Image processing apparatus for semiconductor device, image processing method for semiconductor device, and verification method for semiconductor device

Abstract

To provide an image processor of a semiconductor device, an image processing method of the semiconductor device, and a collation method of the semiconductor device capable of individually recognizing the semiconductor device by a new method.SOLUTION: An image processing device EA of a semiconductor device includes reference image forming means 10 for forming a reference image SP by imaging a semiconductor device SD formed by dividing a base material BM, and reference image providing means 20 for providing the reference image SP to collation means 90 for collating a collation image VP of the semiconductor device SD imaged by collation image forming means 70 and provided via collation image providing means 80 with the reference image SP. The reference-image forming means 10 captures, as a unique feature, a singulation mark CT formed on an outer edge of the semiconductor device SD at the time of singulation of the base material BM to form the reference image SP.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an image processing device for a semiconductor device, an image processing method for a semiconductor device, and a verification method for a semiconductor device. [Background technology]

[0002] An image processing method for individually recognizing semiconductor devices is known (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-242973 Summary of the Invention [Problem to be solved by the invention]

[0004] Patent Document 1 discloses an image processing technique for individually recognizing semiconductor devices 100 (semiconductor devices) based on a mottled pattern, but in recent years, there has been a demand for image processing techniques for individually recognizing semiconductor devices using new methods.

[0005] An object of the present invention is to provide an image processing device and image processing method for a semiconductor device, and a semiconductor device verification method, which are capable of individually recognizing semiconductor devices by a new method. [Means for solving the problem]

[0006] The present invention employs the configurations described in the claims. [Effects of the Invention]

[0007] According to the present invention, the singulation marks formed on the outer edge of the semiconductor device when the base material is singulated are captured as unique features to form a reference image.Therefore, when individually recognizing a semiconductor device, the reference image is used as a reference image and compared with a match image, thereby enabling individual recognition of the semiconductor device using a new method. [Brief explanation of the drawings]

[0008] [Figure 1] 1A to 1I are explanatory diagrams of an image processing device of a semiconductor device according to one embodiment of the present invention and an explanatory diagram of the operation of the device, and FIGS. 1J to 1L are explanatory diagrams of a modified example according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In this embodiment, the X-axis, Y-axis, and Z-axis are orthogonal to each other, and the X-axis and Y-axis are axes within a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. Furthermore, in this embodiment, the view from the front in Fig. 1(A) parallel to the Y-axis is used as the reference, and when directions are indicated without specifying the figure, "up" is the direction of the Z-axis arrow, "down" is the opposite direction, "left" is the direction of the X-axis arrow, "right" is the opposite direction, "front" is the direction toward the front in Fig. 1(A) parallel to the Y-axis, and "rear" is the opposite direction.

[0010] The semiconductor device image processing device EA (hereinafter also simply referred to as "image processing device EA") which implements the semiconductor device image processing method of the present invention comprises a reference image forming means 10 which implements a reference image forming process of imaging a semiconductor device SD (see Figure 1(D)) formed by individualizing a base material BM to form a reference image SP (see Figure 1(E)), and a reference image providing means 20 which implements a reference image providing process of providing the reference image SP to a comparison means 90 which implements a comparison process of comparing a comparison image VP (see Figures 1(F) to (I)) of the semiconductor device SD which is imaged by a comparison image forming means 70 and provided via a comparison image providing means 80 with the reference image SP, and is arranged near the manufacturing equipment EA1 which manufactures the semiconductor device SD. In this embodiment, the base material BM is formed by laminating an adhesive sheet AS as a covering material onto a semiconductor wafer (hereinafter simply referred to as a "wafer") WF using manufacturing equipment EA1, and the semiconductor device SD is formed by laminating sheet pieces AS1 as covering material pieces formed by dicing the adhesive sheet AS onto semiconductor chips (hereinafter simply referred to as "chips") CP formed by dicing the wafer WF. The manufacturing equipment EA1 includes a lamination means 30 that performs a lamination process of laminating an adhesive sheet AS onto a wafer WF to form a base material BM, an energy application means 40 that performs an energy application process of applying heat HA as a predetermined energy to the adhesive sheet AS, and a singulation means 50 that performs a singulation process of cutting the base material BM to individualize the base material BM and form semiconductor devices SD, and is located near a moving means 60 that performs a moving process of moving the wafer WF. The adhesive sheet AS of this embodiment undergoes hardening as a change specific to the heat HA when heat HA is applied.

[0011] The reference image forming means 10 is equipped with a reference image forming device 11 such as a microscope camera or a CCD camera, and takes an image of one corner of each semiconductor device SD, i.e., any one of the four corners recognized when the semiconductor device SD in the state of Fig. 1(A) is viewed from above, at 300x magnification, thereby forming a reference image SP by capturing, as a unique feature, the cut marks CT (see Fig. 1(E)) that are singulation marks formed on the outer edge of the semiconductor device SD when the base material BM is singulated. Note that the reference image forming means 10 of this embodiment is configured to form the reference image SP by capturing, as a unique feature, the cut marks CT that are formed on the outer edge of the sheet piece AS1 when the base material BM is singulated.

[0012] The reference image providing means 20 includes a reference image providing device 21 such as a CCD (Charge Coupled Device) or a wireless video transmission device, and provides the reference image SP to the collation means 90 via a communication medium such as electricity or radio waves.

