Component collecting method for mounting line

Abstract

To improve efficiency of component collection work in a mounting line.SOLUTION: In a component recovery method of a mounting line 10 for mounting a component E on a substrate 5, a recovery plate 70 is arranged adjacent to the substrate 5 and simultaneously conveyed onto the mounting line 10, and a component required to be recovered in a working process of the mounting line 10 is directly recovered onto the recovery plate 70 by using a working head 42.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a technology for recovering parts. [Background technology]

[0002] The mounting line is made up of machines such as printing machines, inspection machines, and manters (surface mount machines), and circuit boards are sent to each machine in sequence using a transport device such as a conveyor, where they undergo printing, inspection, mounting, and other processes to produce circuit boards.

[0003] If any abnormality occurs during the work process on a mounting line, the component may be collected and discarded or reused. Patent Document 1 below discloses a surface mounter equipped with a component disposal box, and Patent Document 2 discloses an electronic circuit component placement machine equipped with a component disposal box. [Patent Document 1] JP 2010-272620 A [Patent Document 2] JP 2011-129846 A DISCLOSURE OF THE INVENTION [Problem to be solved by the invention]

[0004] An object of the present invention is to improve the efficiency of component collection work in a mounting line. [Means for solving the problem]

[0005] (1) A component recovery method for a mounting line in which components are mounted on a board, in which a recovery plate is placed adjacent to the board and transported simultaneously on the mounting line, and components that need to be recovered during a work process on the mounting line are directly recovered onto the recovery plate using a work head. The recovery plate only needs to be adjacent to the board in the board transport direction, and may be located either upstream or downstream from the board. It may also be connected to the board, or not. Any configuration other than the above is optional for the component recovery method described in (1), and any configuration may be used.

[0006] In the configuration (1), components that need to be collected during the work process on the mounting line are collected directly onto a collection plate that is transported along the mounting line at the same time as the board. This allows for efficient collection work. In addition, the collection plate can be collected collectively at a designated location, such as downstream of the line. This eliminates the need to collect the collection plate for each machine on the mounting line, reducing the burden of the collection work.

[0007] (2) In the component recovery method described in (1), the recovery plate may be connected to the substrate being transported at the same time. In this configuration, the recovery plate is integrated with the substrate, which stabilizes transportation and makes it easy to recognize its position.

[0008] (3) In the component recovery method described in (1), if the recovery plate is not connected to the substrate, a gap may be provided between the substrate and the recovery plate. This configuration eliminates the need for a mechanism for attaching or detaching the recovery plate to the substrate, thereby avoiding the complexity of the line equipment. Furthermore, collision of the recovery plate with the substrate during simultaneous transport can be avoided, thereby preventing misalignment of the components mounted on the substrate. Furthermore, it can prevent the recovered components from falling off.

[0009] (4) In the component recovery method according to any one of (1) to (3), the mounting line may include a machine that performs a predetermined operation on a circuit board. When the recovery plate is carried in, the machine may photograph a mark on the recovery plate and recognize the position of the recovery plate based on the photograph. This configuration allows the position of the recovery plate to be identified from the mark recognition result, enabling accurate component recovery operations. This is effective when the recovery plate is not connected to a circuit board.

[0010] (5) In the component recovery method according to any one of (1) to (4), the mounting line may include a machine that performs a predetermined operation on a circuit board. When the recovery plate is delivered, the machine may photograph the recovery plate immediately after delivery and confirm the components that have been recovered by the upstream machine. This configuration also makes it possible to confirm that the components recovered by the upstream machine have been correctly recovered (that they have not fallen during transport).

[0011] (6) In the part collection method according to any one of (1) to (5), when the machine collects parts onto the collection plate, the machine may take an image of the state of the collection plate after the parts have been collected. This configuration makes it possible to confirm whether the parts have been collected from the image after collection.

[0012] (7) In the part collection method according to any one of (1) to (6), the machine may be provided with a built-in waste box, and the machine may be able to select whether to collect the parts on the collection plate or to discard them in the waste box. This configuration allows flexible collection operations according to the situation by providing two options, the collection plate and the waste box.

[0013] (8) In the part collection method according to any one of (1) to (7), a collection area may be set on the collection plate according to part information. The part information may be, for example, the maximum size or type of part to be collected. When the collection area is set wider than the maximum size of the part, the part can be placed in the collection area with ample space, so that the collection operation can be performed without errors. When the collection area is set for each type of part, there is an advantage that parts of the same type can be collected together from the collection plate.

