Component mounting apparatus and component mounting method

Abstract

To provide a component mounting device capable of improving efficiency and safety at a work site by suppressing complication of wiring of an electric wire for transmitting and receiving an image acquired by an imaging part and saving a space for the wiring even when one or a plurality of imaging parts are added.SOLUTION: The component mounting device includes a component recognition camera and a tip recognition camera. The component recognition camera receives the imaging instruction signal from the main body controller, determines whether an imaging instruction target by the imaging instruction signal is the component recognition camera or the tip recognition camera, performs imaging based on the imaging instruction signal and transmits the captured image to the main body controller when the imaging instruction target is the component recognition camera, and transfers the imaging instruction signal to the tip recognition camera and transfers the image transmitted from the tip recognition camera to the main body controller when the imaging instruction target is the tip recognition camera.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting apparatus and a component mounting method. [Background technology]

[0002] In electronic circuit board manufacturing factories and the like, component mounting devices are used that mount chip-type electronic components (hereinafter also abbreviated as "components") such as ICs (Integrated Circuits), resistors, and capacitors onto circuit boards using a mounting head. Such component mounting devices pick up components from a component supply device (component supply mechanism) such as a tape feeder or tray feeder using a suction nozzle (component holding nozzle) provided on the mounting head.

[0003] A known conventional component mounting device of this type is configured with a component recognition camera as an imaging unit, and the component recognition camera recognizes the pickup state and characteristics of the component (see, for example, Patent Document 1). This component mounting device receives the recognition result from the imaging unit, corrects the difference between the pickup posture of the component and the posture to be placed, and mounts it in the specified position. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-123609 Summary of the Invention [Problem to be solved by the invention]

[0005] In the component mounting device of Patent Document 1, when one or more imaging units are added, it is difficult to reduce the complexity of the wiring of the electric wires for transmitting and receiving the images captured by the imaging units, which makes it difficult to reduce the space required for wiring and improve efficiency and safety at the work site.

[0006] The present disclosure provides a component mounting device and a component mounting method that can reduce the complexity of wiring the electrical wires for transmitting and receiving images acquired by the imaging units, even when one or more imaging units are added, and that can save space in the wiring, thereby improving efficiency and safety at the work site. [Means for solving the problem]

[0007] One aspect of the present disclosure includes a nozzle that holds a component and moves toward a board on which the component is to be mounted, a first imaging unit that images the component held by the nozzle from below, a control unit that corrects a deviation in position and orientation of the component with respect to the nozzle based on the component included in an image captured by the first imaging unit, and a second imaging unit different from the first imaging unit, wherein the first imaging unit receives an imaging instruction signal from the control unit and determines whether the imaging instruction signal is directed to the first imaging unit or the second imaging unit. and if the imaging instruction target is the first imaging unit, performs imaging based on the imaging instruction signal and transmits the captured first image to the control unit; and if the imaging instruction target is the second imaging unit, transfers the imaging instruction signal to the second imaging unit and transfers the second image transmitted from the second imaging unit to the control unit, and the second imaging unit receives the imaging instruction signal transmitted from the first imaging unit, performs imaging based on the imaging instruction signal, and transmits the captured second image to the first imaging unit.

[0008] One aspect of the present disclosure is a component mounting device including: a nozzle that holds a component and moves toward a board on which the component is to be mounted; a first imaging unit that images the component held by the nozzle from below; a control unit that corrects misalignment of the component in position and orientation relative to the nozzle based on the component included in the image captured by the first imaging unit; and a second imaging unit different from the first imaging unit, wherein the first imaging unit receives a mode instruction signal from the control unit to indicate an operation mode, determines the operation mode based on the mode instruction signal, receives an imaging instruction signal from the control unit, and, if the operation mode is the first operation mode, captures an image based on the imaging instruction signal and transmits the captured first image to the control unit; and, if the operation mode is the second operation mode, transfers the imaging instruction signal to the second imaging unit and transfers the second image transmitted from the second imaging unit to the control unit, and the second imaging unit receives the imaging instruction signal transmitted from the first imaging unit, captures an image based on the imaging instruction signal, and transmits the captured second image to the first imaging unit.

[0009] One aspect of the present disclosure includes a nozzle moving step of using a nozzle to hold a component and move the component toward a board on which the component is to be mounted; a first imaging step of using a first imaging unit to image the component held by the nozzle from below; a first control step of using a control unit to correct a deviation in position and orientation of the component relative to the nozzle based on the component included in an image captured by the first imaging unit; a second imaging step of using a second imaging unit different from the first imaging unit to image a predetermined imaging target; and a second control step of transmitting an imaging instruction signal from the control unit to control operation of the first imaging unit and the second imaging unit, wherein in the first imaging step: The component mounting method includes receiving the imaging instruction signal at the first imaging unit, determining whether the imaging instruction signal is directed to the first imaging unit or the second imaging unit, and if the imaging instruction signal is directed to the first imaging unit, capturing an image based on the imaging instruction signal and transmitting the captured first image to the control unit, and if the imaging instruction signal is directed to the second imaging unit, transferring the imaging instruction signal to the second imaging unit and transferring the second image transmitted from the second imaging unit to the control unit, and in the second imaging step, receiving the imaging instruction signal transmitted from the first imaging unit, capturing an image based on the imaging instruction signal, and transmitting the captured second image to the first imaging unit.

[0010] One aspect of the present disclosure includes a nozzle moving step of using a nozzle to hold a component and move the component toward a board on which the component is to be mounted; a first imaging step of using a first imaging unit to image the component held by the nozzle from below; a first control step of using a control unit to correct a deviation in position and orientation of the component relative to the nozzle based on the component included in an image captured by the first imaging unit; a second imaging step of using a second imaging unit different from the first imaging unit to image a predetermined imaging target; and a second control step of transmitting a mode instruction signal and an imaging instruction signal for instructing an operation mode from the control unit to switch and control operations of the first imaging unit and the second imaging unit. The component mounting method includes the steps of: receiving the mode instruction signal with the first imaging unit; determining the operation mode based on the mode instruction signal; receiving the imaging instruction signal with the first imaging unit; and, if the operation mode is a first operation mode, capturing an image based on the imaging instruction signal and transmitting the captured first image to the control unit; and, if the operation mode is a second operation mode, transferring the imaging instruction signal to the second imaging unit and transferring the second image transmitted from the second imaging unit to the control unit; and, in the second imaging step, receiving the imaging instruction signal transmitted from the first imaging unit, capturing an image based on the imaging instruction signal, and transmitting the captured second image to the first imaging unit. [Effects of the Invention]

[0011] According to the present disclosure, even when one or more imaging units are added, the complexity of wiring the electrical wires for transmitting and receiving images acquired by the imaging units can be reduced, and space for wiring can be saved, thereby improving efficiency and safety at the work site. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a top view illustrating a mechanical configuration of a component mounting device according to a first embodiment of the present invention; [Figure 2] FIG. 2 is a side view illustrating a mechanical configuration of the component mounting device shown in FIG. [Figure 3] FIG. 3 is a perspective view illustrating the operation of the moving head and the component holding nozzle shown in FIG. [Figure 4] FIG. 4 is a schematic diagram illustrating the focal heights of the component recognition camera and the tip recognition camera shown in FIG. 3 . [Figure 5] FIG. 2 is a block diagram illustrating the functional configuration of a main body control unit of the component mounting device shown in FIG. 1; [Figure 6] FIG. 6 is a block diagram illustrating the configuration of the component recognition camera and the tip recognition camera shown in FIG. 5 . [Figure 7] A flowchart illustrating an example of an operation flow executed by the component recognition camera shown in FIG. [Figure 8] 7 is a flowchart illustrating an example of an operation flow executed by the front-end recognition camera shown in FIG. 6. [Figure 9] 10 is a flowchart illustrating an example of an operation flow executed by a component recognition camera according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of the present disclosure will be described in detail with appropriate reference to the drawings. However, more detailed description than necessary may be omitted. For example, detailed descriptions of well-known matters and redundant descriptions of substantially identical configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[0014] For example, the term "unit" or "device" in the embodiments is not limited to a physical configuration mechanically realized by hardware, but also includes a configuration whose functions are realized by software such as a program. Furthermore, the functions of one configuration may be realized by two or more physical configurations, or the functions of two or more configurations may be realized by, for example, one physical configuration.

[0015] (How the embodiment of the present disclosure was achieved) In a component mounting device such as that disclosed in Patent Document 1, in order to realize various additional functions (to accommodate various applications), it may be necessary to add an additional imaging unit (camera) in addition to the component recognition camera (existing imaging unit) mentioned above.

[0016] For example, it is being considered to use an additional imaging unit to capture images of the tip of the suction nozzle in order to detect whether the position and orientation of the suction nozzle itself that mounts and transports the component is correct, and to detect component mounting errors such as the component being suction-held by the suction nozzle dropping midway through or moving back while still being held by suction.In addition, it is also being considered to add an imaging unit separate from the existing component recognition camera in order to capture images of smaller-than-normal components with greater accuracy than the existing imaging unit.

