Semiconductor device processing apparatus and semiconductor device processing method

Abstract

To provide a processing device of a semiconductor device and a processing method of the semiconductor device capable of performing individual recognition of the semiconductor device by a new method and performing predetermined processing to the semiconductor device.SOLUTION: A collation image providing unit 20 configured to provide a collation image VP to a collation unit A0 configured to collate the collation image VP with a reference image SP of the device SD imaged by a reference image forming unit 80 and provided via a reference image providing unit 90, and a processing unit 30 configured to perform predetermined processing on the device SD which is an imaging target of the collation image VP of which matching with the reference image SP is confirmed by collation by the collation unit A0. The comparison-image forming means 10 and the reference-image forming means 80 form the comparison image VP and the reference image SP by capturing, as a unique feature, the singulation mark CT formed at the outer edge of the semiconductor device SD when the base material BM is singulated.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing device for a semiconductor device and a processing method for a semiconductor device. [Background technology]

[0002] There is known a technique for individually recognizing a semiconductor device and performing a predetermined process (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-242973 Summary of the Invention [Problem to be solved by the invention]

[0004] Patent document 1 discloses a technology for individually recognizing semiconductor devices 100 (semiconductor devices) by using a mottled pattern and then performing a predetermined process, but in recent years there has been a demand for a technology for individually recognizing semiconductor devices using a new method and performing a predetermined process.

[0005] An object of the present invention is to provide a semiconductor device processing apparatus and a semiconductor device processing method that can individually recognize a semiconductor device by a new method and perform predetermined processing on the semiconductor device. [Means for solving the problem]

[0006] The present invention employs the configurations described in the claims. [Effects of the Invention]

[0007] According to the present invention, the singulation marks formed on the outer edge of the semiconductor device when the base material is singulated can be captured as unique features to form a reference image and a match image, and these reference images can be matched with the match image, thereby enabling individual recognition of semiconductor devices using a new method and performing specified processing on the semiconductor device. [Brief explanation of the drawings]

[0008] [Figure 1] 1A to 1I are explanatory diagrams of a processing apparatus for semiconductor devices according to an embodiment of the present invention and an explanatory diagram of the operation of the apparatus, and FIGS. 1J to 1L are explanatory diagrams of modified examples according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In this embodiment, the X-axis, Y-axis, and Z-axis are orthogonal to each other, and the X-axis and Y-axis are axes within a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. Furthermore, in this embodiment, the view from the front in Fig. 1(A) parallel to the Y-axis is used as the reference, and when directions are indicated without specifying the figure, "up" is the direction of the Z-axis arrow, "down" is the opposite direction, "left" is the direction of the X-axis arrow, "right" is the opposite direction, "front" is the direction toward the front in Fig. 1(A) parallel to the Y-axis, and "rear" is the opposite direction.

[0010] The semiconductor device processing device EA (hereinafter also simply referred to as "processing device EA") that implements the semiconductor device processing method of the present invention comprises a match image forming means 10 that performs a match image formation process of imaging a semiconductor device SD (see Figure 1(D)) formed by individualizing a base material BM to form a match image VP (see Figures 1(F) to (I)), a match image providing means 20 that performs a match image providing process that provides the match image VP to a matching means A0 that performs a matching process of comparing the match image VP with a reference image SP (see Figure 1(E)) of the semiconductor device SD that was imaged by a reference image forming means 80 and provided via a reference image providing means 90, and a processing means 30 that performs a predetermined processing on the semiconductor device SD that was the subject of the match image VP that was confirmed to match with the reference image SP through matching by the matching means A0, and is arranged near a manufacturing device EA1 that manufactures the semiconductor device SD. In this embodiment, the base material BM is formed by laminating an adhesive sheet AS as a covering material onto a semiconductor wafer (hereinafter simply referred to as a "wafer") WF using manufacturing equipment EA1, and the semiconductor device SD is formed by laminating sheet pieces AS1 as covering material pieces formed by dicing the adhesive sheet AS onto semiconductor chips (hereinafter simply referred to as "chips") CP formed by dicing the wafer WF. The manufacturing equipment EA1 includes a lamination means 40 that performs a lamination process of laminating an adhesive sheet AS onto a wafer WF to form a base material BM, an energy application means 50 that performs an energy application process of applying heat HA as a predetermined energy to the adhesive sheet AS, and a singulation means 60 that performs a singulation process of cutting the base material BM to individualize the base material BM and form semiconductor devices SD, and is located near a moving means 70 that performs a moving process of moving the wafer WF. The adhesive sheet AS of this embodiment undergoes hardening as a change specific to the heat HA when heat HA is applied.

[0011] The reference image forming means 10 is equipped with a reference image forming device 11 such as a microscope camera or a CCD camera, and takes images of all four corners of one semiconductor device SD, i.e., all four corners that are recognized when the semiconductor device SD in the state of Fig. 1(A) is viewed from above, at 300x magnification, so as to form a reference image VP by capturing, as a unique feature, the cut marks CT (see Figs. 1(F) to (I)) that are singulation marks formed on the outer edge of the semiconductor device SD when the base material BM is singulated. Note that the reference image forming means 10 of this embodiment is configured to form the reference image VP by capturing, as a unique feature, the cut marks CT that are formed on the outer edge of the sheet piece AS1 when the base material BM is singulated.

[0012] The match image providing means 20 includes a match image providing device 21 such as a CCD (Charge Coupled Device) or a wireless video transmission device, and provides the match image VP to the matching means A0 via a communication medium such as electricity or radio waves.

