Electrical connector and method of manufacturing the same

Abstract

To provide an electric connector capable of suppressing deviation of a connection position between an electrode of a device and an electrode wire of the electric connector due to distortion during thermal expansion or compression of an elastic sheet.SOLUTION: The electric connector includes an insulating elastic sheet 10, a large number of conductive wires 20 mutually separately penetrating between a first surface 11 and a second surface 12 of the elastic sheet 10, and a first layer 30A directly formed on the first surface 11 of the elastic sheet 10, and on the first surface 11, an area in contact with connection terminals 41 is defined as a first contact area S1. When a region other than the first contact region S1 is defined as a first non-contact region S2, the first layer 30A is formed in the first non-contact region S2 and covers 80% or more of the total area of the first non-contact region S2, and the linear expansion coefficient of the first layer 30A is smaller than the linear expansion coefficient of the elastic sheet 10.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] TECHNICAL FIELD The present disclosure relates to electrical connectors and methods of manufacturing the same. [Background technology]

[0002] Conventionally, pressure-displacement electrical connectors are used to connect two devices, such as a ball grid array (BGA) package and a test board. This electrical connector is composed of an elastic sheet and multiple conductive wires that penetrate the elastic sheet in the thickness direction or diagonally to the thickness direction.By placing it between the testing board and the BGA to be tested and pressing it together, the conductive wires that penetrate the electrical connector electrically connect the solder balls of the BGA to the pattern electrodes of the testing board (Patent Document 1).

[0003] When such electrical connectors are used in high-temperature environments, the elastic sheet undergoes thermal expansion. Thermal expansion in the planar direction of the elastic sheet can cause the conductive wires to shift in the planar direction, while thermal expansion in the thickness direction of the elastic sheet can cause the ends of the conductive wires to become embedded in the elastic sheet, resulting in an unstable connection. Furthermore, when the electrical connector is crimped, the device's electrodes apply a load to a portion of the elastic sheet, causing local distortion of the elastic sheet and potentially causing the electrode wires of the electrode connector to shift in position. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 2787032 Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been made in consideration of the above circumstances, and aims to provide an electrical connector that can suppress misalignment of the connection position between the electrode of a device and the electrode wire of an electrical connector due to distortion during thermal expansion or compression of the elastic sheet, and a method for manufacturing such an electrical connector. [Means for solving the problem]

[0006] In order to solve the above problems, the present invention proposes the following means. (1) The electrical connector of the first aspect of the present invention is an electrical connector disposed between a connection terminal of a first device and a connection terminal of a second device, for electrically connecting the connection terminal of the first device and the connection terminal of the second device, an insulating elastic sheet having a first surface disposed on the connection terminal side of the first device and a second surface disposed on the connection terminal side of the second device; a plurality of conductive wires passing through the elastic sheet between the first surface and the second surface while being spaced apart from one another; a first layer formed directly on the first surface of the elastic sheet; Equipped with When an area of ​​the first surface that comes into contact with the connection terminal of the first device is defined as a first contact area, and an area other than the first contact area is defined as a first non-contact area, the first layer is formed in the first non-contact region and covers 80% or more of the total area of ​​the first non-contact region; The first layer has a linear expansion coefficient smaller than that of the elastic sheet. (2) A second aspect of the present invention is the electrical connector of the first aspect, a second layer formed directly on the second surface of the elastic sheet; When an area of ​​the second surface that comes into contact with the connection terminal of the second device is defined as a second contact area, and an area other than the second contact area is defined as a second non-contact area, the second layer is formed in the second non-contact region and covers 80% or more of the total area of ​​the second non-contact region; The second layer has a linear expansion coefficient smaller than that of the elastic sheet. (3) A third aspect of the present invention is the electrical connector of the first aspect, further comprising a plurality of first conductive pads formed directly on the first surface of the elastic sheet; Each of the plurality of first conductive pads is formed in the first contact region corresponding to each of the connection terminals of the first device, and the end faces of the plurality of conductive wires on the first surface side of the numerous conductive wires contact each of the plurality of first conductive pads. (4) A fourth aspect of the present invention is the electrical connector of the second aspect, further comprising a plurality of second conductive pads formed directly on the second surface of the elastic sheet; Each of the plurality of second conductive pads is formed in the second contact region corresponding to each of the connection terminals of the second device, and the end faces of the plurality of conductive wires on the second surface side among the numerous conductive wires contact each of the plurality of second conductive pads. (5) A fifth aspect of the present invention is the electrical connector according to the first or fourth aspect, The numerous conductive wires pass through the elastic sheet in parallel orientations. (6) A sixth aspect of the present invention is the electrical connector according to the first or fourth aspect, The numerous conductive wires are aligned in parallel with one another and penetrate the elastic sheet at an angle to the thickness direction of the elastic sheet. (7) A seventh aspect of the present invention is the electrical connector of the first aspect, The first layer is provided with marks or holes for alignment with the connection terminals of the first device. (8) Aspect 8 of the present invention is the electrical connector of aspect 2, The second layer is provided with marks or holes for alignment with the connection terminals of the second device. (9) A ninth aspect of the present invention is the electrical connector of the first or second aspect, wherein each end of the conductive wire on the second surface side is plated. (10) In the method for producing an electrical connector according to the tenth aspect of the present invention, A method for manufacturing an electrical connector according to aspect 1, comprising: a step 1 for manufacturing a connector body having the elastic sheet and the plurality of conductive wires penetrating the elastic sheet; and a step 2a for forming the first layer on one surface of the connector body, The step 2a Step 2a-1: forming a first seed layer on the one surface of the connector body by sputtering; Step 2a-2: forming a first photosensitive material layer on the first seed layer formed on the one surface; Step 2a-3: exposing the first photosensitive material layer to transfer a photomask pattern onto the first photosensitive material layer, and then developing the exposed photosensitive material layer; Step 2a-4: forming a first plating layer in the area where the first photosensitive material layer has been removed, thereby forming the first layer consisting of the first seed layer and the first plating layer; Step 2a-5: removing the first photosensitive material layer remaining in the area where the first plating layer is not formed; a step 2a-6 of removing the first seed layer remaining in the portion where the first plating layer is not formed by etching; Includes. (11) Aspect 11 of the present invention is a method for producing an electrical connector according to aspect 10, comprising: further comprising step 2b of forming a second layer on the other surface of the connector body; The step 2b is Step 2b-1: forming a second seed layer on the other surface of the connector body by sputtering; Step 2b-2: forming a second photosensitive material layer on the second seed layer formed on the other surface; Step 2b-3: exposing the second photosensitive material layer to transfer a photomask pattern onto the second photosensitive material layer, and then developing the exposed photosensitive material layer; Step 2b-4: forming a second plating layer in the area where the second photosensitive material layer has been removed, thereby forming a second layer consisting of a second seed layer and the second plating layer; Step 2b-5: removing the second photosensitive material layer remaining in the area where the second plating layer is not formed; Step 2b-6: removing the second seed layer remaining in the portion where the second plating layer is not formed by etching; Includes. [Effects of the Invention]

