Electrical connector and method of manufacturing the same

Abstract

To provide a pressure contact type electric connector which hardly damages a connection terminal of a device while having durability for repeated use, and is easy to manufacture, and to provide a manufacturing method thereof.SOLUTION: An insulating elastic sheet 20 having a first surface 21 disposed on a connection terminal 41 side of the first device 40 and a second surface 22 disposed on a connection terminal 51 side of the second device 50, a large number of conductive wires 30 penetrating between the first surface 21 and the second surface 22 of the elastic sheet 20 while being separated from each other, and a plurality of first conductive pads 31 directly formed on the first surface 21 of the elastic sheet 20, each of the plurality of first conductive pads 31 is formed in contact with end faces on the first surface 21 side of the plurality of conductive wires 30 among the large number of conductive wires 30, at a position corresponding to each of the connection terminals 41 of the first device 40.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electrical connector and a method for manufacturing the same, and more particularly to an insulation displacement type electrical connector in which two devices are pressure-welded to both sides to electrically connect the connection terminals of both devices, and a method for manufacturing the same. [Background technology]

[0002] Conventionally, pressure-displacement electrical connectors are used to connect two devices, such as a ball grid array (BGA) package and a test board. This electrical connector is composed of an elastic sheet and multiple conductive wires that penetrate the elastic sheet in the thickness direction or diagonally to the thickness direction.By placing it between the testing board and the BGA to be tested and pressing it together, the conductive wires that penetrate the electrical connector electrically connect the solder balls of the BGA to the pattern electrodes of the testing board (Patent Document 1).

[0003] The conductive wires of this electrical connector are pressure-welded to connection terminals such as solder balls in a nearly point-contact manner. This can result in parts of the solder balls being scraped off and damaged. Furthermore, the scraped solder residue can cause electrical connections in unintended locations.

[0004] Therefore, an electrical connector having a hollow, flexible conductive wire has been proposed (Patent Document 2). However, if the conductive wire is flexible, repeated use can cause the tip of the conductive wire to become crushed or deformed, which can impair its durability for repeated use.In addition, hollow conductive wires can have the problem of making it difficult to obtain a sufficient contact area with the connection terminal of a device.

[0005] To address the above-mentioned problems, a mesh sheet with conductive portions formed thereon is known, which is placed between the connection terminals, such as solder balls, and the electrical connector. The conductive portions are provided at positions corresponding to the connection terminals so as to provide electrical continuity between the front and back of the mesh sheet. To ensure stable electrical connection, it is necessary to prevent the mesh sheet from shifting or floating up.

[0006] Therefore, Patent Document 3 proposes providing an adhesive layer between the mesh sheet and the elastic sheet to prevent the mesh sheet from shifting or floating up and to ensure stable electrical connection. However, when providing an adhesive layer, care must be taken to form the adhesive layer so as not to cover the ends of the conductive wires so as not to interfere with the electrical connection between the conductive wires and the conductive parts, and manufacturing is not easy. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Publication No. 6-251848 [Patent Document 2] International Publication No. 2018 / 212277 [Patent Document 3] Patent Publication No. 2021-197211 Summary of the Invention [Problem to be solved by the invention]

[0008] In view of the above circumstances, an object of the present invention is to provide a pressure-displacement type electrical connector that is durable enough for repeated use, does not easily damage the connection terminals of devices, and is easy to manufacture, and a method for manufacturing the same. [Means for solving the problem]

[0009] In order to achieve the above object, the present invention employs the following configuration. [1] An electrical connector disposed between a connection terminal of a first device and a connection terminal of a second device, for electrically connecting the connection terminal of the first device and the connection terminal of the second device, an insulating elastic sheet having a first surface disposed on the connection terminal side of the first device and a second surface disposed on the connection terminal side of the second device; a plurality of conductive wires passing through the elastic sheet between the first surface and the second surface while being spaced apart from one another; a plurality of first conductive pads formed directly on the first surface of the elastic sheet; An electrical connector, wherein each of the plurality of first conductive pads is formed at a position corresponding to each of the connection terminals of the first device, and the end faces of the plurality of conductive wires on the first surface side of the plurality of conductive wires contact each of the plurality of first conductive pads. [2] An electrical connector as described in claim 1, wherein a mark for alignment with the second device is provided in a portion of the first surface of the elastic sheet where the plurality of first conductive pads are not formed. [3] The electrical connector according to [1] or [2], wherein each of the ends of the conductive wires on the second surface side is plated. [4] further comprising a plurality of second conductive pads formed directly on the second surface of the elastic sheet; [1] or [2]. An electrical connector according to [1] or [2], wherein each of the plurality of second conductive pads is formed at a position corresponding to each of the connection terminals of the second device, and the end faces of the second surface side of the plurality of conductive wires among the large number of conductive wires are in contact with each of the plurality of second conductive pads. [5] An electrical connector according to any one of [1] to [4], wherein holes for aligning the first device and the second device are formed in the portions of the elastic sheet where the plurality of first conductive pads are not formed, or where the plurality of first conductive pads and the plurality of second conductive pads are not formed. [6] The electrical connector according to any one of [1] to [5], wherein the numerous conductive wires pass through the elastic sheet in the same direction so as to be parallel to one another. [7] An electrical connector according to any one of [1] to [5], wherein the numerous conductive wires are aligned so as to be parallel to one another and pass through the elastic sheet at an angle relative to the thickness direction of the elastic sheet. [8] A method for manufacturing an electrical connector according to any one of [1] to [3], comprising: step 1 of manufacturing a connector body having the elastic sheet and a large number of the conductive wires penetrating the elastic sheet; and step 2a of forming the first conductive pads on one surface of the connector body, The method for producing an electrical connector is characterized in that the step 2a includes the following steps 2a-1 to 2a-6. Step 2a-1: A seed layer is formed on one surface of the connector body by sputtering. Step 2a-2: A photosensitive material layer is formed on the seed layer formed on one surface. Step 2a-3: After exposure to transfer the pattern of the photomask onto the photosensitive material layer, the layer is developed. Step 2a-4: A plating layer is formed in the area where the photosensitive material layer has been removed, to form a first conductive pad consisting of the seed layer and the plating layer. Step 2a-5: The photosensitive material layer remaining in the area where the plated layer is not formed is removed. Step 2a-6: The seed layer remaining in the area where the plated layer is not formed is removed by etching. [9] [4] A method for manufacturing an electrical connector according to the present invention, comprising: a step 1 for manufacturing a connector body having the elastic sheet and a large number of the conductive wires penetrating the elastic sheet; a step 2a for forming the first conductive pads on one surface of the connector body; and a step 2b for forming the second conductive pads on the other surface of the connector body, The step 2a includes the following steps 2a-1 to 2a-6: The method for producing an electrical connector is characterized in that the step 2b includes the following steps 2b-1 to 2b-6. Step 2a-1: A seed layer is formed on one surface of the connector body by sputtering. Step 2a-2: A photosensitive material layer is formed on the seed layer formed on one surface. Step 2a-3: After exposure to transfer the pattern of the photomask onto the photosensitive material layer, the layer is developed. Step 2a-4: A plating layer is formed in the area where the photosensitive material layer has been removed, to form a first conductive pad consisting of the seed layer and the plating layer. Step 2a-5: The photosensitive material layer remaining in the area where the plated layer is not formed is removed. Step 2a-6: The seed layer remaining in the area where the plated layer is not formed is removed by etching. Step 2b-1: A seed layer is formed on the other surface of the connector body by sputtering. Step 2b-2: A photosensitive material layer is formed on the seed layer formed on the other surface. Step 2b-3: After exposure to transfer the pattern of the photomask onto the photosensitive material layer, the layer is developed. Step 2b-4: A plating layer is formed in the area where the photosensitive material layer has been removed, to form a second conductive pad consisting of the seed layer and the plating layer. Step 2b-5: The photosensitive material layer remaining in the area where the plated layer is not formed is removed. Step 2b-6: The seed layer remaining in the area where the plated layer is not formed is removed by etching. [Effects of the Invention]

