Control device and heat source unit equipped with the same

Abstract

To provide a control device in which a heat generating component is cooled via a refrigerant flowing through a refrigerant pipe, and a printed wiring board can be removed without bringing down the refrigerant pipe.SOLUTION: In the control device 60, the heat generating component 53, the heat sink 55, and the attachment plate 57 are arranged in this order in the thickness direction of the printed wiring board 51 when viewed from the printed wiring board 51. In the heat sink 55, a first area 55a facing the attachment plate 57 and a second area 55b not facing the attachment plate 57 are provided on a surface different from the surface facing the heat generating component 53 side. The second area 55b is not located on a movement line of the printed wiring board 51 when the board assembly 50 is removed from the mounting plate 57. The heat transfer plate 59 is fixed to the second area 55b.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a control device in which heat-generating components are cooled by a refrigerant flowing through a refrigerant pipe. [Background technology]

[0002] Conventionally, among the electronic components mounted on the printed wiring board of a control device, heat-generating components are cooled by closely contacting a heat transfer plate (herein referred to as a refrigerant jacket) fitted with refrigerant piping through which a refrigerant flows. For example, in the outdoor unit disclosed in Patent Document 1 (JP 2016-109350 A), a printed wiring board on which heat-generating components are mounted is arranged on the back side when the refrigerant jacket is viewed from the front. Summary of the Invention [Problem to be solved by the invention]

[0003] However, in the above configuration, the refrigerant pipe needs to be tilted forward when removing the printed wiring board, which may cause stress to the refrigerant pipe. Therefore, there is a need for a configuration that allows the printed wiring board to be removed without tilting the refrigerant pipe. [Means for solving the problem]

[0004] A control device according to a first aspect includes a printed wiring board, a heat-generating component mounted on the printed wiring board, a heat sink fixed to the heat-generating component, a mounting plate to which the printed wiring board is attached, and a heat transfer plate. The heat transfer plate is fixed to the heat sink with refrigerant piping attached. When viewed from the printed wiring board, the heat-generating component, the heat sink, and the mounting plate are arranged in this order in the thickness direction of the printed wiring board. The heat sink has a first region facing the mounting plate and a second region not facing the mounting plate on a side different from the side facing the heat-generating component. The second region is not located on the path of movement of the printed wiring board when the printed wiring board is removed from the mounting plate. The heat transfer plate is fixed to the second region.

[0005] With this control device, once the heat transfer plate is removed from the heat sink, the printed wiring board, heat generating components and heat sink can be removed in a direction that pulls them away from the mounting plate. This eliminates the need to tilt the heat transfer plate and refrigerant piping forward to avoid interference between the heat transfer plate and the printed wiring board, etc., as was previously the case, and reduces stress on the refrigerant piping.

[0006] A control device according to a second aspect is the control device according to the first aspect, wherein the heat sink has a first heat sink portion including a first region and a second heat sink portion including a second region, and the heat sink is formed such that the first heat sink portion and the second heat sink portion form a predetermined angle.

[0007] A control device according to a third aspect is the control device according to the second aspect, wherein the first heat sink portion and the second heat sink portion form an L-shape.

[0008] In this control device, the first heat sink section and the second heat sink section form an L-shape, so they are nearly perpendicular to each other, and the second heat sink section extends in the thickness direction of the mounting plate. By removing the heat transfer plate from the second region of the second heat sink section, the printed wiring board, heat-generating components, and heat sink can be removed in a direction away from the mounting plate. Therefore, unlike conventional systems, there is no need to tilt the heat transfer plate and refrigerant piping to avoid interference between the heat transfer plate and the printed wiring board, etc., and stress on the refrigerant piping is reduced.

[0009] A control device according to a fourth aspect is the control device according to the first aspect, wherein the heat sink further includes a third region. The third region is located on a surface different from the surface facing the heat-generating component, does not face the mounting plate, and is different from the second region. The heat sink has a first heat sink portion including the first region, a second heat sink portion including the second region, and a third heat sink portion including the third region. The first heat sink portion is located between the second heat sink portion and the third heat sink portion. The heat sink is formed so that the second heat sink portion and the third heat sink portion form a predetermined angle with the first heat sink portion. The third region is not located on the path of movement of the printed wiring board when the printed wiring board is removed from the mounting plate. The heat transfer plate is fixed to the second region or the third region.

