Apparatus and method for forming metal film

Abstract

To provide a film deposition apparatus for a metal film capable of suppressing plastic deformation of a mask part and depositing a metal film of a desired pattern even when film deposition is repeatedly performed using a masking material.SOLUTION: The mask portion 65 has a plurality of through portions 68 formed through the mask portion 65 in a predetermined pattern P to expose the mesh portion 64, and a plurality of grooves 67 provided on a surface of the mask portion 65 facing the electrolyte membrane 13 so as to be continuous with the through portions 68. The film forming apparatus 1 further includes a suction device 81 that air in the through portion 68 via the plurality of recessed grooves 67 in a state where the masking material 60 is in contact with the base material B.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a metal film forming apparatus and a metal film forming method. [Background technology]

[0002] Conventionally, there have been known film-forming devices for forming a metal film on a substrate. The metal film-forming device described in Patent Document 1 applies a voltage between an anode and the substrate while pressing an electrolyte membrane against the substrate, thereby reducing metal ions contained inside the electrolyte membrane and partially forming a metal film on the surface of the substrate. Before film formation, the electrolyte membrane and the substrate are brought into contact with each other while air between the substrate and the electrolyte membrane is sucked out by a suction device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-139630 Summary of the Invention [Problem to be solved by the invention]

[0004] However, when a metal coating having a predetermined pattern is formed using a masking material having perforations formed in the mask portion, the mask portion is deformed along with the electrolyte membrane due to suction by a suction device. Repeated metal coating formation may result in plastic deformation of the mask portion due to repeated deformation of the mask portion. This may result in failure to form a metal coating having the desired pattern.

[0005] The present invention has been made in consideration of these points, and its purpose is to provide a metal film deposition apparatus and method that can suppress plastic deformation of the mask portion and deposit a metal film in a desired pattern even when film deposition is performed repeatedly using a masking material. [Means for solving the problem]

[0006] In view of the above-described problems, the present invention provides a metal film forming apparatus for forming a metal film having a predetermined pattern on the surface of a substrate by electroplating. The film forming apparatus includes a container that contains a plating solution with an opening facing the substrate covered with an electrolyte membrane, a pressure-increasing mechanism that increases the pressure of the plating solution contained in the container, and a masking material that is disposed between the electrolyte membrane and the substrate and attached to the container. The masking material includes a sheet-like mesh portion that allows the electroplating solution to pass through, and masking portions that are provided on the front and back of the mesh portion and are sandwiched between the electrolyte membrane and the substrate. The masking portion has a plurality of through-holes that penetrate the masking portion according to the predetermined pattern to expose the mesh portion, and a plurality of grooves that are provided on the surface of the masking portion facing the electrolyte membrane so as to be continuous with each through-hole. The film forming apparatus further includes a suction device that sucks air from the through-holes through the grooves while the masking material is in contact with the substrate. [Effects of the Invention]

[0007] According to the present invention, while the masking material is in contact with the substrate, air present between the electrolyte membrane and the masking material can be sucked out by a suction device. Specifically, during film formation, air is removed from the perforated portions of the masking material through the recessed grooves, thereby preventing poor metal film formation due to air. Next, while the air is removed, the pressure of the plating solution contained in the container is increased by a pressure boosting mechanism, allowing the electrolyte membrane to uniformly press against the substrate through the masking material. With the electrolyte membrane pressed, plating solution seeping out of the electrolyte membrane fills the perforated portions, allowing a metal film to be formed on the surface of the substrate by electroplating. As a result, even when film formation is repeatedly performed using the masking material, plastic deformation of the masking material can be suppressed, and a metal film with a desired pattern can be formed. [Brief explanation of the drawings]