[0013] The lamination means 30 includes a base plate 31 that directly or indirectly supports the components that make up the lamination means 30, a support roller 32 that supports the raw roll RS on which the adhesive sheet AS is temporarily attached to a strip-shaped release sheet RL, a guide roller 33 that guides the raw roll RS, a release plate 34 that serves as a release means that folds the release sheet RL at a release edge 34A and releases the adhesive sheet AS from the release sheet RL, a pressure roller 35 that serves as a pressing means that presses the adhesive sheet AS against the wafer WF to laminate it, a drive roller 36 that is supported by an output shaft (not shown) of a rotary motor 36A that serves as a drive device and that pinches the release sheet RL between itself and a pinch roller 36B, and a recovery roller 37 that is supported by an output shaft (not shown) of the drive device and that constantly applies a predetermined tension to the release sheet RL that is between itself and the pinch roller 36B while the image processing device EA of the semiconductor device is automatically operating, and serves as a recovery means that recovers the release sheet RL.

[0014] The energy applying means 40 includes a hot air blower 41 as an energy applying device capable of applying heat HA.

[0015] The singulation means 50 includes two linear motors 51 as driving devices capable of moving each slider 51A in the forward and backward directions, linear motors 52 as driving devices supported by each slider 51A and capable of moving slider 52A in the left and right directions, a rotary linear motor 53 as a driving device supported by slider 52A and capable of rotating output shaft 53A and moving output shaft 53A in the up and down directions, a rotary motor 54 as a driving device supported by output shaft 53A and capable of rotating output shaft 54A, and a rotary cutter 55 as cutting means supported by output shaft 54A.

[0016] The moving means 60 includes a linear motor 61 as a driving device, and a support table 62 supported by a slider 61A of the linear motor 61 and having a support surface 62A that can be adsorbed and held by a pressure reduction means (holding means) not shown, such as a pressure reduction pump or a vacuum ejector.

[0017] The reference image forming means 70 is arranged near a processing device TA such as a bonding device or a printing device that performs a predetermined process on the semiconductor device SD transported from the manufacturing device EA1, and is equipped with a reference image forming device 71 such as a microscope camera or a CCD camera, and is configured to carry out a reference image forming process in which the semiconductor device SD is imaged and a reference image VP is formed. The reference image forming means 70 forms a reference image VP by capturing, at 300x magnification, all four corners of one semiconductor device SD, i.e., all four corners that are recognized when the semiconductor device SD in the state of Figure 1(A) is viewed from above. The reference image forming means 70 forms a reference image VP by capturing, as a unique feature, the cut marks CT that are formed on the outer edge of the semiconductor device SD when the base material BM is singulated. Note that, like the reference image forming means 10, the reference image forming means 70 of this embodiment forms a reference image VP by capturing, as a unique feature, the cut marks CT that are formed on the outer edge of the sheet piece AS1 when the base material BM is singulated.

[0018] The match image providing means 80 is equipped with a match image providing device 81 such as a CCD (Charge Coupled Device) or a wireless video transmission device, and is configured to carry out a match image providing process of providing the match image VP to the matching means 90 via a communication medium such as electricity or radio waves.

[0019] The matching means 90 is configured to match the reference image SP with the match image VP as a match source image when individually recognizing the semiconductor device SD. That is, the matching means 90 stores one or more reference images SP provided by the reference image providing means 20, matches the match image VP provided by the match image providing means 80 with the reference image SP, and includes a matching device 91 that checks whether or not an image matching the match image VP exists among the stored reference images SP. The matching device 91 can be, for example, an image processing system or computer that performs pattern matching, alignment, measurement, calibration, and analysis between the reference image SP and the matching image VP, and when it confirms that there is a reference image SP that matches the matching image VP, it outputs a match signal to the processing device TA via a communication medium, and when it confirms that there is no image in the stored reference images SP that matches the matching image VP, it outputs a mismatch signal to the processing device TA via the communication medium.

[0020] The operations of the image processing apparatus EA and the manufacturing apparatus EA1 will now be described. First, a user (hereinafter simply referred to as "user") of the image processing apparatus EA and manufacturing apparatus EA1, with each component positioned in the initial position indicated by the solid lines in FIG. 1(A), sets the web RS as shown in the figure, and then inputs a signal to start automatic operation via an operation means (not shown), such as an operation panel or a personal computer. The laminating means 30 then drives the rotation motor 36A to pay out the web RS. As shown in FIG. 1(A), when the leading edge of the leading adhesive sheet AS in the payout direction is peeled off a predetermined length from the release sheet RL at the folded portion of the release sheet RL folded back by the peeling edge 34A of the peeling plate 34, the rotation motor 36A is stopped. Next, the user or a transport means (not shown), such as an articulated robot or belt conveyor, places the wafer WF in a predetermined orientation on the support table 62 at a predetermined position, as shown in FIG. 1(A). The moving means 60 then drives the pressure-reducing means (not shown), and begins suction and holding the wafer WF on the support surface 62A.

