Substrate supporting apparatus

Abstract

To guide a substrate to a predetermined position and support the substrate at the predetermined position even when the substrate is placed at a position deviated from the predetermined position.SOLUTION: A substrate support device 1 includes a plurality of supports 11 capable of supporting a substrate S at a predetermined substrate support position Q, and each of the supports 11 has at least one contact surface 15 capable of supporting the substrate S in contact with a side surface Sc of the substrate S. While the support body 11 rotates about the rotation axis B, the contact surface 15 reaches the support position 10a where the substrate S is supported from the upper position R1 located above the support surface R2, and the support body 11 moves from the upper position R1 to the support position R2, at least one contact surface 15 guides the substrate S to the substrate support position Q while being in contact with the substrate S placed at a position shifted from the substrate support position Q.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a substrate support apparatus for supporting a substrate, and more particularly to a substrate support apparatus used in a substrate processing apparatus such as an ion implantation apparatus. [Background technology]

[0002] Ion implantation devices used in semiconductor manufacturing processes and the like generally include a substrate support device that supports a substrate within a processing chamber. One example of such a substrate support device is an electrostatic chuck equipped with a mechanical clamp, as disclosed in Patent Document 1. This electrostatic chuck electrostatically attracts a substrate placed on a clamping surface and also holds the substrate by the mechanical clamp. Therefore, this electrostatic chuck can hold a substrate even when the electrostatic attracting force is insufficient.

[0003] The electrostatic chuck rotates between a horizontal position, in which the clamping surface is oriented horizontally when the substrate is placed on the clamping surface, and a non-horizontal position, in which the substrate secured to the clamping surface is oriented toward the ion beam. The electrostatic chuck can also secure the substrate in the non-horizontal position using only the mechanical clamp. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] U.S. Patent No. 8,941,968 Summary of the Invention [Problem to be solved by the invention]

[0005] The electrostatic chuck in Patent Document 1 has multiple mechanical clamps arranged around a clamping surface, and each mechanical clamp rotates about a predetermined rotation axis and presses the substrate from the outside to hold the substrate in a predetermined position. However, because each mechanical clamp rotates in a direction to lift the substrate, if the substrate is placed off-center on the clamping surface, it is expected that the substrate will be fixed in a lifted state by the mechanical clamps. That is, with the electrostatic chuck of Patent Document 1, if the substrate is placed at a position displaced from a predetermined position on the clamping surface, the substrate cannot be reliably held at the predetermined position.

[0006] The present invention solves the above problem and aims to provide a substrate support device that can guide a substrate to a predetermined position and support the substrate in the predetermined position even if the substrate is placed in a position that is shifted from the predetermined position. [Means for solving the problem]

[0007] The substrate support device of the present invention comprises a support table having a support surface on which a disk-shaped substrate is placed, and which rotates to change the orientation of the support surface, thereby changing from a loading position in which the substrate is placed on the support surface to a processing position in which a predetermined processing is performed on the surface of the substrate to be processed; and a plurality of supports which, when the support table is in the processing position, can support the substrate at a predetermined substrate support position on the support surface, wherein each of the plurality of supports has at least one contact surface which can contact a side of the substrate to support the substrate, and each of the plurality of supports rotates about a predetermined rotation axis, and moves from an upper position where the contact surface is located above the support surface, such that the contact surface moves toward the support surface, to reach a support position where the substrate is supported, and while the plurality of supports move from the upper position to the support position, at least one of the contact surface contacts the substrate, which is placed at a position offset from the substrate support position on the support surface, and guides the substrate to the substrate support position.

[0008] According to this configuration, when the substrate is placed at a position deviated from the predetermined substrate support position, at least one contact surface comes into contact with the substrate while the plurality of supports move from their upper positions to their support positions, guiding the substrate to the predetermined substrate support position. In other words, when the substrate is placed at a position deviated from the predetermined substrate support position, at least one contact surface moves from above the substrate toward the substrate side, guiding the substrate to the predetermined substrate support position. Therefore, even if the substrate is placed at a position displaced from the predetermined substrate supporting position, the substrate supporting device of the present invention can reliably guide the substrate to the substrate supporting position without lifting it. Furthermore, in the substrate support device of the present invention, the multiple supports support the substrate at a predetermined substrate support position even when the support table is in a processing posture. That is, in a substrate processing apparatus using the substrate support device of the present invention, even if the substrate is placed at a position displaced from the substrate support position, the multiple supports guide and support the substrate to the substrate support position, and then the support table assumes the processing posture, so that the substrate can be processed while supported at the predetermined substrate support position.

[0009] Furthermore, the substrate support device of the present invention may be configured so that the contact surfaces are arranged so that the center of the substrate placed at the substrate support position is within any of the triangular areas formed by connecting the three points where each of the contact surfaces contacts the side surface.

[0010] According to this configuration, the substrate support device can guide the substrate to the substrate support position and support it at the substrate support position, even if the substrate is placed in any direction displaced from the predetermined substrate support position on the support surface.

[0011] Furthermore, the substrate support device of the present invention may be configured so that at least one of the contact surfaces contacts the substrate in each of four regions of the substrate separated by a first line that passes through the center of the substrate placed at the substrate support position and is parallel to the horizontal direction when the support table is in the processing posture, and a second line that passes through the center and is perpendicular to the first line.

[0012] According to this configuration, the substrate support device can guide the substrate to the substrate support position and support it at the substrate support position, even if the substrate is placed in any direction displaced from the predetermined substrate support position on the support surface.

[0013] Furthermore, the substrate support device of the present invention may be configured so that the substrate has a cutout portion, and the plurality of contact surfaces come into contact with the substrate in at least one region of the four regions.

