Display device manufacturing apparatus, bending apparatus, and display device manufacturing method

Abstract

To provide an apparatus for manufacturing a display device, a bending apparatus, and a method for manufacturing a display device, which are capable of freely bending a flexible printed circuit board regardless of the size and shape of a display panel and the position where the flexible printed circuit board is bonded to the display panel.SOLUTION: An apparatus for manufacturing a display device according to an exemplary embodiment includes a bending device 100 including a multi-axis robot, a connector 101 detachably mounted on the multi-axis robot, and a body 102 suspended from and supported by the connector and configured to bend a target substrate. The body part includes a center frame 1100 extending in a first direction, an extension frame 1200 integrally coupled to the center frame and extending from the center frame in a second direction crossing the first direction, a suction part 1300 located on the extension frame, and a rotation member 1400 coupled to one end of the center frame and configured to rotate the suction part about a first rotation axis parallel to the first direction.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a display device manufacturing apparatus, a bending apparatus, and a display device manufacturing method. [Background technology]

[0002] The display device may include a display panel that displays an image and a flexible printed circuit board (FPCB) that is connected to the display panel and transmits signals to the display panel.

[0003] The manufacturing method of the display device includes a step of folding a flexible printed circuit board using a display device manufacturing device or a bending device. Summary of the Invention [Problem to be solved by the invention]

[0004] The embodiments are intended to provide a display device manufacturing apparatus, a bending apparatus, and a display device manufacturing method that can freely bend a flexible printed circuit board without restrictions on the size or shape of the display panel or the position where the flexible printed circuit board is connected to the display panel. [Means for solving the problem]

[0005] According to one embodiment of the present disclosure, a display device manufacturing apparatus includes a bending device including a multi-axis robot, a connector detachably attached to the multi-axis robot, and a main body configured to be suspended and supported by the connector and to bend a target substrate, wherein the main body includes a central frame extending in a first direction, an extension frame integrally connected to the central frame and extending from the central frame in a second direction intersecting the first direction, an adsorption portion located on the extension frame, and a rotating member connected to one end of the central frame and configured to rotate the adsorption portion around a first rotation axis parallel to the first direction.

[0006] The extension frame may include a first extension frame and a second extension frame extending from the central frame toward opposite sides along the second direction, and the suction portion may include a first suction portion located on the first extension frame and a second suction portion located on the second extension frame.

[0007] The suction unit may include a suction surface configured to place the target substrate thereon, and a pressure unit positioned between the suction surface and the extension frame and configured to move the suction surface.

[0008] The rotation member may include a rotation coupling part connected to one end of the central frame and configured to rotate around the first rotation axis, a rotation reducer connected to the rotation coupling part in the first direction, and a rotation driving part connected to the rotation reducer to provide a driving force for rotating the rotation coupling part.

[0009] The rotation member may include a sensor unit located between the rotation coupling unit and the rotation reducer and configured to sense a rotation angle of the central frame.

[0010] The central frame may include a first end to which the rotating member is coupled and a second end opposite the first end in the first direction, and the main body may include a main body frame positioned between the connector and the rotating member, a first reinforcing frame extending from the second end along a third direction intersecting the first direction and the second direction, and a second reinforcing frame spaced apart from the central frame and connecting the first reinforcing frame to the main body frame.

[0011] A minimum distance between the central frame and the second reinforcing frame may be longer than a length of the extension frame in the second direction.

[0012] The main body portion may include a main body frame positioned between the connector and the rotating member, and a grip portion extending from the main body frame along a second direction and having an openable and closable clamp shape at an end in the second direction.

[0013] The main body may include a pressure frame extending from the central frame along a third direction intersecting the first direction and the second direction, and configured to rotate about a second rotation axis parallel to the first direction, and may further include a protrusion protruding in the second direction from one surface of the pressure frame extending along the first direction.

[0014] A bending device according to one embodiment of the present disclosure includes a connector configured to be attachable to and detachable from a multi-axis robot, and a main body configured to be suspended and supported by the connector to bend a target substrate, the main body including a central frame extending in a first direction, an extension frame integrally connected to the central frame and extending from the central frame in a second direction intersecting the first direction, an adsorption portion located on the extension frame, and a rotating member connected to one end of the central frame and configured to rotate the adsorption portion around a first rotation axis parallel to the first direction.

[0015] The extension frame may include a first extension frame and a second extension frame extending from the central frame toward opposite sides along the second direction, and the suction portion may include a first suction portion located on the first extension frame and a second suction portion located on the second extension frame.

[0016] The suction unit may include a suction surface configured to place the target substrate thereon, and a pressure unit positioned between the suction surface and the extension frame and configured to move the suction surface.

[0017] The rotation member may include a rotation coupling part connected to one end of the central frame and configured to rotate around the first rotation axis, a rotation reducer connected to the rotation coupling part in the first direction, and a rotation driving part connected to the rotation reducer to provide a driving force for rotating the rotation coupling part.

[0018] The central frame may include a first end to which the rotating member is coupled and a second end opposite the first end in the first direction, and the main body portion may include a main body frame positioned between the connector and the rotating member, a first reinforcing frame extending from the second end along a third direction intersecting the first direction and the second direction, and a second reinforcing frame spaced apart from the central frame and connecting the first reinforcing frame to the main body frame.

[0019] The main body portion may include a main body frame positioned between the connector and the rotating member, and a grip portion extending from the main body frame along a second direction and having an openable and closable clamp shape at an end in the second direction.

[0020] The main body may include a pressure frame extending from the central frame along a third direction intersecting the first direction and the second direction, and configured to rotate about a second rotation axis parallel to the first direction, and may further include a protrusion protruding in the second direction from one surface of the pressure frame extending along the first direction.

[0021] A method for manufacturing a display device according to one embodiment of the present disclosure includes the steps of preparing a bending device including a connector configured to be detachable from a multi-axis robot and a main body including an adsorption portion and suspended and supported by the connector; moving the multi-axis robot to position the adsorption portion under a target substrate; the adsorption portion adsorbing at least a portion of the target substrate; rotating the adsorption portion simultaneously with the movement of the multi-axis robot to bend the target substrate; and moving the multi-axis robot to move the adsorption portion away from the target substrate.

[0022] The adsorption unit may include an adsorption surface and a pressure unit connected to the adsorption surface, and the method may further include pressing the adsorption surface using the pressure unit.

[0023] The body may include a grip part having an openable and closable clamp shape at an end thereof, and the method may further include peeling off the release liner using the grip part.

[0024] The main body may include a central frame extending in a first direction, an extension frame integrally connected to the central frame and extending from the central frame in a second direction intersecting the first direction, a pressure frame extending from the central frame along a third direction intersecting the first and second directions and configured to rotate about a second rotation axis parallel to the first direction, and a protrusion protruding in the second direction from one surface of the pressure frame extending along the first direction, and the method may further include pressing the bent target substrate against the protrusion by rotating the pressure frame. [Effects of the Invention]

[0025] According to the embodiment, the flexible printed circuit board can be freely bent without any restrictions on the size or shape of the display panel or the position where the flexible printed circuit board is bonded to the display panel.

