Electronic device

Abstract

To provide a compact electronic apparatus having a heat radiation structure.SOLUTION: The electronic device includes an opening through which a storage medium for storing information can be inserted and removed, and a moving unit movable between an open position for opening the opening and a closed position for closing the opening. The heat dissipating portion is in contact with the storage medium when the moving portion is located at the open position and is separated from the storage medium when the moving portion is located at the closed position, and a width of the first elastic portion in a direction orthogonal to the moving direction of the moving portion and the insertion and removal direction is wider on the second end side than on the first end side.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to an electronic device that allows heat dissipation from media components that generate heat internally. [Background technology]

[0002] Conventionally, electronic devices that enable heat dissipation from media components that generate heat internally are known. Patent Document 1 discloses a configuration in which, when an access cover that can open and close a media entrance is opened, a heat sink moves in a direction away from a storage section that stores media, and, when the access cover is closed, the heat sink moves in a direction toward the storage section and is pressed against the media. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-203423 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the electronic device of Patent Document 1 uses a cam mechanism for the movement mechanism that moves the heat sink, which means that the movement mechanism has a large number of parts and a complex configuration, which results in a large space being required to install the movement mechanism, leading to an increase in the size of the electronic device.

[0005] An object of the present invention is to provide a small electronic device having a heat dissipation structure. [Means for solving the problem]

[0006] An electronic device as one aspect of the present invention has an opening through which a storage medium for storing information can be inserted and removed, a movable part that can move between an open position that opens the opening and a closed position that closes the opening, a first elastic part whose first end on the insertion side in the insertion / removal direction of the storage medium moves in accordance with the movement of the movable part and whose second end opposite the first end is fixed, and a heat dissipation part that is arranged between the first elastic member and the storage medium and moves in accordance with the movement of the first end, wherein the heat dissipation part contacts the storage medium when the movable part is in the open position and is separated from the storage medium when the movable part is in the closed position, and the width of the first elastic part in a direction perpendicular to the movement direction of the movable part and the insertion / removal direction is wider on the second end side than on the first end side. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a small-sized electronic device having a heat dissipation structure. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a perspective view of an imaging device that is an example of an electronic device according to a first embodiment. [Figure 2] FIG. 1 is a system diagram of an imaging apparatus according to a first embodiment. [Figure 3] FIG. 2 is an explanatory diagram of a card cover according to the first embodiment. [Figure 4] FIG. 1 is a diagram illustrating the internal configuration of an imaging device according to a first embodiment. [Figure 5] 3 is an enlarged rear view of the periphery of a first card slot of the imaging device of the first embodiment. FIG. [Figure 6] FIG. 10 is an explanatory diagram of the card cover at the start of sliding in the first embodiment. [Figure 7] FIG. 10 is an explanatory diagram of the card cover during sliding in the first embodiment. [Figure 8] FIG. 10 is an explanatory diagram of the card cover when sliding is completed in the first embodiment. [Figure 9] FIG. 10 is an exploded rear perspective view of the inside of the imaging device according to the second embodiment. [Figure 10] FIG. 10 is an enlarged rear view of the periphery of the first card slot of the second embodiment. [Figure 11] FIG. 10 is an explanatory diagram of the card cover when the sliding is completed in the second embodiment. [Figure 12] FIG. 11 is an exploded rear perspective view of the inside of the imaging device according to the third embodiment. [Figure 13] FIG. 11 is an enlarged rear view of the periphery of the first card slot of the third embodiment. [Figure 14] FIG. 11 is an explanatory diagram of the card cover when the sliding is completed in the third embodiment. [Figure 15] FIG. 10 is a perspective view of an electronic device according to a fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to designate the same components, and redundant explanations will be omitted. First Embodiment Fig. 1 is a perspective view of an imaging device 100, which is an example of an electronic device according to this embodiment. Fig. 1(a) and Fig. 1(b) are a front perspective view and a rear perspective view, respectively, of the imaging device 100. The imaging device 100 is configured so that an interchangeable lens (not shown) can be attached or detached. In the following description, the X direction in the figure is defined as the left-hand direction of the body, the Y direction as the upward direction of the body, the Z direction as the front direction of the body, and the -Z direction as the rear direction of the body.

[0010] The display unit 101 is provided on the rear surface of the imaging device 100 and displays images and various information. The display unit 101 is equipped with a touch panel and can detect touch operations on the display surface (operation surface).

[0011] An outside-finder display unit 102 is provided on the top surface of the image capture device 100, and displays various settings of the image capture device 100, including the shutter speed and aperture.

[0012] The shutter button 103 is an operation unit used to issue a shooting instruction, and the mode switching button 104 is an operation unit used to switch between various modes.

[0013] The terminal cover 105 is a cover that protects a connector (not shown) of a connection cable or the like that connects the imaging device 100 to a connection cable for connecting to an external device.

