Processing apparatus and processing method

Abstract

To suppress deterioration of processing quality.SOLUTION: The machining device 1 includes the holding unit 10 that holds the workpiece 200, the first machining unit 20-1 and the second machining unit 20-2 that machine the workpiece 200, the X-axis moving unit 41 that moves the holding unit 10 in the X-axis direction, the first 1Y moving unit 42-1 that moves the first machining unit 20-1 in the Y-axis direction, the second 2Y moving unit 42-2 that moves the second machining unit 20-2 in the Y-axis direction, and the controller 100. The amount of movement of the first 1Y moving unit 42-1 is set on the basis of the processing size of the workpiece 200 and the widths of grooves formed by the first processing unit 20-1, and the amount of movement of the second 2Y moving unit 42-2 is set on the basis of the processing size and the widths of grooves formed by the second processing unit 20-2.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing device including a first processing unit and a second processing unit, and a processing method. [Background technology]

[0002] A method known as dual cut is used in which two cutting blades are used to simultaneously process a workpiece (see, for example, Patent Document 1).

[0003] In the dual cut shown in the aforementioned Patent Document 1, each cutting blade processes one line on the workpiece, then each cutting blade is moved one pitch, and then each cutting blade processes one line on the workpiece. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-3888 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the method described in Patent Document 1, when machining is performed by moving the cutting blade by the same pitch, there is a risk that the chip sizes formed by cutting will differ between the area machined by one cutting blade and the area machined by the other cutting blade, which could result in a decrease in machining quality, and improvement is urgently needed.

[0006] The present invention has been made in view of the above circumstances, and has an object to provide a processing device and a processing method that can suppress a decrease in processing quality. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems and achieve the object, the processing device of the present invention includes a holding unit for holding a workpiece, a first processing unit and a second processing unit each for processing the workpiece held by the holding unit, a processing feed unit for moving the holding unit in a processing feed direction relative to the first processing unit and the second processing unit, an indexing feed unit for the first processing unit for moving the first processing unit in an indexing feed direction intersecting the processing feed direction relative to the holding unit holding the workpiece, and and a controller that controls at least the indexing feed unit, the indexing feed unit for the first machining unit, and the indexing feed unit for the second machining unit, wherein the movement amount of the indexing feed unit for the first machining unit is set based on the machining size of the workpiece and the width of the groove formed by the first machining unit, and the movement amount of the indexing feed unit for the second machining unit is set based on the machining size and the width of the groove formed by the second machining unit.

[0008] In the processing device, the processing device may be equipped with a reading unit that reads an information code, and the controller may have a memory unit that stores the processing size, and the movement amount of the indexing feed unit for the first processing unit may be set by reading an information code containing information on the width of the groove formed by the first processing unit with the reading unit, and the movement amount of the indexing feed unit for the second processing unit may be set by reading an information code containing information on the width of the groove formed by the second processing unit with the reading unit.

[0009] In the processing device, the processing device may further include an imaging unit that images the workpiece held by the holding unit, and the controller may detect the width of the groove formed by the first processing unit from an image captured by the imaging unit, and may also detect the width of the groove formed by the second processing unit from an image captured by the imaging unit, and may set the movement amounts of the indexing feed unit for the first processing unit and the indexing feed unit for the second processing unit, respectively.

[0010] The machining method of the present invention comprises a holding step of holding a workpiece with a holding unit; a machining step of forming grooves along a machining feed direction in the workpiece held by the holding unit using a first machining unit and a second machining unit; after the machining step, a positioning step of positioning the first machining unit and the second machining unit on the workpiece by moving the first machining unit a predetermined amount in an index feed direction intersecting the machining feed direction and moving the second machining unit a predetermined amount in the index feed direction; and a setting step of setting the movement amounts of the first machining unit and the second machining unit in the index feed direction, respectively.In the setting step, the movement amount of the first machining unit is set based on the machining size of the workpiece and the width of the groove formed by the first machining unit, and the movement amount of the second machining unit is set based on the machining size and the width of the groove formed by the second machining unit.

[0011] In the processing method, in the setting step, the movement amount of the first processing unit may be set by reading an information code containing information on the width of the groove formed by the first processing unit with a reading unit, and the movement amount of the second processing unit may be set by reading an information code containing information on the width of the groove formed by the second processing unit with a reading unit.

[0012] The processing method may also include a second setting step in which the width of the groove formed by the first processing unit is detected from an image captured by an imaging unit of the groove formed by the second processing unit, and the width of the groove is detected from an image captured by an imaging unit of the groove formed by the second processing unit, and second movement amounts of the first processing unit and the second processing unit are respectively set. [Effects of the Invention]

