Replica mold manufacturing method and article manufacturing method

Abstract

To provide a technique advantageous for manufacturing a replica mold.SOLUTION: A method for producing a replica mold includes a filling step of filling a space between a replica blank and a pattern region of a master mold with a curable composition, a curing step of curing the curable composition to form a replica pattern portion to which a pattern of the pattern region is transferred, and a separating step of separating the replica pattern portion and the master mold, wherein the master mold has a pattern peripheral region surrounding the pattern region, and a step is present between the pattern region and the pattern peripheral region, the area of the replica pattern portion on the bonding surface between the replica blank and the replica pattern portion is larger than the area of the pattern region.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a replica mold and a method for manufacturing an article. [Background technology]

[0002] One pattern formation method for manufacturing articles such as semiconductor devices and MEMS is the imprint process, which involves placing a curable composition on a substrate, bringing the curable composition into contact with a pattern area of ​​a mold, curing the curable composition, and separating the mold from the cured product of the curable composition to form a pattern on the substrate.

[0003] Repeated imprinting processes can cause mold deterioration through contact between the mold and the curable composition. Molds are very expensive, which can increase the manufacturing cost of an article. Therefore, a method has been proposed in which a master mold is used to replicate multiple replica molds at low cost and then the replica molds are used to perform the imprinting process. Patent Document 1 describes a method for manufacturing such an imprint template. In the manufacturing method described in Patent Document 1, a resin is first applied to a concave-convex portion on the main surface of a base substrate. Then, the resin is cured while an original plate on which a master pattern has been formed is brought into contact with the resin. The original plate is then released from the resin. This allows a pattern transfer portion having a concave-convex pattern that is the inverse of the pattern to be molded to be formed on the main surface of the base substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5395756 Summary of the Invention [Problem to be solved by the invention]

[0005] Although replica molds can be produced at a much lower cost than master molds, their rapid breakage results in increased costs for manufacturing articles using the imprint process. One of the causes of replica mold damage is the presence of foreign matter between the substrate and the replica mold. To reduce damage to replica molds due to foreign matter, it is considered advantageous to increase the thickness of the replica pattern portion of the replica mold formed from the cured product of the curable composition. However, in this case, when filling the space between the replica blank and the master mold with uncured curable composition to produce the replica mold, the controllability of the outer periphery of the liquid film formed from the uncured curable composition may be poor. This makes it difficult to produce replica molds that meet specifications.

[0006] An object of the present invention is to provide an advantageous technique for manufacturing a replica mold. [Means for solving the problem]

[0007] One aspect of the present invention relates to a method for manufacturing a replica mold, the method including: a filling step of filling a space between a replica blank and a pattern area of ​​a master mold with a curable composition; a curing step of curing the curable composition to form a replica pattern area to which a pattern of the pattern area is transferred by separating the replica pattern area from the master mold; and a separation step of separating the replica pattern area from the master mold, wherein the master mold has a pattern peripheral area surrounding the pattern area, and there is a step between the pattern area and the pattern peripheral area, and the area of ​​the replica pattern area at the bonding surface between the replica blank and the replica pattern area is larger than the area of ​​the pattern area. [Effects of the Invention]

[0008] According to the present invention, an advantageous technique is provided for the manufacture of replica molds. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram schematically illustrating the configuration of a replica mold manufacturing apparatus according to a first embodiment. [Figure 2] 3A to 3C are schematic diagrams illustrating a method for manufacturing a replica mold according to the first embodiment. [Figure 3] FIG. 2 is a diagram showing a cross-sectional structure of the vicinity of the edge of the pattern region of the master mold and the replica region of the replica blank. [Figure 4] 5A to 5C are schematic diagrams showing a method for manufacturing a replica mold according to a second embodiment. [Figure 5] FIG. 2 is a diagram showing a cross-sectional structure of the vicinity of the edge of the pattern region of the master mold and the replica region of the replica blank. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0011] FIG. 1 is a diagram schematically illustrating the configuration of a replica mold manufacturing apparatus 101 according to the first embodiment. The replica mold manufacturing apparatus 101 manufactures a replica mold by using a master mold 102 to form a replica pattern portion, which is a replica of the master mold 102, in a replica blank 103. The master mold 102 may have a pattern region 105 having a pattern and a pattern peripheral region 120 surrounding the pattern region 105. A step may exist between the pattern region 105 and the pattern peripheral region 120. In the first embodiment, the master mold 102 has a mesa, and the pattern region 105 is disposed on the mesa. In other words, in the first embodiment, the master mold 102 has a shape in which the pattern region 105 protrudes from a surface to which the pattern peripheral region 120 belongs, forming a step. Note that the second embodiment will be described as an example in which the master mold 102 has a recess, and the pattern region 105 is disposed in the recess.

[0012] The replica mold manufacturing apparatus 101 brings the uncured curable composition 104 placed on the master mold 102 into contact with the replica blank 103, filling the space between the master mold 102 and the replica blank 103 with the curable composition 104. The uncured curable composition 104 can be placed on the master mold 102 in the form of multiple droplets. The replica mold manufacturing apparatus 101 then hardens the curable composition 104. This forms a replica pattern portion to which the pattern of the pattern region 105 of the master mold 102 is transferred. Here, the replica pattern portion is formed in a state where it is bonded to the replica region 118 of the replica blank 103. The replica mold manufacturing apparatus 101 then separates the replica pattern portion from the pattern region 105 of the master mold 102. This forms a replica mold consisting of the replica blank 103 and the replica pattern portion bonded thereto.

