Inspection device and inspection jig

Abstract

To provide a technique capable of reducing the cost required for inspection while improving the accuracy of contact between a device and a probe.SOLUTION: The inspection apparatus inspects a device. The inspection apparatus includes a probe card having a probe that comes into contact with the device, a plurality of pogo blocks electrically connected to the probe card, and a pogo frame that accommodates the pogo blocks. The probe card is formed of a plurality of divided small probe cards. Each of the plurality of small probe cards is fixed to and integrated with the pogo frame.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to an inspection device and an inspection jig. [Background technology]

[0002] Patent Document 1 discloses an inspection device that inspects the electrical characteristics of devices on a board by bringing multiple probes (contact probes) of a probe card into contact with the board. This inspection device includes a pogo frame installed under the motherboard and a pogo block installed on the pogo frame and electrically connected to the probe card, and transmits electrical signals from the motherboard to the board via the pogo block and the probe card.

[0003] Probe cards are prone to poor contact with the substrate due to deformation, wear, and particle adhesion of the probes during testing, so probe cards are consumables that must be replaced after multiple uses. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6895772 Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a technique that can reduce the cost of testing while improving the accuracy of contact between a device and a probe. [Means for solving the problem]

[0006] According to one aspect of the present disclosure, there is provided an inspection apparatus for inspecting a device, comprising: a probe card having probes that contact the device; a plurality of pogo blocks electrically connected to the probe card; and a pogo frame that houses the plurality of pogo blocks, wherein the probe card is formed from a plurality of divided small probe cards, and each of the plurality of small probe cards is fixed to and integrated with the pogo frame. [Effects of the Invention]

[0007] According to one aspect, the cost of testing can be reduced while improving the accuracy of contact between the device and the probe. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a perspective view showing an inspection system according to an embodiment; [Figure 2] 1 is a cross-sectional view schematically illustrating an inspection device provided in an inspection cell of an inspection system. [Figure 3] Fig. 3(A) is a plan view showing the pogo frame of the inspection device, and Fig. 3(B) is an exploded cross-sectional view showing the inspection jig. [Figure 4] 10 is a graph illustrating the amounts of thermal expansion of a substrate, an inspection jig, and a probe card according to a reference example. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and redundant explanations may be omitted.

[0010] As shown in FIG. 1, the inspection system 10 according to the embodiment is a system that inspects the electrical characteristics of a plurality of devices under test (DUTs, hereinafter also referred to as DUTs) formed on a substrate W. Examples of the substrate W to be inspected include a wafer, a carrier, a glass substrate, an electronic circuit board, etc. on which a plurality of DUTs are arranged. Furthermore, the device to be inspected is not limited to the substrate W, and may also be a single chip (DUT). The DUT may be any of a silicon semiconductor device, a compound semiconductor device, or another electronic device.

[0011] The inspection system 10 comprises an inspection section 12 formed in a rectangular parallelepiped shape and having multiple inspection cells 11, a loader section 13 for storing multiple substrates W before inspection or multiple substrates W that have been inspected, and a transport section 14 provided between the inspection section 12 and the loader section 13.

[0012] The inspection unit 12 has, for example, four inspection cells 11 arranged in a row in the Y-axis direction, and these rows are arranged in three rows in the Z-axis direction. An inspection device 20 capable of inspecting the substrate W is provided in each inspection cell 11. It goes without saying that the number and arrangement of the inspection cells 11 are not particularly limited.

[0013] A container such as a FOUP (Front Opening Unified Pod) capable of accommodating a plurality of substrates W is set in the loader unit 13. A transport robot (not shown) capable of transporting the substrates W is also provided in the transport unit 14. The transport robot receives the substrates W before inspection from the container in the loader unit 13 and transports the substrates W into a target inspection cell 11 among the inspection cells 11. The transport robot also receives the inspected substrates W from the inspection cell 11 after the inspection has been completed, transports them out, and stores them in the container in the loader unit 13.

