Power conversion device

Abstract

To provide a power conversion device which is excellent in electrical insulation of an electric component and has good heat dissipation from the electric component.SOLUTION: The power conversion device 4 includes a power module 5 as an electric component in which a metal heat radiation member 52 is arranged at the 51a of one main surface. The electric power converter 4 includes the wall member 31 of the heat exchange member 30. The wall member 31 defines a heat radiation fixing part 60 for fixing the air module 5 to radiate heat from the air module 5. The wall member 31 defines a passage 32 for the heating medium. The air module 5 has at least two side surfaces adjacent to the main surface 51a. The wall member 31 is made of an electrically insulating resin material. The heat radiation fixing portion 60 is provided by the recess 35. The inner surface of recess 35 is disposed to face the main surface 51a and at least two side surfaces. The passage 32 for the heat medium is partitioned so that the heat medium flows along the back of the inner surface of the recess 35.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The disclosure herein relates to power conversion devices. [Background technology]

[0002] Patent Document 1 discloses a technique for cooling a drive circuit in an electric compressor. In Patent Document 1, electrical components molded with electrically insulating resin are cooled by a refrigerant. The contents of the prior art document are incorporated by reference as explanations of the technical elements in this specification. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-124030 Summary of the Invention [Problem to be solved by the invention]

[0004] In a power conversion device including electrical components, it is required to achieve both electrical insulation of the electrical components and heat dissipation from the electrical components. Further improvements are required in power conversion devices in the above respects and in other respects not mentioned above.

[0005] One disclosed object is to provide a power converter that dissipates heat well from electrical components.

[0006] Another disclosed object is to provide a power converter that has excellent electrical insulation between electrical components and also has good heat dissipation from the electrical components. [Means for solving the problem]

[0007] The power conversion device disclosed herein comprises: an electric component (5) that is a flat hexahedron and has a metal heat dissipation member disposed on one of its main surfaces (51a); a heat exchange member (30) having a wall member (31) defining a heat radiation fixing portion (60) on one surface for fixing the electric component to radiate heat from the electric component, and defining a passage (32) for a heat medium on the other surface; The electrical component is It has at least two side surfaces (51c, 51d; 51e, 51f; 51c, 51f) adjacent to the main surface, The wall member is It is made of an electrically insulating resin material. the heat dissipation fixing portion is provided by a recess (35) having at least three inner surfaces (35a, 35c, 35d, 35e, 35f) that are arranged opposite to the main surface and at least two of the side surfaces and are thermally coupled to the main surface and the at least two side surfaces; The passages are defined to allow the heat transfer medium to flow along the rear of at least three of the inner surfaces.

[0008] In the disclosed power conversion device, the wall member on which the electrical components are mounted is made of an electrically insulating resin material. Therefore, electrical insulation is provided even when a metal heat dissipation member is disposed on the main surface of the electrical component. The electrical component dissipates heat from its main surface, which serves as the primary heat dissipation surface, to the wall member and then to the heat medium. In addition, the electrical component dissipates heat from at least two side surfaces adjacent to the main surface to the wall member and then to the heat medium. Therefore, heat dissipation from the electrical component is provided while maintaining electrical insulation of the electrical component.

[0009] The various embodiments disclosed in this specification employ different technical means to achieve their respective objectives. The reference numerals in parentheses in the claims and in this section are intended to exemplify the correspondence with the following embodiments and are not intended to limit the technical scope. The objectives, features, and advantages disclosed in this specification will become more apparent by reference to the following detailed description and the accompanying drawings. [Brief explanation of the drawings]

[0010] [Figure 1]1 is a block diagram of an electrically powered device according to a first embodiment. [Figure 2] FIG. 2 is a cross-sectional view of the power conversion device. [Figure 3] FIG. 2 is a plan view of the power conversion device. [Figure 4] FIG. 2 is an exploded perspective view showing one heat dissipation fixing portion. [Figure 5] FIG. 4 is an enlarged cross-sectional view of a heat dissipation fixing portion. [Figure 6] FIG. 10 is a cross-sectional view of a heat dissipation fixing part of the second embodiment. [Figure 7] FIG. 10 is a cross-sectional view of a heat dissipation fixing part of the third embodiment. [Figure 8] FIG. 10 is a cross-sectional view of a heat dissipation fixing part of the fourth embodiment. [Figure 9] FIG. 11 is a cross-sectional view of a heat dissipation fixing part of the fifth embodiment. [Figure 10] FIG. 13 is an exploded perspective view showing a heat radiation fixing part of the sixth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Several embodiments will be described with reference to the drawings. In several embodiments, functionally and / or structurally corresponding and / or associated parts may be designated by the same reference numerals or reference numerals that differ in the hundredth or more digits. For corresponding and / or associated parts, reference may be made to the descriptions of other embodiments.

[0012] First embodiment FIG. 1 shows a drive system 1 for electric equipment. The drive system 1 provides, for example, a drive system for an electric compressor for a vehicle refrigeration cycle. The drive system 1 of this embodiment can be used in a variety of electric equipment. For example, the drive system 1 can be used in an electric power steering device, an electric hydraulic device, an electric pump, and even an electric mobile device. Furthermore, the electric mobile device includes a human vehicle and a non-rider device. The mobile device is a vehicle that moves on land, a ship that moves on and / or underwater, or an aircraft that moves through the air. The drive system may drive a propeller of the electric mobile device. The drive system 1 includes a rotating electric machine 2 that drives a compressor as a load. The rotating electric machine 2 is, for example, a polyphase AC rotating electric machine. The rotating electric machine 2 rotates, for example, the compressor.

[0013] The drive system 1 includes a power supply device 3 (DCPS). The power supply device 3 supplies at least drive power to the rotating electric machine 2. The power supply device 3 may store power generated by the rotating electric machine 2. The power supply device 3 is, for example, a DC power supply device. The power supply device 3 is provided by, for example, a secondary battery, a fuel cell, or the like.

