Working machine

Abstract

To properly place or grip a component by a gripping tool for gripping the component by a pair of claws.SOLUTION: The work machine includes a gripping tool for gripping a component by a pair of claws, and the gripping tool grips a gripping position of the component set on the basis of a placement position and a placement order of each of a plurality of components and places the plurality of components one by one. The working machine includes a gripping tool for gripping a component by a pair of claws, and the gripping tool grips the plurality of components one by one by gripping a gripping position of the component set on the basis of each placement position and gripping order of the plurality of placed components.SELECTED DRAWING: Figure 13

Description

[Technical Field]

[0001] The present invention relates to a work machine equipped with a gripping tool that grips a part with a pair of claws. [Background technology]

[0002] The following Patent Document describes a work machine equipped with a gripping tool that grips a part with a pair of claws. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2016 / 017029 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to appropriately place or grip a component using a gripping tool that grips a component with a pair of claws. [Means for solving the problem]

[0005] In order to solve the above problems, this specification discloses a work machine that includes a gripping tool that grips a part with a pair of claws, and that grips a part at a gripping position that is set based on the placement position and placement order of each of a plurality of parts, and places the plurality of parts one by one.

[0006] Furthermore, in order to solve the above-mentioned problems, this specification discloses a work machine that includes a gripping tool that grips parts with a pair of claws, and that grips a plurality of parts one by one by gripping the parts at a gripping position that is set based on the placement position and gripping order of each of the plurality of parts placed on the gripping tool. [Effects of the Invention]

[0007] In the present disclosure, a part gripping position is set based on the placement position and placement order of each of the multiple parts, and a gripping tool grips the multiple parts at the set gripping position to place the multiple parts one by one. Also, a part gripping position is set based on the placement position and gripping order of each of the multiple placed parts, and the gripping tool grips each of the placed multiple parts at the set gripping position to grip the multiple parts one by one. This allows the gripping tool to appropriately place or grip the parts. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. [Figure 2] FIG. 2 is a perspective view of a component mounting device of the component mounter. [Figure 3] FIG. 2 is a schematic view of the inside of the gripping tool. [Figure 4] FIG. 2 is a block diagram of a control device. [Figure 5] 1A and 1B are a side view and a top view of a gripping tool for gripping a pair of side surfaces of an electronic component. [Figure 6] 1A and 1B are a side view and a top view of a gripping tool for gripping a pair of side surfaces of an electronic component. [Figure 7] FIG. 2 is a diagram of a circuit board showing intended mounting positions of electronic components. [Figure 8] FIG. 1 is a diagram of a circuit board on which an electronic component is mounted and held by a holding tool. [Figure 9] FIG. 1 is a diagram of a circuit board on which an electronic component is mounted and held by a holding tool. [Figure 10] FIG. 1 is a diagram of a circuit board on which an electronic component is mounted and held by a holding tool. [Figure 11] FIG. 1 is a diagram of a circuit board on which an electronic component is mounted and held by a holding tool. [Figure 12] FIG. 1 is a diagram of a circuit board on which an electronic component is mounted and held by a holding tool. [Figure 13] FIG. 1 is a diagram of a circuit board on which an electronic component is mounted and held by a holding tool. [Figure 14] FIG. 1 is a diagram of a circuit board on which an electronic component is mounted and held by a holding tool. [Figure 15] FIG. 1 is a diagram of a circuit board on which an electronic component is mounted and held by a holding tool. [Figure 16] FIG. 1 is a diagram of a circuit board on which an electronic component is mounted and held by a holding tool. DETAILED DESCRIPTION OF THE INVENTION

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings as modes for carrying out the present invention.

[0010] 1 shows a component mounter 10. The component mounter 10 is a device for performing the operation of mounting components on a circuit substrate 12. The component mounter 10 is equipped with a device main body 20, a substrate transport and holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a component supply device 30, a bulk component supply device 32, and a control device (see FIG. 4) 34. Examples of the circuit substrate 12 include a circuit board or a substrate with a three-dimensional structure, and examples of the circuit substrate include a printed wiring board or a printed circuit board.

