Method for manufacturing bonded body and bonding apparatus

Abstract

To provide a method for manufacturing a laminate suitable for removing air bubbles mixed in an adhesive layer.SOLUTION: A method for manufacturing an adhered body according to the present disclosure includes applying a distributed load to at least a main region of a back surface of a first adhered member and applying a concentrated load to each of at least four points on a back surface of a second adhered member to adhere a front surface of the first adhered member and a front surface of the second adhered member via an adhesive layer to form an adhered body. The method for producing a laminate includes subjecting the laminate to an autoclave treatment.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present disclosure relates to a manufacturing method of a bonded body and a bonding apparatus. [Background technology]

[0002] Two bonding members may be bonded together via an adhesive layer to form a bonded body. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5344870 [Patent Document 2] Patent No. 6501447 Summary of the Invention [Problem to be solved by the invention]

[0004] When two bonding members are bonded together, air bubbles may become trapped in the adhesive layer. It is desirable that the air bubbles trapped in the adhesive layer can be removed by subsequent processing.

[0005] The present disclosure provides a method for manufacturing a bonded body and a bonding apparatus that are suitable for removing air bubbles that have become mixed in an adhesive layer. [Means for solving the problem]

[0006] The manufacturing method of the bonded body according to the present disclosure includes applying a distributed load to the back surface of a first bonding member and applying a concentrated load to each of at least four points on the back surface of a second bonding member to bond the surfaces of the first bonding member and the second bonding member together via an adhesive layer to form a bonded body. The manufacturing method of the bonded body also includes subjecting the bonded body to autoclave treatment. [Effects of the Invention]

[0007] According to the manufacturing method of a bonded body according to the present disclosure, it is possible to provide a manufacturing method of a bonded body that is suitable for removing air bubbles that have become mixed in the adhesive layer. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a flowchart showing an outline of a method for manufacturing a bonded body according to an embodiment. [Figure 2] FIG. 1 is a diagram showing a schematic configuration of a bonding apparatus according to an embodiment. [Figure 3] FIG. 2 is a perspective view showing the configuration of an upper stage and a lower stage in the embodiment. [Figure 4] FIG. 2 is a plan view showing the configuration of an upper stage and a lower stage in the embodiment. [Figure 5] FIG. 3 is a cross-sectional view showing the configuration of an upper stage in the embodiment. [Figure 6] FIG. 2 is a cross-sectional view showing the configuration of a lower stage in the embodiment. [Figure 7] FIG. 10 is a cross-sectional view showing the height of a convex portion of a lower stage in the embodiment. [Figure 8] 10 is a flowchart showing a bonding process in the embodiment. [Figure 9] 4A and 4B are cross-sectional views showing a bonding process in the embodiment. [Figure 10] 4A and 4B are cross-sectional views showing a bonding process in the embodiment. [Figure 11] 4A and 4B are cross-sectional views showing a bonding process in the embodiment. [Figure 12] 4A and 4B are cross-sectional views showing a bonding process in the embodiment. [Figure 13] FIG. 10 is a plan view showing the configuration of an upper stage and a lower stage in a first modified example of the embodiment. [Figure 14] FIG. 10 is a cross-sectional view showing the configuration of an upper stage and a lower stage in a first modified example of the embodiment. [Figure 15] FIG. 10 is a plan view showing the configuration of a lower stage in a second modified example of the embodiment. [Figure 16] FIG. 10 is a cross-sectional view showing the configuration of a lower stage in a second modified example of the embodiment. [Figure 17]FIG. 10 is a cross-sectional view showing the configuration of an upper stage in a third modified example of the embodiment. [Figure 18] FIG. 10 is a cross-sectional view showing a bonding process in a third modified example of the embodiment. [Figure 19] FIG. 10 is a cross-sectional view showing a bonding process in a third modified example of the embodiment. [Figure 20] FIG. 10 is a cross-sectional view showing a bonding process in a third modified example of the embodiment. [Figure 21] FIG. 10 is a cross-sectional view showing a bonding process in a third modified example of the embodiment. [Figure 22] FIG. 10 is a cross-sectional view showing the configuration of an upper stage in a fourth modified example of the embodiment. [Figure 23] FIG. 10 is a cross-sectional view showing a bonding process in a fourth modified example of the embodiment. [Figure 24] FIG. 10 is a cross-sectional view showing a bonding process in a fourth modified example of the embodiment. [Figure 25] FIG. 10 is a cross-sectional view showing a bonding process in a fourth modified example of the embodiment. [Figure 26] FIG. 10 is a cross-sectional view showing a bonding process in a fourth modified example of the embodiment. [Figure 27] FIG. 10 is a cross-sectional view showing a bonding process in a fourth modified example of the embodiment. [Figure 28] FIG. 10 is a cross-sectional view showing a bonding process in a fourth modified example of the embodiment. [Figure 29] FIG. 13 is a plan view showing the configuration of a lower stage in a fifth modified example of the embodiment. [Figure 30] FIG. 13 is a cross-sectional view showing the configuration of a lower stage in a fifth modified example of the embodiment. [Figure 31] FIG. 13 is a plan view showing the configuration of a lower stage in a sixth modified example of the embodiment. [Figure 32] FIG. 13 is a cross-sectional view showing the configuration of a lower stage in a sixth modified example of the embodiment. [Figure 33] FIG. 13 is a plan view showing the configuration of a lower stage in a seventh modified example of the embodiment. [Figure 34] FIG. 13 is a cross-sectional view showing the configuration of a lower stage in a seventh modified example of the embodiment. [Figure 35] FIG. 13 is a plan view showing the configuration of a lower stage in an eighth modified example of the embodiment. [Figure 36] FIG. 13 is a cross-sectional view showing the configuration of a lower stage in an eighth modified example of the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of a method for producing a bonded body according to the present disclosure will be described with reference to the drawings.

[0010] (Embodiment) In the manufacturing method of the bonded body according to the embodiment, two bonding members are bonded together via an adhesive layer to form a bonded body, and the method is devised to make it easier to remove air bubbles that have become mixed into the adhesive layer in subsequent processing.

[0011] The laminated body can be produced generally as shown in Figure 1. Figure 1 is a flow chart showing an outline of the method for producing the laminated body.

[0012] The bonding members BM1 and BM2 are placed in a reduced pressure atmosphere, and a bonding process (S1) is performed in which the bonding members BM1 and BM2 are bonded together via an adhesive layer AD, forming a bonded body BB. The reduced pressure atmosphere is also called a vacuum atmosphere. The bonding process performed in a reduced pressure atmosphere is also called a vacuum bonding process. The bonding members BM1, BM2, and adhesive layer AD may have substantially the same planar shape and planar size.

[0013] The bonded body BB is any device formed by bonding. The bonded body BB may be a display device such as a display. The bonded member BM1 is a member to be a part of the bonded body BB. When the bonded body BB is a display device, the bonded member BM1 may be translucent and may be formed of glass, quartz, transparent resin, etc. Similarly, the bonded member BM2 is a member to be another part of the bonded body BB. When the bonded body BB is a display device, the bonded member BM2 may be translucent and may be formed of glass, quartz, transparent resin, etc. The adhesive layer AD has adhesiveness and bonds the bonded members BM1 and BM2. When the bonded body BB is a display device, the adhesive layer AD may be translucent and includes a transparent adhesive sheet such as OCA (Optically Clear Adhesive).

[0014] During the lamination process, air bubbles may become trapped in the adhesive layer AD. If these air bubbles are sealed within the adhesive layer AD, they can be eliminated from the adhesive layer AD by the subsequent autoclave treatment.

[0015] Taking this into consideration, during the bonding process, a distributed load is applied to the back surface of the bonding member BM1, and a concentrated load is applied to at least four points on the back surface of the bonding member BM2. The distributed load may be uniform or somewhat uneven. The surfaces of the bonding members BM1 and BM2 are bonded together via the adhesive layer AD to form a bonded body BB. This utilizes the limited force required for bonding, increasing the shear force acting on the bonding members BM1 and BM2, and increasing the shear force at the periphery of the bonding members BM1 and BM2, thereby efficiently sealing in any air bubbles within the adhesive layer AD. This is expected to eliminate any air bubbles from the adhesive layer AD during subsequent autoclave treatment.

[0016] The bonded body BB is then subjected to autoclave treatment (S2). In autoclave treatment, the bonded body BB is placed in a high-temperature, high-pressure environment. At this time, the air bubbles sealed in the adhesive layer AD are formed in a reduced-pressure atmosphere, and the pressure is lower than the environmental pressure. This allows the air bubbles to dissolve into the adhesive layer AD, thereby eliminating the air bubbles in the adhesive layer AD.

