Display device and method of manufacturing the same

Abstract

To provide a display device having a specular reflection reduction structure, and a method of manufacturing the same.SOLUTION: The display apparatus includes a substrate 130, COM wiring 140 and SEG wiring 150 formed on the substrate 130, and a plurality of micro LED160 arranged at intersections of the COM wiring 140 and the SEG wiring 150. An uneven shape 170 for scattering external light is formed on the surfaces of the COM wiring 140 and the SEG wiring 160 in a region where the micro LED160 is not mounted.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a display device having a plurality of light-emitting elements arranged on a substrate, and more particularly to a display device having micro LEDs (light-emitting diodes). [Background technology]

[0002] In recent years, micro LEDs have been developed that can display images directly from light-emitting diodes. The micro LEDs are arranged two-dimensionally to correspond to each pixel, and in color images, each pixel is composed of blue, green, and red subpixels. For example, Patent Document 1 discloses a passively driven LED stack for displays in which three LED stacks, namely a first red (R) LED stack, a second green (G) LED stack, and a blue (B) LED stack, are stacked vertically, with the anodes of the light-emitting diodes in the first to third LED stacks commonly connected to data wiring and the cathodes connected to scan wirings 1, 2, and 3, respectively, to independently drive the R, G, and B light-emitting diodes in the same pixel.

[0003] Furthermore, Patent Document 2 discloses an active-drive micro LED in which a thin film transistor (TFT) including a gate electrode, a drain electrode, and a source electrode is formed on a semiconductor layer, a planarization layer is formed to cover the TFT, a first electrode connected to the source electrode through a via hole in the planarization layer is formed on the planarization layer, and an LED is formed between the first electrode and a second electrode formed above it. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-504752 [Patent Document 2] U.S. Patent No. 11,171,270 Summary of the Invention [Problem to be solved by the invention]

[0005] 1 is a schematic perspective view of a substrate on which micro LEDs are mounted. As shown in the figure, COM wiring 20 is formed in the row direction on a substrate 10, SEG wiring 30 is formed in the column direction, and micro LEDs 40 are mounted at the intersections of these matrix-like wirings. The micro LEDs 40 include, for example, R, G, and B LED chips. For example, in passive driving, the SEG wiring 30 is driven in a time-division manner at a constant frequency, and a drive current corresponding to image data is applied from the SEG wiring 30 to the COM wiring 20, causing each micro LED 40 to emit light.

[0006] In passively driven transparent micro LED displays, the wiring resistance of the COM wiring 20 and SEG wiring 30 must be low to prevent brightness unevenness due to voltage drops. To achieve this, metals with high resistivity are used and the wiring width is widened. As a result, the area ratio of the metal electrodes to the display area becomes high, which causes a problem of reduced visibility due to specular reflection when external light enters the panel.

[0007] Figure 2(A) is a graph showing the reflectance of a display area of ​​a micro LED display without anti-reflection measures, and Figure 2(B) is a table showing the relationship between metal wiring patterns and reflectance. SCI is the reflectance of scattered and specular reflection, and SCE is the reflectance due to scattered light excluding specular reflection. As is clear from these figures, the reflection due to scattered light remains roughly constant even when the electrode width changes, but the larger the electrode width, as in Pattern 1, the greater the SCI, or reflectance due to specular reflection.

[0008] One method for suppressing specular reflection from metal electrodes or metal wiring is to place a circular polarizer on the surface of the OLED (organic light-emitting diode) display (OLED) to reverse the optical rotation of the reflected circularly polarized light and absorb the reflected light. However, this method has the drawback that placing a polarizer on the top surface reduces brightness and transmittance by half.

[0009] There is also a technology to form a light-shielding layer such as a black mask on the metal electrode or metal wiring. In the case of active drive types, the effect is great because the line width is 10 μm or less, but in the case of passive drive types, as mentioned above, if the line width exceeds 30 μm, the area ratio of the electrode becomes high, and therefore, a slight effect of specular reflection occurs.

[0010] The present invention aims to solve the above-mentioned conventional problems and to provide a display device having a structure for reducing specular reflection, and a method for manufacturing the same. [Means for solving the problem]

[0011] The display device of the present invention includes a substrate, a plurality of metal wirings formed on the substrate, and a plurality of light-emitting elements arranged on the substrate, each of the plurality of light-emitting elements being electrically connected to each of the plurality of metal wirings via an electrode pad, and an uneven shape is formed on the surface of the metal wiring in an area where the light-emitting elements are not mounted to scatter external light.