[0014] The main electronic dial 106 is a rotary operation member used to change settings such as shutter speed and aperture.

[0015] The power switch 107 is an operating member used to turn the power of the imaging device 100 on and off and to lock various setting values.

[0016] The sub electronic dial 108 is a rotary operation member used to move the selection frame, advance images, and the like.

[0017] The multi-controller 109 is provided on the rear surface of the imaging device 100, and allows input by pressing the key tops as well as tilting the key tops. The key tops can be tilted in eight directions, including up, down, left, right, and diagonal directions. The multi-controller 109 is mainly used to move the selection frame and make selections in each menu.

[0018] The rear electronic dial 110 is a rotary operation member used to move the selection frame, advance through images, etc. The rear electronic dial 110 is located in a position that allows for intuitive operation while playing back captured images on the display unit 101, and is easy to operate even when the imaging device 100 is held vertically.

[0019] A SET button 111 is provided in the center of the rear electronic dial 110. The SET button 111 is a push button that is mainly used to confirm a selected item.

[0020] The video button 112 is used to instruct the start and stop of video shooting (recording).

[0021] The button group 113 is an operation button related to focus and exposure, and consists of an AF-on button, an AE lock button, and an AF frame selection button, which are arranged in a row of three. By pressing any button in the button group 113 while the camera is in shooting standby mode, it is possible to control AF, change the AF range, or fix the exposure.

[0022] The button group 114 consists of a play button, a zoom in / out button, and a delete button, arranged in a row of three horizontally. The play button is used to switch between shooting mode and playback mode. Pressing the play button in shooting mode switches to playback mode, and the most recent image recorded on a storage medium that stores information (a first card 501 and a second card 502, described below) can be displayed on the display unit 101. The zoom in / out button can be used to turn on / off the zoom mode in the live view display in shooting mode, and can be used to turn on / off the zoom mode for the playback image in playback mode. In playback mode, an image can be selected and then deleted by pressing the delete button.

[0023] The button group 115 is made up of an information display button and a quick setting button. The information display button can switch the display method of information displayed on the display unit 101, and the quick setting button is a button that can transition to item setting of shooting parameters.

[0024] The button group 116 is made up of a menu button and a rating button. Pressing the menu button displays a menu screen on the display unit 101 that allows various settings to be made. The user can intuitively make various settings by touching the menu screen displayed on the display unit 101, using the multi-controller 109, rear electronic dial 110, and SET button 111. When the rating button is pressed during playback mode, the playback image can be rated (ranked).

[0025] An interchangeable lens (not shown) is attached to and detached from the mount portion 121 .

[0026] The communication terminal 117 is provided inside the mount section 121 and is used when the imaging device 100 communicates with an interchangeable lens.

[0027] The finder 118 is an eyepiece and is configured as an electronic viewfinder. By looking through the finder 118, the user can view the image displayed inside.

[0028] The grip portion 119 is a holding portion shaped to be easily gripped with the user's right hand when holding the imaging device 100. The front rubber 120 is made of a rubber material and has a shape that fits easily in the hand and is not slippery, extending from the card cover (moving portion) 301 to the rear cover 122.

[0029] The card cover 301 is a cover member that protects the card slots that store the first card 501 and second card 502 described below. The card cover 301 is provided in the grip section 119 in the area where the user's palm rests, and its position and size are determined taking into consideration the restrictions of the internal card slots and operability.

[0030] 2 is a system diagram of the imaging device 100. A CPU (Central Processing Unit) 210 controls the overall operation of the imaging device 100 and executes various processes and instructions for each circuit unit. A main circuit board 201 is a printed wiring board (PWB) on which various components such as the CPU 210 and various electric circuits (detection circuits, control circuits, and processing circuits) are mounted. The CPU 210 controls each functional block of the imaging device 100 and performs the necessary calculations according to a computer program loaded from memory.

[0031] The power supply 211 supplies power to each circuit within the imaging device 100. The imaging sensor 212 is composed of a CCD or CMOS sensor and converts an optical image of a subject into an image signal. The image signal obtained by the imaging sensor 212 is converted into image data by an image processing unit 213 and output to the CPU 210. The image data output from the CPU 210 is recorded on the first card 501 or the second card 502. The shutter 214 is disposed in front of the imaging sensor 212 and adjusts the exposure time of the imaging sensor 212. The shutter control unit 215 drives the shutter 214 based on a signal input from the CPU 210. In response to a user's operation on an operating member 216, the operation detection unit 217 outputs a signal to the CPU 210, which can change shooting conditions such as exposure and shutter speed.

[0032] The opening and closing mechanism of the card cover 301 will be described below with reference to Fig. 3. Fig. 3 is an explanatory diagram of the card cover 301 that opens and closes an opening into which the first card 501 and the second card can be inserted and removed. Fig. 3(a) is a right side view of the imaging device 100 with the card cover 301 open. Fig. 3(b) is an enlarged view of the rectangular frame A indicated by the dotted line in Fig. 3(a). The card cover 301 is configured to be movable between an open position that opens the opening and a closed position that closes the opening.

