Electronic component unit and wiring module

Abstract

To suppress deformation of a connection part connected to an electronic component in an electronic component unit crimped to an electric wire.SOLUTION: The electronic component unit 10 includes the terminal 20 connected to the electric wire 70, the counterpart terminal 30, the resin portion 40 covering a part of the terminal 20 and a part of the counterpart terminal 30, and the electronic component 50, the resin portion 40 maintains an interval between the terminal 20 and the counterpart terminal 30, the electronic component 50 includes the first electrode 51 and the second electrode 52, and the counterpart terminal 30 is electrically connected to the second electrode 52. The terminal 20 includes the connecting portion to be electrically connected to the first electrode 51, the crimping portion 22 to be crimped to the wire 70 and the intermediate portion 24 disposed between the connecting portion and the crimping portion 22, and the intermediate portion 24 is formed with the deformation suppressing portion 25 for suppressing the deformation of the connecting portion when the crimping portion 22 is crimped to the wire 70.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to an electronic component unit and a wiring module. [Background technology]

[0002] High-voltage battery packs used in electric vehicles, hybrid vehicles, and the like typically have a large number of stacked battery cells electrically connected in series or parallel by a wiring module. A conventionally known example of such a wiring module is the conductor module described in JP 2019-32928 A (Patent Document 1 below). The conductor module described in Patent Document 1 includes a wiring material and multiple bus bars. The wiring material has multiple wires that electrically connect the bus bars and the battery module monitoring unit, and electronic components installed along the wires. Patent Document 1 cites a flexible printed circuit (FPC) as an example of the wiring material, and a fuse as an example of the electronic component. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-32928 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-described conductor module, it is conceivable to replace the FPC with multiple terminals with electric wires in order to reduce manufacturing costs, etc. That is, a terminal may be provided between the electric wire and the electronic component, electrically connecting the terminal and the electronic component, and then crimping the terminal to the electric wire. In such a case, when the crimping portion is crimped to the electric wire, stress caused by plastic deformation of the crimping portion may be transmitted to the connection portion with the electronic component, causing deformation of the connection portion. [Means for solving the problem]

[0005] The electronic component unit of the present disclosure includes a terminal connected to an electric wire, a mating terminal, a resin part covering a part of the terminal and a part of the mating terminal, and an electronic component, wherein the resin part maintains a gap between the terminal and the mating terminal, the electronic component includes a first electrode and a second electrode, the mating terminal is electrically connected to the second electrode, and the terminal includes a connecting part electrically connected to the first electrode, a crimping part crimped to the electric wire, and an intermediate part disposed between the connecting part and the crimping part, and the intermediate part is formed with a deformation suppressing part that suppresses deformation of the connecting part when the crimping part is crimped to the electric wire.

[0006] A wiring module according to the present disclosure includes the electronic component unit described above and an electric wire to which the crimping portion is crimped. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to suppress deformation of a connection portion that is connected to an electronic component in an electronic component unit that is crimped onto an electric wire. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of an electronic component unit according to a first embodiment. [Figure 2] FIG. 2 is a plan view of the electronic component unit. [Figure 3] FIG. 3 is a cross-sectional view taken along line AA in FIG. [Figure 4] FIG. 4 is a side view of the electronic component unit. [Figure 5] FIG. 5 is a plan view of the terminal and the mating terminal. [Figure 6] FIG. 6 is a plan view of the intermediate molded body. [Figure 7] FIG. 7 is a cross-sectional view taken along the line AA in FIG. 2, showing a state in which the electronic component is covered with a sealing portion. [Figure 8] FIG. 8 is an enlarged view of FIG. 7 showing the periphery of the sealing portion in an enlarged manner. [Figure 9]FIG. 9 is a cross-sectional view taken along the line AA in FIG. 2, showing a process of crimping the crimping portion of the electronic component unit to the electric wire. [Figure 10] FIG. 10 is a plan view of the electronic component unit to which the electric wires are crimped. [Figure 11] FIG. 11 is a plan view of the electronic component unit according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] [Description of the embodiments of the present disclosure] First, embodiments of the present disclosure will be listed and described. [1] The electronic component unit of the present disclosure comprises a terminal connected to an electric wire, a mating terminal, a resin part covering a part of the terminal and a part of the mating terminal, and an electronic component, wherein the resin part maintains a distance between the terminal and the mating terminal, the electronic component comprises a first electrode and a second electrode, the mating terminal is electrically connected to the second electrode, the terminal comprises a connecting part electrically connected to the first electrode, a crimping part crimped to the electric wire, and an intermediate part disposed between the connecting part and the crimping part, and the intermediate part is formed with a deformation suppressing part that suppresses deformation of the connecting part when the crimping part is crimped to the electric wire.