[0013] The present invention has an effect of suppressing deterioration in processing quality. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a processing device according to the first embodiment. [Figure 2] FIG. 2 is a perspective view schematically showing the configuration of a workpiece to be processed by the processing apparatus shown in FIG. [Figure 3] 3 is a perspective view showing a cutting blade and a blade case of the processing device shown in FIG. 1. FIG. [Figure 4] FIG. 4 is a plan view showing a modification of the blade case shown in FIG. [Figure 5] FIG. 5 is a flowchart showing the flow of the processing method according to the first embodiment. [Figure 6] FIG. 6 is a side view, partly in section, schematically showing the holding step of the processing method shown in FIG. [Figure 7] FIG. 7 is a side view, partly in section, showing a schematic representation of the initial positioning step of the processing method shown in FIG. [Figure 8] FIG. 8 is a side view, partly in section, schematically showing the first processing step of the processing method shown in FIG. [Figure 9] FIG. 9 is a side view, partly in section, showing a schematic representation of the positioning step following step 305 of the processing method shown in FIG. [Figure 10] FIG. 10 is a side view, partly in section, schematically showing a processing step after the positioning step shown in FIG. [Figure 11] FIG. 11 is a flowchart showing the flow of the processing method according to the second embodiment. [Figure 12] FIG. 12 is a side view, partially in section, schematically showing a state in which the width of the groove formed by the first machining unit is detected in the second setting step of the machining method shown in FIG. [Figure 13] FIG. 13 is a side view, partially in section, schematically showing a state in which the width of the groove formed by the second machining unit is detected in the second setting step of the machining method shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0015] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0016] [Embodiment 1] A processing device according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing an example of the configuration of the processing device according to the first embodiment. Fig. 2 is a perspective view schematically showing the configuration of a workpiece to be processed by the processing device shown in Fig. 1. Fig. 3 is a perspective view showing a cutting blade and a blade case of the processing device shown in Fig. 1. Fig. 4 is a plan view showing a modified example of the blade case shown in Fig. 3.

[0017] (Workpiece) The processing apparatus 1 according to the first embodiment, shown in Fig. 1, is a cutting apparatus that cuts a workpiece 200 shown in Fig. 2. The workpiece 200 to be processed by the processing apparatus 1 according to the first embodiment is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, whose substrate is made of silicon, gallium arsenide, SiC (silicon carbide), sapphire, or the like. As shown in Figs. 1 and 2, the workpiece 200 has devices 203 formed in areas partitioned in a grid pattern by a plurality of planned dividing lines 202 formed in a grid pattern on a surface 201.

[0018] The device 203 is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), a MEMS (Micro Electro Mechanical Systems), or various types of memory (semiconductor memory device).

[0019] Furthermore, the workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer in which the central portion is thinned and a thick portion is formed on the periphery, or, in addition to a wafer, may be a resin package substrate such as a rectangular QFN (Quad Flat No leaded) package substrate having multiple devices sealed with resin, a ceramic substrate, a ferrite substrate, a substrate containing at least one of nickel and iron, a glass substrate, or the like.

[0020] In the first embodiment, the workpiece 200 has a tape 206 attached to a back surface 204 thereof, the tape 206 having an annular frame 205 attached to its outer periphery, and is supported within an opening 207 of the annular frame 205 .

[0021] (Processing equipment) The processing apparatus 1 according to the first embodiment is a processing apparatus that holds a workpiece 200 with a holding unit 10, cuts a planned dividing line 202 with a cutting blade 21, forms grooves 208 (shown by dashed lines in FIG. 2) that cut the workpiece 200 along the planned dividing line 202, and divides the workpiece 200 into individual chips 210. Each chip 210 includes a part of a substrate and a device 203 formed on a surface 201 of the substrate. In the first embodiment, the chip 210 has a square planar shape.

[0022] As shown in FIG. 1, the processing device 1 includes a holding unit 10 that suction-holds the workpiece 200 on a holding surface 11, a processing unit 20 that cuts the workpiece 200 held by the holding unit 10 with a cutting blade 21, an imaging unit 30 that images the workpiece 200 held by the holding unit 10, and a controller 100.

[0023] 1, the processing device 1 also includes a moving unit 40 that moves the holding unit 10 and the processing unit 20 relatively. The moving unit 40 includes at least an X-axis moving unit 41, which is a processing feed unit that processes and feeds the holding unit 10 in the X-axis direction parallel to the horizontal direction, a Y-axis moving unit 42, which is an indexing feed unit that indexes and feeds the processing unit 20 in the Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction, a Z-axis moving unit 43, which is a cutting feed unit that cuts and feeds the processing unit 20 in the Z-axis direction parallel to the vertical direction and perpendicular to both the X-axis and Y-axis directions, and a rotational moving unit 44 that rotates the holding unit 10 around an axis parallel to the Z-axis direction.

[0024] As shown in Figure 1, the processing device 1 is equipped with two processing units 20, i.e., a two-spindle dicer, a so-called facing dual-type cutting device. Hereinafter, one processing unit 20 will be referred to as a first processing unit 20-1, and the other processing unit 20 will be referred to as a second processing unit 20-2. The movement units 40 of the processing device 1 are equipped with two Y-axis movement units 42 and two Z-axis movement units 43, and the two Y-axis movement units 42 and Z-axis movement units 43 correspond to the processing units 20-1 and 20-2, respectively.

[0025] Note that, hereinafter, one Y-axis moving unit 42 corresponding to the first machining unit 20-1 will be referred to as a first Y-axis moving unit 42-1 (equivalent to the indexing feed unit for the first machining unit), and the other Y-axis moving unit 42 corresponding to the second machining unit 20-2 will be referred to as a second Y-axis moving unit 42-2 (equivalent to the indexing feed unit for the second machining unit). Also, one Z-axis moving unit 43 corresponding to the first machining unit 20-1 will be referred to as a first Z-axis moving unit 43-1 (equivalent to the infeed feed unit for the first machining unit), and the other Z-axis moving unit 43 corresponding to the second machining unit 20-2 will be referred to as a second Z-axis moving unit 43-2 (equivalent to the infeed feed unit for the second machining unit).

[0026] The X-axis moving unit 41 is installed in the device main body 2. The X-axis moving unit 41 moves the holding unit 10 together with the rotational moving unit 44 in the X-axis direction, which is the processing feed direction, to process and feed the holding unit 10 along the X-axis direction relative to the first processing unit 20-1 and the second processing unit 20-2.