[0014] When the substrate support position is changed, one contact surface in one of the four regions may not be able to contact the substrate depending on the position of the notch in the substrate. In contrast, with this configuration, the other contact portion in the one region can contact the substrate S. Therefore, even if the substrate has a notch and the substrate support position is changed, the substrate placed at the substrate support position can be guided to the substrate support position and supported.

[0015] Furthermore, the substrate support device of the present invention may be configured to further include at least one regulating member positioned above the processing surface and regulating movement of the substrate when the substrate is positioned at the substrate support position.

[0016] Furthermore, the substrate support device of the present invention may be configured so that the regulating member is positioned above the surface to be processed at the same time as the plurality of supports reach the support position or after the plurality of supports reach the support position.

[0017] According to this configuration, the regulating member is positioned above the processing surface simultaneously with or after the multiple supports reach the support positions. In other words, the regulating member is positioned above the processing surface simultaneously with or after the support members position the substrate at the predetermined substrate support position. Therefore, the regulating member does not need to be configured with consideration given to the substrate being positioned at a position offset from the predetermined substrate support position, and therefore the area covering above the substrate can be reduced. As a result, for example, when processing is performed by irradiating the substrate with an ion beam, the area of ​​the processing surface of the substrate that is not processed due to the ion beam being blocked by the regulating member can be reduced.

[0018] The substrate support device of the present invention may be configured such that the regulating member is in contact with the surface to be processed when the regulating member is positioned above the surface to be processed.

[0019] The substrate support device of the present invention may be configured such that the regulating member is spaced apart from the surface to be processed when the regulating member is located at the regulating position.

[0020] The substrate supporting device of the present invention may be configured such that at least one of the regulating members rotates integrally with at least one of the supporting members about the rotation axis.

[0021] In the substrate supporting device of the present invention, the support table may be configured as an electrostatic chuck that electrostatically attracts the substrate to the support surface. [Effects of the Invention]

[0022] According to the substrate support device of the present invention, even if the substrate is placed at a position displaced from the predetermined substrate support position, the substrate can be guided to the substrate support position and supported at the substrate support position. [Brief explanation of the drawings]

[0023] [Figure 1]1 is a schematic diagram of a substrate supporting apparatus and a substrate processing apparatus according to an embodiment of the present invention; [Figure 2] FIG. 2 is a schematic side view of the substrate supporting device in the embodiment, showing a state in which the support is in an upper position. [Figure 3] FIG. 2 is a schematic side view of the substrate supporting device in the embodiment, showing a state in which the support is at a supporting position. [Figure 4] FIG. 2 is a front view of the substrate supporting device in the embodiment, showing a state in which the support body is located at an upper position. [Figure 5] FIG. 2 is a front view of the substrate supporting device in the embodiment, showing a state in which the support body is located at a supporting position. [Figure 6] FIG. [Figure 7] FIG. 10 is a plan view of the substrate supporting device according to the embodiment, showing a state in which the predetermined substrate supporting position has been changed. [Figure 8] FIG. 10 is a schematic side view of a substrate supporting apparatus showing a first modified example of the embodiment. [Figure 9] FIG. 10 is a plan view of a substrate supporting apparatus showing a second modified example of the embodiment. [Figure 10] FIG. 10 is a plan view of a substrate supporting apparatus showing a third modified example of the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0024] A description will be given of a substrate support apparatus 1 according to a first embodiment of the present invention and a substrate processing apparatus 100 that uses the substrate support apparatus 1. Note that Figures 1 to 10 are created for the purpose of understanding the present invention, and the shapes, length dimension ratios, and scale ratios of the components in the figures do not necessarily match.

[0025] FIG. 1 is a schematic diagram showing a substrate supporting apparatus 1 and a substrate processing apparatus 100 including the substrate supporting apparatus 1 according to this embodiment. 1, the substrate processing apparatus 100 in this embodiment is an ion beam irradiation apparatus that irradiates an ion beam IB onto a disk-shaped substrate S. The substrate S in this embodiment is a wafer having a processing surface Sa that is irradiated with the ion beam IB.

[0026] The ion beam irradiation apparatus shown in this embodiment is an example of a substrate processing apparatus 100 that uses the substrate support apparatus 1, and the substrate processing apparatus 100 is not limited to an ion beam irradiation apparatus. In other words, the substrate support apparatus 1 is not limited to being used in an ion beam irradiation apparatus.

[0027] Furthermore, the wafer shown in this embodiment is an example of the substrate S, and the substrate S is not limited to a wafer. That is, the substrate processing apparatus 100 may be any apparatus that performs a predetermined process on the processing target surface Sa of the substrate S. Furthermore, the substrate S may be any apparatus that has a processing target surface Sa on which the predetermined process is performed.

[0028] The substrate processing apparatus 100 includes an ion source 101 that generates plasma from a raw material gas, and a mass analysis magnet 102 that mass-separates an ion beam IB extracted from the ion source 101. The substrate processing apparatus 100 also includes a processing chamber 103 in which the ion beam IB is irradiated onto a substrate S. The ion beam IB that has passed through the mass analysis magnet 102 is guided into the processing chamber 103. A substrate support device 1 that supports the substrate S is disposed in the processing chamber 103.

[0029] The X-axis, Y-axis, and Z-axis shown in each drawing are perpendicular to one another, and the Y-axis shown in each drawing is parallel to the height direction of the substrate support device 1. The Z-axis shown in each drawing is parallel to the traveling direction of the ion beam IB introduced into the processing chamber 103. The substrate S, supported by the substrate support device 1, is transported back and forth multiple times along the X-axis within the processing chamber 103 so as to cross the ion beam IB.