[0026] Furthermore, the embodiments have advantageous effects that can be recognized throughout the specification. [Brief explanation of the drawings]

[0027] [Figure 1] FIG. 1 is a perspective view schematically illustrating a display device. [Figure 2] FIG. 2 is a cross-sectional view schematically illustrating a display panel before a bending process. [Figure 3] 10 is a cross-sectional view schematically illustrating a display panel after a bending process. FIG. [Figure 4]1 is a perspective view showing a manufacturing apparatus for a display device according to an embodiment; [Figure 5] FIG. 10 is a perspective view showing a display device manufacturing apparatus according to another embodiment. [Figure 6] 1 is a perspective view showing a bending device according to an embodiment; [Figure 7] FIG. 7 is a perspective view showing the bending device shown in FIG. 6 in an inverted state. [Figure 8] 1 is a diagram showing a connector included in a bending device according to an embodiment. [Figure 9] 1 is a diagram illustrating a pressure unit included in a bending device according to an embodiment. [Figure 10] FIG. 2 is a diagram illustrating a sensor unit included in the bending device according to an embodiment. [Figure 11] 1A to 1C are diagrams illustrating a method for manufacturing a display device according to an embodiment. [Figure 12] 1A to 1C are diagrams illustrating a method for manufacturing a display device according to an embodiment. [Figure 13] 1A to 1C are diagrams illustrating a method for manufacturing a display device according to an embodiment. [Figure 14] 1A to 1C are diagrams illustrating a method for manufacturing a display device according to an embodiment. [Figure 15] 10A to 10C are diagrams illustrating a pressurizing process of the bending device according to the embodiment. [Figure 16] 10A to 10C are diagrams illustrating a pressurizing process of the bending device according to the embodiment. [Figure 17] 10A to 10C are diagrams illustrating a pressurizing process of the bending device according to the embodiment. [Figure 18] 1 is a diagram illustrating a bending apparatus for sequentially bending different flexible printed circuit boards according to an embodiment; [Figure 19] 1 is a flowchart illustrating a method for manufacturing a display device according to an embodiment. [Figure 20] 1 is a flowchart illustrating a method for manufacturing a display device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0028] The present disclosure may be embodied in various different forms and is not limited to the embodiments set forth herein, but may be practiced in various other forms, such as a computer program, a mobile phone, a tablet PC ...

[0029] For clarity of explanation of the present disclosure, parts unnecessary for explanation will be omitted, and the same reference numerals will be used throughout the specification to refer to the same or similar components.

[0030] Furthermore, the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation, and the present disclosure is not necessarily limited to those shown in the drawings. In the drawings, thicknesses are exaggerated to clearly show various layers and regions. In the drawings, thicknesses of some layers and regions are exaggerated for the convenience of explanation.

[0031] Furthermore, when a layer, film, region, plate, or other part is said to be "on" or "above" another part, this includes not only the case where it is "directly on" another part, but also the case where there is another part in between. Conversely, when a part is said to be "directly on" another part, it means that there is no other part in between. Furthermore, being "on" or "above" a reference part means being located above or below the reference part, and does not necessarily mean being located "on" or "above" in the direction opposite to gravity.

[0032] Also, throughout the specification, when a part is said to "comprise" a certain element, this means that it may further include other elements, not excluding other elements, unless otherwise specified.

[0033] Also, throughout the specification, "on a plane" means when the subject part is viewed from above, and "on a cross section" means when the subject part is cut vertically and viewed from the side.

[0034] A display device is an electronic device that visually presents various types of information. Display devices can be used to display text, images, videos, etc. Display devices include liquid crystal displays (LCDs), light emitting diode displays (LEDs), organic light emitting diode displays (OLEDs), quantum dot displays, etc.

[0035] FIG. 1 is a perspective view that schematically illustrates a display device.

[0036] The display device DD will be described with reference to Fig. 1. The display device DD may include a display panel DP, a flexible printed circuit board CB bonded to the display panel DP, and a driving device including an integrated circuit chip ICC and the like.

[0037] The display panel DP may include a display area DA and a non-display area NA. The display area DA may correspond to a screen on which an image is displayed. The non-display area NA may be an area where circuits and signal lines for generating or transmitting various signals applied to the display area DA are arranged. The non-display area NA may surround the display area DA.

[0038] Pixels PX are arranged in a matrix in the display area DA of the display panel DP. Signal lines such as gate lines (also called scan lines), data lines, and driving voltage lines are also arranged in the display area DA. Each pixel PX is connected to the gate line, data line, driving voltage line, etc., and receives a gate signal (also called a scan signal), a data voltage, a driving voltage (also called a first power supply voltage or a high-potential power supply voltage), etc., from these signal lines. A pixel PX is the smallest unit capable of displaying light or dark. One pixel PX corresponds to one light-emitting area, and the planar shape of the pixel PX is defined by the corresponding light-emitting area. Each pixel PX can display one of the basic colors, such as red, green, or blue. The pixel PX can be realized by a light-emitting element, such as an organic or inorganic light-emitting diode, and a pixel circuit connected to the light-emitting element.

[0039] A touch sensor for detecting a user's touch or non-touch touch is disposed in the display area DA. Although the display area DA shown in FIG. 1 is rectangular, the display area DA may have various shapes other than a rectangle, such as a polygon, a circle, or an ellipse.

[0040] A pad portion PP having an array of pads for receiving signals from outside the display panel DP may be disposed in the non-display area NA of the display panel DP. The pad portion PP may be disposed along one edge of the display panel DP. A flexible printed circuit board CB may be bonded to the pad portion PP, and the pads of the flexible printed circuit board CB may be electrically connected to the pads of the pad portion PP.

[0041] A driving unit that generates or processes various signals for driving the display panel DP may be disposed in the non-display area NA of the display panel DP. The driving unit may include a data driver that applies data voltages to data lines, a gate driver that applies gate signals to gate lines, and a signal controller that controls the data driver and gate driver. The pixels PX may receive data voltages at predetermined timings in response to gate signals generated by the gate driver. The gate driver may be integrated into the display panel DP and disposed on at least one side of the display area DA. The data driver and signal controller may be provided as an integrated circuit chip (also referred to as a driving IC chip) ICC, which may be mounted in the non-display area NA of the display panel DP. The integrated circuit chip ICC may be mounted on a flexible printed circuit board CB or the like and electrically connected to the display panel DP.

[0042] The display panel DP may include at least one bending region BR. The bending region BR may be disposed in the non-display region NA between the display region DA and the pad region PP. The display panel DP is bent with a predetermined radius of curvature based on a bending axis parallel to the direction in which the bending region BR extends. The display panel DP is bent so that the pad region PP and the flexible printed circuit board CB, which are farther from the display region DA than the bending region BR, are positioned behind the display panel DP. In a completed display device DD, the display panel DP may be in this bent state. The bending region BR may span the display region DA and the non-display region NA or may be disposed in the display region DA.

[0043] Alternatively, the display panel DP may not include the bending region BR, but the flexible printed circuit board CB may include the bending region BR. In this case, the flexible printed circuit board CB may be bent to wrap around the periphery of the display panel DP where the pad portion PP is located, so that most of the flexible printed circuit board CB is disposed behind the display panel DP.

[0044] FIG. 2 is a cross-sectional view schematically showing a display panel before the bending process.

[0045] 2 shows the display panel DP, the flexible printed circuit board CB, and the adhesive member AM before being bent. The adhesive member AM may include an adhesive agent AD and a release liner RL.

[0046] The flexible printed circuit board CB can be bonded to one end of the display panel DP. The adhesive member AM can be disposed on a portion of the rear surface of the display panel DP. The release paper RL can protect the adhesive AD. The release paper RL can also be easily peeled off. The release paper RL can be peeled off before bending the display panel DP or the flexible printed circuit board CB. For example, the release paper RL can be peeled off by a release paper peeling device having a clamp shape. The adhesive AD can fix the bent display panel DP or the flexible printed circuit board CB. The position of the adhesive member AM can vary depending on the position of the bending region BR.

[0047] FIG. 3 is a cross-sectional view schematically showing the display panel after the bending process.

[0048] 3 shows a bent display panel DP, a flexible printed circuit board CB, and an adhesive AD. A bending region BR may be included in the display panel DP.

