Display and sheet for optical-semiconductor-element encapsulation

Abstract

To provide a display body which is excellent in antireflection property of a substrate surface and has high luminance.SOLUTION: The display 1 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c disposed on the substrate 2, and a sealing-resin layer 4 that seals the plurality of optical semiconductor elements 3a to 3c. A total thickness HA of the colored layer at a perpendicular PA, a total thickness IA of the non-colored layer at the perpendicular PA, and a total thickness HC of the colored layer at a perpendicular PC, where the perpendicular PA is a perpendicular to the front face of the substrate 2 passing through a center of gravity GA of the optical semiconductor device 3a, and the perpendicular PC is a perpendicular to the front face of the substrate 2 passing through a midpoint C between the center of gravity GA of the optical semiconductor device 3a and a center of gravity GB of the optical semiconductor device 3a adjacent to the optical semiconductor device 3b in the same pixel 3; And the total thickness IC of the non-colored layer at the perpendicular line PC satisfies the following formula (1). HA / HC<IA / IC(1) SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a display body and a sheet for encapsulating an optical semiconductor element. More specifically, the present invention relates to a display body in which an optical semiconductor element of, for example, a self-luminous display device is encapsulated, and a sheet suitable for use in encapsulating an optical semiconductor element. [Background technology]

[0002] In recent years, self-emitting display devices, such as mini / micro LED display devices (Mini / Micro Light Emitting Diode Displays), have been devised as next-generation display devices. Mini / micro LED display devices basically consist of a substrate on which numerous tiny optical semiconductor elements (LED chips) are densely arranged, used as a display panel, with the optical semiconductor elements encapsulated in an encapsulant and a cover member such as a resin film or glass plate laminated on the outermost surface.

[0003] In displays equipped with self-luminous display devices such as mini / micro LED display devices, wiring (metal wiring) made of metal or metal oxide such as ITO is arranged on the substrate of the display panel. Such display devices have a problem in that, for example, when the light is off, the metal wiring reflects light, making the screen look bad and resulting in poor design. For this reason, a technology has been adopted in which an anti-reflection layer is used as an encapsulant for encapsulating optical semiconductor elements to prevent reflection from the metal wiring.

[0004] Patent Document 1 discloses a pressure-sensitive adhesive sheet that is a laminate of a colored pressure-sensitive adhesive layer and a colorless pressure-sensitive adhesive layer, in which the colorless pressure-sensitive adhesive layer is positioned so as to come into contact with an optical semiconductor element. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2020-169262 Summary of the Invention [Problem to be solved by the invention]

[0006] However, although the adhesive sheet having the colored adhesive layer of Patent Document 1 is expected to prevent reflections from metal wiring when sealing an optical semiconductor element and suppress brightness unevenness, it has the problem of reducing the transmittance of light emitted by the optical semiconductor element, resulting in a reduction in the front brightness of the display. When the front brightness decreases, power consumption increases in order to increase the brightness.

[0007] The present invention was conceived under these circumstances, and an object of the present invention is to provide a display having excellent antireflection properties on the substrate surface and high brightness. Another object of the present invention is to provide a sheet for encapsulating a semiconductor element, which can be used to produce a display having excellent antireflection properties on the substrate surface and high brightness by encapsulating an optical semiconductor element. [Means for solving the problem]

[0008] As a result of intensive research to achieve the above object, the inventors have found that, when a plurality of optical semiconductor elements arranged on a substrate are encapsulated with an encapsulating resin layer including colored layers and non-colored layers, a display having a specific relationship between the total thickness of the colored layers and the total thickness of the non-colored layers located on the front side of the optical semiconductor elements, and between the two nearest optical semiconductor elements, can provide excellent anti-reflection properties on the substrate surface and high brightness. The present invention was completed based on these findings.

[0009] That is, the present invention provides a display comprising a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements, the sealing resin layer includes a colored layer and a non-colored layer, A perpendicular line to the substrate surface passing through the center of gravity of the first optical semiconductor element is defined as perpendicular line P A , A perpendicular line to the substrate surface passing through the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel is defined as a perpendicular line P C When Above perpendicular line P A The total thickness H of the colored layers A , the above perpendicular P A The total thickness I of the non-colored layers A , the above perpendicular P C The total thickness H of the colored layers C , and the perpendicular P C The total thickness I of the non-colored layers C provides a display that satisfies the following formula (1). H A / H C A / I C (1)

[0010] In the display, the sealing resin layer that seals the optical semiconductor element includes the colored layer, so that reflection of light by metal wiring or the like provided on the substrate can be prevented. A / H C In the concave-convex shape in which the substrate surface is the concave portion and the optical semiconductor element is the convex portion, I corresponds to the ratio of the total thickness of the colored layer in the convex portion to the total thickness of the colored layer in the concave portion. A / I C corresponds to the ratio of the total thickness of the non-colored layers in the convex portions to the total thickness of the non-colored layers in the concave portions. A / H C A / I C Satisfying the above formula (1) indicates that the difference in the total thickness of the colored layer between the convex portions and the concave portions is greater than the difference in the total thickness of the non-colored layer, and allows more light emitted from the optical semiconductor element, which is the convex portion, to pass through in the front direction, while preventing the transmission of reflected light at the concave portions. Therefore, by satisfying the above formula (1), the display of the present invention has excellent anti-reflection properties on the substrate surface and high brightness.

[0011] ​​The height of the optical semiconductor element on the substrate is preferably 500 μm or less. When the height is 500 μm or less, the sealing resin layer is more excellent in conformity to the uneven shape formed by the optical semiconductor element and the substrate surface.

[0012] The reflected hue when not lit is L * ≦50, -10≦a * ≦10, and -10 ≦ b * It is preferable that the value satisfies the condition ≦10. With such a configuration, the display unit looks good when it is not lit.

[0013] The colored layer preferably has adhesiveness. With such a configuration, the encapsulating resin layer can easily encapsulate the optical semiconductor element, and also has excellent adhesion between the layers, resulting in superior encapsulation of the optical semiconductor element.

[0014] The display preferably comprises a self-luminous display device.

[0015] The display is preferably an image display device.

[0016] The present invention also provides a sheet for encapsulating a plurality of optical semiconductor elements arranged on a substrate, comprising: the sheet includes a sealing resin layer including a colored layer and a non-colored layer; When the plurality of optical semiconductor elements are encapsulated with the encapsulating resin layer to form the encapsulating resin layer, A perpendicular line to the substrate surface passing through the center of gravity of the first optical semiconductor element is defined as perpendicular line P A , A perpendicular line to the substrate surface passing through the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel is defined as a perpendicular line P C When Above perpendicular line P A The total thickness H of the colored layers A , the above perpendicular P A The total thickness I of the non-colored layers A , the above perpendicular P CThe total thickness H of the colored layers C , and the perpendicular P C The total thickness I of the non-colored layers C Provided is a sheet for encapsulating an optical semiconductor element that can satisfy the following formula (1): H A / H C A / I C (1)

[0017] The colored layer preferably has adhesive properties. [Effects of the Invention]

[0018] The display of the present invention has excellent anti-reflection properties on the substrate surface and high brightness. Therefore, the display is bright and looks good without increasing power consumption. Furthermore, light reflection due to metal wiring on the substrate is suppressed, and the display looks good even when the optical semiconductor element is not lit. Furthermore, by encapsulating an optical semiconductor element using the sheet for encapsulating an optical semiconductor element of the present invention, a display having excellent anti-reflection properties on the substrate surface and high brightness can be provided. [Brief explanation of the drawings]

[0019] [Figure 1] FIG. 1 is a partial top view of an optical member in which a plurality of optical semiconductor elements are arranged on a substrate in pixel units. [Figure 2] 1 is a partial cross-sectional view showing an embodiment of a display of the present invention. [Figure 3] FIG. 3 is a partially enlarged view of the display shown in FIG. [Figure 4] 3 is a partial cross-sectional view showing how an optical semiconductor element of the display shown in FIG. 2 emits light. FIG. [Figure 5] FIG. 10 is a partial cross-sectional view showing how an optical semiconductor element of a conventional display emits light. [Figure 6] FIG. 10 is a partial cross-sectional view showing another embodiment of the display of the present invention. [Figure 7] FIG. 7 is a partially enlarged view of the display shown in FIG. [Figure 8] FIG. 10 is a partial cross-sectional view showing still another embodiment of the display of the present invention.​ [Figure 9] FIG. 9 is a partially enlarged view of the display shown in FIG. [Figure 10] 1 is a cross-sectional view showing one embodiment of a sheet for encapsulating an optical semiconductor element of the present invention. [Figure 11] 11 is a partial cross-sectional view showing a step of encapsulating an optical semiconductor element using the optical semiconductor element encapsulation sheet shown in FIG. 10. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0020] [Display] The display of the present invention includes at least a substrate, a plurality of optical semiconductor elements arranged on the substrate, and an encapsulating resin layer encapsulating the plurality of optical semiconductor elements. The display is a device for displaying information using light emitted by the optical semiconductor elements.

