Magnetic component

Abstract

To provide a magnetic component in which eddy current loss can be reduced while reducing the size.SOLUTION: The multilayer substrate 10 includes a plurality of insulating layers 11 to 15. The winding 30 is constituted by a plurality of conductor patterns 31 to 36 provided in the plurality of insulating layers 11 to 15 around the through holes 21 to 23 penetrating the multilayer substrate 10 in the thickness direction. The first core 40 has at least one leg part 42 to 44 inserted into the through hole 21 to 23 of the multilayer substrate 10. The second core 50 is disposed with respect to the end surfaces 45 to 47 of the leg parts 42 to 44 of the first core 40 via the gaps 71 to 73, and constitutes a magnetic circuit together with the first core 40. Among the plurality of conductive patterns 31 to 36, the conductive patterns closest to the gaps 71 to 73 in the plate thickness direction are formed to have smaller widths D1 and W10 in the in-plane direction than the other conductive patterns so that the distances W1 between the gaps 71 to 73 and the conductive patterns in the in-plane direction are large.SELECTED DRAWING: Figure 14

Description

[Technical Field]

[0001] The present disclosure relates to magnetic components. [Background technology]

[0002] 2. Description of the Related Art Magnetic components such as reactors and transformers used in electric circuits have been known. The magnetic component described in Patent Document 1 includes a winding composed of multiple conductor patterns arranged around a through hole that penetrates a multilayer substrate in the thickness direction, a first core inserted into the through hole, and a second core positioned across a gap from the first core. The first and second cores form a magnetic circuit through which magnetic flux flows from a magnetic field generated by current flowing through the winding. This magnetic component does not have a conductor pattern on the gap-side surface or the opposite surface of the insulating layer closest to the gap in the thickness direction among the multiple insulating layers of the multilayer substrate, but instead has a conductor pattern on an insulating layer below that insulating layer (i.e., the second or subsequent insulating layer). This prevents leakage flux generated in the gap when magnetic flux flows through the magnetic circuit from interlinking with the conductor pattern, thereby reducing power loss due to eddy currents. In the following description, power loss due to eddy currents is referred to as "eddy current loss." [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-175657 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the magnetic component described in Patent Document 1 does not have a conductor pattern on the insulating layer that is closest to the gap in the thickness direction among the multiple insulating layers of the multilayer substrate, but has conductor patterns on the second and subsequent insulating layers.As a result, this magnetic component has a problem in that the number of insulating layers in the multilayer substrate is large compared to the number of conductor patterns, resulting in an increase in the physical size of the multilayer substrate in the thickness direction.

[0005] In view of the above, an object of the present disclosure is to provide a magnetic component that can reduce eddy current loss and can be made smaller in size. [Means for solving the problem]

[0006] According to one aspect of the present disclosure, a magnetic component includes: a multilayer substrate (10) having a plurality of insulating layers (11-15) formed of insulating material; through holes (21 to 23) penetrating through a plurality of insulating layers in the thickness direction of the multilayer board; a winding (30) formed by electrically connecting a plurality of conductor patterns (31-36) provided on a plurality of insulating layers around a through hole in a multilayer substrate; a first core (40) having at least one leg (42-44) to be inserted into a through-hole of the multilayer substrate; a second core (50) that is disposed on the end faces (45-47) of the legs of the first core via gaps (71-73) and that forms a magnetic circuit together with the first core; Of the multiple conductor patterns, the conductor pattern closest to the gap in the plate thickness direction is formed to have a smaller in-plane width than the other conductor patterns so that the distance between the gap and the conductor pattern in the in-plane direction of the multilayer substrate is increased.

[0007] This prevents leakage magnetic flux generated at the gap from interlinking with the conductor pattern closest to the gap in the thickness direction (hereinafter referred to as the "gap-side conductor pattern"). This prevents eddy currents from occurring in the gap-side conductor pattern, reducing eddy current loss. It also prevents burnout of the conductor patterns and the multilayer board due to heat generated by eddy currents.

[0008] Furthermore, according to the present disclosure, it is possible to provide a conductor pattern on the insulating layer closest to the gap among the multiple insulating layers of a multilayer substrate. In this case, compared to Patent Document 1, the magnetic component of the present disclosure can reduce the number of insulating layers of the multilayer substrate while maintaining the same number of conductor pattern layers. Therefore, the magnetic component of the present disclosure can reduce the size of the multilayer substrate in the thickness direction.

[0009] According to another aspect of the present disclosure, there is provided a magnetic component comprising: a multilayer substrate (10) having a plurality of insulating layers (11-15) formed of insulating material; through holes (21 to 23) penetrating through a plurality of insulating layers in the thickness direction of the multilayer board; a winding (30) formed by electrically connecting a plurality of conductor patterns (31-36) provided on a plurality of insulating layers around a through hole in a multilayer substrate; a first core (40) having at least one leg (42-44) to be inserted into a through-hole of the multilayer substrate; a second core (50) that is disposed on the end faces (45-47) of the legs of the first core via gaps (71-73) and that forms a magnetic circuit together with the first core; Of the plurality of conductor patterns, the conductor pattern closest to the gap in the plate thickness direction is formed to have a smaller width in the in-plane direction of the multilayer substrate than the other conductor patterns so as to avoid leakage flux generated at the gap.

[0010] According to this, the other aspect of the present disclosure can also achieve the same effects as the one aspect of the present disclosure.

[0011] The reference symbols in parentheses attached to each component indicate an example of the correspondence between the component and the specific components described in the embodiments described below. [Brief explanation of the drawings]

[0012] [Figure 1] 2 is a cross-sectional view taken along the thickness direction of a multilayer substrate in the magnetic component according to the first embodiment. FIG. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 2 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Figure 5] 2 is a cross-sectional view taken along line VV in FIG. 1. [Figure 6] 6 is a cross-sectional view taken along line VI-VI in FIG. [Figure 7] FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. [Figure 8] 2 is a cross-sectional view of FIG. 1, excluding the bottom of the first core and the second core. [Figure 9] 3 is a table comparing the magnetic component according to the first embodiment with the magnetic component of a first comparative example. [Figure 10] 10 is a cross-sectional view taken along the thickness direction of a multilayer substrate in a magnetic component according to a second embodiment. FIG. [Figure 11] FIG. 11 is a cross-sectional view taken along the thickness direction of a multilayer substrate in a magnetic component according to a third embodiment. [Figure 12] FIG. 11 is a cross-sectional view taken along the thickness direction of a multilayer substrate in a magnetic component according to a fourth embodiment. [Figure 13A] FIG. 11 is a cross-sectional view taken along the thickness direction of a multilayer substrate in a magnetic component according to a fifth embodiment. [Figure 13B] FIG. 13 is a cross-sectional view taken along the thickness direction of a multilayer substrate in a magnetic component according to a modified example of the fifth embodiment. [Figure 14] FIG. 13 is a cross-sectional view taken along the thickness direction of a multilayer substrate in a magnetic component according to a sixth embodiment. [Figure 15]FIG. 13 is a cross-sectional view taken along the thickness direction of a multilayer substrate in a magnetic component according to a seventh embodiment. [Figure 16] 16 is a cross-sectional view taken along line XVI-XVI in FIG. 15. [Figure 17] FIG. 17 is a cross-sectional view taken along line XVII-XVII in FIG. [Figure 18] FIG. 18 is a cross-sectional view taken along line XVIII-XVIII in FIG. [Figure 19] 19 is a cross-sectional view taken along line XIX-XIX in FIG. 15. [Figure 20] FIG. 16 is a cross-sectional view taken along the line XX-XX in FIG. 15. [Figure 21] FIG. 11 is a cross-sectional view taken along line XXI-XXI in FIG. [Figure 22] 10 is a cross-sectional view taken along the thickness direction of a multilayer substrate in a magnetic component of a second comparative example. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the following embodiments, identical or equivalent parts will be denoted by the same reference numerals, and description thereof will be omitted.

