Electrical inspection apparatus and electrical inspection method

Abstract

To provide an electric inspection device capable of quickly and easily positioning an electric inspection head with respect to a printed board.SOLUTION: An electrical inspection device 1 according to one aspect of the present invention includes an electrical inspection head 10 that can come into contact with a printed board W from a normal direction side and performs an electrical inspection of the printed board W, an imaging part 12 that has an optical device 22a facing the printed board W from the normal direction and can image the printed board W, and a moving mechanism 13 that moves the imaging part 12 in the normal direction of the printed board W.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electrical inspection device and an electrical inspection method. [Background technology]

[0002] An electrical inspection device is used to inspect the electrical characteristics of printed circuit boards. This electrical inspection device includes an electrical inspection head with multiple probes (electrical contacts) arranged thereon and an imaging unit capable of imaging the printed circuit board from the normal direction. This electrical inspection device inspects the electrical characteristics of the printed circuit board by imaging the printed circuit board using the imaging unit, aligning the electrical inspection head with the area to be inspected on the printed circuit board, and then bringing the electrical inspection head into contact with the printed circuit board from the normal direction (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-52511 Summary of the Invention [Problem to be solved by the invention]

[0004] In Patent Document 1, a fourth embodiment is described in which an electrical inspection jig 50a has a positioning mechanism 57 connected to a base plate 51, and an image recognition camera 56 is disposed in this positioning mechanism 57.

[0005] The electrical inspection device described in Patent Document 1 can adjust the position of the image recognition camera 56 using the positioning mechanism 57, so there is no need to fix the image recognition camera 56 in an accurate position beforehand.

[0006] On the other hand, in such electrical inspection devices, when aligning the electrical inspection head with the area to be inspected on the printed circuit board, the electrical inspection head may be rotated around an axis parallel to the normal direction of the printed circuit board. However, with the configuration described in Patent Document 1, when the electrical inspection head is rotated, the image recognition camera rotates together with the electrical inspection head. Therefore, the electrical inspection device described in Patent Document 1 has room for further improvement in terms of quickly and consecutively capturing an image with the image recognition camera and aligning the electrical inspection head with the area to be inspected.

[0007] The present invention has been made in light of the above circumstances, and an object of the present invention is to provide an electrical inspection device that allows for quick and easy alignment of an electrical inspection head with respect to a printed circuit board. [Means for solving the problem]

[0008] An electrical inspection device according to one aspect of the present invention includes an electrical inspection head that can contact a printed circuit board from the normal side, a rotation mechanism that rotates the electrical inspection head around a rotation axis that is parallel to the normal direction, an imaging unit that has an optical element that faces the printed circuit board from the normal direction and is capable of imaging the printed circuit board, and a movement mechanism that moves the imaging unit between a proximity position and an avoidance position, where the proximity position is a position where the imaging unit can come into contact with the electrical inspection head when the electrical inspection head rotates, and the avoidance position is a position where the imaging unit does not come into contact with the electrical inspection head when the electrical inspection head rotates.

[0009] The moving mechanism may move the imaging unit independently of the electrical inspection head.

[0010] The avoidance position may be a position that is farther away from the approach position in a normal direction of the printed circuit board.

[0011] When viewed in the normal direction of the printed circuit board, the distance between the imaging unit and the rotation shaft at the approach position may be the same as the distance between the imaging unit and the rotation shaft at the avoidance position.

[0012] The electrical inspection device may further include a positioning mechanism that can position the electrical inspection head in a planar direction of the printed circuit board.

[0013] The positioning mechanism may simultaneously position the electrical inspection head and the imaging unit in the planar direction.