[0017] Incidentally, imaging units such as component recognition cameras are used by connecting electric wires (e.g., cables) to connection ports (connection ports) of an image acquisition unit (e.g., an image capture board) mounted on the control device main body (e.g., a controller device) of the component mounting device. Therefore, when an additional imaging unit is added, it is necessary to connect the electric wires of the additional imaging unit to the remaining connection ports of the image acquisition unit. Alternatively, when the image acquisition unit is connected to other electric wires and there is no room for connection ports, it is considered to install a switch or repeater between the imaging unit and the image acquisition unit. That is, it is considered to indirectly connect the additional imaging unit to the image acquisition unit via the switch or repeater, with the images transmitted from the other imaging units being aggregated once by the switch or repeater.

[0018] However, when adding an imaging unit in this way, whether it is directly connected to the connection port of the image acquisition unit or indirectly connected to the image acquisition unit via a switch or the like, the wiring connecting the device elements may be extended excessively or the wiring may become complicated, which may lead to inefficiencies at the work site. From the viewpoint of work safety, there is room for improvement.

[0019] In the following embodiments, we will describe a component mounting device and a component mounting method that can reduce the complexity of wiring the electrical wires used to send and receive images captured by the imaging units, even when one or more imaging units are added, and that can save space in the wiring, thereby improving efficiency and safety at the work site.

[0020] (Embodiment 1) A first embodiment of the present disclosure will be described with reference to FIGS.

[0021] <Mechanical configuration of the component placement device> The mechanical configuration of the component mounting apparatus 1 will be described with reference to FIGS. FIG. 1 is a top view illustrating the mechanical configuration of a component mounting apparatus 1 according to the present embodiment. FIG. 2 is a side view illustrating the mechanical configuration of the component mounting apparatus 1 shown in FIG.

[0022] For ease of explanation, the axis extending in the height direction from the floor surface on which the component mounting device 1 is placed is referred to as the Z-axis. The axis perpendicular to the Z-axis (i.e., parallel to the floor surface) and extending from the front of the component mounting device 1 (the lower side of the paper in FIG. 1 ) to the rear of the component mounting device 1 (the upper side of the paper in FIG. 1 ) is referred to as the Y-axis. The axis perpendicular to the Y-axis and Z-axis is referred to as the X-axis. For ease of explanation, the positive direction of the Z-axis may be referred to as "up," the negative direction of the Z-axis as "down," the positive direction of the Y-axis as "front," the negative direction of the Y-axis as "rear," the positive direction of the X-axis as "right," and the negative direction of the Y-axis as "left." Furthermore, expressions such as "high" and "low" may be used to refer to the direction of the Z-axis. Furthermore, these directional expressions are used for ease of explanation and are not intended to limit the orientation of the structure during actual use.

[0023] One or more component mounting devices 1 are arranged in a mounting board production line for manufacturing a board W by attaching various components P to the board W. The component mounting device 1 mounts the components P in a predetermined position and posture on the board W transported from upstream of the mounting board production line.

[0024] As shown in FIGS. 1 and 2, the component mounting device 1 includes a main body mechanism section 10 and a main body control section 40.

[0025] The main body mechanism unit 10 mainly uses the operations of each unit mechanism to mount components P (for example, ICs (Integrated Circuits)), electronic components such as transistors or capacitors, lead components, chip components, and / or BGA (Ball Grid Array) components on the substrate W. The main body control unit 40 controls the operation of the main body mechanism unit 10.

[0026] The main body mechanism section 10 has a mounting machine main body 11 composed of a base 12 and the like, and a head unit 23 configured to be movable relative to the mounting machine main body 11. The main body control section 40 is housed inside the base 12 (see below) of the component mounting device 1, and controls various mechanisms such as the mounting machine main body 11 and the head unit 23.

[0027] 1 (the conveying direction of the board W). The board conveying mechanism 13 has a pair of conveyor units 14 extending along the X-axis direction. The board conveying mechanism 13 conveys the board W placed on the pair of conveyor units 14, and positions and holds the board W at a predetermined mounting position.

[0028] A pair of front and rear component supply mechanisms 15 are disposed facing each other on both the front and rear sides of the board transport mechanism 13. Each of the pair of component supply mechanisms 15 has a feeder base 16 provided with a slot 17. A plurality of tape feeders 18 are attached in parallel to the slot 17 as component feeders.

[0029] The component mounting device 1 further includes a feeder cart 19. The feeder cart 19 includes a carriage unit 20 having a plurality of wheels disposed on its lower side, and a plurality of reel stock units (not shown) disposed on the upper side of the carriage unit 20.

[0030] Each of the plurality of reel stock units accommodates a reel 21. A carrier tape 22 accommodating components P is pulled out from each of the reels 21, and the components P are supplied to the tape feeder 18 of the component supply mechanism 15.

[0031] The tape feeder 18 of the component supply mechanism 15 supplies the components P by pitch-feeding the carrier tape 22 in the tape feed direction. The component holding nozzle 27 attached to the moving head 26 of the head unit 23 (described later) picks up (e.g., holds by suction) the components P supplied by the tape feeder 18. The position where the component holding nozzle 27 picks up the components P is sometimes referred to as the component removal position.

[0032] Although only one moving head 26 and one component holding nozzle 27 are shown in Figure 2, multiple moving heads 26 and multiple component holding nozzles 27 may be arranged, for example, in multiple columns and / or multiple rows.

[0033] Head unit 23 is disposed above base 12 and is configured to be movable between a mounting position and a component removal position where component supply mechanism 15 and board W are disposed. Specifically, head unit 23 is movable linearly along the X-axis and Y-axis directions by X-axis table mechanism 25 and Y-axis table mechanism 24 that are disposed orthogonal to each other on a plane substantially parallel to the surface of board W.

[0034] A Y-axis table mechanism 24 is disposed along the Y-axis direction on the upper surface of the base 12. In addition, a pair of front and rear X-axis table mechanisms 25 are disposed along the X-axis direction and are attached to the Y-axis table mechanisms 24 respectively so as to be slidable along the Y-axis direction.

[0035] Furthermore, a movable head 26 is attached to the tip of each of the pair of front and rear X-axis table mechanisms 25 so as to be slidable along the X-axis direction. That is, the movable head 26 is mounted on the head unit 23, and is provided so as to be movable independently of each other by the X-axis table mechanism 25 and the Y-axis table mechanism 24. This allows the movable head 26 to be arbitrarily positioned on a plane substantially parallel to the surface of the substrate W, i.e., on the horizontal plane (XY plane). Furthermore, a board recognition camera 36 is fixed to the movable head 26, and the board recognition camera 36 takes an image of the substrate W (see below).

[0036] The X-axis table mechanism 25 and the Y-axis table mechanism 24 are each configured by, for example, a linear guide drive mechanism.

[0037] A component recognition camera 60 is disposed, for example, midway in the X-axis direction, between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. The imaging axis of the component recognition camera 60 is disposed, for example, along the Z-axis direction, and the imaging direction of the component recognition camera 60 is set to face upward from below. In other words, the focal position F1 of the component recognition camera 60 is set at a predetermined position above the housing, and the component recognition camera 60 images the component P suction-held by the component holding nozzle 27 from below (see below).

[0038] A component holding nozzle 27 (described later) is attached to the moving head 26. The component holding nozzle 27 (described later) picks up a component P from the component supply mechanism 15 and holds it by suction (an example of holding), while moving and passing above the component recognition camera 60 (described later).

[0039] The component recognition camera 60 captures images of the components P held by the component holding nozzles 27 from below, and captures images of the components P sucked and held by the component holding nozzles 27 one or more times while illuminating them at a predetermined timing as they pass by. The main body control unit 40 of the component mounting device 1 recognizes the characteristics of the components P based on the image capture results of the component recognition camera 60.

[0040] Furthermore, between at least one of the pair of front and rear component supply mechanisms 15 and board transport mechanisms 13, a nozzle holder 38 or a waste box 37 is further disposed, for example, on one or the other side in the X-axis direction so as to sandwich the component recognition camera 60 from both sides. For example, the nozzle holder 38 is disposed to the right of the component recognition camera 60. The waste box 37 is disposed to the left of the component recognition camera 60.

[0041] Nozzle holder 38 stores multiple types of component holding nozzles 27 of moving head 26 corresponding to the components P to be held. By having moving head 26 access nozzle holder 38 and performing a predetermined nozzle replacement operation, a component holding nozzle 27 (see below) suitable for the component to be held is attached to moving head 26. Disposal box 37 is formed in a box shape and has an internal space, into which components P, etc. that are determined to be defective as a result of recognition of the image captured by component recognition camera 60, are discarded.

[0042] In this embodiment, a tip recognition camera 70 is disposed between the component recognition camera 60 and the disposal box 37. The imaging axis of the tip recognition camera 70 is also disposed along the Z-axis direction, for example, and the imaging direction of the tip recognition camera 70 is set to face upward from below. In other words, the focal position F2 of the tip recognition camera 70 is also set at a predetermined position above the housing, and the tip recognition camera 70 images the tip of the component holding nozzle 27 from below.