[0010] According to this configuration, the deformation suppressing portion formed in the intermediate portion can suppress deformation of the connection portion when the crimping portion is crimped to the electric wire.

[0011] [2] In the above item [1], it is preferable that the deformation suppression portion includes a bent portion formed by bending the intermediate portion in the plate thickness direction.

[0012] According to this configuration, the bending portion provides strength to the deformation suppression portion, thereby making it possible to suppress deformation of the connection portion.

[0013] [3] In the above item [1], it is preferable that the deformation suppression portion has a through-hole that penetrates the intermediate portion.

[0014] According to this configuration, by providing the through holes and configuring the deformation suppression portion to be easily deformed, stress can be absorbed by the deformation suppression portion, thereby suppressing deformation of the connection portion.

[0015] [4] In any one of the above [1] to [3], it is preferable that the deformation suppression portion includes a flat plate portion disposed in the intermediate portion at a position closer to the pressure-bonding portion.

[0016] According to this configuration, when the crimping portion is crimped to the electric wire, the flat plate portion is pressed with a jig or the like, thereby making it possible to suppress the transmission of stress from the crimping portion to the connection portion.

[0017] [5] In any one of the above [1] to [4], it is preferable that the terminal has a notch recessed from an outer edge portion, and the notch defines the connection portion.

[0018] According to this configuration, the connection portion is defined by the notch, and therefore, when the crimping portion is crimped onto the electric wire, it is possible to suppress the transmission of stress from the crimping portion to the connection portion.

[0019] [6] In any one of the above [1] to [5], it is preferable that the resin portion has a peripheral wall portion disposed around the electronic component.

[0020] With this configuration, the electronic components can be protected by the peripheral wall portion.

[0021] [7] Preferably, the electronic component unit of any one of [1] to [6] above further includes a sealing portion that covers the electronic component.

[0022] According to this configuration, the provision of the sealing portion can prevent condensation water and the like from adhering to the electronic component, thereby preventing a short circuit between the terminal and the mating terminal due to condensation water and the like.

[0023] [8] A wiring module according to the present disclosure includes any one of the electronic component units [1] to [7] above, and an electric wire to which the crimping portion is crimped.

[0024] [Details of the embodiments of the present disclosure] The following describes embodiments of the present disclosure. The present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims. In the drawings, for the sake of convenience, some components may be exaggerated or simplified. Furthermore, the dimensional ratios of the components may differ between drawings. In this specification, "orthogonal" and "parallel" do not only refer to cases where the components are strictly orthogonal or parallel, but also include cases where the components are roughly orthogonal or parallel within the scope of the functions and effects of the present embodiment.

[0025] In each drawing, three mutually perpendicular directions are shown, and the three directions are respectively indicated as a first direction D1, a second direction D2, and a third direction D3. That is, the first direction D1 and the second direction D2 are perpendicular to each other, the first direction D1 and the third direction D3 are perpendicular to each other, and the second direction D2 and the third direction D3 are perpendicular to each other. By indicating each direction with an arrow on both sides of the solid line, not only the direction of the arrow on the side with the symbol but also the direction of the arrow on the side without the symbol is considered to indicate the corresponding direction.