[0010] The electrical connector of the present invention is durable enough for repeated use, does not easily damage the connection terminals of devices, and is easy to manufacture. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a longitudinal cross-sectional view showing a schematic configuration of an electrical connector according to a first embodiment of the present invention, together with a first device and a second device. [Figure 2] 1 is a longitudinal cross-sectional view showing a state in which the electrical connector according to the first embodiment of the present invention is in use. [Figure 3]FIG. 10 is a longitudinal cross-sectional view showing a schematic configuration of an electrical connector according to a second embodiment of the present invention, together with a first device and a second device. [Figure 4] FIG. 10 is a longitudinal sectional view showing the state in which an electrical connector according to a second embodiment of the present invention is used. [Figure 5] FIG. 10 is a longitudinal cross-sectional view showing a schematic configuration of an electrical connector according to a third embodiment of the present invention. [Figure 6] FIG. 10 is a longitudinal cross-sectional view showing a schematic configuration of an electrical connector according to a fourth embodiment of the present invention. [Figure 7] FIG. 10 is a longitudinal cross-sectional view showing a schematic configuration of an electrical connector according to a fifth embodiment of the present invention. [Figure 8] FIG. 10 is a longitudinal cross-sectional view showing a schematic configuration of an electrical connector according to a sixth embodiment of the present invention. [Figure 9] FIG. 13 is a plan view of an electrical connector according to a seventh embodiment of the present invention. [Figure 10] 10 is a longitudinal cross-sectional view taken along line XX in FIG. 9, showing the state in which the electrical connector according to the seventh embodiment of the present invention is in use. [Figure 11] FIG. 13 is a plan view showing an electrical connector according to an eighth embodiment of the present invention. [Figure 12] 12 is a longitudinal cross-sectional view taken along line YY in FIG. 11, showing the state in use of the electrical connector according to the eighth embodiment of the present invention. [Figure 13] FIG. 13 is a longitudinal cross-sectional view showing a schematic configuration of an electrical connector according to a ninth embodiment of the present invention, together with a first device and a second device. [Figure 14] 1A to 1C are process diagrams illustrating an example of a method for forming a conductive pad according to the present invention. [Figure 15] 10 is an optical microscope photograph showing the state of a ball terminal when an electrical connector according to an embodiment of the present invention is used. [Figure 16] 10 is an optical microscope photograph showing the state of a ball terminal when an electrical connector according to a comparative example of the present invention is used. DETAILED DESCRIPTION OF THE INVENTION

[0012] In this specification and claims, a numerical range expressed by "to" means a numerical range with the numbers before and after "to" as the lower and upper limits. In this specification, the plating thickness is the average value of measurements taken at five locations using a non-contact fluorescent X-ray coating thickness meter. The "thickness" of each other component is the average value of measurements taken at five locations on the cross section of the object using a magnifying observation tool such as a digital microscope.

[0013] First Embodiment An electrical connector 10A according to a first embodiment will be described with reference to Figures 1 and 2. As shown in Figure 1, the electrical connector 10A includes an insulating elastic sheet 20, a number of conductive wires 30 penetrating the elastic sheet 20, and a number of first conductive pads 31 formed directly on the elastic sheet 20. The electrical connector 10A is disposed between the first device 40 and the second device 50 to connect the connection terminal 41 of the first device 40 with the connection terminal 51 of the second device 50 .

[0014] The elastic sheet 20 is in a sheet shape and has a first surface 21 arranged on the first device 40 side and a second surface 22 opposite to the first surface 21 and arranged on the second device 50 side. The thickness of the elastic sheet 20 is preferably 20 μm to 5000 μm, more preferably 40 μm to 1000 μm, and even more preferably 60 μm to 500 μm. When the thickness is equal to or greater than the lower limit of the above range, the mechanical strength and rigidity of the elastic sheet 20 are improved, making it easier to handle. When the thickness is equal to or less than the upper limit of the above range, the length of the conductive wire 30 is suitable for improving high-frequency characteristics.

[0015] The insulating elastic sheet 20 can be made of an elastomer or a thermoplastic resin. Examples of insulating elastomers include synthetic rubbers such as silicone rubber, acrylonitrile-butadiene rubber, chloroprene rubber, ethylene-chloroprene rubber, ethylene-propylene-diene rubber, styrene-butadiene rubber, fluororubber, butadiene rubber, isoprene rubber, and urethane rubber.