[0027] The Y-axis movement units 42-1 and 42-2 are installed on a gate-shaped support frame 3 that stands upright from the apparatus main body 2. The first Y-axis movement unit 42-1 moves the first processing unit 20-1 in the Y-axis direction relative to the holding unit 10 that holds the workpiece 200. The second Y-axis movement unit 42-2 moves the second processing unit 20-2 in the Y-axis direction relative to the holding unit 10 that holds the workpiece 200.

[0028] The Z-axis moving units 43-1 and 43-2 are installed on a moving frame 4 that is moved in the Y-axis direction by the Y-axis moving units 42-1 and 42-2. The first Z-axis moving unit 43-1 moves the first processing unit 20-1 in the Z-axis direction relative to the holding unit 10 that holds the workpiece 200. The second Z-axis moving unit 43-2 moves the second processing unit 20-2 in the Z-axis direction relative to the holding unit 10 that holds the workpiece 200.

[0029] The X-axis moving unit 41, the Y-axis moving units 42-1 and 42-2, and the Z-axis moving units 43-1 and 43-2 are each equipped with a well-known ball screw rotatably mounted about its axis, a well-known motor for rotating the ball screw about its axis, and a well-known guide rail for supporting the holding unit 10 or the processing units 20-1 and 20-2 movably in the X-axis, Y-axis, or Z-axis direction. The rotational moving unit 44 is equipped with a well-known motor for rotating the holding unit 10 about its axis.

[0030] The holding unit 10 is disk-shaped, and a holding surface 11 that holds the workpiece 200 is formed from porous ceramic or the like. The holding unit 10 is provided so as to be movable in the X-axis direction by an X-axis moving unit 41 between a processing area below the processing units 20-1 and 20-2 and a carry-in / out area that is spaced from below the processing units 20-1 and 20-2 and where the workpiece 200 is carried in and out, and is provided so as to be rotatable about an axis parallel to the Z-axis direction by a rotation moving unit 44.

[0031] The holding unit 10 has a holding surface 11 connected to a vacuum suction source (not shown), and is sucked by the vacuum suction source to suction and hold the workpiece 200 placed on the holding surface 11. In the first embodiment, the holding unit 10 sucks and holds the back surface 204 of the workpiece 200 via tape 206. Also, as shown in FIG. 1, a plurality of clamping sections 12 that clamp a frame 205 are provided around the periphery of the holding unit 10.

[0032] The processing units 20-1 and 20-2 are cutting units to which a cutting blade 21 that cuts the workpiece 200 held by the holding unit 10 is detachably attached. The processing units 20-1 and 20-2 are attached to a second moving frame 5 that is movable in the Z-axis direction by corresponding Z-axis moving units 43-1 and 43-2, respectively, and are provided so as to be movable in the Y-axis direction by Y-axis moving units 42-1 and 42-2 relative to the workpiece 200 held by the holding unit 10, and are also provided so as to be movable in the Z-axis direction by Z-axis moving units 43-1 and 43-2. ​​The processing units 20-1 and 20-2 can position the cutting blade 21 at any position on the holding surface 11 of the holding unit 10 by the Y-axis moving units 42-1 and 42-2 and the Z-axis moving units 43-1 and 43-2.

[0033] The machining units 20-1 and 20-2 each include a cutting blade 21, a spindle housing 22 attached to the lower end of the second moving frame 5 and movable in the Y-axis and Z-axis directions by Y-axis moving units 42-1 and 42-2 and Z-axis moving units 43-1 and 43-2, a spindle 23 serving as a rotating shaft rotatably mounted on the spindle housing 22 around its axis, a spindle motor (not shown) that rotates the spindle 23 around its axis, and a cutting water supply nozzle that supplies cutting water to the cutting blade.

[0034] The cutting blade 21 is an extremely thin cutting grindstone having a substantially ring shape for cutting the workpiece 200. In the first embodiment, the cutting blade 21 is a so-called hub blade having an annular cutting edge 24 for cutting the workpiece 200 and an annular base 25 on whose outer edge the cutting edge 24 is provided, as shown in FIG. 3 . The cutting edge 24 is made of abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bonding material such as metal or resin, and is formed to a predetermined thickness. In the present invention, the cutting blade 21 may be a so-called washer blade consisting of only the cutting edge 24.

[0035] In the first embodiment, the cutting blade 21 has an information code 26 provided on the annular base 25. The information code 26 records at least the width of a groove formed by cutting the workpiece 200 before the cutting blade 21 is shipped from the factory, and the radial distance between the outer edge of the cutting blade 24 and the outer edge of the annular base 25, which is the cutting edge exposure amount of the cutting blade 24. The width of the groove formed by cutting the workpiece 200 before the cutting blade 21 is shipped from the factory corresponds to the width of the groove formed in the processing units 20-1 and 20-2 to which the cutting blade 21 is attached.

[0036] In the first embodiment, the information code 26 is a barcode, but any type of identification code or identification mark that can identify an individual, such as a two-dimensional code, a character string, a symbol, or a concavo-convex pattern, may be used. Also, in the first embodiment, the information code 26 is formed on a sticker attached to the surface of the annular base 25.

[0037] The cutting blade 21 is housed in a blade case 60 shown in Fig. 3 and shipped from a factory. As shown in Fig. 3, the blade case 60 integrally comprises a housing section 61 that houses the cutting blade 21 and a lid 63 that is rotatably formed on the housing section 61 by a self-hinge 62. The lid 63 rotates by the self-hinge 62 and is displaced between a closed position where the lid 63 closes an opening surrounding the outer edge of the housing section 61 to house the cutting blade 21 inside the blade case 60, and an open position where the opening is open to allow the cutting blade 21 to be inserted into or removed from the housing section 61.

