Substrate processing system and method of manufacturing article

Abstract

To provide a technique advantageous for conveying a substrate to which a liquid is applied.SOLUTION: The substrate processing system includes a processing apparatus having a processing chamber for processing a substrate to which a liquid is applied, and a transfer robot that performs at least one of an operation of loading the substrate into the processing chamber and an operation of unloading the substrate from the processing chamber. The transfer robot includes an arm capable of bending and stretching, a hand connected to the arm and configured to hold the substrate, and a first magnet disposed in the hand. The processing device includes a second magnet. The second magnet is disposed in the processing chamber such that a force acts on the hand in a direction opposite to the gravity direction due to a repulsive force between the first magnet and the second magnet in a state where the hand of the transfer robot enters the processing chamber.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] FIELD The present disclosure relates to substrate processing systems and methods for manufacturing articles. [Background technology]

[0002] When manufacturing articles such as panels (organic EL panels) having OLEDs (organic light emitting diodes), which are organic EL (electroluminescence) elements, a method is known in which a solution film is disposed on a substrate by applying a solution to a desired location on the substrate using an inkjet coating device. The solution film is a film composed of a solution (ink) containing a solute and a solvent. A film (layer) is formed on the substrate by drying the solution film disposed on the substrate. A reduced-pressure drying device is used to dry the solution film. A transfer robot is used to transport the substrate from the inkjet coating device to the reduced-pressure drying device. Patent Document 1 discloses a correction device that uses power from a drive source to correct tilt caused by arm bending when the transfer robot holds a substrate such as a semiconductor wafer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-120861 Summary of the Invention [Problem to be solved by the invention]

[0004] However, when a substrate to which liquid has been applied is transported using a transport robot, as the arm of the transport robot is extended, the hand may bend due to insufficient rigidity, making it impossible to maintain the level of the substrate, and there is a risk that the liquid may drip from the substrate or become unevenly distributed on the substrate.

[0005] The present disclosure provides an advantageous technique for transporting a substrate to which a liquid has been applied. [Means for solving the problem]

[0006] One aspect of the present disclosure is a substrate processing system comprising: a processing apparatus having a processing chamber for processing a substrate to which a liquid has been applied; and a transport robot that performs at least one of the operations of transporting the substrate into the processing chamber and transporting the substrate out of the processing chamber, wherein the transport robot has an arm that can bend and extend, a hand connected to the arm and holding the substrate, and a first magnet arranged in the hand, and the processing apparatus has a second magnet, and the second magnet is arranged in the processing chamber so that when the hand of the transport robot has entered the processing chamber, a force acts on the hand in a direction opposite to the direction of gravity due to a repulsive force between the first magnet and the second magnet. [Effects of the Invention]

[0007] According to the present disclosure, a technique is provided that is advantageous for transporting a substrate to which a liquid has been applied. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic plan view of a substrate processing system according to a first embodiment. [Figure 2] 1A is an explanatory diagram of a substrate according to the first embodiment, and FIG. 1B is a cross-sectional view of a portion of the substrate according to the first embodiment. [Figure 3] 1(a) is an explanatory diagram of a substrate according to Modification 1 of the first embodiment, and FIG. 1(b) is a cross-sectional view of a portion of the substrate according to Modification 1 of the first embodiment. [Figure 4] 1A is a schematic side view of a portion of the configuration of the substrate processing system according to the first embodiment, and FIG. 1B is a plan view of the portion of the configuration of the substrate processing system according to the first embodiment. [Figure 5] 1A is an explanatory view for explaining the operation of transferring a substrate between a transport robot and a plurality of holding pins in the first embodiment, and FIG. 1B is an explanatory view for explaining the operation of transferring a substrate between a transport robot and a plurality of holding pins in the first embodiment. [Figure 6] 3 is a flowchart of a control method according to the first embodiment. [Figure 7] 1A is an explanatory diagram schematically showing a state in which a solution film has been applied to a bank on a substrate according to the first embodiment, and FIG. 1B is an explanatory diagram schematically showing a state in which a solution has been applied to a bank on a substrate according to the first embodiment. [Figure 8] 10(a) is a schematic side view of a part of the configuration of a substrate processing system according to a second embodiment, and (b) is a plan view of a part of the configuration of a substrate processing system according to the second embodiment. [Figure 9] 10(a) is a schematic side view of a part of the configuration of a substrate processing system according to a second embodiment, and (b) is a plan view of a part of the configuration of a substrate processing system according to the second embodiment. [Figure 10] 10 is a flowchart of a control method according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] The following embodiments will be described with reference to the drawings. Note that the following embodiments are merely examples, and those skilled in the art can appropriately modify the detailed configurations without departing from the spirit of the present invention. In the drawings referred to in the following description of the embodiments, elements denoted by the same reference numerals have the same functions unless otherwise noted. When multiple identical elements are arranged in a drawing, the assignment of reference numerals and their explanations may be omitted. Furthermore, the drawings may be represented schematically for the convenience of illustration and explanation, and therefore the shape, size, arrangement, etc. of elements depicted in the drawings may not strictly correspond to the actual objects.

[0010] In the following description, directions are indicated using an XYZ coordinate system, which is a Cartesian coordinate system. The X, Y, and Z axes are perpendicular to one another. The direction of the X axis is also referred to as the X direction, the direction of the Y axis as the Y direction, and the direction of the Z axis as the Z direction. For example, the positive direction of the X axis refers to the same direction as the X-axis arrow in the coordinate system shown in the figure, and the negative direction of the X axis refers to the direction 180° opposite to the direction of the X-axis arrow in the coordinate system shown in the figure. Furthermore, when simply referred to as the X direction, it refers to a direction parallel to the X axis, regardless of whether it is in the direction indicated by the X-axis arrow in the figure. The same applies to the Y and Z axes other than the X axis. In the XYZ coordinate system, the X and Y directions are horizontal, and the negative Z direction is vertical (the direction of gravity). For example, a plane including the X and Y axes is referred to as an XY plane.