[0008] [Figure 1]Fig. 1(a) is a schematic cross-sectional view showing an example of a film forming apparatus equipped with a masking material according to an embodiment of the present invention before forming a metal film, and Fig. 1(b) is a cross-sectional view illustrating the state of the film forming apparatus of Fig. 1(a) during film formation. [Figure 2] FIG. 2 is a schematic perspective view of a masking material and a substrate on which a film has been formed. [Figure 3] Fig. 3(a) is a partially enlarged cross-sectional view taken along line AA in Fig. 2. Fig. 3(b) is a partially enlarged cross-sectional view taken along line CC in Fig. 3(a). Fig. 3(c) is a partially enlarged cross-sectional view taken along line BB in Fig. 2. [Figure 4] Fig. 4(a) is a diagram for explaining the state after the degassing step has been performed in the cross section shown in Fig. 3(a), and Fig. 4(b) is a diagram for explaining the state after the pressing step and the film forming step have been performed in the cross section shown in Fig. 4(a). DETAILED DESCRIPTION OF THE INVENTION

[0009] First, with reference to FIGS. 1(a) to 4(b), a film forming apparatus 1 equipped with a masking material 60 according to an embodiment of the present invention will be described.

[0010] As shown in FIG. 1(a), the film formation apparatus 1 is a film formation apparatus that forms a metal coating F in a predetermined pattern P on a substrate B by electroplating. The film formation apparatus 1 forms the metal coating with a masking material 60 sandwiched between an electrolyte membrane 13 and the substrate B. The film formation apparatus 1 includes an anode 11, an electrolyte membrane 13, and a power source 14 that applies a voltage between the anode 11 and the substrate B.

[0011] The film formation apparatus 1 includes a container 15 that contains an anode 11 and a plating solution L, a mounting table 40 on which a substrate B is placed, and a masking material 60. During film formation, the masking material 60 attached to the container 15 is placed on the mounting table 40 together with the substrate B. The electrolyte membrane 13 is placed between the masking material 60 and the anode 11.

[0012] The film forming apparatus 1 includes a linear actuator 70 that raises and lowers the container 15. The linear actuator 70 may be a movement mechanism that moves at least one of the container 15 and the substrate B so that the masking material 60 and the substrate B can be brought into contact with or separated from each other.

[0013] The substrate B functions as a cathode. The substrate B is a plate-shaped substrate. In this embodiment, the substrate B is a rectangular substrate. The surface of the substrate B facing the electrolyte membrane 13 is a film formation surface that functions as a cathode. In this embodiment, the substrate B is an insulating substrate having a metal layer formed on its surface. The insulating substrate is made of an electrically insulating material such as glass, ceramics, resin, or a composite material thereof. The metal layer may be made of a metal such as aluminum or copper. In this embodiment, since a wiring pattern is formed from a metal coating F, the substrate B is an insulating substrate such as a resin substrate having a metal layer such as copper formed on its surface. In this case, after the metal coating F is formed, the metal layer Ba is removed by etching or the like from the area other than where the metal coating F is formed. This allows a pattern (wiring pattern) P made of the metal coating F to be formed on the surface of the insulating substrate.

[0014] The anode 11 is, for example, a non-porous (e.g., non-porous) anode made of the same metal as the metal of the metal coating. The anode 11 has a block or flat plate shape. Examples of materials for the anode 11 include copper. The anode 11 dissolves when a voltage is applied from the power source 14. However, when forming a film using only metal ions of the plating solution L, the anode 11 is an anode that is insoluble in the plating solution L. The anode 11 is electrically connected to the positive electrode of the power source 14.

[0015] The plating solution L is a solution containing the metal of the metal coating to be formed in an ionic state. Examples of such metals include copper and nickel. The plating solution L is a solution in which these metals are dissolved (ionized) with an acid such as nitric acid, phosphoric acid, or sulfuric acid.

[0016] The electrolyte membrane 13 is a membrane that can be impregnated (contain) metal ions together with the plating solution L by contacting it with the plating solution L. The electrolyte membrane 13 is a flexible membrane. The material of the electrolyte membrane 13 is not particularly limited as long as it allows the metal ions of the plating solution L to migrate to the substrate B side when a voltage is applied from the power source 14. Examples of materials for the electrolyte membrane 13 include resins with ion exchange properties, such as fluororesins such as Nafion (registered trademark) manufactured by DuPont. The thickness of the electrolyte membrane 13 is preferably in the range of 20 μm to 200 μm.

