Peeling apparatus and peeling method

Abstract

To efficiently adjust the tension of a release sheet.SOLUTION: A holding unit configured to hold a workpiece in a state where a first sheet is exposed, a supply unit configured to supply a release sheet to a region facing an exposed surface of the first sheet, a sheet fixing unit configured to fix the release sheet to the first sheet, and a collection unit configured to collect the first sheet by winding the release sheet fixed to the first sheet; And a peeling roller that rotates about an axis disposed along a direction intersecting the predetermined direction, in which a tension state of the peeling sheet between a first position in contact with the peeling roller and a second position fixed to the first sheet is adjusted by rotating the peeling roller according to relative movement between the holding unit and the peeling roller.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a peeling device that peels off a first sheet from a workpiece having a first sheet fixed to one surface thereof, and a peeling method that peels off a first sheet from a workpiece having a first sheet fixed to one surface thereof. [Background technology]

[0002] It is known that a frame unit is formed by integrating the first ring frame, wafer, and first sheet by adhering a first sheet to one side of a wafer and one side of a first ring frame provided on the outer periphery of the wafer, and then this frame unit is placed in a processing device and the wafer is processed.

[0003] After processing the wafer, a transfer device is known that attaches a second sheet to the other side of the wafer and one side of a second ring frame provided on the outer periphery of the wafer to a frame unit, thereby integrating the wafer, the second ring frame, and the second sheet, and then peels off the first sheet and removes the first ring frame, thereby transferring the wafer from the first sheet to the second sheet (see, for example, Patent Document 1).

[0004] This transfer device includes a supply unit having a feed roller that supplies the release sheet, and a recovery unit having a recovery roller that winds up and recovers the release sheet. When peeling the first sheet from the wafer, a portion of the release sheet is fixed to the first sheet, and then the feed roller and recovery roller are rotated while the fixed position of the release sheet is moved relative to the first sheet in a predetermined direction.

[0005] At this time, it is possible to increase the tension of the first sheet (i.e., apply tension to the first sheet) by appropriately rotating the feed roller and recovery roller, thereby reducing the slack that occurs in the release sheet.

[0006] However, since one or more guide rollers are provided in the area between the fixed position of the release sheet and the feed roller, and in the area between the fixed position of the release sheet and the recovery roller, it was difficult to eliminate slack in the release sheet that occurred near the fixed position.

[0007] If unexpected slack occurs near the fixed position of the release sheet, the adhesive surface of the release sheet may stick to an unexpected area, making it difficult to peel off the first sheet; if unexpected strong tension occurs near the fixed position of the release sheet, the wafer may be subjected to a tensile force greater than expected, causing it to be damaged. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 2023-120503 Summary of the Invention [Problem to be solved by the invention]

[0009] The present invention has been made in consideration of these problems, and aims to efficiently adjust the tension of the release sheet near the fixed position of the release sheet fixed to the first sheet when using the release sheet to release the first sheet fixed to the wafer. [Means for solving the problem]

[0010] According to one aspect of the present invention, a peeling device for peeling a first sheet from a workpiece having the first sheet fixed to one surface thereof includes a holding unit for holding the workpiece with the first sheet exposed, a supply unit for supplying the release sheet to an area facing the exposed surface of the first sheet, a sheet fixing unit for fixing the release sheet to the first sheet, a recovery unit for holding one end of the release sheet supplied from the supply unit and recovering the first sheet by winding up the release sheet fixed to the first sheet, and a device for connecting the supply unit and the recovery unit. and a peeling roller that is provided separately from the first sheet and rotates about an axis arranged in a direction intersecting the predetermined direction in response to relative movement of the release sheet along a predetermined direction relative to the holding unit with a portion of the release sheet fixed to the first sheet, wherein the tension of the release sheet between a first position in contact with the peeling roller and a second position fixed to the first sheet is adjusted by rotating the peeling roller in response to the relative movement of the holding unit and the peeling roller along the predetermined direction.

[0011] Preferably, the peeling device further includes a disk portion fixed to one end of the peeling roller, and a receiving portion having an upper surface extending along the predetermined direction and receiving the disk portion, and when the peeling roller and the holding unit move relative to each other, the disk portion rolls on the upper surface of the receiving portion, causing the peeling roller to rotate in synchronization with the relative movement between the peeling roller and the holding unit.

[0012] Preferably, the peeling device further includes an imaging unit that images the area of ​​the release sheet between the first position where the release sheet is in contact with the peeling roller and the second position where the release sheet is fixed to the first sheet.

[0013] According to another aspect of the present invention, there is provided a peeling method for peeling a first sheet from a workpiece having the first sheet fixed to one surface, the peeling method comprising: a holding step of holding the workpiece with a holding unit while exposing the first sheet; a fixing step of fixing a portion of a release sheet to the first sheet after the holding step; and a peeling step of peeling the first sheet from the workpiece by moving the holding unit and a release roller relatively along a predetermined direction after the fixing step, wherein in the peeling step, the release roller is rotated during the relative movement between the holding unit and the release roller along the predetermined direction, thereby adjusting the tension of the release sheet between a first position in contact with the release roller and a second position fixed to the first sheet. [Effects of the Invention]

[0014] A peeling device according to one aspect of the present invention includes a peeling roller provided separately from the supply unit and the recovery unit, which rotates about an axis extending in a direction intersecting the predetermined direction in response to the movement of the peeling roller relative to the holding unit in a predetermined direction with a portion of the release sheet fixed to the first sheet.

[0015] In particular, by rotating the peeling roller in accordance with the relative movement of the holding unit and the peeling roller in a predetermined direction, the tension of the release sheet between a first position where the release sheet is in contact with the peeling roller and a second position where the release sheet is fixed to the first sheet is adjusted, which makes it possible to adjust the tension of the release sheet more efficiently than when adjusting the tension of the release sheet using only the supply unit and the recovery unit.

[0016] In the peeling step of the peeling method according to another aspect of the present invention, the tension of the release sheet between a first position where the release sheet is in contact with the peeling roller and a second position where the release sheet is fixed to the first sheet is adjusted by rotating the peeling roller during relative movement between the holding unit and the peeling roller in a predetermined direction. This allows for more efficient adjustment of the tension of the release sheet than when the tension of the release sheet is adjusted using only the supply unit and the collection unit. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. 1(A) is a perspective view of a wafer, and FIG. 1(B) is a perspective view of a first wafer unit. [Figure 2] FIG. [Figure 3] FIG. 2 is an enlarged perspective view of the temporary placement mechanism and its vicinity. [Figure 4] 2 is a perspective view showing a ring frame storage section, a first ring frame transport unit, a ring frame support table, and an adhesive tape supply unit. FIG. [Figure 5] FIG. [Figure 6] Figure 6(A) is an oblique view showing the first support unit and the second support unit, Figure 6(B) is an oblique view showing how a second ring frame or the like is placed on the second support unit, and Figure 6(C) is an oblique view showing how a second adhesive tape is adhered to a wafer. [Figure 7] FIG. 10 is a partial cross-sectional side view showing how a second adhesive tape is attached to the rear surface of the wafer. [Figure 8] FIG. 2 is a perspective view showing a combined body transport mechanism and a peeling unit. [Figure 9] 9(A) and 9(B) are partial cross-sectional side views showing the assembly held by the holding unit. [Figure 10] FIG. 10 is a partial cross-sectional side view showing a state in which the moving plate is positioned directly below the holding unit. [Figure 11] FIG. 10 is a partial cross-sectional side view showing a fixing step. [Figure 12] FIG. 10 is a partial cross-sectional side view showing the initial stage of the peeling process. [Figure 13] FIG. 10 is a partial cross-sectional side view showing how slack in the release sheet is reduced in the peeling step. [Figure 14] FIG. 10 is a partial cross-sectional side view showing the final stage of the peeling process. [Figure 15] FIG. 10 is a partial cross-sectional side view showing how the first ring frame is being retrieved. [Figure 16] FIG. 10 is a perspective view showing the reversing unit, the delivery table, the second wafer unit transport unit, the guide rail table, the second ultraviolet irradiation unit, the cleaning unit, and the push-pull arm. [Figure 17] FIG. 2 is a perspective view showing a guide rail table, a second ultraviolet irradiation unit, and a cleaning unit in a separated state. [Figure 18] 1 is a flowchart showing a peeling method. DETAILED DESCRIPTION OF THE INVENTION

[0018] An embodiment of the present invention will be described with reference to the accompanying drawings. A transfer device (i.e., peeling device) 2 (see FIG. 2) and a transfer method (i.e., peeling method) (see FIG. 18) according to this embodiment handle a processed wafer (i.e., workpiece) 11 (see FIG. 1(B)) having a first adhesive tape (first sheet) 17 attached (i.e., fixed) to its surface 11a.

[0019] To outline the transfer method, first, a second adhesive tape (i.e., a second sheet) 25 is attached (i.e., fixed) to the back surface (i.e., one surface) 11b of the processed wafer 11 (see Figure 7), and then the first adhesive tape 17 is peeled off from the front surface 11a of the wafer 11 (see Figure 14).

[0020] As a result, the wafer 11 is transferred from the first adhesive tape 17 to the second adhesive tape 25 (i.e., the adhesive tape is replaced). First, the wafer 11 transferred from the first adhesive tape 17 to the second adhesive tape 25 will be described.

[0021] 1(A) is a perspective view showing the front surface 11a side of the wafer 11. The wafer 11 has a disk-shaped single crystal substrate made of a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductor material.

[0022] However, the material and shape of the wafer 11 are not limited to these. The material of the wafer 11 may be formed of a material other than a semiconductor material, and may not be single crystal. The wafer 11 may also have a rectangular substrate.

[0023] The surface 11a of the wafer 11 is divided by a plurality of dividing lines 13 that intersect with each other (in this example, they are perpendicular to each other). In each rectangular area divided by the dividing lines 13, a device 15 such as an IC (Integrated Circuit) is formed.