[0033] First, the process of changing the card cover 301 from an open state (a state in which the card cover 301 is in an open position that opens the opening) to a closed state (a state in which the card cover 301 is in a closed position that closes the opening) will be described. A first card 501 and a second card 502 are inserted into the interior side of the card cover 301 as media for recording image data. In this embodiment, the first card 501 is assumed to be an XQD card or a CF Express card, and the second card 502 is assumed to be an SD card, but the media types are not limited to these and other media may be used. A base member 302 is disposed on the interior side of the card cover 301, forming insertion slots for the first card 501 and the second card 502. A through-hole (not shown) is provided in each of the card cover 301 and the base member 302, penetrating in the Y direction, and a shaft 303 is disposed so as to pass through the through-hole (not shown). The through-hole in the base material 302 (not shown) has an oval shape with long sides parallel to the Z axis, and the shaft 303 can slide inside the through-hole in a direction parallel to the Z axis. The shaft 303 is the center of rotation of the card cover 301. The user can rotate the card cover 301 around the shaft 303 as the axis of rotation. A spring 304 is provided on the shaft 303, which generates a biasing force between the card cover 301 and the base material 302.

[0034] Figure 3(c) is an enlarged view of square box A in Figure 3(a) when card cover 301 has been rotated and has begun to slide. In this state, card cover 301 has rotated from the state in Figure 3(b) around shaft 303 as the axis of rotation until it approaches base material 302. In this state, card cover 301 is not locked and can be slid in the +Z direction by a slide amount S.

[0035] Figure 3(d) is an enlarged view of square box A in Figure 3(a) when card cover 301 is closed. This state is achieved by sliding card cover 301 in the +Z direction by a slide amount S from Figure 3(c). In this state, card cover 301 is locked, and first card 501 and second card 502 are protected by card cover 301.

[0036] Next, the process of changing card cover 301 from a closed state to an open state will be described. Card cover 301 is slid in the -Z direction by a slide distance S from the state shown in Figure 3(d) to the state shown in Figure 3(c). In the state shown in Figure 3(c), card cover 301 receives the biasing force of spring 304 and rotates around shaft 303 as the axis of rotation until it reaches the open state of card cover 301 shown in Figure 3(b).

[0037] The configuration around the first card 501 will be described below with reference to Fig. 4 and Fig. 5. Fig. 4 is a diagram showing the internal configuration of the imaging device 100. Fig. 4(a) and Fig. 4(b) are a rear perspective view and an exploded rear perspective view, respectively, of the interior of the imaging device 100. Fig. 5 is an enlarged rear view of the periphery of the first card slot 401 of the imaging device 100.

[0038] A main circuit board 201 is disposed inside the imaging device 100. A CPU 210 (not shown) is mounted on the main circuit board 201. In this embodiment, two different types of card slots are attached to the main circuit board 201. A first card slot 401 is attached on the -Z direction side, and a second card slot (not shown) is attached on the +Z direction side. In this embodiment, it is assumed that the first card slot 401 is a slot into which a first card 501 is inserted, and the second card slot is a slot into which a second card 502 is inserted, but the present invention is not limited to this. A single slot, double slots of the same type, or other combinations of slots may also be used. An eject button 401a is provided in the first card slot 401, and when the corresponding first card 501 is inserted into the first card slot 401, a lever 401b rotates, and the eject button 401a moves in the -X direction. On the other hand, when the eject button 401a is pressed in the +X direction, the lever 401b rotates in the opposite direction to the previous one, and the first card 501 is pushed out in the -X direction.

[0039] The first card slot 401 has multiple notches, which form leaf springs that can move toward the front and rear of the main body. In this embodiment, the leaf springs are formed in three locations. The central leaf spring portion (first elastic portion) 402a is formed to have a larger area than the two upper and lower leaf spring portions 402b. The leaf spring portion 402a has a free end (first end) B on the -X direction side (the insertion side in the insertion / removal direction of the first card 501) and a fixed end (second end) C on the +X direction side (the side opposite the insertion side in the insertion / removal direction of the first card 501). The leaf spring portions 402b, which are arranged in two locations above and below the leaf spring portion 402a, constantly urge the first card 501 inserted into the first card slot 401 in the +Z direction, fixing the position of the first card 501. A first cushion material (second elastic portion) 403 is disposed directly below the central leaf spring portion 402a in the +Z direction. A second cushion material 405 is disposed directly above the free end B side of the leaf spring portion 402a. A first heat dissipation member (heat dissipation portion) 404 is attached directly below the first cushion material 403 in the +Z direction. The first heat dissipation member 404 passes through an opening 401c provided in the first card slot 401 and is exposed on the -Z direction side of the first card slot 401. The first heat dissipation member 404 is thermally connected to a metal plate or an exterior member (not shown). In this embodiment, the first heat dissipation member 404 is assumed to be a graphite sheet, but other sheet-like heat dissipation members such as copper foil may also be used. Furthermore, the width of the leaf spring portion 402a, the first cushion material 403, and the first heat dissipation member 404 increases in the Y direction (a direction perpendicular to the movement direction of the card cover 301 and the insertion / removal direction of the first card 501) as they move toward the +X direction.

