Electronic component collecting apparatus, electronic component collecting method, and electronic component mounting apparatus

Abstract

To improve the recovery rate of electronic components.SOLUTION: The outer tube 50 includes the notches 52, and the inner tube 40 includes the base portion 41 joined to the inner surface of the outer tube 50 and the upper end portion 42 spaced apart from the inner surface of the outer tube 50 and has flexibility such that the upper end portion 42 is crushed in the radial direction when a vacuum is supplied from the vacuum source 61 into the inner tube 40.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to an electronic component recovery device that recovers electronic components sucked onto the tip of a nozzle, an electronic component recovery method using the electronic component recovery device, and an electronic component mounting device that includes the electronic component recovery device. [Background technology]

[0002] Electronic component mounting devices are used to pick up electronic components, such as semiconductor dies, onto the tip of a suction nozzle and mount them on a substrate, wafer, or other semiconductor die. In such electronic component mounting devices, pickup errors can occur, such as when an abnormality in the supply of electronic components to the suction nozzle causes the suction nozzle to pick up the electronic component in an uncorrectable position. Furthermore, operational abnormalities during mounting on a substrate can also cause mounting errors, such as when an electronic component is not mounted on the substrate and remains held by the suction nozzle. When such pickup or mounting errors occur, the electronic component held by the suction nozzle must be removed and recovered in order to mount the next electronic component on the substrate.

[0003] As a method for this, Patent Document 1 discloses a method for recovering electronic components by blowing gas from the side of an electronic component that is sucked onto the tip of a nozzle and sucking the electronic component into a suction path together with the gas surrounding the electronic component.

[0004] Patent Document 2 also discloses a device that inserts the tip of a nozzle that has vacuum-sucked electronic components into a component recovery section, releases the vacuum suction of the nozzle, creates a vacuum in the component recovery section, transfers the electronic components from the component recovery section to a pipe, receives the electronic components with a filter installed in the pipe, shuts off the vacuum in the pipe, and drops the electronic components into a component storage container located at the bottom of the pipe. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-251979 [Patent Document 2] Patent No. 4831059 specification Summary of the Invention [Problem to be solved by the invention]

[0006] However, when electronic components are detached from the nozzle by blowing or the like, as in the conventional electronic component recovery devices described in Patent Documents 1 and 2, there is a risk that the electronic components will not enter the suction path or the component recovery section, but will be blown out and will not be fully recovered. Also, depending on the state in which the electronic components are held, there are cases in which the airflow from blowing or the like will not be able to detach the electronic components from the tip of the nozzle.

[0007] Therefore, an object of the present disclosure is to improve the recovery rate of electronic components. [Means for solving the problem]

[0008] The electronic component recovery device disclosed herein is an electronic component recovery device that recovers electronic components sucked onto the tip of a nozzle, and is characterized in that it comprises an outer tube having a predetermined rigidity, an inner tube that is fitted into the inner surface of the outer tube and into which the tip of the nozzle is inserted, and a path for supplying vacuum from a vacuum source to the inner tube, wherein the outer tube includes a plurality of notches extending downward from its upper end surface, and the inner tube includes a base portion joined to the inner surface below the lower ends of the notches of the outer tube, and an upper end portion positioned spaced apart from the inner surface between the upper end surface of the outer tube and the lower ends of the notches, and the upper end portion has flexibility that allows it to be crushed radially when vacuum is supplied to the interior from the vacuum source.

[0009] In this way, the upper end of the inner tube has flexibility that allows it to be crushed in the radial direction, so that electronic components can be picked up by the upper end of the inner tube. This allows the electronic components to be collected without being blown away. Furthermore, even when it is difficult to remove the electronic components by blowing, such as when the electronic components are sucked vertically to the tip of the nozzle, the electronic components can be reliably picked up. This improves the collection rate of electronic components.

[0010] In the electronic component recovery device of the present disclosure, the multiple notches are arranged in pairs opposite each other in the diameter direction of the outer tube, and when the interior of the inner tube is evacuated, the upper end of the inner tube may be crushed in a direction perpendicular to the direction in which the notches are arranged, and part of the upper end may protrude into the notch.

[0011] This makes it easier for the inner tube to be crushed in the radial direction, allowing the electronic components to be picked up reliably, thereby improving the efficiency of recovering the electronic components.

[0012] In the electronic component recovery device of the present disclosure, the upper end of the inner tube may have a plurality of notches at positions corresponding to the circumferential centers of the notches in the outer tube.

[0013] This makes it easier for the inner tube to be crushed in the radial direction, allowing the electronic components to be picked up more reliably, thereby improving the efficiency of collecting electronic components.

[0014] In the electronic component recovery device of the present disclosure, the notch may have a vertical length that is 1.5 to 3 times the diameter of the inner tube, a circumferential width that is at least twice the thickness of the inner tube and not more than 1 / 4 of the outer peripheral length of the inner tube, and the inner tube may be made of resin with a rubber Shore of 60 or less and a wall thickness of 1 / 10 or less of the inner diameter.