[0007] According to the above aspects of the present invention, it is possible to provide an electrical connector and a method for manufacturing the electrical connector that can suppress misalignment of the connection position between the electrode of the device and the electrode wire of the electrical connector due to distortion during thermal expansion or compression of the elastic sheet. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic diagram illustrating the configuration of an electrical connector according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a top view of the electrical connector shown in FIG. 1. [Figure 3] 3A to 3C are process diagrams illustrating an example of a method for forming a first layer in an embodiment. [Figure 4] FIG. 10 is a schematic diagram illustrating the configuration of an electrical connector according to a second embodiment of the present invention. [Figure 5] FIG. 5 is a bottom view of the electrical connector shown in FIG. 4. [Figure 6] 5A to 5C are process diagrams illustrating an example of a method for forming a second layer in an embodiment. [Figure 7] FIG. 10 is a schematic diagram illustrating the configuration of an electrical connector according to a third embodiment of the present invention. [Figure 8] FIG. 8 is a top view of the electrical connector shown in FIG. 7. [Figure 9] 3A to 3C are process diagrams illustrating an example of a method for forming a first layer and a first conductive pad in an embodiment. [Figure 10] FIG. 10 is a schematic diagram illustrating the configuration of an electrical connector according to a fourth embodiment of the present invention. [Figure 11] FIG. 11 is a bottom view of the electrical connector shown in FIG. 10. [Figure 12] 5A to 5C are process diagrams illustrating an example of a method for forming a second layer and a second conductive pad in an embodiment. [Figure 13]FIG. 10 is a schematic diagram illustrating the configuration of an electrical connector according to a fifth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0009] In this specification and claims, a numerical range expressed by "to" means a numerical range with the numbers before and after "to" as the lower and upper limits. In this specification, the plating thickness is the average value of measurements taken at five locations using a non-contact fluorescent X-ray coating thickness meter. The "thickness" of each other component is the average value of measurements taken at five locations on the cross section of the object using a magnifying observation tool such as a digital microscope.

[0010] First Embodiment An electrical connector 100A according to a first embodiment will be described using Figures 1 and 2. Figure 1 is a schematic diagram of the electrical connector 100A according to the first embodiment of the present invention. Figure 2 is a top view of the electrical connector 100A shown in Figure 1. As shown in Figure 1, the electrical connector 100A includes an insulating elastic sheet 10, a number of conductive wires 20 penetrating the elastic sheet 10, and a first layer 30A formed directly on the elastic sheet 10. The electrical connector 100A is disposed between the first device 40 and the second device 50 to connect the connection terminal 41 of the first device 40 and the connection terminal 51 of the second device 50 .

[0011] (Elastic sheet 10) The elastic sheet 10 is sheet-shaped and has a first surface 11 that is positioned on the connection terminal 41 side of the first device 40, and a second surface 12 that is opposite the first surface 11 and is positioned on the connection terminal 51 side of the second device 50.

[0012] On the first surface 11, the elastic sheet 10 has a first contact region S1 that is a region that comes into contact with the connection terminal 41 of the first device 40, and a first non-contact region S2 that is a region other than the first contact region. In Fig. 2, the first contact region S1 is the region inside the region surrounded by the dashed line, and the first non-contact region S2 is the region other than the region surrounded by the dashed line. The region that comes into contact with the connection terminal 41 refers to the region that overlaps with the connection terminal 41 in a plan view (viewed from above) when the first device 40 and the electrical connector 100A are placed in a crimping position (Fig. 1).

[0013] The thickness of the elastic sheet 10 is preferably 20 μm to 5000 μm, more preferably 40 μm to 1000 μm, and even more preferably 60 μm to 500 μm. When the thickness of the elastic sheet 10 is 20 μm or more, the mechanical strength and rigidity of the elastic sheet 10 are improved, making it easier to handle. When the thickness of the elastic sheet 10 is 5000 μm or less, the length of the conductive wires 20 becomes suitable for improving high-frequency characteristics.

[0014] The insulating elastic sheet 10 can be made of an elastomer or a thermoplastic resin. Examples of the thermoplastic resin include polyvinyl chloride, polyethylene, polypropylene, polyvinyl acetate, and polybutylene terephthalate. These thermoplastic resins may be used alone or in combination of two or more.

[0015] Examples of the elastomer include butylene-styrene rubber, isoprene rubber, acrylonitrile-butadiene rubber, styrene-butadiene rubber, silicone rubber, etc. These elastomers may be used alone or in combination of two or more. The material constituting the elastic sheet 10 is preferably silicone rubber, which has high elasticity and excellent heat resistance.

[0016] (Conductive wire 20) The numerous conductive wires 20 penetrate between the first surface 11 and the second surface 12 of the elastic sheet 10, spaced apart from one another. Penetrating between the first surface 11 and the second surface 12 means that one end of each conductive wire 20 is exposed or protruding from the first surface 11, and the other end of each conductive wire 20 is exposed or protruding from the second surface 12. It is preferable that the numerous conductive wires 20 penetrate the elastic sheet 10 in the same direction, so as to be parallel to one another. It is preferable that all of the numerous conductive wires 20 penetrate between the first surface 11 and the second surface 12. As long as electrical connection can be made between the connection terminal 41 of the first device 40 and the connection terminal 51 of the second device 50, the conductive wires 20 may include conductive wires 20 that do not penetrate between the first surface 11 and the second surface 12, for example, conductive wires 20 whose one end is not exposed or protruding from either surface.

[0017] In this embodiment, one end of the conductive wire 20 is exposed on the first surface 11 , and the other end of the conductive wire 20 is exposed on the second surface 12 . In this embodiment, the penetration direction of the numerous conductive wires 20 is substantially along the thickness direction (direction perpendicular to the first surface 11) and is substantially parallel to one another. The position and number of conductive wires 20 on the elastic sheet 10 are not particularly limited and are adjusted appropriately according to the arrangement and number of connection terminals 41 and 51 of the first device 40 and the second device 50, respectively, which are electrically connected by the electrical connector 100A.

[0018] Examples of materials for the conductive wire 20 include metals such as copper, tungsten, nickel, gold, silver, iron, aluminum, lead, zinc, tin, brass, and phosphor bronze. The contour shape of the cross section perpendicular to the longitudinal direction of the conductive wires 20 is not particularly limited, and examples thereof include a circle, ellipse, triangle, square, rectangle, and polygon with pentagons or more. The contour shapes of the cross sections of the conductive wires 20 may be the same or different. Each conductive wire 20 may be solid or at least partially hollow. Each conductive wire 20 may also have a multilayer structure in which a core wire is plated.

[0019] The diameter of the conductive wire 20 is the diameter of the outline shape of the cross section perpendicular to its length direction, and is preferably 5 μm to 50 μm, more preferably 10 μm to 25 μm. If the outline shape of the cross section is other than circular, the diameter is the diameter of the smallest including circle. Here, the diameter of the conductive wires 20 is the average value of the diameters of five or more randomly selected conductive wires 20 measured at the position of the first surface 11 of the elastic sheet 10 .

[0020] (First layer 30A) The first layer 30A is formed directly on the first surface 11 of the elastic sheet 10. When the area of ​​the first surface 11 that comes into contact with the connection terminals 41 of the first device 40 is defined as a first contact area S1 and the area other than the first contact area S1 is defined as a first non-contact area S2, the first layer 30A is formed within the first non-contact area S2. In other words, the first layer 30A is not formed in the first contact area S1. This allows the connection terminals 41 of the first device 40 to come into contact with the conductive wires 20 of the electrical connector 100A when the first device 40 and the electrical connector 100A are brought into contact with each other.

[0021] The first layer 30A preferably covers 80% or more of the total area of ​​the first non-contact region S2. More preferably, the first layer 30A covers 85% or more of the total area of ​​the first non-contact region S2. More preferably, the first layer 30A covers 90% or more of the total area of ​​the first non-contact region S2. The first layer 30A may cover the entire area of ​​the first non-contact region S2. By covering 80% or more of the total area of ​​the first non-contact region S2, the first layer 30A can suppress thermal expansion of the elastic sheet 10 and suppress misalignment of the connection positions between the connection terminals 41 of the first device 40 and the conductive wires 20 of the electrical connector 100A in a high-temperature environment. Similarly, when the first device 40 and the electrical connector 100A are brought into contact with each other, distortion of the elastic sheet 10 can be suppressed, thereby suppressing misalignment of the connection positions between the connection terminals 41 of the first device 40 and the conductive wires 20 of the electrical connector 100A.

