Substrate transfer apparatus and substrate transfer method

Abstract

To provide a technique for performing accurate operation control even when a conveyance object other than a substrate is conveyed by using a substrate conveyance module.SOLUTION: In a control unit of an apparatus that adjusts a magnetic force of a first magnet provided on a floor surface portion of a substrate transfer chamber and transfers a substrate by a substrate transfer module including a second magnet, a parameter storage unit stores a model parameter for representing a relationship between an actuation force applied to a control model integrally representing a transfer object and the substrate transfer module and a motion, and a control schedule creation unit outputs a control schedule defining an actuation force for operating the substrate transfer module by using the model parameter corresponding to the transfer object and an operation schedule defining the motion of the substrate transfer module. The magnetic force adjustment unit executes feedforward control for adjusting the magnetic force of the first magnet so that the actuating force based on a control schedule is applied.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to an apparatus for transporting substrates and a method for transporting substrates. [Background technology]

[0002] For example, in an apparatus (wafer processing apparatus) that processes semiconductor wafers (hereinafter also referred to as "wafers"), which are substrates, the wafers are transported between a carrier that stores the wafers and a wafer processing chamber where the processing is performed. Wafer transport mechanisms of various configurations are used to transport the wafers. The applicant is currently developing a wafer processing apparatus that uses a substrate transfer module that utilizes magnetic levitation to transfer substrates.

[0003] For example, Patent Document 1 describes a substrate carrier that uses magnetic levitation to transfer semiconductor substrates between processing chambers while floating above a plate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Special Publication No. 2018-504784 Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a technique for performing accurate operation control even when a substrate transfer module is used to transfer an object other than a substrate. [Means for solving the problem]

[0006] The present disclosure provides an apparatus for transporting a substrate to a substrate processing chamber, comprising: a substrate transfer chamber having a floor portion on which a first magnet capable of adjusting magnetic force is provided, and a sidewall portion to which the substrate processing chamber is connected and which has an opening formed therein through which the substrate is transferred in and out of the substrate processing chamber; a substrate transfer module including: a holder configured to be able to hold each of a plurality of types of transported objects, which are the substrates or equipment used in the substrate transfer chamber or the substrate processing chamber; and a second magnet that generates a repulsive force between itself and the first magnet, and configured to be movable within the substrate transfer chamber by magnetic levitation using the repulsive force; a control unit that controls an actuation force for operating the substrate transfer module using feedforward control by adjusting the magnetic force of the first magnet to change the repulsive force, The control unit a parameter storage unit that stores at least one model parameter for expressing a relationship between an actuation force applied to a control model that integrally represents the transport object and the substrate transport module and a motion of the control model, in association with each of the plurality of types of transport object; a control schedule creation unit that acquires specific information for identifying the transported object and an operation schedule that defines the movement of the substrate transport module along a time axis, uses the model parameters of the control model that correspond to the specific information stored in the parameter storage unit to determine the operating force that should be applied when operating the substrate transport module holding the transported object that corresponds to the specific information based on the operation schedule, and outputs the control schedule that defines the operating force along the time axis; The present invention relates to an apparatus that is equipped with a magnetic force adjustment unit that performs the feedforward control by adjusting the magnetic force of the first magnet so that the actuation force based on the control schedule is applied to the substrate transport module that transports the transported item corresponding to the specific information. [Effects of the Invention]

[0007] According to the present disclosure, accurate operation control can be performed even when a substrate transfer module is used to transfer an object other than a substrate. [Brief explanation of the drawings]

[0008] [Figure 1]FIG. 1 is a plan view showing a first configuration example of a wafer processing system. [Figure 2] FIG. 2 is a plan view showing a first configuration example of a transfer module. [Figure 3] FIG. 10 is a perspective view showing an example of the configuration of a transport module and tiles. [Figure 4] FIG. 1 is a block diagram showing an example of the configuration of a wafer processing system. [Figure 5A] FIG. 2 is a perspective view of a first configuration example of a control model. [Figure 5B] FIG. 10 is a perspective view showing a second configuration example of the control model. [Figure 6] 10A and 10B are plan views showing an example of the operation of the transfer module. [Figure 7] 10 is an example of a time chart relating to feedforward control. [Figure 8] 10 is an example of a flowchart relating to operation control of a transfer module. [Figure 9] FIG. 10 is a plan view showing a second configuration example of the wafer processing system. [Figure 10] FIG. 10 is a plan view showing a second configuration example of the transfer module. [Figure 11] 10A and 10B are side views illustrating an example of a transport operation of the transport module. [Figure 12] 10A and 10B are schematic diagrams illustrating an example of a transport operation of a failed transport module. [Figure 13] 10A and 10B are schematic diagrams illustrating an example of a component transport operation. DETAILED DESCRIPTION OF THE INVENTION

[0009] <Wafer processing system> The configuration of an "apparatus for transporting substrates" according to an embodiment of the present disclosure will be described below with reference to Fig. 1. The apparatus for transporting substrates is provided in a wafer processing system 101. 1 shows a multi-chamber type wafer processing system 101 equipped with a plurality of wafer processing chambers 110, which are substrate processing chambers. As shown in Fig. 1, the wafer processing system 101 is equipped with a load port 141, an atmospheric transfer chamber 140, a load lock chamber 130, a vacuum transfer chamber 160, and a plurality of wafer processing chambers 110. In the following description, the position where the load port 141 is provided is referred to as the front side.

[0010] In the wafer processing system 101, the load port 141, atmospheric transfer chamber 140, load lock chamber 130, and vacuum transfer chamber 160 are arranged horizontally in this order from the front side. In addition, multiple wafer processing chambers 110 are arranged side by side on the left and right sides of the vacuum transfer chamber 160 when viewed from the front side.

[0011] The load port 141 is configured as a mounting table on which carriers C, which accommodate wafers W to be processed, are placed, and four carriers C are arranged side by side in the left-right direction when viewed from the front side. For example, a FOUP (Front Opening Unified Pod) can be used as the carriers C.

[0012] The atmospheric transfer chamber 140 has an atmospheric pressure (normal pressure) atmosphere, and for example, a downflow of clean air is formed. A wafer transfer mechanism 142 for transferring wafers W is provided inside the atmospheric transfer chamber 140. The wafer transfer mechanism 142 inside the atmospheric transfer chamber 140 is configured, for example, by an articulated arm. This wafer transfer mechanism 142 transfers wafers W between the carrier C and the load lock chamber 130. An alignment chamber (not shown) for aligning wafers W is provided, for example, on the left side of the atmospheric transfer chamber 140.