[0013] The replica blank 103 may have, for example, a mesa. In this case, the replica region 118 is disposed on the top surface of the mesa, and the replica pattern portion is formed in the mesa of the replica blank 103. The area of ​​the top surface of the mesa of the replica blank 103 is larger than the area of ​​the pattern region 105 of the master mold 102. The replica blank 103 may have a replica peripheral region 119 surrounding the replica region 118. A step may exist between the replica region 118 and the replica peripheral region 119, as schematically shown in FIG. 1 . In other words, the replica blank 103 may have a shape in which the replica region 118 protrudes from the surface to which the replica peripheral region 119 belongs, forming a step. However, this is merely an example, and there does not necessarily have to be a step between the replica region 118 and the replica peripheral region 119.

[0014] 1, the master mold 102 is placed below the replica blank 103, but the master mold 102 may also be placed above the replica blank 103. In this case, the replica mold manufacturing apparatus 101 places the uncured curable composition 104 on the replica blank 103, and then brings the uncured curable composition 104 placed on the replica blank 103 into contact with the master mold 102. This causes the curable composition 104 to fill the space between the master mold 102 and the replica blank 103.

[0015] The pattern area 105 and the replica area 118 may have various shapes such as a rectangle or a circle, but in the first embodiment, the pattern area 105 and the replica area 118 will be described as having a rectangular shape in the XY plane. The master mold 102 may have multiple pattern areas 105 arranged at a distance from each other.

[0016] The curable composition 104 is a material that cures when curing energy is applied. Examples of curing energy include electromagnetic waves and heat. Electromagnetic waves include, for example, light having a wavelength selected from the range of 10 nm to 1 mm, specifically infrared light, visible light, and ultraviolet light. Thus, the curable composition 104 is a composition that cures when irradiated with light or heated. A photocurable composition that cures when irradiated with light contains at least a polymerizable compound and a photopolymerization initiator and may further contain a non-polymerizable compound or a solvent, as needed. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, and a polymer component. The viscosity of the curable composition (at 25°C) is, for example, 1 mPa·s to 100 mPa·s.

[0017] The master mold 102 can be made of, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass. The replica blank 103 can be made of, for example, glass, ceramics, metal, semiconductor, or resin. If necessary, a member made of a material different from that of the substrate may be provided on the surface of the substrate.

[0018] In this specification and the accompanying drawings, directions are indicated in an XYZ coordinate system, with the direction parallel to the surface of the master mold 102 being the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X direction, Y direction, and Z direction, respectively, and rotation around the X-axis, Y-axis, and Z-axis are referred to as θX, θY, and θZ, respectively. Control or drive about the X-axis, Y-axis, and Z-axis refers to control or drive about the direction parallel to the X-axis, the direction parallel to the Y-axis, and the direction parallel to the Z-axis, respectively. Control or drive about the θX-axis, θY-axis, and θZ-axis refers to control or drive about the rotation around an axis parallel to the X-axis, the rotation around an axis parallel to the Y-axis, and the rotation around an axis parallel to the Z-axis, respectively. Position refers to information determined based on coordinates of the X-axis, Y-axis, and Z-axis, and orientation refers to information determined by values ​​of the θX-axis, θY-axis, and θZ-axis. Positioning refers to controlling the position and / or orientation.

[0019] The replica mold manufacturing apparatus 101 may include a first holding unit 106 that holds the master mold 102, a first drive mechanism 107 that moves the master mold 102 by driving the first holding unit 106, and a support base 108 that supports the first drive mechanism 107. The replica mold manufacturing apparatus 101 may also include a second holding unit 109 that holds the replica blank 103, and a second drive mechanism 110 that moves the replica blank 103 by driving the second holding unit 109.

[0020] The first drive mechanism 107 and the second drive mechanism 110 constitute a relative drive mechanism that drives at least one of the master mold 102 and the replica blank 103 so as to adjust the relative positions of the master mold 102 and the replica blank 103. Adjustment of the relative positions of the master mold 102 and the replica blank 103 by the relative drive mechanism may include driving the master mold 102 and the replica blank 103 to bring the curable composition 104 on the master mold 102 into contact with the replica blank 103. Adjustment of the relative positions of the master mold 102 and the replica blank 103 by the relative drive mechanism may also include driving the master mold 102 and the replica blank 103 to separate the replica pattern portion made of the cured product of the curable composition 104 from the master mold 102. Adjustment of the relative positions of the master mold 102 and the replica blank 103 by the relative drive mechanism may also include aligning the master mold 102 and the replica blank 103. The first drive mechanism 107 can be configured to drive the master mold 102 about multiple axes (e.g., three axes: X-axis, Y-axis, and θZ-axis, preferably six axes: X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis). The second drive mechanism 110 can be configured to drive the replica blank 103 about multiple axes (e.g., three axes: Z-axis, θX-axis, and θY-axis, preferably six axes: X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis).

[0021] The replica mold manufacturing apparatus 101 may include a curing unit 111 for curing the curable composition 104 filled in the space between the master mold 102 and the replica blank 103. The curing unit 111 may harden the curable composition 104 between the master mold 102 and the replica blank 103, for example, by applying curing energy to the curable composition 104 via the replica blank 103.