[0012] In one aspect, the electrode pad is bonded to a region of the metal wiring where the uneven shape is not formed. In one aspect, the plurality of metal wirings include row-side metal wiring extending in the row direction and column-side metal wiring extending in the column direction, and at an intersection between the row-side metal wiring and the column-side metal wiring, one electrode pad of the light-emitting element is electrically connected to the row-side metal wiring, and the other electrode pad is electrically connected to the column-side metal wiring. In one aspect, the uneven shape of the metal wiring is formed to imitate the uneven shape formed on the substrate. In one aspect, the uneven shape of the metal wiring is formed to imitate the uneven shape formed on the underlying resin. In one aspect, the light-emitting element is a micro LED.

[0013] The method of manufacturing a display device according to the present invention, in which a plurality of light-emitting elements are arranged on a substrate, includes the steps of forming an uneven shape on the substrate, forming metal wiring on the substrate including the uneven shape and forming an uneven shape on the surface of the metal wiring that imitates the uneven shape of the substrate, and electrically connecting the light-emitting elements via electrode pads to flat areas of the metal wiring where the uneven shape is not formed.

[0014] In one aspect, the step of forming the textured pattern on the substrate includes treating the substrate with hydrofluoric acid. In another aspect, the step of forming the textured pattern on the substrate includes treating the substrate with sandblasting.

[0015] The method of manufacturing a display device according to the present invention, in which a plurality of light-emitting elements are arranged on a substrate, includes the steps of forming a resin on the substrate, forming an uneven shape in the resin, forming metal wiring on the resin containing the uneven shape and forming an uneven shape on the surface of the metal wiring that imitates the uneven shape of the resin, and electrically connecting the light-emitting elements via electrode pads to flat areas of the metal wiring where the uneven shape is not formed.

[0016] In one aspect, the step of forming the concave-convex shape in the resin includes photolithography of a photosensitive resin. In one aspect, the step of forming the concave-convex shape in the resin includes pressing a mold including the concave-convex shape. [Effects of the Invention]

[0017] According to the present invention, by forming an uneven shape to scatter external light on the surface of the area where the metal wiring light-emitting element is not mounted, the specular reflectance in the display area can be reduced, and a decrease in visibility due to specular reflection can be prevented. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 1 is a schematic perspective view of a substrate on which a conventional micro LED is mounted. [Figure 2]Figure 2(A) is a graph showing the reflectance of the display area of ​​a micro LED display without anti-reflection measures, and Figure 2(B) is a table showing the relationship between electrode patterns and reflectance. [Figure 3] FIG. 3A is a block diagram showing the electrical configuration of the display device of this embodiment, and FIG. 3B is a diagram showing the electrical connection relationship between the metal wiring and the micro LEDs. [Figure 4] 4A and 4B are diagrams illustrating the configuration of a display device according to an embodiment of the present invention, in which FIG. 4A is a plan view of the substrate wiring before mounting micro LEDs, FIG. 4B is a plan view of the substrate wiring after mounting micro LEDs, FIG. 4C is a cross-sectional view of metal wiring with a conventional structure, and FIG. 4D is a cross-sectional view of the gold wiring of this embodiment along the DD line. [Figure 5] 5A is a plan view of a substrate showing a state in which a textured surface is formed on the surface of the metal wiring, and FIG. 5B is a diagram showing a cross section of an electrode portion and a textured metal wiring portion. It is a plan view of a micro LED substrate according to an embodiment of the present invention. [Figure 6] 2A to 2C are diagrams illustrating a manufacturing process of a micro LED substrate according to a first embodiment of the present invention. [Figure 7] 5A to 5C are diagrams illustrating a manufacturing process of a micro LED substrate according to a second embodiment of the present invention. [Figure 8] 10A to 10C are diagrams illustrating a manufacturing process of a micro LED substrate according to a third embodiment of the present invention. [Figure 9] 10A to 10C are diagrams illustrating a manufacturing process of a micro LED substrate according to a fourth embodiment of the present invention. [Figure 10] 10 is a table showing simulation results of the display device according to the embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0019] The present invention relates to a display device including a substrate on which a plurality of light-emitting elements are mounted, and in particular to a display device having a structure that reduces specular reflection from metal electrodes or metal wiring on the substrate. The light-emitting elements are, but are not limited to, micro LEDs cut out from a semiconductor wafer or the like, and when the display device displays color images, the light-emitting elements include R, G, and B micro LEDs. It should be noted that the drawings referred to in the following description contain exaggerated representations to facilitate understanding of the invention and do not directly represent the shape and scale of the actual product. [Example]

[0020] 3A is a block diagram showing the electrical configuration of a display device according to an embodiment of the present invention. As shown in the figure, the display device 100 includes a drive circuit 110 and a micro LED unit 120 driven by the drive circuit 110.

