Method for manufacturing electronic component

Abstract

To provide a method of manufacturing an electronic component capable of achieving high-density mounting.SOLUTION: A method for manufacturing an electronic component including an element body portion 110 having a first end surface 115 and a second end surface 116 opposite to each other in a length direction, and a first side surface 111, a second side surface 112, a third side surface, and a fourth side surface opposite to each other in a direction perpendicular or substantially perpendicular to the length direction, and an outer electrode provided on each of the first end surface 115 and the second end surface 116, the method including a step of immersing the element body portion 110 in a conductive paste layer 51, which is a precursor of the outer electrode, from the first end surface 115 side; 110 115, the method includes a step of moving the element body part 110 to the AR1 in the direction from the first side face 111 toward the second side face 112, and a step of pulling up the element body part 110 from the conductive paste layer 51 while or after the element body part 110 is moved in the direction from the first side face 111 toward the second side face 112.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present disclosure relates to a method for manufacturing an electronic component. [Background technology]

[0002] Conventionally, electronic components have been known that include a substantially rectangular parallelepiped element body in which dielectric layers and internal electrode layers are alternately stacked, and external electrodes provided on a pair of end faces in the longitudinal direction of the element body. JP 2021-48388 A (Patent Document 1) discloses a multilayer ceramic electronic component as one such electronic component.

[0003] The multilayer ceramic electronic component is mounted on a substrate by, for example, joining external electrodes to lands provided on the substrate via solder. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-48388 Summary of the Invention [Problem to be solved by the invention]

[0005] To stabilize the position of the electronic component and thereby reliably mount the electronic component on the board, it is necessary to provide lands on the board that correspond in size to the external electrodes. However, if the land area is large, it becomes difficult to mount electronic components at a high density.

[0006] Therefore, the present disclosure has been made to solve the above-mentioned problems, and aims to provide a method for manufacturing electronic components that can achieve high-density mounting. [Means for solving the problem]

[0007] A method for manufacturing an electronic component according to the present disclosure includes an element part having first and second end faces that face each other in a longitudinal direction, first and second side faces that face each other in a first direction perpendicular to the longitudinal direction, and third and fourth side faces that face each other in a second direction perpendicular to the longitudinal direction and the first direction, and external electrodes provided on each of the first and second end faces. The method for manufacturing an electronic component according to the present disclosure includes the steps of immersing the element part from the first end face side into a conductive paste layer that is a precursor of the external electrodes, moving the element part relative to the conductive paste layer in a direction from the first side face toward the second side face while the element part is immersed in the conductive paste layer from the first end face side, and lifting the element part out of the conductive paste layer while or after the element part is being moved relative to the conductive paste layer in the direction from the first side face toward the second side face. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to provide a method for manufacturing electronic components that allows high-density mounting to be achieved. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a perspective view schematically illustrating the appearance of a multilayer ceramic capacitor manufactured according to a method for manufacturing a multilayer ceramic capacitor according to an embodiment. [Figure 2] FIG. 2 is a schematic front view of the multilayer ceramic capacitor shown in FIG. [Figure 3] FIG. 2 is a schematic bottom view of the multilayer ceramic capacitor shown in FIG. [Figure 4] FIG. 2 is a schematic cross-sectional view of the multilayer ceramic capacitor shown in FIG. [Figure 5] FIG. 3 is a schematic cross-sectional view of the multilayer ceramic capacitor shown in FIG. [Figure 6] FIG. 2 is a flowchart showing a method for manufacturing a multilayer ceramic capacitor according to an embodiment. [Figure 7]It is a detailed flowchart of step S8 in the manufacturing flow shown in FIG. 6. [Figure 8] It is a schematic front view for explaining step S812 in the manufacturing flow shown in FIG. 7. [Figure 9] It is a schematic front view for explaining step S813 in the manufacturing flow shown in FIG. 7. [Figure 10] It is a schematic front view for explaining step S813 in the manufacturing flow shown in FIG. 7. [Figure 11] It is a schematic front view for explaining step S814 in the manufacturing flow shown in FIG. 7. [Figure 12] It is a schematic cross-sectional view showing a state where the multilayer ceramic capacitor shown in FIG. 1 is mounted on a substrate. [Figure 13] It is a schematic cross-sectional view showing a state where the multilayer ceramic capacitor shown in FIG. 1 is mounted on a substrate. [Figure 14] It is a schematic front view for explaining step S814 in the manufacturing flow shown in FIG. 7 in the manufacturing method of the multilayer ceramic capacitor according to the modified example.

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments shown below exemplify a method for manufacturing a multilayer ceramic capacitor as a method for manufacturing an electronic component. Note that the method for manufacturing an electronic component according to the present embodiment shown below is also applicable to a method for manufacturing a multilayer ceramic inductor or a multilayer ceramic thermistor.

[0011] In the embodiments shown below, the same or common parts are denoted by the same reference numerals in the drawings, and the description thereof will not be repeated. In the drawings, the length direction of the element body is denoted by L, the width direction of the element body is denoted by W, and the stacking direction of the element body is denoted by T. The element body will be described in detail later.

