Electronic device

Abstract

To provide an electronic device capable of suppressing malfunction of a semiconductor chip.SOLUTION: A semiconductor device includes a heat sink 12, a semiconductor chip 13 arranged on the heat sink 12, bus bars 23, 24 electrically connected to the semiconductor chip 13, a wiring member 30 having connection wiring parts 31, 32 connecting the semiconductor chip 13 and the bus bars 23, 24, and sealing members 14, 16, 22 sealing the heat sink 12, the semiconductor chip 13, and a part of the bus bars 23, 24.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to electronic devices. [Background technology]

[0002] Conventionally, electronic devices in which bus bars are connected to semiconductor chips have been proposed (see, for example, Patent Document 1). Specifically, these electronic devices have a conductive lid, and a recess is formed by bending the lid. In these electronic devices, a semiconductor chip is placed in the recess, and the bus bars are connected to the semiconductor chip via the lid. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-25159 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the electronic device, the conductive lid and bus bar are exposed. Therefore, the lid and bus bar of the electronic device may be susceptible to external potential. For example, when the electronic device is placed together with another circuit board, the exposed lid and bus bar may cause the potential of the lid and bus bar to change due to the influence of current flowing through the other circuit board. Therefore, in the electronic device, the semiconductor chip may malfunction.

[0005] The present disclosure aims to provide an electronic device that can prevent malfunction of a semiconductor chip. [Means for solving the problem]

[0006] According to one aspect of the present disclosure, an electronic device includes a heat sink (12), a semiconductor chip (13) arranged on the heat sink, bus bars (23, 24) electrically connected to the semiconductor chip, a wiring member (30) having connection wiring portions (31, 32) connecting the semiconductor chip and the bus bar, and sealing members (14, 16, 22) that seal the heat sink, the semiconductor chip, and a portion of the bus bar.

[0007] According to this, the heat sink and a portion of the bus bar are sealed with the sealing member, which makes the portion sealed with the sealing member less susceptible to the influence of external potential, thereby preventing malfunction of the semiconductor chip.

[0008] The reference symbols in parentheses attached to each component indicate an example of the correspondence between the component and the specific components described in the embodiments described below. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a cross-sectional view of an electronic device according to a first embodiment. [Figure 2] FIG. 10 is a cross-sectional view of an electronic device according to a second embodiment. [Figure 3] FIG. 10 is a cross-sectional view of an electronic device according to a third embodiment. [Figure 4] FIG. 10 is a cross-sectional view of an electronic device according to a fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In the following embodiments, identical or equivalent parts will be denoted by the same reference numerals.

[0011] (First embodiment) A first embodiment will be described with reference to the drawings. The electronic device of this embodiment is preferably mounted on a vehicle, for example, and used to control electronic components mounted on the vehicle.

[0012] As shown in FIG. 1, the electronic device of this embodiment is configured to include a chip module 10, a bus bar module 20, a wiring member 30, a control board 60, and the like.

[0013] The chip module 10 comprises an insulating heat dissipation sheet 11, a heat sink 12, a semiconductor chip 13, a chip sealing member 14, and the like.

[0014] The insulating heat dissipation sheet 11 is made of epoxy resin containing a filler or the like having a higher thermal conductivity than the epoxy resin, and is plate-shaped with one side 11a and another side 11b opposite to the first side 11a. The heat sink 12 is made of, for example, copper, and is block-shaped with one side 12a and another side 12b opposite to the first side 12a. A mounting recess 121 is formed on the first side 12a of the heat sink 12, and the other side 12b is bonded to the first side 11a of the insulating heat dissipation sheet 11. In this embodiment, the heat sink 12 and the insulating heat dissipation sheet 11 are bonded by heat pressing or the like, but they may also be bonded via a bonding member or the like having a high thermal conductivity.

[0015] The semiconductor chip 13 is configured by forming semiconductor elements such as switching elements such as MOSFET elements and IGBT elements, and freewheeling diode elements, etc. Note that MOSFET is an abbreviation for Metal Oxide Semiconductor Field Effect Transistor, and IGBT is an abbreviation for Insulated Gate Bipolar Transistor.