[0043] After passing above the component recognition camera 60, the component holding nozzle 27 moves toward the board W and places the component P at a placement point on the board W. After placement, the component holding nozzle 27 moves back to the component removal position. At this time, the component holding nozzle 27 may move back to the component removal position while moving slightly downward so that the tip position of the component holding nozzle 27 is at the height position for board mounting (the height of the component holding nozzle 27 when mounting the component P on the board W).

[0044] In this embodiment, the imaging axis of the tip recognition camera 70 may be disposed so as to be inclined with respect to the Z-axis direction.

[0045] <Configuration and operation of moving head> The configuration and operation of the moving head 26 and the component holding nozzle 27 will be described with reference to FIG.

[0046] FIG. 3 is a perspective view illustrating the operation of the moving head 26 and the component holding nozzle 27 shown in FIG.

[0047] 3, the description will be given focusing on one moving head 26 and one component holding nozzle 27, but it is also possible to arrange a plurality of moving heads 26 and component holding nozzles 27. For example, the moving heads 26 and the component holding nozzles 27 may be arranged side by side in a plurality of columns and / or a plurality of rows.

[0048] The component holding nozzles 27 individually lift and lower the components P by vacuum suction using, for example, air pressure, from the tape feeders 18 of the component supply mechanism 15. The moving head 26 also has a Z-axis lifting mechanism (not shown) that individually lifts and lowers each of the component holding nozzles 27, and a θ-axis rotation mechanism (not shown) that individually rotates each of the component holding nozzles 27 around its nozzle axis.

[0049] Moving head 26 is positioned arbitrarily in the horizontal plane (XY plane) by driving Y-axis table mechanism 24 and X-axis table mechanism 25. By this movement, moving head 26 picks up component P from the component pick-up position of tape feeder 18 of component supply mechanism 15 by suction with component holding nozzle 27.

[0050] The component recognition camera 60 and the tip recognition camera 70 are disposed adjacent to each other in the X-axis direction, for example. As will be described later, the component recognition camera 60 captures an image when the component holding nozzle 27 makes an outward movement. The tip recognition camera 70 captures an image, for example, after nozzle replacement or before production (i.e., before producing a board W on which a component P is mounted). In this case, the tip recognition camera 70 may capture an image each time the nozzle is replaced or each time production is carried out. The tip recognition camera 70 may also capture an image when the component holding nozzle 27 makes a return movement. In this way, the tip recognition camera 70 captures an image of the component holding nozzle 27 at a different timing from that of the component recognition camera 60.

[0051] While the component holding nozzle 27 holding the component P is moving toward the position of the board W, in other words, while moving on its way, the component recognition camera 60 captures an image of the component P being sucked and held from below.

[0052] The main body control unit 40 analyzes the image captured by the component recognition camera 60 and recognizes the characteristics of the component P. In addition, the main body control unit 40 calculates the position and orientation of the component P sucked and held by the component holding nozzle 27 relative to the component holding nozzle 27. The position and orientation of the component P relative to the component holding nozzle 27 are based on the position and orientation when the component holding nozzle 27 accurately holds the component P.

[0053] Hereinafter, the magnitude of the position and orientation of the component P relative to the component holding nozzle 27 may be referred to as the amount of deviation in the position and orientation of the component P. The amount of deviation in the position of the component P may be expressed as the amount of movement in the X-axis direction and Y-axis direction and / or the amount of movement in the Z-axis direction on the XY plane. The amount of deviation in the orientation of the component P may be expressed as a rotation angle on the XY plane.

[0054] A board recognition camera 36 (see FIGS. 1 and 2) is fixed to the moving head 26 and is disposed below the X-axis table mechanism 25, moving integrally with the moving head 26. As the moving head 26 moves, the board recognition camera 36 passes above the board W positioned by the board transport mechanism 13 and captures an image of the board W. The image result (image) is similarly subjected to recognition processing, thereby detecting the position and posture of the board W.

[0055] As a result of detecting the position of the board W, the main body control unit 40 moves the component holding nozzle 27 of the moving head 26 to the mounting point of the component P held by that component holding nozzle 27, and mounts that component P at that mounting point in a mounting attitude. The mounting point indicates the position on the board W where the component P is to be mounted. The mounting attitude indicates the attitude (e.g., orientation) of the component P when it is mounted at that mounting point. At this time, the moving head 26 moves in the XY plane and rotates around its axis to correct the amount of deviation in the position and orientation of the component P described above, and then mounts the component P at the mounting point. This corrects the relative deviation between the component holding nozzle 27 and the component P, and the component P is accurately mounted at the mounting point on the board W.

[0056] The above-described movement and mounting operations may be repeated until all of the components P sucked and held by each of the multiple component holding nozzles 27 have been mounted on the board W. In this manner, the components P are held and moved by the component holding nozzles 27 of the moving head 26 between the component pick-up position and the mounting operation position, and are finally mounted on the board W.

[0057] After each component P is mounted, the component holding nozzle 27 of the moving head 26 returns to the component pick-up position.

[0058] The tip recognition camera 70 may capture an image when the component holding nozzle 27 returns. In this case, the component holding nozzle 27 moves downward toward the component removal position so that its tip is positioned at the mounting height, i.e., the height of the component holding nozzle 27 when mounting the component P on the board W. Along the way, the tip recognition camera 70 captures an image of the tip of the component holding nozzle 27 from below. In this case, a position above the tip recognition camera 70 along at least the Z axis is a position captured by the tip recognition camera 70, and at this position, the tip (lower end) of the tip recognition camera 70 is set to be at the mounting height (board mounting height). Therefore, the tip recognition camera 70 captures an image of the tip of the component holding nozzle 27 when the component holding nozzle 27 is at the mounting height. In addition, during the return movement, the tip height of the tip recognition camera 70 may be set to another height other than the above-mentioned positions captured by the tip recognition camera 70.

[0059] As described above, the component mounting apparatus 1 repeatedly performs a series of operations, including the component holding nozzle 27 of the moving head 26 picking up and placing multiple components P, and then moving the moving head 26 back to the component pick-up position, until all placements at multiple placement points on the board W are completed. By repeating this operation, multiple components P are sequentially placed on each of the sequentially transported boards W. After placement, the board W on which all components P have been placed is transported to a downstream process. In this manner, the mounting machine main body 11 and the head unit 23 operate in coordination, and this coordination is performed in response to instructions from the main body control unit 40. Furthermore, during the forward movement of the component holding nozzle 27, the component recognition camera 60 captures an image of the component P held by suction from below. After nozzle replacement, before production, or during the return movement of the component holding nozzle 27, the tip recognition camera 70 captures an image of the tip of the component holding nozzle 27 from below.

[0060] In this embodiment, a series of work units consisting of the forward movement from the removal of component P at the component removal position to the mounting position of component P, and the subsequent return movement to the component removal position, may be referred to as a "one turn" work unit. The forward movement from the component removal position to the mounting position in one turn may also be referred to as "forward movement in one turn" hereinafter. The return movement from the mounting position to the component removal position in one turn may also be referred to as "return movement in one turn" hereinafter.

[0061] <Focus position of the part recognition camera and tip recognition camera> Referring to FIG. 4, the focal positions F1 and F2 of the component recognition camera 60 and the leading end recognition camera 70 will be described.

[0062] FIG. 4 is a schematic diagram illustrating the focal heights of the component recognition camera 60 and the tip recognition camera 70 shown in FIG.

[0063] 4, the focal position F1 and the component recognition height of the component recognition camera 60 are set to be substantially the same, and during the forward movement of one turn, the component holding nozzle 27 passes by so that the component P held by suction coincides with the focal position F1 of the component recognition camera 60. As the component recognition camera 60 passes by, it captures an image of the component P. The main body control unit 40 recognizes the characteristics of the component P based on the image captured by the component recognition camera 60.

[0064] The focal position F2 of the tip recognition camera 70 and the board mounting height are set to be substantially the same, and after nozzle replacement, before production, or at least part of the process of the return movement in one turn, the component holding nozzle 27 passes so that its tip position coincides with the focal position F2 of the tip recognition camera 70. During this passage, the tip recognition camera 70 captures an image of the tip of the component holding nozzle 27. That is, the tip recognition camera 70 captures an image of the tip of the component holding nozzle 27 at the height of the component holding nozzle 27 when components are mounted on the board W, and the main body control unit 40 detects the tip position of the component holding nozzle 27 at the board mounting height based on the image from the tip recognition camera 70, calculates the amount of deviation, and performs correction.

[0065] Regarding the moving height of the component holding nozzle 27 in one turn, the height of the component holding nozzle 27 when the leading edge recognition camera 70 takes an image is set lower than the height of the component recognition camera 60 when the component P is taken by the component recognition camera 60. Therefore, the focal position F2 of the leading edge recognition camera 70 is set lower than the focal position F1 of the component recognition camera 60. The difference in height is set to L (for example, approximately 8 mm).

[0066] <Software configuration of the main body control unit of the component placement device> The software configuration (functional configuration) of the main body control unit 40 of the component mounting apparatus 1 will be described with reference to FIG.