[0026] <Embodiment 1> (Electronic Components Unit 10) A first embodiment of the present disclosure will be described with reference to Figures 1 to 10. As shown in Figures 1 to 3, an electronic component unit 10 of this embodiment includes a terminal 20, a mating terminal 30, a resin part 40, and an electronic component 50. Note that, for multiple identical components, only some of the components may be designated by reference numerals, and the reference numerals for the other components may be omitted.

[0027] (Terminal 20) The terminal 20 is made of a conductive metal. An example of the conductive metal is a copper alloy. An example of a surface treatment of the conductive metal is tin plating. Specifically, the terminal may be a copper alloy with tin plating formed on its surface. As shown in FIG. 5, the terminal 20 includes a plate-like portion 21 having a rectangular plate shape and a crimping portion 22. The crimping portion 22 is formed to be continuous with the plate-like portion 21 in the extension direction (first direction D1) of the terminal 20.

[0028] The plate-shaped portion 21 has two notches 21A recessed from the outer edge of one side (the left side in the figure) of the terminal 20 in the first direction D1. A portion of the plate-shaped portion 21 defined by the two notches 21A from both sides in the width direction (third direction D3) of the terminal 20 is a first connection portion 23 (an example of a connection portion). In other words, the first connection portion 23 and the notches 21A are adjacent to each other in the width direction of the terminal 20. The portions of the plate-shaped portion 21 disposed on both sides of the first connection portion 23 in the third direction D3 across the notches 21A are side piece portions 21B. The first connection portion 23 is a portion to which a first electrode 51 of the electronic component 50 is connected. The first connection portion 23 and the first electrode 51 are connected by soldering.

[0029] Cutout 21A appropriately sets the area of ​​first connection portion 23 when viewed from second direction D2. If cutout 21A were not provided, there is a possibility that heat dissipation to terminal 20 would be large when first electrode 51 of electronic component 50 and first connection portion 23 are connected by soldering. However, in this embodiment, cutout 21A is used to appropriately adjust the size of first connection portion 23, thereby making it possible to appropriately control heat dissipation to terminal 20.

[0030] The crimping portion 22 includes a core wire crimping portion 22A and an insulating sheath crimping portion 22B. The core wire crimping portion 22A is disposed between the plate-shaped portion 21 and the insulating sheath crimping portion 22B in the extension direction of the terminal 20. As shown in FIG. 10 , the core wire crimping portion 22A is crimped to the core wire of the electric wire 70. The terminal 20 is electrically connected to the electric wire 70 by the core wire crimping portion 22A. The insulating sheath crimping portion 22B is crimped to the insulating sheath of the electric wire 70. The electric wire 70 can be fixed to the terminal 20 by the insulating sheath crimping portion 22B.

[0031] (Deformation suppression part 25) 5, the portion of the plate-like portion 21 between the first connecting portion 23 and the crimping portion 22 is defined as an intermediate portion 24. The intermediate portion 24 is formed with a deformation suppressing portion 25 that suppresses deformation of the first connecting portion 23 when the crimping portion 22 is crimped to the electric wire 70. The deformation suppressing portion 25 of this embodiment includes a bent portion 26 formed by bending the intermediate portion 24 in the plate thickness direction, and a flat portion 27.

[0032] The bent portion 26 extends in the width direction (third direction D3) of the terminal 20. Preferably, the bent portion 26 is configured to have a plurality of bend lines across the entire width in the third direction D3. As shown in FIG. 4, the bent portion 26 has a crank shape, i.e., a Z-shape, when viewed from the third direction D3. The bent shape of the bent portion 26 when viewed from the third direction D3 may be other shapes, for example, a convex shape. The bent portion 26 may also be a bead. By forming the bent portion 26, the strength of the intermediate portion 24 can be increased and deformation of the intermediate portion 24 can be suppressed.

[0033] The flat portion 27 is a plate having a flat surface. The flat portion 27 is disposed in the intermediate portion 24 at a position closer to the crimping portion 22. The flat portion 27 is disposed between the bent portion 26 and the crimping portion 22.

[0034] 5, a recess 24A and a filling hole 24B are provided in the intermediate portion 24 at a position closer to the first connecting portion 23. The recess 24A is recessed from the edge of the intermediate portion 24 in the third direction D3. The filling hole 24B penetrates the intermediate portion 24 in the second direction D2.