[0016] In this embodiment, the semiconductor chip 13 has a first electrode 131 and a control electrode (i.e., gate electrode) 13 formed on one surface 13a, and a second electrode 132 formed on the other surface 13b, forming a vertical semiconductor element in which a current flows between the first electrode 131 and the second electrode 132 by controlling the voltage applied to the control electrode 133. The semiconductor chip 13 is then disposed in the mounting recess 121 of the heat sink 12 such that the second electrode 132 is joined to the heat sink 12 via a conductive joining member 15. The joining member 15 is made of, for example, solder or sintered silver.

[0017] The chip sealing member 14 is disposed on the insulating heat dissipation sheet 11 so as to seal the semiconductor chip 13 and the heat sink 12. In this embodiment, the chip sealing member 14 is formed by laminating multiple film members made of resin such as prepreg, and integrating them by applying heat and pressure.

[0018] The chip sealing member 14 is formed with a first electrode via hole 141a exposing the first electrode 131, a heat sink via hole 142a exposing the heat sink 12, and a control electrode via hole 143a exposing the control electrode 133. A first electrode via 141b is arranged in the first electrode via hole 141a, a heat sink via 142b is arranged in the heat sink via hole 142a, and a control electrode via 143b is arranged in the control electrode via hole 143a. A plurality of each of the via holes 141a to 143a may be formed as needed. Each of the vias 141b to 143b is formed of, for example, a copper via.

[0019] A first chip wiring portion 151, a second chip wiring portion 152, and a chip control wiring portion 153 are formed on the chip sealing member 14. Specifically, the first chip wiring portion 151 is arranged so as to be connected to the first electrode 131 through the first electrode via 141b. The second chip wiring portion 152 is arranged so as to be connected to the heat sink 12 through the heat sink via 142b. As a result, the second chip wiring portion 152 is connected to the second electrode 132 via the heat sink 12. In other words, the heat sink via 142b in this embodiment can also be referred to as a second electrode via. The chip control wiring portion 153 is arranged so as to be connected to the control electrode 133 through the control electrode via 143b. The first chip wiring portion 151, the second chip wiring portion 152, and the chip control wiring portion 153 are made of aluminum wiring, copper wiring, or the like.

[0020] The bus bar module 20 is configured to include a heat sink 21, a bus bar sealing member 22, a first bus bar 23, a second bus bar 24, and the like.

[0021] The heat sink 21 is plate-shaped and has a surface dimension larger than that of the chip module 10. The heat sink 21 has one surface 21a and another surface 21b opposite to the one surface 21a. The bus bar sealing member 22 is disposed on the heat sink 21 and is made of a molded resin or a film material similar to that of the chip sealing member 14. Hereinafter, in this embodiment, the surface of the bus bar sealing member 22 opposite to the heat sink 21 side is also referred to as the first surface 22a. The bus bar sealing member 22 has an opening 221 formed therein so as to expose a substantially central portion of the one surface 21a of the heat sink 21 from the one surface 22a side. Specifically, the opening 221 is sized to accommodate the chip module 10. The bus bar sealing member 22 has a thickness substantially equal to that of the chip module 10.

[0022] The first bus bar 23 and the second bus bar 24 each have a substantially L-shaped cross section, one end 23a and the other end 23b, and are arranged sealed in the bus bar sealing member 22. In this embodiment, the first bus bar 23 and the second bus bar 24 are arranged in opposing portions of the bus bar sealing member 22, sandwiching the opening 221 therebetween. The first bus bar 23 and the second bus bar 24 are arranged in the bus bar sealing member 22 such that the one end portions 23a, 24a and the other end portions 23b, 24b are exposed from the bus bar sealing member 22. In other words, the first bus bar 23 and the second bus bar 24 are partially sealed in the bus bar sealing member 22.

[0023] Specifically, the first bus bar 23 and the second bus bar 24 are arranged such that one end 23a, 24a is exposed from one surface 22a of the bus bar sealing member 22. The first bus bar 23 and the second bus bar 24 are arranged in the bus bar sealing member 22 such that the other end 23b, 24b reaches a portion that will be the periphery in the planar direction of the wiring member 30, which will be described later. In other words, the shapes of the first bus bar 23 and the second bus bar 24 are adjusted so that the other end 23b, 24b is located around the wiring member 30, which will be described later. The first bus bar 23 and the second bus bar 24 are arranged so as not to contact the heat sink 21. The other end 23b, 24b of the first bus bar 23 and the second bus bar 24 function as external terminals to be connected to other circuits, etc. In this embodiment, the heat sink 21, the first bus bar 23, and the second bus bar 24 are configured using lead frames made of copper, etc.