[0016] Examples of thermoplastic resins include polyvinyl chloride, polyethylene, polypropylene, polyvinyl acetate, and polybutylene terephthalate. Among these, elastomers are preferred because they are easy to obtain elasticity, and silicone rubber is preferred because it has high elasticity and excellent heat resistance.

[0017] The numerous conductive wires 30 penetrate, spaced apart from one another, between the first surface 21 and the second surface 22 of the elastic sheet 20. Penetrating between the first surface 21 and the second surface 22 means that one end of each conductive wire is exposed or protrudes from the first surface 21, and the other end is exposed or protrudes from the second surface 22. It is preferable that all of the numerous conductive wires 30 penetrate between the first surface 21 and the second surface 22, but it is acceptable if there are some conductive wires 30 that do not penetrate, for example, conductive wires 30 whose one end is not exposed or protruding from either surface.

[0018] In this embodiment, one end of each of the conductive wires 30 is exposed on the first surface 21 , and the other end is exposed on the second surface 22 . In this embodiment, the penetration direction of the numerous conductive wires 30 is substantially along the thickness direction (direction perpendicular to the first surface 21) and is substantially parallel to one another. The position and number of conductive wires 30 on the elastic sheet 20 are not particularly limited and are adjusted appropriately according to the arrangement and number of connection terminals 41 and 51 of the first device 40 and the second device 50, respectively, which are electrically connected by the electrical connector 10A.

[0019] Examples of materials for the conductive wire 30 include metals such as copper, tungsten, nickel, gold, silver, iron, aluminum, lead, zinc, tin, brass, and phosphor bronze. The cross-sectional contour shape of the conductive wires 30 perpendicular to the longitudinal direction is not particularly limited, and examples thereof include circles, ellipses, triangles, squares, rectangles, and polygons with pentagons or more. The cross-sectional contour shapes of the conductive wires 30 may be the same or different. Each conductive wire 30 may be solid or at least partially hollow. Each conductive wire 30 may also have a multilayer structure in which a core wire is plated.

[0020] The diameter of the conductive wire 30 is the diameter of the outline shape of the cross section perpendicular to its length direction, and is preferably 5 μm to 50 μm, and more preferably 10 μm to 25 μm. If the outline shape of the cross section is other than circular, the diameter is the diameter of the smallest including circle. Here, the diameter of the conductive wires 30 is the average value of the diameters of five or more randomly selected conductive wires 30 measured at the position of the first surface 21 of the elastic sheet 20 .

[0021] Each of the plurality of first conductive pads 31 is formed directly on the first surface 21 of the elastic sheet 20 at a position corresponding to each of the connection terminals 41 . The term "corresponding positions" means that they are in overlapping positions in a plan view (viewed from above in the figure). In a plan view, the center of each first conductive pad 31 is preferably close to the center of the corresponding connection terminal 41, and particularly preferably coincides with the center of the corresponding connection terminal 41.

[0022] Of the numerous conductive wires 30, the end faces of the plurality of conductive wires 30 on the first surface 21 side are in contact with each of the plurality of first conductive pads 31. The number of conductive wires 30 in contact with each of the first conductive pads 31 is preferably 2 to 600, more preferably 3 to 200, and even more preferably 5 to 50. When the thickness is equal to or greater than the lower limit of the above range, the electrical connection with the connection terminal 51 via the conductive wire 30 is sufficiently stable. Furthermore, when the thickness is equal to or less than the upper limit of the above range, the insulation between the conductive wires 30 is easily maintained, and crosstalk (interference) does not occur.

[0023] The contour shape of the plurality of first conductive pads 31 in plan view is not particularly limited, and examples thereof include a circle, an ellipse, a triangle, a square, a rectangle, a polygon with pentagons or more sides, etc. The contour shapes of the plurality of first conductive pads 31 may be the same or different.

[0024] The diameter of the smallest encompassing circle of each of the plurality of first conductive pads 31 is preferably 50 μm to 800 μm, and more preferably 50 μm to 300 μm. When the value is equal to or greater than the lower limit of the above range, it is possible to ensure a sufficient area for each first conductive pad 31. Therefore, an excessive compressive load is not applied between the connection terminal 41 and the conductive wire 30, and good electrical contact can be obtained, and electrical connection with the connection terminal 51 via the conductive wire 30 can also be easily ensured. Furthermore, when the thickness is equal to or less than the upper limit of the above range, insulation between the first conductive pads 31 can be easily maintained.

[0025] The thickness of the plurality of first conductive pads 31 is preferably 5 μm to 50 μm, and more preferably 10 μm to 20 μm. Furthermore, the distance between the first conductive pads 31 is preferably 30 μm or more, and more preferably 50 μm or more. Within this range, it is easy to maintain the insulation between the first conductive pads 31.

[0026] Examples of materials for the plurality of first conductive pads 31 include copper, nickel, gold, and composites thereof, among which composites are preferred because they have sufficient electrical properties and can reduce costs. The plurality of first conductive pads 31 are formed directly on the first surface 21 of the elastic sheet 20. The plurality of first conductive pads 31 are preferably formed on the first surface 21 by plating.

[0027] There are no particular limitations on the specific embodiments of the first device 40 and the second device 50. 1 and 2 show an example in which the first device 40 is a ball grid array (BGA) having ball-shaped connection terminals 41, but the first device 40 may also be a land grid array (LGA) package having flat-shaped connection terminals 41, a small outline package (SOP), a small outline J-lead (SOJ) package, a small outline no-lead (SON) package, a quad flat package (QFP), a quad flat J-lead (QFJ) package, a quad flat no-lead (QFN) package, a test board, or the like.

[0028] Similarly, the second device 50 may be a BGA, an LGA, a small outline package (SOP), a small outline J-lead (SOJ) package, a small outline no-lead (SON) package, a quad flat package (QFP), a quad flat J-lead (QFJ) package, a quad flat no-lead (QFN) package, a test substrate thereof, or the like. A specific example of the combination is a combination in which the first device 40 is a BGA and the second device 50 is a test substrate thereof.