[0021] Thereafter, the moving means 60 drives the linear motor 61 to move the wafer WF supported by the support table 62 to the left, and when the wafer WF reaches a predetermined position relative to the laminating means 30, the laminating means 30 drives the rotation motor 36A to pay out the raw web RS in accordance with the movement speed of the wafer WF. As a result, the adhesive sheet AS is peeled off from the release sheet RL at the folded portion of the release sheet RL and is pressed by the pressure roller 35 to be laminated on the wafer WF, as shown by the two-dot chain line in FIG. 1(A), thereby forming the base material BM. Next, after the entire leading adhesive sheet AS is laminated on the wafer WF to form the base material BM, the leading end of the next adhesive sheet AS following the leading adhesive sheet AS in the payout direction is peeled off a predetermined length from the release sheet RL at the folded portion of the release sheet RL, and the laminating means 30 stops driving the rotation motor 36A.

[0022] Then, when the base material BM being transported by the moving means 60 reaches just before the hot air blowing area of ​​the energy applying means 40, the energy applying means 40 drives the hot air blower 41 to emit heat HA. Next, as shown by the two-dot chain line in Figure 1(A), as the base material BM passes through the hot air blowing area, the adhesive sheet AS hardens, and when the entire base material BM has passed through the hot air blowing area, the energy applying means 40 stops driving the hot air blower 41.

[0023] Thereafter, when the base material BM being conveyed by the moving means 60 reaches the cutting position AP of the singulating means 50, indicated by the two-dot chain line in FIG. 1A, the moving means 60 stops driving the linear motor 61. Next, the singulating means 50 drives the linear motors 51 and 52, the rotary motor 53, and the rotary motor 54 to cut the base material BM along the cut lines CL shown in FIG. 1B. As shown in FIG. 1C, the base material BM is singulated, forming chips CP from the wafer WF and sheet pieces AS1 from the adhesive sheet AS, thereby forming semiconductor devices SD in which the sheet pieces AS1 are stacked on the chips CP. At this time, the rotary cutter 55 rubs against each sheet piece AS1 to form an outer edge, and individual cut marks CT due to chips, cracks, stretching, etc. are formed on the outer edge, as shown in FIGS. 1E to 1I.

[0024] Then, when cutting along the cut line CL is completed, the singulation means 50 stops driving the rotary motor 54 and then drives the linear motors 51 and 52 and the rotary linear motor 53 to return the rotary cutter 55 to its initial position. Next, the movement means 60 drives the linear motor 61 to move the support table 62 leftward. When the support table 62 reaches the imaging position RP of the reference image forming device 11, indicated by the two-dot chain line in FIG. 1A, the movement means 60 stops driving the linear motor 61. Thereafter, the reference image forming means 10 drives the reference image forming device 11 to image one corner of each sheet piece AS1 at 300x magnification to form a reference image SP (see FIG. 1E). The reference image providing means 20 then drives the reference image providing device 21 to provide the reference image SP to the verification means 90. Next, the verification means 90 drives the verification device 91 to store the reference image SP provided by the reference image providing device 21.

[0025] Then, when the collation device 91 stores the reference images SP (40 reference images SP in this embodiment) corresponding to all the semiconductor devices SD formed from one base material BM, the moving means 60 stops driving the pressure reducing means (not shown) and releases the suction hold on the support surface 62A. Next, a user or a transport means (not shown) holds the semiconductor device SD and transports the semiconductor device SD to the processing device TA, and when all the semiconductor devices SD and parts other than the semiconductor device SD have been transported from the support surface 62A, the moving means 60 drives the linear motor 61 to return the support table 62 to its initial position, and the same operations as those described above are repeated thereafter.

[0026] In the processing device TA to which the semiconductor device SD has been transported as described above, before performing a predetermined process, the collation image forming means 70 drives the collation image forming device 71 to take images of four corners of each sheet piece AS1 at 300x magnification and form four collation images VP (see FIGS. 1(F)-(I)). After that, the collation image providing means 80 drives the collation image providing device 81 to provide the collation image VP to the collation means 90. In this embodiment, of the four collation images VP, FIG. 1(H) matches FIG. 1(E). Thereafter, the collation means 90 drives the collation device 91 and stores the collation image VP provided by the collation image providing device 81. The collation means 90 compares the just-stored collation image VP with the previously stored reference image SP to determine whether or not an image matching the collation image VP exists in the reference image SP.

[0027] Here, as a result of the comparison by the comparison device 91, if it is confirmed that there is an image (the image of Figure 1 (E) in this embodiment) that matches the comparison image VP among the previously stored reference images SP, the comparison device 91 outputs a match signal to the processing device TA. Next, the processing device TA, which has received the match signal from the comparison device 91, recognizes that the semiconductor device SD that was the subject of the image of the comparison image VP that has been confirmed to match is an appropriate product to be processed, such as an expected product or a genuine product, and performs normal processing on the semiconductor device SD. In other words, if the processing device EA is, for example, a bonding device, the processing device EA stacks the semiconductor device SD on a substrate or the like. Also, if the processing device EA is, for example, a printing device, the processing device EA performs predetermined printing on the semiconductor device SD.

[0028] On the other hand, if the result of the comparison by the comparison device 91 is that an image matching the comparison image VP (the image in FIG. 1(E) in this embodiment) is not found to exist among the previously stored reference images SP, the comparison device 91 outputs a mismatch signal to the processing device TA. The processing device TA, which has received the mismatch signal from the comparison device 91, recognizes that the semiconductor device SD that was the subject of the image of the comparison image VP for which no match was found to exist is an unsuitable product for processing, such as an unexpected product or an irregular product, and performs operations such as not performing normal processing on the semiconductor device SD or removing the semiconductor device SD from the processing device TA.