[0014] 2, a substrate W placed on a stage 70 is transported to each inspection cell 11. The inspection device 20 in each inspection cell 11 inspects all of the DUTs provided on the substrate W. Specifically, the inspection device 20 includes a tester 21 and an inspection jig 30 installed vertically below the tester 21. Furthermore, the inspection device 20 has a wiring member 50 that electrically connects the tester 21 and the inspection jig 30.

[0015] The tester 21 outputs power and electrical signals to each DUT on the board W and receives signals returned from each DUT, thereby conducting an electrical test on the board W. For example, the tester 21 has a motherboard 22 that outputs power and electrical signals to the testing jig 30, and a housing 23 that holds the motherboard 22.

[0016] The housing 23 accommodates a test head (not shown) mounted on the motherboard 22. The test head is composed of, for example, a plurality of testing circuit boards. The motherboard 22 is supported by the housing 23 so as to be exposed from the bottom surface of the housing 23.

[0017] The motherboard 22 is formed in a flat plate shape with a substantially uniform thickness and is fixed so as to extend horizontally. A plurality of terminals 221 are provided on the underside of the motherboard 22. Note that, in FIG. 2, for ease of understanding the configuration, the terminals 221 are shown protruding from the underside of the motherboard 22, but the terminals 221 may be exposed flush with the plate surface. The same applies to the terminals of the other components described below.

[0018] On the other hand, the inspection jig 30 is a structure for electrically connecting the motherboard 22 of the tester 21 and the substrate W placed on the stage 70. The inspection jig 30 includes a pogo frame 31, a plurality of pogo blocks 35 housed inside the pogo frame 31, and a probe card 40 disposed below each of the pogo blocks 35 and the pogo frame 31. The inspection jig 30 may also include a wiring member 50.

[0019] 3A and 3B, the pogo frame 31 is formed in the shape of a circular disk in a plan view, and extends horizontally with a constant thickness. The pogo frame 31 according to the embodiment supports each pogo block 35 therein and also supports the probe card 40 on its bottom surface.

[0020] The pogo frame 31 has a frame main body 32 and a plurality of accommodating holes 33 that penetrate the frame main body 32 in the thickness direction and can individually accommodate a plurality of pogo blocks 35. Each accommodating hole 33 is formed in a rectangular shape in a plan view. The pogo frame 31 has the accommodating holes 33 arranged in a matrix. For example, the pogo frame 31 has the accommodating holes 33 at positions overlapping each DUT of the board W to be inspected, and the multiple pogo blocks 35 that it holds are positioned vertically above the multiple DUTs. However, this is not limiting, and for example, one pogo block 35 may be arranged to overlap two or more DUTs.

[0021] The frame body 32 of the pogo frame 31 is formed to have higher rigidity and heat resistance than the motherboard 22 and the probe card 40. By maintaining the shape of the pogo frame 31, the pogo blocks 35 and the probe card 40 can be positioned with high precision. For example, it is preferable to use a low thermal expansion material as the material for the frame body 32. This low thermal expansion material is not particularly limited, and examples of the low thermal expansion material include NiFe alloy (Invar), NiFeCo alloy, stainless steel, and carbon steel. Note that the frame body 32 may be formed from a hard metal material other than the low thermal expansion material.

[0022] Each pogo block 35 is a member that electrically connects between the wiring members 50 stacked in the vertical direction and the probe card 40. Each pogo block 35 includes a block body 36, a plurality of first terminals 37 protruding from one surface of the block body 36, and second terminals 38 protruding from the other surface of the block body 36.