[0035] (Mating terminal 30) The mating terminal 30 is made of a conductive metal. The metal constituting the mating terminal 30 may be different from the metal constituting the terminal 20. Examples of conductive metals include aluminum and copper alloys. Examples of surface treatments for conductive metals include nickel plating and tin plating. Specifically, the mating terminal may be an aluminum terminal with nickel plating formed on its surface, an aluminum terminal with tin plating formed on its surface, or a copper alloy terminal with tin plating formed on its surface. The mating terminal 30 includes a rectangular plate-shaped plate portion 31. The plate portion 31 has two notches 31A recessed from the outer edge of the mating terminal 30 on the other side (right side in the figure) of the mating terminal 30 in the first direction D1. The portion of the plate portion 31 defined by the two notches 31A on both sides in the width direction (third direction D3) of the mating terminal 30 is a second connecting portion 32. In other words, the second connecting portion 32 and the notch 31A are adjacent to each other in the width direction of the mating terminal 30. The second connection portion 32 is a portion to which the second electrode 52 of the electronic component 50 is connected. The second connection portion 32 and the second electrode 52 are connected by soldering.

[0036] In this embodiment, by appropriately adjusting the size of the second connection portion 32 using the notch 31A, it is possible to appropriately control heat dissipation to the mating terminal 30 when connecting the second electrode 52 of the electronic component 50 to the second connection portion 32 by soldering.

[0037] One portion of the plate-shaped portion 31 on one side in the first direction D1 is a mating member connecting portion 33. The mating member connecting portion 33 is a portion that is electrically connected to a mating member. The mating member is, for example, a bus bar or an electrode terminal of an energy storage element. The mating member connecting portion 33 and the mating member are connected by, for example, welding or soldering.

[0038] A recess 34 and a filling hole 35 are provided in the plate-shaped portion 31 between the second connection portion 32 and the mating member connection portion 33. The recess 34 is recessed from the edge of the plate-shaped portion 31 in the third direction D3. The filling hole 35 penetrates the plate-shaped portion 31 in the second direction D2.

[0039] As shown in Fig. 3, the plate thickness of the first connecting portion 23 (plate-shaped portion 21) of the terminal 20 may be different from the plate thickness of the second connecting portion 32 (plate-shaped portion 31) of the mating terminal 30. Specifically, the plate thickness of the plate-shaped portion 21 of the terminal 20 is smaller than the plate thickness of the plate-shaped portion 31 of the mating terminal 30. Also, unlike this embodiment, the plate thickness of the plate-shaped portion of the terminal may be the same as the plate thickness of the plate-shaped portion of the mating terminal. The plate thickness of the plate-shaped portion of the terminal may be larger than the plate thickness of the plate-shaped portion of the mating terminal.

[0040] (Resin part 40) The resin portion 40 is made of an insulating synthetic resin. As shown in FIGS. 1 to 3, the resin portion 40 covers a portion of the terminal 20 and a portion of the mating terminal 30. The resin portion 40 is formed integrally with the terminal 20 and the mating terminal 30 by insert molding. As shown in FIG. 6, during insert molding, molten resin, which is the raw material of the resin portion 40, is filled into the filling holes 24B, 35 and the recesses 24A, 34, thereby fixing the terminal 20 and the mating terminal 30 to the resin portion 40. The resin portion 40 maintains the distance between the terminal 20 and the mating terminal 30. The resin portion 40 positions the terminal 20 and the mating terminal 30 so that they do not come into direct contact with each other.

[0041] 3, the resin part 40 exposes an end face 23A (upper end face) on one side in the second direction D2 of the first connection part 23 and an end face 32A (upper end face) on one side in the second direction D2 of the second connection part 32. The first connection part 23 and the second connection part 32 are arranged at a predetermined distance in the first direction D1 by the resin part 40. The resin part 40 exposes the bent part 26 and the flat part 27 to the outside. The resin part 40 exposes the mating member connection part 33 to the outside.

