Peeling apparatus, peeling system, and peeling method

Abstract

To provide a peeling device, a peeling system, and a peeling method capable of efficiently peeling an adhesive member.SOLUTION: The peeling device 20 includes a peeling unit 26 located in an object including a plurality of bonded members 51 and 52 bonded by an adhesive member 53, and a control unit 21. The peeling unit 26 is configured to be operable to peel off the adhesive member 53 by acting on the adhesive member 53. The terminal 21 activates the peeling unit 26 based on the peeling instruction received from the control device 10 located outside the object.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a stripping device, a stripping system, and a stripping method. [Background technology]

[0002] BACKGROUND ART Conventionally, a method has been known in which a dismantlable adhesive member that has been given heat melting or heat decomposition properties is dismantled by heating with electromagnetic induction or microwaves (see, for example, Non-Patent Document 1). [Prior art documents] [Non-patent literature]

[0003] [Non-Patent Document 1] Tetsuo Kurashiki, "Current status of adhesive bonding considering dismantling and its application to FRP adhesive bonding", Journal of the Adhesion Society of Japan, Vol. 54, No. 11 (2018), pp. 397-401 Summary of the Invention [Problem to be solved by the invention]

[0004] When adhesive members are heated to dismantle or separate the object, the entire object must be heated in order to heat the adhesive members inside the object. In this case, the energy used to heat parts other than the adhesive members is wasted, or the heating may cause adverse effects such as deterioration of parts other than the adhesive members. Therefore, it is necessary to efficiently peel off the adhesive members.

[0005] The present disclosure has been made in view of the above-mentioned points, and an object of the present disclosure is to provide a peeling device, a peeling system, and a peeling method that can efficiently peel adhesive members. [Means for solving the problem]

[0006] (1) According to some embodiments, a peeling device includes one or more peeling units located within an object including a plurality of bonded members bonded together by adhesive members, and a control unit. The peeling units are configured to operate to peel the adhesive members by acting on the adhesive members. The control unit activates the peeling units based on a peeling instruction received from a terminal device located outside the object.

[0007] (2) In the peeling device described in (1) above, the peeling unit may include a container that contains a solvent capable of dissolving the adhesive member, and an actuator that releases the solvent from the container.

[0008] (3) In the peeling device described in (1) or (2) above, the peeling section may include a heat source that applies heat to the adhesive member.

[0009] (4) In the peeling device according to any one of (1) to (3) above, the peeling section may include a light source that irradiates the adhesive member with light.

[0010] The peeling device applies a solvent, heat, or light to the adhesive material within the object using the peeling section, thereby efficiently peeling off the adhesive material and efficiently dismantling the object to be dismantled.

[0011] (5) In the peeling device described in any one of (1) to (4) above, the control unit may receive authentication information from the terminal device and enable the peeling unit to be activated if authentication using the authentication information is successful.

[0012] (6) The peeling device described in (5) above may include a memory. The control unit may determine that authentication using the authentication information has been successful if information previously stored in the memory matches the authentication information.

[0013] By activating the peeling unit when the peeling device has successfully authenticated the object, it is possible to prevent the object from being unintentionally dismantled. For example, this prevents unauthorized dismantling by a malicious third party. As a result, security regarding dismantling is improved.

[0014] (7) The peeling device according to any one of (1) to (6) above may be separated into a parent unit including the control unit and a child unit including the one or more peeling units.

[0015] By separating the parent unit and the child unit, the peeling device can be arranged in various ways, thereby improving the convenience of the peeling system.

[0016] (8) A peeling system according to some embodiments includes one or more peeling devices and a terminal device that wirelessly supplies power to the one or more peeling devices and transmits peeling instructions to the one or more peeling devices. The peeling devices include one or more peeling units located within an object including a plurality of bonded members bonded together by an adhesive member, and a control unit. The peeling units are configured to be operable to peel the object by acting on the adhesive members. The control unit activates the peeling units based on peeling instructions wirelessly received from a transmitting device located outside the object.