[0029] According to the above-described embodiment, the cut marks CT formed on the outer edge of the semiconductor device SD when the base material BM is singulated are captured as unique features to form a reference image SP. Therefore, when individually recognizing the semiconductor device SD, the reference image SP is used as a reference image to compare with the comparison image VP, thereby enabling individual recognition of the semiconductor device SD using a new method.

[0030] The means and steps of the present invention are not limited in any way as long as they can perform the operations, functions, or steps described for those means and steps, and are in no way limited to the components and steps of a single embodiment shown in the above embodiment. For example, the reference image providing means may be anything that can provide a reference image to a verification means that verifies a verification image of the semiconductor device captured by a verification image forming means and provided via the verification image providing means with the reference image, and is not limited in any way as long as it is within the scope of the common general technical knowledge at the time of filing (the same applies to other means and steps).

[0031] The reference image forming means 10 may be disposed inside or outside the manufacturing apparatus EA1, or may form a reference image SP by capturing, as a unique feature, cut marks CT formed on the outer edges of the semiconductor chips CP when the base material is singulated, as shown in FIG. 1(J), or may form a reference image SP by capturing, as a unique feature, cut marks CT (see FIGS. 1(K) and 1(L)) formed on the outer edges of both the semiconductor chips CP and the sheet pieces AS1 when the base material is singulated, or may image one corner of one semiconductor device SD to form one or more reference images SP, or may form a reference image SP by capturing, as shown in FIG. 1(J), cut marks CT formed on the outer edges of both the semiconductor chips CP and the sheet pieces AS1 when the base material is singulated, as unique features A plurality of corners of the semiconductor device SD may be imaged to form one or more reference images SP, or, for example, a position other than a corner of a side or face of the semiconductor device SD may be imaged to form one or more reference images SP, or a position other than a corner of one semiconductor device SD may be imaged to form one or more reference images SP, or a plurality of positions other than corners of one semiconductor device SD may be imaged to form one or more reference images SP, or one image may be imaged once for one semiconductor device SD to form one or more reference images SP, or multiple images may be imaged for one semiconductor device SD to form one or more reference images SP, the number of times imaging is performed for one semiconductor device SD and the number of reference images SP formed for one semiconductor device SD may be the same or different, or the semiconductor device SD may be imaged at a magnification of 2x, 1000x, etc., or at a reduced magnification of 1 / 2x, 1 / 15x, etc., or at the same magnification to form a reference image SP, or the reference image SP may be formed by imaging the semiconductor device SD at the same magnification as or a different magnification than that at which the verification image forming device 71 images the semiconductor device SD A quasi-image SP may be formed, or the reference image SP may be formed by capturing information such as the manufacturing number, serial number, model number, type, name, dimensions, and weight recorded on the semiconductor device SD, or the reference image SP may be formed by capturing an image of the semiconductor device SD in the state of FIG. 1(A) from above, diagonally above, below, diagonally below, left, diagonally left, right, diagonally right, front, diagonally forward, rear, or diagonally rear, or the reference image SP may be formed by capturing an image of the entire semiconductor device SD, or, for example, when the semiconductor device SD is a triangle or a pentagon or more, three or five or more corners,The reference image SP may be formed by imaging a position other than three or five or more corners, or, for example, if the semiconductor device SD is triangular, quadrangular, or pentagonal or more, the reference image SP may be formed by imaging one corner or a position other than the corners, or the reference image SP may be formed by imaging multiple corners or positions other than the corners. As long as the singulation marks formed on the outer edge of the semiconductor device SD when the base material BM is singulated can be regarded as unique features and the reference image SP can be formed by imaging any position on the outer edge of the semiconductor device SD in any way, or the reference image forming device 11 may be moved or stopped while the semiconductor device SD is moving or stopped, and the semiconductor device SD may be imaged to form the reference image SP. The reference image forming device 11 may be equivalent to the collation image forming device 71, may have the same functions as the collation image forming device 71, may not be equivalent to the collation image forming device 71, or may not have the same functions as the collation image forming device 71, and may be any device, such as an infrared camera, an ultraviolet camera, an ultrasonic camera, an X-ray camera, an optical sensor, an ultrasonic sensor, an area sensor, a line sensor, etc.

[0032] The reference image providing means 20 may be located inside or outside the manufacturing apparatus EA1, may be configured integrally with the reference image forming means 10, may be incorporated into the reference image forming means 10, may be configured as a function of the reference image forming means 10, or may be configured separately from the reference image forming means 10. The reference image providing device 21 may be equivalent to the collation image providing device 81, may have the same functions as the collation image providing device 81, may not be equivalent to the collation image providing device 81, or may not have the same functions as the collation image providing device 81, and if the reference image forming device 11 forms multiple reference images SP for one semiconductor device SD, it may provide one of them, some but not all of them, or all of them to the collation means 90.

