Method for producing fiber-reinforced substrate

By integrating short fibers into the adhesive and orienting them to withstand deformation, the method strengthens the adhesive layer, preventing breakage and maintaining substrate integrity.

JP2026001383APending Publication Date: 2026-01-07TORAY ENG CO LTD
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Patent Information

Application Number
JP2024098653
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-06-19
Publication Date
2026-01-07

AI Technical Summary

Technical Problem

The adhesive layer in fiber-reinforced substrates can break due to deformation caused by temperature changes, leading to a decrease in substrate strength as the tape peels off.

Method used

Incorporating short fibers into the adhesive to strengthen the adhesive layer, orienting the fibers in a specific direction, and forming irregularities on the substrate surfaces to enhance bonding.

Benefits of technology

The method prevents adhesive layer breakage, maintains substrate strength, and improves bending properties by distributing load effectively.

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Abstract

To provide a method for manufacturing a fiber-reinforced base material capable of suppressing the destruction of an adhesive layer and preventing the lowering of the strength of the base material.SOLUTION: A method for producing a fiber-reinforced base material, which produces a reinforced base material by attaching a tape containing a fiber reinforcement to an attachment surface of a base material, includes an application step of applying an adhesive to at least one of the attachment surface and an attachment surface of the tape facing the attachment surface, and an attachment step of attaching the tape to the attachment surface, wherein the adhesive contains short fibers.SELECTED DRAWING: Figure 2
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Description

[Technical Field]

[0001] The present invention relates to a method for producing a fiber-reinforced substrate by applying tape to a substrate to produce a reinforced substrate. [Background technology]

[0002] In order to manufacture high-performance fiber-reinforced plastic parts required in industrial fields such as aircraft and automobiles, the strength of the substrate (plastic part) is increased by attaching a tape in which resin is impregnated into fiber bundles of fiber reinforcement (e.g., carbon fiber) to the surface of the substrate.

[0003] As a method for manufacturing a fiber-reinforced substrate for producing a substrate reinforced in this way, for example, Patent Document 1 listed below discloses a tape application device having an application section that applies adhesive to the application surface of the tape facing the application surface of the substrate, and an application section that presses the tape onto the application surface, in which adhesive is applied to the application surface by the application section, and the tape is pressed onto the application surface by the application section, and the adhesive located between the application surface and the application surface is hardened, thereby applying the tape to the application surface. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-151326 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the above-mentioned manufacturing method of a fiber-reinforced substrate, the adhesive layer may be broken, resulting in a decrease in the strength of the substrate. Specifically, when the substrate or tape is deformed due to expansion or contraction of the substrate or tape caused by temperature changes, the deformation of the substrate or tape may impose a load on the adhesive layer, resulting in the adhesive layer being broken. When the adhesive layer is broken, the tape may peel off from the surface to which it is attached, resulting in a decrease in the strength of the substrate.

[0006] The present invention has been made in consideration of the above problems, and aims to provide a method for manufacturing a fiber-reinforced substrate that can suppress destruction of the adhesive layer and prevent a decrease in the strength of the substrate. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems, the method for manufacturing a fiber-reinforced substrate of the present invention is a method for manufacturing a fiber-reinforced substrate in which a reinforced substrate is manufactured by attaching a tape containing a fiber reinforcing material to a substrate's surface to be attached, and includes an application step of applying an adhesive to at least one of the substrate's surface to be attached and an attachment surface of the tape facing the substrate to be attached, and an attachment step of attaching the tape to the substrate to be attached, and is characterized in that the adhesive contains short fibers.

[0008] According to the above-described method for producing a fiber-reinforced substrate, the adhesive applied to the substrate's surface to be attached or the tape's surface in the application step contains short fibers, which allows the short fibers to bear the load on the adhesive layer after the adhesive has hardened. That is, the inclusion of short fibers in the adhesive increases the strength of the adhesive layer. This suppresses breakage of the adhesive layer, thereby preventing a decrease in the strength of the substrate.

[0009] In addition, in the coating step, the adhesive may be coated so that the short fibers are oriented in a certain direction.