[0013] The processing means 30 is arranged within the imaging range of the collation image forming device 11, and is equipped with a mounting table 31 on which the semiconductor device SD transported from the manufacturing facility EA1 is placed, and a processing device 32 that performs a predetermined processing on the semiconductor device SD. In addition, if the processing device EA is, for example, a bonding device that stacks a semiconductor device SD on something else, the processing device 32 can be, for example, a bonding device that stacks a semiconductor device SD on a substrate, etc., and if the processing device EA is, for example, a printing device that prints on the semiconductor device SD, the processing device 32 can be, for example, a printing device that prints a predetermined character on the semiconductor device SD.

[0014] The lamination means 40 comprises a base plate 41 that directly or indirectly supports the components that make up the sheet lamination means 40, a support roller 42 that supports the raw roll RS on which the adhesive sheet AS has been temporarily attached to a strip-shaped release sheet RL, a guide roller 43 that guides the raw roll RS, a release plate 44 that serves as a release means for folding back the release sheet RL at a release edge 44A and peeling the adhesive sheet AS from the release sheet RL, a pressure roller 45 that serves as a pressing means for pressing the adhesive sheet AS against the wafer WF to laminate it, a drive roller 46 that is supported by an output shaft (not shown) of a rotary motor 46A that serves as a drive device and that pinches the release sheet RL between itself and a pinch roller 46B, and a recovery roller 47 that serves as a recovery means that is supported by an output shaft (not shown) of the drive device and that constantly applies a predetermined tension to the release sheet RL that is between itself and the pinch roller 46B while the semiconductor device processing device EA is in automatic operation, and recovers the release sheet RL.

[0015] The energy applying means 50 includes a hot air blower 51 as an energy applying device capable of applying heat HA.

[0016] The singulation means 60 includes two linear motors 61 as driving devices capable of moving each slider 61A in the forward and backward directions, linear motors 62 as driving devices supported by each slider 61A and capable of moving slider 62A in the left and right directions, a rotary linear motor 63 as a driving device supported by slider 62A and capable of rotating output shaft 63A and moving output shaft 63A in the up and down directions, a rotary motor 64 as a driving device supported by output shaft 63A and capable of rotating output shaft 64A, and a rotary cutter 65 as cutting means supported by output shaft 64A.

[0017] The moving means 70 includes a linear motor 71 as a driving device, and a support table 72 supported by a slider 71A of the linear motor 71 and having a support surface 72A that can be adsorbed and held by a pressure reduction means (holding means) such as a pressure reduction pump or a vacuum ejector (not shown).

[0018] The reference image forming means 80 includes a reference image forming device 81 such as a microscope camera or a CCD camera, and is configured to perform a reference image forming step of taking an image of the semiconductor device SD and forming a reference image SP. The reference image forming means 80 forms a reference image SP by capturing, at 300x magnification, one corner of each semiconductor device SD, i.e., any one of the four corners recognized when the semiconductor device SD in the state of Fig. 1(A) is viewed from above, the cut marks CT formed on the outer edge of the semiconductor device SD when the base material BM is singulated as a unique feature. Note that, similar to the collation image forming means 10, the reference image forming means 80 of this embodiment forms a reference image SP by capturing, as a unique feature, the cut marks CT formed on the outer edge of the sheet piece AS1 when the base material BM is singulated.

[0019] The reference image providing means 90 is equipped with a reference image providing device 91 such as a CCD (Charge Coupled Device) or a wireless video transmission device, and is configured to carry out a reference image providing process of providing the reference image SP to the matching means A0 via a communication medium such as electricity or radio waves.

[0020] The matching means A0 is configured to match a reference image VP with a reference image SP as a matching source image when individually recognizing a semiconductor device SD. That is, the matching means A0 includes a matching device A1 that stores one or more reference images SP provided by a reference image providing means 90, matches a match image VP provided by a match image providing means 20 with the reference image SP, and checks whether or not an image matching the match image VP exists among the stored reference images SP. The matching device A1 can be an image processing system or computer that performs pattern matching, alignment, measurement, calibration, and analysis between the reference image SP and the matching image VP, and when it confirms that there is a reference image SP that matches the matching image VP, it outputs a match signal to the processing device EA via a communication medium, and when it confirms that there is no image in the stored reference images SP that matches the matching image VP, it outputs a mismatch signal to the processing device EA via the communication medium.

[0021] The operations of the processing equipment EA and the manufacturing equipment EA1 will now be described. First, a user (hereinafter simply referred to as the "user") of the processing equipment EA and manufacturing equipment EA1, with each component positioned in the initial position indicated by the solid lines in FIG. 1(A), sets the web RS as shown in the figure, and then inputs a signal to start automatic operation via an operation means (not shown), such as an operation panel or a personal computer. The laminating means 40 then drives the rotation motor 46A to pay out the web RS. As shown in FIG. 1(A), when the leading edge of the leading adhesive sheet AS in the payout direction is peeled off a predetermined length from the release sheet RL at the folded portion of the release sheet RL folded back by the peeling edge 44A of the peeling plate 44, the rotation motor 46A is stopped. Next, the user or a transport means (not shown), such as an articulated robot or belt conveyor, places the wafer WF in a predetermined orientation on the support table 72, as shown in FIG. 1(A). The moving means 70 then drives the pressure-reducing means (not shown), and begins suction and holding the wafer WF on the support surface 72A.

