LED lamp and heat dissipation device thereof

Abstract

To provide an LED lamp and a heat dissipation device thereof.SOLUTION: The LED lamp includes at least one LED light bead disposed on the heat dissipation device. The heat dissipation device includes a circuit board and a heat sink. The circuit board comprises a first metal layer and a second metal layer respectively located at opposite sides of each other, the LED light bead is welded to the first metal layer, and the second metal layer is welded to the heat sink. The circuit board has a plurality of heat transfer holes, so that the heat energy from the LED light bead is transferred to the heat sink via the heat transfer holes. On the other hand, some of the heat-conducting holes are selectively filled with the heat-conducting material columns, so that the heat energy from the LED light beads is conducted to the heat sink through the heat-conducting material columns in the heat-conducting holes.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a lamp and a heat dissipation device thereof, and more particularly to a light-emitting diode (LED) lamp that dissipates a large amount of heat and a heat dissipation device thereof. [Background technology]

[0002] Light-emitting diodes (LEDs) are semiconductor devices that emit different wavelengths depending on the materials used. Currently, the photoelectric conversion efficiency of high-power LEDs is generally such that approximately 15% to 25% of the input power is converted into light, and the remainder is converted into thermal energy. Because the area of ​​an LED chip is extremely small, the heat density per unit area of ​​a high-power LED is extremely high, which is even worse than that of a general IC element. This causes the junction temperature of the LED chip to rise significantly, leading to the problem of overheating. If the temperature of the chip junction is too high, the brightness of the LED light will decrease and the wavelength of the LED will shift, affecting the quality and specifications and significantly shortening the lifespan of the LED. Therefore, the heat dissipation design of LED-related products is extremely important.

[0003] Currently, the most commonly used welding method for high-power LEDs is to first weld the LED to an aluminum or copper substrate, and then connect the aluminum or copper substrate to a heat sink via a heat dissipation gel. However, with such a conventional connection method, the heat is transferred via an insulating layer on the substrate, and therefore the heat transfer and radiation effects are poor.

[0004] PCT Patent No. WO2014166113A1 (Patent Title: Welding Method for High Heat Conduction LED) discloses a welding method for high heat conduction LED, which includes the steps of welding the electrodes of the LED to a circuit board with high-temperature solder and directly welding the heat dissipation plate of the LED to a heat dissipation device with low-temperature solder. The heat dissipation plate of the LED is in direct contact with the heat dissipation device, so the heat transfer and heat dissipation effect of the LED is good. However, this method makes it difficult to manufacture the circuit board and increases the processing cost.

[0005] On the other hand, Taiwan Patent No. TW201248947A (Patent title: Heat dissipation device for light emitting diode device) has multiple heat transfer lines on a circuit board, which are connected to the heat transfer area of ​​the LED, and the circuit board and the heat sink are connected with screws, which contact the heat dissipation lines of the LED. The heat transfer path in this patent is the LED heat transfer area, the circuit board lines, the screws, and the heat sink. However, this heat transfer method does not have a good heat dissipation effect because the area of ​​the heat dissipation line and the area of ​​the screw are too small. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] PCT Patent Publication No. WO2014166113A1 [Patent Document 2] Taiwan Patent Publication No. TW201248947A Summary of the Invention [Problem to be solved by the invention]

[0007] The main purpose of the present invention is to solve the problem of LEDs generating too much heat, which reduces the specifications and quality of LEDs and shortens their lifespan. This invention uses materials with a higher heat transfer coefficient, such as solder or silver gel, and uses heat transfer holes to directly connect the solder / silver gel to the heat sink, instead of the traditional heat dissipation gel and screws, thereby greatly improving the heat dissipation effect. This allows the use of commercially available circuit boards, and provides good heat dissipation effect, so the circuit design is simple and the production costs are low. [Means for solving the problem]

[0008] The LED lamp of the present invention includes at least one LED light bead and a heat dissipation device, and the LED light bead is mounted on the heat dissipation device, so that the heat energy from the LED light bead is dissipated through the heat dissipation device.

[0009] According to the heat dissipation device of the present invention, the heat dissipation device dissipates heat energy from at least one LED light bead, a circuit board having at least one first metal layer and at least one second metal layer located on opposite sides of each other, the circuit board having at least one heat transfer hole extending through the board; The second metal layer of the circuit board is connected via a second heat conductive material layer, so that the heat energy of the LED light bead is transferred from the second metal layer to the heat sink via the second heat conductive material layer; Equipped with The first metal layer of the circuit board is connected to the heat dissipation base of the LED light bead via the first heat transfer material layer, so that thermal energy from the LED light bead is transferred from the heat dissipation base to the second metal layer of the circuit board via the first heat transfer material layer, the first metal layer and the heat transfer holes.