[0017] The bonding process (S1) may be performed by a bonding apparatus 1 as shown in Fig. 2. Fig. 2 is a diagram showing a schematic configuration of the bonding apparatus 1. In the following, the direction perpendicular to the surface of the bonded member BM1 during the bonding process is defined as the Z direction, and two directions perpendicular to the Z direction in a plane perpendicular to the Z direction are defined as the X direction and the Y direction.

[0018] The bonding apparatus 1 includes a stage 10, a stage 20, an exhaust system 40, a drive unit 50, and a controller .

[0019] The controller 70 controls each part of the bonding apparatus 1 in an integrated manner.

[0020] The stage 10 and the stage 20 face each other in the Z direction when the bonding members BM1 and BM2 are bonded. Hereinafter, for convenience, the stage arranged on the +Z side when the bonding members BM1 and BM2 are bonded will be referred to as the upper stage 10, and the stage arranged on the -Z side will be referred to as the lower stage 10. The upper stage 10 and the lower stage 20 are disposed in a processing chamber CH.

[0021] The processing chamber CH is a space surrounded by a vacuum vessel 30. The vacuum vessel 30 has a sealing member 33 extending in a tubular (e.g., cylindrical) shape, the +Z end of which is closed by an upper chamber section 31, and the -Z end is closed by a lower chamber section 32. An upper stage 10 can be fixed to the upper chamber section 31. A recess 32a is arranged on the +Z side surface of the lower chamber section 32. The recess 32a can accommodate the lower stage 20. A hole 32d is provided in the lower chamber section 32, which connects the processing chamber CH to an exhaust system 40.

[0022] The exhaust system 40 is configured to be able to communicate with the interior of the processing chamber CH. The exhaust system 40 includes an exhaust pipe 41, a gate valve 42, an exhaust pipe 43, and an exhaust device 44. The exhaust pipe 41 is connected to the interior of the processing chamber CH via the hole 32d. The gate valve 42 is controlled to open and close by the controller 70. When the gate valve 42 is open, it connects the exhaust pipe 41 and the exhaust pipe 43, and when it is closed, it blocks the exhaust pipe 41 from the exhaust pipe 43. The operation of the exhaust device 44 is controlled by the controller 70. Under the control of the controller 70, the exhaust device 44 can evacuate the processing chamber CH via the exhaust pipe 41 and the exhaust pipe 43 when the gate valve 42 is open.

[0023] The drive unit 50 can move the upper stage 10 and the lower stage 20 relatively in the X, Y, and Z directions. The upper stage 10 and the lower stage 20 can be moved relatively in the X, Y, and Z directions by driving the lower stage 20 in the X, Y, and Z directions. The bonding apparatus 1 can have multiple drive units 50. Although two drive units 50_1 and 50_2 are illustrated in FIG. 2, the number of drive units 50 may be three or more. The drive unit 50 has an actuator 51 and a shaft 52. The actuator 51 can generate drive forces in the X, Y, and Z directions. The shaft 52 transmits the drive forces in the X, Y, and Z directions generated by the actuator 51 to the lower stage 20. This allows the lower stage 20 to be driven in the X, Y, and Z directions.

[0024] The bonding member BM1 is placed on the upper stage 10. The upper stage 10 can come into contact with the back surface of the bonding member BM1.

[0025] The upper stage 10 has a stage base 11 and an elastic body 12. The stage base 11 may have a shape corresponding to the bonding material BM1. When the bonding material BM1 has a substantially plate shape, the stage base 11 may have a substantially plate shape extending in the XY direction as shown in FIG. 3(a), or may have a substantially rectangular shape in the XY plane view. FIG. 3 is a perspective view showing the configuration of the upper stage 10 and the lower stage 20. FIG. 4 is a plan view showing the configuration of the upper stage 10 and the lower stage 20.

[0026] The upper stage 10 may further include a chucking mechanism using a predetermined chucking method such as vacuum chucking, electrostatic chucking, etc. The upper stage 10 may be capable of chucking the back surface of the bonding member BM1.

[0027] As shown in Figures 5(a) and 5(b), the stage base 11 has a main surface 11a on the -Z side and a main surface 11b on the +Z side. Figure 5 is a cross-sectional view showing the configuration of the upper stage. Figure 5(a) shows a YZ cross section when Figure 4(a) is cut along line AA. Figure 5(b) shows an XZ cross section when Figure 4(a) is cut along line BB.

[0028] The elastic body 12 covers the main surface 11a of the stage base 11. The elastic body 12 may be a substantially plate-like body extending in the XY directions, or may have a substantially rectangular shape in the XY plane view as shown in FIG. 4(a). The elastic body 12 can come into contact with the back surface of the bonding member BM1. The front surface 12a of the elastic body 12 is substantially flat in the XY directions. This allows the elastic body 12 to come into contact with the entire back surface of the bonding member BM1.

[0029] The elastic body 12 has greater elasticity than the stage base 11. The elastic body 12 can be formed of a material having greater elasticity than the stage base 11.

[0030] In this specification, high elasticity refers to a large amount of reversible deformation in the direction of stress acting on a unit area within the elastic limit.

[0031] The elastic body 12 may be formed of a material having a smaller Young's modulus than the material of the stage base 11. The elastic body 12 may be formed of sponge, rubber, or the like. The sponge may include a synthetic resin sponge or a rubber sponge. The synthetic resin sponge may include a polyurethane sponge or a polyethylene sponge. The polyurethane sponge may be Sofras (registered trademark). The rubber may include at least one of natural rubber, silicone rubber, fluororubber, and urethane rubber.

[0032] The bonding material BM2 is placed on the lower stage 20 shown in Fig. 2. The lower stage 20 can come into contact with at least four points on the back surface of the bonding material BM2.

[0033] The lower stage 20 has a stage base 21 and a convex structure 22. The stage base 21 may have a shape corresponding to the bonding material BM2. When the bonding material BM2 has a substantially plate shape, the stage base 21 may have a substantially rectangular parallelepiped shape as shown in Fig. 3(b) or may have a substantially rectangular shape in the XY plane view as shown in Fig. 4(a).

[0034] As shown in FIGS. 6(a) to 6(c), the stage base 21 has a main surface 21a on the +Z side and a main surface 21b on the -Z side. FIG. 6 is a cross-sectional view showing the configuration of the lower stage 20. FIG. 6(a) shows a YZ cross section obtained by cutting FIG. 4(b) along line CC. FIG. 6(b) shows an XZ cross section obtained by cutting FIG. 4(b) along line DD. FIG. 6(c) shows an XZ cross section obtained by cutting FIG. 4(b) along line EE. The main surface 21a includes an inner region 21a1 and an outer peripheral region 21a2. The outer peripheral region 21a2 is disposed outside the inner region 21a1 in an XY plane view. The outer peripheral region 21a2 extends in a rectangular ring shape outside the inner region 21a1 in an XY plane view and surrounds the inner region 21a1. The combined area of ​​the inner region 21a1 and the outer peripheral region 21a2 corresponds to the bonding member BM2.

[0035] The convex structure 22 is arranged on the +Z side surface of the stage base 21. The convex structure 22 can contact at least four points on the back surface of the bonding member BM2. The convex structure 22 may be capable of point contact with each of the at least four points. The convex structure 22 includes at least four convex portions 221. The at least four convex portions 221 are arranged on the main surface 21a. The at least four convex portions 221 are not on the same line on the main surface 21a and are in a positional relationship that allows a plane to be mathematically defined. The at least four convex portions 221 may be arranged at positions on the main surface 21a where the spacing between them is greater than a threshold value.

[0036] 4(b), four protrusions 221_1 to 221_4 are illustrated. The four protrusions 221_1 to 221_4 are arranged on the main surface 21a. The four protrusions 221_1 to 221_4 may be arranged in the outer circumferential region 21a2 of the main surface 21a. The four protrusions 221_1 to 221_4 may be arranged at positions in the outer circumferential region 21a2 where the intervals between them are greater than a threshold. When the stage base 21 is substantially rectangular in the XY plane view, the threshold may be determined in advance in accordance with the length of the short side of the stage base 21, or may be a value obtained by subtracting the dimension of the protrusion 221 from the length of the short side of the stage base 21. The four protrusions 221_1 to 221_4 may be arranged near corners in the outer circumferential region 21a2.

[0037] As shown in Fig. 2, each of the protrusions 221 has an island shape in the XY plane view. Each of the protrusions 221 may have a circular shape in the XY plane view, or a polygonal shape in the XY plane view. As shown in Fig. 6(c), each of the protrusions 221 protrudes from the main surface 21a toward the upper stage 10. Each of the protrusions 221 may protrude toward the +Z side in a spherical or aspherical shape, or may protrude toward the +Z side in a conical or pyramidal shape.