[0022] Thereafter, the moving means 70 drives the linear motor 71 to move the wafer WF supported by the support table 72 to the left, and when the wafer WF reaches a predetermined position relative to the laminating means 40, the laminating means 40 drives the rotation motor 46A to pay out the raw web RS in accordance with the movement speed of the wafer WF. As a result, the adhesive sheet AS is peeled off from the release sheet RL at the folded-back portion of the release sheet RL and, as shown by the two-dot chain line in FIG. 1(A), is pressed by the pressure roller 45 and laminated onto the wafer WF to form the base material BM. Next, after the entire leading adhesive sheet AS is laminated onto the wafer WF to form the base material BM, the leading end of the next adhesive sheet AS following the leading adhesive sheet AS in the payout direction is peeled off a predetermined length from the release sheet RL at the folded-back portion of the release sheet RL, and the laminating means 40 stops driving the rotation motor 46A.

[0023] Then, when the base material BM being transported by the moving means 70 reaches just before the hot air blowing area of ​​the energy applying means 50, the energy applying means 50 drives the hot air blower 51 to emit heat HA. Next, as shown by the two-dot chain line in Figure 1(A), as the base material BM passes through the hot air blowing area, the adhesive sheet AS hardens, and when the entire base material BM has passed through the hot air blowing area, the energy applying means 50 stops driving the hot air blower 51.

[0024] Thereafter, when the base material BM being conveyed by the moving means 70 reaches the cutting position AP of the singulating means 60, indicated by the two-dot chain line in FIG. 1A, the moving means 70 stops driving the linear motor 71. Next, the singulating means 60 drives the linear motors 61 and 62, the rotary motor 63, and the rotary motor 64 to cut the base material BM along the cut lines CL shown in FIG. 1B. As shown in FIG. 1C, the base material BM is singulated, forming chips CP from the wafer WF and sheet pieces AS1 from the adhesive sheet AS, thereby forming semiconductor devices SD in which the sheet pieces AS1 are stacked on the chips CP. At this time, the rotary cutter 65 rubs against each sheet piece AS1 to form an outer edge, and individual cut marks CT due to chips, cracks, stretching, etc. are formed on the outer edges, as shown in FIGS. 1E to 1I.

[0025] Then, when cutting along the cut line CL is completed, the singulation means 60 stops driving the rotary motor 64 and then drives the linear motors 61 and 62 and the rotary linear motor 63 to return the rotary cutter 65 to its initial position. Next, the moving means 70 drives the linear motor 71 to move the support table 72 leftward. When the support table 72 reaches the imaging position RP of the reference image forming device 81, indicated by the two-dot chain line in FIG. 1A, the moving means 70 stops driving the linear motor 71. Thereafter, the reference image forming means 80 drives the reference image forming device 81 to image one corner of each sheet piece AS1 at 300x magnification to form a reference image SP (see FIG. 1E). The reference image providing means 90 then drives the reference image providing device 91 to provide the reference image SP to the verification means A0. Next, the verification means A0 drives the verification device A1 to store the reference image SP provided by the reference image providing device 91.

[0026] Then, when the collation device A1 stores the reference images SP (40 reference images SP in this embodiment) corresponding to all the semiconductor devices SD formed from one base material BM, the moving means 70 stops driving the pressure reducing means (not shown) and releases the suction hold on the support surface 72A. Next, a user or a transporting means (not shown) holds the semiconductor device SD and transports the semiconductor device SD onto the mounting table 31 of the processing means 30, and when all the semiconductor devices SD and the parts other than the semiconductor devices SD have been transported from the support surface 62A, the moving means 70 drives the linear motor 71 to return the support table 72 to its initial position, and the same operations as those described above are repeated thereafter.

[0027] In the processing device EA to which the semiconductor device SD has been transported as described above, before performing the predetermined processing, the collation image forming means 10 drives the collation image forming device 11 to take images of four corners of each sheet piece AS1 at 300x magnification and form four collation images VP (see Figures 1(F) to 1(I)). After that, the collation image providing means 20 drives the collation image providing device 21 to provide the collation images VP to the collation means A0. Note that in this embodiment, of the four collation images VP, Figure 1(H) matches Figure 1(E). Thereafter, the collation means A0 drives the collation device A1 and stores the collation image VP provided by the collation image providing device 21. The newly stored collation image VP is compared with the previously stored reference image SP to determine whether any image in the reference image SP matches the collation image VP.

[0028] Here, as a result of the comparison by the comparison device A1, if it is confirmed that there is an image (the image of FIG. 1(E) in this embodiment) that matches the comparison image VP among the previously stored reference images SP, the comparison device A1 outputs a match signal to the processing device EA. Next, the processing device EA, which has received the match signal from the comparison device A1, recognizes that the semiconductor device SD that was the subject of the image of the matched comparison image VP is an appropriate product to be processed, such as an expected product or a genuine product, and performs normal processing on the semiconductor device SD. That is, if the processing device EA is, for example, a bonding device, the processing means 30 drives the processing device 32 to stack the semiconductor device SD on a substrate or the like. Also, if the processing device EA is, for example, a printing device, the processing means 30 drives the processing device 32 to perform predetermined printing on the semiconductor device SD.

[0029] On the other hand, if the collation by the collation device A1 does not confirm the existence of an image (the image of FIG. 1(E) in this embodiment) that matches the collation image VP among the previously stored reference images SP, the collation device A1 outputs a mismatch signal to the processing device EA. The processing device EA, which receives the mismatch signal from the collation device A1, recognizes that the semiconductor device SD that was the subject of the image of the collation image VP for which no match was confirmed is an unexpected or non-genuine product, or an unsuitable product for processing, and performs operations such as not performing normal processing on the semiconductor device SD or removing the semiconductor device SD from the processing device EA.