[0010] In this control device, simply removing the heat transfer plate attached to either the second region of the second heat sink or the third region of the third heat sink allows the printed wiring board, heat-generating components, and heat sink to be removed in a direction away from the mounting plate. This eliminates the need to tilt the heat transfer plate and refrigerant piping to avoid interference between the heat transfer plate and the printed wiring board, as was necessary in conventional systems, and reduces stress on the refrigerant piping.

[0011] A control device according to a fifth aspect is the control device according to the third aspect, wherein the mounting plate has a hole or a notch through which the second heat sink portion of the heat sink passes.

[0012] In this control device, when the heat sink is removed in the thickness direction of the mounting plate, the second heat sink portion does not get in the way.

[0013] A control device according to a sixth aspect is the control device according to the fourth aspect, wherein the mounting plate has a hole or a notch through which at least one of the second heat sink portion and the third heat sink portion of the heat sink passes.

[0014] In this control device, when the heat sink is removed in the thickness direction of the mounting plate, the second heat sink portion and the third heat sink portion do not get in the way.

[0015] A seventh aspect of the present invention is directed to the control device of any one of the first to sixth aspects, wherein the first region of the heat sink is in close contact with the mounting plate.

[0016] In this control device, the mounting plate diffuses the heat transferred from the heat sink, improving the cooling performance of the heat sink.

[0017] A heat source unit according to an eighth aspect is a heat source unit including a casing that houses the control device according to any one of the first to seventh aspects. The casing has an opening for maintenance on a side surface facing the heat transfer plate.

[0018] This heat source unit is easy to work with because the worker can remove and attach the heat transfer plate through the opening for maintenance.

[0019] A heat source unit according to a ninth aspect is the heat source unit according to the eighth aspect, wherein the heat transfer plate is fastened to the second region of the heat sink by a screw, and the fastening direction by the screw and the opening direction of the opening are the same direction.

[0020] In this heat source unit, when a worker removes or attaches a heat transfer plate through the maintenance opening, the worker can handle it with a tool (a screwdriver) inserted in the direction of the opening, which improves workability. [Brief explanation of the drawings]

[0021] [Figure 1] 1 is a refrigerant circuit diagram of a refrigeration device equipped with a control device according to an embodiment of the present invention. [Figure 2] FIG. 2 is a perspective view of a heat source unit equipped with a control device. [Figure 3] 1 is a diagram comparing the normal state of the control device, a first state in which the heat transfer plate is removed, and a second state in which the board assembly is removed from the mounting plate. [Figure 4] 4 is a diagram in which the heat sink in FIG. 3 is replaced with a heat sink according to a first modified example. [Figure 5]4 is a diagram in which the heat sink in FIG. 3 is replaced with a heat sink according to a second modified example. [Figure 6] 4 is a diagram in which the heat sink in FIG. 3 is replaced with a heat sink according to a third modified example. DETAILED DESCRIPTION OF THE INVENTION

[0022] (1) Overall configuration of refrigeration device 1 Fig. 1 is a refrigerant circuit diagram of a refrigeration system 1 equipped with a control device 60 according to one embodiment of the present invention. In Fig. 1, the refrigeration system 1 is composed of a utilization unit 2 and a heat source unit 3. The refrigeration system 1 performs heating and cooling within a building by operating a vapor compression refrigeration cycle.

[0023] The utilization unit 2 is equipped with an indoor heat exchanger 20 and an indoor fan 21. The heat source unit 3 is equipped with a compressor 32, a four-way switching valve 33, an outdoor heat exchanger 30, an electric expansion valve 34, an accumulator 31, an outdoor fan 38, and a control device 60.

[0024] The utilization unit 2 and the heat source unit are connected via refrigerant pipes 41 and 42 to form a refrigerant circuit 11.

[0025] A refrigerant is sealed in the refrigerant circuit 11, and a refrigeration cycle operation is performed in which the refrigerant is compressed, cooled, decompressed, evaporated, and then compressed again.

