Heat generating component mounting substrate and heat generating component module

Abstract

To provide a wiring board capable of efficiently cooling heat generated from a heating component.SOLUTION: One representative heating component mounting substrate of the present invention is a substrate for mounting a heating component, including a first region 110 for mounting a heating component on an outer peripheral portion of the substrate, a second region 120 for mounting a heat dissipation component on a region adjacent to the first region 110 on the outer peripheral portion of the substrate, and a heat transfer pattern 130 extending from the first region to the second region, wherein the heat transfer pattern includes 70% or more of a second area.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a heat-generating component mounting substrate and a heat-generating component module. [Background technology]

[0002] Due to the increase in communication data, optical transmission has become the mainstream in backbone networks. However, signal processing at the terminal where information processing is performed is still mainly performed using electrical signals. For this reason, optical-to-electrical conversion is required at the intermediate stage of information processing from the communication network to the terminal.

[0003] Optical transceivers, also known as optical transceivers, have been developed for photoelectric conversion, converting electrical signals into light and vice versa, and these have mainly been external devices inserted into the front panel of signal processing units such as switches. However, in recent years, in order to cope with the increasing number of optical cables being connected, attention has been focused on the development of photoelectric conversion devices (CPO: Co-Package Optics) that directly connect optical cables to wiring boards. However, since photoelectric conversion devices generate a large amount of heat, when a photoelectric conversion device is mounted on a semiconductor package substrate such as an interposer, how to dissipate the heat becomes an important issue.

[0004] Patent Document 1 aims to quickly transfer heat from heat-generating components mounted on a multilayer printed wiring board to heat-dissipating components for heat dissipation, and discloses the following details regarding a thick copper foil printed wiring board for mounting heat-generating components and a manufacturing method thereof. "A thick copper foil layer for heat dissipation is laminated on a multilayer wiring printed circuit board, lands for mounting heat-generating components and heat sinks are formed separately from lands for other devices and circuits, a plating layer is formed on the inner wall of a through-hole formed in the land to connect to the thick copper foil layer for heat dissipation exposed on the inner wall surface of the through-hole, a copper thermally conductive paste is filled into the through-hole and these surfaces are plated to form a thermally conductive layer on the land to the heat-generating components and heat sink." [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-235036 Summary of the Invention [Problem to be solved by the invention]

[0006] In Patent Document 1, the thermoelectric path from the heat-generating component to the heat sink must travel through the heat-generating component, through-hole, through-hole in the heat-dissipating thick copper foil layer, and then back to the heat sink, resulting in a long thermoelectric path. Furthermore, the contact area between the heat sink and the heat-dissipating thick copper foil layer is insufficient, leaving room for improvement in the heat dissipation effect. SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a wiring board that can efficiently cool the heat generated by heat-generating components. [Means for solving the problem]

[0007] In order to solve the above problems, one representative heat-generating component mounting substrate of the present invention is a substrate on which a heat-generating component is mounted, a first area in which the heat-generating component is mounted on the outer periphery of the substrate; a second region in which a heat dissipation component is mounted, the second region being adjacent to the first region at the outer periphery of the substrate; a heat transfer pattern extending from the first region to the second region; The heat transfer pattern includes 70% or more of the second area. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a wiring board that efficiently cools heat generated from heat-generating components. Problems, configurations, and effects other than those described above will become apparent from the following description of the preferred embodiments of the invention. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view showing an example of a heat-generating component mounting substrate according to a first embodiment. [Figure 2] FIG. 2 is a diagram showing an example of a cross-sectional structure of the heat-generating component mounting board of the first embodiment. [Figure 3] FIG. 3 is a diagram showing an example of a cross-sectional structure of a heat-generating component mounting board according to the second embodiment. [Figure 4] FIG. 4 is a plan view showing an example of a heat-generating component module according to the third embodiment. [Figure 5] FIG. 5 is a plan view showing an example of a heat-generating component module according to the fourth embodiment. [Figure 6] FIG. 6 is a plan view showing an example of a substrate according to the fifth embodiment. [Figure 7] FIG. 7 is a plan view showing an example of a heat-generating component module according to the sixth embodiment. [Figure 8] FIG. 8 is an example of a cross-sectional view of a heat-generating component module. [Figure 9] FIG. 9 is a cross-sectional view of a case where heat-generating component modules are stacked. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Note that the present invention is not limited to this embodiment. In addition, in the description of the drawings, the same parts are designated by the same reference numerals. When there are multiple components with the same or similar functions, they may be described using the same reference numeral with different subscripts. When there is no need to distinguish between these multiple components, the subscripts may be omitted.