[0030] According to the above-described embodiment, the cut marks CT formed on the outer edge of the semiconductor device SD when the base material BM is singulated can be captured as unique features to form a reference image SP and a match image VP, and these reference image SP and match image VP can be matched, so that the semiconductor device SD can be individually recognized using a new method and a predetermined processing can be performed on the semiconductor device SD.

[0031] The means and steps of the present invention are not limited in any way as long as they can perform the operations, functions, or steps described for those means and steps, and are in no way limited to the components and steps of a single embodiment shown in the above embodiment. For example, the reference image providing means may be anything that can provide a reference image to a verification means that verifies the reference image with a reference image of the semiconductor device SD that is captured by a reference image forming means and provided via the reference image providing means, and is not limited in any way as long as it is within the technical scope in light of the common general technical knowledge at the time of filing (the same applies to other means and steps).

[0032] The reference image forming means 10 may be disposed inside or outside the processing device EA, or may form a reference image VP by capturing, as a unique feature, cut marks CT formed on the outer edges of the semiconductor chips CP when the base material is singulated, as shown in FIG. 1(J), or may form a reference image VP by capturing, as a unique feature, cut marks CT (see FIGS. 1(K) and 1(L)) formed on the outer edges of both the semiconductor chips CP and the sheet pieces AS1 when the base material is singulated, or may image one corner of one semiconductor device SD to form one or more reference images VP, or may form a reference image VP by capturing, as shown in FIG. 1(J), cut marks CT formed on the outer edges of both the semiconductor chips CP and the sheet pieces AS1 when the base material is singulated, as unique features. A plurality of corners of the semiconductor device SD may be imaged to form one or more reference images VP, or, for example, a position other than a corner of a side or face of the semiconductor device SD may be imaged to form one or more reference images VP, or a position other than a corner of one semiconductor device SD may be imaged to form one or more reference images VP, or a plurality of positions other than corners of one semiconductor device SD may be imaged to form one or more reference images VP, or one image may be imaged once for one semiconductor device SD to form one or more reference images VP, or multiple images may be imaged for one semiconductor device SD to form one or more reference images VP, the number of times imaging is performed for one semiconductor device SD and the number of reference images VP formed for one semiconductor device SD may be the same or different, or the semiconductor device SD may be imaged at a magnification of 2x, 1000x, etc., or at a reduced magnification of 1 / 2x, 1 / 15x, etc., or at the same magnification to form the reference image VP, or the semiconductor device SD may be imaged at the same magnification as that at which the reference image forming device 81 images the semiconductor device SD or at a magnification different from that at which the reference image forming device 81 images the semiconductor device SD to illuminate the semiconductor device SD, A composite image VP may be formed, or the verification image VP may be formed by capturing an image of written information such as the manufacturing number, serial number, model number, type, name, dimensions, weight, etc., written on the semiconductor device SD, or the verification image VP may be formed by capturing an image of the semiconductor device SD in the state of FIG. 1(A) from above, diagonally above, below, diagonally below, left, diagonally left, right, diagonally right, front, diagonally forward, rear, or diagonally rear, or the verification image VP may be formed by capturing an image of the entire semiconductor device SD, or, for example, when the semiconductor device SD is a triangle or a pentagon or more, three or five or more corners,The match image VP may be formed by imaging a position other than three or five or more corners, or, for example, if the semiconductor device SD is triangular, quadrangular, or pentagonal or more, the match image VP may be formed by imaging one corner or a position other than the corners, or the match image VP may be formed by imaging multiple corners or positions other than the corners. As long as the match image VP can be formed by capturing the singulation marks formed on the outer edge of the semiconductor device SD when the base material BM is singulated as a unique feature, any position on the outer edge of the semiconductor device SD may be imaged in any way, or the match image forming device 11 may be moved or stopped while the semiconductor device SD is moving or stopped, and the semiconductor device SD may be imaged to form the match image VP. The comparison image forming device 11 may be equivalent to the reference image forming device 81, may have the same functions as the reference image forming device 81, may not be equivalent to the reference image forming device 81, or may not have the same functions as the reference image forming device 81, and may be any type of device, such as an infrared camera, an ultraviolet camera, an ultrasonic camera, an X-ray camera, an optical sensor, an ultrasonic sensor, an area sensor, a line sensor, etc.

[0033] The match image providing means 20 may be located inside or outside the processing device EA, may be configured integrally with the match image forming means 10, may be incorporated into the match image forming means 10, may be configured as a function of the match image forming means 10, or may be configured separately from the match image forming means 10. The collation image providing device 21 may be equivalent to the reference image providing device 91, may have functions equivalent to those of the reference image providing device 91, may not be equivalent to the reference image providing device 91, or may not have functions equivalent to those of the reference image providing device 91, and if the collation image forming device 11 forms multiple collation images VP for one semiconductor device SD, it may provide one of them, some but not all of them, or all of them to the collation means A0.

