High-temperature superconductor

By positioning the superconducting layer at the center of the wire's thickness and using protective and stabilizing layers, the conductor's critical current is maintained, addressing strain-related performance issues in yttrium-based superconducting wires.

JP2026006051AActive Publication Date: 2026-01-16MITSUBISHI ELECTRIC CORP +1
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Patent Information

Application Number
JP2024104796
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-06-28
Publication Date
2026-01-16
Estimated Expiration
2044-06-28

AI Technical Summary

Technical Problem

Yttrium-based high-temperature superconducting wires face reduced performance due to tensile strain when spirally wound with the superconducting layer facing outward, leading to a decrease in critical current.

Method used

A high-temperature superconducting conductor design where the superconducting layer is positioned at the center of the wire's thickness, with a protective and stabilizing layer configuration that minimizes tensile strain by facing the superconducting layer outward during winding.

Benefits of technology

The design suppresses the decrease in critical current, enhancing the conductor's performance by reducing strain-related degradation.

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Abstract

To obtain a high-temperature superconductor in which reduction in critical current is suppressed.SOLUTION: The high-temperature superconducting conductor 10 includes a cylindrical metal rod 2 and a tape-shaped high-temperature superconducting wire 1 spirally wound around the metal rod 2, and the high-temperature superconducting wire 1 includes a high-temperature superconducting portion 9 having a tape-shaped substrate 3, a high-temperature superconducting layer 5 formed on one surface of the substrate 3 via an intermediate layer 4, a protective layer 6 formed on one surface of the high-temperature superconducting layer 5, and a stabilization layer 7 covering the periphery of the substrate 3, the intermediate layer 4, the high-temperature superconducting layer 5, and the protective layer 6; The high-temperature superconducting wire 1 is wound around the metallic rod 2 with the 101a of the lower surface on the substrate 3 side facing the metallic rod 2 and the 101b of the upper surface on the high-temperature superconducting layer 5 side facing the outside.SELECTED DRAWING: Figure 2
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Description

[Technical Field]

[0001] The present disclosure relates to a high-temperature superconducting conductor using a high-temperature superconducting wire. [Background technology]

[0002] Development of an assembly conductor using high-temperature superconducting wire for application of high magnetic fields is underway. Among the high-temperature superconducting wires used in assembly conductors, yttrium-based high-temperature superconducting wires have particularly excellent magnetic field characteristics, and high performance conductors are expected. Yttrium-based high-temperature superconducting wires have a superconducting layer formed on a tape-shaped substrate. However, because the superconducting layer is a thin film and the yttrium-based superconducting material itself is ceramic, it is vulnerable to mechanical stress. For this reason, conductor structures have been proposed that protect against distortion that occurs during conductor formation and coil winding, as well as electromagnetic stress during current flow.

[0003] As disclosed in Non-Patent Document 1, a high-temperature superconductor has been developed in which a tape-shaped yttrium-based high-temperature superconducting wire is spirally wound around a metal rod. High-temperature superconducting spiral conductors have excellent flexibility and can be used with a small former diameter, allowing for the application of large currents. [Prior art documents] [Non-patent literature]

[0004] [Non-Patent Document 1] DC van der Laan et al, “Supercond. Sci. Technol. 32 033001”, IOP Publishing, 2019, p.1-33 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the high-temperature superconductor disclosed in Non-Patent Document 1 has a structure in which a superconducting layer thinner than the substrate is formed on a substrate. Therefore, the high-temperature superconducting layer is not located at the center of the wire's thickness. Bending the wire with the high-temperature superconducting layer facing inward generates compressive strain in the high-temperature superconducting layer. Conversely, bending the wire with the high-temperature superconducting layer facing outward generates tensile strain in the high-temperature superconducting layer. Yttrium-based superconducting materials are weak against tensile strain, resulting in a decrease in their critical current, which is the maximum current that can be carried. Therefore, when spirally winding tape-shaped yttrium-based high-temperature superconducting wire around a metal rod to produce a conductor, winding the high-temperature superconducting layer facing outward causes a problem of reduced performance.