[0013] Between the vacuum transfer chamber 160 and the atmospheric transfer chamber 140, for example, three load lock chambers 130 are installed side by side. Each load lock chamber 130 has lift pins 131 that push up the loaded wafer W from below and hold it. For example, three lift pins 131 are provided at equal intervals along the circumferential direction and are configured to be able to move up and down freely. Note that the lift pins 113 described below are configured in the same way.

[0014] The load lock chamber 130 is configured to be able to switch between an atmospheric pressure atmosphere and a vacuum atmosphere. The load lock chamber 130 and the atmospheric transfer chamber 140 are connected via a gate valve 133. The load lock chamber 130 and the vacuum transfer chamber 160 are also connected via a gate valve 132.

[0015] The vacuum transfer chamber 160 corresponds to the substrate transfer chamber of the present disclosure. As shown in FIG. 1, the vacuum transfer chamber 160 is configured as a housing that is long in the front-to-rear direction and has a rectangular shape in a plan view. The vacuum transfer chamber 160 is depressurized by a vacuum exhaust mechanism (not shown) to create a vacuum atmosphere. In the wafer processing system 101 of the example shown in FIG. 1, six wafer processing chambers 110, three on each side, are connected to the left and right side walls of the vacuum transfer chamber 160 via gate valves 111. Wafers W are loaded and unloaded between the vacuum transfer chamber 160 and the wafer processing chambers 110 via openings that are opened and closed by the gate valves 111.

[0016] Each wafer processing chamber 110 is depressurized by a vacuum exhaust mechanism (not shown) to create a vacuum atmosphere. A mounting table 112 is provided inside each wafer processing chamber 110, and a predetermined process is performed on the wafer W while it is placed on the mounting table 112. Examples of processes performed on the wafer W include etching, film formation, cleaning, and ashing.

[0017] For example, if the wafer W is to be processed while being heated, a heater is provided on the mounting table 112. If the process to be performed on the wafer W uses a processing gas, a processing gas supply unit constituted by a shower head or the like is provided in the wafer processing chamber 110. Note that these heaters and processing gas supply units are not shown in the drawings. The mounting table 112 is also provided with lift pins 113 for transferring the wafer W when it is loaded or unloaded. The wafer processing chamber 110 corresponds to the substrate processing chamber in this embodiment.

[0018] <Transport module 30> In the wafer processing system 101 of this example, wafers W are transported using a magnetic levitation type transport module (substrate transport module) 30. As shown in FIG. 2, the transport module 30 includes a main body 31 that is rectangular in plan view, and is configured to hold the wafer W directly on the upper surface of the main body 31. That is, the main body 31 of the transport module 30 serves as a stage 34, which is a holder for holding the wafer W. For example, the stage 34 is formed in the shape of a flat rectangular plate. A module-side magnet 33 is provided inside the main body 31 of the transport module 30, and an example of the configuration thereof will be described later with reference to FIG. 3.

[0019] The transfer module 30 enters the wafer processing chamber 110 or the load lock chamber 130 and transfers the wafer W between the lift pins 113 and 131. The transfer module 30 is formed with a slit 341 for transferring the wafer W while avoiding interference with the lift pins 113 and 131. The slit 341 is formed along the path along which the lift pins 113 and 131 pass when the stage 34 moves to and from a position below the wafer W held by the lift pins 113 and 131. The slit 341 is also formed so that the direction of entry to the position below the wafer W can be reversed by 180°. With this configuration, the transfer module 30 and the wafer W can be vertically arranged with their centers aligned while avoiding interference between the transfer module 30 and the lift pins 113 and 131.

[0020] <Magnetic levitation mechanism> 3, a plurality of tiles (transfer tiles) 10 are provided on the floor of the vacuum transfer chamber 160. These tiles 10 are provided on the entire floor of the vacuum transfer chamber 160, which is the transfer area of ​​the transfer module 30. Furthermore, since the transfer area of ​​the transfer module 30 in this example is set so that it can move into the load lock chamber 130 and the wafer processing chamber 110, tiles 10 are also provided on the floor of these load lock chamber 130 and wafer processing chamber 110.

[0021] A plurality of moving surface side coils 11 are arranged inside each tile 10. The moving surface side coils 11 generate a magnetic field when power is supplied from a power supply unit 53. The moving surface side coils 11 correspond to the first magnet of the present disclosure.

[0022] Meanwhile, multiple module-side magnets 33, each composed of, for example, permanent magnets, are arranged inside the transport module 30. A repulsive force (magnetic force) acts between the module-side magnets 33 and the magnetic field generated by the moving surface-side coils 11. This action allows the transport module 30 to be magnetically levitated relative to the moving surface on the upper surface side of the tile 10. The module-side magnets 33 provided in the transport module 30 correspond to the second magnet of the present disclosure.

[0023] Furthermore, the tile 10 can change the state of the magnetic field by adjusting the position where the magnetic field is generated and the strength of the magnetic force using the multiple moving surface side coils 11. By controlling this magnetic field, it is possible to move the transport module 30 in a desired direction on the moving surface, adjust the levitation distance from the moving surface, and adjust the orientation of the transport module 30. Control of the magnetic field on the tile 10 side is performed by selecting the moving surface side coils 11 to which power is supplied and adjusting the amount of power supplied to the moving surface side coils 11.

[0024] The multiple module-side magnets 33 may be configured with coils that function as electromagnets and are supplied with power from a battery provided inside the transport module 30. The module-side magnets 33 may also be configured with both permanent magnets and coils.

[0025] The vacuum transfer chamber 160 having the above-described configuration is provided with a plurality of transfer modules 30, and these transfer modules 30 can be moved simultaneously to transfer the wafer W. The vacuum transfer chamber 160, which is equipped with the transfer module 30 and to which the wafer processing chamber 110 is connected, corresponds to the device for transferring substrates according to the present disclosure.

[0026] <Control unit 5> The wafer processing system 101 includes a control unit 5. The control unit 5 is configured by a computer having a CPU and a storage unit, and controls each unit of the wafer processing system 101. The storage unit stores a program that includes a group of steps (commands) for controlling the movement of the transfer module 30 and the operation of the wafer processing chamber 110. This program is stored in a storage medium such as a hard disk, compact disk, magnetic optical disk, memory card, or nonvolatile memory, and is installed from there into the computer.

