Detection device

Abstract

To provide a detection device including a sensor layer printed on an array substrate and separated from a detection electrode.SOLUTION: The sensing device includes an array substrate and a sensor layer stacked in sequence. A direction in which the sensor layer is disposed when viewed from the array substrate is defined as a first stacking direction. The opposite direction of the first stacking direction is taken as a second stacking direction. The array substrate includes a first surface facing the first stacking direction, a plurality of recessed surfaces recessed from the first surface in the second stacking direction, and a plurality of detection electrodes provided on the recessed surfaces. The sensor layer is formed by printing and curing a conductive resin material on the first surface. The sensor layer and the detection electrode are separated from each other.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a detection device. [Background technology]

[0002] The detection device detects a load (pressure) acting perpendicularly to a detection surface. The detection device includes a protective layer, a sensor layer, and an array substrate, which are stacked in this order from the detection surface side. One surface of the protective layer constitutes the detection surface. The array substrate of Patent Document 1 listed below has a detection electrode and a common electrode arranged on a surface facing the sensor layer. The sensor layer has opposing surfaces facing the detection electrode and the common electrode, respectively, and spaced apart from the detection electrode and the common electrode. When pressure is applied to the detection surface, the opposing surfaces move toward the detection electrode and the common electrode and come into contact with the detection electrode and the common electrode, respectively. This causes a current to flow from the common electrode to the detection electrode via the sensor layer. Furthermore, when the pressure applied to the detection surface is large, the contact area of ​​the opposing surfaces in contact with the common electrode and the detection electrode increases. As a result, the current flowing from the common electrode to the detection electrode increases. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2023-109115 Summary of the Invention [Problem to be solved by the invention]

[0004] The protective layer may be a protective film made of polyethylene terephthalate (PET) or polyimide (PI). Alternatively, a sensor layer may be printed on the protective film, and the protective film with the printed sensor layer may then be overlaid on an array substrate to manufacture a detection device. This manufacturing method results in warping of the protective film with the printed sensor layer due to the difference in linear expansion coefficient between the protective film and the sensor layer. This warping increases the distance from the opposing surface to the detection electrodes and common electrode, potentially making it impossible to detect small pressures. On the other hand, if the sensor layer is printed on the array substrate, the sensor layer will be in contact with the detection electrodes. This means that a structure cannot be adopted in which the contact area of ​​the sensor layer with the detection electrodes increases or decreases in proportion to the magnitude of the input pressure. For these reasons, even if the sensor layer is printed on the array substrate, it is required that the sensor layer be spaced apart from the detection electrodes.

[0005] SUMMARY OF THE INVENTION An object of the present invention is to provide a sensing device that includes a sensor layer printed on an array substrate and spaced apart from sensing electrodes. [Means for solving the problem]