[0040] The heat dissipation configuration of the first card 501 will be described below. FIG. 6 is an explanatory diagram of the card cover 301 at the start of sliding. FIG. 6(a) is a cross-sectional view of the card cover 301 taken along line DD in FIG. 5 when the card cover 301 starts to slide. FIG. 6(b) is an enlarged view of the rectangular frame E indicated by the dotted line in FIG. 6(a). The card cover 301 is disposed directly above the free end B of the leaf spring portion 402a and includes a protrusion 301a extending (protruding) in the +Z direction (the direction perpendicular to the surface of the first card 501). In the state shown in FIG. 6, the protrusion 301a and the second cushion material 405 on the leaf spring portion 402a are not in contact with each other, creating a clearance between them. Furthermore, the first heat dissipation member 404, disposed via the first cushion material 403, is not in surface contact with the top surface (exterior) 501a of the first card 501 directly below the leaf spring portion 402a in the +Z direction. Therefore, heat is not transferred from the first card 501 to the first heat dissipation member 404 .

[0041] 7 is an explanatory diagram of the card cover 301 during sliding, showing the state when the protrusion 301a and the second cushion material 405 on the leaf spring portion 402a come into contact. FIG. 7(a) is a cross-sectional view taken along line DD in FIG. 5 when the card cover 301 is being slid. FIG. 7(b) is an enlarged view of the rectangular frame F indicated by the dotted line in FIG. 7(a). When the card cover 301 is further slid in the +Z direction from the state shown in FIG. 7, the protrusion 301a presses the free end B side of the leaf spring portion 402a in the +Z direction via the first cushion material 403 of the leaf spring portion 402a, causing the leaf spring portion 402a to approach the first card 501.

[0042] FIG. 8 is an explanatory diagram of the card cover 301 when the card cover 301 is fully slid. FIG. 8(a) is a cross-sectional view of line DD in FIG. 5 when the card cover 301 is fully slid. FIG. 8(b) is an enlarged view of the rectangular frame G indicated by the dotted line in FIG. 8(a). The protrusion 301a presses the free end B of the leaf spring 402a in the +Z direction via the second cushion material 405 on the leaf spring 402a. The leaf spring 402a biases the first cushion material 403 below the leaf spring 402a in the +Z direction. The first heat dissipation member 404 is biased in the +Z direction by the first cushion material 403 below the leaf spring 402a and comes into surface contact with the top surface 501a of the first card 501. This allows heat to be transferred from the first card 501 to the first heat dissipation member 404. Here, it is desirable that the position where first heat dissipation member 404 comes into contact with top surface 501a be close to a heat source (not shown) inside first card 501. In this embodiment, it is assumed that the position where first heat dissipation member 404 comes into contact with top surface 501a is directly above in the -Z direction at least a part of the heat source (not shown) inside first card 501.

[0043] The sliding distance S of the card cover 301 may vary depending on the tolerances of peripheral components and the state of the product. Therefore, the first heat dissipation member 404 does not necessarily come into contact with the top surface 501a of the first card 501 in a parallel state. In this embodiment, the first heat dissipation member 404 is biased in the +Z direction by the first cushion material 403, so that even if the sliding distance S varies, the first heat dissipation member 404 can be reliably brought into surface contact with the top surface 501a of the first card 501. Therefore, it is desirable that the first cushion material 403, the first heat dissipation member 404, and the second cushion material 405 have a lower elastic modulus than the leaf spring portion 402a and the top surface 501a of the first card 501.

[0044] The first card 501 is biased in the +Z direction by the first cushioning material 403, and therefore a load is applied in the +Z direction. Therefore, if the slide amount S of the card cover 301 varies, the load on the first card 501 also varies. For example, if the slide amount S increases due to variation, the biasing amount of the first cushioning material 403 increases, thereby increasing the load on the first card 501. In this embodiment, when the card cover 301 is slid and pressed in the +Z direction, the plate spring portion 402a moves in a circular motion with the fixed end C side as the center and the free end B side in the +Z direction. In other words, even if the slide amount S of the card cover 301 varies, the displacement of the plate spring portion 402a does not vary on the fixed end C side, but only on the free end B side. The first card 501 is provided with a communication terminal 501b that is located near the fixed end C of the plate spring portion 402a and electrically connected to the main circuit board 201. Therefore, the load applied to the fixed end C side of the first card 501 does not fluctuate, and the load applied to the communication terminal 501b of the first card 501 does not fluctuate either, so that a stable terminal connection can be achieved.