[0049] The display panel DP can be bent to bond the flexible printed circuit board CB to the rear surface of the display panel DP. The display panel DP is bent at the bending region BR. An adhesive AD is positioned on the rear surface of the display panel DP, and the display panel DP and the flexible printed circuit board CB are bonded by the adhesive. The flexible printed circuit board CB can be flexibly bent. The rear surface of the display panel DP may be one side of the display panel DP that does not display an image. By performing the bending process, the area of ​​the non-display region DA of the display panel DP can be reduced. In addition, by performing the bending process, the display device DD can be made smaller while maintaining the size of the display region DA.

[0050] 3 shows a display panel DP after the bending process, with the release paper in FIG. 2 being peeled off before the bending process. The release paper RL is peeled off, allowing the adhesive AD to bond the entire display panel DP and the flexible printed circuit board CB. After the bending process, a predetermined process is performed to firmly bond the flexible printed circuit board CB and the display panel DP. For example, a process may be performed in which physical pressure is applied to a portion of the flexible printed circuit board CB that overlaps with the adhesive AD.

[0051] While Fig. 3 shows an example in which the bending region BR of the display panel DP is bent, alternatively, the bending region of the flexible printed circuit board CB bonded to the pad portion PP of the display panel DP may be bent. The bending region of the display panel DP or the flexible printed circuit board CB is bent by a bending device or a display device manufacturing apparatus including a bending device. Figs. 4 and 5 will be used to explain a display device manufacturing apparatus including a bending device and a multi-axis robot.

[0052] FIG. 4 is a perspective view showing a manufacturing apparatus for a display device according to an embodiment.

[0053] The display device manufacturing apparatus 10 in Fig. 4 may include a multi-axis robot and a bending apparatus 100. Specifically, the multi-axis robot in Fig. 4 may be a multi-joint robot 201. The multi-joint robot 201 is a robot with multiple rotary joints and can move like a human arm.

[0054] The bending apparatus 100 includes a connector 101, and can be connected to an articulated robot 201 through the connector 101. The bending apparatus 100 is suspended from the articulated robot 201 through the connector 101. Therefore, the bending apparatus 100 can move while suspended from the articulated robot 201. The bending apparatus 100 can move freely in a first direction D1, a second direction D2, or a third direction D3 in space. The bending apparatus 100 can approach a target substrate through the movement of the articulated robot 201. The bending apparatus 100 can bend the target substrate through the movement of the articulated robot 201. The position of the bending apparatus 100 does not need to be fixed during the bending process. The bending apparatus 100 can bend the target substrate regardless of the position of the flexible printed circuit board CB on the display panel DP.

[0055] FIG. 5 is a perspective view showing a manufacturing apparatus for a display device according to another embodiment.

[0056] The display device manufacturing apparatus 10 of Fig. 5 may include a multi-axis robot and a bending apparatus 100. Specifically, the multi-axis robot of Fig. 5 may be a multi-axis Cartesian robot 202. The multi-axis Cartesian robot 202 may be configured with three or more linear axes. The multi-axis Cartesian robot 202 has a structure in which each axis is perpendicular to each other, thereby providing high precision and stability.

[0057] The display device manufacturing apparatus 10 according to one embodiment of FIG. 4 shows an articulated robot 201 as a multi-axis robot, and the display device manufacturing apparatus 10 according to another embodiment of FIG. 5 shows a multi-axis Cartesian robot 202 as a multi-axis robot. In other embodiments, the multi-axis robot may be a cylindrical robot, a polar robot, a SCARA robot, or a humanoid robot. In other words, the type of multi-axis robot is not limited.

[0058] The bending device attached to the multi-axis robot shown in FIGS. 4 and 5 will be described in more detail with reference to FIGS. 6 and 7. FIG.

[0059] Fig. 6 is a perspective view showing a bending device according to an embodiment, and Fig. 7 is a perspective view showing the bending device shown in Fig. 6 in an inverted state.

[0060] The bending apparatus 100 of Fig. 6 can bend a display panel DP or a flexible printed circuit board CB. The bending apparatus 100 of Fig. 7 is a perspective view of the bending apparatus of Fig. 6 rotated 180 degrees around a rotation axis extending in the first direction D1. That is, Fig. 6 is a perspective view of the bending apparatus 100 seen from above, and Fig. 7 is a perspective view of the bending apparatus 100 seen from below.

[0061] Hereinafter, a bending device 100 according to an embodiment will be described with reference to FIGS.

[0062] The bending apparatus 100 may include a connector 101 and a main body 102. The connector 101 may be configured to be attachable to and detachable from a multi-axis robot. The main body 102 is connected to the connector 101. The main body 102 may be configured to be suspended and supported by the connector 101 and to bend a target substrate. The target substrate is a substrate to be bent, and may be a display panel DP or a flexible printed circuit board CB to be bent by the bending apparatus 100.

[0063] The main body 102 may include a central frame 1100, an extension frame 1200 integrally connected thereto, a suction portion 1300 for suctioning a target substrate, and a rotation member 1400 for rotating the suction portion 1300. The main body 102 may also include a main body frame 1500 for connecting the rotation member 1400 to the connector 101, a grip portion 1600 extending from the main body frame 1500, a reinforcing frame 1700 for reinforcing the rigidity of the central frame 1100 and the extension frame 1200, a pressure frame 1800 for applying pressure to the bent target substrate, and a protrusion 1810 protruding for this purpose. Each component of the main body 102 will be described below.

[0064] The central frame 1100 can extend along a first direction D1. The central frame 1100 can rotate about a first rotation axis 1103 parallel to the first direction D1. The central frame 1100 is preferably not flexible and does not change shape.

[0065] The length of the central frame 1100 in the first direction D1 may vary depending on the width of the target substrate. Bending devices 100 having different lengths of the central frame 1100 in the first direction D1 are prepared. The size of the bending device 100 is determined by the length of the central frame 1100 in the first direction D1.

[0066] The extension frame 1200 may be integrally connected to the central frame 1100. The extension frame 1200 may extend from the central frame 1100 in a second direction D2 intersecting the first direction D1. The second direction D2 may be perpendicular to the first direction D1. There may be at least one extension frame 1200. The extension frame 1200 may include a first extension frame 1201 and a second extension frame 1202 extending in opposite directions from the central frame 1100 along the second direction D2. The extension frame 1200 may extend from an end of the central frame 1100 along the second direction D2. Alternatively, the extension frame 1200 may extend from the center of the central frame 1100 along the second direction D2. Preferably, the extension frame 1200 is inflexible and does not change shape.

[0067] The suction unit 1300 may suction the target substrate. The suction unit 1300 may be disposed on the extension frame 1200. For example, the suction unit 1300 may be disposed at an end of the extension frame 1200 in the second direction D2. The suction unit 1300 may extend along the first direction D1. The suction unit 1300 may be disposed across the plurality of extension frames 1200. There may be at least one suction unit 1300. The plurality of suction units 1300 may be disposed facing each other with respect to the central frame 1100. The suction units 1300 may all rotate clockwise and counterclockwise around the first rotation axis 1103. When the main body 102 includes a plurality of suction units 1300 facing each other with respect to the central frame 1100, the suction unit 1300 that is easiest to bend may be selected depending on the position of the target substrate to bend the target substrate. For example, the suction unit 1300 to be placed under the target substrate is selected depending on the direction of rotation of the suction unit 1300. The suction unit 1300 may include a first suction unit 1301 located on the first extension frame 1201 and a second suction unit 1302 located on the second extension frame 1202. There may be at least one first suction unit 1301. There may also be at least one second suction unit 1302.

[0068] The target substrate held by the suction unit 1300 is bent by the movement of the bending device 100 and the rotation of the suction unit 1300. The suction unit 1300 may rotate around a first rotation axis 1103 parallel to the first direction D1. The suction unit 1300 may move according to the movement of the multi-axis robot.

