Simultaneous cold and hot temperature adjustment device and removal system

Abstract

To normally execute cooling / heating of a heat exchange fluid in a state where a cold heat amount and a hot heat amount to be supplied are unbalanced SOLUTION: When the first condition that the hot heat quantity is smaller than the cold heat quantity to be supplied is satisfied, the control unit 7 controls the flow passage switching unit (valves 23282527 and) so as to switch the flow passage to the first refrigerant flow passage in which the low temperature-side refrigerant Rc passes through the heat exchangers 222624 and in this order and flows into the heat exchanger 22, thereby radiating the heat from the refrigerant Rc to the heat transfer medium liquid Wa in the heat exchanger 26. In addition, when the second condition that the heat is radiated from the heat transfer medium liquid Wa to the atmospheric air in the heat exchanger 41 and the cold heat quantity is smaller than the hot heat quantity to be supplied is satisfied, the flow path is switched to the second refrigerant flow path in which the refrigerant Rc is diverged after passing through the heat exchanger 22, is joined after passing through the heat exchangers 2426 and, and flows into the heat exchanger 22, the heat is absorbed from the heat transfer medium liquid Wa to the refrigerant Rc in the heat exchanger 26, and the heat is absorbed from the atmospheric air to the heat transfer medium liquid Wa in the heat exchanger 41.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a simultaneous cooling and heating temperature control device equipped with a multi-stage refrigeration cycle in which a low-temperature refrigerant in a low-temperature refrigeration circuit and a high-temperature refrigerant in a high-temperature refrigeration circuit are configured to be able to exchange heat in a first heat exchanger, and a first heat exchange fluid supplied to an object to be cooled is cooled in a second heat exchanger of the low-temperature refrigeration circuit, and a second heat exchange fluid supplied to an object to be heated is heated in a third heat exchanger of the high-temperature refrigeration circuit, and to a removal system configured with such a simultaneous cooling and heating temperature control device. [Background technology]

[0002] The following patent document discloses a heat pump water heater (hereinafter simply referred to as a "water heater") as an example of this type of simultaneous cooling and heating temperature adjustment device. This water heater is equipped with a dual cascade refrigeration cycle in which a first refrigerant in a low-stage refrigerant circuit (hereinafter also referred to as a "low-stage refrigerant in the "low-stage circuit") and a second refrigerant in a high-stage refrigerant circuit (hereinafter also referred to as a "high-stage refrigerant in the "high-stage circuit") can exchange heat with each other in a first heat exchanger. This water heater is also configured to be capable of five types of operation: hot water supply operation (operation for hot water supply without heating or cooling), hot water supply and heating operation (hereinafter also referred to as "hot water supply and heating operation"), hot water supply and cooling operation (hereinafter also referred to as "hot water supply and cooling operation"), heating operation (operation for heating without hot water supply), and cooling operation (operation for cooling without hot water supply).

[0003] In this hot water supply device, during hot water supply operation, the refrigerant flow path of the low-stage circuit is switched so that all of the low-stage refrigerant discharged from the first compressor passes through the first and second heat exchangers in that order, then passes through the outdoor heat exchanger, and is then drawn into the first compressor. At this time, the temperature of the hot water is increased by being preheated by the second heat exchanger of the low-stage circuit and then heated by the condenser of the high-stage circuit. During hot water supply and heating operation, in addition to the above-described flow path of the low-stage refrigerant during hot water supply operation, a refrigerant flow path is formed so that a portion of the low-stage refrigerant discharged from the first compressor passes through the indoor heat exchanger, then passes through the outdoor heat exchanger, and is then drawn into the first compressor. At this time, the temperature of the hot water is increased in the same way as during hot water supply operation, and the temperature of the indoor air is increased in the indoor heat exchanger, thereby heating the room.

[0004] Furthermore, during hot water supply and cooling operation, the refrigerant flow path is switched so that a portion of the low-stage refrigerant discharged from the first compressor passes through the first heat exchanger and the second heat exchanger in that order, then passes through the indoor heat exchanger, and is then drawn into the first compressor, and another portion of the low-stage refrigerant discharged from the first compressor passes through the outdoor heat exchanger, then passes through the indoor heat exchanger, and is then drawn into the first compressor. At this time, the hot water is preheated by the second heat exchanger in the low-stage circuit and then heated by the condenser in the high-stage circuit, thereby sufficiently increasing the temperature of the hot water, and the temperature of the indoor air is lowered in the indoor heat exchanger, thereby cooling the room.

[0005] During heating operation, the refrigerant flow path is switched so that all of the low-stage refrigerant discharged from the first compressor passes through the indoor heat exchanger, then the outdoor heat exchanger, and then is drawn into the first compressor, thereby raising the temperature of the indoor air in the indoor heat exchanger, and heating the room. Furthermore, during cooling operation, the refrigerant flow path is switched so that all of the low-stage refrigerant discharged from the first compressor passes through the outdoor heat exchanger, then the indoor heat exchanger, and then is drawn into the first compressor, thereby lowering the temperature of the indoor air in the indoor heat exchanger, and cooling the room. In this way, this hot water heater can perform heating and / or cooling processes depending on the application by switching the flow path of the low-stage refrigerant. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 4-263758 (pages 2-4, Figure 1) Summary of the Invention [Problem to be solved by the invention]

[0007] However, the water heaters disclosed in the above patent documents have the following problems.

[0008] Specifically, the water heater described above is configured to be capable of performing hot water heating operation and hot water cooling operation for the purpose of concurrently processing hot water and air conditioning. In this case, to heat a specified amount of hot water to a specified temperature within a specified time during hot water heating operation or hot water cooling operation, a sufficient amount of high-stage refrigerant needed to heat the hot water in the condenser of the high-stage circuit needs to be evaporated in the first heat exchanger. To achieve this, a sufficient amount of low-stage refrigerant needs to be supplied to the first heat exchanger, and a sufficient amount of low-stage refrigerant needs to be discharged from the first compressor so that a sufficient amount of low-stage refrigerant needed to preheat the hot water is supplied to the second heat exchanger.

[0009] Furthermore, in order to discharge a required amount of low-stage refrigerant from the first compressor during hot water supply and cooling operation, a sufficient amount of low-stage refrigerant needs to be evaporated in the indoor heat exchanger. Therefore, when the cooling set temperature during hot water supply and cooling operation is high (an example of a case where the cooling processing load for cooling to the cooling set temperature is small), if all of the low-stage refrigerant to be discharged from the first compressor is evaporated in the indoor heat exchanger, the room may be cooled to a temperature lower than the cooling set temperature. Furthermore, when the room is not cooled to a temperature lower than the cooling set temperature, the amount of evaporation in the indoor heat exchanger may be small, making it impossible to discharge the required amount of low-stage refrigerant from the first compressor. Furthermore, when the room temperature during hot water supply and cooling operation is low, the amount of evaporation in the indoor heat exchanger may be small, making it impossible to discharge the required amount of low-stage refrigerant from the first compressor.

[0010] Conversely, when the cooling setting temperature during hot water supply and cooling operation is low (an example of a case where the cooling processing load required to cool the room to the cooling setting temperature is large), even if all of the low-stage refrigerant to be discharged from the first compressor is evaporated in the indoor heat exchanger as described above, the room may not be sufficiently cooled to the cooling setting temperature. Furthermore, when cooling to a temperature lower than the cooling setting temperature, the amount of evaporation in the indoor heat exchanger is so large that a large amount of low-stage refrigerant is discharged from the first compressor in excess of the amount to be supplied to the first and second heat exchangers. As a result, a larger amount of high-stage refrigerant than necessary is evaporated in the first heat exchanger, and the hot water is preheated more than necessary in the second heat exchanger. Furthermore, even when the room temperature is high during hot water supply and cooling operation, the amount of evaporation in the indoor heat exchanger is large, causing the first compressor to discharge a large amount of low-stage refrigerant that exceeds the amount that should be supplied to the first heat exchanger and the second heat exchanger.As a result, more high-stage refrigerant than necessary is evaporated in the first heat exchanger, and the hot water is preheated more than necessary in the second heat exchanger.

[0011] In this way, in the hot water supply device disclosed in the above patent document, during hot water cooling operation in which cooling of indoor air (first heat exchange fluid) and preheating of hot water (second heat exchange fluid) in the low-stage circuit (low-temperature side refrigeration circuit) are performed in parallel with heating of hot water (second heat exchange fluid) in the high-stage circuit (high-temperature side refrigeration circuit), depending on the usage environment, it may be difficult to cool to the cooling set temperature or to heat the specified amount of hot water to the specified temperature within the specified time.

[0012] The present invention has been made in consideration of the above-mentioned problems to be solved, and its main object is to provide a simultaneous cold and warm temperature control device that can normally cool the first heat exchange fluid and heat the second heat exchange fluid even when the amount of cold heat to be supplied to the object to be cooled (the cooling processing load of the first heat exchange fluid) and the amount of warm heat to be supplied to the object to be heated (the heating processing load of the second heat exchange fluid) are not balanced. [Means for solving the problem]

[0013] In order to achieve the above object, the simultaneous cooling and heating temperature adjustment device according to claim 1 comprises a multi-stage refrigeration cycle having a low-temperature side refrigeration circuit and a high-temperature side refrigeration circuit, configured so that a low-temperature side refrigerant in the low-temperature side refrigeration circuit and a high-temperature side refrigerant in the high-temperature side refrigeration circuit can exchange heat in a first heat exchanger, and configured so that a first heat exchange fluid to be supplied to an object to be cooled can be cooled in a second heat exchanger of the low-temperature side refrigeration circuit and a second heat exchange fluid to be supplied to an object to be heated can be heated in a third heat exchanger of the high-temperature side refrigeration circuit; and a control unit for controlling the operation of the multi-stage refrigeration cycle in accordance with the amount of heat to be supplied to the object to be heated by supplying the second heat exchange fluid, and the amount of heat to be supplied to the object to be heated by supplying the second heat exchange fluid, the apparatus including a fluid circulation path in which a fourth heat exchanger capable of heat exchange between a third heat exchange fluid and the atmosphere is disposed and configured to be able to circulate the third heat exchange fluid, and configured so that the low-temperature side refrigerant and the third heat exchange fluid can exchange heat in a fifth heat exchanger, and the low-temperature side refrigeration circuit is configured so that the low-temperature side refrigerant discharged from a low-temperature side refrigerant compressor is circulated through the first heat exchanger, the fifth heat exchanger, and the a flow path switching unit that switches between a first refrigerant flow path that is passed through a second heat exchanger in this order and flows into the first heat exchanger, and a second refrigerant flow path that is split after passing through the first heat exchanger, passes through the second heat exchanger and the fifth heat exchanger, and then merges and flows into the first heat exchanger; and a first expansion valve that is arranged to allow the low-temperature side refrigerant that flows into the second heat exchanger to pass through; and and a second expansion valve arranged to allow passage of the refrigerant through the first expansion valve, and when a first condition is satisfied that the amount of hot heat to be supplied to the object to be heated is smaller than the amount of cold heat to be supplied to the object to be cooled, the control unit controls the flow path switching unit to switch to the first refrigerant flow path, thereby dissipating heat from the low-temperature side refrigerant to the third heat exchange fluid in the fifth heat exchanger and dissipating heat from the third heat exchange fluid to the atmosphere in the fourth heat exchanger, and when a second condition is satisfied that the amount of cold heat to be supplied to the object to be cooled is smaller than the amount of hot heat to be supplied to the object to be heated,By controlling the flow path switching unit to switch to the second refrigerant flow path, heat is absorbed from the third heat exchange fluid to the low-temperature side refrigerant in the fifth heat exchanger, and heat is absorbed from the atmosphere to the third heat exchange fluid in the fourth heat exchanger.