[0042] The end face 23A of the first connecting portion 23 and the end face 32A of the second connecting portion 32 are planar. The end face 23A of the first connecting portion 23 and the end face 32A of the second connecting portion 32 are located at substantially the same position in the second direction D2 and are parallel to each other. The resin portion 40 has an intervening portion 41 interposed between the first connecting portion 23 and the second connecting portion 32. The intervening portion 41 does not protrude to one side (upward) in the second direction D2 beyond the end face 23A of the first connecting portion 23 and the end face 32A of the second connecting portion 32. With this configuration, the first electrode 51 and the second electrode 52 of the electronic component 50 can be mounted on the end face 23A of the first connecting portion 23 and the end face 32A of the second connecting portion 32, respectively. Therefore, the mounting process allows the electronic component 50 to be easily incorporated into the electronic component unit 10.

[0043] (Peripheral wall part 42) The resin part 40 has a peripheral wall part 42 that extends further to one side (upward) in the second direction D2 than the first connection part 23 and the second connection part 32. The peripheral wall part 42 is arranged to surround the electronic component 50 in a direction perpendicular to the second direction D2. The peripheral wall part 42 is arranged so as not to come into contact with the electronic component 50. The upper end of the peripheral wall part 42 is arranged higher than the upper end of the electronic component 50. The peripheral wall part 42 defines an opening 42A that opens upward.

[0044] (Electronic Components 50) Examples of the electronic component 50 include a fuse (such as a chip fuse or a fuse with leads), a resistor (such as a chip resistor or a resistor with leads), and a metal piece. In the present disclosure, a chip fuse is exemplified. As shown in FIG. 2 , the electronic component 50 includes a first electrode 51 and a second electrode 52. When the chip fuse melts due to a large current flowing through it, the first electrode 51 and the second electrode 52 are electrically insulated from each other. The first electrode 51 is disposed on the first connection portion 23, and the second electrode 52 is disposed on the second connection portion 32. The first electrode 51 and the first connection portion 23 are connected by soldering. The second electrode 52 and the second connection portion 32 are connected by soldering.

[0045] (Sealing portion 60) As shown in FIG. 7 , the electronic component unit 10 of this embodiment may include a sealing portion 60. The sealing portion 60 is made of a curable insulating resin. The sealing portion 60 may be made of a resin different from the synthetic resin that constitutes the resin portion 40. The sealing portion 60 may be transparent. The sealing portion 60 is, for example, a potting agent. The sealing portion 60 is arranged to fill the space within the opening 42A of the peripheral wall portion 42. The sealing portion 60 covers the electronic component 50, the connection portion between the first connecting portion 23 and the first electrode 51, and the connection portion between the second connecting portion 32 and the second electrode 52. The sealing portion 60 is formed by filling the opening 42A with uncured liquid insulating resin after the mounting process and curing the insulating resin.

[0046] The provision of the sealing portion 60 can prevent water droplets from entering the opening 42A of the peripheral wall portion 42. Therefore, after the chip fuse has blown, electrical continuity between the first connecting portion 23 and the second connecting portion 32 through the water droplets can be prevented.

[0047] As shown in FIG. 1, a guide portion 42B may be provided on the inner peripheral surface of the peripheral wall portion 42. In this embodiment, the guide portion 42B is a stepped portion. The guide portion 42B may also be a recessed portion or a protruding portion. The guide portion 42B indicates an appropriate amount of insulating resin to be filled in the opening 42A with the uncured liquid insulating resin. For example, as shown in FIG. 8, the uncured liquid insulating resin is filled and cured so that the liquid level is located above the guide portion 42B indicated by the dashed line, thereby stably performing the function of the sealing portion 60. The guide portion 42B is positioned above the upper end of the electronic component 50.