[0027] <Wafer W Transfer Operation> Next, an example of the transfer operation of the wafer W in the wafer processing system 101 having the above-described configuration will be described. First, a carrier C containing a wafer W to be processed is placed on the load port 141, and the wafer W is removed from the carrier C by the wafer transfer mechanism 142 in the atmospheric transfer chamber 140. Next, the wafer W is transferred to an alignment chamber (not shown), where alignment of the wafer W is performed. Furthermore, when the wafer W is removed from the alignment chamber by the wafer transfer mechanism 142, the gate valve 133 is opened.

[0028] When the wafer transfer mechanism 142 enters the load lock chamber 130, the lift pins 131 push up and receive the wafer W. After that, when the wafer transfer mechanism 142 retreats from the load lock chamber 130, the gate valve 133 is closed. Furthermore, the atmosphere inside the load lock chamber 130 is switched from atmospheric pressure to a vacuum atmosphere.

[0029] Once the load lock chamber 130 is in a vacuum atmosphere, the gate valve 132 is opened. At this time, inside the vacuum transfer chamber 160, the transfer module 30 is facing the load lock chamber 130 and is waiting in a magnetically levitated state near the connection position of the load lock chamber 130.

[0030] 1, the transfer module 30 enters the load lock chamber 130 and is positioned below the wafer W supported by the lift pins 131. When the lift pins 131 are further lowered, the wafer W is delivered onto the stage 34 of the transfer module 30.

[0031] Next, the transfer module 30 holding the wafer W leaves the load lock chamber 130 and moves within the vacuum transfer chamber 160 along a preset movement path to the wafer processing chamber 110, the destination of the wafer W. As shown in FIG. 1, when the transfer module 30 reaches a position directly facing the wafer processing chamber 110, the gate valve 111 is opened and the transfer module 30 enters the wafer processing chamber 110. Thereafter, the wafer W is transferred to the mounting table 112 via the lift pins 113, and the transfer module 30 is retracted from the wafer processing chamber 110. After the gate valve 111 is closed, processing of the wafer W begins.

[0032] In processing the wafer W, the wafer W placed on the mounting table 112 is heated as needed to a preset temperature. If a processing gas supply unit is provided, a processing gas is supplied into the wafer processing chamber 110. In this manner, the desired processing of the wafer W is performed.

[0033] After processing the wafer W for a preset period, heating of the wafer W is stopped and the supply of processing gas is stopped. If necessary, a cooling gas may be supplied into the wafer processing chamber 110 to cool the wafer W. Thereafter, the wafer W is transferred from the wafer processing chamber 110 to the load lock chamber 130 in the reverse order of the loading procedure. Furthermore, after the atmosphere in the load lock chamber 130 is switched to a normal pressure atmosphere, the wafer W in the load lock chamber 130 is removed by the wafer transfer mechanism 142 on the atmospheric transfer chamber 140 side and returned to a predetermined carrier C.

[0034] <Feedforward control> In the wafer W transfer operation in the wafer processing system 101 described above, the transfer module 30 moves while levitating above the floor of the vacuum transfer chamber 160, the load lock chamber 130, and the wafer processing chamber 110. Movement using magnetic levitation is less susceptible to changes in physical characteristics due to friction or changes in posture, unlike, for example, an articulated arm robot. Therefore, the transfer module 30 can be treated as an ideal rigid body, making it easy to identify the relationship between externally applied forces and the motion of the transfer module 30.

[0035] If the above relationship can be identified, it becomes possible to schedule the position and posture of the transport module 30 in advance, and to perform feedforward control (hereinafter also referred to as "FF control") by adjusting the force (the repulsive force between the moving surface side coil 11 and the module side magnet 33) applied to operate the transport module 30 based on this schedule. Compared to feedback control, which adjusts the force applied based on the detection results of the position and posture of the transport module 30, FF control allows for control with less delay. Therefore, in the wafer processing system 101 of this embodiment, the control unit 5 described above is configured to execute operation control of the transfer module 30 using FF control.

[0036] On the other hand, the wafer processing chamber 110 and the vacuum transfer chamber 160 are equipped with a variety of components, and these components may need to be repaired, replaced, or cleaned. Furthermore, if various sensors are installed as needed in the wafer processing chamber 110 or the vacuum transfer chamber 160 and the internal conditions can be detected using these sensors, this can be useful for improving wafer W processing and equipment maintenance. Furthermore, a wafer W may be damaged or a transfer module 30 may malfunction inside the vacuum transfer chamber 160 or the wafer processing chamber 110, making it necessary to remove the damaged wafer W or transfer module 30.

[0037] In these cases, it is necessary to remove components and transfer modules 30 from the wafer processing chamber 110 and vacuum transfer chamber 160, or to install sensors inside them. However, to perform these operations, it is necessary to stop operation of the wafer processing system 101 as needed, and to return the interior of the target wafer processing chamber 110 or vacuum transfer chamber 160 from a vacuum atmosphere to an atmospheric pressure atmosphere before opening the chamber. Furthermore, to resume operation of the wafer processing system 101, it is necessary to depressurize the wafer processing chamber 110 or vacuum transfer chamber 160 back to a vacuum atmosphere. The time required for these operations results in lost opportunity because wafers W cannot be processed during this time.

[0038] In this regard, the wafer processing system 101 of this example is equipped with a transfer module 30 that can move within the vacuum transfer chamber 160 and the wafer processing chamber 110. If this transfer module 30 can be used to load and unload parts, damaged wafers W, broken transfer modules 30, and sensors, for example, via the load lock chamber 130, there will be no need to switch or release the pressure in the wafer processing chamber 110 and the vacuum transfer chamber 160. On the other hand, transporting an object having a weight and shape different from that of an undamaged wafer W (hereinafter also referred to as a "normal wafer W") can cause deterioration in the operational control of the transport module 30 using FF control.

[0039] Therefore, the wafer processing system 101 in this example performs FF control, assuming in advance that the transport module 30 will transport multiple types of transported items, such as, in addition to normal wafers W, parts that are subject to repair or replacement, damaged wafers W, broken transport modules 30, and various sensors. Here, the parts used in the wafer processing chamber 110 or the vacuum transfer chamber 160, the damaged wafer W, the faulty transfer module 30, and the sensor correspond to "equipment used in the vacuum transfer chamber 160 or the wafer processing chamber 110" in this example. Also, the normal wafer W and the multiple types of equipment correspond to "transported items" of the transfer module 30.

[0040] The control unit 5 is configured to be able to change the content of the FF control depending on the type of the transported article. The configuration of the control unit 5 related to the operation control of the transfer module 30 and the content of the control will be described below with reference to FIGS.