[0014] The simultaneous cooling and heating temperature control device of claim 2 is the simultaneous cooling and heating temperature control device of claim 1, wherein the second expansion valve is an electronic expansion valve whose opening can be changed under the control of the control unit, and the control unit increases the opening of the second expansion valve to increase the amount of heat absorbed from the third heat exchange fluid to the low-temperature side refrigerant in the fifth heat exchanger when the second condition is satisfied by a decrease in the amount of cold heat to be supplied to the object to be cooled, when the second condition is satisfied by an increase in the amount of hot heat to be supplied to the object to be heated, when the amount of cold heat to be supplied decreases when the second condition is satisfied, and when the amount of hot heat to be supplied increases when the second condition is satisfied, and decreases the opening of the second expansion valve to decrease the amount of heat absorbed from the third heat exchange fluid to the low-temperature side refrigerant in the fifth heat exchanger when the amount of cold heat to be supplied increases when the second condition is satisfied, and when the amount of hot heat to be supplied decreases when the second condition is satisfied.

[0015] The simultaneous cooling and heating temperature control device of claim 3 is the simultaneous cooling and heating temperature control device of claim 1, further comprising a variable air flow rate blower that blows air to be heat exchanged with the third heat exchange fluid in the fourth heat exchanger according to the control of the control unit, and the control unit adjusts the amount of heat exchange between the third heat exchange fluid and the air in the fourth heat exchanger by adjusting the amount of air blown by the blower so that the refrigerant pressure of the low-temperature side refrigerant in the low-temperature side refrigeration circuit is within a predetermined pressure range, thereby adjusting the amount of heat exchange between the third heat exchange fluid and the air in the fourth heat exchanger and the amount of heat exchange between the third heat exchange fluid and the low-temperature side refrigerant in the fifth heat exchanger.

[0016] The simultaneous cooling and heating temperature control device of claim 4 is the simultaneous cooling and heating temperature control device of claim 1, further comprising a variable air flow rate blower that blows air to be heat exchanged with the third heat exchange fluid in the fourth heat exchanger according to the control of the control unit, and when the first condition is satisfied, the control unit adjusts the air flow rate blown by the blower so that the temperature of the third heat exchange fluid flowing into the fifth heat exchanger is lower than the temperature of the low-temperature side refrigerant flowing into the fifth heat exchanger, and the temperature difference is within a predetermined first temperature range.

[0017] The simultaneous cooling and heating temperature control device of claim 5 is the simultaneous cooling and heating temperature control device of claim 1, further comprising a variable air flow rate blower that blows air to be heat exchanged with the third heat exchange fluid in the fourth heat exchanger according to the control of the control unit, and when the second condition is satisfied, the control unit adjusts the air flow rate blown by the blower so that the temperature of the third heat exchange fluid flowing into the fifth heat exchanger is higher than the temperature of the low-temperature side refrigerant flowing into the fifth heat exchanger, and the temperature difference is within a predetermined second temperature range.

[0018] The simultaneous cooling and heating temperature control device of claim 6 is the simultaneous cooling and heating temperature control device of claim 1, which is further provided with a variable flow rate pump that circulates the third heat exchange fluid within the fluid circulation path according to the control of the control unit, and when the first condition is satisfied, the control unit adjusts the amount of the third heat exchange fluid circulated by the pump so that the temperature of the third heat exchange fluid flowing into the fifth heat exchanger is lower than the temperature of the low-temperature side refrigerant flowing into the fifth heat exchanger, and the temperature difference is within a predetermined first temperature range.

[0019] The simultaneous cooling and heating temperature control device of claim 7 is the simultaneous cooling and heating temperature control device of claim 1, which is further provided with a variable flow rate pump that circulates the third heat exchange fluid within the fluid circulation path according to the control of the control unit, and when the second condition is satisfied, the control unit adjusts the amount of the third heat exchange fluid circulated by the pump so that the temperature of the third heat exchange fluid flowing into the fifth heat exchanger is higher than the temperature of the low-temperature side refrigerant flowing into the fifth heat exchanger, and the temperature difference is within a predetermined second temperature range.

[0020] A removal system according to claim 8 includes the simultaneous cooling and heating temperature control device according to any one of claims 1 to 7, and includes a plurality of adsorption towers containing adsorbents that adsorb the target to be removed contained in a gas and remove it from the gas, and is configured to be able to concurrently perform an adsorption removal process in which the target to be removed is adsorbed onto the adsorbent contained in any of the adsorption towers to remove the target to be removed from the gas, and an adsorbent regeneration process in which the target to be removed adsorbed onto the adsorbent contained in any of the other adsorption towers is desorbed from the adsorbent and regenerates the adsorption capacity of the adsorbent, and in the adsorption removal process, a heat exchanger A as the target to be cooled is supplied from the simultaneous cooling and heating temperature control device to a heat exchanger B as the target to be cooled. the first heat exchange fluid is supplied to the heat exchanger A, the gas cooled by heat exchange with the first heat exchange fluid in the heat exchanger A is allowed to flow into one of the adsorption towers, and the object to be removed contained in the gas is adsorbed by the adsorbent housed in one of the adsorption towers; and in the adsorbent regeneration process, the second heat exchange fluid is supplied from the hot and cold simultaneous temperature control device to heat exchanger B as the object to be heated, and the gas heated by heat exchange with the second heat exchange fluid in the heat exchanger B is allowed to flow into one of the other adsorption towers, and the object to be removed is released from the adsorbent housed in one of the other adsorption towers into the gas, thereby regenerating the adsorption capacity of the adsorbent. [Effects of the Invention]

[0021] The simultaneous cooling and heating temperature control device according to claim 1 includes a multi-cascade refrigeration cycle configured to enable heat exchange between a low-temperature refrigerant in a low-temperature refrigeration circuit and a high-temperature refrigerant in a high-temperature refrigeration circuit in a first heat exchanger, to cool a first heat exchange fluid supplied to an object to be cooled in a second heat exchanger of the low-temperature refrigeration circuit, and to heat a second heat exchange fluid supplied to an object to be heated in a third heat exchanger of the high-temperature refrigeration circuit; and a control unit that controls the operation of the multi-cascade refrigeration cycle according to the amount of cold heat to be supplied to the object to be cooled and the amount of hot heat to be supplied to the object to be heated. and a fluid circulation path in which a fourth heat exchanger capable of exchanging heat between the third heat exchange fluid and the atmosphere is disposed and which is configured to be able to circulate the third heat exchange fluid, and a low-temperature side refrigerant and the third heat exchange fluid are configured to be able to exchange heat in the fifth heat exchanger, and the low-temperature side refrigeration circuit is configured to have a first refrigerant flow path in which the low-temperature side refrigerant discharged from the low-temperature side refrigerant compressor is made to pass through the first heat exchanger, the fifth heat exchanger and the second heat exchanger in this order and then flow into the first heat exchanger, and a second refrigerant flow path in which the low-temperature side refrigerant is split after passing through the first heat exchanger and passes through the second heat exchanger and the fifth heat exchanger, respectively. a first expansion valve disposed to allow passage of the low-temperature side refrigerant flowing into the second heat exchanger, and a second expansion valve disposed to allow passage of the low-temperature side refrigerant flowing into the fifth heat exchanger at least when the refrigerant flow path is switched to the second refrigerant flow path, and a control unit controls the flow path switching unit when a first condition is satisfied that the amount of hot heat to be supplied to the object to be heated is less than the amount of cold heat to be supplied to the object to be cooled. When a second condition is satisfied that the amount of cold heat to be supplied to the object to be cooled is less than the amount of hot heat to be supplied to the object to be heated, the flow path switching unit is controlled to switch to the second refrigerant flow path, so that the low-temperature side refrigerant in the fifth heat exchanger absorbs heat into the third heat exchange fluid, and so that the third heat exchange fluid absorbs heat from the atmosphere in the fourth heat exchanger.

[0022] In addition, the removal system described in claim 8 is equipped with the above-mentioned simultaneous hot and cold temperature control device and multiple adsorption towers, and is configured to be able to concurrently perform an adsorption removal process in which the target to be removed is adsorbed onto an adsorbent housed in one of the adsorption towers to remove the target to be removed from the gas, and an adsorbent regeneration process in which the target to be removed adsorbed onto the adsorbent housed in one of the other adsorption towers is desorbed from the adsorbent, thereby regenerating the adsorption capacity of the adsorbent. In the adsorption removal process, a first heat exchange fluid is supplied from the simultaneous hot and cold temperature control device to heat exchanger A as the target to be cooled, and the gas cooled by heat exchange with the first heat exchange fluid in heat exchanger A is allowed to flow into one of the adsorption towers, whereby the target to be removed is adsorbed onto the adsorbent housed in one of the adsorption towers. In the adsorption regeneration process, a second heat exchange fluid is supplied from the simultaneous hot and cold temperature control device to heat exchanger B as the target to be heated, and the gas heated by heat exchange with the second heat exchange fluid in heat exchanger B is allowed to flow into one of the other adsorption towers, whereby the target to be removed is desorbed into the gas from the adsorbent housed in one of the other adsorption towers, thereby regenerating the adsorption capacity of the adsorbent.

[0023] Therefore, according to the simultaneous cooling and heating temperature control device of claim 1 and the removal system of claim 8, even when the amount of cold to be supplied to the target to be cooled and the amount of hot heat to be supplied to the target to be heated are not balanced, the difference between the amounts of cold and hot heat to be supplied can be compensated for by heat dissipation to the atmosphere or heat absorption from the atmosphere via the fluid circulation path. Therefore, the low-temperature refrigeration circuit and the high-temperature refrigeration circuit can be continuously operated without causing an excess or deficiency of cold to be supplied to the target to be cooled or a shortage of hot heat to be supplied to the target to be heated. Therefore, a necessary and sufficient amount of cold can be supplied to the target to be cooled and a necessary and sufficient amount of hot heat can be supplied to the target to be heated. Therefore, by configuring a removal system including such a simultaneous cooling and heating temperature control device, the cold required for the adsorption removal process and the hot heat required for the adsorption capacity regeneration process can be reliably supplied from the simultaneous cooling and heating temperature control device. Therefore, unnecessary removal targets can be reliably removed from the gas to be supplied to the target to be supplied, and the adsorption tower (adsorbent) whose adsorption capacity has been reduced due to adsorption of the removal targets can be reliably regenerated.

[0024] In the simultaneous cooling and heating temperature control device described in claim 2, the control unit increases the opening of the second expansion valve consisting of an electronic expansion valve to increase the amount of heat absorbed from the third heat exchange fluid to the low-temperature side refrigerant in the fifth heat exchanger when the second condition is satisfied by a decrease in the amount of cold heat to be supplied to the object to be cooled, when the second condition is satisfied by an increase in the amount of hot heat to be supplied to the object to be heated, when the amount of cold heat to be supplied decreases when the second condition is satisfied, and when the amount of hot heat to be supplied increases when the second condition is satisfied, and decreases the opening of the second expansion valve to decrease the amount of heat absorbed from the third heat exchange fluid to the low-temperature side refrigerant in the fifth heat exchanger.

