Spatter adhesion suppressing device for laser processing machine, laser processing machine, and laser processing method

Abstract

To provide a spatter adhesion suppressing device of a laser beam machine, a laser beam machine, and a laser beam machining method, capable of effectively suppressing adhesion of spatter to an inner surface of a pipe while suppressing deposition of spatter on a spatter guard when performing laser beam machining of a pipe-shaped workpiece.SOLUTION: A spatter adhesion suppressing device of a laser beam machine includes a spatter guard inserted into a pipe and having a distal end portion that receives spatters generated due to irradiation of the pipe with a laser beam, an injection unit that injects a fluid to the distal end portion of the spatter guard, and a discharge device that discharges a spatter adhesion inhibitor to the distal end portion of the spatter guard and an inner surface of the pipe.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a spatter adhesion suppression device for a laser processing machine, a laser processing machine, and a laser processing method. [Background technology]

[0002] 2. Description of the Related Art There is a known technique for preventing molten metal chips from adhering to the inner surface of a pipe when the pipe-shaped workpiece is laser-machined.

[0003] As a related technique, Patent Document 1 discloses a molten metal scrap removal mechanism for a laser processing device. The molten metal scrap removal mechanism described in Patent Document 1 includes a receiving member that is inserted into a pipe-shaped workpiece. The receiving member receives the molten metal scrap when the pipe is cut. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] CD-ROM of Japanese Utility Model Application No. 3-88410 (Japanese Utility Model Application No. 5-39783) Summary of the Invention [Problem to be solved by the invention]

[0005] The object of the present invention is to provide a sputter adhesion suppression device for a laser processing machine, a laser processing machine, and a laser processing method that can effectively suppress the adhesion of spatter to the inner surface of a pipe while suppressing the accumulation of spatter on a spatter guard when laser processing a pipe-shaped workpiece. [Means for solving the problem]

[0006] Embodiments of the present invention relate to a spatter adhesion suppression device for a laser processing machine, a laser processing machine, and a laser processing method, which will be described below.

[0007] (1) a sputter guard that is inserted into a pipe and has a tip that receives sputters generated by irradiating the pipe with a laser; an injection unit that injects a fluid onto the tip end of the spatter guard; a discharge device that discharges a spatter adhesion preventive agent onto the tip of the spatter guard and the inner surface of the pipe; Equipped with A device for suppressing spatter adhesion in laser processing machines. (2) The discharge device includes a first flow path that supplies a mixed fluid containing a gas and the sputter adhesion preventive agent to the injection part, The discharge device is capable of discharging the mixed fluid from the injection portion onto the inner surface of the pipe. The spatter adhesion suppression device for a laser processing machine according to (1) above. (3) The ejection device is capable of adjusting the proportion of the sputter adhesion preventive agent in the mixed fluid ejected from the ejection unit. The spatter adhesion suppression device for a laser processing machine according to (2) above. (4) The discharge device includes a second flow path that supplies the gas to the ejection part. The spatter adhesion suppression device for a laser processing machine according to (2) or (3) above. (5) The discharge device is a first on-off valve that opens and closes the first flow path; a second on-off valve that opens and closes the second flow path; Equipped with The spatter adhesion suppression device for a laser processing machine according to (4) above. (6) The discharge device is capable of discharging the mixed fluid onto the inner surface of the pipe while the injection portion is positioned outside the pipe. The spatter adhesion suppression device for a laser processing machine according to any one of (2) to (5) above. (7) The discharge device is a gas supply mode in which only gas is supplied to the injection portion; a mixed fluid supply mode in which a mixed fluid containing the gas and the sputter adhesion preventive agent is supplied to the injection part; can be selectively executed The spatter adhesion suppression device for a laser processing machine according to (1) above. (8) The discharge device includes a lubricator that mixes the spatter adhesion preventive agent into the gas. The spatter adhesion suppression device for a laser processing machine according to any one of (2) to (7) above. (9) The ejection unit is disposed on the spatter guard. The spatter adhesion suppression device for a laser processing machine according to any one of (1) to (8) above. (10) The tip portion has a bottom wall, a first side wall, and a second side wall opposite to the first side wall, When a direction from a base end of the spatter guard toward a tip end of the spatter guard is defined as a first direction, an elongated space extending in the first direction is defined by the bottom wall, the first side wall, and the second side wall, The ejection unit ejects the fluid into the elongated space. The spatter adhesion suppression device for a laser processing machine according to any one of (1) to (9) above. (11) A support device for supporting the pipe; a rotation drive device that rotates the pipe around a first axis; a laser irradiation device having a laser head that irradiates the pipe with a laser; a moving device that moves the laser head relative to the pipe; a spatter adhesion suppression device; a control device that controls the rotation drive device, the laser irradiation device, the moving device, and the sputter adhesion suppression device; Equipped with The spatter adhesion suppression device is a sputter guard inserted into the pipe from a first end thereof and having a tip portion for receiving sputters generated due to irradiation of the pipe with the laser; a sputter guard moving device that moves the sputter guard; an injection unit that injects a fluid onto the tip end of the spatter guard; a discharge device that discharges a spatter adhesion preventive agent onto the tip of the spatter guard and the inner surface of the pipe; Equipped with Laser processing machine. (12) A suction device is provided to suck the spatter so that the spatter is discharged from the internal space of the pipe to the outside of the pipe through the second end of the pipe. The laser processing machine according to (11) above. (13) The control device a spatter adhesion prevention agent discharge mode; The first processing mode and is executable, the sputter adhesion preventive agent discharge mode includes transmitting a control command from the control device to at least the sputter adhesion suppression device so that the sputter adhesion preventive agent is discharged onto the tip portion of the sputter guard and the inner surface of the pipe; The first processing mode includes transmitting a control command from the control device to at least the laser irradiation device and the spatter adhesion suppression device so that the laser head irradiates the pipe with the laser and the spatter is blown off from the tip of the spatter guard onto the inner surface of the pipe. The laser processing machine according to (11) or (12) above. (14) a step of discharging a spatter adhesion preventive agent onto the tip of the spatter guard and the inner surface of the pipe; irradiating the pipe with a laser while the tip of the spatter guard is inserted into the pipe; a step of blowing spatter generated by irradiating the pipe with the laser from the tip of the spatter guard onto the inner surface of the pipe; Equipped with The step of blowing away the spatter is performed by injecting a fluid from an injection portion of the spatter guard onto the tip of the spatter guard. Laser processing method. (15) The step of discharging the sputter adhesion preventive agent includes rotating the pipe around a central axis in a longitudinal direction of the pipe while the sputter adhesion preventive agent is being discharged. The laser processing method according to (14) above. [Effects of the Invention]

[0008] The present invention provides a sputter adhesion suppression device for a laser processing machine, a laser processing machine, and a laser processing method that can effectively suppress spatter adhesion to the inner surface of a pipe while suppressing the accumulation of spatter on the spatter guard when laser processing a pipe-shaped workpiece. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic cross-sectional view showing a state in which a discharge device discharges a spatter adhesion preventive agent onto the tip of a spatter guard and the inner surface of a pipe. [Figure 2] FIG. 2 is a schematic cross-sectional view showing how spatter is blown off from the tip of the spatter guard onto the inner surface of the pipe during laser processing. [Figure 3] FIG. 3 is an enlarged view of the area surrounded by a circle A3 in FIG. [Figure 4] FIG. 4 is a diagram showing a schematic view of the discharge device in the first example discharging the spatter adhesion preventive agent onto the tip of the spatter guard and the inner surface of the pipe. [Figure 5] FIG. 5 is a diagram showing a schematic view of spatter being blown off from the tip of the spatter guard onto the inner surface of the pipe during laser processing. [Figure 6] FIG. 6 is a diagram showing a schematic view of spatter being blown off from the tip of the spatter guard onto the inner surface of the pipe during laser processing. [Figure 7] FIG. 7 is a diagram showing a schematic view of the discharge device in the second example discharging the spatter adhesion preventive agent onto the tip of the spatter guard and the inner surface of the pipe. [Figure 8] FIG. 8 is a diagram showing a schematic view of spatter being blown off from the tip of the spatter guard onto the inner surface of the pipe during laser processing. [Figure 9]FIG. 9 is a schematic cross-sectional view showing a state in which the spatter guard is connected to the connector via the first tube. [Figure 10] FIG. 10 is a schematic cross-sectional view showing a state in which the second spatter guard is connected to the connector via another tube. [Figure 11] FIG. 11 is a schematic perspective view showing the pipe and the spatter guard. [Figure 12] 12 is a cross-sectional view taken along the line A2-A2 in FIG. [Figure 13] FIG. 13 is a schematic perspective view showing the pipe and the spatter guard. [Figure 14] FIG. 14 is a schematic perspective view showing the pipe and the spatter guard. [Figure 15] FIG. 15 is a cross-sectional view taken along the line A1-A1 in FIG. [Figure 16] FIG. 16 is a schematic front view showing the state in which the discharge device discharges the spatter adhesion preventive agent onto the tip of the spatter guard and the inner surface of the pipe. [Figure 17] FIG. 17 is a schematic cross-sectional view showing an ejection section in a modified example. [Figure 18] FIG. 18 is an enlarged view of a portion of FIG. [Figure 19] FIG. 19 is a schematic front view showing how spatter is blown off from the tip of the spatter guard onto the inner surface of the pipe during laser processing. [Figure 20] FIG. 20 is a schematic front view showing how spatter inside the pipe is sucked by a suction device during laser processing. [Figure 21] FIG. 21 is a schematic front view showing how spatter inside the pipe is sucked by a suction device during laser processing. [Figure 22] FIG. 22 is a schematic front view showing the state in which the tip of the spatter guard is cleaned by the cleaning device. [Figure 23]FIG. 23 is a diagram schematically showing a spatter adhesion suppression device for a laser processing machine according to the second embodiment. [Figure 24] FIG. 24 is a diagram schematically showing a spatter adhesion suppression device for a laser processing machine according to the second embodiment. [Figure 25] FIG. 25 is a schematic cross-sectional view showing how spatter is blown off from the tip of the spatter guard onto the inner surface of the pipe during laser processing. [Figure 26] FIG. 26 is a diagram schematically showing a spatter adhesion suppression device for a laser processing machine according to the third embodiment. [Figure 27] FIG. 27 is a diagram schematically showing a spatter adhesion suppression device for a laser beam machine in a first modified example of the third embodiment. [Figure 28] FIG. 28 is a schematic front view showing a laser processing machine according to the fourth embodiment. [Figure 29] FIG. 29 is a schematic cross-sectional view showing a state in which the discharge device discharges the spatter adhesion preventive agent onto the tip of the spatter guard and the inner surface of the pipe. [Figure 30] FIG. 30 is a schematic front view showing a laser processing machine according to the fourth embodiment. [Figure 31] FIG. 31 is a schematic front view showing a laser processing machine according to the fourth embodiment. [Figure 32] FIG. 32 is a diagram showing a schematic diagram of a state in which a control device can control a plurality of control target devices. [Figure 33] FIG. 33 is a flowchart showing an example of a laser processing method according to the fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, a spatter adhesion suppression device 2 for a laser processing machine, a laser processing machine 1, and a laser processing method according to embodiments will be described with reference to the drawings. In the following description of the embodiments, parts and members having the same functions are given the same reference numerals, and repeated descriptions of parts and members given the same reference numerals will be omitted.

[0011] (Definition of terms) In this specification, of the two ends of the pipe P, the end into which the spatter guard 30 is inserted is defined as a first end Pa. Also, of the two ends of the pipe P, the end opposite to the first end Pa is defined as a second end Pb.

[0012] As illustrated in Figure 9, in this specification, the direction from the base end 30d of the sputter guard 30 to the tip 30e of the sputter guard 30 is defined as a first direction DR1, and the direction from the tip 30e of the sputter guard 30 to the base end 30d of the sputter guard 30 is defined as a second direction DR2.

[0013] In this specification, the direction in which the tip 31 of the spatter guard 30 is inserted into the pipe P is defined as the third direction DR3, and the direction opposite to the third direction DR3 is defined as the fourth direction DR4. In the example shown in Figure 16, the third direction DR3 is the same direction as the direction from the first end Pa of the pipe P toward the second end Pb of the pipe P, and the fourth direction DR4 is the same direction as the direction from the second end Pb of the pipe P toward the first end Pa of the pipe P. Also, in the example shown in Figure 16, the third direction DR3 is the same direction as the first direction DR1.

[0014] In this specification, the vertically upward direction is defined as a fifth direction DR5, and the vertically downward direction is defined as a sixth direction DR6.