[0011] The device main body 20 is composed of a frame 40 and a beam 42 suspended from the frame 40. The substrate transport and holding device 22 is disposed in the center of the frame 40 in the front-to-rear direction and includes a transport device 50 and a clamping device 52. The transport device 50 transports the circuit substrate 12, and the clamping device 52 holds the circuit substrate 12. As a result, the substrate transport and holding device 22 transports the circuit substrate 12 and securely holds the circuit substrate 12 at a predetermined position. In the following description, the transport direction of the circuit substrate 12 is referred to as the X direction, the horizontal direction perpendicular to that direction is referred to as the Y direction, and the vertical direction is referred to as the Z direction. In other words, the width direction of the component mounter 10 is the X direction, and the front-to-rear direction is the Y direction.

[0012] The component mounting device 24 is disposed on the beam 42 and has two work heads 60, 62 and a work head moving device 64. The work head moving device 64 has an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. The two work heads 60, 62 are moved together to any position on the frame 40 by the X-direction moving device 68 and the Y-direction moving device 70. As shown in FIG. 2, each work head 60, 62 is attached to a slider 74, 76 so that it can be removably positioned with a single touch by the operator without using any tools, and the Z-direction moving device 72 moves the slider 74, 76 individually in the vertical direction. In other words, the work heads 60, 62 are moved individually in the vertical direction by the Z-direction moving device 72.

[0013] The work heads 60, 62 are equipped with a gripping tool 78 that holds a component. As shown in Figure 3, the gripping tool 78 has a pair of gripping claws 80, 82 and a claw operating mechanism 84. Note that Figure 3 is a diagram showing the internal structure of the gripping tool 78, with the housing of the gripping tool 78 omitted. The gripping claws 80, 82 are disposed so as to extend in the vertical direction, and a through-hole (not shown) that penetrates in the left-right direction is formed at the upper end of the gripping claws 80, 82.

[0014] The claw operating mechanism 84 has a guide rail 100, a ball screw mechanism 102, a transmission mechanism 104, and an electromagnetic motor 106. The guide rail 100 is disposed so as to extend in the left-right direction, and is fixed inside a housing (not shown) of the gripping tool 78. The guide rail 100 holds the pair of gripping claws 80, 82, which are oriented so as to extend in the up-down direction, so that they can slide in the left-right direction.

[0015] The ball screw mechanism 102 is composed of a screw rod 110 and a pair of nuts 112, 114. The screw rod 110 is disposed above the guide rail 100, extending in the left-right direction and parallel to the guide rail 100. The screw rod 110 has both ends inserted into through holes in the pair of gripping jaws 80, 82. A screw groove 116 is formed on the outer circumferential surface of the screw rod 110, extending from the center to the left end, and a screw groove 118 is formed on the outer circumferential surface of the screw rod 110, extending from the center to the right end. The screw groove 116 is formed on the outer circumferential surface of the screw rod 110 so as to rotate in a predetermined direction, and the screw groove 118 is formed on the outer circumferential surface of the screw rod 110 so as to rotate in a direction different from that of the screw groove 116. Nuts 112 and 114 also hold a plurality of bearing balls (not shown), with nut 112 threadedly engaging with thread groove 116 and nut 114 threadedly engaging with thread groove 118 via the plurality of bearing balls. Nut 112 is fixed inside the through-hole of gripping jaw 80, and nut 114 is fixed inside the through-hole of gripping jaw 82.

[0016] The transmission mechanism 104 has two gears 120, 122 and a belt 124. The gear 120 is fixed to the end of the threaded rod 110 and coaxially with the threaded rod 110. The gear 122 is fixed to a motor shaft 126 of the electromagnetic motor 106 and coaxially with the motor shaft 126. The electromagnetic motor 106 is disposed so that the motor shaft 126 is parallel to the threaded rod 110. The belt 124 is wound around the two gears 120, 122.