[0017] (9) In the peeling system described in (8) above, the terminal device may transmit authentication information to the plurality of peeling devices. The control unit may enable activation of the peeling unit when authentication using the authentication information is successful. The authentication information may be information that allows authentication to be successful only in some of the plurality of peeling devices.

[0018] (10) In some embodiments, a peeling method includes activating a peeling unit located within an object including a plurality of bonded members bonded by an adhesive member and configured to operate to peel the object by acting on the adhesive member, based on a peeling instruction received from a terminal device located outside the object.

[0019] (11) In the step of activating the peeling unit of the peeling method described in (10) above, authentication information may be received from the terminal device, and the peeling unit may be made activatable if authentication using the authentication information is successful. [Effects of the Invention]

[0020] According to the present disclosure, a peeling device, a peeling system, and a peeling method that can efficiently peel adhesive members are provided. [Brief explanation of the drawings]

[0021] [Figure 1A] FIG. 10 is a schematic diagram showing a peeling method by heating according to a comparative example. [Figure 1B] FIG. 10 is a schematic diagram showing a peeling method using a solvent according to a comparative example. [Figure 2] 1 is a block diagram illustrating an example configuration of a peeling system according to the present disclosure. [Figure 3] 1 is a schematic diagram illustrating an example of the arrangement of a peeling system according to the present disclosure. FIG. [Figure 4] 1 is a flowchart showing an example of a procedure for a peeling method according to the present disclosure. [Figure 5] FIG. 10 is a block diagram showing an example of a configuration in which a peeling device is separated into a parent device and a child device. [Figure 6] FIG. 2 is a schematic diagram illustrating an example of the arrangement of a parent unit and a child unit of a peeling device. DETAILED DESCRIPTION OF THE INVENTION

[0022] (Comparative Example) In order to disassemble the components bonded with the adhesive member, the adhesive member must be peeled off.

[0023] When the adhesive member is made of a material that softens when heated, or when the adhesive member contains a thermal expansion material such as microcapsules or a foaming agent that expands when heated, it is possible to heat the components to be dismantled to peel off the adhesive member and dismantle them. As a first comparative example, as shown in FIG. 1A , assume a case in which bonded components 91 and 92 are bonded together by adhesive member 93 containing microcapsules 94 that expand when heated. In this case, microcapsules 94 expand when the components to be dismantled are heated. The expansion of microcapsules 94 causes the layer of adhesive member 93 to expand and peel off from bonded components 91 and 92, resulting in the dismantling of the components including bonded components 91 and 92.

[0024] However, when the entire components to be disassembled are heated in order to heat the adhesive member 93, the larger the components are, the more heat energy is wasted.

[0025] If the adhesive members are made of a material that dissolves in a solvent, it is possible to apply the solvent to the adhesive members to peel them off and disassemble them. As a second comparative example, as shown in Figure 1B, applying solvent 95 to a layer of adhesive member 93 between adherend members 91 and 92 peels adhesive member 93, and adherend members 91 and 92 are disassembled.

[0026] However, if the components are configured to be disassembled by peeling off the adhesive member 93 with a solvent, it is necessary to gradually dissolve the adhesive member 93 by applying the solvent from the edge of the adhesive member 93, which takes time and also increases the amount of solvent that is wasted.

[0027] As described above, the peeling method according to the comparative example wastes heat energy or solvent, resulting in poor peeling efficiency. The present disclosure describes a peeling system 1 and a peeling device 20 (see FIG. 2 or FIG. 3, etc.) that can efficiently peel adhesive members, as well as a peeling method.

[0028] (Configuration example of peeling system 1) 2, a peeling system 1 according to the present disclosure includes a terminal device 10 and a peeling device 20. The terminal device 10 includes a terminal control unit 11, a communication antenna 12, a power supply antenna 13, and a display unit 14. The peeling device 20 includes a peeling control unit 21, a communication antenna 22, a power supply antenna 23, a memory 24, a battery 25, and a peeling unit 26.