[0023] The block body 36 is formed in a rectangular shape in a plan view and is housed in the pogo frame 31 so as to be displaceable (slidable) in the vertical direction. For example, the thickness of the block body 36 is preferably set thinner than the thickness of the frame body 32 of the pogo frame 31. The block body 36 is formed of a resin material capable of insulating the first terminals 37 from each other and the second terminals 38 from each other. Alternatively, the block body 36 may be formed of a hard metal material, with the first terminals 37 and the second terminals 38 surrounded by an insulating material. Furthermore, the block body 36 and the pogo frame 31 may be provided with an engagement mechanism that allows the pogo block 35 to slide in the housing hole 33 while preventing the pogo block 35 from coming off.

[0024] The first terminal 37 contacts the second terminal 53 exposed from the wiring member 50, and is electrically connected to the motherboard 22 of the tester 21 via the wiring member 50. Meanwhile, the second terminal 38 contacts a terminal 421 of the probe card 40. Pogo pins that are elastically expandable and contractible in the vertical direction may be applied to the first terminal 37 and the second terminal 38. Alternatively, the pogo block 35 may include a spring pin in the block body 36 that is elastically expandable and contractible between the first terminal 37 and the second terminal 38.

[0025] The probe card 40 of the inspection jig 30 is a member that comes into contact with electrode pads (not shown) of each DUT on the substrate W and electrically connects each DUT to each pogo block 35. The probe card 40 according to the embodiment is configured as a plurality of divided small probe cards 41. For example, the probe card 40 has the same number of divided small probe cards 41 as the number of pogo blocks 35 housed in the pogo frame 31, and is installed vertically below each pogo block 35.

[0026] Each divided small probe card 41 has a plate-shaped card body 42 having a plurality of terminals 421 on its upper surface, and a plurality of probes 43 provided on the lower surface of the card body 42 and contacting each electrode pad of the DUT.

[0027] The card body 42 is formed in a rectangular shape that is slightly larger than each of the receiving holes 33 of the pogo frame 31. The card body 42 is placed on the underside of the pogo frame 31 so as to cover the lower side of each of the receiving holes 33. The upper surface of the outer periphery of the card body 42 and the lower surface of the pogo frame 31 are fixed via a fixing part 44 such as an adhesive. Each miniature probe card 41 is fixed to the pogo frame 31 by the adhesive, thereby being integrated with the pogo frame 31. Furthermore, when replacing the miniature probe card 41, each miniature probe card 41 can be easily separated from the pogo frame 31 by an appropriate peeling means. Note that the fixing part 44 that fixes the card body 42 to the pogo frame 31 is not limited to an adhesive, and may also fix the two together using a mechanical mechanism such as a screw, a hook, or a fitting.

[0028] Each small probe card 41 is fixed to the lower surface (one surface) of the pogo frame 31 so as to close the corresponding receiving hole 33. As a result, the upper surface of the card body 42 faces each receiving hole 33. Each terminal 421 formed on the upper surface of the card body 42 is disposed at a position corresponding to each second terminal 38 of the pogo block 35. By receiving the pogo block 35 in the receiving hole 33, each second terminal 38 is positioned, and each second terminal 38 and each terminal 421 come into contact with each other.

[0029] Furthermore, conductive wires (not shown) that electrically connect each terminal 421 and each probe 43 are provided on the surface and inside of the card body .

[0030] The card body 42 may be made of, for example, a flexible polyimide substrate or a hard glass epoxy substrate. The card body 42 has a larger thermal expansion coefficient than the pogo frame 31, but by being divided into small probe cards 41, the amount of thermal expansion is sufficiently small. Therefore, each small probe card 41 is fixed to the pogo frame 31 in a state where the amount of thermal expansion is suppressed.

[0031] Each probe 43 of the small probe card 41 protrudes slightly from the card body 42 and contacts each electrode pad of the opposing DUT. The formation area of ​​each probe 43 is set to be wider than the formation area of ​​each second terminal 38 of the pogo block 35. Note that each probe 43 may be provided at an angle from the card body 42 toward the center of the small probe card 41 as shown in FIG. 3(B), or may be provided protruding in a direction perpendicular to the card body 42.