[0014] (First embodiment) A first embodiment will be described. The magnetic component of the first embodiment is a reactor used in various electric circuits, such as the power supply circuit of an electric vehicle. As shown in Figures 1 to 7, the magnetic component includes a multilayer substrate 10, through holes 21 and 22, a winding 30, a first core 40, and a second core 50.

[0015] Multilayer substrate 10 is a printed circuit board having multiple insulating layers formed of insulating materials. Hereinafter, for ease of explanation, the multiple insulating layers 11-15 of multilayer substrate 10 may be referred to as first insulating layer 11, second insulating layer 12, third insulating layer 13, fourth insulating layer 14, and fifth insulating layer 15, in that order, from the insulating layer at the top of the page in FIG. 1 to the insulating layer at the bottom of the page. Hereinafter, the direction in which multiple insulating layers 11-15 of multilayer substrate 10 are stacked will be referred to as the "thickness direction of multilayer substrate 10" or simply the "thickness direction." Furthermore, the direction perpendicular to the thickness direction will be referred to as the "in-plane direction of multilayer substrate 10" or simply the "in-plane direction."

[0016] The through holes 21, 22 penetrate the insulating layers 11 to 15 in the plate thickness direction. The magnetic component of this embodiment has at least two through holes 21, 22 in the multilayer substrate 10. Hereinafter, for ease of explanation, of the two through holes 21, 22, the one on the right side of the paper in FIG. 1 may be referred to as the first through hole 21, and the one on the left side of the paper in FIG. 1 may be referred to as the second through hole 22.

[0017] The winding 30 is configured by electrically connecting a plurality of conductor patterns 31 to 36 provided on a plurality of insulating layers 11 to 15 of the multilayer substrate 10 vias or the like. For ease of explanation, the plurality of conductor patterns 31 to 36 may be referred to as the first conductor pattern 31, the second conductor pattern 32, the third conductor pattern 33, the fourth conductor pattern 34, the fifth conductor pattern 35, and the sixth conductor pattern 36 in that order from the top to the bottom of the page in Fig. 1. In addition, in this embodiment, the first conductor pattern 31 may be referred to as the "gap-side conductor pattern 31."

[0018] 1, 2, 4, and 6, the first, third, and fifth conductor patterns 31, 33, and 35 are provided around the first through hole 21. As shown in Figures 1, 3, 5, and 7, the second, fourth, and sixth conductor patterns 32, 34, and 36 are provided around the second through hole 22. In Figure 2, the position of the first insulating layer 11 is indicated by a dashed line.

[0019] As shown in Figures 2 to 7, multilayer substrate 10 is provided with a plurality of through vias 61 to 65. For ease of explanation, the plurality of through vias 61 to 65 may be referred to as a first via 61, a second via 62, a third via 63, a fourth via 64, and a fifth via 65, in that order, from right to left in Figures 2 to 7. Furthermore, one end of winding 30 shown in Figure 2 is referred to as a first end 66, and the other end of winding 30 shown in Figure 7 is referred to as a second end 67.

[0020] The multiple conductor patterns 31 to 36 constituting the winding 30 are electrically connected, for example, as follows: first end 66 shown in Fig. 2 → first conductor pattern 31 → third via 63 → third conductor pattern 33 shown in Fig. 4 → second via 62 → fifth conductor pattern 35 shown in Fig. 6 → first via 61 → second conductor pattern 32 shown in Fig. 3 → fourth via 64 → fourth conductor pattern 34 shown in Fig. 5 → fifth via 65 → sixth conductor pattern 36 shown in Fig. 7 → second end 67. Therefore, when a current flows through the winding 30 from the first end 66 to the second end 67, the current first flows through the first, third, and fifth conductor patterns 31, 33, and 35, and then flows through the second, fourth, and sixth conductor patterns 32, 34, and 36. Furthermore, when a current flows through the winding 30 from the second end 67 to the first end 66, the current flows through the sixth, fourth and second conductor patterns 36, 34 and 32, and then flows through the fifth, third and first conductor patterns 35, 33 and 31. Note that the method of connecting the multiple conductor patterns 31 to 36 is not limited to the above and can be changed as desired.

[0021] Both the first core 40 and the second core 50 are formed of a magnetic material and form a magnetic circuit through which the magnetic flux of the magnetic field generated by the current flowing through the winding 30 flows. The first core 40 integrally includes a bottom 41 disposed on the outside of the multilayer substrate 10 and two legs 42 and 43 extending in a direction intersecting (specifically, perpendicular to) the bottom 41. The first core 40 is sometimes referred to as a U-shaped core. The bottom 41 of the first core 40 is disposed on the outside of the side of the multilayer substrate 10 on which the sixth conductor pattern 36 is provided. The two legs 42 and 43 are inserted into the first through hole 21 and the second through hole 22, respectively. Hereinafter, for convenience of explanation, of the two legs 42 and 43, the one inserted into the first through hole 21 may be referred to as the "leg 42 on one side," and the one inserted into the second through hole 22 may be referred to as the "leg 43 on the other side."

[0022] The second core 50 is formed in a plate shape and is disposed on the outer side of the multilayer substrate 10 on the side where the first conductor pattern 31 is provided. The second core 50 is sometimes referred to as an I-shaped core. The second core 50 is disposed with gaps 71 and 72 interposed between the end faces 45 and 46 of the two legs 42 and 43 of the first core 40, respectively. For ease of explanation, of the two gaps 71 and 72, the one on the right side of the paper in FIG. 1 may be referred to as the first gap 71, and the one on the left side of the paper in FIG. 1 may be referred to as the second gap 72. In this embodiment, the above-mentioned first conductor pattern 31 is the closest to the gaps 71 and 72 in the plate thickness direction among the multiple conductor patterns 31 to 36, and therefore may be referred to as the "gap-side conductor pattern 31."

[0023] When magnetic components are used in applications where currents primarily consisting of AC components or ripples flow through the windings 30, it is preferable to increase the gaps 71 and 72 in the core to prevent magnetic saturation and operate the components below the maximum magnetic flux density. This increases the range of leakage magnetic flux generated by the gaps 71 and 72, as indicated by the arrow LF in Figure 1. This can affect not only the layers of the multilayer substrate 10 closest to the gaps 71 and 72, but also the layers below them. If a conductor pattern is provided in a location where leakage magnetic flux passes, eddy currents will flow in the conductor pattern, causing losses. The impact of eddy currents becomes greater as the frequency of the current flowing through the electrical circuit in which the magnetic component is used increases, leading to increased eddy current losses and burnout due to heat generation.