[0038] Each protrusion 221 may have a Z height H1 as shown in FIG. 7(a). The Z height H1 can be experimentally determined in advance as a height at which the back surface of the bonding member BM2 does not come into contact with the main surface 21a when the bonding member BM2 is curved toward the -Z side due to its own weight. FIG. 7 is a cross-sectional view showing the height of the protrusion 221 on the lower stage 20. Alternatively, each protrusion 221 may have a Z height H2 as shown in FIG. 7(b). The Z height H2 can be experimentally determined in advance as a height at which the back surface of the bonding member BM2 does not come into contact with the main surface 21a when the bonding member BM2 is curved toward the -Z side due to the application of force from the upper stage 10 while the bonding member BM1 is bonded to the bonding member BM2 via the adhesive layer AD.

[0039] Next, the details of the manufacturing method of the bonded body BB will be described with reference to Fig. 1 and Figs. 8 to 12. Fig. 8 is a flowchart showing the bonding process. Figs. 9(a) to 9(c), 10(a), 10(b), and 12(a) to 12(c) are cross-sectional views showing the bonding process. Fig. 11 is an enlarged cross-sectional view showing the bonding process, showing an enlarged cross-section of part L in Fig. 10(b).

[0040] In S1 shown in FIG. 1, S11 to S15 shown in FIG. 8 may be performed.

[0041] In S11, the bonding members BM1 and BM2 are respectively carried in and placed on the upper stage 10 and the lower stage 20 of the bonding apparatus 1. In the bonding apparatus 1, the vacuum container 30 is opened (for example, the sealing member 33 is moved in the +Z direction from the lower stage portion 32), the processing chamber CH is opened to the atmosphere, and the upper stage 10 and the lower stage 20 are exposed.

[0042] The bonding material BM1 is carried in the vicinity of the elastic body 12 of the upper stage 10 by a conveying system (not shown) or the like, and as shown in Fig. 9(a), the bonding material BM1 is placed on the surface 12a of the elastic body 12. If the upper stage 10 has a suction mechanism, the controller 70 may control the upper stage 10 to cause the bonding material BM1 to be adsorbed onto the surface 12a of the elastic body 12.

[0043] The bonding material BM2 is carried in the vicinity of the convex structure 22 of the lower stage 20 by a conveying system or the like, and is placed on each convex portion 221 of the convex structure 22 as shown in FIG. 9(b). An adhesive layer AD may be disposed on the +Z side surface of the bonding material BM2. The adhesive layer AD may be a transparent adhesive sheet such as OCA. The bonding material BM2 and the adhesive layer AD may have substantially the same planar shape and planar size.

[0044] In S12, the controller 70 positions the upper stage 10 and the lower stage 20 opposite each other in the Z direction and aligns the XY position of the upper stage 10 with the XY position of the lower stage 20. The vacuum vessel 30 is closed (for example, moved in the -Z direction until the seal member 33 contacts the lower stage 32) to seal the processing chamber CH. The controller 70 controls the exhaust system 40 to reduce the pressure in the processing chamber CH. The controller 70 uses an imaging device (not shown) to capture an image of the reference mark MK1 of the bonded member BM1 to determine its XY position, and also uses the imaging device to capture an image of the reference mark MK2 of the bonded member BM2 to determine its XY position. The controller 70 calculates the difference between the XY position of the reference mark MK1 and the XY position of the reference mark MK2 to determine the XY error. The controller 70 calculates a drive amount ΔPxy in the XY direction in accordance with the XY error and supplies it to the driver 50. The driver 50 moves the upper stage 10 and the lower stage 20 relatively in the X and Y directions in accordance with the drive amount ΔPxy. The driver 50 may move the upper stage 10 and the lower stage 20 relatively in the X and Y directions by driving the lower stage 20 in the X and Y directions in accordance with the drive amount ΔPxy. As a result, the X and Y positions of the upper stage 10 and the lower stage 20 are aligned, as shown in FIG. 9(c).

[0045] In S13, the controller 70 moves the upper stage 10 and the lower stage 20 closer to each other in the Z direction, bonding the surfaces of the bonded members BM1 and BM2 together via the adhesive layer AD. The bonded members BM1, BM2, and the adhesive layer AD may have substantially equal planar shapes and sizes. The controller 70 captures an image of the reference mark MK11 of the bonded member BM1 using an imaging device to determine its Z position, and also captures an image of the reference mark MK12 of the bonded member BM2 using an imaging device to determine its Z position. The controller 70 calculates the difference between the Z positions of the reference mark MK11 and the reference mark MK12 to determine the Z error. The controller 70 calculates a drive amount ΔPz in the Z direction based on the Z error and supplies it to the driver 50. The driver 50 moves the upper stage 10 and the lower stage 20 closer to each other in the Z direction based on the drive amount ΔPz. The driving unit 50 may raise the lower stage 20 in the Z direction according to the driving amount ΔPz, thereby bringing the upper stage 10 and the lower stage 20 relatively closer to each other in the Z direction. As a result, as shown in FIG. 10(a), a bonded body BB is formed in which the bonded members BM1 and BM are bonded together via the adhesive layer AD. At this time, air bubbles GB1 and GB2 may be mixed into the adhesive layer AD. Some of the air bubbles GB2 may be mixed into the adhesive layer AD without being sealed. The air bubbles GB1 and GB2 may be located near the interface with the bonded member BM1 in the adhesive layer AD.

[0046] In S14, the bonding apparatus 1 presses the bonded body BB in the Z direction from the upper stage 10 and the lower stage 20. The controller 70 calculates a drive amount ΔPf for pressurization and supplies it to the drive unit 50. The drive unit 50 relatively presses the upper stage 10 and the lower stage 20 in the Z direction according to the drive amount ΔPf. The drive unit 50 may relatively pressurize the upper stage 10 and the lower stage 20 in the Z direction by pressurizing the lower stage 20 in the +Z direction according to the drive amount ΔPf. This allows the air bubbles GB1 and GB3 to be sealed in the adhesive layer AD, as shown in FIGS. 10(b) and 11.

[0047] That is, as shown by the dotted arrows in Figure 11, a distributed load in the -Z direction, uniformly distributed in the XY direction, is applied to the back surface of the bonding member BM1, and a concentrated load in the +Z direction is applied to at least four points in the peripheral region of the back surface of the bonding member BM2. The distributed load and concentrated load act on the bonded body BB from opposite directions, generating a shear force that bends the entire bonded body BB concavely toward the -Z side. By arranging the protrusion 221 on the periphery of the bonded body BB as shown in Figure 11, the shear force acting on the entire bonded body BB, particularly the shear force acting on the periphery of the bonded body BB, can be increased. This allows the sealed air bubble GB1 (see Figure 10(a)) in the adhesive layer AD to remain sealed, and the unsealed air bubble GB2 can be converted into a sealed air bubble GB3. That is, the air bubbles GB1 and GB3 can be sealed within the adhesive layer AD.

[0048] In S15, the bonded body BB is carried out from the bonding apparatus 1.

[0049] When the upper stage 10 has a suction mechanism, the controller 70 controls the upper stage 10 to release the suction of the bonding material BM1 to the surface 12a of the elastic body 12. The controller 70 calculates a driving amount ΔPr in the Z direction for moving the upper stage 10 and the lower stage 20 away from each other in the Z direction to move them away from the Z position, and supplies the calculated driving amount ΔPr to the driving unit 50. The driving unit 50 moves the upper stage 10 and the lower stage 20 away from each other in the Z direction according to the driving amount ΔPr. The driving unit 50 may move the upper stage 10 and the lower stage 20 away from each other in the Z direction by lowering the lower stage 20 in the Z direction to the bottom surface of the recess 32a according to the driving amount ΔPr.

[0050] 12(a), the upper stage 10 and the lower stage 20 return to the Z position S12, and the bonded body BB is placed on the lower stage 20. The vacuum container 30 is opened (for example, the sealing member 33 is moved in the +Z direction from the lower stage part 32), the processing chamber CH is opened to the atmosphere, and the upper stage 10 and the lower stage 20 are exposed.

[0051] The bonded body BB arranged on the lower stage 20 is carried out from the bonding apparatus 1 by a conveying system (not shown) or the like.