[0026] During cooling operation, the four-way selector valve 33 is in the state shown by the solid line in Fig. 1, that is, the discharge side of the compressor 32 is connected to the gas side of the outdoor heat exchanger 30, and the suction side of the compressor 32 is connected to the gas side of the indoor heat exchanger 20 via the accumulator 31. During cooling operation, the refrigeration device 1 causes the outdoor heat exchanger 30 to function as a radiator and the indoor heat exchanger 20 to function as an evaporator.

[0027] During cooling operation, the indoor fan 21 causes air taken in from inside the room to exchange heat with the indoor heat exchanger 20, and then blows the cooled air back into the room, thereby cooling the room.

[0028] During heating operation, the four-way selector valve 33 is in the state shown by the dashed line in Fig. 1, that is, the discharge side of the compressor 32 is connected to the gas side of the indoor heat exchanger 20, and the suction side of the compressor 32 is connected to the gas side of the outdoor heat exchanger 30 via the accumulator 31. During heating operation, the refrigeration device 1 causes the indoor heat exchanger 20 to function as a radiator, and the outdoor heat exchanger 30 to function as an evaporator.

[0029] During heating operation, the indoor fan 21 exchanges heat between the air taken in from the room and the indoor heat exchanger 20, and blows the heated air back into the room, thereby heating the room.

[0030] A heat transfer plate 59 is attached to the refrigerant piping 41 between the outdoor heat exchanger 30 and the motor-operated expansion valve 34. The heat transfer plate 59 cools heat-generating components mounted on the control device 60 by the refrigerant flowing through one section of the refrigerant piping 41. The portion of the refrigerant piping 41 where the heat transfer plate 59 is attached is referred to as a cooling pipe 591.

[0031] (2) Configuration of heat source unit 3 Here, a description will be given of the heat source unit 3. Fig. 2 is a perspective view of the heat source unit 3 equipped with a control device 60. In Fig. 2, the heat source unit 3 has a casing 70 in the shape of a substantially rectangular parallelepiped.

[0032] The casing 70 accommodates the compressor 32, four-way switching valve 33, motor-operated expansion valve 34, outdoor heat exchanger 30, outdoor fan 38, and control device 60 shown in FIG.

[0033] The casing 70 forms the outer shell of the heat source unit 3 and is made up of a top plate 71, a bottom plate 72, a front plate 73, a rear right side plate 74, a front right side plate 75, a back plate not shown in Figure 2, and a left side plate when the front plate 73 is viewed from the front.

[0034] An air outlet (not shown) through which air blown from the outdoor fan 38 passes is formed in the front panel 73, and a grill 73a is attached to cover the air outlet. The rear right panel 74 forms the right corner on the far side when the front panel 73 is viewed from the front.

[0035] The front right side plate 75 is a side plate with an L-shaped cross section that forms the front right corner when the front plate 73 is viewed from the front. The front right side plate 75 can be separated into a lower region 75a and an upper region 75b, and while the lower region 75a remains fixed to the bottom plate 72, only the upper region 75b can be removed.

[0036] The ratio of the height of the front right side plate 75 between the lower region 75a and the upper region 75b is about 1:3, and when the upper region 75b is removed, the control device 60 is exposed from the casing 70.

[0037] (3) Configuration of the control device 60 3 is a diagram comparing the normal state of the control device 60, a first state in which the heat transfer plate 59 is removed, and a second state in which the substrate assembly 50 is removed from the mounting plate 57. In FIG. 3, the upper row shows the normal state of the control device 60, the middle row shows the first state in which the heat transfer plate 59 is removed, and the lower row shows the second state in which the substrate assembly 50 is removed from the mounting plate 57.

[0038] First, in the normal state shown in the upper part of FIG. 3, heat-generating component 53, heat sink 55, and mounting plate 57 are arranged in this order in the thickness direction of printed wiring board 51 when viewed from printed wiring board 51, and heat transfer plate 59 is fixed to heat sink 55.