[0048] (Wiring module 1) The electronic component unit 10 of this embodiment can be applied to a wiring module 1 that connects multiple energy storage elements. For example, the wiring module 1 may be mounted on a vehicle such as an electric vehicle or a hybrid vehicle. As shown in FIG. 10 , the wiring module 1 includes the electronic component unit 10 and an electric wire 70 to which the crimping portion 22 is crimped. For example, the mating member connecting portion 33 of the mating terminal 30 may be connected to an electrode terminal of a pre-joined energy storage element. Alternatively, the wiring module 1 may include the electronic component unit 10, the electric wire 70 to which the crimping portion 22 is crimped, and a bus bar connected to the mating member connecting portion 33, and the bus bar may be connected to the electrode terminal of the energy storage element. The electric wire 70 is connected to an external device such as an ECU (Electronic Control Unit) via a connector. The electric wire 70 functions as a voltage detection line.

[0049] (Method of manufacturing electronic component unit 10) The following describes an example of a method for manufacturing the electronic component unit 10. First, a metal plate is pressed to form the terminal 20 and the mating terminal 30 (see FIG. 5).

[0050] Next, insert molding of the resin part 40 is performed using a part of the terminal 20 and a part of the mating terminal 30 as insert parts. The terminal 20 and the mating terminal 30 are placed in a mold, and molten resin, which is the raw material for the resin part 40, is filled into the mold. Once the resin has hardened, the mold is removed, and an intermediate molded body 44 is obtained in which the terminal 20, the mating terminal 30, and the resin part 40 are integrated (see FIG. 6).

[0051] The electronic component 50 is placed in the opening 42A of the intermediate molded body 43, and the first electrode 51 is soldered to the first connecting portion 23, and the second electrode 52 is soldered to the second connecting portion 32 (see FIG. 2).

[0052] Furthermore, opening 42A may be filled with a curable insulating resin and cured to provide sealing portion 60. In this way, the manufacturing of electronic component unit 10 is completed.

[0053] (Crimping process of the electric wire 70) 9, a process for crimping the electric wire 70 to the electronic component unit 10 of this embodiment will be described. The crimping portion 22 is crimped to the electric wire 70 by a crimping machine 80. The crimping machine 80 includes an anvil 81 and a crimper 82 provided above the anvil 81. The bottom of the crimping portion 22 is placed on the anvil 81. The crimping piece of the crimping portion 22 is crimped to the electric wire 70 by lowering the crimper 82 toward the anvil 81.

[0054] It is preferable that the electronic component unit 10 is fixed when the crimping portion 22 is crimped to the electric wire 70. Since the electronic component unit 10 of this embodiment has the flat plate portion 27, the electronic component unit 10 can be fixed by clamping the flat plate portion 27 from above and below using jigs 83, 84, for example. The resin portion 40 and the mating terminal 30 of the electronic component unit 10 may be placed on a mounting table 85 or the like.

[0055] (Deformation of terminal 20 during crimping process of electric wire 70) In the process of crimping the electric wire 70, the crimping portion 22 deforms so as to be wound around the electric wire 70. Accordingly, stress is transmitted from the crimping portion 22 to the intermediate portion 24, and both ends of the intermediate portion 24 in the third direction D3 tend to deform and rise relative to the center of the intermediate portion 24 in the third direction D3. In this embodiment, the strength of the intermediate portion 24 is improved by the bent portion 26, making the intermediate portion 24 less likely to deform. This suppresses the transmission of stress from the intermediate portion 24 to the first connecting portion 23. Therefore, when the crimping portion 22 is crimped to the electric wire 70, deformation of the first connecting portion 23 can be suppressed.

[0056] In this embodiment, the flat plate portion 27 is disposed in the intermediate portion 24 at a position closer to the crimping portion 22. In the intermediate portion 24, the flat plate portion 27 is disposed in a position closer to the crimping portion 22 than the bent portion 26. The flat plate portion 27 has a flat plate shape and is clamped in the vertical direction by jigs 83 and 84. Therefore, stress is less likely to be transmitted from the crimping portion 22 to the portion of the intermediate portion 24 that is disposed on the opposite side of the flat plate portion 27 from the crimping portion 22. This makes it possible to further suppress deformation of the first connecting portion 23.