[0015] This ensures that the inner tube is collapsed in the radial direction when the inside is evacuated, and that the inner tube returns to its original annular shape when the inside is returned to atmospheric pressure.

[0016] The electronic component recovery method disclosed herein is an electronic component recovery method for recovering electronic components sucked onto the tip of a nozzle, the method comprising: an outer tube having a predetermined rigidity; an inner tube fitted onto the inner surface of the outer tube and into which the tip of a nozzle is inserted; and a path for supplying vacuum from a vacuum source to the inner tube, wherein the outer tube includes a plurality of notches extending downward from its upper end surface, and the inner tube includes a base portion joined to the inner surface below the lower ends of the notches of the outer tube, and an upper end portion positioned spaced apart from the inner surface between the upper end surface of the outer tube and the lower ends of the notches, the electronic component recovery device having flexibility such that the upper end portion is crushed radially when vacuum is supplied to the inside from the vacuum source; inserting the tip of the nozzle into the inner tube, creating a vacuum inside the inner tube, and while the inside of the inner tube is vacuum, pulling the nozzle out of the inner tube and allowing the upper end portion to pick up the electronic component sucked onto the tip of the nozzle.

[0017] By creating a vacuum inside the tube, the nozzle is pulled out from the radially crushed inner tube to pick up the electronic components, allowing the electronic components to be collected without being blown away. Furthermore, even when it is difficult to remove electronic components by blowing, the electronic components can be reliably picked up. This improves the collection rate of electronic components.

[0018] In the electronic component recovery method of the present disclosure, after the electronic components are picked, the pressure inside the inner tube may be set to atmospheric pressure, and then air may be sucked from the inside to recover the electronic components from inside the inner tube.

[0019] This allows the picked electronic components to be collected in a predetermined location.

[0020] In the electronic component recovery method of the present disclosure, air may be blown out from the tip of a nozzle when the inside of the inner tube is evacuated.

[0021] This allows the electronic components to be more effectively collected from the tip of the nozzle.

[0022] The electronic component mounting device of the present disclosure is an electronic component mounting device that mounts electronic components on a mounting target, and includes a nozzle that sucks electronic components at its tip, a drive unit that moves the nozzle in a vertical direction, an electronic component recovery unit that recovers electronic components sucked at the tip of the nozzle, and a control unit that adjusts the operation of the drive unit, and the electronic component recovery unit includes an outer tube having a predetermined rigidity, an inner tube that is fitted into the inner surface of the outer tube and into which the tip of the nozzle is inserted, and a path that supplies vacuum from a vacuum source to the inner tube, and the outer tube includes a plurality of notches extending downward from an upper end surface, and the inner tube The nozzle includes a base portion joined to the inner surface below the lower end of the notch in the outer tube, and an upper end portion positioned at a distance from the inner surface between the upper end surface of the outer tube and the lower end of the notch, and has flexibility such that the upper end portion is crushed radially when a vacuum is supplied to the inside from a vacuum source.The control unit is characterized in that it inserts the tip of the nozzle into the inside of the inner tube using the drive unit, creates a vacuum inside the inner tube, and while the inside of the inner tube is in a vacuum state, moves the nozzle upward using the drive unit to pull it out of the inner tube, and causes the upper end portion to pick up the electronic component sucked to the tip of the nozzle.

[0023] In this way, the nozzle is pulled out by the drive unit from the radially collapsed inner tube by creating a vacuum inside, and electronic components are picked up, which improves the recovery rate of electronic components.In addition, electronic components remaining at the tip of the nozzle of the electronic component mounting device can be recovered with a simple configuration.

[0024] The electronic component mounting device of the present disclosure may include a holding state detector that detects the holding state of the electronic component adsorbed to the tip of the nozzle, and if the holding state of the electronic component detected by the holding state detector is poor, the control unit may cause the drive unit to insert the tip of the nozzle into the inside of the inner tube, create a vacuum inside the inner tube, and while the inside of the inner tube is in a vacuum state, move the nozzle upward by the drive unit to pull it out of the inner tube, and have the upper end pick up the electronic component adsorbed to the tip of the nozzle.

[0025] This allows the electronic component sucked at the tip of the nozzle to be picked up according to the state of the electronic component being held.

[0026] In the electronic component mounting device of the present disclosure, after the electronic component is picked, the control unit may set the inside of the inner tube to atmospheric pressure, then suck air from inside the inner tube, and recover the electronic component from inside the inner tube.

[0027] This allows the picked electronic components to be collected in a predetermined location.

[0028] In the electronic component mounting apparatus of the present disclosure, the control unit may blow air from the tip of the nozzle when creating a vacuum inside the inner tube.