[0010] According to this configuration, the tape can be attached to the surface to be attached with the adhesive applied to the surface to be attached so that the short fibers are oriented in a specific direction, thereby improving the bending properties of the substrate, such as the bending strength and bending modulus, in the specific direction, i.e., the orientation direction of the short fibers, thereby increasing the strength of the substrate in the direction requiring strength.

[0011] In addition, in the applying step, the adhesive may be applied so that the orientation direction of the fiber reinforcement material contained in the tape and the orientation direction of the short fibers are approximately parallel to each other.

[0012] According to this configuration, the tape can be attached to the surface to be attached using adhesive applied to the surface to be attached or the adhesive surface so that the orientation direction of the fiber reinforcing material contained in the tape and the orientation direction of the short fibers contained in the adhesive are approximately parallel, thereby further increasing the strength of the base material in the direction where strength is required.

[0013] The coating step may also include a discharge step of discharging the adhesive from a discharge unit that discharges the adhesive so as to orient the short fibers in a certain direction.

[0014] According to this configuration, by ejecting the adhesive from the ejection section so as to orient the short fibers in a certain direction during the ejection process, the adhesive can be applied to the surface to be attached or the surface to be attached with the short fibers oriented in a certain direction.

[0015] In addition, in the application step, the tape may be tilted with the application surface facing upward, and the adhesive may flow along the tilt of the tape.

[0016] According to this configuration, the adhesive can be applied to the attachment surface so that the short fibers are oriented in the flow direction of the adhesive.

[0017] In addition, in the application step, the base material may be tilted with the attachment surface facing upward, and the adhesive may be caused to flow along the tilt of the base material.

[0018] According to this configuration, the adhesive can be applied to the surface to be attached so that the short fibers are oriented in the direction of flow of the adhesive.

[0019] The short fibers may be carbon fibers.

[0020] According to this configuration, since the adhesive contains carbon fiber, which has high rigidity and strength, the strength of the adhesive can be made higher than when the adhesive contains other fibers.

[0021] The configuration may further include a step of forming irregularities on at least one of the adhered surface and the adherend surface.

[0022] According to this configuration, by forming irregularities on at least one of the surface to be attached and the attaching surface in the irregularity forming process, the short fibers contained in the adhesive become caught in the irregularities, making it difficult for the adhesive to peel off from the surface to be attached when irregularities are formed on the surface to be attached, and making it difficult for the adhesive to peel off from the attaching surface when irregularities are formed on the attaching surface. [Effects of the Invention]

[0023] According to the method for producing a fiber-reinforced substrate of the present invention, it is possible to suppress the destruction of the adhesive layer and prevent the strength of the substrate from decreasing. [Brief explanation of the drawings]

[0024] [Figure 1] FIG. 2 is a diagram showing a tape application device used in the manufacture of a fiber-reinforced substrate in one embodiment of the present invention. [Figure 2] FIG. 4 is a diagram illustrating a coating step in the first embodiment of the present invention. [Figure 3] FIG. 10 is a diagram illustrating a coating step in the second embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0025] First Embodiment The method for manufacturing a fiber-reinforced substrate in this embodiment will be described with reference to the drawings. In the following description, the three axes of an orthogonal coordinate system are designated as X, Y, and Z, the horizontal direction is referred to as the X-axis direction and the Y-axis direction, and the direction perpendicular to the XY plane (i.e., the vertical direction) is referred to as the Z-axis direction.

[0026] Fig. 1 is a diagram showing a tape application device 100 used in manufacturing a fiber-reinforced substrate in this embodiment. Fig. 2 is a diagram for explaining the application step in this embodiment. Note that arrow A shown in Fig. 2 indicates the feeding direction of tape 2.