[0029] 2, the first device 40 arranged on the first surface 21 side of the electrical connector 10A and the second device 50 arranged on the second surface 22 side are pressed against the electrical connector 10A from both sides. As a result, each of the first conductive pads 31 comes into contact with a corresponding connection terminal 41, and the connection terminals 41 are electrically connected to the ends of the plurality of conductive wires 30 on the first surface 21 side via the first conductive pads 31. On the other hand, the end of the conductive wire 30 on the second surface 22 side comes into contact with the connection terminal 51 at the corresponding position, thereby electrically connecting the connection terminal 41 and the connection terminal 51.

[0030] In this embodiment, the conductive wire 30 does not come into direct contact with the connection terminal 41, but rather the connection terminal 41 comes into contact with the first conductive pad 31, which has a large area. By increasing the contact area, the load locally applied to the connection terminal 41 is reduced, and the conductive wire 30 is prevented from piercing the connection terminal 41.

[0031] Furthermore, when the conductive wires 30 come into direct contact with the ball-shaped or other connecting terminals 41, only the specific conductive wires 30 with the tips of the connecting terminals 41 in direct contact therewith will be subjected to the load from the connecting terminals 41. In this case, the end of a particular conductive wire 30 subjected to the load may be damaged or deformed, and may be buried under the first surface 21, resulting in an increase in connection resistance.

[0032] In contrast, in this embodiment, the conductive wires 30 do not come into direct contact with the ball-shaped or other connecting terminals 41, but rather the plurality of conductive wires 30 come into contact with the flat first conductive pad 31 with a substantially equal load. Therefore, the load from the connecting terminals 41 is shared between the plurality of conductive wires 30 and the elastic sheet 20, and damage or deformation to the ends of the conductive wires 30 can be avoided.

[0033] Furthermore, even in cases where the connection terminal 41 is a so-called recessed electrode formed in a recess provided in the first device 40, as in some LGAs, the connection terminal 41 and the first conductive pad 31 can be brought into contact by making the shape and thickness of the second conductive pad 32 correspond to the diameter and size of the recess provided in the first device 40.

[0034] Second Embodiment An electrical connector 10B according to the second embodiment will be described with reference to Figures 3 and 4. In Figures 3 and 4, the same components as those in the first embodiment are denoted by the same reference numerals as those in Figures 1 and 2, and detailed description thereof will be omitted.

[0035] As shown in FIG. 3, the electrical connector 10B includes an insulating elastic sheet 20, a number of conductive wires 30 penetrating the elastic sheet 20, a number of first conductive pads 31 formed directly on the elastic sheet 20, and a number of second conductive pads 32 formed directly on the elastic sheet 20.

[0036] The electrical connector 10B is disposed between the first device 40 and the second device 50 to connect the connection terminal 41 of the first device 40 and the connection terminal 51 of the second device 50 . The preferred aspects of the elastic sheet 20, the conductive wires 30, and the first conductive pad 31 are the same as those in the first embodiment.

[0037] Each of the plurality of second conductive pads 32 is formed directly on the second surface 22 of the elastic sheet 20 at a position corresponding to each of the connection terminals 51 . The term "corresponding positions" means that they are in overlapping positions in a plan view (as viewed from above in the figure). In a plan view, the center of the second conductive pad 32 is preferably close to the center of the corresponding connection terminal 51, and particularly preferably coincides with the center of the corresponding connection terminal 51.

[0038] Each of the plurality of second conductive pads 32 is in contact with the end faces of the plurality of conductive wires 30 on the second surface 22 side of the numerous conductive wires 30. The preferred range of the number of conductive wires 30 in contact with each of the second conductive pads 32 is the same as the preferred range of the number of conductive wires 30 in contact with the first conductive pad 31.

[0039] The outline shape of the second conductive pads 32 in plan view is not particularly limited, similar to the outline shape of the first conductive pads 31, and may be the same or different for each of the first conductive pads 31. The preferred range of the area of ​​each of the second conductive pads 32 is the same as the preferred range of the area of ​​each of the first conductive pads 31. However, the contour shape and area of ​​the second conductive pad 32 must be such that the second conductive pad 32 can be inserted into the recess 52 so that it can contact the connection terminal 51 provided in the recess 52.

[0040] The thickness of the plurality of second conductive pads 32 is preferably 5 μm to 50 μm, and more preferably 10 μm to 20 μm. When the thickness is equal to or greater than the lower limit of the above range, it is easy to bring the material into contact with the connection terminal 51 in the recess 52. When the thickness is equal to or less than the upper limit of the above range, it is easy to keep costs down.

[0041] The plurality of second conductive pads 32 may be made of the same material as that of the first conductive pads 31 . The plurality of second conductive pads 32 are formed directly on the second surface 22 of the elastic sheet 20. The plurality of second conductive pads 32 are preferably formed on the second surface 22 by plating.

[0042] As in the first embodiment, there is no particular limitation on the specific form of the first device 40. However, the second device 50 of this embodiment is an example in which the connection terminal 51 is formed in the recess 52, that is, a so-called sunken electrode. A specific combination of the first device 40 and the second device 50 is, for example, a combination in which the first device 40 is a BGA and the second device 50 is an LGA having recessed electrodes. The second device 50 may be modified so that the connection terminals 51 are provided in a convex shape on the surface of the second device 50, similar to the first embodiment.

[0043] 4, the first device 40 arranged on the first surface 21 side of the electrical connector 10B and the second device 50 arranged on the second surface 22 side are pressed against the electrical connector 10B from both sides. As a result, each of the first conductive pads 31 comes into contact with a corresponding connection terminal 41, and the connection terminals 41 are electrically connected to the ends of the plurality of conductive wires 30 on the first surface 21 side via the first conductive pads 31.

[0044] Meanwhile, each second conductive pad 32 contacts a connection terminal 51 at a corresponding position, and the connection terminal 51 is electrically connected to the ends of the plurality of conductive wires 30 on the second surface 22 side via the second conductive pads 32 . As a result, the connection terminal 41 and the connection terminal 51 are electrically connected to each other.