[0015] (First embodiment) A sputter adhesion suppression device 2A for a laser processing machine according to a first embodiment will be described with reference to FIGS. 1 to 22. FIG. 1 is a schematic cross-sectional view showing a discharge device 3 discharging a sputter adhesion preventive agent C1 onto the tip 31 of a sputter guard 30 and the inner surface Pn of a pipe P. FIG. 2 is a schematic cross-sectional view showing a state in which sputter B is blown from the tip 31 of the sputter guard 30 onto the inner surface Pn of the pipe P during laser processing. FIG. 3 is an enlarged view of the area surrounded by a circle A3 in FIG. 2. FIG. 4 is a diagram showing a state in which a discharge device 3 according to a first example discharges a sputter adhesion preventive agent C1 onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P. FIGS. 5 and 6 are diagrams showing a state in which sputter B is blown from the tip 31 of the sputter guard 30 onto the inner surface Pn of the pipe P during laser processing. FIG. 7 is a diagram illustrating a first example of a discharge device 3 discharging a sputter adhesion inhibitor C1 onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P. FIG. 8 is a diagram illustrating a state in which sputter B is blown off from the tip 31 of the sputter guard 30 onto the inner surface Pn of the pipe P during laser processing. FIG. 9 is a cross-sectional view illustrating a state in which the sputter guard 30 is connected to a connector 48 via a first tube 47a. FIG. 10 is a cross-sectional view illustrating a state in which a second sputter guard 30-2 is connected to a connector 48 via another tube 47a-2. FIG. 11 is a perspective view illustrating a pipe P and the sputter guard 30. FIG. 12 is a cross-sectional view taken along the line A2-A2 in FIG. 2. FIGS. 13 and 14 are perspective views illustrating a pipe P and the sputter guard 30. FIG. 15 is a cross-sectional view taken along the line A1-A1 in FIG. 1. Fig. 16 is a schematic front view showing the state in which the discharge device 3 discharges the spatter adhesion preventive agent C1 onto the tip 31 of the spatter guard 30 and the inner surface Pn of the pipe P. Fig. 17 is a schematic cross-sectional view showing the spray unit 36 ​​in a modified example. Fig. 18 is an enlarged view of a portion of Fig. 16. Fig. 19 is a schematic front view showing the state in which spatter B is blown off from the tip 31 of the spatter guard 30 onto the inner surface Pn of the pipe P during laser processing.20 and 21 are schematic front views showing how spatter in pipe P is sucked by suction device 55 during laser processing. Fig. 22 is a schematic front view showing how tip 31 of spatter guard 30 is cleaned by cleaning device 57. In Figs. 2, 3, 5, 6, 8, and 19, the state in which fluid D is being sprayed from spraying portion 36 is shown by multiple radial dashed lines.

[0016] As shown in FIG. 1, the spatter adhesion suppression device 2A for a laser processing machine includes a spatter guard 30, an ejection unit 36, and a discharge device 3.

[0017] As illustrated in Fig. 2, the sputter guard 30 has a tip 31 that is inserted into the pipe P. In the example illustrated in Fig. 2, the tip 31 of the sputter guard 30 receives sputter B that is generated due to the irradiation of the pipe P with the laser LB. The sputter B is a metal chunk that is generated from the pipe P due to the irradiation of the pipe P with the laser LB. In the example illustrated in Fig. 2, the sputter guard 30 receives the sputter B (for example, molten sputter B) and thereby prevents the sputter B (for example, molten sputter B) from adhering to the inner surface Pn of the pipe P.

[0018] In this specification, the cross-sectional shape of the pipe P in a plane perpendicular to the longitudinal direction of the pipe P may be circular, rectangular (for example, approximately square or approximately rectangular), or other shapes. In other words, the pipe P to be processed by the laser LB (in other words, the pipe P that is the workpiece) may be a circular pipe, a rectangular pipe, or other pipe.

[0019] 2, the tip 31 of the sputter guard 30 is inserted into the pipe P. In the example shown in FIG. 3, the tip 31 of the sputter guard 30 is disposed on the axis of the laser LB emitted from the laser head 71 (in other words, on the optical axis of the laser LB). Therefore, the tip 31 of the sputter guard 30 effectively prevents sputter B generated by laser irradiation of the pipe P from adhering to the inner surface Pn of the pipe P (see FIG. 2).

[0020] As illustrated in Fig. 2, the injector 36 injects fluid D onto the tip 31 of the spatter guard 30. More specifically, the injector 36 injects fluid D onto the tip 31 of the spatter guard 30 so that spatter B is blown off from the tip 31 of the spatter guard 30 onto the inner surface Pn of the pipe P. Fluid D is a blowing fluid that blows off spatter B. Fluid D (in other words, the blowing fluid) may or may not contain a spatter adhesion preventive agent C1.

[0021] In the example shown in FIG. 1 , the discharge device 3 discharges the sputter adhesion preventive agent C1 onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P. As illustrated in FIG. 1 , the discharge device 3 that discharges the sputter adhesion preventive agent C1 onto the tip 31 of the sputter guard 30 and the discharge device that discharges the sputter adhesion preventive agent C1 onto the inner surface Pn of the pipe P may be the same device. Alternatively, the discharge device that discharges the sputter adhesion preventive agent onto the tip 31 of the sputter guard 30 may be a different device from the discharge device that discharges the sputter adhesion preventive agent onto the inner surface Pn of the pipe P. The components of the sputter adhesion preventive agent C1 discharged onto the tip 31 of the sputter guard 30 may be the same as the components of the sputter adhesion preventive agent C1 discharged onto the inner surface Pn of the pipe P. Alternatively, the components of the sputter adhesion preventive agent C1 discharged onto the tip 31 of the sputter guard 30 may be different from the components of the sputter adhesion preventive agent discharged onto the inner surface Pn of the pipe P.

[0022] The spatter adhesion suppression device 2A for a laser processing machine in the first embodiment includes a spatter guard 30 having a tip 31 that is inserted into a pipe P (see FIG. 2). The tip 31 of the spatter guard 30 prevents spatter B that scatters from the pipe P during laser processing from adhering to the inner surface Pn of the pipe P.

[0023] The sputter adhesion suppression device 2A for a laser processing machine in the first embodiment includes an injection unit 36 ​​that injects fluid D (in other words, a blowing fluid) onto the tip 31 of the sputter guard 30 (see FIG. 2). The fluid D injected onto the tip 31 of the sputter guard 30 blows sputter B away from the tip 31. In this way, the accumulation of sputter B on the tip 31 of the sputter guard 30 is suppressed. This prevents the tip 31 from being unable to adequately catch sputter B due to the accumulation of sputter B on the tip 31 of the sputter guard 30. Furthermore, this prevents a decrease in the effectiveness of the sputter guard 30 in preventing sputter B from adhering to the inner surface Pn of the pipe P due to the tip 31 being unable to adequately catch sputter B.

[0024] 2, the sputter guard 30 receives the sputter B at the tip 31. Therefore, the distance between the received sputter B and the tip 30e of the sputter guard 30 is not large. Therefore, the fluid D injected from the injection part 36 can easily blow the sputter B out of the sputter guard 30.

[0025] The sputter adhesion suppression device 2A for a laser processing machine in the first embodiment includes a discharge device 3 that discharges a sputter adhesion preventive agent C1 onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P (see FIG. 1).

[0026] Because the spatter adhesion preventive agent C1 is discharged onto the tip 31 of the spatter guard 30, spatter B scattered from the pipe P during laser processing is prevented from adhering to the tip 31 of the spatter guard 30. More specifically, although the spatter B scattered from the pipe P is received by the tip 31 of the spatter guard 30, the spatter adhesion preventive agent C1 prevents the spatter B from adhering to the tip 31 due to this reception. Because the adhesion of spatter B to the tip 31 of the spatter guard 30 is prevented, the spatter B can be easily blown away from the tip 31 of the spatter guard 30 to the outside of the spatter guard 30 using the fluid D sprayed from the spraying portion 36.

[0027] 2, the spatter adhesion preventive agent C1 is applied to the inner surface Pn of the pipe P, and therefore spatter B blown off from the tip portion 31 of the spatter guard 30 onto the inner surface Pn of the pipe P is prevented from adhering to the inner surface Pn of the pipe P. More specifically, although the spatter B blown off from the tip portion 31 of the spatter guard 30 is received by the inner surface Pn of the pipe P, the spatter B is prevented from adhering to the inner surface Pn due to this reception by the spatter adhesion preventive agent C1.

[0028] Because the sputter guard 30 is a component that prevents spatter B from reaching the inner surface Pn of the pipe P, conventionally, the spatter B is not blown off from the sputter guard 30 onto the inner surface Pn of the pipe P. In this case, although adhesion of spatter B to the inner surface Pn of the pipe is prevented, accumulation of spatter B on the sputter guard 30 is unavoidable. In the example shown in FIGS. 1 and 2 , a spatter adhesion preventive agent C1 is ejected onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P, and spatter B is blown off from the tip 31 of the sputter guard 30 onto the inner surface Pn of the pipe P. In this way, both the accumulation of spatter B on the sputter guard 30 and the adhesion of spatter B to the inner surface Pn of the pipe P are suppressed.

[0029] (Optional configuration) Next, with reference to Figures 1 to 22, optional additional configurations that can be adopted in the first embodiment (or the second embodiment, the third embodiment, the fourth embodiment, or the fifth embodiment) will be described below.

[0030] (Spatter prevention agent C1) In this specification, the spatter adhesion preventive agent C1 is, for example, oil. The spatter adhesion preventive agent C1 may be discharged in the form of oil-air onto the tip 31 of the spatter guard 30 and the inner surface Pn of the pipe P. In oil-air, the oil is carried by air. In other words, in oil-air, the air functions as a carrier fluid that carries the oil. When the spatter adhesion preventive agent C1 is oil, the spatter adhesion preventive agent C1 can be procured at low cost. In addition, the spatter adhesion preventive agent C1 is easy to handle. When the spatter adhesion preventive agent C1 is discharged in the form of oil-air onto the tip 31 of the spatter guard 30 and the inner surface Pn of the pipe P, it is easy to apply the oil over a wide area of ​​the tip 31 of the spatter guard 30 and the inner surface Pn of the pipe P.

[0031] Any known sputter adhesion preventive agent C1 may be used as the sputter adhesion preventive agent C1 dispensed onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P. The sputter adhesion preventive agent C1 may be a water-soluble sputter adhesion preventive agent (e.g., an aqueous solution-type sputter adhesion preventive agent containing a water-soluble resin, a water-soluble polymer, an alcohol, and / or a surfactant). The sputter adhesion preventive agent C1 may be a water-insoluble sputter adhesion preventive agent (e.g., an oil-based sputter adhesion preventive agent). The oil-based sputter adhesion preventive agent may contain an organic solvent and a substance soluble in the organic solvent. In this specification, the sputter adhesion preventive agent C1 may be a liquid sputter adhesion preventive agent or a powder-based sputter adhesion preventive agent. The liquid sputter adhesion preventive agent C1 may or may not contain powder.

[0032] The anti-spatter agent C1 dispensed onto the inner surface Pn of the pipe P may be removed from the product in a cleaning process before shipping the product manufactured from the pipe P. If there is no problem even if the anti-spatter agent C1 adheres to the inner surface of the product manufactured from the pipe P, the cleaning process may be omitted.

[0033] (Injection part 36) In the example shown in FIG. 1, the discharge device 3 includes the above-described spray unit 36. The spray unit 36 ​​is capable of discharging a sputter adhesion preventive agent C1 (e.g., oil) onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P. In this case, the space occupied by the sputter adhesion preventive device 2A can be made smaller than when the spray unit that discharges the sputter adhesion preventive agent C1 is provided in a location separate from the spray unit 36 ​​that sprays the fluid D (in other words, the fluid for blowing away sputter). Furthermore, the manufacturing cost of the sputter adhesion preventive device 2A is reduced. In the example shown in FIG. 1, the spray unit 36 ​​includes an injection hole 36h that injects a mixed fluid D2 containing a gas and the sputter adhesion preventive agent C1 (e.g., oil).

[0034] (Discharge device 3) In the example shown in FIG. 4, the discharge device 3 includes a first flow path 45a that supplies a mixed fluid D2 containing a gas and a spatter adhesion preventive agent C1 to the spray unit 36 ​​(more specifically, the spray hole 36h). The discharge device 3 can also spray the mixed fluid D2 from the spray unit 36 ​​(more specifically, the spray hole 36h) onto the inner surface Pn of the pipe P. In the example shown in FIGS. 4 and 5, the spray unit 36 ​​can spray the mixed fluid D2 (see FIG. 4) and the spray unit 36 ​​can spray the fluid D (in other words, the blowing fluid) (see FIG. 5). In this case, the space occupied by the spatter adhesion prevention device 2A can be smaller than when the spray unit that sprays the mixed fluid D2 is provided in a different location from the spray unit 36 ​​that sprays the fluid that blows away spatter. In the example shown in FIGS. 4 and 5, the spray hole 36h that sprays the mixed fluid D2 is the same as the spray hole 36h that sprays the fluid that blows away spatter. Alternatively, the injection unit 36 ​​may include an injection hole 36h for injecting the mixed fluid D2 and another injection hole for injecting a fluid for blowing away spatter.

[0035] In the example shown in FIG. 4, the discharge device 3 is capable of adjusting the proportion of the spatter adhesion preventive agent C1 (e.g., oil) in the mixed fluid D2 sprayed from the spray unit 36. In this case, the discharge device 3 can spray the mixed fluid D2 having a high content of the spatter adhesion preventive agent C1 onto the tip end 31 of the spatter guard 30 and the inner surface Pn of the pipe P (see FIG. 4). The discharge device 3 can also blow off the spatter B from the tip end 31 of the spatter guard 30 onto the inner surface Pn of the pipe P using a fluid D having a low content of the spatter adhesion preventive agent C1 or a fluid D having no content of the spatter adhesion preventive agent C1 (see FIG. 5 or 6).