[0006] A detection device according to one aspect of the present disclosure includes an array substrate and a sensor layer stacked in this order. A first stacking direction is a direction in which the sensor layer is arranged as viewed from the array substrate. A second stacking direction is a direction opposite to the first stacking direction. The array substrate has a first surface facing the first stacking direction, a plurality of concave surfaces recessed from the first surface in the second stacking direction, and a plurality of detection electrodes provided on the concave surfaces. The sensor layer is formed by printing and curing a conductive resin material on the first surface. The sensor layer and the detection electrodes are spaced apart from each other. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a view of the detection device according to the first embodiment as viewed from the detection surface side. [Figure 2]FIG. 2 is a schematic cross-sectional view of the detection device of the first embodiment, and more specifically, a schematic cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 3 is a view of a part of the first surface of the array substrate of the first embodiment, viewed from the sensor layer side. [Figure 4] FIG. 4 is an enlarged view of one individual detection region on the first surface of the array substrate of the first embodiment, viewed from the sensor layer side. [Figure 5] FIG. 5 is a circuit diagram showing the circuit configuration of the detection device of the first embodiment. [Figure 6] FIG. 6 is a cross-sectional view schematically showing a state in which pressure is input to the detection device of the first embodiment. [Figure 7] FIG. 7 is a cross-sectional view that schematically shows a state in which a pressure greater than that in FIG. 6 is input. [Figure 8] FIG. 8 is a schematic cross-sectional view of the detection device of the first modification. [Figure 9] FIG. 9 is a view of a part of the first surface of the array substrate of the second modification, viewed from the sensor layer side. [Figure 10] FIG. 10 is a cross-sectional view of the array substrate of the second modification when the concave surface is cut in the lamination direction. [Figure 11] FIG. 11 is a cross-sectional view schematically showing a state in which pressure is input to the detection device of the second modification. [Figure 12] FIG. 12 is a cross-sectional view of the array substrate of the third modification cut in the lamination direction. [Figure 13] FIG. 13 is a cross-sectional view of the array substrate of the fourth modification cut in the lamination direction. [Figure 14] FIG. 14 is a cross-sectional view of the array substrate of the fifth modification cut in the lamination direction. [Figure 15] FIG. 15 is a cross-sectional view of the array substrate of the sixth modification cut in the lamination direction. DETAILED DESCRIPTION OF THE INVENTION

[0008] Modes (embodiments) for implementing the detection device of the present disclosure will be described in detail with reference to the drawings. The invention of the present disclosure is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially identical. Furthermore, the components described below can be combined as appropriate. Note that the disclosure is merely an example, and any appropriate modifications that a person skilled in the art can easily conceive while maintaining the gist of the invention are naturally included within the scope of the present invention. For clarity of explanation, the drawings may schematically depict the width, thickness, shape, etc. of each part compared to the actual embodiment. However, these are merely examples and are not intended to limit the interpretation of the present invention. Furthermore, in this specification and each figure, components similar to those previously described with reference to the preceding figures are designated by the same reference numerals, and detailed descriptions may be omitted as appropriate.

[0009] Furthermore, in this specification and claims, when expressing an aspect of placing another structure on top of a certain structure, the term "on top" is used, unless otherwise specified, to include both a case in which another structure is placed directly on top of a certain structure so as to be in contact with the certain structure, and a case in which another structure is placed above a certain structure via yet another structure.

[0010] (Embodiment 1) FIG. 1 is a view of the detection device according to the first embodiment as viewed from the detection surface side. The detection device 100 is a device that detects pressure acting on a detection surface 1. As shown in FIG. 1, the detection device 100 is formed in a flat plate shape. The detection device 100 has a planar front surface (detection surface 1) and a planar back surface 2 (not shown in FIG. 1; see FIG. 2). The detection device 100 has a rectangular shape when viewed from the normal direction of the detection surface 1.

[0011] The detection surface 1 is divided into a detection area 3 where pressure can be detected and a peripheral area 4 where pressure cannot be detected. The detection area 3 is located in the center of the detection surface 1. The peripheral area 4 is formed in a frame shape and surrounds the outside of the detection area 3.

[0012] The detection area 3 is formed in a rectangular shape when viewed from the normal direction of the detection surface 1. Therefore, the outer frame M of the detection area 3 has a pair of short sides 3a and a pair of long sides 3b. Hereinafter, a direction parallel to the detection surface 1 and parallel to the short sides 3a will be referred to as the first direction X. A direction parallel to the detection surface 1 and parallel to the long sides 3b will be referred to as the second direction Y. Therefore, the second direction Y is a direction perpendicular to (intersects with) the first direction X. Furthermore, below, a direction parallel to the detection surface 1 may be referred to as the planar direction.

[0013] The detection area 3 is divided into a plurality of individual detection areas 5. In other words, the detection area 3 is a collection of a plurality of individual detection areas 5, and a pressure value is detected in each of the individual detection areas 5. When viewed from the normal direction of the detection surface 1, the individual detection areas 5 are square-shaped. The plurality of individual detection areas 5 are arranged in a first direction X and a second direction Y.