[0014] Another aspect of the present invention provides an electrical inspection method using an electrical inspection device that includes an electrical inspection head that can contact a printed circuit board from the normal side, a rotation mechanism that rotates the electrical inspection head around a rotation axis that is parallel to the normal direction, an imaging unit that has an optical element that faces the printed circuit board from the normal direction and is capable of imaging the printed circuit board, and a movement mechanism that moves the imaging unit between a proximity position and an avoidance position, and moves the imaging unit so that the proximity position is a position where the imaging unit can come into contact with the electrical inspection head when the electrical inspection head is rotated, and the avoidance position is a position where the imaging unit does not come into contact with the electrical inspection head when the electrical inspection head is rotated. [Effects of the Invention]

[0015] In one aspect of the present invention, an electrical inspection device can image the printed circuit board from a normal direction using the imaging unit while the imaging unit is positioned in a proximal position, and then move the imaging unit to a avoidance position where it will not come into contact with the electrical inspection head when the electrical inspection head rotates. Therefore, the electrical inspection device can image the printed circuit board using the imaging unit near the electrical inspection head, and then rotate the electrical inspection head independently of the imaging unit. As a result, the electrical inspection device can quickly and easily align the electrical inspection head with the printed circuit board. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 is a schematic side view of an electrical inspection device according to one embodiment of the present invention, viewed from a direction perpendicular to the normal direction of a printed circuit board. [Figure 2] FIG. 2 is a schematic plan view of the electrical inspection device of FIG. [Figure 3] FIG. 3 is a schematic side view showing a state in which the imaging unit of the electrical inspection device of FIG. 1 has been moved to an avoidance position. [Figure 4] FIG. 4 is a flow chart showing an electrical inspection method using the electrical inspection device of FIG. [Figure 5] FIG. 5 is a schematic plan view showing a state in the middle of rotation of the electrical inspection head in the electrical inspection method of FIG. [Figure 6] FIG. 6 is a schematic side view showing a state in which the imaging unit has been moved to a close position after the electrical inspection head has been rotated in the electrical inspection method of FIG. [Figure 7] FIG. 7 is a schematic side view showing a state in which the electrical inspection head is brought into contact with the printed circuit board in the electrical inspection method of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Note that with respect to the numerical values ​​described in this specification, it is possible to adopt only one of the stated upper and lower limit values, or to arbitrarily combine the upper and lower limit values.

[0018] [Electrical testing equipment] 1 and 2 includes an electrical inspection head 10 capable of contacting a printed circuit board W from the normal direction (Z direction in FIG. 1 ), a rotation mechanism 11 that rotates the electrical inspection head 10 about a rotation axis R parallel to the normal direction, an imaging unit 12 having an optical element 22a facing the printed circuit board W from the normal direction and capable of imaging the printed circuit board W, and a movement mechanism 13 that moves the imaging unit 12 between a proximity position and an avoidance position. The electrical inspection device 1 also includes a positioning mechanism 14 that can position the electrical inspection head 10 in the planar direction of the printed circuit board W (the XY plane direction in FIG. 1 ), an elevation mechanism 15 that raises and lowers the electrical inspection head 10 in the normal direction of the printed circuit board W, a housing 16 connected to the positioning mechanism 14, and a control unit 17 that controls the operation of the rotation mechanism 11, the movement mechanism 13, the positioning mechanism 14, and the elevation mechanism 15. In FIG. 1 , the electrical inspection head 10 and the imaging unit 12 are disposed on both sides of the printed circuit board W, respectively. However, in the electrical inspection device 1, one or both of the electrical inspection head 10 and the imaging unit 12 may be arranged on only one side of the printed circuit board W. Also, Fig. 1 illustrates a configuration in which the electrical inspection heads 10 and the control units 17 are provided in one-to-one correspondence. However, the electrical inspection device 1 may have a control unit 17 that is common to the pair of electrical inspection heads 10.

[0019] [Printed circuit board] The printed circuit board W is plate-shaped or sheet-shaped. A circuit pattern disposed on a thin-film substrate can be used as the printed circuit board W. The printed circuit board W has multiple areas to be inspected. The electrical inspection device 1 is configured to perform electrical inspection for each area to be inspected by bringing an electrical inspection head 10 into contact with each area to be inspected. The electrical inspection device 1 is configured to perform electrical inspection continuously for multiple areas to be inspected arranged on the printed circuit board W. While there is no clear distinction between "plate-shaped" and "sheet-shaped" in the present invention, a material that does not substantially deflect due to its own weight can be called a "plate-shaped," and a material that is flexible and deflects due to its own weight can be called a "sheet-shaped." Furthermore, the term "sheet-shaped" encompasses the concept of "film-shaped."