[0014] (9) In the part collection method according to any one of (1) to (8), a priority order may be set for the collected parts. In this configuration, parts with higher priority can be collected on the collection plate with priority.

[0015] (10) In the parts collection method described in (9), the priority may be set based on at least one of the cost and the number of parts to be collected. [Effects of the Invention]

[0016] According to the present invention, the efficiency of parts collection work can be improved. [Brief explanation of the drawings]

[0017] [Figure 1] Mounting line configuration diagram [Figure 2] Plan view of the mounter [Figure 3] Diagram showing the head unit support structure [Figure 4] Mounter block diagram [Figure 5] Top view of the substrate and collection plate [Figure 6] Cross section of Figure 5 [Figure 7] Diagram of how parts are collected [Figure 8] Parts collection flow [Figure 9] Top view of the substrate and collection plate [Figure 10A] Diagram showing the normal component pickup position [Figure 10B] Diagram showing the component pickup position during vertical pickup [Figure 11A] Diagram showing parts collection area [Figure 11B] Diagram showing parts collection area [Figure 12] Mounting line configuration diagram [Figure 13] Diagram explaining how the loader works [Figure 14A] Diagram showing the connection mechanism [Figure 14B] Diagram showing the connection mechanism [Figure 15] Diagram explaining the operation of the unloader [Figure 16A] Diagram showing the disconnect mechanism [Figure 16B] Diagram showing the disconnect mechanism [Figure 17]Diagram explaining how the loader works [Figure 18] Diagram explaining the operation of the unloader [Figure 19] Top view of the substrate and collection plate [Figure 20] Diagram showing parts collection area [Figure 21] Illustration of priority of parts to be collected BEST MODE FOR CARRYING OUT THE INVENTION

[0018] <Embodiment 1> 1. Mounting line description 1 is a line configuration diagram of a mounting line 10. The mounting line 10 is a line for mounting components E on a board 5. The mounting line 10 is equipped with a printer 11, an SPI 12, a mounter 13, an inspection machine 14, a reflow device 15, and an inspection machine 16. These machines 11 to 16 are connected in series via a conveying device 32.

[0019] The transfer device 32 is a device that transfers the substrate 5 in the X direction, and may be a transfer conveyor or a linearly driven uniaxial robot. In this embodiment, a transfer conveyor equipped with a pair of conveyor rails 35 is used.

[0020] Mounting line 10 sends substrate 5 to each machine 11-16 in order by conveyance device 32, while performing predetermined operations (printing ⇒ post-printing inspection ⇒ component mounting ⇒ post-mounting inspection ⇒ reflow ⇒ post-reflow inspection).

[0021] Furthermore, each of the machines 11 to 16 on the mounting line 10 is connected to a production management device 18 via a LAN (local area network). The production management device 18 manages the production plan and production results (including the collection history of component E) of the mounting line 10. Note that machines 11 to 16 are a collective term for each of the devices that make up the mounting line 10.

[0022] Hereinafter, the transport direction of the substrate 5 is defined as the X direction, the direction perpendicular to this is defined as the Y direction, and the vertical direction is defined as the Z direction.

[0023] 2. Mounter explanation The mounter 13 is a device that mounts components E on the board 5. The mounter 13 is also called a surface mounter. The number of mounters 13 may be one or more, and in this embodiment, a line configuration is used in which three mounters 13A to 13C are arranged in series.

[0024] As shown in FIGS. 2 and 3, the mounter 13 includes a base 31, a transport device 32 that transports the substrate 5 in the X direction, a head unit 33, and a drive device .

[0025] The driving device 34 is a device that moves the head unit 33 in a planar direction (X and Y directions) on the base 31. The driving device 34 is made up of a Y-axis ball screw 36, a Y-axis motor 37, an X-axis ball screw 38, and an X-axis motor 39.

[0026] By driving the Y-axis motor 37, the X-beam 40 and the head unit 33 can be moved in the Y direction along the guide rails 41 (Y-axis servo mechanism).

[0027] By driving the X-axis motor 39, the head unit 33 can be moved in the X direction relative to the X-beam 40 (X-axis servo mechanism).