[0014] FIG. 2 is a schematic cross-sectional view of the detection device of embodiment 1, specifically a cross-sectional view taken along line II-II in FIG. 4. As shown in FIG. 2, the detection device 100 includes an array substrate 10, a sensor layer 70, and a protective layer 80, which are stacked in this order. Hereinafter, the direction in which the array substrate 10, the sensor layer 70, and the protective layer 80 are stacked will be referred to as the stacking direction. The normal direction of the detection surface 1 described above has the same meaning as the stacking direction. In addition, within the stacking directions, the direction in which the sensor layer 70 is arranged as viewed from the array substrate 10 will be referred to as the first stacking direction Z1, and the opposite direction will be referred to as the second stacking direction Z2. The view from the first stacking direction Z1 will sometimes be referred to as a planar view.

[0015] The array substrate 10 includes a base material 11 and an array layer 12 formed in a first stacking direction Z1 of the base material 11. The base material 11 is a plate-like material that supports the array layer 12 and has insulating properties. There are no particular limitations on the material from which the base material 11 is formed. The base material 11 may be a flexible substrate made of polyimide, for example. The surface of the base material 11 in the second stacking direction Z2 forms the back surface 2 of the detection device 100.

[0016] The array layer 12 has a first insulating layer 13, a second insulating layer 14, and a third insulating layer 15 stacked in this order on the surface of the base material 11 in the first stacking direction Z1. A gate insulating film 42 of a transistor 40, which will be described later, is provided between the first insulating layer 13 and the second insulating layer 14.

[0017] The first insulating layer 13, the second insulating layer 14, and the third insulating layer 15 are formed of an insulating material. The insulating material may be either an inorganic material or an organic material. The third insulating layer 15 is a layer (planarizing film) for planarizing the first surface 16 of the array layer 12 in the first stacking direction Z1. Although the array layer 12 of the embodiment has three insulating layers, the present disclosure does not particularly limit the number of insulating layers.

[0018] A concave surface 17, a detection electrode 20, and a common electrode 30 are formed on the first surface 16 of the array layer 12. The concave surface 17 is recessed from the first surface 16 in the second stacking direction Z2. The concave surface 17 is formed in a hemispherical shape. Therefore, the concave surface 17 has a circular shape in a plan view (see FIG. 3).

[0019] 3 is a view of a portion of the first surface of the array substrate of embodiment 1 as viewed from the sensor layer side. Note that in FIG. 3, the detection electrodes 20 and the common electrode 30 are not shown in order to make the concave surface 17 more visible. As shown in FIG. 3, the concave surface 17 is formed in an area overlapping with the detection region 3. In other words, the concave surface 17 is not formed in an area overlapping with the peripheral region 4. As described above, the first surface 16 has a fine concave-convex structure in an area overlapping with the detection region 3, and is difficult to get wet (has water repellency).

[0020] 2, the detection electrode 20 is formed on the concave surface 17. On the other hand, the common electrode 30 is formed on the first surface 16. The detection electrode 20 and the common electrode 30 are metal films made of a metal material such as ITO (Indium Tin Oxide) and formed on the concave surface 17 or the first surface 16. Since the concave surface 17 is hemispherical, the detection electrode 20 formed on the concave surface 17 is also hemispherical.

[0021] 4 is an enlarged view of one individual detection region on the first surface of the array substrate of Embodiment 1, viewed from the sensor layer side. In FIG. 4, the detection electrodes 20 and the common electrode 30 are marked with dots to make them easier to see.

[0022] As shown in Fig. 4, four recessed surfaces 17 are formed for one individual detection area 5. In other words, four detection electrodes 20 are arranged for one individual detection area 5. The detection electrodes 20 are circular in plan view. The detection electrodes 20 are arranged in the center of the recessed surfaces 17 and are spaced apart from the edge portions 17a of the recessed surfaces 17.