[0029] This allows the electronic components to be more effectively collected from the tip of the nozzle. [Effects of the Invention]

[0030] The present disclosure can improve the recovery rate of electronic components. [Brief explanation of the drawings]

[0031] [Figure 1] 1 is a schematic system diagram showing a configuration of an electronic component mounting apparatus according to an embodiment. [Figure 2] FIG. 2 is an enlarged perspective view of the collection tube shown in FIG. 1. [Figure 3A]3 is a cross-sectional view of the recovery tube shown in FIG. 2, taken along line AA in FIG. 2. [Figure 3B] 3 is a cross-sectional view of the recovery tube shown in FIG. 2, taken along the line BB shown in FIG. 2. [Figure 4] 10 is a flowchart showing an electronic component collecting operation of the electronic component mounting apparatus according to the embodiment. [Figure 5] 10 is a perspective view showing a state in which the collet has been moved to a position directly above the collection tube in the electronic component mounting apparatus of the embodiment. FIG. [Figure 6] 1 is a perspective view showing a state in which a collet is inserted into an inner tube and the inside of the inner tube is evacuated in the electronic component mounting apparatus according to the embodiment; [Figure 7A] 7 is a cross-sectional view of the recovery tube shown in FIG. 6, taken along line CC shown in FIG. 6. [Figure 7B] 7 is a cross-sectional view of the recovery tube shown in FIG. 6, taken along line DD in FIG. 6. [Figure 8] 8 is a detailed view of part E shown in FIG. 7, and is a cross-sectional view showing the change in the upper end portion of the inner tube when the collet is pulled out from the inner tube. FIG. [Figure 9] 1 is a perspective view showing a state in which the collet has been pulled out of the inner tube in the electronic component mounting apparatus according to the embodiment; [Figure 10A] 10 is a cross-sectional view of the recovery tube shown in FIG. 9, taken along line FF shown in FIG. [Figure 10B] 10 is a cross-sectional view of the recovery tube shown in FIG. 9, taken along line GG in FIG. 9. [Figure 11] FIG. 10 is a perspective view showing another collection tube. [Figure 12] 10 is a flowchart showing another electronic component collecting operation of the electronic component mounting apparatus according to the embodiment. [Figure 13] 3 is a flowchart showing an electronic component recovery method according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0032] An electronic component mounting apparatus 100 according to an embodiment will now be described with reference to the drawings. As shown in Fig. 1, the electronic component mounting apparatus 100 includes a drive unit 14, a bonding head 15, a collet 16, a bonding stage 17, a push-up unit 18, a light emitting / receiving sensor 68, an electronic component collecting device 200, and a control unit 80. In the following description, the transport direction of a substrate 21 is referred to as the X direction, the direction from the bonding stage 17 toward the push-up unit 18 as the Y direction, and the up-down direction as the Z direction.

[0033] The driving unit 14 is a Cartesian robot that moves the bonding head 15 in the X, Y, and Z directions. The driving unit 14 has an X-axis actuator 11, a Y-axis actuator 12, and a Z-axis actuator 13. The X-axis actuator 11 moves the bonding head 15 along the X-axis direction, the Y-axis actuator 12 moves the bonding head 15 along the Y-axis direction, and the Z-axis actuator 13 moves the bonding head 15 along the Z-axis direction. The X-axis actuator 11, the Y-axis actuator 12, and the Z-axis actuator 13 are connected to the control unit 80 and operate according to commands from the control unit 80.

[0034] The collet 16 is composed of a cylindrical base portion 16A held by the bonding head 15 and a truncated cone-shaped tip portion 16B extending downward from the bottom end of the base portion 16A. The base portion 16A and tip portion 16B each have an air hole 16C extending vertically through their centers. The air hole 16C is connected to a vacuum source 61 or an air source (not shown). By creating a vacuum in this air hole 16C, the tip portion 16B adsorbs a semiconductor die 70, an electronic component, onto its underside. Therefore, the collet 16 forms a nozzle at its tip for adsorbing an electronic component. The air source supplies air at a pressure higher than atmospheric pressure. By connecting the air hole 16C to the air source, air can be blown from the tip to release the semiconductor die 70.

[0035] The bonding stage 17 vacuum-sucks the substrate 21 onto its upper surface and heats the substrate 21 with a built-in heater (not shown). The push-up unit 18 is a device that pushes up the semiconductor die 70 to be picked up from the wafer 22 from below. The light-emitting / receiving sensor 68 includes a light-emitting section that emits light toward the tip 16B of the collet 16 and a light-receiving section that receives light reflected from the tip 16B. The light-emitting / receiving sensor 68 detects whether the semiconductor die 70 is adsorbed to the tip 16B. The light-emitting / receiving sensor 68 also detects the holding state of the semiconductor die 70 adsorbed to the tip 16B of the collet 16. Therefore, the light-emitting / receiving sensor 68 constitutes a holding state detector that detects the holding state of the semiconductor die 70. A detection signal of the holding state of the semiconductor die 70 by the light-emitting / receiving sensor 68 is input to the control unit 80.