[0022] The thickness of the first layer 30A is preferably 5 μm to 50 μm, and more preferably 10 μm to 20 μm. If the thickness of the first layer 30A is 5 μm or more, the thermal expansion of the elastic sheet 10 can be further suppressed. If the thickness of the first layer 30A is 50 μm or less, the elasticity of the elastic sheet 10 is not impaired, and the electrical connection between the connection terminals 41 and the conductive wires 20 is not hindered when the first device 40 and the electrical connector 100A are brought into contact with each other.

[0023] The linear expansion coefficient of the first layer 30A is smaller than the linear expansion coefficient of the elastic sheet 10. This makes it possible to prevent misalignment of the connection positions between the connection terminals 41 and the conductive wires 20 of the electrical connector 100A due to thermal expansion of the elastic sheet 10.

[0024] The material of first layer 30A is not particularly limited as long as it has a linear expansion coefficient smaller than that of elastic sheet 10. Examples of materials for first layer 30A include metals such as copper, nickel, and gold, and alloys thereof, ceramics, diamond-like carbon (DLC), polyimide, and silica.

[0025] The linear expansion coefficient of the first layer 30A is 25 x 10 -6 The linear expansion coefficient of the first layer 30A is preferably 20×10 -6 The linear expansion coefficient of the first layer 30A is more preferably 15×10 -6 It is more preferable that the temperature is 1 / K or less.

[0026] The linear expansion coefficients of the first layer 30A and the elastic sheet 10 may be measured in accordance with the Japanese Industrial Standards. If the material of the first layer 30A is metal, the measurement may be based on, for example, JIS Z 2285:2003. If the material of the elastic sheet 10 is resin, the measurement may be based on, for example, JIS K7197:2012. The known linear expansion coefficient of the material of the first layer 30A may be considered to be the linear expansion coefficient of the first layer 30A. Furthermore, the known linear expansion coefficient of the material of the elastic sheet 10 may be considered to be the linear expansion coefficient of the elastic sheet 10.

[0027] The first layer 30A may be composed of multiple layers. For example, the first layer 30A may be composed of a seed layer (first seed layer) that improves adhesion between the elastic sheet 10 and the first layer 30A, and a plating layer (first plating layer) that is provided on the first seed layer and suppresses thermal expansion. The first layer 30A may be a single layer. Examples of materials for the first seed layer include titanium, copper, and composites thereof.

[0028] (First device 40, second device 50) There are no particular limitations on the specific embodiments of the first device 40 and the second device 50. While Fig. 1 shows an example in which the first device 40 is a ball grid array (BGA) having ball-shaped connection terminals 41, the first device 40 may also be a land grid array (LGA) package having flat-shaped connection terminals 41, a small outline package (SOP), a small outline J-lead (SOJ) package, a small outline no-lead (SON) package, a quad flat package (QFP), a quad flat J-lead (QFJ) package, a quad flat no-lead (QFN) package, a test board, or the like.

[0029] Similarly, the second device 50 may be a BGA, an LGA, a small outline package (SOP), a small outline J-lead (SOJ) package, a small outline no-lead (SON) package, a quad flat package (QFP), a quad flat J-lead (QFJ) package, a quad flat no-lead (QFN) package, a test substrate thereof, or the like. A specific example of the combination is a combination in which the first device 40 is a BGA and the second device 50 is its test substrate.

[0030] (Connection method) The first device 40 arranged on the first surface 11 side of the electrical connector 100A and the second device 50 arranged on the second surface 12 side are pressed against the electrical connector 100A from both sides. As a result, the end of the conductive wire 20 on the first surface 11 side comes into contact with the connection terminal 41, while the end of the conductive wire 20 on the second surface 12 side comes into contact with the connection terminal 51. As a result, the connection terminal 41 and the connection terminal 51 are electrically connected.

[0031] <Manufacturing method> Next, a method for manufacturing the electrical connector 100A according to this embodiment will be described. Examples of a method for manufacturing the electrical connector 100A include a step 1 for manufacturing a connector main body 100a having an elastic sheet 10 and a large number of conductive wires 20 penetrating the elastic sheet 10, and a step 2a for forming a first layer 30A on one surface (first surface) 11 of the connector main body 100a, but the method for manufacturing the electrical connector 100A is not limited to this method. Step 2a includes step 2a-1 of forming a first seed layer 31A by sputtering on one surface (first surface) 11 of the connector body 100a, step 2a-2 of forming a first photosensitive material layer 32A on the first seed layer 31A formed on the one surface 11, step 2a-3 of exposing the first photosensitive material layer 32A to transfer a photomask pattern to it and then developing it, step 2a-4 of forming a first plating layer 33A in the area where the first photosensitive material layer 32A has been removed, thereby forming a first layer 30A consisting of the first seed layer 31A and the first plating layer 33A, step 2a-5 of removing the first photosensitive material layer 32A remaining in the area where the first plating layer 31A is not formed, and step 2a-6 of etching away the first seed layer 31A remaining in the area where the first plating layer 31A is not formed.

[0032] Step 1 can be carried out, for example, in the same manner as in Patent Document 1, by the following steps 1-1 to 1-4. Step 1-1: On one surface of a first elastic sheet, a plurality of conductive wires 20 are arranged at an arbitrary interval, oriented in the same direction so that the extending direction of the conductive wires 20 is parallel to one surface of the first elastic sheet. Step 1-2: A second elastic sheet is placed on top of the elastic sheet 10 on which a large number of conductive wires 20 are arranged, and the sheets are integrated together, and the plurality of conductive wires 20 are fixed between the first elastic sheet and the second elastic sheet, thereby obtaining a conductive wire-containing sheet. Step 1-3: A plurality of conductive wire-containing sheets are stacked and integrated so that the orientation of the conductive wires 20 is aligned, thereby obtaining a laminate of conductive wire-containing sheets. Step 1-4: The laminate of conductive wire-containing sheets is cut perpendicularly or obliquely to the direction in which the numerous conductive wires 20 extend, to obtain the connector body 100a.

[0033] When the ends of the conductive wires 20 are to protrude from the elastic sheet 10, the conductive wires 20 may be arranged in step 1-1 so that the ends protrude from the outer edge of the elastic sheet. Alternatively, the ends of the conductive wires 20 may be protruded by scraping the surface of the elastic sheet 10 by laser irradiation.

[0034] (Step 2a) The step 2a of forming the first layer 30A can be performed, for example, by the above steps 2a-1 to 2a-6.

[0035] Step 2a-1: On one surface (first surface) 11 of connector body 100a (FIG. 3(a)), a first seed layer 31A is formed by sputtering using titanium, copper, a composite thereof, or the like (FIG. 3(b)). Step 2a-2: A first photosensitive material layer 32A is formed on the first seed layer 31A formed on one surface 11 of the connector body 100a using a dry film photoresist or the like (FIG. 3(c)). Step 2a-3: After exposure to transfer the pattern of the photomask onto the first photosensitive material layer 32A, development is performed (FIG. 3(d)). Step 2a-4: A first plating layer 33A is formed from copper, nickel, gold, or a composite of these in the area where the first photosensitive material layer 32A has been removed, thereby obtaining a first layer 30A consisting of the first seed layer 31A and the first plating layer 33A (Figure 3(e)). Step 2a-5: The first photosensitive material layer 32A remaining in the area where the first plating layer 31A is not formed is removed (FIG. 3(f)). Step 2a-6: The first seed layer 31A remaining in the area where the first plating layer 31A is not formed is removed by etching (FIG. 3(g)).