[0025] Therefore, according to the simultaneous cold and warm temperature control device described in claim 2 and the removal system equipped with such a simultaneous cold and warm temperature control device, the heat exchange efficiency in the fifth heat exchanger, i.e., the degree of heat exchange between the low-temperature side refrigerant in the low-temperature side refrigeration circuit and the third heat exchange fluid in the fluid circulation path, can be reliably transitioned to an appropriate state in a short period of time, thereby sufficiently shortening the operating time when there is an excess or deficiency of cold heat to be supplied to the object to be cooled or an excess or deficiency of hot heat to be supplied to the object to be heated.

[0026] In the simultaneous cooling and heating temperature regulation device described in claim 3, the control unit adjusts the amount of heat exchange between the third heat exchange fluid and the atmosphere in the fourth heat exchanger by adjusting the amount of air blown by the variable air blower so that the refrigerant pressure of the low-temperature side refrigerant in the low-temperature side refrigeration circuit is within a predetermined pressure range, thereby adjusting the amount of heat exchange between the third heat exchange fluid and the low-temperature side refrigerant in the fifth heat exchanger.Furthermore, in the simultaneous cooling and heating temperature regulation device described in claim 4, when the first condition is satisfied, the control unit adjusts the amount of air blown by the variable air blower so that the temperature of the third heat exchange fluid flowing into the fifth heat exchanger is lower than the temperature of the low-temperature side refrigerant flowing into the fifth heat exchanger and the temperature difference is within a predetermined first temperature range. In addition, in the simultaneous cooling and heating temperature control device described in claim 5, when the second condition is satisfied, the control unit adjusts the amount of air blown by the variable air blower so that the temperature of the third heat exchange fluid flowing into the fifth heat exchanger is higher than the temperature of the low-temperature side refrigerant flowing into the fifth heat exchanger, and the temperature difference is within a predetermined second temperature range.

[0027] Therefore, the simultaneous cold and hot temperature control device described in claims 3 to 5 and the removal system equipped with such a simultaneous cold and hot temperature control device have a very simple configuration in which the temperature of the third heat exchange fluid is adjusted by changing the amount of air sent to the fourth heat exchanger by the blower, yet the temperature of the low-temperature side refrigerant after heat exchange with the third heat exchange fluid can be suitably adjusted.

[0028] In the simultaneous cooling and heating temperature regulation device described in claim 6, when the first condition is satisfied, the control unit adjusts the amount of the third heat exchange fluid circulated by the variable flow pump so that the temperature of the third heat exchange fluid flowing into the fifth heat exchanger is lower than the temperature of the low-temperature side refrigerant flowing into the fifth heat exchanger and the temperature difference is within a predetermined first temperature range.Furthermore, in the simultaneous cooling and heating temperature regulation device described in claim 7, when the second condition is satisfied, the control unit adjusts the amount of the third heat exchange fluid circulated by the variable flow pump so that the temperature of the third heat exchange fluid flowing into the fifth heat exchanger is higher than the temperature of the low-temperature side refrigerant flowing into the fifth heat exchanger and the temperature difference is within a predetermined second temperature range.

[0029] Therefore, according to the simultaneous cold and hot temperature control device described in claims 6 and 7, and the removal system equipped with such a simultaneous cold and hot temperature control device, the temperature of the low-temperature side refrigerant after heat exchange with the third heat exchange fluid can be suitably adjusted while using a very simple configuration in which the temperature of the third heat exchange fluid in the fourth heat exchanger and the heat exchange amount between the third heat exchange fluid and the low-temperature side refrigerant in the fifth heat exchanger are adjusted by changing the amount of circulation of the third heat exchange fluid in the fluid circulation path by the pump, i.e., the amount of liquid sent of the third heat exchange fluid to the fourth heat exchanger and the fifth heat exchanger. [Brief explanation of the drawings]

[0030] [Figure 1] 1 is a diagram showing the configuration of a removal system 1. FIG. [Figure 2] 1 is a diagram showing the configuration of a removal system 1. FIG. [Figure 3] FIG. 2 is a diagram showing the configuration of a simultaneous cooling and heating temperature control device 2. [Figure 4] 10A and 10B are explanatory diagrams illustrating a control mode in which heat is not absorbed from the heat transfer fluid Wa in the heat absorption and radiation circuit 10A and heat is not radiated to the heat transfer fluid Wa. [Figure 5] 10 is an explanatory diagram of a control mode for dissipating heat to the heat transfer liquid Wa. FIG. [Figure 6] 10 is an explanatory diagram of a control mode for absorbing heat from the heat transfer liquid Wa. FIG. [Figure 7] FIG. 10 is an explanatory diagram of a control mode in which heat is absorbed from the heat transfer liquid Wa without cooling the heat transfer liquid Wc (heat is absorbed from the heat transfer liquid Wc). DETAILED DESCRIPTION OF THE INVENTION

[0031] Hereinafter, embodiments of a simultaneous cold and hot temperature adjusting device and a removal system will be described with reference to the accompanying drawings.

[0032] First, the configuration of the removal system 1 will be described with reference to the accompanying drawings.

[0033] The removal system 1 shown in Figures 1 and 2 is an example of a "removal system" and is equipped with a simultaneous hot and cold temperature control device 2, a blower 3, a gas-liquid separation tank 4, heat exchangers 4c, 5c, 5h, flow path switching valves 6a, 6b, a control unit 7, and adsorption towers Ta, Tb, and is configured to be able to remove moisture, which is an example of a "target to be removed," from hydrogen gas G, which is an example of a "gas."

[0034] Specifically, this removal system 1 is configured to remove moisture contained in hydrogen gas G supplied from a hydrogen supply source (such as a hydrogen generator or hydrogen storage tank; not shown) via a pipe Pi, and then supply the hydrogen gas G to a hydrogen supply target (such as a fuel cell, hydrogen combustion device, or hydrogen storage tank; not shown) via a pipe Po. More specifically, the removal system 1 of this example is configured to be capable of performing an adsorption removal process in which the moisture contained in the hydrogen gas G is adsorbed onto an adsorbent in the adsorption towers Ta and Tb to remove the moisture from the hydrogen gas G, and is also configured to be capable of performing an adsorption capacity regeneration process using a thermal regeneration method in which the adsorption capacity of the adsorbent (adsorption towers Ta and Tb) is regenerated (restored) by removing moisture from the adsorbent whose adsorption capacity has been reduced due to the adsorption of moisture in the adsorption removal process.

[0035] In this case, the adsorption towers Ta and Tb (hereinafter, when not distinguished from one another, they may be simply referred to as "adsorption tower T") are an example of "multiple adsorption towers" and are composed of a pressure-resistant vessel provided with two inlets and outlets through which hydrogen gas G can be introduced and discharged, and a layer of adsorbent (synthetic zeolite, etc.) through which hydrogen gas G can pass is provided between the inlets and outlets. In the removal system 1 of this example, an inlet pipe Pi is connected to a flow path switching valve 6a provided at one of the two inlets and outlets in both adsorption towers T, and a discharge pipe Po is connected to a flow path switching valve 6b provided at the other of the two inlets and outlets in both adsorption towers T. In addition, in the removal system 1 of this example, a pipe Pho connected to the gas-liquid separation tank 4 is connected to the flow path switching valve 6a, and a pipe Phi connected to the heat exchanger 5h is connected to the flow path switching valve 6b.

[0036] As a result, in the removal system 1 of this example, the flow path switching valves 6a and 6b are controlled by the control unit 7 as described below, making it possible to perform the adsorption capacity regeneration process for the adsorption tower Ta and the adsorption removal process using the adsorption tower Tb in parallel, as shown in Figure 1, or to perform the adsorption capacity regeneration process for the adsorption tower Tb and the adsorption removal process using the adsorption tower Ta in parallel, as shown in Figure 2.

[0037] 3, the simultaneous cooling and heating temperature control device 2 is an example of a "simultaneous cooling and heating temperature control device," and is equipped with a cascade refrigeration cycle 10 (an example of a "multiple cascade refrigeration cycle") having a low-temperature side refrigeration circuit 10C, which is an example of a "low-temperature side refrigeration circuit," and a high-temperature side refrigeration circuit 10H, which is an example of a "high-temperature side refrigeration circuit," and a heat absorption and dissipation circuit 10A, which is an example of a "fluid circulation path." In this case, the simultaneous cooling and heating temperature control device 2 (cascade refrigeration cycle 10) of this example is configured so that low-temperature side refrigerant Rc (an example of a "low-temperature side refrigerant") circulated within the low-temperature side refrigeration circuit 10C and high-temperature side refrigerant Rh (an example of a "high-temperature side refrigerant") circulated within the high-temperature side refrigeration circuit 10H can exchange heat with each other in a heat exchanger (cascade condenser) 22, which is an example of a "first heat exchanger."

[0038] Furthermore, in the simultaneous cooling and heating temperature control device 2 of this example, as will be described later, a low-temperature heat transfer liquid Wc (an example of a "first heat exchange fluid") is supplied via a heat transfer liquid circulation path LC to a heat exchanger 5c (a cooler; an example of a "heat exchanger A as a cooling target") that cools the hydrogen gas G to be supplied to an adsorption tower T that performs an adsorption removal treatment, and a high-temperature heat transfer liquid Wh (an example of a "second heat exchange fluid") is supplied via a heat transfer liquid circulation path LH to a heat exchanger 5h (a heater; an example of a "heat exchanger B as a heating target") that heats the hydrogen gas G to be supplied to an adsorption tower T that is to undergo an adsorption capacity regeneration treatment. A liquid feed pump for circulating the heat transfer liquid Wc is disposed in the heat transfer liquid circulation path LC, and a liquid feed pump for circulating the heat transfer liquid Wh is disposed in the heat transfer liquid circulation path LH. However, to facilitate understanding of the configuration of the removal system 1 (simultaneous cooling and heating temperature control device 2), illustrations and descriptions of these pumps are omitted.

[0039] The low-temperature side refrigeration circuit 10C is configured to include, in addition to the heat exchanger 22 shared with the high-temperature side refrigeration circuit 10H, a compressor 21, a flow control valve 23, a heat exchanger 24, a flow path switching valve 25, a heat exchanger 26, a flow path switching valve 27, and a flow control valve 28. The compressor 21 is an example of a "low-temperature side refrigerant compressor" and compresses (pressure-feeds) the low-temperature side refrigerant Rc under the control of the control unit 7. As described above, the heat exchanger 22 is disposed to enable heat exchange between the low-temperature side refrigerant Rc in the low-temperature side refrigeration circuit 10C and the high-temperature side refrigerant Rh in the high-temperature side refrigeration circuit 10H, and also functions as a "condenser" that condenses the low-temperature side refrigerant Rc through heat exchange with the high-temperature side refrigerant Rh.

[0040] The flow rate control valve 23 is an electronic expansion valve that is an example of a "first expansion valve," and is disposed upstream of the heat exchanger 24 in the flow path of the low-temperature side refrigerant Rc, and adjusts the flow rate of the low-temperature side refrigerant Rc that passes through the heat exchanger 24 (evaporates in the heat exchanger 24) by changing its opening degree under the control of the control unit 7. The heat exchanger 24 is an example of a "second heat exchanger," and cools the heat transfer liquid Wc (heat transfer liquid Wc supplied to the heat exchanger 5c) in the heat transfer liquid circulation path LC by heat exchange between the low-temperature side refrigerant Rc that has passed through the flow rate control valve 23, as will be described later.