[0020] The printed circuit board W has, for example, a rectangular shape in a plan view. The printed circuit board W is held horizontally with its four corners gripped by grippers 31. The printed circuit board W is held in mid-air with its peripheral edge part partially gripped by grippers 31.

[0021] A reference position marker (not shown) is provided on the printed circuit board W to be imaged by the imaging unit 12. This reference position marker is used to determine the relative positional relationship between the area to be inspected on the printed circuit board W and the electrical inspection head 10. The reference position marker may be, for example, the circuit pattern itself, or may be a positioning mark provided separately from the circuit pattern.

[0022] (Electrical Inspection Head) The electrical inspection head 10 has a plurality of probes 21a, a pair of support plates (a bottom plate 21b that can contact the printed circuit board W in the normal direction, and a top plate 21c that is arranged opposite the bottom plate 21b in the direction away from the printed circuit board W in the normal direction) having through holes through which the plurality of probes 21a can pass, and a base 21d fixed to the top plate 21c. The plurality of probes 21a are provided so as to be able to contact the circuit pattern of the printed circuit board W.

[0023] When viewed in the normal direction of the printed circuit board W (hereinafter also referred to as "plan view"), the electrical inspection head 10 has corners. More specifically, the electrical inspection head 10 has a rectangular shape in plan view with four corners. Furthermore, the base 21d also has corners in plan view. The planar shape of the base 21d is the same as the planar shape of the electrical inspection head 10. A specific shape of the base 21d is a rectangular parallelepiped with the thickness direction aligned with the normal direction of the printed circuit board W. Note that the "rectangular parallelepiped" is not limited to a perfect rectangular parallelepiped, but also includes shapes with partial irregularities, shapes with rounded corners, etc.

[0024] The thickness T1 of the base 21d can be set within a range that can adequately hold the multiple probes 21a while maintaining the necessary strength. From this perspective, the lower limit of the thickness T1 of the base 21d is preferably 30 mm, and more preferably 40 mm. On the other hand, the upper limit of the thickness T1 of the base 21d is preferably 100 mm, more preferably 80 mm, and even more preferably 60 mm. If the thickness T1 exceeds the upper limit, it may be difficult to sufficiently shorten the movement distance of the imaging unit 12 by the movement mechanism 13.

[0025] The thickness T2 of the electrical inspection head 10 (defined by the bottom surface of the bottom plate 21b and the top surface of the base 21d) can be set within a range that allows the multiple probes 21a to properly perform electrical inspection of the printed circuit board W while maintaining the necessary strength. The lower limit of the thickness T2 of the electrical inspection head 10 is preferably 50 mm, and more preferably 60 mm. On the other hand, the upper limit of the thickness T2 of the electrical inspection head 10 is preferably 150 mm, and more preferably 120 mm, and even more preferably 90 mm.

[0026] (Rotation mechanism) The rotation mechanism 11 is configured to be able to rotate the electrical inspection head 10 independently of the imaging unit 12 (more specifically, the imaging terminal 22 described below). The rotation mechanism 11 rotates the electrical inspection head 10 around a rotation axis R that is perpendicular to the electrical inspection head 10. The rotation axis R is located at the center of the electrical inspection head 10 in a plan view. The specific configuration of the rotation mechanism 11 is not particularly limited, but may include a configuration in which the electrical inspection head 10 is rotatably held directly or indirectly by a bearing (not shown) arranged in the housing 16.

[0027] (imaging unit) The imaging unit 12 has an imaging terminal 22 including the aforementioned optical element 22a facing the printed circuit board W from the normal direction, and an image processing unit. The imaging terminal 22 is configured to be able to capture digital images. The imaging terminal 22 captures images of the aforementioned reference position markers provided on the printed circuit board W from the normal direction. An example of the optical element 22a is a lens. The image processing unit processes the digital images captured by the imaging terminal 22.