[0036] The above describes the electrical connector 100A according to the first embodiment and a method for manufacturing the same. In the electrical connector 100A according to this embodiment, the first layer 30A is formed in the first non-contact area S2, covers at least 80% of the total area of ​​the first non-contact area, and has a linear expansion coefficient that is smaller than that of the elastic sheet. This prevents misalignment of the connection between the device electrodes and the electrode wires of the electrical connector due to distortion caused by thermal expansion or compression of the elastic sheet.

[0037] Second Embodiment Next, an electrical connector 100B according to a second embodiment of the present invention will be described with reference to Figures 4 and 5. Figure 4 is a schematic diagram of the electrical connector 100B according to the second embodiment of the present invention. Figure 5 is a bottom view of the electrical connector 100B shown in Figure 4. In this second embodiment, parts that are the same as those in the first embodiment are given the same reference numerals, and their description may be omitted.

[0038] As shown in FIG. 4, the electrical connector 100B comprises an insulating elastic sheet 10, a number of conductive wires 20 penetrating the elastic sheet 10, a first layer 30A formed directly on the elastic sheet 10, and a second layer 30B formed directly on the elastic sheet 10. The electrical connector 100B is disposed between the first device 40 and the second device 50 to connect the connection terminal 41 of the first device 40 and the connection terminal 51 of the second device 50 .

[0039] (Elastic sheet 10) The configuration of the elastic sheet 10 is the same as that of the first embodiment. On the second surface 12, the elastic sheet 10 has a second contact region S3 that is a region that contacts the connection terminal 51 of the second device 50, and a second non-contact region S4 that is a region other than the second contact region. In FIG. 5 , the second contact region S3 is the region inside the region surrounded by the dashed line, and the second non-contact region S4 is the region other than the region surrounded by the dashed line. The region that contacts the connection terminal 51 refers to the region that overlaps with the connection terminal 51 in a plan view when the second device 50 and the electrical connector 100B are positioned for crimping.

[0040] (Conductive wire 20, first layer 30A) The conductive wire 20 and the first layer 30A are similar to those in the first embodiment.

[0041] (Second layer 30B) The second layer 30B is formed directly on the second surface 12 of the elastic sheet 10. When the area of ​​the second surface 12 that comes into contact with the connection terminals 51 of the second device 50 is defined as a second contact area S3 and the area other than the second contact area S3 is defined as a second non-contact area S4, the second layer 30B is formed within the second non-contact area S4. In other words, the second layer 30B is not formed in the second contact area S3. This allows the connection terminals 51 of the second device 50 to come into contact with the conductive wires 20 of the electrical connector 100B when the second device 50 and the electrical connector 100B are brought into contact with each other. Furthermore, the presence of first layer 30A and second layer 30B can suppress warping of elastic sheet 10.

[0042] The second layer 30B preferably covers 80% or more of the total area of ​​the second non-contact region S4. More preferably, the second layer 30B covers 85% or more of the total area of ​​the second non-contact region S4. More preferably, the second layer 30B covers 90% or more of the total area of ​​the second non-contact region S4. The second layer 30B may cover the entire area of ​​the second non-contact region S4. By covering 80% or more of the total area of ​​the second non-contact region S4, the second layer 30B can suppress thermal expansion of the elastic sheet 10 and prevent misalignment of the connection positions between the connection terminals 51 of the second device 50 and the conductive wires 20 of the electrical connector 100B in a high-temperature environment. Similarly, when the second device 50 and the electrical connector 100B are brought into contact with each other, distortion of the elastic sheet 10 can be suppressed, thereby preventing misalignment of the connection positions between the connection terminals 51 of the second device 50 and the conductive wires 20 of the electrical connector 100B.

[0043] It is preferable that the total area of ​​the first layer 30A is equal to the total area of ​​the second layer 30B, which can further suppress warping of the elastic sheet 10.

[0044] The thickness of the second layer 30B is preferably 5 μm to 50 μm, and more preferably 10 μm to 20 μm. If the thickness of the second layer 30B is 5 μm or more, the thermal expansion of the elastic sheet 10 can be further suppressed. If the thickness of the second layer 30B is 50 μm or less, the elasticity of the elastic sheet 10 is not impaired, and the electrical connection between the connection terminals 51 and the conductive wires 20 is not hindered when the second device 50 and the electrical connector 100B are brought into contact with each other.

[0045] The linear expansion coefficient of the second layer 30B is smaller than that of the elastic sheet 10. This makes it possible to prevent misalignment of the connection positions between the connection terminals 41 and the conductive wires 20 of the electrical connector 100B due to thermal expansion of the elastic sheet 10. Furthermore, it is preferable that the linear expansion coefficient of the second layer 30B is equal to that of the first layer 30A. This makes it possible to further prevent warping of the elastic sheet 10.

[0046] The material of second layer 30B is not particularly limited as long as it has a linear expansion coefficient smaller than that of elastic sheet 10. Examples of materials for second layer 30B include metals such as copper, nickel, and gold, alloys of these metals, ceramics, diamond-like carbon (DLC), polyimide, and silica.

[0047] The linear expansion coefficient of the second layer 30B is 25×10 -6 The linear expansion coefficient of the second layer 30B is preferably 20×10 -6 The linear expansion coefficient of the second layer 30B is more preferably 15×10 -6 It is more preferable that the temperature is 1 / K or less.

[0048] The linear expansion coefficient of the second layer 30B can be measured in the same manner as the linear expansion coefficient of the first layer 30A.

[0049] The second layer 30B may be composed of multiple layers. For example, the second layer 30B may be composed of a seed layer (second seed layer) that improves adhesion between the elastic sheet 10 and the second layer 30B, and a plating layer (second plating layer) that is provided on the second seed layer and suppresses thermal expansion. The second layer 30B may be a single layer. Examples of materials for the second seed layer include titanium, copper, and composites thereof.

[0050] <Manufacturing method> Next, a method for manufacturing the electrical connector 100B according to this embodiment will be described. Examples of a method for manufacturing the electrical connector 100B include a step 1 for manufacturing a connector body 100a having an elastic sheet 10 and a large number of conductive wires 20 penetrating the elastic sheet 10, a step 2a for forming a first layer 30A on one surface (first surface) 11 of the connector body 100a, and a step 2b for forming a second layer 30B on the other surface (second surface) 12 of the connector body 100a. However, the method for manufacturing the electrical connector 100B is not limited to this method. Step 2b includes, for example, step 2b-1 of forming a second seed layer 31B by sputtering on the other surface (second surface) 12 of the connector body 100a; step 2b-2 of forming a second photosensitive material layer 32B on the second seed layer 31B formed on the other surface 12; step 2b-3 of exposing the second photosensitive material layer 32B to transfer a photomask pattern to the second photosensitive material layer 32B, followed by development; step 2b-4 of forming a second plating layer 33B in the area where the second photosensitive material layer 32B has been removed, thereby forming a second layer 30B consisting of the second seed layer 31B and the second plating layer 32B; step 2b-5 of removing the second photosensitive material layer 32B remaining in the area where the second plating layer 33B is not formed; and step 2b-6 of etching away the second seed layer 31B remaining in the area where the second plating layer 33B is not formed.

[0051] Step 1 and step 2a are the same as those in the first embodiment.

[0052] (Step 2b) The step 2b of forming the second layer 30B can be performed, for example, by the above steps 2b-1 to 2b-6.