[0006] The present disclosure has been made in view of the above, and has an object to obtain a high-temperature superconducting conductor in which a decrease in critical current is suppressed. [Means for solving the problem]

[0007] To solve the above-mentioned problems and achieve the object, the present disclosure provides a high-temperature superconducting conductor comprising a cylindrical metal rod and a tape-shaped high-temperature superconducting wire spirally wound around the metal rod. The high-temperature superconducting wire comprises a tape-shaped substrate, a high-temperature superconducting layer formed on one side of the substrate with an intermediate layer interposed therebetween, a protective layer formed on one side of the high-temperature superconducting layer, a high-temperature superconducting portion having a stabilizing layer covering the substrate, intermediate layer, high-temperature superconducting layer, and protective layer, and a metal portion arranged so that the high-temperature superconducting layer is located at the center of the thickness of the high-temperature superconducting wire. The high-temperature superconducting wire is wound around the metal rod with the surface facing the substrate facing the metal rod and the surface facing the high-temperature superconducting layer facing outward. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to obtain an effect of obtaining a high-temperature superconducting conductor in which a decrease in critical current is suppressed. [Brief explanation of the drawings]

[0009] [Figure 1] Overall view of a high-temperature superconductor according to embodiment 1 [Figure 2]Cross-sectional view of a high-temperature superconducting conductor according to embodiment 1 [Figure 3] 1 is a cross-sectional view of a high-temperature superconducting wire used in a high-temperature superconducting conductor according to Embodiment 1. [Figure 4] 1 is a cross-sectional view of a high-temperature superconducting portion used in a high-temperature superconducting conductor according to embodiment 1. [Figure 5] FIG. 10 is a diagram showing the configuration of a high-temperature superconducting wire of a high-temperature superconducting conductor according to a second embodiment. [Figure 6] FIG. 10 is a diagram showing the configuration of a high-temperature superconducting wire of a high-temperature superconducting conductor according to a third embodiment. [Figure 7] FIG. 10 is a diagram showing the configuration of a high-temperature superconducting wire of a high-temperature superconducting conductor according to a fourth embodiment. [Figure 8] FIG. 10 is a diagram showing the configuration of a high-temperature superconducting wire of a high-temperature superconducting conductor according to a fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] High-temperature superconducting conductors according to embodiments will be described in detail below with reference to the drawings.

[0011] Embodiment 1 FIG. 1 is an overall view of a high-temperature superconducting conductor according to a first embodiment. FIG. 2 is a cross-sectional view of the high-temperature superconducting conductor according to the first embodiment. A high-temperature superconducting conductor 10 according to the first embodiment includes high-temperature superconducting wires 1a, 1b, and 1c and a metal rod 2. In the following description, when the three high-temperature superconducting wires 1a, 1b, and 1c need to be distinguished from one another, they will be referred to as high-temperature superconducting wire 1a, high-temperature superconducting wire 1b, or high-temperature superconducting wire 1c. When the high-temperature superconducting wires 1a, 1b, and 1c are referred to collectively without distinction, they will be referred to as high-temperature superconducting wire 1. Note that FIG. 2 shows only the high-temperature superconducting wire 1a, and does not show the high-temperature superconducting wires 1b and 1c.

[0012] The metal rod 2 is cylindrical. The metal rod 2 may be cylindrical with a hole in the axial direction. The metal rod 2 may also be made by twisting together a plurality of cylindrical metal rods.

[0013] The high-temperature superconducting wire 1 is tape-shaped and spirally wound around the metal rod 2. Three high-temperature superconducting wires 1a are wound side by side around the metal rod 2, and three high-temperature superconducting wires 1b are wound side by side and overlapping on the high-temperature superconducting wires 1a. Furthermore, three high-temperature superconducting wires 1c are wound side by side and overlapping on the high-temperature superconducting wires 1b. That is, the high-temperature superconducting wires 1a, 1b, and 1c are wound side by side and overlapping on the metal rod 2 in this order. The high-temperature superconducting wires 1a, 1b, and 1c in the same layer are wound so as not to overlap each other.

[0014] As shown in Figure 1, high-temperature superconducting wires 1a, 1b, and 1c are spirally wound to form multiple layers. High-temperature superconducting wire 1b in the second layer is wound in a direction opposite to that of high-temperature superconducting wire 1a in the first layer. High-temperature superconducting wire 1c in the third layer is wound in a direction opposite to that of high-temperature superconducting wire 1b in the second layer. By reversing the winding direction of high-temperature superconducting wire 1 for each layer in this way, the solenoid magnetic field generated by the current flowing in each layer can be reduced, and the amount of current that can be passed through the conductor can be increased. 1 shows a configuration in which the winding rotation direction of the high-temperature superconducting wire 1a for the first layer is opposite to that of the high-temperature superconducting wire 1b for the second layer and the winding rotation direction of the high-temperature superconducting wire 1b for the second layer is opposite to that of the high-temperature superconducting wire 1c for the third layer, but the winding rotation direction of the high-temperature superconducting wire 1a for the first layer may be the same as that of the high-temperature superconducting wire 1b for the second layer.Furthermore, the winding rotation direction of the high-temperature superconducting wire 1b for the second layer may be the same as that of the high-temperature superconducting wire 1c for the third layer.

