Alignment apparatus, film forming apparatus, alignment method, film forming method, and electronic device manufacturing method

Abstract

To provide an alignment apparatus, a film deposition apparatus, an alignment method, a film deposition method, and a method for manufacturing an electronic device, capable of improving positioning accuracy between a substrate and a mask.SOLUTION: The electrostatic chuck is provided with a protruding unit 300 protruding toward the mask M side beyond the substrate held on the holding surface, the protruding unit 300 including a case member 310 fixed to the electrostatic chuck and having an opening 311 on the mask M side, and a moving member 320 having a protruding portion 322 protruding from the opening 311 toward the mask M side and movable in a direction parallel to the holding surface by a frictional force received by the protruding portion 322 from the mask M.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to an alignment apparatus, a film formation apparatus, an alignment method, a film formation method, and a method for manufacturing an electronic device. [Background technology]

[0002] In a film formation apparatus, an alignment device aligns a substrate held by a substrate holding member with a mask, and then the substrate and mask are brought into contact with each other to form a thin film on the substrate. In this technique, there is a risk of misalignment between the substrate and mask when they are brought into contact with each other after alignment. To address this issue, the applicant of the present application has proposed a technique in which a protruding member (seating block) is provided on the substrate holding member, outside the substrate holding area on the holding surface side that holds the substrate (see Patent Document 1). By providing such a member, the member first comes into contact with the mask during the process of bringing the substrate and mask into contact with each other after the alignment operation, thereby preventing misalignment between the substrate and mask.

[0003] On the other hand, in the alignment device, it is being considered to perform finer alignment after the substrate holding member is seated on the mask. In this case, frictional resistance occurs between the seating block and the mask, which may cause problems during fine alignment. Therefore, there is still room for improvement. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-143408 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide an alignment apparatus, a film deposition apparatus, an alignment method, a film deposition method, and a method for manufacturing an electronic device that can improve the positioning accuracy between a substrate and a mask. [Means for solving the problem]

[0006] The present invention employs the following means to solve the above problems.

[0007] The alignment device of the present invention comprises: An alignment apparatus for aligning a substrate held by a substrate holding member with a mask, comprising: a protrusion unit fixed to the substrate holding member on a holding surface side that holds the substrate, outside a substrate holding region, and protruding toward the mask beyond the substrate held on the holding surface; The protruding unit is a case member fixed to the substrate holding member and having an opening on the mask side; a moving member having a protruding portion protruding from the opening toward the mask, and movable in a direction parallel to the holding surface by a frictional force applied to the protruding portion by the mask; The present invention is characterized by comprising: [Effects of the Invention]

[0008] According to the present invention, the accuracy of positioning the substrate and the mask can be improved. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram of a film forming apparatus. [Figure 2] FIG. 2 is an explanatory diagram of the operation of a main part of the film forming apparatus. [Figure 3] FIG. 2 is an explanatory diagram of the operation of a main part of the film forming apparatus. [Figure 4] FIG. 2 is an explanatory diagram of the operation of a main part of the film forming apparatus. [Figure 5] FIG. 2 is an explanatory diagram of the operation of a main part of the film forming apparatus. [Figure 6] FIG. 2 is an explanatory diagram of the operation of a main part of the film forming apparatus. [Figure 7] FIG. [Figure 8] Schematic diagram of a protrusion unit. [Figure 9] FIG. 1 is an explanatory diagram of an organic EL display device. [Figure 10] 10A and 10B are diagrams showing modified examples of the protrusion unit. [Figure 11] 10A and 10B are diagrams showing modified examples of the protrusion unit. DETAILED DESCRIPTION OF THE INVENTION

[0010] The following detailed description of the present invention will be given by way of example with reference to the accompanying drawings, although the dimensions, materials, shapes, relative positions, etc. of the components described in the examples are not intended to limit the scope of the present invention unless otherwise specified.

[0011] (Example) With reference to FIGS. 1 to 10, an alignment apparatus, a film formation apparatus, an alignment method, a film formation method, and a method for manufacturing an electronic device according to an embodiment of the present invention will be described. In FIGS. 1 to 6, components that operate integrally are hatched in the same manner to facilitate understanding of the operation of each component. While each component is shown cross-sectionally in these figures, the hatching does not necessarily represent a cross-section, since each component may be located in different positions on the front and back sides of the page. In this embodiment, the film formation apparatus also functions as an alignment apparatus that aligns a substrate and a mask. Therefore, in the film formation apparatus described below, the configuration related to the alignment of a substrate and a mask can be referred to as the configuration of an alignment apparatus. In some film formation apparatuses, an alignment apparatus that aligns a substrate and a mask and an apparatus that forms a film using a film formation source are separately provided. In such a technique, after alignment, the substrate, mask, etc. are transported to an apparatus equipped with a film formation source, where a thin film is formed. Such a technique is also included in the present invention.