[0053] Step 2b-1: A second seed layer 31B is formed on the other surface (second surface) 12 of the connector body 100a (FIG. 6(a)) by sputtering using titanium, copper, a composite thereof, or the like (FIG. 6(b)). Step 2b-2: A second photosensitive material layer 32B is formed on the second seed layer 31B formed on the other surface 12 of the connector body 100a using a dry film photoresist or the like (FIG. 6(c)). Step 2b-3: After exposure to transfer the pattern of the photomask onto the second photosensitive material layer 32B, development is performed (FIG. 6(d)). Step 2b-4: A second plating layer 33B is formed from copper, nickel, gold, or a composite of these in the area where the second photosensitive material layer 32B has been removed, thereby obtaining a second layer 30B consisting of the second seed layer 31B and the second plating layer 32B (Figure 6(e)). Step 2b-5: The second photosensitive material layer 32B remaining in the area where the second plating layer 33B is not formed is removed (FIG. 6(f)). Step 2b-6: The second seed layer 31B remaining in the area where the second plating layer 33B is not formed is removed by etching (FIG. 6(g)).

[0054] The electrical connector 100B according to the second embodiment and a method for manufacturing the same have been described above. In the electrical connector 100B according to this embodiment, the first layer 30A is formed in the first non-contact region S2, covers at least 80% of the total area of ​​the first non-contact region, and has a linear expansion coefficient smaller than that of the elastic sheet. This prevents misalignment of the connection between the device electrodes and the electrode wires of the electrical connector due to distortion caused by thermal expansion or compression of the elastic sheet. Furthermore, the presence of the first layer 30A and second layer 30B prevents warping of the elastic sheet 10.

[0055] In this embodiment, first layer 30A is formed, and second layer 30B is formed, but the present invention is not limited to this. Steps 2a and 2b may be performed in parallel on both sides of connector body 100a. Steps 2a-1 and 2b-1, 2a-2 and 2b-2, 2a-4 and 2b-4, 2a-5 and 2b-5, and 2a-6 and 2b-6 can be performed simultaneously. Steps 2a-3 and 2b-3 can be performed simultaneously with exposure followed by development.

[0056] Third Embodiment Next, an electrical connector 100C according to a third embodiment of the present invention will be described with reference to Figures 7 and 8. Figure 7 is a schematic diagram of the electrical connector 100C according to the third embodiment of the present invention. Figure 8 is a top view of the electrical connector 100C shown in Figure 7. In this third embodiment, parts that are the same as those in the first embodiment are given the same reference numerals, and their description may be omitted.

[0057] As shown in FIG. 7, the electrical connector 100C includes an insulating elastic sheet 10, a number of conductive wires 20 penetrating the elastic sheet 10, a first layer 30A formed directly on the elastic sheet 10, and a number of first conductive pads 60A formed directly on the elastic sheet 10. The electrical connector 100C is disposed between the first device 40 and the second device 50 to connect the connection terminal 41 of the first device 40 and the connection terminal 51 of the second device 50.

[0058] The elastic sheet 10, the conductive wires 20, and the first layer 30A are the same as those in the first embodiment.

[0059] (First conductive pad 60A) Each of the plurality of first conductive pads 60A is formed directly on the first surface 11 of the elastic sheet 10 in a first contact region S1 corresponding to each of the connection terminals 41. In plan view, the center of the first conductive pad 60A is preferably close to the center of the corresponding connection terminal 41, and particularly preferably coincides with the center of the corresponding connection terminal 41.

[0060] Each of the plurality of first conductive pads 60A is in contact with the end face on the first surface 11 of one or more of the numerous conductive wires 20. The number of conductive wires 20 in contact with each of the first conductive pads 60A is preferably 1 to 600, more preferably 3 to 200, and even more preferably 5 to 50. When the number of conductive wires 20 in contact with each of the first conductive pads 60A is one or more, the electrical connection with the connection terminals 51 via the conductive wires 20 is sufficiently stable. Furthermore, if the number of conductive wires 20 in contact with each of the first conductive pads 60A is 600 or less, crosstalk (interference) between the conductive wires 20 will not occur.

[0061] The contour shape of the plurality of first conductive pads 60A in plan view is not particularly limited, and examples thereof include a circle, an ellipse, a triangle, a square, a rectangle, a polygon with pentagons or more sides, etc. The contour shapes of the plurality of first conductive pads 60A may be the same or different.

[0062] The size area of ​​each of the plurality of first conductive pads 60A is preferably such that the diameter of the smallest encompassing circle is 50 μm to 800 μm, more preferably 50 μm to 300 μm. If the diameter of the smallest encompassing circle is 50 μm or more, the area of ​​each first conductive pad 60A can be made sufficient, so that an excessive compressive load is not applied between the connection terminal 41 and the conductive wire 20, and good electrical contact can be obtained, and electrical connection with the connection terminal 51 via the conductive wire 20 can also be easily ensured. The distance between the first conductive pads 60A is preferably 30 μm or more, and more preferably 50 μm or more.Within this range, it is easy to maintain the insulation between the first conductive pads 60A.

[0063] The thickness of the plurality of first conductive pads 60A is preferably 5 μm to 50 μm, and more preferably 10 μm to 20 μm. If the thickness of the first conductive pads 60A is 5 μm or more, it is easy to ensure strength when pressed together. If the thickness of the first conductive pads 60A is 50 μm or less, it is easy to keep costs down.

[0064] The first conductive pads 60A may be made of metals such as copper, nickel, and gold, or composites thereof. Composites are preferred because they have sufficient electrical properties and are cost-effective. They are preferably formed on the first surface 11 by plating.

[0065] It is preferable that the material of the first conductive pad 60A and the material of the first layer 30A are the same, as this can further suppress the thermal expansion of the elastic sheet 10. It is also preferable that the material of the first conductive pad 60A and the material of the first layer 30A are the same, as this can simplify the manufacturing process.

[0066] The first conductive pad 60A may be configured as a single layer or multiple layers, but is preferably configured as multiple layers.

[0067] If the material of the first layer 30A is a conductive material, the first conductive pad 60A and the first layer 30A are spaced apart so as not to be in electrical contact with each other, i.e., if the material of the first layer 30A is a conductive material, the first layer 30A and the first conductive pad 60A are insulated from each other.

[0068] <Manufacturing method> Next, a method for manufacturing the electrical connector 100C according to this embodiment will be described. Examples of a method for manufacturing the electrical connector 100C include a step 1 for manufacturing a connector body 100a having an elastic sheet 10 and a large number of conductive wires 20 penetrating the elastic sheet 10, and a step 2c for forming a first layer 30A and a plurality of first conductive pads 60A on one surface (first surface) 11 of the connector body 100a, but the method for manufacturing the electrical connector 100C is not limited to this method. Step 2c includes, for example, Step 2c-1, in which a first seed layer 31A is formed by sputtering on one surface (first surface) 11 of the connector body 100a; Step 2c-2, in which a first photosensitive material layer 32A is formed on the first seed layer 31A formed on the one surface 11; Step 2c-3, in which the first photosensitive material layer 32A is exposed to light to transfer a photomask pattern onto the first photosensitive material layer 32A, followed by development; Step 2c-4, in which a first plating layer 33A is formed in the area where the first photosensitive material layer 32A has been removed, to form a first layer 30A consisting of the first seed layer 31A and the first plating layer 33A and a first conductive pad 60A consisting of the first seed layer 31A and the first plating layer 33A; Step 2c-5, in which the first photosensitive material layer 32A remaining in the area where the first plating layer 33A is not formed is removed; and Step 2c-6, in which the first seed layer 31A remaining in the area where the first plating layer 33A is not formed is removed by etching. Includes.