[0045] In this embodiment, the conductive wire 30 does not come into direct contact with the connection terminal 41, but the connection terminal 41 comes into contact with the first conductive pad 31 having a large area, thereby achieving the same effect as in the first embodiment. Furthermore, in this embodiment, the conductive wire 30 does not come into direct contact with the connection terminal 51, but rather the connection terminal 51 comes into contact with the second conductive pad 32, which has a large area. By increasing the contact area, the load locally applied to the connection terminal 51 is reduced, and the conductive wire 30 is prevented from piercing the connection terminal 51.

[0046] Furthermore, the conductive wires 30 do not come into direct contact with the connection terminals 51, but rather the plurality of conductive wires 30 come into contact with the flat second conductive pads 32 with a substantially equal load. Therefore, the load from the connection terminals 51 is shared between the plurality of conductive wires 30 and the elastic sheet 20, and damage or deformation to the ends of the conductive wires 30 can be avoided.

[0047] Third Embodiment An electrical connector 10C according to the third embodiment will be described with reference to Fig. 5. In Fig. 5, the same components as those in the first embodiment are denoted by the same reference numerals as in Figs. 1 and 2, and detailed description thereof will be omitted.

[0048] Similar to the electrical connector 10A, the electrical connector 10C is disposed between the first device 40 and the second device 50 to connect the connection terminal 41 of the first device 40 with the connection terminal 51 of the second device 50. Note that the connection terminal 51 of the second device 50 may be a so-called recessed electrode, similar to the second embodiment.

[0049] The electrical connector 10C of this embodiment differs from the electrical connector 10A of the first embodiment only in that both ends of the numerous conductive wires 30 protrude from the first surface 21 and the second surface 22. In this embodiment, the contact area of ​​the conductive wire 30 with the first conductive pad 31 is increased on the first surface 21 side, thereby improving the adhesion of the first conductive pad 31 to the elastic sheet 20 and making the electrical connection between the first conductive pad 31 and the conductive wire 30 more reliable.

[0050] Furthermore, the contact area between the second surface 22 and the connection terminal 51 of the second device 50 increases, resulting in a stable connection. In addition, both ends of the numerous conductive wires 30 may not protrude from both the first surface 21 and the second surface 22, but may protrude from only one of the first surface 21 or the second surface 22.

[0051] Fourth Embodiment An electrical connector 10D according to a fourth embodiment will be described with reference to Fig. 6. In Fig. 6, the same components as those in the first embodiment are denoted by the same reference numerals as in Figs. 1 and 2, and detailed description thereof will be omitted.

[0052] The electrical connector 10D is disposed between the first device 40 and the second device 50 to connect the connection terminal 41 of the first device 40 and the connection terminal 51 of the second device 50, similar to the electrical connector 10A.

[0053] The electrical connector 10D differs from the electrical connector 10A of the first embodiment only in that the penetration direction of the numerous conductive wires 30 is oblique to the thickness direction (the direction perpendicular to the first surface 21). In this embodiment, the conductive wire 30 tilts when compressed, thereby reducing the load between the conductive wire 30 and the connection terminal 51 and the load between the first conductive pad 31 and the connection terminal 41.

[0054] The angle between the penetration direction of the numerous conductive wires 30 and the thickness direction is preferably 1° to 60°, and more preferably 10° to 30°. When the thickness is equal to or greater than the lower limit of the above range, the conductive member is more likely to elastically deform, resulting in a significant effect of suppressing the load.When the thickness is equal to or less than the upper limit of the above range, the positional deviation between the first conductive pad 31 and the second conductive pad 32 is small, resulting in a stable connection when a load is applied from both sides.

[0055] Fifth Embodiment An electrical connector 10E according to a fifth embodiment will be described with reference to Fig. 7. In Fig. 7, components similar to those in the first and fourth embodiments are denoted by the same reference numerals as in Figs. 1, 2, and 6, and detailed descriptions thereof will be omitted.

[0056] Like the electrical connectors 10A and 10D, the electrical connector 10E is disposed between the first device 40 and the second device 50 to connect the connection terminal 41 of the first device 40 with the connection terminal 51 of the second device 50. Note that the connection terminal 51 of the second device 50 may be a so-called recessed electrode, as in the second embodiment.

[0057] The electrical connector 10E of this embodiment differs from the electrical connector 10D of the fourth embodiment only in that both ends of the numerous conductive wires 30 protrude from the first surface 21 and the second surface 22. In this embodiment, the contact area of ​​the conductive wire 30 with the first conductive pad 31 is increased on the first surface 21 side, thereby improving the adhesion of the first conductive pad 31 to the elastic sheet 20 and making the electrical connection between the first conductive pad 31 and the conductive wire 30 more reliable.

[0058] Furthermore, the contact area between the second surface 22 and the connection terminal 51 of the second device 50 increases, resulting in a stable connection. In addition, both ends of the numerous conductive wires 30 may not protrude from both the first surface 21 and the second surface 22, but may protrude from only one of the first surface 21 or the second surface 22.

[0059] Sixth Embodiment An electrical connector 10F according to the sixth embodiment will be described with reference to Fig. 8. In Fig. 8, the same components as those in the first and second embodiments are denoted by the same reference numerals as those in Figs. 1 to 4, and detailed description thereof will be omitted.

[0060] Similar to electrical connectors 10A and 10B, electrical connector 10F is disposed between first device 40 and second device 50 to connect connection terminal 41 of first device 40 with connection terminal 51 of second device 50. Note that connection terminal 51 of second device 50 may be provided in a convex shape on the surface of second device 50, similar to the first embodiment, or may be a so-called recessed electrode, similar to the second embodiment.

[0061] The electrical connector 10F of this embodiment differs from the electrical connector 10B of the second embodiment only in that the penetration direction of the numerous conductive wires 30 is oblique to the thickness direction (direction perpendicular to the first surface 21). In this embodiment, the conductive wire 30 tilts when compressed, thereby reducing the load between the conductive wire 30 and the first conductive pad 31, the connection terminal 41, and the load between the second conductive pad 32 and the connection terminal 51.