[0039] (3-1) Printed wiring board 51 The printed wiring board 51 has a first surface 51a, which is the front surface, and a second surface 51b, which is the back surface. Electrical components are mounted on the first surface 51a. When the front plate 73 is viewed from the front and the upper region 75b of the front right side plate 75 is removed from the casing 70, the first surface 51a is on the near side. Heat-generating components 53 are mounted on the second surface 51b of the printed wiring board 51.

[0040] (3-2) Heat-generating parts 53 The heat generating component 53 is a power semiconductor component that becomes hot during operation, such as an intelligent power module or a diode module.

[0041] (3-3) Heat sink 55 The heat sink 55 is made of aluminum or an aluminum alloy and has a first heat sink portion 551 and a second heat sink portion 552. The first heat sink portion 551 is in close contact with the heat generating surface of the heat generating component 53.

[0042] The second heat sink portion 552 extends substantially perpendicularly from an end of the first heat sink portion 551, and passes through the mounting plate 57, extending in a direction away from the mounting plate 57. In this embodiment, the first heat sink portion 551 and the second heat sink portion 552 form an L-shape.

[0043] However, the angle α formed between the first heat sink portion 551 and the second heat sink portion 552 does not necessarily have to be a strict right angle. Considering the workability of the heat sink 55 and the ease of assembly with other components, the angle α should be in the range of 85 to 95°.

[0044] Furthermore, it is more preferable that first heat sink portion 551 be formed longer than second heat sink portion 552. This is because, since second heat sink portion 552 is shorter than first heat sink portion 551, the depth (direction from the front to the back of casing 70) of the space in which heat sink 55 is installed can be reduced.

[0045] The first heat sink portion 551 is provided with a first region 55a that faces the attachment plate 57 and is different from the surface facing the heat-generating component 53 side.

[0046] Further, second heat sink portion 552 is provided with second region 55b on a surface different from the surface facing heat-generating component 53 and not facing mounting plate 57. Second region 55b is not positioned on the path of movement of printed wiring board 51 when printed wiring board 51 is removed from mounting plate 57. A heat transfer plate 59 is fixed to second region 55b.

[0047] The flow line of printed wiring board 51 is the path of printed wiring board 51 when printed wiring board 51 moves in the board assembly removal direction (the direction of the white arrow) as shown in the lower part of FIG.

[0048] (3-4) Mounting plate 57 Printed wiring board 51 is attached to mounting plate 57 with heat sink 55 fixed to heat-generating component 53 mounted on second surface 51b. The gap between printed wiring board 51 and mounting plate 57 is stably maintained by spacer 501.

[0049] The distance between the printed wiring board 51 and the mounting plate 57 is arbitrary, but in this embodiment, the printed wiring board 51 and the mounting plate 57 are brought close enough that the first heat sink portion 551 of the heat sink 55 comes into contact with the mounting plate 57.

[0050] The mounting plate 57 is provided with a hole 57a through which the second heat sink portion 552 passes in order to avoid interference with the second heat sink portion 552 of the heat sink 55. However, it does not necessarily have to be a hole 57a and may be a notch.

[0051] However, if the first heat sink portion 551 is formed longer than the second heat sink portion 552, it is also possible to configure the mounting plate 57 without providing a hole 57a or a notch for passing the second heat sink portion 552 through.

[0052] (3-5) Heat Transfer Plate 59 The heat transfer plate 59 is a block made of aluminum or an aluminum alloy. The heat transfer plate 59 is processed so that cooling pipes 591 are inserted into holes provided in advance and are in close contact with the holes.

[0053] 1, the refrigerant circulating in the refrigerant circuit 11 flows through the cooling pipe 591. The temperature of the refrigerant flowing through the cooling pipe 591 is lower than the temperature of the heat-generating component 53 during operation, and therefore heat is exchanged between the heat-generating component 53 and the refrigerant via the heat transfer plate 59 and the heat sink 55, thereby cooling the heat-generating component 53.

[0054] The heat transfer plate 59 is attached to the second region 55 b of the heat sink 55 with screws 593 .

[0055] (4) Removal of the board assembly 50 Here, the assembly of the printed wiring board 51, the heat generating component 53, and the heat sink 55 is referred to as the board assembly 50.