[0041] <Detailed configuration of control unit 5> 4 is a block diagram showing an electrical configuration related to the operation control of the transport module 30. Regarding the operation control of the transport module 30 using feedback control, the control unit 5 includes a parameter storage unit 503, a control schedule creation unit 502, and a magnetic force adjustment unit 501. The parameter storage unit 503 stores model parameters for expressing the relationship between the force applied to the transport module 30 while it is holding the load and the motion of the transport module 30.

[0042] The model parameters are stored in association with a plurality of types of transport objects, including normal wafers W. Transport objects other than normal wafers W include components used in the wafer processing chamber 110 and the vacuum transfer chamber 160, damaged wafers W, broken transfer modules 30, and various sensors. A specific example of a component is a focus ring 114 disposed on a mounting table 112 in the wafer processing chamber 110, where wafers W are processed using plasmatized processing gas. Another example of a sensor is a camera-equipped wafer, in which a camera is mounted on a circular plate having approximately the same diameter as the wafer W.

[0043] <Model parameters> In the wafer processing system 101 of this example, the model parameters are determined based on a control model that integrally represents the transported object and the transport module 30. Specific examples of the control model and model parameters will be described below with reference to Figures 5A and 5B.

[0044] 5A is an external perspective view of the transfer module 30 transferring a normal wafer W as a transfer object. Let m0 be the mass of the transfer module 30 and m1 be the mass of the wafer W, and a force F1 is applied in the direction of the arrow shown in FIG. 5A. As a result, when the transfer module 30 transferring the wafer W moves linearly, the theoretical equation expressing the relationship between the force F1 and the acceleration a is given by the following equation (1). F1=(m0+m1)a …(1)

[0045] Here, if the wafer W and the transfer module 30 are regarded as an integrated control model 3A and the total mass thereof is taken as M1 (=m0+m1), then equation (1) can be rewritten as the following equation (1)'. F1=M1a …(1)' Equation (1)' expresses the relationship between the force applied to the control model 3A, which integrally represents the wafer W and the transfer module 30, and the linear motion of the control model 3A. In this case, the mass M1 of the control model 3A corresponds to a model parameter for expressing the relationship between the force applied to perform linear motion and the acceleration.

[0046] Next, a rotational force N1 is applied to the control model so that it rotates clockwise around the center of rotation O shown by the dashed line in Figure 5A. Here, the wafer W is held by the transfer module 30, which has a roughly square planar shape, so that the center of the wafer W coincides with the center of the transfer module 30. In this example, the center of rotation O is set to pass through the centers of the wafer W and the transfer module 30. Furthermore, if the effects of the notch and orientation flat formed on the wafer W and the slit 341 of the transfer module 30 described with reference to Figure 2 can be ignored, the center of rotation O passes through the center of gravity G of the control model 3A.

[0047] When the control model 3A shown in FIG. 5A performs a rotational motion, the theoretical equation expressing the relationship between the rotational force N1 and the angular acceleration α is expressed by the following equation (2). N1=I1α …(2) Here, I1 is the moment of inertia of the control model 3A, which is determined according to the mass M1 and shape of the control model 3A, the position of the center of gravity G, and the position of the center of rotation O.

[0048] Equation (2) expresses the relationship between the rotational force applied to the control model 3A and the rotational motion of the control model 3A. In this case, the moment of inertia I1 corresponds to a model parameter for expressing the relationship between the rotational force applied to perform the rotational motion and the angular acceleration. Note that the center of rotation O may be located outside the control model 3A. In this case, the control model 3A performs circular motion, rotating around the center of rotation O.

[0049] Next, Fig. 5B is an external perspective view of the conveying module 30 conveying the L-shaped member 4. The mass of the conveying module 4 is m2, and a force F2 is applied in the direction of the arrow shown in Fig. 5A. As a result, when the conveying module 30 conveying the conveying module 4 moves linearly, the relationship between the force F2 and the acceleration a is expressed by the following equation (3). F2=(m0+m2)a …(3)

[0050] Here, if the load 4 and the transport module 30 are regarded as one unit and the total mass thereof is M2 (=m0+m2), then equation (3) can be rewritten as equation (3)' below. F2=M2a …(3)' Equation (3)' expresses the relationship between the force applied to the control model 3B, which integrally represents the transported object 4 and the transport module 30, and the linear motion of the control model 3B. In this case, the mass M2 of the control model 3B corresponds to a model parameter for expressing the relationship between the force applied to perform linear motion and the acceleration.

[0051] Next, a rotational force N2 is applied to the control model 3B so that it rotates clockwise around the center of rotation O indicated by the dashed line in FIG. 5B. Here, the transported object 4 is held at a preset position on the transport module 30 in a preset attitude. The center of rotation O is set to pass through the center position of the transport module 30. In this example, the center of rotation O passes through a position offset from the center of gravity G of the control model 3B.

[0052] When the control model shown in FIG. 5B performs rotational motion, the theoretical equation expressing the relationship between the rotational force N2 and the angular acceleration α is expressed by the following equation (4). N2=I2α …(4) Here, I2 is the moment of inertia of the control model 3B, which is determined according to the mass M2 and shape of the control model 3B, the position of the center of gravity G, and the position of the center of rotation O. Equation (4) expresses the relationship between the rotational force applied to control model 3B and the rotational motion of control model 3B. In this case, moment of inertia I2 corresponds to a model parameter for expressing the relationship between the force rotation applied to perform the rotational motion and angular acceleration. Note that the center of rotation O may be outside control model 3A, as with control model 3A in FIG. 5A.

[0053] As illustrated above, the model parameters are determined according to the control models 3A and 3B, which represent the transported object and the transport module 30 as a single unit, and are set in association with each of a plurality of types of transported object. The model parameters are set according to the type of motion, such as linear motion or rotational motion. Note that model parameters for this state are also set for the transport module 30 that is not transporting an object.

[0054] <Control Schedule Creation Unit 502> The control schedule creation unit 502 has the function of outputting a "control schedule" that shows, along a time axis, the operating force to be applied when operating the transport module 30 holding the transported object, based on a pre-set "operation schedule."

[0055] In the wafer processing system 101, when a carrier C is placed on the load port 141, a transfer schedule is created for each wafer W accommodated in the carrier C. The transfer schedule contains information that specifies, along a time axis, when and to which wafer processing chamber 110 each wafer W removed from the carrier C will be transferred, and then when the wafer W that has completed processing will be unloaded from the wafer processing chamber 110 and transferred to the carrier C.