[0069] There is no limitation on the method by which the suction unit 1300 suctions the target substrate, for example, vacuum suction, electrostatic chuck, mechanical clamping, adhesive bonding, etc.

[0070] The suction unit 1300 includes a pressure unit 1320, which can apply pressure to the target substrate, as will be described later.

[0071] The rotating member 1400 may include a rotation coupling unit 1410, a rotation driving unit 1420, a rotation reducer 1430, and a sensor unit 1440. The rotating member 1400 may be coupled to one end of the central frame 1100. The rotating member 1400 may be configured to rotate the suction unit 1300 about a first rotation axis 1103 parallel to the first direction D1. The rotating member 1400 may be disposed at a first end 1101 of the central frame 1100. The central frame 1100 may include a second end 1102 opposite to the first end 1101 in the first direction.

[0072] The rotational coupling 1410 may be disposed at the first end 1101 of the central frame 1100. The rotational coupling 1410 may be connected to the central frame 1100. For example, the rotational coupling 1410 may abut the central frame 1100. The rotational coupling 1410 may be disposed between the rotational reducer 1430 and the central frame 1100. The rotating member 1400 may rotate in both clockwise and counterclockwise directions around a first rotational axis 1103. The first rotational axis 1103 may be the center of the rotating member 1400. The first rotational axis 1103 may be the center of the rotational movement of the rotational coupling 1410. The central frame 1100 may rotate together with the rotational movement of the rotational coupling 1410.

[0073] The rotary reducer 1430 may be disposed spaced apart from the rotary coupler 1410 in the first direction D1. The rotary reducer 1430 may be connected to the rotary coupler 1410 along the first direction D1. The rotary reducer 1430 may transmit rotational kinetic energy to the rotary coupler 1410. The rotary reducer 1430 may receive rotational kinetic energy from the rotary driver 1420. For example, the rotary reducer 1430 may receive rotational kinetic energy from the rotary driver 1420 through gears. The rotary reducer 1430 may reduce the speed of the rotational motion. The rotary reducer 1430 may also increase the torque of the rotational motion. When the rotary driver 1420 rotates at a high speed, the rotary reducer 1430 may convert the rotational motion to an appropriate speed. For example, the rotary reducer 1430 may convert the speed and torque through a gear ratio.

[0074] The rotation drive unit 1420 may be connected to the rotation reducer 1430. The rotation drive unit 1420 may provide a driving force for rotating the rotation coupling unit 1410. The rotation drive unit 1420 may convert electrical energy into rotational kinetic energy. For example, the rotation drive unit 1420 may be a motor. Electrical energy for the rotation drive unit 1420 may be applied from the multi-axis robot through the connector 101. Alternatively, electrical energy for the rotation drive unit 1420 may be applied from a battery of the bending apparatus 100. The rotation drive unit 1420 may include a gear.

[0075] The rotation coupling unit 1410 can transmit the rotational kinetic energy of the rotation reducer 1430 to the central frame 1100. The central frame 1100 is integrally formed with the extension frame 1200, and the suction unit 1300 can be disposed on the extension frame 1200. Therefore, when the central frame 1100 rotates, the suction unit 1300 can also rotate. The suction unit 1300 can rotate clockwise or counterclockwise around the first rotation axis 1103. The target substrate can be bent by rotating the suction unit 1300. The rotation reducer 1430 can control the rotation speed and torque of the suction unit 1300 to allow the suction unit 1300 to move precisely.

[0076] The body frame 1500 can be disposed between the connector 101 and the rotating member 1400. The body frame 1500 can be a support for the body portion 102. For example, the body frame 1500 can support the connector 101, the rotating member 1400, and the central frame 1100. The size and shape of the body frame 1500 are not limited. It is preferable that the body frame 1500 is not flexible and does not change shape.

[0077] The main body frame 1500 may include a power line or a signal line connected through the connector 101 and applied from the multi-axis robot. The power line may be connected to the rotation driver 1420 and may supply electrical energy to the rotation driver 1420. The power line may also supply electrical energy to the rotation reducer 1430 and the sensor unit 1440. The signal line may transmit a control signal of the multi-axis robot to each component of the bending apparatus 100. For example, the rotation driver 1420 may receive a drive signal from the multi-axis robot through the signal line. The sensor unit 1440 may receive a sensing command signal from the multi-axis robot through the signal line.

[0078] The grip portion 1600 may perform a peeling process of peeling off the release liner RL of the adhesive member AM before performing the bending process. The grip portion 1600 may be formed by extending from the main body frame 1500 along the second direction D2. The grip portion 1600 may have an openable and closable clamp shape at its end. The clamp shape of the grip portion 1600 is a shape that can grip the release liner RL and is not limited to a specific shape. The grip portion 1600 may extend in the second direction D2 sufficiently to peel off the release liner RL.

[0079] The bending apparatus 100 can be moved by the movement of the multi-axis robot. The bending apparatus 100 can move so that the release liner RL and the gripping unit 1600 are close to each other. In addition, the bending apparatus 100 can move in a direction in which the gripping unit 1600 grips the release liner RL and then peels the release liner RL. By including the gripping unit 1600 in the bending apparatus 100, the peeling process and bending process can be performed quickly and simply. Although a separate peeling device is required for the peeling process, including the gripping unit 1600 in the bending apparatus can eliminate the need for a separate peeling device.

[0080] The reinforcing frame 1700 can support the bending apparatus 100 to ensure stability. More specifically, the reinforcing frame 1700 can support the central frame 1100, the extension frame 1200, and the suction unit 1300 to ensure stability. The reinforcing frame 1700 can include a first reinforcing frame 1701 and a second reinforcing frame 1702. The first reinforcing frame 1701 can extend from a second end 1102 of the central frame 1100 along a third direction D3 intersecting the first direction D1 and the second direction D2, respectively. The second end 1102 of the central frame 1100 can be an end of the central frame 1100 to which the rotating member 1400 is not coupled. Alternatively, the second end 1102 of the central frame 1100 can be an end of the central frame 1100 farther from the rotating member 1400. The second reinforcing frame 1702 can be disposed spaced apart from the central frame 1100. The second reinforcing frame 1702 can connect the first reinforcing frame 1701 and the main body frame 1500. The second reinforcing frame 1702 may have a shape that extends in the first direction D1. It is preferable that the reinforcing frame 1700 is not flexible and does not change shape.

[0081] The main body 102 of the bending device 100 is suspended in the air, supported only by the connector 101. In one embodiment of the bending device 100, the connector 101 may be disposed on the first end 1101 side of the central frame 1100. As a result, the central frame 1100, the extension frame 1200, and the suction unit 1300, which extend in the first direction D1, may sag in the direction of gravity due to their own weight. In other words, the second end 1102 side of the central frame 1100 is far from the connector 101 and may sag in the direction of gravity. Therefore, the main body 102 can be stabilized by connecting the reinforcing frame 1700 extending from the second end 1102 of the central frame 1100 to the main frame 1500. Since both the first end 1101 and the second end 1102 of the central frame 1100 are directly supported by the main frame 1500, the bending device 100 is stably supported.