[0030] The substrate support device 1 includes a support table 10 having a circular support surface 10a on which a substrate S is placed. The support table 10 is configured to be rotatable within a predetermined range around a predetermined support table rotation axis A shown in FIG.

[0031] The support table 10 rotates about the support table rotation axis A so as to change the orientation of the support surface 10a, thereby changing from a loading position P1, which is the position when the substrate S is loaded on the support surface 10a, to a processing position P2, which is the position when a predetermined process is performed on the processing surface Sa. In this embodiment, the predetermined process performed on the processing surface Sa is an ion beam irradiation process, such as an ion implantation process.

[0032] The substrate S has a processing surface Sa that is generally circular, and has a notch Sb that defines the processing surface Sa as a circle with a portion thereof cut out. In this embodiment, the notch Sb is an oriental flat, but is not limited thereto. The notch Sb may also be, for example, a notch.

[0033] The substrate S may be a plate material having a generally circular surface Sa, and may have a generally circular overall shape. The surface Sa may have a partially cut-out shape as in the present embodiment, or may have a curved shape in the thickness direction of the substrate S.

[0034] 1, the support table 10 is shown by a broken line as it moves parallel to the X-axis while supporting the substrate S after changing from the placement posture P1 to the processing posture P2, and crosses the ion beam IB. Also, in FIG. 1, the support table 10 is shown by a solid line as it is in a position when the substrate S is placed on the support table 10. The operation of changing the orientation of the surface to be processed Sa by changing the support table 10 from the placement posture P1 to the processing posture P2 is performed at the position when the substrate S is placed on the support table 10.

[0035] The substrate support device 1 is provided with a plurality of supports 11 that can support the substrate S at a predetermined substrate support position Q on the support surface 10a when the support table 10 is in the processing posture P2. The number of supports 11 is not limited to a specific number, but the substrate support device 1 of this embodiment is provided with two supports 11.

[0036] When a predetermined process is performed on the substrate S, that is, when the substrate support device 1 is in the position shown by the dashed line in Fig. 1, the support table 10 is in a processing posture P2, and the processing surface Sa of the substrate S is directed toward the ion beam IB. Even in this state, the substrate S is supported at the substrate support position Q by the two supports 11.

[0037] That is, while the processing surface Sa is being irradiated with the ion beam IB, the substrate S is always supported at the substrate support position Q by the two supports 11. The substrate support position Q is a relative position with respect to the support surface 10a, and in Fig. 1, the substrate support position Q in this embodiment is indicated by a dashed line. Hereinafter, one of the two supports 11 provided in the substrate support device 1 may be referred to as a first support 11A, and the other as a second support 11B.

[0038] Fig. 2 is a schematic side view of the substrate support apparatus 1 showing a state in which each support 11 in this embodiment is at an upper position R1 (described later), and Fig. 4 is a schematic side view of the substrate support apparatus 1 showing a state in which each support 11 in this embodiment is at a support position R2 (described later).

[0039] 2 and 3, each support 11 is fixed to the support base 10 outside the support surface 10a so as to be rotatable within a predetermined range around a rotation axis B, which will be described later. In this embodiment, the first support 11A and the second support 11B are disposed outside the support surface 10a so as to face each other with the support surface 10a in between.

[0040] Each support 11 is provided with a shaft member 16 that is disposed inside the support 11 and to which a driving force generated by a motor (not shown) is transmitted. In Figures 2 and 3, the shaft member 16 is indicated by a dashed line.

[0041] Each support 11 is configured to rotate within a predetermined range about a rotation axis B defined by the shaft member 16 when a driving force from a motor (not shown) is transmitted to the shaft member 16. In FIG. 1, the rotation axis B is indicated by a dashed line. Each shaft member 16 is disposed parallel to the support surface 10a. In other words, the rotation axis B defined by each shaft member 16 is parallel to the support surface 10a.

[0042] Hereinafter, the rotation axis B of the first support 11A may be referred to as the first rotation axis B1, and the rotation axis B of the second support 11B may be referred to as the second rotation axis B2. Also, the shaft member 16 provided on the first support 11A may be referred to as the first shaft member 16a, and the shaft member 16 provided on the second support 11B may be referred to as the second shaft member 16b.

[0043] Each support 11 moves from an upper position R1 shown in Fig. 2 to a support position R2 shown in Fig. 3 by rotating about a rotation axis B. Each shaft member 16, i.e., the first shaft member 16a and the second shaft member 16b, is positioned outside the substrate S in the radial direction of the substrate S positioned at the substrate support position Q. Therefore, each support 11 rotates within a predetermined range around the rotation axis B, which is positioned outside the substrate S in the radial direction of the substrate S positioned at the substrate support position Q, and moves from the upper position R1 to the support position R2.

[0044] In this embodiment, each support 11 is configured to start its rotation about the rotation axis B from the upper position R1, but the position at which each support 11 starts its rotation about the rotation axis B is not limited to the upper position R1. Each support 11 may be configured to reach the support position R2 via the upper position R1.

[0045] Each support 11 has a plurality of support members 12 that support the substrate S at a predetermined substrate support position Q when the support 11 is located at support position R2. Each support 11 also has a plurality of regulating members 13 that are positioned above the processing surface Sa in the thickness direction of the substrate S and regulate the movement of the substrate S when the support 11 is located at support position R2 and the substrate S is located at substrate support position Q.

[0046] Each support 11 in this embodiment has four support members 12 and four regulating members 13, but Figures 2 and 3 show only one of these support members 12 and one of these regulating members 13. The number of support members 12 and the number of regulating members 13 included in each support 11 are not limited to a specific number. The number of regulating members 13 and the positions at which the regulating members 13 are arranged may be changed depending on the expected movement of the substrate S, and the substrate support device 1 only needs to be equipped with at least one regulating member 13.