[0045] Here, the reason why the widths of the leaf spring portion 402a, the first cushion material 403, and the first heat dissipation member 404 in the Y direction are increased toward the +X direction, as described above, will be explained. Generally, to improve heat dissipation efficiency through thermal conduction, it is desirable to have a larger contact area of ​​the first heat dissipation member 404. However, increasing the width and area of ​​the leaf spring portion 402a or the first cushion material 403 increases the load in the +Z direction on the first card 501. As described above, the load in the +Z direction on the fixed end C side does not fluctuate, so the load is not larger than that on the free end B side. Utilizing this characteristic, the width in the Y direction is increased from the free end B side toward the fixed end C side so that the width in the Y direction on the fixed end C side is wider than the width in the Y direction on the free end B side. This makes it possible to increase the contact area of ​​the first heat dissipation member 404 while adjusting the load in the +Z direction on the entire first card 501.

[0046] As mentioned above, the size of plate spring portion 402a and first cushion material 403 tends to affect the load in the +Z direction applied to first card 501. Therefore, it is effective to configure at least plate spring portion 402a and first cushion material 403 so that their width in the Y direction increases as they approach the +X direction. Furthermore, if first cushion material 403 is not used, it is sufficient to configure at least plate spring portion 402a so that their width in the Y direction increases as they approach the +X direction.

[0047] Furthermore, when the width of the leaf spring portion 402a in the Y direction on the free end B side is A and the width of the leaf spring portion 402a in the Y direction on the fixed end C side is B, it is preferable that the following conditional expression be satisfied.

[0048] 1.1≦B / A≦2.0 Furthermore, it is more preferable that the numerical range of the conditional expression is set to the following numerical range.

[0049] 1.2≦B / A≦1.9 The operation from the open state to the closed state of card cover 301 (herein expressed as (i)) has been described above with reference to FIGS.

[0050] Next, the operation of moving the card cover 301 from the closed state to the open state (herein referred to as (ii)) will be described.

[0051] From the state shown in FIG. 8, card cover 301 is slid in the −Z direction. At this time, protrusion 301a of card cover 301 moves away from leaf spring 402a in the −Z direction, reducing the biasing force of first cushion 403. Free end B of leaf spring 402a moves in the −Z direction due to the repulsive force of leaf spring 402a. If the repulsive force of leaf spring 402a is weak and free end B of leaf spring 402a does not move in the −Z direction, a third cushion (third elastic portion) (not shown) may be disposed between free end B of leaf spring 402a and first card 501 to increase the repulsive force toward the rear of the main body. When the state shown in FIG. 7 is reached, first heat dissipation member 404 moves away from first card 501, and second cushion 405 on leaf spring 402a also begins to move away from protrusion 301a of card cover 301. 6, the second cushion material 405 on the leaf spring portion 402a and the protrusion portion 301a of the card cover 301 are completely separated, and the leaf spring portion 402a returns to its natural state. As described above, the operation in (ii) is also the same as in (i), except that the operations are performed in the order of Figures 8, 7, and 6.

[0052] As described above, in this embodiment, when the card cover 301 is in the open state in FIG. 6, the first heat dissipation member 404 is not in surface contact with the top surface 501a of the first card 501. Only when the card cover 301 is in the closed state in FIG. 8 can the first heat dissipation member 404 be in surface contact with the top surface 501a of the first card 501, thereby dissipating heat. An advantage is that the first card 501 is directly dissipated in conjunction with the action of sliding the card cover 301 to close, so the user does not need to perform any additional operations. Furthermore, because a complex mechanism such as a cam mechanism is not required, the first card 501 can be directly dissipated heat in a space-saving manner. <Second embodiment> In the first embodiment, the first card slot 401 is provided with a plurality of notches, which form the leaf spring portion 402a that moves parallel to the Z direction. As described above, the leaf spring portion 402a is provided integrally with the first card slot 401, but the leaf spring portion 402a does not necessarily have to be integral and can also be a separate component. In this embodiment, a heat dissipation configuration for the first card 501 when the first card slot 401 and the leaf spring portion 402a are separate will be described. Note that in this embodiment, only changes from the first embodiment will be described.