[0011] Furthermore, although terms such as "first," "second," and "third" may be used to describe various elements or components in this disclosure, it will be understood that these elements or components should not be limited by these terms. These terms are used only to distinguish one element or component from another. Thus, a first element or component discussed below could also be referred to as a second element or component without departing from the teachings of the inventive concept. In order to facilitate understanding of the invention, the position, size, shape, range, etc. of each component shown in the drawings may not represent the actual position, size, shape, range, etc. Therefore, the present invention is not necessarily limited to the position, size, shape, range, etc. disclosed in the drawings.

[0012] In this disclosure, the term "surface" may refer not only to the surface of a plate-shaped member, but also to the interface of a layer contained in the plate-shaped member that is approximately parallel to the surface of the plate-shaped member. Furthermore, the terms "upper surface" and "lower surface" refer to the surface shown at the top or bottom of a drawing of a plate-shaped member or a layer contained in the plate-shaped member. The "upper surface" and "lower surface" may also be referred to as the "first surface" and "second surface."

[0013] Furthermore, the term "side surface" refers to a surface or thickness portion of a layer included in a plate-like member or a layer included in a plate-like member. Furthermore, a portion of a surface and a side surface may be collectively referred to as an "edge portion." Furthermore, "upward" refers to the direction vertically upward when the plate-like member or layer is placed horizontally. Furthermore, "upward" and its opposite, "downward," are sometimes referred to as the "positive Z-axis direction" and the "negative Z-axis direction," and the horizontal direction is sometimes referred to as the "X-axis direction" and the "Y-axis direction."

[0014] Furthermore, "planar shape" and "plan view" refer to the shape of a surface or layer when viewed from above. Furthermore, "cross-sectional shape" and "cross-sectional view" refer to the shape of a plate-like member or layer when cut in a specific direction and viewed from the horizontal direction.

[0015] In this disclosure, "heat-generating components" include components and elements that may generate heat, such as photoelectric conversion elements, CPUs, LEDs, inverters, capacitors, and motors. Furthermore, "heat dissipation components" include heat sinks and other components and elements that can exhibit heat dissipation and exhaust performance. The configuration of heat dissipation components includes various forms, and they may or may not have fins. Furthermore, the heat dissipation and exhaust mechanism may be air-cooled or liquid-cooled.

[0016] In this disclosure, "periphery" refers to the area near the outer edge of a plate-shaped substrate when viewed from above. Furthermore, "corner" refers to the corner of a polygon when the substrate has a polygonal shape when viewed from above. Furthermore, "edge surface" refers to the exposed side surface at the outer edge of a plate-shaped member. Furthermore, the term "interlayer conductive structure" refers to a member having a via, a through hole, or a similar shape, which has the effect of transferring heat between layers of a multilayer substrate.

[0017] First Embodiment First, the configuration of a heat-generating component mounting substrate (hereinafter referred to as "substrate") according to a first embodiment of the present disclosure will be described with reference to Fig. 1. Fig. 1 is a plan view showing an example of the substrate according to the first embodiment. 1, the substrate 100 in the first embodiment has a substantially rectangular planar shape and is provided with four first regions 110 at its four corners for mounting heat-generating components. In addition, the substrate 100 is provided with four second regions 120 between the four first regions 110 for mounting heat-dissipating components. Furthermore, a semiconductor element mounting area 150 is provided in the approximate center of the substrate 100, and electrical wiring 140 is provided to connect the first region 110 on which the heat-generating components are mounted to the semiconductor element mounting area 150.

[0018] When heat-generating components are present on a board, it is preferable to place a heat-dissipating component such as a heat sink directly above the heat-generating component in order to dissipate heat most efficiently. However, stacking a heat-dissipating component directly above the heat-generating component increases the overall height of the module, making miniaturization difficult. Therefore, a structure in which the heat-generating component and the heat-dissipating component are arranged in parallel on a plane is required. In this case, it is possible to use electrical wiring made of copper wire as a heat transfer route from the heat-generating component to the heat-dissipating component, but it is difficult to transfer the required amount of heat using such electrical wiring alone.