[0012] <Configuration of film deposition equipment> The overall configuration of the film formation apparatus 1 will be described with particular reference to Figure 1. Figure 1 is a schematic diagram of the overall configuration of the film formation apparatus. The film formation apparatus 1 includes a chamber 10 and a film formation source 20 provided within the chamber 10. The interior of the chamber 10 is configured so that a vacuum atmosphere or an inert gas atmosphere can be maintained. The film formation source 20 may be an evaporation source that evaporates or sublimates a film formation material, or a sputtering cathode for forming a film by sputtering.

[0013] The upper part of the chamber 10 is provided with various mechanisms for aligning the substrate S, which is the target of film formation, with a mask M, which is placed on the surface of the substrate S on the film formation side, in order to form a thin film of a desired pattern on the substrate S. Note that FIG. 1 shows a state before the substrate S is loaded into the chamber 10. The substrate S is shown in FIGS. 2 to 6. In this embodiment, a configuration is shown in which these various mechanisms are provided in the chamber 10 in which the film formation source 20 is placed, and as described above, a chamber for aligning the substrate S with the mask M and a film formation source are provided. Alternatively, a configuration may be adopted in which the chamber for heating and the chamber for heating are provided separately.

[0014] The following describes various mechanisms for aligning the substrate S and the mask M. A base member 11 and a support plate 12 for supporting various mechanisms are fixed to the ceiling of the chamber 10.

[0015] A first lifting mechanism 30 is attached to the base member 11 and vertically raises and lowers an electrostatic chuck 31 serving as a substrate holding member. The first lifting mechanism 30 includes a holding member 32 that holds the electrostatic chuck 31, a shaft member 33 for raising and lowering the holding member 32, and a drive source 34 for raising and lowering the shaft member 33. The holding member 32 includes a lifting plate 32a that is perpendicular to the vertical direction. The specific configuration of the lifting mechanism may employ various known technologies, such as a ball screw mechanism, and a detailed description thereof will be omitted. The electrostatic chuck 31 has an internal electrode 31a that generates an electrostatic adsorption force when a voltage is applied to the electrode 31a. Various known methods, such as a Coulomb force type, a Johnson-Rahbek force type, and a gradient force type, may be used to generate the electrostatic adsorption force. The electrostatic chuck 31 adsorbs the surface of the substrate S opposite the surface on which the film is formed, thereby holding the substrate S.

[0016] A second lifting mechanism (lifting unit) 40 that vertically lifts and lowers the substrate S is provided on the lifting plate 32a of the holding member 32 in the first lifting mechanism 30. The second lifting mechanism 40 includes a first support member 41 that supports the periphery of the surface of the substrate S on the film-forming side, a shaft member 42 for raising and lowering the first support member 41, and a drive source 43 for raising and lowering the shaft member 42. The specific configuration of the lifting mechanism may employ various known techniques, such as a ball screw mechanism, and therefore a detailed description thereof will be omitted. When the lifting plate 32a is raised and lowered by the first lifting mechanism 30 without operating the second lifting mechanism 40, the electrostatic chuck 31 and the substrate S are raised and lowered together. Operating the second lifting mechanism 40, on the other hand, can raise and lower the substrate S relative to the electrostatic chuck 31.

[0017] The film forming apparatus 1 also includes a mask adjustment mechanism 50 serving as a mask driver that adjusts the position of the mask M. The mask adjustment mechanism 50 includes a support column 51 fixed to the ceiling of the chamber 10, a mask table holder 52 attached to the lower end of the support column 51, and a magnetic field generating coil box 53 fixed to the support column 51. A magnet 55 is attached to the periphery of a mask table 54 serving as a mask holder that holds the mask M. The mask table 54 is positioned so that the magnet 55 is located in the gap between the mask table holder 52 and the magnetic field generating coil box 53. The magnetic field generated by the magnetic field generating coil box 53 is controlled to adjust the horizontal position of the mask table 54 while it is magnetically levitated. In other words, if the directions perpendicular to the vertical direction and orthogonal to each other are defined as the X and Y directions, and the direction rotating around the vertical direction is defined as the θ direction, the mask table 54 can be moved in the X, Y, and θ directions by controlling the magnetic field generated by the magnetic field generating coil box 53.

[0018] The mask adjustment mechanism 50 also has a third lifting mechanism that raises and lowers the mask M. This third lifting mechanism is attached to a support plate 12 fixed to the ceiling of the chamber 10, and includes a support member 56 that supports the mask M, a shaft member 57 for raising and lowering the support member 56, and a drive source 58 for raising and lowering the shaft member 57. The specific configuration of the lifting mechanism can employ various known techniques, such as a ball screw mechanism, and therefore a detailed description thereof will be omitted. This mask lifting mechanism is used to receive the mask M transported into the chamber 10 and place the mask M on a mask table 54. FIG. 1 shows the mask M placed on the mask table 54.