[0023] One common electrode 30 is formed for each individual detection area 5. The common electrode 30 is formed in a rectangular frame shape in a plan view. The common electrode 30 surrounds the outside of the four concave surfaces 17 (four detection electrodes 20). The common electrode 30 is also provided with an extended common electrode 31 that extends in the first direction X1 at the center of the individual detection area 5 in the second direction Y.

[0024] As shown in Fig. 4, a first contact hole 6 extending in the second stacking direction Z2 is formed in the center of the concave surface 17. In addition, a second contact hole 7 extending in the second stacking direction Z2 is formed on the first surface 16 in a range overlapping with the common electrode 30. As shown in Fig. 2, a first contact portion 6a connecting to the detection electrode 20 is formed in the first contact hole 6. A second contact portion 7a connecting to the common electrode 30 is formed in the second contact hole 7. Next, the circuit configuration formed in the array layer 12 of the array substrate 10 will be described.

[0025] Fig. 5 is a circuit diagram showing the circuit configuration of the detection device of embodiment 1. As shown in Fig. 5, transistors 40, gate lines 46, signal lines 47, reference potential lines 48, connection sections 50 (see Fig. 1), gate line drive circuits 51 (see Fig. 1), signal line selection circuits 52 (see Fig. 1), and common lines 53 (see Fig. 1) are formed inside the array layer 12. Furthermore, a plurality of transistors 40, gate lines 46, signal lines 47, and reference potential lines 48 are formed in the array layer 12 (array substrate 10).

[0026] The transistor 40 is a switching element. A plurality of transistors 40 are arranged in each individual detection region 5. As shown in FIG. 2, the transistor 40 includes a semiconductor layer 41, a gate insulating film 42, a gate electrode 43, a drain electrode 44, and a source electrode 45. An end of the source electrode 45 in the first stacking direction Z1 is connected to a connection wiring 49. The connection wiring 49 extends in the planar direction (see FIG. 4) and is connected to the first contact portion 6a. Thus, the source electrode 45 is connected to the detection electrode 20 via the connection wiring 49 and the first contact portion 6a. As shown in FIG. 4, a rectangular frame-shaped annular wiring 49a is provided at one end of the connection wiring 49. The annular wiring 49a is connected to all four first contact portions 6a (four detection electrodes 20) arranged in one individual detection region 5.

[0027] As shown in FIG. 5, the gate line 46 extends in a first direction X. The multiple gate lines 46 are arranged in a second direction Y. As shown in FIG. 4, the gate line 46 has a branch portion 46u extending in the second direction Y. The branch portion 46u is provided in each individual detection region 5. The gate line 46 is connected to each gate electrode 43 (see FIG. 2) of the multiple transistors 40 arranged in the first direction X via the branch portion 46u.

[0028] 5, the signal line 47 extends in the second direction Y. The signal lines 47 are arranged in the first direction X. The signal lines 47 are connected to the drain electrodes 44 (see FIG. 2) of the transistors 40 arranged in the second direction Y.

[0029] 5, the reference potential wiring 48 extends in the second direction Y. The multiple reference potential wirings 48 are arranged in the first direction X. As shown in FIG. 2, the reference potential wiring 48 is connected to the second contact portion 7a of the common electrode 30.

[0030] 1, a connection section 50, a gate line driving circuit 51, a signal line selection circuit 52, and a common wiring 53 are arranged in the peripheral region 4 of the array layer 12. The connection section 50 is for connecting to a driving IC (Integrated Circuit) arranged outside the detection device 100. The driving IC may be mounted as a COF (Chip On Film) on a flexible printed circuit board or a rigid board connected to the connection section 50. Alternatively, the driving IC may be mounted as a COG (Chip On Glass) in the peripheral region 4 of the array substrate 10.