[0010] In the heat dissipation device according to the present invention, the area of ​​the second metal layer of the circuit board is at least larger than the area of ​​the heat sink connected to the second metal layer of the circuit board via the second thermally conductive material layer.

[0011] In the heat dissipation device of the present invention, the heat transfer holes formed in the circuit board are located in an area that connects with the first metal layer of the circuit board through the first heat transfer material layer of the heat dissipation base of the LED light bead.

[0012] In the heat dissipation device of the present invention, the heat transfer hole is filled with at least one heat transfer material column, which is connected to the first heat transfer material layer and the second heat transfer material layer, and the thermal energy from the LED light bead is transferred from the first heat transfer material layer to the second heat transfer material layer via the heat transfer material column.

[0013] In the heat dissipation device according to the present invention, the material of the first heat conductive material layer, the second heat conductive material layer and / or the heat conductive material columns is selected from the group consisting of solder and silver adhesive material.

[0014] In the heat dissipation device according to the present invention, the material of the first heat-conductive material layer, the second heat-conductive material layer and / or the heat-conductive material columns is a heat-conductive adhesive substance.

[0015] In the heat dissipation device of the present invention, the heat transfer holes have a third metal layer formed on the back wall of the circuit board, and the third metal layer is connected to the first metal layer and the second metal layer, and the thermal energy from the LED light bead is transferred from the heat dissipation base to the second metal layer of the circuit board via the first heat transfer material layer, the first metal layer, the heat transfer holes and the third metal layer in the heat transfer holes.

[0016] In the heat dissipation device according to the present invention, the circuit board is a copper foil circuit board, and the first metal layer and / or the second metal layer are each copper foil.

[0017] In the heat dissipation device according to the present invention, the heat sink is made of pure copper.

[0018] In the heat dissipation device according to the present invention, the heat sink is a copper pillar heat dissipation sheet, a water-cooled heat sink, a fan-assisted copper pillar heat dissipation sheet, or a fan-assisted water-cooled heat sink.

[0019] The heat dissipation device of the present invention has a plurality of heat transfer holes, and among these heat transfer holes, a plurality of first heat transfer holes are each filled with a heat transfer material column, and among these heat transfer holes, a plurality of second heat transfer holes are hollow.

[0020] In the heat dissipation device of the present invention, the first heat transfer holes formed on the circuit board are located in an area that connects the LED light bead's heat dissipation base to the first metal layer of the circuit board via the first heat transfer material layer of the heat dissipation base, and the second heat transfer holes formed on the circuit board are located outside the area that connects the LED light bead's heat dissipation base to the first metal layer of the circuit board via the first heat transfer material layer.

[0021] In the heat dissipation device according to the present invention, the circuit board is a two-layer board or a multi-layer board.

[0022] According to the heat dissipation device of the present invention, the heat dissipation device dissipates heat energy from at least one LED light bead, a copper foil circuit board having at least one first copper foil and at least one second copper foil located on opposite sides of each other, with the LED light bead welded to the first copper foil; a copper foil circuit board welded to the second copper foil, the copper foil circuit board having at least one copper-plated heat transfer hole, the copper-plated heat transfer hole penetrating the copper foil circuit board, the first copper foil, and the second copper foil, so that thermal energy from the LED light bead is transferred to the heat sink via the copper-plated heat transfer hole; The present invention is characterized by comprising:

[0023] In the heat dissipation device according to the present invention, the area of ​​the second copper foil is larger than the area of ​​the heat sink that is welded to the second copper foil.

[0024] The heat dissipation device of the present invention has a plurality of copper-plated heat transfer holes, and among the copper-plated heat transfer holes, only one first copper-plated heat transfer hole in the welding area between the heat sink and the second copper foil is filled with solder or silver gel.

[0025] In the heat dissipation device of the present invention, at least one second copper-plated heat transfer hole located outside the welding area between the heat sink and the second copper foil is not filled with solder or silver gel. [Effects of the Invention]

[0026] The LED lamp and its heat dissipation device according to the present invention have the following advantages. (1) By using materials with a higher heat transfer coefficient, such as solder or silver gel, and by using heat transfer holes, the solder / silver gel is directly connected to the heat sink instead of the traditional heat dissipation gel and screws, which greatly improves the heat dissipation effect.