[0014] The drive system 1 includes a power converter 4 (INV). The power converter 4 adjusts the power supplied from the power supply device 3 and supplies the adjusted power to the rotating electric machine 2. The power converter 4 may adjust the power generated by the rotating electric machine 2 and supply the adjusted power to the power supply device 3. The power converter 4 may include, for example, an inverter circuit having an AC-to-DC conversion function. The power converter 4 may further include, for example, a converter circuit that converts the voltage of the power supply device 3. The power converter 4 may include circuit components such as a capacitor, a reactor, and a control circuit for configuring a power conversion circuit.

[0015] The drive system 1 includes one or more heat-generating electrical components in its electrical circuit. Examples of heat-generating electrical components are bus bars, switching elements, capacitive electrical components, or inductive electrical components. For example, an inverter circuit and / or a converter circuit includes one or more switching elements. The switching elements are an example of a heat-generating electrical component. In many cases, the inverter circuit and / or the converter circuit includes multiple switching elements. The electrical component is a flat hexahedron. A metal heat dissipation member is disposed on one main surface of the electrical component.

[0016] One or more switching elements are provided in a semiconductor package called an element module 5. An example of a switching element is illustrated by a symbol in the figure. The element module 5 is one of the main heat-generating devices in the power conversion device 4. One element module 5 may include one or more switching elements. One element module 5 may include multiple switching elements. The element module 5 may be an assembly of multiple semiconductor packages. In this embodiment, all of the switching elements constituting the power conversion device 4 are housed in a dispersed manner in multiple element modules 5. The element module 5 is a flat hexahedron. The element module 5 has a metal heat dissipation member on one main surface 51a. At least a portion of the surface of the heat dissipation member is exposed on the surface of the element module 5. The metal heat dissipation member also serves as a current-carrying electrode in the element module 5. Therefore, the metal heat dissipation member is charged to a predetermined potential in the electric circuit.

[0017] The drive system 1 includes a temperature control device for heat-generating equipment. The temperature control device controls the temperature of one or more element modules 5 of the power conversion device 4. The temperature control device includes a heat exchanger 6 (HEX) that exchanges heat with the element module 5. The heat exchanger 6 provides heat exchange between the element module 5 and a heat exchange medium.

[0018] The temperature control device includes a medium system 7 (CL) that supplies a heat medium to the heat exchanger 6. The heat medium is provided as a liquid or gas. The heat medium is a liquid called water, oil, coolant, antifreeze, etc. The heat medium may be provided as a refrigerant in a vapor compression refrigeration cycle. The medium system 7 supplies the heat medium to the heat exchanger 6 to lower the temperature of the element module 5. The medium system 7 may also be called a heat dissipation system. The heat medium may also be called a heat dissipation medium or a cooling medium. The medium system 7 may include, for example, a passage pipe for circulating the heat medium and a pump. The medium system 7 may include a heat dissipation heat exchanger that lowers the temperature of the heat medium. The heat dissipation heat exchanger provides, for example, heat exchange between the heat medium and the atmosphere. The medium system 7 may include a refrigeration cycle that supplies a low-temperature heat medium. In this case, the medium system 7 is a vapor compression refrigeration cycle. The heat medium is a refrigerant that circulates through the refrigeration cycle. A refrigerant is a medium that undergoes a phase transition from liquid to gas and / or from gas to liquid during a heat absorption process and / or a heat release process.

[0019] In FIG. 2, the power conversion device 4 has a housing 10, a circuit board 20, and a heat exchange member 30. The housing 10 is made of a conductive metal or an electrically insulating resin. The housing 10 accommodates the power conversion device 4. The housing 10 allows the power conversion device 4 to be handled as a unit. The circuit board 20 is a printed circuit board including an electric circuit electrically connected to electronic components. In this embodiment, the circuit board 20 is a multilayer circuit board. The circuit board 20 includes a power conversion circuit including an inverter circuit and / or a converter circuit. The circuit board 20 may include a control circuit including a processor that executes a program for controlling the power conversion circuit.

[0020] The power conversion device 4 has an element module 5 as an electrical component. The power conversion device 4 is equipped with a plurality of element modules 5. One element module 5 is a flat hexahedron. The element module 5 is a flat rectangular parallelepiped. The element module 5 has chamfered or curved corners. The element module 5 has an outer surface and shape that allows it to be press-fitted into a recess 35 described below.

[0021] One element module 5 has one of the widest faces of the hexahedron as a main surface 51a for heat dissipation. The element module 5 has a metal heat dissipation member 52 on one main surface 51a. The heat dissipation member 52 also serves as an electrode in the element module 5. Therefore, the heat dissipation member 52 is charged to a predetermined potential when the electric circuit is functioning. The heat dissipation member 52 is arranged so that one surface of the heat dissipation member 52 is exposed to the main surface 51a.

[0022] One element module 5 has a plurality of electrical connection members 53. The element module 5 as an electrical component and the circuit board 20 are electrically connected by the electrical connection members 53. The plurality of connection members 53 include power lines for flowing the electric power to be controlled. The plurality of connection members 53 include signal lines for transmitting control signals. The connection members 53 are provided by lead wires extending from the element module 5. The connection members 53 are connected to lands on the circuit board 20 by soldering, for example.

[0023] The element module 5 has the above-mentioned principal surface 51a as a first principal surface and a second principal surface 51b. The principal surface 51b is a surface located opposite to the principal surface 51a. The plurality of connection members 53 extend from the principal surface 51b toward the circuit board 20. The connection members 53 are provided by I-shaped electrical conductors. The plurality of connection members 53 may also extend from other surfaces of the element module 5. For example, as in an embodiment described below, the plurality of connection members 53 can extend from one of the plurality of side surfaces, pass through a bent portion, and extend toward the circuit board 20. In this case, the connection members 53 are provided by L-shaped electrical conductors.

[0024] The heat exchange member 30 provides a part of the heat exchanger 6. The heat exchange member 30 includes a heat dissipation fixing part 60. The heat dissipation fixing part 60 enables heat dissipation from the element module 5. The heat dissipation fixing part 60 adjusts the temperature of the element module 5 by dissipating heat from the element module 5. The element module 5 is fixed to the heat dissipation fixing part 60.

[0025] The power conversion device 4 includes a fixing member 70 for fixing the element module 5 to the heat exchange member 30. The fixing member 70 is provided by a screw member 71 that tightens the element module 5 toward the heat exchange member 30. The screw member 71 is threadedly engaged with a wall member 31, which will be described later. The screw member 71 tightens the element module 5 toward the wall member 31 along the thickness direction of the element module 5.