[0012] (Embodiment) <A. Configuration of Multilayer Ceramic Capacitor> Fig. 1 is a perspective view schematically showing the appearance of a multilayer ceramic capacitor manufactured in accordance with a method for manufacturing a multilayer ceramic capacitor according to an embodiment. Fig. 2 is a schematic front view of the multilayer ceramic capacitor shown in Fig. 1. Fig. 3 is a schematic bottom view of the multilayer ceramic capacitor shown in Fig. 1. Fig. 4 is a schematic cross-sectional view taken along line IV-IV of the multilayer ceramic capacitor shown in Fig. 1. Fig. 5 is a schematic cross-sectional view taken along line VV of the multilayer ceramic capacitor shown in Fig. 2. First, with reference to Figs. 1 to 5, the configuration of a multilayer ceramic capacitor 100 manufactured in accordance with a method for manufacturing a multilayer ceramic capacitor according to this embodiment will be described.

[0013] As shown in FIGS. 1 to 5, a multilayer ceramic capacitor 100 according to this embodiment includes an element body 110 and external electrodes.

[0014] The element body 110 has a substantially rectangular parallelepiped shape. The element body 110 has a first side surface 111 and a second side surface 112 facing in the stacking direction T, a third side surface 113 and a fourth side surface 114 facing in the width direction W perpendicular to the stacking direction T, and a first end surface 115 and a second end surface 116 facing in the length direction L perpendicular to the stacking direction T and the width direction W. As an example, in this embodiment, the second side surface 112 defines a mounting surface when the multilayer ceramic capacitor 100 is mounted on a substrate. In this embodiment, the stacking direction T corresponds to a first direction, and the width direction W corresponds to a second direction.

[0015] The size of the element body 110 is, for example, 0.1 mm to 3.2 mm in length direction L, 0.05 mm to 1.6 mm in width direction W, and 0.05 mm to 1.6 mm in stacking direction T. Note that tolerances are taken into account in the above sizes.

[0016] The external electrodes are composed of a first external electrode 120 and a second external electrode 130. The first external electrode 120 is provided on the first end surface 115. The second external electrode 130 is provided on the second end surface 116.

[0017] The first external electrode 120 includes an end face side first external electrode 121 and a side face side first external electrode 122 .

[0018] The end surface-side first external electrode 121 is a portion provided over the entire first end surface 115. The side surface-side first external electrode 122 is a portion extending from the first end surface 115 to each of the first side surface 111, the second side surface 112, the third side surface 113, and the fourth side surface 114. More specifically, the side surface-side first external electrode 122 includes a first side surface-side first external electrode 122a covering a portion of the first side surface 111 located on the first end surface 115 side, a second side surface-side first external electrode 122b covering a portion of the second side surface 112 located on the first end surface 115 side, a third side surface-side first external electrode 122c covering a portion of the third side surface 113 located on the first end surface 115 side, and a fourth side surface-side first external electrode 122d covering a portion of the fourth side surface 114 located on the first end surface 115 side.

[0019] In this embodiment, the area of ​​the second side surface side first external electrode 122b is larger than the area of ​​the first side surface side first external electrode 122a, the area of ​​the third side surface side first external electrode 122c, and the area of ​​the fourth side surface side first external electrode 122d. The area of ​​the first side surface side first external electrode 122a is smaller than the area of ​​the second side surface side first external electrode 122b, the area of ​​the third side surface side first external electrode 122c, and the area of ​​the fourth side surface side first external electrode 122d. The area of ​​the third side surface side first external electrode 122c and the area of ​​the fourth side surface side first external electrode 122d are configured to be approximately the same.

[0020] Here, the area of ​​the first side surface side first external electrode 122a refers to the area of ​​the first side surface side first external electrode 122a when viewed from a direction perpendicular to the first side surface 111. The same applies to the areas of the second side surface side first external electrode 122b, the third side surface side first external electrode 122c, and the fourth side surface side first external electrode 122d.

[0021] The third side surface side first external electrode 122c and the fourth side surface side first external electrode 122d are unevenly distributed on the second side surface 112 side in the stacking direction T.

[0022] The second external electrode 130 includes an end face side second external electrode 131 and a side face side second external electrode 132 .

[0023] The end face-side second external electrode 131 is a portion provided over the entire second end face 116. The side face-side second external electrode 132 is a portion extending from the second end face 116 to each of the first side face 111, the second side face 112, the third side face 113, and the fourth side face 114. More specifically, the side face-side second external electrode 132 includes a first side face-side second external electrode 132a covering a portion of the first side face 111 located on the second end face 116 side, a second side face-side second external electrode 132b covering a portion of the second side face 112 located on the second end face 116 side, a third side face-side second external electrode 132c covering a portion of the third side face 113 located on the second end face 116 side, and a fourth side face-side second external electrode 132d covering a portion of the fourth side face 114 located on the second end face 116 side.

[0024] In this embodiment, the area of ​​the second side surface side second external electrode 132b is larger than the area of ​​the first side surface side second external electrode 132a, the area of ​​the third side surface side second external electrode 132c, and the area of ​​the fourth side surface side second external electrode 132d. The area of ​​the first side surface side second external electrode 132a is smaller than the area of ​​the second side surface side second external electrode 132b, the area of ​​the third side surface side second external electrode 132c, and the area of ​​the fourth side surface side second external electrode 132d. The area of ​​the third side surface side second external electrode 132c and the area of ​​the fourth side surface side second external electrode 132d are configured to be approximately the same.

[0025] The third side surface side second external electrode 132c and the fourth side surface side second external electrode 132d are unevenly distributed on the second side surface 112 side in the stacking direction T.