[0028] 3, the head unit 33 is equipped with a plurality of mounting heads (an example of a working head of the present invention) 42. The mounting heads 42 are configured to be able to move up and down independently of the head unit 33 by a linear motion mechanism (for example, a screw mechanism) driven by a Z-axis motor 48. In addition, the mounting heads 42 can be rotated around their axes by an R-axis motor.

[0029] Negative pressure is supplied to the mounting head 42 from a negative pressure means (not shown), which generates a suction force at the head tip (suction nozzle 42A). The mounting head 42 can hold the component E by the negative pressure.

[0030] 2, four component supply units 25 are provided around the work position in the center of the base. In the component supply unit 25, a large number of tape feeders F are installed side by side, for example, via dollies.

[0031] The tape feeder F supplies electronic components E to be mounted on the substrate 5. The components E are electronic components such as resistors and capacitors. A waste box 26 is also provided on the base 31. The waste box 26 is for disposing of defective components.

[0032] With the above configuration, the mounting head 42 can pick up the component E from the tape feeder F and mount it on the board 5. In this embodiment, the series of operations from picking up the component E to mounting it is called mounting.

[0033] The mounter 13 is also equipped with multiple inspection cameras to check the status of the work process (board delivery, component pickup, component mounting, etc.). Specifically, it is equipped with a component recognition camera 43, a side view camera 44, and a board recognition camera 45.

[0034] The component recognition camera 43 is fixed on the base 31 with its imaging surface facing upward, and captures an image of the bottom surface of the component E picked up by the mounting head .

[0035] Side view camera 44 is installed on X-beam 40 and captures a side image of component E picked up by mounting head 42. The images from component recognition camera 43 and side view camera 44 make it possible to confirm the state of component E being picked up by mounting head 42. By correcting the mounting position and mounting angle of component E on board 5 according to the state of component E being picked up, it is possible to improve the mounting accuracy of component E.

[0036] 3, the board recognition camera 45 is fixed to the head unit 33 with its imaging surface facing downward. The board recognition camera 45 can capture a planar image of the board 5 brought into the work position. The image from the board recognition camera 45 can be used to check the state of the board 5 before and after component mounting.

[0037] 4, the mounter 13 includes a control device 50, an X-axis motor 39, a Y-axis motor 37, a Z-axis motor 48, a conveying device 32, a component recognition camera 43, a side-view camera 44, and a board recognition camera 45. The control device 50 includes a CPU 51 and a memory 52.

[0038] The control device 50 controls the transport device 32 in accordance with the transport program recorded in the memory 52 to transport the board 5 and the collection plate 70. Also, in accordance with the mounting program recorded in the memory 52, the control device 50 controls the X-axis motor 39, the Y-axis motor 37, and the Z-axis motor 48 to execute the mounting process of the component E on the board 5. Also, in accordance with the collection program recorded in the memory 52, the control device 50 executes the collection process of the component E.

[0039] 3. Parts collection If any abnormality occurs during the mounting process, the mounter 13 recovers the component E. A method for recovering the component E using the recovery plate 70 will be disclosed below.

[0040] 5 is a plan view of the substrate 5 and the recovery plate 70. The substrate 5 is rectangular. Pads are provided on the top surface (component mounting surface) of the substrate 5. Position marks M1 are also provided on the four corners.

[0041] The recovery plate 70 is rectangular, just like the board 5. The upper surface of the recovery plate 70 is a recovery space 71 for components E. The width of the recovery plate 70 in the Y direction is approximately equal to the width of the board 5 in the Y direction so that the recovery plate 70 can be transported simultaneously with the board 5 on the mounting line by the transport device 32.

[0042] 7, the collection plate 70 is attached to the board 5 at the most upstream position of the mounting line 10. More specifically, it is attached to each board individually.

[0043] Then, the substrate 5 and the recovery plate 70 are simultaneously transported to the machines 11 to 15 of the mounting line 10 while being aligned in the X direction.

[0044] When the board 5 is carried into the work position on the base by the transport device 32, the mounter 13 photographs the position mark M1 of the board 5 with the camera 45 and recognizes the position of the board 5. Then, the mounting head 42 performs the work of mounting the component E on the board 5.

[0045] If any abnormality occurs in the mounting process, the component E is not mounted (placed) on the board 5, but is moved to a recovery plate 70 on the mounting line by using the mounting head 42 and recovered.