[0017] The container 15 is made of a material that is insoluble in the plating solution L. The container 15 has a container space 15a that contains the plating solution L. The anode 11 is disposed in the container space 15a of the container 15. An opening 15d is formed in the container space 15a at a position facing the substrate B. The opening 15d of the container 15 is covered with an electrolyte membrane 13. Specifically, the periphery of the electrolyte membrane 13 is sandwiched between the container 15 and the frame 17. This allows the plating solution L in the container space 15a to be sealed by the electrolyte membrane 13. The frame 17 has a degassing port 17a.

[0018] As shown in FIGS. 1(a) and 1(b), the linear actuator 70 raises and lowers the container 15 so that the substrate B and the masking material 60 can be moved toward and away from each other. In this embodiment, the mounting table 40 is fixed, and the container 15 is raised and lowered by the linear actuator 70. The linear actuator 70 is an electric actuator that converts the rotational motion of a motor into linear motion using a ball screw or the like (not shown). However, instead of an electric actuator, a hydraulic or pneumatic actuator may be used.

[0019] The container 15 is formed with a supply port 15b for supplying the plating solution L to the container space 15a. The container 15 is formed with a discharge port 15c for discharging the plating solution L from the container space 15a. The supply port 15b and the discharge port 15c are holes that communicate with the container space 15a. The supply port 15b and the discharge port 15c are formed on either side of the container space 15a. The supply port 15b is fluidly connected to a liquid supply pipe 50. The discharge port 15c is fluidly connected to a liquid discharge pipe 52.

[0020] The film forming apparatus 1 further includes a tank 90, a liquid supply pipe 50, a liquid discharge pipe 52, and a pump 80. As shown in FIG. 1(a), the tank 90 contains a plating solution L. The liquid supply pipe 50 connects the tank 90 to the accommodation body 15. The liquid supply pipe 50 is provided with a pump 80. The pump 80 supplies the plating solution L from the tank 90 to the accommodation body 15. The liquid discharge pipe 52 connects the tank 90 to the accommodation body 15. The liquid discharge pipe 52 is provided with a pressure adjustment valve 54. The pressure adjustment valve 54 adjusts the pressure (liquid pressure) of the plating solution L in the accommodation space 15a to a predetermined pressure.

[0021] In this embodiment, the plating solution L is sucked from the tank 90 into the solution supply pipe 50 by driving the pump 80. The sucked plating solution L is then pumped from the supply port 15b to the accommodation space 15a. The plating solution L in the accommodation space 15a is returned to the tank 90 via the discharge port 15c. In this manner, the plating solution L circulates within the film forming apparatus 1.

[0022] Furthermore, by continuing to drive the pump 80, the liquid pressure of the plating solution L in the accommodation space 15a can be maintained at a predetermined pressure by the pressure regulating valve 54. The pump 80 presses the masking material 60 with the electrolyte membrane 13 acting on the liquid pressure of the plating solution L. The pump 80 is a pressure boosting mechanism that increases the liquid pressure of the plating solution L accommodated in the accommodation body 15.

[0023] The mounting table 40 has, for example, a main body 41 made of an insulating material. The main body 41 is formed with a protrusion 43 that protrudes toward the masking material 60, and the protrusion 43 is formed with a recess 44 that accommodates the substrate B.

[0024] As shown in FIG. 1(a), the masking material 60 includes a frame 61 and a screen mask 62. The masking material 60 is disposed between the electrolyte membrane 13 and the substrate B, and is attached to the housing 15. A peripheral edge 62a of the screen mask 62 is fixed to the frame 61. For example, the frame 61 may be made of a metal material such as stainless steel, or a resin material such as a thermoplastic resin.