[0022] The replica mold manufacturing apparatus 101 may include a transparent member 113 for forming a pressure-controlled space 112 on the back side of the replica blank 103 (the side opposite to the surface facing the master mold 102). The transparent member 113 is made of a material that transmits the curing energy from the curing section 111, and makes it possible to apply the curing energy to the curable composition 104 between the master mold 102 and the replica blank 103.

[0023] The replica mold manufacturing apparatus 101 may include a pressure control unit 114 that controls the deformation of the replica blank 103 in the Z-axis direction by controlling the pressure in the pressure-controlled space 112. For example, when the pressure control unit 114 increases the pressure in the pressure-controlled space 112 above atmospheric pressure, the replica blank 103 deforms into a convex shape toward the master mold 102.

[0024] The replica mold manufacturing apparatus 101 may include an application unit 115 for placing, supplying, or distributing the curable composition 104 on the master mold 102. However, the master mold 102 on which the curable composition 104 has been placed by another device may be supplied or carried into the replica mold manufacturing apparatus 101. In this case, the replica mold manufacturing apparatus 101 does not need to include the application unit 115.

[0025] The replica mold manufacturing apparatus 101 may include a measurement unit 116 for measuring the positional deviation (alignment error) between the master mold 102 and the replica blank 103. The replica mold manufacturing apparatus 101 may include a control device 117 that may be configured as a computer having installed therein a program that controls the operation of multiple components that make up the replica mold manufacturing apparatus 101. The control device 117 may also be configured as a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), or an ASIC (abbreviation for Application Specific Integrated Circuit).

[0026] 2 is a schematic diagram showing a method for manufacturing a replica mold according to the first embodiment using the replica mold manufacturing apparatus 101. The method for manufacturing a replica mold may include, for example, a positioning step, a filling step, a curing step, and a separation step. The positioning step, filling step, curing step, and separation step may be controlled by a control device 117. The coordinate system in FIG. 2 conforms to the coordinate system shown in FIG. 1, and FIG. 2 is a schematic diagram of an XZ cross section passing through the centers of the pattern region 105 and the replica region 118.

[0027] 2(a) schematically shows the disposing step. In the disposing step, the curable composition 104 can be applied or disposed as multiple droplets 201 on the pattern region 105 of the master mold 102 by the applicator 115. Note that, as described above, the disposing step may be performed by an apparatus external to the replica mold manufacturing apparatus 101. The applicator 115 is controlled based on control information stored in advance in the control device 117, and can dispose the droplets 201 of the curable composition 104 on the pattern region 105.

[0028] The individual droplets 201 placed on the pattern area 105 spread out so that their diameters increase, but at this point they do not come into contact with other droplets 201 and can maintain their droplet shape. In the filling process described below, the droplets 201 are crushed between the pattern area 105 of the master mold 102 and the replica area 118 of the replica blank 103, and the droplets 201 combine with each other to form a liquid film.

[0029] The control information may include a list of information on the volume of each droplet 201 and its placement position (X coordinate and Y coordinate) relative to the pattern area 105 (master mold 102). The number and placement positions of the droplets 201 may be determined mainly depending on the target thickness of the liquid film of the curable composition 104 to be formed between the pattern area 105 and the replica area 118.

[0030] The method for driving the droplets in the applicator 115 is not limited to a specific driving method, but for example, an electrically driven piezoelectric actuator can be used. When a piezoelectric actuator is used, the volume of the droplets 201 can be controlled by controlling the voltage value applied to the piezoelectric actuator. The placement position of the droplets 201 can be controlled by adjusting the relative position between the master mold 102 and the applicator 115. For example, the droplets 201 can be placed at a target position on the master mold 102 by controlling the timing of ejection of the droplets 201 by the applicator 115 in accordance with the position of the master mold 102 driven by the first drive mechanism 107.

[0031] 2(b) schematically illustrates the filling step. In the filling step, the space between the replica region 118 of the replica blank 103 and the pattern region 105 of the master mold 102 is filled with a curable composition. The filling step includes a contact step in which a droplet 201 of the curable composition disposed on the pattern region 105 of the master mold 102 is brought into contact with the replica region 118 of the replica blank 103. When the droplet 201 of the curable composition disposed on the pattern region 105 is brought into contact with the replica region 118, the curable composition begins to fill the space between the pattern region 105 and the replica region 118. In the filling step, the curable composition spreads along the top surface (replica region 118) of the mesa of the replica blank 103, and may reach the edge of the top surface.

[0032] The distance between the pattern region 105 and the replica region 118 is calculated by subtracting the volume of the recesses in the pattern region 105 from the total volume of the curable composition, which is determined from the number of droplets provided by the droplet list included in the control information, and dividing the resulting volume by the area of ​​the pattern region 105. The recesses in the pattern region 105 refer to recesses that constitute the pattern. In the contacting step, the pressure control unit 114 increases the pressure in the pressure-controlled space 112, causing the center of the replica blank 103 to bend downward in a convex shape, and then the droplets 201 of the curable composition are brought into contact with the replica region 118. This reduces the amount of gas trapped in the space between the pattern region 105 and the replica region 118. The relative positions of the replica blank 103 and the master mold 102 in the X and Y directions can be adjusted before the droplets 201 of the curable composition are brought into contact with the replica region 118. Furthermore, the relative positions of the replica blank 103 and the master mold 102 in the X and Y directions may be further adjusted after the droplet 201 of the curable composition is brought into contact with the replica region 118. When the droplet 201 of the curable composition is brought into contact with the replica region 118, the pressure in the pressure-controlled space 112 may be controlled by the pressure control unit 114 to reduce the convex shape of the replica blank 103. The pressure in the pressure-controlled space 112 and the attitude (tilt) of the pressure-controlled space 112 may be controlled so that the lower surface (top surface of the mesa) of the replica pattern portion 202 becomes flat and parallel to the envelope surface of the pattern region 105 when filling is complete. The thickness of the replica pattern portion 202 may be in the range of 0.1 μm to 1000 μm, preferably in the range of 0.5 μm to 100 μm, and more preferably in the range of 0.7 μm to 10 μm.