[0024] By cutting the wafer 11 along the planned division lines 13, the wafer 11 is divided into a plurality of device chips (not shown), each having a device 15. The cutting of the wafer 11 is performed using a processing device (not shown), such as a cutting device or a laser processing device.

[0025] The wafer 11 is carried into the processing device in the form of a first wafer unit 21a that is integrated with the first adhesive tape 17 and the first ring frame 19. Fig. 1(B) is a perspective view showing the first wafer unit 21a that is formed by integrating the first ring frame 19, the first adhesive tape 17, and the wafer 11.

[0026] The first ring frame 19 is made of a metal such as aluminum or stainless steel. A first opening 19c is formed in the radial center of the first ring frame 19, penetrating from the front surface 19a to the back surface 19b of the first ring frame 19. The first opening 19c has a diameter larger than the diameter of the wafer 11.

[0027] The first adhesive tape 17 is also called a dicing tape. The first adhesive tape 17 is attached to the back surface 19b of the first ring frame 19 so as to close the first opening 19c. The first adhesive tape 17 has a diameter that is larger than the diameter of the first opening 19c and smaller than the outer diameter of the first ring frame 19.

[0028] The first adhesive tape 17 includes, for example, a base layer made of resin or the like and an adhesive layer formed on one side of the base layer. The adhesive layer is preferably made of ultraviolet-curable resin. In this case, the adhesive strength of the adhesive layer can be reduced by irradiating the first adhesive tape 17 with ultraviolet light.

[0029] When the first adhesive tape 17 is attached to the first ring frame 19 so as to close the first opening 19c, an adhesive layer of the first adhesive tape 17 is exposed in the first opening 19c. In this embodiment, the surface 11a of the wafer 11 is attached to this adhesive layer.

[0030] This forms a first wafer unit 21a in which the wafer 11 is supported on the first ring frame 19 via the first adhesive tape 17. Note that instead of the first adhesive tape 17, a resin layer sheet (first sheet) having a base layer but no adhesive layer may be attached to the front surface 11a of the wafer 11 and the back surface 19b of the first ring frame 19.

[0031] Such a sheet may be made of, for example, a polyolefin such as polyethylene or polypropylene, or may be made of a thermoplastic resin other than polyolefin. By using a sheet without an adhesive layer, it is possible to prevent part of the adhesive from remaining on the surface 11a of the wafer 11 after the sheet is peeled off from the wafer 11.

[0032] When the first wafer unit 21a is transferred to a processing device (not shown), processing is performed on the wafer 11. For example, the processing device divides the wafer 11. After processing, the first wafer unit 21a is carried out from the processing device.

[0033] If the first adhesive tape 17 is attached to the front surface 11a of the wafer 11, the circuit patterns and the like constituting the devices 15 must be observed through the first adhesive tape 17. Furthermore, if the first adhesive tape 17 is attached to the front surface 11a, it becomes difficult to perform tests on the devices 15, such as functional tests, and it also becomes difficult to mount device chips with the front surface 11a facing upward in a later process.

[0034] Therefore, in the transfer device 2 and transfer method according to this embodiment, the second adhesive tape 25 is attached to the back surface 11b of the wafer 11, and the first adhesive tape 17 is peeled off from the front surface 11a of the wafer 11, thereby transferring the wafer 11 to the second adhesive tape 25. This exposes the front surface 11a.

[0035] At this time, the wafer 11, the second adhesive tape 25, and the second ring frame 23 are integrated to form a second wafer unit 21b (see FIG. 14). That is, the wafer 11 is supported by the second ring frame 23 via the second adhesive tape 25.

[0036] The second adhesive tape 25 of this embodiment has an adhesive layer made of ultraviolet curable resin and a base layer, similar to the first adhesive tape 17. However, the second adhesive tape 25 may also be formed of a base layer made of thermoplastic resin without having an adhesive layer.

[0037] The transfer device 2 and the transfer method according to this embodiment are not limited to the above. The front surface 11a of the first wafer unit 21a, which has the first adhesive tape 17 attached to the back surface 11b of the wafer 11, may be processed, and then the second adhesive tape 25 may be attached to the front surface 11a, and the first adhesive tape 17 may be peeled off from the back surface 11b.

[0038] The transfer of the wafer 11 is performed by a transfer device 2 shown in Figure 2. The transfer device 2 will now be described in detail. Figure 2 is a perspective view showing the transfer device 2. The X-axis, Y-axis, and Z-axis directions shown in Figure 2 are perpendicular to one another. The XY plane defined by the X-axis and Y-axis directions is, for example, parallel to the horizontal plane, and the Z-axis direction is, for example, parallel to the vertical direction.

[0039] The transfer device 2 includes a base 4 that supports each of the components. Cassette tables 6a and 6b are provided on the front side of the base 4. The cassette tables 6a and 6b can be raised and lowered in the vertical direction (i.e., can move along the Z-axis direction) by an elevation mechanism (not shown).

[0040] A cassette 8a containing a plurality of first wafer units 21a is placed on the cassette table 6a, and a cassette 8b containing a plurality of wafer units each having undergone the transfer process is placed on the cassette table 6b.

[0041] The cassettes 8a and 8b have first and second side walls that face each other. The inner surfaces of the first and second side walls define a storage space that stores a plurality of frame units. The first and second side walls have no side walls at both ends in the width direction, and these ends form openings of the cassettes 8a and 8b.

[0042] A plurality of guide rails are provided on the inner surface of each side wall at approximately equal intervals along the height direction. One frame unit is placed on a pair of guide rails at corresponding height positions (for example, the same height position) on each side wall.

[0043] A push-pull arm 10 is provided behind the cassette table 6a to carry out the first wafer unit 21a stored in the cassette 8a from the cassette 8a. The push-pull arm 10 is movable along the X-axis direction by a movement mechanism (not shown) having a motor or the like.

[0044] The push-pull arm 10 has a rectangular parallelepiped housing, and a pair of gripping plates is provided on one side of this housing closest to the cassette table 6a. The pair of gripping plates moves toward or away from each other along the Z-axis direction by an actuator (not shown). The pair of gripping plates grips the first ring frame 19 by sandwiching it from above and below.

[0045] A temporary placement mechanism having a pair of guide rails 12 is provided near the push-pull arm 10. The pair of guide rails 12 are driven by an actuator (not shown) and move toward or away from each other along the Y-axis direction while maintaining a state in which they are parallel to each other in the X-axis direction.

[0046] 3 is an enlarged perspective view of the vicinity of the temporary placement mechanism. Each of the pair of guide rails 12 has a substantially flat support surface 12a that supports the first ring frame 19 of the first wafer unit 21a, and an abutment surface 12b that is substantially perpendicular to the support surface 12a.

[0047] The support surface 12a is disposed approximately parallel to the XY plane, and the abutment surface 12b is disposed approximately parallel to the XZ plane. The abutment surfaces 12b of the pair of guide rails 12 face each other. A first ultraviolet irradiation unit 14 is provided in the area directly below the pair of guide rails 12, and in Figure 3, the first ultraviolet irradiation unit 14 is simply shown by a two-dot chain line.

[0048] The first ultraviolet irradiation unit 14 includes a light source that emits ultraviolet light (for example, light having a wavelength of about 100 nm to 400 nm). The first ultraviolet irradiation unit 14 irradiates the first wafer unit 21a, which is supported by the pair of guide rails 12, with ultraviolet light from below to above.

[0049] Here, we will explain the process of unloading the first wafer unit 21a from the cassette 8a and reducing the adhesive strength of the first adhesive tape 17. First, the height of the cassette table 6a is adjusted by the lifting mechanism so that the height of the first wafer unit 21a to be unloaded matches the height of the push-pull arm 10.

[0050] Next, the push-pull arm 10 enters the cassette 8a and grips the first ring frame 19 of the first wafer unit 21a with the pair of gripping parts. After that, the push-pull arm 10 moves in a direction away from the cassette 8a and places the first wafer unit 21a on the support surface 12a of the guide rail 12.

[0051] At this time, the first wafer unit 21a is positioned at a predetermined position in the X-axis direction by adjusting the position of the push-pull arm 10. Thereafter, the first ring frame 19 is released from the gripping by the pair of gripping parts.

[0052] Next, the pair of guide rails 12 are moved in a direction approaching each other in an interlocking manner, and the abutment surfaces 12b of the pair of guide rails 12 are brought into contact with the outer periphery of the first ring frame 19, thereby sandwiching the first ring frame 19. This positions the first wafer unit 21a at a predetermined position in the Y-axis direction.

[0053] Thereafter, the first wafer unit 21a is irradiated with ultraviolet light from the first ultraviolet irradiation unit 14, thereby reducing the adhesive strength of the adhesive layer (ultraviolet curable resin) of the first adhesive tape 17. This makes it easier to peel off the first adhesive tape 17 compared to when ultraviolet light is not irradiated.

[0054] A first transport unit 16 is provided near the first ultraviolet irradiation unit 14. The first transport unit 16 transports a first wafer unit 21a that is aligned by a pair of guide rails 12 and irradiated with ultraviolet light.

[0055] The first transport unit 16 has a rail 18 whose longitudinal direction is aligned with the X-axis direction. The base end of an arm 20 is slidably fixed to the rail 18. The arm 20 extends in a predetermined direction within the XY plane so as to intersect with both the X-axis and the Y-axis.

[0056] A holder 22 is provided on the underside of the tip of the arm 20 via an elevation mechanism 24. The holder 22 has a plurality of suction pads and holds the first ring frame 19 of the first wafer unit 21a by suction with negative pressure.

[0057] The lifting mechanism 24 has an air cylinder or the like and has the function of lifting and lowering the holding part 22 along the Z-axis direction. A first support unit 26 is provided behind the pair of guide rails 12 and the first ultraviolet irradiation unit 14 in the X-axis direction.