[0052] In S2 shown in FIG. 1, the bonded body BB is autoclaved. The bonded body BB is transported into an autoclave (not shown) by a transport system or the like. The autoclave provides a high-temperature, high-pressure environment to the bonded body BB, as indicated by the dotted arrow in FIG. 12(b). The autoclave may also provide a high-temperature, high-pressure environment to the bonded body BB by supplying high-pressure air around the bonded body BB and heating the bonded body BB with a heater (not shown). The air bubbles GB are formed in a reduced-pressure atmosphere, and their pressure is lower than the ambient pressure. This pressure difference (low pressure inside the air bubbles GB, high pressure outside the bonded body BB) crushes the air bubbles GB, reducing their surface area. Furthermore, the trace amounts of residual gas (gas density nearly zero) in the air bubbles GB easily dissolve into the adhesive layer AD, which has increased absorbency at high temperatures, eliminating the air bubbles GB. This eliminates the air bubbles in the adhesive layer AD, as shown in FIG. 12(c).

[0053] As described above, in this embodiment, in the bonding process, a distributed load is applied to the back surface of the bonded member BM1, and a concentrated load is applied to at least four points on the back surface of the bonded member BM2. The surfaces of the bonded members BM1 and BM2 are bonded together via the adhesive layer AD to form a bonded body BB. This utilizes the limited force required for bonding, increasing the shear force acting on the bonded members BM1 and BM2, increasing the shear force at the periphery of the bonded members BM1 and BM2, and efficiently sealing air bubbles within the adhesive layer AD. As a result, air bubbles can be eliminated from the adhesive layer AD by subsequent autoclaving. Therefore, the adhesion between the bonded members BM1 and BM2 in the bonded body BB can be increased, reducing the defective rate of the bonded body BB in the manufacturing process and improving yield. Furthermore, if the bonded body BB is a display device, the display quality of the bonded body BB can be improved.

[0054] The bonding apparatus 1 may have a configuration in which the upper stage 10 and the lower stage 20 are interchanged. In this case, during the bonding process, a concentrated load is applied to at least four points on the back surface of the bonded member BM1, and a distributed load is applied to the back surface of the bonded member BM2. The surfaces of the bonded members BM1 and BM2 are bonded together via the adhesive layer AD to form a bonded body BB. This also makes it possible to utilize the limited force required for bonding, increase the shear force acting on the bonded members BM1 and BM2, increase the shear force at the outer periphery of the bonded members BM1 and BM2, and efficiently seal air bubbles within the adhesive layer AD.

[0055] Alternatively, as a first modified example of the embodiment, as shown in FIG. 13, in a bonding apparatus 1i, the planar size of the upper stage 10 and the lower stage 20i may be larger than the planar size of the bonding members BM1 and BM2. FIG. 13 is a plan view showing the configuration of the upper stage 10 and the lower stage 20i in the first modified example of the embodiment. In the bonding apparatus 1i, the upper stage 10 is similar to the upper stage 10 (see FIG. 4(a)) of the embodiment, except that, as shown in FIG. 13(a), its planar size is larger than the planar size of the bonding member BM1. As shown in FIGS. 13(b) and 14, the configuration of the lower stage 20i differs from that of the embodiment.

[0056] Figure 14 is a cross-sectional view showing the configuration of the lower stage 20i. Figure 14(a) shows a YZ cross section when Figure 13(b) is cut along line FF. Figure 14(b) shows an XZ cross section when Figure 13(b) is cut along line GG. Figure 14(c) shows an XZ cross section when Figure 13(b) is cut along line HH.

[0057] The main surface 21a includes an inner region 21a11, a middle region 21a12, and an outer region 21a13. The middle region 21a12 is disposed outside the inner region 21a11 and inside the outer region 21a13 in an XY plane view. The outer region 21a13 is disposed outside the inner region 21a11 and the middle region 21a12 in an XY plane view. The middle region 21a12 extends in a rectangular annular shape outside the inner region 21a11 and surrounds the inner region 21a11 in an XY plane view. The outer region 21a2 extends in a rectangular annular shape outside the inner region 21a11 and the middle region 21a12 in an XY plane view and surrounds the inner region 21a11 and the middle region 21a12. The combined region of the inner region 21a1 and the middle region 21a12 corresponds to the bonding member BM12.

[0058] The lower stage 20i has a convex structure 22i instead of the convex structure 22 (see FIG. 4(b)). The convex structure 22i is arranged in the intermediate region 21a12 of the main surface 21a. The convex structure 22i can contact at least four points on the rear surface of the bonding member BM12. The convex structure 22i includes at least four convex portions 221i. The at least four convex portions 221i are arranged in the intermediate region 21a12 of the main surface 21a.

[0059] 13(b), four protrusions 221i_1 to 221i_4 are illustrated. The four protrusions 221i_1 to 221i_4 are arranged in the intermediate region 21a12 on the main surface 21a of the stage base 21, as shown by the dotted line in FIG. 13(b). The four protrusions 221i_1 to 221i_4 may be arranged at positions on the main surface 21a where the intervals between them are greater than a threshold value. When the bonding member BM12 has a substantially rectangular shape in the XY plane view, the threshold value may be determined in advance in accordance with the length of the short side of the bonding member BM12, or may be a value obtained by subtracting the dimension of the protrusion 221i from the length of the short side of the bonding member BM12. The four protrusions 221i_1 to 221i_4 may be arranged near corners in the intermediate region 21a12 on the main surface 21a.

[0060] 14(c), each of the protrusions 221i protrudes from the main surface 21a toward the upper stage 10. Each of the protrusions 221i may protrude toward the +Z side in a spherical or aspherical shape, or may protrude toward the +Z side in a conical or pyramidal shape.

[0061] In such a bonding apparatus 1i, a distributed load can be applied to the rear surface of the bonding member BM11, and a concentrated load can be applied to at least four points on the rear surface of the bonding member BM12.

[0062] Alternatively, as a second modified example of the embodiment, as shown in FIGS. 15 and 16, in a bonding apparatus 1j, a lower stage 20j may be capable of contacting more than four points on the rear surface of the bonded member BM2. FIG. 15 is a plan view showing the configuration of the lower stage 20j in the second modified example of the embodiment. FIG. 16 is a cross-sectional view showing the configuration of the lower stage 20j in the second modified example of the embodiment. FIG. 16(a) shows a YZ cross section when FIG. 15 is cut along line II. FIG. 16(b) shows an XZ cross section when FIG. 15 is cut along line JJ. FIG. 16(c) shows an XZ cross section when FIG. 15 is cut along line KK.

[0063] The lower stage 20j has a convex structure 22j instead of the convex structure 22 (see FIG. 4(b)). The convex structure 22j includes more than four convex portions 221j. The more than four convex portions 221j may be arranged at positions on the main surface 21a where the intervals between them are greater than a threshold value.

[0064] 15 illustrates eight protrusions 221j_1 to 221j_8. The eight protrusions 221j_1 to 221j_8 may be arranged in the outer circumferential region 21a2. The eight protrusions 221j_1 to 221j_8 may be arranged at positions in the outer circumferential region 21a2 where the intervals between them are greater than a threshold. When the stage base 21 is substantially rectangular in the XY plane view, the threshold may be determined in advance to correspond to half the length of a side of the stage base 21. The eight protrusions 221j_1 to 221j_8 may be arranged near corners or midpoints of sides in the outer circumferential region 21a2.

[0065] 15 and 16(a) to 16(c), each of the convex portions 221j protrudes from the main surface 21a toward the upper stage 10. Each of the convex portions 221j may protrude toward the +Z side in a spherical or aspherical shape, or may protrude toward the +Z side in a conical or pyramidal shape.

[0066] In such a bonding apparatus 1j, a distributed load can be applied to the rear surface of the bonding member BM1, and a concentrated load can be applied to each of more than four points on the rear surface of the bonding member BM2.

[0067] Alternatively, as a third modified example of the embodiment, in a bonding apparatus 1k, an upper stage 10k may be configured so that the contact area can be gradually increased from the center to the periphery, as shown in Fig. 17. Fig. 17 is a cross-sectional view showing the configuration of the upper stage 10k in the third modified example of the embodiment.

[0068] The bonding apparatus 1k has an upper stage 10k instead of the upper stage 10 (see FIGS. 5(a) and 5(b)), and further has a pressurizing / depressurizing mechanism 60k shown in FIG. 17. The upper stage 10k has a stage base 11k and an elastic body 12k shown in FIG. 17 instead of the stage base 11 and the elastic body 12 (see FIG. 2).