[0057] If stress were to propagate from the crimping portion 22 to the vicinity of the first connecting portion 23, it is conceivable that both side portions of the first connecting portion 23 would be deformed so as to be lifted relative to the center portion of the first connecting portion 23. However, in this embodiment, the first connecting portion 23 is separated from the side piece portion 21B by the notch 21A (see FIG. 5). Therefore, even if stress were to propagate from the crimping portion 22 to the vicinity of the first connecting portion 23 and the side piece portion 21B were to be deformed, the first connecting portion 23 would be less likely to deform.

[0058] (Effects of the first embodiment) (1-1) The electronic component unit 10 of the first embodiment includes a terminal 20 connected to an electric wire 70, a mating terminal 30, a resin part 40 covering a part of the terminal 20 and a part of the mating terminal 30, and an electronic component 50, wherein the resin part 40 maintains the distance between the terminal 20 and the mating terminal 30, the electronic component 50 includes a first electrode 51 and a second electrode 52, the mating terminal 30 is electrically connected to the second electrode 52, the terminal 20 includes a connection part (first connection part 23) electrically connected to the first electrode 51, a crimping part 22 crimped to the electric wire 70, and an intermediate part 24 arranged between the connection part and the crimping part 22, and the intermediate part 24 is formed with a deformation suppression part 25 that suppresses deformation of the connection part when the crimping part 22 is crimped to the electric wire 70.

[0059] According to this configuration, the deformation suppressing portion 25 formed in the intermediate portion 24 can suppress deformation of the connection portion when the crimping portion 22 is crimped to the electric wire 70 .

[0060] (1-2) In the first embodiment, the deformation suppression portion 25 includes a bent portion 26 formed by bending the middle portion 24 in the plate thickness direction.

[0061] According to this configuration, bending portion 26 provides strength to deformation suppression portion 25, thereby making it possible to suppress deformation of the connection portion.

[0062] (1-3) In the first embodiment, the deformation suppression portion 25 includes a flat plate portion 27 disposed in the intermediate portion 24 at a position closer to the pressure-bonding portion 22 .

[0063] With this configuration, when crimping portion 22 is crimped to electric wire 70, flat plate portion 27 is pressed by jigs 83, 84, etc., so that stress can be prevented from being transmitted from crimping portion 22 to the connection portion.

[0064] (1-4) In the first embodiment, the terminal 20 has a notch 21A recessed from the outer edge, and the notch 21A defines a connection portion.

[0065] According to this configuration, the connection portion is defined by the notch 21A, and therefore, when the crimping portion 22 is crimped to the electric wire 70, stress can be prevented from being transmitted from the crimping portion 22 to the connection portion.

[0066] (1-5) In the first embodiment, the resin part 40 includes a peripheral wall part 42 disposed around the electronic component 50 .

[0067] With this configuration, the electronic component 50 can be protected by the peripheral wall portion 42.

[0068] (1-6) The electronic component unit 10 according to the first embodiment further includes a sealing portion 60 that covers the electronic component 50 .

[0069] According to this configuration, the provision of the sealing portion 60 can prevent condensation water and the like from adhering to the electronic component 50. Therefore, it is possible to prevent a short circuit between the terminal 20 and the mating terminal 30 due to condensation water and the like.

[0070] (1-7) The wiring module 1 of the present disclosure includes the electronic component unit 10 and the electric wire 70 to which the crimping portion 22 is crimped.

[0071] <Embodiment 2> A second embodiment of the present disclosure will be described with reference to Fig. 11. Electronic component unit 110 according to the second embodiment has the same configuration as that of the first embodiment, except for the configuration of deformation suppression section 125 of terminal 120, and therefore, descriptions of the same members, functions, and effects as those of the first embodiment may be omitted.

[0072] (Deformation suppression part 125) The deformation suppression portion 125 of this embodiment has a through hole 126 that penetrates the intermediate portion 24 in the second direction D2. The through hole 126 is, for example, an elongated hole that is long in the third direction D3. By forming the through hole 126 in the intermediate portion 24, the portion of the intermediate portion 24 around the through hole 126 is more likely to deform. As a result, when the crimping portion 22 is crimped to the electric wire 70, if stress is transmitted from the crimping portion 22 to the intermediate portion 24, the stress is absorbed by the deformation of the intermediate portion 24. Therefore, stress is less likely to be transmitted from the intermediate portion 24 to the first connecting portion 23, and deformation of the first connecting portion 23 can be suppressed.

