Electrical connection device

Abstract

Since there is a difference in the amount of thermal expansion between the connection wiring board and the probe board, a positional deviation occurs between the terminals and the probes.SOLUTION: An electrical connecting apparatus according to the present invention is an electrical connecting apparatus for electrically connecting an inspection device and an object to be inspected by bringing an electrode terminal of the object to be inspected and an electrical contactor into electrical contact with each other, the electrical connecting apparatus including a wiring board for wiring connection with the inspection device side, a contactor board having a plurality of electrical contactors for electrical contact with the electrode terminal of the object to be inspected, a connection wiring board having a connection terminal connected to a distal end of the electrical contactor and electrically connected to the wiring board, and a cooling unit for lowering a temperature of the connection wiring board.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electrical connection device, and can be applied to, for example, an electrical connection device used in electrical testing to check the electrical characteristics of semiconductor integrated circuits (hereinafter also referred to as "semiconductor devices") formed on a semiconductor wafer. [Background technology]

[0002] A probe card having a plurality of probes is used for electrical testing of semiconductor devices on a semiconductor wafer. The probe card is attached to a test head of a semiconductor testing device, and during testing, the probes of the probe card are brought into electrical contact with electrode terminals of the semiconductor device.

[0003] The semiconductor inspection equipment supplies an electrical signal to the semiconductor device via the probe, and the semiconductor device responds with a response signal via the probe to the semiconductor inspection equipment. The semiconductor inspection equipment then analyzes the electrical signal received from the semiconductor device to inspect the electrical characteristics of the semiconductor device.

[0004] The probe card includes a connection wiring board (for example, a space transformer) that electrically connects the probes to a wiring board that is connected to a tester.

[0005] The connection wiring boards are classified into inorganic boards made of ceramics or the like and organic boards made of synthetic resin or the like, and are used depending on the characteristics of the product (see Patent Document 1). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2020-35866 Summary of the Invention [Problem to be solved by the invention]

[0007] However, organic substrates have a large coefficient of thermal expansion, so when semiconductor devices are inspected in a high-temperature environment, the difference between the amount of thermal expansion of the organic substrate and the amount of thermal expansion of the probe substrate becomes large, resulting in misalignment of the probe relative to the terminals on the organic substrate.

[0008] Therefore, in view of the above-mentioned problems, the present invention aims to provide an electrical connection device that can reduce the difference in thermal expansion between the connection wiring board and the probe board by using a cooling element to lower the temperature of the connection wiring board, thereby suppressing misalignment between the terminals and the probes. [Means for solving the problem]

[0009] In order to solve such problems, the present invention provides an electrical connection device that electrically connects an inspection device and an object to be inspected by electrically contacting electrode terminals of the object to be inspected with electrical contactors, and is characterized by comprising a wiring board that is wired and connected to the inspection device, a contact board that has a plurality of electrical contactors with ends that can come into contact with the electrode terminals of the object to be inspected, a connection wiring board that has connection terminals that can be electrically connected to the wiring board, and a cooling unit that cools the connection wiring board. [Effects of the Invention]

[0010] According to the present invention, by lowering the temperature of the connection wiring board using a cooling element, the difference in the amount of thermal expansion between the connection wiring board and the probe board can be reduced, and misalignment between the terminals and the probes can be suppressed. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 2 is an exploded view showing the configuration of the electrical connecting device according to the embodiment. [Figure 2] FIG. 1 is a diagram illustrating a configuration of a prober according to an embodiment. [Figure 3] 5A and 5B are explanatory diagrams illustrating the positions of terminals of a connection wiring board and ends of probes according to the embodiment; [Figure 4] 1 is an explanatory diagram illustrating a cooling / heating structure of a cooling element according to an embodiment. FIG. [Figure 5] 10A and 10B are explanatory diagrams illustrating positional deviation of a probe caused by a difference in the amount of thermal expansion in an embodiment. [Figure 6] 10A and 10B are diagrams illustrating the amount of thermal expansion of a probe area of ​​a probe board and the amount of thermal expansion of a connection wiring board according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] (A) Main embodiment DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electrical connecting device according to the present invention will be described in detail below with reference to the drawings.

[0013] (A-1) Configuration of the electrical connection device Fig. 1 is an exploded view showing the configuration of an electrical connecting device according to an embodiment, and Fig. 2 is a configuration diagram showing the configuration of a prober according to an embodiment.

[0014] 2, the prober 1 according to the embodiment includes an electrical connecting device 10 and a wafer driving mechanism unit 80. The electrical connecting device 10 according to the embodiment also includes a support member 11, a wiring board 12, a cooling element 13 as a cooling unit, a connection wiring board 14, and a probe board 15.