[0024] Therefore, the magnetic component of this embodiment is configured so that the in-plane widths of the multiple conductor patterns 31 to 36 are different. That is, in this embodiment, as shown in FIGS. 2 and 8 , the gap-side conductor pattern 31, which is located closest to the gaps 71 and 72 in the plate thickness direction among the multiple conductor patterns 31 to 36, is formed with smaller in-plane widths W1 and W10 than the other conductor patterns 32 to 36 so that the in-plane distance D1 between the gaps 71 and 72 and the conductor pattern is increased. Note that in the above description, "increasing the in-plane distance between the gaps 71 and 72 and the conductor pattern" can be rephrased as "avoiding leakage flux generated at the gaps 71 and 72" or "increasing the distance between the legs 42 and 43 and the conductor pattern." This also applies to the following description.

[0025] In other words, the conductor pattern 31 provided on the insulating layer 11 that is closest to the gaps 71, 72 in the thickness direction among the multiple insulating layers 11-15 of the multilayer substrate 10 is formed to have a smaller in-plane width than the conductor patterns 32-36 provided on the other insulating layers so that the in-plane distance between the gaps 71, 72 and the conductor pattern is greater. Note that, among the multiple insulating layers 11-15 of the multilayer substrate 10, the insulating layer 11 that is closest to the gaps 71, 72 in the thickness direction corresponds to the first insulating layer 11 in this embodiment.

[0026] 1 and 8, in the first embodiment, the conductor patterns 31 to 36 that are located closer to the gaps 71, 72 in the plate thickness direction have smaller in-plane widths so that the distance between the gaps 71, 72 and the conductor pattern in the in-plane direction increases. In other words, the conductor patterns 31 to 36 that are located farther from the gaps 71, 72 in the plate thickness direction have larger in-plane widths so that the distance between the gaps 71, 72 and the conductor pattern in the in-plane direction decreases.

[0027] In other words, the conductor patterns provided on insulating layers that are closer to gaps 71, 72 in the thickness direction of the multiple insulating layers 11-15 of multilayer substrate 10 have smaller in-plane widths so that the distance between gaps 71, 72 and the conductor patterns in the in-plane direction increases. In other words, the conductor patterns provided on insulating layers that are farther from gaps 71, 72 in the thickness direction of the multiple insulating layers 11-15 of multilayer substrate 10 have larger in-plane widths so that the distance between gaps 71, 72 and the conductor patterns in the in-plane direction decreases.

[0028] Furthermore, in the first embodiment, the surface 311 of the gap-side conductor pattern 31 facing the second core 50 is located on the opposite side from the second core 50 with respect to the end faces 45, 46 of the legs 42, 43 of the first core 40 facing the second core 50. In other words, a distance ΔD in the plate thickness direction between the surface 311 of the gap-side conductor pattern 31 facing the second core 50 and the end faces 45, 46 of the legs 42, 43 of the first core 40 facing the second core 50 is greater than 0. This distance ΔD is greater than the manufacturing tolerance when the surface 311 of the gap-side conductor pattern 31 facing the second core 50 and the end faces 45, 46 of the legs 42, 43 of the first core 40 facing the second core 50 are hypothetically formed at the same positions in the plate thickness direction. This allows the distance between the gap-side conductor pattern 31 and the gaps 71 and 72 to be increased, and prevents leakage flux generated in the gaps 71 and 72 from interlinking with the gap-side conductor pattern 31 .

[0029] The widths of the plurality of conductive patterns of this embodiment will be described in detail with reference to FIG. 8. As shown in FIG. 8, in the region between the leg portion 42 on one side and the leg portion 43 on the other side, let the width of the first conductor pattern 31 be W1, the width of the second conductor pattern 32 be W2, the width of the third conductor pattern 33 be W3, the width of the fourth conductor pattern 34 be W4, the width of the fifth conductor pattern 35 be W5, and the width of the sixth conductor pattern 36 be W6. At this time, W1 < W2 < W3 < W4 < W5 < W6.

[0030] Also, in the region on the side opposite to the leg portion 43 with respect to the leg portion 42 on one side, let the width of the first conductor pattern 31 be W10, the width of the third conductor pattern 33 be W30, and the width of the fifth conductor pattern 35 be W50. At this time, W10 < W30 < W50. In the region on the side opposite to the leg portion 42 with respect to the leg portion 43 on the other side, let the width of the second conductor pattern 32 be W20, the width of the fourth conductor pattern 34 be W40, and the width of the sixth conductor pattern 36 be W60. At this time, W20 < W40 < W60. Also, W10 < W20 < W30 < W40 < W50 < W60.

[0031] Let the in-plane distance between the gaps 71 and 72 and the first conductor pattern 31 be D1, the in-plane distance between the gaps 71 and 72 and the second conductor pattern 32 be D2, the in-plane distance between the gaps 71 and 72 and the third conductor pattern 33 be D3, the in-plane distance between the gaps 71 and 72 and the fourth conductor pattern 34 be D4, the in-plane distance between the gaps 71 and 72 and the fifth conductor pattern 35 be D5, and the in-plane distance between the gaps 71 and 72 and the sixth conductor pattern 36 be D6. At this time, D1 < D2 < D3 < D4 < D5 < D6.

[0032] The distance between the first gap 71 and the first conductor pattern 31 is D10, and the distance between the first gap 71 and the third conductor pattern 33 is D30. The distance between the first gap 71 and the fifth conductor pattern 35 is D50. The distance between the second gap 72 and the second conductor pattern 32 is D20, the distance between the second gap 72 and the fourth conductor pattern 34 is D40, and the distance between the second gap 72 and the sixth conductor pattern 36 is D60. In this case, D10, D20, D30, D40, D50, and D60 may be the same or different. Note that "same" includes not only completely same, but also substantially same due to manufacturing tolerances, etc.

[0033] Next, the magnetic component of the first embodiment described above will be compared with a number of magnetic components of comparative examples.

[0034] 9, in the magnetic component of the first comparative example, similar to Patent Document 1, no conductor patterns are provided on the surface of insulating layer 11 closest to gaps 71, 72 among the multiple insulating layers 11-17 of multilayer substrate 10, the surface facing gaps 71, 72, or the surface opposite thereto. Conductive patterns 31-36 are provided on insulating layers below insulating layer 11 closest to gaps 71, 72. The number of layers of conductor patterns 31-36 in the first comparative example and the number of layers of conductor patterns 31-36 in the first embodiment are both six.

[0035] As a result of analysis by the inventors, the winding loss (i.e., the loss of power flowing through the winding 30) in the first embodiment was 0.75 when the winding loss in the first comparative example was set to 1. In other words, the first embodiment achieved a 25% reduction in winding loss compared to the first comparative example.