[0021] Examples of the optical semiconductor element include light emitting diodes (LEDs) such as blue light emitting diodes, green light emitting diodes, red light emitting diodes, and ultraviolet light emitting diodes.

[0022] The plurality of optical semiconductor elements are arranged within one pixel (picture element) on the substrate, and a plurality of pixels are arranged. That is, the plurality of optical semiconductor elements are arranged for each pixel including a plurality of optical semiconductor elements. FIG. 1 shows a partial top view of an optical member in which a plurality of optical semiconductor elements are arranged for each pixel on a substrate. In the optical member 11 shown in FIG. 1, three optical semiconductor elements 3a to 3c are arranged closely to each other on a substrate 2, and the three optical semiconductor elements 3a to 3c form one pixel (pixel 3). Furthermore, three optical semiconductor elements 3d to 3f are arranged closely to each other on the substrate 2, and the three optical semiconductor elements 3d to 3f form one pixel (pixel 3'). A plurality of pixels, such as pixel 3 and pixel 3', are arranged on the substrate 2.

[0023] The display of the present invention has an uneven shape formed by the substrate and the optical semiconductor elements, with the substrate surface in the area between the two closest optical semiconductor elements where no optical semiconductor elements are placed being a recess and the optical semiconductor elements being a protrusion.

[0024] The height of the optical semiconductor element on the substrate (the height from the surface of the substrate to the front end of the optical semiconductor element) is preferably 500 μm or less. When the height is 500 μm or less, the sealing resin layer has better ability to conform to the uneven shape.

[0025] It is preferable that the encapsulating resin layer contacts the plurality of optical semiconductor elements and conforms to the uneven shape. It is also preferable that the encapsulating resin layer collectively encapsulates the plurality of optical semiconductor elements. In this specification, "encapsulating the optical semiconductor elements" means embedding at least a portion of the optical semiconductor elements in the encapsulating resin layer or conforming to and covering the optical semiconductor elements with the encapsulating resin layer.

[0026] The encapsulating resin layer includes at least a colored layer and a non-colored layer. In the encapsulating resin layer, the colored layer and the non-colored layer may be laminated directly or via another layer. The encapsulating resin layer may encapsulate the optical semiconductor element such that the colored layer side faces the optical semiconductor element, or such that the non-colored layer side faces the optical semiconductor element.

[0027] Any one of the plurality of optical semiconductor elements is designated as a first optical semiconductor element. An optical semiconductor element adjacent to the first optical semiconductor element in the same pixel is designated as a second optical semiconductor element. A perpendicular line P passing through the center of gravity of the first optical semiconductor element to the surface of the substrate is designated as a perpendicular line P. A A perpendicular line to the substrate surface that passes through the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element is defined as a perpendicular line P C At this time, the perpendicular line P A The total thickness H of the colored layers A , the above perpendicular P A The total thickness I of the non-colored layers A , the above perpendicular PC The total thickness H of the colored layers C , and the perpendicular P C The total thickness I of the non-colored layers C satisfies the following formula (1). H A / H C A / I C (1)

[0028] In the display, the sealing resin layer that seals the optical semiconductor element includes the colored layer, so that reflection of light by metal wiring or the like provided on the substrate can be prevented. A / H C In the concave-convex shape in which the substrate surface is the concave portion and the optical semiconductor element is the convex portion, I corresponds to the ratio of the total thickness of the colored layer in the convex portion to the total thickness of the colored layer in the concave portion. A / I C corresponds to the ratio of the total thickness of the non-colored layers in the convex portions to the total thickness of the non-colored layers in the concave portions. A / H C A / I C Satisfying the above formula (1) indicates that the difference in the total thickness of the colored layer between the convex portions and the concave portions is greater than the difference in the total thickness of the non-colored layer, and allows more light emitted from the optical semiconductor element, which is the convex portion, to pass through in the front direction, while preventing the transmission of reflected light at the concave portions. Therefore, by satisfying the above formula (1), the display of the present invention has excellent anti-reflection properties on the substrate surface and high brightness.

[0029] Here, the total thickness of the colored layer H A is the perpendicular P A For example, if the sealing resin layer has a plurality of colored layers, the total thickness H of the colored layers is A is the perpendicular P A The total thickness H of the colored layers is the sum of the thicknesses of all the colored layers located above the colored layers. C is the perpendicular P C For example, if the sealing resin layer has a plurality of colored layers, the total thickness H of the colored layers is​​C is the perpendicular P C It is the total thickness of all of the above-mentioned colored layers.

[0030] In addition, the total thickness of the non-colored layers I A is the perpendicular P A The total thickness of all non-colored layers located on the encapsulating resin layer is I. For example, if the encapsulating resin layer has a plurality of non-colored layers, the total thickness I of the non-colored layers is I. A is the perpendicular P A The total thickness of the non-colored layers is the sum of the thicknesses of all of the non-colored layers located above. C is the perpendicular P C The total thickness of all non-colored layers located on the encapsulating resin layer is I. For example, if the encapsulating resin layer has a plurality of non-colored layers, the total thickness I of the non-colored layers is I. C is the perpendicular P C It is the sum of the thicknesses of all of the above non-pigmented layers.

[0031] In this specification, the term "front" refers to the side from which the display is viewed, and is, for example, the upward direction in FIG. 2 described later.

[0032] (First embodiment) The display of the present invention will be described using one embodiment of the display shown in Fig. 2. The display 1 shown in Fig. 2 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, an encapsulating resin layer 4 that collectively encapsulates the optical semiconductor elements 3a to 3c, and a base material part 5 that is bonded to the surface of the encapsulating resin layer 4 on the side opposite to the optical semiconductor elements 3a to 3c. Fig. 2 is an enlarged view of a vertical cross section with respect to the substrate 2 that passes through the centers of gravity of the optical semiconductor elements 3a to 3c.

[0033] Each of the optical semiconductor elements 3a to 3c is fixed onto one substrate 2 by a support 31. The display 1 has an uneven shape formed by the substrate 2 and the optical semiconductor elements 3a to 3c, with the surface of the substrate 2 in areas between the optical semiconductor elements 3a to 3c where no optical semiconductor elements are arranged being recessed portions N and the optical semiconductor elements 3a to 3c being protruding portions P.

[0034] 2 are the optical semiconductor elements 3a to 3c shown in FIG. 1, and the optical semiconductor elements 3a to 3c are located within the same pixel 3. For example, the optical semiconductor element 3a is a first optical semiconductor element, and the optical semiconductor element 3b is a second optical semiconductor element adjacent to the optical semiconductor element 3a.

[0035] As shown in FIG. 2, the sealing resin layer 4 comes into contact with the plurality of optical semiconductor elements 3a to 3c, conforms to the uneven shape, and seals the plurality of optical semiconductor elements 3a to 3c collectively.

[0036] The sealing resin layer 4 is configured by directly laminating a non-colored layer 41, a colored layer 42, and a non-colored layer 43 in this order, and seals the optical semiconductor elements 3a to 3c so that the non-colored layer 41 side faces the optical semiconductor elements 3a to 3c. The non-colored layer 41 in contact with the optical semiconductor elements 3a to 3c conforms to the above-mentioned uneven shape, and the non-colored layer 41 also has an uneven shape in the display unit 1. Meanwhile, one surface of the colored layer 42 conforms to the uneven shape of the non-colored layer 41, thereby having an uneven shape that is the opposite of the uneven shape of the non-colored layer 41, and the other surface is flat. Both surfaces of the non-colored layer 43 are flat. The non-colored layer 41 and the non-colored layer 43 may each independently be a diffusion functional layer, as described below, or a non-diffusion functional layer.

[0037] When the non-colored layer 41 is a diffusion functional layer, the encapsulating resin layer 4 has, from the optical semiconductor element side, a diffusion functional layer, a colored layer, and a non-colored layer (particularly a non-diffusion functional layer) in this order. In this case, light emitted by the optical semiconductor element in the lateral direction or the like is diffused in the diffusion functional layer before entering the colored layer, thereby further improving the front brightness and further suppressing brightness unevenness.

[0038] That is, the encapsulating resin layer 4 includes, from the optical semiconductor element side 3a to 3c, a non-colored layer 41, a colored layer 42, and a non-colored layer 43 in this order. The encapsulating resin layer 4 encapsulates the optical semiconductor elements 3a to 3c such that the non-colored layer 41 is in contact with the optical semiconductor elements 3a to 3c.