[0058] The first support unit 26 includes a wafer support portion 28 that supports the wafer 11 of the first wafer unit 21a via the first adhesive tape 17, and a ring frame support portion 30 that supports the first ring frame 19 via the first adhesive tape 17.

[0059] The wafer support portion 28 has a circular upper surface (i.e., support surface) with a diameter similar to that of the wafer 11. The ring frame support portion 30 has an annular upper surface (i.e., support surface). The inner peripheral edge of the annular upper surface of the ring frame support portion 30 has a diameter similar to that of the first opening 19c of the first ring frame 19.

[0060] The first support unit 26 includes an elevator (not shown) that relatively raises and lowers the wafer support 28 and the ring frame support 30. The elevator is a lifting mechanism having a ball screw, an elevator mechanism having an air cylinder, or the like. The wafer support 28 and the ring frame support 30 can be raised and lowered independently.

[0061] The wafer support part 28 may have a built-in heating mechanism (heater) such as an electric heating wire. For example, the wafer support part 28 heats the supported wafer 11 to a predetermined temperature within a range of 30°C to 80°C.

[0062] In this embodiment, when the first wafer unit 21a is supported by the wafer support portion 28, the back surface 11b of the wafer 11 is exposed upward, and the front surface 11a faces the upper surface of the wafer support portion 28 via the first adhesive tape 17 (see Figure 6(B)).

[0063] When the wafer 11 supported by the wafer support portion 28 is heated, as will be described later, the second adhesive tape 25 is heated and softened when the second adhesive tape 25 is adhered to the back surface 11b of the wafer 11 (see FIG. 7). This makes it easier for the second adhesive tape 25 to deform to follow the shape of the surface to which the tape is to be adhered (the back surface 11b in this embodiment) of the wafer 11.

[0064] The second adhesive tape 25 is attached to the back surface 11b of the wafer 11 in the first wafer unit 21a supported by the wafer support portion 28 and to the back surface 23b of the second ring frame 23 (see FIG. 7).

[0065] The supply mechanism for the second ring frame 23 will now be described with reference to Figures 4 and 5. Figure 4 is a perspective view showing the ring frame accommodating section 32, the first ring frame transport unit 38, the ring frame support table 48, and the adhesive tape supply unit 50, and Figure 5 is a perspective view showing the ring frame accommodating section 32.

[0066] 5 shows one second ring frame 23 accommodated in the ring frame accommodating section 32, but the number of second ring frames 23 accommodated in the ring frame accommodating section 32 is not limited to one. The second ring frame 23 has the same shape, structure, and material as the first ring frame 19.

[0067] The ring frame accommodating section 32 is provided inside the base 4. The ring frame accommodating section 32 has a support table 34 that supports the second ring frame 23. A plurality of positioning pillars 36 are provided on the outer periphery of the support table 34. Each positioning pillar 36 protrudes from the upper surface of the support table 34.

[0068] The outer peripheral edge of the second ring frame 23 has cutouts, straight sections, and arc sections formed thereon, and each positioning pillar 36 is provided at a position corresponding to the cutout or straight section on the outer peripheral edge of the second ring frame 23.

[0069] The positioning posts 36 contact the outer periphery of the second ring frame 23 and uniquely determine the position, orientation, and front and back of the second ring frame 23. The second ring frame 23 has a front surface 23a and a back surface 23b, and in this embodiment, the second ring frame 23 is accommodated in the ring frame accommodating section 32 so that the back surface 23b faces upward.

[0070] The multiple second ring frames 23 stored in a stacked state in the ring frame storage section 32 are carried out one by one by the first ring frame transport unit 38. As shown in Fig. 4, the first ring frame transport unit 38 has a guide rail 42 whose longitudinal direction is aligned along the Y-axis direction.

[0071] A movable body 40 is slidably fixed to the guide rail 42. The movable body 40 has an arm 44 whose longitudinal direction is along the X-axis direction. The arm 44 can be raised and lowered by an actuator (not shown). A holding portion 46 is provided at the tip of the arm 44.

[0072] The holding unit 46 has a disk-shaped base. The base ends of a pair of arms are fixed to the outer periphery of the base, sandwiching the radial center of the base. A beam-shaped member is fixed to the tip of each arm, with its longitudinal portion perpendicular to the longitudinal direction of the arm. A plurality of suction pads are provided on the underside of the beam-shaped member to suction and hold the second ring frame 23 with negative pressure.

[0073] One end of the guide rail 42 is located near the ring frame accommodating portion 32 in the Y-axis direction, and the other end of the guide rail 42 is located near the ring frame support table 48 in the Y-axis direction.

[0074] The first ring frame transport unit 38 transports the second ring frame 23 held by the holder 46 from the ring frame storage section 32 to the ring frame support table 48. The ring frame support table 48 in this embodiment has a substantially flat rectangular upper surface that is substantially parallel to the XY plane.

[0075] An adhesive tape supply unit 50 is provided above the ring frame support table 48, which supplies the second adhesive tape 25 to the second ring frame 23. The adhesive tape supply unit 50 has a feed roll 52 on which a long feed tape 54 is wound around a core. The rotation of the feed roll 52 is controlled by a motor (not shown).

[0076] The path of travel of the supply tape 54 fed from the feed roll 52 is defined by a plurality of guide rollers 56 provided near the feed roll 52. The plurality of guide rollers 56 are arranged directly above the ring frame support table 48 so that the supply tape 54 is fed substantially parallel to the XY plane.

[0077] The supply tape 54 passes through a plurality of guide rollers 56 and is taken up by a take-up roll 58. The rotation of the take-up roll 58 is also controlled by a motor (not shown). The entire adhesive tape supply unit 50 is supported by an elevating mechanism (not shown) and can be raised and lowered above the ring frame support table 48.

[0078] The supply tape 54 has, for example, a base layer made of resin or the like and an adhesive layer formed on one surface of the base layer. The supply tape 54 is cut into a predetermined shape to form the second adhesive tape 25 (see FIG. 6(B)).

[0079] The adhesive tape supply unit 50 has a cutting mechanism 60 that cuts out the supply tape 54. The cutting mechanism 60 has a rotation shaft 62 that is arranged along the Z-axis direction. The base end of an arm 64 that extends horizontally is fixed to the lower end of the rotation shaft 62. A cutter 66 is provided at the tip of the arm 64 in a manner that protrudes downward.

[0080] The rotation axis 62 is positioned directly above the center of the second opening 23c in the second ring frame 23 supported by the ring frame support table 48. The arm portion 64 is longer than the radius of the second opening 23c.

[0081] The cutting mechanism 60 has a rotation drive source (not shown) such as a motor that rotates the rotation shaft 62. By operating the rotation drive source, the arm 64 and the cutter 66 are caused to rotate around the rotation shaft 62.

[0082] When the second adhesive tape 25 is applied from the adhesive tape supply unit 50 to the second ring frame 23, first, the adhesive tape supply unit 50 is lowered toward the second ring frame 23 supported by the ring frame support table 48. As a result, the supply tape 54 is applied to the rear surface 23b of the second ring frame 23 exposed upward.

[0083] Then, with the cutter 66 cutting into the supply tape 54, the cutter 66 is rotated around the rotation shaft 62. As a result, the supply tape 54 is cut into a circular shape, and a circular second adhesive tape 25 is provided on the back surface 23b of the second ring frame 23. In other words, the second adhesive tape 25 is part of the supply tape 54.

[0084] Note that a plurality of second adhesive tapes 25, each having a circular outer shape, may be provided discretely in the longitudinal direction of the supply tape 54. In this case, the second adhesive tapes 25 can be attached to the back surface 23b of the second ring frame 23 without using a cutter 66.

[0085] Furthermore, the adhesive tape supply unit 50 does not necessarily have to be located above the ring frame support table 48. The adhesive tape supply unit 50 can also be provided on a second support unit 72 (see FIG. 6(A) and the like) described later.

[0086] The transfer device 2 has a second ring frame transport unit 68. The second ring frame transport unit 68 transports the second ring frame 23 from the ring frame support table 48 to the second support unit 72.

[0087] The second ring frame transport unit 68 has a guide rail 70 whose longitudinal direction is aligned along the X-axis direction. A movable body (not shown) is slidably fixed to the guide rail 70. The movable body has an arm whose longitudinal direction is aligned along the Y-axis direction.

[0088] The arm can be raised and lowered by an actuator (not shown). A holding part having a plurality of suction pads that hold the second ring frame 23 by negative pressure is provided at the tip of the arm. The shape and structure of the holding part are substantially the same as the holding part 46 described above.

[0089] The second ring frame 23 with the second adhesive tape 25 attached, which is suction-held by the holding portion of the second ring frame transport unit 68 , is transported from the ring frame support table 48 to the second support unit 72 .

[0090] 6(A) is a perspective view showing the first support unit 26 and the second support unit 72. The second support unit 72 has a plurality of thin plate-shaped first claw portions 74. Each first claw portion 74 is a substantially triangular thin plate having an arc-shaped inner peripheral edge and two linear outer peripheral edges that are perpendicular to each other.

[0091] The inner peripheral edge of the first claw portion 74 is a quarter arc having a diameter equal to or greater than the inner peripheral diameter of the second ring frame 23. The multiple first claw portions 74 are arranged on a predetermined XY plane so that each arc-shaped inner peripheral edge is in contact with a disk area of ​​a predetermined diameter. The two linear sides of each first claw portion 74 are arranged approximately parallel to the X-axis direction or the Y-axis direction.

[0092] A gap is provided between adjacent first claws 74. As will be described later, second claws 102 (see FIG. 8) of the holding unit 90 are inserted into the gaps between the first claws 74.