[0038] In the present invention, the information code 26 may be formed on the surface of the blade case 60 (on the surface of the lid 63 in FIG. 4), as shown in FIG. 4. In FIG. 4, the same parts as those in the example shown in FIG. 3 are denoted by the same reference numerals, and their explanation will be omitted. In the example shown in FIG. 4, the information code 26 is formed on the surface of the lid 63.

[0039] The spindle housing 22 is attached to the lower end of the second moving frame 5, and is supported by Z-axis moving units 43-1 and 43-2 for movement in the Z-axis direction, and is supported by Y-axis moving units 42-1 and 42-2 for movement in the Y-axis direction via the Z-axis moving units 43-1 and 43-2 and the moving frame 4. The spindle housing 22 accommodates the portion of the spindle 23 excluding the tip end thereof, as well as a spindle motor (not shown), and supports the spindle 23 for rotation about its axis.

[0040] The cutting blade 21 is detachably fixed to the tip of the spindle 23. The spindle 23 is rotated by a spindle motor (not shown), and the cutting blade 21 is attached to the tip of the spindle 23. The axes of the spindle 23 and the cutting blade 21 of the processing units 20-1 and 20-2 are parallel to the Y-axis direction.

[0041] The imaging unit 30 captures an image of the workpiece 200 held by the holding unit 10 and acquires the captured image. The imaging unit 30 is fixed to the first machining unit 20-1 so as to move integrally with the first machining unit 20-1. The imaging unit 30 includes an imaging element that captures an image of the area to be cut of the workpiece 200 held by the holding unit 10 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 30 captures an image of the workpiece 200 held by the holding unit 10 and acquires an image for performing alignment between the workpiece 200 and the cutting blade 21, and outputs the acquired image to the controller 100.

[0042] The machining apparatus 1 also includes an X-axis position detection unit (not shown) for detecting the position of the holding unit 10 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the positions of the machining units 20-1 and 20-2 in the Y-axis direction, and a Z-axis position detection unit for detecting the positions of the machining units 20-1 and 20-2 in the Z-axis direction. The X-axis position detection unit and the Y-axis position detection unit can be configured with a linear scale parallel to the X-axis or Y-axis direction and a read head. The Z-axis position detection unit detects the positions of the machining units 20-1 and 20-2 in the Z-axis direction using motor pulses.

[0043] The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit output the position of the holding unit 10 in the X-axis direction and the position of the processing units 20-1 and 20-2 in the Y-axis direction or the Z-axis direction to the controller 100. The angle detection unit outputs the angle from a reference position around the axis of the holding unit 10 to the controller 100. In the first embodiment, the position of each component of the processing device 1 in the X-axis direction, the Y-axis direction, and the Z-axis direction is determined based on a predetermined reference position (not shown).

[0044] The processing device 1 also includes a cassette elevator 50 on which a cassette 6 containing the workpiece 200 before and after cutting is placed and which moves the cassette 6 in the Z-axis direction, a cleaning unit 51 which cleans the workpiece 200 after cutting, and a transport unit (not shown) which transports the workpiece 200 between the cassette 6, the holding unit 10, and the cleaning unit 51.

[0045] The controller 100 also controls each component of the processing apparatus 1 to cause the processing apparatus 1 to perform a processing operation on the workpiece 200. That is, the controller 100 controls at least the X-axis moving unit 41, the first Y-axis moving unit 42-1, and the second Y-axis moving unit 42-2.

[0046] The controller 100 is a computer having an arithmetic processing device with a microprocessor such as a CPU (central processing unit), a storage device with memory such as a ROM (read only memory) or RAM (random access memory), and an input / output interface device. The arithmetic processing device of the controller 100 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs control signals for controlling the processing device 1 to each component of the processing device 1 via the input / output interface device.

[0047] The controller 100 is connected to a display unit 110 configured with a liquid crystal display device or the like that displays the status of the processing operation and captured images, an input unit 120 that the operator uses to register processing conditions and the like, a notification unit (not shown), and a reading unit 130. That is, the processing device 1 includes the display unit 110, the input unit 120, the notification unit, and the reading unit 130.

[0048] The input unit 120 includes a touch panel provided on the display unit. The alarm unit emits at least one of sound and light to notify the operator. The reading unit 130 reads the information code 26 formed on the surface of the annular base 25 of the cutting blade 21 and outputs the read information to the controller 100. In the first embodiment, the reading unit 130 is a barcode reader that reads barcodes.

[0049] In the first embodiment, the controller 100 includes a processing control unit 101 and a storage unit 102. The processing control unit 101 controls each component of the processing device 1 to cause the processing device 1 to perform a processing operation on the workpiece 200.

[0050] The storage unit 102 stores the length L of one side of the chip 210 (shown in FIG. 2, hereinafter referred to as chip size), which is a processing size that is part of the processing conditions.

[0051] The functions of the storage unit 102 are realized by the above-mentioned storage device, and the functions of the machining control unit 101 are realized by the above-mentioned arithmetic processing device performing arithmetic processing in accordance with the computer program stored in the storage device.

[0052] (Processing method) Next, a processing method according to the first embodiment will be described. Fig. 5 is a flowchart showing the flow of the processing method according to the first embodiment. The processing method according to the first embodiment is a method for processing the workpiece 200 shown in Fig. 1. As shown in Fig. 5, the processing method according to the first embodiment includes a setting step 301, a holding step 302, a positioning step 303, and a processing step 304.