[0036] 4, the discharge device 3 has a mixer 41 that mixes a gas D1 (e.g., air) and a sputter adhesion preventive agent C1 (e.g., oil). The discharge device 3 adjusts the ratio between the flow rate of the gas D1 (e.g., air) supplied to the mixer 41 and the flow rate of the sputter adhesion preventive agent C1 (e.g., oil) supplied to the mixer 41, thereby adjusting the proportion of the sputter adhesion preventive agent C1 (e.g., oil) in the fluid D sprayed from the spray unit 36.

[0037] 4, the discharge device 3 has an air source AS (for example, an air compressor), a mixer 41, a tank 42, a pump 43, an air supply pipe 44, and a first flow path 45a. The air source AS may be capable of supplying air to components 12 of the laser processing machine other than the discharge device 3 (for example, an air cylinder 12a, an actuator as a gripping jaw moving device 66 described later), in addition to the discharge device 3.

[0038] The air source AS supplies air to the mixer 41 via an air supply pipe 44. The pump 43 supplies a sputter adhesion preventive agent C1 (e.g., oil) from a tank 42 to the mixer 41. The mixer 41 mixes the air received from the air source AS via the air supply pipe 44 with the sputter adhesion preventive agent C1 (e.g., oil) received from the tank 42 to form a mixed fluid D2 containing the sputter adhesion preventive agent C1 (e.g., oil) and air. The mixer 41 also sends the mixed fluid D2 to the spray unit 36 ​​via a first flow path 45a. The mixer 41 may be a lubricator (lubricators will be described later). In this case, the pump 43 may be omitted. The lubricator may be capable of adjusting the proportion of the sputter adhesion preventive agent C1 (e.g., oil) in the mixed fluid D2 sprayed from the spray unit 36.

[0039] In the examples shown in Figures 4 and 5, the discharge device 3 is capable of adjusting the proportion of the anti-spatter adhesion agent C1 (e.g., oil) in the mixed fluid D2 sprayed from the spray section 36 between a first proportion and a second proportion that is greater than zero and smaller than the first proportion.

[0040] 4, the discharge device 3 injects the mixed fluid D2 containing the sputter adhesion preventive agent C1 (e.g., oil) from the injection part 36 toward the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P, with the proportion of the sputter adhesion preventive agent C1 (e.g., oil) in the mixed fluid D2 injected from the injection part 36 being a first proportion. By injecting the mixed fluid D2 containing the sputter adhesion preventive agent C1 (e.g., oil) at the first proportion toward the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P, a sufficient amount of the sputter adhesion preventive agent C1 (e.g., oil) is applied to the tip 31 and the inner surface Pn.

[0041] 5, when the pipe P is being laser processed, the discharge device 3 injects the mixed fluid D2 containing the sputter adhesion preventive agent C1 (e.g., oil) from the injection part 36 toward the tip 31 of the sputter guard 30, with the mixed fluid D2 injected from the injection part 36 containing the sputter adhesion preventive agent C1 (e.g., oil) at a second ratio. By injecting the mixed fluid D2 containing the sputter adhesion preventive agent C1 (e.g., oil) at the second ratio toward the tip 31 of the sputter guard 30, the sputter B on the tip 31 of the sputter guard 30 can be blown away from the tip 31 while suppressing the consumption of the sputter adhesion preventive agent C1 (e.g., oil).

[0042] Assume that spatter B is collected by a suction device 55, which will be described later. In the example shown in FIG. 5, the mixed fluid D2 contains a small amount of spatter adhesion preventive agent C1, so the amount of spatter adhesion preventive agent C1 collected by the suction device 55 is small. Therefore, the adverse effect of the spatter adhesion preventive agent C1 (e.g., oil) on the suction device 55 is small, and the suction device 55 is less likely to break down. Furthermore, in the example shown in FIG. 5, the mixed fluid D2 containing the spatter adhesion preventive agent C1 (e.g., oil) is additionally discharged onto the inner surface Pn of the pipe P, so adhesion of spatter B to the inner surface Pn of the pipe P is more effectively suppressed.

[0043] 4, the discharge device 3 may have a first on-off valve 49a and / or a first flow rate adjustment valve 49b. In the example shown in FIG. 4, the first on-off valve 49a is disposed between the air source AS and the mixer 41, and opens and closes the flow path between the air source AS and the mixer 41. The first flow rate adjustment valve 49b adjusts the flow rate of air flowing through the flow path between the air source AS and the mixer 41. The pump 43 may be capable of adjusting the flow rate of the sputter adhesion preventive agent C1 (e.g., oil) supplied from the tank 42 to the mixer 41 based on a command received from the control device 9.

[0044] In the examples shown in Figures 4 and 6, the ejection device 3 is capable of adjusting the proportion of anti-spatter adhesion agent C1 (e.g., oil) in the fluid D ejected from the ejection section 36 between zero and a first proportion greater than zero.

[0045] 4, the discharge device 3 injects the mixed fluid D2 containing the sputter adhesion preventive agent C1 (e.g., oil) from the injection part 36 toward the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P, with the proportion of the sputter adhesion preventive agent C1 (e.g., oil) in the mixed fluid D2 injected from the injection part 36 being a first proportion. By injecting the mixed fluid D2 containing the sputter adhesion preventive agent C1 (e.g., oil) at the first proportion toward the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P, a sufficient amount of the sputter adhesion preventive agent C1 (e.g., oil) is applied to the tip 31 and the inner surface Pn.

[0046] 6, when the pipe P is being laser processed, the discharge device 3 injects the fluid D from the injection part 36 toward the tip 31 of the sputter guard 30, in a state in which the proportion of the sputter adhesion preventive agent C1 (e.g., oil) in the fluid D injected from the injection part 36 is zero. By injecting the fluid D that does not contain the sputter adhesion preventive agent C1 toward the tip 31 of the sputter guard 30, the sputter B on the tip 31 of the sputter guard 30 can be blown away from the tip 31 without consuming the sputter adhesion preventive agent C1.

[0047] Assume that spatter B is collected by a suction device 55, which will be described later. In the example shown in Fig. 6, the fluid D does not contain the spatter adhesion preventive agent C1, so the amount of the spatter adhesion preventive agent C1 collected by the suction device 55 is even smaller. Therefore, the adverse effect of the spatter adhesion preventive agent C1 (e.g., oil) on the suction device 55 is small, and the suction device 55 is less likely to break down.

[0048] In the example shown in Figures 4 and 6 (or Figures 7 and 8), the discharge device 3 can selectively operate in a gas supply mode N2 (see Figure 6 or Figure 8) in which only gas D1 (e.g., air) is supplied to the injection section 36, and a mixed fluid supply mode N1 (see Figure 4 or Figure 7) in which a mixed fluid D2 containing gas D1 (e.g., air) and a sputter adhesion inhibitor C1 (e.g., oil) is supplied to the injection section 36.

[0049] The discharge device 3 executes a mixed fluid supply mode N1 (see FIG. 4 or FIG. 7) to discharge a mixed fluid D2 containing a gas D1 (e.g., air) and a spatter adhesion preventive agent C1 (e.g., oil) onto the tip 31 of the spatter guard 30 and the inner surface Pn of the pipe P. The discharge device 3 also executes a gas supply mode N2 (see FIG. 6 or FIG. 8) to blow the spatter B received by the tip 31 of the spatter guard 30 from the tip 31 of the spatter guard 30 onto the inner surface Pn of the pipe P.

[0050] 7, the discharge device 3 includes a first flow path 45a that supplies a mixed fluid D2 (e.g., oil-air) containing a gas D1 (e.g., air) and a sputter adhesion preventive agent C1 (e.g., oil) to the injection section 36 (more specifically, injection hole 36h), and a first supply device 46a (e.g., mixer 41) that supplies the mixed fluid D2 (e.g., oil-air) containing the gas D1 (e.g., air) and the sputter adhesion preventive agent C1 (e.g., oil) to the first flow path 45a. The first supply device 46a (e.g., mixer 41) mixes the gas D1 (e.g., air) received from a second supply device 46b (e.g., air source AS) via an air supply pipe 44 with the sputter adhesion preventive agent C1 (e.g., oil) received from a tank 42, to form a mixed fluid D2 containing the gas D1 (e.g., air) and the sputter adhesion preventive agent C1 (e.g., oil).

[0051] In the example shown in FIG. 7, the discharge device 3 (more specifically, the first supply device 46a) includes a lubricator 41a. The lubricator 41a mixes a sputter adhesion preventive agent C1 (e.g., oil) with a gas (e.g., air). The lubricator 41a is one embodiment of the mixer 41. The lubricator 41a extracts the sputter adhesion preventive agent C1 (e.g., oil) from the tank 42 using the pressure of the gas D1 (e.g., air) supplied from the second supply device 46b (e.g., air source AS) and mixes the extracted sputter adhesion preventive agent C1 (e.g., oil) with the gas D1 (e.g., air). Therefore, a pump for extracting the sputter adhesion preventive agent C1 from the tank 42 can be omitted. Note that in the example shown in FIG. 7, any known lubricator can be used as the lubricator 41a.

[0052] Alternatively, the mixer 41 may mix the gas supplied from the second supply device 46b (e.g., the air source AS) with the sputter adhesion preventive agent C1 taken out of the tank 42 using a pump. Still alternatively, the mixer 41 may be configured by a joint that connects a supply pipe that supplies the gas and a supply pipe that supplies the sputter adhesion preventive agent C1.

[0053] 8, the discharge device 3 includes a second flow path 45b that supplies the gas D1 (e.g., air) to the ejection part 36 (more specifically, the ejection hole 36h). The discharge device 3 also includes a second supply device 46b (e.g., an air source AS) that supplies the gas D1 (e.g., air) to the second flow path 45b.

[0054] 7 and 8, a part of the first flow path 45a and a part of the second flow path 45b may be shared. In other words, the discharge device 3 may include a common flow path 45c that functions as a part of the first flow path 45a and a part of the second flow path 45b.

[0055] As illustrated in FIG. 7, the discharge device 3 may include a first on-off valve 49a and a second on-off valve 49c. The first on-off valve 49a opens and closes the first flow path 45a. The second on-off valve 49c opens and closes the second flow path 45b. In the example illustrated in FIG. 7, the control device 9 opens the first on-off valve 49a and closes the second on-off valve 49c. With the first on-off valve 49a open and the second on-off valve 49c closed, the first supply device 46a (e.g., the mixer 41 such as the lubricator 41a) supplies the mixed fluid D2 containing the gas D1 and the sputter adhesion preventive agent C1 to the injection unit 36. In the example illustrated in FIG. 8, the control device 9 closes the first on-off valve 49a and opens the second on-off valve 49c. With the first on-off valve 49a in a closed state and the second on-off valve 49c in an open state, the second supply device 46b (for example, an air source AS such as an air compressor) supplies the gas D1 to the injection part .

[0056] 7, the first on-off valve 49a is disposed between the air source AS and the mixer 41 (more specifically, the lubricator 41a). Alternatively, as illustrated in FIG. 28, the first on-off valve 49a may be disposed between the mixer 41 (more specifically, the lubricator 41a) and the spray unit 36. In the example illustrated in FIG. 7, in the mixed fluid supply mode N1 (or the sputter adhesion preventive agent discharge mode M1 shown in FIG. 28), the mixer 41 (more specifically, the lubricator 41a) mixes a gas D1 (e.g., air) with a sputter adhesion preventive agent C1 (e.g., oil) to form a mixed fluid D2, and supplies the mixed fluid D2 to the first flow path 45a.

[0057] 8, the second on-off valve 49c is disposed between the air source AS and the spray unit 36. The second on-off valve 49c may be disposed between the air source AS and the common flow path 45c. In the example shown in FIG. 8, in the gas supply mode N2 (or in the first processing mode M2 ​​shown in FIG. 30 and described below), the second on-off valve 49c is opened, and air is supplied from the air source AS to the second flow path 45b via the second on-off valve 49c.

[0058] The discharge device 3 may have a second flow rate adjustment valve 49d. The second flow rate adjustment valve 49d adjusts the flow rate of air flowing through the second flow path 45b.

[0059] 7, the discharge device 3 supplies a mixed fluid D2 containing a gas D1 (e.g., air) and a spatter adhesion preventive agent C1 (e.g., oil) to the spray unit 36. The discharge device 3 also sprays the mixed fluid D2 from the spray unit 36 ​​toward the tip 31 of the spatter guard 30 and the inner surface Pn of the pipe P. By spraying the mixed fluid D2 toward the tip 31 of the spatter guard 30 and the inner surface Pn of the pipe P, the spatter adhesion preventive agent C1 (e.g., oil) is applied to the tip 31 and the inner surface Pn.

[0060] 8, when the pipe P is being laser processed, the discharge device 3 supplies gas D1 that does not contain a spatter adhesion preventive agent to the injection part 36. The discharge device 3 also injects the gas D1 from the injection part 36 toward the tip 31 of the spatter guard 30. By injecting the gas D1 that does not contain a spatter adhesion preventive agent toward the tip 31 of the spatter guard 30, the spatter B on the tip 31 of the spatter guard 30 can be blown away from the tip 31 without consuming the spatter adhesion preventive agent.

[0061] 4 or 7, the discharge device 3 (more specifically, the spray unit 36) can simultaneously discharge the sputter adhesion preventive agent C1 onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P. In this case, the time required to apply the sputter adhesion preventive agent C1 is short, and the preparation time before laser processing is short.