[0011] Furthermore, although a solution may be referred to as "ink" in this specification, the ink according to the embodiment is not limited to a solution containing a recording material for forming characters or images. For example, the ink may be a solution containing a functional material for forming a functional thin film such as an electrode or an optical filter, or a functional element such as an organic EL element. The ink may also be a solution containing an insoluble solid component.

[0012] Examples of the substrate include a semiconductor wafer, a glass substrate for a liquid crystal display, and a glass substrate for an organic EL display. In the following, an example in which the substrate is a glass substrate for an organic EL display will be described.

[0013] [First embodiment] 1 is a schematic plan view of a substrate processing system 1000 according to a first embodiment. The substrate processing system 1000 is a system for manufacturing an article to be used in a display device. The article is, for example, a substrate S on which an organic film is formed. The substrate processing system 1000 is configured to include, for example, a film forming apparatus for forming an organic film on the substrate S.

[0014] The base material of the substrate S is a glass substrate. An organic EL display panel is manufactured by processing the substrate S. Each of the plurality of pixels included in the panel is composed of three sub-pixels, RGB. A plurality of organic films are formed in each sub-pixel. Each organic film may be a functional film.

[0015] In each subpixel, an organic film is formed in the recess defined by the bank. The organic film can be, for example, any of the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, and electron injection layer of an organic light-emitting device (OLED). In the process of manufacturing an organic EL device, organic films such as the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, and electron injection layer are formed on a substrate S. The process of forming each organic film on the substrate S can include a process of applying a solution containing a functional material as a solute onto the substrate S to form a solution film of the solution on the substrate S. For example, the process of forming an organic film on the substrate S can include a coating process of applying (disposing) a solution film on the substrate S by, for example, an inkjet method, a liquid property adjustment process of adjusting the liquid properties of the applied solution film, a drying process of drying the adjusted solution film to form a dry film, and a baking process of baking the dried film.

[0016] The solution film is composed of a solution (liquid) containing a solute for forming an organic film and at least one solvent. Hereinafter, the solution may also be referred to as ink. The solvent may have the property of accelerating evaporation in a reduced pressure environment lower than atmospheric pressure (1 atmosphere). Evaporation of the solvent may be accelerated, for example, at temperatures higher than room temperature (25°C).

[0017] The substrate processing system 1000 includes a plurality of processing devices that perform some kind of processing on a substrate S, and a transfer robot 1, which is an example of a transfer device configured to be able to transfer substrates between the plurality of processing devices. Each processing device may include a processing container (processing chamber). The substrate processing system 1000 includes a transfer container 20 connected to each processing container of the plurality of processing devices. The transfer container 20 defines a transfer chamber, which is an internal space. The transfer robot 1 is disposed in the transfer chamber. The transfer container 20 is disposed so as to be surrounded by the plurality of processing containers. The substrate processing system 1000 may be a multi-chamber type substrate processing system.

[0018] In one example, the multiple processing devices include a coating device 10 that coats a solution film on the substrate S by supplying ink to the substrate S using an inkjet method, and a drying device 12 that dries the solution film coated on the substrate S by the coating device 10. The multiple processing devices may also include a load lock device 13, an unload lock device 15, a processing device 14, a processing device 16, a processing device 17, and a processing device 18. The drying device 12 is an example of a first processing device, and the coating device 10 is an example of a second processing device.

[0019] The load lock device 13 is used as an interface for transporting a substrate S from outside the substrate processing system 1000 to inside the substrate processing system 1000. The unload lock device 15 is configured as an interface for transporting a substrate S from the substrate processing system 1000 to outside after processing in the substrate processing system 1000. The load lock device 13 and the unload lock device 15 may be configured as a single device shared for loading and unloading.

[0020] The drying apparatus 12 is configured to form a dry film by performing a drying process that dries the solution film disposed on the substrate S. In the first embodiment, the drying apparatus 12 is a reduced-pressure drying apparatus having a decompression mechanism, and dries the solution film on the substrate S by reducing the pressure in the processing chamber to which the substrate S is transferred below atmospheric pressure. The processing apparatuses 14, 16, 17, and 18 may include processing chambers that perform various processes such as cooling and alignment according to the characteristics of the apparatus. Note that the number of processing apparatuses is not limited to the example shown in the figure, and may be increased or decreased.

[0021] The transfer robot 1 is configured to be able to hold a substrate S, and is configured to be able to carry the substrate S into each processing chamber and carry the substrate S out of each processing chamber.

[0022] In the first embodiment, a transfer container 21 is provided between the coating apparatus 10 and the transfer container 20. The transfer container 21 defines a transfer chamber. A transfer mechanism (not shown) is disposed in the transfer chamber of the transfer container 21. The transfer mechanism is configured to unload the substrate S from the coating apparatus 10 and transfer the substrate S in a straight line to the transfer chamber of the transfer container 20 without changing the orientation of the substrate S.

[0023] The substrate processing system 1000 further includes a control device 40 that controls the operation of each part of the substrate processing system 1000. The control device 40 is an example of a control unit. The control device 40 may include a CPU, which is an example of a processor, an I / O port, and a computer-readable recording medium. The computer-readable recording medium may be a non-transitory recording medium that stores processing programs executed by the CPU, parameters required for executing the processing, etc. Examples of non-transitory recording media that may be used include flexible disks, optical disks, magneto-optical disks, magnetic tapes, USB memories, and SSDs. The control device 40 may also include a rewritable storage medium (such as a RAM) that provides a storage area required for processing such as calculations.