[0056] When a service person removes the board assembly 50 from the heat source unit 3 for maintenance, as shown in FIG. 2, the upper region 75b of the front right side plate 75 is removed from the casing 70 to expose the control device 60.

[0057] Next, as shown in the middle of FIG. 3, the service person removes the screws 593 from the heat transfer plate 59, separating the heat transfer plate 59 from the second heat sink portion 552 and creating a gap between the second heat sink portion 552 and the heat transfer plate 59.

[0058] Then, the service person pulls out the board assembly 50 toward himself, as shown in the lower part of FIG. 3, to separate the board assembly 50 from the attachment plate 57.

[0059] Since the second region 55b of the second heat sink portion 552 is not positioned on the path of movement of the printed wiring board 51 when the board assembly 50 is removed from the attachment plate 57, the board assembly 50 can be easily removed.

[0060] (5) Features (5-1) In the control device 60, the heat-generating component 53, the heat sink 55, and the mounting plate 57 are arranged in this order in the thickness direction of the printed wiring board 51 as viewed from the printed wiring board 51. The heat sink 55 has a first region 55a facing the mounting plate 57 and a second region 55b not facing the mounting plate 57 on a side different from the side facing the heat-generating component 53. The second region 55b is not located on the path of movement of the printed wiring board 51 when the board assembly 50 is removed from the mounting plate 57. The heat transfer plate 59 is fixed to the second region 55b.

[0061] In the control device 60, by removing the heat transfer plate 59 from the heat sink 55, the substrate assembly 50 can be removed in a direction away from the mounting plate 57, and there is no need to tilt the heat transfer plate 59 and the cooling pipe 591 forward to avoid interference between the heat transfer plate 59 and the printed wiring board 51, etc., as in the conventional case, and stress on the cooling pipe 591 is suppressed.

[0062] (5-2) The heat sink 55 has a first heat sink portion 551 including a first region 55a and a second heat sink portion 552 including a second region 55b. The heat sink 55 is formed so that the first heat sink portion 551 and the second heat sink portion 552 form a predetermined angle.

[0063] (5-3) The first heat sink portion 551 and the second heat sink portion 552 form an L-shape, and the second heat sink portion 552 extends in the thickness direction of the mounting plate 57. By removing the heat transfer plate 59 from the second region 55b of the second heat sink portion 552, the board assembly 50 can be removed in a direction away from the mounting plate 57. Therefore, unlike the conventional case, it is not necessary to tilt the heat transfer plate 59 and the cooling pipe 591 to avoid interference between the heat transfer plate 59 and the printed wiring board 51, etc., and stress on the cooling pipe 591 can be suppressed.

[0064] (5-4) Since the mounting plate 57 has a hole 57a through which the second heat sink portion 552 of the heat sink 55 passes, the second heat sink portion 552 does not get in the way when the heat sink 55 is removed in the thickness direction of the mounting plate 57.

[0065] (5-5) The first region 55a of the heat sink 55 is in close contact with the mounting plate 57, and the mounting plate 57 diffuses the heat transferred from the heat sink 55, thereby improving the cooling performance of the heat sink 55.

[0066] (5-6) The casing 70 of the heat source unit 3 has a maintenance opening 74a on the side opposite the heat transfer plate 59, so that an operator can remove the heat transfer plate 59 through the maintenance opening 74a, improving workability.

[0067] (5-7) The heat transfer plate 59 is fastened to the second region 55b of the heat sink 55 by screws 593. As shown in Fig. 2, when the maintenance opening 74a is viewed from the right side surface of the casing 70, the flat surface of the heat transfer plate 59 is at the front, and the screws 593 pass through the heat transfer plate 59 to fasten the second region 55b of the heat sink 55 and the heat transfer plate 59 together in a direction perpendicular to the flat surface of the heat transfer plate 59.

[0068] Therefore, the opening direction of the opening 74a and the fastening direction of the screw 593 are the same, and the head of the screw 593 can be seen directly from the opening 74a.