[0033] If the liquid film of the curable composition overflows from the space between the pattern region 105 and the replica region 118 during the filling process, the shape of the formed replica pattern portion 202 will deviate from the target shape. Furthermore, if the liquid film of the curable composition overflows from the space between the pattern region 105 and the replica region 118 along the side of the pattern region 105 of the master mold 102 during the filling process, a replica pattern portion 202 having a protrusion protruding downward as shown in FIG. 2 may be formed. This means that when the manufactured replica mold is used in an imprint process, the substrate on which the pattern is to be formed may be damaged, or defects may occur in the pattern formed by the imprint process. Furthermore, if the liquid film of the curable composition overflows from the space between the pattern region 105 and the replica region 118, the volume of the curable composition in the space between the pattern region 105 and the replica region 118 decreases, which may result in defects in the formed replica pattern portion 202.

[0034] FIG. 2(c) schematically illustrates the curing step. In the curing step, the replica pattern portion 202 to which the pattern of the pattern region 105 is transferred is formed by curing the curable composition. The curing portion 111 applies curing energy to the liquid film of the curable composition between the pattern region 105 and the replica region 118, thereby curing the curable composition and forming the replica pattern portion 202. The curing of the curable composition may be accompanied by shrinkage of the volume of the curable composition. This shrinkage facilitates separation of the pattern region 105 from the replica pattern portion 202 that is formed.

[0035] FIG. 2(d) schematically illustrates the separation process. In this process, the replica pattern portion 202 and the master mold 102 are separated. In this process, for example, the replica blank 103 can be driven by the second drive mechanism 110 in a direction (+z direction) away from the master mold 102. In this process, the control device 117 can separate the replica pattern portion 202 and the master mold 102 from each other by controlling the second drive mechanism 110 according to a preset drive profile. Here, while the replica blank 103 and the replica pattern portion 202 are bonded together, the replica pattern portion 202 and the master mold 102 are separated from each other, resulting in a replica mold 140 consisting of the replica pattern portion 202 and the replica blank 103. In the first embodiment, the area of ​​the replica pattern portion 202 at the bonding surface 130 between the replica blank 103 and the replica pattern portion 202 is larger than the area of ​​the pattern region 105. In addition, in orthogonal projection onto the bonding surface 130, the pattern area 105 is contained within the area of ​​the replica pattern area 202 on the bonding surface 130. The bonding surface 130 between the replica blank 103 and the replica pattern area 202 is the whole or part of the replica area 118 of the replica blank 103.

[0036] The replica mold 140 manufactured by the above manufacturing method is used in an imprint process for manufacturing an article. Repeated imprint processes using the replica mold 140 may cause deterioration (including damage) of the replica pattern portion 202. If the replica pattern portion 202 has deteriorated, it is recommended to peel the replica pattern portion 202 from the replica mold 140 (replica blank 103) and then form a new replica pattern portion 202 in the replica area 118. To peel the replica pattern portion 202 from the replica mold 140 (replica blank 103), for example, the replica pattern portion 202 may be dissolved using a peeling solution. For example, a solution obtained by mixing H2SO4 (sulfuric acid) and H2O2 (hydrogen peroxide) can be used as the peeling solution. Alternatively, the replica pattern portion 202 may be physically peeled from the replica mold 140 (replica blank 103).

[0037] Fig. 3 shows a schematic cross-sectional structure near the ends of the pattern area 105 and the replica area 118. A preferred relationship between the area of ​​the replica pattern area 202 at the bonding surface 130 between the replica blank 103 and the replica pattern area 202 and the area of ​​the pattern area 105 of the master mold 102 will be described with reference to Fig. 3. Fig. 3 is a schematic diagram of an XZ cross section passing through the centers of the pattern area 105 and the replica area 118.

[0038] Let L1 be half the dimension of the bonding surface 130 in a direction parallel to the bonding surface 130 between the replica blank 103 and the replica pattern portion 202 (for example, the X direction), L2 be half the dimension of the pattern area 105 in this direction, and t be the thickness of the replica pattern area 202. L1 may be understood as the distance from the center of the bonding surface 130 to the outer edge of the bonding surface 130. L2 may be understood as the distance from the center of the pattern area 105 to the outer edge of the pattern area 105.

[0039] 3(a) schematically illustrates a case where the area of ​​the replica region 118 (or the bonding surface 130) is equal to the area of ​​the pattern region 105, in other words, a case where L1 and L2 are equal. The curable composition 104 before curing may form a meniscus (concave shape) 301 at the outer edge of the curable composition 104 in the final stage of the process of spreading in the space between the replica region 118 and the pattern region 105 (filling process). The outer edge 302 of the curable composition 104 at the contact interface between the replica region 118 (the top surface of the mesa of the replica blank 103) and the curable composition 104 may spread along the replica region 118 (the top surface of the mesa) and reach the edge of the replica region 118. Furthermore, the outer edge 303 of the curable composition 104 at the contact interface between the pattern region 105 (the top surface of the mesa of the master mold 102) and the curable composition 104 may extend along the pattern region 105 and reach the edge of the pattern region 105.

