Water-cooled mounter

Abstract

To cool not only an electronic component facing a cooling unit but also an electronic component located around it while attaching the cooling unit to a circuit board.SOLUTION: The water-cooling mounter is for attaching the cooling unit of the water-cooling cooler to the circuit board. The water-cooled mounter includes a mount member made of metal. The mount member has a first surface disposed to face the circuit board and a second surface opposite to the first surface. The mount member is formed with a through-hole which penetrates from the first surface to the second surface and into which the cooling unit is inserted. The mount member has a heat dissipation structure that transfers heat of the first surface to a portion other than the first surface.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a water-cooled mounter. [Background technology]

[0002] Conventionally, cooling devices for cooling electronic components arranged on a circuit board have been known (see Patent Documents 1 and 2). Also, conventionally, water-cooled mounters for attaching a cooling unit of a water-cooled cooler to a circuit board have been known. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2021 / 038989 [Patent Document 2] Japanese Patent Publication No. 2022-043012 Summary of the Invention [Problem to be solved by the invention]

[0004] However, conventional water-cooled mounters can only cool electronic components facing the cooling unit, and to cool electronic components located around the water-cooled unit, a separate heat sink must be installed on the circuit board.

[0005] This specification discloses a technique that can solve at least part of the above-mentioned problems. [Means for solving the problem]

[0006] The technology disclosed in this specification can be realized in the following forms.

[0007] (1) The water-cooled mounter disclosed in this specification mounts a cooling unit of a water-cooled cooler to a circuit board. The water-cooled mounter includes a metal mounting member. The mounting member has a first surface facing the circuit board and a second surface opposite the first surface, and the mounting member has a through-hole that penetrates from the first surface to the second surface and through which the cooling unit is inserted. The mounting member has a heat dissipation structure that transfers heat from the first surface to areas other than the first surface.

[0008] In this configuration, the cooling unit can be attached to the circuit board by inserting the cooling unit into the through-hole of the mounting member and placing the mounting member on the circuit board. The heat absorption effect of the cooling unit cools the electronic components facing the cooling unit. Furthermore, the cooling structure of the mounting member cools the electronic components located near the first surface of the mounting member. Thus, with this configuration, while the cooling unit is attached to the circuit board, it is possible to cool not only the electronic components facing the cooling unit, but also the electronic components located around it.

[0009] (2) In the water-cooled mounter, the heat dissipation structure may have heat dissipation fins provided on at least one of the outer periphery and the second surface of the mount member. With this configuration, heat from electronic components located near the first surface of the mount member is dissipated to the outside of the mount member by the heat dissipation fins.

[0010] (3) In the water-cooled mounter, the mount member may have an extension extending from the first surface to the inner periphery of the through hole. With this configuration, electronic components located near the first surface of the mount member can be cooled by the heat absorption effect of the cooling unit.

[0011] The technology disclosed in this specification can be realized in various forms, for example, in the form of a cooling mount, a graphic board having the cooling mount, etc. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a top view of the fixing bracket of this embodiment. [Figure 2] Bottom view of the fixing bracket of the present invention [Figure 3] Schematic diagram of assembly as an example of how the present invention can be used [Figure 4] Schematic diagram of assembly as an example of how the present invention can be used DETAILED DESCRIPTION OF THE INVENTION

[0013] A. Implementation: This embodiment relates to a liquid cooling device fixing bracket that is suitable for easily improving the cooling performance of the GPU core (a1) of a graphics board used in a computer by fixing the heat absorption part of a commercially available liquid cooling device in contact with the GPU core, and for efficiently cooling peripheral elements that generate a lot of heat, such as a video memory (a2) and a power supply circuit.

[0014] One such product, designed solely for connecting the heat sink of a liquid cooling device to the GPU core, has already been developed, sold, and distributed on the market. When using this product, the video memory, power supply circuit, and other heat-generating components located around the GPU core are cooled by attaching a separate heat sink and blowing air through it with a fan. However, with the increasing component density on graphics cards in recent years, the distance between the GPU core and the surrounding components has become closer. When the heat sink of a liquid cooling device is installed on the GPU core, the liquid cooling device ends up covering the surrounding components, leaving insufficient space for the heat sink, making it difficult to use similar products.

[0015] The objective of this embodiment is to solve the problem that when attempting to attach a heat sink of a commercially available liquid cooling device to the GPU core of a graphics board, the video memory and power supply circuit are close to the GPU core due to the influence of the increase in component packaging density in recent years, and the liquid cooling device covers these components, making it difficult to install a heat sink to cool these components, and the components that are not cooled enough overheat, forcing the installation of the liquid cooling device to be abandoned.

[0016] This embodiment has been made to solve the above-mentioned problems, and is a fixing bracket (an example of a mount member) that combines a framework for fixing the heat absorption part (an example of a cooling unit) of a liquid-cooling cooling device so that it comes into contact with the GPU core of a graphics board, with the function of a heat sink for cooling peripheral elements such as video memory by using a material with high thermal conductivity and coming into thermal contact with the peripheral elements, thereby efficiently cooling mounted components even on a board with a high component mounting density.

[0017] When replacing the cooling device for a graphics board used in a computer with a commercially available liquid cooling device for a CPU (b), this metal fitting functions as a framework for fixing the liquid cooling device so that the GPU core (a1) and the heat absorption surface (b1) of the liquid cooling device come into contact, and has a structure (A) for fixing the graphics board (b) on one side and a structure (B) for fixing the liquid cooling device for the CPU on the other side. This invention is a metal fitting for fixing a liquid cooling device that is made of a material with good thermal conductivity and is in thermal contact with surrounding elements that generate a lot of heat, such as video memory (a2) and power supply circuits (a3), to absorb heat from those elements (C), and dissipate that heat to the heat absorption surface of the liquid cooling device for the CPU or the surrounding atmosphere through a structure (E) (an example of a heat dissipation fin) that also functions as a heat sink for those elements.

[0018] The metal fittings are fixed to the graphics board (an example of a circuit board) at part A using screws or the like, and the liquid cooling device is fixed at part B using screws, hooks, springs, etc. This brings the GPU core (an example of an electronic component) and the heat absorption surface (an example of a first surface) of the liquid cooling device into contact.

[0019] By attaching a thermally conductive sheet to part C, the entire fixture functions as a heat sink, allowing for efficient cooling of elements that are in thermal contact with part C.

[0020] By designing part D so that it does not interfere with the liquid cooling device, and part C (an example of an extension part) for contact with the element, the limited space can be effectively utilized, and the heat generated by the element can be dispersed and dissipated throughout the entire fixing bracket.

[0021] B. Variations: The technology disclosed in this specification is not limited to the above-described embodiments, and can be modified into various forms without departing from the spirit thereof, for example, the following modifications are also possible. [Explanation of symbols]

[0022] A: Graphics board b: Liquid cooling device for CPU

Claims

1. A water-cooled mounter for attaching a cooling unit of a water-cooled cooler to a circuit board, Equipped with metal mounting members, the mounting member has a first surface disposed opposite to the circuit board and a second surface opposite to the first surface; a through-hole penetrating from the first surface to the second surface and into which the cooling unit is inserted is formed in the mount member; The mounting member has a heat dissipation structure that transfers heat from the first surface to a portion other than the first surface.

2. 2. The water-cooled mounter according to claim 1, The heat dissipation structure is a structure having heat dissipation fins provided on at least one of the outer peripheral portion of the mount member and the second surface side.

3. 3. The water-cooled mounter according to claim 1, The mount member has an extension portion that extends from the first surface toward the inner periphery of the through hole.

Images