[0056] The transfer schedule is created based on a processing recipe that specifies the details of the processing to be performed on each wafer W in the carrier C (processing variables: heating temperature of the wafer W, pressure in the wafer processing chamber 110, supply time of processing gas, processing time, etc.). The processing variables are set via an interface unit 54. The interface unit 54 is configured, for example, by a touch panel operated by an operator.

[0057] When the transfer schedule is created, an operation schedule is created that defines the operations (movements) of the transfer modules 30 arranged in the vacuum transfer chamber 160 of Fig. 1. The operation schedule includes information that defines, along a time axis, when and where each transfer module 30 will receive a wafer W and when and where the received wafer W will be transferred, as well as the movement path of the transfer module 30.

[0058] For items other than normal wafers W, information is set that defines when and where each item is to be received and where and by when it is to be transported along a time axis. The transfer schedule and operation schedule described above are created, for example, by the control unit 5. Alternatively, an operation schedule created externally may be acquired via communication.

[0059] The control schedule creation unit 502 acquires specification information for identifying the transported object to be transported by the transport module 30 and the above-mentioned operation schedule. The specification information is set, for example, via the interface unit 54. The control schedule creation unit 502 then reads out the model parameters of the transported object corresponding to the specification information stored in the parameter storage unit 503. Then, using the parameters, the control schedule creation unit 502 calculates the operating force to be applied when the transport module 30 holding the transported object corresponding to the specification information is operated based on the operation schedule, and outputs the calculated operating force as a control schedule representing the operating force along the time axis. Note that the specification information can also identify a state in which "the transported object is not being transported."

[0060] 6 shows a simplified example of the operation of the transfer module 30 based on the operation schedule. The transfer module 30 moves linearly from point P1, where it exits the load lock chamber 130, toward the rear of the vacuum transfer chamber 160 (the X' direction of the secondary coordinate set for the transfer module 30). Next, the transfer module 30 changes direction of movement at point P2 and moves linearly to the left (the Y' direction of the secondary coordinate set for the transfer module 30) as viewed from the front side to point P3. Thereafter, the transfer module 30 is set to rotate 90 degrees clockwise. Note that the counterclockwise θ direction of the secondary coordinate set for the positive rotation direction.

[0061] 6 during a predetermined period (for example, the period from time T0 to time T9 shown in FIG. 7), the operation schedule includes the linear movement speed and rotation speed of the transfer module 30 along the time axis. Here, FIGS. 7(a) and 7(c) show the movement speeds (V X’ , V Y’ ), and Fig. 7(e) shows the rotation speed in the θ direction (ω θ ) is shown.

[0062] Based on the identification information indicating the transported object acquired together with the operation schedule, the control schedule creation unit 502 reads out model parameters stored in the parameter storage unit 503. When the transported object identified by the identification information is the wafer W shown in Fig. 5A, the control schedule creation unit 502 reads out model parameters M1 and I1 for the linear movements of points P1 to P2 and points P2 to P3, and the rotational movement at point P3.

[0063] Then, using the model parameter M1, the operating force to be applied to the control model 3A (transfer module 30 holding the wafer W) which integrally represents the wafer W and the transfer module 30 is calculated. That is, for the linear movement from point P1 to point P2 (the period from time T0 to time T3 in FIG. 7), the moving speed V of the transfer module 30 at each time in the X' direction shown in FIG. 7(a) is calculated. X’ From the acceleration a in the same direction at each time X’ is obtained (Fig. 7(b)). Then, the acceleration aX’ and the model parameter M1 into the above-mentioned equation (1)', a control schedule is obtained which represents the operating force to be applied to the transport module 30 along the time axis.

[0064] Here, the acceleration a at each time shown in FIG. X’ may be generated by the control schedule generation unit 502 that has acquired the operation schedule of FIG. 7(a). Alternatively, the acceleration a X’ may be obtained from outside as an "operation schedule that defines the movement of the transfer module 30" (the same applies to FIGS. 7(d) and (f) described later).

[0065] Similarly, for the linear movement of the path from points P2 to P3 (the period from times T3 to T6 in Figure 7) and the rotation at point P3 (the period from times T6 to T9 in Figure 7), the acceleration at each time in the Y' direction and the θ direction in Figures 7(c) and (e) is obtained from the changes in each speed in the same directions (Figures 7(d) and (f)).

[0066] For linear movement along the path from point P2 to point P3, the acceleration a Y’ , and model parameter M1 into equation (1)' to obtain a control schedule. Also, for the rotation at P3, the acceleration α at each time in Figure 7(f) and model parameter I1 are substituted into equation (2) to obtain a control schedule.

[0067] On the other hand, if the transported object identified by the identification information is transported object 4 shown in Fig. 5B, model parameters M2 and I2 are read out from parameter storage unit 503. Then, using the above-described equations (3)' and (4), a control schedule for control model 3B (transport module 30 holding transported object 4) is obtained in the same manner as in the case of control model 3A.

[0068] <Magnetic force adjustment section 501> The control schedule creation unit 502 outputs the created control schedule to the magnetic force adjustment unit 501. The magnetic force adjustment unit 501 performs control to adjust the magnetic force of the moving surface side coils 11 so that an actuation force based on the control schedule is applied to the transport module 30 (which is transporting an object) in Fig. 6. That is, it outputs a control signal to the power supply unit 53 shown in Fig. 4 to select the moving surface side coils 11 to which power is to be supplied and to adjust the magnitude of the power supplied to the selected moving surface side coils 11.

[0069] Based on the control signal acquired from the magnetic force adjustment unit 501, the power supply unit 53 selects the moving surface side coils 11 to which power is to be supplied and adjusts the magnitude of the power supplied to the selected moving surface side coils 11. As a result, based on the operation schedule shown in Figures 7(a), (c), and (e), FF control is performed in which the transport module 30 moves along the movement path shown in Figure 6 and changes its posture.

[0070] Here, the operation of the transfer module 30 may be not only the simple operation exemplified in Fig. 6 but also a complex operation including a curved movement. By combining the movement operations in the X' and Y' directions and the rotation operation in the θ direction and the circular movement operation shown in each diagram of Fig. 7, a control schedule for even more complex operations can be created. Furthermore, if the transfer module 30 is configured to enter areas other than the vacuum transfer chamber 160, such as the wafer processing chamber 110 and the load lock chamber 130, operation schedules and control schedules that include operations in these areas are created.

[0071] As described above, the wafer processing system 101 of this embodiment creates a control schedule based on the model parameters set using different control models depending on the transported object and the operation schedule. By performing FF control of the transport module 30 based on this control schedule, control with minimal delay can be achieved even when transporting different types of transported objects.