[0069] When removing or attaching the heat transfer plate 59 through the maintenance opening 74a, the worker can handle it with the tool (driver) inserted in the opening direction of the opening 74a, which improves workability.

[0070] (6) Variations Here, first, second and third modified examples of the control device 60 described in the above embodiment, in which the shape of the heat sink 55 is changed, will be described.

[0071] However, the first, second and third modified examples share the following points (a) to (g). (a) The printed wiring board 51, the heat generating component 53 and the heat transfer plate 59 are common. (b) When viewed from the printed wiring board 51 , the heat generating component 53 , the heat sink 55 and the mounting plate 57 are arranged in this order in the thickness direction of the printed wiring board 51 , and a heat transfer plate 59 is fixed to the heat sink 55 . (c) Printed wiring board 51 is attached to mounting plate 57 with heat sink 55 fixed to heat-generating component 53 mounted on second surface 51b. The gap between printed wiring board 51 and mounting plate 57 is stably maintained by spacer 501. (c) The distance between the printed wiring board 51 and the mounting plate 57 is arbitrary, but the printed wiring board 51 and the mounting plate 57 are brought close enough that the first heat sink portion 551 of the heat sink 55 comes into contact with the mounting plate 57 . (d) The heat sinks 55 in the first, second, and third modified examples have different shapes, but are all made of aluminum or an aluminum alloy. (e) During maintenance, when a service person removes the board assembly 50 from the heat source unit 3, as shown in FIG. 2, the upper region 75b of the front right side plate 75 is removed from the casing 70 to expose the control device 60. (f) The service person removes the screws 593 from the heat transfer plate 59 and separates the heat transfer plate 59 from the second heat sink portion 552 to create a gap between the second heat sink portion 552 and the heat transfer plate 59 . (g) The service person pulls out the board assembly 50 toward himself and separates it from the mounting plate 57.

[0072] (6-1) First Modification Fig. 4 is a diagram in which the heat sink 55 in Fig. 3 is replaced with a heat sink according to the first modified example. In Fig. 4, the upper part shows the normal state of the control device 60, the middle part shows a first state in which the heat transfer plate 59 has been removed, and the lower part shows a second state in which the board assembly 50 has been removed from the mounting plate 57.

[0073] (6-1-1) Heatsink 55 The heat sink 55 has a first heat sink portion 551, a second heat sink portion 552, and a third heat sink portion 553. The first heat sink portion 551 is in close contact with the heat generating surface of the heat generating component 53.

[0074] The first heat sink portion 551 is located between the second heat sink portion 552 and the third heat sink portion 553. The second heat sink portion 552 extends substantially perpendicularly from one end of the first heat sink portion 551, passing through the mounting plate 57 and in a direction away from the mounting plate 57. The third heat sink portion 553 extends substantially perpendicularly from the other end of the first heat sink portion 551, passing through the mounting plate 57 and in a direction away from the mounting plate 57.

[0075] However, the angle α formed between the first heat sink portion 551 and the second and third heat sink portions 552 and 553 does not necessarily have to be a right angle. In consideration of the ease of assembling the heat sink 55 with other components, an angle α in the range of 85 to 95° is appropriate.

[0076] The first heat sink portion 551 is provided with a first region 55a that faces the attachment plate 57 and is different from the surface facing the heat-generating component 53 side.

[0077] The second heat sink portion 552 is provided with a second region 55b on a surface different from the surface facing the heat generating component 53 and not facing the attachment plate 57.

[0078] The third heat sink portion 553 is provided with a third region 55c that is on a surface different from the surface facing the heat-generating component 53 and that does not face the attachment plate 57.

[0079] The second region 55b and the third region 55c are not located on the path of movement of the printed wiring board 51 when the printed wiring board 51 is removed from the attachment plate 57.

[0080] The flow line of printed wiring board 51 is the path of printed wiring board 51 when printed wiring board 51 moves in the board assembly removal direction (the direction of the white arrow) as shown in the lower part of FIG.

[0081] In the first modified example, the heat transfer plate 59 is fixed to either the second region 55b or the third region 55c, whichever faces the front right side plate 75 of the casing .