[0015] Although each figure illustrates the main components, the present invention is not limited to the illustrated components and may actually include components not shown. In each figure, identical or corresponding components are denoted by the same or corresponding reference numerals. It should be noted that each figure is a schematic diagram, and the dimensions, thickness, etc. of each component may differ from the actual components. Furthermore, the dimensions and proportions of corresponding components may differ between drawings. The following embodiments are intended to exemplify devices and methods for embodying the technical ideas of the present disclosure, and are not intended to limit the materials, shapes, structures, arrangements, etc. of the components of the present disclosure.

[0016] [Tester TE] The tester TE is a semiconductor testing device that tests the electrical characteristics of the device under test 83. The tester TE is connected to a prober 1 equipped with an electrical connection device 10, and when testing the device under test 83, it sends and receives electrical signals through the prober 1 to test it.

[0017] [Prober 1] The prober 1 is connected to a tester TE and is equipped with an electrical connecting device 10 having probes (also called "electrical contactors") 151, and is used to inspect the electrical characteristics of a device under test 83. The prober 1 aligns the probes 151 with the electrode terminals 84 of the device under test 83, brings the probes 151 into contact with the electrode terminals 84, moves the device under test 83, and performs other operations.

[0018] [Subject 83] The object under test 83 is, for example, a semiconductor integrated circuit formed on a semiconductor wafer before dicing. The object under test 83 has a large number of transistors, such as a semiconductor integrated circuit (IC chip device).

[0019] The object under test 83 is placed and fixed on the upper surface of a chuck 82 connected to a driving unit 81 such as a multi-axis stage. The position of the object under test 83 on the chuck 82 can be adjusted by driving the driving unit 81. During testing, the object under test 83 on the chuck 82 and the probes 151 of the electrical connecting device 10 are brought relatively close to each other so that each electrode terminal 84 of the object under test 83 and the corresponding probe 151 come into electrical contact.

[0020] The chuck 82 has a temperature adjustment function for adjusting the temperature of the semiconductor wafer, and is capable of handling high-temperature tests at 150° C. or higher and low-temperature tests at −20° C. or lower, for example.

[0021] [Electrical connection device 10] The electrical connection device 10 is attached to the test header of the prober 1, and transmits and receives electrical signals between the tester TE and the device under test 83. The electrical connection device 10 has a plurality of probes (also called "electrical contactors") 151, and during testing, electrically connects the tester TE and the device under test 83 by electrically contacting the corresponding electrical contactors with the electrode terminals 84 of the device under test 83. A probe card, for example, can be used as the electrical connection device 10.

[0022] During testing, the electrical connection device 10 supplies electrical signals from the tester TE to the electrode terminals 84 of the device under test 83 via the electrical contacts, and also supplies electrical signals from the device under test 83 to the tester TE via the electrical contacts.

[0023] As shown in FIG. 1, when the components of the electrical connecting device 10 are assembled and disassembled, they include, in order from top to bottom in the Z-axis direction, a support member 11, a cooling element 13, a wiring board 12, a connection wiring board 14, and a probe board 15.

[0024] [Wiring board 12] The wiring board 12 is electrically connected to the test head and is also electrically connected to the connection wiring board 14 on the side of the probe 151. The wiring board 12 is a substantially circular plate-shaped printed circuit board made of a synthetic resin material such as polyimide.

[0025] Wiring and terminals for electrically connecting to the test head, as well as electronic components such as resistors and capacitors, are provided on a first surface (e.g., the top surface) of the wiring board 12. Wiring and terminals for connecting to the connection wiring board 14 are formed on a second surface (e.g., the bottom surface) of the wiring board 12. The outer edge of the wiring board 12 is provided with a plurality of tester connection parts (not shown) for connecting to the electrical circuit of the tester TE, and each tester connection part is connected to a printed wiring on the wiring board 12.

[0026] For example, wiring board 12 has a plurality of through holes that allow electrical continuity between the first surface and the second surface. Also, as illustrated in Fig. 2, wiring board 12 has a plurality of conductive connectors 16, and each conductive connector 16 is connected to a terminal 23 of wiring board 12 and a terminal 24 of connection wiring board 14 to allow electrical continuity.

[0027] In this example, the conductive connector 16 is a pogo pin formed to be elastically deformable in the Z-axis direction, but is not limited to this, and a wide range of connectors, such as conductive rods or plates, can be used.