[0017] With this structure, the jaw actuation mechanism 84 moves the pair of gripping jaws 80, 82 closer to or farther from each other, gripping a component with the tips of the gripping jaws 80, 82. Specifically, the electromagnetic motor 106 rotates the gear 122, causing the belt 124 to rotate, which in turn rotates the gear 120. The threaded rod 110 then rotates along with the gear 120, causing the pair of nuts 114 to move closer to or farther from each other in a linear fashion, which in turn causes the pair of gripping jaws 80, 82 to move closer to or farther from each other in a linear fashion. This allows the pair of gripping jaws 80, 82 to grip an electronic component 130 located between the pair of gripping jaws 80. In other words, the electromagnetic motor 106 moves the pair of gripping jaws 80, 82 closer to or farther from each other, thereby gripping the electronic component 130. The electromagnetic motor 106 is a servo motor, which allows the distance between the pair of gripping jaws 80, 82 to be adjusted to any desired distance.

[0018] Furthermore, the work heads 60, 62 are equipped with a rotation device (see FIG. 4) 132 that rotates the gripper 78 about an axis extending in the vertical direction. This allows the work heads 60, 62 to change the position of the electronic component 130 held by the gripper 78 by operating the rotation device 132.

[0019] 2, mark camera 26 is attached to slider 74 facing downward, and moves in the X, Y, and Z directions together with work head 60. This allows mark camera 26 to capture an image of any position on frame 40. As shown in FIG. 1, part camera 28 is disposed on frame 40 between substrate material conveying and holding device 22 and part supply device 30 facing upward. This allows part camera 28 to capture an image of a part held by gripper 78 of work heads 60, 62.

[0020] The component supply device 30 is disposed at one end of the frame 40 in the front-to-rear direction. The component supply device 30 has a tray-type component supply device 140 and a feeder-type component supply device 142. The tray-type component supply device 140 is a device that supplies components placed on a tray. The feeder-type component supply device 142 is a device that supplies components using a tape feeder (not shown) or a stick feeder (not shown).

[0021] The bulk component supply device 32 is disposed at the other end of the frame 40 in the front-to-rear direction. The bulk component supply device 32 is a device that aligns multiple components that are scattered randomly and supplies the aligned components. In other words, the bulk component supply device 32 is a device that aligns multiple components in any orientation into a predetermined orientation and supplies the components in the predetermined orientation. Components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, solar cell components, and power module components. Electronic circuit components include components with leads and components without leads.

[0022] As shown in FIG. 4, the control device 34 includes a controller 150, multiple drive circuits 152, and an image processing device 154. The multiple drive circuits 152 are connected to the conveying device 50, the clamping device 52, the work heads 60 and 62, the work head moving device 64, the tray-type component supply device 140, the feeder-type component supply device 142, and the bulk component supply device 32. The controller 150 is primarily a computer, including a CPU, ROM, RAM, etc., and is connected to the multiple drive circuits 152. This allows the controller 150 to control the operation of the substrate conveying and holding device 22, the component mounting device 24, etc. The controller 150 is also connected to the image processing device 154. The image processing device 154 processes image data obtained by the mark camera 26 and the part camera 28, and the controller 150 acquires various information from the image data. The controller 150 stores a production program 160, and the controller 150 controls the operation of the substrate conveying and holding device 22, the component mounting device 24, etc. in accordance with the production program 160, thereby performing the work of mounting components on the circuit substrate 12.

[0023] Specifically, in response to a command from controller 150 in accordance with production program 160, substrate conveying and holding device 22 conveys circuit substrate 12 to the work position, where clamping device 52 securely holds circuit substrate 12. Next, in response to a command from controller 150 in accordance with production program 160, mark camera 26 moves above circuit substrate 12 and captures an image of circuit substrate 12. As a result, controller 150 obtains information regarding errors in the holding position of circuit substrate 12, etc.

[0024] Furthermore, in response to a command from the controller 150 in accordance with the production program 160, the component supply device 30 or the bulk component supply device 32 supplies an electronic component 130 at a predetermined supply position. Then, in response to a command from the controller 150 in accordance with the production program 160, either the work heads 60, 62 moves to above the component supply position, and the gripper 78 grips the electronic component 130 with the pair of gripping jaws 80, 82.