[0026] In this way, the side surface-side first external electrode 122 and the side surface-side second external electrode 132 are configured to be located unevenly on the second side surface 112 side in the stacking direction T. Such a configuration can be achieved by the method for manufacturing the multilayer ceramic capacitor according to this embodiment, which will be described in detail later.

[0027] 4 and 5, the first external electrode 120 and the second external electrode 130 include a base electrode layer 160 and a plating layer 170. The plating layer 170 covers the base electrode layer 160.

[0028] The base electrode layer 160 includes at least one of a baked layer, a resin layer, a thin film layer, etc. In this embodiment, the base electrode layer 160 is formed of a baked layer.

[0029] The baking layer contains, for example, a metal component and a glass component. The metal component is one selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing this metal, such as an alloy of Ag and Pd. The glass component contains at least one of Si and Zn.

[0030] The baked layer may be composed of a single layer, or may be composed of multiple laminated layers. The baked layer may be a layer formed by baking the conductive paste 53 after it has been applied to the element body 110, or may be a layer formed by firing simultaneously with the internal electrode layer 118. When the baked layer is a layer formed by baking the conductive paste 53 after it has been applied to the element body 110, it is preferable that the baked layer contains a glass component. When the baked layer is a layer formed by firing simultaneously with the internal electrode layer 118, it is preferable that the baked layer contains a dielectric. The conductive paste 53 will be described later.

[0031] The plating layer 170 is disposed on the base electrode layer 160. The material constituting the plating layer 170 may be one metal selected from the group consisting of Ni, Cu, Ag, Pd, Au, and Sn, or an alloy containing such a metal. As an example, the plating layer 170 may be formed by stacking a layer made of Ni and a layer made of Sn.

[0032] A resin layer containing a metal filler may be further provided between the base electrode layer 160 formed of a baked layer and the plating layer 170. The resin layer can be formed through steps similar to the steps for forming the base electrode layer 160 in the method for manufacturing the multilayer ceramic capacitor according to the present embodiment, which will be described in detail later (see steps S811 to S815 in FIG. 7, which will be described later).

[0033] The element body 110 has a plurality of internal electrode layers 118 and a plurality of dielectric layers 119 stacked alternately along the stacking direction T.

[0034] The multiple internal electrode layers 118 include multiple first internal electrode layers 118a and multiple second internal electrode layers 118b. The multiple first internal electrode layers 118a and the multiple second internal electrode layers 118b are alternately stacked in the stacking direction T.

[0035] The first internal electrode layer 118a is drawn to a first end surface 115. The first end surface 115 is covered with a first external electrode 120. The first external electrode 120 is electrically connected to the first internal electrode layer 118a. The second internal electrode layer 118b is drawn to a second end surface 116. The second end surface 116 is covered with a second external electrode 130. The second external electrode 130 is electrically connected to the second internal electrode layer 118b.

[0036] Although Figures 4 and 5 show an example in which seven first internal electrode layers 118a and seven second internal electrode layers 118b are provided, the number of each of the first internal electrode layers 118a and the second internal electrode layers 118b is not particularly limited to seven.

[0037] The plurality of dielectric layers 119 include an outer layer dielectric layer located between the internal electrode layer 118 positioned closest to the first side surface 111 in the stacking direction T and the first side surface 111, and between the internal electrode layer 118 positioned closest to the second side surface 112 in the stacking direction T and the second side surface 112, and an inner layer dielectric layer located between the internal electrode layers 118 adjacent to each other in the stacking direction T.

[0038] Each of the first internal electrode layer 118a and the second internal electrode layer 118b contains Ni as a main component. Each of the first internal electrode layer 118a and the second internal electrode layer 118b may further contain a dielectric material of the same composition system as the ceramic contained in the dielectric layer 119. Also, each of the first internal electrode layer 118a and the second internal electrode layer 118b may contain Sn at the interface with the dielectric layer 119.

[0039] Each of the plurality of dielectric layers 119 is composed of, for example, a dielectric ceramic material mainly composed of a perovskite compound containing Ba and Ti. The dielectric layer 119 may contain at least one selected from the group consisting of Si, Mg, Mn, V, Cr, and rare earths as an additive.

[0040] The element body 110 includes an inner layer portion C. The inner layer portion C has a capacitance by laminating in the stacking direction T the first internal electrode layer 118a at a portion facing the second internal electrode layer 118b adjacent in the stacking direction T and the second internal electrode layer 118b at a portion facing the first internal electrode layer 118a adjacent in the stacking direction T.

[0041] <B. Manufacturing Method of Multilayer Ceramic Capacitor> FIG. 6 is a flowchart showing a method for manufacturing a multilayer ceramic capacitor according to an embodiment. FIG. 7 is a detailed flowchart of step S8 in the manufacturing flow shown in FIG. 6. FIGS. 8 to 11 are schematic front views for explaining each step of the manufacturing flow shown in FIG. 7. Hereinafter, a method for manufacturing the multilayer ceramic capacitor 100 according to the present embodiment will be described with reference to FIGS. 6 to 11.

[0042] First, as shown in Fig. 6, a ceramic dielectric slurry is prepared (step S1). In detail, a ceramic dielectric powder, an additive powder, a binder resin, a dissolving liquid, etc. are dispersed and mixed. In this way, the ceramic dielectric slurry is prepared.