[0039] 3 is a partial enlarged view of the area between the optical semiconductor elements 3a and 3b of the display 1 shown in FIG. 2. As shown in FIG. 3, in the display 1, the center of gravity of the optical semiconductor element 3a is G A , the center of gravity of the optical semiconductor element 3b is G B The center of gravity G of the optical semiconductor element 3a is A The perpendicular line to the surface of substrate 2 that passes through A The center of gravity G of the optical semiconductor element 3a A and the center of gravity G of the optical semiconductor element 3b B The midpoint of the two lines is C. The perpendicular line to the surface of the substrate 2 that passes through the midpoint C is called the perpendicular line P C Let P be the perpendicular line A The total thickness of the colored layer in H A , the total thickness of the non-colored layers is I A Let P be the perpendicular line C The total thickness of the colored layer in H C , the total thickness of the non-colored layers is I C In the display 1, the non-colored layer is composed of two layers, non-colored layers 41 and 43, so I A I A1 and I A2 is the total thickness of I C I C1 and I C2 In this case, the display 1 satisfies the following formula (1). A <H C and I A C Meet the following. H A / H C A / I C (1)

[0040] In the display 1, the sealing resin layer 4 that seals the optical semiconductor elements 3a to 3c includes the colored layer 42, so that it is possible to prevent light reflection due to metal wiring and the like provided on the substrate 2. A / H C In the uneven shape in which the surface of the substrate 2 between the optical semiconductor elements 3a and 3b is the recess N and the optical semiconductor element 3a is the protrusion P, I corresponds to the ratio of the total thickness of the colored layer 42 at the recess N to the total thickness of the colored layer 42 at the protrusion P. A ​​ / I C corresponds to the ratio of the total thickness of the non-colored layers 41 and 43 in the protrusions P to the total thickness of the non-colored layers 41 and 43 in the recesses N. A / H C A / I C Satisfying the above formula (1) means that the difference in the total thickness of the colored layer 42 between the convex portion P and the concave portion N is greater than the difference in the total thickness of the non-colored layers 41 and 43, and allows more light emitted from the optical semiconductor element 3a, which is the convex portion P, to pass through in the front direction, while preventing the transmission of reflected light at the concave portion N. Therefore, by satisfying the above formula (1), the display 1 has excellent anti-reflection properties on the substrate surface and high brightness.

[0041] In addition, in Figure 3, the case where optical semiconductor element 3a located at one end within a pixel satisfies the above formula (1) has been described. However, in addition to or instead of this case, the above formula (1) may be satisfied when an optical semiconductor element located within a pixel, such as optical semiconductor element 3b, is designated as the first optical semiconductor element, and an optical semiconductor element adjacent to the optical semiconductor element within the pixel, such as optical semiconductor element 3a and / or optical semiconductor element 3c, is designated as the second optical semiconductor element, or the above formula (1) may be satisfied when an optical semiconductor element located at the other end within a pixel, such as optical semiconductor element 3c, is designated as the first optical semiconductor element, and an optical semiconductor element adjacent to the optical semiconductor element located at the other end within the pixel, such as optical semiconductor element 3b, is designated as the second optical semiconductor element.

[0042] Furthermore, it is preferable that all optical semiconductor elements within the same pixel satisfy the above formula (1) in relation to all adjacent optical semiconductor elements. In this case, for example, light emitted from all optical semiconductor elements 3a to 3c within the same pixel as shown in Fig. 2 is easily transmitted in the front direction, further increasing the front brightness of the display 1. Furthermore, the anti-reflection properties of the substrate surface can be excellent between all optical semiconductor elements 3a to 3c within the same pixel.

[0043] Specifically, as shown in FIG. 4, light F emitted from the optical semiconductor elements 3a to 3c toward the front is A , F​B , and F C On the other hand, the reflected light R reflected by the surface of the substrate 2 between the optical semiconductor elements 3a and 3b is AB , and reflected light R reflected by the surface of the substrate 2 between the optical semiconductor elements 3b and 3c. BC The transmission of light is prevented by the colored layer 42, and the surface of the substrate 2 has excellent anti-reflection properties.

[0044] On the other hand, one embodiment of a conventional display is shown in Fig. 5. The display shown in Fig. 5 includes a non-colored layer 41 and a colored layer 42 in this order from the optical semiconductor element side. A =H C , I A C In this case, H A / H C >I A / I C and the front direction F emitted by the semiconductor elements 3a to 3c A , F B , and F C is transmitted through the colored layer 42, and reflected light R is reflected by the surface of the substrate 2 between the optical semiconductor elements 3a to 3c. AB and R BC is transmitted through the colored layer 42. In the embodiment shown in FIG. 5, when the thickness of the colored layer 42 is increased, the reflected light R AB and R BC is easily absorbed by the colored layer 42, while the light F emitted by the optical semiconductor elements 3a to 3c A ~F C Furthermore, when the thickness of the colored layer 42 is reduced, the light F emitted from the optical semiconductor elements 3a to 3c is absorbed by the colored layer 42, resulting in a decrease in the front brightness. A ~F C is not easily absorbed by the colored layer 42 and has excellent front brightness, while reflected light R AB and R BC However, the display of the present invention can be made superior in both high front brightness and anti-reflection performance, because light easily passes through the colored layer 42.

[0045] ​In this way, by satisfying the above formula (1), the display of the present invention has excellent transmittance in the front direction for the light emitted by the optical semiconductor element, while keeping the transmittance of reflected light from the substrate surface low, resulting in excellent anti-reflection properties for the substrate surface and high front brightness.

[0046] The center of gravity of an optical semiconductor element is determined by the three-dimensional shape of the optical semiconductor element. The three-dimensional shape of the optical semiconductor element is not particularly limited, and examples include a rectangular prism such as a cube or rectangular parallelepiped, a truncated pyramid, a cylinder, a truncated cone, and shapes with a dome-shaped upper portion of any of these. When the three-dimensional shape of the optical semiconductor element is a regular prism, the center of gravity is the center of the optical semiconductor element.

[0047] The display 1 does not necessarily have to include the substrate 5. The number of optical semiconductor elements in one pixel does not have to be three, and is not particularly limited.

[0048] Second Embodiment Another embodiment (second embodiment) of the display of the present invention is shown in Figures 6 and 7. Figure 7 is a partially enlarged view of the vicinity between optical semiconductor elements 3a and 3b of display 1 shown in Figure 6. Similar to Figure 2, display 1 shown in Figure 6 comprises substrate 2, multiple optical semiconductor elements 3a to 3c arranged on substrate 2, encapsulating resin layer 4 that collectively encapsulates these optical semiconductor elements 3a to 3c, and base material 5 bonded to the surface of encapsulating resin layer 4 opposite to the optical semiconductor elements 3a to 3c.

[0049] In the display element 1 shown in Figure 6, the sealing resin layer 4 is constructed by laminating a colored layer 42 and a non-colored layer 43 in this order, and seals the optical semiconductor elements 3a to 3c so that the colored layer 42 side faces the optical semiconductor elements 3a to 3c and the colored layer 42 is in contact with the optical semiconductor elements 3a to 3c.

[0050] The colored layer 42 in contact with the optical semiconductor elements 3a to 3c conforms to the above-mentioned uneven shape, and one surface of the non-colored layer 43 conforms to the uneven shape of the colored layer 42, thereby having an uneven shape that is the opposite of the uneven shape of the colored layer 42, and the other surface is flat. Note that the non-colored layer 43 may be a diffusion functional layer or a non-diffusion functional layer, as described below. In this way, the display of the present invention does not need to have a non-colored layer on the optical semiconductor element side of the colored layer.

[0051] 6 and 7, the center of gravity G of the optical semiconductor element 3a A Normal line P to the surface of substrate 2 passing through A The total thickness H of the upper color layer 42 A is the center of gravity G of the optical semiconductor element 3a A and the center of gravity G of the optical semiconductor element 3b B Normal line P to the surface of substrate 2 passing through the midpoint C of C The total thickness H of the upper color layer 42 C Perpendicular line P A Total thickness of the upper non-colored layer 43 I A is the perpendicular P C Total thickness of the upper non-colored layer 43 I C is smaller than H A / H C A / I C The rest of the display is the same as the display 1 shown in FIG.

[0052] (Third embodiment) Another embodiment (third embodiment) of the display of the present invention is shown in Figures 8 and 9. Figure 9 is a partially enlarged view of the vicinity between optical semiconductor elements 3a and 3b of display 1 shown in Figure 8. Similar to Figure 2, display 1 shown in Figure 8 comprises substrate 2, multiple optical semiconductor elements 3a to 3c arranged on substrate 2, encapsulating resin layer 4 that collectively encapsulates these optical semiconductor elements 3a to 3c, and base material 5 bonded to the surface of encapsulating resin layer 4 opposite to the optical semiconductor elements 3a to 3c side.