[0021] 3B is a diagram showing the electrical connection relationship between the substrate wiring and the micro LEDs in the micro LED unit 120. As shown in the figure, for example, a plurality of COM wirings S1, S2, ..., S5, S6 extending in the row direction (X direction) and a plurality of SEG wirings D1, D2, ..., D5, D6 extending in the column direction (Y direction) are formed on the substrate, and micro LEDs are mounted at each intersection of the COM wiring and the SEG wiring. Here, for convenience, 6x6 passive drive type COM wirings and SEG wirings are illustrated as an example, but in reality, the number of COM wirings and SEG wirings formed corresponds to the number of pixels. Furthermore, the micro LED unit 120 is not limited to the passive drive type, and may be an active drive type, in which case switching elements such as TFTs are formed at the intersections of the COM wiring and the SEG wiring.

[0022] Although the COM wiring and SEG wiring are illustrated as linear, the shape and pattern of the wiring are appropriately determined depending on the position and shape of the anode electrode / cathode electrode of the micro LED. The COM wiring is electrically insulated from the SEG wiring. For example, at the intersection of the COM wiring and the SEG wiring, the COM wiring and the SEG wiring may be insulated by an interlayer insulating film, or the COM wiring and the SEG wiring may be configured by a multilayer wiring structure. At the intersection of the COM wiring and the SEG wiring, for example, the cathode electrode of the micro LED is electrically connected to the COM wiring, and the anode electrode of the micro LED is electrically connected to the SEG wiring.

[0023] When the micro LED unit 120 displays a color image, one pixel (picture element) is composed of three sub-pixels that generate R (red), G (green), and B (blue). Micro LEDs can be mounted using either a chip mounting method or a wafer bonding method. In the former, individual LED chips are cut out from a semiconductor wafer, and each LED chip is mounted on a substrate on which wiring and drive circuits are formed. In the latter, the semiconductor wafer on which the LEDs are formed is directly bonded to a silicon wafer on which wiring and drive circuits are formed. The micro LED unit 120 of this embodiment may be mounted using either a chip mounting method or a wafer bonding method.

[0024] The drive circuit 110 passively or actively drives the micro LED unit 120 in accordance with the image data, applies a drive current in accordance with the image data from the SEG wiring to the COM wiring, and causes each micro LED to emit light.

[0025] Next, the specific structure of the micro LED unit 120 of this embodiment will be described. Figure 4(A) is a plan view of the board wiring before mounting the micro LED, Figure 4(B) is a plan view of the board wiring after mounting the micro LED, Figure 4(C) is a cross-sectional view of the metal wiring near the mounting of the micro LED of the conventional structure, and Figure 4(D) is a cross-sectional view near the mounting of the micro LED of this embodiment, which is a cross-section of the line DD in Figure 4(B).

[0026] The micro LED unit 120 includes a substrate 130 having, for example, a rectangular shape. The substrate 130 may be, for example, a transparent substrate or film having optical transparency such as a glass substrate, a plastic substrate, or an acrylic substrate, or a semiconductor substrate such as silicon. When the substrate 130 is a transparent substrate, the transparent substrate can be bonded onto a semiconductor substrate on which the driving circuit 110 is formed. When the substrate 130 is a silicon substrate, the driving circuit 110 may be formed on the silicon substrate.

[0027] A plurality of COM wirings 140 extending in the row direction and a plurality of SEG wirings 150 extending in the column direction are formed on the surface of the substrate 130. As shown in Fig. 4(A) , the COM wirings 140 include rectangular electrode portions 142 that protrude in the column direction at the intersections with the SEG wirings 150, and the SEG wirings 150 include rectangular electrode portions 152 that protrude in the row direction at the intersections with the COM wirings 140. The positions and sizes of the electrode portions 142 and 152 correspond to the positions and sizes of the electrode pads of the micro LEDs 160 to be mounted.