[0024] The wiring member 30 is configured as a printed circuit board or the like having a first connection wiring portion 31, a second connection wiring portion 32, a connection control wiring portion 33, a wiring portion sealing member 34, etc. The first connection wiring portion 31 and the second connection wiring portion 32 are configured as a copper plate or the like. Furthermore, the wiring portion sealing member 34 constituting the printed circuit board of this embodiment is configured by disposing glass cloth within a resin material such as epoxy resin or polyimide resin. The wiring member 30 has a substantially rectangular parallelepiped shape having one surface 30a and the other surface 30b, and is configured so that the first connection wiring portion 31 and the second connection wiring portion 32 are exposed from the other surface 30b. In other words, the wiring portion sealing member 34 is arranged to seal the first connection wiring portion 31 and the second connection wiring portion 32 while exposing portions of the first connection wiring portion 31 and the second connection wiring portion 32. Furthermore, the connection control wiring portion 33 is arranged to penetrate between the one surface 30a and the other surface 30b.

[0025] The control board 60 includes a control circuit that generates a control voltage to be applied to the control electrode 133, and processing circuits such as a protection circuit that includes a capacitor, a resistor, and the like.

[0026] The electronic device of this embodiment is configured as follows: That is, chip module 10 is arranged so that insulating heat dissipation sheet 11 and heat dissipation plate 21 are joined in opening 221 of busbar module 20. Note that insulating heat dissipation sheet 11 and heat dissipation plate 21 may be joined by heat pressing or the like, or may be joined via a joining member or the like having high thermal conductivity.

[0027] The wiring member 30 is arranged such that the first connection wiring portion 31 is connected to the first chip wiring portion 151 via the first joint member 51, and the first connection wiring portion 31 is connected to the first bus bar 23 via the fourth joint member 54. The wiring member 30 is also arranged such that the second connection wiring portion 32 is connected to the second chip wiring portion 152 via the second joint member 52, and the second connection wiring portion 32 is connected to the second bus bar 24 via the fifth joint member 55. The wiring member 30 is arranged such that the connection control wiring portion 33 exposed from the other surface 30b is connected to the chip control wiring portion 153 via the third joint member 53. The first to fifth joint members 51 to 55 are formed of, for example, solder or a sintered silver body.

[0028] The control board 60 is arranged so as to be connected to the connection control wiring portion 33 exposed from the one surface 30a side of the wiring member 30 via a joining member 71. The joining member 71 is made of, for example, solder or sintered silver.

[0029] The above is the electronic device of this embodiment. In use, such an electronic device is connected to the cooling member 70 via the connecting member 80 at the other surface 21b of the heat sink 21. In such an electronic device, a current flows between the first bus bar 23 and the second bus bar 24 via the first connection wiring portion 31, the semiconductor chip 13, and the second connection wiring portion 32 by adjusting the control voltage applied to the control electrode 133 from the control board 60. In addition, in such an electronic device, heat generated in the semiconductor chip 13 is transferred to the cooling member 70 via the heat sink 12 and the heat sink 21. The connecting member 80 is made of, for example, solder or a silver sintered body, and the cooling member 70 is made of, for example, a metal housing.

[0030] According to the present embodiment described above, the heat sink 12 is sealed with the chip sealing member 14, and portions of the first and second bus bars 23, 24 are sealed with the bus bar sealing member 22. Therefore, the portions sealed with the chip sealing member 14 and the bus bar sealing member 22 are less susceptible to the influence of external potentials. This makes it possible to prevent the semiconductor chip 13 from malfunctioning.

[0031] (1) In this embodiment, the chip module 10 and the bus bar module 20 are provided as separate components. Therefore, when making a design change to the semiconductor chip 13, the heat sink 12, the heat sink 21, the first bus bar 23, the second bus bar 24, etc., it is sufficient to make a design change to the module that includes the components to be changed. Therefore, it is easier to accommodate design changes compared to when the semiconductor chip 13, the heat sink 12, the heat sink 21, the first bus bar 23, the second bus bar 24, etc. are integrated.