[0028] The imaging terminal 22 is provided so as to be able to capture an image of the reference position marker from the side of the electrical inspection head 10. This configuration makes it possible to reduce the distance between the imaging terminal 22 and the printed circuit board W during imaging. As a result, the amount of light taken in by the imaging terminal 22 can be increased, and the recognition accuracy of the image captured by the imaging terminal 22 can be improved.

[0029] The imaging terminal 22 captures an image of the reference position marker from a position close to the electrical inspection head 10 (close position P1). More specifically, the imaging terminal 22 captures an image of the reference position marker from a position where it can come into contact with a corner of the electrical inspection head 10 when the electrical inspection head 10 is rotated. By arranging the imaging terminal 22 close to the electrical inspection head 10 in this manner, it is possible to reduce the movement distance of the electrical inspection head 10 when aligning the electrical inspection head 10 with the area to be inspected on the printed circuit board W after capturing an image of the reference position marker. As a result, it is possible to suppress errors caused by the movement of the electrical inspection head 10 while improving the efficiency of the electrical inspection process.

[0030] The image processing unit may be included in the control unit 17, or may be provided separately from the control unit 17. When the image processing unit is included in the control unit 17, the image processing unit may be part of a program processed by the control unit 17.

[0031] (moving mechanism) The moving mechanism 13 holds the imaging terminal 22. As shown in Fig. 1 and Fig. 3, the moving mechanism 13 moves the imaging terminal 22 between a close position P1 and an avoidance position P2. The close position P1 is a position where the imaging unit 12 (more specifically, the imaging terminal 22) may come into contact with the electrical inspection head 10 when the electrical inspection head 10 rotates. The avoidance position P2 is a position where the imaging unit 12 (more specifically, the imaging terminal 22) does not come into contact with the electrical inspection head 10 when the electrical inspection head 10 rotates.

[0032] As described above, the electrical inspection device 1 can improve the efficiency of the electrical inspection process by capturing an image of the reference position marker using the imaging terminal 22 from the proximity position P1. However, if the imaging terminal 22 is located at the proximity position P1, the rotation of the electrical inspection head 10 is restricted, which can make it difficult to align the electrical inspection head 10 with the area to be inspected. For this reason, the electrical inspection device 1 is configured so that the imaging terminal 22 can be moved to the avoidance position P2 using the movement mechanism 13.

[0033] It is preferable that the moving mechanism 13 moves the imaging unit 12 independently of the electrical inspection head 10. In other words, it is preferable that the moving mechanism 13 is provided so that the imaging terminal 22 does not move following the electrical inspection head 10 when the electrical inspection head 10 rotates and moves up and down. With this configuration, it is possible to align the electrical inspection head 10 with respect to the printed circuit board W while maintaining the focal length of the optical element 22a with respect to the printed circuit board W, and then perform electrical inspection using the electrical inspection head 10 after this alignment. As a result, electrical inspection can be performed more efficiently and stably.

[0034] 3, the avoidance position P2 is preferably a position that is farther away from the proximity position P1 in the normal direction of the printed circuit board W. With this configuration, the electrical inspection device 1 can prevent the movement distance of the imaging terminal 22 from increasing even when the imaging terminal 22 is placed to the side of and close to the electrical inspection head 10. As a result, errors caused by the movement of the electrical inspection head 10 can be more easily suppressed while promoting the efficiency of the electrical inspection process.

[0035] When viewed in the normal direction of the printed circuit board W, it is preferable that the distance between the imaging unit 12 (more specifically, the imaging terminal 22) and the rotation axis R at the approach position P1 is the same as the distance between the imaging unit 12 (more specifically, the imaging terminal 22) and the rotation axis R at the avoidance position P2. With this configuration, the movement distance of the imaging terminal 22 can be easily reduced.

[0036] It is preferable that the movement mechanism 13 is provided so as to linearly move the imaging terminal 22. With this configuration, the movement distance of the imaging terminal 22 can be more easily reduced.