[0053] ​In the display element 1 shown in Figure 8, the sealing resin layer 4 is composed of a colored layer 42, a non-colored layer 43, a colored layer 44, and a non-colored layer 45 laminated in this order from the optical semiconductor elements 3a to 3c side, and seals the optical semiconductor elements 3a to 3c so that the colored layer 42 side faces the optical semiconductor elements 3a to 3c and the colored layer 42 is in contact with the optical semiconductor elements 3a to 3c.

[0054] The colored layer 42 in contact with the optical semiconductor elements 3a to 3c conforms to the uneven shape, and the colored layer 42 also has an uneven shape in the display 1. One surface of the non-colored layer 43 conforms to the uneven shape of the colored layer 42, and thus has an uneven shape that is the opposite of the uneven shape of the colored layer 42, and the other surface is flat. The colored layer 44 in contact with the non-colored layer 43 and the non-colored layer 45 in contact with the colored layer 44 both have flat surfaces. The rest is the same as the display 1 shown in FIG. 2.

[0055] As shown in FIG. 9, the sealing resin layer 4 in the display unit 1 has two colored layers, so that the perpendicular line P A Total thickness of the upper color layer H A is the perpendicular P A The thickness H of the overlying colored layer 42 A1 and the thickness H of the colored layer 44 A2 The sum of the above values ​​is also given by the perpendicular line P C Total thickness of the upper color layer H C is the perpendicular P C The thickness H of the overlying colored layer 42 C1 and the thickness H of the colored layer 44 C2 In the display 1, the sealing resin layer 4 has two non-colored layers, so that the perpendicular line P A Total thickness of the upper non-pigmented layer I A is the perpendicular P A Thickness of the overlying non-colored layer 43 I A1 and the thickness of the non-colored layer 45 I A2 The sum of the above values ​​is also given by the perpendicular line P C Total thickness of the upper non-pigmented layer I C is the perpendicular P C Thickness of the overlying non-colored layer 43 I C1 and the thickness of the non-colored layer 45 I C2 The display 1 shown in FIG. A <HC , I A C , and H A / H C A / I C The rest of the display is the same as the display 1 shown in FIG.

[0056] The cross-sectional views of the display body shown in Figures 2 to 9 can be obtained by, for example, exposing the cross section by cutting the display body in a cooled state perpendicular to the substrate surface so as to pass through the center of gravity of the multiple optical semiconductor elements. By cooling the display body, it is possible to prevent the encapsulating resin layer from melting or deforming due to the heat generated during cutting. Cutting can be performed using a known or commonly used cutting device such as a laser beam irradiator or ion beam irradiator. After cutting, the exposed cross section may be milled to expose a cross section with a lower degree of deformation. The cooling temperature is appropriately set within a range that prevents the degree of deformation of the encapsulating resin layer and cracking of the display body.

[0057] The display of the present invention is H A <H C In this case, the anti-reflection property of the substrate surface is more excellent and the brightness is higher. A C In this case, the surface of the sealing resin layer on the front side tends to be flat, which makes it difficult for diffused reflection of external light to occur, and improves the appearance of the display both when it is turned on and when it is not turned on.

[0058] The reflected hue of the display of the present invention when not turned off is L * ≦50, -10≦a * ≦10, and -10 ≦ b * It is preferable that the above L satisfies the above condition. By having such a configuration, the display looks good when it is not lit. * , a * , and b * is a value measured from the sealing resin layer side of the substrate, and can be measured using a known or commonly used spectrophotometer.

[0059] L​​​* is preferably 50 or less, more preferably 35 or less. * When the value is 50 or less, the anti-reflection property when the display is not lit is excellent, and the appearance of the display is better. * is -10≦a * It is preferable that the value satisfies the condition of -5≦a≦10, and more preferably -5≦a * ≦5. b * is -10≦b * It is preferable that b≦10 is satisfied, and more preferably, −5≦b * ≦5. a * and b * When each of these is within the above range, the color tone of the display is good and the appearance is good.

[0060] <Sealing resin layer> The encapsulating resin layer includes at least the colored layer and the non-colored layer. Each of the layers (the colored layer and the non-colored layer) constituting the encapsulating resin layer may be a single layer within the encapsulating resin layer, or may be multiple layers having the same or different compositions. When multiple colored layers or non-colored layers are included, the multiple layers may be stacked in contact with each other or may be stacked separately (for example, two colored layers stacked with one non-colored layer in between). The total number of layers constituting the encapsulating resin layer is two or more, including the colored layers and the non-colored layers, and may be three or more. The total number of layers may be, for example, 10 or less, 5 or less, or 4 or less, from the viewpoint of reducing the thickness of the display.

[0061] In the display of the present invention, the encapsulating resin layer preferably comprises the colored layer and the non-colored layer in this order from the optical semiconductor element side. This configuration prevents the uneven colored layer surface from being exposed on the encapsulating resin layer surface on the front side (opposite the optical semiconductor element side), and also makes the encapsulating resin layer surface on the front side more flat, reducing the likelihood of diffused reflection of external light, improving the appearance of the display both when lit and when unlit. In the display 1 shown in Figures 2, 3, and 6-9, the encapsulating resin layer 4 comprises the colored layer 42 and the non-colored layer 43 in this order from the optical semiconductor element 3a-3c side.

[0062] The encapsulating resin layer preferably includes a diffusion functional layer. This configuration allows light emitted by the optical semiconductor element to be diffused within the diffusion functional layer, thereby increasing the front brightness and further suppressing brightness unevenness. The diffusion functional layer is preferably a layer that corresponds to the non-colored layer in this specification. In Figures 2, 3, and 6 to 9, the non-colored layers 41, 43, and 45 may each independently be a diffusion functional layer or a non-diffusion functional layer.

[0063] When the encapsulating resin layer includes the diffusion layer, the encapsulating resin layer preferably includes, from the optical semiconductor element side, the diffusion layer, the colored layer, and the non-colored layer in this order. The non-colored layer may be either a diffusion layer or a non-diffusion layer. This configuration can increase the front brightness, suppress brightness unevenness, and improve the appearance of the display both when the display is turned on and when the display is off.

[0064] In the display of the present invention, it is preferable that at least one surface of the colored layer (particularly the surface on the optical semiconductor element side) has an uneven shape that follows the uneven shape. In this case, the display of the present invention is more likely to satisfy the above formula (1). Furthermore, the colored layer may have an uneven shape on the front side that follows the uneven shape. In the display 1 shown in Figures 6 to 9, the colored layer 42 has an uneven shape on both the front side and the optical semiconductor element side. In the display 1 shown in Figures 2 and 3, only the surface of the colored layer 42 on the optical semiconductor element side has an uneven shape, and the front side surface is flat.

[0065] In the display of the present invention, the non-colored layer located closer to the front than the colored layer preferably has a flat front surface. In this case, diffuse reflection of external light is less likely to occur on the surface of the sealing resin layer, improving the appearance of the display both when the display is turned on and when the display is off. In the display 1 shown in Figures 2, 3, and 6 to 9, the non-colored layer 43 has a flat front surface.

[0066] In the display member of the present invention, the non-colored layer may be provided on the optical semiconductor element side of the colored layer. That is, the encapsulating resin layer may include the non-colored layer and the colored layer in this order from the optical semiconductor element side. Furthermore, when the non-colored layer is provided on the optical semiconductor element side of the colored layer, it is preferable that both surfaces of the non-colored layer have an uneven shape that follows the uneven shape. With such a configuration, the colored layer is likely to have an uneven shape. In the display member 1 shown in Figures 2 and 3, the encapsulating resin layer 4 includes, in order from the optical semiconductor element 3a-3c side, the non-colored layer 41 and the colored layer 42, and both surfaces of the non-colored layer 41 have an uneven shape that follows the uneven shape.

[0067] Each layer constituting the encapsulating resin layer (the colored layer and the non-colored layer) may or may not independently have adhesive properties. Among these, adhesive properties are preferred. This configuration allows the encapsulating resin layer to easily encapsulate the optical semiconductor element, and also provides excellent adhesion between the layers, resulting in superior encapsulation of the optical semiconductor element. In particular, it is preferred that at least the layer in contact with the optical semiconductor element be adhesive. This configuration provides excellent conformability and embedding of the optical semiconductor element by the encapsulating resin layer. As a result, excellent design is achieved even when the step caused by the optical semiconductor element is high. Note that layers other than the layer in contact with the optical semiconductor element do not need to be adhesive. In this case, the adhesiveness between adjacent encapsulating resin layers in a tiling state is low, and when adjacent small-sized stacks (stacks in which encapsulating resin layers encapsulate optical semiconductor elements arranged on a substrate) are separated from each other, damage to the encapsulating resin layer and adhesion of adjacent encapsulating resin layers are unlikely to occur.