[0082] The suction unit 1300 of the bending apparatus 100 can bend a target substrate by rotating about a first rotation axis 1103 while suctioning at least a portion of the target substrate. The suction unit 1300 can be disposed on an extension frame 1200 that extends from the central frame 1100 along the second direction D2. For example, the suction unit 1300 can be disposed at the end of the extension frame 1200 in the second direction D2. As a result, the radius of the rotation of the suction unit 1300 about the first rotation axis 1103 can be the same as the length of the extension frame 1200 in the second direction D2. The central frame 1100 and the second reinforcement frame 1702 are spaced apart from each other. However, if the distance between the central frame 1100 and the second reinforcement frame 1702 is not sufficient, the second reinforcement frame 1702 may interfere with the rotation of the suction unit 1300. The separation distance between the central frame 1100 and the second reinforcement frame 1702 may be the distance between the central frame 1100 and the second extension frame 1202. The minimum separation distance between the central frame 1100 and the second reinforcement frame 1702 may be the distance between the closest portions of the central frame 1100 and the second extension frame 1202. Considering the rotational movement of the suction part 1300, it is preferable that the minimum separation distance between the central frame 1100 and the second reinforcement frame 1702 be longer than the length of the extension frame 1200 in the second direction D2.

[0083] The pressure frame 1800 may be disposed extending from the central frame 1100 along a third direction D3 intersecting the first direction D1 and the second direction D2. The pressure frame 1800 may be configured to rotate about a second rotation axis 1801 parallel to the first direction D1. The second rotation axis 1801 may be a central axis about which the pressure frame 1800 rotates. The second rotation axis 1801 may be disposed spaced apart from the first rotation axis 1103 in the third direction D3. The second rotation axis 1801 may be disposed between the protrusion 1810 and the central frame 1100. The second rotation axis 1801 may be disposed spaced apart from the central frame 1100 in the third direction D3. The pressure frame 1800 may extend along the first direction D1. A protrusion 1810 protruding in the second direction D2 may be included on one side of the pressure frame 1800 extending in the first direction D1. The protrusions 1810 may be spaced apart from the central frame 1100 in the third direction D3. The protrusions 1810 may be spaced apart from the second rotation shaft 1801 in the third direction D3. The protrusions 1810 may be integrally connected to the pressure frame 1800. After the bending process, the pressure frame 1800 rotates around the second rotation shaft 1801, and the target substrate, which is sucked by the suction unit 1300, may be pressed by the protrusions 1810. This allows the target substrate to be firmly attached to the display panel DP.

[0084] The length of the pressure frame 1800 in the first direction D1 may be approximately the same as the length of the suction unit 1300 in the first direction D1. Also, the length of the pressure frame 1800 in the first direction D1 may be the same as the length of the center frame 1100 in the first direction D1. The multiple protrusions 1810 can thereby sufficiently pressurize the suction area of ​​the target substrate suctioned by the suction unit 1300 along the first direction D1.

[0085] There may be at least one protrusion 1810. Some of the protrusions 1810 may be arranged at predetermined intervals along the first direction D1. Some of the protrusions 1810 may extend in opposite directions from the pressure frame 1800 along the second direction D2. By including the protrusions 1810 extending in opposite directions from the pressure frame 1800 along the second direction D2, the target substrate can be pressed using the protrusions 1810 regardless of the rotation direction (clockwise or counterclockwise) of the bending apparatus 100.

[0086] FIG. 8 is a diagram showing a connector included in a bending device according to an embodiment.

[0087] The multi-axis robot 200 in FIG. 8 may be the articulated robot 201 shown in FIG. 4 or the multi-axis Cartesian robot 202 shown in FIG.

[0088] The connector 101 can connect the multi-axis robot 200 and the bending apparatus 100. The connector 101 can connect the power lines and signal lines of the multi-axis robot 200 and the bending apparatus 100. The multi-axis robot 200 and the bending apparatus 100 can be connected through a predetermined interface and can exchange signals with each other.

[0089] The size of the bending apparatus 100 may vary as needed. For example, a bending apparatus 100 for bending a small-sized target substrate and a bending apparatus 100 for bending a large-sized target substrate may differ in size. Furthermore, the main body 102 may include suction units 1300 of different shapes as needed. While the suction units 1300 shown in FIGS. 6 and 7 have a linear shape extending in the first direction D1, other examples of the suction units 1300 may have a curved shape. Alternatively, the length of the suction units 1300 in the first direction D1 or the length of the suction units 1300 in the second direction D2 may vary as needed. That is, bending apparatuses 100 of various sizes and shapes are required for an appropriate bending process. Although the shapes and sizes of bending apparatuses 100 vary as mentioned above, by using the same connector 101, the bending apparatus 100 can be easily replaced as needed. Replacing the multi-axis robot 200 to accommodate different display panels DP can be cumbersome. For example, the same connector 101 may refer to connectors 101 having the same shape and function. Also, the same connector 101 may refer to connectors 101 that can transmit the same signal from the multi-axis robot 200 to different bending devices 100. It is preferable that the connector 101 has sufficient support force so that the bending device 100 can be suspended from the multi-axis robot 200.

[0090] The connector 101 in FIG. 8 can be separated into upper and lower parts. The upper part of the connector 101 can be connected to the multi-axis robot 200, and the lower part of the connector 101 can be included in the bending apparatus 100. The upper and lower parts can be connected to each other. This allows for easy replacement of the bending apparatus 100 during successive bending processes. The shape and size of the connector 101 are not limited. In another example, the connector 101 can be an integral shape that is not separated into upper and lower parts. The integral connector 101 can be included in the bending apparatus 100 and connected to the multi-axis robot 200.

[0091] The connector 101 in FIG. 8 is located on the top of the main body 102. However, in another example, the connector 101 may be located on the side of the main body 102. For example, the connector 101 and the main body 102 may be arranged along the first direction D1. In another example, the connector 101 may be located on the bottom of the main body 102. For example, in the display device manufacturing apparatus 10, the connector 101 may be located on the multi-axis robot 200, and the main body 102 may be located on top of the connector 101.

[0092] The connector 101, which is formed by coupling the multi-axis robot 200 and the main body 102 in FIG. 8, can rotate in situ around a rotation axis parallel to the third direction D3. The rotation of the connector 101 in situ can also rotate the bending device 100 in situ. For example, the bending device 100 can rotate 180 degrees based on the third direction D3, so that the suction unit 1300 that approaches the flexible printed circuit board CB can be freely selected. Therefore, the bending device 100 of the present disclosure can not only move freely in space, but also freely change its posture in space.

[0093] FIG. 9 is a diagram showing a pressure unit included in a bending device according to an embodiment.

[0094] FIG. 9 is a cross-sectional perspective view of the suction part 1300 taken along the line IX-IX′ in FIG. 6, showing the shape of the suction part 1300 in which the suction surface 1310 is pushed up by the pressure part 1320. As shown in FIG.

[0095] The suction portion 1300 may include an suction surface 1310, a support portion 1311, and a pressure portion 1320. The pressure portion 1320 may include an elastic member 1321, a pressure member 1322, and a bearing 1323.

[0096] An adsorption surface 1310 is exposed along a third direction D3 intersecting the first direction D1 and the second direction D2. A target substrate may be placed on the adsorption surface 1310. The target substrate is attached to or detached from the adsorption surface 1310. A pressure unit 1320 configured to move the adsorption surface 1310 may be disposed between the adsorption surface 1310 and the extension frame 1200. The pressure unit 1320 presses the adsorption surface 1310 along the third direction D3, thereby firmly adhering the target substrate to the display panel DP.

[0097] The elastic member 1321 may have the property of being temporarily deformed in response to an external load or deforming force, but returning to its original shape when the force is removed. For example, the elastic member 1321 may be a spring.

[0098] The pressure member 1322 may receive power to press up the suction surface 1310. The pressure member 1322 may be disposed along a third direction D3 from the suction surface 1310. The pressure member 1322 may press up the suction surface 1310 along the third direction D3. The pressure member 1322 may receive power from the multi-axis robot via a power line. Alternatively, the pressure member 1322 may receive power from a battery included in the bending apparatus 100.

[0099] The bearing 1323 can serve to reduce friction between shafts during rotational or linear movement, and may be, for example, a ball bush.