[0043] The ceramic dielectric powder is, for example, dielectric particles with a perovskite structure such as BaTiO3, CaTiO3, SrTiO3, CaZrO3, or CaHfO3. The additive powder is, for example, composed of at least one of Si compounds, Mg compounds, Mn compounds, Fe compounds, Cr compounds, Ni compounds, and Co compounds. Examples of binder resins that can be used include polyurethane resins, urea resins, melamine resins, epoxy resins, vinyl acetate resins, acrylic resins, and water-based polymers such as polyvinyl alcohol (PVA) and polyvinyl butyral (PVB). These may be used alone or in combination. The ceramic dielectric slurry may be either solvent-based or water-based. When the ceramic dielectric slurry is used as a water-based paint, the ceramic dielectric slurry is prepared by mixing a water-soluble binder and dispersant with the dielectric raw material dissolved in water.

[0044] Next, a ceramic dielectric sheet is formed (step S2). Specifically, the ceramic dielectric slurry is formed into a sheet on a carrier film using a die coater, gravure coater, microgravure coater, or the like, and then dried. This forms a ceramic dielectric sheet. From the viewpoint of miniaturization and high capacitance of the multilayer ceramic capacitor, the thickness of the ceramic dielectric sheet is preferably 0.4 μm or more and 0.8 μm or less.

[0045] Next, a mother sheet is formed (step S3). Specifically, a conductive paste is applied to a ceramic dielectric sheet in a predetermined pattern. This results in a mother sheet having a predetermined internal electrode pattern on the ceramic dielectric sheet. The conductive paste contains Ni powder, a solvent, a dispersant, a binder, etc., and is prepared to have a constant viscosity. PVA, PVB, etc., is used as the binder. The conductive paste can be applied by screen printing, inkjet printing, gravure printing, etc. From the viewpoint of miniaturization and high capacity of the multilayer ceramic capacitor, the thickness of the internal electrode pattern is preferably 0.3 μm or more and 0.8 μm or less. In addition to mother sheets having internal electrode patterns, ceramic dielectric sheets that have not been subjected to step S3 can also be prepared as mother sheets.

[0046] Next, a plurality of mother sheets are stacked (step S4). In detail, a predetermined number of mother sheets, each consisting of only a ceramic dielectric sheet and without an internal electrode pattern, are stacked to a thickness of, for example, 10 μm or more and 30 μm or less. A predetermined number of mother sheets, each having an internal electrode pattern, are stacked on top of these. The number of stacked mother sheets, each having an internal electrode pattern, is, for example, 1 sheet or more and 1000 sheets or less. A predetermined number of mother sheets, each consisting of only a ceramic dielectric sheet and without an internal electrode pattern, are stacked on top of these to a thickness of, for example, 10 μm or more and 30 μm or less. In this way, a mother sheet group is formed.

[0047] Next, the mother sheet group is pressed together to form a dielectric block (step S5). Specifically, the mother sheet group is pressed in the stacking direction using a hydrostatic press or a rigid press, and is pressed together. This forms the dielectric block. At this time, the ceramic dielectric sheets are pressed at a predetermined temperature, so that the ceramic dielectric sheets adhere to each other. Furthermore, a ceramic dielectric sheet of a certain thickness is placed on the outermost layer in the stacking direction and pressed. This makes it possible to protect the dielectric sheet on which the internal electrode patterns are formed.

[0048] Next, the dielectric block is divided into chips (step S6). Specifically, the dielectric block is divided into a matrix shape by press-cutting, dicing, or laser cutting, thereby being separated into a plurality of chips. When dividing the dielectric block, the dielectric block may be divided in a softened state by heating.

[0049] Next, the chip is fired (step S7). Specifically, the chip is heated to fire the dielectric material and conductive material contained in the chip, forming the element part 110. The firing temperature is, for example, 900°C or higher and 1300°C or lower. The firing temperature is set appropriately depending on the dielectric material and conductive material.

[0050] Next, external electrodes are formed (step S8). As shown in Fig. 7, step S8 includes steps S81 to S83, which will be described below.

[0051] First, the first external electrode 120 is formed (Step S81). Step S81 further includes Steps S811 to S816, which will be described below.

[0052] First, as shown in FIG. 7, a conductive paste layer 51, which is a precursor of the external electrodes, is formed on the flat plate portion 60 (step S811).

[0053] The conductive paste layer 51 is a layer of conductive paste 53 made of conductive particles mixed with a binder, a solvent, a dispersant, etc. The flat plate portion 60 is made of, for example, a metal material. The surface of the flat plate portion 60 extends horizontally. The thickness of the conductive paste layer 51 formed on the flat plate portion 60 (see dimension H in FIG. 8 described later) is preferably one-tenth or less of the dimension of the element portion 110 in the longitudinal direction L.

[0054] Next, as shown in FIGS. 7 and 8, the element part 110 is immersed in a conductive paste layer 51 (step S812).

[0055] In detail, first, the plurality of element bodies 110 are held by the holding part 20 so that the first end face 115 of each of the plurality of element bodies 110 faces the conductive paste layer 51. The holding part 20 is for holding the element body parts 110 so that one of the pair of end faces of the element body parts 110 faces downward in the vertical direction. Note that in Figures 9 to 11 described below, only one of the plurality of element body parts 110 is shown.

[0056] The holding part 20 includes a base layer 21 and an adhesive layer 22 provided on a main surface of the base layer 21. The base layer 21 is made of, for example, a metal material. The adhesive layer 22 is made of, for example, silicone rubber. In this embodiment, the second end surface 116 of the element part 110 is attached to the adhesive layer 22, whereby the element part 110 is held by the holding part 20 so that the first end surface 115 faces vertically downward.