[0024] A computer-readable non-transitory recording medium provided in the control device 40 stores a program for the substrate processing system 1000 to execute the transport operation according to this embodiment and the manufacture of substrates for organic EL display devices.

[0025] The control device 40 having a processor may be configured with hardware such as a field programmable gate array (FPGA). The control device 40 may also be configured with a programmable logic device (PLD) or an application specific integrated circuit (ASIC). Alternatively, the control device 40 may be configured with a general-purpose or dedicated computer in which a program (software) is installed, or may be configured by combining all or part of the above-mentioned configuration with a computer.

[0026] FIG. 2(a) is an explanatory diagram of the substrate S according to the first embodiment. FIG. 2(a) shows a perspective view of the substrate S. The substrate S may be a square plate, but in the first embodiment, it is a rectangular plate. The substrate S has four sides S1, S2, S3, and S4. Sides S1 and S3 are long sides, and sides S2 and S4 are short sides. Sides S1 and S3 of the substrate S extend in the Y direction, and sides S2 and S4 of the substrate S extend in the X direction.

[0027] The substrate S has a flat glass base material 22 and a metal frame 23 arranged on a main surface 221 of the glass base material 22. The metal frame 23 forms a bank 30. The bank 30 defines a plurality of recesses 33. The recesses 33 are arranged in a matrix at intervals in the X and Y directions. Each recess 33 is shaped, for example, as a rectangle having long and short sides. The long side of each recess 33 extends in the Y direction, and the short side of each recess 33 extends in the X direction.

[0028] 2(b) is a cross-sectional view of a portion of the substrate S according to the first embodiment. A solution (ink) is applied to each recess 33 by the coating device 10 of FIG. 1, and a solution film 31 is formed in each recess 33. Two adjacent solution films 31 are formed so as not to come into contact with each other (so as not to mix with each other).

[0029] FIG. 3(a) is an explanatory diagram of a substrate S according to Modification 1 of the first embodiment. FIG. 3(a) shows a perspective view of the substrate S. The substrate S may be a square plate, but in Modification 1, it is a rectangular plate. The substrate S has four sides S1, S2, S3, and S4. Sides S1 and S3 are long sides, and sides S2 and S4 are short sides. Sides S1 and S3 of the substrate S extend in the Y direction, and sides S2 and S4 of the substrate S extend in the X direction.

[0030] The substrate S has a flat glass base 22 and a metal frame 23 arranged on a main surface 221 of the glass base 22. The metal frame 23 forms a bank 30. The bank 30 defines a plurality of linear recesses 33 extending in the longitudinal direction (Y direction). The plurality of recesses 33 are arranged at intervals in the X direction. Each recess 33 is shaped like a rectangle having long and short sides. The long side of each recess 33 extends in the Y direction, and the short side of each recess 33 extends in the X direction. That is, each of the plurality of recesses 33 is a linear recess extending in the longitudinal direction (Y direction) parallel to the direction in which the sides S1 and S3 of the substrate S extend. The length L1 of each of the plurality of recesses 33 in the longitudinal direction (Y direction) may be 32 inches or more.

[0031] Fig. 3(b) is a cross-sectional view of a portion of the substrate S according to Modification 1 of the first embodiment. The coating device 10 of Fig. 1 applies a solution (ink) to each recess 33, forming a solution film 31 in each recess 33. Two adjacent solution films 31 are formed so as not to come into contact with each other (so as not to mix with each other).

[0032] Fig. 4(a) is a schematic side view of a portion of the configuration of the substrate processing system 1000 according to the first embodiment. Fig. 4(a) shows a cross section of a portion of the configuration of the substrate processing system 1000 along an imaginary plane parallel to the YZ plane. Fig. 4(b) is a plan view of a portion of the configuration of the substrate processing system 1000 according to the first embodiment. Fig. 4(b) shows a portion of the configuration of the substrate processing system 1000 as viewed in the direction of arrow IVB (i.e., the negative direction of the Z axis) from the position shown in Fig. 4(a).

[0033] The drying apparatus 12 is an example of a first processing apparatus. The drying apparatus 12 includes a container 101 having a processing chamber SP1. The container 101 is an airtight container. The processing chamber SP1 is a chamber for processing a substrate to which a liquid has been applied. In the processing chamber SP1, a predetermined process is performed on the substrate S, and in the first embodiment, a drying process is performed to dry the substrate S. The processing chamber SP1 can be connected to the transfer chamber of the transfer container 20 in FIG. 1 via a gate valve (not shown).

[0034] Here, drying the substrate S may be expressed as drying the solution film 31 placed on the substrate S, evaporating the solvent contained in the solution film 31 placed on the substrate S, or drying the solvent contained in the solution film 31 placed on the substrate S, but these all have the same meaning.

[0035] The transfer robot 1 carries out an operation of loading a substrate S before drying into the processing chamber SP1 and an operation of unloading a substrate S after drying from the processing chamber SP1. The transfer robot 1 has an articulated arm 91 and a hand 92 provided at the tip of the arm 91. The arm 91 is a robot arm, and the hand 92 is a robot hand.

[0036] The arm 91 is, for example, a SCARA (Selective Compliance Assembly Robot Arm). The arm 91 has a plurality of links connected by a plurality of joints, and a hand 92 is rotatably connected to the link at the tip. The arm 91 is capable of bending and stretching and pivoting as each link rotates at each joint. That is, as the arm 91 bends and stretches, the hand 92 can be moved in a straight direction (horizontal direction) perpendicular to a central axis C1 at the base end of the arm 91. Furthermore, as the arm 91 pivots around the central axis C1, the hand 92 can be moved in a rotational direction (pivoting direction) around the central axis C1. The central axis C1 is an axis parallel to the Z axis.