[0026] The heat exchange member 30 has a wall member 31. The wall member 31 is made of an electrically insulating resin material. The wall member 31 has a heat dissipation fixing portion 60 on one surface for mounting the element module 5. The wall member 31 defines a passage 32 for a heat medium on the other surface. In the illustrated example, the heat exchange member 30 is provided as an independent heat exchanger that defines the passage 32 for flowing the heat medium. The heat exchange member 30 has a heat medium inlet 33 and a heat medium outlet 34. When the power conversion device 4 is functioning, the heat medium flows through the passage 32 in the direction of the arrow.

[0027] The heat dissipation fixing portion 60 is provided by a recess 35 formed in the wall member 31. The recess 35 is a hexahedral recess having an opening on only one side. The recess 35 has an inner surface. The inner surface is partitioned by a plurality of flat surfaces. The plurality of flat surfaces are arranged opposite to the plurality of surfaces of the element module 5 and are thermally coupled to promote heat dissipation from the element module 5.

[0028] By providing a recess 35 on one surface of the wall member 31, a protrusion 36 is formed on the other surface, i.e., the back surface, of the wall member 31. The protrusion 36 protrudes toward the passage 32. The protrusion 36 narrows the flow path cross-sectional area of ​​the passage 32. The passage 32 has an average flow path cross-sectional area A32. The flow path cross-sectional area is the cross-sectional area of ​​the passage 32 perpendicular to the flow direction of the heat medium. The passage 32 has a flow path cross-sectional area A36 behind the protrusion 36. The passage cross-sectional area A32 is larger than the passage cross-sectional area A36 (A32 > A36). The flow rate of the heat medium flowing through the passage 32 is accelerated behind the protrusion 36. Heat from the element module 5 accommodated in the recess 35 is transferred to the wall member 31 at the recess 35, and then transferred from the protrusion 36 to the heat medium. As a result of the increased flow rate of the heat medium behind the protrusions 36, heat dissipation from the element modules 5 via the wall members 31 is promoted.

[0029] The heat exchange member 30 defines a side passage 37 for the heat medium so as to surround the heat dissipation fixing portion 60. From another perspective, the side passage 37 for the heat medium is arranged so as to surround the side surface of the element module 5. The side passage 37 is arranged behind the wall member 31 facing the side surface of the element module 5. The side passage 37 surrounding the side surface of the element module 5 promotes heat dissipation from the element module 5 to the heat medium.

[0030] 2, the power conversion device 4 includes a plurality of element modules 5 as a plurality of electric components. The heat exchange member 30 includes a plurality of heat dissipation fixing portions 60, i.e., a plurality of recesses 35, corresponding to the plurality of element modules 5. Two element modules 5 and two recesses 35 are shown in the figure.

[0031] 3, the circuit board 20 and the heat exchange member 30 are arranged in a layered manner, at least partially overlapping each other. The circuit board 20 includes an electric circuit electrically connected to the plurality of element modules 5. The circuit board 20 extends to cover the plurality of heat dissipation fixing parts 60. In other words, the circuit board 20 extends to cover the plurality of recesses 35. The circuit board 20 overlaps with all of the plurality of heat dissipation fixing parts 60. This achieves a short electrical connection between the circuit board 20 and the plurality of heat dissipation fixing parts 60.

[0032] In FIG. 4, the element module 5 has a three-dimensional shape defined by multiple planes. The element module 5 has an external shape that can be called a flat rectangular parallelepiped. The external appearance of the element module 5 is mainly provided by a resin material. The element module 5 has a main body 51. The main body 51 is a so-called semiconductor resin package. The element module 5 has a heat dissipation member 52 made of metal. The element module 5 has multiple connection members 53. The element module 5 has through holes 54 for receiving screw members 71.

[0033] Due to its flat shape, the element module 5 has two main surfaces 51a and 51b with the largest areas. The heat dissipation member 52 is disposed on the main surface 51a. The heat dissipation member 52 is disposed and exposed on the main surface 51a. The heat dissipation member 52 is electrically connected to the semiconductors serving as switching elements. The main surface 51a provides the main heat dissipation surface of the element module 5. The main surface 51b provides the exposed surface facing the circuit board 20.

[0034] The element module 5 has at least a pair of side surfaces adjacent to the main surfaces 51a, 51b. The pair of side surfaces function as auxiliary heat dissipation surfaces of the element module 5. The pair of side surfaces includes two side surfaces. The pair of side surfaces may be opposite sides located on opposite sides of the element module 5. Alternatively, or additionally, the pair of side surfaces may be adjacent side surfaces that are adjacent to each other among the four side surfaces of the element module 5.

[0035] An example of a pair of side surfaces includes opposite side surface 51c and opposite side surface 51d. Opposite side surfaces 51c and 51d face in opposite directions from each other on element module 5. Opposite side surface 51c and opposite side surface 51d may also be referred to as longitudinal side surfaces that extend in the longitudinal direction among the four side surfaces. Therefore, element module 5 has at least three surfaces that essentially serve as heat dissipation surfaces. In one example, the three surfaces that contribute to heat dissipation include main surface 51a and two opposite side surfaces 51c and 51d adjacent to main surface 51a.

[0036] Another example of a pair of side surfaces includes opposite side surface 51e and opposite side surface 51f. Opposite side surfaces 51e and 51f face in opposite directions from each other on element module 5. Opposite side surface 51e and opposite side surface 51f may also be called short side surfaces that extend in the short direction among the four side surfaces. In this example, element module 5 also has at least three surfaces that essentially serve as heat dissipation surfaces. In this example, the three surfaces that contribute to heat dissipation include main surface 51a and two opposite side surfaces 51e and 51f adjacent to main surface 51a.

[0037] Another example of the pair of side surfaces includes either one of the side surfaces 51c and 51d, and either one of the side surfaces 51e and 51f. In this example, the element module 5 also has at least three surfaces that essentially serve as heat dissipation surfaces.