[0100] The elastic member 1321 may be disposed between the suction surface 1310 and the pressure member 1322. The elastic member 1321 can absorb the impact when the pressure member 1322 lifts the suction surface 1310. This is because if an excessively strong force is transmitted from the pressure member 1322 to the target substrate through the suction surface 1310 in a short period of time, the target substrate may be damaged.

[0101] The bearing 1323 may be disposed inside the pressure member 1322. When the pressure member 1322 moves in the third direction D3, friction may occur between the pressure member 1322 and the support part 1311 that supports the adsorption surface 1310. The bearing 1323 may be disposed between the pressure member 1322 and the support part 1311 to reduce friction.

[0102] FIG. 10 is a diagram showing a sensor unit included in a bending device according to an embodiment.

[0103] The sensor unit 1440 may be disposed between the rotary coupler 1410 and the rotary reducer 1430. The sensor unit 1440 may measure the rotation speed and rotation angle of the rotary coupler 1410. The sensor unit 1440 may measure the rotation speed and rotation angle of the central frame 1100 or the suction unit 1300 by sensing the rotation speed and rotation angle of the rotary coupler 1410. The sensor unit 1440 may also measure the rotation speed and rotation angle of the pressure frame 1800. The pressure frame 1800 may include a position-checking sensor test piece 1802 at one of its two ends in the first direction D1 that is closest to the rotating member 1400. The sensor unit 1440 may measure the rotation speed by measuring the change in the rotation angle of the rotary coupler 1410 or the pressure frame 1800 over time. The method by which the sensor unit 1440 measures the rotation speed and rotation angle of the rotary coupler 1410 or the pressure frame 1800 is not limited. For example, the sensor unit 1440 may be an optical rotary encoder, which can measure the angle of rotation using a disk equipped with an optical sensor and a light source.

[0104] 10 shows sensor unit 1440, which is located between rotational coupling unit 1410 and rotational reducer 1430 and contacts main body frame 1500. The rotational shaft that transmits rotational kinetic energy from rotational reducer 1430 to rotational coupling unit 1410 is shown cut away.

[0105] 11 to 14 are diagrams shown for explaining a method for manufacturing a display device according to one embodiment.

[0106] 11 to 14 sequentially illustrate a process of bending and then pressurizing a flexible printed circuit board CB bonded to a display panel DP using a bending apparatus 100 according to an embodiment. The display panel DP shown in FIGS. 11 to 14 has a polygonal shape, and a first flexible printed circuit board CB1, a second flexible printed circuit board CB2, and a third flexible printed circuit board CB3 are attached to different positions on the display panel DP. To perform the bending process on the display panel DP and the flexible printed circuit boards CB shown in FIGS. 11 to 14 using a fixed bending apparatus according to a comparative example, multiple bending apparatuses of different sizes and positions may be required. This may reduce work efficiency and waste space. The bending apparatus 100 according to an embodiment can perform the bending process by fixing the display panel DP and freely moving the bending apparatus 100. Because the bending apparatus 100 can move to the location of the flexible printed circuit board CB, the bending process is not limited by the size and shape of the display panel DP. Furthermore, after bending one of the plurality of flexible printed circuit boards CB, the preparation process for bending another flexible printed circuit board CB can be simplified.

[0107] 11 shows the bending apparatus 100 connected to the articulated robot 201. The display device manufacturing apparatus 10 according to one embodiment, which includes the articulated robot 201 and the bending apparatus 100, can grasp the position of the flexible printed circuit board CB to be bent. If necessary, before the bending process, a peeling process can be performed in which the release paper RL of the adhesive member AM is peeled off using the gripping unit 1600 (see FIG. 6) of the bending apparatus 100.

[0108] 12 shows the bending device 100 moved close to the first flexible printed circuit board CB1 to be bent. The bending device 100 can be moved by the movement of the articulated robot 201. The first flexible printed circuit board CB1 may be placed on the suction unit 1300 (see FIG. 6) of the bending device 100. The suction unit 1300 of the bending device 100 can suction the first flexible printed circuit board CB1. The first flexible printed circuit board CB1 suctioned by the suction unit 1300 is bent as the bending device 100 moves.

[0109] FIG. 13 illustrates the first flexible printed circuit board CB1 after bending. The articulated robot 201 may move according to the bending trajectory of the first flexible printed circuit board CB1 (see FIG. 12). The suction unit 1300 (see FIG. 6) may rotate 180 degrees around the first rotation axis 1103 (see FIG. 6) according to the bending trajectory of the first flexible printed circuit board CB1. The bending apparatus 100 may apply pressure to the first flexible printed circuit board CB1 to firmly attach the bent first flexible printed circuit board CB1 to the display panel DP. For example, the bending apparatus 100 may apply pressure to the first flexible printed circuit board CB1 using the movement of the articulated robot 201. Alternatively, the bending apparatus 100 may apply pressure to the first flexible printed circuit board CB1 using the pressure unit 1320.

[0110] 14 shows a pressurizing step in which the first flexible printed circuit board CB1 is pressed by the protrusion 1810 (see FIG. 13) by rotating the pressurizing frame 1800. The pressurizing frame 1800 and the protrusion 1810 can rotate around a second rotation axis 1801 (see FIG. 7). The pressurizing step in which the first flexible printed circuit board CB1 is pressed using the pressurizing frame 1800 and the protrusion 1810 will be described with reference to FIGS. 15 to 17.

[0111] 15 to 17 are diagrams showing a pressurizing process of the bending device according to one embodiment.

[0112] 15 to 17 show the bending apparatus 100 performing the pressure step after performing the bending step on the target substrate. During the pressure step, the suction unit 1300 may be rotated 180 degrees compared to its position before the bending step. Also, during the pressure step, the suction unit 1300 may be in a state of suctioning the target substrate. During the pressure step, the pressure frame 1800 of the bending apparatus 100 may rotate around the second rotation axis 1801. As the pressure frame 1800 rotates, the protrusion 1810 extending from the pressure frame 1800 in the second direction D2 may also rotate.

[0113] The protrusion 1810 can apply pressure to a portion of the target substrate that is being adsorbed by the adsorption unit 1300 and other portions of the target substrate. For example, the protrusion 1810 can apply pressure to the end side of the target substrate. When applying pressure to the target substrate using the movement of a multi-axis robot or the pressure unit 1320, only the portion of the target substrate that overlaps the adsorption surface 1310 can be applied pressure. However, when applying pressure to the target substrate using the rotational movement of the protrusion 1810, the portion of the target substrate that does not overlap the adsorption surface 1310 can also be applied pressure.

[0114] 15 shows the bending device 100 immediately after the bending process is completed. The pressure frame 1800 and the protrusion 1810 can maintain a neutral state without rotation.

[0115] 16 shows the bending apparatus 100 after the pressure step has started but before the protrusions 1810 come into contact with the target substrate. The pressure frame 1800 and the protrusions 1810 may be tilted at an angle of about 45 degrees compared to their neutral state.

[0116] 17 shows the bending device 100 with the protrusions 1810 in contact with the target substrate during the pressure application process. The target substrate is pressed by the protrusions 1810. The protrusions 1810 can pressurize portions of the target substrate that do not overlap with the suction surface 1310. After the pressure application by the protrusions 1810 is completed, the pressure frame 1800 and the protrusions 1810 can rotate in opposite directions to reach a neutral state.

[0117] FIG. 18 is a diagram illustrating a bending apparatus according to an embodiment for sequentially bending different flexible printed circuit boards.