[0036] The electronic component recovery device 200 includes a recovery tube 30, a vacuum valve 62, a filter 63, an atmospheric release valve 67, a recovery pipe 64, and a vacuum tube 65. The electronic component recovery device 200 constitutes the electronic component recovery section of the electronic component mounting device 100. The vacuum source 61 may be composed of, for example, a vacuum tank and a vacuum pump. The recovery tube 30 includes an inner tube 40 and an outer tube 50 (see FIGS. 2 and 3), and the tip portion 16B of the collet 16 is inserted into the recovery tube 30. The structure of the recovery tube 30 will be described later with reference to FIGS. 2 and 3. The filter 63 allows air to pass through but does not allow the semiconductor die 70 to pass through. The filter 63 may be, for example, a centrifugal filter.

[0037] The inner tube 40 and the filter 63 are connected by a recovery pipe 64. The filter 63 and the vacuum source 61 are connected by a vacuum pipe 65. A vacuum valve 62 is provided in the vacuum pipe 65. The vacuum valve 62 is, for example, an electromagnetic gate valve. In addition, an atmosphere release pipe 66 is connected to the recovery pipe 64. An atmosphere release valve 67 is provided in the atmosphere release pipe 66. The atmosphere release valve 67 may be an electromagnetic gate valve, like the vacuum valve 62. The recovery pipe 64 and the vacuum pipe 65 form a path for supplying vacuum from the vacuum source 61 to the inner tube 40.

[0038] The control unit 80 is a computer including a CPU 81, which is an internal processor for information processing, and a memory 82 for storing programs and control data. The control unit 80 receives signals from a sensor (not shown) that detects the position of the tip 16B of the collet 16 in the X, Y, and Z directions. The control unit 80 also receives signals from the light-emitting / receiving sensor 68. The control unit 80 operates the drive unit 14 to adjust the position of the tip 16B of the collet 16 in the X, Y, and Z directions. The control unit 80 also operates the vacuum valve 62 and the air release valve 67 to change the pressure inside the inner tube 40 between atmospheric pressure and vacuum. The control unit 80 also adjusts the connection and opening of the vacuum source 61, an air source (not shown), and the air hole 16C of the collet 16.

[0039] As shown in FIGS. 2 and 3, the recovery tube 30 is made up of an inner tube 40 and an outer tube 50.

[0040] The outer tube 50 is a cylindrical member made of metal such as aluminum, and has higher rigidity than the inner tube 40. As shown in FIG. 2 , the outer tube 50 includes a main body 51 and notches 52 provided in the upper part of the main body 51. Two notches 52 are provided, one on the positive side in the X direction and the other on the negative side in the X direction, at the top of the main body 51. In other words, two notches 52 are provided in the upper part of the main body 51, facing each other in the diameter direction. The notches 52 are U-shaped and extend downward from the upper end surface 55 of the outer tube 50. Lip portions 54 are provided between the notches 52, one on the positive side in the Y direction and the other on the negative side in the Y direction. Like the notches 52, two lip portions 54 are provided.

[0041] As shown in FIGS. 3A and 3B , the inner tube 40 is a cylindrical member made of silicone resin and fitted onto the inner surface of the outer tube 50. The inner tube 40 includes a base portion 41 and an upper end portion 42. The base portion 41 is a portion bonded with adhesive 44 to the inner surface of the main body 51 below the lower end 53 of the cutout 52 of the outer tube 50. The upper end portion 42 is a portion located between the upper end surface 55 of the outer tube 50 and the lower end 53 of the cutout 52 and spaced apart from the inner surface of the main body 51. The portions of the upper end portion 42 located on the inner diameter sides of the two lip portions 54 are referred to as the Y-direction portion 42Y. The portions of the upper end portion 42 located on the inner diameter sides of the two cutouts 52 are referred to as the X-direction portion 42X. The upper surface 43 of the upper end portion 42 is flush with the upper end surface 55 of the outer tube 50.

[0042] Here, the inner diameter of the inner tube 40 is set to a size that leaves a gap of 0.2 to 0.5 mm between the inner tube 40 and the outer surface of the base portion 16A of the collet 16. In other words, the inner diameter of the inner tube 40 is 0.4 to 1.0 mm larger than the outer diameter of the base portion 16A of the collet 16. The inner diameter of the outer tube 50 is the same as the outer diameter of the inner tube 40.

[0043] Furthermore, the inner tube 40 may be made of silicone resin with a wall thickness of 0.5 mm and a rubber shore number of 30 to 50, for example. Alternatively, the inner tube 40 may be made of silicone resin with a wall thickness of 0.2 mm to 0.25 mm and a rubber shore number of 50 to 60. The vertical length of the notch 52 may be 1.5 to 3 times the diameter of the inner tube 40. The circumferential width of the notch 52 may be at least twice the wall thickness of the inner tube 40 and not more than ¼ the outer circumferential length of the inner tube 40.

[0044] Next, we will explain the operation of electronic component mounting apparatus 100 configured as described above. First, we will briefly explain the bonding operation of electronic component mounting apparatus 100. The bonding operation is realized by CPU 81 of control unit 80 executing a program stored in memory 82.