[0019] After the substrate S and the mask M are aligned, the base member 11 is A fourth lifting mechanism 60 is attached to vertically raise and lower a magnetic attraction member 61 that magnetically attracts the mask M via the electrostatic chuck 31. The fourth lifting mechanism 60 includes a holding member 62 that holds the magnetic attraction member 61, and a drive source 63 that raises and lowers the holding member 62. The specific configuration of the lifting mechanism can be realized by various known techniques such as a ball screw mechanism, and therefore a detailed description thereof will be omitted.

[0020] Furthermore, the film forming apparatus 1 also includes a control device 90 for controlling the operation of the film forming source 20 and the various mechanisms described above. Control devices for controlling the various devices are well-known technologies, and therefore detailed description will be omitted, but the control device 90 includes a processor such as a CPU, a storage device such as a semiconductor memory or a hard disk, and an input / output interface.

[0021] <Operations up to alignment of substrate and mask in film formation equipment> In particular, the operation up to the alignment of the substrate and the mask in the film forming apparatus 1 (alignment method using the alignment apparatus) will be described with reference to Figures 2 to 8. Figures 2 to 6 show the part of Figure 1 where various mechanisms are provided near the ceiling of the chamber 10.

[0022] First, the mask M is transferred into the chamber 10 by a hand unit (not shown) of the transfer robot, and the support member 56 of the third lifting mechanism is raised to place the mask M on the mask stage 54. Then, the substrate S is transferred into the chamber 10 by a hand unit (not shown) of the transfer robot, and the substrate S is placed on the first support member 41 of the second lifting mechanism 40. As a result, the first support member 41 supports the peripheral edge of the surface of the substrate S on the film formation side (see FIG. 2). This completes the supporting process. Note that the electrostatic chuck 31, the substrate S, and the mask M are all bent such that their centers are curved vertically downward due to their own weights.

[0023] After the supporting step, an approaching step is performed in which the substrate S supported by the first supporting member 41 is brought closer to the electrostatic chuck 31. In this embodiment, the second lifting mechanism 40 raises the substrate S supported by the first supporting member 41, and the peripheral edge of the substrate S comes into contact with the electrostatic chuck 31 (see FIG. 3). After this approaching step, an attracting step is performed in which the substrate S is attracted by the electrostatic chuck 31. That is, a voltage is applied to the electrode 31a provided on the electrostatic chuck 31, and the substrate S is attracted to the electrostatic chuck 31 by electrostatic attracting force. After this attracting step, an alignment operation is performed to align the substrate S with the mask M.

[0024] Various known methods can be used for the alignment operation of aligning the substrate S and the mask M, but a representative example will be described here. Generally, to perform alignment, alignment marks (not shown) are provided on the substrate S and the mask M, respectively. Then, a camera C fixed to the chamber 10 photographs the marks on both and determines the amount of misalignment between them. Then, the horizontal position of at least one of the substrate S and the mask M is adjusted so that the misalignment is eliminated (usually, the amount of misalignment falls within a threshold value). In this embodiment, to achieve high-precision alignment in a short time, a rough alignment (first alignment) that roughly aligns the positions and a fine alignment (second alignment) that aligns the positions with high precision are performed. Generally, a camera C with low resolution but a wide field of view is used for rough alignment, and a camera C with narrow field of view but high resolution is used for fine alignment. Furthermore, separate alignment marks are usually used for the rough alignment and the fine alignment.

[0025] Specifically, after the substrate S is attracted to the electrostatic chuck 31, the electrostatic chuck 31 and the substrate S are lowered together by the first lifting mechanism 30, so that the substrate S comes into contact with the mask M (see FIG. 4). In this state, the control device 90, based on the photographing information obtained from the camera C, The amount of misalignment between the substrate S and the mask M is determined. Thereafter, the electrostatic chuck 31 and the substrate S are raised together by the first lifting mechanism 30, so that the substrate S is slightly separated from the mask M (see FIG. 5). In this state, rough alignment is performed. That is, in this embodiment, the mask adjustment mechanism 50 adjusts the mask stage 54 in the horizontal directions (X, Y, and θ directions) based on the amount of misalignment, thereby performing rough alignment between the substrate S and the mask M.

[0026] After the rough alignment is performed, the electrostatic chuck 31 and the substrate S are lowered together again by the first lifting mechanism 30, and fine alignment is performed in the same order as the rough alignment. However, in this embodiment, the substrate S and the mask M are aligned with at least the protrusion unit 300 and the mask M in contact with each other. The protrusion unit 300 will be described in detail later. This fine alignment is performed with the substrate S and the mask M in contact with each other, or at least with the distance between the substrate S and the mask M narrower than that during the rough alignment. Then, the fine alignment is repeated until the amount of misalignment between the substrate S and the mask M falls within a predetermined threshold range.