[0028] The COM wiring 140 and the SEG wiring 150 are made of a metal material, such as a single layer or a multilayer of Au, Ag, Cu, AgMg, Al, or ITO. For example, the COM wiring 140 including the electrode portion 142 and the SEG wiring 150 including the electrode portion 152 are formed by patterning a metal material deposited on the substrate 130. The COM wiring 140 and the SEG wiring 150 are electrically connected to the drive circuit 110.

[0029] The micro LED 160 is, for example, a rectangular LED chip cut from a wafer, and has an anode-side electrode pad 162 and a cathode-side electrode pad 164, each having a certain thickness, at its bottom. The anode-side electrode pad 162 is connected to the electrode portion 142 of the SEG wiring 140, and the cathode-side electrode pad 164 is connected to the electrode portion 152 of the COM wiring 150, and the micro LED 160 is mounted at each intersection of the COM wiring 140 and the SEG wiring 150. The electrode pads 162, 164 and the electrodes 142, 152 can be connected by any method, such as by a conductive adhesive or solder. After mounting the micro LED 160, the entire substrate including the COM wiring 140 and the SEG wiring 150 may be covered with a transparent protective member.

[0030] In this embodiment, a finely textured structure 170 is formed on the surfaces of the COM wiring 140 and SEG wiring 150, which are exposed to external light. In other words, the metal surfaces exposed to external light are roughened. By forming the finely textured structure 170 on the surfaces of the metal wiring of the COM wiring 140 and SEG wiring 150, light incident from the outside can be scattered. This is shown in FIG. 4(D). As shown, external light L is scattered as light La, Lb, and Lc by the finely textured structure 170 of the metal wiring. Each of the textured structures does not necessarily have to be of uniform depth or shape, and the arrangement of the textured structures does not necessarily need to be regular but can be random. By scattering the external light L, specular reflection is reduced, making it possible to suppress glare and other issues caused by the external light L without requiring special light-shielding treatment on the electrodes. On the other hand, FIG. 4C shows metal wiring of a conventional structure, in which the surfaces of the metal wiring of the COM wiring 20 and the SEG wiring 30 are flat, and external light L is specularly reflected by the surfaces of the metal wiring.

[0031] However, the surfaces of the electrode portions 142 and 144 to which the electrode pads 162 and 164 of the micro LED 160 are bonded are left flat because making the areas to be bonded with the electrode pads 162 and 164 uneven would adversely affect the physical bond (poor adhesion) and electrical bond (poor contact) with the micro LED.

[0032] Fig. 5(A) illustrates the range in which the uneven shape 170 is formed in the COM wiring 140 and SEG wiring 150 shown in Fig. 4(A). Fig. 5(B) is an enlarged cross section of Fig. 4(D). As shown in the figure, the uneven shape 170 is processed in most of the areas of the COM wiring 140 and SEG wiring 150 where the micro LEDs 160 are not mounted, and most of the electrode parts 142, 152 in the areas where the micro LEDs 160 are mounted have flat surfaces and are not processed with uneven shapes.

[0033] In one embodiment, the unevenness must have a depth or step of 0.5 μm or more to exhibit a scattering effect. Meanwhile, the height of the electrode pads 162, 164 of the micro LED 160 is generally 1 μm or less. Electrical contact is made between the electrode portions 142, 152 and the electrode pads 162, 164 using a conductive adhesive, but the thickness of the conductive adhesive varies, resulting in variations in contact resistance. Furthermore, if the micro LED elements are bonded at an angle due to the unevenness, the central axes of the individual micro LED elements will not be aligned, leading to variations in brightness and viewing angle characteristics. Therefore, it is desirable for the surfaces of the electrode portions 142, 152 for mounting the micro LEDs to be flat.

[0034] According to this embodiment, by providing a textured surface on the metal wiring where the micro LED is not mounted, the incident light from the outside is scattered on the surface of the metal wiring, reducing specular reflection and suppressing glare. Also, visibility can be improved without compromising the transmittance and brightness advantages of the transparent micro LED.