[0025] Next, in response to a command from controller 150 in accordance with production program 160, working heads 60, 62 move above part camera 28, and part camera 28 captures an image of electronic component 130 held by gripper 78. As a result, controller 150 acquires information, etc., relating to errors in the holding position of electronic component 130. Then, in response to a command from controller 150 in accordance with production program 160, working heads 60, 62 move above circuit board 12, correct errors in the holding position of circuit board 12, errors in the holding position of the component, etc., and mount the held electronic component 130 onto circuit board 12.

[0026] In this way, the gripping tool 78 provided on the work heads 60, 62 grips the electronic component 130 with the pair of gripping claws 80, 82 and mounts the gripped electronic component 130 on the circuit board 12. Multiple components are mounted on the circuit board 12, and when the work heads 60, 62 mount the component to be mounted, there is a possibility that the gripping claws 80, 82 gripping the component to be mounted may interfere with a component that has been mounted on the circuit board 12 before the component to be mounted, i.e., a so-called pre-mounted component.

[0027] More specifically, the gripping tool 78 grips a pair of opposing side surfaces of the electronic component 130 with a pair of gripping claws 80, 82, and the four side surfaces of the electronic component 130 include a pair of side surfaces 170, 172 and a pair of side surfaces 176, 178, as shown in Figures 5 and 6. Therefore, the gripping tool 78 can grip the pair of side surfaces 170, 172 of the electronic component 130 with a pair of gripping claws 80, 82 as shown in Figure 5, and can also grip the pair of side surfaces 176, 178 of the electronic component 130 with a pair of gripping claws 80, 82 as shown in Figure 6. Before the gripping tool 78 grips the pair of side surfaces 170, 172 of the electronic component 130 with the pair of gripping claws 80, 82, the electromagnetic motor 106 of the gripping tool 78 is operated to make the distance between the pair of gripping claws 80, 82 slightly larger than the width dimension L1 (see FIG. 5 ) of the side surfaces 176, 178 of the electronic component 130, i.e., the left-right dimension of the side surfaces 176, 178 of the electronic component 130. Then, when the gripping tool 78 grips the pair of side surfaces 170, 172 of the electronic component 130 with the pair of gripping claws 80, 82, i.e., after the gripping tool 78 has gripped the pair of side surfaces 170, 172 of the electronic component 130, the electromagnetic motor 106 of the gripping tool 78 is operated to make the distance between the pair of gripping claws 80, 82 slightly smaller than the width dimension L1 of the side surfaces 176, 178 of the electronic component 130. Furthermore, before the gripping tool 78 grips the pair of side surfaces 176, 178 of the electronic component 130 with the pair of gripping claws 80, 82, the electromagnetic motor 106 of the gripping tool 78 is operated to make the distance between the pair of gripping claws 80, 82 slightly larger than the width dimension L2 (see FIG. 6 ) of the side surfaces 170, 172 of the electronic component 130, i.e., the left-right dimension of the side surfaces 170, 172 of the electronic component 130. Then, when the gripping tool 78 grips the pair of side surfaces 176, 178 of the electronic component 130 with the pair of gripping claws 80, 82, the electromagnetic motor 106 of the gripping tool 78 is operated to make the distance between the pair of gripping claws 80, 82 slightly smaller than the width dimension L2 of the side surfaces 170, 172 of the electronic component 130.

[0028] In this way, by changing the distance between the pair of gripping jaws 80, 82, gripping tool 78 can grip electronic component 130 at two positions: at the pair of side surfaces 170, 172 and at the pair of side surfaces 176, 178. However, conventional production programs only allow gripping tool 78 to set one position for gripping electronic component 130. For this reason, for example, as shown in FIG. 7 , when a work head sequentially places three electronic components 130 at planned positions 180 on circuit board 12, there is a risk that gripping jaws 80, 82 gripping the components to be placed may interfere with a component previously attached to circuit board 12. Note that planned position 180a is the position where the work head plans to place electronic component 130a, planned position 180b is the position where the work head plans to place electronic component 130b, and planned position 180c is the position where the work head plans to place electronic component 130c. Furthermore, electronic components 130a, 130b, and 130c are the same type of components, i.e., they have the same dimensions, the same performance, and the same color.