[0032] On the other hand, the wiring member 50 disposed between the motherboard 22 and the pogo block 35 is a member that transmits an electrical signal from the motherboard 22 of the tester 21 to the target pogo block 35. Specifically, the wiring member 50 includes a main body 51, a plurality of first terminals 52 provided on the upper surface of the main body 51, and a plurality of second terminals 53 provided on the lower surface of the main body 51.

[0033] The main body 51 is formed, for example, in the shape of a sheet that is sufficiently thin relative to the thickness of the pogo frame 31. The main body 51 is made of an insulating resin material, and conductive wires are wired inside. A flexible substrate (polyimide substrate) can be used as the main body 51. The wiring member 50, which is a flexible substrate, elastically bends in accordance with the shapes of the pogo blocks 35 and the like when sandwiched between the motherboard 22, the pogo frame 31, and the pogo blocks 35. This makes it easy to align the wiring member 50 with the terminals of the motherboard 22 and the terminals of the pogo blocks 35. Note that the wiring member 50 is not limited to a flexible substrate, and a rigid substrate (such as a glass epoxy substrate) may also be used.

[0034] The wiring member 50 has first terminals 52 at positions facing the terminals 221 of the motherboard 22 of the tester 21, and second terminals 53 at positions facing the first terminals 37 of the pogo blocks 35. The first terminals 52 contact the terminals 221 of the motherboard 22 when sandwiched between the motherboard 22 and the pogo frame 31. Similarly, the second terminals 53 contact the first terminals 37 of the pogo blocks 35 when sandwiched between the motherboard 22 and the pogo block 35.

[0035] A plurality of conductive wires formed on the main body 51 electrically connect each of the first terminals 52 and each of the second terminals 53. The wiring member 50 wires each conductive wire corresponding to each DUT on the substrate W to be tested, thereby enabling electrical connection between the motherboard 22 and each pogo block 35 without the need for wiring in a conventional probe card. In other words, the testing device 20 can use the wiring member 50 to handle the electrical wiring from the motherboard 22 to the small probe card 41. Note that while FIG. 2 shows a configuration in which a single main body 51 sandwiches the continuous wiring member 50 between the motherboard 22 and the pogo frame 31, the wiring member 50 may also be divided into multiple pieces as long as signals from the motherboard 22 can be appropriately distributed.

[0036] Returning to FIG. 2, the inspection device 20 includes a fixing mechanism 60 for fixing the inspection jig 30 to the tester 21. The fixing mechanism 60 has a seal member 61 between the motherboard 22 and the pogo frame 31, and a bellows member 62 between the pogo frame 31 and the stage 70. The seal member 61 and the bellows member 62 are endlessly circumferentially arranged in the horizontal direction. Furthermore, the fixing mechanism 60 includes a first suction device 63 that evacuates the space surrounded by the seal member 61, and a second suction device 64 that evacuates the space surrounded by the bellows member 62.

[0037] The fixing mechanism 60 applies suction using the first suction device 63 with the wiring member 50 sandwiched between the motherboard 22 and the pogo frame 31. This allows the fixing mechanism 60 to lift and adsorb the entire inspection jig 30 (the pogo frame 31, each pogo block 35, and each small probe card 41) toward the motherboard 22. Furthermore, the fixing mechanism 60 applies suction using the second suction device 64, allowing the stage 70, which is in contact with the lower end of the bellows member 62, to be adsorbed to the inspection jig 30.