[0029] The terminal control unit 11 and the peeling control unit 21 may be configured to include a processor such as a CPU (Central Processing Unit) or a dedicated circuit such as an FPGA (Field Programmable Gate Array). The terminal control unit 11 and the peeling control unit 21 may be configured to execute programs that realize various functions of the peeling system 1. The terminal control unit 11 or the peeling control unit 21 may also be simply referred to as a control unit.

[0030] The terminal control unit 11 or the peeling control unit 21 may include a memory unit. The memory unit may store various information used in the operation of the terminal control unit 11 or the peeling control unit 21, or programs for realizing the functions of the terminal control unit 11 or the peeling control unit 21. The memory unit may function as a work memory for the terminal control unit 11 or the peeling control unit 21. The memory unit may be configured as a semiconductor memory, for example. The memory unit may be configured separately from the terminal control unit 11 or the peeling control unit 21. The function of the memory unit of the peeling control unit 21 may be realized by the memory 24, which will be described later. The terminal control unit 11 or the peeling control unit 21 may include a clock or timer for recognizing the time, and may synchronize based on the time.

[0031] The communication antennas 12 and 22 are configured to transmit and receive radio waves at a frequency for communication between the terminal device 10 and the peeling device 20. When the terminal device 10 outputs information or data to the peeling device 20, the terminal control unit 11 modulates an electrical signal related to the information or data to be output to the peeling control unit 21 and transmits the modulated electrical signal from the communication antenna 12. The peeling control unit 21 demodulates the radio waves received by the communication antenna 22 to obtain the electrical signal related to the information or data from the terminal control unit 11. Conversely, when the peeling device 20 outputs information or data to the terminal device 10, the peeling control unit 21 modulates the electrical signal related to the information or data to be output to the terminal control unit 11 and transmits the modulated electrical signal from the communication antenna 22. The terminal control unit 11 demodulates the radio waves received by the communication antenna 12 to obtain the electrical signal related to the information or data from the peeling control unit 21. Although communication via radio waves has been described in this example, optical communication may also be used.

[0032] The terminal control unit 11 and the peeling control unit 21 may be configured to include a communication device for realizing communication via the communication antennas 12 and 22. The communication device may be a device based on a communication standard such as LAN (Local Area Network) or Bluetooth (registered trademark). The communication device is not limited to these communication standards and may be a device based on various other communication standards.

[0033] The power feeding antenna 13 is configured so that radio waves of a frequency for feeding power to the peeling device 20 can be transmitted from the terminal device 10. The power feeding antenna 23 is configured so that the peeling device 20 can receive radio waves of a frequency for feeding power from the terminal device 10. When feeding power from the terminal device 10 to the peeling device 20, the terminal control unit 11 transmits radio waves for feeding power from the power feeding antenna 13. The peeling control unit 21 converts the energy of the radio waves received by the power feeding antenna 23 into electric power, which is consumed by the peeling control unit 21 itself. The peeling control unit 21 also feeds power to the memory 24, the battery 25, or the peeling unit 26.

[0034] The communication frequency and the power feeding frequency may be set to the same value. The communication antenna 12 and the power feeding antenna 13 of the terminal device 10 may be a common antenna. The communication antenna 22 and the power feeding antenna 23 of the peeling device 20 may be a common antenna.

[0035] The peeling system 1 may not include the power feeding antennas 13 and 23. In this case, the peeling device 20 operates using power stored in the battery 25. The peeling system 1 may not include the battery 25. In this case, the peeling device 20 operates using power fed to the power feeding antenna 23.

[0036] The display unit 14 of the terminal device 10 may include various displays such as a liquid crystal display. The terminal device 10 may also include an input device that accepts input from a user. The input device may include, for example, a keyboard or physical keys, or may include a touch panel, a touch sensor, or a pointing device such as a mouse. In the present disclosure, the display unit 14 is considered to be a touch panel integrated with the input device.

[0037] The memory 24 of the peeling device 20 stores information used to verify whether an instruction to operate the peeling unit 26 is correct when the peeling control unit 21 receives the instruction via the communication antenna 22. The memory 24 may be configured as, for example, a semiconductor memory. The memory 24 may also be configured integrally with the peeling control unit 21.