[0034] The processing means 30 may not have the mounting table 31, or instead of the mounting table 31, a belt conveyor, a roller conveyor, a positioning device, a holding device, or the like may be used. The mounting table 31 may be configured integrally with the processing device 32, may be incorporated into the processing device 32, may be configured as one function of the processing device 32, or may be configured separately from the processing device 32. The processing equipment 32 may be any equipment, such as cleaning equipment, etching equipment, immersion equipment, cutting equipment, oxide film forming equipment, nitriding equipment, grinding equipment, sandblasting equipment, polishing equipment, painting equipment, laminating equipment, sheet bonding equipment, surface treatment equipment, drilling equipment, bending equipment, inspection equipment, verification equipment, irradiation equipment, plating equipment, etc., and may perform a predetermined process on the semiconductor device SD placed on the mounting table 31, or may perform a predetermined process on the semiconductor device SD transported from the mounting table 31.

[0035] The laminating means 40 may form a closed-loop slit or a slit extending over the entire short width direction in a strip-shaped adhesive sheet base material temporarily attached to a strip-shaped release sheet RL, so that the adhesive sheet AS is peeled from the raw roll RS in which a predetermined area partitioned by the slit is made into the adhesive sheet AS, and then laminate the adhesive sheet AS on the wafer WF; alternatively, a strip-shaped adhesive sheet base material in which a strip-shaped adhesive sheet base material is temporarily attached to a strip-shaped release sheet RL is employed, and while the strip-shaped adhesive sheet base material is being unwound, a cutting blade is used as cutting means to form a closed-loop slit or a slit extending over the entire short width direction in the adhesive sheet base material, so that the adhesive sheet AS is peeled from the raw roll RS in which the predetermined area partitioned by the slit is made into the adhesive sheet AS, and then laminate the adhesive sheet AS on the wafer WF; alternatively, the strip-shaped adhesive sheet AS may be peeled from the raw roll RS in which the strip-shaped adhesive sheet AS is temporarily attached to a strip-shaped release sheet RL, and then laminated on the wafer WF; or, when laminating the adhesive sheet AS on the wafer WF, a predetermined tension is applied to the adhesive sheet AS by controlling the speed and tension of the unwound roll RS. Alternatively, the adhesive sheet AS may be peeled off from, for example, a fan-folded original roll RS without being rolled up and laminated on the wafer WF, or a pressing means may be employed which is supported by the output shaft of a linear motor as a driving device and which holds the adhesive sheet AS with a holding member capable of suction and holding by a pressure reducing means (not shown) such as a pressure reducing pump or a vacuum ejector, and which presses the adhesive sheet AS held by the holding member onto the wafer WF to laminate it, or a recovery means may be employed which recovers the release sheet RL without rolling up, for example, by fan-folding it, by shredding it with a shredder or by piling it up randomly, or no recovery means may be employed, or the adhesive sheet AS may be laminated on the wafer WF by moving the base plate 41 without moving the wafer WF or while moving the wafer WF, or an adhesive sheet AS that is not temporarily attached to the release sheet RL may be employed. The laminating means 40 may laminate a coating material on one side of the wafer WF, or may laminate a coating material on both one side and the other side, or may laminate a coating material on a portion of one side of the wafer WF as shown in Figure 1(B), or on the entirety of one side of the wafer WF, or on all or part of all sides of the wafer WF, and may or may not be provided in the processing apparatus EA or manufacturing apparatus EA1 of the present invention.

[0036] The energy application means 50 may be provided at a location other than that shown in the above embodiment, and may be provided at any location as long as it is capable of applying a predetermined energy to the coating material. The predetermined energy may be applied to the coating material by moving or stopping the energy application device while the base material BM is moving or stopped, or the predetermined energy may be applied to the entire coating material or a part of the coating material. Any type of energy application device may be used as the predetermined energy, such as one that applies electromagnetic waves such as ultraviolet rays, infrared rays, visible light, sound waves, X-rays or gamma rays, one that applies a heating medium such as hot water or hot air, or one that applies a cooling medium such as cold water or cold air. Any device may be used as long as it is capable of causing a change specific to the energy in the coating material, taking into account the characteristics, properties, properties, material, composition and configuration of the coating material, and it may or may not be provided in the processing apparatus EA or manufacturing apparatus EA1 of the present invention.

[0037] The singulation means 60 may employ an articulated robot as a driving device in place of at least one of the linear motors 61, 62, the rotary linear motor 63 and the rotary motor 64, and may form semiconductor devices SD in the shape of circles, ellipses, polygons such as triangles and rectangles, or other shapes, and may or may not be provided in the processing device EA or manufacturing device EA1 of the present invention. The singulation means 60 may, for example, change the properties or characteristics of the base material BM to form a brittle layer, and then apply an external force to the base material BM to break it, thereby singulating the base material BM.In this case, the matching image forming means 10 and the reference image forming device 81 may form the matching image VP and the reference image SP by capturing the cleavage marks, which are singulation marks formed on the outer edge of the semiconductor device SD when the base material BM is singulated, as unique features. The singulation means 60 may, for example, singulate the base material BM by etching the base material BM, in which case the matching image forming means 10 and the reference image forming device 81 may form the matching image VP and the reference image SP by capturing the etching marks, which are singulation marks formed on the outer edge of the semiconductor device SD when the base material BM is singulated, as unique features.

[0038] The moving means 70 may employ a support table 72 that cannot be held by suction on the support surface 72A, and may or may not be provided in the processing apparatus EA or manufacturing apparatus EA1 of the present invention.