[0047] Each support 11 has a base 14 that connects multiple support members 12 and multiple regulating members 13. In this embodiment, each support 11 is formed by integrally molding four support members 12, four regulating members 13, and base 14. Hereinafter, the base 14 of the first support 11A may be referred to as the first base 14a, and the base 14 of the second support 11B may be referred to as the second base 14b. Note that each support 11 may be configured such that, for example, each support member 12, each regulating member 13, and base 14 are formed separately and then assembled.

[0048] In this embodiment, each of the support members 12 is columnar, and has a height dimension greater than the thickness dimension of the substrate S. Furthermore, when the support 11 is positioned at support position R2, each of the support members 12 has a contact surface 15 that can contact the side surface Sc of the substrate S positioned at the substrate support position Q and support the substrate S. Note that, since each support 11 has four support members 12, each support 11 can be considered to have four contact surfaces 15.

[0049] The substrate S that is carried into the processing chamber 103 is placed on the support surface 10a by a robot (not shown), but may be placed at a position that is shifted from the predetermined substrate support position Q. Figure 2 shows a state in which the substrate S is placed at a position that is shifted from the substrate support position Q indicated by the dashed line. Note that the substrate support position Q indicated by the dashed line in Figure 2 is slightly spaced from the support surface 10a, but this is to avoid overlap with the solid line indicating the substrate S; in reality, the substrate S located at the substrate support position Q is on the support surface 10a.

[0050] Even if the substrate S is placed in a state shifted from the substrate support position Q, the substrate support device 1 guides the substrate S to the predetermined substrate support position Q by moving at least one contact surface 15 in contact with the peripheral edge of the side surface Sc or back surface Sd of the substrate S as each support 11 moves from the upper position R1 to the support position R2.

[0051] The regulating members 13 regulate the movement of the substrate S positioned at the substrate support position Q. As shown in FIG. 3, in this embodiment, each regulating member 13 is configured to come into contact with the processing surface Sa of the substrate S when the support body 11 is positioned at the support position R2 and positioned above the processing surface Sa. In this embodiment, each regulating member 13 only comes into contact with the processing surface Sa, and is not intended to apply a pressing force that presses the substrate S toward the support surface 10a. Note that the substrate support device 1 may be configured so that at least one regulating member 13 applies the pressing force to the substrate S.

[0052] 2, when each support 11 is located at the upper position R1, each contact surface 15 is located above the support surface 10a. Note that the state in which the contact surface 15 is located above the support surface 10a refers to a state in which the area of ​​the contact surface 15 that comes into contact with the substrate S as the support 11 moves from the upper position R1 to the support position R2 is located above the support surface 10a. In other words, when the support 11 is located at the upper position R1, it is not necessary for the entire area of ​​the contact surface 15 to be above the support surface 10a.

[0053] Each of the two supports 11 rotates about a predetermined rotation axis B, and moves from an upper position R1 where each contact surface 15 is located above the support surface 10a, toward the support surface 10a, to reach a support position R2 where the contact surface 15 supports the substrate S. As each support 11 moves, each support member 12 also moves from above the substrate S placed on the support surface 10a toward the substrate S.

[0054] While the two supports 11 move from the upper position R1 to the support position R2, at least one contact surface 15 contacts the substrate S placed at a position shifted from the predetermined substrate support position Q on the support surface 10a, and guides the substrate S to the substrate support position Q.

[0055] If the support member 12 operates to move from below the substrate S placed on the support surface 10a toward the substrate S, and the substrate S is placed at a position displaced from the substrate support position Q, it is expected that the substrate S will be lifted by at least one contact surface 15. In this case, it is expected that the substrate S will ultimately be lifted by at least one contact surface 15, and that a portion of the substrate S will be supported by the support 11 in a state separated from the support surface 10a. In other words, if the support 11 is configured so that the contact surface 15 moves from below the support surface 10a toward above it, a situation will arise in which the substrate S cannot be supported at the predetermined substrate support position Q.

[0056] In contrast to this, in this embodiment, as the two supports 11 move from the upper position R1 to the support position R2, each contact surface 15 moves from above the substrate S placed on the support surface 10a toward the substrate S. Therefore, even if the substrate S is placed at a position displaced from the substrate support position Q, the substrate support device 1 can reliably guide the substrate S to the substrate support position Q without lifting it up.

[0057] Furthermore, in the substrate processing apparatus 100 using the substrate support apparatus 1, even when the support table 10 is in the processing posture P2, the multiple supports 11 support the substrate S at the predetermined substrate support position Q. In other words, even if the substrate S is placed at a position displaced from the substrate support position Q, the substrate processing apparatus 100 can process the substrate S while it is supported at the substrate support position Q by having the multiple supports 11 guide and support the substrate S to the substrate support position Q and then assume the processing posture P2.

[0058] 2 and 3, the substrate support device 1 is disposed inside the support table 10 and includes an electrode 10b for electrostatically attracting the substrate S to the support surface 10a. That is, the support table 10 in this embodiment is configured as an electrostatic chuck that electrostatically attracts the substrate S to the support surface 10a.

[0059] 1, in the substrate processing apparatus 100 of this embodiment, the substrate S is first carried into the processing chamber 103 from the outside and placed on the support surface 10a of the support table 10 in a placement orientation P1 by a robot (not shown). At this time, the supports 11 are located at the upper position R1 shown in FIG. 2, and the substrate S is placed on the support surface 10a without contacting the supports 11.