[0036] Furthermore, in the first comparative example, the total number of substrates (i.e., the number of layers on which conductor patterns can be arranged on the substrate) is eight, while in the first embodiment, the total number of substrates is six. The number of insulating layers constituting the multilayer substrate 10 is seven in the first comparative example and five in the first embodiment. Therefore, it can be said that the first embodiment has a configuration that allows for a smaller physical size in the plate thickness direction compared to the first comparative example.

[0037] 22, the magnetic component of the second comparative example is configured such that the in-plane widths of the plurality of conductor patterns 31 to 36 are all the same. In the second comparative example, the conductor patterns 31 to 36 that are positioned closer to the gaps 71 and 72 in the plate thickness direction are arranged such that the distance between the gaps 71 and 72 and the conductor pattern in the in-plane direction increases. Therefore, the magnetic component of the second comparative example has a larger in-plane width A of the multilayer substrate 10 than the first embodiment.

[0038] Compared with the first and second comparative examples, the magnetic component of the first embodiment has the following advantages. (1) In the first embodiment, the gap-side conductor pattern 31 is formed to have smaller in-plane widths W1 and W10 than the other conductor patterns 32 to 36 so that the in-plane distance D1 between the gaps 71 and 72 and the conductor pattern is greater. This prevents leakage flux generated in the gaps 71, 72 from interlinking with the gap-side conductor pattern 31. This prevents eddy currents from occurring in the gap-side conductor pattern 31, reducing eddy current loss. It also prevents burnout of the conductor patterns and multilayer substrate 10 due to heat generated by eddy currents. Furthermore, it is possible to provide the conductor pattern 31 on the insulating layer 11 that is closest to the gaps 71, 72 among the multiple insulating layers 11 to 15 of the multilayer substrate 10. In this case, compared to the first comparative example, the magnetic component of the first embodiment can reduce the number of insulating layers of the multilayer substrate 10 while maintaining the same number of conductor pattern layers. Therefore, compared to the first comparative example, this magnetic component can reduce the size of the multilayer substrate 10 in the thickness direction. Furthermore, in the magnetic component of the first embodiment, the in-plane widths W1 and W10 of the gap-side conductor pattern 31 are reduced, so the size of the multilayer substrate 10 in the in-plane direction can be made smaller than in the second comparative example.

[0039] (2) In the first embodiment, the conductor pattern 31 provided on the insulating layer 11 that is closest to the gaps 71, 72 in the thickness direction among the multiple insulating layers 11 to 15 of the multilayer substrate 10 is formed to have smaller in-plane widths W1, W10 than the conductor patterns 32 to 36 provided on the other insulating layers so that the in-plane distance D1 between the gaps 71, 72 and the conductor pattern 31 is greater. According to this, the magnetic component of the first embodiment has the conductor pattern 31 provided on the insulating layer 11 that is closest to the gaps 71, 72 among the multiple insulating layers 11 to 15 of the multilayer substrate 10, so that, compared to the first comparative example, it is possible to reduce the number of insulating layers of the multilayer substrate 10 for the same number of conductor pattern layers. Therefore, this magnetic component can reduce the size of the multilayer substrate 10 in the thickness direction.

[0040] (3) Incidentally, when a magnetic component is used in a manner that causes a current mainly consisting of an AC component or ripple to flow through winding 30, it is preferable to increase core gaps 71, 72 to prevent magnetic saturation in the core in order to operate the magnetic component at or below the maximum magnetic flux density. This widens the range of leakage magnetic flux generated from gaps 71, 72, as shown by arrow LF in Figure 1, and the leakage magnetic flux may affect not only the layers of multilayer substrate 10 closest to gaps 71, 72, but also the layers below them. In contrast, in the first embodiment, the conductor patterns 31 to 36 that are positioned closer to the gaps 71, 72 in the thickness direction are formed with smaller in-plane widths so that the in-plane distance between the gaps 71, 72 and the conductor patterns is greater. This makes it possible to prevent the leakage flux generated at the gaps 71, 72 from linking not only the gap-side conductor pattern 31 but also the conductor patterns 32 to 36 in the layer below the gap-side conductor pattern 31, even when the range of the leakage flux generated from the gaps 71, 72 is widened. This makes it possible to prevent eddy currents from occurring in the multiple conductor patterns 31 to 36, thereby reducing eddy current loss. It also makes it possible to prevent burnout of the conductor patterns and the multilayer substrate 10 due to heat generated by eddy currents. Furthermore, this magnetic component can reduce wiring resistance and power loss by increasing the cross-sectional area of ​​the conductor patterns provided on insulating layers farthest from gaps 71 and 72 in the thickness direction among multiple insulating layers 11-15 of multilayer substrate 10.

[0041] (4) In the first embodiment, the first core 40 integrally includes a bottom 41 provided on the outside of the multilayer substrate 10 and a plurality of legs 42, 43 that are inserted into the plurality of through holes 21, 22, respectively. The second core 50 is disposed on the opposite side of the multilayer substrate 10 from the bottom 41 of the first core 40, with gaps 71, 72 interposed between the end faces 45, 46 of the plurality of legs 42, 43 of the first core 40. This allows the gaps 71, 72 between the first core 40 and the second core 50 to be formed outside the multilayer substrate 10. Therefore, by increasing the distance between the conductor patterns and the gaps 71, 72, it is possible to prevent leakage flux from interlinking the gap-side conductor pattern 31 and reduce eddy current loss. It is also possible to prevent the conductor patterns and the multilayer substrate 10 from being burned due to heat generated by eddy currents.

[0042] (5) In the first embodiment, the first core 40 is a U-shaped core having a bottom 41 and two legs 42, 43. The second core 50 is an I-shaped core that is disposed with gaps 71, 72 between it and the two legs 42, 43 of the first core 40. According to this, the core is exemplified by a combination of a U-shaped core and an I-shaped core.

[0043] (6) In the first embodiment, the surface 311 of the gap-side conductor pattern 31 facing the second core 50 is located on the opposite side of the second core 50 from the end surfaces 45, 46 of the legs 42, 43 of the first core 40 facing the second core 50. This allows the gap-side conductor pattern 31 to be spaced apart from the gaps 71 and 72. This prevents leakage flux from interlinking the gap-side conductor pattern 31, reducing eddy current loss. It also prevents the conductor pattern and the multilayer substrate 10 from being burned due to heat generated by eddy currents.

[0044] (7) In the first embodiment, the gap-side conductor pattern 31 is formed to have smaller widths W1 and W10 in the in-plane direction of the multilayer substrate 10 than the other conductor patterns 32 to 36 so as to avoid leakage flux generated in the gaps 71 and 72. This can achieve the same effect as that described in (1) above.

[0045] (Second embodiment) The second embodiment will be described. The second embodiment is different from the first embodiment in that the configuration of the winding 30 is changed, but the rest is the same as the first embodiment, so only the parts that are different from the first embodiment will be described.