[0037] The movement distance of the imaging unit 12 between the approach position P1 and the avoidance position P2 is preferably equal to or less than the thickness T2 of the electrical inspection head 10, and more preferably equal to or less than the thickness T1 of the base 21d. The electrical inspection device 1 can be configured to capture an image of the reference position marker using the imaging terminal 22 from the side of the base 21d, for example, thereby controlling the movement distance of the imaging unit 12 to be equal to or less than the thickness T1 of the base 21d. With this configuration, the focal length of the optical element 22a with respect to the printed circuit board W at the approach position P1 can be appropriately maintained, while the movement distance of the imaging terminal 22 can be easily reduced.

[0038] The moving mechanism 13 holds the imaging terminal 22 while being connected to the housing 16. The moving mechanism 13 is provided so that the imaging terminal 22 can slide relative to the housing 16 in the normal direction of the printed circuit board W. With this configuration, the moving mechanism 13 can move the imaging terminal 22 in the normal direction of the printed circuit board W independently of the electrical inspection head 10. A specific configuration of the moving mechanism 13 can be, for example, a configuration that includes a rail member that is arranged on the housing 16 and a movable member that is slidably arranged on the rail member and can fix the imaging terminal 22.

[0039] (positioning mechanism) The positioning mechanism 14 positions the electrical inspection head 10 in the planar direction of the printed circuit board W while maintaining the orientation of the electrical inspection head 10. By providing the positioning mechanism 14, the electrical inspection device 1 can easily align the electrical inspection head 10 with the area to be inspected after the image of the reference position marker is captured by the imaging unit 12.

[0040] The specific configuration of the positioning mechanism 14 is not particularly limited as long as it can position the electrical inspection head 10 in the planar direction of the printed circuit board W, and may be, for example, a Cartesian coordinate system as shown in Figures 1 and 2. The positioning mechanism 14 has a pair of fixed rails 14a extending parallel to one direction (the Y direction in Figures 1 and 2) parallel to the planar direction of the printed circuit board W, a movable rail 14b extending parallel to the planar direction of the printed circuit board W and spanning between the pair of fixed rails 14a, and a movable body 14c disposed on the movable rail 14b. A housing 16 is fixed to the movable body 14c.

[0041] The positioning mechanism 14 is configured such that the movable rail 14b moves along the extension direction of the pair of fixed rails 14a (Y direction in FIGS. 1 and 2), and the movable body 14c moves along the extension direction of the movable rail 14b (X direction in FIGS. 1 and 2). With this configuration, the housing 16 is provided so as to be movable in the planar direction of the printed circuit board W while maintaining its orientation in this planar direction. As a result, the electrical inspection head 10, together with the housing 16, also moves in this planar direction while maintaining its orientation in this planar direction of the printed circuit board W.

[0042] Furthermore, the positioning mechanism 14 is provided so as to be able to simultaneously position the electrical inspection head 10 and the imaging unit 12 in the planar direction of the printed circuit board W. More specifically, the imaging terminal 22 is connected to the housing 16 via the moving mechanism 13, and is configured to move together with the housing 16 in the planar direction of the printed circuit board W. As a result, the electrical inspection head 10 and the imaging terminal 22 are simultaneously positioned in the planar direction of the printed circuit board W by the positioning mechanism 14 via the housing 16. With this configuration, the electrical inspection device 1 can more easily suppress errors caused by the movement of the electrical inspection head 10 while promoting the efficiency of the electrical inspection process.

[0043] (Lifting mechanism) The lifting mechanism 15 is provided so as to be able to raise and lower a fixed member 18 fixed to a base 21d of the electrical inspection head 10. The lifting mechanism 15 moves the electrical inspection head 10 in the normal direction of the printed circuit board W by raising and lowering the fixed member 18.

[0044] The fixed member 18 is disposed slidably relative to the housing 16. The fixed member 18 is configured to move up and down independently of the housing 16. With this configuration, the lifting mechanism 15 is provided to lift and lower the electrical inspection head 10 independently of the movement of the imaging unit 12 by the moving mechanism 13.