[0060] Thereafter, each support 11 rotates about a predetermined rotation axis B, thereby moving to a support position R2 shown in FIG.

[0061] When the substrate S is placed on the support surface 10a by a robot (not shown), the substrate S may be placed at a position displaced from the predetermined substrate support position Q. Even in such a case, as each support 11 moves from the upper position R1 to the support position R2, at least one contact surface 15 moves while contacting the substrate S, guiding the substrate S to the predetermined substrate support position Q.

[0062] In other words, the substrate S placed at a position displaced from the predetermined substrate support position Q moves on the support surface 10a while being pushed by at least one contact surface 15, and is guided to the substrate support position Q. More specifically, the contact surface 15 of at least one support member 12 moves in a manner to push the substrate S while contacting the peripheral edge of the side surface Sc or back surface Sd of the substrate S, and guides the substrate S to the predetermined substrate support position Q.

[0063] Furthermore, in this embodiment, each regulating member 13 is integrated with the support 11, and therefore, as the support 11 rotates about the rotation axis B, each regulating member 13 also rotates about the rotation axis B. Therefore, each regulating member 13 is positioned above the surface to be processed Sa at the same time that each support 11 reaches the support position R2.

[0064] The regulating member 13 does not need to be integrated with the support 11. The support 11 may be configured to operate independently of the support 11, and may be configured to operate so as to be positioned above the surface to be processed Sa simultaneously when each support 11 reaches the support position R2 or after each support 11 reaches the support position R2.

[0065] That is, each regulating member 13 may be configured to be positioned above the surface to be processed Sa simultaneously with or after the two supports 11 reach the support position R2. That is, each regulating member 13 may be configured to be positioned above the surface to be processed Sa simultaneously with or after the substrate S is positioned at the predetermined substrate support position Q.

[0066] If it is assumed that the substrate S will be supported in a position offset from the substrate support position Q, the regulating member 13 needs to be configured in a relatively large shape so that it can regulate the movement of the substrate S regardless of the position in which the substrate S is placed.

[0067] In contrast, the regulating member 13 of this embodiment does not need to be configured taking into consideration that the substrate S will be placed at a position displaced from the predetermined substrate support position Q. This makes it possible to reduce the area that the regulating member 13 covers above the substrate S. As a result, for example, while the substrate processing apparatus 100 is performing a process of irradiating the substrate S with the ion beam IB, it is possible to reduce the area of ​​the processing surface Sa that is not processed because the ion beam IB is blocked by the regulating member 13.

[0068] After the substrate S is supported at the substrate supporting position Q by the supports 11, a voltage is applied to the electrode 10b, and the substrate S is electrostatically attracted to the supporting surface 10a. In other words, the substrate S is supported at the substrate supporting position Q not only by the two supports 11 but also by the electrical force generated by applying a voltage to the electrode 10b.

[0069] 1, when the substrate S is supported at the substrate support position Q, the support table 10 rotates about the support table rotation axis A to assume a processing attitude P2, and the surface to be processed Sa is directed toward the ion beam IB. Thereafter, the substrate support device 1 supporting the substrate S moves back and forth within the processing chamber 103 so as to cross the ion beam IB, and the surface to be processed Sa is irradiated with the ion beam IB.

[0070] When the ion beam IB is irradiated onto substantially the entire surface Sa to be processed and the ion beam irradiation process for the substrate S is completed, the support table 10 rotates about the support table rotation axis A and assumes the mounting attitude P1 again. Then, the application of voltage to the electrode 10b is stopped, thereby releasing the electrostatic adsorption of the substrate S, and the pair of supports 11 then move back to the upper position R1, thereby releasing the support for the substrate S. Thereafter, the substrate S is lifted by a robot (not shown) to separate it from the support surface 10a and is carried out of the processing chamber 103.

[0071] When the voltage application to the electrode 10b is released and the electrostatic attraction to the substrate S is released, the substrate S may jump up from the support surface 10a. In this case, it is expected that the substrate S may detach from the support surface 10a or may move to a position significantly displaced from the substrate support position Q. If such a situation occurs, the robot (not shown) will not be able to lift and transport the processed substrate S, and the operation of the substrate processing apparatus 100 will be stopped.

[0072] In contrast, the substrate support device 1 is provided with the regulating member 13 that regulates the movement of the substrate S, and therefore, even if the substrate S tries to move so as to jump up from the support surface 10a as described above, the movement of the substrate S is regulated by the regulating member 13. This prevents the substrate S from falling off the support surface 10a or from significantly shifting from the substrate support position Q when the voltage application to the electrode 10b is released.

[0073] Each regulating member 13 in this embodiment may be any member that can prevent the substrate S from moving significantly from the predetermined substrate support position Q due to the substrate S bouncing up from the support surface 10a. When the support body 11 is positioned at the support position R2, the regulating member 13 does not need to be in contact with the processing surface Sa of the substrate S, but only needs to be positioned above the processing surface Sa in the thickness direction of the substrate S.

[0074] In the substrate support device 1 of this embodiment, even when the support table 10 is in the processing posture P2, i.e., when the processing surface Sa of the substrate S is facing the ion beam IB, the substrate S can be supported at the substrate support position Q by only the two supports 11. More specifically, even when the processing surface Sa of the substrate S is facing the ion beam IB, the substrate S can be supported at the substrate support position Q by only the multiple support members 12 of the two supports 11.

[0075] That is, even when no voltage is applied to the electrode 10b, the substrate S is supported at the substrate supporting position Q by only the two supports 11. That is, it is not essential that the support table 10 be configured as an electrostatic chuck in the substrate supporting device 1. By configuring the support table 10 as an electrostatic chuck, the substrate S is held at the substrate supporting position Q more firmly.