[0069] The stage base 11k may be substantially plate-shaped extending in the XY directions, as in the embodiment, but differs from the embodiment in having a recess 11k1, a vent 11k2, and a wall 11k3. The recess 11k1 is recessed toward the +Z side over almost the entire surface of the -Z side of the stage base 11k. The wall 11k3 protrudes toward the -Z side from the bottom surface of the recess 11k1 along the entire periphery of the -Z side edge of the stage base 11k. The vent 11k2 extends at least in the Z direction from near the center of the XY direction on the bottom surface of the recess 11k1 and penetrates to the +Z side surface 11b of the stage base 11k. The vent 11k2 may extend partially in the XY direction.

[0070] The elastic body 12k includes a diaphragm 12k1. The diaphragm 12k1 is connected to the wall portion 11k3 and completely covers the recessed portion 11k1 from the -Z side. The diaphragm 12k1, together with the recessed portion 11k1 and the wall portion 11k3, forms a space SP that can be pressurized and depressurized. The diaphragm 12k1 has a main portion 12k1a and an edge portion 12k1b. The main portion 12k1a extends generally flat in the X and Y directions. The edge portion 12k1b extends in the Z direction from the outer end of the main portion 12k1a in the X and Y directions and is connected to the wall portion 11k3. The diaphragm 12k1 may be formed of a material, such as rubber, that has a lower elastic modulus than the stage base 11k. The rubber may include at least one of natural rubber, silicone rubber, fluororubber, and urethane rubber.

[0071] The pressurizing / depressurizing mechanism 60k is configured to be able to communicate with the space SP. The pressurizing / depressurizing mechanism 60k has a gas supply source 61, an air supply pipe 62, an on-off valve 63, an exhaust device 64, an exhaust pipe 65, an on-off valve 66, and a common pipe 67. The common pipe 67 is connected to the space SP via an air vent 11k2. The on-off valves 63 and 66 are each controlled to open and close by a controller 70. The on-off valve 63 connects the gas supply source 61 to the space SP when open, and isolates the gas supply source 61 from the space SP when closed. The on-off valve 66 connects the exhaust device 64 to the space SP when open, and isolates the exhaust device 64 from the space SP when closed. The operation of the exhaust device 64 is controlled by the controller 70.

[0072] Under the control of the controller 70, the gas supply source 61 can supply pressurized gas (e.g., pressurized air) to the space SP via the air supply pipe 62 and the common pipe 67 while the on-off valve 62 is open. This allows the space SP to be in a pressurized state.

[0073] Under the control of the controller 70, the exhaust device 64 can exhaust the space SP via the common pipe 67 and the exhaust pipe 65 while the on-off valve 66 is open. This allows the space SP to be put into a reduced pressure state.

[0074] In addition, in S12 to S15 shown in Fig. 8, the processes shown in Fig. 18(a) to Fig. 21 may be performed instead of the processes shown in Fig. 10(a) to Fig. 12(a). Fig. 18(a), Fig. 18(b), Fig. 19(a), Fig. 19(b), Fig. 20(a), and Fig. 20(b) are cross-sectional views showing the bonding process. Fig. 21 is an enlarged cross-sectional view showing the bonding process, showing an enlarged cross-section of part N in Fig. 20(a).

[0075] In S12, with no gas (e.g., pressurized air) flowing into the elastic body 12k (diaphragm 12k1) of the upper stage 10k and the elastic body 12k adsorbing the back surface of the bonded member BM1, the controller 70 positions the upper stage 10k and the lower stage 20 opposite each other in the Z direction and aligns the XY position of the upper stage 10k with the XY position of the lower stage 20. The vacuum vessel 30 is closed (for example, moved in the -Z direction until the seal member 33 contacts the lower stage portion 32) to seal the processing chamber CH. The controller 70 controls the exhaust system 40 to depressurize the processing chamber CH. The controller 70 images the reference mark MK1 of the bonded member BM1 with an imaging device (not shown) to determine its XY position, and images the reference mark MK2 of the bonded member BM2 with the imaging device to determine its XY position. The controller 70 calculates the difference between the XY positions of the reference mark MK1 and the XY positions of the reference mark MK2 to determine the XY error. The controller 70 calculates a drive amount ΔPxy in the X and Y directions in accordance with the X and Y errors and supplies the calculated drive amount to the driver 50. The driver 50 moves the upper stage 10 and the lower stage 20 relatively in the X and Y directions in accordance with the drive amount ΔPxy. The driver 50 may move the upper stage 10k and the lower stage 20 relatively in the X and Y directions by driving the lower stage 20 in the X and Y directions in accordance with the drive amount ΔPxy. This aligns the X and Y positions of the upper stage 10k and the lower stage 20, as shown in FIG. 18(a).

[0076] 18(b), the controller 70 moves the upper stage 10k and the lower stage 20 relatively closer to each other in the Z direction to a Z distance d. The Z distance d can be determined experimentally in advance, taking into account an increase in the Z thickness of the elastic body 12k due to the inflow of gas.

[0077] In S14, the bonding apparatus 1 pressurizes the bonded body BB in the Z direction from the upper stage 10k and the lower stage 20. The controller 70 controls the pressurization / depressurization mechanism 60k to start the inflow of gas (e.g., pressurized air) into the space SP of the upper stage 10k. As a result, as shown in FIG. 19(a), the elastic body 12k (diaphragm 12k1) of the upper stage 10k starts to expand from the center in the XY direction, and its surface starts to curve downward convexly. The bonding material BM1 is also attracted by the elastic body 12k and similarly starts to curve downward convexly. In this state, the controller 70 calculates a drive amount ΔPf for pressurization and supplies it to the driver 50. The driver 50 relatively pressurizes the upper stage 10k and the lower stage 20 in the Z direction according to the drive amount ΔPf. The driving unit 50 may pressurize the lower stage 20 in the +Z direction according to the driving amount ΔPf, thereby relatively pressurizing the upper stage 10k and the lower stage 20 in the Z direction, as shown in FIG. 19(a).

[0078] In response to this, the elastic body 12k selectively contacts the vicinity of the center on the back surface of the bonded member BM1 and applies a concentrated load in the Z direction to the vicinity of the center. The convex structure 22 of the lower stage 20 contacts at least four points on the outer circumferential region on the back surface of the bonded member BM2 and applies a concentrated load in the Z direction to at least four points. As a result, the surface of the bonded member BM1 contacts the surface of the bonded member BM2 via the adhesive layer AD, and bonding of the bonded members BM1 and BM via the adhesive layer AD begins near the center in the XY direction. At this time, as shown in Figure 19(a), air bubbles GB4 may be mixed in the adhesive layer AD near the center.

[0079] The controller 70 controls the pressurizing / depressurizing mechanism 60k to continue the inflow of gas into the space SP of the upper stage 10k. As a result, as shown in FIG. 19(b), the expansion of the elastic body 12k (diaphragm 12k1) of the upper stage 10k progresses toward the outer periphery in the XY directions. The bonding material BM1 is also adsorbed by the elastic body 12k, so it similarly deforms toward the outer periphery in the XY directions, becoming flatter and less curved. That is, the surface of the elastic body 12k of the upper stage 10k gradually transitions from a downwardly convex curve to a generally flat state. Accordingly, the contact area of ​​the elastic body 12k with the back surface of the bonding material BM1 gradually increases from the center to the outer periphery. At the same time, the controller 70 calculates a drive amount ΔPf for additional pressure application and supplies it to the driver 50. The driver 50 additionally applies pressure to the upper stage 10k and the lower stage 20 relative to each other in the Z direction according to the drive amount ΔPf. The driving unit 50 may additionally pressurize the lower stage 20 in the +Z direction according to the driving amount ΔPf, thereby relatively additionally pressurizing the upper stage 10k and the lower stage 20 in the Z direction. As a result, the pressurized area on the back surface of the bonding member BM1 gradually expands from the center to the periphery, so that the central air bubble GB4 in the adhesive layer AD can be moved slightly toward the periphery as shown in FIG. 19(b).

[0080] The controller 70 controls the pressurization / decompression mechanism 60k to continue the inflow of gas into the space SP of the upper stage 10k. As a result, as shown in FIG. 20(a), the elastic body 12k (diaphragm 12k1) of the upper stage 10k expands approximately uniformly from the center in the XY directions to the periphery in the XY directions. Accordingly, the pressurized area on the back surface of the bonded member BM1 expands to almost the entire surface, and as shown in FIG. 20(a), a bonded body BB is formed in which the bonded member BM1 and the bonded member BM are bonded together via the adhesive layer AD. In this state, the controller 70 applies a distributed load in the Z direction, which is uniformly distributed in the XY directions, from the upper stage 10k to the back surface of the bonded member BM1, as shown by the dotted arrows in FIG. 21, and applies a concentrated load in the Z direction to at least four points in the periphery of the back surface of the bonded member BM2 from the lower stage 20. As a result, in each of the bonding members BM1 and BM2, the shear force in the outer periphery region becomes greater than the shear force in the inner region, and the air bubbles GB4 guided to the outer periphery side in the adhesive layer AD can be sealed on the outer periphery side.