[0069] Step 1 is the same as in the first embodiment.

[0070] (Step 2c) Step 2c of forming the first layer 30A and the plurality of first conductive pads 60A can be performed, for example, by the above steps 2c-1 to 2c-6.

[0071] Step 2c-1: On one surface (first surface) 11 of connector body 100a (FIG. 9(a)), a first seed layer 31A is formed by sputtering using titanium, copper, a composite thereof, or the like (FIG. 9(b)). Step 2c-2: A first photosensitive material layer 32A is formed on the first seed layer 31A formed on one surface 11 of the connector body 100a using a dry film photoresist or the like (FIG. 9(c)). Step 2c-3: After exposure to transfer the pattern of the photomask onto the first photosensitive material layer 32A, development is performed (FIG. 9(d)). Step 2c-4: A first plating layer 33A is formed from copper, nickel, gold, or a composite of these in the area where the first photosensitive material layer 32A has been removed, thereby obtaining a first layer 30A consisting of the first seed layer 31A and the first plating layer 33A, and a first conductive pad 60A consisting of the first seed layer 31A and the first plating layer 33A (Figure 9(e)). Step 2c-5: The first photosensitive material layer 32A remaining in the area where the first plating layer 33A is not formed is removed (FIG. 9(f)). Step 2c-6: The first seed layer 31A remaining in the area where the first plating layer 33A is not formed is removed by etching (FIG. 9(g)).

[0072] The electrical connector 100C according to the third embodiment and a method for manufacturing the same have been described above. In the electrical connector 100C according to this embodiment, the first layer 30A is formed within the first non-contact region S2, covers at least 80% of the total area of ​​the first non-contact region, and has a linear expansion coefficient lower than that of the elastic sheet. This reduces misalignment of the connection between the device electrodes and the electrode wires of the electrical connector due to distortion caused by thermal expansion or compression of the elastic sheet. Furthermore, because multiple first conductive pads 60A are bonded to the conductive wires 20, burying of the conductive wires due to thermal expansion in the thickness direction of the elastic sheet 10 is reduced, resulting in stable electrical connection.

[0073] <Fourth embodiment> Next, an electrical connector 100D according to a fourth embodiment of the present invention will be described with reference to Figures 10 and 11. Figure 10 is a schematic diagram of the electrical connector 100D according to the fourth embodiment of the present invention. Figure 11 is a bottom view of the electrical connector 100D shown in Figure 10. In this fourth embodiment, parts that are the same as components in the first to third embodiments are given the same reference numerals, and their description may be omitted.

[0074] As shown in FIG. 10, the electrical connector 100D includes an insulating elastic sheet 10, a number of conductive wires 20 penetrating the elastic sheet 10, a first layer 30A formed directly on the elastic sheet 10, a second layer 30B formed directly on the elastic sheet 10, a number of first conductive pads 60A formed directly on the elastic sheet 10, and a number of second conductive pads 60B formed directly on the elastic sheet 10. The electrical connector 100D is disposed between the first device 40 and the second device 50 to connect the connection terminal 41 of the first device 40 and the connection terminal 51 of the second device 50 .

[0075] The elastic sheet 10, conductive wires 20, and first layer 30A are the same as those in the first embodiment. The second layer 30B is the same as those in the second embodiment. The first conductive pad 60A is the same as those in the third embodiment.

[0076] (Second conductive pad 60B) Each of the plurality of second conductive pads 60B is formed directly on the second surface 12 of the elastic sheet 10 in a second contact area S3 corresponding to each of the connection terminals 51. In plan view, the center of the second conductive pad 60B is preferably close to the center of the corresponding connection terminal 51, and particularly preferably coincides with the center of the corresponding connection terminal 51.

[0077] Each of the plurality of second conductive pads 60B is in contact with the end face on the second surface 12 side of one or more of the numerous conductive wires 20. The number of conductive wires 20 in contact with each of the second conductive pads 60B is preferably 1 to 600, more preferably 3 to 200, and even more preferably 5 to 50. When the number of conductive wires 20 in contact with each of the second conductive pads 60B is one or more, the electrical connection with the connection terminals 41 via the conductive wires 20 is sufficiently stable. Furthermore, if the number of conductive wires 20 in contact with each of the second conductive pads 60B is 600 or less, crosstalk (interference) between the conductive wires 20 will not occur.

[0078] The contour shape of the plurality of second conductive pads 60B in plan view is not particularly limited, and examples thereof include a circle, an ellipse, a triangle, a square, a rectangle, a polygon with pentagons or more sides, etc. The contour shapes of the plurality of second conductive pads 60B may be the same or different.

[0079] The size area of ​​each of the plurality of second conductive pads 60B is preferably such that the diameter of the smallest encompassing circle is 50 μm to 800 μm, more preferably 50 μm to 300 μm. If the diameter of the smallest encompassing circle is 50 μm or more, the area of ​​each second conductive pad 60B can be made sufficient, so that an excessive compressive load is not applied between the connection terminal 51 and the conductive wire 20, and good electrical contact can be obtained, and electrical connection with the connection terminal 41 via the conductive wire 20 can also be easily ensured. The distance between the second conductive pads 60B is preferably 30 μm or more, and more preferably 50 μm or more.Within this range, it is easy to maintain the insulation between the second conductive pads 60B.

[0080] The thickness of the plurality of second conductive pads 60B is preferably 5 μm to 50 μm, and more preferably 10 μm to 20 μm. If the thickness of the second conductive pads 60B is 5 μm or more, it is easy to ensure strength when pressed together. If the thickness of the second conductive pads 60B is 50 μm or less, it is easy to keep costs down.

[0081] The second conductive pads 60B may be made of metals such as copper, nickel, and gold, or composites thereof. Composites are preferred because they have sufficient electrical properties and are cost-effective. They are preferably formed on the second surface 12 by plating.

[0082] It is preferable that the material of the second conductive pad 60B and the material of the second layer 30B are the same, as this can further suppress the thermal expansion of the elastic sheet 10. It is also preferable that the material of the second conductive pad 60B and the material of the second layer 30B are the same, as this can simplify the manufacturing process.

[0083] The second conductive pad 60B may be configured as a single layer or multiple layers, and is preferably configured as multiple layers.

[0084] If the material of the second layer 30B is a conductive substance, the second conductive pad 60B and the second layer 30B are spaced apart so as not to be in electrical contact with each other, i.e., if the material of the second layer 30B is a conductive substance, the second layer 30B and the second conductive pad 60B are insulated from each other.

[0085] <Manufacturing method> Next, a manufacturing method for the electrical connector 100D according to this embodiment will be described. Examples of manufacturing methods for the electrical connector 100D include a step 1 for manufacturing a connector body 100a having an elastic sheet 10 and a large number of conductive wires 20 penetrating the elastic sheet 10, a step 2c for forming a first layer 30A and a plurality of first conductive pads 60A on one surface (first surface) 11 of the connector body 100a, and a step 2d for forming a second layer 30B and a plurality of second conductive pads 60B on the other surface (second surface) 12 of the connector body 100a. However, the manufacturing method for the electrical connector 100D is not limited to this method. Step 2d includes, for example, step 2d-1 of forming a second seed layer 31B by sputtering on the other surface (second surface) 12 of the connector body 100a; step 2d-2 of forming a second photosensitive material layer 32B on the second seed layer 31B formed on the other surface 12; step 2d-3 of exposing the second photosensitive material layer 32B to transfer a photomask pattern to the second photosensitive material layer 32B, followed by development; step 2d-4 of forming a second plating layer 33B in the area where the second photosensitive material layer 32B has been removed, thereby forming a second layer 30B consisting of the second seed layer 31B and the second plating layer 33B and a second conductive pad 60B consisting of the second seed layer 31B and the second plating layer 33B; step 2d-5 of removing the second photosensitive material layer 32B remaining in the area where the second plating layer 33B is not formed; and step 2d-6 of etching away the second seed layer 31B remaining in the area where the second plating layer 33B is not formed.