[0076] If the substrate support apparatus 1 does not include the electrode 10b, that is, if the support table 10 is not configured as an electrostatic chuck, the above-described bouncing of the substrate S does not occur. Therefore, in this case, the substrate support apparatus 1 does not need to include the regulating member 13. Furthermore, even if the support table 10 is configured as an electrostatic chuck, if the above-described bouncing of the substrate S is not expected, the substrate support apparatus 1 does not need to include the regulating member 13.

[0077] Even if the substrate support device 1 does not include the electrode 10b, the regulating member 13 may be provided for the purpose of more firmly holding the substrate S at the substrate support position Q. In this case, the regulating member 13 may be configured to come into contact with the processing surface Sa of the substrate S located at the substrate support position Q.

[0078] Fig. 4 is a plan view of the substrate support apparatus 1 showing the two supports 11 in the upper position R1. Fig. 5 is a plan view of the substrate support apparatus 1 showing the two supports 11 in the support position R2. The support table 10 shown in Figs. 4 and 5 is in the placement position P1.

[0079] 6 is a perspective view of the first support 11A in this embodiment. Since the second support 11B in this embodiment has a configuration that is symmetrical to the first support 11A, a perspective view of the second support 11B is omitted.

[0080] As shown in Figures 4 and 5, the first support 11A and the second support 11B each have four support members 12, four regulating members 13, and a base 14 connecting these support members 12 and these regulating members 13.

[0081] Hereinafter, the four support members 12 of the first support 11A may be referred to as support members 12a to 12d, and the four support members 12 of the second support 11B may be referred to as support members 12e to 12h. Furthermore, the four regulating members 13 of the first support 11A may be referred to as regulating members 13a to 13d, and the four regulating members 13 of the second support 11B may be referred to as regulating members 13e to 13h.

[0082] A first line L1 shown by a dashed line in Fig. 5 passes through the center O of the substrate S placed at the substrate support position Q and is parallel to the horizontal direction when the support table 10 is in the processing posture P2. In other words, the first line L1 is parallel to the support table rotation axis A and the X axis. A second line L2 shown by a dashed line in Fig. 5 passes through the center O of the substrate S placed at the substrate support position Q and is perpendicular to the first line L1.

[0083] The substrate S is divided into four regions by a first line L1 and a second line L2. In this embodiment, when the support table 10 moves to the processing posture P2, the notch Sb of the substrate S is positioned downward. Therefore, of the region divided by the first line L1, the upper side of the substrate S when the support table 10 is in the processing posture P2, i.e., the upper side of the paper in FIG. 5, is defined as the upper side of the substrate S. Furthermore, of the region divided by the first line L1, the lower side of the substrate S when the support table 10 is in the processing posture P2, i.e., the lower side of the paper in FIG. 5, is defined as the lower side of the substrate S for convenience. Furthermore, of the region divided by the second line L2 in FIG. 5, the right side of the paper will be referred to as the right side of the substrate S, and the left side of the paper will be referred to as the left side of the substrate S for convenience.

[0084] 5, the support members 12a and 12b of the first support 11A support the side surface Sc of the substrate S in an area above and to the right of the substrate S. The support members 12c and 12d of the first support 11A support the side surface Sc of the substrate S in an area below and to the right of the substrate S.

[0085] Support members 12e and 12f of second support 11B support side surface Sc of substrate S in an upper left region of substrate S. Support members 12g and 12h of second support 11B support side surface Sc of substrate S in a lower left region of substrate S.

[0086] The regulating members 13a and 13b of the first support 11A are positioned above the processing surface Sa of the substrate S in an area on the upper right side of the substrate S. The regulating members 13c and 13d of the first support 11A are positioned above the processing surface Sa of the substrate S in an area on the lower right side of the substrate S.

[0087] The regulating members 13e and 13f of the second support 11B are positioned above the processing surface Sa of the substrate S in an area on the upper left side of the substrate S. The regulating members 13g and 13h of the second support 11B are positioned above the processing surface Sa of the substrate S in an area on the lower left side of the substrate S.

[0088] That is, in this embodiment, two support members 12 and two regulating members 13 are positioned in each of the four regions of the substrate S divided by the first straight line L1 and the second straight line L2.

[0089] 6, the support members 12a to 12h have contact surfaces 15a to 15h, respectively, that can contact the side surface Sc of the substrate S and support the substrate S. The contact surfaces 15a to 15h each form a curved surface that bulges out toward the center O of the substrate S in the state in which the substrate S is supported as shown in FIG. Note that the contact surfaces 15a to 15h forming a curved surface includes the contact surfaces 15a to 15h forming a spherical surface.

[0090] Since the contact surfaces 15a to 15h of the substrate support device 1 are curved, the substrate S can be smoothly guided to the predetermined substrate support position Q no matter how the substrate S is placed at a position displaced from the predetermined substrate support position Q on the processing surface Sa.

[0091] 4 shows a state in which the substrate S is placed in a position shifted diagonally upward to the right on the paper surface from a predetermined substrate support position Q. When the first support 11A and the second support 11B rotate from the upper position R1 toward the support position R2 from the state shown in FIG. 4, the contact surface 15a of the support member 12a closest to the substrate S first comes into contact with the peripheral edge of the back surface Sd or the side surface Sc of the substrate S. Then, as the first support 11A rotates about the first rotation axis B1, the substrate S is pushed by the contact surface 15a and moves toward the lower left on the paper surface.

[0092] Thereafter, as first support 11A and second support 11B rotate and move, substrate S comes into contact with contact surface 15e, and is then pushed by contact surfaces 15a and 15e to move downward in the plane of the paper. Substrate S then comes into contact with one of other contact surfaces 15b to 15d and contact surfaces 15f to 15h and is guided thereto, and is finally positioned at a predetermined substrate support position Q.