[0025] 2, the screen mask 62 includes a sheet-like mesh portion 64 and a mask portion 65. The screen mask 62 is a mask having flexibility of about 50 μm to 400 μm. The screen mask 62 is supported by the frame 61 on the electrolyte membrane 13 side of the frame 61.

[0026] The periphery of the mesh portion 64 is fixed to the frame 61 via a portion of the mask portion 65. The mesh portion 64 allows the electroplating solution to pass through and has a plurality of openings 64c, 64c, ... formed in a lattice pattern. Specifically, as shown in FIGS. 2 and 3(a), the mesh portion 64 is a mesh-like portion in which a plurality of oriented wires 64a, 64b are woven so as to intersect. The plurality of wires 64a, 64a are arranged at intervals, and the plurality of intersecting wires 64b, 64b are also arranged at intervals. As a result, a plurality of openings 64c, 64c, ... are formed in a lattice pattern in the mesh portion 64. The material of the wires 64a, 64b is not particularly limited as long as it is corrosion-resistant to the plating solution L. Examples of materials for the wires 64a, 64b include resin materials such as polyester.

[0027] The mask portion 65 is fixed to the mesh portion 64. The mask portion 65 has through-holes 68 formed therein according to a predetermined pattern P. The through-holes 68 penetrate the mask portion 65 according to the predetermined pattern P to expose the mesh portion 64. The mask portion 65 is a portion that is brought into close contact with the substrate B during membrane formation by pressure from the electrolyte membrane 13. The material of the mask portion 65 is not particularly limited as long as it can be brought into close contact with the substrate B. For example, the material of the mask portion 65 can be a rubber material such as silicone rubber (PMDS) or ethylene propylene diene rubber (EPDM). The hardness of the rubber material is preferably HS100 or less, and more preferably HS50 or less, in Shore A hardness.

[0028] The mask portion 65 is made of an elastic material that undergoes compressive elastic deformation due to pressure from the electrolyte membrane 13. To ensure close contact with the substrate B, the amount of deformation of the mask portion 65 in the thickness direction (pressing direction) due to pressure from the electrolyte membrane 13 may be within a range of 5 to 20% of the thickness of the mask portion before deformation. A screen mask 62 having a predetermined pattern P can be manufactured using a common silk screen manufacturing technique using an emulsion. As shown in FIGS. 3(a), 3(b), and 4(a), the mask portion 65 is provided on the front and back of the mesh portion 64 and is sandwiched between the electrolyte membrane 13 and the substrate B. The mask portion 65 has a first elastic layer 65a formed on the electrolyte membrane 13 side of the mesh portion 64, and a second elastic layer 65b formed on the substrate B side of the mesh portion 64. The first elastic layer 65a and the second elastic layer 65b are bonded by impregnating the mesh portion 64 with the material of the mask portion 65.

[0029] Furthermore, as shown in FIG. 2, the mask portion 65 has a plurality of grooves 67 formed on the surface of the mask portion 65 facing the electrolyte membrane 13, so as to be continuous with each of the through-portions 68. As shown in FIG. 1(b), the film forming apparatus 1 further includes a suction device 81 that sucks air from the through-portions 68 via the plurality of grooves 67 shown in FIG. 2 while the masking material 60 (the screen mask 62) is in contact with the substrate B. In this embodiment, the suction device 81 is connected to the degassing port 17a of the frame 17. This allows air to be degassed from the grooves 67 before film formation. An example of the suction device 81 is a suction pump.

[0030] As shown in FIG. 2, multiple grooves 67 are formed in the first elastic layer 65a. In this embodiment, the grooves 67 are linear grooves with rectangular cross sections, but this is not limiting. In this embodiment, the groove bottoms 67t of the grooves 67 are surfaces derived from the shapes of the wires 64a and 64b that constitute the mesh portion 64. The wires 64a and 64b may be partially exposed from the groove bottoms 67t. As long as the groove bottoms 67t have irregularities derived from the shapes of the wires 64a and 64b, they may be covered with the material of the mask portion 65. Even if the electrolyte membrane 13 deforms so as to block the grooves 67 during degassing using the suction device 81, a small gap is formed between the groove bottoms 67t and the electrolyte membrane 13 due to the irregularities. This allows air to pass through the grooves 67. The groove width of the grooves 67 is preferably 50 μm to 300 μm. It is more preferable that the width of the recessed groove 67 is smaller than the thickness of the electrolyte membrane 13. This prevents the recessed groove 67 from being blocked by the electrolyte membrane 13 even if the electrolyte membrane 13 is deformed.