[0038] In the illustrated embodiment, the element module 5 has two pairs of side surfaces adjacent to the main surfaces 51a and 51b. The element module 5 also has side surfaces 51c, 51d, 51e, and 51f. These side surfaces 51c, 51d, 51e, and 51f function as auxiliary heat dissipation surfaces for the element module 5.

[0039] The distance between the two opposite surfaces 51c, 51d of the element module 5 is a distance WD5. The distance WD5 is the dimension in the width direction WD. The distance between the two opposite surfaces 51e, 51f of the element module 5 is a distance LG5. The distance LG5 is the dimension in the depth direction LG. The distance between the two main surfaces 51a, 51b of the element module 5 is a distance TH5. The distance TH5 is the dimension in the thickness direction TH. The distance TH5 is also called the height of the element module 5.

[0040] 4, the heat dissipation fixing portion 60 is defined by a recess 35. The recess 35 has an external shape that can be called a concave rectangular parallelepiped. The external appearance of the recess 35 is provided by a wall member 31 made of a resin material.

[0041] The multiple flat surfaces forming the recess 35 have an inner bottom surface 35a. The ceiling surface facing the inner bottom surface 35a is the opening end 35b of the recess 35. The inner bottom surface 35a and the opening end 35b are located on opposite sides of the recess 35. The element module 5 is fixed directly or indirectly to the inner bottom surface 35a. The element module 5 is thermally coupled to the inner bottom surface 35a. As a result, the element module 5 dissipates heat from the main surface 51a to the inner bottom surface 35a. The inner bottom surface 35a provides the main heat exchange surface of the wall member 31.

[0042] The recess 35 has at least a pair of inner surfaces adjacent to the inner bottom surface 35a. The inner surfaces are flat. The pair of inner surfaces function as auxiliary heat exchange surfaces of the recess 35. The pair of inner surfaces includes two inner surfaces. The pair of inner surfaces may be inner surfaces located on opposite sides of the recess 35. Alternatively, or additionally, the pair of inner surfaces may be adjacent sides of the four inner surfaces of the recess 35 that are adjacent to each other.

[0043] An example of a pair of inner surfaces includes inner surface 35c and inner surface 35d. Inner surface 35c and inner surface 35d may also be referred to as longitudinal inner surfaces, which are the four sides of the recess 35 and extend in the longitudinal direction. Therefore, the recess 35 has at least three surfaces that essentially serve as heat exchange surfaces. In one example, the three surfaces that contribute to heat exchange include inner bottom surface 35a and two opposite inner surfaces 35c and 35d adjacent to inner bottom surface 35a.

[0044] Another example of a pair of side surfaces includes inner side surface 35e and inner side surface 35f. Inner side surface 35e and inner side surface 35f may also be referred to as short inner side surfaces that extend in the short direction among the four side surfaces. In this example, element module 5 also has at least three surfaces that essentially serve as heat exchange surfaces. In this example, the three surfaces that contribute to heat exchange include inner bottom surface 35a and two opposite inner side surfaces 35e and 35f adjacent to inner bottom surface 35a.

[0045] Another example of the pair of side surfaces includes either one of inner side surface 35c and inner side surface 35d, and either one of inner side surface 35e and inner side surface 35f. In this example, element module 5 also has at least three surfaces that essentially serve as heat exchange surfaces. In this example, recess 35 has open ends on two or three of the six faces.

[0046] In the illustrated embodiment, the recess 35 has two pairs of inner side surfaces adjacent to the inner bottom surface 35a. The recess 35 has inner side surfaces 35c, 35d, 35e, and 35f. These inner side surfaces 35c, 35d, 35e, and 35f function as auxiliary heat exchange surfaces of the recess 35. In this manner, the heat dissipation fixing portion 60 is provided by the recess 35. The recess 35 has at least three inner surfaces. The three inner surfaces include the inner bottom surface 35a, which is disposed opposite to and thermally coupled with the main surface 51a of the element module 5. Furthermore, the three inner surfaces include inner side surfaces, which are disposed opposite to and thermally coupled with at least two side surfaces of the element module 5. The two side surfaces of the element module 5 are two of the side surfaces 51c, 51d, 51e, and 51f. The inner surfaces of the recess 35 are two of the inner surface 35c, the inner surface 35d, the inner surface 35e, and the inner surface 35f.

[0047] The distance between the two inner surfaces 35c, 35d of the recess 35 is a distance WD35. The distance WD35 is the dimension in the width direction WD. The distance between the two inner surfaces 35e, 35f of the recess 35 is a distance LG35. The distance LG35 is the dimension in the depth direction LG. The distance between the inner bottom surface 35a and the opening end 35b of the recess 35 is a distance TH35. The distance TH35 is the dimension in the thickness direction TH. The distance TH35 is also called the depth of the recess 35.

[0048] The main surface 51a of the element module 5 and the inner bottom surface 35a of the recess 35 are disposed opposite to each other. The main surface 51a and the inner bottom surface 35a are strongly thermally coupled to each other so as to provide heat dissipation from the element module 5. The main surface 51a and the inner bottom surface 35a are in direct or indirect contact with each other.

[0049] The side surface 51c of the element module 5 and the inner surface 35c of the recess 35 are arranged opposite to each other. The side surface 51c and the inner surface 35c are strongly thermally coupled to each other so as to provide heat dissipation from the element module 5. The side surface 51c and the inner surface 35c are in direct or indirect contact with each other.

[0050] The side surface 51d of the element module 5 and the inner surface 35d of the recess 35 are arranged opposite to each other. The side surface 51d and the inner surface 35d are strongly thermally coupled to each other so as to provide heat dissipation from the element module 5. The side surface 51d and the inner surface 35d are in direct or indirect contact with each other.

[0051] The side surface 51e of the element module 5 and the inner surface 35e of the recess 35 are disposed opposite to each other. The side surface 51e and the inner surface 35e are strongly thermally coupled to each other so as to provide heat dissipation from the element module 5. The side surface 51e and the inner surface 35e are in direct or indirect contact with each other.

[0052] The side surface 51f of the element module 5 and the inner surface 35f of the recess 35 are arranged opposite to each other. The side surface 51f and the inner surface 35f are strongly thermally coupled to each other so as to provide heat dissipation from the element module 5. The side surface 51f and the inner surface 35f are in direct or indirect contact with each other.