[0027] After the fine alignment is completed, the magnetic attraction member 61 is lowered by the fourth lifting mechanism 60. As a result, the mask M is attracted to the magnetic attraction member 61 via the substrate S and the electrostatic chuck 31. As a result, the substrate S and the mask M are fixed in contact with each other (see FIG. 6). Thereafter, the film formation source 20 forms a thin film on the surface (film formation surface) of the substrate S in the desired pattern (openings) formed on the mask M. In this way, a film formation process is performed after the attraction process. In this embodiment, the electrostatic chuck 31 is made of a non-magnetic material.

[0028] <Protruding unit> The protrusion units 300 will be described in detail. In this embodiment, the electrostatic chuck 31 serving as a substrate holding member has a plurality of protrusion units 300 provided outside the substrate holding area on the holding surface side that holds the substrate S. FIG. 7 shows the holding surface of the electrostatic chuck 31 that holds the substrate S. The area surrounded by a dotted line in the figure corresponds to the substrate holding area. The protrusion units 300 are configured to protrude toward the mask M beyond the substrate S held on the holding surface of the electrostatic chuck 31. By providing such protrusion units 300, after rough alignment is completed, the first lifting mechanism 30 lowers the electrostatic chuck 31 and the substrate S together, so that the protrusion units 300 contact the mask M before the substrate S. This reduces misalignment between the substrate S and the mask M compared to when the protrusion units 300 are not provided and the substrate S and the mask M are brought into contact with each other. Then, fine alignment is performed as described above.

[0029] The configuration of the protrusion unit 300 will be described with reference to Fig. 8. Fig. 8(a) is a plan view of the protrusion unit 300, and Figs. 8(b), 8(c), and 8(d) are schematic cross-sectional views of the protrusion unit 300, which correspond to the cross-sectional view taken along line AA in Fig. 8(a). Fig. 8(b) shows a state in which the protrusion unit 300 and the mask M are not in contact, and Fig. 8(c) shows a state in which the protrusion unit 300 and the mask M are in contact. Fig. 8(d) shows a state in which the protrusion unit 300 and the mask M are in contact and the electrostatic chuck 31 and the mask M have moved relatively by 2X due to fine alignment.

[0030] The protruding unit 300 includes a case member 310 fixed to the electrostatic chuck 31, and a moving member 320 configured to be movable relative to the case member 310. The case member 310 may be fixed to the electrostatic chuck 31 with a bolt B, for example, as shown in FIG. 8(a). The case member 310 has an opening 311 on the mask M side. The moving member 320 has an accommodated portion 321 accommodated in the accommodation portion of the case member 310, and a movable member 320 extending from the opening 311 to the mask M. The movable member 320 has a protruding portion 322 that protrudes to the side. In this embodiment, the accommodated portion 321 is formed of a rectangular parallelepiped portion, and the protruding portion 322 is formed of a cylindrical portion, and these are integrally provided. The movable member 320 is configured to be movable in a direction parallel to the holding surface of the electrostatic chuck 31 by the frictional force that the protruding portion 322 receives from the mask M.

[0031] Furthermore, in the protrusion unit 300, a rolling element 330 is provided in the housing of the case member 310. The rolling element 330 generates rolling friction when the moving member 320 moves relative to the case member 310. The rolling element 330 is formed of a spherical element (such as an iron ball). In this embodiment, a plurality of rolling elements 330 is provided. Although two rolling elements 330 are shown in the cross-sectional views of FIGS. 8(b), 8(c), and 8(d), three or more rolling elements 330 are provided to support the surface. The rolling element 330 is disposed so as to be able to roll on both the moving member 320 and the surface 312 of the inner surface of the case member 310 facing the moving member 320. The protrusion unit 300 according to this embodiment also includes a rolling element holding member 340 that holds the rolling element 330. The rolling element holding member 340 has a through-hole 341 with a substantially hemispherical inner circumferential surface, and the rolling element 330 is held in the through-hole 341.

[0032] Furthermore, the protrusion unit 300 according to this embodiment is provided with a positioning means that returns the movable member 320 to its initial position when the protrusion 322 of the movable member 320 and the mask M separate. The positioning means according to this embodiment is a spring 350 as an elastic body, one end of which is fixed to the inner surface of the case member 310 and the other end of which is fixed to the movable member 320. In this embodiment, the spring 350 is provided in two locations. The spring 350 is arranged to pass through a through-hole 342 provided in the rolling element holding member 340, and one end of which is fixed to the inner surface of the case member 310 and the other end of which is fixed to the movable member 320.

[0033] The operation of the protruding unit 300 configured as above will now be described. When the protruding portion 322 of the moving member 320 and the mask M are separated, the accommodated portion 321 of the moving member 320 is in contact with the case member 310. Furthermore, the rolling element 330 is in contact with the upper end 323 of the moving member 320 and is separated from the inner surface of the case member 310. The moving member 320, the rolling element holding member 340, and the rolling element 330 held by the rolling element holding member 340 are positioned relative to the case member 310 by the spring 350 (see FIG. 8(b)).