[0015] 3 is a cross-sectional view of a high-temperature superconducting wire used in the high-temperature superconducting conductor according to embodiment 1. The high-temperature superconducting wire 1 includes a high-temperature superconducting portion 9 and a metal portion 8. As shown in FIG.

[0016] FIG. 4 is a cross-sectional view of a high-temperature superconductor used in the high-temperature superconductor according to the first embodiment. The high-temperature superconductor 9 includes a substrate 3, an intermediate layer 4, a high-temperature superconducting layer 5, a protective layer 6, and a stabilizing layer 7. As shown in FIG. 4, the high-temperature superconductor 9 includes an intermediate layer 4 laminated on one side of a tape-shaped substrate 3, a high-temperature superconducting layer 5 laminated on one side of the intermediate layer 4, and a protective layer 6 laminated on one side of the high-temperature superconducting layer 5. The high-temperature superconductor 9 also includes a stabilizing layer 7 that surrounds the entire laminate of the substrate 3, intermediate layer 4, high-temperature superconducting layer 5, and protective layer 6. The high-temperature superconductor 9 may be configured such that at least one of the intermediate layer 4 and the protective layer 6 is omitted.

[0017] In the following explanation, the components of the high-temperature superconducting wire 1 will be explained using an xyz Cartesian coordinate system having three mutually perpendicular axes: x, y, and z. The z direction is the longitudinal direction of the high-temperature superconducting wire 1. The y direction is the stacking direction of each layer of the superconducting wire and is referred to as the thickness direction. The x direction is referred to as the width direction. Hereinafter, the dimension in the width direction will be simply referred to as "width," and the dimension in the thickness direction will be simply referred to as "thickness." In the thickness direction, the direction from the substrate 3 toward the high-temperature superconducting layer 5 will be referred to as "upper," and the direction from the high-temperature superconducting layer 5 toward the substrate 3 will be referred to as "lower."

[0018] The high-temperature superconducting wire 1, in which the metal portion 8 and the high-temperature superconducting portion 9 are joined, is spirally wound around the metal rod 2 with the lower surface 101a facing the metal rod 2 and the upper surface 101b facing outward. The high-temperature superconducting wire 1a, which has the metal portion 8 wound around the metal rod 2, is joined to the metal rod 2 at least in part of the surface that comes into contact with the metal rod 2 using solder or another alloy.

[0019] The substrate 3 is a tape-shaped metal substrate. For example, a nickel alloy such as Hastelloy (registered trademark) can be used for the substrate 3, but metals other than the exemplified materials may also be used. The thickness of the substrate 3 is the greatest among the layers constituting the high-temperature superconductor portion 9.

[0020] The intermediate layer 4 does not have to be configured as only one layer, but may have a multi-layer structure in which, for example, an Al2O3 layer, a Y2O3 layer, an MgO layer, a CeO2 layer, or a LaMnO3 layer is laminated.

[0021] The high temperature superconducting layer 5 is laminated on the upper surface of the intermediate layer 4. In the high temperature superconducting section 9 having a configuration in which the intermediate layer 4 is omitted, the high temperature superconducting layer 5 is laminated on the upper surface of the substrate 3.

[0022] The high-temperature superconducting layer 5 is formed using an oxide superconductor. For example, the high-temperature superconducting layer 5 is formed using an oxide superconductor such as ReBa2Cu3O 7-δ The symbol "Re" in the above chemical formula represents a rare earth metal, such as yttrium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, and lutetium. The element represented by the symbol "Re" is the compound ReBa2Cu3O 7-δ As long as the element exhibits superconducting properties below a certain temperature, it may be an element other than the elements exemplified above. Furthermore, δ in the above chemical formula is the amount of oxygen vacancy, and takes a value in the range of 0 to 1. The material of the high-temperature superconducting layer 5 may be a superconductor other than the oxide superconductors described above, and the constituent elements may not contain oxygen.

[0023] The position of the high-temperature superconducting layer 5 in the thickness direction is above the center of the thickness of the high-temperature superconducting wire 1.

[0024] The protective layer 6 is laminated on the upper surface of the high temperature superconducting layer 5. The protective layer 6 can be formed using a metal with good electrical conductivity such as silver or gold, or an alloy using these metals.