[0040] When the outer edges 302 and 303 of the curable composition 104 reach the edge of the replica region 118 and the edge of the pattern region 105, respectively, the spreading of the outer edges 302 and 303 of the curable composition 104 may temporarily stop. In this state, the external force applied to the curable composition 104 is used to deform the meniscus 301. When the surface tension of the meniscus 301 and the external force are balanced, the spreading of the curable composition 104 completely stops. On the other hand, when the external force is greater than the surface tension of the meniscus 301, the curable composition 104 spreads further and overflows from the space between the pattern region 105 and the replica region 118. This means that the controllability of the outer periphery of the liquid film formed by the curable composition 104 is poor. Here, the external force is, for example, a force applied to the curable composition 104 by the second driving mechanism 110 (or a relative driving mechanism). When the control error of the external force is absorbed (cancelled) by the deformation of the meniscus 301, the curable composition 104 does not overflow from the space between the pattern region 105 and the replica region 118. On the other hand, when the control error of the external force cannot be absorbed (cancelled) by the deformation of the meniscus 301, the curable composition 104 overflows from the space between the pattern region 105 and the replica region 118.

[0041] FIG. 3(b) schematically illustrates a case where L1-L2=t is satisfied, as an example of a case where the area of ​​the replica region 118 (or the bonding surface 130) is larger than the area of ​​the pattern region 105. In this case, even if an external force control error acts in a direction that spreads the curable composition 104, the outer edge 302 of the curable composition 104 at the contact interface between the replica region 118 and the curable composition 104 is absorbed by spreading along the replica region 118. This prevents the curable composition 104 from spilling along the side of the pattern region 105 of the master mold 102, thereby preventing protrusions from forming in the replica pattern portion 202. This means that the outer periphery of the liquid film made of the curable composition 104 is well controlled. However, if the margin (L1-L2) is too large, this may cause poor thickness of the replica pattern portion 202 to be formed. If the control error of the external force acts in a direction that does not spread the curable composition 104, the outer edge 302 of the curable composition 104 at the contact interface between the replica area 118 and the curable composition 104 will be positioned inward from the target position, so the problem of overflow will not occur.

[0042] FIG. 3(c) schematically illustrates a case where L2 - L1 = t is satisfied, as an example of a case where the area of ​​the pattern region 105 is larger than the area of ​​the replica region 118 (or the bonding surface 130). In this case, even if an external force control error acts in a direction that spreads the curable composition 104, the outer edge 303 of the curable composition 104 at the contact interface between the pattern region 105 and the curable composition 104 spreads along the pattern region 105, thereby absorbing the error. This prevents the curable composition 104 from spilling along the side of the pattern region 105 of the master mold 102 and thus preventing the formation of protrusions in the replica pattern portion 202. However, if the area of ​​the pattern region 105 is larger than the area of ​​the replica region 118 (or the bonding surface 130), the area of ​​the manufactured replica mold 140 that comes into contact with the curable composition during the imprint process will be larger than the normal area. This means that the outer periphery of the liquid film composed of the curable composition 104 is poorly controllable. This can lead to other problems, such as collisions with adjacent shot regions.

[0043] According to studies by the present inventors, the area of ​​the replica pattern portion 202 at the bonding surface 130 between the replica blank 103 and the replica pattern portion 202 is preferably larger than the area of ​​the pattern region 105 of the master mold 102. From another perspective, to prevent leakage of the curable composition to the side surfaces of the pattern region 105, the lower limit of L1-L2 may be set to any one of 0.1t, 0.2t, 0.3t, 0.4t, 0.5t, 0.6t, 0.7t, 0.8t, and 0.9t. Furthermore, to prevent insufficient thickness of the replica pattern portion 202 formed, the upper limit of L1-L2 may be set to any one of 2t, 1.9t, 1.8t, 1.7t, 1.6t, 1.5t, 1.4t, 1.3t, 1.2t, and 1.1t. From yet another viewpoint, it is preferable to satisfy 0.1t≦L1−L2≦2t, more preferably 0.5t≦L1−L2≦1.5t, and even more preferably 0.7t≦L1−L2≦1.3t.

[0044] A method for manufacturing a replica mold according to the second embodiment using the replica mold manufacturing apparatus 101 will be described below. Details not mentioned in the manufacturing method according to the second embodiment may follow the manufacturing method according to the first embodiment. FIG. 4 is a schematic diagram showing a method for manufacturing a replica mold according to the second embodiment using the replica mold manufacturing apparatus 101. The replica mold manufacturing method may include, for example, a placement step, a filling step, a curing step, and a separation step. The placement step, filling step, curing step, and separation step may be controlled by a control device 117. The coordinate system in FIG. 4 conforms to the coordinate system shown in FIG. 1, and FIG. 4 is a schematic diagram of an XZ cross section passing through the centers of the pattern region 105 and the replica region 118.

[0045] In the second embodiment, the master mold 102 may have a pattern region 401 having a pattern, and a pattern peripheral region 120 surrounding the pattern region 401. A step may exist between the pattern region 401 and the pattern peripheral region 120. In the second embodiment, the master mold 102 has a recess, and the pattern region 401 is disposed in the recess. In other words, in the second embodiment, the master mold 102 has a shape in which the pattern region 401 is recessed from the surface to which the pattern peripheral region 120 belongs, so as to form a step.