[0046] 10 , in the second embodiment, at least one leg 43 of two legs 42, 43 of a first core 40 is inserted into one through-hole 22 of a multilayer substrate 10. A plurality of conductor patterns 31-36 are provided around the one through-hole 22 into which the leg 43 of the first core 40 is inserted. The plurality of conductor patterns 31-36 are provided on a plurality of insulating layers 11-15 of the multilayer substrate 10, and are electrically connected through vias (not shown) to form a winding 30.

[0047] In the second embodiment as well, the gap-side conductor pattern 31 is formed to have a smaller in-plane width than the other conductor patterns 32 to 36 so that the in-plane distance between the gaps 71, 72 and the conductor pattern increases. Also in the second embodiment as well, the conductor patterns among the multiple conductor patterns 31 to 36 that are positioned closer to the gaps 71, 72 in the plate thickness direction have smaller in-plane widths so that the in-plane distance between the gaps 71, 72 and the conductor pattern increases.

[0048] In the second embodiment described above, the winding 30 provided in the magnetic component is made up of a plurality of conductor patterns 31 to 36 provided around one through-hole 22 into which the leg portion 43 is inserted. According to this, by providing the conductor pattern that constitutes the winding 30 around one through-hole 22, the size of the magnetic component in the in-plane direction of the multilayer substrate 10 can be reduced.

[0049] (Third embodiment) The third embodiment will be described. The third embodiment is different from the first embodiment in that the configuration of the core and winding 30 is changed, but the rest is the same as the first embodiment, so only the parts that are different from the first embodiment will be described.

[0050] 11 , in the third embodiment, the first core 40 and the second core 50 are both U-shaped cores. Specifically, the first core 40 integrally has a first bottom 41 and two first leg portions 42 and 43. The first bottom 41 is disposed on the outer side of the multilayer substrate 10 on which the sixth conductor pattern 36 is provided. The two first leg portions 42 and 43 extend in a direction intersecting (specifically, a direction perpendicular to) the first bottom 41 and are inserted into a plurality of through holes 21 and 22 in the multilayer substrate 10, respectively.

[0051] The second core 50 integrally has a second bottom 51 and two second leg portions 52, 53. The second bottom portion 51 is disposed on the outer side of the multilayer substrate 10, on which the first conductor pattern 31 is provided. In other words, the second bottom portion 51 is disposed on the opposite side of the multilayer substrate 10 from the first bottom portion 41 of the first core 40. The two second leg portions 52, 53 extend in a direction intersecting (specifically, a direction perpendicular to) the second bottom portion 51, and are inserted into a plurality of through holes 21, 22 of the multilayer substrate 10, respectively.

[0052] The first core 40 and the second core 50 can have the same shape. One of the first legs 42, 43 and one of the second legs 52, 53 are arranged opposite each other across a gap 71 inside the first through hole 21. The other of the first legs 42, 43 and the other of the second legs 52, 53 are arranged opposite each other across a gap 72 inside the second through hole 22.

[0053] For ease of explanation, in the third embodiment as well, the multiple conductor patterns 31 to 36 will be referred to as the first conductor pattern 31, the second conductor pattern 32, the third conductor pattern 33, the fourth conductor pattern 34, the fifth conductor pattern 35, and the sixth conductor pattern 36, in that order from the top to the bottom of the paper in FIG. 11.

[0054] In the third embodiment, of the multiple conductor patterns 31 to 36, the conductor patterns closest to the gaps 71, 72 in the plate thickness direction are the third conductor pattern 33 and the fourth conductor pattern 34. In the third embodiment, the third conductor pattern 33 and the fourth conductor pattern 34 correspond to the "gap-side conductor patterns 33, 34." In the third embodiment, the third conductor pattern 33 and the fourth conductor pattern 34 are formed to have smaller in-plane widths than the other conductor patterns 31, 32, 35, 36 so that the distance between the gaps 71, 72 and the conductor patterns in the in-plane direction is greater.

[0055] Also in the third embodiment, among the multiple conductor patterns 31 to 36, the conductor patterns that are positioned closer to the gaps 71, 72 in the plate thickness direction have smaller in-plane widths so that the in-plane distance between the gaps 71, 72 and the conductor pattern increases. Specifically, the third and fourth conductor patterns 33, 34 have smaller in-plane widths than the second and fifth conductor patterns 32, 35 so that the in-plane distance between the gaps 71, 72 and the conductor pattern increases. Furthermore, the second and fifth conductor patterns 32, 35 have smaller in-plane widths than the first and sixth conductor patterns 31, 36 so that the in-plane distance between the gaps 71, 72 and the conductor pattern increases.

[0056] In the third embodiment described above, the first core 40 integrally includes the first bottom 41 and the plurality of first legs 42, 43. The second core 50 integrally includes the second bottom 51 and the plurality of second legs 52, 53. The first legs 42, 43 and the second legs 52, 53 are disposed inside the through holes 21, 22 with gaps 71, 72 between them. This allows the first core 40 and the second core 50 to have the same shape. Therefore, by reducing the number of types of cores, it is possible to reduce component costs, manufacturing costs, management costs, and the like. In the third embodiment, the first core 40 and the second core 50 are both described as U-shaped cores, but this is not limited thereto. For example, the first core 40 and the second core 50 may both be E-shaped cores or the like.

[0057] (Fourth embodiment) The fourth embodiment will be described. The fourth embodiment is different from the first embodiment in that the configuration of the core and winding 30 is changed, but the rest is the same as the first embodiment, so only the parts that are different from the first embodiment will be described.

[0058] 12 , in the fourth embodiment, the first core 40 is an E-shaped core, and the second core 50 is an I-shaped core. Specifically, the first core 40 integrally includes a first bottom 41 and three first leg portions 42, 43, and 44. The first bottom 41 is disposed on the outer side of the multilayer substrate 10 on which the sixth conductor pattern 36 is provided. The three first leg portions 42, 43, and 44 extend in a direction intersecting (specifically, perpendicular to) the first bottom 41. Of the three first leg portions 42, 43, and 44, the central first leg portion 43 is inserted into a through-hole 23 provided in the multilayer substrate 10.

[0059] The second core 50 is formed in a plate shape and is arranged on the outside of the side where the first conductor pattern 31 (i.e., the gap-side conductor pattern 31) is provided in the multilayer substrate 10. The second core 50 is arranged with gaps 71, 72, 73 interposed between the end faces 45, 46, 47 of the three legs 42, 43, 44 of the first core 40, respectively.

[0060] The plurality of conductor patterns 31 to 36 are arranged around one through-hole 23 into which the first leg 43 at the center of the first core 40 is inserted. The plurality of conductor patterns 31 to 36 are arranged on the plurality of insulating layers 11 to 15 of the multilayer substrate 10, and are electrically connected through vias (not shown) to form the winding 30.

[0061] In the fourth embodiment, the first conductor pattern 31 corresponds to the gap-side conductor pattern 31. The gap-side conductor pattern 31 is formed to have a smaller in-plane width than the other conductor patterns 32 to 36 so that the distance between the gaps 71, 72, and 73 and the conductor pattern in the in-plane direction increases. Also in the fourth embodiment, among the multiple conductor patterns 31 to 36, the conductor patterns that are positioned closer to the gaps 71, 72, and 73 in the plate thickness direction have smaller in-plane widths so that the distance between the gaps 71, 72, and 73 and the conductor pattern in the in-plane direction increases.