[0057] An actuator 23 is attached to the holding unit 20. The actuator 23 can move the holding unit 20 in any direction based on a signal from the control unit 90. More specifically, the actuator 23 is driven so that the holding unit 20 can move in three orthogonal axial directions: the length direction L, the width direction W, and the stacking direction T. The actuator 23 is configured, for example, by a servo motor, a stepping motor, a robo cylinder, or the like, but the type of actuator 23 is not particularly limited to these.

[0058] The control unit 90 controls the operation of the actuator 23. The control unit 90 has, as its main components, a CPU (Central Processing Unit) 91, a memory 92, an input / output device (not shown) for inputting and outputting various signals, and the like.

[0059] The CPU 91 executes programs. The memory 92 includes a ROM (Read Only Memory) and a RAM (Random Access Memory). The ROM stores data in a non-volatile manner. The RAM stores data generated by the CPU 91 executing programs in a volatile manner.

[0060] The components of the control unit 90 are interconnected by a data bus. Processing in the CPU 91 is realized by the various pieces of hardware and software executed by the CPU 91. Such software is pre-stored in ROM / RAM. The control unit 90 is supplied with power from an internal power supply (not shown) or an external power supply (not shown). Connection to the external power supply is made, for example, using an AC adapter (not shown).

[0061] The control unit 90 drives the actuator 23 to immerse the element body 110 in the conductive paste layer 51 from the first end face 115 side so that the first end face 115 of the element body 110 approximately reaches the bottom 52 of the conductive paste layer 51 (see Figure 9 described below).

[0062] The first end face 115 substantially reaching the bottom 52 means not only that the first end face 115 abuts against the surface of the flat plate portion 60, but also that the first end face 115 is positioned slightly spaced apart from the surface of the flat plate portion 60. This is because, due to dimensional tolerances in the length direction L of the element body portion 110, etc., it is conceivable that the first end faces 115 of some of the multiple element body portions 110 abut against the surface of the flat plate portion 60, while the first end faces 115 of the remaining element body portions 110 do not abut against the surface of the flat plate portion 60.

[0063] Next, as shown in FIGS. 7, 9, and 10, the element body part 110 is moved relatively to the conductive paste layer 51 in the in-plane direction of the first end surface 115 (step S813).

[0064] In detail, when the element body 110 is immersed in the conductive paste layer 51 from the first end face 115 side, the control unit 90 drives the actuator 23, thereby moving the element body 110 relative to the conductive paste layer 51 in the direction from the first side face 111 toward the second side face 112 (in the direction of arrow AR1 in Figure 9).

[0065] In this way, by immersing the element body 110 in the conductive paste layer 51 and moving the element body 110 relative to the conductive paste layer 51, the conductive paste 53 is applied to a portion of the element body 110.

[0066] Here, as the element body 110 is moved relative to the conductive paste layer 51 in the direction from the first side surface 111 toward the second side surface 112, the portion of the conductive paste layer 51 located downstream of the element body 110 in the direction of movement of the element body 110 is pushed out by the element body 110 toward the downstream side of the movement direction.

[0067] 10, the conductive paste layer 51 of the portion extruded in this manner flows so as to rise at a position downstream of the position of the element body 110 in the movement direction. As a result, the conductive paste layer 51 is applied in greater amounts to the portion of the element body 110 located downstream in the movement direction than to the portion located upstream. As a result, the conductive paste 53 is applied to the element body 110 so as to be unevenly distributed toward the second side surface 112 in the stacking direction T as a whole.

[0068] Here, the direction from the first side surface 111 to the second side surface 112 is not necessarily limited to a direction along a direction perpendicular to the first side surface 111. As long as the conductive paste 53 is applied to the element part 110 so that the conductive paste 53 as a whole is unevenly distributed toward the second side surface 112 in the stacking direction T, the direction from the first side surface 111 to the second side surface 112 may be a direction inclined with respect to the direction perpendicular to the first side surface 111.

[0069] The amount of movement of the element body 110 in the direction from the first side surface 111 to the second side surface 112 is preferably greater than the dimension of the element body 110 in the stacking direction T. This makes it possible to cause the conductive paste 53 as a whole to be sufficiently unevenly distributed toward the second side surface 112 in the stacking direction T.

[0070] Next, as shown in FIGS. 7 and 11, the element part 110 is lifted up from the conductive paste layer 51 (step S814).

[0071] In detail, the control unit 90 drives the actuator 23, thereby moving the element body 110 so that the element body 110 is lifted up from the conductive paste layer 51 while being moved relative to the conductive paste layer 51 in a direction from the first side surface 111 toward the second side surface 112.

[0072] As a result, with the conductive paste layer 51 and the element body 110 connected to each other by the conductive paste 53 stretched from the conductive paste layer 51, the element body 110 is moved relative to the conductive paste layer 51 in the direction from the first side surface 111 to the second side surface 112, and is pulled up diagonally upward from the conductive paste layer 51 (see arrow AR2 in Figure 11).

[0073] The conductive paste 53, which is a precursor of the base electrode layer 160 of the first external electrode 120, is applied to the first end face 115, the first side face 111, the second side face 112, the third side face 113, and the fourth side face 114 of the element body 110 thus lifted up from the conductive paste layer 51. Furthermore, by lifting the element body 110 obliquely upward in this manner from the conductive paste layer 51, the conductive paste 53 can be sufficiently unevenly distributed overall toward the second side face 112 in the stacking direction T.