[0046] In the second embodiment, the replica blank 103 has a flat surface 410 having an area larger than the area of ​​the replica pattern portion 403 on the bonding surface 130, and the replica pattern portion 403 is formed on the flat surface 410. However, as in the first embodiment, the replica blank 103 may have a mesa, and the replica pattern portion 403 may be formed on the mesa of the replica blank 103. In this case, the area of ​​the top surface of the mesa of the replica blank 103 may be larger than the area of ​​the pattern region 401 of the master mold 102.

[0047] 4(a) schematically shows the disposing step. In the disposing step, a plurality of droplets 201 of the curable composition 104 can be applied or disposed on the pattern region 401 of the master mold 102 by the applicator 115. Note that, as described above, the disposing step may be performed by an apparatus external to the replica mold manufacturing apparatus 101. The applicator 115 is controlled based on control information stored in advance in the control device 117, and can dispose the droplets 201 of the curable composition 104 on the pattern region 401.

[0048] FIG. 4(b) schematically illustrates the filling step. In this step, the space between the replica blank 103 and the pattern region 105 of the master mold 102 is filled with a curable composition. This step includes a contacting step in which a droplet 201 of the curable composition disposed on the pattern region 105 of the master mold 102 is brought into contact with the replica region 402 of the replica blank 103. When the droplet 201 of the curable composition disposed on the pattern region 401 is brought into contact with the replica region 402, filling of the space between the pattern region 401 and the replica region 402 with the curable composition begins. In this filling step, the curable composition may spread along the flat surface (replica region 402) of the replica blank 103. The replica region 402 may have a mark for alignment with the master mold 102. An adhesive may also be applied to the replica region 402.

[0049] FIG. 4(c) schematically shows the curing step. In the curing step, the replica pattern portion 403 to which the pattern of the pattern region 401 is transferred is formed by curing the curable composition. The curing unit 111 applies curing energy to the liquid film of the curable composition between the pattern region 401 and the replica region 402, thereby curing the curable composition and forming the replica pattern portion 403. The curing of the curable composition may be accompanied by shrinkage of the volume of the curable composition. This shrinkage facilitates separation of the pattern region 401 from the replica pattern portion 403 that is formed.

[0050] FIG. 4(d) schematically illustrates the separation process. In this process, the replica pattern portion 403 and the master mold 102 are separated. In this process, for example, the second drive mechanism 110 can drive the replica pattern portion 403 in a direction away from the master mold 102 (in the +z direction). In this process, the control device 117 can separate the replica pattern portion 403 and the master mold 102 from each other by controlling the second drive mechanism 110 according to a preset drive profile. Here, while the replica blank 103 and the replica pattern portion 403 are bonded together, the replica pattern portion 403 and the master mold 102 are separated from each other, resulting in a replica mold 140 consisting of the replica pattern portion 403 and the replica blank 103. In the second embodiment, the area of ​​the replica pattern portion 403 at the bonding surface 130 between the replica blank 103 and the replica pattern portion 403 is larger than the area of ​​the pattern region 401. Furthermore, in orthogonal projection onto the bonding surface 130, the pattern area 401 falls within the area of ​​the replica pattern area 403 on the bonding surface 130. The bonding surface 130 between the replica blank 103 and the replica pattern area 403 is the whole or part of the replica area 402 of the replica blank 103. The replica mold 140 manufactured by the above manufacturing method is used in an imprint process for manufacturing an article.

[0051] Fig. 5 shows a schematic cross-sectional structure near the ends of the pattern area 401 and the replica area 402. A preferred relationship between the area of ​​the replica pattern area 403 at the bonding surface 130 between the replica blank 103 and the replica pattern area 403 and the area of ​​the pattern area 401 of the master mold 102 will be described with reference to Fig. 5. Fig. 5 is a schematic diagram of an XZ cross section passing through the centers of the pattern area 401 and the replica area 402.

[0052] Let L1 be half the dimension of the bonding surface 130 in a direction (e.g., the X direction) parallel to the bonding surface 130 between the replica blank 103 and the replica pattern portion 403, L2 be half the dimension of the pattern area 105 in this direction, and t be the thickness of the replica pattern portion 403. L1 may be understood as the distance from the center of the bonding surface 130 to the outer edge of the bonding surface 130. L2 may be understood as the distance from the center of the pattern area 105 to the outer edge of the pattern area 105.

[0053] FIG. 5(a) schematically illustrates a case where the area of ​​the replica region 402 (or the bonding surface 130) is equal to the area of ​​the pattern region 401, in other words, a case where L1 and L2 are equal. The outer periphery of the curable composition 104 before curing can form a meniscus (concave shape) 404. The shape of the meniscus 404 formed when the area of ​​the replica region 402 (or the bonding surface 130) is equal to the area of ​​the pattern region 401 strongly depends on the control error of the thickness t of the replica pattern portion 403. This means that the outer periphery of the liquid film formed by the curable composition 104 is poorly controllable. Furthermore, if the shape of the meniscus 404 is unstable, when the manufactured replica mold 140 is used in an imprinting process, the pressure applied to the curable composition by the periphery of the replica pattern portion 403 is unstable, which can make the imprinting process unstable.