[0031] The plurality of grooves 67 include first grooves 67a and second grooves 67b. As shown in FIGS. 2 and 3(a), in this embodiment, the first grooves 67a are provided on the surface of the mask portion 65 facing the electrolyte membrane 13 so as to connect adjacent through-portions 68, 68. The second grooves 67b are also provided on the surface of the mask portion 65 facing the electrolyte membrane 13 so as to connect the through-portions 68 to the frame 61. With the masking material 60 in contact with the base material B, air present between the electrolyte membrane 13 and the masking material 60 can be removed by the suction device 81 via the first grooves 67a and the second grooves 67b.

[0032] Furthermore, in this embodiment, a plurality of intersecting grooves 67d that intersect with the second grooves 67b are formed in the mask portion 65. This improves the air permeability to the second grooves 67b during degassing. The intersecting grooves 67d are grooves that are connected to third grooves 67c (described later), and both ends of the intersecting grooves 67d are connected to the third grooves 67c.

[0033] As shown in FIGS. 2 and 3(c), the frame 61 is formed with a third groove 67c that is connected to all of the second grooves 67b and the intersecting grooves 67d. The third groove 67c circles the frame 61. The frame 61 is formed with a connecting groove 67e that is connected to the third groove 67c and communicates with the degassing port 17a. The suction device 81 sucks air from the through-ports 68 through the third groove 67c via the degassing port 17a and the connecting groove 67e. When the suction device 81 performs suction, it uniformly sucks air from around the pattern P formed by the multiple through-ports 68, thereby improving the degassing properties of the through-ports 68.

[0034] A film formation method using the film formation apparatus 1 will be described with reference to FIGS. 1(a), 1(b), 4(a), and 4(b), etc. First, as shown in FIG. 1(a), the substrate B is placed on the mounting table 40. In this embodiment, the substrate B is accommodated in the recess 44, and the metal layer Ba of the substrate B protrudes from the mounting table 40. This allows the mask portion 65 of the masking material 60 to be in uniform contact with the surface of the substrate B.

[0035] 1(b), the linear actuator 70 is driven to lower the housing 15 toward the substrate B. Since the masking material 60 is integrally attached to the housing 15 at a position facing the electrolyte membrane 13, the surface of the substrate B can be covered with the mask portion 65 of the masking material 60 by lowering the housing 15.

[0036] 4(a), with the masking material 60 in contact with the base material B, the suction device 81 removes air A from the plurality of through-holes 68 via the plurality of grooves 67. By suction by the suction device 81, the air present in the through-holes 68 passes through the first groove 67a, the second groove 67b, etc., and is discharged from the third groove 67c of the frame body 61. Because the inside of the through-holes 68 is an enclosed space, a negative pressure is generated inside the through-holes 68, causing the second elastic layer 65b of the mask portion 65 to elastically deform, and the mask portion 65 to adhere closely to the base material B.

[0037] Next, in a deaerated state, the pump 80 is driven to increase the pressure of the plating solution L contained in the container 15, causing the electrolyte membrane 13 to press against the substrate B via the mask portion 65. Specifically, the plating solution L is supplied to the container space 15a of the container 15. Because the pressure control valve 54 is provided in the liquid discharge pipe 52, the liquid pressure of the plating solution L in the container space 15a is maintained at a predetermined pressure. This pressing force can improve the adhesion of the screen mask 62 to the substrate B. Because the mask portion 65 is made of an elastic material, the mask portion 65 is compressed and elastically deformed by the liquid pressure of the plating solution L, improving the adhesion between the mask portion 65 and the substrate B. Because the mask portion 65 is fixed to the mesh portion 64, the mask portion 65 can be uniformly pressed via the mesh portion 64, as shown in FIG. 4(b). As pressure on the electrolyte membrane 13 continues, the through-holes 68 formed in the screen mask 62 are filled with the seepage liquid (plating solution L) La that seeps out from the electrolyte membrane 13 that has been swollen by the plating solution L. Since air has been removed, almost no air remains in the through-holes 68.