[0118] FIG. 18 shows a bending device 100 that bends a third flexible printed circuit board CB3 after bending a first flexible printed circuit board CB1 and a second flexible printed circuit board CB2. The suction portion 1300 (see FIG. 6) that bends the first flexible printed circuit board CB1 and the third flexible printed circuit board CB3 may be a first suction portion 1301 (see FIG. 6). The suction portion 1300 that bends the second flexible printed circuit board CB2 may be a second suction portion 1302 (see FIG. 6) located on the opposite side of the first suction portion 1301. A protrusion 1810 that applies pressure to the first flexible printed circuit board CB1 and the third flexible printed circuit board CB3 during the pressure application process may be disposed on the first suction portion 1301 side. A protrusion 1810 that applies pressure to the second flexible printed circuit board CB2 during the pressure application process may be disposed on the second suction portion 1302 side. This is because the second flexible printed circuit board CB2 is bonded to the side of the display panel DP opposite to the side to which the first flexible printed circuit board CB1 and the third flexible printed circuit board CB2 are bonded. To perform the bending and pressing processes on the second flexible printed circuit board CB2, it may be easier to use the suction parts 1300 and protrusions 1810 on the opposite side to those used on the first flexible printed circuit board CB1 and the third flexible printed circuit board CB3. To use the suction parts 1300 used on the first flexible printed circuit board CB1 on the second flexible printed circuit board CB2, the bending apparatus 100 must be rotated 180 degrees, which can be cumbersome. A process in which the display device manufacturing apparatus 10 bends multiple flexible printed circuit boards CB attached to one display panel DP will be described in detail with reference to the flowchart of FIG. 19 .

[0119] FIG. 19 is a flowchart showing a method for manufacturing a display device according to an embodiment.

[0120] First, step S1901 is performed to position the suction unit 1300 of the bending device 100 under the first flexible printed circuit board CB1. The bending device 100 can be moved by the movement of the articulated robot 201. Then, step S1902 is performed to suction the first flexible printed circuit board CB1 to the suction unit 1300 of the bending device 100. The suction unit 1300 suctions the first flexible printed circuit board CB1, thereby fixing the first flexible printed circuit board CB1 to the bending device 100. Then, step S1903 is performed to bend the first flexible printed circuit board CB1 by rotating the suction unit 1300 of the bending device 100 simultaneously with the movement of the articulated robot 201. The first flexible printed circuit board CB1 is bent along a predetermined bending trajectory. Then, step S1904 is performed to detach the first flexible printed circuit board CB1 from the bending device 100. Since the bending process for the first flexible printed circuit board CB1 has been completed, this may be a preparation process for separating the bending apparatus 100 from the first flexible printed circuit board CB1. Then, step S1905 is performed in which the articulated robot 201 is moved away from the first flexible printed circuit board CB1. Simultaneously with or after step S1905, step S1906 is performed in which it is determined whether there are any other flexible printed circuit boards that need to be bent.

[0121] 18 includes a second flexible printed circuit board CB2, a step of positioning the suction unit 1300 of the bending device 100 under the second flexible printed circuit board CB2 (S1907) is performed. Then, a step of suctioning the second flexible printed circuit board CB2 with the suction unit 1300 of the bending device 100 (S1908) is performed. Then, a step of bending the second flexible printed circuit board CB2 by rotating the suction unit 1300 of the bending device 100 simultaneously with the movement of the articulated robot 201 (S1909) is performed. The second flexible printed circuit board CB2 is bent along a predetermined bending trajectory. Then, a step of detaching the second flexible printed circuit board CB2 from the bending device 100 (S1910) is performed. Now that the bending process for the second flexible printed circuit board CB2 is complete, this may be a preparation process for separating the bending device 100 from the second flexible printed circuit board CB2. Thereafter, step S1911 is performed in which the articulated robot 201 is moved to move the bending apparatus 100 away from the second flexible printed circuit board CB2. Simultaneously with or after step S1911, step S1912 is performed in which it is determined whether there are other flexible printed circuit boards that need to be bent.

[0122] 18 includes a third flexible printed circuit board CB3, a step of positioning the suction unit 1300 of the bending device 100 under the third flexible printed circuit board CB3 is performed (S1913). Then, a step of suctioning the third flexible printed circuit board CB3 with the suction unit 1300 of the bending device 100 is performed (S1914). Then, a step of bending the third flexible printed circuit board CB3 by rotating the suction unit 1300 of the bending device 100 simultaneously with the movement of the articulated robot 201 is performed (S1915). The third flexible printed circuit board CB3 is bent along a predetermined bending trajectory. Then, a step of detaching the third flexible printed circuit board CB3 from the bending device 100 is performed (S1916). Now that the bending process for the third flexible printed circuit board CB3 is complete, this may be a preparation process for separating the bending device 100 from the third flexible printed circuit board CB3. Thereafter, step S1917 is performed in which the articulated robot 201 is moved to move the bending apparatus 100 away from the third flexible printed circuit board CB3. Simultaneously with or after step S1917, step S1918 is performed in which it is determined whether there are any other flexible printed circuit boards that need to be bent. Since all of the flexible printed circuit boards CB bonded to the display panel DP have been bent, the bending apparatus 100 can complete the bending process.

[0123] FIG. 20 is a flowchart showing a method for manufacturing a display device according to an embodiment.

[0124] FIG. 20 is a flowchart including a peeling step and a pressure applying step that are performed before and after the bending step using the bending device 100 according to one embodiment.

[0125] First, step S2001 is performed in which the release liner RL of the adhesive material AM is peeled off using the gripper 1600 of the bending apparatus 100. Step S2001 may be a peeling process. The peeling process may involve moving the gripper 1600 of the bending apparatus 100 close to the release liner RL using the movement of the articulated robot 201. Next, the gripper 1600 may peel off the release liner RL. Next, step S2002 is performed in which the suction unit 1300 of the bending apparatus 100 is positioned under the flexible printed circuit board CB. Next, step S2003 is performed in which the flexible printed circuit board CB is suctioned to the suction unit 1300 of the bending apparatus 100. Next, step S2004 is performed in which the suction unit 1300 of the bending apparatus 100 is rotated simultaneously with the movement of the articulated robot 201 to bend the flexible printed circuit board CB. Next, step S2005 is performed in which the flexible printed circuit board CB is pressed using the display device manufacturing apparatus 10.

[0126] A method for pressing a flexible printed circuit board CB, which may be included in step S2005, will now be described. First, step S2005 may include a step S2005A of pressing the suction surface 1310 using the pressure unit 1320 of the suction unit 1300. Second, step S2005 may include a step S2005B of pressing the flexible printed circuit board CB using the movement of the articulated robot 201. Third, step S2005 may include a step S2005C of pressing the flexible printed circuit board CB using a protrusion 1810 protruding from one surface of the pressure frame 1800 of the bending apparatus 100. Step S2005 may include at least one of steps S2005A, S2005B, and S2005C. Steps S2005A, S2005B, and S2005C may be performed simultaneously or sequentially. After step S2005, step S2006 is performed to detach the flexible printed circuit board CB from the suction unit 1300 of the bending device 100. Then, step S2007 is performed to move the articulated robot 201 away from the flexible printed circuit board CB.

[0127] The size and shape of the display panel DP may vary depending on various applications and user requirements. For example, the display panel DP may be rectangular. Alternatively, the display panel DP may have a free-form curve on one side. As the shape and size of the display panel DP vary, the position at which the flexible printed circuit board CB is bonded to the display panel DP may also vary. In addition, multiple flexible printed circuit boards CB may be bonded to one display panel DP. Although there is one display panel DP, the bonding environment at which the flexible printed circuit board CB is bonded may vary depending on the position on the display panel DP. For example, the bonding environment may be the shape of the display panel DP to which the flexible printed circuit board CB is bonded. Alternatively, the bonding environment may be the size of the display panel DP to which the flexible printed circuit board CB is bonded. Alternatively, the bonding environment may be the width or length of the flexible printed circuit board CB.