[0093] The second support unit 72 includes a slide mechanism (not shown) that slides each of the first claws 74 along the radial direction of a disk area having a predetermined diameter. The slide mechanism is composed of a moving mechanism such as a ball screw, an expanding and contracting mechanism such as an air cylinder, etc. In Fig. 6(A), the arrows indicate how the first claws 74 slide.

[0094] Each of the first claws 74 is moved between an inner position and an outer position by a slide mechanism. When each of the first claws 74 is in the outer position, the slide mechanism prevents interference between each of the first claws 74 and the first wafer unit 21a and the holder 22 being transported to the first support unit 26.

[0095] When each first claw portion 74 is in the inner position, the inner peripheral edge of the first claw portion 74 is located between the first opening 19c and the outer peripheral edge of the first ring frame 19. As a result, the inner peripheral edge of the first claw portion 74 is hidden by the first ring frame 19 and the second ring frame 23, so that the first adhesive tape 17 or the second adhesive tape 25 can be prevented from adhering to the first claw portion 74.

[0096] However, when each first claw portion 74 is in the inner position, the inner peripheral edge of the first claw portion 74 may be located between the first opening 19c and the outer peripheral edge of the wafer 11. In this case, the first claw portion 74 prevents contact between the first adhesive tape 17 and the second adhesive tape 25 when the second adhesive tape 25 is adhered to the wafer 11.

[0097] However, since there is a possibility that the first adhesive tape 17 or the second adhesive tape 25 may come into contact with the first claw portion 74, it is preferable to apply a treatment to the surface of the first claw portion 74 to make it non-adhesive (for example, a fluororesin coating such as PTFE) so that the adhesive layers of the first adhesive tape 17 and the second adhesive tape 25 are less likely to adhere.

[0098] Next, with reference to Figures 6(A) to 6(C) and 7, a description will be given of how to use the second support unit 72. First, each of the first claws 74 is moved to its inner position (see Figure 6(A)). Then, the second ring frame 23 with the second adhesive tape 25 is placed on the first claws 74 positioned at their inner positions (see Figure 6(B)).

[0099] Fig. 6(B) is a perspective view showing how the second ring frame 23 with the second adhesive tape 25 and the like are placed on the second support unit 72. In Fig. 6(B), the second opening 23c of the second ring frame 23 is indicated by a dashed line.

[0100] As shown in Figure 6(B), the second ring frame 23 with the second adhesive tape 25 is transported to a predetermined position of the first claw portion 74 so that the centers of the circular area surrounded by the first claw portion 74 and the second opening 23c coincide with each other on the XY plane.

[0101] Furthermore, the first wafer unit 21a is placed on the first support unit 26. In this state, the wafer support portion 28 and the ring frame support portion 30 are each raised (see FIG. 6(C)).

[0102] Figure 6(C) is an oblique view showing how the wafer support part 28 and the ring frame support part 30 are raised to adhere the second adhesive tape 25 to the back surface 11b of the wafer 11, and Figure 7 is a partially cross-sectional side view showing how the second adhesive tape 25 is adhered to the back surface 11b of the wafer 11.

[0103] 7, when the second adhesive tape 25 is attached, the first claw portion 74 is sandwiched between the first ring frame 19 and the second ring frame 23, and the distance between the first ring frame 19 and the second ring frame 23 is equal to the thickness of the first claw portion 74. In other words, the first claw portion 74 functions as a spacer that maintains the distance between them.

[0104] 7, when the second adhesive tape 25 is attached, it is preferable to raise the wafer support portion 28 so that the upper surface of the wafer support portion 28 is higher than the upper surface of the ring frame support portion 30. For example, the height of the upper surface of the wafer support portion 28 is controlled so that the back surface 11b of the wafer 11 is higher than the front surface 19a of the first ring frame 19.

[0105] Here, if the wafer support part 28 is equipped with a heating mechanism, it is preferable to operate the heating mechanism to heat the wafer 11 to a predetermined temperature. When the second adhesive tape 25 comes into contact with the back surface 11b of the heated wafer 11, the second adhesive tape 25 also softens due to the heat and becomes more likely to deform.

[0106] For example, if an uneven shape is formed on the back surface 11b of the wafer 11, softening the second adhesive tape 25 makes it easier for the second adhesive tape 25 to conform to the uneven shape of the back surface 11b. This increases the contact area between the second adhesive tape 25 and the back surface 11b, allowing the second adhesive tape 25 to be more firmly fixed to the back surface 11b.

[0107] A tape application unit 76 that applies the second adhesive tape 25 to the back surface 11b of the wafer 11 is provided near the second support unit 72. The tape application unit 76 has a roller 78 that rolls on the second adhesive tape 25 and presses the second adhesive tape 25 downward. The longitudinal direction of the roller 78 is approximately parallel to the X-axis direction.

[0108] The rollers 78 can move up and down along the Z-axis direction and can move along the Y-axis direction while rotating. The length of the rollers 78 in the longitudinal direction is, for example, smaller than the diameter of the second opening 23c of the second ring frame 23 and equal to or larger than the diameter of the wafer 11, and therefore the rollers 78 can move within the second opening 23c.

[0109] 7, the tape application unit 76 lowers the roller 78 into the second opening 23c of the second ring frame 23 and presses the second adhesive tape 25 from above, thereby applying the second adhesive tape 25 to one end of the back surface 11b of the wafer 11. Thereafter, the roller 78 is moved on a horizontal plane to apply the second adhesive tape 25 to substantially the entire back surface 11b.

[0110] At this time, the first claws 74 maintain a predetermined distance between the first ring frame 19 and the second ring frame 23. In addition, the wafer support parts 28 are positioned higher than the ring frame support parts 30.

[0111] This allows the distance between the second adhesive tape 25 and the first ring frame 19 and the first adhesive tape 17 to be greater than when the first claw portion 74 is not present, and also allows the wafer 11 to be brought closer to the second adhesive tape 25.

[0112] Therefore, even if the second adhesive tape 25 sags between the outer peripheral edge of the wafer 11 and the inner peripheral edge of the second ring frame 23, the second adhesive tape 25 is less likely to come into contact with the first ring frame 19 and the first adhesive tape 17.

[0113] If the second adhesive tape 25 comes into contact with and adheres to the first ring frame 19 and the first adhesive tape 17, it will be necessary to peel off the second adhesive tape 25. At this time, a load will be applied to the wafer 11, etc., which may cause damage to the wafer 11 or unnecessary stretching of the second adhesive tape 25.

[0114] In particular, when the adhesive layers of the first adhesive tape 17 and the second adhesive tape 25 come into contact with each other, they adhere to each other with an extremely large force. When the two tapes are peeled apart, a considerable amount of force is applied to each element, which can cause damage, deformation, stretching, etc. to the components, making it impossible to form the second wafer unit 21b in the desired state.

[0115] Such problems can be prevented by using the first claw portion 74 as a separator to ensure the distance between the first ring frame 19 and the second ring frame 23 and by raising the wafer support portion 28 relative to the ring frame support portion 30.

[0116] For example, if the diameter of the wafer 11 is 6 inches (approximately 150 mm), the inner diameter of the first opening 19c is 194 mm, and the thickness of the first ring frame 19 and the second ring frame 23 is 1.2 mm, the thickness of the first claw portion 74 should be 2.0 mm. The length of the roller 78 should be 156 mm.

[0117] If the thickness of the first claw portion 74 is greater than the thickness of the first ring frame 19 and the second ring frame 23, the ring frames can be separated by a sufficient distance, preventing the adhesive tapes from coming into contact with each other.

[0118] However, in Fig. 7, for the sake of convenience, the thickness of the first claw portion 74 is drawn to be thinner than the thickness of the first ring frame 19 and the second ring frame 23. In other words, the thickness of each component is not limited to the ratio shown in Fig. 7.

[0119] When the second adhesive tape 25 is attached to the back surface 11b of the wafer 11, a combined body 21c is formed in which the first ring frame 19, the first adhesive tape 17, the second ring frame 23, the second adhesive tape 25 and the wafer 11 are integrated.

[0120] 2, the transfer device 2 includes a combined body transport mechanism 80 that holds a combined body 21c including a wafer 11. The combined body transport mechanism 80 has a support part 82 whose longitudinal direction is aligned along the Y-axis direction. A guide rail 84 whose longitudinal direction is aligned along the Y-axis direction is provided on one surface of the support part 82.

[0121] One end of the guide rail 84 is located near the second support unit 72 in the Y-axis direction. The other end of the guide rail 84 is located near the peeling unit 108 in the Y-axis direction.

[0122] 8 is a perspective view showing the combined body transport mechanism 80 and the peeling unit 108. As shown in Fig. 8, the base end of an arm 86 extending along the X-axis direction is slidably fixed to the guide rail 84. An elevating unit 88 is fixed to the tip of the arm 86 so as to hang down from the tip of the arm 86.

[0123] The lifting unit 88 has, for example, an air cylinder. A holding unit 90 is fixed to the lower end of the lifting unit 88, and the lifting unit 88 raises and lowers the holding unit 90. The holding unit 90 holds the combined body 21c located on the second support unit 72.

[0124] The holding unit 90 has a disk-shaped suction holding portion 92 that holds the combined body 21c by suction from above. The suction holding portion 92 has a substantially flat lower surface. A suction port (not shown) is formed in the lower surface of the suction holding portion 92. Negative pressure is transmitted to the suction port from a vacuum device (not shown) such as a vacuum pump.

[0125] The suction-holding unit 92 suction-holds the combined body 21c via the second adhesive tape 25. The suction-holding unit 92 may have a built-in heating mechanism (heater) such as an electric heating wire. The heating mechanism may be used to heat the wafer 11 held by the suction-holding unit 92 to a predetermined temperature within a range of 30°C to 80°C.

