for fixing the sheet 130 according to a modified example of this embodiment.

[0037] In the above description, an example has been given in which the integration step S15 is performed after the main fixing step S14, as shown in Fig. 4. In this modified example, an example will be described in which the main fixing step S14 and the integration step S15 are performed together (simultaneously).

[0038] The temporary fixing step S21, peeling step S22, and recovery step S23 shown in FIG. 10 can be similar to the temporary fixing step S11, peeling step S12, and recovery step S13 shown in FIG. 4, and therefore description thereof will be omitted.

[0039] 11, in the main fixing and integration step S24, when the sheet 130 (second region 132) is main fixed to the frame 120, the wafer 110 is also fixed to the frame 120. In this case, the wafer 110 can be held (fixed) in the fixing device 1 without the need to transport the frame 120 to the wafer table 300 by the above-mentioned transport device 200. In the fixing device 1 shown in FIG. 11, an outer table 11 and an inner table 12 are arranged instead of the frame table 10.

[0040] The frame 120 is preferably supported by a cylindrical outer table 11 (only the outer table 11 is shown in cross section), and the wafer 110 is preferably supported by a cylindrical inner table 12 disposed inside the outer table 11. If the outer table 11 and the inner table 12 can be raised and lowered relative to each other, the height of the upper surface of the frame 120 and the height of the upper surface of the wafer 110 can be made equal. However, if the heights of the frame 120 and the frame table 10 are equal, or if the sheet 130 can be fixed without making the height of the upper surface of the frame 120 and the height of the upper surface of the wafer 110 equal, the arrangement of the outer table 11 and the inner table 12 can be omitted. In this case, after the sheet 130 has been peeled off from the frame 120 and before the sheet 130 is fixed, the frame table 10 shown in FIG. 1 can be lowered, and the wafer 110 can be transported to the opening 121 of the frame 120.

[0041] In the present embodiment described above, the method of fixing the sheet 130 includes a temporary fixing step S11 (S21) of fixing the sheet 130 to the frame 120, a peeling step S12 (S22) of peeling the sheet 130 from the frame 120 after this temporary fixing step S11, a final fixing step S14 (S24) of fixing a second region 132 of the sheet 130, which is different from the first region 131 fixed in the temporary fixing step S11, to the frame 120 after this peeling step S12, and an integration step S15 (S24) of holding the wafer 110 (an example of an object to be processed) in the opening 121 of the frame 120 inside the second region 132 of the sheet 130.

[0042] As a result, even if foreign matter F is attached to the frame 120, the foreign matter F can be removed by temporarily fixing and peeling off the sheet 130 used in the permanent fixation before the wafer 110 is attached. That is, by once fixing the sheet 130 to the frame 120 and peeling it off to remove the foreign matter F, and then fixing the sheet 130 to the frame 120 again, it is possible to prevent the sheet 130 from being fixed with the foreign matter F attached to the frame 120. Therefore, according to this embodiment, the wafer 110 (the processing target) can be fixed to the frame 120 via the sheet 130 in a state where the foreign matter F on the frame 120 has been removed. This makes it possible to prevent problems such as the sheet 130 peeling off from the portion of the foreign matter F in a subsequent process. Furthermore, compared to an embodiment in which the foreign matter F on the frame 120 is removed by a suction process, a wiping process, or the like before fixing the sheet 130 to the frame 120, the foreign matter F can be removed with a simple configuration using the same fixing device 1 (fixing unit 60, etc.) just before fixing the sheet 130 to the frame 120.

[0043] In this embodiment, sheet 130 is fixed to a delivery section 20 that delivers sheet 130 and a take-up section 30 that takes up sheet 130, and the region between delivery section 20 and take-up section 30 is positioned opposite frame 120 and fixed to frame 120. In the main fixing step S14 (S24), a first region 131 of sheet 130 is taken up by take-up section 30, and a second region 132 delivered from delivery section 20 is positioned opposite frame 120, and then second region 132 is fixed to frame 120.

[0044] In this way, the winding unit 30 winds up the frame 120, so that the first region 131 peeled off from the frame 120 can be wound up at the same time as the second region 132 that is permanently fixed to the frame 120 is fed out. Therefore, the first region 131 can be collected with a simple configuration that does not require any additional parts.

[0045] In addition, in this embodiment, the fixing step S14 (S24) is performed by fixing the sheet 130 via a fixing part 60 that faces the frame 120, and the peeling step S12 (S22) is performed by moving a peeling part 70, which is installed on the opposite side of the sheet 130 from the fixing part 60, relative to the frame 120.

[0046] Therefore, the fixing section 60 and the peeling section 70, which are located on opposite sides of the sheet 130, can perform temporary fixing and peeling of the sheet 130 (first region 131) and actual fixing of the sheet 130 (second region 132) with a simple configuration.

[0047] In this embodiment, the area where the sheet 130 is fixed to the wafer 110 does not have an adhesive layer.

[0048] This can prevent glue from adhering to the wafer 110. Furthermore, if the sheet 130 does not have an adhesive layer in the portion that is temporarily fixed to the frame 120, it can prevent glue residue from being left on the frame 120 after the sheet 130 is peeled off in the peeling step S12 (S22).

[0049] It goes without saying that the seat fixing method according to the present invention is not limited to the above-described embodiment, and may be implemented in various different forms within the scope of the technical concept thereof. Furthermore, the components shown in the accompanying drawings may be modified as appropriate within the scope of the effects of the present invention. [Industrial Applicability]

[0050] As described above, the sheet fixing method of the present invention can fix the processing object to the frame via the sheet in a state where foreign matter on the frame has been removed, and is therefore particularly useful when processing the processing object such as a wafer. [Explanation of symbols]

[0051] 1 Fixing device 10 Frame Table 11 Outside Table 12 Inner Table 20 Delivery section 21 Feeding axis 30 Winding section 31 Winding shaft 40 Release paper winding section 41 Release paper winding shaft 51 Drawer section 52 Driven part 53,54 Guide section 60 Fixed part 70 Peeling section 80 Control Unit 90 Cut section 91 cutter 92 Arm 93 Rotation drive unit 100 wafer unit (processing object unit) 110 Wafer (processing object) 111 Surface 112 Planned division line 113 chips 120 frames 121 Aperture 130 sheets 131 First area 132 Second area 200 Conveyor 300 wafer table F Foreign object P Release paper R Roll Sheet

Claims

1. A temporary fixing step to fix the seat to the frame; a peeling step of peeling the sheet from the frame after the temporary fixing step; a main fixing step of fixing a second region of the sheet, which is different from the first region fixed in the temporary fixing step, to the frame after the peeling step; an integration step of holding an object to be treated in the opening of the frame inside the second region of the sheet; A method for fixing a sheet comprising:

2. The sheet is a delivery section that delivers the sheet; a winding section that winds up the sheet; The area between the delivery section and the winding section positioned opposite the frame and fixed to the frame, The main fixing step includes: winding the first region of the sheet by the winding section; After the second region fed from the feeding section is made to face the frame, Fixing the second region to the frame The method for fixing a sheet according to claim 1.

3. The main fixing step includes: The sheet is fixed by a fixing portion facing the frame via the sheet, The peeling step comprises: The sheet is sandwiched between the fixing part and the peeling part, which is installed on the opposite side of the fixing part and is moved relatively to the frame. The method for fixing a sheet according to claim 1.

4. The area of ​​the sheet that is fixed to the object to be treated does not have an adhesive layer. The method for fixing a sheet according to claim 1.

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