[0037] The hand 92 is rotatably connected to the arm 91 at the wrist portion of the arm 91, and is configured to hold the substrate S by supporting the substrate S. The hand 92 is supported by the arm 91 in a cantilevered manner at a base end 921, and a tip 922 of the hand 92 is a free end. In the position of the arm 91 shown in Figures 4(a) and 4(b), the direction from the base end 921 to the tip 922 of the hand 92 is the positive direction of the Y axis.

[0038] The hand 92 holds the substrate S so that the direction from the base end 921 to the tip 922 of the hand 92 is parallel to the direction in which the sides S1 and S3 of the substrate S extend.

[0039] In the operation of loading the substrate S before drying processing into the processing chamber SP1, the transfer robot 1 performs an entry operation of loading the hand 92 into the processing chamber SP1 and a retraction operation of retracting the hand 92 from the processing chamber SP1. The transfer robot 1 also performs the entry operation and the retraction operation in the operation of unloading the substrate S after drying processing from the processing chamber SP1.

[0040] In the approaching operation and the retracting operation, the arm 91 bends and stretches so that the hand 92 moves linearly along the Y direction while maintaining the state in which it faces the direction shown in Figures 4(a) and 4(b). That is, in the approaching operation, the hand 92 is moved in the positive direction of the Y axis while the direction from the base end 921 to the tip end 922 of the hand 92 is maintained in the positive direction of the Y axis. In addition, in the retracting operation, the hand 92 is moved in the negative direction of the Y axis while the direction from the base end 921 to the tip end 922 of the hand 92 is maintained in the positive direction of the Y axis.

[0041] Here, the operation of the transfer robot 1 will be described, in which the transfer robot 1 acquires the substrate S coated with the solution by the coating device 10 and transfers the acquired substrate S to the drying device 12. It is assumed that the substrate S coated with the solution by the coating device 10 is waiting in the transfer chamber of the transfer container 21.

[0042] With the tip 922 of the hand 92 facing the transfer chamber of the transfer container 21, the arm 91 extends in a straight direction, allowing the hand 92 to retrieve the substrate S, onto which the solution has been applied by the coating device 10, from the transfer chamber of the transfer container 20. Then, with the hand 92 holding the substrate S, the arm 91 assumes a bent position so that the hand 92 retreats from the transfer chamber of the transfer container 20. The arm 91 pivots while maintaining the bent position so that the hand 92 faces the processing chamber SP1 of the container 101. With the tip 922 of the hand 92 facing the processing chamber SP1 of the container 101, the arm 91 extends in a straight direction in the positive direction of the Y axis, allowing the hand 92 to enter the processing chamber SP1 as shown in FIG. 4(a). The hand 92 is provided with a plurality of stoppers 93 to prevent the substrate S from falling off the hand 92.

[0043] A substrate holding table 6, which is an example of a substrate holding section that holds a substrate S, is disposed in the processing chamber SP1. An upper surface 61 of the substrate holding table 6 is flat, and the substrate S can be placed on the upper surface 61 of the substrate holding table 6. The upper surface 61 of the substrate holding table 6 is a substrate holding surface. When the substrate S is subjected to a drying process, the substrate S is placed on the upper surface 61 of the substrate holding table 6.

[0044] The drying device 12 has a plurality of holding pins 71 and a drive mechanism 72 that drives the plurality of holding pins 71 in the vertical direction (Z direction). The substrate S can be held by the tips (upper ends) of the plurality of holding pins 71.

[0045] 5(a) and 5(b) are explanatory views for explaining the operation of transferring a substrate S between the transfer robot 1 and the plurality of holding pins 71 in the first embodiment. The plurality of holding pins 71 are movable between a protruding position P1 where they protrude upward relative to the upper surface 61 of the substrate holding table 6 to enable the transfer of the substrate S between the transfer robot 1 and the plurality of holding pins 71, and a retracted position P2 where they retract downward relative to the upper surface 61 of the substrate holding table 6. The protruding position P1 is an example of the first position, and the retracted position P2 is an example of the second position.

[0046] The protruding position P1 is a position where the upper end of the holding pin 71 is above the upper surface 61 of the substrate holding table 6 and is above the hand 92. The retracted position P2 is a position where the upper end of the holding pin 71 is below the upper surface 61 of the substrate holding table 6. The drive mechanism 72, under the control of the control device 40, drives the multiple holding pins 71 so that the multiple holding pins 71 move between the protruding position P1 and the retracted position P2.

[0047] As shown in FIG. 5A, with the holding pins 71 retracted to the retracted position P2, the transfer robot 1 moves the hand 92 linearly in the positive direction of the Y axis to a transfer position where the substrate S can be transferred between the holding pins 71 and the hand 92. Then, the drive mechanism 72 drives the holding pins 71 so that the holding pins 71 move from the retracted position P2 to the protruding position P1 shown in FIG. 5B. As a result, the substrate S is held by the multiple holding pins 71 and moves upward away from the hand 92. In this state, the transfer robot 1 can retract the hand 92 from the processing chamber SP1 by moving the hand 92 linearly in the negative direction of the Y axis. Thereafter, the drive mechanism 72 drives the holding pins 71 so that the holding pins 71 move from the protruding position P1 to the retracted position P2, thereby placing the substrate S on the upper surface 61 of the substrate holder 6.