[0027] 1, the tape application device 100 of this embodiment includes a transport unit 3 that transports the tape 2 to the application surface 11 of the substrate 1, an application unit 4 that presses the tape 2 against the application surface 11, an applicator 5 that applies adhesive 51 (see FIG. 2) to the application surface 21 of the tape 2 that faces the application surface 11, a substrate stand 12 that holds the substrate 1, and a mounting stand (not shown) on which the tape 2 is placed. The application unit 5 applies adhesive 51 to the application surface 21 of the tape 2 that is transported from the mounting stand to the application surface 11 by the transport unit 3, and the application unit 4 presses the tape 2 against the application surface 11 of the substrate 1 held on the substrate stand 12, thereby applying the tape 2 to the application surface 11.

[0028] The substrate 1 is, for example, an injection-molded product of thermoplastic resin, and the tape 2 is attached to its surface, which is the attachment surface 11. The tape 2 is a strip-shaped member formed by impregnating a bundle of fiber reinforcement material 22 (see FIG. 2) with thermoplastic resin, and is placed on a mounting table after being cut to a predetermined length. The substrate 1 is reinforced by attaching the tape 2 to the attachment surface 11. This forms a fiber-reinforced substrate. The shape of the substrate 1, the position where the tape 2 is attached, and the length of the attached tape 2 are predetermined by design. The fiber reinforcement material 22 contained in the tape 2 is carbon fiber.

[0029] The adhesive 51 is used to bond the attachment surface 11 and the attachment surface 21. The adhesive 51 is, for example, an epoxy-based, urethane-based, polyester-based, or other thermosetting adhesive, and bonds the attachment surface 11 and the attachment surface 21 by hardening while in contact with the attachment surface 11 and the attachment surface 21. In the following description, the hardened adhesive 51 will be referred to as an adhesive layer 61.

[0030] The transport unit 3 is for transporting the tape 2 to the receiving surface 11. The transport unit 3 has a feeder 31 that feeds the tape 2 toward the receiving surface 11, and a supply mechanism (not shown) that supplies the tape 2 placed on a mounting table to the feeder 31.

[0031] The feeder 31 has a pair of transport rollers 32 that grip the tape 2 from the joining surface 21 and its back surface, and by driving and rotating the pair of transport rollers 32, the tape 2 is fed toward the joining surface 11. The supply mechanism has a hand unit that grips the tape 2, and a movement mechanism that moves the hand unit vertically and horizontally, and while the hand unit grips the tape 2 placed on the mounting table, the movement mechanism moves the tape 2 so that one end of the tape 2 is inserted into an insertion opening (not shown) of the feeder 31. In this way, the tape 2 is supplied to the feeder 31 and transported to the joining surface 11.

[0032] The application unit 4 is for pressing the tape 2 conveyed by the conveyance unit 3 against the surface 11 to be applied. The application unit 4 has a pressure roller 41 that presses the tape 2 against the surface 11 to be applied, and a roller support unit 42 that supports the pressure roller 41. A drive unit 43 (e.g., an air cylinder) that applies pressure to the pressure roller 41 is provided inside the roller support unit 42, and by operating this drive unit 43, the force with which the pressure roller 41 presses the tape 2 against the surface 11 to be applied can be controlled. The operation of the drive unit 43 is controlled by a control unit (not shown), which is a general-purpose computer device.

[0033] The application unit 4 is attached to the tip of an arm 71 of an articulated robot 7. The articulated robot 7 is a general-purpose industrial robot, and the posture (tilt) of the application unit 4 is controlled by operating the articulated robot 7. The operation of the articulated robot 7 is controlled by the control unit described above.

[0034] The control unit controls the operation of the articulated robot 7 and the drive unit 43 to control the attitude of the joining unit 4 so that the pressure roller 41 presses the surface 11 from a direction perpendicular to the tangential direction of the surface 11 (normal direction), and the magnitude of the force with which the pressure roller 41 presses the tape 2 against the surface 11, thereby keeping the pressure state of the pressure roller 41 against the tape 2 constant. The attitude control of the joining unit 4 with respect to the substrate 1 is performed based on the three-dimensional design data of the substrate 1 stored in the control unit.