[0027] (2) Commercially available circuit boards can be used, and the heat dissipation effect is good, so the circuit design is not complicated and the production cost is not high.

[0028] (3) The copper foil circuit board of the heat dissipation device of the present invention has copper-plated heat transfer holes, some of which are filled with heat transfer material columns for connecting with LED light beads and heat sinks, and some of which are not filled with heat transfer material columns, thereby utilizing the first type of heat conduction path and the second type of heat conduction path to achieve high heat dissipation efficiency for the LED lamp.

[0029] (4) The order of the first type of heat conduction path according to the present invention is (a) the heat dissipation base of the LED light bead, (b) the first heat conduction material layer / first metal layer / third metal layer in the heat conduction hole / heat conduction material column below the heat dissipation base, (c) the second heat conduction material layer / second metal layer on the other side of the circuit board, and (d) the heat sink, and the order of the second type of heat conduction path is (a) the heat dissipation base, (b) the first heat conduction material layer / first metal layer below the heat dissipation base, (c) the heat conduction hole around the heat dissipation base / third metal layer in the heat conduction hole, (d) the second heat conduction material layer / second metal layer on the other side of the circuit board, and (e) the heat sink.

[0030] (5) The first and second heat conductive material layers are directly connected to the LED light bead and the heat sink, respectively, and are connected to each other by the heat conductive material column and / or the first, second and third metal layers of the circuit board. The LED lamp of the present invention has an improved heat dissipation effect because the LED light bead is directly connected to the heat sink, for example, by solder / silver gel.

[0031] (6) The area of ​​the second metal layer of the circuit board is larger than the area of ​​the second metal layer of the circuit board connected to the heat sink via the second heat conductive material layer, thereby increasing the heat dissipation effect.

[0032] (7) The heat transfer material columns are located in the connection areas (e.g., welding areas) between the LED light beads and the circuit board, and in the connection areas (e.g., welding areas) between the heat sink and the circuit board, which increases the heat dissipation effect.

[0033] (8) The LED lamp according to the present invention is a high-power LED lamp.

[0034] In order to better understand the technical features and achievable technical effects of the present invention, better embodiments and detailed descriptions are provided below. [Brief explanation of the drawings]

[0035] [Figure 1]1 is a cross-sectional view showing the LED light beads of the LED lamp according to the present invention installed in a heat dissipation device; [Figure 2] FIG. 2 is a diagram illustrating heat transfer when the LED light beads of the LED lamp according to the present invention are mounted on a heat dissipation device. [Figure 3] 1 is a cross-sectional view showing the LED light bead of the LED lamp of the present invention mounted on a heat dissipation device, the heat dissipation device having a water-cooled heat sink; [Figure 4] 1 is a perspective view showing the state in which the LED light beads of the LED lamp according to the present invention are installed in a heat dissipation device; [Figure 5] 1 is a perspective view showing a heat dissipation device of an LED lamp according to the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0036] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The proportions of the components in the drawings of the embodiments of the present invention are shown for ease of understanding and are not to scale. Furthermore, the dimensional ratios of the assemblies shown in the drawings are for the purpose of explaining the components and their structures, and the present invention is not limited to these. On the other hand, for ease of understanding, the same components in the following embodiments will be described with the same reference numerals.

[0037] Furthermore, terms used throughout the specification and claims generally have their ordinary meanings as used in this field, the subject matter disclosed herein, and in the particular context, unless otherwise specified. Some terms used to describe the present invention are explained below and elsewhere in the specification to provide those skilled in the art with additional guidance regarding the description of the present invention.

[0038] The use of "first," "second," "third," etc. in this article does not denote a specific order or sequence, nor is it used to limit the invention, but is used only to distinguish between components or operations that are described with the same terminology.

[0039] Secondly, when this article uses terms such as "including," "comprising," "having," and "containing," they are all open terms, meaning including but not limited to.

[0040] Fig. 1 is a cross-sectional view showing an LED light bead of an LED lamp according to the present invention mounted on a heat dissipation device. Fig. 2 is a diagram showing heat transfer when an LED light bead of an LED lamp according to the present invention is mounted on a heat dissipation device. Fig. 3 is a cross-sectional view showing an LED light bead of an LED lamp according to the present invention mounted on a heat dissipation device, the heat dissipation device having a water-cooled heat sink. Fig. 4 is a perspective view showing an LED light bead of an LED lamp according to the present invention mounted on a heat dissipation device. Fig. 5 is a perspective view showing a heat dissipation device of an LED lamp according to the present invention.