[0053] (Setup Steps) First, a description will be given of the setting step 301. The setting step 301 is a step for setting the movement amounts AI in the Y-axis direction of the first machining unit 20-1 and the second machining unit 20-2 for the positioning step 303 after the machining step 304. In the first embodiment, in the setting step 301, the machining apparatus 1 places a cassette 6 containing a plurality of workpieces 200 on the cassette elevator 50, and the controller 100 accepts machining conditions input by the operator via the input unit 120 or the like and stores the machining conditions in the memory unit 102.

[0054] In embodiment 1, in the setting step 301, the processing device 1 inputs into the controller 100 as processing conditions the chip size L input by the operator from the input unit 120 or the like, the reference blade thickness BT of the cutting edge 24 of the cutting blade 21 attached to each processing unit 20-1, 20-2, the position of the planned division line 202 that each processing unit 20-1, 20-2 will initially cut, and the movement direction in the Y-axis direction of one planned division line 202 of each processing unit 20-1, 20-2 after cutting.

[0055] The reference blade thickness BT is a thickness determined in design of the cutting edge 24 of the cutting blade 21 attached to each of the processing units 20-1 and 20-2. Then, in the first embodiment, in the setting step 301, the processing control unit 101 of the controller 100 of the processing apparatus 1 calculates the reference movement amount SI in the Y-axis direction of the processing units 20-1 and 20-2 by the Y-axis moving units 42-1 and 42-2 during cutting processing based on the following formula 1.

[0056] SI = L + BT Equation 1

[0057] In the first embodiment, in the setting step 301, the processing device 1 inputs information read by the reading unit 130 from the information code 26 of the cutting blade 21 attached to each of the processing units 20-1 and 20-2 to the controller 100. Then, the processing control unit 101 of the controller 100 calculates the difference D between the width of the groove formed by cutting the workpiece 200 before shipping from the factory of the cutting blade 21 attached to each of the processing units 20-1 and 20-2 recorded in the information code 26 and the reference blade thickness BT.

[0058] In embodiment 1, in setting step 301, the machining control unit 101 of the controller 100 of the machining apparatus 1 calculates the movement amount AI of the machining units 20-1, 20-2 in the Y-axis direction by the Y-axis moving units 42-1, 42-2 during cutting based on the following equation 2 if the reference blade thickness BT is larger than the groove width recorded in the information code 26, and calculates the movement amount AI of the machining units 20-1, 20-2 in the Y-axis direction by the Y-axis moving units 42-1, 42-2 during cutting based on the following equation 3 if the reference blade thickness BT is smaller than the groove width recorded in the information code 26, and sets the movement amount AI of the machining units 20-1, 20-2 in the Y-axis direction by the Y-axis moving units 42-1, 42-2 during cutting as the reference movement amount SI if the reference blade thickness BT is equal to the groove width recorded in the information code 26.

[0059] AI = SI - D Equation 2 AI = SI + D Equation 3

[0060] Thus, in the setting step 301 of the first embodiment, the machining apparatus 1 sets the movement amounts AI in the Y-axis direction of the machining units 20-1, 20-2 by the Y-axis moving units 42-1, 42-2 during cutting, which are calculated by the machining control unit 101 of the controller 100. Thus, in the setting step 301 of the first embodiment, the machining control unit 101 of the controller 100 sets the movement amount AI in the Y-axis direction of the first machining unit 20-1 based on the chip size L, which is the machining size of the workpiece 200, and the width of the groove formed by the first machining unit 20-1, and sets the movement amount AI in the Y-axis direction of the second machining unit 20-2 based on the chip size L, which is the machining size, and the width of the groove formed by the second machining unit 20-2.

[0061] Also, in embodiment 1, in the setting step 301, as described above, the machining control unit 101 of the controller 100 sets the movement amount AI of the first machining unit 20-1 in the Y-axis direction by reading the information code 26 containing information on the width of the groove formed by the first machining unit 20-1 with the reading unit 130, and sets the movement amount AI of the second machining unit 20-2 in the Y-axis direction by reading the information code 26 containing information on the width of the groove formed by the second machining unit 20-2 with the reading unit 130.

[0062] (holding step) Next, the holding step 302 will be described. Fig. 6 is a side view, partially in cross section, schematically showing the holding step of the processing method shown in Fig. 5. The holding step 302 is a step in which the workpiece 200 is held by the holding unit 10.

[0063] When the controller 100 receives a machining start instruction input by the operator from an input unit or the like, the machining device 1 starts the machining operation, i.e., the holding step 302. In the first embodiment, in the holding step 302, the machining control unit 101 of the controller 100 starts rotating the spindles 23, i.e., the cutting blades 21, of the machining units 20-1, 20-2, and starts supplying cutting water to the cutting blades 21.

[0064] In the holding step 302 of the first embodiment, the processing device 1 causes the processing control unit 101 of the controller 100 to control the cassette elevator 50, the transport unit, etc., to take out one pre-cut workpiece 200 from the cassette 6 and place the back surface 204 of the workpiece 200 on the holding surface 11 of the holding unit 10 positioned in the carry-in / out area via the tape 206. In the holding step 302 of the first embodiment, as shown in FIG. 6 , the processing control unit 101 of the controller 100 suction-holds the back surface 204 of the workpiece 200 on the holding surface 11 of the holding unit 10 positioned in the carry-in / out area via the tape 206, and clamps the frame 205 with the clamp unit 12.

[0065] (positioning step, processing step) Next, the positioning step 303 and the processing step 304 will be described. Fig. 7 is a side view, partially in section, schematically showing the first positioning step of the processing method shown in Fig. 5. Fig. 8 is a side view, partially in section, schematically showing the first processing step of the processing method shown in Fig. 5. Fig. 9 is a side view, partially in section, schematically showing the positioning step returning from step 305 of the processing method shown in Fig. 5. Fig. 10 is a side view, partially in section, schematically showing the processing step after the positioning step shown in Fig. 9.