[0035] The applicator 5 is for applying adhesive 51 to the application surface 21 of the tape 2 transported by the transporter 3. As shown in Fig. 2, the applicator 5 has a discharge unit 52 that discharges the adhesive 51, a tank (not shown) that stores the adhesive 51, a supply path 53 that connects the discharge unit 52 to the tank, and a pump (not shown) that feeds the adhesive 51. That is, the adhesive 51 stored in the tank is supplied to the discharge unit 52 through the supply path 53 by the pump, and is discharged from the discharge unit 52.

[0036] The discharge section 52 is formed long in the width direction (Y-axis direction in FIG. 2) perpendicular to the transport direction of the tape 2 in the in-plane direction of the tape 2. As shown in FIG. 1, the discharge section 52 is disposed between the transport section 3 and the attachment section 4 in the transport path of the tape 2, at a predetermined distance from the attachment surface 21 so that the longitudinal direction of the discharge section 52 and the width direction of the tape 2 are parallel.

[0037] Discharge section 52 is composed of discharge port 54 that discharges adhesive 51 and slit 55 that is wide in the width direction and connects supply path 53 and discharge port 54, and discharge port 54 opens to the same length as slit 55. Adhesive 51 supplied to slit 55 through supply path 53 is discharged from discharge port 54 and applied across the width direction of bonding surface 21. Note that slit 55 is formed narrow in the transport direction of substrate 1.

[0038] Furthermore, a holding section 56 is provided at the position where the tape 2 is sandwiched between the discharge port 54 and the tape 2, which holds the tape 2 from the back side of the application surface 51 by the principle of electrostatic adsorption. That is, with the tape 2 held by the holding section 56, the adhesive 51 is applied to the application surface 51 by the applicator 5. This makes it possible to make the distance between the application surface 51 and the discharge port 54 uniform across the width, and therefore makes it possible to apply the adhesive 51 evenly across the width of the application surface 51.

[0039] The tape application device 100 having the above configuration can apply the tape 2 to the surface 11 to be applied.

[0040] Next, a method for manufacturing a fiber-reinforced substrate in this embodiment will be described. The method for manufacturing a fiber-reinforced substrate in this embodiment includes an application step of applying adhesive 51 to application surface 21, and an attachment step of attaching tape 2 to attachment surface 11.

[0041] The application step is a step of applying adhesive 51 to the attachment surface 21. In this application step, adhesive 51 is applied to the attachment surface 21 by discharging adhesive 51 from discharge unit 52 while tape 2 is being conveyed by conveyance unit 3.

[0042] The attachment step is a step of attaching the tape 2 to the attachment surface 11. In this attachment step, the attachment unit 4 presses the tape 2 onto the attachment surface 11. Thereafter, the adhesive 51 located between the attachment surface 11 and the attachment surface 21 hardens, thereby bonding the attachment surface 11 and the attachment surface 21. In this way, the tape 2 is attached to the attachment surface 11, and a fiber-reinforced substrate is formed.

[0043] Here, the adhesive 51 applied to the bonding surface 21 in the application step contains short fibers 62 (see FIG. 2). Specifically, the short fibers 62 are carbon fibers having a length of 1 to 2 mm, and are mixed into the adhesive 51 in a tank. The adhesive 51 containing the short fibers 62 is then supplied from the tank to the discharge unit 52 through the supply path 53, discharged from the discharge unit 52, and applied to the bonding surface 21. This makes it possible to prevent the adhesive layer 61 from being damaged.

[0044] Specifically, in the application step, the adhesive 51 applied to the attachment surface 21 contains the short fibers 62, which allows the short fibers 51 to bear the load applied to the adhesive layer 61 due to deformation of the substrate 1 or the tape 2, etc. In other words, the inclusion of the short fibers 62 in the adhesive 51 increases the strength of the adhesive layer 61, thereby suppressing damage to the adhesive layer 61. Therefore, peeling of the tape 2 from the substrate 1 due to damage to the adhesive layer 61 can be prevented, and a decrease in the strength of the substrate 1 can be prevented.