[0046] After collecting the components, the mounter 13 performs the remaining work, and when the mounting process is completed, the mounter 13 transports the board 5 and the collection plate 70 to a downstream machine.

[0047] Thereafter, the machines 14 to 16 perform the respective work processes in order, and when the machine reaches the most downstream part of the mounting line 10 as shown in FIG. 7, the recovery plate 70 is separated from the board 5 and recovered.

[0048] In this way, the recovery plate 70 is placed adjacent to the board 5 and is simultaneously transported onto the mounting line 10, and components that need to be recovered in the work process of the mounting line 10 (in this example, the mounting process of the mounter 3) are directly recovered onto the recovery plate 70 using a work head (in this example, the mounting head 42). Therefore, the recovery work can be carried out efficiently.

[0049] Furthermore, since the recovery plates 70 can be recovered all at once at the most downstream (exit) of the mounting line 10, there is no need to recover them for each of the machines 11 to 16, which reduces the burden of the recovery work.

[0050] The collection plate 70 may be connected to the substrate 5 by fixing the mating portion of the two members 5, 70 (the portion surrounded by the frame line A in FIG. 5) with, for example, metal fittings, tape, or a magnet.

[0051] 6, the upper surface (recovery space 71) of the recovery plate 70 may be an adhesive surface 72. The adhesive surface 72 prevents the position of the recovered components E from shifting even if the recovery plate 70 is vibrated during transport, thereby preventing the components E from falling off the recovery plate 70. The adhesive surface 72 can be formed using, for example, a heat-resistant, low-adhesion tape.

[0052] Furthermore, if the upper surface of recovery plate 70 protrudes beyond the upper surface of the substrate, recovery plate 70 may interfere with the lower surface of the mask when the printing process is performed by printer 11. Therefore, when adhesive surface 72 is provided, a recess 73 may be provided in recovery plate 70 so that adhesive surface 72 does not protrude beyond the upper surface of the substrate.

[0053] 4. Collection flow 8 shows the collection flow in the mounter 13, and is made up of steps S10 to S130. Here, the collection operation of the component E will be described using the second mounter 13B of the three mounters 13A to 13C as an example.

[0054] First, the substrate 5 and the recovery plate 70 are simultaneously transported from the mounter 13A to the mounter 13B upon completion of the mounting process in the mounter 13A.

[0055] At this time, the mounter 13A outputs collection information for the components E to the mounter 13B. The collection information is information about the type and number of the components E collected by the mounter 13A onto the collection plate 70. If there are any components collected upstream of the mounter 13A, that information is also output.

[0056] After that, when the substrate 5 and the recovery plate 70 are carried in, the mounter 13B photographs the substrate 5 and the recovery plate 70 with the camera 45 (S10, S20).

[0057] The control device 50 of the mounter 13B checks the position of the board 5 from the board image, and further checks the collected component E on the collection plate from the image of the collection plate 70. Then, it checks whether it matches the collection information for component E acquired from the mounter 13A (S30).

[0058] 9 is an image of the collection plate taken immediately after it was carried into the mounter 13B, and component E on the collection plate 70 is the component collected by the mounter 13A. The rectangular frame in the figure is the collection area for component E to be collected by the mounter 13B.

[0059] If the check result indicates a problem (S30; NO), the control device 50 of the mounter 13B outputs an alarm to notify the user of the abnormality (S80).

[0060] If the check result shows no problem (S30: YES), the control device 50 executes a loop process from S40 to S70.

[0061] This loop process is a process for mounting component E on board 5 in accordance with the mounting program, with S40 being a component pickup operation, S50 being a component recognition operation, S60 being a pickup state determination, and S70 being a component mounting operation.

[0062] The component recognition operation in S50 involves image recognition of the component E adsorbed and held by the mounting head 42 using cameras 43 and 44, and the determination of the adsorption status in S60 involves determining whether the adsorption status of the component E is good or bad based on the image recognition results.

[0063] If the suction state is normal (S60: YES), the loop process of S40 to S70 is repeated for the number of mounted components. Then, when all components E have been mounted on the board 5, the flow ends, and the board 5 and recovery plate 70 are discharged to the downstream mounter 13C.

[0064] If there is an abnormality in the suction state of component E (S60: NO), the recovery operation of component E (S90 to S130) is executed.