[0035] Next, a manufacturing method for forming a concave-convex shape on the surface of metal wiring will be described. FIG. 6 is a diagram showing the manufacturing process of the concave-convex shape according to the first embodiment. First, as shown in FIG. 6(A), a mask member 210 is formed on, for example, a glass substrate 200. The mask member 210 includes openings 210A for exposing the glass substrate 200, and the openings 210A define the regions or areas for forming the concave-convex shape. The material of the mask member 210 is arbitrary, but is, for example, an adhesive resin that can be easily peeled off from the glass substrate 200.

[0036] 6(B), the area exposed by the mask member 210 is wet-etched with a hydrofluoric acid solution 220 to roughen the surface of the exposed area, thereby forming a fine uneven shape 230 on the surface of the area.

[0037] Next, as shown in FIG. 6(C), the mask member 210 is peeled off. Next, as shown in FIG. 6(D), a metal material is applied to the surface of the glass substrate 200 and patterned to form metal wiring (COM wiring and SEG wiring) 240. The method for applying the metal material is not particularly limited, but for example, the metal material is applied by sputtering so as to reflect the uneven shape 230 of the base. The metal wiring 240 includes a region 240A having an uneven shape that reflects the uneven shape 230 of the glass substrate 200, and flat regions 240B and 240C. The flat region 240B corresponds to the electrode portion 142 of the COM wiring 140 shown in FIG. 4, and the flat region 240C corresponds to the electrode portion 152 of the SEG wiring 150.

[0038] Next, as shown in FIG. 6(E), the electrode pads 252 and 254 of the micro LED 250 are connected to the flat areas 240B and 240C via a conductive adhesive or silver paste, and the micro LED 250 is mounted.

[0039] The above manufacturing process shows an example in which the surface of a glass substrate is roughened by hydrofluoric acid treatment, but when a film substrate such as polycarbonate or PET is used, the substrate surface can be roughened using an alkaline solvent (e.g., NaOH).

[0040] Next, a process for manufacturing a concave-convex shape according to a second embodiment will be described with reference to FIG. 7. In the second embodiment, a fine concave-convex shape is formed on the surface of a glass substrate by sandblasting instead of the hydrofluoric acid treatment used in the first embodiment. As shown in FIG. 7(A), a glass substrate 200 is masked with a mask member 210, and as shown in FIG. 7(B), the surface of the glass substrate 200 exposed by the mask member 210 is roughened by sandblasting 270, thereby forming a fine concave-convex shape 230 on the surface of the glass substrate 200. The subsequent processes shown in FIGS. 7(C), (D), and (E) are the same as those in the first embodiment.

[0041] Next, a process for manufacturing a concave-convex shape according to a third embodiment will be described with reference to FIG. 8. As shown in FIG. 8(A), a photosensitive resin resist 310 is applied to a substrate 300. Next, as shown in FIG. 8(B), a pattern 320 including a fine concave-convex shape is formed in the resist 310 using a photolithography process (exposure and development). Next, as shown in FIG. 8(C), a resin 330 is coated on the resist 310 including the pattern 320. The resin 330 is a thermosetting or ultraviolet-curable resin and has a certain viscosity. Therefore, the resin 330 covering the pattern 320 presents a concave-convex surface that matches the concave-convex shape of the underlying substrate. By forming the resin 330, the steps of the pattern 320 can be reduced. Note that the resin 330 is not essential, and the process of forming the resin 330 may be omitted.

[0042] Next, the resin 330 is hardened by applying heat or ultraviolet light, and then, as shown in FIG. 8(D), a metal material is applied to the resin 330 and patterned to form metal wiring 340. The metal wiring 340 includes a region 340A having a concave-convex shape that reflects the concave-convex pattern 320 of the resist 310, and flat regions 340B and 340C. The flat region 340B corresponds to the electrode portion 142 of the COM wiring 140 shown in FIG. 4, and the flat region 340C corresponds to the electrode portion 152 of the SEG wiring 150.

[0043] Next, a process for manufacturing a concave-convex shape according to a fourth embodiment will be described with reference to FIG. 9. In the fourth embodiment, a concave-convex shape is formed on a substrate by nanoimprinting. As shown in FIG. 9(A), a thermosetting or ultraviolet-curable resin 410 is formed on a substrate 400 by spin coating. Next, as shown in FIG. 9(B), a mold 420 having a fine concave-convex shape 420A formed on its bottom surface is prepared, and the mold 420 is pressed against the resin 410 with a constant pressure to transfer the fine concave-convex shape 410A to the resin 410.