[0062] The preferred angle between the penetration direction of the numerous conductive wires 30 and the thickness direction is the same as that described in the fourth embodiment. One or both ends of the multiple conductive wires 30 may protrude from the first surface 21 or the second surface 22 .

[0063] Seventh Embodiment An electrical connector 10G according to the seventh embodiment will be described with reference to Figures 9 and 10. In Figures 9 and 10, the same components as those in the first embodiment are denoted by the same reference numerals as those in Figures 1 and 2, and detailed description thereof will be omitted.

[0064] The electrical connector 10G is similar to the electrical connector 10A of the first embodiment, except that holes 71 for aligning the first device 40 and the second device 50 are formed perpendicular to the first surface 21 in the portion of the elastic sheet 20 where the first conductive pad 31 is not formed. As shown in FIG. 9, in this embodiment, holes 71 are formed at two diagonal positions on the outer periphery of the area in which the first conductive pads 31 are formed.

[0065] As shown in FIG. 10, alignment holes 42 and 53 are formed at positions corresponding to the holes 71 of the first device 40 and the second device 50, respectively. In use, the pin 72 is inserted through the holes 42, 71 and 53, thereby fixing the first device 40, the electrical connector 10G and the second device 50 in a predetermined positional relationship.

[0066] Eighth Embodiment An electrical connector 10H according to the eighth embodiment will be described with reference to Figures 11 and 12. In Figures 11 and 12, the same components as those in the first embodiment are denoted by the same reference numerals as those in Figures 1 and 2, and detailed description thereof will be omitted.

[0067] The electrical connector 10H is similar to the electrical connector 10A of the first embodiment, except that a mark 73 for aligning with the first device 40 and the second device 50 is formed in the portion of the first surface 21 of the elastic sheet 20 where the plurality of first conductive pads 31 are not formed. As shown in FIG. 11, in this embodiment, marks 73 are formed at two diagonal positions on the outer periphery of the area in which the first conductive pads 31 are formed.

[0068] There are no particular limitations on the mark 73 as long as it can be read using a camera, and it can be formed, for example, from a metal plating layer, a printed layer, or the like. After placing the second device 50 in a predetermined position, the electrical connector 10H can be moved based on the position information of the mark 73 read by the camera, thereby placing the electrical connector 10H in a position that aligns with the second device 50.

[0069] Ninth Embodiment An electrical connector 10J according to the ninth embodiment will be described with reference to Fig. 13. In Fig. 13, the same components as those in the first embodiment are denoted by the same reference numerals as in Figs. 1 and 2, and detailed description thereof will be omitted.

[0070] The electrical connector 10J is similar to the electrical connector 10A of the first embodiment, except that plating 75 is applied to each of the ends of the conductive wires 30 on the second surface 22 side. By applying plating 75 to each end of the conductive wires 30 on the second device 50 side, the connection with the connection terminals 51 becomes more stable.

[0071] Other aspects In the seventh and eighth embodiments, a hole 71 is formed or a mark 73 is provided in the electrical connector 10A of the first embodiment, but in the second to sixth embodiments, a hole for alignment may be formed or a mark may be provided. When forming holes in an embodiment in which second conductive pads 32 are provided, the holes are formed in portions where neither first conductive pads 31 nor second conductive pads 32 are formed.

[0072] Furthermore, in any of the first to sixth embodiments, there are no particular limitations on the positions where holes are formed, the number of holes, the size of the holes, or the shape of the holes. Similarly, in any of the first to sixth embodiments, there are no particular limitations on the positions where marks are provided, the number of marks, the size of the marks, the shape of the marks, or the material of the marks.

[0073] In the ninth embodiment, plating 75 is applied to the electrical connector 10A of the first embodiment, but even in embodiments in which the conductive wire 30 protrudes from the second surface 22, as in the third and fifth embodiments, plating 75 may be applied to the end portion on the second surface 22 side. Furthermore, even in the fourth and fifth embodiments, in which the penetration direction of the conductive wire 30 is oblique to the thickness direction of the elastic sheet 20, plating 75 may be applied to the end portion on the second surface 22 side.

[0074] 《Manufacturing method》 The method for manufacturing the electrical connectors of the above embodiments is not limited, but examples include a manufacturing method having step 1 of manufacturing a connector body 10a having elastic sheet 20 and a large number of conductive wires 30 penetrating elastic sheet 20, and step 2a of forming first conductive pads 31 on one surface of connector body 10a. In the case of an embodiment having second conductive pads 32, examples include a manufacturing method further having step 2b of forming second conductive pads 32 on the other surface of connector body 10a.

[0075] Step 1 can be performed, for example, in the same manner as in Patent Document 2 (see FIG. 2), by the following steps 1-1 to 1-4. Step 1-1: A plurality of conductive wires 30 are arranged on one surface of a first elastic sheet in the same direction at arbitrary intervals. Step 1-2: A second elastic sheet is placed on top of the first elastic sheet on which a large number of conductive wires 30 are arranged, and the sheets are integrated together, and the plurality of conductive wires 30 are fixed between the first elastic sheet and the second elastic sheet, thereby obtaining a conductive wire-containing sheet. Step 1-3: A plurality of conductive wire-containing sheets are stacked and integrated so that the orientation of the conductive wires 30 is aligned, thereby obtaining a laminate of conductive wire-containing sheets. Step 1-4: The laminate of conductive wire-containing sheets is cut perpendicularly or obliquely to the direction in which the numerous conductive wires 30 extend, to obtain the connector body 10a.

[0076] When the ends of the conductive wires 30 are made to protrude from the elastic sheet 20 as in the third and fifth embodiments, the conductive wires 30 may be arranged in step 1-1 so that their ends protrude from the outer edge of the elastic sheet. Alternatively, the ends of the conductive wires 30 may be made to protrude by scraping the surface of the elastic sheet 20 with laser irradiation. In addition, in the case where the penetration direction of the numerous conductive wires 30 is oblique to the thickness direction (direction perpendicular to the first surface 21), as in the fourth to sixth embodiments, the laminate of conductive wire-containing sheets may be cut obliquely in step 1-4.

[0077] Step 2a for forming first conductive pads 31 can be performed, for example, by the following steps 2a-1 to 2a-6, as shown in FIG.