[0041] 1 to 5, an LED lamp 10 according to the present invention includes an LED light bead 20 and a heat dissipation device 30. The LED light beads 20 are mounted on a heat dissipation device 30 . The heat dissipation device 30 includes a circuit board 40 and a heat sink 60 . The heat dissipation device 30 allows the heat energy from the at least one LED light bead 20 to be dissipated to the outside via the circuit board 40 and the heat sink 60 . This makes the LED lamp 10 a high heat dissipation LED lamp. The LED light bead 20 may be one or more. For the sake of clarity in explaining the operation of the present invention, the present invention takes as an example, but is not limited to, an LED light bead 20 in which an LED chip 22 is mounted on a heat dissipation base 26 and is covered by a cover 24. The LED light bead 20 of the LED lamp 10 according to the present invention is not limited to a specific type, structure and circuit configuration, and may be appropriately modified or replaced according to actual needs, for example. For example, the cover 24 and / or the heat dissipation base 26 may be omitted or replaced with other structures, and commercially available LED light beads 20 of various types, structures, and circuit configurations may be selectively employed.

[0042] The circuit board 40 of the heat dissipation device 30 of the present invention has at least one first metal layer 42 and at least one second metal layer 44 located on opposite sides of each other, for example, the first metal layer 42 and the second metal layer 44 are located on opposite sides of the substrate 41 of the circuit board 40. The circuit board 40 of the heat dissipation device 30 according to the present invention has at least one heat transfer hole 46, for example, one or more heat transfer holes 46. For example, the heat transfer hole 46 penetrates the substrate 41 and selectively penetrates the first metal layer 42 and the second metal layer 44. The heat transfer holes 46 are selectively formed on the back wall of the circuit board 40 by a third metal layer 48 that connects with the first metal layer 42 and the second metal layer 44 . As a result, the heat transfer holes 46 become metal-plated heat transfer holes. The circuit board 40 is, for example, a copper foil circuit board. The first metal layer 42 and / or the second metal layer 44 are, for example, copper foil, and the third metal layer 48 is also copper foil. This results in the heat transfer holes 46 being copper plated heat transfer holes. The heat transfer holes 46 may be arranged in a matrix, but are not limited thereto. Any material or configuration that can achieve the heat dissipation effect of the present invention is within the scope of the claims of the present invention. However, the circuit board 40, first metal layer 42, second metal layer 44 and third metal layer 48 of the present invention are not limited to any particular size or thickness. Similarly, the diameter of the heat transfer holes 46 or the distance between two heat transfer holes 46 according to the present invention are not particularly limited, and any dimensions or hole diameters are within the scope of the claims of the present invention as long as they can achieve the heat dissipation effect of the present invention.

[0043] The circuit board 40 of the heat dissipation device 30 according to the present invention is, for example, a commercially available printed circuit board, which is, for example, a two-layer board or a multi-layer board, so the shape of the substrate 41 of the circuit board 40 is changed according to the shape of the circuit board 40. Taking a commercially available two-layer board as an example, this has a metal layer (e.g., copper foil) covering each side of the substrate 41, and the substrate 41 is a dielectric layer, such as a glass fiber board, an epoxy resin board, or a composite board thereof. Taking a commercially available multilayer board as an example, this has a metal layer (e.g., copper foil) covering each side of the board 41, and the board 41 has multiple intermediate layers, for example, a laminated structure of the above-mentioned multiple dielectric layers and multiple metal layers, and multiple metal-plated heat transfer holes located between the same or different laminated layers. Based on the disclosure of the present invention, a person skilled in the art would be able to understand how to implement commercially available circuit boards and / or commercially available LED light beads to achieve the technical effects of the present invention, and therefore, the description will be omitted. On the other hand, the circuit board 40 may optionally have other structures (such as screw holes 43, etc.) that allow, for example, the circuit board 40 to be locked to another object (not shown).

[0044] One of the features of the present invention is that at least one heat transfer hole 46 is formed in the circuit board 40 to improve the heat dissipation effect. In one embodiment, the heat transfer holes 46 are formed in the circuit board 40, for example, in the area where the heat dissipation base 26 of the LED light bead 20 connects to the first metal layer 42 of the circuit board 40 via the first heat transfer material layer 70. For example, if the material of the first heat transfer material layer 70 is solder, the heat transfer holes 46 of the circuit board 40 are located in the welding area between the LED light beads 20 and the first metal layer 42. As a result, some or all of the heat transfer holes 46 in this welding area are soldered and further connected to, for example, the second metal layer 44 located on the other side of the circuit board 40 . The heat transfer holes 46 to which the solder is applied are preferably located only in the welding area between the LED light bead 20 and the first metal layer 42 . That is, it is preferable that the heat transfer holes 46 outside the welding area are not covered with solder, thereby avoiding electrical conduction.