[0067] FIG. 5 is a block diagram illustrating the functional configuration of the main body control unit 40 of the component mounting apparatus 1 shown in FIG.

[0068] The main body control unit 40 of the component mounting device 1 may be configured as a general-purpose computer having a storage device (not shown) represented by a ROM (Read Only Memory) and a RAM (Random Access Memory), and an arithmetic device (not shown) represented by a CPU (Central Processing Unit).

[0069] The arithmetic device reads and executes a computer program stored in the storage device to realize the software configuration (functional configuration) shown in Fig. 5. That is, each of the blocks shown in the main body control unit 40 in Fig. 5 represents a function realized by software. However, at least some of the functions expressed as blocks are not limited to software and may be realized by the physical configuration (hardware) of the "device."

[0070] The main body control unit 40 includes a storage unit 41, a mechanism driving unit 46, and an imaging processing unit 47.

[0071] The mechanism drive unit 46 controls the drive of the main body mechanism unit 10. For example, the mechanism drive unit 46 controls the drive of the substrate transport mechanism 13, the component supply mechanism 15, and the head unit 23, and causes the substrate transport mechanism 13, the component supply mechanism 15, and the head unit 23 to operate in coordination with each other.

[0072] The storage unit 41 stores and holds at least mounting information 42, component information 43, and imaging timing information 45.

[0073] The mounting information 42 includes information such as the type of component P to be mounted on each board W, the mounting position and mounting attitude (e.g., orientation) of the component P on the board W. The component information 43 may include information such as the external shape of each type of component P, and the presence or absence of electrodes and the number of electrodes.

[0074] The imaging timing information 45 may include information indicating the light emission timing of the lighting units 62, 72 (see below) of the component recognition camera 60 and the tip recognition camera 70, information indicating the imaging timing of the component P during the forward movement, and information indicating the imaging timing of the tip of the component holding nozzle 27. The number of imaging timings may be multiple. The imaging timing may be interpreted as shutter timing. The number of light emission timings may also be multiple. The imaging timing information 45 may include information indicating the light emission timing of the lighting channels during one turn of forward movement (i.e., the imaging timing of the component P), information indicating the light emission timing of the lighting channels at the imaging timing of the tip of the component holding nozzle 27, and information indicating the imaging timing of the imaging sensor unit 61 (see below) of the component recognition camera 60 or the imaging sensor unit 71 (see below) of the tip recognition camera 70.

[0075] The image capturing processing unit 47 includes a camera control unit 48 , a component recognition unit 50 , and a tip recognition unit 51 .

[0076] The camera control unit 48 controls the imaging and light emission of each camera. The camera control unit 48 sends an imaging instruction signal to the component recognition camera 60 to control the imaging and illumination of the component recognition camera 60 or the tip recognition camera 70. For example, the camera control unit 48 reads imaging timing information 45 from the storage unit 41. The camera control unit 48 then causes the lighting unit 62 of the component recognition camera 60 to emit light at each imaging timing indicated by the imaging timing information 45, causing the imaging sensor unit 61 of the component recognition camera 60 to capture an image of the component P. Similarly, for the tip recognition camera 70, the camera control unit 48 causes the lighting unit 72 of the tip recognition camera 70 to emit light at appropriate times, causing the imaging sensor unit 71 of the tip recognition camera 70 to capture an image of the tip of the component holding nozzle 27.

[0077] In this embodiment, the connection path (signal path) among the camera control unit 48, the component recognition camera 60, and the tip recognition camera 70 is such that the component recognition camera 60 is directly connected to the main body control unit 40, and the tip recognition camera 70 is directly connected to the component recognition camera 60. The main body control unit 40 and the tip recognition camera 70 are not directly connected, but are indirectly connected via the component recognition camera 60. In other words, the component recognition camera 60 and the tip recognition camera 70 are connected in series to the main body control unit 40 in the connection path, that is, connected in a daisy chain. With this connection, the component recognition camera 60 is set as the higher-level (parent) in the signal flow, and the tip recognition camera 70 is set as the lower-level (child) therebetween. When the imaging instruction target is the tip recognition camera 70, the component recognition camera 60 acts as a bridge (relay) for signals between the main body control unit 40 and the tip recognition camera 70.

[0078] In this embodiment, the two imaging units, the component recognition camera 60 and the tip recognition camera 70, are connected in a daisy chain, but this is not limiting. When two or more imaging units are added and three or more imaging units are used, the three or more imaging units may be connected to the main body control unit 40 in a daisy chain.

[0079] Furthermore, a corresponding identification ID (camera ID) is set for each of the component recognition camera 60 and the tip recognition camera 70, and the camera ID is added to the imaging instruction signal transmitted from the camera control unit 48. The component recognition camera 60 sequentially references the camera ID in the imaging instruction signal to determine (identify) the imaging instruction target (see below). In other words, the imaging instruction signal may include information instructing which imaging unit (camera) to use for imaging.

[0080] The component recognition unit 50 receives an image captured by the imaging sensor unit 61 of the component recognition camera 60, and recognizes the characteristics of the component P contained in the image based on the image (see below). The characteristics of the component P may include at least one of the position of the component P, the orientation of the component P, the polarity of the component P, the three-dimensional shape of the component P, the outer shape of the component P, and any characters added to the component P. Based on the recognition results by the component recognition unit 50, the moving head 26 and the component holding nozzle 27 place the component P at the placement point on the board W. Furthermore, the component recognition unit 50 corrects any deviation in the position and orientation of the component P relative to the component holding nozzle 27 based on the component P contained in the image captured by the imaging sensor unit 61 of the component recognition camera 60.

[0081] The tip recognition unit 51 receives an image signal captured by the imaging sensor unit 71 of the tip recognition camera 70 (see below). The tip recognition unit 51 then analyzes the image to detect the height of the tip position (e.g., the lower end position) of the component holding nozzle 27. Based on the detection result, the main body control unit 40 calculates, for example, the difference between the actual tip position of the component holding nozzle 27 and a set value (target value) stored and held in the memory unit 41, i.e., the amount of deviation in the Z-axis direction. Based on this amount of deviation, the main body control unit 40 raises or lowers the height position of the moving head 26 during mounting, thereby correcting (aligning) the height position of the tip of the component holding nozzle 27.

[0082] The image from the board recognition camera 36 is also transmitted to the image capturing processor 47. The image capturing processor 47, like the component recognition unit 50, recognizes the position and posture of the board W from the image, and transmits the recognition result to the mechanism driver 46.

[0083] <Configuration of the parts recognition camera and advanced recognition camera> The configurations of the component recognition camera 60 and the tip recognition camera 70 will be described with reference to FIG.

[0084] FIG. 6 is a block diagram illustrating the configuration of the component recognition camera 60 and the tip recognition camera 70 shown in FIG.

[0085] The component recognition camera 60 and the tip recognition camera 70 are also configured with a general-purpose minicomputer, and may include a calculation device (not shown), a storage device (not shown), and a communication device. In the component recognition camera 60 and the tip recognition camera 70, each calculation device exchanges signals with the outside world via its respective communication device (communication interface), while reading and executing computer programs stored in its respective storage device, thereby realizing the software configuration (functional configuration) shown in Fig. 6.

[0086] The component recognition camera 60 includes an imaging control unit 63 , an imaging communication unit 64 , an imaging sensor unit 61 , and an illumination unit 62 .

[0087] The imaging control unit 63 of the component recognition camera 60 directly controls the imaging sensor unit 61 of the component recognition camera 60, the lighting unit 62 of the component recognition camera 60, and the imaging communication unit 64 of the component recognition camera 60 in accordance with an imaging instruction signal transmitted from the main body control unit 40. The imaging communication unit 64 of the component recognition camera 60 serves as a communication interface for the component recognition camera 60 and executes the exchange (transmission and reception) of signals or information with the main body control unit 40 and the tip recognition camera 70.

[0088] As described above, the imaging sensor unit 61 of the component recognition camera 60 is disposed so that the imaging axis is along the Z-axis direction, and captures an image of the component P from below as it passes above the component recognition camera 60. The imaging sensor unit 61 of the component recognition camera 60 has a lens (not shown) and an imaging element (not shown).

[0089] The number of lenses may be one or more. The imaging element may be configured by, for example, a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor).

[0090] Furthermore, the imaging sensor unit 61 of the component recognition camera 60 has a shutter function, and exposes and captures an image at a predetermined timing in accordance with an imaging instruction signal from the imaging processing unit 47 of the main body control unit 40. The imaging sensor unit 61 of the component recognition camera 60 transmits the result (image) captured by the imaging element to the imaging control unit 63 of the component recognition camera 60. The imaging control unit 63 of the component recognition camera 60 transmits the image to the main body control unit 40 via the imaging communication unit 64 of the component recognition camera 60.

[0091] The lighting unit 62 of the component recognition camera 60 has, for example, a plurality of lighting units (not shown) that emit light and a reflector (not shown) that reflects the light in a predetermined direction, and is arranged so that the overall direction of illumination is along the imaging axis of the imaging sensor unit 61 of the component recognition camera 60. When the plurality of illumination units emit light simultaneously, the lighting unit 62 of the component recognition camera 60 emits light along the imaging axis of the component recognition camera 60, i.e., the Z-axis direction.