[0029] The following describes a case where the production program specifies a pair of side surfaces 176, 178 as positions at which gripping tool 78 grips electronic component 130, and the work head mounts electronic components 130a, 130b, and 130c one by one in predetermined positions on circuit board 12. First, as shown in FIG. 8 , gripping tool 78 grips the pair of side surfaces 176, 178 of electronic component 130a with the pair of gripping jaws 80, 82, and the work head mounts electronic component 130a gripped by gripping tool 78 in predetermined position 180a on circuit board 12. Next, as shown in FIG. 9 , gripping tool 78 grips the pair of side surfaces 176, 178 of electronic component 130b with the pair of gripping jaws 80, 82, and the work head mounts electronic component 130b gripped by gripping tool 78 in predetermined position 180b on circuit board 12. When the work head is mounting electronic component 130b, gripping claws 82 holding electronic component 130b interfere with electronic component 130a, which has been mounted on circuit board 12 before electronic component 130b. Therefore, the work head cannot properly mount electronic component 130b at the intended position 180b on circuit board 12.

[0030] Further, for example, a case will be described in which a pair of side surfaces 170, 172 are set in the production program as positions at which gripper 78 grips electronic component 130, and the work head mounts electronic components 130a, 130b, and 130c one by one in the order of electronic components 130a, 130b, and 130c in predetermined positions on circuit board 12. First, as shown in Fig. 10, gripper 78 grips the pair of side surfaces 170, 172 of electronic component 130a with a pair of gripping claws 80, 82, and the work head mounts electronic component 130a gripped by gripper 78 in predetermined position 180a on circuit board 12. Next, as shown in FIG. 11 , the gripping tool 78 grips the pair of side surfaces 170, 172 of the electronic component 130b with the pair of gripping claws 80, 82, and the work head mounts the electronic component 130b gripped by the gripping tool 78 at the predetermined position 180b on the circuit board 12. Next, as shown in FIG. 12 , the gripping tool 78 grips the pair of side surfaces 170, 172 of the electronic component 130c with the pair of gripping claws 80, 82, and the work head mounts the electronic component 130c gripped by the gripping tool 78 at the predetermined position 180c on the circuit board 12. During this process, the gripping claws 80 holding the electronic component 130c interfere with the electronic component 130b, which was mounted on the circuit board 12 before the electronic component 130c. Therefore, the work head is unable to properly mount the electronic component 130c at the predetermined position 180c on the circuit board 12.

[0031] In consideration of this, the production program 160 sets the positions for gripping the electronic component 130 to either the pair of side surfaces 170, 172 or the pair of side surfaces 176, 178 based on the positions at which the electronic component 130 is planned to be mounted on the circuit board 12 and the order in which the electronic component 130 is to be mounted on the circuit board 12. Specifically, the production program 160 sets the pair of side surfaces 176, 178 at position 180a on the circuit board 12 as the positions for gripping the electronic component 130a that is planned to be mounted first. The production program 160 also sets the pair of side surfaces 170, 172 at position 180b on the circuit board 12 as the positions for gripping the electronic component 130b that is planned to be mounted second. The production program 160 also sets the pair of side surfaces 176, 178 at position 180c on the circuit board 12 as the positions for gripping the electronic component 130c that is planned to be mounted third.

[0032] The production program 160 also sets the distance between the pair of gripping jaws 80, 82 when gripping the electronic component 130. The production program 160 sets L2 as the distance between the pair of gripping jaws 80, 82 that grip the electronic component 130a that is scheduled to be mounted first at position 180a on the circuit board 12. The production program 160 also sets L1 as the distance between the pair of gripping jaws 80, 82 that grip the electronic component 130b that is scheduled to be mounted second at position 180b on the circuit board 12. The production program 160 also sets L2 as the distance between the pair of gripping jaws 80, 82 that grip the electronic component 130c that is scheduled to be mounted third at position 180c on the circuit board 12.