[0062] 1, with the spray unit 36 ​​positioned outside the pipe P, the discharge device 3 can discharge a mixed fluid D2 containing a gas D1 and a sputter adhesion preventive agent C1 onto the inner surface Pn of the pipe P. In this case, the sputter adhesion preventive agent C1 can be easily applied to the edge Pe on the fourth direction DR4 side of the inner surface Pn of the pipe P. Furthermore, when the processing area of ​​the laser processing machine is visible from outside the laser processing machine, a user can easily see the mixed fluid D2 (e.g., oil-air) sprayed from the spray unit 36 ​​toward the inner surface Pn of the pipe P (see FIG. 16).

[0063] The discharge device 3 (more specifically, the spray unit 36) may discharge oil air containing oil and air onto the tip 31 of the spatter guard 30 and the inner surface Pn of the pipe P. By carrying the oil by air, it is easy to apply the oil to the inner surface Pn of the pipe P.

[0064] As illustrated in FIG. 1, part of the anti-spatter agent C1 sprayed from the spraying unit 36 ​​may scatter outside the pipe P.

[0065] 1, the ejection unit 36 ​​can eject a spatter adhesion preventive agent C1 (e.g., oil) onto the upper surface 31u of the tip portion 31 of the spatter guard 30. In this case, when the spatter B is received by the upper surface 31u of the tip portion 31, the spatter B is prevented from adhering to the upper surface 31u (see FIG. 2).

[0066] 2, the ejection portion 36 forms a flow of the fluid D along the upper surface 31u of the tip portion 31 of the spatter guard 30. In the example shown in FIG. 2, the ejection portion 36 has an ejection hole 36h.

[0067] The injection holes 36h may be positioned at approximately the same height as the upper surface 31u of the tip portion 31 of the spatter guard 30. Alternatively, the height of the injection holes 36h may be significantly higher than the height of the upper surface 31u of the tip portion 31 of the spatter guard 30.

[0068] In the example shown in Fig. 2, the extension direction of the injection hole 36h is approximately parallel to the longitudinal direction of the spatter guard 30. Alternatively, the extension direction of the injection hole 36h may be inclined with respect to the longitudinal direction of the spatter guard 30. In the example shown in Fig. 2, the injection unit 36 ​​has one injection hole 36h. Alternatively, the injection unit 36 ​​may have a plurality of injection holes 36h.

[0069] In the example shown in FIG. 1, the discharge device 3 has a tip portion 31 of the sputter guard 30 and an injection hole 36h that injects a sputter adhesion preventive agent C1 onto the inner surface Pn of the pipe P. In the example shown in FIG. 1, an upper end 360u of an outlet 360 of the injection hole 36h is located closer to the second direction DR2 than a lower end 360w of the outlet 360 of the injection hole 36h. In this case, a fluid containing the sputter adhesion preventive agent C1 (e.g., a mixed fluid D2 containing the sputter adhesion preventive agent C1 and a gas) is likely to diffuse obliquely upward from the upper end 360u of the outlet 360. As shown in FIG. 1, the sputter adhesion preventive agent C1 diffused obliquely upward from the upper end 360u of the outlet 360 is preferably applied to the inner surface Pn of the pipe P.

[0070] (Spatter Guard 30) 2, the ejection unit 36 ​​is disposed on the sputter guard 30. When the ejection unit 36 ​​is disposed on the sputter guard 30, the space occupied by the sputter adhesion suppression device 2A can be smaller than when the ejection unit 36 ​​is provided separately from the sputter guard 30.

[0071] 9, the spatter guard 30 has a tip portion 31, an intermediate portion 35 in which the ejection portion 36 (more specifically, the ejection holes 36h) is disposed, and a base portion 38 that defines a fluid flow path 38v that communicates with the ejection portion 36 (more specifically, the ejection holes 36h). The tip portion 31 is disposed closer to the first direction DR1 than the intermediate portion 35. The intermediate portion 35 is also disposed closer to the first direction DR1 than the base portion 38.

[0072] 9, the flow path cross-sectional area of ​​the injection hole 36h is smaller than the flow path cross-sectional area of ​​the fluid flow path 38v of the base end portion 38. In this case, the injection hole 36h can inject the fluid at high speed toward the tip end portion 31. The flow path cross-sectional area may be configured to decrease stepwise or continuously from the fluid flow path 38v of the base end portion 38 toward the injection hole 36h.

[0073] The spatter guard 30 may be replaceable with a second spatter guard 30-2 of a different size. In the example shown in FIG. 9, a spatter adhesion suppression device 2A for a laser processing machine includes a spatter guard 30, a first tube 47a (e.g., a rigid tube) that supplies fluid to a fluid flow path 38v of the spatter guard 30, and a second tube 47b (e.g., a flexible tube) connected to the first tube 47a via a connector 48. In the examples shown in FIGS. 9 and 10, the first tube 47a is detachable from the connector 48, and the second spatter guard 30-2 is attachable to the connector 48 via a tube 47a-2 separate from the first tube 47a. The internal flow path defined by the first tube 47a and the second tube 47b may function as part of the common flow path 45c described above.

[0074] 11, the tip portion 31 of the sputter guard 30 has a bottom wall 321, a first side wall 323, and a second side wall 325 opposite the first side wall 323. In the example shown in FIG. 12, the first side wall 323 and the second side wall 325 prevent sputter B that strikes the tip portion 31 of the sputter guard 30 from diffusing laterally beyond the first side wall 323 or the second side wall 325. In this way, the sputter B is preferably received by the tip portion 31 of the sputter guard 30.

[0075] 11, a narrow space SP1 extending in a first direction DR1 is defined by a bottom wall 321, a first side wall 323, and a second side wall 325. The narrow space SP1 is open at the top (in other words, a narrow opening OP is present above the narrow space SP1). In the example shown in FIG. 13, spatters generated by irradiating the pipe P with a laser beam LB are received in the narrow space SP1 via the narrow opening OP between an upper edge 323e of the first side wall 323 and an upper edge 325e of the second side wall 325.

[0076] 14, the ejector 36 (more specifically, the ejection hole 36h) ejects a fluid D (e.g., air) into the elongated space SP1. Since the elongated space SP1 is surrounded on three sides by the bottom wall 321, the first side wall 323, and the second side wall 325, the fluid D ejected from the ejector 36 suitably blows away the spatter in the first direction DR1.

[0077] In the example shown in Figure 12, the inner surface 320n that defines the elongated space SP1 of the tip portion 31 of the sputter guard 30 has an approximately U-shape when viewed in a direction along the longitudinal direction of the sputter guard 30 (more specifically, when viewed in a direction along the second direction DR2).

[0078] The upper surface 321u of the bottom wall 321 may have a substantially arcuate shape when viewed in the longitudinal direction of the sputter guard 30 (more specifically, when viewed in the second direction DR2). The first side surface 323n of the first side wall 323 facing the elongated space SP1 may have a substantially linear shape when viewed in the longitudinal direction of the sputter guard 30 (more specifically, when viewed in the second direction DR2). The second side surface 325n of the second side wall 325 facing the elongated space SP1 may have a substantially linear shape when viewed in the longitudinal direction of the sputter guard 30 (more specifically, when viewed in the second direction DR2).

[0079] 12, the upper surface 321u of the bottom wall 321 and the first side surface 323n of the first side wall 323 that faces the elongated space SP1 are smoothly connected without any corners. In this case, spatters B are less likely to adhere between the upper surface 321u of the bottom wall 321 and the first side surface 323n of the first side wall 323.

[0080] 12, the upper surface 321u of the bottom wall 321 and the second side surface 325n of the second side wall 325, which faces the elongated space SP1, are smoothly connected without any corners. In this case, spatters B are less likely to adhere between the upper surface 321u of the bottom wall 321 and the second side surface 325n of the second side wall 325.

[0081] 15, the injection unit 36 ​​(more specifically, the injection holes 36h) can inject the sputter adhesion preventive agent C1 (more specifically, a mixed fluid D2 containing the sputter adhesion preventive agent C1 and a gas) diffusively into the elongated space SP1 so that the sputter adhesion preventive agent C1 is simultaneously ejected onto the upper surface 321u of the bottom wall 321, the first side surface 323n of the first side wall 323, and the second side surface 325n of the second side wall 325. The mixed fluid D2 is, for example, oil-air containing oil and air.

[0082] 15, the injection unit 36 ​​(more specifically, the injection holes 36h) can inject the sputter adhesion preventive agent C1 (more specifically, the mixed fluid D2 containing the sputter adhesion preventive agent C1 and a gas) diffusively into the narrow space SP1 so that the sputter adhesion preventive agent C1 is applied to most of the inner surface 320n that defines the narrow space SP1 (more specifically, substantially the entire inner surface 320n that defines the narrow space SP1) of the tip portion 31 of the sputter guard 30. Applying the sputter adhesion preventive agent C1 to most of the inner surface 320n that defines the narrow space SP1 suitably prevents sputters B from adhering to the inner surface 320n.

[0083] In the example shown in FIG. 15, the injection section 36 (more specifically, the injection hole 36h) is capable of diffusively injecting the sputter adhesion prevention agent C1 (more specifically, the mixed fluid D2 containing the sputter adhesion prevention agent C1 and a gas) into the elongated space SP1 so that the sputter adhesion prevention agent C1 passing through the elongated opening OP above the elongated space SP1 reaches the inner surface Pn of the pipe P.

[0084] 1, the sputter adhesion preventive agent C1 directed from the injection unit 36 ​​(more specifically, the injection hole 36h) toward the inner surface Pn of the pipe P has a momentum component in the first direction DR1 and a momentum component in the fifth direction DR5. In this case, the sputter adhesion preventive agent C1 is applied more widely to the inner surface Pn of the pipe P than when the sputter adhesion preventive agent C1 has only the momentum component in the fifth direction DR5.

[0085] In the example shown in Figure 15, when viewed in a direction along the longitudinal direction of the spatter guard 30 (more specifically, when viewed in a direction along the second direction DR2), the injection hole 36h is positioned approximately at the center of the tip portion 31 of the spatter guard 30.

[0086] 15, when viewed in the longitudinal direction of the spatter guard 30 (more specifically, when viewed in the second direction DR2), the ejection hole 36h is disposed at a position overlapping the bottom of the elongated space SP1. In this case, a fluid (e.g., air) is ejected from the ejection hole 36h onto the bottom of the elongated space SP1. Therefore, the fluid (e.g., air) can suitably blow away spatter on the bottom wall 321 of the tip portion 31 in the first direction DR1.

[0087] The shape of the tip portion 31 of the spatter guard 30 is not limited to the shapes shown in Figures 14 and 15. For example, the upper surface 31u of the tip portion 31 of the spatter guard 30 may be a flat surface.

[0088] (Rotational drive device 63) In the example shown in FIG. 16, a spatter adhesion preventing device 2A of a laser processing machine includes a rotation drive device 63 that rotates a pipe P about a longitudinal center axis AT of the pipe. In the example shown in FIG. 16, the rotation drive device 63 can rotate the pipe P about the longitudinal center axis AT while a discharge device 3 (more specifically, an injection unit 36) is injecting a spatter adhesion preventing agent C1 toward the inner surface of the pipe P (see arrow R1). In this case, the spatter adhesion preventing agent C1 can be efficiently applied over the entire circumference of the inner surface Pn of the pipe P (see arrow R1 in FIG. 15).

[0089] In the example shown in FIG. 15 , the spray unit 36 ​​has a spray hole 36h that can spray the sputter adhesion preventive agent C1 above the sputter guard 30. In the example shown in FIG. 15 , the spray hole 36h cannot spray the sputter adhesion preventive agent C1 below the sputter guard 30. Alternatively, as shown in FIG. 17 , the spray unit 36 ​​may have, in addition to the spray hole 36h that can spray the sputter adhesion preventive agent C1 above the sputter guard 30, an auxiliary spray hole 36j that can spray the sputter adhesion preventive agent C1 below the sputter guard 30. In the example shown in FIG. 17 , the spray unit 36 ​​can apply the sputter adhesion preventive agent C1 to the entire circumference of the inner surface Pn of the stationary pipe P. In this case, there is no need to rotate the pipe P about its longitudinal center axis when spraying the sputter adhesion preventive agent C1 onto the inner surface Pn of the pipe P.

[0090] (Spatter guard moving device 51) 16, the spatter adhesion suppression device 2A of the laser processing machine includes a spatter guard moving device 51 that moves the spatter guard 30. The spatter guard moving device 51 may have a first driving device 51a that moves the spatter guard 30 in a direction substantially parallel to the longitudinal direction of the pipe P (e.g., a third direction DR3 or a fourth direction DR4). The spatter guard moving device 51 may also have a second driving device 51b that moves the spatter guard 30 in a direction substantially parallel to the vertical direction (e.g., a fifth direction DR5 or a sixth direction DR6).

[0091] 16, the spatter guard moving device 51 has a first slider 52a that holds the first tube 47a. The first driving device 51a moves the first slider 52a in the third direction DR3 (or the fourth direction DR4). When the first slider 52a moves in the third direction DR3 (or the fourth direction DR4), the first tube 47a and the spatter guard 30 move in the third direction DR3 (or the fourth direction DR4) together with the first slider 52a.