[0072] <Feedback correction unit 504> On the other hand, there is a risk of various unpredictable disturbances when controlling the operation of the transfer module 30. For example, vibrations caused by people or heavy objects moving around the wafer processing system 101 or the occurrence of an earthquake can cause a discrepancy between the operation schedule and the actual operation of the transfer module 30.

[0073] 3, the winding states of the many moving surface side coils 11 arranged on the tile 10 may differ from one another within the tolerance range. Furthermore, the arrangement positions of the moving surface side coils 11 within the tile 10 and the arrangement positions of the module side magnets 33 within the transport module 30 may also be shifted within the tolerance range. Due to these mechanical factors, even if the same amount of power is supplied, the operating force applied to the transport module 30 may change depending on the position of the tile 10.

[0074] Furthermore, for a transport object whose shape cannot be uniquely identified in advance, such as a damaged wafer W, a control model is set based on rough assumptions such as "when a part of the wafer W is chipped" or "when the wafer W is curved." Therefore, the model parameters corresponding to this control model may not accurately represent the actual movement of the transport module 30.

[0075] In this way, when disturbances occur, when the actuation force changes depending on the position, or when highly accurate model parameters cannot be obtained, performing FF control alone may result in the transport module 30 not reaching the correct position within a predetermined period of time. Therefore, the control unit 5 shown in Fig. 4 has a feedback (FB) correction unit 504 that complements the FF control described above and provides more accurate operation control.

[0076] A sensor unit 51 is provided in the vacuum transfer chamber 160 to detect the position and orientation of the transfer module 30 used by the FB correction unit 504. A position and orientation detection unit 52 identifies the position and orientation of the transfer module 30 based on information acquired from the sensor unit 51.

[0077] Examples of the sensor unit 51 include a plurality of hall sensors provided at preset positions in the tile 10, a laser displacement meter, and a camera that captures images of the transport module 30. Fig. 4 shows an example in which a plurality of hall sensors are provided on the tile 10 as the sensor unit 51.

[0078] The FB correction unit 504 compares the position or posture of the transport module 30 specified in the operation schedule with the actual position or posture of the transport module 30 detected by the sensor unit 51. Then, the FB correction unit 504 corrects the adjustment of the magnetic force of the moving surface side coil 11 by the magnetic force adjustment unit 501 so as to reduce the amount of deviation between these positions or postures.

[0079] That is, the FB correction unit 504 outputs a correction signal to the magnetic force adjustment unit 501 to correct the timing of selecting the moving surface side coil 11 to which power is to be supplied and the magnitude of power to be supplied to the selected moving surface side coil 11. The magnetic force adjustment unit 501 adds the correction amount acquired from the FB correction unit 504 to the control signal obtained based on the control schedule and outputs the result to the power supply unit 53.

[0080] <Parameter update unit 505> By correcting the FF control using the FB correction unit 504, it is possible to suppress a decrease in control accuracy caused by the above-mentioned device factors and model parameter factors. On the other hand, if a state in which the proportion of the correction amount acquired from the FB correction unit 504 is large continues, it becomes difficult to demonstrate the inherent characteristics of the FF control, which is that it enables control with little delay.

[0081] 4, the control unit 5 includes a parameter update unit 505 that updates the model parameters. When the correction amount of the FB correction unit 504 exceeds a preset threshold value for a predetermined period of time, the parameter update unit 505 has a function of updating the model parameters so as to reduce the correction amount.

[0082] In an example using the FB correction unit 504, the relationship between the operating force for operating the transport module 30, the FF control component, and the FB correction amount component can be expressed by the following equation (5). F=F FF +F FB …(5) where F is the actuation force applied to the transport module 30, F FF is the component of FF control by the control schedule creation unit 502, F FB represents the component of the correction amount of the FB correction unit 504. FF , F FB The magnitude of the force can be grasped from the operating force indicated by the control schedule output from the control schedule generation unit 502 and the correction amount output from the FB correction unit 504.

[0083] For example, F FF F for the size of FB The ratio of the size of (|F FB | / |F FF If the state where |) exceeds a preset threshold continues, the parameter update unit 505 updates the model parameters stored in the parameter storage unit 503. An example of the threshold is F FB The size of F FF An example of this is when the threshold exceeds 10% of the size of F. FF It is not limited to the case where the ratio is defined as a ratio to the size of F. FB A threshold may be set for the absolute value of . Furthermore, even when the operating force applied to the transport module 30 is the rotational force N described in the above-mentioned equations (2) and (4), the degree of influence of the correction amount of FB can be grasped using the same concept as in the above example.

[0084] On the other hand, if the model parameters are updated when the correction amount of the FB correction unit 504 exceeds the threshold value only for a short period of time, the updates will be performed frequently, which may cause instability in the operation control of the transport module 30. Therefore, the parameter update unit 505 updates the model parameters when the state in which the correction amount exceeds the preset period continues for a preset period of time.

[0085] An example of a period for determining whether or not the model parameters need to be updated is F FB An example of such a case is when the magnitude of the parameter exceeds the threshold value for a certain period of time. Also, if this state is repeated multiple times, the model parameters may be updated.

[0086] An example of a method for updating the model parameters is back-calculation from the corrected actuation force. Explaining this using the example of Figures 5A and 5B, new model parameters of the control models 3A and 3B, namely, masses M1 and M2, are back-calculated based on the actuation force (F in equation (5)) actually applied to the transport module 30 and equations (1)' and (3)'. If the back-calculated model parameters M1 and M2 fluctuate over time, their average values ​​may be used as the new model parameters. Regarding the model parameters (moments of inertia I1 and I2) when the transfer module 30 is rotated, new model parameters can be obtained by the same method.

[0087] 4, it is not essential to provide the FB correction unit 504 and the parameter update unit 505. For example, depending on the accuracy required for the operation control by the transport module 30, the correction by the FB correction unit 504 and the update of the model parameters may be omitted.

[0088] <Function of control unit 5> An example of the operation of controlling the operation of a certain transport module 30 using the control unit 5 having the above-described configuration will be described with reference to the flowchart of FIG. First, as a preliminary preparation before starting operation of the wafer processing system 101 (start), model parameters for each transported object are determined according to the contents of the transport module 30 and stored in the parameter memory unit 503 (step S101, process of determining parameters).

[0089] Next, when the wafer processing system 101 starts operation and it is time to transport the wafer W or other transported objects by the transport module 30, the specific information of the transported objects and the operation schedule are acquired (step S102). After that, the model parameters of the transported objects (including the state where the transported objects are not being transported) corresponding to the specific information are read out, and a control schedule is created and output using the operation schedule and the model parameters (step S103, a step of outputting the control schedule).