[0033] In the production program 160, the gripping positions of the electronic component 130 are set to a pair of side surfaces 176, 178 as default values, and the distance between the pair of gripping jaws 80, 82 is set to L2. If a default value is set for the electronic component to be mounted in the production program 160, the working heads 60, 62 perform the component mounting operation according to the default value in response to a command from the controller 150. If a setting value other than the default value is set for the electronic component to be mounted, the working heads 60, 62 perform the component mounting operation according to the set setting value. Therefore, the default value is set for the electronic component 130a, which is scheduled to be mounted first, at position 180a on the circuit board 12. Furthermore, the pair of side surfaces 170, 172 are set as gripping positions for the electronic component 130b, which is scheduled to be mounted second, at position 180b on the circuit board 12, and L1 is set as the distance between the pair of gripping jaws 80, 82 that grip the electronic component 130b. Additionally, a default value is set for the electronic component 130c that is scheduled to be mounted third at the position 180c on the circuit board 12.

[0034] When work heads 60, 62 perform the mounting operation of electronic component 130 in accordance with production program 160 in which the gripping positions and the distance between the pair of gripping jaws 80, 82 are set as described above, first, as shown in Fig. 8, the pair of gripping jaws 80, 82 of gripping tool 78 grip a pair of side surfaces 176, 178 of electronic component 130a. At this time, before gripping tool 78 grips electronic component 130a, the distance between the pair of gripping jaws 80, 82 is set slightly larger than L2, and when gripping tool 78 grips electronic component 130a, the distance between the pair of gripping jaws 80, 82 is set slightly smaller than L2. Then, gripping tool 78 mounts the gripped electronic component 130a at intended mounting position 180a. Next, as shown in FIG. 11 , gripping tool 78 grips a pair of side surfaces 170, 172 of electronic component 130b with a pair of gripping jaws 80, 82. At this time, before gripping tool 78 grips electronic component 130b, the distance between the pair of gripping jaws 80, 82 is set slightly larger than L1, and when gripping tool 78 grips electronic component 130b, the distance between the pair of gripping jaws 80, 82 is set slightly smaller than L1. Then, gripping tool 78 mounts the gripped electronic component 130b at position 180b on circuit board 12 where it is intended to be mounted. Next, as shown in FIG. 13 , gripping tool 78 grips a pair of side surfaces 176, 178 of electronic component 130c with a pair of gripping jaws 80, 82. At this time, before gripping tool 78 grips electronic component 130c, the distance between the pair of gripping jaws 80, 82 is set slightly larger than L2, and when gripping tool 78 grips electronic component 130c, the distance between the pair of gripping jaws 80, 82 is set slightly smaller than L2. Then, gripping tool 78 mounts the gripped electronic component 130c at position 180c on circuit board 12 where it is scheduled to be mounted.

[0035] In this way, in the production program 160, the position at which the gripping tool 78 grips the electronic component 130 to be mounted on the circuit board 12 and the distance between the pair of gripping claws 80, 82 are set based on the planned positions and mounting order of the electronic components 130 on the circuit board 12, so that the work heads 60, 62 can properly mount multiple electronic components on the circuit board without causing interference between the gripping claws 80, 82 and the previously attached components.

[0036] Therefore, when the order in which work heads 60, 62 place electronic components 130 on the circuit board is changed in production program 160, the position at which gripper 78 grips electronic component 130 and the distance between the pair of gripping claws 80, 82 when gripper 78 grips electronic component 130 are changed. For example, in the above explanation, work heads 60, 62 place electronic components on circuit board 12 in the order of electronic component 130a, electronic component 130b, and electronic component 130c. However, the following explanation will discuss a case in which work heads 60, 62 place electronic components on circuit board 12 in the order of electronic component 130c, electronic component 130b, and electronic component 130a.