[0068] (colored layer) The colored layer in the display of the present invention is a layer intended to prevent light reflection from metal wiring or the like provided on the substrate of the display. The colored layer contains at least a colorant. The colored layer is preferably a resin layer composed of a resin. The colorant may be a dye or a pigment as long as it is soluble or dispersible in the colored layer. Dyes are preferred because they can achieve low haze even with a small amount of addition, do not tend to settle like pigments, and are easily distributed uniformly. Pigments are also preferred because they provide high color expression even with a small amount of addition. When a pigment is used as a colorant, it is preferable that it has low or no conductivity. One or more of the colorants may be used.

[0069] The colorant is preferably a black colorant. Known or commonly used colorants (pigments, dyes, etc.) for producing black can be used as the black colorant, including, for example, carbon black (furnace black, channel black, acetylene black, thermal black, lamp black, pine soot, etc.), graphite, copper oxide, manganese dioxide, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite (non-magnetic ferrite, magnetic ferrite, etc.), magnetite, chromium oxide, iron oxide, molybdenum disulfide, chromium complexes, anthraquinone-based colorants, and zirconium nitride. Alternatively, a colorant functioning as a black colorant may be used by combining and blending colorants producing colors other than black.

[0070] From the viewpoint of imparting appropriate anti-reflection properties to the display, the content of the colorant in the colored layer is preferably 0.2% by mass or more, more preferably 0.4% by mass or more, relative to the total amount (100% by mass) of the colored layer. The content of the colorant is, for example, 10% by mass or less, preferably 5% by mass or less, and more preferably 3% by mass or less. The content may be appropriately set depending on the type of colorant, the color tone and light transmittance of the display, and the like. The colorant may be added to the composition as a solution or dispersion in which it is dissolved or dispersed in an appropriate solvent.

[0071] The haze value (initial haze value) of the colored layer is not particularly limited, but from the viewpoint of ensuring front brightness and visibility of the display, it is preferably 50% or less, more preferably 40% or less, even more preferably 30% or less, and particularly preferably 20% or less. Furthermore, from the viewpoint of efficiently reducing brightness unevenness of the display, the haze value of the colored layer is preferably 1% or more, more preferably 3% or more, even more preferably 5% or more, particularly preferably 8% or more, and may be 10% or more. The haze value is the value at the thickest part of the colored layer in the display.

[0072] The total light transmittance of the colored layer is not particularly limited, but from the viewpoint of further improving the anti-reflection function of metal wiring and the contrast of the display, it is preferably 40% or less, more preferably 30% or less, even more preferably 25% or less, and particularly preferably 20% or less. Furthermore, from the viewpoint of ensuring the brightness of the display, the total light transmittance of the colored layer is preferably 0.5% or more, more preferably 1% or more, even more preferably 1.5% or more, particularly preferably 2% or more, and may even be 2.5% or more, or 3% or more. The total light transmittance is the value at the thickest part of the colored layer in the display.

[0073] The haze value and total light transmittance of the colored layer are values ​​for a single layer and can be measured by the methods specified in JIS K7136 and JIS K7361-1, and can be controlled by the type and thickness, the type and amount of colorant, etc.

[0074] (Non-colored layer) The non-colored layer is a layer different from the colored layer and is not intended to prevent light reflection by metal wiring or the like provided on a substrate in a display device. The non-colored layer may be a colorless layer or may be slightly colored. Furthermore, the non-colored layer may be, for example, a diffusion functional layer intended to perform the function of diffusing light, or a non-diffusion functional layer intended not to perform the function of diffusing light. The non-colored layer may be transparent or non-transparent. The non-colored layer is preferably a resin layer made of resin.

[0075] The content of the colorant in the non-colored layer is preferably less than 0.2% by mass, more preferably less than 0.1% by mass, and even more preferably less than 0.05% by mass, relative to 100% by mass of the total amount of the non-colored layer, and may be less than 0.01% by mass or less than 0.005% by mass.

[0076] The total light transmittance of the non-colored layer is not particularly limited, but from the viewpoint of ensuring the brightness of the display, it is preferably 40% or more, more preferably 60% or more, even more preferably 70% or more, and particularly preferably 80% or more. Furthermore, the upper limit of the total light transmittance of the non-colored layer is not particularly limited, but it may be less than 100%, or may be 99.9% or less, or 99% or less. The total light transmittance is the value at the thickest part of the non-colored layer in the display.

[0077] The total light transmittance of the non-colored layer is a value for a single layer, and can be measured by the method specified in JIS K7136 and JIS K7361-1, and can be controlled by the type and thickness of the non-colored layer.

[0078] The diffusion functional layer is a layer intended to diffuse light. When the encapsulating resin layer has the diffusion functional layer, light emitted from the optical semiconductor element is diffused in the diffusion functional layer, and for example, light emitted from the side surface of the optical semiconductor element is emitted toward the front of the display body, improving the front brightness of the display body and further suppressing brightness unevenness. The diffusion functional layer is preferably a resin layer made of resin. The diffusion functional layer is not limited, but preferably contains light-diffusing fine particles. That is, the diffusion functional layer preferably contains light-diffusing fine particles dispersed in the resin layer. Only one type of light-diffusing fine particles may be used, or two or more types may be used.

[0079] The light-diffusing fine particles have an appropriate refractive index difference from the resin constituting the diffusion functional layer, and impart diffusion properties to the diffusion functional layer. Examples of the light-diffusing fine particles include inorganic fine particles and polymer fine particles. Examples of materials for the inorganic fine particles include silica, calcium carbonate, aluminum hydroxide, magnesium hydroxide, clay, talc, and metal oxides. Examples of materials for the polymer fine particles include silicone resin, acrylic resin (including polymethacrylate resin such as polymethyl methacrylate), polystyrene resin, polyurethane resin, melamine resin, polyethylene resin, and epoxy resin.

[0080] The polymeric fine particles are preferably fine particles made of silicone resin. The inorganic fine particles are preferably fine particles made of metal oxide. The metal oxide is preferably titanium oxide or barium titanate, more preferably titanium oxide. This structure provides the diffusion layer with superior light diffusion properties and reduces brightness unevenness.

[0081] The shape of the light-diffusing fine particles is not particularly limited, and may be, for example, spherical, flat, or irregular.

[0082] The average particle diameter of the light-diffusing fine particles is preferably 0.1 μm or more, more preferably 0.15 μm or more, even more preferably 0.2 μm or more, and particularly preferably 0.25 μm or more, from the viewpoint of imparting appropriate light diffusion performance. Furthermore, the average particle diameter of the light-diffusing fine particles is preferably 12 μm or less, more preferably 10 μm or less, and even more preferably 8 μm or less, from the viewpoint of preventing the haze value from becoming too high and displaying high-resolution images. The average particle diameter can be measured, for example, using a Coulter counter.

[0083] The refractive index of the light-diffusing fine particles is preferably 1.2 to 5, more preferably 1.25 to 4.5, even more preferably 1.3 to 4, and particularly preferably 1.35 to 3.

[0084] The absolute value of the refractive index difference between the light-diffusing fine particles and the resin constituting the diffusion functional layer (the resin layer excluding the light-diffusing fine particles in the diffusion functional layer) is preferably 0.001 or more, more preferably 0.01 or more, even more preferably 0.02 or more, particularly preferably 0.03 or more, and may be 0.04 or more, or 0.05 or more, from the viewpoint of more efficiently reducing brightness unevenness of the display body. Furthermore, the absolute value of the refractive index difference between the light-diffusing fine particles and the resin is preferably 5 or less, more preferably 4 or less, and even more preferably 3 or less, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image.

[0085] The content of the light-diffusing fine particles in the diffusion functional layer is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, even more preferably 0.1 parts by mass or more, and particularly preferably 0.15 parts by mass or more, relative to 100 parts by mass of the resin constituting the diffusion functional layer, from the viewpoint of imparting appropriate light-diffusing performance to the encapsulating resin layer. Furthermore, the content of the light-diffusing fine particles is preferably 80 parts by mass or less, more preferably 70 parts by mass or less, relative to 100 parts by mass of the resin constituting the diffusion functional layer, from the viewpoint of preventing the haze value from becoming too high and displaying a high-resolution image.