[0073] The deformation suppression portion 125 of this embodiment may further include a flat plate portion 27. In detail, the flat plate portion 27 may be provided between the through hole 126 in the intermediate portion 24 and the pressure-bonding portion 22.

[0074] (Effects of the second embodiment) (2-1) In the electronic component unit 110 according to the second embodiment, the deformation suppression portion 125 has a through-hole 126 that penetrates the middle portion 24 .

[0075] According to this configuration, by providing through-holes 126 and configuring deformation suppression portion 125 to be easily deformed, stress can be absorbed by deformation suppression portion 125. Therefore, deformation of the connection portion (first connection portion 23) can be suppressed.

[0076] (Other embodiments) The above-described first and second embodiments can be modified as follows: The above-described first and second embodiments and the following modifications can be combined and implemented within the scope of technical compatibility.

[0077] The electronic component unit may be configured so that electronic components cannot be mounted. The electronic components may be connected to the terminals and mating terminals by, for example, soldering without using a mounting process. Alternatively, the electronic components may be connected to the terminals and mating terminals by, for example, screw fastening.

[0078] The terminal and mating terminal do not need to have any notches, recesses, or filling holes. [Explanation of symbols]

[0079] 1: Wiring module 10: Electronic component unit 20: Terminal 21: Plate-shaped part 21A: Notch 21B: Side piece 22: Crimping section 22A: Core wire crimping section 22B: Insulation coating crimp part 23: First connection part 23A: End face 24: Middle part 24A: Recess 24B: Filling hole 25: Deformation suppression section 26: Bent section 27: Flat plate part 30: Mating terminal 31: Plate-shaped part 31A: Notch 32: Second connection part 32A: End face 33: Connection part of mating member 34: Recess 35: Filling hole 40: Resin part 41: Interposition part 42: Peripheral wall part 42A: Opening 42B: Guide section 44: Intermediate molded body 50: Electronic parts 51: 1st electrode 52:Second electrode 60: Sealing part 70: Electric wire 80: Crimping machine 81: Anvil 82: Crimper 83, 84: Jig 85: Stand 110: Electronic component unit 120: Terminal 125: Deformation suppression part 126:Through hole D1: 1st direction D2:Second direction D3: Third direction

Claims

1. a terminal to be connected to the electric wire; The mating terminal and a resin portion covering a portion of the terminal and a portion of the mating terminal; an electronic component; the resin portion maintains the distance between the terminal and the mating terminal, the electronic component includes a first electrode and a second electrode; the mating terminal is electrically connected to the second electrode, the terminal includes a connection portion electrically connected to the first electrode, a crimping portion crimped to the electric wire, and an intermediate portion disposed between the connection portion and the crimping portion, The electronic component unit has a deformation suppressing portion formed in the intermediate portion that suppresses deformation of the connection portion when the crimping portion is crimped to the electric wire.

2. The electronic component unit according to claim 1 , wherein the deformation suppressing portion includes a bent portion formed by bending the intermediate portion in a thickness direction.

3. The electronic component unit according to claim 1 , wherein the deformation suppression portion has a through-hole that penetrates the intermediate portion.

4. The electronic component unit according to claim 1 , wherein the deformation suppression portion includes a flat plate portion disposed in the intermediate portion at a position closer to the crimping portion.

5. The terminal has a notch recessed from an outer edge thereof, The electronic component unit according to claim 1 , wherein the notch defines the connection portion.

6. The electronic component unit according to claim 1 , wherein the resin portion includes a peripheral wall portion disposed around the electronic component.

7. The electronic component unit according to claim 1 , further comprising a sealing portion that covers the electronic component.

8. The electronic component unit according to any one of claims 1 to 3; and an electric wire to which the crimping portion is crimped.

Images