[0028] 1, an opening 121 is formed in the center of wiring board 12, and cooling element 13 is provided in opening 121. In addition, a support member 11 is provided in the center of wiring board 12 on the first surface side of wiring board 12.

[0029] It is desirable that the shape of the opening 121 of the wiring substrate 12 corresponds to the shape of the cooling element 13. For example, if the cooling element 13 is cylindrical, the shape of the opening 121 may be circular. It is also desirable that the size of the opening 121 is slightly larger than the size of the cooling element 13.

[0030] [Connection wiring board 14] The connection wiring board 14 is a board that electrically connects the wiring board 12 and each probe 151 of the probe board 15, and is also called a probe head. The connection wiring board 14 can be a multi-layer wiring board (MLO: Multi-Layer Organic) formed of an organic material such as resin.

[0031] The connection wiring board 14 has connection terminals 24 for the conductive connectors 16 on a first surface (for example, the upper surface) and is electrically connected to the wiring board 12 via the conductive connectors 16. The connection wiring board 4 also has connection terminals 141 on a second surface (for example, the lower surface) that can be connected to each of the multiple probes 151. During testing, electrical continuity is achieved by connecting the first ends (for example, upper ends) of the probes 151 to the connection terminals 141 of the connection wiring board 14.

[0032] FIG. 3 is an explanatory diagram illustrating the positions of the connection terminals 141 of the connection wiring board 14 and the ends of the probes 151 according to the embodiment.

[0033] 3, a plurality of connection terminals 141 are arranged on the second surface of the connection wiring board 14 at positions corresponding to the positions of the probes 151. During testing, first ends (e.g., upper ends) 1511 of the probes 151 are connected to the connection terminals 141 to enable conduction of the probes 151.

[0034] Furthermore, the first surface of the connection wiring board 14 is provided with the cooling element 13 via the connection terminal 25. As a result, during a high-temperature test, the temperature of the connection wiring board 14 itself is lowered by the cooling element 13, so that thermal expansion of the connection wiring board 14 is suppressed and misalignment between the terminals of the connection wiring board 14 and the probes 151 can be prevented. This will be described in detail later.

[0035] [Cooling element 13] Cooling element 13 lowers the temperature of connection wiring board 14 in order to suppress thermal expansion of connection wiring board 14. In other words, cooling element 13 is a cooling section that cools connection wiring board 14.

[0036] For example, a Peltier element can be used as cooling element 13, which performs electronic cooling. When a Peltier element is used as cooling element 13, cooling element 13 is placed on the first surface of connection wiring board 14 with its heat absorption surface (heat removal surface) facing connection wiring board 14 and its heat dissipation surface facing support member 11.

[0037] That is, cooling element 13 can lower the temperature of connection wiring board 14 by absorbing heat from connection wiring board 14 and dissipating the heat toward support member 11, which is farther from chuck 82, which is the heat source. As a result, during high-temperature testing, the difference in the amount of thermal expansion between connection wiring board 14 and probe board 15 is reduced, and misalignment between connection terminals 141 and probes 151 can be prevented.

[0038] A specific arrangement is illustrated below. For example, connection terminals 25 and a conductive cushion material 22 are arranged on the first surface of the connection wiring board 14, and the cooling element 13 is provided at the positions of the connection terminals 25 and the cushion material 22. The cooling element 13, which is generally rectangular in plan view, is housed in a generally rectangular opening 121 provided in the center of the wiring board 12, and the heat dissipation surface of the cooling element 13 is arranged on the support member 11 side. By arranging the cooling element 13 in this manner, heat is removed from the connection wiring board 14 and dissipated toward the support member 11 side. A paste-like or gel-like cushion material 21 with good conductivity is provided between the cooling element 13 and the support member 11.

[0039] Although this embodiment illustrates the use of a Peltier element, the cooling element 13 is not limited to a Peltier element, and any element that can cool the connection wiring board 14 to lower its temperature can be widely used.

[0040] Furthermore, cooling element 13 may be a Peltier module made up of a plurality of Peltier elements, which may be arranged in accordance with the arrangement of electrical connection terminals 141 of connection wiring board 14. For example, if electrical connection terminals 141 are arranged in a ring shape around the periphery of the front and back surfaces of connection wiring board 14, by arranging Peltier modules in a ring shape corresponding to this, it is possible to effectively cool the heat-generating parts of connection wiring board 14.