[0025] The stabilization layer 7 is provided so as to surround the entire laminated substrate 3, intermediate layer 4, high-temperature superconducting layer 5, and protective layer 6. Therefore, the stabilization layer 7 forms a lower surface 111a, which is the end surface of the high-temperature superconductor portion 9 facing the substrate 3, an upper surface 111b, which is the end surface facing the high-temperature superconducting layer 5, and side surfaces 111c and 111d. The side surfaces 111c and 111d connect the lower surface 111a and the upper surface 111b. The stabilization layer 7 can be formed using a metal with good conductivity such as copper or a copper alloy.

[0026] The metal portion 8 is in the form of a tape having the same width as the high-temperature superconducting portion 9, and is made of a metal such as copper, silver, or gold that has good electrical conductivity and flexibility.

[0027] As shown in Fig. 3, the metal part 8 is joined to the upper surface 111b of the high-temperature superconductor part 9 via a brazing part 91. The thickness of the metal part 8 is set so that the high-temperature superconducting layer 5 is located at the center in the thickness direction of the high-temperature superconducting wire 1. In this specification, the "center in the thickness direction" refers to a position where, when the high-temperature superconducting wire 1 is bent in the thickness direction with the upper surface 101b facing outward, the tensile strain on the high-temperature superconducting layer 5 is reduced compared to when the metal part 8 is not joined, and the high-temperature superconducting layer 5 does not need to be located at the center in the thickness direction where the distance from the lower surface 101a is equal to the distance from the upper surface 101b.

[0028] By joining the metal part 8 to the high-temperature superconducting part 9 as described above, it is possible to suppress the tensile strain that occurs in the high-temperature superconducting layer 5 when the high-temperature superconducting wire 1 is wound around the metal rod 2 with the lower surface 101a facing the metal rod 2 and the upper surface 101b facing outward, and to suppress the decrease in the allowable current value.

[0029] The above-mentioned examples of the materials of the respective parts of the high-temperature superconducting wire 1 are merely representative, and the materials of the respective parts of the high-temperature superconducting wire 1 are not limited to the above-mentioned examples.

[0030] Although the example here shows a configuration in which each layer has three high-temperature superconducting wires 1, the number of high-temperature superconducting wires 1 in each layer may be one or two, or may be four or more. In this case, the high-temperature superconducting wires 1 are wound so that they do not overlap each other in the same layer. The number of high-temperature superconducting wires 1 in each layer does not need to be the same, and the number may differ for each layer.

[0031] Next, a description will be given of a method for manufacturing the high-temperature superconducting conductor 10 according to embodiment 1. The high-temperature superconducting conductor 10 is manufactured by joining the metal portion 8 to the high-temperature superconducting portion 9, and then spirally winding the high-temperature superconducting wire 1 having the metal portion 8 around the metal rod 2 with the lower surface 101a facing the metal rod 2 and the upper surface 101b facing outward.

[0032] The high-temperature superconducting portion 9 can be manufactured by a known method for manufacturing a high-temperature superconducting wire. For example, first, a tape-shaped substrate 3 is prepared. Next, an intermediate layer 4 is laminated on the upper surface of the substrate 3. After that, a high-temperature superconducting layer 5 is laminated on the upper surface of the intermediate layer 4. Next, a protective layer 6 is laminated on the upper surface of the high-temperature superconducting layer 5. After that, a stabilizing layer 7 is attached so as to surround the laminated substrate 3, intermediate layer 4, high-temperature superconducting layer 5, and protective layer 6. The stabilizing layer 7 may be applied by metal plating.

[0033] The metal part 8 is joined by soldering or brazing to the stabilizing layer 7 that forms the end face of the high-temperature superconductor part 9 facing the high-temperature superconducting layer 5. At this time, a brazed joint 91 is formed between the metal part 8 and the stabilizing layer 7 that forms the end face of the high-temperature superconductor part 9 facing the high-temperature superconducting layer 5. An alloy such as solder or a general brazing material is used to braze the metal part 8 to the stabilizing layer 7 that forms the end face of the high-temperature superconductor part 9 facing the high-temperature superconducting layer 5.

[0034] The high-temperature superconducting conductor 10 is manufactured by spirally winding a high-temperature superconducting wire 1 having a metal portion 8 around a metal rod 2. Part or all of the contact surface between the high-temperature superconducting wire 1 and the metal rod 2 may be brazed. In addition, when the high-temperature superconducting wire 1 has multiple layers, adjacent high-temperature superconducting wires 1 may be brazed to each other.