[0048] Here, when the entire hand 92 is inserted into the processing chamber SP1, the arm 91 is in an extended position rather than a bent position. When the arm 91 is extended, a force acts on the hand 92 in the direction of gravity (the negative direction of the Z axis) due to its own weight and the weight of the substrate S. The substrate S is held by the hand 92 so that the direction from the base end 921 to the tip 922 of the hand 92 is parallel to the direction in which the sides S1 and S3 of the substrate S extend. Therefore, for example, in the case of the substrate S shown in FIGS. 2(a) and 2(b), or for example, in the case of the substrate S shown in FIGS. 3(a) and 3(b), if the tip 922 of the hand 92 is tilted in the negative direction of the Z axis, the solution of the solution film 31 applied to the recess 33 is likely to drip from the recess 33. In particular, since the volume of the solution film 31 shown in FIG. 3(b) is larger than the volume of the solution film 31 shown in FIG. 2(b), the solution in the solution film 31 shown in FIG.

[0049] Therefore, in the first embodiment, the transfer robot 1 has two magnets 4 as at least one first magnet arranged in the hand 92, and the drying device 12 has two magnets 5 as at least one second magnet arranged in the substrate holder 6. The two magnets 4 are arranged in the hand 92 with an interval in the X direction. The two magnets 5 are arranged in the substrate holder 6 with an interval in the X direction.

[0050] The magnet 4 is fixed to the lower surface opposite to the upper surface of the hand 92. The substrate S is placed on the upper surface of the hand 92. The magnet 4 may be either an electromagnet or a permanent magnet, but in the first embodiment, it is a permanent magnet.

[0051] The magnet 5 may be either an electromagnet or a permanent magnet, but is an electromagnet in the first embodiment. The magnets 4 and 5 are configured to generate a magnetic field in a direction in which a repulsive force acts on each other.

[0052] When the hand 92 of the transfer robot 1 has entered the processing chamber SP1, the magnet 5 is located below the magnet 4. In the first embodiment, the magnet 5 is arranged in the processing chamber SP1 so that when the hand 92 of the transfer robot 1 has entered the processing chamber SP1, a force acts on the hand 92 in the direction opposite to the direction of gravity (the positive direction of the Z axis) due to the repulsive force between the magnets 4 and 5. In the first embodiment, the magnet 5 is arranged on the upper surface 61 of the substrate holder 6.

[0053] The repulsive force between the magnets 4 and 5 corrects the tilt and / or bending of the hand 92, making it possible to make the substrate S horizontal or nearly horizontal. This reduces the solution contained in the solution film 31 applied to the substrate S from dripping from the substrate S or becoming unevenly distributed on the substrate S. Thus, the first embodiment provides a technique that is advantageous for transporting the substrate S to which the solution has been applied.

[0054] The length of magnet 4 in the longitudinal direction (Y direction) is preferably longer than sides S1 and S3, which are the long sides of substrate S. This enhances the effect of lifting the entire substrate S in the direction opposite to the direction of gravity by the repulsive forces of magnets 4 and 5. Note that the length of magnet 5 in the longitudinal direction (Y direction) may be shorter than the length of magnet 4 in the longitudinal direction (Y direction).

[0055] Since the multiple holding pins 71 are movable between two positions P1 and P2, the magnet 5 is positioned so as not to overlap with the multiple holding pins 71 in the Z direction perpendicular to the upper surface 61 of the substrate holding table 6 so as not to interfere with the multiple holding pins 71.

[0056] In the first embodiment, the magnet 5 is movably mounted on the upper surface 61 of the substrate holder 6 so as not to interfere with the substrate S when the substrate S is placed on the upper surface 61 of the substrate holder 6. The magnet 5 is configured to be driven between positions P11 and P12 by a moving mechanism 80 including a cylinder or the like.

[0057] Position P11 is a position where the magnet 5 faces the substrate S in the Z direction when the hand 92 has entered the processing chamber SP1 and moved to a position where the substrate S is transferred between the multiple holding pins 71 and the substrate holder 6. Position P12 is a position where the magnet 5 retreats from position P11 so as not to interfere with the substrate S when the substrate S is placed on the upper surface 61 of the substrate holder 6. That is, position P11 is a position where the magnet 5 overlaps the substrate S in the Z direction perpendicular to the upper surface 61 of the substrate holder 6 when the hand 92 has moved to a position where the substrate S is transferred between the multiple holding pins 71 and the substrate holder 6. Position P12 is a position where the magnet 5 does not overlap the substrate S in the Z direction perpendicular to the upper surface 61 of the substrate holder 6 when the hand 92 has moved to a position where the substrate S is transferred between the multiple holding pins 71 and the substrate holder 6. Position P11 is an example of the third position, and position P12 is an example of the fourth position. That is, when viewed in the Z direction, the magnet 5 that has moved to position P11 overlaps with the substrate S, and the magnet that has moved to position P12 does not overlap with the substrate S.

[0058] The control operation by the control device 40 will be specifically described below. The control device 40 controls the coating device 10 to perform a coating process of coating the substrate S with a solution. After the coating process is completed, the control device 40 controls a transfer mechanism (not shown) disposed in the transfer chamber of the transfer container 21 to transfer the substrate S from the coating device 10 to the transfer chamber of the transfer container 21. Then, the control device 40 causes the transfer robot 1 to retrieve the substrate S, to which the solution has been applied by the coating device 10, from the transfer mechanism (not shown).

[0059] 6 is a flowchart of the control method according to the first embodiment. First, in step S101, the control device 40 controls the transfer robot 1 holding the substrate S to move the transfer robot 1 in front of the processing chamber SP1 so that the tip 922 of the hand 92 faces the processing chamber SP1. That is, the control device 40 controls the arm 91 to rotate in a bent position, so that the tip 922 of the hand 92 faces the processing chamber SP1.

[0060] Also, in step S101, the control device 40 controls the movement mechanism 80 to move the magnet 5 forward from position P12 to position P11. The control device 40 applies a current of a predetermined current value to the electromagnetic coil of the magnet 5. This generates a magnetic field around the magnet 5. The holding pin 71 is located at the retracted position P2.