[0041] The cooling element 13 cools the connection wiring board 14, and its purpose is to cool the connection wiring board 14 to suppress thermal expansion. During high-temperature testing, terminals on the board made of metal may become hot and transfer the heat to the board. Therefore, the cooling target of the cooling element 13 is not limited to the connection wiring board 14, but the cooling target may also be the connection terminals 24 arranged between the connection wiring board 14 and the wiring board 12. In other words, the cooling element 13 may be a cooling unit that cools at least the connection wiring board 14 and the connection terminals 24 on the connection wiring board 14.

[0042] [Support member 11] Support member 11 is disposed in the center of a first surface (for example, an upper surface) of wiring board 12, and stabilizes the posture of wiring board 12. Support member 11 is a member also called a stiffener.

[0043] The support member 11 fixes the cooling element 13 housed in the opening 121 of the wiring board 12 and also suppresses deformation such as bending of the wiring board 12. The support member 11 is structured to easily dissipate heat emitted from the cooling element 13 to the outside.

[0044] For example, the support member 11 has an annular outer frame member 113, a cooling element fixing portion 111 in the center of the outer frame member 113, and four spokes 112 provided radially from the cooling element fixing portion 111 toward the outer frame member 113. Heat from the cooling element 13 can be radiated from spaces 114 formed between each spoke 112.

[0045] The outer frame member 113 is formed of an annular member with a rectangular cross section. The four spokes 112 are rod members that extend radially from each corner of the rectangular cooling element fixing portion 111 toward the outer frame member 113. The shape and number of the spokes 112 are not particularly limited.

[0046] In order to reliably fix the cooling element 13, the size of the cooling element fixing part 111 is slightly larger than the size of the cooling element 13. In the example of FIG. 1, the shape of the cooling element fixing part 111 in a plan view is illustrated as being approximately rectangular to match the shape of the cooling element 13. In other words, the cooling element fixing part 111 has a quadrangular prism shape. However, the shape of the cooling element fixing part 111 is not limited to this, and various shapes are possible.

[0047] Furthermore, the cooling element fixing portion 111 fixes the cooling element 13 with fixing portions such as screws. Note that the method for fixing the cooling element 13 is not limited to screws, and it may also be fixed with adhesive or the like.

[0048] [Probe board 15] The probe board 15 is a contactor board having a plurality of probes 151. In the probe board 15, the probes 151 are provided at positions corresponding to the positions of the electrode terminals 84 of the device under test 83.

[0049] A first end (e.g., an upper end) 1511 of the probe 151 is electrically connected to a connection terminal 141 provided on a second surface (e.g., a lower surface) of the connection wiring board 14. A second end (e.g., a lower end) of the probe 151 is electrically connected to an electrode terminal 84 of the device under test 83. This enables electrical connection between the tester TE and the device under test 83 via the probe 151 during testing.

[0050] The probe 151 may be either a vertical probe or a cantilever probe.

[0051] (A-2) Thermal Expansion Suppression Structure of the Connection Wiring Board 14 Next, a method for suppressing thermal expansion of the connection wiring board 14 in the embodiment will be described with reference to the drawings.

[0052] FIG. 4 is an explanatory diagram illustrating the structure of the cooling element 13 according to the embodiment.

[0053] As shown in FIG. 4, the cooling element 13 as a Peltier element has a terminal 32 for supplying a direct current and a terminal 33 for outputting the current that has flowed.

[0054] The cooling element 13 as a Peltier element is an element having an n-type semiconductor (indicated as "N" in FIG. 4), a p-type semiconductor (indicated as "P" in FIG. 4), and a metal electrode, and has the property that when a direct current is passed through it in a certain direction, it absorbs heat (cools) on one side of the element and dissipates heat on the other side.

[0055] 4, one surface (heat absorption surface) of cooling element 13 faces connection wiring board 14, and the other surface (heat dissipation surface) faces support member 11. This allows cooling element 13 to absorb heat from connection wiring board 14 on the heat source side and dissipate the heat to support member 11.

[0056] Furthermore, by arranging the cooling element 13 in the central portion 143 of the connection wiring board 14, the temperature of the entire surface of the connection wiring board 14 can be efficiently reduced.

[0057] Furthermore, by arranging the cooling element 13 in the center portion 143 of the connection wiring board 14, the load of the probe 151 can be supported at the center when the connection terminal 141 and the probe 151 are in contact with each other, thereby preventing deformation such as bending.

[0058] Furthermore, the cooling element 13 can be arranged near the terminals 24 provided on the connection wiring board 14, thereby efficiently lowering the temperature. For example, as illustrated in Figures 1 and 2, the terminals 24 are arranged on the first surface (e.g., the upper surface) of the connection wiring board 14 on which the cooling element 13 is arranged, and the area near the terminals 24 is likely to become hot and the temperature increases. Therefore, the cooling element 13 is arranged on the first surface of the connection wiring board 14, near the terminals 24.