[0065] If the determination in S60 is NO, the control device 50 first determines whether to collect the part E that was the subject of the error in S60 (S90). In this embodiment, whether or not to perform the collection operation is determined based on the reliability of the collection operation. In the following cases, it is determined that the reliability is low.

[0066] <If it is deemed unlikely (if not subject to recall)> (1) When the part is not properly attached and may fall during collection (2) When the part is tall and there is a possibility that it may fall during collection

[0067] 10A shows the component posture during normal pickup, and FIG. 10B shows the component posture during standing pickup. Standing pickup is an example of an unstable posture, and is determined not to be subject to collection.

[0068] If the determination in S90 is YES, the control device 50 collects the component E (S100). Specifically, in the same way as when mounting the component E on the board 5, the mounting head 42 is used to move the component E onto the collection plate 70 and collect it.

[0069] The collection method (how the components E are placed on the collection plate 70) may be to collect the components E in order with ample space for the maximum size of the components E as shown in Fig. 11A, or to separate areas and collect the components E by type as shown in Fig. 11B. The first area A1 is a collection area for ICs, and the second area A2 is a collection area for chips.

[0070] After the collection operation, the control device 50 photographs the collection plate 70 again to confirm whether the component E has been collected (S120). If it has been confirmed (S120: YES), the collection operation ends.

[0071] On the other hand, if the confirmation cannot be made (S120: NO), the process proceeds to S80, where the mounter 13B outputs an alarm to notify the user of an abnormality.

[0072] Furthermore, if the determination in S90 is NO (if the component E is not subject to collection), the control device 50 uses the mounting head 42 to move the component E above the waste box 26 and discard it (S130). Even if the collection plate 70 is full and the component E cannot be placed on it, the component E is discarded in the waste box 26.

[0073] 4.Effects As described above, the recovery plate 70 is transported simultaneously with the board 5, and components E that have some kind of abnormality during the work process (the mounting process in this example) are directly recovered onto the recovery plate 70, so the recovery work can be carried out efficiently. Furthermore, if the recovered components E themselves are not abnormal, they can be reused, which reduces costs and contributes to resource conservation.

[0074] <Embodiment 2> In embodiment 1, a recovery plate 70 is attached to the substrate 5 at the beginning (most upstream) of the mounting line 10 and sent out, and when the substrate 5 and recovery plate 70 reach the end (most downstream) of the mounting line 10, the recovery plate 70 is separated from the substrate 5 and recovered.

[0075] In the second embodiment, the recovery plate 70 is connected and disconnected midway along the mounting line 10. Specifically, dedicated loaders 100 and unloaders 110 are provided midway along the mounting line 10 to connect and disconnect the recovery plate 70.

[0076] In the example of Fig. 12, a loader 100 is placed at the head of the three mounters 13A to 13C, and an unloader 110 is placed at the rear. As shown in Fig. 13, the loader 100 is equipped with a transport device 102. The loader 100 as a whole is movable in the Y direction, and can enter and exit the mounting line 10. Note that the symbol S shown in Fig. 13 is a stopper for stopping the board 5 at a work position or the like.

[0077] Once the loader 100 is positioned off-line, it can move the collecting plate 70 from the supply stock 130 onto the transport device 102. The loader 100 is then moved into-line and the connecting mechanism is used to connect the collecting plate 70 to the substrate 5.

[0078] After that, by driving the transport devices 32 and 102, the substrate 5 and the recovery plate 70 can be transported simultaneously on the mounting line 10.

[0079] The connection mechanism may be, for example, a structure using metal fittings 150 as shown in FIG. 14A, or a structure using adhesive tape 160 or a magnet as shown in FIG. 14B.

[0080] When using metal fittings 150, the connection work needs to be performed while substrate 5 and recovery plate 70 are stationary on conveying devices 32 and 102. When adhesive tape 160 or a magnet is used, there is an advantage that the recovery plate 70 can be fed by conveying device 102 and then brought into contact with substrate 5 on conveying device 32 to connect them.

[0081] The unloader 110, like the loader 100, is provided with a transport device 112. The unloader 110 is movable as a whole in the Y direction, and can enter and exit the mounting line 10.

[0082] 15 , a separation mechanism is used on the unloader 110 to separate the recovery plate 70 from the substrate 5. The unloader 110 is then moved out of the line, allowing the recovery plate 70 to be recovered from the mounting line 10. In this example, the recovered recovery plate 70 is stored in the recovery stock 140.