[0045] The first metal layer 42 of the circuit board 40 of the heat dissipation device 30 of the present invention is connected to the heat dissipation base 26 of the LED light bead 20 via the first heat-conductive material layer 70 . As a result, thermal energy from the LED light beads 20 is transferred along the second type of thermal conduction path P2 shown in FIG. 2 from the heat dissipation base 26 through the first heat transfer material layer 70, the first metal layer 42, and the third metal layer 48 in the heat transfer hole 46 to the second metal layer 44 of the circuit board 40. In detail, the order of the second type of heat conduction path P2 of the present invention is (a) the heat dissipation base 26 of the LED light bead 20, (b) the first heat conductive material layer 70 / first metal layer 42 below the heat dissipation base 26, (c) the third metal layer 48 in the heat transfer holes 46 around the heat dissipation base 26, (d) the second heat conductive material layer 80 / second metal layer 44 on the other side of the circuit board 40, and (e) the heat sink 60.

[0046] In this embodiment, the heat transfer hole 46 is selectively filled with at least one heat transfer material column 50 . The heat transfer material column 50 is connected to the first heat transfer material layer 70 and the second heat transfer material layer 80, and thermal energy from the LED light bead 20 is transferred from the first heat transfer material layer 70 to the second heat transfer material layer 80 via the heat transfer material column 50 (and possibly, for example, via the first metal layer 42, the heat transfer material column 50 / third metal layer 48 and the second metal layer 44) along the first type of heat transfer path P1 shown in FIG. 2. The heat transfer material column 50 is located within the heat transfer hole 46 (for example, and further protrudes outside one or both ends of the heat transfer hole 46), and the position at which the heat transfer hole 46 is formed on the circuit board 40 is, for example, located in an area that connects with the first metal layer 42 of the circuit board 40 via the first heat transfer material layer 70 of the heat dissipation base 26 of the LED light bead 20. For example, if the material of the first heat transfer material layer 70 is solder, the position where the heat transfer material column 50 is formed in the heat transfer hole 46 on the circuit board 40 is located in the welding area between the LED light bead 20 and the first metal layer 42. The heat conductive material column 50 is preferably located between the LED light bead 20 and the heat sink 60, for example, in the welding area between the heat dissipation base 26 of the LED light bead 20 and the circuit board 40, and in the welding area between the heat sink 60 and the circuit board 40. This allows the heat energy from the LED light beads 20 to be transferred directly from the heat dissipation base 26 to the heat sink 60 . In detail, the order of the first type of heat conduction path P1 of the present invention is (a) the heat dissipation base 26 of the LED light bead 20, (b) the first heat conduction material layer 70 / first metal layer 42 / third metal layer 48 in the heat conduction hole 46 / heat conduction material column 50 below the heat dissipation base 26, (c) the second heat conduction material layer 80 / second metal layer 44 on the other side of the circuit board 40, and (d) the heat sink 60.

[0047] The heat transfer hole 46 may be one or more, for example, a plurality of first heat transfer holes 46a and a plurality of second heat transfer holes 46b. The heat transfer material pillars 50 may be one or more, and may be located in, for example, all or some of the heat transfer holes 46. Taking an example in which there are multiple heat transfer holes 46 and multiple heat transfer material pillars 50, it is preferable that the heat transfer material pillars 50 only fill some of the heat transfer holes 46 (e.g., the first heat transfer hole 46a), and that the heat transfer material pillars 50 only be located in the welding area between the LED light bead 20 and the first metal layer 42. This can increase the heat dissipation effect. In order to avoid electrical conductivity, it is preferable that the heat transfer material columns 50 do not fill some of the other heat transfer holes 46 (for example, the second heat transfer holes 46b). The first heat transfer holes 46 a are preferably provided in the welding area between the heat sink 60 and the circuit board 40 , and also in the welding area between the heat dissipation base 26 and the circuit board 40 . The second heat transfer hole 46 b is provided in the welding area between the heat sink 60 and the circuit board 40 , but is preferably located outside the welding area between the heat dissipation base 26 and the circuit board 40 . In the LED lamp 10 according to the present invention, the first heat-conducting holes 46a and the heat-conducting material columns 50 are, for example, distributed below the heat-dissipating base 26 of the LED light bead 20, and the second heat-conducting holes 46b are, for example, distributed around the heat-dissipating base 26 of the LED light bead 20. The materials of the first heat-conductive material layer 70, the second heat-conductive material layer 80, and / or the heat-conductive material columns 50 may be, for example, adhesive substances with thermal conductivity, such as, but not limited to, solder or silver gel, or other welding materials with high thermal conductivity. Silver gel, for example, has high thermal conductivity.