[0041] The flow path switching valve 25 switches the flow path of the low-temperature refrigerant Rc in the low-temperature refrigeration circuit 10C under the control of the control unit 7. The heat exchanger 26 is an example of a "fifth heat exchanger" and is arranged to enable heat exchange between the low-temperature refrigerant Rc that has exchanged heat with the high-temperature refrigerant Rh in the heat exchanger 22 and a heat transfer fluid Wa (an example of a "third heat exchange fluid") in the heat absorption and heat release circuit 10A described below. The flow path switching valve 27 switches the flow path of the low-temperature refrigerant Rc in the low-temperature refrigeration circuit 10C under the control of the control unit 7. The flow rate adjustment valve 28 is an electronic expansion valve which is an example of a "second expansion valve" and changes its opening degree under the control of the control unit 7 to adjust the flow rate of the low-temperature refrigerant Rc that passes through the heat exchanger 26 (to be evaporated in the heat exchanger 26).

[0042] In this case, in the simultaneous cooling and heating temperature control device 2 (low-temperature side refrigeration circuit 10C) of this example, the flow control valves 23, 28 and the flow path switching valves 25, 27 work together to form a "flow path switching unit," and by switching these valves 23, 25, 27, 28 by the control unit 7, it is possible to form a "first refrigerant flow path" (see Figure 5) in which the low-temperature side refrigerant Rc discharged from the compressor 21 passes through the heat exchanger 22, the heat exchanger 26, and the heat exchanger 24 in that order, passes through the compressor 21, and then flows back into the heat exchanger 22, or a "second refrigerant flow path" (see Figure 6) in which the low-temperature side refrigerant Rc discharged from the compressor 21 is split after passing through the heat exchanger 22, passes through the heat exchangers 24, 26, and then merges, passes through the compressor 21, and then flows back into the heat exchanger 22.

[0043] The high-temperature side refrigeration circuit 10H is configured to include a compressor 31, a heat exchanger 32, and a flow control valve 33, in addition to the aforementioned heat exchanger 22 shared with the low-temperature side refrigeration circuit 10C. The compressor 31 compresses (pressure-feeds) the high-temperature side refrigerant Rh under the control of the control unit 7. The heat exchanger 32 is an example of a "third heat exchanger" and heats the heat transfer liquid Wh by heat exchange between the high-temperature side refrigerant Rh pressure-fed by the compressor 31 (discharged from the compressor 31) and the heat transfer liquid Wh in the heat transfer liquid circulation path LH (heat transfer liquid Wh supplied to the heat exchanger 5h).

[0044] The flow rate control valve 33 is disposed upstream of the heat exchanger 22 in the flow path of the high-temperature side refrigerant Rh, and adjusts the flow rate of the high-temperature side refrigerant Rh passing through the heat exchanger 22 under the control of the control unit 7. In the high-temperature side refrigeration circuit 10H, the flow rate control valve 33 functions as an "expansion valve," and the heat exchanger 22 functions as an "evaporator" that evaporates the high-temperature side refrigerant Rh by heat exchange with the low-temperature side refrigerant Rc.

[0045] The heat absorption / dissipation circuit 10A is equipped with a heat exchanger 41 and a pump 42 in addition to the aforementioned heat exchanger 26 shared with the low-temperature side refrigeration circuit 10C, and is configured to enable the circulation of the heat transfer liquid Wa. The heat exchanger 41 is an example of a "fourth heat exchanger" and is arranged to enable heat exchange between the heat transfer liquid Wa and the atmosphere (outside air: the air surrounding the heat exchanger 41) (heat dissipation of heat possessed by the heat transfer liquid Wa to the atmosphere, or heat absorption of heat possessed by the atmosphere into the heat transfer liquid Wa). The heat exchanger 41 is equipped with a variable-flow blower 41a (an example of a "blower") that blows outside air to the heat exchanger 41 under the control of the control unit 7.

[0046] The pump 42 is an example of a "pump" and circulates the heat transfer liquid Wa under the control of the control unit 7. In the simultaneous cooling and heating temperature control device 2 (heat absorption and heat release circuit 10A) of this example, the pump 42 is configured as, for example, a variable flow rate liquid feed pump. As a result, in the simultaneous cooling and heating temperature control device 2 (heat absorption and heat release circuit 10A) of this example, as will be described later, it is possible to adjust the amount of heat exchanged between the heat transfer liquid Wa and the outside air in the heat exchanger 41 by changing the amount of air sent by the blower 41a to the heat exchanger 41 or by changing the amount of heat transfer liquid Wa sent by the pump 42.

[0047] The simultaneous cold and warm temperature control device 2 is equipped with various sensors that detect the pressure and temperature of the low-temperature side refrigerant Rc in the low-temperature side refrigeration circuit 10C, the pressure and temperature of the high-temperature side refrigerant Rh in the high-temperature side refrigeration circuit 10H, the temperature of the heat transfer liquid Wa in the heat absorption and dissipation circuit 10A, the outside air temperature, the temperature of the heat transfer liquid Wc, and the temperature of the heat transfer liquid Wh. However, in order to facilitate understanding of the configuration of the removal system 1 (simultaneous cold and warm temperature control device 2), illustrations and detailed explanations of these sensors are omitted.

[0048] The blower 3 blows the hydrogen gas G so that it passes through the heat exchanger 5h, the flow path switching valve 6b, one of the adsorption towers T, the flow path switching valve 6a, and the gas-liquid separation tank 4 in that order, and then flows back into the heat exchanger 5h. The location of the blower 3 is not limited to between the gas-liquid separation tank 4 and the heat exchanger 5h as shown in FIGS. 1 and 2 , but can also be between the heat exchanger 5h and the flow path switching valve 6b or between the flow path switching valve 6a and the gas-liquid separation tank 4. The gas-liquid separation tank 4 separates moisture from the hydrogen gas G that has passed through the adsorption tower T that is being treated for adsorption capacity regeneration. The heat exchanger 4c is disposed in the pipe Pho (between the flow path switching valve 6a and the gas-liquid separation tank 4) and cools the hydrogen gas G by heat exchange between the hydrogen gas G that has passed through the adsorption tower T that is being treated for adsorption capacity regeneration and the atmosphere (air) blown by the blower 4cf.

[0049] The heat exchanger 5c is an example of a "heat exchanger A" and is arranged on the pipe Pi. The heat exchanger 5c is configured to be able to cool the hydrogen gas G (hydrogen gas G containing moisture to be removed) passing through the adsorption tower T that is to undergo adsorption and removal treatment by heat exchange with the heat transfer liquid Wc supplied from the simultaneous cooling and heating temperature control device 2 (low-temperature side refrigeration circuit 10C). The heat exchanger 5h is an example of a "heat exchanger B" and is arranged on the pipe Phi. The heat exchanger 5h is configured to be able to heat the hydrogen gas G that is to flow into the adsorption tower T that is to undergo adsorption capacity regeneration treatment by heat exchange with the heat transfer liquid Wh supplied from the simultaneous cooling and heating temperature control device 2 (high-temperature side refrigeration circuit 10H).

[0050] The flow path switching valve 6a, under the control of the control unit 7, connects the pipe Pi to the adsorption tower T performing the adsorption removal treatment and connects the adsorption tower T to the pipe Pho, while also connecting the adsorption tower T to be treated for adsorption capacity regeneration. The flow path switching valve 6b, under the control of the control unit 7, connects the adsorption tower T performing the adsorption removal treatment to the pipe Po and connects the pipe Pho to the adsorption tower T to be treated for adsorption capacity regeneration.

[0051] The control unit 7 is an example of a "control unit" and controls the removal system 1 overall. Specifically, the control unit 7 controls the operation of each component in the cascade refrigeration cycle 10 and the heat absorption / dissipation circuit 10A in accordance with the amount of cold heat to be supplied to the heat exchanger 5c by supplying the heat transfer liquid Wc and the amount of hot heat to be supplied to the heat exchanger 5h by supplying the heat transfer liquid Wh. The control unit 7 also controls the blower 3 and the flow path switching valves 6a and 6b to remove moisture contained in the hydrogen gas G to be supplied to the supply target via the pipe Po by causing the adsorbent in one of the adsorption towers T to adsorb and remove the moisture, while also regenerating the adsorption capacity of the adsorbent in one of the other adsorption towers T. The control unit 7 also controls the blower 4cf to blow atmospheric air (air) toward the heat exchanger 4c. The control of each component by the control unit 7 will be described in detail later with specific examples.

[0052] Next, the adsorption removal process and adsorption capacity regeneration process performed by the removal system 1 will be described.

[0053] The removal system 1 of this example is configured to be able to operate in three modes: an operation mode in which only the adsorption removal process is performed independently; an operation mode in which only the adsorption capacity regeneration process is performed independently; and an operation mode in which the adsorption removal process and the adsorption capacity regeneration process are performed in parallel. Hereinafter, to facilitate understanding of the operating principle of the removal system 1 (the simultaneous cooling and heating temperature control device 2), the operation mode in which both processes are performed in parallel will be mainly described. Note that the removal system 1 of this example controls the operating state of the simultaneous cooling and heating temperature control device 2 to be appropriately changed depending on the state of the adsorption tower T performing the adsorption removal process and the state of the adsorption tower T that is the target of the adsorption capacity regeneration process. The control of the operation of the simultaneous cooling and heating temperature control device 2 depending on the state of the adsorption tower T will be described in detail later.

[0054] For example, during the previous operation, when the adsorption removal process using the adsorption tower Tb and the adsorption capacity regeneration process for the adsorption tower Ta were performed in parallel as shown in Figure 1, the adsorption capacity of the adsorbent in the adsorption tower Tb was reduced, and the adsorption capacity of the adsorbent in the adsorption tower Ta was restored. When the removal system 1 in this state is restarted and the adsorption removal process using the adsorption tower Tb is resumed, the time until the adsorption tower Tb has difficulty adequately removing moisture contained in the hydrogen gas G is shortened. Therefore, during the restart, the adsorption removal process using the adsorption tower Ta is started instead of the adsorption tower Tb, and the adsorption capacity regeneration process is started for the adsorption tower Tb, which has adsorbed a large amount of moisture during the adsorption removal process during the previous operation.

[0055] Specifically, when the removal system 1 is restarted, the control unit 7 starts the operation of the simultaneous hot and cold temperature control device 2 and the fans 3 and 4cf, and also controls the flow path switching valves 6a and 6b to connect the pipes Pi and Po to the adsorption tower Ta and the pipes Phi and Pho to the adsorption tower Tb, as shown in Fig. 2. At this time, hydrogen gas G supplied from the hydrogen supply source via the pipe Pi passes through the heat exchanger 5c and the flow path switching valve 6a and flows into the adsorption tower Ta, and is then supplied from the adsorption tower Ta to the hydrogen supply target via the flow path switching valve 6b and the pipe Po. At the same time, hydrogen gas G blown by the fan 3 passes through the heat exchanger 5h, the pipe Phi, and the flow path switching valve 6b and flows into the adsorption tower Tb, and passes from the adsorption tower Tb through the flow path switching valve 6a, the pipe Pho, the heat exchanger 4c, and the gas-liquid separation tank 4 in this order, before being blown again toward the adsorption tower Tb by the fan 3.