[0092] 16, the spatter guard moving device 51 has a second slider 52b that supports a first slider 52a. The second driving device 51b moves the second slider 52b in a fifth direction DR5 (or a sixth direction DR6). When the second slider 52b moves in the fifth direction DR5 (or the sixth direction DR6), the first slider 52a, the first tube 47a, and the spatter guard 30 move in the fifth direction DR5 (or the sixth direction DR6) together with the second slider 52b.

[0093] 18 and 19, the spatter guard moving device 51 (more specifically, the first driving device 51a and the second driving device 51b) can move the spatter guard 30 between a first position P1 and a second position P2. In the example shown in FIG. 18, when the spatter guard 30 is located at the first position P1, the entire spatter guard 30 is located outside the pipe P. In the example shown in FIG. 19, when the spatter guard 30 is located at the second position P2, the tip 31 of the spatter guard 30 is inserted into the pipe P. In the example shown in FIGS. 18 and 19, the second position P2 is located closer to the third direction DR3 than the first position P1. In addition, in the example shown in FIGS. 18 and 19, the second position P2 is located higher than the first position P1 (more specifically, the second position P2 is located slightly higher than the first position P1).

[0094] 18, with the sputter guard 30 located at the first position P1, a fluid containing a sputter adhesion preventive agent C1 (e.g., a mixed fluid D2 containing oil and air) is injected from the injection portion 36 of the sputter guard 30 toward the inner surface Pn of the pipe P. In the example of FIG. 19, with the sputter guard 30 located at the second position P2, the sputter guard 30 receives sputter generated due to laser irradiation of the pipe P. Furthermore, with the sputter guard 30 located at the second position P2, a fluid D (e.g., a gas D1 such as air) is injected from the injection portion 36 of the sputter guard 30 toward the inner surface Pn of the pipe P.

[0095] The sputter adhesion suppression device 2A for the laser processing machine may have a guide roller 54 that guides the movement of the first tube 47a in the third direction DR3. In the example shown in Fig. 19, the guide roller 54 is supported by the second slider 52b.

[0096] (Suction device 55) 20, a spatter adhesion suppression device 2A of a laser processing machine may include a suction device 55 that sucks spatter B. In the example shown in FIG. 21, the suction device 55 sucks spatter B so that the spatter B is discharged from the internal space SP2 of the pipe P to the outside of the pipe P through the second end Pb of the pipe P. By discharging the spatter B to the outside of the pipe P, adhesion of the spatter B to the inner surface Pn of the pipe P is suppressed.

[0097] 21, the suction device 55 sucks the sputter adhesion preventive agent C1 (e.g., oil) adhering to the inner surface Pn of the pipe P in the third direction DR3 (more specifically, the direction toward the first chuck 61). In this way, the sputter adhesion preventive agent C1 applied to the inner surface of the first end Pa of the pipe P moves in the third direction DR3 (see the dashed arrow in FIG. 21). Therefore, the discharge device 3 does not need to discharge the sputter adhesion preventive agent C1 onto the entire inner surface Pn of the pipe P.

[0098] The suction device 55 cannot move the sputter adhesion preventive agent C1 applied to the inner surface Pn of the pipe P in the fourth direction DR4. For this reason, it is preferable that the discharge device 3 discharge the sputter adhesion preventive agent C1 onto the inner surface Pn of the first end Pa of the pipe P, including the edge Pe on the fourth direction DR4 side of the pipe P. The sputter adhesion preventive agent C1 applied to the edge Pe on the fourth direction DR4 side of the inner surface Pn of the pipe P moves from the edge Pe in the third direction DR3 by suction by the suction device 55.

[0099] (Cleaning device 57) As illustrated in FIG. 22, the spatter adhesion suppression device 2A of the laser processing machine may include a cleaning device 57 (e.g., brush 57b) that removes spatter B adhering to the spatter guard 30. In the first embodiment, a spatter adhesion preventive agent C1 is discharged onto the tip 31 of the spatter guard 30, and the spatter B on the tip 31 of the spatter guard 30 is blown away by a fluid. For this reason, a large amount of spatter B does not accumulate on the tip 31 of the spatter guard 30. On the other hand, it is possible that some spatter B will adhere to the tip 31 of the spatter guard 30. In the example illustrated in FIG. 22, the spatter B remaining on the tip 31 of the spatter guard 30 is removed by the cleaning device 57 (e.g., brush 57b).

[0100] In the example shown in FIG. 22, the spatter guard moving device 51 (more specifically, the first driving device 51a and the second driving device 51b) can move the spatter guard 30 to a third position P3 where the tip 31 of the spatter guard 30 comes into contact with the cleaning device 57 (e.g., brush 57b). As the spatter guard moving device 51 moves the spatter guard 30, the tip 31 of the spatter guard 30 moves relative to the cleaning device 57 (e.g., brush 57b) while coming into contact with the cleaning device 57 (e.g., brush 57b). In this way, spatter B remaining on the tip 31 of the spatter guard 30 is removed by the cleaning device 57 (e.g., brush 57b).

[0101] (Second embodiment) A spatter adhesion suppression device 2B for a laser processing machine according to a second embodiment will be described with reference to Figs. 23 to 25. Figs. 23 and 24 are diagrams schematically showing the spatter adhesion suppression device 2B for a laser processing machine according to the second embodiment. Fig. 25 is a schematic cross-sectional view showing the state in which spatter B is blown off from the tip 31 of the spatter guard 30 onto the inner surface Pn of the pipe P during laser processing. In Fig. 25, the state in which fluid D is being sprayed from the spraying portion 36 is shown by multiple radial dashed dotted lines.

[0102] The sputter adhesion suppression device 2B for a laser processing machine in the second embodiment differs from the sputter adhesion suppression device 2A for a laser processing machine in the first embodiment in that the discharge device 3 that discharges the sputter adhesion preventive agent C1 onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P is provided completely independent of the sputter guard 30. In other respects, the sputter adhesion suppression device 2B for a laser processing machine in the second embodiment is similar to the sputter adhesion suppression device 2A for a laser processing machine in the first embodiment.

[0103] In the second embodiment, differences from the first embodiment will be mainly described. On the other hand, in the second embodiment, repeated descriptions of matters already described in the first embodiment will be omitted. Therefore, it goes without saying that matters already described in the first embodiment can be applied to the second embodiment even if they are not explicitly described in the second embodiment.

[0104] As illustrated in Figures 23 to 25, the sputter adhesion suppression device 2B for a laser processing machine in the second embodiment comprises: (1) a sputter guard 30 that is inserted into a pipe P and has a tip 31 that receives sputter generated due to laser irradiation of the pipe P; (2) an injection section 36 (more specifically, an injection hole) that injects a fluid into the tip 31 of the sputter guard 30; and (3) an injection device 3 (see Figures 23 and 24) that injects a sputter adhesion prevention agent C1 onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P.

[0105] Therefore, the sputter adhesion suppression device 2B for a laser processing machine in the second embodiment has the same effects as the sputter adhesion suppression device 2A for a laser processing machine in the first embodiment.

[0106] 23 and 24, the discharge device 3 has a nozzle 301 provided independently of the spatter guard 30. As illustrated in FIG. 23, the nozzle 301 applies the spatter adhesion preventive agent C1 to the inner surface Pn of the pipe P. Also, as illustrated in FIG. 24, the nozzle 301 applies the spatter adhesion preventive agent C1 to the tip 31 of the spatter guard 30.

[0107] The fluid sprayed from the nozzle 301 may be a mixed fluid D2 containing oil and air. In this case, the nozzle 301 sprays oil onto the tip 31 of the spatter guard 30. Alternatively, the nozzle 301 may drip a spatter adhesion preventive agent C1 (e.g., oil) onto the tip 31 of the spatter guard 30.

[0108] 23 and 24, the nozzle 301 is tiltably supported by the nozzle support 302. The nozzle 301 is capable of changing its position (more specifically, tilting) between a first position (see FIG. 23) for discharging the sputter adhesion preventive agent C1 onto the inner surface Pn of the pipe P and a second position (see FIG. 24) for discharging the sputter adhesion preventive agent C1 onto the tip 31 of the sputter guard 30.

[0109] (Third embodiment) A sputter adhesion suppressing device 2C for a laser processing machine according to the third embodiment will be described with reference to Fig. 26 and Fig. 27. Fig. 26 is a diagram schematically showing a sputter adhesion suppressing device 2C for a laser processing machine according to the third embodiment. Fig. 27 is a diagram schematically showing a sputter adhesion suppressing device 2C for a laser processing machine according to a first modified example of the third embodiment.

[0110] As illustrated in FIG. 26 or 27 , a sputter adhesion suppression device 2C for a laser processing machine in the third embodiment includes a first discharge device 3a that discharges a sputter adhesion preventive agent onto the tip end 31 of the sputter guard 30 and a second discharge device 3b that discharges the sputter adhesion preventive agent onto the inner surface Pn of the pipe P. The sputter adhesion suppression device 2C for a laser processing machine in the third embodiment differs from the sputter adhesion suppression device 2A for a laser processing machine in the first embodiment and the sputter adhesion suppression device 2B for a laser processing machine in the second embodiment in that the first discharge device 3a that discharges the sputter adhesion preventive agent onto the tip end 31 of the sputter guard 30 is different from the second discharge device 3b that discharges the sputter adhesion preventive agent onto the inner surface Pn of the pipe P. In other respects, the sputter adhesion suppression device 2C for a laser processing machine in the third embodiment is similar to the sputter adhesion suppression device 2A for a laser processing machine in the first embodiment or the sputter adhesion suppression device 2B for a laser processing machine in the second embodiment.

[0111] In the example shown in FIG. 26, the second discharge device 3b includes a nozzle 301 provided independently of the spatter guard 30. The nozzle 301 discharges a spatter adhesion preventive agent C1 onto the inner surface Pn of the pipe P. In the example shown in FIG. 26, the first discharge device 3a (more specifically, the spray unit 36 ​​arranged on the spatter guard 30) discharges the spatter adhesion preventive agent C1 onto the tip 31 of the spatter guard 30. Furthermore, when the pipe P is laser processed, the spray unit 36 ​​can spray a blowing fluid to blow away spatter onto the tip 31 of the spatter guard 30.

[0112] In the example shown in FIG. 27, the first discharging device 3a includes a nozzle 301 provided independently of the spatter guard 30. The nozzle 301 discharges a spatter adhesion preventive agent C1 onto the tip 31 of the spatter guard 30. In the example shown in FIG. 27, the second discharging device 3b (more specifically, the spray unit 36 ​​arranged on the spatter guard 30) discharges the spatter adhesion preventive agent C1 onto the inner surface Pn of the pipe P. Furthermore, when the pipe P is laser processed, the spray unit 36 ​​can spray a blowing fluid to blow away spatter onto the tip 31 of the spatter guard 30.

[0113] In the example shown in FIG. 27, the second discharge device 3b includes a first on-off valve 49a that opens and closes a first flow path 45a (more specifically, the first flow path 45a that supplies the mixed fluid D2 containing the gas D1 and the sputter adhesion preventive agent C1 to the spray unit 36). In the example shown in FIG. 27, the first on-off valve 49a is disposed between the mixer 41 (more specifically, the lubricator 41a) and the spray unit 36. As illustrated in FIG. 27, the first discharge device 3a may include a third flow path 45e that supplies the mixed fluid D2 containing the gas D1 and the sputter adhesion preventive agent C1 to the nozzle 301, and a third on-off valve 49e that opens and closes the third flow path 45e. In the example shown in FIG. 27, the third on-off valve 49e is disposed between the mixer 41 (more specifically, the lubricator 41a) and the nozzle 301.

[0114] In the example shown in FIG. 27, the discharge device including the first discharge device 3a and the second discharge device 3b can simultaneously discharge a sputter adhesion prevention agent C1 (more specifically, a mixed fluid D2 containing a gas and the sputter adhesion prevention agent C1) onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P.

[0115] (Fourth embodiment) A laser processing machine 1 according to a fourth embodiment will be described with reference to Figs. 1 to 32. Fig. 28 is a schematic front view showing the laser processing machine 1 according to the fourth embodiment. Fig. 29 is a schematic cross-sectional view showing the state in which the discharge device 3 discharges the spatter adhesion preventive agent C1 onto the tip 31 of the spatter guard 30 and the inner surface Pn of the pipe P. Figs. 30 and 31 are schematic front views showing the laser processing machine 1 according to the fourth embodiment. Fig. 32 is a diagram showing the state in which the control device 9 can control a plurality of devices to be controlled.

[0116] In the fourth embodiment, differences from the first, second, and third embodiments will be mainly described. On the other hand, in the fourth embodiment, repeated descriptions of matters already described in the first, second, or third embodiments will be omitted. Therefore, it goes without saying that matters already described in the first, second, or third embodiments can be applied to the fourth embodiment, even if they are not explicitly described in the fourth embodiment. Conversely, all matters described in the fourth embodiment can be applied to the first, second, and third embodiments.

[0117] As illustrated in Figure 28, the laser processing machine 1 in the fourth embodiment includes a support device 60, a rotation drive device 63, a laser irradiation device 70, a movement device 75, a spatter adhesion suppression device 2, and a control device 9.