[0039] The reference image forming means 80 may be disposed inside or outside the manufacturing apparatus EA1, or may form a reference image SP by capturing, as a unique feature, cut marks CT formed on the outer edges of the semiconductor chips CP when the base material is singulated, as shown in FIG. 1(J), or may form a reference image SP by capturing, as a unique feature, cut marks CT (see FIGS. 1(K) and 1(L)) formed on the outer edges of both the semiconductor chips CP and the sheet pieces AS1 when the base material is singulated, or may image one corner for one semiconductor device SD and form one or more reference images SP, or may form a reference image SP by capturing, as shown in FIG. 1(J), cut marks CT formed on the outer edges of both the semiconductor chips CP and the sheet pieces AS1 when the base material is singulated, as unique features A plurality of corners of the semiconductor device SD may be imaged to form one or more reference images SP, or, for example, a position other than a corner of a side or face of the semiconductor device SD may be imaged to form one or more reference images SP, or a position other than a corner of one semiconductor device SD may be imaged to form one or more reference images SP, or a plurality of positions other than corners of one semiconductor device SD may be imaged to form one or more reference images SP, or one image may be imaged once for one semiconductor device SD to form one or more reference images SP, or multiple images may be imaged for one semiconductor device SD to form one or more reference images SP, the number of times imaging is performed for one semiconductor device SD and the number of reference images SP formed for one semiconductor device SD may be the same or different, or the semiconductor device SD may be imaged at a magnification of 2x, 1000x, etc., or at a reduced magnification of 1 / 2x, 1 / 15x, etc., or at the same magnification to form a reference image SP, or the reference image SP may be formed by imaging the semiconductor device SD at the same magnification as or a different magnification than that at which the verification image forming device 11 images the semiconductor device SD A quasi-image SP may be formed, or the reference image SP may be formed by capturing information such as the manufacturing number, serial number, model number, type, name, dimensions, and weight recorded on the semiconductor device SD, or the reference image SP may be formed by capturing an image of the semiconductor device SD in the state of FIG. 1(A) from above, diagonally above, below, diagonally below, left, diagonally left, right, diagonally right, front, diagonally forward, rear, or diagonally rear, or the reference image SP may be formed by capturing an image of the entire semiconductor device SD, or, for example, when the semiconductor device SD is a triangle or a pentagon or more, three or five or more corners,The reference image SP may be formed by imaging a position other than three or five or more corners, or, for example, if the semiconductor device SD is triangular, quadrangular, or pentagonal or more, the reference image SP may be formed by imaging one corner or a position other than the corners, or the reference image SP may be formed by imaging multiple corners or positions other than the corners. As long as the reference image SP can be formed by capturing the singulation marks formed on the outer edge of the semiconductor device SD when the base material BM is singulated as a unique feature, any position on the outer edge of the semiconductor device SD may be imaged in any way, or the reference image forming device 81 may be moved or stopped while the semiconductor device SD is moving or stopped, and the reference image SP may be formed by imaging the semiconductor device SD. This may or may not be provided in the processing device EA or manufacturing device EA1 of the present invention. The reference image forming device 81 may be equivalent to the collation image forming device 11, may have the same functions as the collation image forming device 11, may not be equivalent to the collation image forming device 11, or may not have the same functions as the collation image forming device 11, and may be any device, such as an infrared camera, an ultraviolet camera, an ultrasonic camera, an X-ray camera, an optical sensor, an ultrasonic sensor, an area sensor, a line sensor, etc.

[0040] The reference image providing means 90 may be located inside or outside the manufacturing apparatus EA1, may be configured integrally with the reference image forming means 80, may be incorporated into the reference image forming means 80, may be configured as a function of the reference image forming means 80, or may be configured separately from the reference image forming means 80. The reference image providing device 91 may be equivalent to the collation image providing device 21, may have the same functions as the collation image providing device 21, may not be equivalent to the collation image providing device 21, or may not have the same functions as the collation image providing device 21, and when the reference image forming device 81 forms multiple reference images SP for one semiconductor device SD, it may provide one of them, some but not all of them, or all of them to the collation means A0.

[0041] The comparison means A0 may be located inside or outside the processing device EA or the manufacturing device EA1, and may compare the comparison image VP with the reference image SP after or simultaneously with the processing device EA performing a predetermined process. The comparison device A1 may be, for example, an image processing system, an appearance inspection device, an AI-based determination device, or any other device that can compare the comparison image VP with the reference image SP. The comparison device A1 may be configured independently, shared with other devices, or configured as part of other devices, or may be configured as a so-called host computer that collectively controls other devices and factory equipment, or may be configured as part or a function of a host computer. However, it may be configured integrally with at least one of the match image forming means 10, match image providing means 20, reference image forming means 80 or reference image providing means 90, or it may be incorporated into at least one of the match image forming means 10, match image providing means 20, reference image forming means 80 or reference image providing means 90, or it may be configured as one function of at least one of the match image forming means 10, match image providing means 20, reference image forming means 80 or reference image providing means 90, or it may be configured separately from the match image forming means 10, match image providing means 20, reference image forming means 80 or reference image providing means 90, and it may or may not be provided in the processing device EA or manufacturing device EA1 of the present invention. When the matching device A1 determines, as a result of the matching, that there is no image in the stored reference image SP that matches the match image VP, it may output a mismatch signal via a communication medium to an alarm means such as a monitor, lamp, or buzzer to notify the user that a match was not confirmed by the matching, or the condition for a match may be that the entire reference image SP matches the entire match image VP, or that a part of the reference image SP matches the entire match image VP, or that a part of the reference image SP matches the entire match image VP, or that a part of the reference image SP matches the entire match image VP, or that a mismatch is a mismatch between the entire reference image SP and the entire match image VP, or that a mismatch is a mismatch between a part of the reference image SP and a part of the match image VP, or that a mismatch is a mismatch between the entire reference image SP and the entire match image VP, or that a mismatch is a mismatch between a part of the reference image SP and a part of the match image VP, or that a mismatch is a mismatch between the entire reference image SP and the entire match image VP. The collation device A1 may output only a match signal or only a mismatch signal to the processing device EA or the warning means. When the collation device A1 outputs only a match signal, for example, the processing device EA may not perform normal processing for a semiconductor device SD that did not receive a match signal, or the warning means may be activated to notify the user. When the collation device A1 outputs only a mismatch signal, for example, the processing device EA may perform normal processing for a semiconductor device SD that did not receive a mismatch signal, or the warning means may not be activated.