[0062] In the fourth embodiment described above, the first core 40 integrally includes a first bottom portion 41 provided on the outside of the multilayer substrate 10 and a first leg portion 43 inserted into the through hole 23. The second core 50 is disposed on the opposite side of the bottom portion 41 of the first core 40 outside the multilayer substrate 10, with gaps 71, 72, 73 interposed between the end faces 45, 46, 47 of the first legs 42, 43, 44. This allows the gaps 71, 72, and 73 between the first legs 42, 43, and 44 of the first core 40 and the second core 50 to be formed outside the multilayer substrate 10. This increases the distance between the conductor patterns and the gaps 71, 72, and 73, suppressing leakage flux from interlinking with the gap-side conductor pattern 31 and reducing eddy current loss. It also prevents the conductor patterns and the multilayer substrate 10 from being burned due to heat generated by eddy currents.

[0063] Specifically, in the fourth embodiment, the first core 40 is an E-shaped core having three legs 42, 43, and 44, and the second core 50 is an I-shaped core. According to this, the core is exemplified by a combination of an E-shaped core and an I-shaped core.

[0064] In the fourth embodiment, the winding 30 provided in the magnetic component is made up of a plurality of conductor patterns 31 to 36 provided around one through-hole 23 into which one leg 43 is inserted. According to this, by providing the conductor pattern that constitutes the winding 30 around one through hole 23, the size of the magnetic component in the in-plane direction of the multilayer substrate 10 can be reduced.

[0065] (Fifth embodiment) The fifth embodiment will be described. The fifth embodiment is the same as the first embodiment except that a cooler is added, and therefore only the differences from the first embodiment will be described.

[0066] As shown in FIG. 13A , the magnetic component of the fifth embodiment includes a cooler 80. The cooler 80 is disposed on the bottom 41 side of the first core 40. The cooler 80 is disposed directly or across the insulating layer 15 on the bottom 41 side of the multilayer substrate 10 from conductor patterns (specifically, the fifth and sixth conductor patterns 35, 36) disposed on the insulating layer on the bottom 41 side of the first core 40, among the multiple insulating layers 11 to 15 constituting the multilayer substrate 10. Specifically, the cooler 80 is disposed across a position directly facing the sixth conductor pattern 36, a position facing the bottom 41 of the first core 40, and a position facing the fifth conductor pattern 35 across the insulating layer 15 on the bottom 41 side of the multilayer substrate 10. This allows the cooler 80 to efficiently absorb heat generated by the winding 30, as indicated by arrows H. In other words, the winding 30 can efficiently dissipate heat generated by energization to the cooler 80.

[0067] As a modification of the fifth embodiment, as shown in FIG. 13B, a heat dissipation material 81a may be inserted between the first core 40 and the cooler 80. Also, a heat dissipation material 81b may be inserted between the multilayer substrate 10 and the cooler 80. Also, a heat dissipation material 81c may be inserted between the cooler 80 and a conductor pattern (e.g., sixth conductor pattern 36) provided on an insulating layer on the bottom 41 side of the first core 40, among the multiple insulating layers 11 to 15 constituting the multilayer substrate 10. Also, a heat dissipation material 81d may be inserted between the multilayer substrate 10 (including the conductor pattern) and the first core 40. Also, the heat dissipation materials 81a to 81d may be formed as an integrated unit or as separate members.

[0068] In the fifth embodiment and its modified examples described above, the magnetic component includes the cooler 80 disposed on the bottom portion 41 side of the first core 40. This improves heat dissipation from the conductor patterns to cooler 80 via first core 40, preventing burnout due to heat generation in the conductor patterns and multilayer substrate 10. Also, improving the heat dissipation of the conductor patterns and preventing temperature increases reduces the resistance of the conductor patterns and reduces power loss. Furthermore, since a wide conductor pattern is disposed on the bottom 41 side of first core 40, disposing cooler 80 on the bottom 41 side of first core 40 improves heat dissipation from winding 30.

[0069] In addition, in the fifth embodiment and its variants, the cooler 80 is provided at a position facing the conductor pattern provided on the insulating layer on the bottom 41 side of the multiple insulating layers 11 to 15 that make up the multilayer substrate 10, either directly or across the insulating layer on the bottom 41 side, and at a position facing the bottom 41. According to this, wide conductor patterns 35, 36 are arranged on the insulating layer on the bottom 41 side of the multiple insulating layers 11 to 15 that make up the multilayer substrate 10, and by arranging the cooler 80 in a position opposite the conductor patterns, the heat dissipation performance of the winding 30 can be improved.

[0070] (Sixth embodiment) The sixth embodiment will be described. The sixth embodiment is different from the first embodiment in that the configuration of the winding 30 is changed, but the rest is the same as the first embodiment, so only the parts that are different from the first embodiment will be described.

[0071] 14, also in the sixth embodiment, the gap-side conductor pattern 31 is formed to have smaller in-plane widths W1, W10 than the other conductor patterns 32 to 36 so that the in-plane distance D1 between the gaps 71, 72 and the conductor pattern is increased. Note that in the sixth embodiment, the first conductor pattern 31 corresponds to the "gap-side conductor pattern 31."

[0072] In other words, the conductor pattern 31 provided on the insulating layer 11 that is closest to the gaps 71, 72 in the thickness direction among the multiple insulating layers 11-15 of the multilayer substrate 10 has smaller in-plane widths W1, W10 than the conductor patterns 32-36 provided on the other insulating layers so that the in-plane distance D1 between the gaps 71, 72 and the conductor pattern is greater. Note that the insulating layer 11 that is closest to the gaps 71, 72 in the thickness direction among the multiple insulating layers 11-15 of the multilayer substrate 10 corresponds to the first insulating layer 11 in the sixth embodiment.

[0073] In the sixth embodiment, the conductor patterns excluding the gap-side conductor pattern 31, i.e., the second to sixth conductor patterns 32 to 36, have the same width in the in-plane direction of the conductor patterns. The conductor patterns 32 to 36 excluding the gap-side conductor pattern 31 also have the same distance in the in-plane direction between the gaps 71, 72 and the conductor patterns. Note that "same" includes not only completely same but also substantially same due to manufacturing tolerances and the like.

[0074] In the sixth embodiment described above, the gap-side conductor pattern 31 is formed to have smaller in-plane widths W1 and W10 than the other conductor patterns 32 to 36 so that the in-plane distance D1 between the gaps 71 and 72 and the conductor pattern is greater. This prevents leakage flux generated in the gaps 71, 72 from interlinking with the gap-side conductor pattern 31. This prevents eddy currents from occurring in the gap-side conductor pattern 31, reducing eddy current loss. It also prevents burnout of the conductor patterns and multilayer substrate 10 due to heat generated by eddy currents. Furthermore, it is possible to provide the conductor pattern 31 on the insulating layer 11 that is closest to the gaps 71, 72 among the multiple insulating layers 11 to 15 of the multilayer substrate 10. Therefore, compared to the first comparative example, the magnetic component of the sixth embodiment can also reduce the number of insulating layers of the multilayer substrate 10 if the number of conductor pattern layers is the same. Therefore, this magnetic component can reduce the size of the multilayer substrate 10 in the thickness direction. Furthermore, by reducing the in-plane widths W1 and W10 of the gap-side conductor pattern 31 in the magnetic component of the sixth embodiment, the size of the multilayer substrate 10 in the in-plane direction can be made smaller than that of the second comparative example.