[0074] 7, the conductive paste 53 is baked (step S815). Specifically, the conductive paste 53 applied to the first end face 115 and its surrounding area is heated, for example, in a drying oven, to form a baked layer that constitutes the base electrode layer 160. The baking temperature is, for example, 700°C or higher and 900°C or lower. The baking temperature can be changed as appropriate depending on the dielectric material and the conductive material.

[0075] 7, a plating layer 170 (see FIG. 4, etc.) is provided on the surface of the baked layer (step S816). As a result, the first external electrode 120 is provided on the first end face 115.

[0076] 7, the element body part 110 is inverted (step S82). In detail, first, a holding part 20 is prepared that has substantially the same configuration as the holding part 20 that holds the element body part 110, but is configured separately from the holding part 20. For ease of explanation, the holding part 20 that holds the element body part 110 will also be referred to as a first holding part, and the holding part 20 that is configured separately from the first holding part will also be referred to as a second holding part.

[0077] Next, the second holding part is positioned with respect to the first holding part so that the adhesive layer 22 of the second holding part faces the first external electrode 120. Next, the first holding part is moved relative to the second holding part so that the first holding part and the second holding part approach each other. As a result, the first external electrode 120 is pressed against the adhesive layer 22 of the second holding part.

[0078] Next, the first holding part, the second holding part and the element part 110 are turned upside down as a whole.

[0079] Next, the first holding part is moved relative to the second holding part so that the first holding part and the second holding part are separated from each other. Here, the adhesive strength of the adhesive layer 22 of the second holding part is configured to be stronger than the adhesive strength of the adhesive layer 22 of the first holding part. As a result, the element part 110, with the first external electrode 120 attached to the adhesive layer 22 of the second holding part, is peeled off from the adhesive layer 22 of the first holding part.

[0080] As a result, the element part 110 is held by the second holding part so that the second end face 116 faces downward in the vertical direction.

[0081] 7, the second external electrode 130 is formed on the second end surface 116 (step S83). Step S83 further includes steps corresponding to the above-mentioned steps S811 to S816, but the contents of these steps are basically the same as steps S811 to S816, so the description thereof will be omitted.

[0082] 6, the multilayer ceramic capacitor 100 is collected (step S9). The collection of the multilayer ceramic capacitor 100 is achieved, for example, by inserting the tip of a collection blade into the gap between the adhesive layer 22 of the second holding part and the first external electrode 120 to remove the multilayer ceramic capacitor 100 from the second holding part.

[0083] By going through the steps described above, the multilayer ceramic capacitor 100 can be manufactured according to the method for manufacturing a multilayer ceramic capacitor according to this embodiment.

[0084] In the method for manufacturing a multilayer ceramic capacitor according to this embodiment, as described above, an example has been given in which a retaining portion 20 including a base layer 21 and an adhesive layer 22 is used. However, instead of a retaining portion 20 having such a configuration, a retaining portion including a base layer having a plurality of through holes arranged in a lattice pattern and an approximately cylindrical adhesive portion inserted into each of the plurality of through holes may be used.

[0085] In this case, the plurality of element parts 110 are held by the holding part by being inserted into each of the plurality of adhesive parts. Also, in this case, by pushing the multilayer ceramic capacitor 100 out of the through-hole with a pin or the like, the multilayer ceramic capacitor 100 can be transferred to a holding part configured separately from the holding part, or the multilayer ceramic capacitor 100 can be collected.

[0086] <Mounting of Multilayer Ceramic Capacitor> FIG. 12 and FIG. 13 are schematic cross-sectional views showing a state where the multilayer ceramic capacitor shown in FIG. 1 is mounted on a substrate. Next, referring to FIG. 12 and FIG. 13, an example of a method for mounting a multilayer ceramic capacitor 100 manufactured according to the manufacturing method of the multilayer ceramic capacitor according to the present embodiment on a substrate 70 will be described.

[0087] As shown in FIGS. 12 and 13, when mounting the multilayer ceramic capacitor 100 on the substrate 70, first, a pair of conductive lands 71 are provided on the main surface of the substrate 70.

[0088] Next, the multilayer ceramic capacitor 100 is arranged on the substrate 70 such that the first external electrode 120 is positioned on one of the pair of lands 71 and the second external electrode 130 is positioned on the other of the pair of lands 71. In the present embodiment, the multilayer ceramic capacitor 100 is arranged on the substrate 70 such that the second side surface 112 as the mounting surface faces the main surface of the substrate 70.

[0089] Next, the multilayer ceramic capacitor 100 arranged on the substrate 70 is soldered. Thereby, the multilayer ceramic capacitor 100 is fixed to the substrate 70 via the solder 72 wetted on the first external electrode 120 and the second external electrode 130.

[0090] By performing the above steps in the same manner for a plurality of multilayer ceramic capacitors 100, the plurality of multilayer ceramic capacitors 100 will be arranged adjacent to each other on the substrate 70.

[0091] <D. Parentheses> Here, in the manufacturing method of the multilayer ceramic capacitor according to this embodiment, as described above, when the external electrode is provided on the element body portion 110, the element body portion 110 is immersed in the conductive paste layer 51 from one end face side, and then the element body portion 110 is moved relative to the conductive paste layer 51 in the direction from the first side surface 111 to the second side surface 112.