[0126] A plurality of (four in this embodiment) second claws 102, each of which holds a second ring frame 23, are provided at approximately equal intervals along the circumferential direction of the suction-holding part 92 on the outer periphery of the suction-holding part 92. In addition, two third claws 106 and two third claws 106 are provided on the outer periphery of the suction-holding part 92 so as to sandwich the lifting unit 88 therebetween in the XY plane.

[0127] 9(A) is a partial cross-sectional side view, taken along the XZ or YZ plane, showing the combined body 21c held by the holding unit 90. Figures 9(A) and 9(B) correspond to the holding step S10 in which the combined body 21c including the wafer 11 is held by the holding unit 90 (see Figure 18).

[0128] Figure 9(B) is a partial cross-sectional side view showing the combined body 21c held by the holding unit 90, and is a partial cross-sectional side view on a predetermined plane formed by a predetermined direction that is 45 degrees with respect to the positive directions of the X-axis direction and the Y-axis direction, and the Z-axis direction.

[0129] 9(A), the holding unit 90 includes a second claw moving unit 94 that moves the second claw 102 radially in the XY plane. The second claw moving unit 94 includes, for example, an extension / contraction unit 98 having an air cylinder or the like, and a moving body 100 connected to the tip of the extension / contraction unit 98.

[0130] The base end of the second claw portion 102 is fixed to the movable body 100. When the extension / contraction portion 98 is operated, the second claw portion 102 moves along the radial direction of the holding unit 90. In this embodiment, the shape of the second claw portion 102 is hook-shaped. The tip portion of the second claw portion 102 has a thickness and shape that allows it to fit between the first ring frame 19 and the second ring frame 23.

[0131] When the second claw moving part 94 is activated and the tip of the second claw part 102 enters between the first ring frame 19 and the second ring frame 23, the second claw part 102 comes into contact with the surface 23a of the second ring frame 23 and holds the second ring frame 23 located at the top of the combined body 21c from below.

[0132] In addition, when the second ring frame 23 is supported by the above-mentioned first claw portions 74, the holding unit 90 can insert the second claw portions 102 into the gaps between adjacent first claw portions 74.

[0133] 9(B), the holding unit 90 has a third claw opening / closing part 96 for opening and closing the third claw part 106. The third claw opening / closing part 96 has a shaft part 104 for rotating the upper end part of the third claw part 106.

[0134] The third claw opening / closing unit 96 includes a rotary drive source (not shown) such as a motor, and transmits the power of the rotary drive source to the shaft 104 to rotate the third claw 106 around the shaft 104. When the third claw opening / closing unit 96 is operated to close the third claw 106, the lower end of the third claw 106 wraps around below the first ring frame 19.

[0135] As a result, the third claw portion 106 supports the first ring frame 19 located at the bottom of the combined body 21c from below. When the third claw portion opening / closing unit 96 is operated to open the third claw portion 106, the third claw portion 106 moves away from the first ring frame 19.

[0136] When transporting the combined body 21c including the first ring frame 19 etc. while held by the holding unit 90, first, the holding unit 90 is moved above the first claw portion 74, and the combined body 21c supported by the first claw portion 74 is brought into contact with the holding unit 90.

[0137] At this time, the holding unit 90 activates the extension / contraction part 98 to move the second claw part 102 outward, and also activates the third claw part opening / closing part 96 to keep the third claw part 106 open so that the third claw part 106 does not interfere with the first claw part 74.

[0138] Then, the suction holding unit 92 is operated to hold the wafer 11 by suction via the second adhesive tape 25, and the second claws 102 are inserted into the gap between the first ring frame 19 and the second ring frame 23. At this time, the second claws 102 enter between the adjacent first claws 74.

[0139] Next, the first claws 74 are moved to the outer position to release the support of the second ring frame 23 by the first claws 74. As a result, the combined body 21c is sucked by the suction holding portion 92 and supported by the multiple second claws 102 (see FIG. 9(A)).

[0140] Thereafter, the holding unit 90 is moved along the guide rail 84 to transport the combined body 21c to the position of the peeling unit 108. During this transport process, the third claw portion 106 is closed, and the third claw portion 106 supports the first ring frame 19 from below (see FIG. 9(B)).

[0141] In this way, the combined body 21c including the wafer 11 is held by the holding unit 90 with the first adhesive tape 17 exposed downward (holding step S10 in FIG. 18). Next, the peeling unit 108 will be described with reference to FIGS. 8 and 10.

[0142] The peeling unit 108 peels the first adhesive tape 17 from the wafer 11 and the first ring frame 19 held by the holding unit 90. The peeling unit 108 has a supply unit 112 that supplies a release sheet 110.

[0143] The release sheet 110 is a strip-shaped adhesive tape having a base material and an adhesive layer provided on one side of the base material. The surface of the release sheet 110 on which the adhesive layer is exposed is the adhesive surface 110a of the release sheet 110 (see FIG. 10).

[0144] The supply unit 112 has a delivery roller 114 that is configured to be rotatable by a rotary drive source (not shown) such as a motor. The release sheet 110 is wound around the delivery roller 114 in a roll.

[0145] A plurality of rollers 116 (i.e., rollers 116a, 116b, ... 116e) are provided on the movement path of the release sheet 110 delivered from the delivery roller 114, guiding the release sheet 110 and forming a path of travel for the release sheet 110. The plurality of rollers 116 are each provided so that their longitudinal direction is along the Y-axis direction.

[0146] One end of the peeling sheet 110 is held by a collection roller 120 of a collection unit 118. After passing through a plurality of rollers 116, the peeling sheet 110 is finally taken up by the collection roller 120 of the collection unit 118. The collection roller 120 is configured to be rotatable by a rotation drive source (not shown) such as a motor.

[0147] By rotating the delivery roller 114 and the collection roller 120 at approximately the same speed using each rotation drive source, the release sheet 110 flows between the delivery roller 114 and the collection roller 120. In this embodiment, the spatial positions of the supply unit 112 and the collection unit 118 relative to the base 4 are fixed.

[0148] The peeling unit 108 has an upright plate 122 with one surface extending along the XZ plane. The upright plate 122 includes a first rectangular region 122a that protrudes downward, and a second rectangular region 122b and a third rectangular region 122c that protrude upward (see FIG. 10). The second rectangular region 122b and the third rectangular region 122c are spaced apart in the X-axis direction.

[0149] In the first rectangular region 122a, a roller 116b is provided so as to protrude from one surface of the upright plate 122. A roller 116a is provided between this roller 116b and the feed roller 114. Although the roller 116a is not fixed to the upright plate 122, its spatial position relative to the base 4 is fixed.

[0150] The second rectangular area 122b is provided with a roller 116c protruding from one surface of the upright plate 122, and the third rectangular area 122c is provided with a roller 116c protruding from one surface of the upright plate 122.

[0151] The upright plate 122 is fixed to a flat movable plate 124 having one surface aligned along the XY plane. The rollers 116a and 116b are positioned below the movable plate 124, and the rollers 116c and 116d are positioned above the movable plate 124.

[0152] The movable plate 124 is provided with a pair of connecting portions 126 that protrude from the upper surface of the movable plate 124. Each connecting portion 126 is provided with two through holes at different positions in the Z-axis direction, and the above-mentioned roller 116e is rotatably attached to the lower through hole.

[0153] On the other hand, a peeling roller 128 is rotatably attached to the upper through-hole of each connecting portion 126. The peeling roller 128 is a roller provided separately from the delivery roller 114 of the supply unit 112 and the collection roller 120 of the collection unit 118.

[0154] Like roller 116e, peeling roller 128 also rotates about a shaft center 128a (see FIG. 8) that is disposed along the Y-axis direction (a direction intersecting the predetermined direction). As shown in FIG. 8, a base end of a rotation shaft 128b that extends along the Y-axis direction is fixed to one end of peeling roller 128.

[0155] 8, a pinion (i.e., a disk portion) 128c, which is a circular gear, is fixed to the tip of the rotating shaft 128b. When the pinion 128c rotates, the rotating shaft 128b and the peeling roller 128 also rotate together.

[0156] A wall 130 is provided at the end of the moving plate 124 in the Y-axis direction, supporting the moving plate 124 so that the moving plate 124 can slide along the X-axis direction. A moving unit 132 is provided on one surface 130a of the wall 130.

[0157] The moving unit 132 is provided with a guide rail 134 whose longitudinal portion is along the X-axis direction. A moving block 124a fixed to the lower surface of the moving plate 124 is slidably fixed to the guide rail 134.

[0158] The moving unit 132 is, for example, a ball screw having a screw shaft, a rotation drive source such as a servo motor or a stepping motor provided at one end of the screw shaft, and a nut portion to which the screw shaft is rotatably coupled. In this case, the nut portion is provided on the moving block 124a.

[0159] The moving unit 132 may be a linear motor including a stator and a mover. In this case, the stator has a plurality of north pole magnets and a plurality of south pole magnets arranged alternately along the Y-axis direction, and the moving block 124a is provided with a mover having a coil through which a current flows.

[0160] In either case, the moving unit 132 slides the moving plate 124 along the X-axis direction via the moving block 124a. Note that the moving unit 132 is shown in simplified form in FIG.

[0161] A rack (i.e., receiving portion) 136 having an upper surface extending along the X-axis direction (predetermined direction) is provided on one surface 130a of the wall portion 130 above the moving unit 132. The rack 136 is a square bar-shaped member, and teeth for receiving the pinion 128c so as to mesh with the pinion 128c are provided on the upper surface of the rack 136.

[0162] When peeling the first adhesive tape 17 from the wafer 11, the holding unit 90 holding the combined body 21c and the peeling roller 128 are moved relative to each other. At this time, the pinion 128c rolls on the upper surface of the rack 136 without slipping, so that the peeling roller 128 can rotate in synchronization with the relative movement of the peeling roller 128 and the holding unit 90.