[0033] The laminating means 30 may form a closed-loop slit or a slit extending over the entire short width direction in a strip-shaped adhesive sheet base material temporarily attached to a strip-shaped release sheet RL, so that a predetermined area partitioned by the slit becomes the adhesive sheet AS, and peel the adhesive sheet AS from the raw roll RS and laminate it on the wafer WF; alternatively, a strip-shaped adhesive sheet base material in which a strip-shaped adhesive sheet base material is temporarily attached to a strip-shaped release sheet RL is employed, and while the strip-shaped adhesive sheet base material is being unwound, a cutting blade is used as cutting means to form a closed-loop slit or a slit extending over the entire short width direction in the adhesive sheet base material, so that the adhesive sheet AS is peeled from the raw roll RS in which a predetermined area partitioned by the slit becomes the adhesive sheet AS, and laminate it on the wafer WF; alternatively, the strip-shaped adhesive sheet AS may be peeled from the raw roll RS in which a strip-shaped adhesive sheet AS is temporarily attached to a strip-shaped release sheet RL, and laminate it on the wafer WF; or, when laminating the adhesive sheet AS on the wafer WF, a predetermined tension is applied to the adhesive sheet AS by controlling the speed and tension of the unwound roll RS. Alternatively, the adhesive sheet AS may be peeled off from, for example, a fan-folded original roll RS without being rolled up and laminated on the wafer WF, or a pressing means may be employed which is supported by the output shaft of a linear motor as a driving device and which holds the adhesive sheet AS with a holding member capable of suction and holding by a pressure reducing means (not shown) such as a pressure reducing pump or a vacuum ejector, and which presses the adhesive sheet AS held by the holding member onto the wafer WF to laminate it, or a recovery means may be employed which recovers the release sheet RL without rolling up, for example, by fan-folding it, by shredding it with a shredder or by piling it up randomly, or no recovery means may be employed, or the adhesive sheet AS may be laminated on the wafer WF by moving the base plate 31 without moving the wafer WF or while moving the wafer WF, or an adhesive sheet AS that is not temporarily attached to the release sheet RL may be employed. The laminating means 30 may laminate a coating material on one side of the wafer WF, or may laminate a coating material on both one side and the other side, or may laminate a coating material on a portion of one side of the wafer WF as shown in Figure 1(B), or on the entirety of one side of the wafer WF, or on all or part of all sides of the wafer WF, and may or may not be provided in the image processing device EA or manufacturing device EA1 of the present invention.

[0034] The energy application means 40 may be provided at a location other than that shown in the above embodiment, and may be provided at any location as long as it is capable of applying a predetermined energy to the coating material. The predetermined energy may be applied to the coating material by moving or stopping the energy application device while the base material BM is moving or stopped, or the predetermined energy may be applied to the entire coating material or a part of the coating material. Any type of energy application device may be used as the predetermined energy, such as one that applies electromagnetic waves such as ultraviolet rays, infrared rays, visible light, sound waves, X-rays, or gamma rays, one that applies a heating medium such as hot water or hot air, or one that applies a cooling medium such as cold water or cold air. Any device may be used as long as it is capable of causing a change specific to the energy in the coating material, taking into account the characteristics, properties, properties, material, composition, and configuration of the coating material, and it may or may not be provided in the image processing device EA or manufacturing device EA1 of the present invention.

[0035] The singulation means 50 may employ an articulated robot as a driving device in place of at least one of the linear motors 51, 52, the rotary linear motor 53 and the rotary motor 54, and may form semiconductor devices SD in the shape of circles, ellipses, polygons such as triangles and rectangles, or other shapes, and may or may not be provided in the image processing device EA or manufacturing device EA1 of the present invention. The singulation means 50 may, for example, change the properties or characteristics of the base material BM to form a brittle layer, and then apply an external force to the base material BM to break it, thereby singulating the base material BM.In this case, the reference image forming means 10 and the collation image forming device 71 may form the reference image SP and the collation image VP by capturing the cleavage marks, which are singulation marks formed on the outer edge of the semiconductor device SD when the base material BM is singulated, as unique features. The singulation means 50 may, for example, singulate the base material BM by etching the base material BM, and in this case, the reference image forming means 10 and the collation image forming device 71 may form the reference image SP and the collation image VP by capturing the etching marks, which are singulation marks formed on the outer edge of the semiconductor device SD when the base material BM is singulated, as unique features.

[0036] The moving means 60 may employ a support table 62 that cannot be held by suction on the support surface 62A, and may or may not be provided in the image processing apparatus EA or manufacturing apparatus EA1 of the present invention.