[0045] (Housing) The housing 16 is fixed to the movable body 14c as described above, so that the housing 16 is movable in the planar direction of the printed circuit board W while maintaining its orientation in the planar direction of the printed circuit board W.

[0046] (Control unit) The control unit 17 includes a computer having, for example, a CPU (Central Processing Unit) for performing data processing and a storage unit such as a semiconductor memory for temporarily or permanently storing various information.

[0047] An example of a control procedure performed by the control unit 17 will be described. The control unit 17 first causes the imaging terminal 22 to capture an image of the reference position marker on the printed circuit board W from the proximity position P1. Next, the control unit 17 moves the imaging terminal 22 to the avoidance position P2, and in this state rotates the electrical inspection head 10 90° around the rotation axis R as the center of rotation, while aligning the electrical inspection head 10 with the area to be inspected on the printed circuit board W. After rotating the electrical inspection head 10, the control unit 17 moves the imaging terminal 22 to the proximity position P1. Furthermore, while maintaining the imaging terminal 22 at the proximity position P1, the control unit 17 brings the electrical inspection head 10 into contact with the printed circuit board W from the normal direction, and performs an electrical inspection of the area to be inspected on the printed circuit board W. After the electrical inspection by the electrical inspection head 10 is completed, the control unit 17 moves the electrical inspection head 10 away from the printed circuit board W. The control unit 17 controls the operations of the rotation mechanism 11, the movement mechanism 13, the positioning mechanism 14, and the lifting mechanism 15 so that the above-described procedure is performed for each inspection area of ​​the printed circuit board W, modifying some of the procedure as necessary. With the control unit 17 performing the above-described control, the electrical inspection device 1 can quickly and easily align the electrical inspection head 10 with respect to the printed circuit board W, and properly perform electrical inspection of the printed circuit board W.

[0048] [Electrical inspection method] Next, an electrical inspection method using the electrical inspection device 1 of FIGS. 1 and 2 will be described with reference to the respective drawings.

[0049] The electrical inspection method is performed using an electrical inspection device 1 that includes an electrical inspection head 10 that can contact the printed circuit board W from the normal direction, a rotation mechanism 11 that rotates the electrical inspection head 10 about a rotation axis R that is parallel to the normal direction, an imaging unit 12 that has an optical element 22a that faces the printed circuit board W from the normal direction and can image the printed circuit board W, and a movement mechanism 13 that moves the imaging unit 12 between a proximity position P1 and an avoidance position P2. As shown in FIG. 4 , the electrical inspection method includes the steps of: capturing an image of the printed circuit board W using the imaging unit 12 at the proximity position P1 (S1); moving the imaging unit 12 to the avoidance position P2 (S2); rotating the electrical inspection head 10 (S3); moving the imaging unit 12 to the proximity position P1 (S4); and bringing the electrical inspection head 10 into contact with the printed circuit board W (S5). The electrical inspection method further includes a step of moving the electrical inspection head 10 away from the printed circuit board W after S5. This electrical inspection method repeats the above-described procedure for each area to be inspected on the printed circuit board W, modifying some of the procedures as necessary, thereby enabling the electrical inspection head 10 to be quickly and easily aligned with the printed circuit board W and allowing proper electrical inspection of the printed circuit board W.

[0050] (S1) In S1, as shown in FIG. 1, the imaging terminal 22 captures an image of the reference position marker on the printed circuit board W in a state where the imaging terminal 22 is placed at the proximity position P1.

[0051] (S2) In S2, the imaging terminal 22 is moved to an avoidance position P2, as shown in Fig. 3. In S2, the imaging unit 12 is moved so that the proximity position P1 is a position where the imaging unit 12 (more specifically, the imaging terminal 22) may come into contact with the electrical inspection head 10 when the electrical inspection head 10 is rotated, and the avoidance position P2 is a position where the imaging unit 12 (more specifically, the imaging terminal 22) does not come into contact with the electrical inspection head 10 when the electrical inspection head 10 is rotated.