[0042] The processing equipment EA may be any equipment, such as a cleaning equipment, etching equipment, immersion equipment, cutting equipment, oxide film forming equipment, nitriding equipment, grinding equipment, sandblasting equipment, polishing equipment, painting equipment, laminating equipment, sheet bonding equipment, surface treatment equipment, drilling equipment, bending equipment, inspection equipment, verification equipment, irradiation equipment, plating equipment, etc., and may change the content or type of the specified processing to be performed on the semiconductor device SD based on the results of the comparison by the comparison means A0.The processing equipment EA may be directly or indirectly connected to the manufacturing equipment EA1, or may be located in the same building, on the same premises or in a different building as the processing equipment EA without being connected to the manufacturing equipment EA1, or may be located in the building or premises to which the semiconductor device SD is shipped.

[0043] The manufacturing apparatus EA1 may be provided with a marking means for marking the imaging position on the semiconductor device SD imaged by the reference image forming means 80 or the vicinity of the imaging position so that the imaging position imaged by the reference image forming means 80 can also be imaged by the collation image forming means 10. As such a marking means, for example, a laser irradiation machine, a laser printing machine, an inkjet printer, a letterpress printing machine, an intaglio printing machine, a lithographic printing machine, a silk printing machine, a screen printing machine, a thermal printing machine, a thermal transfer printing machine, a dot impact printing machine, an adhesive tape application machine, etc. may be adopted.

[0044] The base material BM may have a covering material laminated on both one side and the other side of the wafer WF, or may be only the wafer WF without a covering material laminated thereon, or may be supported on a separate adhesive sheet different from the adhesive sheet AS, or may be supported on a separate adhesive sheet and the separate adhesive sheet is supported on a ring frame. Note that when the base material BM is supported on a separate adhesive sheet, an expanding means may be employed that performs an expanding step of applying tension to the separate sheet to widen the spacing between the semiconductor devices SD when the reference image forming means 80 images the semiconductor devices SD. The semiconductor device SD may have pieces of coating material laminated on both one side and the other side, may be only a chip CP without pieces of coating material laminated thereon, may be 40 or less or 40 or more formed from one base material BM, or may be only one formed from one base material BM. Note that when the base material BM is supported on another adhesive sheet, a singulation means 60 may be employed that applies tension to the other sheet to cut the base material BM, thereby singulating the base material BM and forming the semiconductor device SD. The wafer WF may have an orientation mark such as an orientation flat or V-notch to indicate the orientation, or it may not have an orientation mark, and it may have a circuit formed on at least one of its one surface and the other surface, or it may have no circuit formed on either its one surface or the other surface. The covering material and covering piece may be any material capable of covering the wafer WF or chip CP, such as an adhesive sheet, adhesive tape, adhesive tape, glue, pressure sensitive adhesive, resin material, rubber material, metal material, solder, wax, varnish, etc., and may be a solid substance, a liquid substance, or a gel substance. The change that the coating material undergoes in response to a predetermined energy may be any change, such as hardening, softening, shrinking, expanding, vaporizing, liquefying, solidifying, discoloring, oxidation, penetration, settling, loss of adhesive strength, or increase in adhesive strength. The coating material may be larger, smaller, or the same size as the wafer WF, may not undergo changes specific to the application of a specified energy, and may not be stacked on the wafer WF. The singulation marks may be formed only on the outer edge of the covering material, or only on the outer edge of the chip CP, or on the outer edges of both the covering material and the chip CP, or may be singulation marks that appear on one or more of the front, back, left, or right surfaces of the semiconductor device SD in the state shown in Figure 1(A), or may be cut marks CT, fracture marks, etching marks, tear marks, bending marks, etc., that are formed on the outer edge of the semiconductor device SD when the base material BM is singulated, as long as it allows individual identification of the semiconductor device SD. The reference image SP or the match image VP shown in FIGS. 1(E) to 1(I) are merely examples, and the present invention is not limited to these.