[0083] 16A, when substrate 5 and recovery plate 70 are connected with metal fittings 150, recovery plate 70 can be separated from substrate 5 by using mechanism 170 that pulls out metal fittings 150.

[0084] As shown in Figure 16B, when the substrate 5 and the recovery plate 70 are connected with adhesive tape 160 or a magnet, the recovery plate 70 can be separated from the substrate 5 by cutting the connection between the substrate 5 and the recovery plate 70 using a cutting mechanism 180.

[0085] The loader 100 and unloader 110 can also be provided inside the mounter 13. Specifically, the loader 100 and the supply stock 130 can be provided for the leading mounter 13A shown in FIG. 12 (see FIG. 17). Also, the unloader 110 and the recovery stock 140 can be provided for the trailing mounter 13B shown in FIG. 12 (see FIG. 18).

[0086] <Embodiment 3> In the first embodiment, the recovery plate 70 is connected to the substrate 5 and transported. In the third embodiment, the recovery plate 70 is not connected to the substrate 5, but is transported alongside the substrate 5. Not connecting the recovery plate 70 to the substrate 5 has the advantage of eliminating the need for a connection mechanism for connecting the recovery plate 70 to the substrate 5 and a disconnection mechanism for disconnecting the connection.

[0087] 19 is a plan view of the substrate 5 and the recovery plate 70, showing the positional relationship between the substrate 5 and the recovery plate 70 during simultaneous transport. The recovery plate 70 is simultaneously transported on the transport device 32, slightly spaced apart from the substrate 5. D1 indicates the distance (interval) between the substrate 5 and the recovery plate 70 in the X direction.

[0088] By providing a distance from the substrate 5, even if the collection plate 70 slides on the transport device 32, it is possible to avoid or suppress collision with the substrate 5.

[0089] Furthermore, when the recovery plate 70 is transported without being connected to the board 5, a position mark M2 may be provided on the recovery plate 70, and the position mark M2 of the recovery plate 70 may be photographed by the camera 45 when the recovery plate 70 is carried into the mounter 13. The control device 50 can recognize the position of the recovery plate 70 from the recognition result of the position mark M2, and therefore can accurately recover the component E at the target position on the recovery plate 70.

[0090] Furthermore, when the substrate 5 is transported without the recovery plate 70 connected thereto, the control device 50 may control the transport of the substrate by regarding the primary substrate 5 and the recovery plate 70 as one large substrate P. The dashed dotted line in FIG. 19 indicates the outer shape (outline) of the large substrate P.

[0091] 19, in this example, the rear gap (distance from the rear end of the recovery plate) D3 is set wider than the front gap (distance from the front end of the actual substrate) D2 of the large substrate P. By doing so, when the recovery plate 70 gradually falls behind due to repeated transport, interference with the following substrate 5 can be suppressed.

[0092] <Embodiment 4> The fourth embodiment discloses a method for collecting parts E using the collection history. From the collection history of component E on a per-mounting-line basis, data on the type, size (area), and number of components E collected per board is calculated.

[0093] From the above data, the total area U required for recovery can be calculated for each part type. U=S×N (1) S is the area of ​​the part, and N is the number of parts collected.

[0094] 20 is a diagram showing the relationship between the collection history and the area G of the collection plate 70. Area G is the range in which collected parts are placed, with Ga for part type A, Gb for part type B, and Gc for part type C. In this example, the areas G are allocated in descending order of the total area U required for collection.

[0095] By allocating the area G using the collection history, all of the parts E can be collected onto the collection plate 70 if the number of collected parts is in accordance with the collection history.

[0096] The collection history of the parts E and the data on the allocation of the areas G are managed and calculated by the production management device 18, and the results are notified to each of the mounters 13A to 13C from the production management device 18. Then, each of the mounters 13A to 13C can collect the parts E in each of the areas G on the collection plate according to the notified allocation.

[0097] <Embodiment 5> The fourth embodiment discloses a method for collecting the part E using the collection history. The fifth embodiment will explain a case where it is predicted from the collection history that the part E will not fit on the collection plate 70.

[0098] If it is predicted that the parts E will not fit on the collection plate 70, a priority is set for the parts E to be collected. The priority can be set in terms of cost, collection frequency (number of collected parts), etc. The user may also be able to change the setting.