[0032] (2) In this embodiment, the chip module 10 is disposed in the opening 221 formed in the bus bar module 20. Therefore, compared to when the chip module 10 is disposed on the bus bar module 20, for example, it is possible to prevent the electronic device from becoming larger in size in the thickness direction.

[0033] (3) In this embodiment, the wiring portions connected to the chip module 10 and through which current mainly flows are the first connection wiring portion 31, the second connection wiring portion 32, the first bus bar 23, and the second bus bar 24, and are made of a lead frame, a copper plate, etc. Therefore, for example, compared to when the wiring portions connected to the chip module 10 are formed by plating, etc., it is easier to increase the thickness and to handle large currents.

[0034] (Second embodiment) A second embodiment will be described. This embodiment differs from the first embodiment in that it does not have the control board 60. As the rest of the configuration is the same as the first embodiment, a description thereof will be omitted here.

[0035] In this embodiment, as shown in FIG. 2 , the wiring member 30 has a third connection wiring portion 35 connected to the first connection wiring portion 31 and arranged so as to be exposed from the first surface 30a. Instead of the control board 60, a control circuit chip 61 is arranged on the first surface 30a of the wiring member 30 via a bonding member 72, and the control circuit chip 61 has a control circuit for generating a control voltage to be applied to the control electrode 133. The control circuit chip 61 is connected to the connection control wiring portion 33 via a bonding member 72. The first surface 30a of the wiring member 30 also has a protection circuit chip 62, which has a protection circuit including a capacitor, a resistor, and the like, and is arranged via a bonding member 73, and the protection circuit chip 62 is connected to the third connection wiring portion 35. The bonding members 72 and 73 are made of, for example, solder or a silver sintered body. Alternatively, or in addition to the protection circuit chip 62, a circuit chip performing another process may be arranged as appropriate.

[0036] According to the present embodiment described above, the heat sink 12 is sealed with the chip sealing member 14, and portions of the first and second bus bars 23, 24 are sealed with the bus bar sealing member 22. Therefore, the same effects as those of the first embodiment can be obtained.

[0037] (1) In this embodiment, the control board 60 is not provided, and the control circuit chip 61 and the protection circuit chip 62 are provided as separate components. Therefore, when changing the design of either the control circuit chip 61 or the protection circuit chip 62, it is only necessary to change the configuration of the chip whose design is to be changed. Therefore, compared to the first embodiment, it is easier to accommodate design changes.

[0038] (Third embodiment) A third embodiment will be described. In this embodiment, the chip module 10 and the bus bar module 20 are integrated into one body, unlike the first embodiment. As the rest of the configuration is the same as the first embodiment, a description thereof will be omitted here.

[0039] 3, the heat sink 12, the semiconductor chip 13, the first bus bar 23, and the second bus bar 24 are sealed with the same sealing member 16. That is, in this embodiment, the chip module 10 and the bus bar module 20 are integrated. Furthermore, the insulating heat dissipation sheet 11 of this embodiment is also disposed between the first bus bar 23 and the second bus bar 24 and the heat dissipation plate 21, and is also joined to the first bus bar 23 and the second bus bar 24.

[0040] According to the present embodiment described above, the heat sink 12 and parts of the first and second bus bars 23 and 24 are sealed with the sealing member 16. Therefore, the same effects as those of the first embodiment can be obtained.

[0041] (1) In this embodiment, the heat sink 12, the semiconductor chip 13, the first bus bar 23, and the second bus bar 24 are sealed with the same sealing member 16. This reduces the number of parts and simplifies the manufacturing process.

[0042] (Fourth embodiment) A fourth embodiment will be described. This embodiment is different from the first embodiment in that the configuration of the wiring member 30 is changed. As the rest of the configuration is the same as the first embodiment, a description thereof will be omitted here.

[0043] The electronic device of this embodiment has a configuration basically similar to that of the first embodiment, as shown in Fig. 4. However, in the wiring member 30 of this embodiment, the first connection wiring portion 31, the second connection wiring portion 32, and the connection control wiring portion 33 are sealed with a sealing member 36 made of molded resin. Note that the sealing member 36 of this embodiment is made of molded resin and does not contain glass cloth.