[0031] The gate line driving circuit 51 is a circuit that drives the multiple gate lines 46 (see FIG. 5) based on various control signals from the driving IC. The gate line driving circuit 51 selects the multiple gate lines 46 sequentially or simultaneously, and supplies gate driving signals to the selected gate lines 46.

[0032] The signal line selection circuit 52 is a switch circuit that sequentially or simultaneously selects a plurality of signal lines 47 (see FIG. 5). The signal line selection circuit 52 is, for example, a multiplexer. The signal line selection circuit 52 connects the selected signal line 47 to the driving IC based on a selection signal supplied from the driving IC.

[0033] The common wiring 53 is connected to the driving IC via the connection portion 50, and a constant amount of current is supplied from the driving IC. The common wiring 53 extends along the peripheral region in a ring shape. The reference potential wiring 48 is connected to the common wiring 53. This allows a constant amount of current to be supplied to the common electrode 30.

[0034] 2, the sensor layer 70 is made of a resin material having electrical conductivity (hereinafter referred to as a conductive resin material). The sensor layer 70 is formed by printing on the first surface 16 of the array substrate 10, and is planar along the first surface 16. That is, the sensor layer 70 is formed by applying a paste-like conductive resin material to the first surface 16 and then curing it. Therefore, a surface 71 of the sensor layer 70 facing the second stacking direction Z2 is welded to the first surface 16.

[0035] Here, the first surface 16 has a plurality of concave surfaces 17 formed in an area overlapping the detection region 3 (see FIG. 3). Therefore, the first surface 16 is water-repellent, and the conductive resin material applied to the first surface 16 does not move along the first surface 16 (does not spread toward the concave surfaces 17). In other words, the portion of the surface 71 of the sensor layer 70 facing the concave surfaces 17 hardens while maintaining surface tension. Therefore, the portion of the surface 71 of the sensor layer 70 facing the concave surfaces 17 forms a bulging surface 72 that bulges out in the second stacking direction Z2 from the surface 71.

[0036] The bulging surface 72 formed by the above configuration is spaced apart from the detection electrode 20. An internal space S is formed within the recessed surface 17. Since the bulging surface 72 bulges in the second stacking direction Z2, there is a possibility that the bulging surface 72 may adhere to the vicinity of the edge portion 17a of the recessed surface 17. However, the detection electrode 20 of this embodiment is not provided on the edge portion 17a of the recessed surface 17. In other words, in this embodiment, the sensor layer 70 (bulging surface 72) and the detection electrode 20 are reliably spaced apart.

[0037] 2, the protective layer 80 is a layer provided on a surface 73 of the sensor layer 70 in the first stacking direction Z1, and is made of an insulating material. The surface of the protective layer 80 in the first stacking direction serves as the detection surface 1.

[0038] 6 is a cross-sectional view schematically illustrating a state in which pressure is input to the detection device of embodiment 1. Next, an example of the operation of the detection device 100 will be described. As shown in FIG. 6, when pressure F1 is input to the detection surface 1, the protective layer 80 and the sensor layer 70 in the individual detection region 5 to which pressure F1 is input are deformed in the second stacking direction Z2. Then, a portion of the bulging surface 72 of the sensor layer 70 comes into contact with the detection electrode 20. As a result, a current flows from the common electrode 30 to the detection electrode 20 via the sensor layer 70 (see arrow A1 in FIG. 5).

[0039] The detection electrode 20 of this embodiment has a hemispherical shape, and the edge portion 20b of the detection electrode 20 is disposed closer to the first stacking direction Z1 than the central portion 20a of the detection electrode 20. In the example shown in FIG. 6, the bulging surface 72 of the sensor layer 70 is in contact only with the edge portion 20b of the detection electrode 20.