[0038] The battery 25 of the peeling device 20 is charged with power obtained by rectifying the power supply radio waves received by the power supply antenna 23 by the peeling control unit 21. The battery 25 supplies power to the peeling unit 26 by discharging. The battery 25 may also supply power to the peeling control unit 21 or the memory 24.

[0039] The peeling unit 26 of the peeling device 20 is configured to be operable to act on the adhesive member 53 (see FIG. 3 etc.) to peel off the adhesive member 53. The peeling unit 26 starts the operation of peeling off the adhesive member 53 in response to a control instruction from the peeling control unit 21.

[0040] When the adhesive member 53 is made of a material that can be dissolved by a solvent, the peeling unit 26 includes a container that contains a solvent that can dissolve the adhesive member 53, and an actuator that releases the solvent from the container and applies it to the adhesive member 53.

[0041] The peeling unit 26 may include a heat source when the adhesive member 53 is made of a material that decomposes or expands when heated. The heat source may include a heater. The heat source may include a material that generates heat through a chemical reaction and an actuator that starts the chemical reaction of the heat-generating material. The heat source may include a microwave source that emits microwaves at a frequency that vibrates the molecules of the adhesive member 53. The heat source is not limited to these examples and may be configured in various ways.

[0042] The peeling unit 26 may include a light source when the adhesive member 53 is made of a material that decomposes when irradiated with light such as UV light. The light source may include a lamp, an LED (Light Emitting Diode), an LD (Laser Diode), or the like.

[0043] (Example of operation of peeling system 1) As illustrated in FIG. 3 , in a component in which a bonded member 51 and a bonded member 52 are bonded with an adhesive member 53, the terminal device 10 is disposed outside the component. Meanwhile, the peeling device 20 is disposed inside the component. The number of peeling devices 20 may be one or more. When the component is to be dismantled, the peeling system 1 transmits radio waves from the terminal device 10 disposed outside the component, remotely controls the peeling device 20 disposed inside the component to start the peeling operation and peel off the adhesive member 53, thereby easily dismantling the object including the bonded members 51 and 52. The number of peeling devices 20 that can be remotely controlled by one terminal device 10 may be one or more. Two or more terminal devices 10 may each remotely control a peeling device 20 disposed inside the component. The combination of the terminal device 10 and the peeling device 20 may be identified by the frequency of the radio waves used for communication.

[0044] The peeling devices 20 may be arranged within the member so as to be in direct contact with the adhesive member 53. The peeling devices 20 may be arranged in a position surrounded by the adhesive member 53. The peeling devices 20 may be arranged between the adherend member 51 or 52 and the adhesive member 53. The spacing between the peeling devices 20 may be determined appropriately so that the adhesive member 53 is efficiently peeled off. When the peeling devices 20 peel the adhesive member 53 using a solvent, the spacing between the peeling devices 20 may be determined depending on the amount of solvent released by the peeling unit 26. When the peeling devices 20 peel the adhesive member 53 by heating, the spacing between the peeling devices 20 may be determined depending on the amount of heat generated by the peeling unit 26. When the peeling devices 20 peel the adhesive member 53 using light, the spacing between the peeling devices 20 may be determined depending on the amount of light emitted by the peeling unit 26.

[0045] The peeling device 20 may be arranged inside the member so as not to come into direct contact with the adhesive member 53. In the case where the peeling device 20 is arranged so as not to come into direct contact with the adhesive member 53, if the peeling unit 26 contains a solvent, a path may be provided through which the solvent reaches the adhesive member 53 from the peeling unit 26. If the peeling unit 26 contains a heat source, a material with high thermal conductivity may be arranged between the heat source and the adhesive member 53. If the peeling unit 26 contains a light source, a material with high light transmittance may be arranged between the light source and the adhesive member 53.