[0061] Next, in step S102, the control device 40 controls the transfer robot 1 so that the hand 92 advances in the positive direction of the Y axis. As a result, the arm 91 extends, and as the hand 92 advances into the processing chamber SP1, a force is gradually applied to the hand 92 in the direction opposite to the direction of gravity (the positive direction of the Z axis) due to the repulsive force between the magnets 4 and 5, correcting the tilt and / or bending of the hand 92. As shown in FIG. 5(a), the hand 92 reaches the transfer position above the substrate holder 6.

[0062] Next, in step S103, the control device 40 controls the drive mechanism 72 to move the holding pin 71 from the retracted position P2 to the protruding position P1 shown in FIG. 5(b). As a result, the holding pin 71 rises and receives the substrate S from the hand 92. The substrate S is separated from the hand 92.

[0063] Next, in step S104, the control device 40 controls the transfer robot 1 so that the hand 92 retreats in the negative direction of the Y axis, thereby bending the arm 91 and retracting the hand 92 from the processing chamber SP1.

[0064] Furthermore, in step S104, the control device 40 controls the moving mechanism 80 to move the magnet 5 back from the position P11 to the position P12.

[0065] Next, in step S105, the control device 40 controls the drive mechanism 72 to move the holding pins 71 from the protruding position P1 to the retracted position P2. As a result, the holding pins 71 are lowered and the substrate S is placed on the upper surface 61 of the substrate holding table 6. The control device 40 positions and fixes the substrate S on the upper surface 61 of the substrate holding table 6 using a vacuum chuck, an electrostatic chuck, or the like, and starts the drying process.

[0066] Next, a description will be given of the control operation of the control device 40 after the drying process of the substrate S. The control device 40 releases the chuck on the substrate holder 6 and moves the holding pins 7 to the protruding position P1. The control device 40 moves the holding pin 7 to the protruding position P1, and then moves the magnet 5 to a position P11. After moving the magnet 5 to the position P11, the control device 40 moves the hand 92 to a position below the substrate S. At this time, the repulsive force between the magnets 4 and 5 corrects the tilt and / or bending of the hand 92. The control device 40 lowers the holding pin 7, and transfers the substrate S from the holding pin 7 to the hand 92. After the transfer is complete, the control device 40 retracts the hand 92, and transports the substrate S to the next processing chamber.

[0067] As described above, according to the first embodiment, it is possible to prevent the solution from dripping due to tilting caused by the weight of the hand 92 of the transport robot 1.

[0068] Here, the current value of the current applied to the magnet 5 is set in advance in the control device 40 through testing or the like. The operation for setting the current value will be described below. The control device 40 causes the hand 92 to enter the processing chamber SP1 while the current to the electromagnetic coil of the magnet 5 is turned off. When the hand 92 arrives at the transfer position for the substrate S, position information of the hand 92 is acquired. Specifically, the control device 40 acquires the maximum value of the inclination of the tip 922 of the hand 92 from a dial gauge, level, or the like as the position information of the hand 92. Then, the control device 40 determines (adjusts) the current to be applied to the magnet 5 based on the acquired position information. Thereafter, the control device 40 causes the hand 92 to retreat from the processing chamber SP1.

[0069] The control device 40 may repeat the advancement and retreat of the hand 92 into the processing chamber SP1, and adjust the current value of the current to the electromagnetic coil of the magnet 5 until the tilt of the tip 922 of the hand 92 converges within a target value.

[0070] 7(a) and 7(b) are explanatory diagrams schematically illustrating a state in which a solution film 31 has been applied to a bank 30 on a substrate S according to the first embodiment. Fig. 7(a) illustrates a state in which the substrate is horizontal, and Fig. 7(b) illustrates a state in which the substrate is tilted and the solution of the solution film 31 has spilled from the bank 30.

[0071] In order for the substrate coated with the solution film 31 to be transported normally by the hand 92 to the drying device 12, the following formula must be satisfied. a>b a: The inclination at which the solution of the solution film 31 spills from the bank 30 on the substrate b: Tilt of hand 92

[0072] Regarding a, the following two conditions (a-1) and (a-2) are compared, and the slope at which the solution of the solution film 31 spills from the bank 30 of the substrate is determined by finding the value where (a-2) exceeds (a-1). (a-1): The force that prevents the solution of the solution film 31 from spilling from the bank 30 ⇒Surface tension x width of bank 30 (a-2): Approximate calculation of the volume of the solution spilling from the bank 30 in the solution film 31 ⇒ (liquid weight x gravitational acceleration) x slope of bank 30 (sinθ) Liquid weight: Volume (V) x Density (D)

[0073] Regarding b, since the substrate is loaded over the entire hand 92, it is assumed to be an evenly distributed load, and since the hand 92 is attached to the tip of the arm 91 of the transport robot 1, it is assumed to be a cantilever beam, and the tilt angle θ of the hand 92 due to the deflection of the hand 92 when the arm 91 moves forward is calculated using the following equation (1).

number

[0074] If a>b does not hold, it is necessary to provide a mechanism for lifting the tip 922 of the hand 92 of the transfer robot 1 to correct the posture of the hand 92.

[0075] [Second embodiment] The second embodiment will be described. Below, elements with the same reference symbols as those in the first embodiment will have substantially the same configurations and functions as those described in the first embodiment unless otherwise specified, and differences from the first embodiment will be mainly described.