[0086] Step 1 is the same as in the first embodiment. Step 2c is the same as in the third embodiment.

[0087] (Step 2d) Step 2d of forming second layer 30B and a plurality of second conductive pads 60B can be performed, for example, by the above steps 2d-1 to 2d-6.

[0088] Step 2d-1: A second seed layer 31B is formed on the other surface (second surface) 12 of the connector body 100a (Figure 12(a)) by sputtering using titanium, copper, a composite thereof, or the like (Figure 12(b)). Step 2d-2: A second photosensitive material layer 32B is formed on the second seed layer 31B formed on the other surface 12 of the connector body 100a using a dry film photoresist or the like (FIG. 12(c)). Step 2d-3: After exposure to transfer the photomask pattern onto the second photosensitive material layer 32B, development is performed (FIG. 12(d)). Step 2d-4: A second plating layer 33B is formed from copper, nickel, gold, a composite of these, or the like in the area where the second photosensitive material layer 32B has been removed, to obtain a second layer 30B consisting of the second seed layer 31B and the second plating layer 33B, and a second conductive pad 60B consisting of the second seed layer 31B and the second plating layer 33B (Figure 12(e)). Step 2d-5: The second photosensitive material layer 32B remaining in the area where the second plating layer 33B is not formed is removed (FIG. 12(f)). Step 2d-6: The second seed layer 31B remaining in the area where the second plating layer 33B is not formed is removed by etching (FIG. 12(g)).

[0089] The electrical connector 100D according to the fourth embodiment and its manufacturing method have been described above. In the electrical connector 100D according to this embodiment, the first layer 30A is formed within the first non-contact region S2, covers at least 80% of the total area of ​​the first non-contact region, and has a linear expansion coefficient lower than that of the elastic sheet. This prevents misalignment of the connection between the device electrodes and the electrode wires of the electrical connector due to distortion caused by thermal expansion or compression of the elastic sheet. The presence of the first layer 30A, second layer 30B, first conductive pad 60A, and second conductive pad 60B further prevents warping of the elastic sheet 10. Furthermore, because the conductive wires 20 are bonded to the multiple first conductive pads 60A and multiple second conductive pads 60B, burying of the conductive wires 20 due to thermal expansion in the thickness direction of the elastic sheet 10 is prevented, resulting in more stable electrical connection.

[0090] In the fourth embodiment, the second layer 30B and the second conductive pad 60B are formed after the first layer 30A and the first conductive pad 60A are formed, but the present invention is not limited to this. Steps 2c and 2c may be performed in parallel on both sides of the connector body 100a. Steps 2c-1 and 2d-1, 2c-2 and 2d-2, 2c-4 and 2d-4, 2c-5 and 2d-5, and 2c-6 and 2d-6 can be performed simultaneously. Steps 2c-3 and 2d-3 can be performed simultaneously with exposure followed by development.

[0091] Fifth Embodiment An electrical connector 100E according to a fifth embodiment will be described with reference to Figure 13. Figure 13 is a schematic diagram of the electrical connector 100E according to the fifth embodiment of the present invention. As shown in Figure 1, the electrical connector 100E includes an insulating elastic sheet 10, a large number of conductive wires 20 penetrating the elastic sheet 10, and a first layer 30A formed directly on the elastic sheet 10. The large number of conductive wires 20 are oriented parallel to one another and penetrate the elastic sheet 10 at an angle relative to the thickness direction of the elastic sheet 10. The electrical connector 100E is disposed between the first device 40 and the second device 50 to connect the connection terminal 41 of the first device 40 and the connection terminal 51 of the second device 50.

[0092] Electrical connector 100E differs from electrical connector 100A of the first embodiment in that the penetration direction of numerous conductive wires 20 is oblique to the thickness direction (direction perpendicular to first surface 11). In this embodiment, the conductive wire 20 tilts when compressed, thereby reducing the load between the conductive wire 20 and the connection terminal 41 and the load between the conductive wire 20 and the connection terminal 51.

[0093] The angle between the penetration direction of the numerous conductive wires 20 and the thickness direction is preferably 1° to 60°, and more preferably 10° to 30°. When the angle between the penetration direction of the numerous conductive wires 20 and the thickness direction is 1° or more, the conductive member becomes more susceptible to elastic deformation, and the effect of suppressing load is significant.When the angle between the penetration direction of the numerous conductive wires 20 and the thickness direction is 60° or less, misalignment of the conductive wires 20 is small, and connection is stable when load is applied from both sides.

[0094] <Manufacturing method> Next, a method for manufacturing the electrical connector 100E according to the fifth embodiment will be described. The method for manufacturing the electrical connector 100E simply involves diagonally cutting the laminate of conductive wire-containing sheets in steps 1-4 of the first embodiment. The other manufacturing steps are the same as those of the first embodiment.

[0095] The above describes the electrical connector 100E according to the fifth embodiment and a method for manufacturing the same. In the electrical connector 100E according to this embodiment, the first layer 30A is formed in the first non-contact area S2, covers at least 80% of the total area of ​​the first non-contact area, and has a linear expansion coefficient that is smaller than that of the elastic sheet 10. Furthermore, because the conductive wires 20 penetrate the elastic sheet 10 at an angle relative to the thickness direction of the elastic sheet 10, the load applied to the connection terminals 41, 51, and the conductive wires 20 is reduced, improving the durability of the electrical connector 100E.

[0096] In each embodiment, the first layer 30A on the first surface 11 may be provided with marks or holes (not shown) for alignment with the connection terminals 41 of the first device 40. Similarly, in the second and fourth embodiments, the second layer 30B on the second surface 12 may be provided with marks or holes (not shown) for alignment with the connection terminals 51 of the second device 50.

[0097] When a hole is formed in the first device 40 and a hole is also formed in the second device 50, for example, the positional relationship between the first device, the electrical connector 100A, and the second device can be fixed by inserting a pin through the hole in the first device, the hole in the electrical connector 100A, and the hole in the second device.

[0098] The mark is not particularly limited as long as it can be read using a camera, and can be formed, for example, from a metal plating layer, a printed layer, or the like. After placing the second device 50 in a predetermined position, the electrical connector 100A can be positioned to align with the second device 50, for example, by moving the electrical connector 100A based on the position information of the mark read by the camera.

[0099] Furthermore, each end of the conductive wire 20 on the second surface 12 side may be plated. By plating each of the ends of the conductive wires 20 on the second device 50 side, the connection with the connection terminals 51 becomes more stable.

[0100] Furthermore, each end of the conductive wire 20 on the first surface 11 side may be plated. By plating each of the ends of the conductive wires 20 on the first device 40 side, the connection with the connection terminals 41 becomes more stable.

[0101] Within the scope of the present invention, the components in the above-described embodiments may be replaced with known components as appropriate, and the above-described embodiments may be combined as appropriate. [Example]

[0102] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to the descriptions of these examples. In the following description, all blending amounts are calculated on a solid content basis.

[0103] Comparative Example 1 A plurality of conductive wires were arranged in parallel at 50 μm intervals and aligned in the same direction on one side of a 250 μm thick silicone rubber first elastic sheet formed on a polyethylene terephthalate substrate. The conductive wires had a cylindrical core wire with a diameter of 25 μm made of beryllium copper and a 0.5 μm thick gold plating layer covering the outer surface of the core wire.