[0048] The heat dissipation device 30 according to the present invention further comprises a heat sink 60 . The heat sink 60 is made of, for example, pure copper. The second metal layer 44 of the circuit board 40 is connected to the heat sink 60 via the second heat conductive material layer 80 described above. As a result, thermal energy from the LED light bead 20 is transferred along the above-mentioned first type thermal conduction path P1 and / or second type thermal conduction path P2 from the second metal layer 44, through the second thermally conductive material layer 80, and to the heat sink 60. For example, the second heat conductive material layer 80 is made of solder, and the second metal layer 44 of the circuit board 40 is welded to the heat sink 60 via the second heat conductive material layer 80 . The area of ​​the second metal layer 44 is preferably larger than the area of ​​the welded area between the second metal layer 44 and the heat sink 60 . 1 to 3, the second metal layer 44 protrudes outside the above-mentioned welding area. In the LED lamp 10 according to the present invention, the heat dissipation base 26 of the LED light bead 20 and the heat sink 60 of the heat dissipation device 30 are directly connected to the first heat conductive material layer 70 and the second heat conductive material layer 80, respectively, and the first heat conductive material layer 70 and the second heat conductive material layer 80 are connected to each other via the heat conductive material column 50 and / or the first metal layer 42, the second metal layer 44 and the third metal layer 48 of the circuit board 40. In other words, the LED lamp 10 of the present invention is directly connected to the LED light bead 20 and the heat sink 60 of the heat dissipation device 30 by the solder / silver gel (i.e., the first heat conductive material layer 70, the second heat conductive material layer 80 and the heat conductive material column 50). This can increase the heat dissipation effect.

[0049] Another feature of the present invention is that the area of ​​the second metal layer 44 of the circuit board 40 is large, and the area of ​​the second metal layer 44 of the circuit board 40 is at least larger than the area of ​​the heat sink 60 connected to the second metal layer 44 of the circuit board 40 via the second thermally conductive material layer 80. For example, if the material of the second heat-conducting material layer 80 is solder, the area of ​​the second metal layer 44 of the circuit board 40 is at least larger than the area of ​​the heat sink 60 welded to the second metal layer 44 of the circuit board 40 via the second heat-conducting material layer 80 (i.e., the area of ​​the welded area between the second metal layer 44 and the heat sink 60). This can increase the heat dissipation effect.

[0050] The material of the heat sink 60 is, for example, pure copper, but is not limited to this. The heat sink 60 may be, but is not limited to, a copper column heat dissipation sheet, a water-cooled heat sink, a fan-assisted copper column heat dissipation sheet, or a fan-assisted water-cooled heat sink. For example, if the heat sink 60 is a copper column heat dissipation sheet, the heat sink 60 has multiple copper columns, so that the heat energy from the LED light beads 20 is dissipated to the outside via the copper columns. Taking the heat sink 60 as a water-cooled heat sink (a water-cooled passage heat sink shown in FIG. 3) as an example, the heat sink 60 includes a water-cooled head 62 , two passage tubes 64 and a radiator 66 . The two passage tubes 64 are each connected to a radiator 66 . As shown by the arrows, the aqueous solution flows through one of the two passage tubes 64, and the thermal energy of the water-cooled head 62 is transferred to the radiator 66. The cooled aqueous solution then flows back through the other passage tube 64 to the water-cooled head 62, thereby continuously recycling the solution. Meanwhile, the heat sink 60 according to the present invention may also be optionally equipped with a fan (not shown), which assists the copper pillar heat dissipation sheet or water-cooled heat sink.