[0076] Fig. 8(a) is a schematic side view of a portion of the configuration of a substrate processing system 1000A according to a second embodiment. Fig. 8(a) shows a cross section of a portion of the configuration of the substrate processing system 1000A along an imaginary plane parallel to the YZ plane. Fig. 8(b) is a plan view of a portion of the configuration of the substrate processing system 1000A according to the second embodiment. Fig. 8(b) shows a portion of the configuration of the substrate processing system 1000A as viewed in the direction of arrow VIIIB (i.e., the negative direction of the Z axis) from the position shown in Fig. 8(a).

[0077] Fig. 9(a) is a schematic side view of a portion of the configuration of a substrate processing system 1000A according to a second embodiment. Fig. 9(a) shows a cross section of a portion of the configuration of the substrate processing system 1000A along an imaginary plane parallel to the YZ plane. Fig. 9(b) is a plan view of a portion of the configuration of the substrate processing system 1000A according to the second embodiment. Fig. 9(b) shows a portion of the configuration of the substrate processing system 1000A as viewed in the direction of arrow IXB (i.e., the negative direction of the Z axis) from the position shown in Fig. 9(a).

[0078] 8(a) and 8(b) show a state in which the holding pin 71 is retracted to the retracted position P2, and Fig. 9(a) and 9(b) show a state in which the holding pin 71 is protruding to the protruding position P1.

[0079] In the substrate processing system 1000A of the second embodiment, the magnet 5 is fixedly disposed on the upper surface 61 of the substrate holder 6, and the moving mechanism 80 is omitted. The magnet 4 is disposed offset in the X direction so as not to overlap the substrate S held by the hand 92 in the Z direction. The magnet 5 is fixedly disposed on the upper surface 61 of the substrate holder 6 at a position where it does not interfere with the substrate S placed on the upper surface 61. That is, like the magnet 4, the magnet 5 is also disposed offset in the X direction. As shown in FIGS. 8(b) and 9(b), the magnet 5 overlaps the magnet 4 when viewed in the Z direction. This allows the depth of the processing chamber SP1 in the Y direction to be reduced, thereby reducing the cost and weight of the substrate processing system 1000A.

[0080] 10 is a flowchart of the control method according to the second embodiment. In steps S101 and S104, there is no need to move the magnet 5, so once the substrate S is received by the holding pins 7 and the hand 92 of the transfer robot 1 leaves the processing chamber SP1, the holding pins 7 can be immediately lowered, thereby suitably shortening the processing time (takt time).

[0081] [Embodiment of manufacturing method of article] The method for manufacturing an article according to an embodiment of the present disclosure is suitable for manufacturing an article such as an organic light-emitting diode (OLED) panel using the substrate processing system 1000 or 1000A. The method for manufacturing an article according to this embodiment includes a step (coating step) of depositing or applying a solution film (a solution containing a solute and a solvent for forming an organic film) on a substrate by a printing method using an inkjet printing device or the like to obtain a coated substrate. It also includes a step (drying step) of drying the solution film on the coated substrate using the substrate processing system 1000 or 1000A to obtain a dry substrate on which a dry film has been formed. Furthermore, this manufacturing method includes other well-known steps (such as baking, cooling, dehumidification, dry cleaning, electrode formation, and sealing film formation). The method for manufacturing an article according to this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0082] [Other variations] The present disclosure is not limited to the above-described embodiments, and many modifications of the embodiments are possible within the technical concept of the present disclosure. For example, at least two of the above-described embodiments and modifications may be combined. Furthermore, the effects described in the present embodiments are merely a list of the most preferable effects resulting from the embodiments of the present disclosure, and the effects of the embodiments of the present disclosure are not limited to those described in the present embodiments.

[0083] In the above description, the liquid is a solution containing a solvent and a solute, but the liquid is not limited to this and may be a liquid that does not contain a solute.

[0084] In the above description, the substrate processing system has been described as having one transfer robot, but the present invention is not limited to this. For example, the substrate processing system may have multiple transfer robots. In this case, each of the multiple transfer robots may be configured to perform at least one of the following operations: loading a substrate into a processing chamber and unloading a substrate from a processing chamber.

[0085] In the above description, the arm 91 is a SCARA, but the present invention is not limited to this. Various robot arms can be used as the arm of the transport robot, such as a horizontal articulated arm, a parallel link arm, or an orthogonal robot.

[0086] The disclosure of the above embodiments includes the following sections.

[0087] (Section 1) a processing apparatus having a processing chamber for processing a substrate to which a liquid has been applied; a transfer robot that performs at least one of an operation of loading the substrate into the processing chamber and an operation of unloading the substrate from the processing chamber, the transport robot has an arm capable of bending and stretching, a hand connected to the arm and configured to hold the substrate, and a first magnet disposed in the hand; the processing device has a second magnet; the second magnet is disposed in the processing chamber such that, when the hand of the transport robot has entered the processing chamber, a force acts on the hand in a direction opposite to the direction of gravity due to a repulsive force between the first magnet and the second magnet. A substrate processing system comprising:

[0088] (Section 2) the hand supports the substrate and holds the substrate; Item 1. A substrate processing system according to item 1.

[0089] (Section 3) The processing device includes: a substrate holding part having a substrate holding surface on which the substrate is placed; a plurality of holding pins movable between a first position where the holding pins protrude upward relative to the substrate holding surface to enable the transfer of the substrate between the transfer robot and the substrate, and a second position where the holding pins retract downward relative to the substrate holding surface; the second magnet is disposed at a position where it does not overlap with the plurality of holding pins in a direction perpendicular to the substrate holding surface. 3. The substrate processing system according to item 1 or 2,

[0090] (Section 4) the second magnet is movable on the substrate holding surface; the processing device further includes a moving mechanism that moves the second magnet between a third position where the second magnet overlaps the substrate in a direction perpendicular to the substrate holding surface and a fourth position where the second magnet retreats from the third position. Item 4. A substrate processing system according to item 3.