[0104] Next, a second elastic sheet made of silicone rubber and having a thickness of 25 μm was placed on one side of the first elastic sheet on which multiple conductive wires were arranged, and integrated with the first elastic sheet, and multiple conductive wires were fixed between the first elastic sheet and the second elastic sheet, thereby forming a conductive wire-containing sheet.

[0105] Next, 200 sheets of the conductive wire-containing sheets were stacked so that the longitudinal direction of the conductive wires was aligned and the conductive wires overlapped when viewed in the stacking direction, thereby forming a laminate of conductive wire-containing sheets. The laminate obtained above was cut and sliced ​​to a thickness of 250 μm at an angle of 63° relative to the direction in which the conductive wires extended, to obtain the electrical connector of Comparative Example 1. The angle of the conductive wires relative to each main surface of the connector was approximately 63°.

[0106] Example 1 The electrical connector of Comparative Example 1 was used as a connector body, and a first conductive pad was formed on one main surface of the connector body. First, a seed layer of titanium and copper with a thickness of approximately 0.4 μm was formed on the entire surface of one side of the connector body by sputtering.

[0107] Next, a dry film having a thickness of 25 μm was pressure-bonded onto the entire upper surface of the seed layer to form a photosensitive material layer. The photosensitive material layer thus obtained was exposed to light to transfer the pattern of the photomask, and then developed, and the photosensitive material layer was removed from the area where the first non-contact area S2 was to be provided. The photosensitive material layers were each 200 μm in diameter and arranged in an 8 × 8 matrix with a 0.3 mm pitch. A first layer was formed by electrolytic plating, and the photosensitive material layer and seed layer remaining in areas where no plating layer was formed were removed by etching to obtain the electrical connector of Example 1. More than 80% of the non-contact area was covered with the first layer 30A.

[0108] "evaluation" The electrical connector of each example was placed on a test board having pattern electrodes, with the exposed ends of the conductive wires of the electrical connector contacting the pattern electrodes of the test board. Next, a dummy package of a semiconductor element was pressed onto the electrical connector, with the multiple solder balls on the dummy coming into contact with the conductive wires 20 at corresponding positions to form a daisy chain.

[0109] The dummy package used had solder balls of 0.2 mm diameter arranged in an 8 x 8 matrix with a 0.3 mm pitch, and had an internal circuit that could be daisy-chained to the test board. In the above assembly, the dummy package was pressed against the electrical connector three times using an automatic load testing machine (product name: MAX-1KN-S-1, manufactured by Japan Measurement Systems Co., Ltd.) at a pressure of 20 N. Evaluations were carried out at high temperatures (125 to 180°C) and at room temperature (25°C).

[0110] The positional deviation was measured from the traces of the solder ball conductive wires. Example 1 showed smaller positional deviation at high temperature and room temperature than Comparative Example 1. [Explanation of symbols]

[0111] 100A~100E Electrical Connector 10 Elastic sheet 11 Front page 12 Second side 20 Conductive wire 30A first layer 30B second layer 60A First Conductive Pad 60B Second conductive pad 40 First Device 41 Connection terminal 50 Secondary Device 51 Connection terminal

Claims

1. an electrical connector disposed between a connection terminal of a first device and a connection terminal of a second device, for electrically connecting the connection terminal of the first device and the connection terminal of the second device, an insulating elastic sheet having a first surface disposed on the connection terminal side of the first device and a second surface disposed on the connection terminal side of the second device; a plurality of conductive wires passing through the elastic sheet between the first surface and the second surface while being spaced apart from one another; a first layer formed directly on the first surface of the elastic sheet; Equipped with When an area of ​​the first surface that comes into contact with the connection terminal of the first device is defined as a first contact area, and an area other than the first contact area is defined as a first non-contact area, the first layer is formed in the first non-contact region and covers 80% or more of the total area of ​​the first non-contact region; The first layer has a linear expansion coefficient that is smaller than the linear expansion coefficient of the elastic sheet.

2. a second layer formed directly on the second surface of the elastic sheet; When an area of ​​the second surface that comes into contact with the connection terminal of the second device is defined as a second contact area, and an area other than the second contact area is defined as a second non-contact area, the second layer is formed in the second non-contact region and covers 80% or more of the total area of ​​the second non-contact region; 2. The electrical connector according to claim 1, wherein the second layer has a linear expansion coefficient that is smaller than the linear expansion coefficient of the elastic sheet.

3. further comprising a plurality of first conductive pads formed directly on the first surface of the elastic sheet; 2. The electrical connector of claim 1, wherein each of the plurality of first conductive pads is formed in the first contact region corresponding to each of the connection terminals of the first device, and the end faces of the plurality of conductive wires on the first surface side of the plurality of conductive wires contact each of the plurality of first conductive pads.

4. further comprising a plurality of second conductive pads formed directly on the second surface of the elastic sheet; 3. The electrical connector of claim 2, wherein each of the plurality of second conductive pads is formed in the second contact region corresponding to each of the connection terminals of the second device, and the end faces of the plurality of conductive wires on the second surface side of the plurality of conductive wires contact each of the plurality of second conductive pads.

5. 5. The electrical connector according to claim 1, wherein the plurality of conductive wires pass through the elastic sheet in parallel with one another.

6. 5. The electrical connector according to claim 1, wherein the plurality of conductive wires are oriented parallel to one another and extend through the elastic sheet at an angle relative to the thickness direction of the elastic sheet.

7. The electrical connector according to claim 1 , wherein the first layer is provided with marks or holes for alignment with the connection terminals of the first device.

8. The electrical connector according to claim 2 , wherein the second layer is provided with marks or holes for alignment with the connection terminals of the second device.

9. 3. The electrical connector according to claim 1, wherein each of the ends of the conductive wires on the second surface side is plated.

10. 2. A method for manufacturing an electrical connector according to claim 1, comprising: a step 1 for manufacturing a connector body having the elastic sheet and the plurality of conductive wires penetrating the elastic sheet; and a step 2a for forming the first layer on one surface of the connector body, The step 2a Step 2a-1: forming a first seed layer on the one surface of the connector body by sputtering; Step 2a-2: forming a first photosensitive material layer on the first seed layer formed on one surface; Step 2a-3: exposing the first photosensitive material layer to transfer a photomask pattern onto the first photosensitive material layer, and then developing the exposed photosensitive material layer; Step 2a-4: forming a first plating layer in the area where the first photosensitive material layer has been removed, thereby forming the first layer consisting of the first seed layer and the first plating layer; a step 2a-5 of removing the first photosensitive material layer remaining in the area where the first plating layer is not formed; a step 2a-6 of removing the first seed layer remaining in the portion where the first plating layer is not formed by etching; A method for manufacturing an electrical connector, comprising:

11. The method further includes a step 2b of forming a second layer on the other surface of the connector body; The step 2b Step 2b-1: forming a second seed layer on the other surface of the connector body by sputtering; Step 2b-2: forming a second photosensitive material layer on the second seed layer formed on the other surface; Step 2b-3: exposing the second photosensitive material layer to transfer a photomask pattern onto the second photosensitive material layer, and then developing the exposed photosensitive material layer; Step 2b-4: forming a second plating layer in the area where the second photosensitive material layer has been removed, thereby forming a second layer consisting of a second seed layer and the second plating layer; Step 2b-5: removing the second photosensitive material layer remaining in the area where the second plating layer is not formed; Step 2b-6: removing the second seed layer remaining in the portion where the second plating layer is not formed by etching; The method of manufacturing an electrical connector according to claim 10, comprising:

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