[0078] Step 2a-1: A seed layer 61 is formed on one surface of the connector body 10a (FIG. 14(a)) by sputtering using titanium, copper, a composite thereof, or the like (FIG. 9(b)). Step 2a-2: A photosensitive material layer 62 is formed on the seed layer 61 formed on one surface of the connector body 10a using a dry film photoresist or the like (FIG. 14(c)). Step 2a-3: After exposure to transfer the pattern of the photomask onto the photosensitive material layer 62, development is performed (FIG. 14(d)). Step 2a-4: A plating layer 63 is formed from copper, nickel, gold, or a composite of these in the area where the photosensitive material layer 62 has been removed, to obtain a first conductive pad 31 consisting of the seed layer 61 and the plating layer 63 (Figure 14 (e)). Step 2a-5: The photosensitive material layer 62 remaining in the area where the plating layer 63 is not formed is removed. Step 2a-6: The seed layer 61 remaining in the area where the plated layer 63 is not formed is removed by etching.

[0079] Step 2b for forming second conductive pads 32 can be performed in the same manner as step 2a, except that it is performed on the other surface of connector body 10a through the following steps 2b-1 to 2b-6.

[0080] Step 2b-1: A seed layer is formed on the other surface of the connector body 10a by sputtering using titanium, copper, a composite thereof, or the like. Step 2b-2: A photosensitive material layer is formed on the seed layer formed on the other surface of the connector body 10a using a dry film photoresist or the like. Step 2b-3: After exposure to transfer the pattern of the photomask onto the photosensitive material layer, the layer is developed. Step 2b-4: A plating layer is formed of copper, nickel, gold, a composite of these, or the like in the area where the photosensitive material layer has been removed, to obtain a second conductive pad consisting of the seed layer and the plating layer. Step 2b-5: The photosensitive material layer remaining in the area where the plating layer is not formed is removed. Step 2b-6: The seed layer remaining in the area where the plating layer is not formed is removed by etching.

[0081] When forming both the first conductive pad 31 and the second conductive pad 32, one of the first conductive pad 31 and the second conductive pad 32 may be formed before the other, or steps 2a and 2b may be performed in parallel on both sides of the connector body 10a. Steps 2a-1 and 2b-1, 2a-2 and 2b-2, 2a-4 and 2b-4, 2a-5 and 2b-5, and 2a-6 and 2b-6 can be performed simultaneously. Steps 2a-3 and 2b-3 can be performed simultaneously with exposure followed by development.

[0082] When providing a mark 73 as in the eighth embodiment, by setting the pattern of the photomask in step 2a-3 so that the photosensitive material layer 62 at the location where the mark 73 is to be provided is also removed, the mark 73 can be provided simultaneously with the first conductive pad 31 in step 2a-4.

[0083] When forming the hole 71 as in the seventh embodiment, in step 2a-3, the photomask pattern is set so that the photosensitive material layer 62 at the location that serves as the marker for the location where the hole 71 is to be provided is also removed, and thus in step 2a-4, the marker for the location where the hole 71 is to be provided can be provided at the same time as the first conductive pad 31. There is no particular limitation on the timing of forming the holes 71 thereafter, but for example, they can be formed at the positions of the marks after the end of step 2a.

[0084] When plating 75 is applied to each of the ends of the conductive wires 30 on the second surface 22 side as in the ninth embodiment, it can be formed by electrolytic plating, utilizing the fact that electricity passes from the seed layer formed to form the first conductive pads 31 through the conductive wires to the ends of the conductive wires on the second surface side. Specifically, plating may be performed on the second surface 22 side at the same time as step 2a-4. [Example]

[0085] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to the descriptions of these examples. In the following description, all blending amounts are calculated on a solid content basis.

[0086] Comparative Example 1 A plurality of conductive wires were arranged in parallel at 50 μm intervals and aligned in the same direction on one side of a 25 μm-thick silicone rubber first elastic sheet formed on a polyethylene terephthalate substrate. The conductive wires had a cylindrical core wire with a diameter of 25 μm made of beryllium copper and a 0.5 μm-thick gold-plated layer covering the outer surface of the core wire.

[0087] Next, a second elastic sheet made of silicone rubber and having a thickness of 25 μm was placed on one side of the first elastic sheet on which multiple conductive wires were arranged, and integrated with the first elastic sheet, and multiple conductive wires were fixed between the first elastic sheet and the second elastic sheet, thereby forming a conductive wire-containing sheet.

[0088] Next, 200 sheets of the conductive wire-containing sheets were stacked so that the longitudinal direction of the conductive wires was aligned and the conductive wires overlapped when viewed in the stacking direction, thereby forming a laminate of conductive wire-containing sheets. The laminate obtained above was cut and sliced ​​to a thickness of 250 μm at an angle of 63° relative to the direction in which the conductive wires extended, to obtain the electrical connector of Comparative Example 1. The angle of the conductive wires relative to each main surface of the connector was approximately 63°.

[0089] Example 1 The electrical connector of Comparative Example 1 was used as a connector body, and a first conductive pad was formed on one main surface of the connector body. First, a seed layer of titanium and copper having a thickness of approximately 0.4 μm was formed by sputtering over the entire surface of one side of the connector body.

[0090] Next, a dry film having a thickness of 25 μm was pressure-bonded onto the entire upper surface of the seed layer to form a photosensitive material layer. The photosensitive layer thus obtained was exposed to light to transfer the pattern of the photomask onto it, and then developed, and the photosensitive layer was removed from the area where the first conductive pads were to be provided. The locations where the first conductive pads were to be provided were each circular with a diameter of 200 μm, and these were arranged in an 8×8 matrix with a pitch of 0.3 mm.

[0091] Next, electrolytic plating was carried out on the seed layer in the area where the photosensitive material layer had been removed to form a plating layer with a thickness of about 12 μm, thereby obtaining a first conductive pad consisting of the seed layer and plating layer. Finally, the seed layer remaining in the area where the plated layer was not formed was removed by etching, thereby obtaining the electrical connector of Example 1.