[0034] When the protruding portion 322 of the moving member 320 is in contact with the mask M, the moving member 320 is pushed by the mask M and rises relative to the case member 310, and the housed portion 321 of the moving member 320 is separated from the case member 310. In addition, the spring 350 is compressed from its initial state, and the rolling element 330 is pushed by the moving member 320 and rises relative to the case member 310. As a result, the rolling element 330 is in contact with both the moving member 320 and the surface 312 of the inner surface of the case member 310 that faces the moving member 320 (see FIG. 8(c)).

[0035] By performing fine alignment, when the mask M moves relative to the electrostatic chuck 31, the moving member 320 moves in a direction parallel to the holding surface of the electrostatic chuck 31 due to a frictional force (static frictional force (a force that prevents relative movement between the mask M and the protrusions 322)) that the mask M exerts on the protrusions 322. The rolling element 330 rolls against both the moving member 320 and the opposing surface 312 of the case member 310. Therefore, the amount of movement of the mask M in the parallel direction is 2X, and the amount of movement of the rolling element 330 and the rolling element holding member 340 in the parallel direction is X, which is half of the amount of movement 2X of the mask M (see FIG. 8(d)). In this embodiment, when the mask M moves relative to the electrostatic chuck 31, no sliding friction occurs between the members, and only rolling friction occurs due to the rolling element 330. This makes it possible to significantly reduce the frictional force that occurs when the mask M moves relative to the electrostatic chuck 31. Therefore, fine alignment can improve the positioning accuracy of the substrate S and the mask M. In addition, When the moving member 320 moves in the parallel direction relative to the case member 310, the spring 350 is deformed.

[0036] Thereafter, after the various processes are completed, when the protrusion 322 of the moving member 320 and the mask M are separated, the spring 350 returns to its original state by its elastic restoring force. As a result, the moving member 320 returns to its initial position. In addition, the rolling element holding member 340 also returns to its initial position together with the rolling element 330 as the spring 350 presses the through-hole 342.

[0037] <Electronic device manufacturing method> Next, an example of a method for manufacturing an electronic device using the film forming apparatus of this embodiment will be described. Below, the configuration of an organic EL display device will be shown as an example of an electronic device, and a method for manufacturing the organic EL display device will be illustrated.

[0038] First, the organic EL display device to be manufactured will be described. Figure 9(a) is an overall view of an organic EL display device 150, and Figure 9(b) shows the cross-sectional structure of one pixel.

[0039] As shown in FIG. 9(a), a plurality of pixels 152, each including a plurality of light-emitting elements, are arranged in a matrix in a display region 151 of an organic EL display device 150. As will be described in detail later, each light-emitting element has a structure including an organic layer sandwiched between a pair of electrodes. Note that the term "pixel" here refers to the smallest unit that enables a desired color to be displayed in the display region 151. In the organic EL display device according to this embodiment, each pixel 152 is configured by a combination of a first light-emitting element 152R, a second light-emitting element 152G, and a third light-emitting element 152B, which emit light different from one another. The pixel 152 is often configured by a combination of red, green, and blue light-emitting elements, but may also be a combination of yellow, cyan, and white light-emitting elements, and is not particularly limited as long as it emits at least one color.

[0040] 9(b) is a partial cross-sectional schematic diagram taken along line AB in FIG. 9(a). A pixel 152 is composed of a plurality of light-emitting elements, each of which includes a first electrode (anode) 154, a hole transport layer 155, one of light-emitting layers 156R, 156G, and 156B, an electron transport layer 157, and a second electrode (cathode) 158 on a substrate 153. Among these, the hole transport layer 155, the light-emitting layers 156R, 156G, and 156B, and the electron transport layer 157 correspond to organic layers. In this embodiment, the light-emitting layer 156R is an organic EL layer that emits red light, the light-emitting layer 156G is an organic EL layer that emits green light, and the light-emitting layer 156B is an organic EL layer that emits blue light. The light-emitting layers 156R, 156G, and 156B are formed in patterns corresponding to the light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively. Furthermore, first electrode 154 is formed separately for each light-emitting element. Hole transport layer 155, electron transport layer 157, and second electrode 158 may be formed in common for multiple light-emitting elements 152R, 152G, and 152B, or may be formed for each light-emitting element. In order to prevent short-circuiting between first electrode 154 and second electrode 158 due to foreign matter, insulating layer 159 is provided between first electrodes 154. Furthermore, because the organic EL layer deteriorates due to moisture and oxygen, protective layer 140 is provided to protect the organic EL elements from moisture and oxygen.

[0041] 9(b), the hole transport layer 155 and the electron transport layer 157 are shown as a single layer, but depending on the structure of the organic EL display element, they may be formed of multiple layers including a hole blocking layer and an electron blocking layer. Furthermore, a hole injection layer having an energy band structure that can smoothly inject holes from the first electrode 154 to the hole transport layer 155 can be formed between the first electrode 154 and the hole transport layer 155. Similarly, an electron injection layer can be formed between the second electrode 158 and the electron transport layer 157.