[0019] For this reason, in the first embodiment, a wide heat transfer pattern 130 extending from the first region 110 to the second region is provided on the outermost layer of the substrate. The heat transfer pattern 130 is provided so as to cover 70% or more of the second region, and is designed so that the heat transfer pattern 130 and the heat dissipation components mounted in the second region come into contact over a large area, thereby enhancing the heat transfer and heat dissipation effects. The heat transfer pattern 130 is formed on the surface of a buildup layer of the substrate, which will be described later, and the buildup layer and the heat transfer pattern 130 are covered with a first surface insulating resin layer made of solder resist.

[0020] It is preferable that the proportion of the second region covered by the heat transfer pattern 130 be as large as possible, and if it is 70% or more, the heat transfer and heat exhaust effect can be fully exerted. Also, the area of ​​the heat transfer pattern 130 between the first region and the second region can be increased as much as possible. For this reason, it is desirable to design the heat transfer pattern 130 so that it is wide and large in area, without overlapping with other electrical wiring on the board. The heat transfer pattern 130 is formed using the same material as the electrical wiring, that is, copper or copper alloy, and may be formed simultaneously in the same process as the electrical wiring of the copper substrate.

[0021] Next, the cross-sectional structure of the substrate of the first embodiment will be described with reference to Fig. 2. Fig. 2 is a diagram showing an example of the cross-sectional structure of the first embodiment taken along line A-A' in Fig. 1. Note that in Fig. 2, electrical signal wiring is omitted, and for convenience of explanation, the dimensions and shape may not match those of Fig. 1. 2, the substrate 100 has a multilayer wiring structure in which a first buildup layer 220 and a second buildup layer 240 are provided on both sides of a core layer 230. A first surface insulating resin layer 210 and a second surface insulating resin layer 250 are provided on the upper and lower outermost layers of the substrate 100, and the heat transfer pattern 130 provided on the outermost layer is covered with the respective insulating resins.

[0022] The core layer 230, the first buildup layer 220, and the second buildup layer 240 may be formed of organic materials used in general multilayer wiring boards. The first surface insulating resin layer 210 and the second surface insulating resin layer 250 may be solder resist. Covering the outermost heat transfer pattern with the first surface insulating resin layer 210 and the second surface insulating resin layer 250 makes it possible to prevent the heat transfer pattern 130 from coming into direct contact with a heat dissipation component (described later) and being damaged.

[0023] 2, the outermost heat transfer pattern 130 covered by the first surface insulating resin layer 210, which is the uppermost surface of the substrate 100, extends from the first region 110 to the second region, and also communicates with the substrate through the heat transfer pattern 131, vias 270, and through holes 260, to the outermost heat transfer pattern 130 covered by the second surface insulating resin layer 250, which is the lowermost surface of the substrate 100. As a result, the outermost heat transfer pattern 130 covered by the first surface insulating resin layer 210 transfers heat generated in the first region 110 to the second region 120, and at the same time, transfers heat to the outermost heat transfer pattern 130 covered by the second surface insulating resin layer 250, thereby more efficiently dissipating heat.

[0024] As will be described later in Figure 8, if the heat dissipation components mounted in the second region are configured to be able to receive heat from both sides of the substrate 100, the heat received at the top surface can be transferred to the bottom surface, thereby further enhancing the heat dissipation effect. According to the layout of the first embodiment, the diagonal direction of the board can be used to maximize the distance between the heat-generating components and the semiconductor element mounting area, thereby minimizing the effect of heat on the semiconductor element. The heat transfer pattern 131 inside the substrate 100 may or may not be exposed at the end surface B of the substrate.

[0025] Second Embodiment Next, with reference to FIG. 3, a cross-sectional structure of a substrate according to a second embodiment of the present disclosure will be described. In the second embodiment, the plan view of the upper surface of the substrate is the same as that of FIG. 1, but the second embodiment is premised on the assumption that heat-generating components are also mounted on the lower surface of the substrate, and a first region 110 is also formed on the lower surface of the substrate. Accordingly, the heat transfer pattern on the outermost layer also extends to the first region 110 on the lower surface, which is different from the first embodiment. In the following description, components that are the same as or equivalent to those in the first embodiment described above will be denoted by the same reference numerals, and their description will be simplified or omitted.

[0026] As shown in FIG. 3, in the second embodiment, the heat transfer pattern 130 on the outermost layer on the underside of the substrate 100 extends to the first region on the underside, so that even if a heat-generating component is mounted on the underside of the substrate, heat can be efficiently transferred to and dissipated from the second region. In the second embodiment, as in the first embodiment, the distance between the heat-generating component and the semiconductor element can be maximized.