[0052] (S3) In S3, as shown in Fig. 5, with the imaging terminal 22 in the avoidance position P2, the electrical inspection head 10 is rotated around the rotation axis R. More specifically, in S3, the electrical inspection head 10 is rotated to a position where the imaging terminal 22 does not overlap with the electrical inspection head 10 when viewed in the normal direction of the printed circuit board W. The rotation angle of the electrical inspection head 10 is not particularly limited, but can typically be set to 90°.

[0053] (S4) 6, in S4, after rotating the electrical inspection head 10 in S3, the imaging terminal 22 is moved to the proximity position P1. More specifically, in S4, the imaging terminal 22 is moved from the avoidance position P2 to the proximity position P1 along the same path as that used to move the imaging terminal 22 from the proximity position P1 to the avoidance position P2 in S2. Note that in this electrical inspection method, the positioning mechanism 14 may be used to align the electrical inspection head 10 with the area to be inspected on the printed circuit board W at any timing between the end of S1 and the start of S5.

[0054] (S5) In S5, as shown in FIG. 7, the electrical inspection head 10 is brought into contact with the printed circuit board W from the normal direction side, and an electrical inspection of the inspection area is performed by the multiple probes 21a.

[0055] <Advantages> The electrical inspection device 1 can position the imaging unit 12 at a proximity position P1, image the printed circuit board W from the normal direction with the imaging unit 12, and then move the imaging unit 12 to an avoidance position P2 where it will not come into contact with the electrical inspection head 10 when the electrical inspection head 10 rotates. Therefore, the electrical inspection device 1 can image the printed circuit board W with the imaging unit 12 from near the electrical inspection head 10, and then rotate the electrical inspection head 10 independently of the imaging unit 12. As a result, the electrical inspection device 1 can quickly and easily align the electrical inspection head 10 with respect to the printed circuit board W. Therefore, the electrical inspection device 1 can quickly and stably perform electrical inspection of the printed circuit board W.

[0056] In this electrical inspection method, with the imaging unit 12 positioned at a proximity position P1, the imaging unit 12 can capture an image of the printed circuit board W from the normal direction, and then move the imaging unit 12 to an avoidance position P2 where it will not come into contact with the electrical inspection head 10 when the electrical inspection head 10 rotates. Therefore, in this electrical inspection method, the imaging unit 12 can capture an image of the printed circuit board W from near the electrical inspection head 10, and then rotate the electrical inspection head 10 independently of the imaging unit 12. As a result, this electrical inspection method can quickly and easily align the electrical inspection head 10 with the printed circuit board W. Therefore, this electrical inspection method can quickly and stably perform electrical inspection of the printed circuit board W.

[0057] [Other embodiments] The above-described embodiments do not limit the configuration of the present invention. Therefore, the above-described embodiments may include omissions, substitutions, or additions of components based on the description in this specification and common general technical knowledge, and all of these should be construed as falling within the scope of the present invention.

[0058] In the above embodiment, a configuration has been described in which the moving mechanism moves the imaging unit in the normal direction of the printed circuit board. However, in this electrical inspection device, the moving direction of the imaging unit is not limited to the normal direction of the printed circuit board. For example, the moving mechanism may move the imaging unit in a planar direction of the printed circuit board. Furthermore, the moving mechanism does not have to move the imaging unit linearly. For example, the moving mechanism may move the imaging unit in a rotational direction of the planar direction of the printed circuit board.

[0059] In the above embodiment, the configuration in which the printed circuit board is held horizontally has been described. However, the holding direction of the printed circuit board can be changed depending on the specifications of the device. Also, in the above embodiment, the configuration in which the corners of the printed circuit board are gripped by gripping tools has been described, but the method of gripping the printed circuit board in the electrical inspection device is not limited to the above configuration.

[0060] The specific configuration of the electrical inspection head is not limited to the configuration of the above-described embodiment. For example, the electrical inspection head may be configured without the support plate described above. An example of a configuration without the support plate is a configuration without one or both of the bottom plate and the top plate. For example, when the electrical inspection head does not have the bottom plate, the thickness of the electrical inspection head can be determined by the total thickness of the base and the probe. Note that the thickness of the probe here refers to the protruding length of the probe before electrical inspection.