[0082] (6-1-2) Mounting plate 57 The mounting plate 57 is provided with holes 57a for passing the second heat sink portion 552 and the third heat sink portion 553 through in order to avoid interference with the second heat sink portion 552 and the third heat sink portion 553 of the heat sink 55. However, the holes 57a do not necessarily have to be holes and may be cutouts.

[0083] In the first variant, when the board assembly 50 is removed from the mounting plate 57, the second region 55b of the second heat sink portion 552 and the third region 55c of the third heat sink portion 553 are not located on the movement path of the printed wiring board 51, making it easy to remove the board assembly 50.

[0084] (6-2) Second Modification Fig. 5 is a diagram in which the heat sink 55 in Fig. 3 is replaced with a heat sink according to the second modified example. In Fig. 5, the upper part shows the normal state of the control device 60, the middle part shows a first state in which the heat transfer plate 59 has been removed, and the lower part shows a second state in which the board assembly 50 has been removed from the mounting plate 57.

[0085] (6-2-1) Heatsink 55 The heat sink 55 has a first heat sink portion 551 and a second heat sink portion 552. The first heat sink portion 551 is in close contact with the heat generating surface of the heat generating component 53.

[0086] The second heat sink portion 552 extends substantially perpendicularly from one end of the first heat sink portion 551 and passes beside the printed wiring board 51 .

[0087] The angle β formed between the first heat sink portion 551 and the second heat sink portion 552 does not necessarily have to be a right angle. Considering the workability of the heat sink 55 and the ease of assembly with other components, it is reasonable for the angle β to be in the range of 85 to 180°.

[0088] The first heat sink portion 551 is provided with a first region 55a that faces the attachment plate 57 and is different from the surface facing the heat-generating component 53 side.

[0089] The second heat sink portion 552 is provided with a second region 55b on a surface different from the surface facing the heat generating component 53 and not facing the attachment plate 57.

[0090] Since the second heat sink portion 552 extends to pass along the side of the printed wiring board 51, the second region 55b is not located on the path of movement of the printed wiring board 51 when the printed wiring board 51 is removed from the mounting plate 57. The heat transfer plate 59 is fixed to the second region 55b.

[0091] The flow line of printed wiring board 51 is the path of printed wiring board 51 when printed wiring board 51 moves in the board assembly removal direction (the direction of the white arrow) as shown in the lower part of FIG.

[0092] (6-2-2) Mounting plate 57 Since the mounting plate 57 and the second heat sink portion 552 of the heat sink 55 do not interfere with each other, there is no need for a hole for passing the second heat sink portion 552 through as shown in Fig. 3. However, the same mounting plate as in the above embodiment or first modified example may be used for both purposes.

[0093] In the second variant, the second region 55b of the second heat sink portion 552 is not located on the path of movement of the printed wiring board 51 when the board assembly 50 is removed from the mounting plate 57, making it easy to remove the board assembly 50.

[0094] (6-3) Third Modification Fig. 6 is a diagram in which the heat sink 55 in Fig. 3 is replaced with a heat sink according to the third modified example. In Fig. 6, the upper part shows the normal state of the control device 60, the middle part shows a first state in which the heat transfer plate 59 has been removed, and the lower part shows a second state in which the board assembly 50 has been removed from the mounting plate 57.

[0095] (6-3-1) Heatsink 55 The heat sink 55 is a single plate-shaped member and has a first heat sink portion 551 and a second heat sink portion 552. The first heat sink portion 551 is in contact with the mounting plate 57. The second heat sink portion 552 is not in contact with the mounting plate 57.

[0096] The first heat sink portion 551 is in close contact with the heat generating surface of the heat generating component 53. The first heat sink portion 551 is provided with a first region 55a that faces the attachment plate 57 and is on a surface different from the surface facing the heat generating component 53.

[0097] The second heat sink portion 552 is provided with a second region 55b on a surface different from the surface facing the heat generating component 53 and not facing the attachment plate 57.

[0098] (6-3-2) Mounting plate 57 Since the mounting plate 57 and the second heat sink portion 552 of the heat sink 55 do not interfere with each other, there is no need for a hole for passing the second heat sink portion 552 through as shown in Fig. 3. However, the same mounting plate as in the above embodiment or first modified example may be used for both purposes.