[0118] The support device 60 supports the pipe P. In the example shown in FIG. 28 , the support device 60 includes a first chuck 61, and the first chuck 61 has a gripping member 64 that grips the pipe P. In the example shown in FIG. 28 , the gripping member 64 grips the second end Pb of the pipe P. The support device 60 may also include a second chuck 62 that supports the pipe P. In the example shown in FIG. 28 , the second chuck 62 supports the middle portion Pm of the pipe P.

[0119] The rotation drive device 63 rotates the pipe P about the first axis AX. The rotation drive device 63 may include a first rotation drive device 63a that rotates the gripping member 64 about the first axis AX. The rotation drive device 63 may also include a second rotation drive device 63b that rotates the multiple guide rollers 67 of the second chuck 62 about the first axis AX.

[0120] The laser irradiation device 70 has a laser head 71 that irradiates the pipe P with a laser LB.

[0121] The moving device 75 moves the laser head 71 relative to the pipe P. In the example shown in FIG. 28, the moving device 75 moves the laser head 71 relative to the support device 60 (more specifically, the first chuck 61 and the second chuck 62).

[0122] The sputter adhesion suppression device 2 may be the sputter adhesion suppression device 2A in the first embodiment, the sputter adhesion suppression device 2B in the second embodiment (see FIG. 23), the sputter adhesion suppression device 2C in the third embodiment (see FIG. 26 or 27), or any other sputter adhesion suppression device. The sputter adhesion suppression devices (2A, 2B, 2C) have already been described in the first to third embodiments, so repeated description of the sputter adhesion suppression devices (2A, 2B, 2C) will be omitted.

[0123] The spatter adhesion suppression device 2 includes (1) a spatter guard 30 that is inserted into the pipe P from a first end Pa of the pipe P and has a tip 31 that receives spatter generated due to laser irradiation of the pipe P, (2) a spatter guard moving device 51 that moves the spatter guard 30, (3) an injection unit 36 ​​that injects a fluid onto the tip 31 of the spatter guard 30, and (4) a discharge device 3 that discharges a spatter adhesion preventive agent C1 onto the tip 31 of the spatter guard 30 and the inner surface Pn of the pipe P. The spatter guard 30, the spatter guard moving device 51, the injection unit 36, and the discharge device 3 have already been described in the first to third embodiments, so repeated description of these configurations will be omitted.

[0124] The control device 9 controls the rotation drive device 63 , the laser irradiation device 70 , the moving device 75 , and the spatter adhesion suppression device 2 .

[0125] The laser processing machine 1 in the fourth embodiment has the same effects as the sputter adhesion suppression device 2A of the laser processing machine in the first embodiment, the sputter adhesion suppression device 2B of the laser processing machine in the second embodiment, or the sputter adhesion suppression device 2C of the laser processing machine in the third embodiment.

[0126] (Optional configuration) Next, with reference to Figures 1 to 32, optional additional configurations that can be adopted in the fourth embodiment (or the first embodiment, the second embodiment, or the third embodiment) will be described.

[0127] (1st chuck 61) In the example shown in FIG. 28, the first chuck 61 includes a gripping member 64 having a plurality of gripping jaws 65, a gripping jaw moving device 66, and a first rotation driving device 63a.

[0128] The gripping member 64 has a plurality of gripping claws 65 including a first gripping claw 65a and a second gripping claw 65b. The gripping claw moving device 66 can move the plurality of gripping claws 65 in a direction toward the first axis AX and can move the plurality of gripping claws 65 in a direction away from the first axis AX. More specifically, the gripping claw moving device 66 moves the plurality of gripping claws 65 between a gripping position in contact with the pipe P and a release position away from the pipe P.

[0129] The first rotation drive device 63a rotates the gripping member 64 (more specifically, the multiple gripping claws 65) around a first axis AX. In the example shown in Fig. 28, the first axis AX is substantially coaxial with the longitudinal center axis AT of the pipe P.

[0130] (Second chuck 62) 28, the second chuck 62 has a plurality of guide rollers 67, a guide roller moving device 68, and a second rotation drive device 63b. In the example shown in Fig. 28, the second chuck 62 is disposed between the first chuck 61 and the laser head 71 in the direction along the first axis AX.

[0131] The multiple guide rollers 67 guide the movement of the pipe P in a direction parallel to the first axis AX. The guide roller moving device 68 can move the multiple guide rollers 67 in a direction toward the first axis AX, and can move the multiple guide rollers 67 in a direction away from the first axis AX. More specifically, the guide roller moving device 68 moves the multiple guide rollers 67 between a contact position where they contact the pipe P and a spaced position where they are spaced apart from the pipe P.

[0132] The second rotation drive device 63b rotates the plurality of guide rollers 67 around the first axis AX.

[0133] (Mobility Device 75) 28, the moving device 75 includes a first chuck moving device 76 that moves the first chuck 61. The first chuck moving device 76 moves the first chuck 61 in a direction substantially parallel to the first axis AX.

[0134] 28, the moving device 75 includes a laser head moving device 77 that moves the laser head 71. The laser head moving device 77 may be a device that can move the laser head 71 two-dimensionally along a plane that is substantially perpendicular to the first axis AX. The laser head moving device 77 may be a device that can move the laser head 71 three-dimensionally.

[0135] In the example shown in Fig. 28, the laser head moving device 77 includes a first linear moving device 77a that moves the laser head 71 along the vertical direction. As illustrated in Fig. 28, the laser head moving device 77 may include a second linear moving device 77b that moves the laser head 71 along the first axis AX. As illustrated in Fig. 28, the laser head moving device 77 may include a third linear moving device 77c that moves the laser head 71 along a direction perpendicular to both the vertical direction and the first axis AX. The laser head moving device 77 may also have a tilting device that tilts the laser head 71 about a horizontal axis.

[0136] (Laser irradiation device 70) 28, the laser irradiation device 70 has a laser head 71 that emits a laser. As illustrated in FIG. 12, the laser irradiation device 70 (more specifically, the laser head 71) may have an assist gas injection unit 72 that injects an assist gas G onto the surface of the pipe P.

[0137] In the example shown in FIG. 12, the laser irradiation device 70 simultaneously emits the laser beam LB and sprays the assist gas G. The assist gas G may be nitrogen gas or oxygen gas. Nitrogen gas as the assist gas G is supplied to the surface of the pipe P at a relatively high supply pressure. On the other hand, oxygen gas as the assist gas G is supplied to the surface of the pipe P at a relatively low supply pressure to suppress excessive oxidation reactions. When nitrogen gas is used as the assist gas G, an oxide film is less likely to form on the cut or perforated portion of the pipe P. On the other hand, when oxygen gas is used as the assist gas G, a pipe P with a greater plate thickness can be suitably laser processed.

[0138] When the assist gas injection unit 72 injects nitrogen gas onto the surface of the pipe P, the pipe material vaporized or melted by the irradiation of the laser LB is removed from the laser irradiation area by the nitrogen gas. In this case, the spatter B generated from the pipe P tends to become small particles. The small particles of spatter B generated from the pipe P move toward the tip 31 of the spatter guard 30 due to the nitrogen gas and gravity, and the small particles of spatter B are blown away from the tip 31 of the spatter guard 30 by the fluid D injected from the injection unit 36.

[0139] When the assist gas injection unit 72 injects oxygen gas onto the surface of the pipe P, the pipe material is melted by the heat input to the pipe P due to the irradiation of the laser LB and the reaction heat due to the chemical reaction between the pipe material and oxygen. In this case, the spatter B generated from the pipe P tends to be large. The large spatter B generated from the pipe P (for example, large spatter B in a molten state) moves toward the tip 31 of the spatter guard 30 due to the oxygen gas and gravity, and the large spatter B is blown away from the tip 31 of the spatter guard 30 by the fluid D injected from the injection unit 36.

[0140] The laser irradiation device 70 may be capable of switching the assist gas G injected from the assist gas injection unit 72 between nitrogen gas and oxygen gas.

[0141] (Suction device 55) The laser processing machine 1 may include a suction device 55 that sucks the spatter B. In the example shown in Fig. 21, the suction device 55 sucks the spatter B so that the spatter B is discharged from the internal space SP2 of the pipe P to the outside of the pipe P via the second end Pb of the pipe P. Discharging the spatter B to the outside of the pipe P prevents the spatter B from adhering to the inner surface Pn of the pipe P.

[0142] 21 , the sputter suction port 56 of the suction device 55 may be disposed in the first chuck 61. As viewed in the direction along the third direction DR3, the sputter suction port 56 may be disposed between the first gripping jaws 65a and the second gripping jaws 65b. In the example shown in FIG. 21 , when the first chuck 61 grips the second end Pb of the pipe P, the sputter suction port 56 faces the opening of the second end Pb of the pipe P. In other words, when the first chuck 61 performs the operation of gripping the second end Pb of the pipe P, the sputter suction port 56 and the opening of the second end Pb of the pipe P are automatically aligned.

[0143] (Control device 9) In the examples shown in Figures 28 and 30, the control device 9 controls the rotation drive device 63 (more specifically, the first rotation drive device 63a and the second rotation drive device 63b), the laser irradiation device 70, the moving device 75 (more specifically, the first chuck moving device 76 and the laser head moving device 77), and the sputter adhesion suppression device 2.

[0144] (Spatter prevention agent dispensing mode M1) In the example shown in FIG. 28, the control device 9 can execute a sputter adhesion preventive agent discharge mode M1 for discharging a sputter adhesion preventive agent C1 onto the tip end 31 of the sputter guard 30 and the inner surface Pn of the pipe P.

[0145] In the example shown in Figure 28, the sputter adhesion prevention agent discharge mode M1 includes sending a control command E1 (more specifically, a first group of control commands E1) from the control device 9 to at least the sputter adhesion prevention device 2 so that the sputter adhesion prevention agent C1 is discharged onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P.

[0146] The sputter adhesion preventive agent discharge mode M1 may include transmitting a first movement command E1-1 from the control device 9 to the sputter guard moving device 51 of the sputter adhesion suppression device 2 so as to move the sputter guard 30 to the first position P1. In the example shown in FIG. 28 , when the sputter guard 30 is located at the first position P1, the entire sputter guard 30 is located outside the pipe P. When the sputter guard 30 is located at the first position P1, it is preferable that the sputter adhesion preventive agent C1 can be discharged from the injection portion 36 of the sputter guard 30 onto the edge Pe (see FIG. 1 if necessary) of the inner surface Pn of the pipe P on the fourth direction DR4 side.

[0147] In the example shown in Figure 28, the sputter adhesion prevention agent ejection mode M1 includes sending a first injection command E1-2 from the control device 9 to the sputter adhesion suppression device 2 (more specifically, the ejection device 3) so that a fluid (e.g., oil air) containing a sputter adhesion prevention agent C1 is ejected from the ejection portion 36 of the sputter guard 30 located at the first position P1 onto both the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P.

[0148] Additionally, the spatter adhesion preventive agent dispensing mode M1 may include transmitting a first rotation command E1-3 from the control device 9 to the rotation drive devices 63 (more specifically, the first rotation drive device 63a and the second rotation drive device 63b) so as to rotate the pipe P about the first axis AX. By simultaneously dispensing the spatter adhesion preventive agent C1 onto the inner surface Pn of the pipe P and rotating the pipe P about the first axis AX, the spatter adhesion preventive agent C1 can be efficiently applied over the entire circumference of the inner surface Pn of the pipe P (see arrow R1 in FIG. 15 ).

[0149] Alternatively, or additionally, the sputter adhesion preventive agent discharge mode M1 may include transmitting an additional movement command E1-4 from the control device 9 to at least one of the sputter guard moving device 51 and the first chuck moving device 76 so as to move the spray unit 36 ​​of the sputter guard 30 relative to the pipe P in the direction along the first axis AX. By discharging the sputter adhesion preventive agent C1 onto the inner surface Pn of the pipe P and moving the spray unit 36 ​​of the sputter guard 30 relative to the pipe P in the direction along the first axis AX, the sputter adhesion preventive agent C1 can be applied over a wider area of ​​the inner surface Pn of the pipe P (see arrow AR1 in FIG. 29 ). As illustrated in FIG. 29 , when the sputter adhesion preventive agent discharge mode M1 is executed, the spraying of a fluid (e.g., oil-air) containing the sputter adhesion preventive agent C1 from the spray unit 36, the rotation of the pipe P about the first axis AX, and the movement of the sputter guard 30 in the direction along the first axis AX may be performed simultaneously.

[0150] (First processing mode M2) 30, the control device 9 can execute a first processing mode M2 ​​in which the laser LB is irradiated onto the pipe P with the tip 31 of the spatter guard 30 inserted into the pipe P. In the example shown in FIG. 30, when the first processing mode M2 ​​is executed, the tip 31 of the spatter guard 30 is positioned on the axis of the laser LB emitted from the laser head 71 (in other words, on the optical axis of the laser LB).

[0151] 30 , the first processing mode M2 ​​includes transmitting control commands E2 (more specifically, a second group of control commands E2) from the control device 9 to at least the laser irradiation device 70 and the spatter adhesion prevention device 2 so that the laser head 71 irradiates the pipe P with the laser LB and the spatter B is blown off from the tip portion 31 of the spatter guard 30 onto the inner surface Pn of the pipe P. Additionally, the first processing mode M2 ​​may include transmitting control commands E2 to the suction device 55 so that the spatter B in the internal space SP2 of the pipe P is sucked by the suction device 55.