[0038] When the fixing mechanism 60 is in the suction state, each probe 43 of each small probe card 41 facing each DUT on the substrate W is in contact with each electrode pad of the corresponding DUT. Furthermore, in the testing jig 30, each terminal 421 on the top surface of each small probe card 41 contacts the second terminal 38 of each pogo block 35, and the first terminal 37 of each pogo block 35 contacts the second terminal 53 of the wiring member 50. Furthermore, the first terminal 52 of the wiring member 50 contacts the terminal of the motherboard 22. This allows the testing device 20 to electrically connect the motherboard 22 of the tester 21 to each DUT on the substrate W, enabling the tester 21 to successfully test the substrate W. The testing device 20 is not limited to a configuration in which the substrate W is fixed by suction of the fixing mechanism 60. For example, the inspection device 20 may be configured to fix the substrate W using a mechanical mechanism or suction mechanism installed on the stage 70, and move this stage 70 horizontally and vertically to bring each probe 43 of each small probe card 41 into contact with each DUT on the substrate W.

[0039] In testing the board W, the tester 21 outputs power and electrical signals from the motherboard 22 to each DUT on the board W and receives electrical signals returned from each DUT. This allows the testing device 20 to properly test the electrical characteristics (including the presence or absence of abnormalities) of each DUT.

[0040] Here, during the inspection of the substrate W, the temperature of the substrate W itself, the tester 21, the inspection jig 30, etc. rises. As the temperature rises, the substrate W thermally expands, for example, in the horizontal direction. However, the amount of thermal expansion of the substrate W, which is a silicon semiconductor or a compound semiconductor, is not so large, as shown in FIG.

[0041] In contrast, for example, the probe card according to the reference example experiences a large amount of thermal expansion even when its temperature rises to the same temperature as that of the substrate W. The probe card according to the reference example is formed as a single continuous card body made of resin and held on the underside of the pogo frame by vacuum suction. In other words, the probe card according to the reference example is not one in which a plurality of divided small probe cards 41 are applied and fixed to the pogo frame 31, as in the probe card 40 according to the embodiment.

[0042] The probe card according to this reference example may expand more than the thermal expansion of the substrate W, potentially causing misalignment between each DUT on the substrate W and each probe. For this reason, it may be possible to form a single continuous probe card from a low-thermal expansion material, but in this case, the cost of the probe card itself, which is a consumable item, becomes high. Furthermore, when testing the substrate W, if the type of substrate W changes, the probe card must also be changed. In other words, if a probe card made of a low-thermal expansion material is used, the cost of testing will increase significantly.

[0043] In contrast to this, the inspection jig 30 according to the embodiment has a pogo frame 31 made of a low thermal expansion material, while each small probe card 41 made of resin is fixed to the underside of the pogo frame 31. This makes it possible for the inspection jig 30 to suppress thermal expansion even when it is affected by heat during inspection of the substrate W.

[0044] That is, because each small probe card 41 is originally small, its thermal expansion amount can be reduced even if it is made of a resin material. Furthermore, because the pogo frame 31 is made of a low-thermal-expansion material, its overall thermal expansion amount can be reduced even if it is large. Therefore, even when each small probe card 41 and the pogo frame 31 are combined, as shown in FIG. 4, the sum of the thermal expansion amounts of each small probe card 41 and the pogo frame 31 can be made approximately equal to the thermal expansion amount of the substrate W. As a result, the testing jig 30 can prevent misalignment of the probes 43 of each small probe card 41 with respect to each DUT on the substrate W, and can maintain stable contact of each probe 43 with the electrode pads of each DUT.

[0045] In particular, by dividing each small probe card 41 so that it faces each pogo block 35, it can be made as small as possible, and the amount of thermal expansion can be further reduced. Also, the relative positions of each pogo block 35 accommodated in each accommodation hole 33 and each small probe card 41 fixed to the underside of the pogo frame 31 can be easily determined, and the contact state between the second terminal 38 and the terminal 421 can be stably maintained. Moreover, each small probe card 41 made of a resin material can be made at a significantly lower cost than if it were made of a low-thermal expansion material. Conversely, a pogo frame 31 made of a low-thermal expansion material can be used for a long period of time by simply replacing each small probe card 41.