[0037] The reference image forming means 70 may be disposed inside or outside the processing device TA or the manufacturing device EA1, and may form the reference image VP after a predetermined process is performed in the processing device TA or simultaneously with the predetermined process being performed in the processing device TA, or may form the reference image VP by taking as a unique feature the cut marks CT formed on the outer edges of the semiconductor chips CP when the base material is singulated, as shown in FIG. 1(J), or may form the reference image VP by taking as a unique feature the cut marks CT (see FIGS. 1(K) and 1(L)) formed on the outer edges of both the semiconductor chips CP and the sheet pieces AS1 when the base material is singulated. Alternatively, one corner of one semiconductor device SD may be imaged to form one or more check images VP, or multiple corners of one semiconductor device SD may be imaged to form one or more check images VP, or, for example, a position other than a corner on a side or face of the semiconductor device SD may be imaged to form one or more check images VP, or a position other than one corner of one semiconductor device SD may be imaged to form one or more check images VP, or multiple positions other than corners of one semiconductor device SD may be imaged to form one or more check images VP. Alternatively, one or more reference images VP may be formed by imaging one semiconductor device SD once, or one or more reference images VP may be formed by imaging one semiconductor device SD multiple times, the number of times imaging is performed for one semiconductor device SD may be the same as or different from the number of reference images VP formed for one semiconductor device SD, the semiconductor device SD may be imaged at 2x magnification, 1000x magnification, etc., or at 1 / 2x magnification, 1 / 15x magnification, etc., or at the same magnification to form the reference image VP, or the reference image forming device 1 may be imaged at 2x magnification, 1000x magnification, etc., or at the same magnification to form the reference image VP, or the reference image forming device 1 may be imaged at 2x magnification, 1 / 15 ... The comparison image VP may be formed by imaging the semiconductor device SD at the same magnification as or a different magnification than that at which the semiconductor device SD is imaged by the imager 1, or the comparison image VP may be formed by imaging written information such as the manufacturing number, serial number, model number, type, name, dimensions, weight, etc., written on the semiconductor device SD, or the comparison image VP may be formed by imaging the semiconductor device SD in the state of FIG. 1(A) from above, diagonally above, below, diagonally below, left, diagonally left, right, diagonally right, front, diagonally forward, rear, or diagonally rear, or the comparison image VP may be formed by imaging the entire semiconductor device SD, or, for example,If the semiconductor device SD is triangular or has a pentagonal shape, the match image VP may be formed by imaging three or five or more corners or a position other than three or five or more corners. For example, if the semiconductor device SD is triangular, quadrangular, or has a pentagonal shape, the match image VP may be formed by imaging one corner or a position other than a corner, or the match image VP may be formed by imaging multiple corners or positions other than corners. As long as the match image VP can be formed by capturing the singulation marks formed on the outer edge of the semiconductor device SD when the base material BM is singulated as a unique feature, any position on the outer edge of the semiconductor device SD may be imaged in any way. The match image forming device 71 may be moved or stopped while the semiconductor device SD is moving or stopped, and the semiconductor device SD may be imaged to form the match image VP. This may or may not be provided in the image processing device EA or manufacturing device EA1 of the present invention. The comparison image forming device 71 may be equivalent to the reference image forming device 11, may have the same functions as the reference image forming device 11, may not be equivalent to the reference image forming device 11, or may not have the same functions as the reference image forming device 11, and may be any device, such as an infrared camera, an ultraviolet camera, an ultrasonic camera, an X-ray camera, an optical sensor, an ultrasonic sensor, an area sensor, a line sensor, etc.

[0038] The match image providing means 80 may be located inside or outside the processing device TA, and may provide the match image VP to the matching means 90 after performing a predetermined processing in the processing device TA or at the same time as performing a predetermined processing in the processing device TA, or may be configured integrally with the match image forming means 70, or may be incorporated into the match image forming means 70, or may be configured as a function of the match image forming means 70, or may be configured separately from the match image forming means 70. The collation image providing device 81 may be equivalent to the reference image providing device 21, may have functions equivalent to the reference image providing device 21, may not be equivalent to the reference image providing device 21, or may not have functions equivalent to the reference image providing device 21, and if the collation image forming device 71 forms multiple collation images VP for one semiconductor device SD, it may provide one of them, some but not all of them, or all of them to the collation means 90.

[0039] The comparison means 90 may be located inside or outside the manufacturing equipment EA1 or the processing equipment TA, and may compare the comparison image VP with the reference image SP after a predetermined process has been performed in the processing equipment TA, or at the same time as the predetermined process is performed in the processing equipment TA. The comparison device 91 may be, for example, an image processing system, an appearance inspection device, an AI-based judgment device, or any other device that can compare the comparison image VP with the reference image SP. It may be configured independently, shared with other devices, or configured as part of other devices, or may be configured as a so-called host computer that controls other devices and factory equipment collectively, or may be configured as part or a function of a host computer. It may be integrally configured with at least one of the reference image forming means 10, the reference image providing means 20, the collation image forming means 70 or the collation image providing means 80, or it may be incorporated into at least one of the reference image forming means 10, the reference image providing means 20, the collation image forming means 70 or the collation image providing means 80, or it may be configured as a function of at least one of the reference image forming means 10, the reference image providing means 20, the collation image forming means 70 or the collation image providing means 80, or it may be configured separately from the reference image forming means 10, the reference image providing means 20, the collation image forming means 70 or the collation image providing means 80, and it may or may not be included in the image processing device EA or manufacturing device EA1 of the present invention. When the matching device 91 determines, as a result of the matching, that there is no image in the stored reference image SP that matches the match image VP, it may output a mismatch signal via a communication medium to an alarm means such as a monitor, lamp, or buzzer to notify the user that a match was not confirmed by the matching, or the condition for a match may be that the entire reference image SP matches the entire match image VP, or that a part of the reference image SP matches the entire match image VP, or that a part of the reference image SP matches the entire match image VP, or that a part of the reference image SP matches the entire match image VP, or that a mismatch is a mismatch between the entire reference image SP and the entire match image VP, or that a mismatch is a mismatch between a part of the reference image SP and a part of the match image VP, or that a mismatch is a mismatch between the entire reference image SP and the entire match image VP, or that a mismatch is a mismatch between a part of the reference image SP and a part of the match image VP, or that a mismatch is a mismatch between the entire reference image SP and the entire match image VP. The comparison device 91 may output only a match signal or only a mismatch signal to the processing device TA or the warning means. When the comparison device 91 outputs only a match signal, for example, the processing device TA may not perform normal processing for a semiconductor device SD that did not receive a match signal, or the warning means may be activated to notify the user. When the comparison device 91 outputs only a mismatch signal, for example, the processing device TA may perform normal processing for a semiconductor device SD that did not receive a mismatch signal, or the warning means may not be activated.