[0035] The high-temperature superconducting conductor 10 according to embodiment 1 includes a metal part 8 joined to the surface of the high-temperature superconducting part 9 facing the high-temperature superconducting layer 5, and the high-temperature superconducting layer 5 is located at the center in the thickness direction of the high-temperature superconducting wire 1. Therefore, when the high-temperature superconducting wire 1 is bent with the high-temperature superconducting layer 5 facing outward, tensile strain is unlikely to occur in the high-temperature superconducting layer 5, and a decrease in the allowable current value can be prevented.

[0036] Embodiment 2 The high-temperature superconducting conductor 10 according to the second embodiment is configured by winding a high-temperature superconducting wire 1 around a metal rod 2, similar to the high-temperature superconducting conductor 10 according to the first embodiment. FIG. 5 is a diagram showing the configuration of a high-temperature superconducting wire of a high-temperature superconducting conductor according to the second embodiment. In the high-temperature superconducting wire 1 according to the second embodiment, the metal portion 8 includes a first portion 8a and a second portion 8b. In the high-temperature superconducting wire 1 according to the second embodiment, the brazed portion 91 surrounds the high-temperature superconducting portion 9 in the thickness direction and the width direction.

[0037] Both the first portion 8a and the second portion 8b are made of tape-shaped metal. The width of each of the first portion 8a and the second portion 8b is wider than the high-temperature superconductor portion 9. The width of the first portion 8a and the width of the second portion 8b may be equal. Furthermore, the material of each of the first portion 8a and the second portion 8b is the same as that of the metal portion 8 of the high-temperature superconductor 10 according to the first embodiment.

[0038] The first portion 8a is joined to the upper surface 111b of the high-temperature superconductor portion 9 via a brazing portion 91. The second portion 8b is joined to the lower surface 111a of the high-temperature superconductor portion 9 via a brazing portion 91. Both widthwise ends of the first portion 8a and the second portion 8b protrude from the high-temperature superconductor portion 9, and are located outside the side surfaces 111c, 111d of the high-temperature superconductor portion 9.

[0039] The brazed joints 91 are formed of a brazing material such as solder or another alloy. The brazed joints 91 are located between the lower surface 111a of the high-temperature superconductor 9 and the second portion 8b, between the upper surface 111b of the high-temperature superconductor 9 and the first portion 8a, between the first portion 8a including the side surface 111c of the high-temperature superconductor 9 and the second portion 8b, and between the first portion 8a including the side surface 111d of the high-temperature superconductor 9 and the second portion 8b so as to surround the high-temperature superconductor 9, and join the high-temperature superconductor 9 to the first portion 8a and the second portion 8b.

[0040] The thickness of each of the first portion 8a, the second portion 8b and the brazed portion 91 is set so that the high-temperature superconducting layer 5 is located at the center of the high-temperature superconducting wire 1 in the thickness direction.

[0041] In the high-temperature superconducting wire 1 according to the second embodiment, the high-temperature superconducting portion 9 is sandwiched between the first portion 8a and the second portion 8b of the metal portion 8, and a brazing portion 91 is present so as to surround the periphery of the high-temperature superconducting portion 9. This allows for a stronger bond between the high-temperature superconducting portion 9 and the metal portion 8. Furthermore, since the second portion 8b of the metal portion 8 is bonded to the lower surface 111a of the high-temperature superconducting portion 9 and the first portion 8a of the metal portion 8 is bonded to the upper surface 111b of the high-temperature superconducting portion 9, the thicknesses of the first portion 8a and the second portion 8b of the metal portion 8 can be adjusted in various ways so that the high-temperature superconducting layer 5 is located in the center of the thickness.

[0042] The high-temperature superconducting wire 1 according to the second embodiment is manufactured by successively joining the metal portion 8 and the high-temperature superconducting portion 9 by soldering or the like from the longitudinal ends to form the brazed joint portion 91.

[0043] Like the high-temperature superconducting conductor 10 according to the first embodiment, the high-temperature superconducting conductor 10 according to the second embodiment can suppress deterioration of the high-temperature superconducting wire 1 due to tensile strain occurring in the high-temperature superconducting layer 5.