[0090] Based on the created control schedule, the magnetic force adjuster 501 controls the power supply by the power supply unit 53, and performs the transport operation of the transport module 30 to transport the transported object (step S104, a step of performing feedforward control). At this time, if the control unit 5 is equipped with an FB correction unit 504, the sensor unit 51 detects the position and posture of the transport module 30 (a step of detecting the position or posture of the transport module 30). Then, correction is performed so that the deviation amount of the detection result relative to the position and posture of the transport module 30 specified in the operation schedule becomes small (a step of performing feedback correction). Then, if the transport operation is not completed, these operations are continued (step S105: NO).

[0091] When the transport operation is completed (step S105: YES), the correction amount of the FB correction unit 504 is greater than the threshold value, and this state has continued for a predetermined period, so it is checked whether it is necessary to update the model parameters (step S106). If updating is not necessary, the operation is completed, and the timing to transport the next transported object is awaited (step S106; NO → step S102).

[0092] If the model parameters need to be updated (step S106; YES), new model parameters are obtained using the method described above, and the obtained results are input into the parameter storage unit 503 to update the model parameters (step S107, process of updating the model parameters), after which the timing to transport the next transported item is awaited (go to step S102).

[0093] <Effects> The wafer processing system 101 of the present disclosure has the following advantages. Based on a control model that integrally represents the transported object and the transport module 30, multiple types of model parameters are prepared according to the transported object to express the relationship between the actuation force applied to the control model and its motion. By switching between these model parameters and creating a control schedule that specifies the actuation force for operating the transport module 30 along a time axis, accurate motion control (FF control) can be performed even when transporting an object other than a wafer W.

[0094] <Wafer Processing System 101a> 9 to 11 show an example of the configuration of a wafer processing system 101a that transfers an object using a transfer module 30a according to another embodiment. In the following description of FIGS. 9 to 13, components common to the wafer processing system 101 and transfer module 30 described with reference to FIGS. 1 to 6 are denoted by the same reference numerals as those in these figures.

[0095] The wafer processing system 101a shown in FIG. 9 transports an object to be transported using a transport module 30a equipped with an arm unit 32. In this respect, it differs from the transport module 30 according to the first embodiment, in which the upper surface of the main body 31 of the transport module 30 serves as a stage 34 that holds the object to be transported. In the transport module 30a, the main body 31, which is formed in a rectangular shape in a plan view, has a configuration substantially similar to that of the transport module 30 according to the first embodiment. That is, similar to the example shown in FIG. 3, a plurality of module-side magnets 33 are provided inside the main body 31. However, the main body 31 of the transport module 30a of this example does not have a slit 341 formed therein.

[0096] 10 and 11, the main body 31 is provided with an arm 32 that holds the wafer W horizontally. The arm 32 is provided so as to extend horizontally from a base end on the main body 31 side. A fork is provided at the tip of the arm 32 so as to surround from the left and right an area where three lift pins 131 and 112 are provided. The fork corresponds to a holder in the transfer module 30a.

[0097] The transfer module 30a transfers the wafer W by inserting the arm 32 into the wafer processing chamber 110 or the load lock chamber 130 while keeping the main body 31 positioned within the vacuum transfer chamber 160. Therefore, the length L of the arm 32 is set to a length that allows the wafer W held by the arm 32 to enter a position above the lift pins 113 and 131.

[0098] 9, the length of the short side of the vacuum transfer chamber 160, which is rectangular in plan view, is wide enough to allow two transfer modules 30a, each holding a wafer W, to pass each other side by side. In addition, the length of the short side of the vacuum transfer chamber 160 in this example is shorter than the length from the main body 31 to the front end of the wafer W when the transfer module 30a holds the wafer W (the total length of the transfer module 30a when holding the wafer W).

[0099] When the transfer module 30a having the above-described configuration is used to transfer a wafer W in a vacuum transfer chamber 160 whose short-side length is shorter than the overall length of the transfer module 30a, the transfer module 30a that has received the wafer W in the load lock chamber 130 performs a retreating operation. When the transfer module 30a is retreated to a position to the side of the wafer processing chamber 110, the main body 31 moves past the position of the gate valve 111 of the wafer processing chamber 110 to the rear side. By this operation, the tip end of the arm 32 holding the wafer W is positioned to the side of the gate valve 111.

[0100] In this way, when the tip of the arm unit 32 reaches the side of the gate valve 111, in addition to the retreating operation, the tip of the arm unit 32 is rotated so as to face the gate valve 111. Next, the gate valve 111 is opened, and while rotating so as to insert the wafer W into the wafer processing chamber 110, the movement direction of the transfer module 30a is switched to forward.

[0101] As described above, the length of the short side of the vacuum transfer chamber 160 is shorter than the overall length of the transfer module 30a holding the wafer W. Even in this case, the wafer W can be loaded into the wafer processing chamber 110 within the vacuum transfer chamber 160 by a switching operation that moves the transfer module 30a forward and backward while combining a rotation operation.

[0102] In the above-described operation control of the transport module 30a, the control unit 5 still acts to create a control schedule using the operation schedule and model parameters. However, the transport module 30a, which transports an object using the arm unit 32, may be subject to greater vibrations. If the object is transported while large vibrations are occurring, the object may shift from its position on the arm unit 32, fall, or come into contact with other equipment.

[0103] Therefore, in the wafer processing system 101a of this example, when the arm portion 32, which is the holding portion, is viewed as a leaf spring, the parameter memory unit 503 stores the mass m of the transported object, the moment of inertia I' of the transport module 30a holding the transported object, the spring constant k, and the damping coefficient c as model parameters for expressing the vibrations that occur in the arm portion 32.

[0104] It is assumed that the vibration f of the arm unit 32 can be expressed as a function f(m, I', k, c) of these model parameters using a theoretical equation that expresses the natural frequency of the arm unit 32. To suppress this vibration, when the transfer module 30a shown in FIG. 11 is moved in the X' direction, the transfer module 30 may be moved up and down so as to trace a trajectory that is aligned in frequency with, but inverted in phase with, the vibration f, thereby performing vibration suppression control (see the dashed arrow in FIG. 11). Furthermore, a notch filter may be provided in the feedback loop to reduce the vibration f, which corresponds to the natural frequency of the arm unit 32.