[0045] The CPU 81 of the control unit 80 controls the drive unit 14 to move the tip 16B of the collet 16 above the push-up unit 18. Then, with the air hole 16C of the collet 16 evacuated, the control unit 80 controls the push-up unit 18 to push up the semiconductor die 70 to be picked up, and the drive unit 14 to lower the collet 16. The control unit 80 then adsorbs the semiconductor die 70 onto the tip 16B of the collet 16. The control unit 80 then picks up the semiconductor die 70 from the wafer 22. The control unit 80 then moves the tip 16B of the collet 16 to a predetermined bonding position on the substrate 21, which is the mounting target. The control unit 80 then lowers the tip 16B of the collet 16 to mount the semiconductor die 70 on the substrate 21. After mounting is complete, the control unit 80 restores atmospheric pressure to the air hole 16C of the collet 16, releasing the semiconductor die 70. Then, the control unit 80 moves the tip 16B of the collet 16 to above the push-up unit 18 so that it passes over the light emitting and receiving sensor 68. The control unit 80 then picks up the next semiconductor die 70 and mounts it on the substrate 21, in the same manner as before.

[0046] 4 to 10B, the electronic component collecting operation of electronic component mounting apparatus 100 will be described. Similar to the bonding operation described above, the electronic component collecting operation is realized by CPU 81 of control unit 80 executing a program stored in memory 82.

[0047] After mounting the semiconductor die 70 on the substrate 21, the control unit 80 causes the tip 16B of the collet 16 to pass over the light emitting / receiving sensor 68. At this time, as shown in step S100 of FIG. 4, if the signal of the semiconductor die 70 input from the light emitting / receiving sensor 68 indicates a defective holding state, the control unit 80 executes the electronic component collection operation shown in FIG. 4. The defective holding state refers, for example, to a situation where the semiconductor die 70 remains at the tip 16B after mounting. In this case, the control unit 80 determines that a mounting error has caused a defective holding state of the semiconductor die 70, and proceeds to step S101 of FIG. 4 to collect the semiconductor die 70 remaining at the tip 16B. Furthermore, if the semiconductor die 70 is, for example, vertically oriented, the control unit 80 determines that a pickup error has caused a defective holding state of the semiconductor die 70, and proceeds to step S101 of FIG. 4 to collect the semiconductor die 70 remaining at the tip 16B.

[0048] 4, CPU 81 of control unit 80 operates drive unit 14 to move tip portion 16B of collet 16 above collection tube 30, as shown in FIG. 5. Then, control unit 80 causes drive unit 14 to lower tip portion 16B of collet 16 and insert it into inner tube 40.

[0049] Next, the CPU 81 of the control unit 80 opens the vacuum valve 62, as shown in step S102 of FIG. 4. At this time, the atmosphere release valve 67 is closed. This reduces the pressure inside the inner tube 40. Then, as shown in FIGS. 6 and 7A, the Y-direction portion 42Y of the upper end portion 42 of the inner tube 40 moves radially inward. At this time, as shown in FIGS. 6 and 7B, the X-direction portion 42X of the upper end portion 42 of the inner tube 40 deforms radially outward and protrudes into the notches 52. In other words, when the pressure inside the inner tube 40 decreases, the Y-direction portion 42Y has flexibility such that it is crushed radially along the Y direction, which is perpendicular to the X direction in which the notches 52 are aligned. At this time, the X-direction portion 42X protrudes into the notches 52. Then, when the Y-direction portion 42Y and the X-direction portion 42X come into close contact with the outer peripheral surface of the base portion 16A of the collet 16, a vacuum is created inside the inner tube 40.

[0050] Next, the CPU 81 of the control unit 80 gradually pulls the collet 16 upward using the drive unit 14. As the collet 16 rises, the upper end 42 of the inner tube 40 moves downward relative to the collet 16. As shown by arrows 94 and 95 in FIG. 8, the Y-direction portion 42Y, which is in close contact with the outer peripheral surface of the base portion 16A of the collet 16, moves downward relative to the collet 16 as the collet 16 rises. The Y-direction portion 42Y then moves obliquely downward while in close contact with the conical surface of the tip portion 16B. The Y-direction portion 42Y then grips and picks up the semiconductor die 70 remaining at the tip portion 16B from both sides in the Y direction.

[0051] When tip portion 16B of collet 16 has been completely pulled out from inside inner tube 40, as shown in Figures 9 and 10B, two X-direction portions 42X protrude largely into notch 52. As a result, two Y-direction portions 42Y come into close contact with each other and close top surface 43, as shown in Figures 9 and 10A.

[0052] In step S104 of FIG. 4, the CPU 81 of the control unit 80 determines whether the tip portion 16B of the collet 16 has been pulled out from inside the inner tube 40. If the CPU 81 of the control unit 80 determines YES in step S104 of FIG. 4, the process proceeds to step S105 of FIG. 4, where the vacuum valve 62 is closed. The control unit 80 then proceeds to step S106 of FIG. 4, where the air release valve 67 is opened. This causes the pressure inside the inner tube 40 to return to atmospheric pressure. The upper end portion 42 of the inner tube 40 then returns to its initial annular shape as shown in FIG. 2. At this time, the semiconductor die 70 picked up by the two Y-direction portions 42Y falls by gravity onto the base portion 41 of the inner tube 40.