[0086] The haze value (initial haze value) of the diffusion functional layer is not particularly limited, but from the viewpoint of efficiently reducing brightness unevenness, it is preferably 30% or more, more preferably 40% or more, even more preferably 50% or more, and particularly preferably 60% or more. It may be 70% or more, 80% or more, 90% or more, 95% or more, or 97% or more, and a value around 99.9% is more effective in improving brightness unevenness. The upper limit of the haze value of the diffusion functional layer is not particularly limited, and may be 100%. The haze value is the value at the thickest part of the diffusion functional layer in the display.

[0087] The total light transmittance of the diffusion functional layer is not particularly limited, but from the viewpoint of ensuring brightness, it is preferably 40% or more, more preferably 60% or more, even more preferably 70% or more, and particularly preferably 80% or more. Furthermore, the upper limit of the total light transmittance of the diffusion functional layer is not particularly limited, but it may be less than 100%, or may be 99.9% or less, or 99% or less. The total light transmittance is the value at the thickest part of the diffusion functional layer in the display.

[0088] The haze value and total light transmittance of the above-mentioned diffusion functional layer are values ​​for a single layer and can be measured by the methods specified in JIS K7136 and JIS K7361-1. They can be controlled by the type and thickness of the diffusion functional layer, the type and amount of light-diffusing microparticles, etc.

[0089] The haze value (initial haze value) of the non-diffusion functional layer is not particularly limited, but from the viewpoint of improving the brightness of the display, it is preferably less than 30%, more preferably 10% or less, even more preferably 5% or less, particularly preferably 1% or less, and may be 0.5% or less. The lower limit of the haze value of the non-diffusion functional layer is not particularly limited. The haze value is the value at the thickest part of the non-diffusion functional layer in the display.

[0090] The total light transmittance of the non-diffusion functional layer is not particularly limited, but from the viewpoint of ensuring the brightness of the display, it is preferably 60% or more, more preferably 70% or more, even more preferably 80% or more, and particularly preferably 90% or more. Furthermore, the upper limit of the total light transmittance of the non-diffusion functional layer is not particularly limited, but it may be less than 100%, or may be 99.9% or less, or 99% or less. The total light transmittance is the value at the thickest part of the non-diffusion functional layer in the display.

[0091] The haze value and total light transmittance of the non-diffusion functional layer are values ​​for a single layer, and can be measured by the methods specified in JIS K7136 and JIS K7361-1. They can be controlled by the type and thickness of the non-diffusion functional layer.

[0092] In order to improve the brightness of the display, the content of the colorant and / or light-diffusing microparticles in the non-diffusion functional layer is preferably less than 0.01 parts by mass, and more preferably less than 0.005 parts by mass, per 100 parts by mass of the resin constituting the non-diffusion functional layer.

[0093] (resin layer) When the colored layer and the non-colored layer are resin layers, the resin constituting the resin layer may be a known or commonly used resin, such as an acrylic resin, a urethane acrylate resin, a urethane resin, a rubber resin, an epoxy resin, an epoxy acrylate resin, an oxetane resin, a silicone resin, a silicone acrylic resin, a polyester resin, a polyether resin (such as polyvinyl ether), a polyamide resin, a fluorine-containing resin, a vinyl acetate / vinyl chloride copolymer, or a modified polyolefin. One or more of the resins may be used. The resins constituting each layer of the encapsulating resin layer may be the same or different.

[0094] When the resin layer is a layer having adhesive properties (adhesive layer), a known or commonly used pressure-sensitive adhesive can be used as the resin. Examples of the adhesive include acrylic adhesives, rubber adhesives (natural rubber, synthetic rubber, and mixtures thereof), silicone adhesives, polyester adhesives, urethane adhesives, polyether adhesives, polyamide adhesives, and fluorine adhesives. One or more of the adhesives may be used.

[0095] The resin layer may contain other components in addition to the above-mentioned components, as long as the effects of the present invention are not impaired in each layer. Examples of such other components include curing agents, crosslinking accelerators, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), oligomers, antioxidants, fillers (metal powders, organic fillers, inorganic fillers, etc.), antioxidants, plasticizers, softeners, surfactants, antistatic agents, surface lubricants, leveling agents, light stabilizers, UV absorbers, polymerization inhibitors, granular materials, and foil-like materials. Only one or more of the above other components may be used.

[0096] Examples of the laminate structure of the encapsulating resin layer include [colored layer / diffusion functional layer], [colored layer / non-diffusion functional layer], [colored layer / diffusion functional layer / non-diffusion functional layer], [non-diffusion functional layer / colored layer], [diffusion functional layer / colored layer], [diffusion functional layer / colored layer / non-diffusion functional layer], [non-diffusion functional layer / colored layer / diffusion functional layer], [diffusion functional layer / colored layer / diffusion functional layer], [non-diffusion functional layer / colored layer / non-diffusion functional layer], [non-diffusion functional layer / diffusion functional layer / colored layer], [diffusion functional layer / non-diffusion functional layer / colored layer], [diffusion functional layer / diffusion functional layer / colored layer], [diffusion functional layer / colored layer / colored layer], [colored layer / diffusion functional layer / colored layer / non-diffusion functional layer] (all in order from the optical semiconductor element side), and the like.

[0097] <Base material part> The display of the present invention may or may not include a substrate. When the substrate is provided on the front side of the encapsulating resin layer in the display, the surface of the encapsulating resin layer can be made flat, thereby reducing the occurrence of diffused reflection of light and improving the appearance of the display both when the display is turned on and when the display is not lit. Furthermore, by forming an anti-glare layer or an anti-reflection layer described below on the substrate, anti-glare properties and anti-reflection properties can be imparted to the display. Furthermore, the substrate serves as a support for the encapsulating resin layer in the sheet for encapsulating optical semiconductor elements described below, and the presence of the substrate provides excellent handleability of the sheet for encapsulating optical semiconductor elements.

[0098] The substrate may be a single layer, or may be multiple layers having the same or different compositions, thicknesses, etc. When the substrate is multiple layers, each layer may be bonded to another layer such as a pressure-sensitive adhesive layer. The substrate layer used in the substrate is the part that is attached to the substrate including the optical semiconductor element together with the encapsulating resin layer, and the "substrate" does not include a release liner that is peeled off when the sheet for encapsulating optical semiconductor elements is used (attached), or a surface protection film that merely protects the surface of the substrate.

[0099] Examples of the substrate layer constituting the substrate part include glass and plastic substrates (particularly, plastic films). Examples of resins constituting the plastic substrate include low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, very low-density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homopolypropylene, polybutene, polymethylpentene, ionomer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester (random, alternating) copolymer, ethylene-vinyl acetate copolymer (EVA), ethylene-propylene copolymer, cyclic olefin polymer, ethylene-butene copolymer, ethylene-hexene copolymer, etc. Examples of suitable resins include polyolefin resins, polyurethanes, polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate (PBT), polycarbonates, polyimide resins, polyether ether ketones, polyetherimides, polyamides such as aramids and wholly aromatic polyamides, polyphenyl sulfides, fluororesins, polyvinyl chloride, polyvinylidene chloride, cellulose resins such as triacetyl cellulose (TAC), silicone resins, acrylic resins such as polymethyl methacrylate (PMMA), polysulfones, polyarylates, and polyvinyl acetates. The above resins may be used singly or in combination. The substrate layer may be any of various optical films, such as antireflection (AR) films, polarizing plates, and retardation plates.

[0100] The thickness of the plastic film is preferably 20 to 300 μm, more preferably 40 to 250 μm. When the thickness is 20 μm or more, the supportability and handleability of the sheet for encapsulating an optical semiconductor element are further improved. When the thickness is 250 μm or less, the display body can be made thinner.

[0101] The surface of the substrate on the side where the encapsulating resin layer is provided may be subjected to surface treatments such as physical treatments such as corona discharge treatment, plasma treatment, sand matting treatment, ozone exposure treatment, flame exposure treatment, high-voltage shock exposure treatment, and ionizing radiation treatment; chemical treatments such as chromic acid treatment; and adhesion-enhancing treatments using a coating agent (primer), for the purpose of improving adhesion and retention with the encapsulating resin layer. The surface treatment for improving adhesion is preferably applied to the entire surface of the substrate on the side where the encapsulating resin layer is provided.

[0102] The thickness of the substrate is preferably 5 μm or more, more preferably 10 μm or more, from the viewpoint of excellent support function and surface scratch resistance, and is preferably 300 μm or less, more preferably 250 μm or less, from the viewpoint of excellent transparency.

[0103] <Display body> The display may include a layer having antiglare and / or antireflection properties. Such a configuration can suppress the gloss and light reflection of the display, improving its appearance. An example of the layer having antiglare properties is an antiglare-treated layer. An example of the layer having antireflection properties is an antireflection-treated layer. The antiglare treatment and the antireflection treatment can be performed by known or conventional methods. The antiglare layer and the antireflection layer may be the same layer or different layers. The display may have only one layer having antiglare and / or antireflection properties, or two or more layers.