[0105] Furthermore, even if it is difficult to specify the vibration f using a theoretical formula, the model parameters may be determined by machine learning. For example, the vibration f may be expressed by the following formula (6), and the operation of transporting the transported object without vibration suppression control may be repeated multiple times, and the model parameters A, ω, and θ may be determined by machine learning using, for example, a neural network. f = Asin(ωt + θ) …(6) where A is the amplitude, ω is the angular velocity, and θ is the initial phase.

[0106] Furthermore, machine learning such as a neural network may be performed not only when determining the model parameters but also when updating the model parameters by the parameter update unit 505. For example, suppose that a vibration sensor serving as a sensor unit is provided in the main body unit 31, and the frequency and phase of the vibration suppression movement are corrected so that the amplitude of the vibration detected by this vibration sensor is reduced.

[0107] At this time, if the state in which the correction amount of the FB correction unit 504 exceeds a preset threshold continues for a preset period, for example, the model parameters A, ω, and θ in equation (6) may be updated. At this time, the vertical movement of the transport module 30 for vibration suppression control can be grasped based on the corrected control signal output from the magnetic force adjuster 501. This vertical movement may be learned by machine learning, equation (6) may be found, and new model parameters may be determined.

[0108] In the above explanation, the determination and update of the model parameters of the control model have been exemplified by cases where the model parameters are determined based on a theoretical formula that represents the relationship with the motion of the control model, and where the model parameters are determined by machine learning. In addition to these, a state equation may be formulated that includes model parameters and represents the details of FF control and FB correction of the transport modules 30 and 30a, and an observer that estimates the internal state of this control system may also be formulated.The model parameters can be determined and updated based on the results of the estimation of the internal state of the control system by the observer.

[0109] 12 and 13 show an example in which a plurality of transport modules 30 cooperate to transport an object. First, Figure 12 shows a schematic diagram of a transport object being transported from a broken transport module 30b by two other transport modules 30b. In the figure, the broken transport module 30b is hatched with diagonal lines.

[0110] In this example, a protrusion 35 is provided on the side surface of each transfer module 30b. A recess 36 into which the protrusion 35 can be inserted is provided on the side surface opposite to the side on which the protrusion 35 is provided. As shown in Fig. 12, multiple transfer modules 30b can be connected by inserting the protrusion 35 of one transfer module 30b into the recess 36 of another transfer module 30b.

[0111] As described above, by configuring the plurality of transport modules 30b to be connectable, if, for example, one transport module 30b breaks down and becomes immobile, the other transport modules 30b can connect the failed transport module 30b so that the failed transport module 30b is sandwiched between them. The failed transport module 30b is held and transported by the other transport modules 30b.

[0112] For the transport module 30b exemplified above, model parameters are determined in advance based on a control model in which the failed transport module 30b is the transported object. Then, a control schedule is created using these model parameters and an operation schedule, and operation control is performed. This operation is the same as in the examples described with reference to FIGS. 1 to 11.

[0113] On the other hand, if the two transport modules 30b that cooperate to transport the failed transport module 30b are each independently controlled, a discrepancy in the operation control may occur. If a discrepancy in the operation control occurs, the distance between the two transport modules 30b may widen, potentially causing the failed transport module 30b to fall. Therefore, in this example, the transport module 30a designates one of the transport modules 30b as the master module 30A and performs the previously described FF control on this master module 30A. Meanwhile, the remaining transport module 30b is designated as the slave module 30B, and the magnetic force of the moving surface coil 11 is adjusted so that the slave module 30B is subjected to an operating force that causes it to operate in accordance with the master module 30A. In this way, master-slave control can prevent the transported object from falling due to a discrepancy in the control.

[0114] The multiple transfer modules 30 may also work together to transfer components installed in the vacuum transfer chamber 160 or the wafer processing chamber 110. Furthermore, the multiple transfer modules 30 may be configured to work together to transfer components in the load lock chamber 130. FIG. 13 shows three transfer modules 30 working together to transfer a focus ring 114 provided on a mounting table 112 in a wafer processing chamber 110.

[0115] Even when three or more transport modules 30 work together, one master device 30A and the other slave devices 30B are set. The master device 30A executes operation control based on a control schedule created using model parameters and an operation schedule. The remaining slave devices 30B follow the master device 30A, enabling accurate operation control while preventing the transported object from falling.

[0116] Here, the configuration example of the apparatus in which the transfer module 30 transfers the transfer object is not limited to the example of the vacuum transfer chamber 160 described above. For example, the control method of this example can also be applied when the wafer W is transferred under atmospheric pressure and processed under atmospheric pressure. Examples of processes performed under atmospheric pressure include coating and developing processes in which a resist solution for exposure or a developer is applied to the wafer W, and cleaning processes in which the substrate is cleaned with a cleaning solution.

[0117] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive, and the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0118] W wafer 101, 101a Wafer processing system 110 Wafer processing chamber 160 Vacuum Transfer Chamber 30, 30a, 30b Transfer Module 33 Module side magnet 5. Control section 501 Magnetic force adjustment section 502 Control Schedule Creation Department 503 Parameter storage unit

Claims

[Claim 1] An apparatus for transporting substrates to a substrate processing chamber, a substrate transfer chamber having a floor portion on which a first magnet having an adjustable magnetic force is provided, and a sidewall portion to which the substrate processing chamber is connected and which has an opening formed therein through which the substrate is transferred between the substrate processing chamber and the sidewall portion; a substrate transfer module including: a holder configured to be able to hold each of a plurality of types of transported objects, which are the substrates or equipment used in the substrate transfer chamber or the substrate processing chamber; and a second magnet that generates a repulsive force between itself and the first magnet, the substrate transfer module being configured to be movable within the substrate transfer chamber by magnetic levitation using the repulsive force; a control unit that controls an actuation force for operating the substrate transfer module using feedforward control by adjusting the magnetic force of the first magnet to change the repulsive force, The control unit a parameter storage unit that stores at least one model parameter for expressing a relationship between an actuation force applied to a control model that integrally represents the transport object and the substrate transport module and a motion of the control model, in association with each of the plurality of types of transport object; a control schedule creation unit that acquires specific information for identifying the transported object and an operation schedule that defines the movement of the substrate transport module along a time axis, uses the model parameters of the control model that correspond to the specific information stored in the parameter storage unit to determine the operating force that should be applied when operating the substrate transport module holding the transported object that corresponds to the specific information based on the operation schedule, and outputs the control schedule that defines the operating force along the time axis; and a magnetic force adjustment unit that performs the feedforward control by adjusting the magnetic force of the first magnet so that the actuation force based on the control schedule is applied to the substrate transport module that transports the transported object corresponding to the specific information.

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