[0092] As a result, the conductive paste layer 51 is applied more to the downstream portion of the element body 110 in the moving direction than to the upstream portion thereof, and as a result, the side surface-side first external electrode 122 and the side surface-side second external electrode 132 are configured to be unevenly distributed overall toward the second side surface 112 in the stacking direction T. Configuring the multilayer ceramic capacitor 100 in this manner makes it possible to achieve high-density packaging.

[0093] That is, the multilayer ceramic capacitor 100 is fixed to the substrate 70 via the solder 72 by spreading the solder 72 over the external electrodes and covering the surfaces of the external electrodes, but it is not easy to selectively spread the solder 72 over only the desired portions of the external electrodes.

[0094] Therefore, if more external electrodes than necessary are provided on the element body 110, the solder 72 will spread to these more external electrodes, and this will require the area of ​​the lands 71 ​​to be larger than necessary. As a result, it becomes difficult to mount the multilayer ceramic capacitor 100 on the substrate 70 at high density.

[0095] In this regard, by manufacturing the multilayer ceramic capacitor 100 according to the manufacturing method of the multilayer ceramic capacitor of this embodiment, it is possible to configure the areas of the end face side first external electrode 121 and the end face side second external electrode 131 electrically connected to the internal electrode layer 118, and the second side face side first external electrode 122b and the second side face side second external electrode 132b located on the second side face 112 as the mounting surface, to be sufficiently large, while effectively preventing the areas of the remaining external electrodes from being configured to be larger than necessary.

[0096] As a result, the amount of solder 72 that wets and spreads onto the external electrodes is kept to a minimum, and the area of ​​the lands 71 ​​is also kept to a minimum. Therefore, the distance between the lands 71 ​​corresponding to two adjacent multilayer ceramic capacitors 100 in the width direction W (see dimension w1 in FIG. 13) is significantly reduced, making it possible to mount the multilayer ceramic capacitors 100 at a high density in the width direction W.

[0097] Therefore, by configuring as described above, it is possible to provide a method for manufacturing electronic components that allows high-density mounting.

[0098] Furthermore, in this embodiment, as described above, the element body 110 is moved relative to the conductive paste layer 51 in the direction from the first side surface 111 to the second side surface 112 with the first end surface 115 substantially reaching the bottom 52 of the conductive paste layer 51. This effectively prevents air bubbles from being trapped in the gap between the first end surface 115 and the end-face-side first external electrode 121, a phenomenon known as bubble entrapment. This is because air bubbles that are unintentionally trapped in the gap are pushed outward from the gap by the relative movement of the element body 110 with respect to the conductive paste layer 51.

[0099] In this embodiment, an example has been given of a case in which the element body portion 110 is lifted up from the conductive paste layer 51 while being moved relative to the conductive paste layer 51 in the direction from the first side surface 111 toward the second side surface 112 in step S814, but the element body portion 110 may also be lifted up from the conductive paste layer 51 after being moved relative to the conductive paste layer 51 in the direction from the first side surface 111 toward the second side surface 112.

[0100] In addition, in this embodiment, an example has been described in which the first side surface 111 and the second side surface 112 are opposed to each other in the stacking direction T, and the third side surface 113 and the fourth side surface 114 are opposed to each other in the width direction W that is perpendicular to the stacking direction T. However, the first side surface 111 and the second side surface 112 may be opposed to each other in the width direction W, and the third side surface 113 and the fourth side surface 114 may be opposed to each other in the stacking direction T.

[0101] Furthermore, in this embodiment, an example has been given in which the element body portion 110 is immersed in the conductive paste layer 51 so that the first end face 115 of the element body portion 110 approximately reaches the bottom 52 of the conductive paste layer 51, but when the element body portion 110 is immersed in the conductive paste layer 51, the first end face 115 does not necessarily have to approximately reach the bottom 52.

[0102] (Variation) Fig. 14 is a schematic front view illustrating step S814 in the manufacturing method of a multilayer ceramic capacitor according to a modified example of the manufacturing flow shown in Fig. 7. Hereinafter, with reference to Fig. 14, a manufacturing method of a multilayer ceramic capacitor according to a modified example based on the above-described embodiment will be described.

[0103] The method for manufacturing a multilayer ceramic capacitor according to this modification differs from the method for manufacturing a multilayer ceramic capacitor according to the above-described embodiment in the direction in which the element body part 110 is moved in step S814.

[0104] In detail, in this modified example, as shown in Figure 14, the control unit 90 drives the actuator 23, whereby the element body 110 is moved relative to the conductive paste layer 51 in the direction from the first side surface 111 toward the second side surface 112, and then the element body 110 is pulled vertically upward from the conductive paste layer 51 (see arrow AR3 in the figure).

[0105] After the element body 110 has been pulled up from the conductive paste layer 51 in this manner, the element body 110 is again moved relative to the conductive paste layer 51 in the direction from the first side surface 111 toward the second side surface 112, with the conductive paste layer 51 and the element body 110 connected to each other by the conductive paste 53 stretched from the conductive paste layer 51 (see arrow AR4 in the figure).

[0106] By moving element body part 110 in this manner, conductive paste 53 can be sufficiently distributed unevenly toward second side surface 112 in stacking direction T as a whole.

[0107] The method for manufacturing a multilayer ceramic capacitor according to this modified example also provides effects similar to those described in the above-described embodiment, and can be used as a method for manufacturing an electronic component that enables high-density mounting.

[0108] (Addendum) The characteristic features of the electronic component manufacturing method disclosed in the above-described embodiment and its modified examples can be summarized as follows.