[0051] Meanwhile, in another embodiment of the present invention, the LED lamp 10 and its heat dissipation device 30 of the present invention have the LED light beads 20 mounted on the heat dissipation device 30, and the heat dissipation device 30 can dissipate the heat energy from at least one LED light bead 20. The heat dissipation device 30 includes a copper foil circuit board (i.e., circuit board 40) and a heat sink 60. The copper foil circuit board includes a first copper foil (i.e., first metal layer 42) and a second copper foil (i.e., second metal layer 44) located on opposite sides. The heat dissipation base 26 of the LED light bead 20 was welded to the first copper foil. At least one copper-plated heat transfer hole (i.e., heat transfer hole 46) penetrates the copper foil circuit board, and the heat transfer hole 46 is located at least in the welding area between the heat dissipation base 26 and the first copper foil. A portion of the copper-plated heat transfer hole attracts solder (i.e., heat transfer material column 50) and connects with the second copper foil on the other side of the copper foil circuit board. Meanwhile, in order to avoid electrical conduction, some of the copper-plated heat transfer holes located around the heat dissipation base 26 of the LED light bead 20 are not filled with solder. By connecting the second copper foil to the heat sink 60 with solder or highly heat-conductive silver gel, the thermal energy from the LED light beads 20 can be transferred to the heat sink 60 via the copper-plated heat transfer holes that adsorb solder and the copper-plated heat transfer holes that do not adsorb solder. That is, the first type heat conduction path P1 and the second type heat conduction path P2 shown in FIG. The area of ​​the second copper foil is preferably larger than the area of ​​the second copper foil that is connected to the heat sink 60 (for example, the welding area).

[0052] The LED lamp and its heat dissipation device according to the present invention have the following advantages. (1) By using materials with a higher heat transfer coefficient, such as solder or silver gel, and by using heat transfer holes, the solder / silver gel is directly connected to the heat sink instead of the traditional heat dissipation gel and screws, which greatly improves the heat dissipation effect.

[0053] (2) Commercially available circuit boards can be used, and the heat dissipation effect is good, so the circuit design is not complicated and the production cost is not high.

[0054] (3) The copper foil circuit board of the heat dissipation device of the present invention has copper-plated heat transfer holes, some of which are filled with heat transfer material columns for connecting with LED light beads and heat sinks, and some of which are not filled with heat transfer material columns, thereby utilizing the first type of heat conduction path and the second type of heat conduction path to achieve high heat dissipation efficiency for the LED lamp.

[0055] (4) The order of the first type of heat conduction path according to the present invention is (a) the heat dissipation base of the LED light bead, (b) the first heat conduction material layer / first metal layer / third metal layer in the heat conduction hole / heat conduction material column below the heat dissipation base, (c) the second heat conduction material layer / second metal layer on the other side of the circuit board, and (d) the heat sink, and the order of the second type of heat conduction path is (a) the heat dissipation base, (b) the first heat conduction material layer / first metal layer below the heat dissipation base, (c) the heat conduction hole around the heat dissipation base / third metal layer in the heat conduction hole, (d) the second heat conduction material layer / second metal layer on the other side of the circuit board, and (e) the heat sink.

[0056] (5) The first and second heat conductive material layers are directly connected to the LED light bead and the heat sink, respectively, and are connected to each other by the heat conductive material column and / or the first, second and third metal layers of the circuit board. The LED lamp of the present invention has an improved heat dissipation effect because the LED light bead is directly connected to the heat sink, for example, by solder / silver gel.

[0057] (6) The area of ​​the second metal layer of the circuit board is larger than the area of ​​the second metal layer of the circuit board connected to the heat sink via the second heat conductive material layer, thereby increasing the heat dissipation effect.

[0058] (7) The heat transfer material columns are located in the connection areas (e.g., welding areas) between the LED light beads and the circuit board, and in the connection areas (e.g., welding areas) between the heat sink and the circuit board, which increases the heat dissipation effect.

[0059] (8) The LED lamp according to the present invention is a high-power LED lamp.

[0060] The foregoing description is by way of example only and is not intended to be limiting. Any equivalent modifications or variations thereto that do not depart from the spirit and scope of the present invention are intended to be encompassed within the scope of the claims. [Explanation of symbols]

[0061] 10 LED lamps 20 LED light beads 22 LED chips 24 Cover 26 Heat dissipation pedestal 30 Heat dissipation device 40 Circuit Board 41 PCB 42 First Metal Layer 43 screw holes 44 Second Metal Layer 46 Heat transfer holes 46a First heat transfer hole 46b Second heat transfer hole 48 Third Metal Layer 50 Heat transfer material column 60 Heatsink 62 water cooling head 64 Passage Tube 66 Radiator 70 First heat transfer material layer 80 Second heat transfer material layer P1 First type of heat conduction path P2 Second type of heat conduction path

Claims

1. 1. A heat dissipation device for dissipating thermal energy from at least one LED light bead, comprising: a circuit board having at least one first metal layer and at least one second metal layer located on opposite sides of each other, the circuit board having at least one heat transfer hole extending through the board; the second metal layer of the circuit board is connected to a heat sink via a second heat conductive material layer, so that the thermal energy of the LED light bead is transferred from the second metal layer to the heat sink via the second heat conductive material layer; Equipped with A heat dissipation device characterized in that the first metal layer of the circuit board is connected to the heat dissipation base of the LED light bead via a first heat conduction material layer, so that the thermal energy from the LED light bead is transferred from the heat dissipation base to the second metal layer of the circuit board via the first heat conduction material layer, the first metal layer and the heat transfer hole.