[0163] 10, a seat fixing unit 138 is provided on the upper surface of the moving plate 124 so as to protrude from the upper surface. The seat fixing unit 138 has a moving block 138a made of metal or rubber.

[0164] The moving block 138a is configured to be able to move up and down along the Z-axis direction by an elevating mechanism 138b. The elevating mechanism 138b is, for example, an air cylinder or an electric actuator, but is not particularly limited as long as it can move the moving block 138a linearly along the Z-axis direction.

[0165] The moving block 138a is located between the rollers 116c and 116d in the X-axis direction, and between the base end and tip end of the rollers 116c and 116d in the Y-axis direction (see FIG. 8).

[0166] When supplying the release sheet 110 to the area facing the exposed surface of the first adhesive tape 17 and fixing a portion of the release sheet 110 to the first adhesive tape 17, first, the holding unit 90 holding the combined body 21c is made stationary above the moving plate 124.

[0167] Furthermore, with the release sheet 110 positioned above the movable block 138a and below the first adhesive tape 17 (see Figure 10), the lifting mechanism 138b is operated to raise the movable block 138a, thereby pressing the adhesive surface 110a of the release sheet 110 against the base layer of the first adhesive tape 17 (see Figure 11).

[0168] This fixes a portion of the release sheet 110 to the first adhesive tape 17 (fixing step S20 in FIG. 18). The portion of the release sheet 110 fixed to the first adhesive tape 17 (i.e., the fixed position) serves as the starting point for peeling off the first adhesive tape 17. In this specification, this portion of the release sheet 110 is referred to as the second position 110c of the release sheet 110 (see FIGS. 11 to 13).

[0169] An imaging unit 140 is provided on the movable plate 124 in a manner that protrudes from the upper surface of the movable plate 124. The imaging unit 140 has an imaging section 140a that includes a housing that houses a lens, a solid-state imaging element, etc. (neither of which are shown).

[0170] The imaging unit 140a is fixed at a predetermined height by legs 140b. The imaging unit 140a and legs 140b are provided on the opposite side of the pinion 128c in the Y-axis direction, with the peeling roller 128 sandwiched between them. The imaging unit 140a captures an image of the release sheet 110 using visible light from the side of the release sheet 110 in the width direction of the release sheet 110.

[0171] The imaging unit 140 of this embodiment uses visible light to capture an image of the area of ​​the peeling sheet 110 between a first position 110b (see Figure 12) that is in contact with the peeling roller 128 and a second position 110c (see Figures 11 to 13) that is fixed to the first adhesive tape 17.

[0172] The image obtained by imaging the release sheet 110 with the imaging unit 140a is subjected to image processing by a controller, which will be described later. For example, the controller performs binarization processing on the obtained image, and then calculates the length of the curve corresponding to the release sheet 110, thereby calculating, for example, the length of the release sheet 110 that is loose.

[0173] In this way, the controller measures the length of slack in the release sheet 110 using the imaging unit 140, which helps to eliminate excessive slack in the release sheet 110, as will be described later.

[0174] 8 and the like is an example, and the imaging unit 140a may be provided between the peeling roller 128 and the collection unit 118 in the X-axis direction. In this case, the imaging unit 140 may be fixed to the moving plate 124, or may be fixed to the base 4 without being fixed to the moving plate 124.

[0175] In either case, the imaging unit 140 images the slack area of ​​the release sheet 110 between the first position 110b and the second position 110c in the direction from the recovery unit 118 to the pair of connecting portions 126 (i.e., from a front or rear view rather than a side view).

[0176] Next, with reference to Figures 10 to 15 and 18, a procedure for fixing a portion of the release sheet 110 to the wafer 11 of the combined body 21c and then peeling the first adhesive tape 17 from the wafer 11 will be described. For ease of explanation, both the second claw portion 102 and the third claw portion 106 are shown in Figures 10 to 15.

[0177] First, the moving plate 124 is placed below the holding unit 90 that holds the combined body 21c. Figure 10 is a partial cross-sectional side view showing the moving plate 124 positioned directly below the holding unit 90. At this time, the peeling sheet 110 is spread between the supply unit 112 and the collection unit 118.

[0178] Next, the lifting mechanism 138b is operated to raise the moving block 138a, thereby pressing the adhesive surface 110a of the release sheet 110 against the base layer of the first adhesive tape 17. This causes a portion of the release sheet 110 to be attached and fixed to the first adhesive tape 17 (fixing step S20 in FIG. 18). FIG. 11 is a partial cross-sectional side view showing the fixing step S20.

[0179] With a portion of the release sheet 110 fixed to the first adhesive tape 17 in this manner, the moving unit 132 is operated to move the moving plate 124 relative to the holding unit 90 along the X-axis direction at a predetermined speed, and the feed roller 114 and the recovery roller 120 begin to rotate.

[0180] 12 is a partial cross-sectional side view showing the start stage of the peeling step S30 (see FIG. 18). As the movable plate 124 moves, the pair of connecting parts 126 and peeling roller 128 fixed to the movable plate 124 also move relative to the holding unit 90 along the X-axis direction (predetermined direction) (see the leftward arrow in FIG. 12).

[0181] However, in this embodiment, the peeling roller 128 rotates in response to the movement of the moving plate 124 due to the action of the pinion 128c and the rack 136. In particular, the peeling roller 128 rotates in a direction (see the counterclockwise arrow in FIG. 12) that sends the peeling sheet 110 to the collection unit 118.

[0182] At the start of the peeling process S30, slack 110d may occur between the first position 110b and the second position 110c of the peeling sheet 110 depending on the movement speed of the moving plate 124, the rotation speed of the feed roller 114 and the recovery roller 120, the tension of the peeling sheet 110 between the rollers 116a, 116b...116e, etc.

[0183] However, in this embodiment, the peeling roller 128 automatically rotates in response to the relative movement of the holding unit 90 and the peeling roller 128 along the X-axis direction. This reduces slack 110d in the release sheet 110 between the first position 110b in contact with the peeling roller 128 and the second position 110c fixed to the first adhesive tape 17.

[0184] 13 is a partial cross-sectional side view showing how slack 110d is reduced in the peeling step S30 of the release sheet 110. In this embodiment, even if slack 110d occurs near the second position 110c, the rotation of the peeling roller 128 can quickly reduce the slack 110d.

[0185] Therefore, compared to when the slack 110d of the release sheet 110 is eliminated using only the supply unit 112 and the collection unit 118, the slack 110d of the release sheet 110 near the second position 110c can be eliminated more efficiently. For example, the slack 110d can be almost eliminated. In this way, the tension of the release sheet 110 between the first position 110b and the second position 110c can be adjusted.

[0186] When the moving plate 124 is further moved, the pinion 128c and the rack 136 act to automatically rotate the peeling roller 128 in accordance with the relative movement of the holding unit 90 and the peeling roller 128 along the X-axis direction.

[0187] After the second position 110c of the release sheet 110, which is fixed to the first adhesive tape 17, passes over the end of the first adhesive tape 17 in the X-axis direction, the first adhesive tape 17 is completely peeled off from the wafer 11.

[0188] 14 is a partial cross-sectional side view showing the final stage of the peeling step S30. As shown in FIG. 14, by winding up the release sheet 110 around the recovery roller 120, the first adhesive tape 17 peeled off from the wafer 11 is finally recovered in the recovery unit 118.

[0189] When the first adhesive tape 17 is peeled off, a second wafer unit 21b is formed, which includes the wafer 11, the second adhesive tape 25, and the second ring frame 23. That is, the transfer of the wafer 11 from the first adhesive tape 17 to the second adhesive tape 25 is completed.

[0190] If the holding unit 90 is equipped with a heating mechanism, the heating mechanism may be operated to heat the wafer 11 to a predetermined temperature when peeling the first adhesive tape 17 from the wafer 11. The first adhesive tape 17 is softened by heating, which makes it easier to peel the first adhesive tape 17 from the wafer 11.

[0191] After the first adhesive tape 17 is peeled off from the wafer 11, the first ring frame 19 is moved from the holding unit 90 to directly above the collection container 142 (see FIG. 15). At this time, the first ring frame 19 from which the first adhesive tape 17 has been peeled off is supported by the third claw portions 106.

[0192] 15 is a partial cross-sectional side view showing how the first ring frame 19 is collected. The collection container 142 is provided, for example, directly below the holding unit 90. The collection container 142 has an opening that is larger than the diameter of the first ring frame 19.

[0193] When recovering the first ring frame 19, first, the moving plate 124 of the peeling unit 108 is retracted from the area below the holding unit 90. Then, while the holding unit 90 continues to hold the wafer 11 and the second ring frame 23, the third claw opening / closing part 96 is actuated to release the first ring frame 19 from the third claw part 106.

[0194] As a result, the first ring frame 19 falls into the collection container 142. The first ring frames 19 from which the first adhesive tape 17 has been peeled off are collected one after another into the collection container 142. The collected first ring frames 19 are carried out of the transfer device 2, and are reused after undergoing a predetermined cleaning process.

[0195] After the first ring frame 19 and the first adhesive tape 17 are separated from the wafer 11, the second wafer unit 21b is cleaned in a cleaning unit 186 (see FIG. 16) before being carried out of the transfer device 2. FIG. 16 is a perspective view of the cleaning unit 186 and the like.

[0196] To perform cleaning, first, the inversion unit 150 receives the second wafer unit 21b from the holding unit 90 and inverts the second wafer unit 21b upside down. The inversion unit 150 has guide rails 152 along the X-axis direction.

[0197] A moving block 154 is fixed to the guide rail 152 so as to be slidable along the X-axis direction. A rotating arm 156 is provided on the moving block 154 so that its longitudinal direction is along the Y-axis direction.