[0066] The positioning step 303 is a step of positioning the cutting blade 21 and the planned dividing line 202 of the workpiece 200. The processing step 304 is a step of forming grooves 208 along the X-axis direction in the workpiece 200 held by the holding unit 10 using the first processing unit 20-1 and the second processing unit 20-2.

[0067] In the first embodiment, in the first positioning step 303, the machining control unit 101 of the controller 100 controls the moving unit 40 to position the holding unit 10 holding the workpiece 200 in the machining area, causes the imaging unit 30 to capture an image of the workpiece 200, and performs alignment based on the captured image and the machining conditions. In the first embodiment, in the first positioning step 303, the machining control unit 101 of the controller 100 controls the moving unit 40 to position the planned dividing line 202 of the workpiece 200 held by the holding unit 10 parallel to the X-axis direction.

[0068] Also, in the first embodiment, in the first positioning step 303, the machining control unit 101 of the controller 100 of the processing apparatus 1 controls the moving unit 40 to align the X-axis end of the planned division line 202 to be cut first with the lower ends of the cutting edges 24 of the cutting blades 21 attached to each of the processing units 20-1 and 20-2 in the X-axis direction, as shown in Fig. 7. Also, in the first embodiment, in the first positioning step 303, the machining control unit 101 of the controller 100 of the processing apparatus 1 aligns the X-axis end of the planned division line 202 at both ends of the Y-axis direction of the workpiece 200 with the lower ends of the cutting edges 24 of the cutting blades 21 attached to each of the processing units 20-1 and 20-2 in the X-axis direction, as shown in Fig. 7. Also, in embodiment 1, in the first positioning step 303, the processing device 1 has the processing control unit 101 of the controller 100 control the moving unit 40 as shown in Figure 7 to position the lower end of the cutting edge 24 of the cutting blade 21 attached to each processing unit 20-1, 20-2 in the Z-axis direction so as to cut into the tape 206.

[0069] In the processing step 304 of the first embodiment, the processing control section 101 of the controller 100 of the processing device 1 controls the moving unit 40 to move the holding unit 10 in the X-axis direction, and as shown in Fig. 8, causes the cutting blade 21 to cut into the tape 206, thereby cutting the planned division lines 202 with the cutting blade 21. In the first embodiment, in the processing step 304, each of the processing units 20-1 and 20-2 cuts one planned division line 202 to form a groove 208 over the entire length of the planned division line 202.

[0070] In the first embodiment, after the processing step 304, the processing device 1 determines whether or not the processing control unit 101 of the controller 100 has finished cutting all of the planned division lines 202 of the workpiece 200 (step 305). In the first embodiment, after the processing step 304, if the processing control unit 101 of the controller 100 determines that all of the planned division lines 202 of the workpiece 200 have not finished cutting (step 305: No), the processing device 1 returns to the positioning step 303.

[0071] In the first embodiment, in the positioning step 303 returned after the processing step 304, the processing control unit 101 of the controller 100 of the processing apparatus 1 controls the moving unit 40 to move the processing units 20-1 and 20-2 in the Y-axis direction by the movement amount AI set in the setting step 301, and also moves each of the processing units 20-1 and 20-2 in the Y-axis direction in the movement direction set by the processing conditions, thereby aligning the end of the planned division line 202 to be cut next with the lower ends of the cutting edges 24 of the cutting blades 21 attached to each of the processing units 20-1 and 20-2 in the X-axis direction. Also, in the first embodiment, in the positioning step 303 returned after the processing step 304, the processing control unit 101 of the controller 100 controls the moving unit 40 to position the lower ends of the cutting edges 24 of the cutting blades 21 attached to each of the processing units 20-1 and 20-2 in the Z-axis direction where they will cut into the tape 206, as shown in FIG.

[0072] Thus, the positioning step 303 returned from step 305 is a step in which, after the processing step 304, the first processing unit 20-1 is moved a predetermined amount AI in the Y-axis direction and the second processing unit 20-2 is moved a predetermined amount AI in the Y-axis direction, thereby positioning the first processing unit 20-1 and the second processing unit 20-2 at the planned dividing line 202 along which the workpiece 200 will be cut next.

[0073] Also, in the positioning step 303 after returning from step 305, if the processing control unit 101 of the controller 100 has already cut all of the planned division lines 202 parallel to the X-axis direction, the processing device 1 moves the processing units 20-1 and 20-2 as described above and rotates the holding unit 10 around the Z-axis to align the X-axis ends of the planned division lines 202 at both ends of the Y-axis direction of the workpiece 200 with the lower ends of the cutting edges 24 of the cutting blades 21 attached to each processing unit 20-1 and 20-2 in the X-axis direction, as shown in Figure 7.

[0074] 9, in the processing step 304 after the positioning step 303, the processing control unit 101 of the controller 100 controls the moving unit 40 to move the holding unit 10 in the X-axis direction, and as shown in Fig. 10, the cutting blade 21 cuts into the tape 206 to cut the planned division lines 202 with the cutting blade 21. In the first embodiment, after the processing step 304, when the processing control unit 101 of the controller 100 determines that all of the planned division lines 202 of the workpiece 200 have been cut (step 305: Yes), the processing device 1 controls the moving unit 40 to retract the processing units 20-1 and 20-2 from the holding unit 10.