[0045] Furthermore, in the coating process, the adhesive 51 is coated so that the short fibers 62 are oriented in a fixed direction. Specifically, the coating process includes a discharge process in which the adhesive 51 is discharged from the discharge unit 52 so as to orient the short fibers 62 in a fixed direction, and the adhesive 51 supplied through the supply path 53 flows in a flow path such as the slit 55 that is long in the width direction and narrow in the conveyance direction of the substrate 1, and is then discharged from the discharge unit 52, whereby the short fibers 62 are oriented in the flow direction of the adhesive 51 in the flow path. This allows the adhesive 51 to be discharged from the discharge unit 52 with the short fibers 62 oriented in a fixed direction.

[0046] In this embodiment, the adhesive 51 is applied to the attachment surface 21 by discharging the adhesive 51 from the discharge unit 52 while the tape 2 is being conveyed by the conveyance unit 3, so that the short fibers 62 can be oriented in the conveyance direction of the tape 2. As a result, the tape 2 can be attached to the attachment surface 11 with the adhesive 51 applied to the attachment surface 21 so as to orient the short fibers 62 in a fixed direction, and therefore the bending properties such as the bending strength and bending modulus of the base material 1 in a fixed direction, i.e., in the orientation direction of the short fibers 62, can be improved. Therefore, the strength of the base material 1 can be increased in a direction requiring strength.

[0047] In the application step, the adhesive 51 is applied to the application surface 21 so that the orientation direction of the fiber reinforcement 22 contained in the tape 2 is approximately parallel to the orientation direction of the short fibers 62. In this embodiment, the fiber reinforcement 22 is oriented in the feeding direction of the tape 2.

[0048] In this embodiment, in the above-described discharging step, the adhesive 51 is discharged from the discharge unit 52 and applied to the attachment surface 21 while the tape 2 is being conveyed by the conveyance unit 3, so that the short fibers 62 can be oriented in the conveyance direction of the tape 2, i.e., in the direction in which the fiber reinforcing material 22 contained in the tape 2 is oriented. As a result, the tape 2 can be attached to the attachment surface 11 with the adhesive 51 applied to the attachment surface 21 so that the orientation direction of the fiber reinforcing material 22 contained in the tape 2 and the orientation direction of the short fibers 62 contained in the adhesive 51 are approximately parallel, and therefore the strength of the substrate 1 in the direction in which strength is required can be further increased.

[0049] In addition, the manufacturing method of the fiber-reinforced substrate in this embodiment further includes an unevenness forming process of forming unevenness on at least one of the attachment surface 11 and the attachment surface 21, and in this embodiment, an example of forming recesses on each of the attachment surface 11 and the attachment surface 21 will be described.

[0050] Specifically, when recesses are formed in the adhered surface 11 in the unevenness forming step, a scraping tool (not shown, for example, sandpaper) for scraping the adhered surface 11 is rubbed against the adhered surface 11 to scrape the adhered surface 11, thereby forming the recesses. When recesses are formed in the adhered surface 21 in the unevenness forming step, convex portions are provided on the contact surface of a stamp (not shown) that comes into contact with the adhered surface 21, and the contact surface of the stamp is brought into contact with the adhered surface 21, causing the convex portions to bite into the adhered surface 21, thereby forming recesses 23 (see FIG. 2) in the adhered surface 21 that correspond to the shape of the convex portions. As a result, the adhesive 51 enters and hardens into the recesses formed in the adhered surface 11 and the adhered surface 21, improving the adhesive strength between the adhesive 51 and each of the adhered surface 11 and the adhered surface 21.

[0051] When the adhesive 51 enters the recesses formed on the attachment surface 11 and the attachment surface 21 and hardens, some of the short fibers 62 contained in the adhesive 51 get caught in the recesses. This makes it difficult for the adhesive 51 to peel off from the attachment surface 11 and the attachment surface 21.

[0052] As described above, according to the manufacturing method of a fiber-reinforced substrate in the above embodiment, the adhesive 51 applied to the attachment surface 21 in the application step contains the short fibers 62, which allows the short fibers 51 to bear the load applied to the adhesive layer 61 due to deformation of the substrate 1 or the tape 2, etc. In other words, the inclusion of the short fibers 62 in the adhesive 51 increases the strength of the adhesive layer 61. This makes it possible to suppress breakage of the adhesive layer 61, thereby preventing a decrease in the strength of the substrate 1. Furthermore, even if a crack occurs in the adhesive layer 61, the presence of the short fibers 62 in the adhesive layer 61 prevents the crack from progressing.