[0054] 5(b) shows a schematic diagram of an example in which the area of ​​the replica region 402 (or the bonding surface 130) is larger than the area of ​​the pattern region 105, where L1-L2=t is satisfied. Having the area of ​​the replica region 402 (or the bonding surface 130) larger than the area of ​​the pattern region 105 is advantageous for obtaining a shape in which the cross-sectional area in a plane parallel to the bonding surface 130 decreases with increasing distance from the bonding surface 130. This means that the outer periphery of the liquid film made of the curable composition 104 can be easily controlled.

[0055] 5(c) shows a schematic diagram of an example in which L2-L1=t is satisfied, where the area of ​​the pattern region 401 is larger than the area of ​​the replica region 402 (or the bonding surface 130). If the area of ​​the pattern region 401 is larger than the area of ​​the replica region 402 (or the bonding surface 130), the area of ​​the manufactured replica mold 140 that comes into contact with the curable composition during the imprint process will be larger than the normal area. In this case, other problems may occur, such as collision with adjacent shot regions.

[0056] According to the inventors' investigations, the area of ​​the replica pattern portion 403 at the bonding surface 130 between the replica blank 103 and the replica pattern portion 403 is preferably larger than the area of ​​the pattern region 401 of the master mold 102. From another perspective, to consistently obtain a shape in which the cross-sectional area in a plane parallel to the bonding surface 130 decreases with increasing distance from the bonding surface 130, the lower limit of L1-L2 may be set to any of 0.1t, 0.2t, 0.3t, 0.4t, 0.5t, 0.6t, 0.7t, 0.8t, and 0.9t. Furthermore, to prevent thickness defects in the replica pattern portion 202 formed, the upper limit of L1-L2 may be set to any of 2t, 1.9t, 1.8t, 1.7t, 1.6t, 1.5t, 1.4t, 1.3t, 1.2t, and 1.1t. From yet another viewpoint, it is preferable to satisfy 0.1t≦L1−L2≦2t, more preferably 0.5t≦L1−L2≦1.5t, and even more preferably 0.7t≦L1−L2≦1.3t.

[0057] A third embodiment of a method for manufacturing an article, such as a semiconductor device or MEMS, will be described below. The third embodiment of the method for manufacturing an article may include a step of manufacturing a replica mold according to the replica mold manufacturing method described above. The method for manufacturing an article may also include a step of using the replica mold to form a pattern made of a cured product of a curable composition on a substrate, and a step of processing the substrate on which the pattern has been formed to obtain an article. The method for manufacturing an article may also include a step of peeling off the replica pattern portion in response to deterioration of the replica mold and manufacturing (regenerating) a new replica mold. The step of processing the substrate on which the pattern has been formed may include, for example, etching, resist peeling, dicing, bonding, packaging, and the like.

[0058] This specification and the accompanying drawings include the following disclosure: (Item 1) a filling step of filling a space between the replica blank and the pattern area of ​​the master mold with a curable composition; a curing step of forming a replica pattern portion to which the pattern of the pattern region is transferred by curing the curable composition; a separation step of separating the replica pattern portion and the master mold, the master mold has a pattern peripheral region surrounding the pattern region, and a step exists between the pattern region and the pattern peripheral region; an area of ​​the replica pattern portion at a bonding surface between the replica blank and the replica pattern portion is larger than an area of ​​the pattern region; A method for manufacturing a replica mold. (Item 2) In the filling step, the replica blank is placed on the master mold. 2. A method for manufacturing a replica mold according to item 1. (Item 3) the filling step includes a contacting step of contacting the replica blank with the curable composition disposed on the pattern area of ​​the master mold; 3. The method for manufacturing a replica mold according to item 2. (Item 4) the master mold has a mesa, and the pattern region is disposed on the mesa; 4. The method for manufacturing a replica mold according to item 3. (Item 5) the replica blank has a mesa, and the replica pattern portion is formed on the mesa of the replica blank. 4. The method for manufacturing a replica mold according to item 3. (Item 6) the area of ​​the top surface of the mesa of the replica blank is larger than the area of ​​the pattern region; 6. The method for manufacturing a replica mold according to item 5, (Item 7) In the filling step, the curable composition spreads along the top surface and reaches an edge of the top surface. 7. The method for manufacturing a replica mold according to item 6, (Item 8) the master mold has a recess, and the pattern area is disposed in the recess; 4. The method for manufacturing a replica mold according to item 3. (Item 9) the replica blank has a flat surface having an area larger than an area of ​​the replica pattern portion on the bonding surface, and the replica pattern portion is formed on the flat surface. 9. The method for manufacturing a replica mold according to item 8. (Item 10) the replica blank has a mesa, and the replica pattern portion is formed on the mesa of the replica blank. 10. The method for manufacturing a replica mold according to item 9. (Item 11) the area of ​​the top surface of the mesa of the replica blank is larger than the area of ​​the pattern region; 11. A method for manufacturing a replica mold according to item 10. (Item 12) a cross-sectional area of ​​the replica pattern portion in a plane parallel to the bonding surface decreases with increasing distance from the bonding surface; 12. The method for manufacturing a replica mold according to any one of items 1 to 11. (Item 13) In an orthogonal projection onto the bonding surface, the pattern area is contained within an area of ​​the replica pattern portion on the bonding surface. 13. The method for manufacturing a replica mold according to any one of items 1 to 12. (Item 14) When half the dimension of the bonding surface in a direction parallel to the bonding surface is L1, half the dimension of the pattern area in the same direction is L2, and the thickness of the replica pattern portion is t, 0.1t≦L1-L2≦2t 14. The method for manufacturing a replica mold according to any one of items 1 to 13, wherein the above-mentioned condition is satisfied. (Item 15) When half the dimension of the bonding surface in a direction parallel to the bonding surface is L1, half the dimension of the pattern area in the same direction is L2, and the thickness of the replica pattern portion is t, 0.5t≦L1-L2≦1.5t 14. The method for manufacturing a replica mold according to any one of items 1 to 13, wherein the above-mentioned condition is satisfied. (Item 16) When half the dimension of the bonding surface in a direction parallel to the bonding surface is L1, half the dimension of the pattern area in the same direction is L2, and the thickness of the replica pattern portion is t, 0.7t≦L1-L2≦1.3t 14. The method for manufacturing a replica mold according to any one of items 1 to 13, wherein the above-mentioned condition is satisfied. (Item 17) The thickness of the replica pattern portion is in the range of 0.1 μm or more and 1000 μm or less. 17. A method for manufacturing a replica mold according to any one of items 1 to 16. (Item 18) A step of manufacturing a replica mold according to the replica mold manufacturing method described in any one of items 1 to 17; forming a pattern made of a cured product of the curable composition on a substrate using the replica mold; processing the patterned substrate to obtain an article; A method for manufacturing an article, comprising:

[0059] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0060] 102: master mold, 103: replica blank, 105: pattern area, 118: replica area, 119: replica peripheral area, 120: pattern peripheral area, 130: bonding surface, 202: replica pattern part, 140: replica blank, 401: pattern area, 403: replica pattern part

Claims

1. a filling step of filling a space between the replica blank and the pattern area of ​​the master mold with a curable composition; a curing step of forming a replica pattern portion to which the pattern of the pattern region is transferred by curing the curable composition; a separation step of separating the replica pattern portion and the master mold, the master mold has a pattern peripheral region surrounding the pattern region, and a step exists between the pattern region and the pattern peripheral region; an area of ​​the replica pattern portion at a bonding surface between the replica blank and the replica pattern portion is larger than an area of ​​the pattern region; A method for manufacturing a replica mold.

2. In the filling step, the replica blank is placed on the master mold.

2. The method for manufacturing a replica mold according to claim 1.

3. the filling step includes a contacting step of contacting the replica blank with the curable composition disposed on the pattern area of ​​the master mold; 3. The method for manufacturing a replica mold according to claim 2.

4. the master mold has a mesa, and the pattern region is disposed on the mesa; 4. The method for manufacturing a replica mold according to claim 3.

5. the replica blank has a mesa, and the replica pattern portion is formed on the mesa of the replica blank.

4. The method for manufacturing a replica mold according to claim 3.

6. the area of ​​the top surface of the mesa of the replica blank is larger than the area of ​​the pattern region; 6. The method for manufacturing a replica mold according to claim 5.

7. In the filling step, the curable composition spreads along the top surface and reaches an edge of the top surface.

7. The method for manufacturing a replica mold according to claim 6.

8. the master mold has a recess, and the pattern area is disposed in the recess; 4. The method for manufacturing a replica mold according to claim 3.

9. the replica blank has a flat surface having an area larger than an area of ​​the replica pattern portion on the bonding surface, and the replica pattern portion is formed on the flat surface.

9. The method for manufacturing a replica mold according to claim 8.

10. the replica blank has a mesa, and the replica pattern portion is formed on the mesa of the replica blank. The method for manufacturing a replica mold according to claim 9 .

11. the area of ​​the top surface of the mesa of the replica blank is larger than the area of ​​the pattern region; The method for manufacturing a replica mold according to claim 10.

12. a cross-sectional area of ​​the replica pattern portion in a plane parallel to the bonding surface decreases with increasing distance from the bonding surface; 2. The method for manufacturing a replica mold according to claim 1.

13. In an orthogonal projection onto the bonding surface, the pattern area is contained within an area of ​​the replica pattern portion on the bonding surface.

2. The method for manufacturing a replica mold according to claim 1.

14. When L1 is half the dimension of the bonding surface in a certain direction parallel to the bonding surface, L2 is half the dimension of the pattern area in the same direction, and t is the thickness of the replica pattern portion, 0.1t≦L1-L2≦2t 14. The method for manufacturing a replica mold according to claim 1, wherein the following is satisfied:

15. When L1 is half the dimension of the bonding surface in a certain direction parallel to the bonding surface, L2 is half the dimension of the pattern area in the same direction, and t is the thickness of the replica pattern portion, 0.5t≦L1-L2≦1.5t 14. The method for manufacturing a replica mold according to claim 1, wherein the following is satisfied:

16. When L1 is half the dimension of the bonding surface in a certain direction parallel to the bonding surface, L2 is half the dimension of the pattern area in the same direction, and t is the thickness of the replica pattern portion, 0.7t≦L1-L2≦1.3t 14. The method for manufacturing a replica mold according to claim 1, wherein the following is satisfied:

17. the thickness of the replica pattern portion is in the range of 0.1 μm or more and 1000 μm or less; The method for manufacturing a replica mold according to any one of claims 1 to 13.

18. A step of manufacturing a replica mold according to the method of manufacturing a replica mold according to any one of claims 1 to 13; forming a pattern made of a cured product of the curable composition on a substrate using the replica mold; processing the patterned substrate to obtain an article; A method for manufacturing an article, comprising:

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