[0081] The controller 70 maintains the pressure on the bonded materials BM1, BM2 from the upper stage 10k and the lower stage 20 for a predetermined time. At this time, the controller 70 calculates a driving amount ΔPf for additional pressure and supplies it to the driving unit 50. The driving unit 50 additionally pressurizes the upper stage 10k and the lower stage 20 relatively in the Z direction according to the driving amount ΔPf. The driving unit 50 may additionally pressurize the upper stage 10k and the lower stage 20 relatively in the Z direction by additionally pressurizing the lower stage 20 in the +Z direction according to the driving amount ΔPf. This allows the air bubbles GB4 to be reliably sealed on the outer periphery side of the adhesive layer AD.

[0082] In S15, the bonded body BB is carried out from the bonding apparatus 1.

[0083] The controller 70 controls the pressurization / decompression mechanism 60k to remove gas from the space SP of the upper stage 10k. As a result, as shown in FIG. 20(b), the elastic body 12k (diaphragm 12k1) of the upper stage 10k contracts, and the upper stage 10k separates from the bonded material BM1. The controller 70 calculates a Z-direction drive amount ΔPr for moving the upper stage 10k and the lower stage 20 away from each other in the Z direction and supplies this to the driver 50. The driver 50 moves the upper stage 10k and the lower stage 20 relatively away from each other in the Z direction according to the drive amount ΔPr. As a result, the upper stage 10k and the lower stage 20 return to the Z position S12, and the bonded material BB is placed on the lower stage 20. The vacuum vessel 30 is opened (for example, the seal member 33 is moved in the +Z direction from the lower stage portion 32), opening the processing chamber CH to the atmosphere and exposing the upper stage 10k and the lower stage 20.

[0084] The bonded body BB arranged on the lower stage 20 is carried out from the bonding apparatus 1 by a conveying system (not shown) or the like.

[0085] Such a bonding device 1k can also utilize the limited force required for bonding to increase the shear force acting on the bonding members BM1 and BM2, increase the shear force at the outer periphery of the bonding members BM1 and BM2, and efficiently seal air bubbles within the adhesive layer AD.

[0086] Alternatively, as a fourth modified example of the embodiment, as shown in Fig. 22, in a bonding apparatus 1n, an upper stage 10n may be configured to gradually increase the shear force from the center to the periphery. Fig. 22 is a cross-sectional view showing the configuration of the upper stage 10n in the fourth modified example of the embodiment. Fig. 22(a) shows a YZ cross section corresponding to cutting Fig. 4(a) along line AA. Fig. 22(b) shows an XZ cross section corresponding to cutting Fig. 4(a) along line BB.

[0087] The elastic body 12n extends generally in the XY directions. The Z thickness of the elastic body 12n gradually increases from the center to the periphery. The back surface 12bn of the elastic body 12n extends flat in the XY directions. The front surface 12an of the elastic body 12n is inclined so as to recess toward the +Z side from the periphery to the center. The front surface 12an of the elastic body 12n may recess toward the +Z side in the shape of an inverted cone or an inverted pyramid.

[0088] The elastic body 12n has greater elasticity (smaller elastic modulus) than the stage base 11, and can be made of a material having greater elasticity (smaller elastic modulus) than the stage base 11, as in the embodiment.

[0089] 8, the processes shown in FIGS. 23(a) to 28 may be performed instead of the processes shown in FIGS. 9 to 12(a). FIGS. 23(a), 23(b), 25(a) to 25(c), 27(a), and 27(b) are cross-sectional views showing the bonding process. FIG. 24 is an enlarged cross-sectional view showing the bonding process, showing a cross-section of an enlarged portion M in FIG. 23(b). FIG. 26 is an enlarged cross-sectional view showing the bonding process, showing a cross-section of an enlarged portion P in FIG. 25(a). FIG. 28 is an enlarged cross-sectional view showing the bonding process, showing a cross-section of an enlarged portion Q in FIG. 27(a).

[0090] In S11, the bonding materials BM1 and BM2 are respectively carried into and placed on the upper stage 10n and the lower stage 20 of the bonding apparatus 1n. In the bonding apparatus 1n, the vacuum container 30 is opened (for example, the seal member 33 is moved in the +Z direction from the lower stage portion 32), the processing chamber CH is opened to the atmosphere, and the upper stage 10n and the lower stage 20 are exposed.

[0091] The bonding material BM1 is carried in the vicinity of the elastic body 12 of the upper stage 10n by a conveying system (not shown) or the like, and the bonding material BM1 is placed on the surface 12an of the elastic body 12 as shown in Fig. 23(a). If the upper stage 10n has a suction mechanism, the controller 70 may control the upper stage 10n to suction the bonding material BM1 onto the surface 12an of the elastic body 12n.

[0092] At this time, the bonding material BM1 is subjected to gravity in the -Z direction and a force in the -Z direction corresponding to the suction force. The surface 12an of the elastic body 12n is inclined from the periphery to the center so as to concave toward the +Z direction, but it is soft and easily deformed. Therefore, as shown in Figures 23(b) and 25(a), the elastic body 12n can elastically deform into a substantially rectangular shape in a YZ cross section due to the weight of the bonding material BM1 and a force corresponding to the suction force of the upper stage 10n. The thickness of the elastic body 12n can be slightly reduced by elastic deformation. As the outer shape of the elastic body 12n deforms into a rectangular shape in a YZ cross section, a distributed load is generated within the elastic body 12n, with uneven magnitudes distributed in the XY directions, as indicated by the dotted arrows in Figure 24. Because the elastic deformation of the elastic body 12n gradually increases from the center to the periphery, the force exerted by the elastic body 12n on the bonding material BM1 is distributed so as to gradually increase from the center to the periphery.

[0093] The bonding material BM2 is carried in the vicinity of the convex structure 22 of the lower stage 20 by a conveyance system or the like, and as shown in Fig. 25(b), the bonding material BM2 is placed on each convex portion 221 of the convex structure 22. An adhesive layer AD may be arranged on the surface of the bonding material BM2 on the +Z side.

[0094] In S12, the controller 70 positions the upper stage 10n and the lower stage 20 opposite each other in the Z direction and aligns the XY position of the upper stage 10n with the XY position of the lower stage 20. The vacuum vessel 30 is closed (for example, moved in the -Z direction until the seal member 33 contacts the lower stage 32) to seal the processing chamber CH. The controller 70 controls the exhaust system 40 to reduce the pressure in the processing chamber CH. The controller 70 uses an imaging device (not shown) to capture an image of the reference mark MK1 of the bonded member BM1 to determine its XY position, and also uses the imaging device to capture an image of the reference mark MK2 of the bonded member BM2 to determine its XY position. The controller 70 calculates the difference between the XY position of the reference mark MK1 and the XY position of the reference mark MK2 to determine the XY error. The controller 70 calculates a drive amount ΔPxy in the XY direction in accordance with the XY error and supplies it to the driver 50. The driver 50 moves the upper stage 10n and the lower stage 20 relatively in the X and Y directions in accordance with the drive amount ΔPxy. The driver 50 may move the upper stage 10n and the lower stage 20 relatively in the X and Y directions by driving the lower stage 20 in the X and Y directions in accordance with the drive amount ΔPxy. As a result, the X and Y positions of the upper stage 10n and the lower stage 20 are aligned, as shown in FIG. 25(c).

[0095] At this time, a force in the -Z direction corresponding to the suction force acts on the bonding material BM1. The elastic body 12n is released from the weight of the bonding material BM1, and deformation due to the force corresponding to the suction force of the upper stage 10n remains. As a result, the thickness reduction due to compression of the elastic body 12n is slightly recovered. Since the amount of elastic deformation of the elastic body 12n gradually increases from the center to the periphery, the force exerted by the elastic body 12n on the bonding material BM1 is distributed so that it gradually increases from the center to the periphery. As shown in Figure 26, the magnitude of each force is slightly smaller than in the state shown in Figure 24.

[0096] In S13, the controller 70 moves the upper stage 10n and the lower stage 20 closer to each other in the Z direction, and selectively brings the elastic body 12n of the upper stage 10n into contact with the periphery of the rear surface of the bonded member BM1. Accordingly, the surface of the bonded member BM1 contacts the surface of the bonded member BM2 via the adhesive layer AD. This forms a bonded body BB in which the bonded members BM1 and BM are bonded together via the adhesive layer AD. At this time, air bubbles GB5 may be mixed into the adhesive layer AD.