[0027] Third Embodiment Next, the configuration of a heat-generating component module according to a third embodiment of the present disclosure will be described with reference to Fig. 4. Fig. 4 is a plan view showing an example of a heat-generating component module according to the third embodiment. As shown in FIG. 4, the third embodiment is a heat-generating component module in which a heat-generating component 410, a heat-dissipating component 420, and a semiconductor element 430 are mounted on the substrate described in the first and second embodiments. 4 is a top view, and is the same for the board of the first embodiment and the board of the second embodiment. Although a bottom view is omitted, in the case of the second embodiment, heat-generating components are also mounted on the bottom surface of the board, so the bottom view of the board bottom will be different between the first embodiment and the second embodiment.

[0028] In the third embodiment, the heat-generating component 410 has an inlet 440. This inlet 440 serves as an optical fiber connection port when the heat-generating component 410 is a photoelectric conversion element. In the third embodiment, by arranging the heat-generating component 410 at the four corners of the substrate, it becomes possible to align the directions of the inlets 440 in two directions (left and right directions in the figure) across the entire substrate, and it becomes possible to store the optical fiber compactly when mounting. Furthermore, a refrigerant inlet / outlet 450 is shown on the heat dissipation component 420. The heat dissipation component 420 does not necessarily need to be liquid-cooled, but if the heat-generating component 410 is a photoelectric conversion element, it is desirable that the heat dissipation component 420 be liquid-cooled because the amount of heat generated is large.

[0029] <Fourth embodiment> Next, the configuration of a heat-generating component module according to a fourth embodiment of the present disclosure will be described with reference to Fig. 5. Fig. 5 is a plan view showing an example of a heat-generating component module according to the fourth embodiment. The fourth embodiment is a modification of the third embodiment, and has a structure in which part of the heat dissipation component 420 is replaced with an external connection electric cable. In the following description, components that are the same as or equivalent to those in the first to third embodiments described above are denoted by the same reference numerals, and their description will be simplified or omitted.

[0030] In the fourth embodiment, a heat transfer pattern 130 is also provided, extending from the heat-generating components mounted in the first region 110 to the heat-dissipating components mounted in the second region. The heat transfer pattern 130 is provided to cover 70% or more of the second region, and the heat transfer pattern 130 and the heat-dissipating components mounted in the second region are in contact over a large area, resulting in a design that enhances the heat transfer and heat dissipation effect. This allows for efficient heat transfer and heat dissipation from the first region to the second region.

[0031] Fifth Embodiment Next, the configuration of a heat-generating component mounting board according to a fifth embodiment will be described with reference to Fig. 6. Fig. 6 is a plan view showing an example of a board according to the fifth embodiment. The fifth embodiment differs from the first and second embodiments in that it has four second regions 120 in which heat dissipation components are mounted at the four corners, and four first regions 110 in which heat-generating components are installed between the four second regions 120. In the following description, components that are the same as or equivalent to those in the first or second embodiment described above are denoted by the same reference numerals, and their description will be simplified or omitted.

[0032] In the fourth embodiment, a heat transfer pattern 130 is provided that extends from the first region 110 to the second region. The heat transfer pattern 130 is provided so as to cover 70% or more of the second region, and is designed so that the heat transfer pattern 130 and the heat dissipation components mounted in the second region come into contact over a large area, thereby enhancing the heat transfer and heat dissipation effect. This allows heat to be efficiently transferred and dissipated from the first region to the second region. Furthermore, the distance between the signal input / output section, which is a heat generating component, and the semiconductor element that processes information can be shortened, which is an advantageous configuration in terms of information processing.

[0033] Sixth Embodiment Next, the configuration of a heat-generating component module according to a fifth embodiment of the present disclosure will be described with reference to Fig. 7. Fig. 7 is a plan view showing an example of a heat-generating component module according to a sixth embodiment. As shown in FIG. 7, the sixth embodiment is a heat-generating component module in which a heat-generating component 410, a heat-dissipating component 420, and a semiconductor element 430 are mounted on the substrate described in the fifth embodiment. The same or equivalent components as those in the first to fifth embodiments described above are denoted by the same reference numerals, and the description thereof will be simplified or omitted. In the sixth embodiment, as in the first embodiment, heat can be efficiently transferred and dissipated from the first region to the second region, and the distance between the signal input / output unit, which is a heat-generating component, and the semiconductor element that processes information can be shortened, resulting in an advantageous configuration in terms of information processing.