[0056] Furthermore, in the simultaneous cooling and heating temperature control device 2, the compressor 21 starts pumping the low-temperature side refrigerant Rc, and the compressor 31 starts pumping the high-temperature side refrigerant Rh, and at the same time, as shown in Fig. 4, the flow control valve 28 is shifted to a closed state, and the flow path switching valve 25 is switched to a state where a flow path is formed from the heat exchanger 22 to the flow control valve 23. Note that in this figure and Figures 5 to 7 referred to later, in the low-temperature side refrigeration circuit 10C, the flow paths through which the low-temperature side refrigerant Rc is allowed to pass are shown by solid lines, and the flow paths through which the passage of the low-temperature side refrigerant Rc is restricted are shown by dashed lines, and in the heat absorption and radiation circuit 10A, the flow paths through which the heat transfer liquid Wa is allowed to pass are shown by solid lines, and the flow paths through which the passage of the heat transfer liquid Wa is restricted are shown by dashed lines.

[0057] At this time, in the low-temperature side refrigeration circuit 10C, the high-temperature, high-pressure low-temperature side refrigerant Rc pumped by the compressor 21 is lowered in temperature and condensed by heat exchange with the high-temperature side refrigerant Rh in the heat exchanger 22, and then passes through the flow control valve 23 and flows into the heat exchanger 24, where it is vaporized and its temperature is raised by heat exchange with the heat transfer liquid Wc (cooling process of the heat transfer liquid Wc). Also, the heat transfer liquid Wa circulating through the heat transfer liquid circulation path LC is supplied to the heat exchanger 5c in a state where its temperature has been lowered by heat exchange with the low-temperature side refrigerant Rc in the heat exchanger 24, and in the heat exchanger 5c it is subjected to heat exchange with the hydrogen gas G supplied via the pipe Pi, where its temperature is raised.

[0058] As a result, the relative humidity of the hydrogen gas G, whose temperature has been lowered by heat exchange with the heat transfer liquid Wc in the heat exchanger 5c, increases, and this hydrogen gas G is caused to flow into the adsorption tower Ta via the flow path switching valve 6a, so that the moisture contained in the hydrogen gas G is suitably adsorbed by the adsorbent in the adsorption tower Ta (an example of a process in which "gas cooled by heat exchange with the first heat exchange fluid in the heat exchanger A is caused to flow into one of the adsorption towers, and the removal target contained in the gas is adsorbed by the adsorbent housed in one of the adsorption towers"). Furthermore, the hydrogen gas G, from which moisture has been sufficiently removed, is supplied to the supply target via the flow path switching valve 6b and the pipe Po (execution of the adsorption removal process in the adsorption tower Ta).

[0059] In the high-temperature side refrigeration circuit 10H, the high-temperature, high-pressure high-temperature side refrigerant Rh pumped by the compressor 31 is lowered in temperature and condensed by heat exchange with the heat transfer liquid Wh in the heat exchanger 32 (heating treatment of the heat transfer liquid Wh), and then passes through the flow control valve 33 and flows into the heat exchanger 22, where its temperature is raised by heat exchange with the low-temperature side refrigerant Rc. In addition, the heat transfer liquid Wh is circulated through the heat transfer liquid circulation path LH and has its temperature raised by heat exchange with the high-temperature side refrigerant Rh in the heat exchanger 32, and is supplied to the heat exchanger 5h, where heat exchange with the hydrogen gas G blown by the blower 3 occurs, raising the temperature of the hydrogen gas G.

[0060] As a result, high-temperature hydrogen gas G, whose relative humidity has decreased as the temperature has increased, is caused to flow into the adsorption tower Tb via the flow path switching valve 6b, causing the temperature of the adsorbent in the adsorption tower Tb to rise and moisture to be released from the adsorbent, and the hydrogen gas G is discharged from the adsorption tower Tb in a state contained in low-humidity hydrogen gas G (an example of a process in which ``gas heated by heat exchange with the second heat exchange fluid in heat exchanger B is flowed into any of the other adsorption towers, and the target to be removed is released from the adsorbent contained in any of the other adsorption towers into the gas, thereby regenerating the adsorption capacity of the adsorbent'').

[0061] The hydrogen gas G discharged from the adsorption tower Tb is passed through the flow path switching valve 6a and the pipe Pho and flows into the heat exchanger 4c, where it is cooled by heat exchange with the atmosphere (air) blown by the blower 4cf, thereby increasing its relative humidity, and then flows into the gas-liquid separation tank 4. As a result, the hydrogen gas G from which moisture has been separated in the gas-liquid separation tank 4 is blown again by the blower 3 toward the heat exchanger 32 (execution of the adsorption capacity regeneration process in the adsorption tower Tb). The moisture separated from the hydrogen gas G in the gas-liquid separation tank 4 is discharged outside the tank (to a wastewater treatment unit, etc.) when a predetermined amount of moisture has been stored in the gas-liquid separation tank 4.

[0062] By continuing the cooling of the heat transfer liquid Wc and its supply to the heat exchanger 5c (cooling of the hydrogen gas G in the heat exchanger 5c) and the heating of the heat transfer liquid Wh and its supply to the heat exchanger 5h (heating of the hydrogen gas G in the heat exchanger 5h) as described above, the adsorption removal process in the adsorption tower Ta and the adsorption capacity regeneration process for the adsorption tower Tb are carried out in parallel, and unnecessary moisture is suitably removed from the hydrogen gas G supplied to the supply target, and the adsorption capacity of the adsorbent that has adsorbed moisture is suitably regenerated.

[0063] When the simultaneous cooling and heating temperature adjustment device 2 (removal system 1) is operating as described above, the amount of cooling of the heat transfer liquid Wc by the low-temperature side refrigeration circuit 10C (the amount of cold heat supplied to the heat transfer liquid Wc in the heat exchanger 24) is approximately the same as the amount of heating of the heat transfer liquid Wh by the high-temperature side refrigeration circuit 10H (the amount of hot heat supplied to the heat transfer liquid Wh in the heat exchanger 32). In this case, the simultaneous cooling and heating temperature adjustment device 2 (removal system 1) of this example employs, as an example, a configuration in which the control unit 7 monitors the value of a pressure sensor (not shown) arranged in the low-temperature side refrigeration circuit 10C, and controls the operation of each component so that the refrigerant pressure of the low-temperature side refrigerant Rc in the low-temperature side refrigeration circuit 10C is kept within a predetermined pressure range.

[0064] For example, when the amount of moisture contained in the hydrogen gas G flowing into the adsorption tower Ta undergoing adsorption removal treatment is large, the hydrogen gas G must be sufficiently cooled in the heat exchanger 5c in order to sufficiently increase the relative humidity of the hydrogen gas G flowing into the adsorption tower Ta, and the temperature of the heat transfer liquid Wc supplied to the heat exchanger 5c from the low-temperature side refrigeration circuit 10C (heat exchanger 24) must be sufficiently lowered. Also, when the amount of moisture adsorbed by the adsorbent in the adsorption tower Tb undergoing adsorption capacity regeneration treatment is small, the amount of heating of the hydrogen gas G in the heat exchanger 5h must be reduced in order to prevent the temperature of the hydrogen gas G flowing into the adsorption tower Tb from becoming excessively high, and the temperature of the heat transfer liquid Wc supplied to the heat exchanger 5h from the high-temperature side refrigeration circuit 10H (heat exchanger 32) must be lowered. Therefore, in a state such as the above example, it is preferable to make the amount of heating of the heat transfer liquid Wh by the high-temperature side refrigeration circuit 10H smaller than the amount of cooling of the heat transfer liquid Wc by the low-temperature side refrigeration circuit 10C (an example of a state in which the first condition "that the amount of hot heat to be supplied to the object to be heated is less than the amount of cold heat to be supplied to the object to be cooled" is satisfied).

[0065] In this case, when the operation rate of the low-temperature side refrigeration circuit 10C is increased in accordance with the required amount of cold (for example, by increasing the amount of low-temperature side refrigerant Rc pumped by the compressor 21), the amount of hot heat (the amount of heat in the heat transfer liquid Wh) supplied from the high-temperature side refrigeration circuit 10H increases excessively as the amount of heat released to the high-temperature side refrigerant Rh in the heat exchanger 22 increases. Also, when the operation rate of the high-temperature side refrigeration circuit 10H is decreased in accordance with the required amount of hot heat, the amount of cold (the amount of cooling in the heat transfer liquid We) supplied from the low-temperature side refrigeration circuit 10C decreases and becomes insufficient as the amount of heat absorbed by the low-temperature side refrigerant Rc in the heat exchanger 22 decreases. Therefore, in the present example of the simultaneous hot and cold temperature control device 2, in order to increase the amount of cold heat supplied from the low-temperature side refrigeration circuit 10C without increasing the amount of hot heat supplied from the high-temperature side refrigeration circuit 10H, or to decrease the amount of hot heat supplied from the high-temperature side refrigeration circuit 10H without decreasing the amount of cold heat supplied from the low-temperature side refrigeration circuit 10C, a portion of the heat of the low-temperature side refrigerant Rc in the low-temperature side refrigeration circuit 10C can be dissipated to the atmosphere from the heat absorption and dissipation circuit 10A without dissipating it to the high-temperature side refrigeration circuit 10H.

[0066] Specifically, when the above-mentioned "first condition" is satisfied, the control unit 7 controls the flow control valves 23, 28 and the flow path switching valves 25, 27 as shown in FIG. 5 to transition the low-temperature side refrigerant Rc in the low-temperature side refrigeration circuit 10C to a state in which it can flow through the above-mentioned "first refrigerant flow path," and controls the pump 42 to start circulating the heat transfer liquid Wa in the heat absorption and heat dissipation circuit 10A. At this time, a portion of the low-temperature side refrigerant Rc pumped by the compressor 21 is condensed by heat exchange with the high-temperature side refrigerant Rh in the heat exchanger 22, and the low-temperature side refrigerant Rc in a gas-liquid mixture state of the condensed liquid-phase low-temperature side refrigerant Rc in the heat exchanger 22 and the uncondensed gas-phase low-temperature side refrigerant Rc passes through the flow path switching valve 25 and flows into the heat exchanger 26, where the gas-phase low-temperature side refrigerant Rc is condensed by the temperature reduction caused by heat exchange with the heat transfer liquid Wa in the heat exchanger 26 (an example of the process of "dissipating heat from the low-temperature side refrigerant to the third heat exchange fluid in the fifth heat exchanger").Then, the low-temperature side refrigerant Rc passes through the flow control valve 23 and is vaporized in the heat exchanger 24, thereby cooling the heat transfer liquid We, and is pumped again by the compressor 21.

[0067] Furthermore, the heat transfer fluid Wa, whose temperature has risen as a result of heat exchange in the heat exchanger 26 (heat absorption from the low-temperature side refrigerant Rc) as described above, is cooled by heat exchange with the atmosphere in the heat exchanger 41 (an example of a process in which heat is dissipated from the third heat exchange fluid to the atmosphere in the fourth heat exchanger), and then is forced to flow back into the heat exchanger 26 by the pump 42. This reduces the amount of hot heat supplied from the low-temperature side refrigeration circuit 10C to the cascade refrigeration cycle 10H by the amount of hot heat dissipated to the atmosphere via the heat absorption and dissipation circuit 10A, thereby preventing an excessive increase in the amount of hot heat supplied from the high-temperature side refrigeration circuit 10H to the heat transfer fluid Wh (the amount of heat of the heat transfer fluid Wh). Furthermore, a sufficient amount of low-temperature side refrigerant Rc can be supplied to the heat exchanger 24 to sufficiently cool the heat transfer fluid We, thereby preventing a decrease in the amount of cold heat supplied from the low-temperature side refrigeration circuit 10C (the amount of cooling of the heat transfer fluid Wec) and resulting in a shortage.