[0046] The inspection device 20 and the inspection jig 30 according to the embodiment are not limited to the above embodiment and may take various modified forms. For example, the inspection device 20 according to the embodiment is configured such that the wiring members 50 are sandwiched between the motherboard 22 and each pogo block 35. However, depending on the arrangement of each terminal 221 of the motherboard 22, the pogo blocks 35 may be in direct contact with the motherboard 22 without using the wiring members 50.

[0047] Furthermore, the number of small probe cards 41 is not limited to the same as the number of pogo blocks 35. For example, one small probe card 41 may be continuous so as to straddle multiple pogo blocks 35. In other words, the number of small probe cards 41 may be less than the number of pogo blocks 35.

[0048] Furthermore, when replacing the probe card 40, it is not necessary to replace all of the small probe cards 41. For example, it is possible to replace only the small probe cards 41 in which deformation, wear, adhesion of particles, etc. of the probes 43 has occurred.

[0049] The technical ideas and effects of the present disclosure explained in the above embodiments will be described below.

[0050] A first aspect of the present disclosure is an inspection apparatus 20 for inspecting a device (substrate W), comprising a probe card 40 having probes 43 that contact the device, a plurality of pogo blocks 35 electrically connected to the probe card 40, and a pogo frame 31 that houses the plurality of pogo blocks 35, wherein the probe card 40 is formed from a plurality of divided small probe cards 41, and each of the plurality of small probe cards 41 is fixed to and integrated with the pogo frame 31.

[0051] As described above, the inspection device 20 fixes a plurality of small probe cards 41 to the pogo frame 31, thereby suppressing the amount of thermal expansion of the probe card 40 and improving the accuracy of contact between the probe 43 and the device (substrate W). Moreover, when deformation, wear, adhesion of particles, etc. occurs in the probe 43, the inspection device 20 can replace only the small probe card 41 and reuse the pogo frame 31, thereby reducing the cost of inspecting devices.

[0052] In addition, the pogo frame 31 is made of a low thermal expansion material. This reduces thermal expansion of the pogo frame 31, allowing it to stably hold the small probe card 41 without shifting its position. Moreover, even though the pogo frame 31 is expensive due to the low thermal expansion material, it can be used for a long period of time, significantly reducing the cost of testing.

[0053] Furthermore, the card bodies 42 of the multiple small probe cards 41 are made of a resin material, which makes it possible to inexpensively form the multiple small probe cards 41, and the pogo frame 31 made of a low-thermal expansion material can maintain the position of each small probe card 41, thereby ensuring stable and continuous electrical connection with the device.

[0054] Furthermore, the block bodies 36 of the multiple pogo blocks 35 are made of a resin material. Since the block bodies 36 are also made of a resin material in this way, the inspection device 20 can reduce the cost of inspection. Furthermore, by being housed in the pogo frame 31, the pogo blocks 35 are prevented from shifting in position, allowing them to make stable contact with each small probe card 41 fixed to the pogo frame 31.

[0055] The pogo frame 31 has a plurality of accommodating holes 33 that can accommodate a plurality of pogo blocks 35, and a plurality of small probe cards 41 are fixed to one side of the pogo frame 31 to close the plurality of accommodating holes 33. This allows the inspection device 20 to easily establish a contact state between the plurality of small probe cards 41 fixed to the pogo frame 31 and the plurality of pogo blocks 35.

[0056] The number of the plurality of receiving holes 33 and the plurality of pogo blocks 35 is the same as the number of the plurality of small probe cards 41. This allows the inspection device 20 to make the plurality of small probe cards 41 as small as possible, and to sufficiently suppress the amount of thermal expansion.

[0057] Each of the multiple small probe cards 41 is fixed to the pogo frame 31 by an adhesive, which allows the inspection device 20 to firmly fix the small probe card 41 and also to smoothly separate it from the pogo frame 31 by a peeling means.