[0037] Specifically, in production program 160, a pair of side surfaces 176, 178 are set as positions at which gripping tool 78 grips electronic component 130c, which is scheduled to be mounted first, at position 180c on circuit board 12, and L2 is set as the distance between the pair of gripping jaws 80, 82 that grip electronic component 130c. Also, a pair of side surfaces 176, 178 are set as positions at which gripping tool 78 grips electronic component 130b, which is scheduled to be mounted second, at position 180b on circuit board 12, and L2 is set as the distance between the pair of gripping jaws 80, 82 that grip electronic component 130b. In addition, a pair of side surfaces 170, 172 are set as positions where the gripping tool 78 grips the electronic component 130a, which is scheduled to be mounted third at position 180a on the circuit board 12, and L1 is set as the distance between the pair of gripping claws 80, 82 that grip the electronic component 130a.

[0038] Even when work heads 60, 62 place electronic components 130c, 130b, and 130a on circuit board 12 in this order, production program 160 sets a pair of side surfaces 176, 178 as the positions at which gripper 78 grips electronic component 130, and sets L2 as the distance between the pair of gripping jaws 80, 82. In other words, a default value is set for electronic component 130c, which work heads 60, 62 will place at position 180c on circuit board 12. A default value is also set for electronic component 130b, which work heads 60, 62 will place at position 180b on circuit board 12. The electronic component 130a attached by the work heads 60, 62 at position 180a on the circuit board 12 has a pair of side surfaces 170, 172 set as positions for gripping by the gripping tool 78, and L1 is set as the distance between the pair of gripping claws 80, 82 that grip the electronic component 130a.

[0039] When work heads 60, 62 perform the operation of placing an electronic component on circuit board 12 in accordance with production program 160 in which the positions of the pair of gripping jaws 80, 82 and the distance between the pair of gripping jaws 80, 82 when gripping tool 78 grips an electronic component are set, gripping tool 78 first grips a pair of side surfaces 176, 178 of electronic component 130c with the pair of gripping jaws 80, 82, as shown in FIG. 14 . In this case, before gripping electronic component 130c, gripping tool 78 sets the distance between the pair of gripping jaws 80, 82 to be slightly larger than L2, and when gripping electronic component 130c, gripping tool 78 sets the distance between the pair of gripping jaws 80, 82 to be slightly smaller than L2. Then, gripping tool 78 places the gripped electronic component 130c at position 180c on circuit board 12. Next, as shown in FIG. 15 , gripping tool 78 grips a pair of side surfaces 176, 178 of electronic component 130b with the pair of gripping jaws 80, 82. At this time, before gripping electronic component 130b, gripping tool 78 sets the distance between the pair of gripping jaws 80, 82 to be slightly larger than L2, and when gripping electronic component 130b, gripping tool 78 sets the distance between the pair of gripping jaws 80, 82 to be slightly smaller than L2. Then, gripping tool 78 mounts gripped electronic component 130b at position 180b on circuit board 12. Subsequently, as shown in FIG. 16 , gripping tool 78 grips a pair of side surfaces 170, 172 of electronic component 130a with the pair of gripping jaws 80, 82. At this time, before gripping electronic component 130a, gripping tool 78 sets the distance between the pair of gripping jaws 80, 82 to be slightly larger than L1, and when gripping electronic component 130a, gripping tool 78 sets the distance between the pair of gripping jaws 80, 82 to be slightly smaller than L1. Then, gripping tool 78 mounts gripped electronic component 130a at position 180a on circuit board 12.

[0040] In this way, when the order in which electronic components 130 are placed on circuit board 12 is changed in production program 160, the position at which gripping tool 78 grips electronic component 130 and the distance between the pair of gripping jaws 80, 82 are newly set in accordance with the changed order in which electronic components 130 are placed. Then, gripping tool 78 places electronic component 130 on circuit board 12 in accordance with the newly set gripping position and distance between the pair of gripping jaws 80, 82 in production program 160, and thereby work heads 60, 62 can properly place multiple electronic components on the circuit board without interference between gripping jaws 80, 82 and components previously attached to circuit board 12.

[0041] Incidentally, the component mounter 10 is an example of a work machine. The gripper 78 is an example of a gripper. The gripping claws 80 and 82 are an example of claws. The electromagnetic motor 106 is an example of a motor.