[0061] As described above, it is preferable that the movement mechanism can move the imaging unit independently of the electrical inspection head. However, the electrical inspection device can also adopt a configuration in which the imaging unit moves up and down in accordance with the electrical inspection head, as long as the imaging unit can be held so as not to rotate in accordance with the rotation of the electrical inspection head.

[0062] In the above embodiment, the electrical inspection head and the imaging unit are simultaneously positioned in the planar direction of the printed circuit board by the positioning mechanism. However, the electrical inspection device may also be configured so that the electrical inspection head and the imaging unit are separately positioned in the planar direction of the printed circuit board.

[0063] In the above embodiment, the electrical inspection head is positioned in the planar direction of the printed circuit board by the positioning mechanism. However, the electrical inspection device may be configured so that the electrical inspection head is positioned in the planar direction of the printed circuit board by moving the printed circuit board in the planar direction. [Industrial Applicability]

[0064] As described above, an electrical testing device according to one aspect of the present invention is suitable for quickly and easily aligning an electrical testing head with respect to a printed circuit board. [Explanation of symbols]

[0065] 1 Electrical testing equipment 10 Electrical Inspection Head 11 Rotation mechanism 12 Imaging unit 13 Moving mechanism 14 Positioning mechanism 14a Fixed rail 14b Movable rail 14c Mobile object 15 Lifting mechanism 16 Case 17 Control Unit 18 Fixing member 21a probe 21b Bottom plate 21c Top 21d base 22 Imaging terminal 22a Optical elements 31 Gripping tool R rotation axis W printed circuit board P1 Proximity position P2 Avoidance position T1 Base thickness T2 Electrical Inspection Head Thickness

Claims

1. an electrical inspection head that can contact the printed circuit board from the normal direction side and performs an electrical inspection of the printed circuit board; an imaging unit having an optical element facing the printed circuit board in a normal direction and capable of imaging the printed circuit board; a moving mechanism that moves the imaging unit in a normal direction of the printed circuit board; An electrical testing device comprising:

2. 2. The electrical inspection device according to claim 1, wherein the moving mechanism moves the imaging unit independently of the electrical inspection head.

3. 2. The electrical inspection device according to claim 1, wherein during electrical inspection, the electrical inspection head moves in a normal direction of the printed circuit board independently of the movement of the imaging unit by the moving mechanism, while maintaining the focal length of the imaging unit relative to the printed circuit board.

4. the moving mechanism moves the imaging unit in a normal direction of the printed circuit board between a close position and an avoidance position, the proximity position is a position where the imaging unit is close to the electrical inspection head, 3. The electrical inspection device according to claim 1, wherein the avoidance position is a position where the imaging unit moves away from the approach position in a normal direction of the printed circuit board.

5. the moving mechanism moves the imaging unit in a normal direction of the printed circuit board between a close position and an avoidance position, the proximity position is a position where the imaging unit images the printed circuit board, 3. The electrical inspection device according to claim 1, wherein the avoidance position is a position where the imaging unit moves away from the approach position in a normal direction of the printed circuit board.

6. 3. The electrical inspection device according to claim 1, further comprising a positioning mechanism that can position the electrical inspection head in a plane direction of the printed circuit board.

7. 7. The electrical inspection device according to claim 6, wherein the positioning mechanism simultaneously positions the electrical inspection head and the imaging unit in the planar direction.

8. 3. The electrical inspection device according to claim 1, further comprising an elevator mechanism for moving the electrical inspection head in a normal direction of the printed circuit board.

9. performing an electrical inspection of the printed circuit board using an electrical inspection head that can contact the printed circuit board from a normal direction; capturing an image of the printed circuit board using an imaging unit having an optical element facing the printed circuit board in a normal direction; moving the imaging unit in a normal direction of the printed circuit board; An electrical inspection method comprising:

Images