[0093] In this manner, in the substrate support device 1 of this embodiment, as the first support 11A and the second support 11B rotate, the contact surfaces 15a to 15h of the support members 12a to 12h, respectively, press the peripheral edges of the side surface Sc or back surface Sd of the substrate S, thereby guiding the substrate S to a predetermined substrate support position Q.

[0094] In this embodiment, the first support 11A and the second support 11B each have four support members 12a to 12d and support members 12e to 12h, but the number of support members 12 included in the first support 11A and the second support 11B is not limited to this. Also, the first support 11A and the second support 11B each have four regulating members 13a to 13d and regulating members 13e to 13h, but the number of regulating members 13 included in the first support 11A and the second support 11B is not limited to this.

[0095] In the substrate support device 1 of this embodiment, two contact surfaces 15 contact the substrate S to support the substrate S in each of four regions of the substrate S divided by a first straight line L1 that passes through the center O of the substrate S placed at the substrate support position Q and is parallel to the horizontal direction when the support table 10 is in the processing posture P2, and a second straight line L2 that passes through the center O of the substrate S and is perpendicular to the first straight line L1.

[0096] With this configuration, the substrate support device 1 can guide the substrate S to the substrate support position Q and support it at the substrate support position Q, even if the substrate S is placed in any direction displaced from the predetermined substrate support position Q on the support surface 10a.

[0097] Here, in order to guide and support the substrate S to the substrate support position Q, the substrate support device 1 is configured so that at least one contact surface 15 in each of the four regions comes into contact with the substrate S to support the substrate S. In other words, at least one support member 12 is positioned in each of the four regions.

[0098] In contrast, the substrate support apparatus 1 of this embodiment assumes that the predetermined substrate support position Q will be changed, and is configured so that two contact surfaces 15 come into contact with the substrate S in each of the four regions of the substrate S. That is, the substrate support apparatus 1 of this embodiment is configured so that two support members 12 are positioned in each of the four regions.

[0099] Fig. 7 is a plan view of the substrate support apparatus 1, showing an example of a state in which the predetermined substrate support position Q has been changed. Fig. 7 shows a state in which the substrate support position Q has been changed and the cutout portion Sb of the substrate S is positioned at a position facing the support member 12d.

[0100] In this case, contact surface 15d of support member 12d cannot come into contact with substrate S, and therefore, if first support 11A were not equipped with support member 12c, substrate S would not be guided or supported in the area to the right and below substrate S. Furthermore, if support table 10 were to rotate in this state and assume processing posture P2, there is a risk that substrate S would fall off support table 10.

[0101] In contrast, in this embodiment, in addition to support member 12d, support member 12c is positioned in the area to the right and below substrate S, so that even if substrate support position Q is changed as described above, substrate S can be reliably guided to substrate support position Q, and substrate S can be reliably supported even when support table 10 is in processing posture P2.

[0102] That is, the number and arrangement of the support members 12 of the support body 11 may be set appropriately depending on the positions of the cutout portions Sb of the substrate S at the substrate support position Q. When the substrate support position Q is changed, the substrate support device 1 may be configured so that the multiple contact surfaces 15 come into contact with the substrate S in at least one of the four regions, taking into account the cutout portions Sb after the change.

[0103] If the position of the substrate support position Q is not changed, when the support body 11 is located at the support position R2, the substrate support device 1 only needs to support the substrate S with one contact surface 15 in contact with the substrate S in each of the four regions of the substrate S separated by the first straight line L1 and the second straight line L2. In other words, the substrate support device 1 only needs to be configured so that at least one support member 12 supports the substrate S in each of the four regions.

[0104] In contrast to this, the substrate support apparatus 1 has the following configuration: By configuring the plurality of contact surfaces 15 to come into contact with the substrate S, even if the position of the substrate support position Q is changed, the substrate S can be guided to and supported at the predetermined substrate support position Q. The substrate support device 1 only needs to be configured so that the plurality of contact surfaces 15 come into contact with the substrate S in at least one of the four regions, depending on the position of the notch Sb of the substrate S located at the changed substrate support position Q.

[0105] 8 is a schematic side view of the substrate support apparatus 1, showing a first modified example of the substrate support apparatus 1. In this modified example, each regulating member 13 is spaced apart from the processing surface Sa of the substrate S when each support 11 is located at the support position R2 and each regulating member 13 is positioned above the processing surface Sa.

[0106] The substrate S may bounce as soon as the voltage application to the electrode 10b is released. Even in such a case, the restricting members 13a to 13h are located above the substrate S, so they restrict the movement of the substrate S, preventing, for example, the substrate S from detaching from the support surface 10a.

[0107] FIG. 9 is a plan view of the substrate support apparatus 1, showing a second modified example of the substrate support apparatus 1. As shown in FIG. 9, the substrate support device 1 in the second modified example includes four supports 11. Each support 11 is integrally formed with one support member 12 having one contact surface 15 and one regulating member 13.

[0108] Furthermore, the substrate support device 1 in the second modified example is provided with two regulating members 13i and 13j that operate independently, separate from each support 11. The two regulating members 13i and 13j are both fixed to the support base 10. Furthermore, the two regulating members 13i and 13j rotate around rotation axes B3 and B4, respectively, that are parallel to the support surface 10a.

[0109] Both regulating members 13i, 13j are configured to operate so as to be positioned above the surface to be treated Sa at the same time as each support 11 reaches the support position R2 or immediately after each support 11 reaches the support position R2.