[0198] The base end of the rotating arm 156 is connected to the moving block 154 so that it can move up and down and rotate. A holding part 158, which is substantially the same as the above-mentioned holding parts 22 and 46, is fixed to the tip end of the rotating arm 156. By rotating the rotating arm 156, the orientation of the holding part 158 ​​can be changed.

[0199] When the second wafer unit 21b is turned upside down by the inversion unit 150, first, the holding portion 158 with its suction pads facing upward is moved below the holding unit 90. Next, the holding portion 158 is raised, and the surface 23a of the second ring frame 23 is held by suction with the suction pads of the holding portion 158.

[0200] Thereafter, the suction holding of the wafer 11 by the suction holding portion 92 of the holding unit 90 is released, and the second claw moving portion 94 is operated to release the support of the second ring frame 23 by the second claw portion 102.

[0201] Thereafter, the moving block 154 is moved in the X-axis direction and the rotating arm 156 is rotated 180° (i.e., turned upside down), so that the front surface 23a of the second ring frame 23 faces upward and the back surface 23b faces downward.

[0202] Then, the holder 158 is moved onto the rectangular plate-shaped delivery table 160, and then the suction hold of the second ring frame 23 by the holder 158 is released. As a result, the second wafer unit 21b is placed on the delivery table 160.

[0203] The second wafer unit 21b placed on the delivery table 160 is further transported by a second wafer unit transport unit 162. The second wafer unit transport unit 162 has a wall-shaped support portion 164.

[0204] A guide rail 166 is provided on one surface of the support portion 164 so that its longitudinal direction is along the X-axis direction. A moving block 168 is fixed to the guide rail 166 so as to be slidable along the X-axis direction.

[0205] The second wafer unit transport unit 162 has a drive mechanism (not shown) such as a ball screw or a linear motor, and the moving block 168 is configured to be movable along the X-axis direction by this drive mechanism.

[0206] The base end of an arm 170 is fixed to the moving block 168 so that its longitudinal direction is along the Y-axis direction. An actuator 172 having a moving body that is movable along the Z-axis direction is provided at the tip of the arm 170. The actuator is, for example, an air cylinder having a rod that is movable along the Z-axis direction.

[0207] A holding portion 174, which is substantially the same as the above-mentioned holding portions 22, 46, and 158, is fixed to the lower end of the moving body of the actuator 172. The holding portion 174 is provided so that the opening of its suction pad faces downward.

[0208] A pair of guide rail tables 176 are provided below the holding portion 174. The pair of guide rail tables 176 are moved toward or away from each other along the Y-axis direction by a motor and an actuator (not shown).

[0209] Each of the pair of guide rail tables 176 has a semicircular opening, and when the pair of guide rail tables 176 are brought close to each other, a single circular through opening 178 is formed. The diameter of this through opening 178 is larger than the diameter of the wafer 11.

[0210] A second ultraviolet irradiation unit 180 that irradiates ultraviolet rays from below upward through a through opening 178 is provided below the pair of guide rail tables 176. Figure 17 is a perspective view showing the guide rail table 176, the second ultraviolet irradiation unit 180, and the cleaning unit 186 separated from each other.

[0211] 17, the second ultraviolet irradiation unit 180 has a guide rail 182 whose longitudinal direction is along the Y-axis direction. A UV (ultraviolet) light source section 184 is fixed to the guide rail 182 so as to be slidable along the Y-axis direction.

[0212] The UV light source unit 184 has a support whose longitudinal direction is along the X-axis direction. A plurality of UV light sources are fixed to the support at approximately equal intervals along the X-axis direction. The UV light sources are, for example, LEDs (Light Emitting Diodes) that emit UV light. The plurality of UV light sources are provided discretely along the X-axis direction, and each emits UV light upward.

[0213] The second ultraviolet irradiation unit 180 has a drive mechanism (not shown) such as a ball screw or a linear motor, and the UV light source part 184 is configured to be movable along the Y-axis direction by this drive mechanism. Below the second ultraviolet irradiation unit 180, a cleaning unit 186 is provided.

[0214] The cleaning unit 186 has a housing 188 that defines a cleaning chamber. The housing 188 is a box with a bottom. In this embodiment, the entire top surface of the housing 188 is open, but the housing 188 may have a roof that can be opened and closed on the top surface.

[0215] A spinner table 190 is provided on the floor of the housing 188. The spinner table 190 is rotatable around a rotation axis along the Z-axis direction. A cleaning arm 192 is provided near the spinner table 190 and is capable of supplying liquid such as pure water to the spinner table 190 from above the spinner table 190.

[0216] The cleaning arm 192 includes a shaft portion along the Z-axis direction and a cantilever portion extending along the XY plane at the upper end of the shaft portion. A nozzle (not shown) is provided at the tip of the cantilever portion to spray gas, liquid, or a gas-liquid mixture fluid downward.

[0217] A gas supply source, a liquid supply source, etc. (not shown) are connected to the shaft of the cleaning arm 192. The gas, liquid, or gas-liquid mixture fluid supplied to the shaft is supplied to the nozzle via the cantilever. In addition, a swing mechanism (not shown) including a motor is connected to the shaft, and the swing mechanism swings the cantilever within a predetermined angle range in the XY plane.

[0218] When the second wafer unit 21b temporarily placed on the delivery table 160 is to be cleaned, the second wafer unit 21b is held by the holder 174 and moved above the guide rail table 176.

[0219] Next, the holder 174 is lowered between a pair of guide rail tables 176 that are spaced apart so that the second wafer unit 21b can pass through, and the second wafer unit 21b is placed on the spinner table 190. Then, after the holder 174 is released from its hold, the spinner table 190 holds the second wafer unit 21b.

[0220] Next, while the spinner table 190 is rotated and the cleaning arm 192 is oscillated, a liquid or a gas-liquid mixture fluid is sprayed onto the second wafer unit 21b from the nozzle of the cleaning arm 192. This cleans the surface 11a of the wafer 11, the surface 23a of the second ring frame 23, etc. (cleaning process).

[0221] After cleaning, the second wafer unit 21b is dried (drying step) by stopping the spraying of the liquid from the nozzle and continuing the rotation of the spinner table 190. Thereafter, the stationary second wafer unit 21b is held again by the holder 174, and the hold of the second wafer unit 21b by the spinner table 190 is released.

[0222] Next, the holder 174 is raised to lift the second wafer unit 21b, and the second wafer unit 21b is placed on the pair of guide rail tables 176. Thereafter, the holder 174 is released from holding the second wafer unit 21b.

[0223] Next, the second adhesive tape 25 is irradiated with UV from the second ultraviolet irradiation unit 180, thereby reducing the adhesive strength of the adhesive layer of the second adhesive tape 25 (UV irradiation step). By reducing the adhesive strength, it becomes easier to peel the wafer 11 from the second adhesive tape 25. For example, if the wafer 11 is divided into multiple device chips, it becomes easier to pick up the device chips.

[0224] After UV irradiation, the second wafer unit 21b placed on the pair of guide rail tables 176 is pushed out by the push-pull arm 194 and stored in the cassette 8b placed on the cassette table 6b. The push-pull arm 194 is similar to the push-pull arm 10, so a detailed description will be omitted.

[0225] The transfer device 2 has a controller (not shown) that controls the operation of each of the above-mentioned components. The controller is configured by, for example, a computer including a processor represented by a CPU (Central Processing Unit) and a memory.

[0226] The memory includes a main storage device such as a dynamic random access memory (DRAM) and an auxiliary storage device such as a flash memory. The auxiliary storage device stores software including predetermined programs.

[0227] The functions of the controller are realized by operating a processor etc. in accordance with this software. The predetermined program includes a program that performs image processing on the image obtained by the imaging unit 140 capturing an image of the release sheet 110, and calculates the length based on the image or data on the image.

[0228] 18 is a flowchart showing a peeling method for peeling the first adhesive tape 17 from the combined body 21c using the transfer device 2. The peeling method includes a holding step S10, a fixing step S20, and a peeling step S30, which are carried out in this order.

[0229] In the holding step S10, as shown in Figures 9(A) and 9(B), the combined body 21c including the wafer 11 is held by a holding unit 90. At this time, the first adhesive tape 17 is exposed downward. After the holding step S10, a fixing step S20 is performed.

[0230] In the fixing step S20, as shown in FIG. 11, the moving block 138a of the sheet fixing unit 138 is disposed below one end of the first adhesive tape 17 in the X-axis direction so as to sandwich the release sheet 110 therebetween.

[0231] At this time, one surface of the base layer of the first adhesive tape 17 is exposed downward, and the adhesive surface 110a of the release sheet 110 is exposed upward. By pressing the release sheet 110 from below upward with the moving block 138a, a part of the adhesive surface 110a of the release sheet 110 is fixed to the base layer of the first adhesive tape 17.

[0232] The part of the release sheet 110 fixed to the first adhesive tape 17 (ie, the second position 110c) serves as a starting point for peeling off the first adhesive tape 17. After the fixing step S20, the peeling step S30 is carried out.

[0233] In the peeling step S30, the position of the holding unit 90 is fixed, and then the moving unit 132 moves the moving plate 124 along the X-axis direction at a predetermined speed. At the start of the movement, the feed roller 114 and the recovery roller 120 also start rotating.

[0234] As the movable plate 124 moves, the pair of connecting portions 126 and the peeling roller 128 also move in the X-axis direction relative to the holding unit 90. In response to the movement of the movable plate 124, the pinion 128c and the rack 136 act to cause the peeling roller 128 to automatically rotate in a direction that sends the peeling sheet 110 to the collection unit 118 (see FIG. 12).

[0235] Rotation of the peeling roller 128 reduces slack 110d of the peeling sheet 110 between the first position 110b (contact position with the peeling roller 128) and the second position 110c (fixed position fixed to the first adhesive tape 17).