[0092] "evaluation" The electrical connector of each example was placed on a testing board having a pattern electrode, with the end of the conductive wire exposed on the surface of the electrical connector where the first conductive pad was not formed being in contact with the pattern electrode of the testing board in Example 1. Next, a dummy package of a semiconductor element was pressure-welded onto the formed first conductive pads. In Example 1, the multiple solder balls on the dummy were brought into contact with the first conductive pads at corresponding positions to form a daisy chain.

[0093] The dummy package used had solder balls of 0.2 mm diameter arranged in an 8 x 8 matrix with a 0.3 mm pitch, and had an internal circuit that could be daisy-chained to the test board. In the above assembly, the dummy package was pressed against the electrical connector three times at a pressure of 20 N using an automatic load testing machine (product name: MAX-1KN-S-1, manufactured by Nippon Keisoku Systems Co., Ltd.).

[0094] Fig. 15 shows a photograph of the solder balls of the dummy package after being pressure-contacted three times to the electrical connector of Example 1. Fig. 16 shows a photograph of the solder balls of the dummy package after being pressure-contacted three times to the electrical connector of Comparative Example 1. As shown in Figure 15, the solder balls pressure-welded to the electrical connector of Example 1 had a good appearance and no significant scratches. In contrast, as shown in Figure 16, multiple deep metal wire marks were observed on the solder balls pressure-welded to the electrical connector of Comparative Example 1. [Explanation of symbols]

[0095] 10A~10J Electrical Connector 20 Elastic Sheet 21 Front page 22 Second side 30 Conductive wire 31 First conductive pad 32 Second conductive pad 40 First Device 41 Connection terminal 50 Secondary Device 51 Connection terminal 52 recess

Claims

1. an electrical connector disposed between a connection terminal of a first device and a connection terminal of a second device, for electrically connecting the connection terminal of the first device and the connection terminal of the second device, an insulating elastic sheet having a first surface disposed on the connection terminal side of the first device and a second surface disposed on the connection terminal side of the second device; a plurality of conductive wires passing through the elastic sheet between the first surface and the second surface while being spaced apart from one another; a plurality of first conductive pads formed directly on the first surface of the elastic sheet; An electrical connector, wherein each of the plurality of first conductive pads is formed at a position corresponding to each of the connection terminals of the first device, and the end faces of the plurality of conductive wires on the first surface side of the plurality of conductive wires contact each of the plurality of first conductive pads.

2. 2. The electrical connector of claim 1, wherein a mark for alignment with the second device is provided on the first surface of the elastic sheet in a portion where the plurality of first conductive pads are not formed.

3. 3. The electrical connector according to claim 1, wherein each of the ends of the conductive wires on the second surface side is plated.

4. further comprising a plurality of second conductive pads formed directly on the second surface of the elastic sheet; 2. The electrical connector of claim 1, wherein each of the plurality of second conductive pads is formed at a position corresponding to each of the connection terminals of the second device, and the end faces of the plurality of conductive wires on the second surface side of the plurality of conductive wires contact each of the plurality of second conductive pads.

5. 5. The electrical connector of claim 1, wherein holes for aligning with the first device and the second device are formed in a portion of the elastic sheet where the plurality of first conductive pads are not formed, or in a portion where the plurality of first conductive pads and the plurality of second conductive pads are not formed.

6. 5. The electrical connector according to claim 1, wherein the plurality of conductive wires pass through the elastic sheet in parallel with one another.

7. 5. The electrical connector according to claim 1, wherein the plurality of conductive wires are oriented parallel to one another and extend through the elastic sheet at an angle relative to the thickness of the elastic sheet.

8. 2. A method for manufacturing an electrical connector according to claim 1, comprising: a step 1 for manufacturing a connector body having the elastic sheet and a large number of the conductive wires penetrating the elastic sheet; and a step 2a for forming the first conductive pad on one surface of the connector body, The method for producing an electrical connector is characterized in that the step 2a includes the following steps 2a-1 to 2a-6. Step 2a-1: A seed layer is formed on one surface of the connector body by sputtering. Step 2a-2: A photosensitive material layer is formed on the seed layer formed on one surface. Step 2a-3: After exposure to transfer the pattern of the photomask onto the photosensitive material layer, the layer is developed. Step 2a-4: A plating layer is formed in the area where the photosensitive material layer has been removed, to form a first conductive pad consisting of the seed layer and the plating layer. Step 2a-5: The photosensitive material layer remaining in the area where the plated layer is not formed is removed. Step 2a-6: The seed layer remaining in the area where the plated layer is not formed is removed by etching.

9. 5. A method for manufacturing an electrical connector according to claim 4, comprising: step 1 of manufacturing a connector body having the elastic sheet and the plurality of conductive wires penetrating the elastic sheet; step 2a of forming the first conductive pads on one surface of the connector body; and step 2b of forming the second conductive pads on the other surface of the connector body, The step 2a includes the following steps 2a-1 to 2a-6: The method for producing an electrical connector is characterized in that the step 2b includes the following steps 2b-1 to 2b-6. Step 2a-1: A seed layer is formed on one surface of the connector body by sputtering. Step 2a-2: A photosensitive material layer is formed on the seed layer formed on one surface. Step 2a-3: After exposure to transfer the pattern of the photomask onto the photosensitive material layer, the layer is developed. Step 2a-4: A plating layer is formed in the area where the photosensitive material layer has been removed, to form a first conductive pad consisting of the seed layer and the plating layer. Step 2a-5: The photosensitive material layer remaining in the area where the plated layer is not formed is removed. Step 2a-6: The seed layer remaining in the area where the plated layer is not formed is removed by etching. Step 2b-1: A seed layer is formed on the other surface of the connector body by sputtering. Step 2b-2: A photosensitive material layer is formed on the seed layer formed on the other surface. Step 2b-3: After exposure to transfer the pattern of the photomask onto the photosensitive material layer, the layer is developed. Step 2b-4: A plating layer is formed in the area where the photosensitive material layer has been removed, to form a second conductive pad consisting of the seed layer and the plating layer. Step 2b-5: The photosensitive material layer remaining in the area where the plated layer is not formed is removed. Step 2b-6: The seed layer remaining in the area where the plated layer is not formed is removed by etching.

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