[0053] The following describes the configuration around the first card slot 401 of this embodiment. FIG. 9 is an exploded perspective rear view of the interior of the imaging device 100. FIG. 10 is an enlarged rear view of the periphery of the first card slot 401. An opening 401d is provided in the center of the first card slot 401 (directly above the surface of the first card 501). A first elastic member 406 is disposed directly above the first card slot 401 in the -Z direction. The first elastic member 406 includes a leaf spring portion (first elastic portion) 406a directly above the opening 401d of the first card slot 401 in the -Z direction, and the leaf spring portion 406a can advance and retreat inside the opening 401d in parallel with the Z direction. The first elastic member 406 is mechanically fastened to the main circuit board 201 together with the first card slot 401. The leaf spring portion 406a has a free end B on the -X direction side and a fixed end C on the +X direction side. A first cushion material 403 is disposed directly below the leaf spring portion 406a in the +Z direction. A first heat dissipation member 404 is attached directly below the first cushion material 403 in the +Z direction. In this embodiment, the first heat dissipation member 404 is exposed in the -Z direction from the opening 401d, passes between the first card slot 401 and the first elastic member 406, and is thermally connected to a metal plate or an exterior member (not shown). As described with reference to FIG. 5 of the first embodiment, the first heat dissipation member 404 may be exposed from the opening 401c of the first card slot 401, passes between the first card slot 401 and the first elastic member 406, and is thermally connected to a metal plate or an exterior member (not shown).

[0054] The heat dissipation configuration of the first card 501 of this embodiment will be described below. FIG. 11 is an explanatory diagram of the card cover 301 when the card cover 301 has been completely slid. FIG. 11(a) is a cross-sectional view of the card cover 301 taken along line HH in FIG. 10 when the card cover 301 has been completely slid. FIG. 11(b) is an enlarged view of the area within the rectangular frame I indicated by the dotted line in FIG. 11(a). The card cover 301 is disposed directly above the free end B of the leaf spring 406a and includes a protrusion 301a extending in the +Z direction. A second cushion material 405 is provided directly above the free end B of the leaf spring 406a. In the state shown in FIG. 11, the protrusion 301a and the second cushion material 405 on the leaf spring 406a are in contact. The first heat dissipation member 404, disposed via the first cushion material 403, is in surface contact with the top surface 501a of the first card 501. 11, heat is transferred from first card 501 to first heat dissipation member 404. As described above, the present embodiment differs from the first embodiment only in that first card slot 401 and leaf spring portion 406a are configured as separate parts, and the other configurations remain unchanged.

[0055] It is desirable that the first cushion material 403, the first heat dissipation member 404, and the second cushion material 405 have a lower elastic modulus than the leaf spring portion 406a of the first elastic member 406 and the top surface 501a of the first card 501. Furthermore, for the same reason as in the first embodiment, the leaf spring portion 406a of the first elastic member 406, the first cushion material 403, and the first heat dissipation member 404 have widths in the Y direction that increase from the free end B side toward the fixed end C side.

[0056] In this embodiment, the first card slot 401 and the first elastic member 406 constituting the leaf spring portion 406a are separate parts, resulting in a large number of parts. However, by making them separate parts, it is possible to move the fixed end C of the leaf spring portion 406a in the -Z direction. Therefore, in this embodiment, the space from the first card 501 to the leaf spring portion 406a can be set more freely than in the first embodiment, without depending on the position of the first card slot 401. <Third embodiment> In this embodiment, only the changes from the first embodiment will be described. In the first and second embodiments, a sheet-like heat dissipation member including a graphite sheet is used as the first heat dissipation member 404, but it does not necessarily have to be a sheet-like heat dissipation member, and it can also be configured with other parts.

[0057] The following describes the configuration around the first card slot 401 of this embodiment. FIG. 12 is an exploded perspective rear view of the interior of the imaging device 100. FIG. 13 is an enlarged rear view of the area around the first card slot 401. The first card slot 401 includes a plate spring 402a, which includes a free end B on the −X direction side and a fixed end C on the +X direction side. A second heat dissipation member (heat dissipation member) 407 is attached directly below the plate spring 402a in the +Z direction. The second heat dissipation member 407 is assumed to be a cushion-like member with high thermal conductivity, such as heat dissipation rubber. A third heat dissipation member 408 is attached to the plate spring 402a, and the third heat dissipation member 408 is thermally connected to a metal plate or exterior member (not shown). The third heat dissipation member 408 is assumed to be a graphite sheet, but may be other sheet-like heat dissipation members, such as copper foil.

[0058] The heat dissipation configuration of the first card 501 of this embodiment will be described below. FIG. 14 is an explanatory diagram of the card cover 301 when the card cover 301 has been completely slid. FIG. 14(a) is a cross-sectional view of the card cover 301 taken along line JJ in FIG. 13 when the card cover 301 has been completely slid. FIG. 14(b) is an enlarged view of the area within the rectangular frame K indicated by the dotted line in FIG. 14(a). The card cover 301 is disposed directly above the free end B of the leaf spring portion 402a and includes a protrusion 301a extending in the +Z direction. A second cushion material 405 is provided directly above the free end B of the leaf spring portion 402a. In the state shown in FIG. 14, the protrusion 301a and the second cushion material 405 on the leaf spring portion 402a are in contact. The second heat dissipation member 407 is in surface contact with the top surface 501a of the first card 501. 14, heat is transferred from the first card 501 to the second heat dissipation member 407. The configuration of this embodiment differs from that of the first embodiment only in that the first cushion material 403 and the first heat dissipation member 404 are not used, but the second heat dissipation member 407 is used instead, and the other configurations remain the same.