[0034] <Structure of heat dissipation components> Next, the structure of the heat dissipation component 420 will be described with reference to Fig. 8. Fig. 8 is an example of a cross-sectional view of a heat-generating component module when the heat dissipation component 420 is mounted on a substrate. The heat dissipation component 420 is provided with heat dissipation component fixing portions 470 for sandwiching the upper and lower surfaces of the substrate, and can be sandwiched depending on the thickness of the substrate. In the following description, components that are the same as or equivalent to those in the first to sixth embodiments described above are designated by the same reference numerals, and their description will be simplified or omitted. In the structure of the heat dissipation component shown in Figure 8, the heat sink, which is the heat dissipation component, receives heat from both the top and bottom surfaces of the board and can efficiently dissipate the heat. Below, the heat transfer and heat dissipation mechanism will be described in detail based on Figure 8.

[0035] Heat generated by the heat-generating component 410 mounted in the first region is first transferred to the heat-transfer pattern 130 in the first region via the first surface insulating resin layer 210. In this case, the first surface insulating resin is a solder resist, which has good thermal conductivity, and the heat from the heat-generating component 410 is efficiently transferred to the heat-transfer pattern 130. The heat-transfer pattern 130 is formed to have a wide and large area without overlapping with other electrical wiring on the board, allowing for efficient heat transfer to the second region 120. In the second region 120, the heat-transfer pattern occupies 70% or more of the area, so the thermal contact area with the heat-dissipating component 420 (heat sink) is large, allowing for efficient heat transfer.

[0036] On the other hand, in the board of the present disclosure, heat transfer patterns 130 are provided on the upper and lower outermost layers of the board 100, and the heat transfer patterns 130 on the upper and lower outermost layers are connected by a heat transfer pattern 131 in the center of the board, vias 270, and through holes 260. Therefore, heat received on the upper surface of the board 100 can be transferred to the lower surface of the board 100 and can be dissipated from a heat dissipation component 420 in contact with the lower surface of the board 100.

[0037] <Stacked module> Next, with reference to FIG. 9, the configuration of a stacked module in which a plurality of heat-generating component modules are stacked will be described. FIG. 9 is a cross-sectional view of two heat-generating component modules (a first heat-generating component mounting board 810 and a second heat-generating component mounting board 820) each equipped with an external connection cable as described in the fourth embodiment, stacked together and stored in a rack. 9, heat-generating components 410 are arranged on both the top and bottom surfaces of each substrate. By arranging the convex portion on one surface of the first heat-generating component mounting substrate to correspond to the concave portion on the opposing surface (i.e., the surface of the second heat-generating component mounting substrate opposing the one surface of the first heat-generating component mounting substrate), it is possible to assemble a stacked module with a minimum height. Furthermore, it is possible to provide a connection port (connector) for an external connection cable connecting the first and second heat-generating component mounting boards in the gap between the first and second heat-generating component mounting boards, facing outward from the heat-generating component mounting boards. This allows for a highly convenient stacked module that does not become excessively tall even when the number of stacked layers is large, and that facilitates the installation and management of wiring, etc.

[0038] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the gist of the present invention. The present disclosure includes the following aspects.

[0039] (Aspect 1) A substrate on which a heat-generating component is mounted, a first area in which the heat-generating component is mounted on the outer periphery of the substrate; a second region in which a heat dissipation component is mounted, the second region being adjacent to the first region at the outer periphery of the substrate; a heat transfer pattern extending from the first region to the second region; The heat transfer pattern includes 70% or more of the second region. A substrate for mounting heat-generating components.

[0040] (Aspect 2) In the heat-generating component mounting substrate according to aspect 1, The first region is disposed at a corner of the substrate. A substrate for mounting heat-generating components.

[0041] (Aspect 3) In the heat-generating component mounting substrate according to aspect 1, The second region is disposed at a corner of the substrate. A substrate for mounting heat-generating components.

[0042] (Aspect 4) In the heat-generating component mounting substrate according to any one of aspects 1 to 3, the substrate is a multilayer substrate in which build-up layers are formed on both sides of a core layer, The heat transfer pattern is provided on the build-up layer and / or the core layer. A substrate for mounting heat-generating components.

[0043] (Aspect 5) In the heat-generating component mounting substrate according to any one of aspects 1 to 4, The heat transfer patterns provided on different layers of the substrate are connected by an interlayer conductive structure. A substrate for mounting heat-generating components.