[0053] 4, the CPU 81 of the control unit 80 closes the atmosphere release valve 67 and opens the vacuum valve 62. Because the upper end 42 of the inner tube 40 is open, air flows from the upper end 42 through the base portion 41, the recovery pipe 64, and the filter 63 into the vacuum source 61. Although the air can pass through the filter 63, the semiconductor die 70 cannot. Therefore, the semiconductor die 70 is captured by the filter 63.

[0054] The CPU 81 of the control unit 80 waits for a predetermined time in step S108 of Fig. 4. Here, the predetermined time can be set freely, and may be, for example, several seconds to several tens of seconds. After waiting for the predetermined time, the CPU 81 of the control unit 80 proceeds to step S109 of Fig. 4 and closes the vacuum valve 62. This causes the CPU 81 of the control unit 80 to end the electronic component collecting operation.

[0055] As described above, the electronic component mounting apparatus 100 pinches the semiconductor die 70 by radially crushing the upper end 42 of the inner tube 40 when the inside of the inner tube 40 is evacuated, so that the semiconductor die 70 can be collected without being blown away. Furthermore, even when the semiconductor die 70 is vertically attracted to the tip 16B of the collet 16 and it is difficult to separate the semiconductor die 70 from the tip 16B by blowing air through the air hole 16C, the semiconductor die 70 can be reliably picked up. This improves the collection rate of the semiconductor die 70 remaining at the tip 16B of the collet 16.

[0056] Furthermore, in electronic component mounting apparatus 100, CPU 81 of control unit 80 causes semiconductor die 70 to be picked up by upper end 42 of inner tube 40, and then causes the pressure inside inner tube 40 to become atmospheric. Then, control unit 80 sucks air from inside inner tube 40 and recovers semiconductor die 70 with filter 63. This allows semiconductor die 70 picked up by upper end 42 of inner tube 40 to be reliably recovered with filter 63.

[0057] In the electronic component mounting apparatus 100, two notches 52 of the outer tube 50 are arranged opposite each other in the diameter direction of the outer tube 50. As a result, when the inside of the inner tube 40 is evacuated, the upper end 42 is crushed in the Y direction, which is perpendicular to the X direction in which the notches 52 are aligned. At this time, a portion of the upper end 42 protrudes into the notch 52. This makes it easier for the inner tube 40 to be crushed in the radial direction, allowing the inner tube 40 to reliably pick up the semiconductor die 70. As a result, the electronic component mounting apparatus 100 can improve the efficiency of collecting the semiconductor die 70.

[0058] The inner tube 40 of the electronic component mounting device 100 is made of silicone resin with a rubber Shore of 60 or less and a wall thickness of 1 / 10 or less of the inner diameter. The notch 52 of the outer tube 50 has a vertical length of 1.5 to 3 times the diameter of the inner tube 40, and a circumferential width of at least twice the wall thickness of the inner tube 40 and 1 / 4 or less of the outer peripheral length of the inner tube 40. This allows the upper end 42 of the inner tube 40 to be crushed in the radial direction when the interior is evacuated, and the inner tube 40 to return to its original annular shape when the interior is returned to atmospheric pressure. This allows the recovery tube 30 including the inner tube 40 to be reused repeatedly.

[0059] Next, another recovery tube 130 will be described with reference to Figure 11. The same parts as those in the recovery tube 30 previously described with reference to Figures 2 and 3 will be given the same reference numerals and description thereof will be omitted.

[0060] 11, the recovery tube 130 has a notch 45 formed in the circumferential center of the X-direction portion 42X of the upper end portion 42 of the inner tube 40. The other portions are the same as the recovery tube 30 described above. The notch 45 is located at a position corresponding to the circumferential center of the notch 52.

[0061] With this configuration, the upper end 42 of the inner tube 40 of the recovery tube 130 is more easily crushed in the radial direction, allowing the semiconductor die 70 to be picked up more reliably.

[0062] Next, another electronic component collecting operation of electronic component mounting apparatus 100 will be described with reference to Fig. 12. In this other electronic component collecting operation, step S102 of the electronic component collecting operation previously described with reference to Fig. 4 is replaced with step S201. The other steps are the same as those in the electronic component collecting operation described with reference to Fig. 4.

[0063] In another electronic component recovery operation, in step S201, the vacuum valve 62 is opened to reduce the pressure inside the inner tube 40, and air is ejected from the air hole 16C of the collet 16 to recover the semiconductor die 70 before picking it up. This allows the semiconductor die 70 to be recovered more reliably.

[0064] Next, an electronic component collecting method according to an embodiment will be described with reference to Fig. 13. This electronic component collecting method describes the electronic component collecting operation of the electronic component mounting apparatus 100 described above as a method. This electronic component collecting method may be realized by causing the CPU 81 of the control unit 80 of the electronic component mounting apparatus 100 to execute a program for the method stored in the memory 82.