[0053] The distance WD5 is equal to or greater than the distance WD35 (WD5≧WD35). The distance LG5 is equal to or greater than the distance LG35 (LG5≧LG35). The manufacturing method for the power conversion device 4 includes a press-fitting step of press-fitting the element module 5 into the recess .

[0054] In the press-fitting process, the element module 5 and / or the wall member 31 are deformed. In this embodiment, the wall member 31 is deformed. The element module 5 is also slightly deformed, but the press-fitting is mainly enabled by the deformation of the wall member 31. Therefore, the wall member 31 is softer than the element module 5 due to its material and structure. Alternatively, both the element module 5 and the wall member 31 may be deformed. Furthermore, alternatively, only the element module 5 may be deformed.

[0055] In the press-fitting process, the deformation occurs in the width direction WD and / or the depth direction LG. In this embodiment, the deformation occurs in both the width direction WD and the depth direction LG. Alternatively, the deformation may occur in either the width direction WD or the depth direction LG.

[0056] After the press-fitting step, the side surfaces 51c and 51d are maintained in a state of being pressed firmly against the inner side surfaces 35c and 35d. After the press-fitting step, the side surfaces 51e and 51f are maintained in a state of being pressed firmly against the inner side surfaces 35e and 35f.

[0057] 5 illustrates the state of the element module 5 in the recess 35. The figure shows a semiconductor chip 55 electrically connected to the heat dissipation member 52. In this embodiment, the semiconductor chip 55 provides a switching element. The figure shows a side surface 51c of the element module 5 and an inner surface 35c of the recess 35 as representative examples. The other side surfaces 51d, 51e, and 51f and inner surfaces 35d, 35e, and 35f also have the illustrated state.

[0058] In the press-fitting process in which the element module 5 is press-fitted into the recess 35, the wall member 31 is elastically deformed. The wall member 31 is deformed so as to slightly increase the distances WD35 and LG35 of the recess 35. The recess 35 receives the element module 5 due to the deformation of the wall member 31. Alternatively or additionally, the element module 5 may be elastically deformed.

[0059] After the press-fitting process, i.e., after the element module 5 has passed through, the wall member 31 undergoes restoration deformation due to its own elasticity. The restoration deformation deforms the inner surface 35c of the recess 35 so as to slightly reduce the distances WD35 and LG35 of the recess 35. As a result, after the element module 5 has passed, the inner surface 35c rises slightly to prevent the element module 5 from falling off. A rise 72 caused by the elastic deformation of the wall member 31 functions as a fixing member 70 that fixes the element module 5. The initial distances WD35 and LG35 that define the recess 35 before the press-fitting process are less than the distances WD5 and LG5 that define the element module 5 (WD5≧WD35, LG5≧LG35). In contrast, the distances that define the recess 35 after the press-fitting process take a value between the distances WD35 and LG35 and the distances WD5 and LG5 due to the rise 72.

[0060] 2, the passage 32 is defined so that the heat medium flows along the rear of the inner bottom surface 35a. The side passage 37 is defined so that the heat medium flows along the rear of the inner surfaces 35c, 35d, 35e, and 35f. Therefore, the heat medium passage 32 including the side passage 37 is defined so that the heat medium flows along the rear of at least three inner surfaces.

[0061] In Figure 5, the wall member 31 defines a side passage 37. The side passage 37 extends behind the inner surface 35c of the recess 35. Although the inner surface 35c is representatively shown in the figure, the side passages 37 are also similarly arranged on the inner surfaces 35d, 35e, and 35f. The side passage 37 extends wider than the side surface 51c of the element module 5 that faces the inner surface 35c.

[0062] In the illustrated example, the side surface 51c of the element module 5 extends over a distance TH5. The increase in the depth of the recess 35 increases the effective heat exchange surface EFX of the side passage 37. The effective heat exchange surface EFX extends wider than the distance TH5. The depth of the recess 35 (distance TH35) is greater than the distance TH5 (TH35>TH5). The height of the element module 5 (distance TH5) plus the thickness TH31 of the wall member 31 is less than or equal to the depth of the recess 35 (distance TH35) (TH5+TH31≦TH35). In other words, a wider area for heat exchange is provided than the side surface 51c. The entire side surface 51c of the element module 5 faces the heat medium of the side passage 37 in the thickness direction via the wall member 31. As a result, the side surface 51c of the element module 5 can dissipate heat from the inner surface 35c via the wall member 31 to the heat medium of the side passage 37. Moreover, the entire side surface 51c of the element module 5 can contribute to heat dissipation. In this embodiment, the side passage 37 is provided so as to surround the recess 35. Therefore, the above-described heat dissipation relationship is provided on all of the side surfaces 51d, 51e, and 51f. It is preferable that the above-described heat dissipation relationship is provided on at least one side surface. Furthermore, it is preferable that the above-described heat dissipation relationship is provided on two opposing side surfaces.

[0063] The power converter 4 of this embodiment provides a structure for dissipating heat from the element modules 5 serving as electrical components. The wall members 31 that fix the element modules 5 are made of an electrically insulating resin material. Therefore, even if a metal heat dissipation member 52 is disposed on the main surface 51a of the element modules 5, electrical insulation is provided. The element modules 5 dissipate heat from the main surface 51a, which serves as the main heat dissipation surface, to the wall members 31, and then to the heat medium. In addition, the element modules 5 dissipate heat from at least two side surfaces adjacent to the main surface 51a to the wall members 31, and then to the heat medium. Therefore, heat dissipation from the element modules 5 is provided while maintaining electrical insulation of the element modules 5.

[0064] Second embodiment This embodiment is a modification based on the preceding embodiment. In the preceding embodiment, a screw member 71 is used as the fixing member 70. Instead, in this embodiment, an elastic spring member 273 provides the fixing member 70.

[0065] As shown in FIG. 6 , the element module 5 is fixed to the recess 35 by a fixing member 70. The fixing member 70 includes a spring member 273 that contacts the element module 5. A preload is applied to the spring member 273 so as to press the element module 5 against the recess 35. The spring member 273 is elastically deformed so as to fix the element module 5 to the recess 35. The fixing member 70 includes a screw member 274 for fixing the spring member 273. The screw member 274 fixes the spring member 273 to the wall member 31. The screw member 274 fixes the spring member 273 to the wall member 31 so as to apply a preload to the spring member 273.