[0042] Next, an example of a method for manufacturing an organic EL display device will be specifically described.

[0043] First, a circuit (not shown) for driving the organic EL display device and a substrate 153 on which a first electrode 154 is formed are prepared.

[0044] An acrylic resin is formed by spin coating on the substrate 153 on which the first electrode 154 is formed, and the acrylic resin is patterned by lithography so that an opening is formed in the portion where the first electrode 154 is formed, thereby forming an insulating layer 159. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0045] The substrate 153 with the patterned insulating layer 159 is carried into a first organic material film formation apparatus, and the substrate is held by a substrate support table and an electrostatic chuck. A hole transport layer 155 is formed as a common layer on the first electrode 154 in the display area. The hole transport layer 155 is formed by vacuum deposition. In practice, the hole transport layer 155 is formed to be larger than the display area 151, so a high-resolution mask is not required.

[0046] Next, the substrate 153 on which the hole transport layer 155 has been formed is carried into a second organic material film formation apparatus and held by a substrate support table and an electrostatic chuck. The substrate and a mask are aligned, and the substrate is placed on the mask. A red light-emitting layer 156R is then formed on the portion of the substrate 153 where the red light-emitting element is to be disposed.

[0047] Similar to the formation of the light-emitting layer 156R, a green-emitting light-emitting layer 156G is formed by a third organic material film formation apparatus, and then a blue-emitting light-emitting layer 156B is formed by a fourth organic material film formation apparatus. After the formation of the light-emitting layers 156R, 156G, and 156B is completed, an electron transport layer 157 is formed over the entire display area 151 by a fifth film formation apparatus. The electron transport layer 157 is formed as a layer common to the three light-emitting layers 156R, 156G, and 156B.

[0048] The substrate on which the electron transport layer 157 has been formed is moved in a metallic evaporation material deposition device, and the second electrode 158 is deposited.

[0049] Thereafter, the substrate is transferred to a plasma CVD apparatus, where a protective layer 140 is formed, and the organic EL display device 150 is completed.

[0050] If the substrate 153 on which the insulating layer 159 has been patterned is exposed to an atmosphere containing moisture or oxygen from the time it is carried into the film-forming apparatus until the completion of the formation of the protective layer 140, the light-emitting layer made of an organic EL material may be deteriorated by the moisture or oxygen. Therefore, in this embodiment, the substrate is carried in and out of the film-forming apparatus in a vacuum atmosphere or an inert gas atmosphere.

[0051] <Advantages of the alignment apparatus, film formation apparatus, alignment method, film formation method, and electronic device manufacturing method according to the present embodiment> According to this embodiment, by adopting a configuration including the protruding unit 300, it is possible to suppress misalignment between the substrate S and the mask M when the electrostatic chuck 31 and the mask M are brought into contact with each other after the rough alignment. Furthermore, during the fine alignment, the substrate S and the mask M are in contact with each other, or at least the distance between the substrate S and the mask M is narrower than that during the rough alignment. This improves the positioning accuracy. Furthermore, during the fine alignment, no sliding friction occurs between the components, and only rolling friction occurs due to the rolling elements 330. Therefore, the substrate S and the mask M can be smoothly moved relative to each other, further improving the positioning accuracy.

[0052] (others) In the above embodiment, a case has been described in which a mask adjustment mechanism 50 for adjusting the position of the mask M is used to align the substrate S and the mask M. However, in the present invention, the alignment of the substrate and the mask may include a case in which only a mechanism for adjusting the substrate position is employed, or a case in which both a mechanism for adjusting the substrate position and a mechanism for adjusting the mask position are employed. Furthermore, when a configuration including both a mechanism for adjusting the substrate position and a mechanism for adjusting the mask position is employed, it is also possible to employ a configuration in which one mechanism is used during rough alignment and the other mechanism is used during fine alignment. Furthermore, when a configuration including both a mechanism for adjusting the substrate position and a mechanism for adjusting the mask position is employed, it is also possible to employ a configuration in which one mechanism is used during rough alignment and both mechanisms are used during fine alignment.

[0053] Furthermore, the configuration of the protrusion unit 300 is not limited to the configuration shown in the above embodiment. Modified examples of the protrusion unit will be described with reference to Figures 10 and 11. During fine alignment, it is desirable to have a low frictional force (resistance force) generated between each member in order to ensure smooth relative movement between the substrate and mask. In the above embodiment, a configuration in which only rolling friction occurs was shown in order to minimize this frictional force. However, even if the frictional resistance is low, and not necessarily rolling friction, sliding friction can also achieve the desired effect.

[0054] For example, in the protrusion unit 300S shown in FIG. 10(a), a configuration is adopted in which no rolling elements are provided, and a protrusion member 324 having a hemispherical upper surface is provided on the upper end of a moving member 320S. The protrusion member 324 is made of a self-lubricating resin material (e.g., POM resin). Note that this moving member 320S is similar to the moving member 320 shown in the above embodiment in that it is provided with an accommodated portion 321 and a protrusion portion 322. Also, in this protrusion unit 300S, as in the above embodiment, a spring 350 is provided as a positioning means for returning the moving member 320S to its initial position.