[0075] In the processing apparatus 1, the processing control unit 101 of the controller 100 positions the holding unit 10 in the carry-in / out area and stops suction holding of the workpiece 200 in the holding unit 10. In the processing apparatus 1, the processing control unit 101 of the controller 100 transports the workpiece 200 to the cleaning unit 51 using the transport unit, cleans the workpiece 200 in the cleaning unit 51, and loads the workpiece 200 into the cassette 6. In the processing method of embodiment 1, the processing control unit 101 of the controller 100 repeats the holding step 302, the positioning step 303, and the processing step 304 in the processing apparatus 1 to cut all of the workpieces 200 in the cassette 6 and completes the processing operation.

[0076] As described above, in the processing apparatus 1 and processing method of embodiment 1, the movement amount AI of the first Y-axis moving unit 42-1 in the Y-axis direction is set based on the width of the groove formed by the first processing unit 20-1, and the movement amount AI of the second Y-axis moving unit 42-2 in the Y-axis direction is set based on the width of the groove formed by the second processing unit 20-2.Therefore, the movement amount AI of each processing unit 20-1, 20-2 in the Y-axis direction is set individually based on the chip size L and the thickness of the cutting edge 24 of the cutting blade 21 attached to each processing unit 20-1, 20-2.

[0077] As a result, the processing device 1 and processing method according to the first embodiment can suppress variations in the chip size L, and can suppress deterioration in processing quality.

[0078] [Embodiment 2] A processing method according to the second embodiment will be described with reference to the drawings. FIG. 11 is a flowchart showing the flow of the processing method according to the second embodiment. FIG. 12 is a side view, partially in section, schematically showing a state in which the width of a groove formed by a first processing unit is detected in the second setting step of the processing method shown in FIG. 11. FIG. 13 is a side view, partially in section, schematically showing a state in which the width of a groove formed by a second processing unit is detected in the second setting step of the processing method shown in FIG. 11. In FIGS. 11, 12, and 13, the same parts as those in the first embodiment are designated by the same reference numerals, and their description will be omitted.

[0079] 11, in the processing method according to the second embodiment, after the processing step 304, the processing control unit 101 of the controller 100 determines whether or not a predetermined amount of cutting has been performed after the processing step 304 after the most recently performed one of the setting step 301 and the second setting step 307 described below (step 306). Note that in the first embodiment, the predetermined amount means that the number of planned division lines 202 cut after the most recently performed one of the setting step 301 and the second setting step 307 is a predetermined number, but the present invention is not limited to this.

[0080] When the machining control unit 101 of the controller 100 determines that a predetermined amount of cutting has been performed after the most recent one of the setting step 301 and a second setting step 307 described below and after machining 302 (step 306: Yes), the machining apparatus 1 proceeds to a second setting step 307. The second setting step 307 is a step in which the width of the groove 208 recently formed by the first machining unit 20-1 is detected from a captured image taken by the imaging unit 30, and the width of the groove 208 recently formed by the second machining unit 20-2 is detected from a captured image taken by the imaging unit 30, and second movement amounts AI2 of the first machining unit 20-1 and the second machining unit 20-2 are set in a positioning step 303 after the machining step 304.

[0081] In the second embodiment, in the second setting step 307, the machining control unit 101 of the controller 100 of the machining apparatus 1 controls the moving unit 40 to position the imaging unit 30 above the groove 208 recently formed by the first machining unit 20-1, as shown in Fig. 12, and captures an image of the groove 208 with the imaging unit 30. In the second setting step 307, the machining control unit 101 of the controller 100 of the machining apparatus 1 detects the width of the groove 208 recently formed by the first machining unit 20-1 from the captured image captured by the imaging unit 30.

[0082] Also, in the second embodiment, in the second setting step 307, the machining control unit 101 of the controller 100 of the machining apparatus 1 controls the moving unit 40 to position the imaging unit 30 above the groove 208 recently formed by the second machining unit 20-2, as shown in Fig. 13, and captures an image of the groove 208 with the imaging unit 30. In the second embodiment, in the second setting step 307, the machining control unit 101 of the controller 100 of the machining apparatus 1 detects the width of the groove 208 recently formed by the second machining unit 20-2 from the captured image captured by the imaging unit 30. Then, the machining control unit 101 of the controller 100 calculates the difference D2 between the groove width recorded in the information code 26 and the width of the groove 208 read from the captured image.

[0083] In embodiment 2, in the second setting step 307, if the width of the groove recorded in the information code 26 is larger than the width of the groove 208 read in the captured image, the processing device 1 calculates the second movement amount AI2 in the Y-axis direction of the processing units 20-1, 20-2 by the Y-axis moving units 42-1, 42-2 during cutting processing based on the following equation 4, by the processing control unit 101 of the controller 100.

[0084] Furthermore, in the second embodiment, in the second setting step 307, if the groove width recorded in the information code 26 is smaller than the width of the groove 208 read in the captured image, the machining control unit 101 of the controller 100 of the machining device 1 calculates the second movement amount AI2 in the Y-axis direction of the machining units 20-1, 20-2 by the Y-axis moving units 42-1, 42-2 during cutting based on the following equation 5. Furthermore, in the first embodiment, in the setting step 301, if the groove width recorded in the information code 26 is equal to the width of the groove 208 read in the captured image, the machining control unit 101 of the controller 100 of the machining device 1 sets the second movement amount AI2 in the Y-axis direction of the machining units 20-1, 20-2 by the Y-axis moving units 42-1, 42-2 during cutting as the reference movement amount SI.