[0092] A transmission glass (not shown) may be arranged horizontally between the component P held by the component holding nozzle 27 and the plurality of lighting units.

[0093] Like the component recognition camera 60, the tip recognition camera 70 is configured to include an imaging control unit 73, an imaging communication unit 74, an imaging sensor unit 71, and an illumination unit 72. The imaging communication unit 74 of the tip recognition camera 70 is directly connected to the component recognition camera 60 via an electric wire (cable), and exchanges signals or information with the main body control unit 40 via (relaying) the imaging communication unit 64 of the component recognition camera 60.

[0094] The other configurations of the leading edge recognition camera 70 are similar or equivalent to those of the component recognition camera 60, and therefore, the description thereof will be omitted or simplified below.

[0095] In this embodiment, the imaging control unit 63 of the component recognition camera 60 directly receives an imaging instruction signal from the main body control unit 40 via the imaging communication unit 64 of the component recognition camera 60. The imaging instruction signal may include a camera ID (an example of camera identification information) that identifies the imaging unit that is the subject of the imaging instruction. The imaging control unit 63 references the camera ID in the imaging instruction signal to determine whether the subject of the imaging instruction is the component recognition camera 60 or the front end recognition camera 70. If the result of this determination indicates that the subject of the imaging instruction is the component recognition camera 60 (itself), the imaging control unit 63 of the component recognition camera 60 controls the imaging sensor unit 61 and the lighting unit 62 of the component recognition camera 60 based on the imaging instruction signal to capture an image of the component P that is sucked and held at a predetermined imaging timing.

[0096] On the other hand, if it is determined that the target of the image capture instruction is the tip recognition camera 70, the image capture control unit 63 of the component recognition camera 60 transfers an image capture instruction signal to the tip recognition camera 70 via the image capture communication unit 64 of the component recognition camera 60. The image capture control unit 63 of the component recognition camera 60 also transfers the image of the tip of the component holding nozzle 27, which is transferred from the tip recognition camera 70 via the image capture communication unit 74 of the tip recognition camera 70, to the main body control unit 40 via the image capture communication unit 64 of the component recognition camera 60. In other words, if it is determined that the target of the image capture instruction is the tip recognition camera 70, the image capture communication unit 64 of the component recognition camera 60 relays the transmission and reception of signals and information between the main body control unit 40 and the tip recognition camera 70.

[0097] In this way, the imaging control unit 73 of the tip recognition camera 70 receives the imaging instruction signal transferred from the component recognition camera 60 via the imaging communication unit 74 of the tip recognition camera 70. As a result of receiving the imaging instruction signal, the imaging control unit 73 of the tip recognition camera 70 controls the imaging sensor unit 71 and lighting unit 72 of the tip recognition camera 70 based on the imaging instruction signal to capture an image of the tip of the component holding nozzle 27 at a predetermined imaging timing. The imaging control unit 73 of the tip recognition camera 70 transmits the captured image of the tip of the component holding nozzle 27 to the component recognition camera 60.

[0098] <Operation flow of the imaging control unit of the parts recognition camera> The operation flow of the imaging control unit 63 of the component recognition camera 60 according to this embodiment will be described with reference to FIG.

[0099] FIG. 7 is a flowchart illustrating an example of an operation flow executed by the component recognition camera 60 shown in FIG.

[0100] When an imaging instruction signal is transmitted from the camera control unit 48 of the main body control unit 40, the imaging control unit 63 of the component recognition camera 60 receives the imaging instruction signal through the imaging communication unit 64 of the component recognition camera 60 (see Figures 5 and 6).

[0101] 7, the imaging control unit 63 of the component recognition camera 60 sequentially determines whether or not an imaging instruction signal has been received from the main body control unit 40 (step S101). This determination is continuously executed (looped) until the component recognition camera 60 receives an imaging instruction signal (NO in step S101).

[0102] If it is determined that an imaging instruction signal has been received from the main body control unit 40 (YES in step S101), the imaging control unit 63 of the component recognition camera 60 refers to the camera ID included in the imaging instruction signal. Based on the camera ID, the imaging control unit 63 of the component recognition camera 60 determines whether the imaging instruction target is a signal for the tip recognition camera 70 (step S102).

[0103] If it is determined that the signal is not intended for the tip recognition camera 70 (NO in step S102), the imaging control unit 63 of the component recognition camera 60 determines that the imaging instruction signal is intended for itself and controls the imaging sensor unit 61 and lighting unit 62 of the component recognition camera 60 without transferring the imaging instruction signal to the tip recognition camera 70 (step S106). As a result of this control, the component recognition camera 60 captures an image of the component P that is sucked and held at a predetermined imaging timing. Then, the imaging control unit 63 of the component recognition camera 60 controls the imaging communication unit 64 of the component recognition camera 60 to transmit the captured image to the main body control unit 40 (step S107). The operation flow after step S107 returns to step S101.

[0104] On the other hand, if it is determined that the signal is for the tip recognition camera 70 (YES in step S102), the imaging control unit 63 of the component recognition camera 60 transfers the imaging instruction signal to the tip recognition camera 70 via the imaging communication unit 64 of the component recognition camera 60 (step S103). Then, the imaging control unit 63 of the component recognition camera 60 sequentially determines whether or not an image has been transmitted (received) from the tip recognition camera 70, by referring to the signal transmitted and received by the imaging communication unit 64 of the component recognition camera 60 (step S104). This determination is executed continuously (in a loop) until the component recognition camera 60 receives an image transmitted from the tip recognition camera 70 (NO in step S104). If it is determined that an image has been transmitted (received) from the tip recognition camera 70 (YES in step S105), the imaging control unit 63 of the component recognition camera 60 controls the imaging communication unit 64 of the component recognition camera 60 to transfer the image of the tip recognition camera 70 to the main body control unit 40 (step S105). The operation flow after step S105 returns to step S101.

[0105] <Operation flow of the imaging control unit of the advanced recognition camera> Referring to FIG. 8, the operation flow of the imaging control unit 73 of the tip recognition camera 70 according to this embodiment will be described.

[0106] FIG. 8 is a flowchart illustrating an example of an operation flow executed by the tip recognition camera 70 shown in FIG.

[0107] When the component recognition camera 60 determines that the target of the imaging instruction signal from the main body control unit 40 is the tip recognition camera 70, and the tip recognition camera 70 transfers the imaging instruction signal, the imaging control unit 73 of the tip recognition camera 70 receives the imaging instruction signal through the imaging communication unit 74 of the tip recognition camera 70 (see Figures 5 and 6).

[0108] 8, the imaging control unit 73 of the tip recognition camera 70 refers to signals transmitted and received by the imaging communication unit 74 of the tip recognition camera 70, and sequentially determines whether or not an imaging instruction signal transferred from the component recognition camera 60 has been received (step S201). This determination is executed continuously (in a loop) until the tip recognition camera 70 receives an imaging instruction signal (NO in step S201).

[0109] If it is determined that an image capture instruction signal has been received from the component recognition camera 60 (YES in step S201), the image capture control unit 73 of the tip recognition camera 70 determines that the signal is directed to itself and controls the image capture sensor unit 71 and lighting unit 72 of the tip recognition camera 70 (step S202). As a result of this control, the tip recognition camera 70 captures an image of the tip of the component holding nozzle 27 at a predetermined image capture timing. The image capture control unit 73 of the tip recognition camera 70 then controls the image capture communication unit 74 of the tip recognition camera 70 to transmit the captured image to the component recognition camera 60 (step S203). After step S203, the operation flow returns to step S201.

[0110] In this way, the component placement device 100 of this embodiment provides the component recognition camera 60 with connection ports (connection openings) to which each unit or device other than the main body control unit 40 can be connected, thereby suppressing the increase in the number of connection openings on the main body control unit 40 and enabling the addition of various other imaging units. Furthermore, even if there are no available connection openings on the main body control unit 40, the existing component recognition camera 60 can relay between the main body control unit 80 and an additional imaging unit (e.g., the leading edge recognition camera 70). Therefore, the main body control unit 40 can issue imaging commands to each imaging unit and collect images captured by each imaging unit.

[0111] For example, the imaging units provided in the component mounting apparatus 100 may include the component recognition camera 60, the board recognition camera 36, ​​and the tip recognition camera 70 described above. The imaging units may also include a head camera that images the board W or the component P from above, a camera that images extremely small components, or other cameras. Furthermore, multiple cameras of each type may be provided. Even when multiple cameras are provided, the component mounting apparatus 100 can accommodate each camera while minimizing the need for additional boards or jigs. Furthermore, even if the main body control unit 40 has sufficient connection ports, the component mounting apparatus 100 can also minimize the complexity of the wiring, which can result from the need for multiple wiring.