[0058] The inspection device 20 also includes a motherboard 22 that can output an electrical signal to the device (substrate W), and a wiring member 50 that can electrically connect the motherboard 22 to the multiple pogo blocks 35 is provided between the pogo frame 31 and the motherboard 22. This allows the wiring member 50 to handle the electrical wiring from the motherboard 22 to the small probe card 41.

[0059] The wiring member 50 is formed in a flexible sheet shape, which allows the wiring member 50 to bend appropriately between the motherboard 22 and the pogo block 35, facilitating alignment of the terminals of the motherboard 22 with the terminals of the pogo block 35.

[0060] The inspection device 20 also includes a fixing mechanism 60 that fixes, by vacuum suction, the pogo frame 31 that houses the plurality of pogo blocks 35 and has the plurality of small probe cards 41. This allows the inspection device 20 to fix the pogo frame 31 that has each small probe card 41, and to satisfactorily inspect the device (substrate W).

[0061] Moreover, a second aspect of the present disclosure is an inspection jig 30 applied to an inspection apparatus 20 that inspects a device (substrate W), and includes a probe card 40 having probes 43 that contact the device, and a pogo frame 31 that houses a plurality of pogo blocks 35 electrically connected to the probe card 40, the probe card 40 being formed by a plurality of divided small probe cards 41, each of which is fixed to and integrated with the pogo frame 31. Even in this case, the inspection jig 30 can reduce the cost of inspection while increasing the accuracy of contact between the device and the probes 43.

[0062] The inspection device 20 and inspection jig 30 according to the presently disclosed embodiments are illustrative in all respects and are not limiting. The embodiments can be modified and improved in various ways without departing from the spirit and scope of the appended claims. The matters described in the above-described embodiments can be configured in other ways as long as they are not inconsistent, and can be combined as long as they are not inconsistent. [Explanation of symbols]

[0063] 20 Inspection equipment 31 Pogo Frame 35 Pogo Block 40 probe cards 41 Small probe card 43 Probe W substrate

Claims

1. An inspection apparatus for inspecting a device, a probe card having probes that contact the device; a plurality of pogo blocks electrically connected to the probe card; a pogo frame that accommodates the plurality of pogo blocks, The probe card is formed by dividing a plurality of small probe cards, Each of the plurality of miniature probe cards is fixed to and integrated with the pogo frame. Inspection equipment.

2. The pogo frame is made of a low thermal expansion material. The inspection device according to claim 1 .

3. The card bodies of the plurality of small probe cards are formed from a resin material. The inspection device according to claim 2 .

4. The block bodies of the plurality of pogo blocks are formed of a resin material. The inspection device according to claim 3 .

5. the pogo frame has a plurality of accommodation holes capable of accommodating the plurality of pogo blocks, the plurality of small probe cards are fixed to one surface of the pogo frame to close the plurality of receiving holes; The inspection device according to any one of claims 1 to 4.

6. the number of the plurality of receiving holes and the plurality of pogo blocks is the same as the number of the plurality of small probe cards; The inspection device according to claim 5 .

7. Each of the plurality of miniature probe cards is fixed to the pogo frame by an adhesive. The inspection device according to any one of claims 1 to 4.

8. a motherboard capable of outputting an electrical signal to the device; a wiring member is provided between the pogo frame and the motherboard, the wiring member being capable of electrically connecting the motherboard and the plurality of pogo blocks; The inspection device according to any one of claims 1 to 4.

9. The wiring member is formed in a flexible sheet shape. The inspection device according to claim 8.

10. a fixing mechanism for fixing the pogo frame, which houses the plurality of pogo blocks and has the plurality of small probe cards, by vacuum suction; The inspection device according to any one of claims 1 to 4.

11. An inspection jig to be applied to an inspection apparatus that inspects devices, a probe card having probes that contact the device; a pogo frame that houses a plurality of pogo blocks electrically connected to the probe card; The probe card is formed by dividing a plurality of small probe cards, Each of the plurality of miniature probe cards is fixed to and integrated with the pogo frame. Inspection jig.

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