[0046] In the peeling system 1, the terminal control unit 11 of the terminal device 10 accepts input of operation instructions from a user via the touch panel of the display unit 14. The operation instructions may include an instruction to charge the battery 25. The operation instructions may include a peeling instruction to start the peeling device 20. The terminal device 10 accepts input of the peeling instruction as an operation instruction, and may also accept input of authentication information required to start the peeling device 20 or to enable start-up of the peeling unit 26.

[0047] When the terminal control unit 11 receives an input of an instruction to charge the battery 25 as an operation instruction, it causes the power feeding antenna 13 to transmit radio waves for power feeding. The peeling control unit 21 of the peeling device 20 receives the radio waves for power feeding at the power feeding antenna 23, rectifies the received radio waves, and charges the battery 25.

[0048] When the terminal control unit 11 receives a peeling instruction as an input operation instruction, it transmits radio waves for communication corresponding to the peeling instruction from the communication antenna 12. The peeling control unit 21 receives the radio waves for communication corresponding to the peeling instruction via the communication antenna 22 and acquires the peeling instruction. When the peeling control unit 21 can start the peeling unit 26 without authentication, it starts the peeling unit 26 in response to the peeling instruction and causes the peeling unit 26 to start the peeling operation. The peeling unit 26 may operate using at least one of power discharged from the battery 25 and power received by the power feeding antenna 23.

[0049] When the terminal control unit 11 receives input of authentication information, it transmits radio waves corresponding to the authentication information together with radio waves corresponding to the peeling instruction from the communication antenna 12. The peeling control unit 21 receives the radio waves corresponding to the authentication information via the communication antenna 22 and acquires the authentication information. When authentication is required to enable the peeling unit 26 to be activated, the peeling control unit 21 compares the acquired authentication information with information stored in the memory 24. When the acquired authentication information matches the authentication information stored in the memory 24, the peeling control unit 21 determines that the authentication has been successful, enables the peeling unit 26 to be activated, activates the peeling unit 26 in response to the peeling instruction, and causes the peeling unit 26 to start the peeling operation.

[0050] The peeling control unit 21 may compare the authentication information acquired from the terminal control unit 11 with information that has been pre-stored as the authentication information itself in the memory 24. The terminal control unit 11 may pre-store the same information as the information that has been pre-stored in the memory 24 in the storage unit, and transmit information read from the storage unit as the authentication information to the peeling control unit 21. In this case, the terminal control unit 11 does not need to accept input of authentication information.

[0051] <Example of peeling procedure> The peeling control unit 21 of the peeling device 20 may execute a peeling method including the exemplary steps of the flowchart shown in Fig. 4. The peeling method may be realized as a peeling program executed by a processor included in the peeling control unit 21. The peeling program may be stored in a non-transitory computer-readable medium.

[0052] The peeling control unit 21 receives a peeling instruction from the terminal control unit 11 of the terminal device 10 via the communication antenna 22 (step S1). The peeling control unit 21 determines whether authentication is required when executing the peeling instruction (step S2). If authentication is not required (step S2: NO), the peeling control unit 21 proceeds to the procedure of step S4.

[0053] If authentication is necessary (step S2: YES), the peeling control unit 21 performs the authentication and determines whether the authentication is successful (step S3). If the authentication is not successful (step S3: NO), that is, if the authentication fails, the peeling control unit 21 ends the execution of the flowchart in FIG. 4 without issuing a peeling instruction.

[0054] If the authentication is successful (step S3: YES) or if authentication is not required (step S2: NO), the peeling control unit 21 enables the peeling unit 26 and executes a peeling instruction to start the peeling unit 26 (step S4). After executing the procedure of step S4, the peeling control unit 21 ends the execution of the flowchart in FIG. 4.

[0055] (summary) As described above, according to the peeling system 1 of the present disclosure, the peeling device 20 located inside the object to be dismantled is remotely operated by the terminal device 10 outside the object. In this manner, a solvent, heat, light, or the like can be applied to the adhesive members 53 inside the object to be dismantled. As a result, the adhesive members 53 are efficiently peeled off, and the object to be dismantled is efficiently dismantled.