[0152] The first processing mode M2 ​​may include transmitting a second movement command E2-1 from the control device 9 to the spatter guard moving device 51 of the spatter adhesion suppression device 2 so that the spatter guard 30 moves to the second position P2. When the spatter guard 30 is located at the second position P2, the tip portion 31 of the spatter guard 30 is inserted into the pipe P.

[0153] In the example shown in Figure 30, the first processing mode M2 ​​includes: (1) sending a laser emission command E2-2 from the control device 9 to the laser irradiation device 70 so that the laser LB is irradiated from the laser head 71 to the pipe P; and (2) sending a second injection command E2-3 from the control device 9 to the sputter adhesion suppression device 2 (more specifically, the discharge device 3) so that a fluid D (e.g., a gas D1 such as air, or a mixed fluid D2 containing a sputter adhesion prevention agent C1 and gas D1) is injected from the injection portion 36 of the sputter guard 30 located at the second position P2 onto the tip 31 of the sputter guard 30.

[0154] 30, the first processing mode M2 ​​may include transmitting a second rotation command E2-4 from the control device 9 to the rotation drive devices 63 (more specifically, the first rotation drive device 63a and the second rotation drive device 63b) so as to rotate the pipe P about the first axis AX. In other words, in the first processing mode M2, irradiation of the pipe P with the laser LB, rotation of the pipe P about the first axis AX, and injection of a fluid D (for example, a gas D1 such as air, or a mixed fluid D2 containing a sputter adhesion preventive agent C1 and the gas D1) to the tip portion 31 of the sputter guard 30 may be performed simultaneously.

[0155] 30 , the first processing mode M2 ​​may include transmitting a third movement command E2-5 from the control device 9 to a movement device 75 (e.g., a first chuck movement device 76 and / or a laser head movement device 77) so as to move the laser head 71 relative to the pipe P. In other words, in the first processing mode M2, irradiation of the pipe P with the laser LB, relative movement of the laser head 71 relative to the pipe P, and injection of a fluid D (e.g., a gas D1 such as air, or a mixed fluid D2 containing a sputter adhesion preventive agent C1 and the gas D1) onto the tip portion 31 of the sputter guard 30 may be performed simultaneously.

[0156] 30 , the first processing mode M2 ​​may include sending a suction command E2-6 to the suction device 55 so that the spatter B in the internal space SP2 of the pipe P is sucked by the suction device 55. In other words, in the first processing mode M2, irradiation of the pipe P with the laser LB, injection of a fluid D (for example, a gas D1 such as air, or a mixed fluid D2 containing a spatter adhesion preventive agent C1 and the gas D1) onto the tip portion 31 of the sputter guard 30, and suction of the spatter B from the internal space SP2 of the pipe P to the suction device 55 may be performed simultaneously.

[0157] 28 and 30, the control device 9 can sequentially execute the sputter adhesion preventive agent discharge mode M1 and the first processing mode M2. More specifically, the control device 9 executes the sputter adhesion preventive agent discharge mode M1, and then executes the first processing mode M2.

[0158] (Second machining mode M3) 31, the control device 9 can execute the second processing mode M3 in which the laser LB is irradiated onto the pipe P without the tip 31 of the spatter guard 30 being inserted into the pipe P. In the example shown in FIG. 31, when the second processing mode M3 is executed, the tip 31 of the spatter guard 30 is positioned at a position retracted from the axis of the laser LB emitted from the laser head 71.

[0159] The control device 9 may be capable of sequentially executing the spatter adhesion preventive agent discharge mode M1 and the second processing mode M3. In this case, the spatter guard 30 is not inserted into the pipe P. However, since the spatter adhesion preventive agent is applied to the inner surface Pn of the pipe P, adhesion of spatter to the inner surface Pn of the pipe P is suppressed.

[0160] In the examples shown in FIGS. 28, 30, and 31, the control device 9 can selectively execute the sputter adhesion preventive agent discharge mode M1, the first processing mode M2, and the second processing mode M3.

[0161] The control device 9 may be configured with one computer or multiple computers. As illustrated in FIG. 32 , the control device 9 includes a hardware processor 90 (hereinafter simply referred to as the “processor 90”), a memory 92, a communication circuit 94, and an input device 96 (e.g., a touch-panel display 962). The processor 90, the memory 92, the communication circuit 94, and the input device 96 are connected to each other via a bus 98. Data required for machining the pipe P (e.g., workpiece data 926 including shape data of the pipe P and machining position data of the pipe P) may be input to the control device 9 via the input device 96, or may be input to the control device 9 from another computer via the communication circuit 94. The input device 96 is not limited to the touch-panel display 962. For example, the control device 9 may include the input device 96 such as a button, a switch, a lever, a pointing device, or a keyboard, and a display that displays the data input to the input device 96 or other information.

[0162] The control device 9 generates a plurality of control commands (for example, the first group of control commands E1 and the second group of control commands E2) by executing the machining program 922 stored in the memory 92. Furthermore, the communication circuit 94 transmits the plurality of control commands generated by the control device 9 to a plurality of control target devices (for example, the rotation drive device 63, the laser irradiation device 70, the moving device 75, the spatter adhesion suppression device 2, the gripping jaw moving device 66, the guide roller moving device 68, etc.). In this way, the control device 9 can control a plurality of control target devices.

[0163] (Fifth embodiment) A laser processing method according to an embodiment will be described with reference to Figures 1 to 33. Figure 33 is a flowchart showing an example of a laser processing method according to the fifth embodiment.

[0164] The laser processing machine 1 used in the laser processing method of the fifth embodiment may be the laser processing machine 1 of the fourth embodiment, or may be another laser processing machine. Since each component of the laser processing machine 1 has been explained in the first to fourth embodiments, repeated explanations of each component of the laser processing machine 1 will be omitted.

[0165] In the first step ST1, a sputter adhesion preventive agent C1 is discharged onto the tip end 31 of the sputter guard 30 and the inner surface Pn of the pipe P. The first step ST1 is a sputter adhesion preventive agent discharge step.

[0166] 1, 4, 7, 15, 16, 17, 18, 27, 28, and 29, the discharge of the sputter adhesion preventive agent C1 onto the tip 31 of the sputter guard 30 and the discharge of the sputter adhesion preventive agent C1 onto the inner surface Pn of the pipe P are performed simultaneously. On the other hand, in the examples shown in FIGS. 23, 24, and 26, the discharge of the sputter adhesion preventive agent C1 onto the tip 31 of the sputter guard 30 and the discharge of the sputter adhesion preventive agent C1 onto the inner surface Pn of the pipe P are performed at different times.

[0167] 1, 4, 7, 15, 16, 17, 18, 28, and 29, the sputter adhesion preventive agent ejection step (first step ST1) may include ejecting a fluid containing the sputter adhesion preventive agent C1 (e.g., oil-air containing oil and air) from the ejection unit 36 ​​of the sputter guard 30 onto both the tip end 31 of the sputter guard 30 and the inner surface Pn of the pipe P. In the examples shown in FIGS. 1, 4, 7, 15, 16, 17, 18, and 28, the sputter adhesion preventive agent ejection step (first step ST1) includes ejecting a fluid containing the sputter adhesion preventive agent C1 (e.g., oil-air containing oil and air) from the ejection unit 36 ​​located outside the pipe P onto both the tip end 31 of the sputter guard 30 and the inner surface Pn of the pipe P. Alternatively, or additionally, as illustrated in FIG. 29, the spatter adhesion prevention agent ejection process (first step ST1) may include injecting a fluid containing a spatter adhesion prevention agent C1 (e.g., oil-air containing oil and air) from an injection section 36 located inside the pipe P onto both the tip 31 of the spatter guard 30 and the inner surface Pn of the pipe P.

[0168] As illustrated in Figures 15, 16, 26, 28, and 29, the sputter adhesion prevention agent ejection process (first step ST1) may include rotating the pipe P around the longitudinal central axis of the pipe P while the sputter adhesion prevention agent C1 is being ejected (more specifically, while the sputter adhesion prevention agent C1 is being ejected from the injection portion 36 or nozzle 301 of the sputter guard 30).

[0169] In this case, the spatter adhesion preventive agent C1 can be applied efficiently over the entire circumference of the inner surface Pn of the pipe P.

[0170] In the examples shown in Figures 15, 16, 28, and 29, the sputter adhesion preventive agent ejection process (first step ST1) includes injecting a mixed fluid D2 containing gas and a sputter adhesion preventive agent C1 (e.g., oil-air containing oil and air) onto the inner surface Pn of the pipe P from the injection portion 36 of the sputter guard 30 while rotating the pipe P around the first axis AX.

[0171] As illustrated in FIG. 1, the sputter adhesion preventive agent discharging step (first step ST1) may include discharging the sputter adhesion preventive agent C1 onto the edge Pe of the inner surface Pn of the pipe P on the fourth direction DR4 side.

[0172] In second step ST2, the pipe P is irradiated with a laser LB. Second step ST2 is a laser irradiation process. The pipe P is processed by irradiating the pipe P with the laser LB. A through hole of any shape may be formed in the pipe P by irradiating the pipe P with the laser LB. Alternatively, or additionally, a slit may be formed in the pipe P by irradiating the pipe P with the laser LB. Alternatively, or additionally, the pipe P may be separated into a first pipe and a second pipe by irradiating the pipe P with the laser LB.

[0173] In the examples described in Figures 2, 3, 5, 6, 8, 12, 13, 14, 19, 20, 21, 25, and 30, the laser irradiation process (second step ST2) is performed with the tip 31 of the sputter guard 30 inserted into the pipe P.

[0174] The laser irradiation step (in other words, irradiating the pipe P with the laser LB while the tip portion 31 of the spatter guard 30 is inserted into the pipe P) and rotating the pipe P about the first axis AX may be performed simultaneously. Alternatively, or additionally, the laser irradiation step (in other words, irradiating the pipe P with the laser LB while the tip portion 31 of the spatter guard 30 is inserted into the pipe P) and moving the pipe P in a direction along the first axis AX may be performed simultaneously. Alternatively, or additionally, the laser irradiation step (in other words, irradiating the pipe P with the laser LB while the tip portion 31 of the spatter guard 30 is inserted into the pipe P) and moving the laser head 71 may be performed simultaneously.

[0175] The sputter adhesion preventive agent discharging step (first step ST1) is preferably performed before the laser irradiation step (second step ST2). The sputter adhesion preventive agent discharging step (first step ST1) and the laser irradiation step (second step ST2) may be performed alternately. For example, before a first portion of the pipe P is laser processed, the sputter adhesion preventive agent C1 may be discharged onto the inner surface of the first portion. Alternatively, after the first portion of the pipe P is laser processed, the sputter adhesion preventive agent C1 may be discharged onto the inner surface of the second portion before the second portion of the pipe P is laser processed. Furthermore, the second portion of the pipe P may then be laser processed.

[0176] By performing the laser irradiation step (second step ST2), spatter B is generated from the pipe P. The spatter B is received by the tip 31 of the spatter guard 30.

[0177] In the third step ST3, spatter B generated by irradiating the pipe P with the laser LB is blown off from the tip 31 of the spatter guard 30 onto the inner surface Pn of the pipe P. The third step ST3 is a blowing step.

[0178] In the examples shown in Figures 2, 3, 5, 6, 8, 12, 13, 14, 19, 20, 21, 25, and 30, the blowing-off process (in other words, the process of blowing off spatter B) is carried out by injecting a fluid D (for example, a gas D1 such as air, or a mixed fluid D2 containing a spatter adhesion prevention agent C1 and gas D1) from the injection portion 36 of the spatter guard 30 onto the tip 31 of the spatter guard 30.

[0179] The type of fluid D injected from the injection portion 36 of the sputter guard 30 in the blowing-off step (third step ST3) may be different from the type of fluid D injected from the injection portion 36 of the sputter guard 30 in the sputter adhesion preventive agent ejection step (first step ST1). For example, the fluid D injected from the injection portion 36 of the sputter guard 30 in the blowing-off step (third step ST3) is a gas (e.g., air) that does not contain a sputter adhesion preventive agent, and the fluid D injected from the injection portion 36 of the sputter guard 30 in the sputter adhesion preventive agent ejection step (first step ST1) is a fluid (e.g., oil air) that contains the sputter adhesion preventive agent C1.

[0180] Alternatively, or additionally, the proportion of the sputter adhesion prevention agent C1 in the fluid D sprayed from the spray portion 36 of the sputter guard 30 in the blowing-off process (third step ST3) may be smaller than the proportion of the sputter adhesion prevention agent C1 in the fluid D sprayed from the spray portion 36 of the sputter guard 30 in the sputter adhesion prevention agent ejection process (first step ST1).

[0181] In the blowing-off step (third step ST3), if the proportion of the sputter adhesion preventive agent C1 in the fluid D injected from the injection portion 36 of the sputter guard 30 is small or zero, the amount of the sputter adhesion preventive agent C1 consumed can be small. Also, if the sputter B is collected by the suction device 55, the amount of the sputter adhesion preventive agent C1 (e.g., oil) collected by the suction device 55 can be small. Therefore, the adverse effect of the sputter adhesion preventive agent C1 (e.g., oil) on the suction device 55 can be small, and the suction device 55 is less likely to break down.