[0068] The simultaneous cooling and heating temperature control device 2 of this example is equipped with temperature sensors (not shown) that detect the temperature of the heat transfer liquid Wa flowing into the heat exchanger 26 and the temperature of the low-temperature side refrigerant Rc, respectively, and is configured such that, when the "first condition" is satisfied and heat is being dissipated to the atmosphere from the heat absorption and dissipation circuit 10A (heat exchanger 41), the control unit 7 adjusts the amount of air blown by the blower 41a and the amount of heat transfer liquid Wa circulated by the pump 42 so that the temperature difference between the heat transfer liquid Wa flowing into the heat exchanger 26 and the low-temperature side refrigerant Rc is within a predetermined "first temperature range" that is lower than the temperature of the low-temperature side refrigerant Rc flowing into the heat exchanger 26. This allows the heat dissipated to the heat transfer liquid Wa by heat exchange in the heat exchanger 26 to be suitably dissipated to the atmosphere in the heat exchanger 41.

[0069] Unlike the above example, for example, when the amount of moisture contained in the hydrogen gas G flowing into the adsorption tower Ta undergoing adsorption removal treatment is small, the amount of cooling of the hydrogen gas G in the heat exchanger 5c must be reduced to prevent the temperature of the hydrogen gas G flowing into the adsorption tower Ta from excessively decreasing, and the temperature of the heat transfer liquid Wc supplied to the heat exchanger 5c from the low-temperature side refrigeration circuit 10C (heat exchanger 24) must be increased. Furthermore, when the amount of moisture adsorbed by the adsorbent in the adsorption tower Tb undergoing adsorption capacity regeneration treatment is large, the hydrogen gas G must be sufficiently heated in the heat exchanger 5h to sufficiently reduce the relative humidity of the hydrogen gas G flowing into the adsorption tower Tb, and the temperature of the heat transfer liquid Wc supplied to the heat exchanger 5h from the high-temperature side refrigeration circuit 10H (heat exchanger 32) must be sufficiently increased. Therefore, in a state such as the above example, it is preferable to make the amount of cooling of the heat transfer liquid Wc by the low-temperature side refrigeration circuit 10C smaller than the amount of heating of the heat transfer liquid Wh by the high-temperature side refrigeration circuit 10H (an example of a state in which the second condition "that the amount of cold heat to be supplied to the object to be cooled is less than the amount of hot heat to be supplied to the object to be heated" is satisfied).

[0070] In this case, when the operation rate of the high-temperature side refrigeration circuit 10H is increased in accordance with the required amount of cold (for example, by increasing the amount of high-temperature side refrigerant Rh pumped by the compressor 31), the amount of cold supplied from the low-temperature side refrigeration circuit 10C (the amount of cooling of the heat transfer liquid Wc) increases excessively as the amount of heat absorbed by the low-temperature side refrigerant Rc in the heat exchanger 22 increases. Also, when the operation rate of the low-temperature side refrigeration circuit 10C is decreased in accordance with the required amount of hot heat, the amount of hot heat supplied from the high-temperature side refrigeration circuit 10H (the amount of heat supplied to the heat transfer liquid Wh) decreases and becomes insufficient as the amount of heat released to the high-temperature side refrigerant Rh in the heat exchanger 22 decreases. Therefore, in the present example of the simultaneous cold and warm temperature control device 2, the device is configured to absorb atmospheric heat into the low-temperature side refrigerant Rc of the low-temperature side refrigeration circuit 10C via the heat absorption and dissipation circuit 10A in order to increase the amount of warm heat supplied from the high-temperature side refrigeration circuit 10H without increasing the amount of cold heat supplied from the low-temperature side refrigeration circuit 10C, or to decrease the amount of cold heat supplied from the low-temperature side refrigeration circuit 10C without decreasing the amount of warm heat supplied from the high-temperature side refrigeration circuit 10H.

[0071] Specifically, when the above-mentioned "second condition" is satisfied, the control unit 7 controls the flow control valves 23, 28 and the flow path switching valves 25, 27 as shown in Figure 6, thereby transitioning the low-temperature side refrigerant Rc in the low-temperature side refrigeration circuit 10C to a state in which it can flow through the above-mentioned "second refrigerant flow path", and controls the pump 42 to start circulating the heat transfer liquid Wa in the heat absorption and heat dissipation circuit 10A. At this time, the low-temperature side refrigerant Rc pumped by the compressor 21 is condensed and its temperature is lowered by heat exchange with the high-temperature side refrigerant Rh in the heat exchanger 22, and a portion of the condensed low-temperature side refrigerant Rc passes through the flow control valve 23 and is vaporized in the heat exchanger 24, thereby cooling the heat transfer liquid Wc, and another portion of the low-temperature side refrigerant Rc passes through the flow control valve 28 and is vaporized in the heat exchanger 26, thereby cooling the heat transfer liquid Wa (an example of the process of "absorbing heat from the third heat exchange fluid into the low-temperature side refrigerant in the fifth heat exchanger"), and then the two refrigerants are merged and pumped again by the compressor 21.

[0072] The heat transfer fluid Wa, whose temperature has been reduced by the heat exchange (heat dissipation to the low-temperature side refrigerant Rc) in the heat exchanger 26 as described above, is then heated by heat exchange with the atmosphere in the heat exchanger 41 (an example of the process of "absorbing heat from the third heat exchange fluid into the atmosphere in the fourth heat exchanger"), and is then pumped by the pump 42 to flow back into the heat exchanger 26. This increases the amount of hot heat supplied from the low-temperature side refrigeration circuit 10C to the cascade refrigeration cycle 10H by the amount of hot heat absorbed from the atmosphere via the heat absorption and dissipation circuit 10A, thereby preventing a decrease in the amount of hot heat supplied from the high-temperature side refrigeration circuit 10H (the amount of heat being supplied to the heat transfer fluid Wh) and preventing an excessive increase in the amount of cold heat supplied from the low-temperature side refrigeration circuit 10C to the heat transfer fluid We (the amount of cooling of the heat transfer fluid Wec).

[0073] In the simultaneous cooling and heating temperature control device 2 of this example, when the "second condition" is satisfied by a decrease in the amount of cold heat to be supplied to the object to be cooled, when the "second condition" is satisfied by an increase in the amount of hot heat to be supplied to the object to be heated, when the "second condition" is satisfied and the amount of cold heat to be supplied decreases, or when the "second condition" is satisfied and the amount of hot heat to be supplied increases, the control unit 7 increases the aperture of the flow control valve 28 to increase the amount of heat absorbed from the heat transfer liquid Wa to the low-temperature side refrigerant Rc in the heat exchanger 26. In addition, in the simultaneous cooling and heating temperature control device 2 of this example, when the "second condition" is satisfied and the amount of cold heat to be supplied increases, or when the "second condition" is satisfied and the amount of hot heat to be supplied decreases, the control unit 7 decreases the aperture of the flow control valve 28 to decrease the amount of heat absorbed from the heat transfer liquid Wa to the low-temperature side refrigerant Rc in the heat exchanger 26.

[0074] Furthermore, in the simultaneous cooling and heating temperature control device 2 of this example, when the "second condition" is satisfied and heat is being absorbed from the atmosphere via the heat absorption and heat dissipation circuit 10A (heat exchanger 41), the control unit 7 adjusts the amount of air blown by the blower 41a and the amount of heat transfer liquid Wa circulated by the pump 42 so that the temperature of the heat transfer liquid Wa flowing into the heat exchanger 26 is higher than the temperature of the low-temperature side refrigerant Rc flowing into the heat exchanger 26 and the temperature difference is within a predetermined "second temperature range." This makes it possible for the heat exchanger 41 to suitably absorb the heat absorbed by the heat transfer liquid Wa through heat exchange in the heat exchanger 26 from the atmosphere.

[0075] Furthermore, in the simultaneous cooling and heating temperature control device 2 of this example, when either the "first condition" or "second condition" is satisfied and heat transfer liquid Wa is circulating in heat absorption and heat release circuit 10A, control unit 7 adjusts the amount of air sent by blower 41a so that the refrigerant pressure of low-temperature side refrigerant Rc in low-temperature side refrigeration circuit 10C (e.g., the suction pressure to compressor 21) is within a predetermined pressure range, thereby adjusting the amount of heat exchanged between heat transfer liquid Wa and the air in heat exchanger 41 and thereby adjusting the amount of heat exchanged between heat transfer liquid Wa and low-temperature side refrigerant Rc in heat exchanger 26. This makes it possible to avoid an excessive supply or insufficient supply of hot heat from low-temperature side refrigeration circuit 10C to heat exchanger 5C, and an excessive supply or insufficient supply of cold heat from low-temperature side refrigeration circuit 10C to heat exchanger 5C (heat transfer liquid We).

[0076] As described above, in the removal system 1 (simultaneous cold and warm temperature control device 2) of this example, even if the ratio of the amount of cold energy necessary and sufficient to cool the hydrogen gas G passing through the adsorption tower T (adsorption tower Ta in the above example) performing the adsorption removal process, and the amount of warm energy necessary and sufficient to heat the hydrogen gas G passing through the adsorption tower T (adsorption tower Tb in the above example) that is the target of the adsorption capacity regeneration process, changes, it is possible to maintain the cold energy and warm energy to be supplied at an appropriate state by dissipating heat into the atmosphere or absorbing heat from the atmosphere via the heat absorption and dissipation circuit 10A.

[0077] On the other hand, when an adsorption removal process using one of the adsorption towers T and an adsorption capacity regeneration process targeting another of the adsorption towers T are performed in parallel, it may be preferable to perform the adsorption removal process without cooling the hydrogen gas G supplied via the pipe Pi using the simultaneous hot and cold temperature control device 2, while continuing the adsorption capacity regeneration process as in the example above.

[0078] Specifically, the amount of moisture to be desorbed from the adsorbent in the adsorption tower T undergoing adsorption capacity regeneration treatment will never exceed the adsorption capacity of the adsorbent. However, the amount of moisture to be adsorbed from hydrogen gas G to the adsorbent in any of the adsorption towers T by the adsorption removal treatment varies depending on the amount of moisture per unit volume contained in the supplied hydrogen gas G and the amount of hydrogen gas G supplied per unit time. Therefore, a state may be reached where moisture can be sufficiently adsorbed onto the adsorbent in the adsorption tower T without increasing the relative humidity of the hydrogen gas G undergoing the adsorption removal treatment. Furthermore, for example, when the supply of hydrogen gas G via the pipe Pi is stopped (a state in which the adsorption removal treatment is not required), it may be necessary to perform only the adsorption capacity regeneration treatment. Therefore, the simultaneous cooling and heating temperature control device 2 of this example is configured to supply hot heat from the low-temperature side refrigeration circuit 10C to the high-temperature side refrigeration circuit 10H without supplying cold heat from the low-temperature side refrigeration circuit 10C to the heat transfer liquid Wc.

[0079] Specifically, when only supplying warm heat to the high-temperature side refrigeration circuit 10H, the control unit 7 controls the flow control valves 23, 28 and the flow path switching valves 25, 27, as shown in Figure 7, to cause the low-temperature side refrigerant Rc discharged from the compressor 21 to pass through the heat exchanger 22, the flow control valve 28 and the heat exchanger 26 in that order, and transitions to a state in which the refrigerant Rc can flow through a refrigerant flow path (hereinafter also referred to as the "third refrigerant flow path") in which the refrigerant passes through the compressor 21 and flows back into the heat exchanger 22 without passing through the flow control valve 23 or the heat exchanger 24, and by controlling the pump 42, starts circulating the heat transfer liquid Wa within the heat absorption and dissipation circuit 10A. At this time, the low-temperature side refrigerant Rc pumped by the compressor 21 is condensed and its temperature is lowered by heat exchange with the high-temperature side refrigerant Rh in the heat exchanger 22, and the condensed low-temperature side refrigerant Rc passes through the flow control valve 28 and is vaporized in the heat exchanger 26, thereby cooling the heat transfer liquid Wa, and is then pumped again by the compressor 21.