[0040] 7 is a cross-sectional view schematically illustrating a state in which a greater pressure than that shown in FIG. 6 is applied. Furthermore, as shown in FIG. 7, when a greater pressure F2 is applied to the detection surface 1, the sensor layer 70 also undergoes a greater amount of movement (deformation) in the second stacking direction Z2. Therefore, the bulging surface 72 contacts not only the edge 20b of the detection electrode 20 but also the center 20a of the detection electrode 20. This means that the contact area between the sensor layer 70 and the detection electrode 20 increases, and the amount of current flowing from the common electrode 30 to the detection electrode 20 increases (see arrow A2 in FIG. 7).

[0041] Furthermore, the electrical signal (current value) input to the detection electrode 20 is output by the signal line 47. Then, the load input to the individual detection area 5 is calculated based on the magnitude of the current value. When the input of pressures F1 and F2 is released, the sensor layer 70 returns to its original shape. In other words, the sensor layer 70 moves away from the detection electrode 20. Therefore, no current flows through the detection electrode 20, and no pressure is detected.

[0042] As described above, according to this embodiment, the sensor layer 70 printed on the first surface 16 of the array substrate 10 is spaced apart from the detection electrodes 20. Therefore, it is possible to employ a structure in which the contact area of ​​the sensor layer 70 with the detection electrodes 20 increases or decreases in proportion to the magnitude of the input pressure.

[0043] Although the first embodiment has been described above, the present disclosure is not limited to the example described in the first embodiment. For example, the common electrode 30 is formed on the first surface 16 of the array substrate 10, but may be provided between the sensor layer 70 and the protective layer 80. Furthermore, in the present embodiment, four concave surfaces 17 (four detection electrodes 20) are provided for one individual detection region 5, but in the present disclosure, there may be only one concave surface 17 (detection electrode 20), and the number of concave surfaces 17 (detection electrodes 20) is not particularly limited.

[0044] Furthermore, although the detection electrode 20 is provided away from the edge 17a of the concave surface 17, the detection electrode of the present disclosure may be provided on the edge 17a of the concave surface 17 as long as contact with the sensor layer 70 can be avoided. Furthermore, to more reliably avoid contact between the detection electrode 20 and the sensor layer 70, the detection device 100A of the following modified example 1 may be used. Below, the modified example will be described, focusing on the differences from embodiment 1.

[0045] (Variation 1) FIG. 8 is a schematic cross-sectional view of a detection device according to Modification 1. The detection device 100A of Modification 1 differs from Embodiment 1 in that a film 18 is provided on the edge 17a of the concave surface 17. The film 18 is made of fluorine-based polyimide. The film 18 is formed in a ring shape along the edge 17a. The fluorine-based polyimide film 18 has high water repellency. According to Modification 1, the portion of the sensor layer 70 facing the concave surface 17 is less likely to spread from the first surface 16 toward the edge 17a of the concave surface 17. In other words, the portion of the surface 71 of the sensor layer 70 facing the concave surface 17 is more likely to harden while maintaining surface tension. From the above, a detection device 100A can be manufactured in which the sensor layer 70 and the detection electrode 20 are spaced apart.

[0046] Although the first modification has been described above, in the present disclosure, the material for forming film 18 is not limited to fluorine-based polyimide, as long as it is a highly water-repellent material. Also, although film 18 is provided only on edge 17a of concave surface 17, it may be provided so as to extend toward first surface 16.

[0047] Additionally, although the shape of the concave surface 17 is hemispherical in the first embodiment, the present disclosure does not particularly limit the shape of the concave surface 17 as long as it is recessed from the first surface 16. Furthermore, the concave surface 17 may have a shape as shown in the following modified example 2.

[0048] (Variation 2) 9 is a view of a portion of the first surface of the array substrate of Modification 2 as viewed from the sensor layer side. As shown in Fig. 9, the concave surface 17B of the detection device 100B of Modification 2 differs from that of Embodiment 1 in that it has a rectangular shape in a plan view. Even with such concave surface 17B, the first surface 16 has a fine uneven structure and is difficult to wet (has water repellency).