[0045] The base material BM, semiconductor device SD, wafer WF, chip CP, and covering material in the present invention are not particularly limited in terms of material, type, shape, etc. For example, the base material BM, semiconductor device SD, wafer WF, chip CP, and covering material may be circular, elliptical, polygonal such as triangular or rectangular, or other shapes, and the covering material may be pressure-sensitive adhesive, heat-sensitive adhesive, or other adhesive type. When a heat-sensitive adhesive covering material is used, the covering material may be laminated in an appropriate manner, for example, by providing a heating means such as a coil heater or the heating side of a heat pipe that heats the covering material. Furthermore, such covering materials may be of any type, such as a single layer consisting of only an adhesive layer, a two-layer structure consisting of a substrate and an adhesive layer laminated together, a three-layer structure or more consisting of a substrate and an adhesive layer with one or more intermediate layers laminated between them, a three-layer structure or more consisting of a substrate with one or more cover layers laminated on the top surface of the substrate, a structure in which the substrate, intermediate layer, or cover layer are releasably provided, a double-sided adhesive sheet consisting of only a single layer consisting of an adhesive layer, a double-sided adhesive sheet in which adhesive layers are laminated on both outermost surfaces of one or more intermediate layers, etc. Furthermore, the semiconductor wafer WF may be any semiconductor wafer, such as a silicon semiconductor wafer, a compound semiconductor wafer, or a diamond semiconductor wafer. The adhesive sheet AS may also be any sheet, film, tape, etc., such as an information label, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, or a recording layer-forming resin sheet.

[0046] The driving equipment in the above embodiments may be electric equipment such as rotary motors, linear motors, single-axis robots, so-called articulated robots with joints on two or three or more axes, actuators such as air cylinders, hydraulic cylinders, rodless cylinders and rotary cylinders, which may be used alone, or may be a direct or indirect combination of such electric equipment and actuators, or may be electric equipment, actuators, etc. that are capable of torque control, speed control, etc. for the output parts of such electric equipment, actuators, etc., or may not be capable of torque control, speed control, etc.

[0047] In the above embodiment, some object (hereinafter referred to as "object A") and an object (hereinafter referred to as "object B") that moves relative to object A, i.e., object A and object B that move relatively, object B may move relative to object A, which is not moving, object A may move relative to object B, which is not moving, or both object A and object B may move. As long as the result achieved by the movement is the same, either object A or object B may move. When a rotating member such as a roller is used, a driving device that rotates the rotating member may be provided. The surface of the rotating member or the rotating member itself may be made of a deformable member such as rubber or resin, or the surface of the rotating member or the rotating member itself may be made of a non-deformable member. Other members such as a rotating or non-rotating shaft or blade may be used instead of the roller. When a pressing means or pressing member such as a pressing roller or a pressing head that presses an object to be pressed is used, rollers, round rods, blade materials, brush-like members, or members that spray air or gas may be used instead of or in combination with the above-mentioned examples. The peeling means may be made of a deformable material such as rubber, resin, sponge, etc., or may be made of a non-deformable material such as metal or glass. When peeling means or peeling members such as peeling plates or peeling rollers are used to peel the material to be peeled, members such as plate-shaped members, round rods, rollers, etc. may be used instead of or in combination with the above examples. The peeling means may be made of a deformable material such as rubber or resin, or may be made of a non-deformable material. When supporting (holding) means or supporting (holding) members are used to support (hold) the supported member (held member), In this case, a configuration may be adopted in which the supported member is supported (held) by gripping means such as a chuck motor or chuck cylinder, Coulomb force, adhesive (adhesive sheet, adhesive tape), pressure sensitive adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli suction, suction, driving equipment, etc., or when a cutting means or cutting member that cuts the member to be cut or forms an incision or cutting line in the member to be cut is used, cutting means that cut by a cutter blade, laser cutter, ion beam, fire, heat, water pressure, an electric heating wire, spraying of gas or liquid, etc., may be used instead of or in combination with the above examples,It is also possible to move the cutting object by combining appropriate driving devices. [Explanation of symbols]

[0048] EA: Processing equipment for semiconductor devices 10... Matching image forming means 20...Means for providing matching images 30...Processing means 80...Reference image forming means 90...Reference image provision means A0...Verification method AS...Adhesive sheet (covering material) AS1...Sheet piece (covering material piece) BM…Base material CP: semiconductor chip CT…cutting marks (singularization marks) SD: Semiconductor device SP: Reference image VP...matching image WF: Semiconductor wafer

Claims

1. a reference image forming means for forming a reference image by imaging a semiconductor device formed by dividing the base material; a reference image providing means for providing the reference image to a verifying means for verifying the reference image with a reference image of the semiconductor device, the reference image being captured by a reference image forming means and provided via a reference image providing means; a processing means for performing a predetermined process on the semiconductor device that is the image subject of the collation image that has been confirmed to match the reference image through collation by the collation means, A semiconductor device processing apparatus characterized in that the matching image forming means and the reference image forming means form the matching image and the reference image by capturing the singulation marks formed on the outer edge of the semiconductor device when the base material is singulated as unique features.

2. The base material is a semiconductor wafer on which a coating material is laminated, The semiconductor device is formed by laminating a covering material piece formed by dividing the covering material onto a semiconductor chip formed by dividing the semiconductor wafer, The semiconductor device processing apparatus described in claim 1, characterized in that the reference image forming means and the comparison image forming means form the reference image and the comparison image by capturing the separation marks formed on at least one of the outer edges of the semiconductor chip and the outer edges of the coating material piece when the base material is separated as unique features.

3. a reference image forming step of forming a reference image by imaging a semiconductor device formed by dividing the base material; a reference image providing step of providing the reference image to a verifying means that verifies the reference image with a reference image of the semiconductor device that is captured in a reference image forming step and provided through a reference image providing step; a processing step of performing a predetermined process on the semiconductor device that was the subject of the image of the collation image that has been confirmed to match the reference image through collation by the collation means; A semiconductor device processing method characterized in that in the match image formation process and the reference image formation process, the match image and the reference image are formed by capturing the singulation marks formed on the outer edge of the semiconductor device when the base material is singulated as unique features.

Images