2. 2. The heat dissipation device according to claim 1, wherein the area of ​​the second metal layer of the circuit board is at least greater than the area of ​​the heat sink connected to the second metal layer of the circuit board via the second thermally conductive material layer.

3. 2. The heat dissipation device according to claim 1, wherein the heat conduction holes formed in the circuit board are located in an area that connects the heat dissipation base of the LED light bead to the first metal layer of the circuit board through the first heat conduction material layer.

4. The heat dissipation device according to claim 1 or 3, characterized in that the heat transfer hole is filled with at least one heat transfer material column, the heat transfer material column is connected to the first heat transfer material layer and the second heat transfer material layer, and the thermal energy from the LED light bead is transferred from the first heat transfer material layer to the second heat transfer material layer via the heat transfer material column.

5. The heat dissipation device according to claim 4 , wherein the materials of the first heat conductive material layer, the second heat conductive material layer and / or the heat conductive material columns are each selected from the group consisting of solder and silver adhesive materials.

6. The heat dissipation device according to claim 4 , wherein the material of the first heat conductive material layer, the second heat conductive material layer, and / or the heat conductive material columns is a heat conductive adhesive substance.

7. 2. The heat dissipation device of claim 1, wherein the heat transfer hole is formed on a back wall of the circuit board by a third metal layer, the third metal layer is connected to the first metal layer and the second metal layer, and the thermal energy from the LED light bead is transferred from the heat dissipation base to the second metal layer of the circuit board via the first heat transfer material layer, the first metal layer, the heat transfer hole and the third metal layer in the heat transfer hole.

8. 2. The heat dissipation device according to claim 1, wherein the circuit board is a copper foil circuit board, and the first metal layer and / or the second metal layer are each copper foil.

9. 2. The heat dissipation device according to claim 1, wherein the heat sink is made of pure copper.

10. The heat dissipation device according to claim 1 , wherein the heat sink is a copper pillar heat dissipation sheet, a water-cooled heat sink, a fan-assisted copper pillar heat dissipation sheet, or a fan-assisted water-cooled heat sink.

11. The heat dissipation device of claim 1, characterized in that there are multiple heat transfer holes, and among these heat transfer holes, multiple first heat transfer holes are each filled with a heat transfer material column, and among these heat transfer holes, multiple second heat transfer holes are hollow.

12. 12. The heat dissipation device of claim 11, wherein the first heat conduction holes formed on the circuit board are located in an area connecting the first metal layer of the circuit board through the first heat conduction material layer of the heat dissipation base of the LED light bead, and the second heat conduction holes formed on the circuit board are located outside the area connecting the first metal layer of the circuit board through the first heat conduction material layer of the heat dissipation base of the LED light bead.

13. 1. A heat dissipation device for dissipating thermal energy from at least one LED light bead, comprising: a copper foil circuit board having at least one first copper foil and at least one second copper foil located on opposite sides of each other, the LED light bead being welded to the first copper foil; a heat sink welded to the second copper foil, the copper foil circuit board having at least one copper-plated heat transfer hole, the copper-plated heat transfer hole penetrating the copper foil circuit board, the first copper foil, and the second copper foil, so that the thermal energy from the LED light bead is transferred to the heat sink via the copper-plated heat transfer hole; A heat dissipation device comprising:

14. The heat dissipation device according to claim 13 , wherein the area of ​​the second copper foil is larger than the area of ​​the heat sink that is welded to the second copper foil.

15. 14. The heat dissipation device of claim 13, wherein there are a plurality of copper-plated heat transfer holes, and among the copper-plated heat transfer holes, only one first copper-plated heat transfer hole in the welding area between the heat sink and the second copper foil is filled with solder or silver gel.

16. 16. The heat dissipation device of claim 15, wherein at least one second copper-plated heat transfer hole located outside the welding area between the heat sink and the second copper foil is not filled with solder or silver gel.

17. at least one LED light bead; A heat dissipation device according to any one of claims 1 to 3 and claims 7 to 16; Equipped with The LED lamp is characterized in that the LED light beads are mounted on the heat dissipation device, and thermal energy from the LED light beads is dissipated via the heat dissipation device.

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