[0049] FIG. 10 is a cross-sectional view of the concave surface of the array substrate of Modification 2 cut in the stacking direction. As shown in FIG. 10, the concave surface 17B has a bottom surface 170 and four side surfaces 171 (only two are shown in FIG. 10). The bottom surface 170 extends in the planar direction. The distance L between two opposing side surfaces 171 is gradually reduced in the second stacking direction Z2. That is, the concave surface 17B is formed in the shape of a quadrangular pyramid. The detection electrode 20 is formed across the bottom surface 170 and the four side surfaces 171. The detection electrode 20 is not provided on the edge portion 17a of the concave surface 17B (the end portion of the side surface 171 in the first stacking direction Z1).

[0050] 11 is a cross-sectional view schematically illustrating a state in which pressure is applied to the detection device of Modification 2. According to Modification 2, when a relatively small pressure F3 is applied to the detection surface 1, the sensor layer 70 deforms in the second stacking direction Z2. A portion of the bulging surface 72 of the sensor layer 70 then contacts the edge portion 20b of the detection electrode 20. As a result, a current flows from the common electrode 30 to the detection electrode 20 via the sensor layer 70.

[0051] Furthermore, although not specifically shown, when a pressure greater than pressure F3 is input, the bulging surface 72 of the sensor layer 70 contacts not only the edge portion 20b of the detection electrode 20 but also the center portion 20a of the detection electrode 20. Therefore, the amount of current flowing from the common electrode 30 to the detection electrode 20 is greater than when pressure F3 is input. As described above, in the detection device 100B of Modification 2 as well, the contact area of ​​the sensor layer 70 with the detection electrode 20 increases or decreases in proportion to the magnitude of the input pressure. Note that, in the present disclosure, Modification 2 may be provided with the fluorine-based polyimide film 18 described in Modification 1.

[0052] Next, other modified examples 3 to 6 will be described.

[0053] (Variation 3) FIG. 12 is a cross-sectional view of the array substrate of Modification 3 cut in the stacking direction. As shown in FIG. 12, the detection device 100C of Modification 3 differs from Embodiment 1 in that a communication hole 60 is formed. The communication hole 60 is a hole that connects the internal space S of the concave surface 17 with the external space. The communication hole 60 is provided in the array substrate 10. One end 60a of the communication hole 60 is provided in the edge portion 17a of the concave surface 17. The communication hole 60 extends from the edge portion 17a of the concave surface 17 in the planar direction and then extends in the second stacking direction Z2. The other end 60b of the communication hole 60 is provided in the back surface 2 of the detection device 100C.

[0054] If the internal space S of the concave surface 17 were sealed, the input of pressure would increase the air pressure inside the concave surface 17, making it difficult for the sensor layer 70 to contact the detection electrode 20. On the other hand, according to Modification 3, when pressure is input, the gas in the internal space S of the concave surface 17 passes through the communication holes 60 and is discharged to the external space. This prevents the sensor layer 70 from being difficult to contact the detection electrode 20.

[0055] (Variation 4) 13 is a cross-sectional view of the array substrate of Modification 4 cut in the stacking direction. As shown in FIG. 13, the detection device 100D of Modification 4 differs from Modification 3 in that communication holes 160 are formed in the sensor layer 70 and the protective layer 80. One end 160a of the communication hole 160 is provided in the bulging surface 72. The communication hole 160 extends from the bulging surface 72 in the first stacking direction Z1. The other end 160b of the communication hole 160 is provided in the detection surface 1 of the detection device 100D. As with Modification 3, Modification 4 also avoids the problem of the sensor layer 70 becoming less likely to come into contact with the detection electrode 20.