[0044] After applying heat or ultraviolet light to the resin 410 onto which the unevenness 410A has been transferred to harden the resin 410, a metal material is applied to the resin 410 and patterned to form metal wiring 430, as shown in FIG. 9C. The metal wiring 430 includes a region 430A having an uneven shape that reflects the unevenness 410A of the resin 410, and flat regions 430B and 430C. The flat region 430B corresponds to the electrode portion 142 of the COM wiring 140 shown in FIG. 4, and the flat region 430C corresponds to the electrode portion 152 of the SEG wiring 150.

[0045] Next, the results of an optical simulation of the specular reflection reduction structure of the display device of this example are shown in Fig. 10. The simulation conditions were: tool: TracePro, pixel pitch: 0.2 mm, electrode line width: 0.03 mm, electrode: Au.

[0046] In the conventional structure, the specular reflectance A of the display area of ​​the display device is 29.7%, while in this embodiment, the specular reflectance A is 14.9%. Of the specular reflectance A, the glass reflectance B due to the glass substrate is 8.1%, which is the same for both the conventional structure and this embodiment, since the shape of the glass substrate is the same. The electrode reflectance C (C = AB) due to the metal wiring is reduced to about one-third of that of the conventional structure as a result of randomly roughening the surface of the metal wiring, confirming the effect of this embodiment.

[0047] Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to the specific embodiments, and various modifications and changes are possible within the scope of the gist of the invention described in the claims. [Explanation of symbols]

[0048] 100: Display device 110: Drive circuit 120: Micro LED unit 130: Circuit board 140:COM wiring 142:Electrode section 150:SEG wiring 152:Electrode part 160: Micro LED 162, 164: Electrode pads 170: Concave and convex shape 200: Glass substrate 210: Mask member 230: Concave and convex shape 240: Metallic materials 250: Micro LED 252, 254: Electrode pads

Claims

1. A substrate; a plurality of metal wirings formed on the substrate; a plurality of light-emitting elements disposed on the substrate; each of the plurality of light-emitting elements is electrically connected to each of the plurality of metal wirings via an electrode pad; The display device further comprises a surface of the metal wiring in an area where the light emitting element is not mounted, the surface having a concave-convex shape for scattering external light.

2. The display device according to claim 1 , wherein the electrode pad is bonded to a region of the metal wiring where the uneven shape is not formed.

3. the plurality of metal wirings include row-side metal wirings extending in a row direction and column-side metal wirings extending in a column direction, 2. The display device according to claim 1, wherein at an intersection between the row-side metal wiring and the column-side metal wiring, one electrode pad of the light-emitting element is electrically connected to the row-side metal wiring, and the other electrode pad is electrically connected to the column-side metal wiring.

4. The display device according to claim 1 , wherein the uneven shape of the metal wiring is formed to follow the uneven shape formed on the substrate.

5. The display device according to claim 1 , wherein the uneven shape of the metal wiring is formed so as to follow the uneven shape formed in the underlying resin.

6. The display device according to claim 1 , wherein the light-emitting element is a micro LED.

7. A method for manufacturing a display device having a plurality of light-emitting elements arranged on a substrate, comprising: forming a textured shape on the substrate; forming a metal wiring on the substrate including the uneven shape, and forming an uneven shape on the surface of the metal wiring that follows the uneven shape of the substrate; electrically connecting a light emitting element to a flat area of ​​the metal wiring where no irregularities are formed via an electrode pad; A manufacturing method comprising:

8. The manufacturing method according to claim 7 , wherein the step of forming the uneven shape on the substrate includes treating the substrate with hydrofluoric acid.

9. The manufacturing method according to claim 7 , wherein the step of forming the uneven shape on the substrate includes sandblasting the substrate.

10. A method for manufacturing a display device having a plurality of light-emitting elements arranged on a substrate, comprising: forming a resin on the substrate; forming a concave-convex shape on the resin; forming a metal wiring on the resin having the uneven shape, and forming an uneven shape on the surface of the metal wiring that follows the uneven shape of the resin; electrically connecting a light emitting element to a flat area of ​​the metal wiring where no irregularities are formed via an electrode pad; A manufacturing method comprising:

11. The manufacturing method according to claim 10 , wherein the step of forming the uneven shape in the resin includes photolithography of a photosensitive resin.

12. The manufacturing method according to claim 10 , wherein the step of forming the uneven shape in the resin includes pressing a mold including the uneven shape against the resin.

Images