[0080] Furthermore, the heat transfer liquid Wa, whose temperature has been reduced by the heat exchange (heat dissipation to the low-temperature side refrigerant Rc) in the heat exchanger 26 as described above, is heated by heat exchange with the atmosphere in the heat exchanger 41, and then is forced to flow back into the heat exchanger 26 by pumping using the pump 42. As a result, a sufficient amount of low-temperature side refrigerant Rc required to operate the low-temperature side refrigeration circuit 10C can be vaporized by the heat absorbed from the atmosphere via the heat absorption / dissipation circuit 10A, and therefore it is possible to supply a sufficient amount of heat from the high-temperature side refrigeration circuit 10H to the heat transfer liquid Wh without supplying cold energy from the low-temperature side refrigeration circuit 10C to the heat transfer liquid We.

[0081] In this manner, in the simultaneous cooling and heating temperature adjustment device 2, the low-temperature side refrigerant Rc in the low-temperature side refrigeration circuit 10C and the high-temperature side refrigerant Rh in the high-temperature side refrigeration circuit 10H are configured to be able to exchange heat in the heat exchanger 22, and the heat transfer liquid Wc to be supplied to the heat exchanger 5c (the object to be cooled) is cooled in the heat exchanger 24 of the low-temperature side refrigeration circuit 10C, and the heat transfer liquid Wh to be supplied to the heat exchanger 5h (the object to be heated) is heated in the heat exchanger 32 of the high-temperature side refrigeration circuit 10H. The low-temperature side refrigeration circuit 10C includes a control unit 7 for controlling the operation of the compressor 21, a heat absorption / dissipation circuit 10A provided with a heat exchanger 41 capable of exchanging heat between the heat transfer liquid Wa and the atmosphere and configured to allow the heat transfer liquid Wa to circulate, and configured to allow heat exchange between the low-temperature side refrigerant Rc and the heat transfer liquid Wa in the heat exchanger 26. The low-temperature side refrigeration circuit 10C includes a "first refrigerant flow path" (see FIG. 5) in which the low-temperature side refrigerant Rc discharged from the compressor 21 is passed through the heat exchangers 22, 26, and 24 in this order and then flows into the heat exchanger 22, and a "second refrigerant flow path" (see FIG. 5) in which the low-temperature side refrigerant Rc is split after passing through the heat exchanger 22, passes through the heat exchangers 24 and 26, and then joins together. The control unit 7 is provided with a "flow path switching unit" (flow path switching valves 25, 27) that switches between the low-temperature side refrigerant Rc flowing into the heat exchanger 24 and the "second refrigerant flow path" (see FIG. 6) that flows into the heat exchanger 22, a flow rate adjustment valve 23 (first expansion valve) that is arranged to allow the low-temperature side refrigerant Rc flowing into the heat exchanger 24 to pass through, and a flow rate adjustment valve 28 (second expansion valve) that is arranged to allow the low-temperature side refrigerant Rc flowing into the heat exchanger 26 to pass through at least in a state where the flow path is switched to the "second refrigerant flow path." The control unit 7 is provided with a "flow path switching unit" (flow path switching valves 25, 27) that switches between the low-temperature side refrigerant Rc flowing into the heat exchanger 24 and the "second refrigerant flow path" (see FIG. 6) that flows into the heat exchanger 22, and a flow rate adjustment valve 28 (second expansion valve) that is arranged to allow the low-temperature side refrigerant Rc flowing into the heat exchanger 26 to pass through when the flow path is switched to the "second refrigerant flow path." When the "second condition" is satisfied, that the amount of cold heat to be supplied to heat exchanger 5c is less than the amount of hot heat to be supplied to heat exchanger 5h, the "flow path switching unit" is controlled to switch to the "second refrigerant flow path", so that heat is absorbed by the low-temperature side refrigerant Rc in heat exchanger 26 and by the heat transfer liquid Wa in heat exchanger 41, and when the "second condition" is satisfied, that the amount of cold heat to be supplied to heat exchanger 5c is less than the amount of hot heat to be supplied to heat exchanger 5h, the "flow path switching unit" is controlled to switch to the "second refrigerant flow path", so that heat is absorbed by the low-temperature side refrigerant Rc in heat exchanger 26 and by the heat transfer liquid Wa in heat exchanger 41.

[0082] Furthermore, this removal system 1 is equipped with the above-mentioned simultaneous cooling and heating temperature adjustment device 2, and is equipped with a plurality of adsorption towers T (Ta, Tb), and is configured to be able to concurrently perform an "adsorption removal process" in which the "removal target (moisture)" is adsorbed onto an adsorbent contained in one of the adsorption towers T to remove the "removal target" from the hydrogen gas G, and an "adsorbent regeneration process" in which the "removal target" adsorbed on an adsorbent contained in any of the other adsorption towers T is desorbed from the adsorbent, thereby regenerating the adsorption capacity of the adsorbent. In the "adsorption removal process", a heat transfer liquid Wc is introduced from the simultaneous cooling and heating temperature adjustment device 2 to a heat exchanger 5c as an "target to be cooled". The hydrogen gas G is supplied and cooled by heat exchange with the heat transfer liquid Wc in the heat exchanger 5c, and then flows into one of the adsorption towers T, where the "removal target" contained in the hydrogen gas G is adsorbed onto the adsorbent housed in one of the adsorption towers T. In the "adsorbent regeneration process", the heat transfer liquid Wh is supplied from the simultaneous hot and cold temperature control device 2 to the heat exchanger 5h as the "heating target", and the hydrogen gas G is heated by heat exchange with the heat transfer liquid Wh in the heat exchanger 5h, and then flows into one of the other adsorption towers T, where the "removal target" is separated from the adsorbent housed in one of the other adsorption towers T into the hydrogen gas G, thereby regenerating the adsorption capacity of the adsorbent.

[0083] Therefore, with this simultaneous cooling and heating temperature control device 2 and removal system 1, even when the amount of cold to be supplied to a cooling target (e.g., heat exchanger 5c) and the amount of hot to be supplied to a heating target (e.g., heat exchanger 5h) are not balanced, the difference between the amounts of cold and hot to be supplied can be compensated for by radiating heat to the atmosphere or absorbing heat from the atmosphere via heat absorption and radiation circuit 10A. This allows the low-temperature side refrigeration circuit 10C and the high-temperature side refrigeration circuit 10H to continue operating without causing an excess or deficiency of cold to be supplied to the cooling target or an excess or deficiency of hot to be supplied to the heating target. Therefore, by configuring removal system 1 with this simultaneous cooling and heating temperature control device 2, the simultaneous cooling and heating temperature control device 2 can reliably supply the cold required for the adsorption and removal process and the hot heat required for the adsorption capacity regeneration process. This reliably removes unnecessary moisture from the hydrogen gas G to be supplied to the supply target and reliably regenerates the adsorption tower T (adsorbent) whose adsorption capacity has been reduced due to moisture adsorption.

[0084] Furthermore, in this simultaneous cold and warm temperature control device 2, when the "second condition" is satisfied by a decrease in the amount of cold heat to be supplied to heat exchanger 5c, when the "second condition" is satisfied by an increase in the amount of hot heat to be supplied to heat exchanger 5h, when the "second condition" is satisfied and the amount of cold heat to be supplied decreases, or when the "second condition" is satisfied and the amount of hot heat to be supplied increases, the control unit 7 increases the aperture of the flow control valve 28, which is composed of an electronic expansion valve, to increase the amount of heat absorbed from the heat transfer liquid Wa to the low-temperature side refrigerant Rc in the heat exchanger 26; and when the amount of cold heat to be supplied increases and the amount of hot heat to be supplied decreases when the "second condition" is satisfied, the control unit 7 decreases the aperture of the flow control valve 28 to decrease the amount of heat absorbed from the heat transfer liquid Wa to the low-temperature side refrigerant Rc in the heat exchanger 26.

[0085] Therefore, according to this simultaneous hot and cold temperature control device 2 and removal system 1, the heat exchange efficiency in the heat exchanger 26, i.e., the degree of heat exchange between the low-temperature side refrigerant Rc in the low-temperature side refrigeration circuit 10C and the heat transfer liquid Wa in the heat absorption and dissipation circuit 10A, can be reliably brought to an appropriate state in a short period of time, thereby sufficiently shortening the operating time when there is an excess or deficiency of cold heat to be supplied to the object to be cooled, or an excess or deficiency of hot heat to be supplied to the object to be heated.

[0086] Furthermore, in this simultaneous cooling and heating temperature regulation device 2, the control unit 7 adjusts the amount of air sent by the blower 41a so that the refrigerant pressure of the low-temperature side refrigerant Rc in the low-temperature side refrigeration circuit 10C is within a predetermined pressure range, thereby adjusting the amount of heat exchange between the heat transfer liquid Wa and the air in the heat exchanger 41 and thereby adjusting the amount of heat exchange between the heat transfer liquid Wa and the low-temperature side refrigerant Rc in the heat exchanger 26. Furthermore, in this simultaneous cooling and heating temperature regulation device 2, when the "first condition" is satisfied, the control unit 7 adjusts the amount of air sent by the blower 41a so that the temperature of the heat transfer liquid Wa flowing into the heat exchanger 26 is lower than the temperature of the low-temperature side refrigerant Rc flowing into the heat exchanger 26 and the temperature difference is within the predetermined "first temperature range." Furthermore, in this simultaneous hot and cold temperature control device 2, when the "second condition" is satisfied, the control unit 7 adjusts the amount of air blown by the blower 41a so that the temperature of the heat transfer liquid Wa flowing into the heat exchanger 26 is higher than the temperature of the low-temperature side refrigerant Rc flowing into the heat exchanger 26, and the temperature difference is within a predetermined "second temperature range."

[0087] Therefore, this simultaneous hot and cold temperature control device 2 and removal system 1 has a very simple configuration in which the temperature of the heat transfer liquid Wa is adjusted by changing the amount of air sent to the heat exchanger 41 by the blower 41a, and yet the temperature of the low-temperature side refrigerant Rc after heat exchange with the heat transfer liquid Wa can be suitably adjusted.

[0088] Furthermore, in this simultaneous cooling and heating temperature regulation device 2, when the "first condition" is satisfied, the control unit 7 adjusts the amount of heat transfer liquid Wa circulated by the pump 42 so that the temperature of the heat transfer liquid Wa flowing into the heat exchanger 26 is lower than the temperature of the low-temperature side refrigerant Rc flowing into the heat exchanger 26, and the temperature difference is within a predetermined "first temperature range." Furthermore, in this simultaneous cooling and heating temperature regulation device 2, when the "second condition" is satisfied, the control unit 7 adjusts the amount of heat transfer liquid Wa circulated by the pump 42 so that the temperature of the heat transfer liquid Wa flowing into the heat exchanger 26 is higher than the temperature of the low-temperature side refrigerant Rc flowing into the heat exchanger 26, and the temperature difference is within a predetermined "second temperature range."