[0065] In the electronic component recovery method, in step S300 of FIG. 13, electronic component mounting apparatus 100 is prepared. In step S301 of FIG. 13, tip portion 16B of collet 16 is inserted into inner tube 40. Next, in step S302 of FIG. 13, a vacuum is created inside inner tube 40, and upper end portion 42 of inner tube 40 is radially crushed. Next, in step S303 of FIG. 13, tip portion 16B of collet 16 is pulled out of inner tube 40 while the inside of inner tube 40 is still under vacuum. This allows semiconductor die 70 to be picked up by upper end portion 42 of inner tube 40. Next, in step S304 of FIG. 13, the inside of inner tube 40 is brought to atmospheric pressure, and inner tube 40 returns to its original annular shape. Then, in step S305 of FIG. 13, air is sucked from inside inner tube 40, and semiconductor die 70 is recovered by filter 63.

[0066] The electronic component recovery method described above allows the semiconductor die 70 to be picked up by the upper end 42 of the inner tube 40 and reliably recovered by the filter 63. This makes it possible to improve the recovery rate of the semiconductor die 70.

[0067] 13, the inside of the inner tube 40 may be evacuated and air may be blown out from the air hole 16C of the collet 16. In step S302 of FIG.

[0068] Alternatively, the electronic component recovery device 200 may be prepared in step S300 of FIG. 13, and each of the steps described above may be performed manually.

[0069] In the above description, the inner tube 40 and the outer tube 50 of the recovery tube 30 are described as cylindrical members, but are not limited to this. For example, the inner tube 40 and the outer tube 50 may be elliptical ring-shaped members.

[0070] Furthermore, although the inner tube 40 has been described as being made of silicone resin, it is not limited to this. It may be made of any other flexible material that allows the upper end portion 42 to be crushed in the radial direction when a vacuum is created inside. The inner tube 40 may be made of, for example, silicone rubber.

[0071] Furthermore, in the above description, the outer tube 50 has two diametrically opposed notches 52, but the number of notches 52 is not limited to two, as long as there are multiple notches. For example, the outer tube 50 may have three notches 52 arranged at 120° intervals in the circumferential direction. Alternatively, the outer tube 50 may have four notches 52 arranged at 90° intervals in the circumferential direction. Furthermore, in the above description, the outer tube 50 is described as being made of metal, but is not limited to metal as long as it is a member having a predetermined rigidity. For example, the outer tube 50 may be made of ceramics or composite fiber.

[0072] In the above description, the electronic component mounting apparatus 100 has been described as picking up the semiconductor die 70 from the wafer 22 and mounting it on the substrate 21, which is the mounting target, but this is not limiting. The electronic component mounting apparatus 100 may also mount the semiconductor die 70 on another wafer or another semiconductor die, which is another mounting target. The electronic component mounting apparatus 100 may also mount electronic components other than the semiconductor die 70, such as resistors or diodes, on the substrate 21. At this time, the electronic component mounting apparatus 100 can recover the resistor or diode remaining at the tip 16B of the collet 16.

[0073] In the above description, the control unit 80 of the electronic component mounting apparatus 100 executes the electronic component collection operation shown in Fig. 4 when a mounting error is detected after the semiconductor die 70 has been mounted on the substrate 21, but this is not limiting. For example, a camera may be provided to capture an image of the semiconductor die 70 held by the tip portion 16B to detect a suction error in the semiconductor die 70, and the electronic component collection operation shown in Fig. 4 may be executed when a suction error is detected. [Explanation of symbols]

[0074] 11 X-axis actuator, 12 Y-axis actuator, 13 Z-axis actuator, 14 drive unit, 15 bonding head, 16 collet, 16A base unit, 16B tip unit, 16C air hole, 17 bonding stage, 18 push-up unit, 21 substrate, 22 wafer, 30, 130 recovery tube, 40 inner tube, 41 base unit, 42 upper end, 42X X-direction portion, 42Y Y-direction portion, 43 upper surface, 44 adhesive, 45 notch, 50 outer tube, 51 main body, 52 notch, 53 lower end, 54 lip portion, 55 upper end surface, 61 vacuum source, 62 vacuum valve, 63 filter, 64 recovery pipe, 65 vacuum tube, 66 atmosphere release pipe, 67 atmosphere release valve, 68 light emitting / receiving sensor, 70 semiconductor die, 80 control unit, 81 CPU, 82 memory, 100 electronic component mounting equipment, 200 electronic component recovery equipment (electronic component recovery section).