[0112] Furthermore, because the component recognition height is, for example, L (mm) higher than the board mounting height, when the tip height of component holding nozzle 27 is lowered from the component recognition height to the board mounting height, the position of the nozzle tip (position on the XY plane) is not necessarily the same as the position of the nozzle tip (position on the XY plane) at the component recognition height. Furthermore, because component recognition camera 60 is focused at the component recognition height, it may not be able to focus at the board mounting height, making it difficult to properly recognize the position of the nozzle tip. Even in such cases, tip recognition camera 70 can focus on the tip position of component holding nozzle 27 at the board mounting height, allowing it to accurately determine the position and orientation of component holding nozzle 27 at the board mounting height.

[0113] Furthermore, for example, by capturing an image of the component holding nozzle 27 and recognizing the tip position of the component holding nozzle 27 during the return movement of the component mounting device 100, the component mounting device 100 can grasp the state of the tip of the component holding nozzle 27 by simply adding the minimum necessary operations to the operations performed during normal mounting of the component P. Furthermore, by capturing an image of the component holding nozzle 27 and recognizing the tip position of the component holding nozzle 27 after nozzle replacement, before production, or during the return movement of the component mounting device 100, the component mounting device 100 can capture an image of the tip of the component holding nozzle 27 when it is not holding a component P, which is difficult to capture during the forward movement, and recognize the state of the component holding nozzle 27.

[0114] In the present embodiment, the component P is recognized by capturing an image of the nozzle tip position after nozzle replacement, before production, or during a return movement. However, this is not a limitation. For example, the component mounting apparatus 100 may be configured such that the main body control unit 40 moves the component holding nozzle 27 above the tip recognition camera 70 at a predetermined timing (e.g., periodically) without mounting a component P, lowers the tip position of the tip recognition camera 70 to the board mounting height, and captures an image of the tip position of the tip recognition camera 70 to recognize the state. In this case, the tip recognition unit 51 may, for example, determine whether the position or orientation of the nozzle tip of the component holding nozzle 27 is misaligned. If the position or orientation of the nozzle tip of the component holding nozzle 27 is misaligned, the main body control unit 40 may correct the position or orientation of the nozzle tip of the component holding nozzle 27. Alternatively, the main body control unit 40 may specify the desired timing by receiving an input of the desired timing from a user via an input device (e.g., a key, button, or switch) provided in the component mounting apparatus 100.

[0115] (Embodiment 2) A second embodiment according to the present disclosure will be described with reference to FIG.

[0116] In addition, since the description of the same or equivalent parts as those in the first embodiment described above will be repeated, the same or equivalent symbols will be used in the following description and drawings, and the description may be omitted or simplified.

[0117] <Operation flow of the parts recognition camera> The operation flow executed by the component recognition camera 60 in this embodiment will be described with reference to FIG.

[0118] FIG. 9 is a flowchart illustrating an example of an operation flow executed by the component recognition camera 60 in this embodiment.

[0119] As explained in the first embodiment, the component recognition camera 60 captures images when the component holding nozzle 27 moves forward, and the tip recognition camera 70 captures images after nozzle replacement, before production, or when the component holding nozzle 27 moves back. In other words, the component recognition camera 60 and the tip recognition camera 70 capture images at different times.

[0120] In this embodiment, the camera control unit 48 of the main body control unit 40 is configured to have multiple operating modes, including a first operating mode and a second operating mode. That is, the camera control unit 48 of the main body control unit 40 sets the operating mode. The first operating mode is, for example, a mode in which an image is captured by the component recognition camera 60 and the characteristics of the component P can be recognized. The second operating mode is, for example, a mode in which an image is captured by the tip recognition camera 70 and the tip of the component holding nozzle 27 can be recognized. The camera control unit 48 adaptively switches between the multiple operating modes depending on, for example, the operation of the component holding nozzle 27, and controls the component recognition camera 60 and the tip recognition camera 70.

[0121] Furthermore, the camera control unit 48 of the main body control unit 40 transmits, in addition to the imaging instruction signal described above, a mode instruction signal to the component recognition camera 60 to indicate an operation mode. The mode instruction signal includes, for example, information indicating whether the operation mode is a first operation mode or a second operation mode among the multiple operation modes. For example, the camera control unit 48 sets the first mode when component recognition is performed and transmits a mode instruction signal indicating the first mode. For example, the camera control unit 48 sets the second mode when recognition of the tip of the component holding nozzle 27 is performed and transmits a mode instruction signal indicating the second mode.

[0122] In the first embodiment described above, the imaging instruction signal includes a camera ID indicating the identification number of the component recognition camera 60 or the tip recognition camera 70, but in the present embodiment, the camera ID does not need to be included. The component recognition camera 60 adaptively bridges (relays) signals between the main body control unit 40 and the tip recognition camera 70 in accordance with the mode instruction signal (see below).

[0123] Furthermore, in this embodiment, the imaging and communication unit 64 of the component recognition camera 60 is provided with, for example, a hardware-configured switch circuit (not shown) in the connection path (relay path) between the main body control unit 40 and the front end recognition camera 70. The switch circuit of the imaging and communication unit 64 of the component recognition camera 60 can set the connection path to ON (electrically connected) or OFF (electrically disconnected) in a hardware manner. For example, the imaging and communication unit 64 may switch the connection path between ON and OFF by switching the contents of a register of the imaging and communication unit 64.

[0124] 9, the imaging control unit 63 of the component recognition camera 60 sequentially determines whether or not a mode instruction signal has been received from the main body control unit 40 by referring to signals transmitted and received by the imaging communication unit 64 of the component recognition camera 60 (step S301). This determination is repeated (in a loop) until the component recognition camera 60 receives a mode instruction signal (NO in step S301). If it is determined that a mode instruction signal has been received from the main body control unit 40 (YES in step S302), the imaging control unit 63 of the component recognition camera 60 determines an operation mode based on the mode instruction signal (step S302). The determined operation mode is stored, for example, in a memory (not shown) of the component recognition camera 60.

[0125] Furthermore, the imaging control unit 63 of the component recognition camera 60 sequentially determines whether or not an imaging instruction signal has been received from the main body control unit 40 (step S303). This determination is continuously executed (looped) until the component recognition camera 60 receives an imaging instruction signal (NO in step S303).

[0126] If it is determined that an imaging instruction signal is received from the main body control unit 40 (YES in step S303), the imaging control unit 63 of the component recognition camera 60 determines whether the determined operation mode is the first operation mode or the second operation mode (step S304).

[0127] If the determination result indicates that the operation mode is the first operation mode ("first operation mode" in step S304), the imaging control unit 63 of the component recognition camera 60 determines that the imaging instruction signal is an instruction to itself. Based on this determination, the imaging control unit 63 of the component recognition camera 60 controls the imaging communication unit 64 of the component recognition camera 60 to set the switch circuit thereof to OFF in a hardware manner, and does not establish a connection path connecting the main body control unit 40 and the front end recognition camera 70. Because this connection path is not established, the imaging instruction signal is not transferred to the front end recognition camera 70. At this time, the imaging control unit 63 of the component recognition camera 60 enters a sleep state. The imaging control unit 63 of the component recognition camera 60 then controls the imaging sensor unit 61 and the lighting unit 62 of the component recognition camera 60 (step S305). The imaging control unit 63 of the component recognition camera 60 then controls the imaging communication unit 64 of the component recognition camera 60 to transmit its own image to the main body control unit 40 (step S306).

[0128] On the other hand, if it is determined that the operation mode is the second operation mode ("second operation mode" in step S304), the imaging control unit 63 of the component recognition camera 60 determines that the imaging instruction signal is an instruction to the tip recognition camera 70. Based on this determination, the imaging control unit 63 of the component recognition camera 60 controls the imaging communication unit 64 of the component recognition camera 60 to set the switch circuit thereof to ON in a hardware manner, thereby establishing a connection path connecting the main body control unit 40 and the tip recognition camera 70. Upon establishment of this path, the imaging control unit 63 of the component recognition camera 60 transfers the imaging instruction signal to the tip recognition camera 70 via the imaging communication unit 64 of the component recognition camera 60 (step S307).

[0129] The imaging control unit 63 of the component recognition camera 60 then references the signals transmitted and received by the imaging communication unit 64 of the component recognition camera 60 to sequentially determine whether or not an image transmitted from the tip recognition camera 70 has been received (step S308). This determination is executed continuously (in a loop) until the component recognition camera 60 receives an image transmitted from the tip recognition camera 70 (NO in step S308). If it is determined that an image has been transmitted from the tip recognition camera 70 (YES in step S308), the imaging control unit 63 of the component recognition camera 60 controls the imaging communication unit 64 of the component recognition camera 60 to transfer the image of the tip recognition camera 70 to the main body control unit 40 (step S309).

[0130] As for the control of switching the operation mode from the first operation mode to the second operation mode or from the second operation mode to the first operation mode, the imaging control unit 63 of the component recognition camera 60 is put into a sleep state as described above, and the imaging communication unit 64 of the component recognition camera 60 executes the switching control instead. That is, the imaging communication unit 64 of the component recognition camera 60 is configured to be able to detect the moment (timing) of switching the operation mode by appropriately referring to the mode instruction signal transmitted from the main body control unit 40. When the imaging communication unit 64 of the component recognition camera 60 detects the moment of switching, it transmits a signal to the imaging control unit 63 of the component recognition camera 60 to return from the sleep state.