[0056] (Variation 5) FIG. 14 is a cross-sectional view of the array substrate of Modification 5 cut in the stacking direction. As shown in FIG. 14, the detection device 100E of Modification 5 differs from Modification 3 in that a communication hole 260 is formed on the first surface 16 of the array substrate 10. The communication hole 260 is a groove recessed from the first surface 16 in the second stacking direction Z2 and extending in the planar direction. One end 260a of the communication hole 260 is provided on the edge 17a of the concave surface 17. The other end 260b of the communication hole 260 is provided on the edge 17a of the concave surface 17 adjacent to the concave surface 17 to which the one end 260a is connected. Thus, the communication hole 260 communicates with the internal spaces S of adjacent concave surfaces 17. The communication hole 260 also connects all of the multiple internal spaces S. According to the fifth modification, the gas in the internal space S whose air pressure has increased due to the input of pressure moves to another internal space S through the communication hole 260. This prevents the sensor layer 70 from being difficult to contact with the detection electrode 20.

[0057] (Variation 6) FIG. 15 is a cross-sectional view of the array substrate of Modification 6 cut in the stacking direction. As shown in FIG. 15, the detection device 100F of Modification 6 differs from Modification 3 in that a communication hole 360 ​​is formed across the array substrate 10, the sensor layer 70, and the protective layer 80. The communication hole 360 ​​has a horizontal hole 361 and a vertical hole 362. The horizontal hole 361 is a groove recessed from the first surface 16 in the second stacking direction Z2 and extending in the planar direction. The vertical hole 362 is a hole extending from the horizontal hole 361 in the first stacking direction Z1 and penetrating the sensor layer 70 and the protective layer 80. According to Modification 6, gas in the internal space S, whose air pressure has increased due to input pressure, flows through the horizontal hole 361 and then the vertical hole 362 and is discharged in the first stacking direction Z1 of the detection surface 1. This prevents the sensor layer 70 from easily contacting the detection electrode 20. In the present disclosure, the communication holes shown in Modifications 3 to 6 may be combined with each other.

[0058] The above describes the embodiments and various modified examples. Regarding the sensor layer, while the embodiments have exemplified a sensor layer formed from a conductive resin material, the present disclosure may also be directed to a sensor layer having a deformable insulating body portion, such as silicone rubber, and conductive particles dispersed within the body portion. When no pressure is applied to such a sensor layer, the resistance value is high. On the other hand, when pressure is applied to the sensor layer and the body portion deforms, the conductive particles come into contact with or are close to each other, thereby reducing the resistance value of the sensor layer. However, in the present disclosure, the material of the sensor layer is limited to a material that can be printed on the first surface. [Explanation of symbols]

[0059] 1 Detection surface 2 Back side 3 Detection Area 4. Surrounding Areas 5 Individual detection areas 10 Array board 11 Base material 12 Array Layer 16 Page 1 17, 17B concave 18 membrane 20 detection electrode 30 common electrode 60, 160, 260, 360 communication hole 70 Sensor Layer 80 protective layer 100, 100A, 100B, 100C, 100D, 100E, 100F Detector

Claims

1. an array substrate and a sensor layer stacked in this order; a direction in which the sensor layer is arranged as viewed from the array substrate is defined as a first stacking direction; a second stacking direction opposite to the first stacking direction; The array substrate comprises: a first surface facing the first stacking direction; a plurality of concave surfaces recessed from the first surface in the second stacking direction; a plurality of detection electrodes provided on the concave surface; and the sensor layer is formed by printing a conductive resin material on the first surface and curing the printed material; The sensor layer and the detection electrode are spaced apart from each other. Detection device.

2. the concave surface has an edge portion located at an end of the concave surface in the first stacking direction, The detection electrode is disposed in the second stacking direction further than the edge portion. The detection device according to claim 1 .

3. A film made of fluorine-based polyimide is formed on the edge of the concave surface. The detection device according to claim 2 .

4. The concave surface is formed in a semispherical shape. The detection device according to claim 1 .

5. The concave surface is formed in a quadrangular pyramid shape. The detection device according to claim 1 .

6. At least one of the sensor layer and the array substrate has a communication hole formed therein that connects the internal space of the concave surface with an external space or that connects the internal space of one concave surface with the internal space of another concave surface. The detection device according to claim 1 .

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