[0038] Next, while maintaining the pressed state by the electrolyte membrane 13, a metal coating F is formed by electroplating. Specifically, a voltage is applied between the anode 11 and the substrate B. This causes metal ions contained in the plating solution L to pass through the electrolyte membrane 13. The metal ions that have passed through the electrolyte membrane 13 migrate to the surface of the substrate B via the leaching liquid La and are reduced on the surface of the substrate B. As a result, as shown in FIG. 2, a metal coating F corresponding to the through portion 68 formed in the mask portion 65 can be stably formed on the surface of the substrate B.

[0039] Furthermore, the exudation liquid La is uniformly pressurized by the pressure of the electrolyte membrane 13, so that a uniform metal coating F can be formed. Thereafter, the linear actuator 70 raises the housing 15, separates the substrate B from the electrolyte membrane 13, and removes the substrate B from the mounting table 40. When manufacturing wiring using the metal coating F, the metal layer Ba formed on the surface of the insulating substrate Bb of the substrate B may be etched, leaving the portion where the metal coating F is formed.

[0040] According to this embodiment, while the mask portion 65 of the masking material 60 is in contact with the substrate B, the suction device 81 can suck air from the through-hole portion 68 through the multiple recessed grooves 67. Therefore, it is not necessary to suck air between the substrate B and the masking material before contacting the substrate B with the masking material. As a result, even if gas generated during electroplating accumulates in the plating solution L in the accommodation space 15a, the mask portion 65 of the masking material 60 is in contact with the substrate B during film formation. Therefore, deformation of the mask portion 65 of the masking material 60 due to the pressure difference with the gas in the accommodation space 15a can be suppressed. As a result, even if the masking material 60 is repeatedly used to form films, plastic deformation of the screen mask 62 of the masking material 60 can be suppressed.

[0041] Furthermore, when the linear actuator 70 raises the housing 15 to separate the substrate B from the electrolyte membrane 13, the weight of the plating solution L can be supported by the masking material 60 via the electrolyte membrane 13. This makes it possible to prevent the electrolyte membrane 13 from being plastically deformed by the weight of the plating solution L.

[0042] [Example] A masking material was produced by forming a mask using silicone rubber on the front and back of a mesh made of LCP resin with a wire diameter of 20 μm and a mesh size of 420 mesh, and forming perforations and recessed grooves with a width of 100 μm in the mask, as shown in Figure 2. The thickness of the mask was 20 μm for the portion located between the electrolyte membrane and the mesh, and 30 μm for the portion located between the mesh and the substrate.

[0043] Next, a copper (Cu) substrate was prepared in a square shape with a thickness of 0.9 mm and a side length of 7.8 cm. The substrate was subjected to cathodic electrolytic degreasing at 55°C for 1 minute using an IC-200RM manufactured by JCU Corporation, and then rinsed with pure water for 1 minute. The substrate was then immersed in 10% diluted sulfuric acid at room temperature for 1 minute for acid cleaning, and then rinsed with pure water for 1 minute.

[0044] Thereafter, a metal film having a thickness of 5 μm was formed on the surface of the substrate by solid phase electrodeposition (SED) using an apparatus having the same configuration as the metal film forming apparatus described in the previous embodiment. The film forming conditions were film forming temperature: 42°C, plating solution: 1 mol / L copper sulfate + 0.2 mol / L sulfuric acid, anode: phosphorus-containing copper plate, anode-cathode electrode distance: 2 mm, pressure: 0.6 MPa, film forming area: 38 cm 2 / Board size 61.4cm 2 , current: 7ASD.