[0131] In this way, the component mounting apparatus 100 of this embodiment can appropriately allocate an image capture instruction signal to an image capture target according to the determined (set) operating mode by utilizing the difference between the timing of component recognition and the timing of recognition of the tip of the component holding nozzle 27. For example, if the image capture target is the component recognition camera 60, the image capture instruction signal is not transferred, but if the image capture target is the tip recognition camera 70, the image capture instruction signal is automatically transferred, allowing the camera to capture an image.

[0132] Even in this case, the component mounting device 100 can relay between the existing component recognition camera 60, the main body control unit 80, and the additionally installed imaging unit (for example, the leading edge recognition camera 70) even when there is no available connection port in the main body control unit 40, as in the first embodiment. Furthermore, whether there is an available connection port in the main body control unit 40 or not, it is possible to prevent the wiring from becoming complicated.

[0133] <Regarding Modification 1 of Embodiment 2> A first modification of the present embodiment will be described.

[0134] In the above-described second embodiment, a hardware switch circuit (not shown) is provided in the imaging communication unit 64 of the component recognition camera 60, but this is not limiting. As in the present first modification, the imaging communication unit 64 of the component recognition camera 60 does not have to be provided with a hardware switch circuit (not shown). Accordingly, the imaging control unit 63 of the component recognition camera 60 may not be provided with a sleep state, and may be provided so that the imaging control unit 63 of the component recognition camera 60 is always capable of performing calculations (control).

[0135] In this first modification, when the first operating mode is selected, the imaging control unit 63 of the component recognition camera 60 sets the imaging sensor unit 61 of the component recognition camera 60 and the lighting unit 62 of the component recognition camera 60 to be operable (see FIG. 6). On the other hand, when the second operating mode is selected, the imaging control unit 63 of the component recognition camera 60 sets the imaging sensor unit 61 of the component recognition camera 60 and the lighting unit 62 of the component recognition camera 60 to be inoperable, and puts the imaging sensor unit 61 and the lighting unit 62 of the component recognition camera 60 into a sleep state.

[0136] According to this variant example 1, the component mounting device 100 can operate the imaging sensor unit 61 and the lighting unit 62 of the component recognition camera 60 only when the component recognition camera 60 is capturing an image, thereby achieving power saving for the component recognition camera 60.

[0137] In the above-described embodiments and modifications, tip recognition camera 70 is used as an example of an imaging unit that is not directly connected to main body control unit 40 (for example, connected to component recognition camera 60 or another imaging unit), but this is not limiting. In other words, the additional camera may have a function other than recognizing the position and orientation of the tip of component holding nozzle 27.

[0138] Furthermore, the comprehensive or specific aspects exemplified in each of the above embodiments and variant examples may be realized by a system, an apparatus, a method, an integrated circuit, a computer program, or a recording medium, or may be realized by any combination of a system, an apparatus, a method, an integrated circuit, a computer program, and a recording medium.

[0139] Although the embodiments have been described above with reference to the drawings, it goes without saying that the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications, alterations, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present disclosure. Furthermore, the components of the above-described embodiments may be combined in any manner as long as they do not deviate from the spirit of the invention.

[0140] (Outline of the embodiment) As a result, the present disclosure describes at least the following: Note that, in parentheses, examples of components corresponding to those in the above-described embodiments are given, but the present disclosure is not limited to these.

[0141] [Item 1] a nozzle (component holding nozzle 27) that holds a component (component P) and moves toward a board (board W) on which the component is to be mounted; a first imaging unit (component recognition camera 60) that captures an image of the component held by the nozzle from below; a control unit (main body control unit 40) that corrects a position and orientation deviation of the component relative to the nozzle based on the component included in the image captured by the first imaging unit; a second imaging unit (tip recognition camera 70) different from the first imaging unit; Including, The first imaging unit receiving an imaging instruction signal from the control unit; determining whether an imaging instruction target according to the imaging instruction signal is the first imaging unit or the second imaging unit; When the imaging instruction target is the first imaging unit, imaging is performed based on the imaging instruction signal, and the captured first image is transmitted to the control unit; When the imaging instruction target is the second imaging unit, the imaging instruction signal is transferred to the second imaging unit; Transferring the second image transmitted from the second imaging unit to the control unit; The second imaging unit receiving the imaging instruction signal transferred from the first imaging unit; capturing an image based on the imaging instruction signal, and transmitting the captured second image to the first imaging unit; Component placement device.

[0142] As a result, the component mounting device communicatively connects the control unit and the first imaging unit, and communicatively connects the first imaging unit and the second imaging unit, thereby preventing all imaging units from being directly connected to the control unit. Therefore, even when the control unit and each imaging unit are connected via a wire, the component mounting device can prevent clutter around the control unit (controller). Furthermore, the component mounting device can add multiple cameras, each connected directly or indirectly to the control unit, and use them for component mounting. In this way, even when one or more imaging units are added, the component mounting device can reduce the complexity of wiring the electrical wires used to send and receive images captured by the imaging units, and can save space for wiring, thereby improving efficiency and safety at the work site.

[0143] [Item 2] a nozzle that holds a component and moves toward a substrate on which the component is to be mounted; a first imaging unit that captures an image of the component held by the nozzle from below; a control unit that corrects a position and orientation deviation of the component with respect to the nozzle based on the component included in the image captured by the first imaging unit; a second imaging unit different from the first imaging unit; Including, The first imaging unit receiving a mode instruction signal for instructing an operation mode from the control unit; determining the operation mode based on the mode indication signal; receiving an imaging instruction signal from the control unit; When the operation mode is a first operation mode (component recognition mode), an image is captured based on the image capture instruction signal, and the captured first image is transmitted to the control unit; When the operation mode is the second operation mode (tip recognition mode), the imaging instruction signal is transferred to the second imaging unit; Transferring the second image transmitted from the second imaging unit to the control unit; The second imaging unit receiving the imaging instruction signal transferred from the first imaging unit; capturing an image based on the imaging instruction signal, and transmitting the captured second image to the first imaging unit; Component placement device.

[0144] As a result, the component mounting device communicatively connects the control unit and the first imaging unit, and communicatively connects the first imaging unit and the second imaging unit, thereby preventing all imaging units from being directly connected to the control unit. Therefore, even when the control unit and each imaging unit are connected via a wire, the component mounting device can prevent clutter around the control unit (controller). Furthermore, the component mounting device can add multiple imaging units, connect each imaging unit directly or indirectly to the control unit, and use them for component mounting. In this way, even when one or more imaging units are added, the component mounting device can reduce the complexity of wiring for transmitting and receiving images captured by the imaging units, and can save space for wiring, thereby improving efficiency and safety at the work site. Furthermore, the operating mode can be determined by utilizing the different imaging timings of each imaging unit, eliminating the need to include identification information, etc., of the imaging unit in the imaging instruction signal.

[0145] [Item 3] The second imaging unit captures an image of the tip of the nozzle from below. Item 3. The component mounting device according to item 1 or 2.

[0146] This allows the component mounting device to capture an image of the nozzle tip and accurately recognize the condition of the nozzle tip, thereby improving component mounting accuracy.

[0147] [Item 4] the second imaging unit images the tip of the nozzle at a height of the nozzle when the component is mounted on the board. Item 3. The component mounting device according to item 3.

[0148] This allows the component mounting device to capture an image of the nozzle tip at the mounting height of the component on the board, further reducing deviations in the nozzle position and orientation, thereby improving component mounting accuracy.

[0149] [Item 5] a height of the nozzle when the second imaging unit captures an image of the component is lower than a height of the nozzle when the first imaging unit captures an image of the component; Item 4. The component mounting device according to item 4.

[0150] As a result, when the component mounting device adjusts the focal position (focal position F1) of the first imaging unit to the component recognition height, the focus may not be on the mounting height of the component P on the board W, but by using imaging units with different focal positions (focal positions F1, F2), images can be taken at the appropriate focus for each.

[0151] [Item 6] The first imaging unit When the first operation mode is determined, a connection path connecting the control unit and the second imaging unit is not established, When the second operation mode is determined, a connection path is established to connect the control unit and the second imaging unit. Item 2. The component mounting device according to item 2.

[0152] This allows the component mounting device to transfer the image capture instruction signal in a hardware manner without referring to the contents of the image capture instruction signal when the second operation mode is set, thereby reducing the processing load on the first image capture unit.

[0153] [Item 7] the first imaging unit includes an imaging device (imaging sensor unit 61) and an illumination device (illumination unit 62); The first imaging unit If the first operation mode is determined, setting the imaging device and the illumination device to be operable; If the second operating mode is determined, the imaging device and the lighting device are set to inoperable. Item 2. The component mounting device according to item 2.

[0154] This allows the component mounting apparatus to operate the imaging device and the illumination device only when imaging is being performed, thereby enabling power saving for the first imaging unit.