[0097] In S14, the bonding apparatus 1n presses the bonded body BB in the Z direction from the upper stage 10n and the lower stage 20. The controller 70 calculates a drive amount ΔPf for pressurization and supplies it to the driver 50. The driver 50 relatively presses the upper stage 10n and the lower stage 20 in the Z direction according to the drive amount ΔPf. The driver 50 may relatively press the upper stage 10n and the lower stage 20 in the Z direction by pressing the lower stage 20 in the +Z direction according to the drive amount ΔPf, as shown in FIG. 27(a).

[0098] At this time, the bonding material BM1 is subjected to a pressure force in the -Z direction in addition to a force in the -Z direction corresponding to the suction force. As shown in FIG. 27(a), the elastic body 12n can be elastically deformed into a substantially rectangular shape in a YZ cross section due to a force corresponding to the suction force of the upper stage 10n. The thickness of the elastic body 12n can be significantly reduced compared to the state shown in FIG. 24 or FIG. 26 due to elastic deformation. As the outer shape of the elastic body 12n deforms into a rectangular shape in a YZ cross section, forces are generated within the elastic body 12n that are unevenly distributed in the XY directions, as shown by the dotted arrows in FIG. 28. Because the elastic deformation of the elastic body 12n gradually increases from the center to the periphery, the force exerted by the elastic body 12n on the bonding material BM1 is distributed so that it gradually increases from the center to the periphery. Since the distribution of the distributed load is greater toward the periphery, the shear force at the periphery is greater. As shown in FIG. 28, the magnitude of each force is significantly greater than that in the state shown in FIG. 24 or FIG. 26.

[0099] That is, as shown by the dotted arrows in Figure 28, the stage base 11 of the upper stage 10n applies a distributed load in the Z direction to the elastic body 12n, which is distributed in the XY direction with a magnitude that gradually increases from the center to the periphery, while the elastic body 12n selectively contacts the vicinity of the periphery on the back surface of the bonding material BM1 and applies a concentrated load in the Z direction to the vicinity of the periphery. The convex structure 22 of the lower stage 20 contacts at least four points in the peripheral region on the back surface of the bonding material BM2 and applies a concentrated load in the Z direction to at least four points. This selectively increases the shear force on the back surface of the bonding material BM1, so that the air bubble GB5 can be sealed in the adhesive layer AD as shown in Figure 28.

[0100] In S15, the bonded body BB is carried out from the bonding apparatus 1n.

[0101] The controller 70 calculates a drive amount ΔPr in the Z direction for moving the upper stage 10n and the lower stage 20 away from each other in the Z direction and supplies this to the drive unit 50. The drive unit 50 moves the upper stage 10n and the lower stage 20 relatively away from each other in the Z direction according to the drive amount ΔPr. As a result, as shown in FIG. 27(b), the upper stage 10n and the lower stage 20 return to the Z position S12, and the bonded body BB is placed on the lower stage 20. The elastic body 12n of the upper stage 10n is released from the external force and returns to its original shape. The vacuum vessel 30 is opened (for example, the seal member 33 is moved in the +Z direction from the lower stage portion 32), and the processing chamber CH is opened to the atmosphere, exposing the upper stage 10n and the lower stage 20.

[0102] The bonded body BB arranged on the lower stage 20 is carried out from the bonding apparatus 1n by a conveying system (not shown) or the like.

[0103] Such a bonding device 1n can also utilize the limited force required for bonding to increase the shear force acting on the bonding members BM1 and BM2, increase the shear force at the outer periphery of the bonding members BM1 and BM2, and efficiently seal air bubbles within the adhesive layer AD.

[0104] Alternatively, as a fifth modified example of the embodiment, as shown in Figures 29 and 30, in a bonding apparatus 1p, a lower stage 20p may be capable of line contact with the back surface of the bonding member BM2. Figure 29 is a plan view showing the configuration of the lower stage 20p in the fifth modified example of the embodiment. Figure 30 is a cross-sectional view showing the configuration of the lower stage 20p in the fifth modified example of the embodiment. Figure 30(a) shows a YZ cross section when Figure 29 is cut along line RR. Figure 30(b) shows an XZ cross section when Figure 29 is cut along line SS.

[0105] The lower stage 20p has a convex structure 22p instead of the convex structure 22 (see FIG. 4(b)). The convex structure 22p is capable of line contact with the rear surface of the bonding member BM2. The convex structure 22p may be capable of contact with a plurality of lines on the rear surface of the bonding member BM2 that are not in the same line and do not intersect with each other. The plurality of lines may include at least four points in the embodiment. The convex structure 22p includes at least two ridges 221p that are not in the same line and do not intersect with each other. The at least two ridges 221p may be arranged at positions on the main surface 21a where the distance between them is greater than a threshold value.

[0106] 29 illustrates two ridges 221p_1 and 221p_2. The two ridges 221p_1 and 221p_2 may be arranged in the outer circumferential region 21a2. The two ridges 221p_1 and 221p_2 may be arranged at positions in the outer circumferential region 21a2 where the distance between them is greater than a threshold. When the stage base 21 has a substantially rectangular shape in the XY plane, the threshold may be determined in advance in accordance with the length of the long side of the stage base 21. The two ridges 221p_1 and 221p_2 may be arranged on the short side of the outer circumferential region 21a2.

[0107] As shown in Fig. 29, each ridge 221p is linear in the XY plane view. Each ridge 221p may be linear in the XY plane view, or may be curved in the XY plane view. As shown in Fig. 30(b), each ridge 221p protrudes from the main surface 21a toward the upper stage 10. In the XZ cross section view, each ridge 221p may protrude toward the +Z side in a spherical or aspherical shape, or may protrude toward the +Z side in a conical or pyramidal shape.

[0108] In such a bonding apparatus 1p, a distributed load can be applied to the rear surface of the bonding member BM1, and a concentrated load can be applied to each of the plurality of lines on the rear surface of the bonding member BM2.

[0109] Alternatively, as a sixth modified example of the embodiment, as shown in Figures 31 and 32, in a bonding apparatus 1q, a lower stage 20q may be capable of line contact with the back surface of the bonding member BM2. Figure 31 is a plan view showing the configuration of the lower stage 20q in the sixth modified example of the embodiment. Figure 32 is a cross-sectional view showing the configuration of the lower stage 20q in the sixth modified example of the embodiment. Figure 32(a) shows a YZ cross section when Figure 31 is cut along line TT. Figure 32(b) shows an XZ cross section when Figure 31 is cut along line UU.

[0110] The lower stage 20q has a convex structure 22q instead of the convex structure 22 (see FIG. 4(b)). The convex structure 22q can be in line contact with the back surface of the bonding material BM2. The convex structure 22q may be in contact with a circular line on the back surface of the bonding material BM2. The circular line may include at least four points in the embodiment. The convex structure 22q includes a circular ridge portion 221q. The circular ridge portion 221q may be a rectangular ring or a curved ring.

[0111] 31 illustrates an annular ridge portion 221q having a rectangular ring shape. The annular ridge portion 221q may be disposed in the outer circumferential region 21a2.

[0112] 32(a) and 32(b), the annular ridge portion 221q protrudes from the main surface 21a toward the upper stage 10. The annular ridge portion 221q may protrude toward the +Z side in a spherical or aspherical shape, or in a conical or pyramidal shape, in both the YZ cross-sectional view and the XZ cross-sectional view.

[0113] In such a bonding apparatus 1q, a distributed load can be applied to the rear surface of the bonding member BM1, and a concentrated load can be applied to a circular line on the rear surface of the bonding member BM2.

[0114] Alternatively, as a seventh modified example of the embodiment, as shown in Figures 33 and 34, in a bonding apparatus 1r, a lower stage 20r may be capable of surface contact with the back surface of the bonded member BM2. Figure 33 is a plan view showing the configuration of the lower stage 20r in the seventh modified example of the embodiment. Figure 34 is a cross-sectional view showing the configuration of the lower stage 20r in the seventh modified example of the embodiment. Figure 34(a) shows a YZ cross section when Figure 33 is cut along line VV. Figure 34(b) shows an XZ cross section when Figure 33 is cut along line WW.

[0115] The lower stage 20r has a convex structure 22r instead of the convex structure 22 (see FIG. 4(b)). The convex structure 22r is capable of surface contact with the rear surface of the bonding member BM2. The convex structure 22r may be capable of contacting a plurality of linear regions on the rear surface of the bonding member BM2 that are not in the same line and do not intersect with each other. The plurality of linear regions may include at least four points in the embodiment. The convex structure 22r includes at least two bank portions 221r ​​that are not in the same line and do not intersect with each other and each have a flat top surface 221ra. The at least two bank portions 221r ​​may be arranged at positions on the main surface 21a where the distance between them is greater than a threshold value.