[0236] Therefore, the slack 110d of the release sheet 110 near the second position 110c can be eliminated more efficiently than when the slack 110d of the release sheet 110 is eliminated using only the supply unit 112 and the collection unit 118. In this way, the tension of the release sheet 110 between the first position 110b and the second position 110c can be adjusted.

[0237] After the peeling step S30, the second wafer unit 21b is transferred to the cassette 8b through a cleaning step, a drying step, and a UV irradiation step in sequence. However, the cleaning step, the drying step, and the UV irradiation step are not essential and may be omitted as necessary.

[0238] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the object of the present invention.

[0239] For example, a first wafer unit 21a including a first ring frame 19 can be placed on top of the first claw portion 74, a second ring frame 23 can be placed below the first claw portion 74, and the second adhesive tape 25 can be attached to the wafer 11 with the first claw portion 74 sandwiched between the two in the Z-axis direction.

[0240] Furthermore, although the case where the second adhesive tape 25 is previously attached to the second ring frame 23 when the second adhesive tape 25 is attached to the wafer 11 has been described (see Figure 6(B)), the second adhesive tape 25 may also be attached to the back surface 23b of the second ring frame 23 and the back surface 11b of the wafer 11 at the same time (i.e., approximately simultaneously).

[0241] (First Modification) Next, a description will be given of modifications of the pinion 128c and the rack 136. Instead of the pinion 128c, a wheel (i.e., a disk portion) (not shown) may be fixed to the rotation shaft 128b. In this case, instead of the rack 136, a rail (not shown) having a substantially flat upper surface is provided, and the upper surface of this rail receives the wheel.

[0242] The outer peripheral side surfaces of the wheels and the upper surface of the rails are preferably formed of or coated with a material that prevents the wheels from slipping on the upper surface of the rails. Even when wheels and rails are used, the peeling roller 128 can be automatically rotated in response to the relative movement of the holding unit 90 and the peeling roller 128 along the X-axis direction.

[0243] (Second Modification) The transfer device 2 does not have to have a mechanism for automatically rotating the peeling roller 128 in response to the movement of the moving plate 124. For example, a motor (not shown), such as a servo motor or a stepping motor, may be provided on the moving plate 124, and rotational power may be transmitted from this motor to the rotation shaft 128b of the peeling roller 128.

[0244] For example, by directly fixing the output shaft of the motor and the rotation shaft 128b, the rotational power can be transmitted directly from the motor to the peeling roller 128. Furthermore, by using a pulley and a belt, for example, the rotational power can be transmitted indirectly from the motor to the peeling roller 128.

[0245] In this case, however, the controller adjusts the rotation speed of the peeling roller 128 in accordance with the movement of the moving plate 124. The controller may also adjust the rotation speed of the peeling roller 128 in accordance with the tension of the release sheet 110.

[0246] For example, the controller monitors the slack 110d of the release sheet 110 in real time using the imaging unit 140, and adjusts the rotation speed of the motor according to the relative movement speed of the holding unit 90 and the moving plate 124 and the degree of slack 110d of the release sheet 110.

[0247] Furthermore, for example, the controller monitors excessive tension of the release sheet 110 in real time using the imaging unit 140, and adjusts the rotation speed of the motor according to the relative movement speed of the holding unit 90 and the moving plate 124 and the degree of excessive tension of the release sheet 110.

[0248] In the present example, when the peeling roller 128 is rotatable independently of the movement of the movable plate 124, the slack 110d of the peeling sheet 110 can be reduced and excessive tension in the peeling sheet 110 can be eliminated.

[0249] As shown in FIGS. 8 and 12, the imaging unit 140 may be provided on the side of the peeling roller 128, or may be provided between the peeling roller 128 and the collection unit 118.

[0250] When the imaging unit 140 is provided between the peeling roller 128 and the collection unit 118, the controller can grasp the change in the length of the peeling sheet 110 in the width direction (the Y-axis direction in Figure 12) by capturing an image of the peeling sheet 110 with the imaging unit 140.

[0251] For example, if the release sheet 110 is excessively taut, the release sheet 110 will stretch along the feed direction, shortening the width of the release sheet 110. In this case, the controller rotates the release roller 128 based on the width of the release sheet 110 to reduce the tension of the release sheet 110 between the first position 110b and the second position 110c.

[0252] In this example, the excessive tension of the release sheet 110 near the second position 110c can be eliminated more efficiently than when the supply unit 112 and the recovery unit 118 alone are used to eliminate the excessive tension of the release sheet 110.

[0253] Furthermore, the slack 110d of the release sheet 110 near the second position 110c can be eliminated more efficiently than when the slack 110d of the release sheet 110 is eliminated using only the supply unit 112 and the collection unit 118. In other words, the tension of the release sheet 110 can be adjusted more efficiently. [Explanation of symbols]

[0254] 2: Transfer device (peeling device), 4: Base 6a, 6b: cassette table, 8a, 8b: cassette 10: Push-pull arm 11: wafer (object to be processed), 11a: front surface, 11b: back surface (one surface) 12: guide rail, 12a: support surface, 12b: abutment surface 13: Planned division line, 15: Device 14: First ultraviolet irradiation unit 16: First transport unit, 18: Rail, 20: Arm 17: First adhesive tape (first sheet) 19: first ring frame, 19a: front surface, 19b: back surface, 19c: first opening 21a: First wafer unit 21b: Second wafer unit 21c: Conjugate 22: Holding part 23: second ring frame, 23a: front surface, 23b: back surface, 23c: second opening 24: Lifting mechanism 25: Second adhesive tape (second sheet) 26: First support unit, 28: Wafer support portion, 30: Ring frame support portion 32: Ring frame receiving section, 34: Support table, 36: Positioning column 38: First ring frame transport unit, 40: Moving body, 42: Guide rail 44: Arm part, 46: Holding part 48: Ring frame support table 50: adhesive tape supply unit, 52: delivery roll, 54: supply tape 56: Guide roller, 58: Winding roll 60: cutting mechanism, 62: rotating shaft, 64: arm, 66: cutter 68: second ring frame transport unit, 70: guide rail 72: second support unit, 74: first claw portion 76: Tape application unit, 78: Roller 80: combined body transport mechanism, 82: support portion, 84: guide rail, 86: arm portion 88: lifting unit, 90: holding unit, 92: suction holding unit 94: Second claw moving part, 96: Third claw opening / closing part 98: Telescopic portion, 100: Moving body, 102: Second claw portion 104: Shaft portion, 106: Third claw portion 108: Peeling unit 110: release sheet, 110a: adhesive surface, 110b: first position, 110c: second position 110d:Slack 112: supply unit, 114: delivery roller 116, 116a, 116b, 116c, 116d, 116e: Rollers 118: Collection unit, 120: Collection roller 122: Upright board 122a: first rectangular area, 122b: second rectangular area, 122c: third rectangular area 124: moving board, 124a: moving block 126: Connection part 128: Peeling roller 128a: shaft center, 128b: rotating shaft, 128c: pinion (disk part) 130: Wall, 130a: One side 132: moving unit, 134: guide rail 136: Rack (receiving part) 138: seat fixing unit, 138a: moving block, 138b: lifting mechanism 140: imaging unit, 140a: imaging section, 140b: legs 142: Collection container 150: Reversing unit, 152: Guide rail, 154: Moving block 156: Rotating arm portion, 158: Holding portion 160: Delivery table 162: Second wafer unit transport unit 164: Support part, 166: Guide rail, 168: Moving block 170: arm, 172: actuator, 174: holder 176: Guide rail table, 178: Through opening 180: second ultraviolet irradiation unit, 182: guide rail, 184: UV light source section 186: cleaning unit, 188: housing, 190: spinner table, 192: cleaning arm 194: Push-pull arm S10: Holding step, S20: Fixing step, S30: Peeling step

Claims

1. A peeling device that peels off a first sheet from a processing object having the first sheet fixed to one surface thereof, a holding unit that holds the object to be processed with the first sheet exposed; a supply unit that supplies a release sheet to an area facing the exposed surface of the first sheet; a sheet fixing unit that fixes the release sheet to the first sheet; a recovery unit that holds one end of the release sheet supplied from the supply unit and recovers the first sheet by winding up the release sheet fixed to the first sheet; a peeling roller provided separately from the supply unit and the recovery unit, which rotates about an axis disposed in a direction intersecting the predetermined direction in response to relative movement of the peeling sheet in a predetermined direction relative to the holding unit with a portion of the peeling sheet fixed to the first sheet; Equipped with A peeling device characterized in that the tension of the peeling sheet between a first position in contact with the peeling roller and a second position fixed to the first sheet is adjusted by rotating the peeling roller in accordance with the relative movement of the holding unit and the peeling roller along the specified direction.

2. a disc portion fixed to one end of the peeling roller; a receiving portion having an upper surface extending along the predetermined direction and configured to receive the disk portion; Further provided with The peeling device according to claim 1, characterized in that when the peeling roller and the holding unit move relative to each other, the disk portion rolls on the upper surface of the receiving portion, thereby causing the peeling roller to rotate in synchronization with the relative movement between the peeling roller and the holding unit.

3. 3. The peeling device according to claim 1, further comprising an imaging unit that images an area of ​​the peeling sheet between the first position where the peeling sheet is in contact with the peeling roller and the second position where the peeling sheet is fixed to the first sheet.

4. A peeling method for peeling a first sheet from a processing object having the first sheet fixed to one surface thereof, comprising: a holding step of holding the object to be processed with a holding unit in a state where the first sheet is exposed; a fixing step of fixing a part of the release sheet to the first sheet after the holding step; a peeling step of peeling the first sheet from the object to be treated by moving the holding unit and the peeling roller relatively in a predetermined direction after the fixing step, In the peeling process, the peeling roller is rotated during relative movement between the holding unit and the peeling roller along the predetermined direction, thereby adjusting the tension of the release sheet between a first position in contact with the peeling roller and a second position fixed to the first sheet.

Images