[0053] In the above embodiment, an example has been described in which the application step is a step of applying the adhesive 51 to the application surface 21. However, the adhesive 51 may be applied to either the application surface 11 or the application surface 21. When the application step is a step of applying the adhesive 51 to the application surface 11, the discharge unit 52 is disposed above the application surface 11, and the adhesive 51 is applied to the application surface 11 by discharging the adhesive 51 from the discharge unit 52 while moving either the substrate 1 or the discharge unit 52. Then, in the application step, the tape 2 is pressed against the application surface 11 to which the adhesive 51 has been applied, thereby attaching the tape 2 to the application surface 11. Here, when the adhesive 51 is applied to the application surface 11, the adhesive 51 is discharged from the discharge unit 52 while moving either the substrate 1 or the discharge unit 52, so that the short fibers 62 can be oriented in the direction of movement of the substrate 1 or the discharge unit 52.

[0054] In addition, in the above embodiment, carbon fibers having high rigidity and strength are used as the short fibers 62 contained in the adhesive 51, so the short fibers 62 are less likely to break even when a load is applied to the short fibers 62. This makes it possible to increase the strength of the adhesive layer 61 compared to when other fibers are contained in the adhesive 51, making it easier to prevent the adhesive layer 61 from breaking.

[0055] Second Embodiment Next, a method for producing a fiber-reinforced substrate in a second embodiment of the present invention will be described with reference to Figure 3. The method for producing a fiber-reinforced substrate in this embodiment differs from the first embodiment in that the application step does not include a dispensing step, and the adhesive 51 is caused to flow along the inclination of the tape 2, thereby orienting the short fibers 62 in a fixed direction. In the following description, a detailed description of the same points as in the first embodiment will be omitted, and the description will focus on the differences.

[0056] Fig. 3 is a diagram for explaining the application step in the second embodiment of the present invention. Fig. 3 shows an example in which no irregularities are formed on the attachment surface 21. Arrow B shown in Fig. 3 indicates the flow direction of the adhesive 51.

[0057] In the method for manufacturing a fiber-reinforced substrate in this embodiment, as shown in FIG. 3, the tape 2 is tilted with the attachment surface 21 facing upward, and the adhesive 51 is caused to flow along the inclination of the tape 2, thereby applying the adhesive 51 to the attachment surface 21 so that the short fibers 62 are oriented in the flow direction of the adhesive 51.

[0058] A more specific description will be given below. The tape application device 100 used in the method for producing a fiber-reinforced substrate in this embodiment is provided with a tilting mechanism 8 that tilts the tape 2, and the discharge unit 52 is disposed directly above the upper end of the application surface 21 of the tape 2 when tilted by the tilting mechanism 8. The tilting mechanism 8 has a holding unit 81 that holds the tape 2 by the principle of electrostatic adsorption, and an articulated robot 82 having the holding unit 81 attached to the tip of an arm.

[0059] In the application step in this embodiment, the articulated robot 82 moves the holding unit 81 to hold the tape 2 placed on the mounting table, and then tilts the tape 2 with the application surface 21 of the tape 2 held by the holding unit 81 facing upward, and discharges the adhesive 51 from the discharge unit 52. As a result, the adhesive 51 discharged from the discharge unit 52 flows from the upper end to the lower end of the application surface 21 along the tilt of the tape 2, and is applied to the application surface 21. When the adhesive 51 is caused to flow in this way, the short fibers 62 are oriented in the flow direction of the adhesive 51.

[0060] In this embodiment, the tape 2 is tilted by the tilting mechanism 8 in a direction in which the short fibers 62 are to be oriented (hereinafter referred to as the predetermined direction), and the adhesive 51 is then discharged from the discharge unit 52. This allows the adhesive 51 to flow in the predetermined direction, so that the adhesive 51 can be applied to the application surface 21 so that the short fibers 62 are oriented in the predetermined direction.