[0155] [Item 8] a nozzle moving step of using a nozzle to hold a component and move the nozzle toward a substrate on which the component is to be mounted; a first imaging step of imaging the component held by the nozzle from below using a first imaging unit; a first control step of correcting, by using a control unit, a position and orientation deviation of the component relative to the nozzle based on the component included in an image captured by the first imaging unit; a second imaging step of imaging a predetermined imaging target using a second imaging unit different from the first imaging unit; a second control step of transmitting an imaging instruction signal from the control unit to control operations of the first imaging unit and the second imaging unit; Including, In the first imaging step, receiving the imaging instruction signal by the first imaging unit; determining whether an imaging instruction target according to the imaging instruction signal is the first imaging unit or the second imaging unit; When the imaging instruction target is the first imaging unit, imaging is performed based on the imaging instruction signal, and the captured first image is transmitted to the control unit; When the imaging instruction target is the second imaging unit, the imaging instruction signal is transferred to the second imaging unit; Transferring the second image transmitted from the second imaging unit to the control unit; In the second imaging step, receiving the imaging instruction signal transferred from the first imaging unit; capturing an image based on the imaging instruction signal, and transmitting the captured second image to the first imaging unit; How to install parts.

[0156] This allows the component mounting method to achieve the same effect as item 1.

[0157] [Item 9] a nozzle moving step of using a nozzle to hold a component and move the nozzle toward a substrate on which the component is to be mounted; a first imaging step of imaging the component held by the nozzle from below using a first imaging unit; a first control step of correcting, by using a control unit, a position and orientation deviation of the component relative to the nozzle based on the component included in an image captured by the first imaging unit; a second imaging step of imaging a predetermined imaging target using a second imaging unit different from the first imaging unit; a second control step of transmitting a mode instruction signal for instructing an operation mode and an imaging instruction signal from the control unit to switch and control operations of the first imaging unit and the second imaging unit; Including, The first imaging step includes: receiving the mode instruction signal by the first imaging unit; determining the operation mode based on the mode indication signal; receiving the imaging instruction signal by the first imaging unit; When the operation mode is the first operation mode, capturing an image based on the image capturing instruction signal and transmitting the captured first image to the control unit; When the operation mode is the second operation mode, the imaging instruction signal is transferred to the second imaging unit; Transferring the second image transmitted from the second imaging unit to the control unit; In the second imaging step, receiving the imaging instruction signal transferred from the first imaging unit; capturing an image based on the imaging instruction signal, and transmitting the captured second image to the first imaging unit; How to install parts.

[0158] This allows the component mounting method to achieve the same effect as item 2.

[0159] Although the embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications, alterations, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also fall within the technical scope of the present disclosure. Furthermore, the components in the above-described embodiments may be combined in any manner without departing from the spirit of the invention. [Industrial Applicability]

[0160] The present disclosure is useful as a component mounting device and a component mounting method that can reduce the complexity of wiring the electrical wires for transmitting and receiving images acquired by the imaging units, even when one or more imaging units are added, and can save space in the wiring, thereby improving efficiency and safety at the work site. [Explanation of symbols]

[0161] 1. Component placement device 10 Main body mechanism section 11 Mounting machine body 12 Foundation 13 Substrate transport mechanism 14 Conveyor section 15 Parts supply mechanism 16 Feeder Base 17 slots 18 Tape Feeder 19 Feeder Cart 20 Bogie section 21 reels 22 Carrier tape 23 Head Unit 24 Y-axis table mechanism 25 X-axis table mechanism 26 Moving Head 27 Component holding nozzle 36 Circuit Board Recognition Camera 37 Disposal Box 38 Nozzle holder 40 Main unit control section 41 Storage section 42 Implementation Information 43 Parts Information 45 Imaging timing information 46 Mechanism drive unit 47 Imaging processing section 48 Camera control unit 50 Parts Recognition Unit 51 Tip recognition section 60 Parts Recognition Camera 61 Image sensor unit 62 Lighting Unit 63 Imaging control unit 64 Imaging and communication unit 70 Advanced Recognition Camera 71 Image sensor section 72 Lighting Unit 73 Imaging control unit 74 Imaging and communication unit F1 focal position F2 focal position P parts W substrate

Claims

1. a nozzle that holds a component and moves toward a substrate on which the component is to be mounted; a first imaging unit that captures an image of the component held by the nozzle from below; a control unit that corrects a position and orientation deviation of the component with respect to the nozzle based on the component included in the image captured by the first imaging unit; a second imaging unit different from the first imaging unit; Including, The first imaging unit receiving an imaging instruction signal from the control unit; determining whether an imaging instruction target according to the imaging instruction signal is the first imaging unit or the second imaging unit; When the imaging instruction target is the first imaging unit, imaging is performed based on the imaging instruction signal, and the captured first image is transmitted to the control unit; When the imaging instruction target is the second imaging unit, the imaging instruction signal is transferred to the second imaging unit; transferring the second image transmitted from the second imaging unit to the control unit; The second imaging unit receiving the imaging instruction signal transferred from the first imaging unit; capturing an image based on the imaging instruction signal, and transmitting the captured second image to the first imaging unit; Component placement device.

2. a nozzle that holds a component and moves toward a substrate on which the component is to be mounted; a first imaging unit that captures an image of the component held by the nozzle from below; a control unit that corrects a position and orientation deviation of the component with respect to the nozzle based on the component included in the image captured by the first imaging unit; a second imaging unit different from the first imaging unit; Including, The first imaging unit receiving a mode instruction signal for instructing an operation mode from the control unit; determining the operation mode based on the mode indication signal; receiving an imaging instruction signal from the control unit; When the operation mode is the first operation mode, capturing an image based on the image capturing instruction signal and transmitting the captured first image to the control unit; When the operation mode is the second operation mode, the imaging instruction signal is transferred to the second imaging unit; transferring the second image transmitted from the second imaging unit to the control unit; The second imaging unit receiving the imaging instruction signal transferred from the first imaging unit; capturing an image based on the imaging instruction signal, and transmitting the captured second image to the first imaging unit; Component placement device.

3. The second imaging unit captures an image of the tip of the nozzle from below.

3. The component mounting device according to claim 1 or 2.

4. the second imaging unit images the tip of the nozzle at a height of the nozzle when the component is mounted on the board.

4. The component mounting apparatus according to claim 3.

5. a height of the nozzle when the second imaging unit captures an image of the component is lower than a height of the nozzle when the first imaging unit captures an image of the component; 5. The component mounting apparatus according to claim 4.

6. The first imaging unit When the first operation mode is determined, a connection path connecting the control unit and the second imaging unit is not established, when the second operation mode is determined, a connection path is established that connects the control unit and the second imaging unit; 3. The component mounting device according to claim 2.

7. the first imaging unit includes an imaging device and an illumination device; The first imaging unit If the first operation mode is determined, setting the imaging device and the illumination device to be operable; when the second operating mode is determined, setting the imaging device and the lighting device to inoperable.

3. The component mounting device according to claim 2.

8. a nozzle moving step of using a nozzle to hold a component and move the nozzle toward a substrate on which the component is to be mounted; a first imaging step of imaging the component held by the nozzle from below using a first imaging unit; a first control step of correcting, by using a control unit, a position and orientation deviation of the component relative to the nozzle based on the component included in an image captured by the first imaging unit; a second imaging step of imaging a predetermined imaging target using a second imaging unit different from the first imaging unit; a second control step of transmitting an imaging instruction signal from the control unit to control operations of the first imaging unit and the second imaging unit; Including, In the first imaging step, receiving the imaging instruction signal by the first imaging unit; determining whether an imaging instruction target according to the imaging instruction signal is the first imaging unit or the second imaging unit; When the imaging instruction target is the first imaging unit, imaging is performed based on the imaging instruction signal, and the captured first image is transmitted to the control unit; When the imaging instruction target is the second imaging unit, the imaging instruction signal is transferred to the second imaging unit; transferring the second image transmitted from the second imaging unit to the control unit; In the second imaging step, receiving the imaging instruction signal transferred from the first imaging unit; capturing an image based on the imaging instruction signal, and transmitting the captured second image to the first imaging unit; How to install parts.

9. a nozzle moving step of using a nozzle to hold a component and move the nozzle toward a substrate on which the component is to be mounted; a first imaging step of imaging the component held by the nozzle from below using a first imaging unit; a first control step of correcting, by using a control unit, a position and orientation deviation of the component relative to the nozzle based on the component included in an image captured by the first imaging unit; a second imaging step of imaging a predetermined imaging target using a second imaging unit different from the first imaging unit; a second control step of transmitting a mode instruction signal for instructing an operation mode and an imaging instruction signal from the control unit to switch and control operations of the first imaging unit and the second imaging unit; Including, The first imaging step includes: receiving the mode instruction signal at the first imaging unit; determining the operation mode based on the mode indication signal; receiving the imaging instruction signal by the first imaging unit; When the operation mode is the first operation mode, capturing an image based on the image capturing instruction signal and transmitting the captured first image to the control unit; When the operation mode is the second operation mode, the imaging instruction signal is transferred to the second imaging unit; transferring the second image transmitted from the second imaging unit to the control unit; In the second imaging step, receiving the imaging instruction signal transferred from the first imaging unit; capturing an image based on the imaging instruction signal, and transmitting the captured second image to the first imaging unit; How to install parts.

Images