[0044] Embodiment 3 The high-temperature superconducting conductor 10 according to the third embodiment is configured by winding a high-temperature superconducting wire 1 around a metal rod 2, similar to the high-temperature superconducting conductor 10 according to the first embodiment. FIG. 6 is a diagram showing the configuration of a high-temperature superconducting wire of a high-temperature superconducting conductor according to the third embodiment. In the high-temperature superconducting wire 1 according to the third embodiment, the metal portion 8 includes a first portion 8a and a second portion 8b. The first portion 8a is disposed along the upper surface 111b of the high-temperature superconducting portion 9, and the second portion 8b is disposed along the lower surface 111a. The high-temperature superconducting wire 1 also includes brazed portions 91a and 91b that join the high-temperature superconducting portion 9 to the first portion 8a and the second portion 8b. The difference from the high-temperature superconducting wire 1 of embodiment 2 is that no solder joint is provided in the portion where the first portion 8a faces the upper surface 111b of the high-temperature superconducting portion 9, and in the portion where the second portion 8b faces the lower surface 111a of the high-temperature superconducting portion 9.

[0045] The first portion 8a and the second portion 8b are the same as the first portion 8a and the second portion 8b of the high-temperature superconducting wire 1 according to the second embodiment. That is, the first portion 8a and the second portion 8b are both made of tape-shaped metal, and the width of each of the first portion 8a and the second portion 8b is larger than the width of the high-temperature superconducting portion 9. The width of the first portion 8a and the width of the second portion 8b may be equal. Furthermore, the material of each of the first portion 8a and the second portion 8b is the same as that of the metal portion 8 described in the first embodiment.

[0046] Both widthwise ends of the first portion 8a and the second portion 8b extend beyond the high-temperature superconducting portion 9, and both widthwise ends of the first portion 8a and the second portion 8b are positioned outside the side surfaces 111c, 111d of the high-temperature superconducting portion 9.

[0047] The first portion 8a and the second portion 8b are joined by brazing portions 91a and 91b at both ends protruding from the high-temperature superconductor portion 9. The brazing portion 91a joins the side surface 111c of the high-temperature superconductor portion 9 to one end of the first portion 8a and one end of the second portion 8b. The brazing portion 91b joins the side surface 111d of the high-temperature superconductor portion 9 to the other end of the first portion 8a and the other end of the second portion 8b.

[0048] In the high-temperature superconducting wire 1 according to the second embodiment, the portion where the first portion 8a of the metal portion 8 faces the upper surface 111b of the high-temperature superconducting portion 9 and the portion where the second portion 8b of the metal portion 8 faces the lower surface 111a of the high-temperature superconducting portion 9 are joined by brazing, and therefore, when the high-temperature superconducting wire 1 is bent, the stabilization layer 7 of the high-temperature superconducting wire 1 may peel off, resulting in deterioration of the high-temperature superconducting wire 1. In the high-temperature superconducting wire 1 according to the third embodiment, no brazing portions are provided in the portion where the first portion 8a of the metal portion 8 faces the upper surface 111b of the high-temperature superconducting portion 9 and the portion where the second portion 8b of the metal portion 8 faces the lower surface 111a of the high-temperature superconducting portion 9, and therefore, deterioration of the high-temperature superconducting wire 1 due to peeling of the stabilization layer 7 that occurs when the high-temperature superconducting wire 1 is bent can be prevented.

[0049] The high-temperature superconducting wire 1 according to the third embodiment is manufactured by joining the metal portion 8 and the high-temperature superconducting portion 9 together by forming brazing portions 91a, 91b, for example, by sequentially soldering both widthwise end portions of each of the first portion 8a and the second portion 8b that protrude from the high-temperature superconducting portion 9 together, starting from the longitudinal ends. At this time, an agent that inhibits penetration of solder, such as oil or grease, may be applied in advance to the lower surface 111a and the upper surface 111b of the high-temperature superconducting portion 9, so that the solder does not penetrate into the portion where the first portion 8a of the metal portion 8 faces the upper surface 111b of the high-temperature superconducting portion 9 and the portion where the second portion 8b of the metal portion 8 faces the lower surface 111a of the high-temperature superconducting portion 9.

[0050] The high-temperature superconducting conductor 10 according to the third embodiment can suppress deterioration of the high-temperature superconducting wire 1 due to tensile strain in the high-temperature superconducting layer 5 and deterioration of the high-temperature superconducting wire 1 due to peeling of the stabilizing layer 7 .

[0051] Embodiment 4 The high-temperature superconducting conductor 10 according to the fourth embodiment is constructed by winding a high-temperature superconducting wire 1 around a metal rod 2, similar to the high-temperature superconducting conductor 10 according to the first embodiment. FIG. 7 is a diagram showing the configuration of the high-temperature superconducting wire of the high-temperature superconducting conductor according to the fourth embodiment. The high-temperature superconducting wire 1 according to the seventh embodiment has a metal portion 8 having a U-shaped cross section perpendicular to the longitudinal direction. The metal portion 8 has a first portion 8a and a second portion 8b extending in the width direction, each of which has one end connected to another by a third portion 8c extending in the thickness direction. The widths of the first portion 8a and the second portion 8b are larger than the width of the high-temperature superconducting portion 9, and the high-temperature superconducting portion 9 is entirely contained within the U-shaped portion of the metal portion 8, which is surrounded on three sides by the first portion 8a, the second portion 8b, and the third portion 8c.