[0066] The element module 5 is in indirect contact with the heat dissipation fixing part 60 via the heat transfer member 80. The heat transfer member 80 provides high heat transfer performance between the members. The heat transfer member 80 is provided by a plate-like member 281 called a heat spreader or a member called thermal transfer grease. Heat from the semiconductor chip 55 is transferred to the wall member 31 via the heat transfer member 80, and then to the heat medium via the wall member 31.

[0067] In this embodiment as well, the heat medium passage is defined so that the heat medium flows along the rear of the inner surface of the recess 35. Moreover, behind the inner surface of the recess 35, the passage 32 extends wider than the side surface of the element module 5 that faces the inner surface.

[0068] Third embodiment This embodiment is a modification of the preceding embodiment. In the preceding embodiment, the entire heat exchange member 30 is made of an electrically insulating resin material. Instead, in this embodiment, only the wall member 31 is made of an electrically insulating resin material.

[0069] 7, the heat exchange member 30 is provided by combining a first member as a wall member 31 and a second member 338. The first member is made of an electrically insulating resin material. The second member 338 is made of a metal such as aluminum. In this embodiment, the wall member 31 also defines a heat dissipation fixing portion 60 on one surface and defines a passage 32 on the other surface.

[0070] Fourth embodiment This embodiment is a modification based on the preceding embodiment. In the preceding embodiment, the heat exchange member 30 defines a passage for the heat medium by itself. Instead, in this embodiment, the heat exchange member 30 defines a passage in cooperation with another member such as the housing 10.

[0071] 8, the heat exchange member 30 includes a wall member 31. The wall member 31 defines a passage 32 for the heat medium in cooperation with a housing 10 serving as a second member 438. The housing 10 is, for example, the housing of an electric compressor. The passage 32 is a low-pressure refrigerant space within the electric compressor. In this embodiment, the wall member 31 also defines a heat dissipation fixing portion 60 on one surface and defines the passage 32 on the other surface.

[0072] The element module 5 is connected to the circuit board 20 by a connection member 453. The connection member 453 includes a detachable connector. In this embodiment, an electrical connection is provided by connecting a connector provided at the tip of a lead wire extending from the element module 5 to a connector mounted on the circuit board 20.

[0073] Fifth embodiment This embodiment is a modification based on the preceding embodiment. In the above embodiment, the heat dissipation fixing portion 60 is provided by a recess 35 having a hexahedron with only one open surface. Alternatively, in this embodiment, the heat dissipation fixing portion 60 may be provided by a recess having two or three open surfaces. The illustrated recess 535 has three adjacent hexahedron surfaces open.

[0074] In FIG. 9, the recess 535 has openings on three sides of a hexahedron. The three sides are adjacent to each other and do not face each other. The element module 5 is arranged so that three sides of the element module 5 are thermally coupled to three sides of the recess 535. In other words, the element module 5 is arranged so that the corners of the element module 5 are positioned at the corners of the recess 535. The main surface 51a of the element module 5 is arranged so as to face the inner bottom surface 35a of the recess 35. The side surface 51c of the element module 5 is arranged so as to face the inner surface 35c of the recess 35. The side surface 51f of the element module 5 is arranged so as to face the inner surface 35f of the recess 35.

[0075] In this embodiment, the heat dissipation fixing portion 60 is also provided by a recess 535. The recess 535 is disposed opposite the main surface 51a of the element module 5 and has an inner bottom surface 35a that is thermally coupled to the main surface 51a. Furthermore, the recess 535 is disposed opposite the two side surfaces 51c and 51f of the element module 5 and has inner surfaces 35c and 35f that are thermally coupled to the main surface 51a and the bottom surface 35a. Furthermore, the heat medium passage is defined so that the heat medium flows along the back of the inner surfaces 35c and 35f of the recess 535. Moreover, the passage 32 extends wider behind the inner surfaces 35c and 35f of the recess 535 than the side surfaces 51c and 51f of the element module 5 that face the inner surfaces 35c and 35f.

[0076] Sixth embodiment This embodiment is a modification of the preceding embodiment. In the preceding embodiment, a plurality of connection members 53 are arranged on the main surface 51b of the element module 5. Instead, a plurality of connection members 653 in this embodiment are arranged on one of the side surfaces of the element module 5. Furthermore, the heat dissipation fixing portion 60 is provided by a recess 35 having an additional recess 639.

[0077] 10, the element module 5 includes a plurality of connection members 653 on the side surface 51e. Each of the plurality of connection members 653 extends from the side surface 51e. Each of the plurality of connection members 653 has a bent portion at a position a predetermined distance away from the side surface 51e. Each of the plurality of connection members 653 is bent at a substantially right angle at the bent portion. Each of the plurality of connection members 653 extends from the bent portion toward the circuit board 20. Thus, each of the plurality of connection members 653 is provided by an L-shaped electrical conductor.

[0078] The recess 35 has a main recess 635 and an additional recess 639. The main recess 635 and the additional recess 639 share an open end 35b. The main recess 635 is a cavity for receiving the main body 51 of the element module 5. The main recess 635 is defined by an inner bottom surface 35a, a plurality of inner side surfaces 35c, 35d, and 35f, and a virtual inner side surface 35e. Note that the virtual inner side surface 35e is the inner side surface 35e in the preceding embodiment. In this embodiment, the inner side surface 35e is provided by two partial inner side surfaces 635e. The two partial inner side surfaces 635e are provided by both shoulder regions of the inner side surface 35e in the width direction WD.

[0079] The additional recess 639 is a cavity for receiving the multiple connecting members 653. The additional recess 639 is a cavity provided adjacent to the main recess 635. The additional recess 639 is defined by multiple inner surfaces. The additional recess 639 is a recess for preventing interference between the multiple connecting members 653 and the wall member 31.