[0075] In addition, in the sixth embodiment, the conductor pattern 31 provided on the insulating layer 11 that is closest to the gaps 71, 72 in the thickness direction among the multiple insulating layers 11 to 15 of the multilayer substrate 10 is formed to have smaller in-plane widths W1, W10 than the conductor patterns provided on the other insulating layers so that the in-plane distance D1 between the gaps 71, 72 and the conductor pattern is greater. According to this, the magnetic component of the sixth embodiment has a conductor pattern on insulating layer 11, which is closest to gaps 71 and 72 among the multiple insulating layers 11 to 15 of multilayer substrate 10, and therefore, compared to the first comparative example, it is possible to reduce the number of insulating layers of multilayer substrate 10 for the same number of conductor pattern layers. Therefore, this magnetic component can reduce the size of multilayer substrate 10 in the thickness direction.

[0076] (Modification of the sixth embodiment) In the sixth embodiment, only the gap-side conductor pattern 31 is formed to have a smaller in-plane width than the other conductor patterns 32 to 36 so that the in-plane distance between the gaps 71, 72 and the conductor pattern is increased. In contrast to this, as a modification of the sixth embodiment, in addition to the gap-side conductor pattern 31, the conductor pattern below it (for example, the second conductor pattern 32) may also be formed to have a smaller in-plane width than the other conductor patterns 32 to 36 so that the in-plane distance between the gaps 71, 72 and the conductor pattern is increased.

[0077] Seventh embodiment The seventh embodiment will be described. The seventh embodiment is different from the first embodiment in that the configuration of the winding 30 is changed, but the rest is the same as the first embodiment, so only the parts that are different from the first embodiment will be described.

[0078] The magnetic component of the seventh embodiment is a transformer used in various electric circuits, such as the power supply circuit of an electric vehicle, etc. As shown in Figures 15 to 21, the magnetic component of the seventh embodiment also includes a multilayer substrate 10, through holes 21 and 22, a winding 30, a first core 40, and a second core 50, similar to the first embodiment.

[0079] The winding 30 is formed by electrically connecting a plurality of conductor patterns 31-36 provided on a plurality of insulating layers 11-15 of the multilayer substrate 10 vias or the like. As shown in Figures 15, 16, 18, and 20, the first, third, and fifth conductor patterns 31, 33, and 35 are provided around the first through hole 21 and form a primary winding. As shown in Figures 15, 17, 19, and 21, the second, fourth, and sixth conductor patterns 32, 34, and 36 are provided around the second through hole 22 and form a secondary winding.

[0080] 16 to 21, the multilayer substrate 10 is provided with a plurality of through vias 61 to 64. For ease of explanation, the plurality of through vias 61 to 64 may be referred to as a first via 61, a second via 62, a third via 63, and a fourth via 64, in that order, from right to left in FIGS. 2 to 7. One end of the primary winding shown in FIG. 16 is referred to as a primary winding-side first end 66, and the other end of the primary winding shown in FIG. 20 is referred to as a primary winding-side second end 67. One end of the secondary winding shown in FIG. 17 is referred to as a secondary winding-side first end 68, and the other end of the secondary winding shown in FIG. 21 is referred to as a secondary winding-side second end 69.

[0081] The multiple conductor patterns 31, 33, and 35 that make up the primary winding are electrically connected, for example, as follows: the first end portion 66 of the primary winding shown in Fig. 16 → the first conductor pattern 31 → the second via 62 → the third conductor pattern 33 shown in Fig. 18 → the first via 61 → the fifth conductor pattern 35 shown in Fig. 20 → the second end portion 67 of the primary winding.

[0082] The multiple conductor patterns 32, 34, 36 that make up the secondary winding are electrically connected, for example, as follows: secondary winding side first end 68 shown in Fig. 17 → second conductor pattern 32 → third via 63 → fourth conductor pattern 34 shown in Fig. 19 → fourth via 64 → sixth conductor pattern 36 shown in Fig. 21 → secondary winding side second end 69. Note that the method of connecting the multiple conductor patterns 31 to 36 is not limited to the above and can be changed as desired.

[0083] In the seventh embodiment described above, as in the first embodiment, the gap-side conductor pattern 31 is formed with smaller in-plane widths W1 and W10 than the other conductor patterns 32 to 36 so that the in-plane distance D1 between the gaps 71 and 72 and the conductor pattern is increased. Furthermore, among the multiple conductor patterns 31 to 36, the conductor patterns that are positioned closer to the gaps 71 and 72 in the plate thickness direction have smaller in-plane widths so that the in-plane distance between the gaps 71 and 72 and the conductor pattern is increased. Therefore, the transformer as a magnetic component of the seventh embodiment can also achieve the same effects as the first embodiment.

[0084] (Other embodiments) (1) In the first embodiment and the like, the conductor pattern provided on the surface of the first insulating layer 11 of the multilayer substrate 10 facing the second core 50 is the gap-side conductor pattern 31. However, this is not limiting, and for example, the conductor pattern provided between the first insulating layer 11 and the second insulating layer 12 of the multilayer substrate 10 may be the gap-side conductor pattern 31. This configuration also reduces the number of insulating layers of the multilayer substrate 10 and makes it possible to reduce the size in the thickness direction, compared to a configuration in which conductor patterns are not provided on both surfaces of the insulating layer closest to the second core 50, as in Patent Document 1.

[0085] (2) In the first embodiment and the like, all of the conductor patterns 31 to 36 constituting the winding 30 are formed with smaller in-plane widths so that the closer the conductor pattern is to the gaps 71 and 72 in the plate thickness direction, the greater the in-plane distance between the gaps 71 and 72 and the conductor pattern. However, this is not limited to this. For example, some of the conductor patterns 31 to 36 constituting the winding 30 may be formed with smaller in-plane widths so that the closer the conductor pattern is to the gaps 71 and 72 in the plate thickness direction, the greater the in-plane distance between the gaps 71 and 72 and the conductor pattern. In this case, the in-plane widths of the conductor patterns of the other part of the conductor patterns 31 to 36 constituting the winding 30 may be the same or different.

[0086] (3) In the above embodiments, the conductor patterns 31 to 36 constituting the winding 30 are described as being in six layers, but this is not limiting and the number of layers of the conductor patterns constituting the winding 30 can be changed as desired. In addition, the method of electrically connecting the multiple conductor patterns 31 to 36 can also be changed as desired.

[0087] (4) In the above embodiments, the multilayer substrate 10 is described as having five insulating layers 11 to 15, but the number of insulating layers constituting the multilayer substrate 10 is not limited to five and may be changed arbitrarily.