[0044] (Aspect 6) In the heat-generating component mounting substrate according to any one of aspects 1 to 5, The heat transfer pattern provided on the outermost layer of the substrate is covered with insulating resin. A substrate for mounting heat-generating components.

[0045] (Aspect 7) A heat-generating component module in which the heat-generating component is mounted in the first region of the heat-generating component mounting substrate according to any one of aspects 1 to 6, and a heat-dissipating component is mounted in the second region.

[0046] (Aspect 8) In the heat-generating component module according to aspect 7, The heat dissipation component is fixed to the heat-generating component mounting substrate so as to contact both surfaces and end surfaces of the heat-generating component mounting substrate. A heat-generating component module characterized by:

[0047] (Aspect 9) In the heat-generating component module according to aspect 7 or 8, The connection port of the external connection cable connected to the heat-generating component is provided facing outward from the heat-generating component mounting substrate. A heat-generating component module characterized by:

[0048] (Aspect 10) A stacked module in which a plurality of heat-generating component modules according to any one of aspects 7 to 9 are stacked, a convex portion on one surface of the first heat-generating component mounting substrate is disposed in correspondence with a concave portion on the opposing surface of the second heat-generating component mounting substrate; A connection port for an external connection cable connecting the first heat-generating component mounting board and the second heat-generating component mounting board is provided in a gap between the first heat-generating component mounting board and the second heat-generating component mounting board, facing outward from the heat-generating component mounting board. A heat-generating component stacked module characterized by: [Explanation of symbols]

[0049] 100: Substrate 110: First area (heat generating components) 120: Second area (heat dissipation components) 130, 131: Heat transfer pattern 140: Electrical wiring 150: Semiconductor element mounting area 210: First surface insulating resin layer 220: First build-up layer 230: Core layer 240: Second build-up layer 250: Second surface insulating resin layer 260:Through hole 270:Beer B: End face 410: Heat generating parts 420: Heat dissipation parts 430: Semiconductor elements 440: Entrance 450: Refrigerant inlet / outlet 460: External connection electrical signal cable 470: Heat dissipation part fixing part

Claims

1. A substrate on which a heat-generating component is mounted, a first region on an outer periphery of the substrate for mounting the heat-generating component; a second region in which a heat dissipation component is mounted, the second region being adjacent to the first region at the outer periphery of the substrate; a heat transfer pattern extending from the first region to the second region; The heat transfer pattern covers 70% or more of the second region. A substrate for mounting heat-generating components.

2. 2. The heat-generating component mounting substrate according to claim 1, The first region is disposed at a corner of the substrate. A substrate for mounting heat-generating components.

3. 2. The heat-generating component mounting substrate according to claim 1, The second region is disposed at a corner of the substrate. A substrate for mounting heat-generating components.

4. The heat-generating component mounting substrate according to any one of claims 1 to 3, the substrate is a multilayer substrate in which build-up layers are formed on both sides of a core layer, The heat transfer pattern is provided on the build-up layer and / or the core layer. A substrate for mounting heat-generating components.

5. 5. The heat-generating component mounting substrate according to claim 4, The heat transfer patterns provided on different layers of the substrate are connected by an interlayer conductive structure. A substrate for mounting heat-generating components.

6. The heat-generating component mounting substrate according to any one of claims 1 to 3, The heat transfer pattern provided on the outermost layer of the substrate is covered with insulating resin. A substrate for mounting heat-generating components.

7. A heat-generating component module, comprising the heat-generating component mounted in the first region of the heat-generating component mounting substrate according to claim 1 , and a heat-dissipating component mounted in the second region.

8. 8. The heat-generating component module according to claim 7, The heat dissipation component is fixed to the heat-generating component mounting substrate so as to contact both surfaces and end surfaces of the heat-generating component mounting substrate. A heat-generating component module characterized by:

9. 8. The heat-generating component module according to claim 7, The connection port of the external connection cable connected to the heat-generating component is provided facing outward from the heat-generating component mounting substrate. A heat-generating component module characterized by:

10. A stacked module in which a plurality of heat-generating component modules according to claim 7 are stacked, a convex portion on one surface of the first heat-generating component mounting substrate is disposed to correspond to a concave portion on the opposing surface of the second heat-generating component mounting substrate; A connection port for an external connection cable connecting the first heat-generating component mounting board and the second heat-generating component mounting board is provided in a gap between the first heat-generating component mounting board and the second heat-generating component mounting board, facing outward from the heat-generating component mounting board. A heat-generating component stacked module characterized by:

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