[0080] The additional recess 639 has a distance LGp in the depth direction LG. The distance LGp is ​​equal to or greater than the protrusion distance of the connecting members 653 from the side surface 51e. The distance LGp is ​​smaller than the distance LG35 of the main recess 635. The additional recess 639 has a distance WDp in the width direction WD. The distance WDp is equal to or greater than the arrangement range of the multiple connecting members 653. The distance WDp is smaller than the distance WD35 of the main recess 635. Therefore, a step shape is formed at the boundary between the main recess 635 and the additional recess 639. This step shape provides two partial inner surfaces 635e. The volume of the additional recess 639 is smaller than the volume of the main recess 635. Therefore, the additional recess 639 is disposed adjacent to the main recess 635 so as to protrude. In this embodiment, the additional recess 639 prevents the multiple connecting members 653 from contacting the wall member 31. Note that at least one of the multiple connecting members 653 may contact the wall member 31. The wall member 31 made of a resin material maintains an electrically insulated state even if contact occurs between at least one of the plurality of connecting members 653 and the wall member 31 .

[0081] The two partial inner side surfaces 635e are positioned opposite the side surface 51e. The side surface 51e has a central region in which a plurality of connecting members 653 are arranged and shoulder regions on both sides of the central region in the width direction WD. The two partial inner side surfaces 635e face the shoulder regions of the side surface 51e. The two partial inner side surfaces 635e are thermally coupled to the shoulder regions of the side surface 51e. As a result, the element module 5 exchanges heat with the heat medium via the shoulder regions of the side surface 51e, the two partial inner side surfaces 635e, and the wall member 31. The two partial inner side surfaces 635e are in mechanical contact with the shoulder regions of the side surface 51e. The element module 5 is press-fitted into the recess 35 so as to provide contact between the inner side surface 35f and the side surface 51f and between the two partial inner side surfaces 635e and the side surface 51e. In other words, the positioning in the depth direction LG is achieved by the contact between the inner side surface 35f and the side surface 51f and the contact between the two partial inner side surfaces 635e and the side surface 51e.

[0082] The amount of heat exchange between the element module 5 and the heat medium via the shoulder regions of the side surface 51e and the two partial inner side surfaces 635e depends on the area of ​​the shoulder regions of the side surface 51e and the two partial inner side surfaces 635e. It is desirable to provide side passages 37 behind the two partial inner side surfaces 635e. However, this area may be insufficient to provide a significant amount of heat exchange. In this case, a configuration in which the side passages 37 are not provided behind the two partial inner side surfaces 635e may also be employed.

[0083] In this embodiment, the main recess 635 has a distance WD35, and the additional recess 639 has a distance WDp. The two partial inner surfaces 635e are provided by a step shape formed at the boundary between the main recess 635 and the additional recess 639. Alternatively, the main recess 635 and the additional recess 639 may have a common distance WDp. In this case, the two partial inner surfaces 635e may be provided by providing a protruding member at the boundary between the main recess 635 and the additional recess 639.

[0084] In the process of press-fitting the element module 5 into the recess 35, the main body portion 51 is press-fitted into the main recess 635. During and after the press-fitting process, the side surface 51c is pressed against the inner side surface 35c, and the side surface 51d is pressed against the inner side surface 35d. Furthermore, during and after the press-fitting process, both shoulder regions of the side surface 51e are pressed against the inner side surface 635e, and the side surface 51f is pressed against the inner side surface 35f. At the same time, the multiple connecting members 653 are received in the additional recess 639. In this embodiment, the multiple connecting members 653 are accommodated in the additional recess 639 without contacting the wall member 31. As described above, at least one of the multiple connecting members 653 may be in contact with the wall member 31.

[0085] According to this embodiment, the connection member 653 can be arranged on the side surface of the element module 5. Even in this case, the temperature of the element module 5 can be adjusted by using the main surface and at least two side surfaces of the element module 5. Moreover, it is possible to provide the power conversion device 4 that is excellent in electrical insulation of the element module 5 which is an electrical component and has good heat dissipation from the electrical component.

[0086] Other embodiments The disclosure in this specification, drawings, etc. is not limited to the illustrated embodiments. The disclosure includes the illustrated embodiments and modifications by those skilled in the art based on them. For example, the disclosure is not limited to the combination of parts and / or elements shown in the embodiments. The disclosure can be implemented by various combinations. The disclosure can have additional parts that can be added to the embodiments. The disclosure includes those in which parts and / or elements of the embodiments are omitted. The disclosure includes the replacement or combination of parts and / or elements between one embodiment and another embodiment. The technical scope disclosed is not limited to the description of the embodiments. Some of the technical scopes disclosed are indicated by the description of the claims, and should be understood to include all changes within the meaning and scope equivalent to the description of the claims.

[0087] Instead of the above embodiment, for example, the distance WD5 may be formed to be WD5≥WD35 and the distance LG5 may be formed to be LG5<LG35. Thereby, heat dissipation via the relatively wide side surfaces 51c and 51d can be enabled. Instead of the above embodiment, for example, the distance WD5 may be formed to be WD5<WD35 and the distance LG5 may be formed to be LG5≥LG35. Thereby, heat dissipation via the side surfaces 51e and 51f can be enabled while reducing the pressing force required for the press-fitting process.

[0088] Alternatively to the above embodiment, for example, the heat dissipation fixing part 60 may be a hexahedron having two opposing open faces and one open face between the two open faces. In this case, the recessed part may also be expressed as a groove. Furthermore, instead of the above embodiment, for example, the heat dissipation fixing part 60 may be provided by a hexahedron having two adjacent open faces.

[0089] (Disclosure of technical ideas) This specification discloses multiple technical ideas described in the following multiple clauses. Some clauses may be written in a multiple dependent form, with the subsequent clause referring to the preceding clause as an alternative. Furthermore, some clauses may be written in a multiple dependent form, referring to another multiple dependent clause. These multiple dependent clauses define multiple technical ideas.

[0090] (Technical thought 1) an electric component (5) that is a flat hexahedron and has a metal heat dissipation member disposed on one of its main surfaces (51a); a heat exchange member (30) having a wall member (31) defining a heat radiation fixing portion (60) on one surface for fixing the electric component to radiate heat from the electric component, and defining a passage (32) for a heat medium on the other surface; The electrical component is It has at least two side surfaces (51c, 51d; 51e, 51f; 51c, 51f) adjacent to the main surface, The wall member is It is made of an electrically insulating resin material. the heat dissipation fixing portion is provided by a recess (35) having at least three inner surfaces (35a, 35c, 35d, 35e, 35f) that are arranged opposite to the main surface and at least two of the side surfaces and are thermally coupled to the main surface and the at least two side surfaces; The passage is partitioned to allow the heat medium to flow along the rear of at least three of the inner surfaces.