[0099] In the example of Figure 21, the priority is set to IC component 2, IC component 1, and chip component in that order. The remaining space is set as a spare area. This spare area can be used to collect unexpected component E.

[0100] By setting the priority, specific parts, such as expensive parts, can be given priority and collected on the collection plate 70.

[0101] <Other embodiments> The present invention is not limited to the embodiments described above and illustrated in the drawings, and for example, the following embodiments are also included within the technical scope of the present invention.

[0102] (1) In the above embodiment, component E that was found to be abnormal in the mounting process by the mounter 13 was collected onto the collection plate 70. However, this is not limited to this, and component E that was found to be abnormal in the work process by another machine on the mounting line 10 may also be collected onto the collection plate 70. For example, if component E that has fallen onto the board is discovered during the inspection process by the inspection machine 14, the component E may be picked up by the inspection head and collected directly onto the collection plate 70. Note that the mounting process and inspection process are examples of work processes, and the mounting head and inspection head are examples of work heads.

[0103] (2) In the above embodiment, one form of the mounting line 10 is shown as a line configuration including the printer 11, the SPI 12, the mounter 13, the inspection machine 14, the reflow machine 15, and the inspection machine 16. The mounting line 10 may have a different line configuration as long as it includes at least one mounter 13. For example, a dispenser or the like may be added, or the reflow machine 15 may be a separate process.

[0104] (3) In the above embodiment, the substrate 5 is disposed on the downstream side and the recovery plate 70 is disposed on the upstream side. The substrate 5 and the recovery plate 70 may be disposed adjacent to each other in the substrate transport direction (X direction), and the substrate 5 may be disposed on the upstream side and the recovery plate 70 on the downstream side.

[0105] (4) In the above embodiment, the priority of the collected part E was set when it was predicted that the part E would not fit on the collection plate 70 based on the collection history of the part. The priority of the collected part E may be set regardless of the collection history of the part. Furthermore, the priority may be set based on at least one of the cost and the number of collected parts. For example, the priority may be set based only on the cost of the part, or only on the number of collected parts. Furthermore, the priority may be set based on both the cost and the number of collected parts. [Explanation of symbols]

[0106] 5. Substrate 10 Mounting Line 13 Surface Mounting Machine 32 Conveyor (conveyor device) 33 Head Unit 42 Mounting head (working head) 50 Control device 70 Recovery Plate

Claims

1. A component recovery method for a mounting line that mounts components on a board, comprising: A component recovery method in which a recovery plate is placed adjacent to the substrate and transported simultaneously onto the mounting line, and components that need to be recovered during a work process on the mounting line are directly recovered onto the recovery plate using a work head.

2. 2. The parts recovery method according to claim 1, The component recovery method further comprises connecting the recovery plate to the substrate that is being transported at the same time.

3. 2. The parts recovery method according to claim 1, When the recovery plate is not connected to the substrate, a gap is provided between the substrate and the recovery plate.

4. 2. The parts recovery method according to claim 1, the mounting line includes a machine that performs a predetermined operation on the board; When the collection plate is carried in, the machine photographs a mark on the collection plate and recognizes the position of the collection plate based on the photograph.

5. 2. The parts recovery method according to claim 1, the mounting line includes a machine that performs a predetermined operation on the board; When the recovery plate is carried in, the machine takes an image of the recovery plate immediately after it is carried in, and checks whether parts have been recovered by an upstream machine.

6. 2. The parts recovery method according to claim 1, the mounting line includes a machine that performs a predetermined operation on the board; When the machine collects parts onto the collection plate, it photographs the state of the collection plate after the parts have been collected.

7. 2. The parts recovery method according to claim 1, the mounting line includes a machine that performs a predetermined operation on the board; A part recovery method, wherein the machine is provided with a waste box installed thereon, and recovery of the part onto the recovery plate or disposal of the part into the waste box is selectable.

8. 2. The parts recovery method according to claim 1, a part collection method for setting an area on the collection plate according to part information;

9. 2. The parts recovery method according to claim 1, A parts recovery method that prioritizes the parts to be recovered.

10. 10. The parts recovery method according to claim 9, A parts collection method, wherein the priority is set based on at least one of the cost and the number of parts to be collected.

Images