[0055] In the protrusion unit 300S configured as described above, when the protrusion 322 and the mask M are in contact with each other, the moving member 320 rises relative to the case member 310. The accommodated portion 321 of the moving member 320 then separates from the case member 310, and the tip of the protrusion member 324 comes into contact with the inner surface of the case member 310. When the mask M subsequently moves relative to the electrostatic chuck 31 by fine alignment, the frictional force exerted by the mask M on the protrusion 322 causes the moving member 320 to move in a direction parallel to the holding surface of the electrostatic chuck 31. In this modification, sliding friction occurs between the tip of the protrusion member 324 and the inner surface of the case member 310. In this modification, the sliding frictional force between the tip of the protrusion member 324 and the inner surface of the case member 310 can be sufficiently reduced. Therefore, the positioning accuracy of the substrate S and the mask M can be improved. Furthermore, in this embodiment, the rolling elements and rolling element holding members are not required, and therefore the number of parts can be reduced compared to the first embodiment.

[0056] In the above embodiment and the modified example shown in Fig. 10(a), a configuration is shown in which an elastic body (more specifically, a spring) is used as the alignment means for returning the movable member to its initial position. However, it is also possible to adopt a configuration in which the shape of the case member and the movable member is devised as the alignment means, without providing a separate member for alignment.

[0057] For example, in the protrusion unit 300T shown in Figures 10(b) and 10(c), the inner circumferential surface of the opening 311T in the case member 310T is configured as a tapered surface whose diameter decreases toward the mask M. Also, the outer circumferential surface of the protrusion 322T in the moving member 320T is provided with a tapered surface 322Ta whose diameter decreases toward the mask M. By adopting such a configuration, when the protrusion 322T and the mask M are not in contact with each other, the opening 311T is tapered. When the inner peripheral surface (tapered surface) of 11T and the outer peripheral surface (portion of tapered surface 322Ta) of protrusion 322T are in contact with each other, a centering effect can be achieved, positioning moving member 320T relative to case member 310T.

[0058] 10(a) in that the movable member 320T is provided with a protruding member 324 instead of a rolling element. Therefore, the operation when the protruding portion 322T comes into contact with the mask M and the operation during fine alignment are the same as those in the modified example shown in FIG. 10(a) above, and therefore a description thereof will be omitted. In this embodiment, there is no need to provide a separate alignment member as an alignment means for returning the movable member to its initial position, which further reduces the number of parts.

[0059] The protrusion unit 300U shown in FIG. 11(a) has a configuration in which a lubricant 325 is provided on the upper end of the movable member 320U. Specific examples of the lubricant 325 include lubricants such as lubricating oil applied to the upper surface of the movable member 320U, as well as lubricants suitable for a vacuum environment, such as solid lubricants. The lubricant 325 can also be formed by coating the upper surface of the movable member 320U with a lubricating material, or by fixing a member made of a highly lubricating material. This movable member 320U is similar to the movable member 320 described in the above embodiment in that it has a accommodated portion 321 and a protrusion 322. Similar to the above embodiment, this protrusion unit 300U also has a spring 350 as a positioning means for returning the movable member 320U to its initial position.

[0060] In the protrusion unit 300U configured as described above, when the protrusion 322 and the mask M are in contact with each other, the moving member 320U rises relative to the case member 310. The accommodated portion 321 of the moving member 320U then moves away from the case member 310, and the lubricant 325 comes into contact with the inner surface of the case member 310. When the mask M subsequently moves relative to the electrostatic chuck 31 by fine alignment, the frictional force exerted by the mask M on the protrusion 322 causes the moving member 320U to move in a direction parallel to the holding surface of the electrostatic chuck 31. In this modification, sliding friction occurs between the lubricant 325 and the inner surface of the case member 310. In this modification, the sliding frictional force between the lubricant 325 and the inner surface of the case member 310 can be sufficiently reduced. Therefore, the positioning accuracy of the substrate S and the mask M can be improved. Furthermore, in this embodiment, the rolling elements and rolling element holding members are not required, and therefore the number of parts can be reduced compared to the first embodiment. In the illustrated example, a configuration in which a lubricant is provided at the upper end of movable member 320U is shown, but the same effect can be obtained by providing a lubricant at a position on the inner surface of case member 310 that faces the upper end of movable member 320U. Also, in this modified example, instead of providing spring 350 as alignment means for returning the movable member to its initial position, a structure that can exert the centering effect shown in Figures 10(b) and 10(c) can be employed.

[0061] In addition, in the examples described above, a configuration has been shown in which the frictional force (resistance force) generated between each member is reduced in order to smooth the relative movement between the substrate and the mask. However, a configuration can also be adopted in which a member is provided that elastically deforms when the substrate and the mask move relative to each other. An example of this will be described with reference to Figures 11(b) and 11(c).