[0091] (Technical thought 2) At least three of the inner surfaces of the recess are an inner surface (35c, 35d, 35e, 35f) disposed opposite the side surface of the electrical component and thermally coupled to the side surface; The power converter according to Technical Idea 1, wherein the passage extends wider behind the inner surface than the side surface of the electrical component facing the inner surface.

[0092] (Technical Thought 3) The two sides of the electrical component are two opposite surfaces (51c, 51d; 51e, 51f) facing in opposite directions; At least three of the inner surfaces of the recess are an inner bottom surface (35a) facing the main surface; two inner surfaces (35c, 35d; 35e, 35f) that are arranged opposite to each other and thermally coupled to the two opposite surfaces; A power conversion device described in technical idea 1 or technical idea 2, wherein the distance (LG5; WD5) between the two opposite surfaces is greater than or equal to the distance (LG35; WD35) between the two inner surfaces (LG5≧LG35; WD5≧WD35).

[0093] (Technical Thought 4) The power converter according to any one of Technical Ideas 1 to 3, wherein the electrical component is press-fitted into the recess.

[0094] (Technical Thought 5) The power conversion device according to Technical Concept 4, wherein the wall member is deformed by receiving the electrical component in the recess.

[0095] (Technical Thought 6) The power conversion device according to Technical Concept 5, wherein the wall member is elastically deformable.

[0096] (Technical Thought 7) The power conversion device according to any one of Technical Ideas 1 to 6 further comprises a fixing member (70) for fixing the electric component to the heat exchange member.

[0097] (Technical Thought 8) Further, the device has a circuit board (20) including an electric circuit electrically connected to the electric component, The power conversion device according to any one of Technical Ideas 1 to 7, wherein the circuit board extends to cover the recess.

[0098] (Technical Thought 9) Further, the device has a circuit board (20) including an electric circuit electrically connected to the electric component, The power conversion device according to any one of Technical Ideas 1 to 7, wherein the electrical component and the circuit board are electrically connected by an electrical connecting member (53, 453, 653).

[0099] (Technical Thought 10) a plurality of the electrical components including the electrical component; The power conversion device according to any one of Technical Ideas 1 to 9, comprising a plurality of the recesses including the recess. [Explanation of symbols]

[0100] 1 Drive system, 2 Rotating electric machine, 3 Power supply equipment, 4 Power conversion device, 5 Element module (electrical component), 6 heat exchanger, 7 medium system, 10 housing, 20 Circuit board, 30 Heat exchange member, 31 wall member, 32 passage, 35 recess, 35a inner bottom surface, 35b open end, 35c, 35d, 35e, 35f inner side, 37 side passage, 51 main body, 52 heat dissipation member, 53 connection member, 54 through hole, 51a, 51b main surface, 51c, 51d, 51e, 51f side surface, 60 heat dissipation fixing portion, 70 fixing member, 71 screw member, 80 heat transfer member, 273 Spring member, 274 Screw member, 281 Plate-shaped member 338 second member, 438 second member, 453 connecting member, 535 recesses, 635 main recess, 639 additional recess, 653 connecting member, LG5, WD5, TH5, LG35, WD35, TH5 distance.

Claims

1. an electric component (5) that is a flat hexahedron and has a metal heat dissipation member disposed on one of its main surfaces (51a); a heat exchange member (30) having a wall member (31) defining a heat radiation fixing portion (60) on one surface for fixing the electric component to radiate heat from the electric component, and defining a passage (32) for a heat medium on the other surface; The electrical component is It has at least two side surfaces (51c, 51d; 51e, 51f; 51c, 51f) adjacent to the main surface, The wall member is It is made of an electrically insulating resin material. the heat dissipation fixing portion is provided by a recess (35) having at least three inner surfaces (35a, 35c, 35d, 35e, 35f) that are arranged opposite to the main surface and at least two of the side surfaces and are thermally coupled to the main surface and the at least two side surfaces; The passage is partitioned to allow the heat medium to flow along the rear of at least three of the inner surfaces.

2. At least three of the inner surfaces of the recess are an inner surface (35c, 35d, 35e, 35f) disposed opposite the side surface of the electrical component and thermally coupled to the side surface; The power converter according to claim 1 , wherein the passage extends behind the inner surface so as to be wider than the side surface of the electrical component facing the inner surface.

3. The two sides of the electrical component are: two opposite surfaces (51c, 51d; 51e, 51f) facing in opposite directions; At least three of the inner surfaces of the recess are an inner bottom surface (35a) facing the main surface; two inner surfaces (35c, 35d; 35e, 35f) arranged opposite to each other and thermally coupled to the two opposite surfaces; A power conversion device as described in claim 1 or claim 2, wherein the distance (LG5; WD5) between the two opposite sides is greater than or equal to the distance (LG35; WD35) between the two inner sides (LG5≧LG35; WD5≧WD35).

4. The power conversion device according to claim 1 or 2, wherein the electrical component is press-fitted into the recess.

5. The power conversion device according to claim 4 , wherein the wall member is deformed by receiving the electrical component in the recess.

6. The power converter according to claim 5 , wherein the wall member is elastically deformable.

7. The power conversion device according to claim 1 or 2, further comprising a fixing member (70) for fixing the electrical component to the heat exchange member.

8. Further, the device has a circuit board (20) including an electrical circuit electrically connected to the electrical component, The power conversion device according to claim 1 or 2, wherein the circuit board extends to cover the recess.

9. Further, the device has a circuit board (20) including an electrical circuit electrically connected to the electrical component, 3. The power conversion device according to claim 1, wherein the electrical components and the circuit board are electrically connected by an electrical connection member (53, 453, 653).

10. a plurality of the electrical components including the electrical component; The power conversion device according to claim 1 or 2, comprising a plurality of the recesses including the recess.

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