[0116] 33 illustrates two bank portions 221r_1 and 221r_2. The two bank portions 221r_1 and 221r_2 may be arranged in the outer circumferential region 21a2. The two bank portions 221r_1 and 221r_2 may be arranged at positions in the outer circumferential region 21a2 where the interval between them is greater than a threshold. When the stage base 21 has a substantially rectangular shape in the XY plane view, the threshold may be determined in advance in accordance with the length of the long side of the stage base 21. The two bank portions 221r_1 and 221r_2 may be arranged on the short side of the outer circumferential region 21a2.

[0117] As shown in Fig. 33, each bank portion 221r ​​is linear in the XY plane view. Each bank portion 221r ​​may be linear in the XY plane view, or may be curved in the XY plane view. As shown in Fig. 34(b), each bank portion 221r ​​bulges out from the main surface 21a toward the upper stage 10, but the top surface 221ra is flat and can come into surface contact with the back surface of the bonding material BM2. Each bank portion 221r ​​may bulge out toward the +Z side in a trapezoidal shape or a rectangular shape in the XZ cross section view.

[0118] In such a bonding apparatus 1r, a distributed load can be applied to the rear surface of the bonding member BM1, and a concentrated load can be applied to each of the plurality of planar regions on the rear surface of the bonding member BM2.

[0119] Alternatively, as an eighth modified example of the embodiment, as shown in Figs. 35 and 36, in a bonding apparatus 1s, a lower stage 20s may be capable of surface contact with the back surface of a bonding member BM2. Fig. 35 is a plan view showing the configuration of the lower stage 20s in the eighth modified example of the embodiment. Fig. 36 is a cross-sectional view showing the configuration of the lower stage 20s in the eighth modified example of the embodiment. Fig. 36(a) shows a YZ cross section when Fig. 35 is cut along line AA-AA. Fig. 36(b) shows an XZ cross section when Fig. 35 is cut along line BB-BB.

[0120] The lower stage 20s has a convex structure 22s instead of the convex structure 22 (see FIG. 4(b)). The convex structure 22s is capable of surface contact with the rear surface of the bonding member BM2. The convex structure 22s may be capable of contacting an annular region on the rear surface of the bonding member BM2. The annular region may include at least four points in the embodiment. The convex structure 22s includes an annular bank portion 221s. The annular bank portion 221s may be a rectangular ring or a curved ring.

[0121] 35 illustrates an annular bank portion 221s having a rectangular ring shape. The annular bank portion 221s may be disposed in the outer circumferential region 21a2.

[0122] 36(a) and 36(b), the annular bank portion 221s bulges from the main surface 21a toward the upper stage 10, but the top surface 221sa is flat and can come into surface contact with the back surface of the bonding material BM2. The annular bank portion 221s may bulge toward the +Z side in a trapezoidal shape or a rectangular shape in each of the YZ cross section and the XZ cross section.

[0123] In such a bonding apparatus 1s, a distributed load can be applied to the rear surface of the bonding member BM1, and a concentrated load can be applied to each of the plurality of lines on the rear surface of the bonding member BM2.

[0124] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, as well as within the scope of the invention described in the claims and their equivalents. [Explanation of symbols]

[0125] 1,1i,1j,1k,1n,1p,1q,1r,1s laminating equipment 10, 10k, 10n Upper Stage 20,20i,20j,20p,20q,20r,20s Lower Stage

Claims

1. Applying a distributed load to the back surface of the first bonding member and applying a concentrated load to each of at least four points on the back surface of the second bonding member to bond the surface of the first bonding member and the surface of the second bonding member together via an adhesive layer to form a bonded body; subjecting the laminate to autoclave treatment; A method for manufacturing a bonded body comprising the steps of:

2. The bonding step includes: The method includes bonding the surface of the first bonding member and the surface of the second bonding member via the adhesive layer so that the adhesive layer includes the at least four points inside when viewed from a direction perpendicular to the back surface of the first bonding member. The method of claim 1.

3. The bonding step includes: A first stage having an elastic body is brought into contact with the back surface of the first bonding member, and a second stage having at least four convex portions that are not in the same straight line is brought into contact with the at least four points, and the surface of the first bonding member and the surface of the second bonding member are brought into contact with each other through the adhesive layer; pressurizing the first stage and the second stage relative to one another; Contains The method of claim 1.

4. The bonding step includes: A first stage having an elastic body is brought into contact with the back surface of the first bonding member, and a second stage having a main surface and at least four convex portions arranged in a peripheral region of the main surface is brought into contact with the at least four convex portions at the at least four points, and the surface of the first bonding member is brought into contact with the surface of the second bonding member via the adhesive layer; pressurizing the first stage and the second stage relative to one another; Contains The method of claim 1.

5. The bonding step includes: A first stage having an elastic body is brought into contact with the back surface of the first bonding member, and a second stage having at least four convex portions disposed at positions where the interval between the main surface and the main surface is greater than a threshold value is brought into contact with the at least four points, and the surface of the first bonding member and the surface of the second bonding member are brought into contact with each other through the adhesive layer; pressurizing the first stage and the second stage relative to one another; Contains The method of claim 1.

6. The bonding step includes: The elastic body of the first stage is brought into contact with the back surface of the first bonding member, and the second stage has a main surface and four convex portions arranged in the outer peripheral region of the main surface, and at least four convex portions each having a height such that the back surface of the second bonding member does not contact the main surface when the second bonding member is bent. In this state, the surface of the first bonding member and the surface of the second bonding member are brought into contact with each other through the adhesive layer. pressurizing the first stage and the second stage relative to one another; Contains The method of claim 1.

7. The bonding step includes: A first stage has a stage base having a recess and a diaphragm closing the recess in a state where the at least four protrusions of the second stage, which have at least four protrusions that are not in the same straight line, are brought into contact with the at least four points, and the contact area of ​​the diaphragm of the first stage with the back surface of the first bonding member is gradually increased from the center to the periphery; Bringing the diaphragm into full contact with the rear surface of the first bonding member; pressurizing the first stage and the second stage relative to one another; Contains The method of claim 1.

8. The bonding step includes: A first stage has an elastic body whose thickness increases from the center to the periphery, and the elastic body of the first stage is brought into contact with the back surface of the first bonding member, and a second stage has at least four convex portions that are not in the same line, and the at least four convex portions of the second stage are brought into contact with the at least four points, and the surface of the first bonding member and the surface of the second bonding member are brought into contact with each other through the adhesive layer; pressurizing the first stage and the second stage relative to one another; Contains The method of claim 1.

9. a first stage on which a first bonding member is disposed; a second stage facing the first stage and on which a second bonding member is disposed; Equipped with The first stage comprises: an elastic body having elasticity and capable of contacting the back surface of the first bonding member; The second stage comprises: The second bonding member has a convex structure that can contact at least four points on the rear surface of the second bonding member. Laminating device.

10. The convex structure includes at least four convex portions that are not collinear. The laminating apparatus according to claim 9 .

11. the second stage further has a major surface; Each of the at least four protrusions is The first stage is disposed in an outer peripheral region of the main surface and protrudes from the main surface toward the first stage. The laminating apparatus according to claim 10.

12. the second stage further has a major surface; Each of the at least four protrusions is The protrusion is disposed at a position on the main surface where the distance between the protrusion and other protrusions is greater than a threshold value, and protrudes from the main surface toward the first stage. The laminating apparatus according to claim 10.

13. The convex structure includes at least two ridges that are not collinear and do not intersect with each other. The laminating apparatus according to claim 9 .

14. The convex structure includes at least two banks that are not collinear, do not intersect each other, and each have a flat top surface. The laminating apparatus according to claim 9 .

15. the second stage further has a major surface; The convex structure has a height such that the rear surface of the second bonding member does not come into contact with the main surface when the second bonding member is bent. The laminating apparatus according to claim 9 .

16. the first stage further comprising a stage base; The elastic body is capable of covering a main surface of the stage base on the side of the first stage to form a flat contact surface. The laminating apparatus according to claim 9 .

17. the first stage further includes a stage base having a recess; The elastic body is A diaphragm is included which closes the recess and can form a convex or flat surface depending on the pressure of a gas filled in a space formed with the recess. The laminating apparatus according to claim 9 .

18. the first stage further comprising a stage base; The elastic body covers a main surface of the stage base on the side of the first stage and has a surface that is gradually recessed from the outer periphery toward the center. The laminating apparatus according to claim 9 .

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