[0182] It is preferable that the blowing-off process (in other words, spraying fluid D from the spray portion 36 of the sputter guard 30 onto the tip 31 of the sputter guard 30) be performed in parallel with the laser irradiation process (in other words, irradiating the pipe P with laser LB while the tip 31 of the sputter guard 30 is inserted into the pipe P).

[0183] During the laser irradiation step (in other words, irradiating the pipe P with a laser beam LB while the tip portion 31 of the sputter guard 30 is inserted into the pipe P), the fluid D (e.g., a gas D1 such as air, or a mixed fluid D2 containing a sputter adhesion preventive agent C1 and the gas D1) may be constantly injected from the injection portion 36 of the sputter guard 30 onto the tip portion 31 of the sputter guard 30. Alternatively, during the laser irradiation step (in other words, irradiating the pipe P with a laser beam LB while the tip portion 31 of the sputter guard 30 is inserted into the pipe P), the fluid D (e.g., a gas D1 such as air, or a mixed fluid D2 containing a sputter adhesion preventive agent C1 and the gas D1) may be intermittently injected from the injection portion 36 of the sputter guard 30 onto the tip portion 31 of the sputter guard 30.

[0184] The laser processing method in the fifth embodiment may include a suction step of suctioning the spatter B. More specifically, as illustrated in Fig. 21 , in a fourth step ST4, the spatter B is suctioned from the internal space SP2 of the pipe P into the suction device 55 (suction step). By discharging the spatter B to the outside of the pipe P, the spatter B is prevented from adhering to the inner surface Pn of the pipe P.

[0185] In the example shown in FIG. 21, in the suction step (fourth step ST4), the spatters B are sucked by the suction device 55 so that the spatters B are discharged to the outside of the pipe P through the second end Pb of the pipe P.

[0186] The suction step (in other words, the suction device 55 suctioning the spatter B from the internal space SP2 of the pipe P) is preferably performed in parallel with the blowing step (in other words, the spraying of the fluid D from the spraying portion 36 of the spatter guard 30 to the tip end 31 of the spatter guard 30). In the example shown in Fig. 21, the fluid D (for example, a gas D1 such as air, or a mixed fluid D2 containing a spatter adhesion inhibitor C1 and the gas D1) sprayed from the spraying portion 36 of the spatter guard 30 blows the spatter B from the tip end 31 of the spatter guard 30 to the inner surface Pn of the pipe P, and the spatter B is sucked from the internal space SP2 of the pipe P to the suction device 55 via the second end Pb of the pipe P, are performed in parallel.

[0187] 21, the suction step (fourth step ST4) includes sucking the spatter B in the third direction DR3 and sucking in the third direction DR3 the spatter adhesion preventive agent C1 (e.g., oil) adhered to the inner surface Pn of the pipe P. In this case, the spatter adhesion preventive agent C1 discharged onto the inner surface of the first end Pa of the pipe P is diffused in the third direction DR3 (see the dashed arrows in FIG. 21).

[0188] The suction step (fourth step ST4) is preferably performed in parallel with the laser irradiation step (second step ST2). The suction step (fourth step ST4) may be started prior to the laser irradiation step (second step ST2). In this case, prior to laser processing of the pipe P, the sputter adhesion preventive agent C1 discharged onto the inner surface of the first end Pa of the pipe P is diffused in the third direction DR3.

[0189] In the laser processing method of the fifth embodiment, the pipe P is irradiated with a laser beam LB while the tip 31 of the sputter guard 30 is inserted into the pipe P. Therefore, the tip 31 of the sputter guard 30 receives the spatter B that scatters from the pipe P during laser processing of the pipe P, and prevents the spatter B from adhering to the inner surface Pn of the pipe P.

[0190] In the laser processing method according to the fifth embodiment, a spatter adhesion preventive agent C1 is discharged onto the tip end 31 of the spatter guard 30 and the inner surface Pn of the pipe P.

[0191] Since the sputter adhesion preventive agent C1 is discharged onto the tip 31 of the sputter guard 30, sputter B scattered from the pipe P during laser processing of the pipe P is prevented from adhering to the tip 31 of the sputter guard 30. More specifically, although the sputter B scattered from the pipe P is received by the tip 31 of the sputter guard 30, the sputter adhesion preventive agent C1 prevents the sputter B from adhering to the tip 31 due to this reception.

[0192] In the laser processing method of the fifth embodiment, the fluid D injected onto the tip 31 of the sputter guard 30 blows the sputter B from the tip 31 of the sputter guard 30 onto the inner surface Pn of the pipe P. Therefore, the accumulation of the sputter B on the tip 31 of the sputter guard 30 is suppressed.

[0193] Furthermore, because the spatter adhesion preventive agent C1 is applied to the inner surface Pn of the pipe P, the spatter B blown off from the tip portion 31 of the spatter guard 30 onto the inner surface Pn of the pipe P is prevented from adhering to the inner surface Pn of the pipe P. More specifically, although the spatter B blown off from the tip portion 31 of the spatter guard 30 is received by the inner surface Pn of the pipe P, the spatter B is prevented from adhering to the inner surface Pn due to this reception by the spatter adhesion preventive agent C1.

[0194] The present invention is not limited to the above-described embodiments or modifications, and it is clear that each embodiment or modification can be appropriately modified or changed within the scope of the technical concept of the present invention. Furthermore, various techniques used in each embodiment or modification can be applied to other embodiments or modifications as long as no technical contradiction occurs. Furthermore, optional additional configurations in each embodiment or modification can be omitted as appropriate. [Explanation of symbols]

[0195] 1...laser processing machine, 2, 2A, 2B, 2C...spatter adhesion suppression device, 3...discharge device, 3a...first discharge device, 3b...second discharge device, 9...control device, 12...component of laser processing machine, 12a...air cylinder, 30...spatter guard, 30-2...second spatter guard, 30d...base end, 30e...tip, 31...tip portion, 31u...upper surface, 35...middle portion, 36...injection portion, 36h...injection hole, 36j...auxiliary injection hole, 38...base end, 38v...fluid flow path, 41...mixer, 41a...lubricator, 42...tank, 43...pump, 44...air supply pipe, 45a...first flow path, 45b... Second flow path, 45c...common flow path, 45e...third flow path, 46a...first supply device, 46b...second supply device, 47a...first pipe, 47a-2...pipe different from first pipe, 47b...second pipe, 48...connector, 49a...first on-off valve, 49b...first flow rate adjustment valve, 49c...second on-off valve, 49d...second flow rate adjustment valve, 49e...third on-off valve, 51...spatter guard moving device, 51a...first drive device, 51b...second drive device, 52a...first slider, 52b...second slider, 54...guide roller, 55...suction device, 56...spatter suction port, 57...cleaning device, 57b...brush, 60...support device , 61...first chuck, 62...second chuck, 63...rotation drive device, 63a...first rotation drive device, 63b...second rotation drive device, 64...gripping member, 65...gripping jaws, 65a...first gripping jaws, 65b...second gripping jaws, 66...gripping jaw moving device, 67...guide roller, 68...guide roller moving device, 70...laser irradiation device, 71...laser head, 72...assist gas ejection unit, 75...moving device, 76...first chuck moving device, 77...laser head moving device, 77a...first linear motion device, 77b...second linear motion device, 77c...third linear motion device, 90...hardware processor, 92... Memory, 94...communication circuit, 96...input device, 98...bus, 301...nozzle, 302...nozzle support, 320n...inner surface, 321...bottom wall, 321u...upper surface, 323...first side wall, 323e...upper edge, 323n...first side surface, 325...second side wall, 325e...upper edge, 325n...second side surface, 360...outlet, 360u...upper end, 360w...lower end, 922...machining program, 926...workpiece data, 962...touch panel display, AS...air source, AT...longitudinal center axis of pipe, AX...first axis, B...spatter, C1...spatter adhesion prevention agent, D...fluid, D1...gas,D2...mixed fluid, DR1...first direction, DR2...second direction, DR3...third direction, DR4...fourth direction, DR5...fifth direction, DR6...sixth direction, E1...control command, E1-1...first movement command, E1-2...first injection command, E1-3...First rotation command, E1-4...Movement command, E2...Control command, E2-1...Second movement command, E2-2...Laser injection command, E2-3...Second injection command, E2-4...Second rotation command, E2-5...Third movement command, E2-6 ...Suction command, G...assist gas, LB...laser, M1...spatter adhesion prevention agent discharge mode, M2...first processing mode, M3...second processing mode, N1...mixed fluid supply mode, N2...gas supply mode, OP...opening, P...pipe, P1...first position, P2...second position, P3...third position, Pa...first end, Pb...second end, Pe...edge of the inner surface of the pipe on the fourth direction side, Pm...middle part, Pn...inner surface, SP1...elongated space, SP2...internal space,

Claims

1. a sputter guard that is inserted into the pipe and has a tip that receives sputters generated due to laser irradiation of the pipe; an injection unit that injects a fluid onto the tip end of the spatter guard; a discharge device that discharges a spatter adhesion preventive agent onto the tip of the spatter guard and the inner surface of the pipe; Equipped with A device for suppressing spatter adhesion in laser processing machines.

2. the discharge device includes a first flow path that supplies a mixed fluid containing a gas and the sputter adhesion preventive agent to the spray part, The discharge device is capable of discharging the mixed fluid from the injection portion onto the inner surface of the pipe. The spatter adhesion suppression device for a laser processing machine according to claim 1.

3. The ejection device is capable of adjusting the proportion of the sputter adhesion preventive agent in the mixed fluid ejected from the ejection unit. The spatter adhesion suppression device for a laser processing machine according to claim 2.

4. The discharge device includes a second flow path that supplies the gas to the injection portion. The spatter adhesion suppression device for a laser processing machine according to claim 2.

5. The discharge device is a first on-off valve that opens and closes the first flow path; a second on-off valve that opens and closes the second flow path; Equipped with The spatter adhesion suppression device for a laser processing machine according to claim 4.

6. The discharge device is capable of discharging the mixed fluid onto the inner surface of the pipe with the injection portion positioned outside the pipe. The spatter adhesion suppression device for a laser processing machine according to claim 2.

7. The discharge device is a gas supply mode in which only gas is supplied to the injection portion; a mixed fluid supply mode in which a mixed fluid containing the gas and the sputter adhesion preventive agent is supplied to the injection part; can be selectively executed The spatter adhesion suppression device for a laser processing machine according to claim 1.

8. The discharge device includes a lubricator that mixes the anti-spatter agent into the gas. The spatter adhesion suppression device for a laser processing machine according to any one of claims 2 to 7.

9. The ejection portion is disposed on the spatter guard. The spatter adhesion suppression device for a laser processing machine according to any one of claims 1 to 7.

10. the tip portion has a bottom wall, a first side wall, and a second side wall opposite the first side wall; When a direction from a base end of the spatter guard toward a tip end of the spatter guard is defined as a first direction, an elongated space extending in the first direction is defined by the bottom wall, the first side wall, and the second side wall, The ejection unit ejects the fluid into the elongated space. The spatter adhesion suppression device for a laser processing machine according to any one of claims 1 to 7.

11. a support device for supporting the pipe; a rotation drive device that rotates the pipe around a first axis; a laser irradiation device having a laser head that irradiates the pipe with a laser; a moving device that moves the laser head relative to the pipe; a spatter adhesion suppression device; a control device that controls the rotation drive device, the laser irradiation device, the moving device, and the sputter adhesion suppression device; Equipped with The spatter adhesion suppression device is a sputter guard inserted into the pipe from a first end thereof and having a tip portion configured to receive sputters generated due to irradiation of the pipe with the laser; a sputter guard moving device that moves the sputter guard; an injection unit that injects a fluid onto the tip end of the spatter guard; a discharge device that discharges a spatter adhesion preventive agent onto the tip of the spatter guard and the inner surface of the pipe; Equipped with Laser processing machine.

12. a suction device that sucks the spatter so that the spatter is discharged from the internal space of the pipe to the outside of the pipe through the second end of the pipe; The laser processing machine according to claim 11.

13. The control device a spatter adhesion prevention agent discharge mode; The first processing mode is executable, the sputter adhesion preventive agent discharge mode includes transmitting a control command from the control device to at least the sputter adhesion suppression device so that the sputter adhesion preventive agent is discharged onto the tip portion of the sputter guard and the inner surface of the pipe; The first processing mode includes transmitting a control command from the control device to at least the laser irradiation device and the spatter adhesion suppression device so that the laser head irradiates the pipe with the laser and the spatter is blown off from the tip of the spatter guard onto the inner surface of the pipe.

13. The laser processing machine according to claim 11 or 12.

14. a step of discharging a spatter adhesion preventive agent onto the tip of the spatter guard and the inner surface of the pipe; irradiating the pipe with a laser while the tip of the spatter guard is inserted into the pipe; a step of blowing spatter generated by irradiating the pipe with the laser from the tip of the spatter guard onto the inner surface of the pipe; Equipped with The step of blowing away the spatter is performed by injecting a fluid from an injection portion of the spatter guard onto the tip of the spatter guard. Laser processing method.

15. The step of discharging the sputter adhesion preventive agent includes rotating the pipe around a central axis in a longitudinal direction of the pipe while the sputter adhesion preventive agent is being discharged. The laser processing method according to claim 14.

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