[0099] In the third variant, the second region 55b of the second heat sink portion 552 is not located on the path of movement of the printed wiring board 51 when the board assembly 50 is removed from the mounting plate 57, making it easy to remove the board assembly 50.

[0100] The flow line of printed wiring board 51 is the path of printed wiring board 51 when printed wiring board 51 moves in the board assembly removal direction (the direction of the white arrow) as shown in the lower part of FIG.

[0101] Although the embodiments of the present disclosure have been described above, it will be understood that various changes in form and details can be made without departing from the spirit and scope of the present disclosure as defined in the claims. [Explanation of symbols]

[0102] 3 Heat source unit 51 Printed wiring board 53 Heat-generating parts 55 Heatsink 55a 1st area 55b 2nd area 55c 3rd area 551 First heat sink part 552 Second heat sink part 553 Third heat sink section 57 Mounting plate 57a hole 59 Heat transfer plate 591 Cooling pipe (refrigerant piping) 593 Screw 60 Control device [Prior art documents] [Patent documents]

[0103] Patent Publication No. 2016-109350

Claims

1. A printed wiring board (51), a heat-generating component (53) mounted on the printed wiring board (51); a heat sink (55) fixed to the heat generating component (53); a mounting plate (57) to which the printed wiring board (51) is attached; a heat transfer plate (59) fixed to the heat sink (55) with a refrigerant pipe (591) attached thereto; Equipped with When viewed from the printed wiring board (51), the heat generating component (53), the heat sink (55), and the mounting plate (57) are arranged in this order in the thickness direction of the printed wiring board (51), The heat sink (55) is provided with a first region (55a) facing the mounting plate (57) and a second region (55b) not facing the mounting plate (57) on a surface different from the surface facing the heat generating component (53), The second region (55b) is not located on a path of movement of the printed wiring board (51) when the printed wiring board (51) is removed from the mounting plate (57), The heat transfer plate (59) is fixed to the second region (55b). A control device (60).

2. The heat sink (55) a first heat sink portion (551) including the first region (55a); a second heat sink portion (552) including the second region (55b); and The heat sink (55) is formed so that the first heat sink portion (551) and the second heat sink portion (552) form a predetermined angle. The control device (60) of claim 1.

3. The first heat sink portion (551) and the second heat sink portion (552) form an L-shape. The control device (60) of claim 2.

4. The heat sink (55) is further provided with a third region (55c) on a surface different from the surface facing the heat generating component (53), the third region (55c) not facing the mounting plate (57) and different from the second region (55b), The heat sink (55) a first heat sink portion (551) including the first region (55a); a second heat sink portion (552) including the second region (55b); a third heat sink portion (553) including the third region (55c); and The first heat sink portion (551) is located between the second heat sink portion (552) and the third heat sink portion (553), The heat sink (55) is formed so that the second heat sink portion (552) and the third heat sink portion (553) form a predetermined angle with the first heat sink portion (551), The third region (55c) is not located on a path of movement of the printed wiring board (51) when the printed wiring board (51) is removed from the mounting plate (57), The heat transfer plate (59) is fixed to the second region (55b) or the third region (55c). The control device (60) of claim 1.

5. The mounting plate (57) has a hole or notch through which the second heat sink portion (552) of the heat sink (55) passes. The control device (60) of claim 3.

6. The mounting plate (57) has a hole or a notch through which at least one of the second heat sink portion (552) and the third heat sink portion (553) of the heat sink (55) passes. The control device (60) of claim 4.

7. The first region (55a) of the heat sink (55) is in close contact with the mounting plate (57). A control device (60) according to claim 1 or claim 2.

8. A heat source unit including a casing that houses the control device (60) according to claim 1 or 2, The casing has an opening for maintenance on a side surface facing the heat transfer plate (59). Heat source unit.

9. The heat transfer plate (59) is fastened to the second region (55b) of the heat sink (55) by a screw, The fastening direction of the screw and the opening direction of the opening are the same direction. The heat source unit according to claim 8.

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