[0061] In the application step, the tape 2 is tilted by the tilting mechanism in the orientation direction of the fiber reinforcement 22 contained in the tape 2, and the adhesive 51 is then discharged from the discharge unit 52. This allows the adhesive 51 to flow in the orientation direction of the fiber reinforcement 22, so that the adhesive 51 can be applied to the application surface 21 so that the orientation direction of the fiber reinforcement 22 and the orientation direction of the short fibers 62 are approximately parallel.

[0062] Furthermore, in this embodiment, in the application step, the tape 2 held in the holding unit 81 by the articulated robot 82 is tilted while the adhesive 51 is discharged from the discharge unit 52 to apply the adhesive 51 to the application surface 21, and then in the application step, the articulated robot 82 moves the holding unit 81 above the application surface 11 and presses the tape 2 held in the holding unit 81 against the application surface 11. This makes it possible to apply the tape 2 to the application surface 11 without the aforementioned transport roller 31 coming into contact with the adhesive 51 applied to the application surface 21.

[0063] Third Embodiment Next, a method for manufacturing a fiber-reinforced substrate according to a third embodiment of the present invention will be described. The method for manufacturing a fiber-reinforced substrate according to this embodiment differs from the second embodiment in that the adhesive 51 is caused to flow along the inclination of the substrate 1, thereby orienting the short fibers 62 in a fixed direction. In the following explanation, a detailed description of the similarities with the first and second embodiments will be omitted, and the explanation will focus on the differences.

[0064] The method for manufacturing a fiber-reinforced substrate in this embodiment involves tilting the substrate 1 with the surface to be attached 11 positioned on top, and causing the adhesive 51 to flow along the inclination of the substrate 1, thereby applying the adhesive 51 to the surface to be attached 11 so as to orient the short fibers 62 in the flow direction of the adhesive 51.

[0065] A more detailed description will be given below. The tape application device 100 used in the method for producing a fiber-reinforced substrate in this embodiment is provided with a tilting mechanism (not shown) that tilts the substrate table 12 that holds the substrate 1 to tilt the substrate 1. The substrate table 12 holds the substrate 1 with the surface to be bonded 11 facing upward, and a discharge unit 52 is positioned directly above the upper end of the surface to be bonded 11 of the substrate 1 when the substrate 1 is tilted by the tilting mechanism. The adhesive 51 discharged from the discharge unit 52 flows from the upper end to the lower end of the surface to be bonded 11 along the tilt of the substrate 1, thereby applying the adhesive 51 to the surface to be bonded 11. When the adhesive 51 is caused to flow in this way, the short fibers 62 are oriented in the flow direction of the adhesive 51.

[0066] In the application step of this embodiment, the substrate 1 is tilted in a predetermined direction by the tilting mechanism, and then the adhesive 51 is discharged from the discharge unit 52. This allows the adhesive 51 to flow in the predetermined direction, so that the adhesive 51 can be applied to the attachment surface 11 so that the short fibers 62 are oriented in the predetermined direction.

[0067] In the application step, the tilting mechanism is used to tilt the substrate 1 in the orientation direction of the fiber reinforcement 22 contained in the tape 2 to be applied to the application surface 11, and the adhesive 51 is then discharged from the discharge unit 52. This allows the adhesive 51 to flow in the orientation direction of the fiber reinforcement 22, so that the adhesive 51 can be applied to the application surface 21 so that the orientation direction of the fiber reinforcement 22 and the orientation direction of the short fibers 62 are approximately parallel.

[0068] Although the embodiments of the present invention have been described above in detail with reference to the drawings, the configurations and combinations thereof in each embodiment are merely examples, and additions, omissions, substitutions, and other modifications of the configurations are possible without departing from the spirit of the present invention. For example, in the above embodiment, the short fibers 62 are carbon fibers, but they may be glass fibers or aramid fibers, or may contain one or more of these fibers. Furthermore, the length of the short fibers 71 is not limited to 1 to 2 mm and can be changed as appropriate.