[0128] The present disclosure may provide a display device manufacturing apparatus 10, a bending apparatus 100, and a display device manufacturing method that are capable of bending a target substrate regardless of the shape and size of a display panel DP. The present disclosure may also provide a display device manufacturing apparatus 10, a bending apparatus 100, and a display device manufacturing method that are capable of bending a target substrate regardless of the position of a display panel DP to which a flexible printed circuit board CB is attached. The present disclosure may also provide a display device manufacturing apparatus 10, a bending apparatus 100, and a display device manufacturing method that are capable of bending a target substrate without the need for additional equipment, even when multiple flexible printed circuit boards CB are attached to a single display panel DP.

[0129] Although the embodiments of the present disclosure have been described in detail above, the scope of the present disclosure is not limited thereto, and various modifications and improvements made by those skilled in the art using the basic concepts of the present disclosure as defined in the following claims also fall within the scope of the present disclosure. [Explanation of symbols]

[0130] AM: Adhesive material AD: Adhesive RL: Release paper DP: Display panel CB: Flexible printed circuit board BR: Bending area 10: Display device manufacturing equipment 100: Bending device 101: Connector 102: Main body 200: Multi-axis robot 201: Articulated robot 202: Multi-axis Cartesian robot 1100: Center frame 1103: First rotation axis 1200: Extension frame 1300: Adsorption part 1310: Adsorption surface 1320: Pressure unit 1400: Rotating member 1410: Rotating joint 1420: Rotation drive unit 1430: Rotary reducer 1440: Sensor unit 1500: Main frame 1600: Grip 1700: Reinforcement frame 1701: First reinforcement frame 1702: Second reinforcement frame 1800: Pressure frame 1801: Second rotation axis 1810:Protrusion

Claims

1. Multi-axis robots, and a bending device including a connector detachably mounted on the multi-axis robot, and a main body configured to be suspended and supported by the connector and to bend a target substrate; The main body portion is a central frame extending in a first direction; an extension frame integrally connected to the central frame and extending from the central frame in a second direction intersecting the first direction; a suction portion located on the extension frame; and An apparatus for manufacturing a display device, comprising: a rotating member coupled to one end of the central frame and configured to rotate the suction portion about a first rotation axis parallel to the first direction.

2. The extension frame includes a first extension frame and a second extension frame extending in opposite directions from the central frame along the second direction, The display device manufacturing apparatus of claim 1 , wherein the suction portion includes a first suction portion located on the first extension frame and a second suction portion located on the second extension frame.

3. The adsorption unit is an adsorption surface configured to receive the target substrate; and The display device manufacturing apparatus according to claim 1 , further comprising a pressure unit positioned between the suction surface and the extension frame and configured to move the suction surface.

4. The rotating member is a rotational coupling coupled to one end of the central frame and configured for rotational movement about the first rotational axis; a rotary reducer coupled to the rotary coupling portion in the first direction; and The display device manufacturing apparatus of claim 1 , further comprising a rotation driver connected to the rotation reducer to provide a driving force for rotating the rotation coupling part.

5. The rotating member is The display device manufacturing apparatus of claim 4 , further comprising a sensor unit located between the rotation coupling unit and the rotation reducer, the sensor unit being capable of detecting a rotation angle of the central frame.

6. the central frame includes a first end to which the rotating member is coupled and a second end opposite to the first end in the first direction, The main body portion is a main body frame positioned between the connector and the rotary member; a first reinforcing frame extending from the second end along a third direction intersecting the first direction and the second direction, respectively; and The display device manufacturing apparatus of claim 1 , further comprising a second reinforcement frame spaced apart from the central frame and connecting the first reinforcement frame and the main frame.

7. The display device manufacturing apparatus of claim 6 , wherein a minimum distance between the center frame and the second reinforcement frame is longer than a length of the extension frame in the second direction.

8. The main body portion is a main body frame positioned between the connector and the rotary member; and The display device manufacturing apparatus according to claim 1 , further comprising a grip portion extending from the main frame along the second direction and having an openable and closable clamp shape at an end in the second direction.

9. The main body portion is a pressurizing frame extending from the central frame along a third direction intersecting the first direction and the second direction, and configured to rotate about a second rotation axis parallel to the first direction; The display device manufacturing apparatus of claim 1 , further comprising a protrusion protruding in the second direction from one surface of the pressure frame extending along the first direction.

10. A connector configured to be detachable from a multi-axis robot; and a main body portion suspended and supported by the connector and configured to bend a target substrate; The main body portion is a central frame extending in a first direction; an extension frame integrally connected to the central frame and extending from the central frame in a second direction intersecting the first direction; a suction portion located on the extension frame; and a rotating member coupled to one end of the central frame and configured to rotate the suction portion about a first rotation axis parallel to the first direction;

11. The extension frame includes a first extension frame and a second extension frame extending in opposite directions from the central frame along the second direction, The bending device according to claim 10 , wherein the suction portion includes a first suction portion located on the first extension frame and a second suction portion located on the second extension frame.

12. The adsorption unit is an adsorption surface configured to receive the target substrate; and The bending device according to claim 10 , further comprising a pressure unit positioned between the suction surface and the extension frame and configured to move the suction surface.

13. The rotating member is a rotational coupling coupled to one end of the central frame and configured for rotational movement about the first rotational axis; a rotary reducer coupled to the rotary coupling portion in the first direction; and The bending apparatus according to claim 10, further comprising a rotation drive unit connected to the rotation reducer and providing a driving force for rotating the rotation coupling unit.

14. the central frame includes a first end to which the rotating member is coupled and a second end opposite to the first end in the first direction, The main body portion is a main body frame positioned between the connector and the rotary member; a first reinforcing frame extending from the second end along a third direction intersecting the first direction and the second direction, respectively; and The bending device according to claim 10 , further comprising a second reinforcing frame spaced apart from the central frame and connecting the first reinforcing frame and the main frame.

15. The main body portion is a main body frame positioned between the connector and the rotary member; and The bending device according to claim 10, further comprising a grip portion extending from the main body frame in the second direction and having an openable and closable clamp shape at an end in the second direction.

16. The main body portion is a pressurizing frame extending from the central frame along a third direction intersecting the first direction and the second direction, and configured to rotate about a second rotation axis parallel to the first direction; The bending apparatus according to claim 10 , further comprising a protrusion protruding in the second direction from one surface of the pressure frame extending along the first direction.

17. preparing a bending device including a connector configured to be detachably attached to a multi-axis robot, and a main body including a suction portion and suspended and supported by the connector; moving the multi-axis robot to position the suction unit under the target substrate; the suction portion suctioning at least a portion of the target substrate; bending the target substrate by rotating the suction unit simultaneously with the movement of the multi-axis robot; A method for manufacturing a display device, comprising: moving the multi-axis robot to move the suction part away from the target substrate.

18. the adsorption unit includes an adsorption surface and a pressure member connected to the adsorption surface; The method of claim 17 , further comprising: pressing the adsorption surface using the pressing unit.

19. The main body includes a grip portion having an openable and closable clamp shape at an end thereof, The method of claim 17, further comprising peeling off the release tape using the gripping portion.

20. The main body portion is a central frame extending in a first direction; an extension frame integrally connected to the central frame and extending from the central frame in a second direction intersecting the first direction; a pressurizing frame configured to extend from the central frame along a third direction intersecting the first direction and the second direction, and to rotate about a second rotation axis parallel to the first direction; and a protrusion protruding in the second direction from one surface of the pressure frame extending along the first direction, The method of claim 17 , further comprising pressing the bent target substrate against the protrusion by rotating the pressure frame.

Images