[0062] 11(b) and (c) employs a configuration in which an elastic ring 326 is provided at the upper end of a moving member 320V. In this example, an O-ring made of an elastomer material and having a circular cross section is used as the elastic ring 326. Note that FIG. 11(c) is a plan view showing the positional relationship between the moving member 320V and the elastic ring 326, and the moving member 320V and elastic ring 326 in FIG. 11(b) correspond to the BB cross section in FIG. 11(c). Note that in this moving member 320V as well, the accommodated portion 32 1 and protrusion 322 is provided, similarly to the moving member 320 shown in the above embodiment. Also, in this protrusion unit 300V, similarly to the above embodiment, a spring 350 is provided as a positioning means for returning the moving member 320 to its initial position.

[0063] In the protrusion unit 300V configured as described above, when the protrusion 322 and the mask M are in contact with each other, the moving member 320V rises relative to the case member 310. The accommodated portion 321 of the moving member 320V then separates from the case member 310, and the elastic ring 326 comes into contact with the inner surface of the case member 310. When the mask M subsequently moves relative to the electrostatic chuck 31 through fine alignment, the frictional force exerted by the mask M on the protrusion 322 causes the moving member 320V to move in a direction parallel to the holding surface of the electrostatic chuck 31. In this modification, the elastic ring 326 deforms in accordance with the relative movement direction between the case member 310 and the moving member 320V. Because the resistance force associated with this deformation is small, the relative movement between the substrate (electrostatic chuck) and the mask can be smoothed. Therefore, the positioning accuracy of the substrate S and the mask M can be improved. Furthermore, in this embodiment, the rolling elements and rolling element holding members are not required, and therefore the number of parts can be reduced compared to the first embodiment. Also, in this modified example, instead of providing the spring 350 as a positioning means for returning the moving member to its initial position, a structure capable of exerting a centering effect as shown in Figures 10(b) and (c) can be adopted. [Explanation of symbols]

[0064] 1: Film forming apparatus 20: Film forming source 300, 300S, 300T, 300U, 300V: Protrusion unit 310, 310Y: Case member 311, 311Y: Opening 312: Opposing surface 320, 320X, 320T, 320U, 320V: Moving member 321: Receiving portion 322, 322Y: Protrusion 322Ya: Tapered surface 323: Upper end 324: Protruding member 325: Lubricant 326: Elastic ring 330: Rolling element 340: Rolling element holding member 341: Through hole 342: Through hole 350: Spring M: Mask S: Substrate

Claims

1. An alignment apparatus for aligning a substrate held by a substrate holding member with a mask, comprising: a protrusion unit fixed to the substrate holding member on a holding surface side that holds the substrate, outside a substrate holding region, and protruding toward the mask beyond the substrate held on the holding surface; The protruding unit is a case member fixed to the substrate holding member and having an opening on the mask side; a moving member having a protruding portion protruding from the opening toward the mask, and movable in a direction parallel to the holding surface by a frictional force applied to the protruding portion by the mask; An alignment device comprising:

2. 2. The alignment device according to claim 1, wherein the housing portion is provided with rolling elements that generate rolling friction when the moving member moves relative to the case member.

3. 3. The alignment device according to claim 2, wherein the rolling elements are arranged to be able to roll on both the moving member and the surface of the inner surface of the case member that faces the moving member.

4. 4. An alignment apparatus according to claim 1, further comprising a positioning means for returning said moving member to an initial position when said protrusion and said mask are separated.

5. 5. The alignment device according to claim 4, wherein said positioning means is an elastic body having one end fixed to the inner surface of said case member and the other end fixed to said moving member.

6. 4. The alignment device according to claim 2, further comprising a rolling element holding member for holding the rolling elements.

7. The alignment device described in claim 6, characterized in that it is equipped with an elastic body that is arranged to pass through a through hole provided in the rolling element holding member, and has one end fixed to the inner surface of the case member and the other end fixed to the moving member, so that when the protrusion and the mask are separated, the moving member and the rolling element holding member return to their initial positions.

8. 4. A film forming apparatus comprising a film forming source for forming a thin film on the substrate positioned by the alignment apparatus according to claim 1.

9. 4. An alignment method for aligning the substrate and the mask using the alignment apparatus according to claim 1, 2 or 3, comprising: a first alignment step of aligning the substrate and the mask while the substrate and the mask are spaced apart from each other; After the first alignment, bringing the substrate and the mask closer together; a second alignment step of aligning the substrate and the mask with at least the protrusion unit and the mask in contact with each other; An alignment method comprising:

10. 10. A film forming method, comprising: forming a thin film on the substrate using a film forming source after the substrate and the mask have been aligned using the alignment method according to claim 9.

11. A method for manufacturing an electronic device, comprising the steps of: manufacturing an electronic device by using the film forming method according to claim 10;

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