[0104] The haze value (initial haze value) of the encapsulating resin layer or the laminate having the encapsulating resin layer and the base material as both end faces is not particularly limited, but from the viewpoint of achieving a superior effect of suppressing brightness unevenness and design, it is preferably 80% or more, more preferably 85% or more, even more preferably 90% or more, and particularly preferably 95% or more. The upper limit of the haze value is not particularly limited.

[0105] The total light transmittance of the encapsulating resin layer or the laminate having the encapsulating resin layer and the base material as both end faces is not particularly limited, but is preferably 40% or less, more preferably 30% or less, and even more preferably 20% or less, from the viewpoint of further improving the anti-reflection function of metal wiring etc. and contrast. Moreover, the total light transmittance is preferably 0.5% or more, from the viewpoint of ensuring brightness.

[0106] The haze value and total light transmittance can be measured by the methods specified in JIS K7136 and JIS K7361-1, respectively, and can be controlled by the stacking order, type, thickness, etc. of the layers constituting the encapsulating resin layer and the base material portion.

[0107] The thickness of the encapsulating resin layer or the laminate having the encapsulating resin layer and the base material as both end faces is preferably 10 to 600 μm, more preferably 20 to 550 μm, even more preferably 30 to 500 μm, still more preferably 40 to 450 μm, and particularly preferably 50 to 400 μm, from the viewpoint of improving the anti-reflection function and contrast of metal wiring and the like while more efficiently reducing color shift. Note that the thickness of the release liner is not included in the above.

[0108] The display of the present invention preferably includes a self-luminous display device. Furthermore, the self-luminous display device can be combined with a display panel, if necessary, to form a display device that is an image display device. In this case, the optical semiconductor elements are LED elements. Examples of the self-luminous display device include LED displays, backlights, and organic electroluminescence (organic EL) display devices. The backlight is preferably a full-surface direct backlight. The backlight includes, as at least a part of its components, a laminate comprising, for example, the substrate and a plurality of optical semiconductor elements arranged on the substrate. For example, in the self-luminous display device, a metal wiring layer is laminated on the substrate for transmitting light emission control signals to each LED element. LED elements emitting red (R), green (G), and blue (B) light are alternately arranged on the substrate via the metal wiring layer. The metal wiring layer is formed of a metal such as copper, and adjusts the light emission intensity of each LED element to display each color.

[0109] The display of the present invention may be a display that is used by folding, for example, a foldable image display device (flexible display) (particularly, a foldable image display device (foldable display)). Specific examples include a display device equipped with a foldable backlight and a display device equipped with a foldable self-luminous display device.

[0110] In the display of the present invention, the sealing resin layer has excellent followability and embeddability for the optical semiconductor element, and therefore the optical semiconductor element may be a mini LED element or a micro LED element.

[0111] The display of the present invention has excellent anti-reflection properties on the substrate surface and high brightness. Therefore, the display is bright and looks good without increasing power consumption. Furthermore, light reflection from metal wiring on the substrate is suppressed, resulting in a good appearance even when the optical semiconductor element is not lit.

[0112] [Display manufacturing method] The display member of the present invention can be produced by laminating a sheet for encapsulating an optical semiconductor element, which includes an encapsulating resin layer, to a substrate on which an optical semiconductor element is arranged, and encapsulating the optical semiconductor element with the encapsulating resin layer.

[0113] (Optical semiconductor element encapsulation sheet) The optical semiconductor element encapsulation sheet is a sheet for encapsulating a plurality of optical semiconductor elements arranged on a substrate. The optical semiconductor element encapsulation sheet includes at least an encapsulating resin layer including a colored layer and a non-colored layer. The optical semiconductor element encapsulation sheet is a sheet that can satisfy the above formula (1) when the encapsulating resin layer is formed by encapsulating the plurality of optical semiconductor elements with the encapsulating resin layer. The optical semiconductor element encapsulation sheet of the present invention can provide a display device that has excellent anti-reflection properties on the substrate surface and high brightness by encapsulating optical semiconductor elements.

[0114] The optical semiconductor element encapsulation sheet includes at least an encapsulating resin layer including a colored layer and a non-colored layer. The encapsulating resin layer is a layer capable of forming the encapsulating resin layer in the display of the present invention. Specifically, the colored layer in the encapsulating resin layer is a layer capable of forming the colored layer in the display of the present invention, and the non-colored layer in the encapsulating resin layer is a layer capable of forming the non-colored layer in the display of the present invention. Specifically, the colored layer in the encapsulating resin layer may be a layer having the same composition (components and their blending ratios) and physical properties (haze, total light transmittance, etc.) as the colored layer in the display of the present invention, or may be a layer that will become the colored layer in the display of the present invention upon curing. Furthermore, the non-colored layer in the encapsulating resin layer may be a layer having the same composition (components and their blending ratios) and physical properties (haze, total light transmittance, etc.) as the non-colored layer in the display of the present invention, or may be a layer that will become the non-colored layer in the display of the present invention upon curing.

[0115] The encapsulating resin layer is appropriately designed depending on the structure of the encapsulating resin layer in the display of the present invention. For example, when the display of the present invention includes the diffusion functional layer, the encapsulating resin layer in the sheet for encapsulating optical semiconductor elements includes the diffusion functional layer. The diffusion functional layer in the encapsulating resin layer may be a layer having the same composition (components and their blending ratio) and physical properties (haze, total light transmittance, etc.) as the diffusion functional layer in the display of the present invention, or may be a layer that becomes the diffusion functional layer in the display of the present invention upon curing. Furthermore, the encapsulating resin layer preferably includes the diffusion functional layer, the colored layer, and the non-colored layer in this order. The diffusion functional layer is a layer that corresponds to either the colored layer or the non-colored layer.

[0116] Each layer (the colored layer and the non-colored layer) constituting the encapsulating resin layer may or may not independently have tackiness and / or adhesiveness. Among these, tackiness and / or adhesiveness are preferred. This configuration allows the encapsulating resin layer to be easily attached to the substrate and the optical semiconductor element, and provides excellent adhesion between the layers, resulting in superior encapsulation of the optical semiconductor element. In particular, it is preferred that at least the layer in contact with the optical semiconductor element has tackiness and / or adhesiveness. This configuration allows the encapsulating resin layer to have excellent conformability and embeddability of the optical semiconductor element. As a result, the design is excellent even when the step caused by the optical semiconductor element is high.

[0117] Each layer (the colored layer and the non-colored layer) constituting the encapsulating resin layer may independently be a resin layer that has the property of being cured by irradiation with radiation (a radiation-curable resin layer), or a resin layer that does not have the property of being cured by irradiation with radiation (a radiation-non-curable resin layer). Examples of the radiation include electron beams, ultraviolet rays, α-rays, β-rays, γ-rays, and X-rays. When the colored layer is a radiation-curable resin layer, the colorant that may be contained in the colored layer preferably absorbs visible light and is transparent to light of a wavelength that can cure the radiation-curable resin layer.

[0118] The optical semiconductor element encapsulation sheet may include the substrate. When the substrate is included, the encapsulating resin layer may be provided on at least one surface of the substrate. The surface of the encapsulating resin layer that comes into contact with the substrate is the surface opposite to the side of the encapsulating resin layer that comes into contact with the optical semiconductor element. When the optical semiconductor element encapsulation sheet includes the substrate, the optical semiconductor element encapsulation sheet is attached to the optical semiconductor element and the substrate together with the substrate, and the substrate in the optical semiconductor element encapsulation sheet serves as the substrate in the display body of the present invention.

[0119] The encapsulating resin layer may also be formed on a release-treated surface of a release liner. When the optical semiconductor element encapsulation sheet is formed on the release liner, the side of the encapsulating resin layer that contacts the optical semiconductor element is the side that contacts the release liner. When the substrate portion is not present, both sides of the encapsulating resin layer may be the sides that contact the release liner. The release liner is used as a protective material for the optical semiconductor element encapsulation sheet and is peeled off when encapsulating the optical semiconductor element. The substrate portion and release liner are not necessarily provided.

[0120] The release liner is an element for covering and protecting the surface of the optical semiconductor element encapsulation sheet, and is peeled off from the sheet when the optical semiconductor element encapsulation sheet is attached to a substrate on which an optical semiconductor element is arranged.

[0121] Examples of the release liner include polyethylene terephthalate (PET) film, polyethylene film, polypropylene film, plastic film and paper whose surface is coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate-based release agent.