[0091] (Section 5) the second magnet is fixedly disposed on the substrate holding surface at a position where it does not interfere with the substrate placed on the substrate holding surface. Item 4. A substrate processing system according to item 3.

[0092] (Section 6) The first magnet is a permanent magnet and the second magnet is an electromagnet. 6. The substrate processing system according to any one of items 1 to 5,

[0093] (Section 7) Further comprising a control unit, the control unit causes the hand to enter the processing chamber, acquires position information of the hand when the hand enters the processing chamber, and determines a current to be applied to the second magnet based on the position information. Item 7. A substrate processing system according to item 6, characterized in that:

[0094] (Section 8) the hand holds the substrate so that a direction from a base end to a tip end of the hand is parallel to a direction in which a long side of the substrate extends. 8. The substrate processing system according to any one of items 1 to 7, characterized in that:

[0095] (Section 9) The length of the first magnet in the longitudinal direction is longer than the long side of the substrate. 9. The substrate processing system according to any one of items 1 to 8, characterized in that:

[0096] (Section 10) The substrate has a plurality of recesses into which a liquid is applied. 10. The substrate processing system according to any one of items 1 to 9, characterized in that:

[0097] (Section 11) Each of the plurality of recesses is a linear recess extending in a longitudinal direction parallel to a direction in which a long side of the substrate extends. Item 11. A substrate processing system according to item 10.

[0098] (Section 12) The longitudinal length of each of the plurality of recesses is 32 inches or greater. Item 12. A substrate processing system according to item 11.

[0099] (Section 13) the processing device performs a drying process to dry the liquid applied to the substrate; 13. The substrate processing system according to any one of items 1 to 12, characterized in that:

[0100] (Section 14) The arm is capable of pivoting, the processing device is a first processing device; Further, a second processing device is provided for applying a liquid to the substrate. when the transfer robot acquires the substrate to which the liquid has been applied by the second treatment device, the arm rotates in a bent position, and then extends the arm to transfer the substrate to the treatment chamber. 14. The substrate processing system according to any one of items 1 to 13,

[0101] (Section 15) Item 15. A method for processing a substrate using the substrate processing system according to any one of items 1 to 14. A method for manufacturing an article. [Explanation of symbols]

[0102] 1...Transfer robot, 4...Magnet (first magnet), 5...Magnet (second magnet), 10...Coating device (second processing device), 12...Drying device (processing device, first processing device), 91...Arm, 92...Hand, 1000...Substrate processing system

Claims

1. a processing apparatus having a processing chamber for processing a substrate to which a liquid has been applied; a transfer robot that performs at least one of an operation of loading the substrate into the processing chamber and an operation of unloading the substrate from the processing chamber, the transport robot includes an arm capable of bending and stretching, a hand connected to the arm and configured to hold the substrate, and a first magnet disposed in the hand; the processing device has a second magnet; the second magnet is disposed in the processing chamber such that, when the hand of the transport robot has entered the processing chamber, a force acts on the hand in a direction opposite to a direction of gravity due to a repulsive force between the first magnet and the second magnet. A substrate processing system comprising:

2. the hand supports the substrate and holds the substrate; The substrate processing system according to claim 1 .

3. The processing device includes: a substrate holding part having a substrate holding surface on which the substrate is placed; a plurality of holding pins movable between a first position where the holding pins protrude upward relative to the substrate holding surface to enable the transfer of the substrate between the transfer robot and the substrate, and a second position where the holding pins retract downward relative to the substrate holding surface; the second magnet is disposed at a position where it does not overlap with the plurality of holding pins in a direction perpendicular to the substrate holding surface. The substrate processing system according to claim 1 .

4. the second magnet is movable on the substrate holding surface; the processing apparatus further includes a moving mechanism that moves the second magnet between a third position where the second magnet overlaps the substrate in a direction perpendicular to the substrate holding surface and a fourth position where the second magnet retreats from the third position.

4. The substrate processing system according to claim 3.

5. the second magnet is fixedly disposed on the substrate holding surface at a position where it does not interfere with the substrate placed on the substrate holding surface.

4. The substrate processing system according to claim 3.

6. The first magnet is a permanent magnet and the second magnet is an electromagnet. The substrate processing system according to claim 1 .

7. Further comprising a control unit, the control unit causes the hand to enter the processing chamber, acquires position information of the hand when the hand enters the processing chamber, and determines a current to be applied to the second magnet based on the position information.

7. The substrate processing system according to claim 6.

8. the hand holds the substrate so that a direction from a base end to a tip end of the hand is parallel to a direction in which a long side of the substrate extends. The substrate processing system according to claim 1 .

9. The length of the first magnet in the longitudinal direction is longer than the long side of the substrate. The substrate processing system according to claim 1 .

10. The substrate has a plurality of recesses into which a liquid is applied. The substrate processing system according to claim 1 .

11. Each of the plurality of recesses is a linear recess extending in a longitudinal direction parallel to a direction in which a long side of the substrate extends. The substrate processing system according to claim 10 .

12. the longitudinal length of each of the plurality of recesses is 32 inches or greater; The substrate processing system according to claim 11 .

13. the processing device performs a drying process to dry the liquid applied to the substrate; The substrate processing system according to claim 1 .

14. The arm is capable of pivoting, the processing device is a first processing device; a second processing device for applying a liquid to the substrate; when the transfer robot acquires the substrate to which the liquid has been applied by the second treatment device, the arm rotates in a bent position, and then extends the arm to transfer the substrate to the treatment chamber. The substrate processing system according to claim 1 .

15. processing a substrate using the substrate processing system of any one of claims 1 to 14, A method for manufacturing an article.

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