[0042] The present invention is not limited to the above-described embodiment and can be embodied in various modifications or improvements based on the knowledge of those skilled in the art. Specifically, for example, the above-described embodiment employs a gripper 78 that grips a component by actuation of an electromagnetic motor 106. However, a gripper that grips a component by supplying air may also be employed. However, a gripper that grips a component by supplying air cannot adjust the distance between the pair of gripping jaws 80, 82 to an arbitrary distance. Therefore, it is necessary to use different types of gripper depending on whether the pair of side surfaces 170, 172 of the electronic component 130 is to be gripped or the pair of side surfaces 176, 178. For example, when gripping the pair of side surfaces 170, 172 of the electronic component 130, the distance between the pair of gripping jaws 80, 82 must be greater than L1 before gripping the electronic component 130. Therefore, the electronic component 130 is gripped using a gripper that allows the distance between the pair of gripping jaws 80, 82 to be greater than L1. On the other hand, when gripping the pair of side surfaces 176, 178 of the electronic component 130, the distance between the pair of gripping jaws 80, 82 needs to be greater than L2 before gripping the electronic component 130. Therefore, the electronic component 130 is gripped using a gripping tool in which the distance between the pair of gripping jaws 80, 82 is greater than L2. In this way, when gripping a pair of side surfaces of different widths using a gripping tool that cannot arbitrarily change the distance between the pair of gripping jaws 80, 82, the type of gripping tool is changed to grip the component when gripping the pair of side surfaces 170, 172 of the electronic component 130 and when gripping the pair of side surfaces 176, 178. Note that, as an example of changing the type of gripping tool, gripping tools with a different distance between the pair of gripping jaws have been described. However, components may also be gripped by changing to gripping tools with different positions, such as gripping tools with different sizes or gripping jaw widths.

[0043] Furthermore, in the above embodiment, when the order in which the gripping tool 78 places the electronic components 130 on the circuit board 12 is changed in the production program 160, the gripping tool 78 changes the position at which the electronic components 130 are held. On the other hand, when the order in which the gripping tool 78 places the electronic components 130 on the circuit board 12 is changed in the production program 160, the gripping tool 78 may also change the order in which the gripping tool 78 places the electronic components 130 on the circuit board 12.

[0044] Furthermore, in the above embodiment, the component held by the gripper 78 is attached to the circuit board 12, but the component is not limited to the circuit board 12, and the component held by the gripper 78 may be placed on various members such as a tray, a stage, or a mounting table.

[0045] In the above embodiment, the present invention is applied when a component held by the gripper 78 is mounted on the circuit board 12. However, the present invention may also be applied when the gripper 78 grips multiple components placed on a predetermined member. In other words, the present invention may be applied to a work machine equipped with a work head that grips components at positions set in a production program based on the positions at which each of multiple components placed on a predetermined member is placed and the order in which the multiple components are gripped.

[0046] Furthermore, in the above embodiment, the present invention is applied to gripping the electronic component 130, but the present invention can also be applied to gripping various types of components. Specifically, for example, the present invention can be applied to gripping components of solar cells, components of power modules, electronic components with leads, etc. When the present invention is applied to an electronic component with leads, the position for gripping the component may be set on the lead or on the component body. [Explanation of symbols]

[0047] 10: Component mounting machine (work machine) 78: Gripping tool 80: Gripping claw (claw) 82: Gripping claw (claw) 106: Electromagnetic motor

Claims

1. a gripping tool that grips a part with a pair of claws; The gripping tool grips the gripping positions of the parts that are set based on the placement positions and placement order of each of the multiple parts, and places the multiple parts one by one.

2. a gripping tool that grips a part with a pair of claws; The work machine grips the plurality of parts one by one by gripping the parts at gripping positions set based on the placement positions and gripping order of each of the plurality of parts placed by the gripping tool.

3. 3. A work machine according to claim 1, wherein the distance between the pair of claws is changed by the operation of an electromagnetic motor.

4. 3. The work machine according to claim 1, wherein the types of the gripping tools are changed to grip the plurality of parts.

5. 3. The work machine according to claim 1, wherein the plurality of parts are parts of the same type.

Images