Claims

1. An electronic component recovery device that recovers electronic components sucked onto a tip of a nozzle, an outer tube having a predetermined rigidity; an inner tube fitted to the inner surface of the outer tube and into which the tip of the nozzle is inserted; a path for supplying a vacuum from a vacuum source to the inner tube; the outer tube includes a plurality of notches extending downward from an upper end surface, The inner tube is a base portion joined to the inner surface below a lower end of the notch of the outer tube; an upper end portion disposed spaced apart from the inner surface between the upper end surface of the outer tube and the lower end of the notch, the upper end portion has flexibility such that it can be crushed in a radial direction when a vacuum is supplied to the interior from the vacuum source; An electronic parts recovery device characterized by:

2. 2. The electronic component recovery device according to claim 1, The plurality of notches are arranged in pairs opposite to each other in a diametrical direction of the outer tube, when the interior of the inner tube is evacuated, the upper end portion of the inner tube is crushed in a direction perpendicular to the direction in which the notches are arranged, and a part of the upper end portion protrudes into the notches; An electronic parts recovery device characterized by:

3. 3. The electronic component recovery device according to claim 2, the upper end portion of the inner tube is provided with a plurality of notches at positions corresponding to the circumferential centers of the notches of the outer tube; An electronic parts recovery device characterized by:

4. 4. The electronic component recovery device according to claim 1, the notch has a vertical length of 1.5 to 3 times the diameter of the inner tube, and a circumferential width of at least two times the wall thickness of the inner tube and not more than ¼ of the outer circumferential length of the inner tube; The inner tube is made of resin with a rubber Shore of 60 or less and a wall thickness of 1 / 10 or less of the inner diameter. An electronic parts recovery device characterized by:

5. An electronic component recovery method for recovering electronic components sucked onto a tip of a nozzle, comprising: an electronic component recovery device comprising: an outer tube having a predetermined rigidity; an inner tube fitted onto the inner surface of the outer tube and into which the tip of the nozzle is inserted; and a path for supplying a vacuum from a vacuum source to the inner tube, wherein the outer tube includes a plurality of notches extending downward from an upper end surface thereof, and the inner tube includes a base portion joined to the inner surface of the outer tube below the lower ends of the notches, and an upper end portion disposed spaced apart from the inner surface between the upper end surface of the outer tube and the lower ends of the notches, and wherein the upper end portion is flexible enough to be crushed in a radial direction when a vacuum is supplied to the interior from the vacuum source; inserting the tip of the nozzle into the interior of the inner tube; creating a vacuum inside the inner tube; while the inside of the inner tube is in a vacuum state, the nozzle is pulled out from the inner tube, and the upper end portion of the nozzle picks up the electronic component sucked to the tip end of the nozzle; An electronic parts recovery method characterized by the above.

6. 6. The electronic component recovery method according to claim 5, After the electronic component is picked up, the inside of the inner tube is set to atmospheric pressure; Thereafter, air is sucked from the inside of the inner tube, and the electronic component is collected from the inside of the inner tube. An electronic parts recovery method characterized by the above.

7. 6. The electronic component recovery method according to claim 5, blowing air from the tip of the nozzle when creating a vacuum inside the inner tube; An electronic parts recovery method characterized by the above.

8. An electronic component mounting apparatus that mounts an electronic component on a mounting target, a nozzle at a tip thereof for suctioning the electronic component; a drive unit that moves the nozzle in a vertical direction; an electronic component recovery unit that recovers the electronic component sucked onto the tip of the nozzle; a control unit that adjusts the operation of the drive unit, The electronic component recovery unit an outer tube having a predetermined rigidity; an inner tube fitted to the inner surface of the outer tube and into which the tip of the nozzle is inserted; a path for supplying a vacuum from a vacuum source to the inner tube; the outer tube includes a plurality of notches extending downward from an upper end surface, the inner tube includes a base portion joined to the inner surface of the outer tube below a lower end of the notch, and an upper end portion disposed spaced apart from the inner surface between the upper end surface of the outer tube and the lower end of the notch, the upper end portion having flexibility such that it is crushed in a radial direction when a vacuum is supplied to the interior from the vacuum source; The control unit the driving unit inserts the tip of the nozzle into the interior of the inner tube; creating a vacuum inside the inner tube; With the inside of the inner tube in a vacuum state, the nozzle is moved upward by the driving unit to pull it out from inside the inner tube, and the upper end portion picks up the electronic component sucked to the tip of the nozzle. An electronic component mounting device characterized by:

9. 9. The electronic component mounting device according to claim 8, a holding state detector for detecting a holding state of the electronic component sucked onto the tip of the nozzle, The control unit When the holding state of the electronic component detected by the holding state detector is poor, the driving unit inserts the tip of the nozzle into the interior of the inner tube; creating a vacuum inside the inner tube; With the inside of the inner tube in a vacuum state, the nozzle is moved upward by the driving unit to pull it out from inside the inner tube, and the upper end portion picks up the electronic component sucked to the tip of the nozzle. An electronic component mounting device characterized by:

10. 10. The electronic component mounting device according to claim 8, The control unit After the electronic component is picked up, the inside of the inner tube is set to atmospheric pressure; Thereafter, air is sucked from the inside of the inner tube, and the electronic component is collected from the inside of the inner tube. An electronic component mounting device characterized by:

11. 10. The electronic component mounting device according to claim 8, the control unit causes air to be blown out from the tip of the nozzle when creating a vacuum inside the inner tube; An electronic component mounting device characterized by:

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