[0044] Such wiring member 30 is manufactured by first arranging first connection wiring portion 31 so as to be connected to first chip wiring portion 151 and first bus bar 23, and second connection wiring portion 32 so as to be connected to second chip wiring portion 152 and second bus bar 24. Furthermore, connection control wiring portion 33 is arranged so as to be connected to chip control wiring portion 153. Thereafter, sealing member 36 made of mold resin is arranged, thereby manufacturing the wiring member.

[0045] According to the present embodiment described above, the heat sink 12 is sealed with the chip sealing member 14, and portions of the first and second bus bars 23, 24 are sealed with the bus bar sealing member 22. Therefore, the same effects as those of the first embodiment can be obtained.

[0046] (1) In this embodiment, the sealing member 36 is made of molded resin and does not contain glass cloth. This simplifies the structure of the wiring member 30, thereby reducing costs.

[0047] (Other embodiments) Although the present disclosure has been described with reference to the embodiments, it is understood that the present disclosure is not limited to the embodiments or structures. The present disclosure also encompasses various modifications and modifications within the scope of equivalents. In addition, various combinations and forms, as well as other combinations and forms including only one element, more than one element, or less than one element, are also within the scope and spirit of the present disclosure.

[0048] For example, in each of the above embodiments, the electronic device has been described as having one semiconductor chip 13. However, the electronic device may have a configuration including a plurality of semiconductor chips 13.

[0049] In the above embodiments, an example has been described in which the semiconductor chip 13 is configured by forming a vertical semiconductor element that allows current to flow in the thickness direction between the one surface 13a and the other surface 13b. However, the semiconductor chip 13 may be configured by forming a horizontal semiconductor element that allows current to flow in the surface direction. In this case, since the second electrode 132 is arranged on the one surface 13a of the semiconductor chip 13, the heat sink via 142b is arranged so as to be directly connected to the second electrode 132. The semiconductor chip 13 may also be configured by forming a diode element or the like.

[0050] The above embodiments can also be combined as appropriate. For example, the second embodiment can be combined with the third and fourth embodiments, and the control circuit chip 61 and the protection circuit chip 62 can be provided as separate components instead of the control board 60. The third embodiment can be combined with the fourth embodiment, and the chip module 10 and the busbar module 20 can be integrated. [Explanation of symbols]

[0051] 12 Heat sink 13 Semiconductor chips 14, 16, 22 Sealing member 23, 24 Bus Bar 30 Wiring materials 31~33 Connection wiring section

Claims

1. 1. An electronic device comprising: a heat sink (12); a semiconductor chip (13) disposed on the heat sink; bus bars (23, 24) electrically connected to the semiconductor chip; a wiring member (30) having connection wiring portions (31, 32) that connect the semiconductor chip and the bus bar; and a sealing member (14, 16, 22) that seals the heat sink, the semiconductor chip, and a portion of the bus bar.

2. a busbar module (20) in which the busbar is sealed in a busbar sealing member (22) as the sealing member; a chip module (10) in which the semiconductor chip and the heat sink are sealed in a chip sealing member (14) as the sealing member, An opening (221) is formed in the bus bar sealing member, The electronic device of claim 1 , wherein the chip module is disposed within the opening.

3. The electronic device according to claim 1 , wherein the bus bar is arranged in a direction intersecting a mounting direction of the heat sink and the semiconductor chip.

4. 2. The electronic device according to claim 1, wherein a control board (60) is disposed on the wiring member, the control board being connected to the semiconductor chip and having a processing circuit including a control circuit for controlling the operation of the semiconductor chip.

5. The electronic device according to claim 1, wherein the wiring member is provided with a control circuit chip (61) connected to the semiconductor chip and having a control circuit formed thereon for controlling the operation of the semiconductor chip, and a circuit chip (62) for performing predetermined processing, separately.

6. The electronic device according to claim 1 , wherein the heat sink, the semiconductor chip, and the bus bar are sealed in the same sealing member (16).

7. 7. The electronic device according to claim 1, wherein the wiring member is made of a molded resin and includes a sealing member (36) that seals the connection wiring portion while leaving a portion of the connection wiring portion exposed.

Images