[0040] The processing device TA may be any device, such as a cleaning device, etching device, immersion device, cutting device, oxide film forming device, nitriding device, grinding device, sandblasting device, polishing device, painting device, laminating device, sheet bonding device, surface treatment device, drilling device, bending device, inspection device, verification device, irradiation device, plating device, etc., and may change the content or type of the specified processing to be performed on the semiconductor device SD based on the results of the comparison by the comparison means 90. It may be directly or indirectly connected to the manufacturing device EA1, or may be located in the same building, the same premises or a different building as the image processing device EA without being connected to the manufacturing device EA1, or may be located in the building or premises to which the semiconductor device SD is shipped, and may or may not be included in the image processing device EA or manufacturing device EA1 of the present invention.

[0041] The image processing device EA and the manufacturing device EA1 may be provided with a marking means for marking the imaging position on the semiconductor device SD imaged by the reference image forming means 10 or the vicinity of the imaging position so that the imaging position imaged by the reference image forming means 10 can also be imaged by the collation image forming means 70. As such a marking means, for example, a laser irradiation machine, a laser printing machine, an inkjet printer, a letterpress printing machine, an intaglio printing machine, a lithographic printing machine, a silk printing machine, a screen printing machine, a thermal printing machine, a thermal transfer printing machine, a dot impact printing machine, an adhesive tape application machine, etc. may be adopted.

[0042] The base material BM may have a covering material laminated on both one side and the other side of the wafer WF, or may be only the wafer WF without a covering material laminated thereon, or may be supported on a separate adhesive sheet different from the adhesive sheet AS, or may be supported on a separate adhesive sheet which is in turn supported on a ring frame. Note that when the base material BM is supported on a separate adhesive sheet, an expanding means may be employed which performs an expanding step of applying tension to the separate sheet to widen the spacing between the semiconductor devices SD when the reference image forming means 10 images the semiconductor devices SD. The semiconductor device SD may have pieces of coating material laminated on both one side and the other side, may be only a chip CP without pieces of coating material laminated thereon, may be 40 or less or 40 or more formed from one base material BM, or may be only one formed from one base material BM. Note that when the base material BM is supported on another adhesive sheet, a singulation means 50 may be employed that applies tension to the other sheet to cut the base material BM, thereby singulating the base material BM and forming the semiconductor devices SD. The wafer WF may have an orientation mark such as an orientation flat or V-notch to indicate the orientation, or it may not have an orientation mark, and it may have a circuit formed on at least one of its one surface and the other surface, or it may have no circuit formed on either its one surface or the other surface. The covering material and covering piece may be any material capable of covering the wafer WF or chip CP, such as an adhesive sheet, adhesive tape, adhesive tape, glue, pressure sensitive adhesive, resin material, rubber material, metal material, solder, wax, varnish, etc., and may be a solid substance, a liquid substance, or a gel substance. The change that the coating material undergoes in response to a predetermined energy may be any change, such as hardening, softening, shrinking, expanding, vaporizing, liquefying, solidifying, discoloring, oxidation, penetration, settling, loss of adhesive strength, or increase in adhesive strength. The coating material may be larger, smaller, or the same size as the wafer WF, may not undergo changes specific to the application of a specified energy, and may not be stacked on the wafer WF. The singulation marks may be formed only on the outer edge of the covering material, or only on the outer edge of the chip CP, or on the outer edges of both the covering material and the chip CP, or may be singulation marks that appear on one or more of the front, back, left, or right surfaces of the semiconductor device SD in the state shown in Figure 1(A), or may be cut marks CT, fracture marks, etching marks, tear marks, bending marks, etc., that are formed on the outer edge of the semiconductor device SD when the base material BM is singulated, as long as it allows individual identification of the semiconductor device SD. The reference image SP or the match image VP shown in FIGS. 1(E) to 1(I) are merely examples, and the present invention is not limited to these.

[0043] The base material BM, semiconductor device SD, wafer WF, chip CP, and covering material in the present invention are not particularly limited in terms of material, type, shape, etc. For example, the base material BM, semiconductor device SD, wafer WF, chip CP, and covering material may be circular, elliptical, polygonal such as triangular or rectangular, or other shapes, and the covering material may be pressure-sensitive adhesive, heat-sensitive adhesive, or other adhesive type. When a heat-sensitive adhesive covering material is used, the covering material may be laminated in an appropriate manner, for example, by providing a heating means such as a coil heater or the heating side of a heat pipe that heats the covering material. Furthermore, such covering materials may be of any type, such as a single layer consisting of only an adhesive layer, a two-layer structure consisting of a substrate and an adhesive layer laminated together, a three-layer structure or more consisting of a substrate and an adhesive layer with one or more intermediate layers laminated between them, a three-layer structure or more consisting of a substrate with one or more cover layers laminated on the top surface of the substrate, a structure in which the substrate, intermediate layer, or cover layer are releasably provided, a double-sided adhesive sheet consisting of only a single layer consisting of an adhesive layer, a double-sided adhesive sheet in which adhesive layers are laminated on both outermost surfaces of one or more intermediate layers, etc. Furthermore, the semiconductor wafer WF may be any semiconductor wafer, such as a silicon semiconductor wafer, a compound semiconductor wafer, or a diamond semiconductor wafer. The adhesive sheet AS may also be any sheet, film, tape, etc., such as an information label, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, or a recording layer-forming resin sheet.