[0069] Furthermore, the tape application device used in the manufacturing method of the fiber-reinforced substrate in the above embodiment is not limited to the one shown in Fig. 1. For example, in the above embodiment, an example was described in which the pressure roller 41 presses the tape 2 against the application surface 11, but a pressure shoe or the like may also be used.

[0070] Furthermore, in the first embodiment, an example was described in which recesses were formed on the adhered surface 11 and the applying surface 21 in the unevenness forming step, but protrusions may also be formed. When protrusions are formed on each of the adhered surface 11 and the applying surface 21, the adhesive 51 hardens with the protrusions embedded in the adhesive 51, thereby improving the adhesive strength between the adhered surface 11 and the applying surface 21 and the adhesive 51 compared to when no protrusions are formed on each of the adhered surface 11 and the applying surface 21. Here, when the protrusions formed on each of the adhered surface 11 and the applying surface 21 embed into the adhesive 51 and the adhesive layer 51 hardens, some of the short fibers 62 contained in the adhesive 51 get caught in the protrusions. This makes it difficult for the adhesive 51 to peel off from the adhered surface 11 and the applying surface 21.

[0071] Furthermore, in the first embodiment, the unevenness may be formed only on one of the adhered surface 11 and the applying surface 21 in the unevenness forming step. Furthermore, in the first embodiment, the method for manufacturing a fiber-reinforced substrate does not need to include the unevenness forming step. That is, unevenness may not be formed on either the adhered surface 11 or the applying surface 21. Furthermore, although examples in which unevenness is not formed on either the adhered surface 11 or the applying surface 21 have been described in the second and third embodiments, unevenness may be formed. [Explanation of symbols]

[0072] 100 Tape application device 1 Base material 11. Surface to be attached 12 Base material stand 2 Tape 21 Attachment surface 22 Fiber reinforcement materials 23 Recess 3. Conveyor 31 Feeder 32 Conveyor roller 4. Attachment section 41 Pressure roller 42 Roller support part 43 Drive unit 5. Application section 51 Adhesive 52 Discharge part 53 Supply route 54 Discharge port 55 Slit 56 Holding part 61 Adhesive layer 62 Short Fiber 7 Articulated Robot 71 Arm 8 Tilt mechanism 81 Holding part 82 Articulated Robot

Claims

1. A method for manufacturing a fiber-reinforced substrate, comprising: attaching a tape containing a fiber reinforcement material to a surface of a substrate to be attached, to manufacture a reinforced substrate; an application step of applying an adhesive to at least one of the surface to be attached and an adhesive surface of the tape facing the surface to be attached; and a sticking step of sticking the tape to the surface to be stuck, The method for producing a fiber-reinforced substrate, wherein the adhesive contains short fibers.

2. 2. The method for producing a fiber-reinforced substrate according to claim 1, wherein the adhesive is applied in the application step so that the short fibers are oriented in a certain direction.

3. 3. The method for manufacturing a fiber-reinforced substrate according to claim 2, wherein in the application step, the adhesive is applied so that the orientation direction of the fiber reinforcement material contained in the tape and the orientation direction of the short fibers are approximately parallel to each other.

4. 4. The method for producing a fiber-reinforced substrate according to claim 2, wherein the application step includes a discharge step of discharging the adhesive from a discharge portion that discharges the adhesive so as to orient the short fibers in a certain direction.

5. 4. The method for manufacturing a fiber-reinforced substrate according to claim 2, wherein in the application step, the tape is tilted with the application surface facing upward, and the adhesive is caused to flow along the tilt of the tape.

6. 4. The method for manufacturing a fiber-reinforced substrate according to claim 2, wherein in the application step, the substrate is tilted with the attachment surface positioned on top, and the adhesive is caused to flow along the inclination of the substrate.

7. 4. The method for producing a fiber-reinforced substrate according to claim 1, wherein the short fibers are carbon fibers.

8. 4. The method for producing a fiber-reinforced substrate according to claim 1, further comprising a step of forming irregularities on at least one of the attachment surface and the attachment surface.

Citation Information

Patent Citations

  • Coating device and fiber bundle pasting device

    JP2022151326A