[0052] The thickness of the first portion 8a, the thickness of the second portion 8b, and the width of the third portion 8c may be different from one another. The thickness of the first portion 8a and the thickness of the second portion 8b are set so that the high-temperature superconducting layer 5 is located at the center of the high-temperature superconducting wire 1 in the thickness direction.

[0053] 7, the metal part 8 and the high-temperature superconductor part 9 are joined by a brazing part 91 at the open side of the U-shape including the side surface 111d of the high-temperature superconductor part 9. The high-temperature superconductor part 9 and the metal part 8 are not joined at the lower surface 111a, the upper surface 111b and the side surface 111c of the high-temperature superconductor part 9.

[0054] In the high-temperature superconducting wire 1 of embodiment 4, the portion where the first portion 8a faces the upper surface 111b of the high-temperature superconducting portion 9 and the portion where the second portion 8b faces the lower surface 111a of the high-temperature superconducting portion 9 are not soldered together with solder or the like. Therefore, as with the high-temperature superconducting wire 1 of embodiment 3, deterioration of the high-temperature superconducting wire 1 due to peeling of the stabilization layer 7 that occurs when the high-temperature superconducting wire 1 is bent can be prevented.

[0055] The high-temperature superconducting wire 1 according to the fourth embodiment is manufactured by joining the first portion 8a, the second portion 8b, and the side surface 111d of the high-temperature superconductor portion 9 at the open side of the U-shape of the metal portion 8 by soldering or the like, starting from the longitudinal end, to form a brazed joint 91. At this time, to prevent the penetration of a brazing material such as solder into a portion where the first portion 8a of the metal portion 8 faces the upper surface 111b of the high-temperature superconductor portion 9 and a portion where the second portion 8b of the metal portion 8 faces the lower surface 111a of the high-temperature superconductor portion 9, an agent such as oil or fat that inhibits the penetration of a brazing material such as solder may be applied in advance to the lower surface 111a and the upper surface 111b of the high-temperature superconductor portion 9.

[0056] In the high-temperature superconducting wire 1 of embodiment 4, the portion where the first portion 8a faces the upper surface 111b of the high-temperature superconducting portion 9 and the portion where the second portion 8b faces the lower surface 111a of the high-temperature superconducting portion 9 are not soldered together with solder or the like, and therefore, deterioration of the high-temperature superconducting wire 1 due to tensile strain in the high-temperature superconducting layer 5 and deterioration of the high-temperature superconducting wire 1 due to peeling of the stabilizing layer 7 can be suppressed.

[0057] Embodiment 5. The high-temperature superconducting conductor 10 according to the fifth embodiment is configured by winding a high-temperature superconducting wire 1 around a metal rod 2, similar to the high-temperature superconducting conductor 10 according to the first embodiment. Fig. 8 is a diagram showing the configuration of the high-temperature superconducting wire of the high-temperature superconducting conductor according to the fifth embodiment. In the high-temperature superconducting wire 1 according to the fifth embodiment, the high-temperature superconducting portion 9 and the metal portion 8 are directly joined without a brazing portion.

[0058] The metal portion 8 is provided so as to cover the entire upper surface 111b of the high-temperature superconductor portion 9. The thickness of the metal portion 8 is set so that the high-temperature superconducting layer 5 is located at the center in the thickness direction of the high-temperature superconducting wire 1. The material of the metal portion 8 is the same as that of the metal portion 8 described in the first embodiment.

[0059] The metal portion 8 is, for example, a metal plated layer formed by subjecting the upper surface 111b of the high-temperature superconductor portion 9 to metal plating.

[0060] In the high-temperature superconducting wire 1 according to the first to fourth embodiments, the metal part 8 is joined to the high-temperature superconducting part 9 by brazing using solder or the like, which requires a manufacturing step of heating and melting the brazing to bring it into contact with the high-temperature superconducting part 9, and the heat may cause a deterioration in the performance of the high-temperature superconducting wire 1. In the high-temperature superconducting wire 1 according to the fifth embodiment, the metal part 8 joined to the high-temperature superconducting part 9 is formed by metal plating, so the performance of the high-temperature superconducting wire 1 does not deteriorate due to heat.