[0056] Furthermore, by enabling the peeling unit 26 to start when the peeling device 20 has successfully authenticated the object, it is possible to prevent the object from being unintentionally dismantled. For example, this prevents unauthorized dismantling by a malicious third party. As a result, security regarding dismantling is improved.

[0057] (Other embodiments) Other embodiments are described below.

[0058] <Separation of peeling device 20> As illustrated in Fig. 5, the peeling device 20 may be separated into a peeling device parent unit 201 and a peeling device child unit 202. The peeling device parent unit 201 includes a peeling control unit 21, a communication antenna 22, a power supply antenna 23, a memory 24, a battery 25, and a parent unit communication unit 27. The peeling device child unit 202 includes a peeling unit 26 and a child unit communication unit 28. The peeling device parent unit 201 is also simply referred to as a parent unit. The peeling device child unit 202 is also simply referred to as a child unit. The number of child units connected to one parent unit may be one or more.

[0059] The master device communication unit 27 and the slave device communication unit 28 are connected to each other via a wire so that they can communicate with each other. The master device communication unit 27 and the slave device communication unit 28 may also be connected to each other via a wireless network so that they can communicate with each other.

[0060] When the peeling device 20 is separated into a peeling device parent unit 201 and a peeling device child unit 202 as illustrated in FIG. 6 , the parent unit and the child unit are disposed within a member in which the bonded members 51 and 52 are bonded with the adhesive member 53. The child unit may be disposed in the same manner as the peeling device 20 illustrated in FIG. 3 . The child unit may be disposed within the member so as to be in direct contact with the adhesive member 53. The child unit may be disposed in a position surrounded by the adhesive member 53. The child unit may be disposed between the bonded members 51 or 52 and the adhesive member 53. The child unit may be disposed within the member so as not to be in direct contact with the adhesive member 53. The parent unit may be disposed within the member so as not to be in direct contact with the adhesive member 53 as illustrated in FIG. 6 , but may also be disposed within the adhesive member 53 or in a position so as to be in contact with the adhesive member 53.

[0061] On the other hand, even in this case, the terminal device 10 is placed outside the member. The peeling system 1 transmits radio waves from the terminal device 10 placed outside the member, remotely operates the parent device placed inside the member, and controls the child device from the parent device to cause the peeling unit 26 to start the peeling operation and peel off the adhesive member 53, thereby easily dismantling the adherend members 51 and 52.

[0062] As described above, by separating the peeling device 20 into the parent device and the child device, the peeling device 20 can be arranged in various modes, thereby improving the convenience of the peeling system 1.

[0063] Furthermore, when the number of slave units increases, the peeling control unit 21, communication antenna 22, power feeding antenna 23, memory 24, and battery 25 of the master unit are shared by the multiple slave units, thereby reducing the number of these components used.

[0064] <How to use the peeling device 20> When one terminal device 10 can communicate with multiple delamination devices 20, it may be configured to activate only some of the devices by setting different authentication information for some of the devices in the multiple delamination devices 20 from authentication information for the other devices. In other words, the multiple delamination devices 20 may be divided into two or more groups, and unique authentication information may be set for each group. In this way, one terminal device 10 can select and activate some of the devices from the multiple delamination devices 20. As a result, the convenience of dismantling work using the delamination system 1 is improved.

[0065] <Object to be demolished> The object to be dismantled may be configured to be difficult to dismantle by means other than activating the peeling device 20 inside the object. If the adhesive member 53 is to be peeled off using a solvent, the object may be configured so that the solvent cannot be applied to the adhesive member 53 from outside the object. If the adhesive member 53 is to be peeled off by heating, the object may be configured so that the adhesive member 53 is surrounded by an insulating member, for example, so that the temperature of the adhesive member 53 does not increase even when the object is heated from outside. In other words, by protecting the adhesive member 53 from peeling means from outside the object, the means for dismantling the object may be limited to activating the peeling device 20. By limiting the means for dismantling the object to activating the peeling device 20, it is possible to avoid situations where the object is unintentionally dismantled. For example, unauthorized dismantling by a malicious third party is prevented. As a result, security regarding dismantling is improved.