[0085] AI2=SI-D2...Formula 4 AI2=SI+D2...Formula 5

[0086] In the second embodiment, in the second setting step 307, the machining control unit 101 of the controller 100 of the machining apparatus 1 sets the second movement amount AI2 in the Y-axis direction of the first machining unit 20-1, and sets the second movement amount AI2 in the Y-axis direction of the second machining unit 20-2, and then proceeds to step 305. The workpiece 200 is cut as in the first embodiment. Note that in the second embodiment, in the positioning step 303 after the second setting step 307, the machining control unit 101 of the controller 100 of the machining apparatus 1 moves the machining units 20-1 and 20-2 in the Y-axis direction by the second movement amount AI2 set in the most recent second setting step 307.

[0087] Thus, in the second setting step 307, the machining device 1 corrects the movement amount AI set by the machining control unit 101 of the controller 100 in the first setting step 301 to a second movement amount AI2 based on the width of the groove 208 formed by actually cutting the workpiece 200 with the cutting blade 21.

[0088] As in the first embodiment, the processing method and processing apparatus 1 of the second embodiment have the advantage of being able to suppress a deterioration in processing quality because the movement amount AI of the first Y-axis moving unit 42-1 in the Y-axis direction is set based on the width of the groove formed by the first processing unit 20-1 and the movement amount AI of the second Y-axis moving unit 42-2 in the Y-axis direction is set based on the width of the groove 208 formed by the second processing unit 20-2.

[0089] In addition, in the processing method and processing apparatus 1 according to embodiment 2, in the second setting step 307, the processing control unit 101 of the controller 100 corrects the movement amount AI to the second movement amount AI2 based on the width of the groove 208 that the processing units 20-1, 20-2 actually form by cutting the workpiece 200 with the cutting blade 21, so that the second movement amount AI2 in the Y-axis direction of each processing unit 20-1, 20-2 is set individually based on the width of the groove 208 formed by the cutting blade 21 attached to each processing unit 20-1, 20-2.

[0090] The present invention is not limited to the above-described embodiment, and can be implemented in various modifications without departing from the gist of the present invention. [Explanation of symbols]

[0091] 1 Processing equipment 10 Holding Unit 20-1 First processing unit 20-2 Second processing unit 26 Information Code 30 Imaging unit 41 X-axis moving unit (processing feed unit) 42-1 1st Y-axis moving unit (indexing feed unit for 1st processing unit) 42-2 2nd Y-axis moving unit (indexing feed unit for 2nd processing unit) 100 Controllers 102 Storage section 130 reading unit 200 Workpiece 301 Setup Steps 302 Retention Step 303 Positioning Step 304 Processing Steps 307 Second setting step AI movement amount AI2 2nd movement amount L Chip size (processing size) X processing feed direction Y Indexing feed direction

Claims

1. a holding unit for holding the workpiece; a first processing unit and a second processing unit each for processing a workpiece held by the holding unit; a processing feed unit that moves the holding unit in a processing feed direction relative to the first processing unit and the second processing unit; an indexing feed unit for a first machining unit that moves the first machining unit relative to the holding unit that holds the workpiece in an indexing feed direction that intersects with the machining feed direction; an indexing feed unit for a second machining unit that moves the second machining unit in the indexing feed direction relative to the holding unit that holds the workpiece; a controller that controls at least the processing feed unit, the first processing unit indexing feed unit, and the second processing unit indexing feed unit; a movement amount of the indexing feed unit for the first machining unit is set based on a machining size of the workpiece and a width of the groove formed by the first machining unit; A machining apparatus in which the movement amount of the indexing feed unit for the second machining unit is set based on the machining size and the width of the groove formed by the second machining unit.

2. The processing device includes a reading unit that reads the information code, the controller has a storage unit that stores the processing size; The processing device of claim 1, wherein the movement amount of the indexing feed unit for the first processing unit is set by reading an information code containing information on the width of the groove formed by the first processing unit with the reading unit, and the movement amount of the indexing feed unit for the second processing unit is set by reading an information code containing information on the width of the groove formed by the second processing unit with the reading unit.

3. The processing device is The apparatus further includes an imaging unit for imaging the workpiece held by the holding unit, 2. The processing device according to claim 1, wherein the controller detects the width of the groove formed by the first processing unit from an image captured by the imaging unit, and detects the width of the groove formed by the second processing unit from an image captured by the imaging unit, and sets the movement amounts of the indexing feed unit for the first processing unit and the indexing feed unit for the second processing unit, respectively.

4. a holding step of holding the workpiece with a holding unit; a machining step in which a first machining unit and a second machining unit respectively form grooves along a machining feed direction in the workpiece held by the holding unit; a positioning step in which, after the machining step, the first machining unit is moved a predetermined amount in an indexing feed direction intersecting the machining feed direction, and the second machining unit is moved a predetermined amount in the indexing feed direction, thereby positioning the first machining unit and the second machining unit on the workpiece, respectively; a setting step of setting movement amounts of the first machining unit and the second machining unit in the indexing feed direction, In the setting step, the movement amount of the first machining unit is set based on the machining size of the workpiece and the width of the groove formed by the first machining unit, and the movement amount of the second machining unit is set based on the machining size and the width of the groove formed by the second machining unit, a machining method.

5. In this setting step, The processing method described in claim 4, wherein the movement amount of the first processing unit is set by reading an information code containing information on the width of the groove formed by the first processing unit with a reading unit, and the movement amount of the second processing unit is set by reading an information code containing information on the width of the groove formed by the second processing unit with a reading unit.

6. The processing method according to claim 4 or 5, further comprising a second setting step in which the width of the groove formed by the first processing unit is detected from an image captured by an imaging unit, and the width of the groove formed by the second processing unit is detected from an image captured by an imaging unit, and second movement amounts of the first processing unit and the second processing unit are respectively set.

Images