[0061] In the metal plating process, the plating thickness can be adjusted by adjusting the processing time for plating, so the high-temperature superconducting wire 1 according to embodiment 5 allows for easy adjustment of the thickness dimension of the metal portion 8.

[0062] Furthermore, metals such as solder used for brazing have lower electrical conductivity than metals used for metal portion 8. Since the high-temperature superconducting wire 1 according to embodiment 5 does not have a brazed portion, it has lower electrical resistance when current is applied from the outside than the high-temperature superconducting wires 1 according to embodiments 1 to 4, and can reduce power loss.

[0063] The configurations shown in the above embodiments are merely examples of the content, and may be combined with other known technologies, or parts of the configurations may be omitted or modified without departing from the spirit of the invention. [Explanation of symbols]

[0064] 1, 1a, 1b, 1c high-temperature superconducting wire, 2 metal rod, 3 substrate, 4 intermediate layer, 5 high-temperature superconducting layer, 6 protective layer, 7 stabilization layer, 8 metal part, 8a first part, 8b second part, 8c third part, 9 high-temperature superconducting part, 10 high-temperature superconducting conductor, 91, 91a, 91b brazed part, 101a, 111a bottom surface, 101b, 111b top surface, 111c, 111d side surface.

Claims

1. The device comprises a cylindrical metal rod and a tape-shaped high-temperature superconducting wire wound in a spiral shape around the metal rod, The high-temperature superconducting wire is a high-temperature superconducting section including a tape-shaped substrate, a high-temperature superconducting layer formed on one surface of the substrate via an intermediate layer, a protective layer formed on one surface of the high-temperature superconducting layer, and a stabilizing layer covering the periphery of the substrate, the intermediate layer, the high-temperature superconducting layer, and the protective layer; a metal portion disposed so as to be positioned at the center of the high-temperature superconducting layer in the thickness direction of the high-temperature superconducting wire, The high-temperature superconducting wire is wound around the metal rod with the surface on the substrate side facing the metal rod and the surface on the high-temperature superconducting layer side facing outward.

2. 2. The high-temperature superconducting conductor according to claim 1, wherein the metal portion is in the form of a tape having the same width as the high-temperature superconducting portion, and is joined to the stabilizing layer on the high-temperature superconducting layer side via a brazing portion.

3. the metal part has a tape shape wider than the high-temperature superconductor part, a first part joined to the stabilization layer forming the end face of the high-temperature superconductor part on the high-temperature superconducting layer side, and a second part also having a tape shape wider than the high-temperature superconductor part, and joined to the stabilization layer forming the end face of the high-temperature superconductor part on the substrate side; 2. The high-temperature superconducting conductor according to claim 1, wherein the portions of the first and second portions that protrude from the high-temperature superconducting portion are joined to the stabilizing layer that forms the side surface of the high-temperature superconducting portion via a brazing joint.

4. the metal portion has a tape-shaped first portion wider than the high-temperature superconductor portion and disposed along the stabilization layer that forms the end face of the high-temperature superconductor portion on the high-temperature superconducting layer side, and a tape-shaped second portion wider than the high-temperature superconductor portion and disposed along the stabilization layer that forms the end face of the high-temperature superconductor portion on the substrate side, 2. The high-temperature superconductor according to claim 1, wherein the portions of the first and second portions that protrude from the high-temperature superconducting portion are joined to the stabilizing layer that forms a lateral end face in the stacking direction of the high-temperature superconducting portion via a brazing joint.

5. the metal portion has a first portion wider than the high-temperature superconductor portion and disposed along the stabilization layer that forms the end face of the high-temperature superconductor portion on the high-temperature superconducting layer side, a second portion wider than the high-temperature superconductor portion and disposed along the stabilization layer that forms the end face of the high-temperature superconductor portion on the substrate side, and a third portion connecting one end of each of the first portion and the second portion, the high-temperature superconducting portion is disposed in a space surrounded on three sides by the first portion, the second portion, and the third portion, 2. The high-temperature superconductor according to claim 1, wherein the portions of the first and second portions that protrude from the high-temperature superconducting portion are joined to the stabilizing layer that forms a lateral end face in the stacking direction of the high-temperature superconducting portion via a brazing joint.

6. 2. The high-temperature superconductor according to claim 1, wherein the metal portion is a metal plating layer formed on the stabilization layer that forms the end face of the high-temperature superconductor portion on the high-temperature superconducting layer side.

Citation Information

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