[0122] The thickness of the release liner is, for example, 10 to 200 μm, preferably 15 to 150 μm, and more preferably 20 to 100 μm. When the thickness is 10 μm or more, the release liner is less likely to break due to cuts during processing. When the thickness is 200 μm or less, the release liner is more easily peeled from the optical semiconductor element encapsulation sheet during use.

[0123] An embodiment of the optical semiconductor element encapsulation sheet will be described with reference to FIG. 10. FIG. 10 is a cross-sectional view of the optical semiconductor element encapsulation sheet capable of forming the display shown in FIG. 2. As shown in FIG. 10, the optical semiconductor element encapsulation sheet 10 can be used to encapsulate one or more optical semiconductor elements arranged on a substrate, and includes a substrate 5 and an encapsulating resin layer 7 formed on the substrate 5. The encapsulating resin layer 7 is formed of a laminate of a non-colored layer 71, a colored layer 72, and a non-colored layer 73. The non-colored layer 71, the colored layer 72, and the non-colored layer 73 have adhesive properties and are directly laminated to one another. A release liner 6 is attached to the surface of the non-colored layer 71 of the encapsulating resin layer 7, and a substrate 5 is attached to the surface of the non-colored layer 73.

[0124] (Sealing process) The method for producing a display member of the present invention using the optical semiconductor element encapsulation sheet includes an encapsulation step of laminating the optical semiconductor element encapsulation sheet to a substrate on which optical semiconductor elements are arranged and encapsulating the optical semiconductor elements with an encapsulating resin layer. Specifically, the encapsulation step first involves peeling the release liner from the optical semiconductor element encapsulation sheet to expose the encapsulating resin layer. Then, of a laminate (such as an optical member) including a substrate and optical semiconductor elements (preferably multiple optical semiconductor elements) arranged on the substrate, the encapsulating resin layer surface, which is the exposed surface of the optical semiconductor element encapsulation sheet, is laminated to the substrate surface on which the optical semiconductor elements are arranged. If the laminate includes multiple optical semiconductor elements, the encapsulating resin layer is further arranged to fill the gaps between the multiple optical semiconductor elements, thereby encapsulating the multiple optical semiconductor elements collectively. Specifically, as shown in FIG. 11, the non-colored layer 71 of the sheet 10 for encapsulating optical semiconductor elements from which the release liner 6 has been peeled off is placed facing the surface of the substrate 2 on which the optical semiconductor elements 3a to 3c are arranged, and the sheet 10 for encapsulating optical semiconductor elements is attached to the surface of the substrate 2 on which the optical semiconductor elements 3a to 3c are arranged, and the optical semiconductor elements 3a to 3c are embedded in the encapsulating resin layer 7.

[0125] The temperature during the lamination is, for example, within a range from room temperature to 110°C. Furthermore, reduced pressure or pressure may be applied during the lamination. This reduced pressure or pressure can prevent voids from forming between the encapsulating resin layer and the substrate or the optical semiconductor element. Furthermore, in the encapsulation step, it is preferable to laminate the optical semiconductor element encapsulation sheet under reduced pressure and then apply pressure. When reduced pressure is applied, the pressure is, for example, 1 to 100 Pa, and the depressurization time is, for example, 5 to 600 seconds. When pressurized, the pressure is, for example, 0.05 to 0.5 MPa, and the pressurization time is, for example, 5 to 600 seconds.

[0126] By appropriately setting the thicknesses of the colored and non-colored layers in the encapsulating resin layer, and the temperature and pressure during lamination, it is possible to adjust the conformability of the colored layer to the optical semiconductor element in the resulting display body, and the thicknesses of the colored and non-colored layers in each of the concave and convex regions in the uneven shape, thereby enabling the resulting display body to have a configuration that satisfies the above formula (1).

[0127] (Radiation irradiation process) When the encapsulating resin layer comprises a radiation-curable resin layer, the manufacturing method may further comprise a radiation irradiation step of irradiating a laminate comprising the substrate, an optical semiconductor element disposed on the substrate, and the optical semiconductor element encapsulation sheet that encapsulates the optical semiconductor element with radiation to cure the radiation-curable resin layer and form a cured product layer. As described above, examples of the radiation include electron beams, ultraviolet rays, α rays, β rays, γ rays, and X-rays. Among these, ultraviolet rays are preferred. The temperature during radiation irradiation is, for example, within a range from room temperature to 100°C, and the irradiation time is, for example, from 1 minute to 1 hour.

[0128] (dicing process) The manufacturing method may further include a dicing step of dicing a laminate including the substrate, an optical semiconductor element disposed on the substrate, and the optical semiconductor element encapsulation sheet that encapsulates the optical semiconductor element. The dicing may be performed on the laminate that has undergone the radiation irradiation step. When the laminate includes a cured product layer formed by curing a radiation-curable resin layer by the radiation irradiation, the dicing step involves dicing and removing the cured product layer of the optical semiconductor element encapsulation sheet and the side edges of the substrate. This allows the surface of the cured product layer, which has been sufficiently cured and has reduced adhesion, to be exposed on the side. The dicing can be performed by a known or conventional method, such as a method using a dicing blade or laser irradiation.

[0129] (Tiling process) The manufacturing method may further include a tiling step of arranging the plurality of display bodies obtained in the dicing step so that they are in contact with each other in a planar direction. In the tiling step, the plurality of stacked bodies obtained in the dicing step are tiled so that they are in contact with each other in a planar direction. In this way, a single large display body can be manufactured.

[0130] In this manner, the display body of the present invention can be produced. When the encapsulating resin layer 7 in the sheet 10 for encapsulating an optical semiconductor element does not have a radiation-curable resin layer, the encapsulating resin layer 7 becomes the encapsulating resin layer 4 in the display body 1. On the other hand, when the encapsulating resin layer 7 in the sheet 10 for encapsulating an optical semiconductor element has a radiation-curable resin layer, for example, when the non-colored layer 73 is a radiation-curable resin layer, the non-colored layer 73 is cured to form the non-colored layer 43, which becomes the encapsulating resin layer 4. [Explanation of symbols]

[0131] 1 Display body 2 boards 3a to 3f Optical semiconductor elements 31 Support 3,3' pixels 4 Sealing resin layer 41 Uncolored layer 42 Colored layer 43 Uncolored layer 44 Colored layer 45 Uncolored layer 5 Base material part 6 Release liner 7 Sealing resin layer 71 Uncolored layer 72 Colored layer 73 Uncolored layer 10. Optical semiconductor element encapsulation sheet 11 Optical components

Claims

1. A display comprising a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements, the sealing resin layer includes a colored layer and a non-colored layer, A perpendicular line to the substrate surface passing through the center of gravity of the first optical semiconductor element is defined as a perpendicular line P Ａ , A perpendicular line to the substrate surface passing through the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel is defined as a perpendicular line P Ｃ When The perpendicular line P Ａ The total thickness H of the colored layer Ａ , the perpendicular line P Ａ The total thickness I of the non-colored layers Ａ , the perpendicular line P Ｃ The total thickness H of the colored layer Ｃ , and the perpendicular line P Ｃ The total thickness I of the non-colored layers Ｃ is a display that satisfies the following formula (1). H Ａ / H Ｃ <I Ａ / I Ｃ (1)

2. 2. The display according to claim 1, wherein the height of the optical semiconductor element above the substrate is 500 [mu]m or less.

3. The reflected hue when not lit is L ＊ ≦50, −10≦a ＊ ≦10, and −10≦b ＊ 3. The display according to claim 1, wherein the display satisfies the condition of ≦10.

4. 4. The display according to claim 1, wherein the colored layer has adhesiveness.

5. 5. The display according to claim 1, comprising a self-luminous display device.

6. The display according to any one of claims 1 to 5, which is an image display device.

7. A sheet for encapsulating a plurality of optical semiconductor elements arranged on a substrate, the sheet includes a sealing resin layer including a colored layer and a non-colored layer, When the plurality of optical semiconductor elements are encapsulated with the encapsulating resin layer to form the encapsulating resin layer, A perpendicular line to the substrate surface passing through the center of gravity of the first optical semiconductor element is defined as a perpendicular line P Ａ , A perpendicular line to the substrate surface passing through the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel is defined as a perpendicular line P Ｃ When The perpendicular line P Ａ The total thickness H of the colored layer Ａ , the perpendicular line P Ａ The total thickness I of the non-colored layers Ａ , the perpendicular line P Ｃ The total thickness H of the colored layer Ｃ , and the perpendicular line P Ｃ The total thickness I of the non-colored layers Ｃ A sheet for encapsulating an optical semiconductor element, which can satisfy the following formula (1): H Ａ / H Ｃ <I Ａ / I Ｃ (1)

8. The sheet for encapsulating an optical semiconductor element according to claim 7 , wherein the colored layer has adhesiveness.

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