[0044] The driving equipment in the above embodiments may be electric equipment such as rotary motors, linear motors, single-axis robots, so-called articulated robots with joints on two or three or more axes, actuators such as air cylinders, hydraulic cylinders, rodless cylinders and rotary cylinders, which may be used alone, or may be a direct or indirect combination of such electric equipment and actuators, or may be electric equipment, actuators, etc. that are capable of torque control, speed control, etc. for the output parts of such electric equipment, actuators, etc., or may not be capable of torque control, speed control, etc.

[0045] In the above embodiment, some object (hereinafter referred to as "object A") and an object (hereinafter referred to as "object B") that moves relative to object A, i.e., object A and object B that move relatively, object B may move relative to object A, which is not moving, object A may move relative to object B, which is not moving, or both object A and object B may move. As long as the result achieved by the movement is the same, either object A or object B may move. When a rotating member such as a roller is used, a driving device that rotates the rotating member may be provided. The surface of the rotating member or the rotating member itself may be made of a deformable member such as rubber or resin, or the surface of the rotating member or the rotating member itself may be made of a non-deformable member. Other members such as a rotating or non-rotating shaft or blade may be used instead of the roller. When a pressing means or pressing member such as a pressing roller or a pressing head that presses an object to be pressed is used, rollers, round rods, blade materials, brush-like members, or members that spray air or gas may be used instead of or in combination with the above-mentioned examples. The peeling means may be made of a deformable material such as rubber, resin, sponge, etc., or may be made of a non-deformable material such as metal or glass. When peeling means or peeling members such as peeling plates or peeling rollers are used to peel the material to be peeled, members such as plate-shaped members, round rods, rollers, etc. may be used instead of or in combination with the above examples. The peeling means may be made of a deformable material such as rubber or resin, or may be made of a non-deformable material. When supporting (holding) means or supporting (holding) members are used to support (hold) the supported member (held member), In this case, a configuration may be adopted in which the supported member is supported (held) by gripping means such as a chuck motor or chuck cylinder, Coulomb force, adhesive (adhesive sheet, adhesive tape), pressure sensitive adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli suction, suction, driving equipment, etc., or when a cutting means or cutting member that cuts the member to be cut or forms an incision or cutting line in the member to be cut is used, cutting means that cut by a cutter blade, laser cutter, ion beam, fire, heat, water pressure, an electric heating wire, spraying of gas or liquid, etc., may be used instead of or in combination with the above examples,It is also possible to move the cutting object by combining appropriate driving devices. [Explanation of symbols]

[0046] EA: Image processing device for semiconductor devices 10...Reference image forming means 20...Reference image provision means 70... Matching image forming means 80...Means for providing matching images 90...Means of matching AS...Adhesive sheet (covering material) AS1...Sheet piece (covering material piece) BM…Base material CP: semiconductor chip CT…cutting marks (singularization marks) SD: Semiconductor device SP: Reference image VP...matching image WF: Semiconductor wafer

Claims

1. a reference image forming means for forming a reference image by imaging a semiconductor device formed by dividing the base material; an image processing device for a semiconductor device, comprising: a reference image providing means for providing a reference image to a verification means for verifying a verification image of the semiconductor device, the verification image being captured by a verification image forming means and provided via a verification image providing means, against the reference image; The image processing device for semiconductor devices, characterized in that the reference image forming means forms the reference image by capturing singulation marks formed on the outer edge of the semiconductor device when the base material is singulated as unique features.

2. The base material is a semiconductor wafer on which a coating material is laminated, The semiconductor device is formed by laminating a covering material piece formed by dividing the covering material onto a semiconductor chip formed by dividing the semiconductor wafer, The image processing device for a semiconductor device according to claim 1, characterized in that the reference image forming means forms the reference image by capturing the singulation marks formed on at least one of the outer edges of the semiconductor chip and the outer edges of the coating material piece when the base material is singulated as unique features.

3. a reference image forming step of forming a reference image by imaging a semiconductor device formed by dividing the base material; a reference image providing step of providing a reference image to a verification means that verifies a verification image of the semiconductor device, the verification image being captured in a verification image forming step and provided through a verification image providing step, against the reference image, An image processing method for a semiconductor device, characterized in that in the reference image formation process, the reference image is formed by capturing the singulation marks formed on the outer edge of the semiconductor device when the base material is singulated as unique features.

4. a reference image forming step of forming a reference image by imaging a semiconductor device formed by dividing the base material; a reference image providing step of providing the reference image to a matching means; a reference image forming step of imaging the semiconductor device to form a reference image; a comparison image providing step of providing the comparison image to the comparison means; a comparison step of comparing the reference image provided to the comparison means with the comparison image, A semiconductor device verification method characterized in that in the reference image formation process and the verification image formation process, the reference image and verification image are formed by capturing the dicing marks formed on the outer edge of the semiconductor device when the base material is diced as unique features.

Images