[0045] In Comparative Example 1, only the first groove was provided in the masked portion of the masking material, and before the masking material was brought into contact with the substrate, air was sucked out between the substrate B and the masking material, and then a metal coating similar to that in Example 1 was formed. In Comparative Example 2, no groove was provided in the masking material, and air was sucked out between the substrate B and the masking material, and then a metal coating similar to that in Example 1 was formed. In Comparative Example 3, no groove was provided in the masked portion of the masking material, and a metal coating similar to that in Example 1 was formed without sucking out air between the substrate B and the masking material.

[0046] The metal coating was formed 20 times in Example and Comparative Examples 1 to 3, and the number of defects in the metal coating and the degree of deformation of the masking sheet of the masking material were confirmed. As a result, the number of defects in Example and Comparative Example 1 was 1, the number of defects in Comparative Example 2 was 2, and the number of defects in Comparative Example 3 was 32. Furthermore, the masking sheet of Example 1 showed almost no plastic deformation compared to those of Comparative Examples 1 to 3.

[0047] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various design modifications can be made without departing from the spirit of the present invention as set forth in the claims. [Explanation of symbols]

[0048] 1: film forming device, 13: electrolyte membrane, 40: mounting table, 60: masking material, 61: frame, 64: mesh portion, 65: mask portion, 67: groove, 67a: first groove, 67b: second groove, 67c: third groove, 67d: intersecting groove, 68: through portion, 80: pump (pressure boosting mechanism), 81: suction device, B: substrate, F: metal film, L: plating solution, P: predetermined pattern

Claims

1. A film forming apparatus for forming a metal film of a predetermined pattern on a surface of a substrate by electroplating, The film forming apparatus includes a container that contains a plating solution with an opening facing the substrate covered with an electrolyte membrane, a pressure increasing mechanism that increases the pressure of the plating solution contained in the container, and a masking material that is disposed between the electrolyte membrane and the substrate and attached to the container, the masking material includes a sheet-like mesh portion that allows the plating solution for the electroplating to pass through, and mask portions that are provided on both sides of the mesh portion and are sandwiched between the electrolyte membrane and the base material, the mask portion is formed with a plurality of through-holes that penetrate the mask portion according to the predetermined pattern to expose the mesh portion, and a plurality of recessed grooves that are provided on a surface of the mask portion facing the electrolyte membrane and are continuous with each through-hole, The film forming apparatus for forming a metal film, further comprising a suction device that sucks air from the through-portion through the plurality of grooves while the masking material is in contact with the substrate.

2. a frame for supporting the mesh portion is provided on the periphery of the masking material, The plurality of recessed grooves include a plurality of first recessed grooves provided on a surface of the mask portion facing the electrolyte membrane so as to connect adjacent through portions; a plurality of second grooves provided on a surface of the mask portion facing the electrolyte membrane so as to connect the through portion to the frame body, a third groove connected to the plurality of second grooves is formed in the frame; The metal coating deposition apparatus according to claim 1 , wherein the suction device sucks air from the through-portion through the third groove.

3. 3. The metal film forming apparatus according to claim 2, wherein the mask portion has an intersecting groove formed therein, the intersecting groove intersecting the second groove and connected to the third groove.

4. 4. The metal film forming apparatus according to claim 3, wherein the third groove surrounds the frame and is connected to the second groove and the intersecting groove.

5. A method for forming a metal film using the film forming apparatus according to claim 1, a step of removing air from the through-hole portion through the plurality of recessed grooves by the suction device while the masking material is in contact with the base material; increasing the pressure of the plating solution contained in the container by the pressure increasing mechanism in a state in which the air has been removed, and pressing the substrate with the electrolyte membrane through the mask portion; and forming the metal coating on the surface of the substrate by electroplating while the electrolyte membrane is pressed against the substrate.

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