[0109] [Appendix 1] A method for manufacturing an electronic component comprising: an element body having a first end face and a second end face opposing each other in a longitudinal direction, a first side face and a second side face opposing each other in a first direction perpendicular to the longitudinal direction, and a third side face and a fourth side face opposing each other in a second direction perpendicular to the longitudinal direction and the first direction; and external electrodes provided on each of the first end face and the second end face, a step of immersing the element body from the first end surface side into a conductive paste layer that is a precursor of the external electrodes; a step of moving the element part relative to the conductive paste layer in a direction from the first side surface toward the second side surface while the element part is immersed in the conductive paste layer from the first end surface side; a step of lifting the element portion from the conductive paste layer while or after the element portion is being moved relative to the conductive paste layer in a direction from the first side surface toward the second side surface.

[0110] [Appendix 2] A method for manufacturing an electronic component as described in Appendix 1, wherein, after the element portion is lifted up from the conductive paste layer, the conductive paste layer and the element portion are connected to each other by the conductive paste stretched from the conductive paste layer, and the element portion is again moved relative to the conductive paste layer in a direction from the first side surface toward the second side surface.

[0111] [Appendix 3] A method for manufacturing an electronic component as described in Appendix 1 or 2, wherein in a step of moving the element body portion relative to the conductive paste layer in a direction from the first side surface toward the second side surface, the amount of movement of the element body portion is greater than the dimension of the element body portion in the first direction.

[0112] [Appendix 4] 4. The method for manufacturing an electronic component according to any one of claims 1 to 3, wherein the thickness of the conductive paste layer is one-tenth or less of the longitudinal dimension of the element portion.

[0113] (Other forms, etc.) In the above-described embodiment and its modified examples of the present disclosure, a multilayer ceramic capacitor has been used as an example of an electronic component, and a manufacturing method thereof has been described. However, the manufacturing methods for electronic components shown in the present embodiment and its modified examples may also be applied to manufacturing electronic components such as multilayer ceramic inductors or multilayer ceramic thermistors. When the electronic component is a multilayer ceramic inductor, for example, the dielectric is made of magnetic ceramic and the internal electrodes are made of coiled conductors. When the electronic component is a multilayer ceramic thermistor, for example, the dielectric layers are made of semiconductor ceramic.

[0114] Furthermore, the shape, configuration, size, number, material, etc. of each part shown in the above-mentioned embodiment of the present disclosure and its modified examples can be modified in various ways as long as they do not deviate from the spirit of the present disclosure.

[0115] Furthermore, the characteristic configurations shown in the above-described embodiments of the present disclosure and their modifications can naturally be combined with each other within the scope of the present disclosure.

[0116] As such, the above-described embodiments and their modifications disclosed herein are illustrative in all respects and are not limiting. The technical scope of the present invention is defined by the claims, and includes all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0117] 20 holding portion, 21 base layer, 22 adhesive layer, 23 actuator, 51 conductive paste layer, 52 bottom, 53 conductive paste, 60 flat plate portion, 70 substrate, 71 land, 72 solder, 90 control portion, 91 CPU, 92 memory, 100 multilayer ceramic capacitor, 110 element portion, 111 first side surface, 112 second side surface, 113 third side surface, 114 fourth side surface, 115 first end surface, 116 second end surface, 118 internal electrode layer, 118a first internal electrode layer, 118b second internal electrode layer, 119 dielectric layer, 120 first external electrode, 121 end surface side first external electrode, 122 side surface side first external electrode, 122a first side surface side first external electrode, 122b second side surface side first external electrode, 122c Third side surface side first external electrode, 122d fourth side surface side first external electrode, 130 second external electrode, 131 end surface side second external electrode, 132 side surface side second external electrode, 132a first side surface side second external electrode, 132b second side surface side second external electrode, 132c third side surface side second external electrode, 132d fourth side surface side second external electrode, 160 base electrode layer, 170 plating layer, C inner layer portion.

Claims

1. A method for manufacturing an electronic component comprising: an element body portion having a first end face and a second end face opposing each other in a longitudinal direction, a first side face and a second side face opposing each other in a first direction perpendicular to the longitudinal direction, and a third side face and a fourth side face opposing each other in a second direction perpendicular to the longitudinal direction and the first direction; and external electrodes provided on each of the first end face and the second end face, a step of immersing the element body from the first end surface side into a conductive paste layer that is a precursor of the external electrodes; a step of moving the element body portion relative to the conductive paste layer in a direction from the first side surface toward the second side surface while the element body portion is immersed in the conductive paste layer from the first end surface side; a step of lifting the element body from the conductive paste layer while or after the element body is being moved relative to the conductive paste layer in a direction from the first side surface toward the second side surface.

2. 2. The method for manufacturing an electronic component according to claim 1, wherein, after the element portion is lifted up from the conductive paste layer, the element portion is again moved relative to the conductive paste layer in a direction from the first side surface toward the second side surface while the conductive paste layer and the element portion are connected to each other by the conductive paste stretched from the conductive paste layer.

3. 2. The method for manufacturing an electronic component according to claim 1, wherein in a process in which the element body portion is moved relative to the conductive paste layer in a direction from the first side surface toward the second side surface, the amount of movement of the element body portion is greater than the dimension of the element body portion in the first direction.

4. The method for manufacturing an electronic component according to claim 1 , wherein the conductive paste layer has a thickness that is equal to or less than one-tenth of the longitudinal dimension of the element body portion.

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