[0110] The number of supports 11 provided in the substrate support device 1 is not limited to a specific number. Furthermore, the number of support members 12 provided in each support 11, i.e., the number of contact surfaces 15, is not limited to a specific number. Furthermore, the regulating member 13 does not need to be formed integrally with the support 11, and may be separate from the support 11 and operate independently.

[0111] Furthermore, the substrate support device 1 is not limited to a configuration in which, when the support 11 is positioned at the support position R2, at least one support member 12 is positioned in each of the four regions of the substrate S separated by the first straight line L1 and the second straight line L2.

[0112] In order to guide and support the substrate S at a predetermined substrate support position Q, the multiple contact surfaces 15 need only be arranged so that the center O of the substrate S placed at the substrate support position Q is included within a triangular area formed by three points selected from multiple points where each contact surface 15 contacts the side surface Sc of the substrate S.

[0113] In other words, if three support members 12, each having one contact surface 15, are arranged so that the center O of the substrate S is included within the triangular area formed by connecting the three points where each support member 12 contacts the side surface Sc of the substrate S, the substrate S can be guided and supported to a predetermined substrate support position Q.

[0114] Therefore, when the position of the notch Sb is fixed when the substrate S is placed at a predetermined substrate support position Q, i.e., when the position of the notch Sb does not change, at least three support members 12 are required.

[0115] FIG. 10 is a plan view of the substrate support apparatus 1, showing a third modified example of the substrate support apparatus 1. In FIG. In the substrate supporting apparatus 1 in the third modified example, the number and positions of the supporting members 12 and the regulating members 13 of the first supporting body 11A and the second supporting body 11B are changed.

[0116] As described above, if the position of the notch Sb of the substrate S does not change when the substrate S is positioned at the predetermined substrate support position Q, at least three support members 12 are required. Therefore, in the third modified example, the substrate support device 1 is configured so that the first support 11A has one support member 12 and the second support 11B has two support members 12.

[0117] 10 , the support member 12 of the first support 11A is in contact with the side surface Sc of the substrate S on a first line L1. The two support members 12 of the second support 11B are in contact with the side surface Sc of the substrate S at positions symmetrical with respect to the first line L1. As an example, with this arrangement, the center O of the substrate S is located within the area of ​​a triangle T formed by connecting the points of contact between the three support members 12 of the first support 11A and the second support 11B and the side surface Sc of the substrate S, and the substrate S can be guided and supported at a predetermined substrate support position Q by the support members 12.

[0118] That is, the substrate support device 1 has three or more contact surfaces 15, and the multiple contact surfaces 15 are arranged so that the center O of the substrate S is located within any of the triangular areas formed by connecting the three points where each contact surface 15 contacts the side surface Sc of the substrate S.

[0119] The number and arrangement of the contact surfaces 15 that support the substrate S of the substrate support device 1, and the number and arrangement of the regulating members 13 may be changed as appropriate depending on the set substrate support position Q, the shape and material of the substrate S, etc.

[0120] Furthermore, the present invention is not limited to the above-described embodiment and modified examples, and it goes without saying that various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0121] 1 Board support device 10 Support stand 10a Support surface 11:Support 12: Support member 13: Regulating member 15: Contact surface L1: First line L2: Second line O: Center P1: Placement position P2: Processing posture Q: Board support position R1:Upper position R2: Support position S: Substrate Sa: Treated surface Sc:Side

Claims

1. a support table having a support surface on which a disk-shaped substrate is placed, the support table being capable of changing its orientation from a placement position in which the substrate is placed on the support surface to a processing position in which a predetermined processing is performed on a surface to be processed of the substrate by rotating the support table to change the orientation of the support surface; a plurality of supports capable of supporting the substrate at predetermined substrate support positions on the support surface when the support table is in the processing posture; each of the plurality of supports has at least one contact surface that can contact a side surface of the substrate to support the substrate; each of the plurality of supports rotates about a predetermined rotation axis, and moves from an upper position where the contact surface is located above the support surface to a support position where the contact surface is directed toward the support surface, and supports the substrate; While the plurality of supports move from the upper position to the support position, at least one of the contact surfaces contacts the substrate placed at a position offset from the substrate support position on the support surface, while guiding the substrate to the substrate support position.

2. 2. The substrate support device of claim 1, wherein the contact surfaces are arranged so that the center of the substrate placed at the substrate support position is within any triangular area formed by connecting three points where each of the contact surfaces contacts the side surface.

3. 2. The substrate support device of claim 1, wherein at least one of the contact surfaces contacts the substrate in each of four regions of the substrate separated by a first line that passes through the center of the substrate placed at the substrate support position and is parallel to the horizontal direction when the support table is in the processing posture, and a second line that passes through the center and is perpendicular to the first line.

4. the substrate has a notch; The substrate support apparatus of claim 3 , wherein a plurality of the contact surfaces contact the substrate in at least one of the four regions.

5. A substrate support device according to any one of claims 1 to 4, further comprising at least one regulating member positioned above the processing surface and regulating movement of the substrate when the substrate is positioned at the substrate support position.

6. The substrate support device according to claim 5 , wherein the regulating member is positioned above the processing surface simultaneously with or after the plurality of supports reach the support position.

7. The substrate supporting device according to claim 5 , wherein the regulating member is in contact with the surface to be processed when the regulating member is positioned above the surface to be processed.

8. 6. The substrate supporting device according to claim 5, wherein the regulating member is spaced apart from the surface to be processed when the regulating member is positioned above the surface to be processed.

9. 6. The substrate supporting apparatus according to claim 5, wherein the support table is configured as an electrostatic chuck that electrostatically attracts the substrate to the support surface.

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