[0088] (5) In the above embodiments, the combinations of the first core 40 and the second core 50 are described as a U-shaped core + an I-shaped core, a U-shaped core + a U-shaped core, and an E-shaped core + an I-shaped core. However, the first core 40 and the second core 50 are not limited to these, and any shape and any combination can be adopted.

[0089] (6) In the first embodiment and the like, the first core 40 has been described as having a plurality of legs 42, 43, and 44. However, the present invention is not limited to this. For example, the first core 40 may have at least one leg.

[0090] (7) In the above first embodiment, the first core 40 and the second core 50 are described as being arranged with multiple gaps 71, 72, and 73 between them, but this is not limited thereto. For example, the first core 40 and the second core 50 may be configured to be arranged with at least one gap between them.

[0091] (8) In the above first embodiment and the like, the surface 311 of the gap-side conductor pattern 31 facing the second core 50 has been described as being located on the opposite side of the second core 50 from the end faces 45, 46, 47 of the legs 42, 43, 44 of the first core 40 that face the second core 50, but this is not limited to this. The surface 311 of the gap-side conductor pattern 31 facing the second core 50 may be located at the same position in the thickness direction of the multilayer substrate 10 as the end faces 45, 46, 47 of the legs 42, 43, 44 of the first core 40 that face the second core 50, or may be located on the second core 50 side.

[0092] The present disclosure is not limited to the above-described embodiments and can be modified as appropriate within the scope of the claims. Furthermore, the above-described embodiments and portions thereof are not unrelated to each other and can be combined as appropriate unless the combination is clearly impossible. It goes without saying that, in each of the above embodiments, the elements constituting the embodiments are not necessarily essential unless specifically stated as essential or clearly considered essential in principle. Furthermore, in each of the above embodiments, when numerical values ​​such as the number, values, amounts, and ranges of components of the embodiments are mentioned, they are not limited to the specific numbers unless specifically stated as essential or clearly limited to a specific number in principle. Furthermore, in each of the above embodiments, when the shape, positional relationship, etc. of components are mentioned, they are not limited to the shape, positional relationship, etc., unless specifically stated or limited to a specific shape, positional relationship, etc. in principle. [Explanation of symbols]

[0093] 10: multilayer substrate, 11: first insulating layer, 12: second insulating layer, 13: third insulating layer, 14: fourth insulating layer, 15: fifth insulating layer, 21-23: through holes, 30: winding, 31: first conductor pattern, 32: second conductor pattern, 33: third conductor pattern, 34: fourth conductor pattern, 35: fifth conductor pattern, 36: sixth conductor pattern, 40: first core, 42-44: legs, 45-47: end faces of legs, 50: second core, 71-73: gaps.

Claims

1. In magnetic components, a multilayer substrate (10) having a plurality of insulating layers (11-15) formed of insulating material; through holes (21 to 23) penetrating a plurality of the insulating layers in a thickness direction of the multilayer substrate; a winding (30) configured by electrically connecting a plurality of conductor patterns (31 to 36) provided on a plurality of the insulating layers around the through hole; a first core (40) having at least one leg (42-44) inserted into the through hole; a second core (50) disposed on the end surfaces (45-47) of the legs via gaps (71-73) and constituting a magnetic circuit together with the first core; A magnetic component, wherein the conductor pattern closest to the gap in the plate thickness direction among the plurality of conductor patterns is formed to have a smaller width in the in-plane direction than the other conductor patterns so that the distance between the gap and the conductor pattern in the in-plane direction of the multilayer substrate is greater.

2. 2. The magnetic component according to claim 1, wherein the conductor pattern provided on the insulating layer closest to the gap in the plate thickness direction among the plurality of insulating layers of the multilayer substrate is formed to have a smaller width in the in-plane direction than the conductor patterns provided on the other insulating layers, so that the distance between the gap and the conductor pattern in the in-plane direction is greater.

3. 3. The magnetic component according to claim 1, wherein at least some of the conductor patterns constituting the winding are formed so that the closer a conductor pattern is positioned to the gap in the plate thickness direction, the smaller its width in the in-plane direction is, such that the distance between the gap and the conductor pattern in the in-plane direction is greater.

4. the first core integrally includes a bottom portion (41) provided on the outside of the multilayer substrate and a plurality of leg portions extending in a direction intersecting the bottom portion and inserted into the plurality of through holes, 3. The magnetic component according to claim 1, wherein the second core is disposed on the outside of the multilayer substrate on the opposite side to the bottom portion, with the gap interposed between the second core and at least one of the end faces of the plurality of legs.

5. the first core has two or three of the legs, 5. The magnetic component according to claim 4, wherein the second core is disposed relative to each of the end faces of the two or three legs of the first core, with the gaps interposed therebetween.

6. the first core integrally includes a first bottom portion provided on the outside of the multilayer substrate and a plurality of first leg portions as the leg portions extending in a direction intersecting the first bottom portion and inserted into the plurality of through holes, respectively; 3. The magnetic component according to claim 1, wherein the second core integrally includes a second bottom portion (51) arranged on the opposite side of the first bottom portion on the outside of the multilayer substrate, and a plurality of second legs (52, 53) extending in a direction intersecting the second bottom portion, inserted into the plurality of through holes, and arranged across the gap from the plurality of first legs.

7. 3. The magnetic component according to claim 1, wherein the winding is configured by a plurality of the conductor patterns provided on a plurality of the insulating layers of the multilayer substrate around one of the through holes into which one of the plurality of leg portions of the first core is inserted.

8. the first core integrally includes a bottom portion provided on the outside of the multilayer substrate and the leg portion extending in a direction intersecting the bottom portion and inserted into the through hole, The magnetic component according to claim 1 or 2, further comprising a cooler (80) disposed on the bottom side.

9. 9. The magnetic component according to claim 8, wherein the cooler is provided across a position facing the conductor pattern provided on the insulating layer on the bottom side of the plurality of insulating layers constituting the multilayer substrate, either directly or across the insulating layer on the bottom side, and a position facing the bottom.

10. 3. The magnetic component according to claim 1, wherein a surface (311) of the conductor pattern closest to the gap in the plate thickness direction among the plurality of conductor patterns facing the second core is located on the opposite side to the second core with respect to an end surface (45, 46) of the leg portion of the first core facing the second core.

11. In magnetic components, a multilayer substrate (10) having a plurality of insulating layers (11-15) formed of insulating material; through holes (21 to 23) penetrating a plurality of the insulating layers in a thickness direction of the multilayer substrate; a winding (30) configured by electrically connecting a plurality of conductor patterns (31 to 36) provided on a plurality of the insulating layers around the through hole; a first core (40) having at least one leg (42-44) inserted into the through hole; a second core (50) disposed on the end surfaces (45-47) of the legs via gaps (71-73) and constituting a magnetic circuit together with the first core; A magnetic component, wherein the conductor pattern closest to the gap in the plate thickness direction among the plurality of conductor patterns is formed to have a smaller width in the in-plane direction of the multilayer substrate than the other conductor patterns so as to avoid leakage magnetic flux generated at the gap.

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