[0059] In the state (ii) not shown, if the repulsive force of the leaf spring portion 402a is weak and the free end B of the leaf spring portion 402a does not move toward the rear of the main body, a third cushioning material not shown can be placed between the free end B of the leaf spring portion 402a and the first card 501. This increases the repulsive force in the -Z direction. In addition, if the second heat dissipation member 407 has an adhesive layer and is adhered to the top surface 501a of the first card 501, a sheet member not shown can be attached between the second heat dissipation member 407 and the first card 501. The second heat dissipation member 407 is thermally connected to the first card slot 401 via the leaf spring portion 402a.

[0060] It is desirable that the second heat dissipation member 407, the third heat dissipation member 408, and the second cushion material 405 have a lower modulus of elasticity than the leaf spring portion 402a of the first card slot 401 and the top surface 501a of the first card 501. Furthermore, for the same reasons as in the first embodiment, the second heat dissipation member 407, the third heat dissipation member 408, and the leaf spring portion 402a of the first card slot 401 increase in width in the Y direction from the free end B side toward the fixed end C side.

[0061] As described above, in this embodiment, the heat of the first card 501 is dissipated to the plate spring portion 402a via the second heat dissipation member 407, and further dissipated to a metal plate or exterior member (not shown) via the third heat dissipation member 408. <Fourth embodiment> In this embodiment, only the changes from the first to third embodiments will be described. In the first to third embodiments, a heat dissipation structure that directly dissipates heat from the media using heat dissipation components while reducing the number of components has been described as a method for dissipating heat from a heat-generating medium in an imaging device consisting of an imaging device 100 and an interchangeable lens (not shown). However, it does not necessarily have to be an imaging device, and it can also be configured with other electronic devices.

[0062] The configuration of electronic device 600 of this embodiment will be described below with reference to FIG. 15. FIG. 15 is a perspective view of electronic device 600 of this embodiment. FIGS. 15(a) and 15(b) are a front perspective view and a rear perspective view of electronic device 600, respectively. The housing of electronic device 600 is composed of a front cover 601 and a rear cover 602. A display unit 603 is provided on front cover 601. A card cover 604 is provided on rear cover 602. FIG. 15 shows the state in which card cover 604 is closed, and a medium (not shown) is installed inside the housing of card cover 604. The medium is assumed to be an SD card, a microSD card, or the like, but other media may be used. Note that electronic device 600 is assumed to be a game console, a photo frame, or the like, but may be other electronic devices.

[0063] As described above, in the electronic device 600 of this embodiment, the number of components can be reduced by using the configurations described in the first to third embodiments, and the heat dissipation components can be used to directly dissipate heat from the media.

[0064] The disclosure of this embodiment includes the following configuration. (Configuration 1) an opening into which a storage medium for storing information can be inserted and removed; a moving unit that is movable between an open position that opens the opening and a closed position that closes the opening; a first elastic portion having a first end on an insertion side in an insertion / removal direction of the storage medium that moves in response to movement of the moving portion and a second end opposite to the first end that is fixed; a heat dissipation portion disposed between the first elastic member and the storage medium and moving in response to movement of the first end, the heat dissipation unit is in contact with the storage medium when the moving unit is located at the open position, and is separated from the storage medium when the moving unit is located at the closed position; An electronic device characterized in that the width of the first elastic part in a direction perpendicular to the movement direction of the moving part and the insertion / removal direction is wider on the side of the second end than on the side of the first end. (Configuration 2) 2. The electronic device according to configuration 1, wherein the heat dissipation portion has a lower elastic modulus than the first elastic portion. (Configuration 3) 3. The electronic device according to configuration 1 or 2, wherein the heat dissipation section has a lower modulus of elasticity than an exterior of the storage medium. (Configuration 4) 4. The electronic device according to any one of configurations 1 to 3, wherein the moving part is a cover member that protects the storage medium. (Configuration 5) 5. The electronic device according to any one of configurations 1 to 4, wherein the moving unit includes a protrusion that protrudes in a direction perpendicular to a surface of the storage medium. (Configuration 6) 6. The electronic device according to any one of configurations 1 to 5, further comprising a second elastic portion disposed between the first elastic portion and the first heat dissipation portion. (Configuration 7) The electronic device described in configuration 6, characterized in that the width of the second elastic part in a direction perpendicular to the movement direction and the insertion / removal direction is wider on the side of the second end than on the side of the first end. (Configuration 8) 7. The electronic device according to configuration 6, wherein the second elastic portion has a lower elastic modulus than the first elastic portion. (Configuration 9) 9. The electronic device according to any one of configurations 1 to 8, wherein the heat dissipation unit is in contact with a surface of the storage medium that corresponds to at least a part of a heat source. (Configuration 10) 10. The electronic device according to any one of configurations 1 to 9, further comprising a third elastic portion disposed between the first elastic portion and the storage medium. (Configuration 11) An electronic device described in any one of configurations 1 to 10, characterized in that the width of the heat dissipation part in a direction perpendicular to the movement direction of the moving part and the insertion / removal direction is wider on the side of the second end than on the side of the first end. (Configuration 12) further comprising a holding unit for holding the storage medium; 12. The electronic device according to any one of configurations 1 to 11, wherein the first elastic portion is formed on the holding portion. (Configuration 13) further comprising a holding unit for holding the storage medium; 13. The electronic device according to any one of configurations 1 to 12, wherein the first elastic portion is fixed to the holding portion. (Configuration 14) 14. The electronic device according to configuration 13, wherein the holding portion has an opening formed immediately above the surface of the storage medium. (Configuration 15) 15. The electronic device according to configuration 14, wherein the first elastic portion moves in and out of the opening in a direction perpendicular to the surface of the storage medium. (Configuration 16) When the width of the first elastic portion on the side of the first end in a direction perpendicular to the movement direction and the insertion / removal direction is A, and the width of the first elastic portion on the side of the second end in a direction perpendicular to the movement direction and the insertion / removal direction is B, 1.1≦B / A≦2.0 16. The electronic device according to any one of configurations 1 to 15, wherein the following conditional expression is satisfied:

[0065] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention. [Explanation of symbols]

[0066] 100 Imaging device (electronic device) 301 Card cover (movable part) 402a, 406a: Leaf spring portion (first elastic portion) 404, 407 First heat dissipation member (heat dissipation part) 501 First card (storage medium) 600 Electronic equipment

Claims

1. an opening into which a storage medium for storing information can be inserted and removed; a moving unit that is movable between an open position that opens the opening and a closed position that closes the opening; a first elastic portion having a first end on an insertion side in an insertion / removal direction of the storage medium that moves in response to movement of the moving portion and a second end opposite to the first end that is fixed; a heat dissipation portion disposed between the first elastic member and the storage medium and moving in response to movement of the first end, the heat dissipation unit is in contact with the storage medium when the moving unit is located at the open position, and is separated from the storage medium when the moving unit is located at the closed position; An electronic device characterized in that the width of the first elastic part in a direction perpendicular to the movement direction of the moving part and the insertion / removal direction is wider on the side of the second end than on the side of the first end.

2. The electronic device according to claim 1 , wherein the heat dissipation portion has a lower elastic modulus than the first elastic portion.

3. 3. The electronic device according to claim 1, wherein the heat dissipation section has a lower modulus of elasticity than an exterior of the storage medium.

4. 3. The electronic device according to claim 1, wherein the moving part is a cover member that protects the storage medium.

5. 3. The electronic device according to claim 1, wherein the moving portion includes a protrusion that protrudes in a direction perpendicular to a surface of the storage medium.

6. 3. The electronic device according to claim 1, further comprising a second elastic portion disposed between the first elastic portion and the first heat dissipation portion.

7. 7. The electronic device according to claim 6, wherein the width of the second elastic portion in a direction perpendicular to the movement direction and the insertion / removal direction is wider on the second end side than on the first end side.

8. The electronic device according to claim 4 , wherein the second elastic portion has a modulus of elasticity smaller than that of the first elastic portion.

9. 3. The electronic device according to claim 1, wherein the heat dissipation portion is in contact with a surface of the storage medium that corresponds to at least a part of a heat source of the storage medium.

10. 3. The electronic device according to claim 1, further comprising a third elastic portion disposed between the first elastic portion and the storage medium.

11. 3. The electronic device according to claim 1, wherein the width of the heat dissipation section in a direction perpendicular to the movement direction of the moving section and the insertion / removal direction is wider on the second end side than on the first end side.

12. further comprising a holding unit for holding the storage medium; 3. The electronic device according to claim 1, wherein the first elastic portion is formed on the holding portion.

13. further comprising a holding unit for holding the storage medium; 3. The electronic device according to claim 1, wherein the first elastic portion is fixed to the holding portion.

14. 14. The electronic device according to claim 13, wherein the holding portion has an opening formed immediately above a surface of the storage medium.

15. 15. The electronic device according to claim 14, wherein the first elastic portion moves forward and backward within the opening in a direction perpendicular to a surface of the storage medium.

16. 3. The electronic device according to claim 1, further comprising a second elastic portion disposed between the first elastic portion and the first heat dissipation portion.

17. When the width of the first elastic portion on the side of the first end in a direction perpendicular to the movement direction and the insertion / removal direction is A, and the width of the first elastic portion on the side of the second end in a direction perpendicular to the movement direction and the insertion / removal direction is B, 1.1≦B / A≦2.0 3. The electronic device according to claim 1, wherein the following condition is satisfied:

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