[0066] Furthermore, by protecting the adhesive member 53 from solvents or heat from outside the object, unintended damage to the object due to an increase in the environmental temperature of the object or solvents present in the object's environment is prevented.

[0067] The object to be demolished may be at least a part of a huge facility or equipment. In this case, it is difficult to peel the internal adhesive member 53 from the outside. By using the peeling system 1 according to the present disclosure, the convenience of the demolition work of the object from which the adhesive member 53 is difficult to peel from the outside is improved.

[0068] <Other examples of authentication information> A one-time password that changes according to the time may be used as the authentication information. When a one-time password is used as the authentication information, the peeling control unit 21 generates a one-time password according to the time that can be confirmed by a clock or timer based on a rule or algorithm for generating a one-time password, and compares it with the authentication information obtained from the terminal control unit 11. The peeling system 1 may further include a device that notifies the user of the one-time password. The terminal device 10 may generate a one-time password and transmit it to the peeling control unit 21 as authentication information. In this case, the terminal control unit 11 does not need to accept input of a one-time password as authentication information.

[0069] The above describes an embodiment of the present disclosure with reference to the drawings, but the specific configuration is not limited to this embodiment, and various modifications are also included within the scope that does not deviate from the spirit of the present disclosure. [Explanation of symbols]

[0070] 1 Peeling System 10 terminal device (11: terminal control unit, 12: communication antenna, 13: power supply antenna, 14: display unit) 20 Peeling device (21: Peeling control unit, 22: Communication antenna, 23: Power supply antenna, 24: Memory, 25: Battery, 26: Peeling unit) 201 Peeling device parent unit (27: Parent unit communication unit) 202 Peeling device slave (28: slave communication unit) 51, 52 Parts to be bonded 53 Adhesive materials

Claims

1. The method includes: one or more peeling units located within an object including a plurality of adherends adhered by an adhesive member; and a control unit; the peeling portion is configured to be operable to peel the adhesive member by acting on the adhesive member; The control unit activates the peeling unit based on a peeling instruction received from a terminal device located outside the object.

2. The peeling device according to claim 1 , wherein the peeling unit comprises: a container that contains a solvent capable of dissolving the adhesive member; and an actuator that releases the solvent from the container.

3. The peeling device according to claim 1 , wherein the peeling unit includes a heat source that applies heat to the adhesive member.

4. The peeling device according to claim 1 , wherein the peeling unit includes a light source that irradiates the adhesive member with light.

5. The peeling device according to claim 1 , wherein the control unit receives authentication information from the terminal device, and enables activation of the peeling unit when authentication using the authentication information is successful.

6. 6. The delamination device according to claim 5, further comprising a memory, wherein the control unit determines that authentication using the authentication information has been successful when information previously stored in the memory matches the authentication information.

7. The peeling device according to claim 1 , wherein the peeling device is separated into a parent unit including the control unit and a child unit including the one or more peeling units.

8. one or more peeling devices; and a terminal device that wirelessly supplies power to the one or more peeling devices and transmits a peeling instruction to the one or more peeling devices, the peeling device includes one or more peeling units located within an object including a plurality of bonded members bonded by an adhesive member, and a control unit; the peeling unit is configured to be operable to peel the object by acting on the adhesive member; The control unit activates the peeling unit based on a peeling instruction received wirelessly from a transmitting device located outside the object.

9. the terminal device transmits authentication information to the plurality of peeling devices; the control unit enables activation of the peeling unit when authentication using the authentication information is successful; The peeling system according to claim 8 , wherein the authentication information is information that allows authentication to be successful in only some of the plurality of peeling devices.

10. A peeling method comprising the step of activating a peeling unit located within an object including a plurality of adherends adhered by an adhesive member and configured to be operable to peel the object by acting on the adhesive member, based on a peeling instruction received from a terminal device located outside the object.

11. The peeling method according to claim 10 , wherein in the step of activating the peeling unit, authentication information is received from the terminal device, and the peeling unit is activated if authentication based on the authentication information is successful.

Images