[0089] Therefore, with this simultaneous hot and cold temperature adjustment device 2 and removal system 1, the temperature of the heat transfer liquid Wa in the heat exchanger 41 and the amount of heat exchange between the heat transfer liquid Wa and the low-temperature side refrigerant Rc in the heat exchanger 26 can be adjusted by changing the amount of heat transfer liquid Wa circulated within the heat absorption and heat dissipation circuit 10A by the pump 42, i.e., the amount of heat transfer liquid Wa sent to the heat exchanger 41 and the heat exchanger 26, and yet the temperature of the low-temperature side refrigerant Rc after heat exchange with the heat transfer liquid Wa can be suitably adjusted.

[0090] The configuration of the "simultaneous cooling and heating temperature control device" and the configuration of the "removal system" are not limited to the examples of the configuration of the simultaneous cooling and heating temperature control device 2 and the configuration of the removal system 1 described above.

[0091] For example, while an example has been described in which an electronic expansion valve such as flow control valve 28 is used as the "second expansion valve," it is also possible to use, for example, multiple types of capillary tubes with different passage resistances and multiple on-off valves that allow / restrict the passage of low-temperature refrigerant through each capillary tube, so that the low-temperature refrigerant passes through the capillary tube in an amount appropriate for the amount to be supplied to the "fifth heat exchanger." Also, while the example has been described in which heat absorption / dissipation circuit 10A includes variable airflow rate blower 41a and variable liquid feed rate pump 42, it is also possible to use, instead of such a configuration, a configuration including a fixed airflow rate blower and a variable liquid feed rate pump that only adjusts the circulation rate of the "third heat exchange fluid," or a configuration including a variable airflow rate blower and a fixed liquid feed rate pump that only adjusts the amount of air sent to the "fourth heat exchanger."

[0092] Furthermore, although an example has been described in which the device is configured with a two-cascade refrigeration cycle 10 having a low-temperature side refrigeration circuit 10C and a high-temperature side refrigeration circuit 10H, the simultaneous cooling and heating temperature control device can also be configured with a multi-cascade refrigeration cycle such as a three-cascade refrigeration cycle or a four-cascade refrigeration cycle instead of the two-cascade refrigeration cycle. In this case, for example, in a three-cascade refrigeration cycle having three refrigeration circuits, namely, a low-temperature refrigeration circuit (low-stage refrigeration circuit), a medium-temperature refrigeration circuit (middle-stage refrigeration circuit), and a high-temperature refrigeration circuit (high-stage refrigeration circuit), when the low-temperature refrigeration circuit is defined as the low-temperature side refrigeration circuit, the medium-temperature refrigeration circuit corresponds to the high-temperature side refrigeration circuit, and when the medium-temperature refrigeration circuit is defined as the low-temperature side refrigeration circuit, the high-temperature refrigeration circuit corresponds to the high-temperature side refrigeration circuit.

[0093] Furthermore, while the example described uses a configuration in which "liquids" such as heat transfer liquids Wc, Wh, and Wa are used as the "first heat exchange fluid," "second heat exchange fluid," and "third heat exchange fluid," it is also possible to use a configuration in which "gases" such as inert gases or air are used as any or all of the "first heat exchange fluid," "second heat exchange fluid," and "third heat exchange fluid." In addition, the targets to which cold and hot heat are supplied by the "simultaneous cold and hot temperature control device" are not limited to systems that perform adsorption removal treatment or adsorption capacity regeneration treatment. [Explanation of symbols]

[0094] 1. Removal System 2. Simultaneous hot and cold temperature control device 3,4cf blower 4 Gas-liquid separation tank 4c,5c,5h,22,24,26,32,41 Heat exchanger 6a, 6b Flow path switching valve 7 Control Unit 10. Cascade refrigeration cycle 10A heat absorption heat dissipation circuit 10C low temperature side refrigeration circuit 10H High temperature side refrigeration circuit 21,31 Compressor 23, 28, 33 Flow control valve 25,27 Flow path switching valve 41a Blower 42 Pump G Hydrogen gas LC,LH Heat medium liquid circulation path Pi,Po,Phi,Pho Piping Ta, Tb adsorption tower Rc Low temperature refrigerant Rh High temperature refrigerant Wa,Wc,Wh Heat medium liquid

Claims

1. a multi-cascade refrigeration cycle including a low-temperature side refrigeration circuit and a high-temperature side refrigeration circuit, configured so that a low-temperature side refrigerant in the low-temperature side refrigeration circuit and a high-temperature side refrigerant in the high-temperature side refrigeration circuit can exchange heat in a first heat exchanger, and configured so that a first heat exchange fluid to be supplied to an object to be cooled can be cooled in a second heat exchanger of the low-temperature side refrigeration circuit, and a second heat exchange fluid to be supplied to an object to be heated can be heated in a third heat exchanger of the high-temperature side refrigeration circuit; a control unit that controls an operation of the multi-cascade refrigeration cycle according to an amount of cold heat to be supplied to the object to be cooled by supplying the first heat exchange fluid and an amount of hot heat to be supplied to the object to be heated by supplying the second heat exchange fluid, a fourth heat exchanger capable of exchanging heat between a third heat exchange fluid and the atmosphere is provided, and a fluid circulation path configured to be able to circulate the third heat exchange fluid is provided, and heat exchange between the low-temperature side refrigerant and the third heat exchange fluid is configured to be able to be performed in a fifth heat exchanger; the low-temperature side refrigeration circuit includes a flow path switching unit that switches between a first refrigerant flow path through which the low-temperature side refrigerant discharged from the low-temperature side refrigerant compressor passes through the first heat exchanger, the fifth heat exchanger, and the second heat exchanger in this order and flows into the first heat exchanger, and a second refrigerant flow path through which the low-temperature side refrigerant is split after passing through the first heat exchanger, passes through the second heat exchanger and the fifth heat exchanger, and then merges and flows into the first heat exchanger; and the low-temperature side refrigeration circuit includes a first expansion valve that is arranged to allow the low-temperature side refrigerant that flows into the second heat exchanger to pass through, and a second expansion valve that is arranged to allow the low-temperature side refrigerant that flows into the fifth heat exchanger to pass through at least in a state where the flow path is switched to the second refrigerant flow path, When a first condition is satisfied that the amount of hot heat to be supplied to the object to be cooled is less than the amount of cold heat to be supplied to the object to be cooled, the control unit controls the flow path switching unit to switch to the first refrigerant flow path, thereby causing heat to be dissipated from the low-temperature side refrigerant to the third heat exchange fluid in the fifth heat exchanger, and heat to be dissipated from the third heat exchange fluid to the atmosphere in the fourth heat exchanger; and when a second condition is satisfied that the amount of cold heat to be supplied to the object to be cooled is less than the amount of hot heat to be supplied to the object to be heated, the control unit controls the flow path switching unit to switch to the second refrigerant flow path, thereby causing heat to be absorbed from the third heat exchange fluid to the low-temperature side refrigerant in the fifth heat exchanger, and heat to be absorbed from the atmosphere to the third heat exchange fluid in the fourth heat exchanger.

2. the second expansion valve is an electronic expansion valve whose opening degree can be changed under the control of the control unit, 2. The simultaneous cooling and heating temperature control device of claim 1, wherein the control unit increases the aperture of the second expansion valve to increase the amount of heat absorbed from the third heat exchange fluid to the low-temperature side refrigerant in the fifth heat exchanger when the second condition is satisfied due to a decrease in the amount of cold heat to be supplied to the object to be cooled, when the second condition is satisfied due to an increase in the amount of hot heat to be supplied to the object to be heated, when the amount of cold heat to be supplied decreases when the second condition is satisfied, and when the amount of hot heat to be supplied increases when the second condition is satisfied.

3. a variable air volume blower configured to blow air to be subjected to heat exchange with the third heat exchange fluid in the fourth heat exchanger under control of the control unit, 2. The simultaneous cooling and heating temperature control device according to claim 1, wherein the control unit adjusts the amount of heat exchange between the third heat exchange fluid and the atmosphere in the fourth heat exchanger by adjusting the amount of air blown by the blower so that the refrigerant pressure of the low-temperature side refrigerant in the low-temperature side refrigeration circuit is within a predetermined pressure range, thereby adjusting the amount of heat exchange between the third heat exchange fluid and the atmosphere in the fifth heat exchanger.

4. a variable air volume blower configured to blow air to be subjected to heat exchange with the third heat exchange fluid in the fourth heat exchanger under control of the control unit, 2. The simultaneous cooling and heating temperature control device according to claim 1, wherein when the first condition is satisfied, the control unit adjusts the amount of air blown by the blower so that the temperature of the third heat exchange fluid flowing into the fifth heat exchanger is lower than the temperature of the low-temperature side refrigerant flowing into the fifth heat exchanger, and the temperature difference is within a predetermined first temperature range.

5. a variable air volume blower configured to blow air to be subjected to heat exchange with the third heat exchange fluid in the fourth heat exchanger under control of the control unit, 2. The simultaneous cooling and heating temperature control device according to claim 1, wherein when the second condition is satisfied, the control unit adjusts the amount of air blown by the blower so that the temperature of the third heat exchange fluid flowing into the fifth heat exchanger is higher than the temperature of the low-temperature side refrigerant flowing into the fifth heat exchanger, and the temperature difference is within a predetermined second temperature range.

6. a variable flow rate pump that circulates the third heat exchange fluid within the fluid circulation path under the control of the control unit, 2. The simultaneous cooling and heating temperature control device of claim 1, wherein when the first condition is satisfied, the control unit adjusts the amount of the third heat exchange fluid circulated by the pump so that the temperature of the third heat exchange fluid flowing into the fifth heat exchanger is lower than the temperature of the low-temperature side refrigerant flowing into the fifth heat exchanger, and the temperature difference is within a predetermined first temperature range.

7. a variable flow rate pump that circulates the third heat exchange fluid within the fluid circulation path under the control of the control unit, 2. The simultaneous cooling and heating temperature control device of claim 1, wherein when the second condition is satisfied, the control unit adjusts the amount of the third heat exchange fluid circulated by the pump so that the temperature of the third heat exchange fluid flowing into the fifth heat exchanger is higher than the temperature of the low-temperature side refrigerant flowing into the fifth heat exchanger, and the temperature difference is within a predetermined second temperature range.

8. A cooling / heating simultaneous temperature control device according to any one of claims 1 to 7, The system is configured to include a plurality of adsorption towers each containing an adsorbent that adsorbs a substance to be removed contained in a gas and removes it from the gas, and is capable of concurrently executing an adsorption removal process in which the substance to be removed is adsorbed onto the adsorbent contained in any of the adsorption towers to remove the substance to be removed from the gas, and an adsorbent regeneration process in which the substance to be removed that has been adsorbed onto the adsorbent contained in any of the other adsorption towers is desorbed from the adsorbent, thereby regenerating the adsorption capacity of the adsorbent, In the adsorption removal process, the first heat exchange fluid is supplied from the simultaneous hot and cold temperature control device to a heat exchanger A serving as the cooling target, and the gas cooled by heat exchange with the first heat exchange fluid in the heat exchanger A is allowed to flow into any one of the adsorption towers, causing the removal target contained in the gas to be adsorbed by the adsorbent accommodated in any one of the adsorption towers; In the adsorbent regeneration process, the second heat exchange fluid is supplied from the hot and cold simultaneous temperature control device to heat exchanger B as the heating target, and the gas heated by heat exchange with the second heat exchange fluid in heat exchanger B is flowed into any of the other adsorption towers, causing the gas to desorb the removal target from the adsorbent contained in any of the other adsorption towers, thereby regenerating the adsorption capacity of the adsorbent.

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