[0059] For example, the cooling element 13 is preferably provided on the connection wiring board 14, and further preferably in an area other than the area where the connection terminals 24 of the connection wiring board 14 are arranged. That is, in this example, the cooling element 13 is preferably provided in the central portion 143 of the connection wiring board 14.

[0060] 5(A) and 5(B) are explanatory diagrams illustrating misalignment of the probe 151 caused by a difference in the amount of thermal expansion in an embodiment. Fig. 5(A) shows the alignment state of the probe 151 with respect to the connection terminal 141 of the connection wiring board 14 at room temperature, while Fig. 5(B) shows the alignment state of the probe 151 with respect to the connection terminal 141 at a high temperature of the semiconductor wafer of 150°C (the temperature of the connection wiring board 14 is 110°C).

[0061] When a high-temperature test is performed on the object under test 83, the object under test 83 is heated by the chuck 82 having a temperature adjustment function, and the temperature of the connection wiring board 14 located near the chuck 82, which is the heat source, also rises.

[0062] When the connection wiring board 14 is made of an organic material such as resin, the value of the thermal expansion coefficient of the connection wiring board 14 is larger than that of the probe board 15, and therefore the amount of thermal expansion of the connection wiring board 14 with an increase in temperature is larger than the amount of thermal expansion of the probe board 15. In a high-temperature test environment of the device under test 83, the difference in the thermal expansion coefficients of the connection wiring board 14 and the probe board 15 causes a more significant difference between the amount of thermal expansion of the connection wiring board 14 and the amount of thermal expansion of the probe board 15.

[0063] In the example of Figure 5(A), the distance between adjacent connection terminals 141 and the distance between adjacent probes 151 are each L, and the central axis P of the probe 151 is in a state where it can be well connected to approximately the center of the connection terminal 141 (in the figure, it is in a connected state).

[0064] 5(B), due to thermal expansion caused by a temperature rise of the components, connection terminal 141 of connection wiring board 14 moves by D1 from its original position, and probe 151 moves by D2 from its original position. That is, due to the difference in the thermal expansion coefficient between connection wiring board 14 and probe board 15, a gap occurs between the amount of movement D1 of connection terminal 141 of connection wiring board 14 and the amount of movement D2 of probe 151. In this state, central axis P of probe 151 is significantly misaligned with center P of connection terminal 141, making it difficult to properly connect probe 151 to connection terminal 141.

[0065] Therefore, in this embodiment, the difference in the amount of thermal expansion between the two components is reduced by using the cooling element 13 to absorb heat and lower the temperature of the connection wiring board 14.

[0066] An example of a process for lowering the temperature of the connection wiring board 14 using the cooling element 13 will be described below.

[0067] FIG. 6 is a graph showing the relationship between the amount of thermal expansion of the probe area of ​​the probe board 15 and the amount of thermal expansion of the connection wiring board 14 for each temperature according to the embodiment.

[0068] 6, the horizontal axis represents the probe area, i.e., the size of the area on the underside of the probe substrate 15 where the probes can be arranged, and the vertical axis represents the amount of thermal expansion. Fig. 6 shows the amount of expansion of each member when the temperature of the chuck 82 is changed from room temperature to 150°C. The larger the probe area, the greater the amount of thermal expansion in response to the temperature rise.

[0069] Result 6 shows the amount of thermal expansion of the probe substrate 15 during the high temperature test.

[0070] Results 1 to 5 show the amount of thermal expansion of the connection wiring board 14 for each temperature.

[0071] Result 1 shows the amount of thermal expansion for each probe area when the temperature of the connection wiring board 14 reaches 110°C during a high temperature test at 150°C.

[0072] Result 2 shows the amount of thermal expansion for each probe area when the temperature of the connection wiring board 14 is lowered by 10°C (-10°C), Result 3 shows the amount of thermal expansion when the temperature of the connection wiring board 14 is lowered by 20°C (-20°C), Result 4 shows the amount of thermal expansion when the temperature is lowered by 30°C (-30°C), and Result 5 shows the amount of thermal expansion when the temperature is lowered by 40°C (-40°C).

[0073] Results 1 to 5 show that as the temperature of the connection wiring board 14 decreases, the amount of thermal expansion decreases.

[0074] For example, when the probe area is 120 mm, the thermal expansion amount of the connection wiring board 14 is "approximately 65 um" according to result 1, whereas the thermal expansion amount of the probe head of the probe board 15 is "approximately 20 um" according to result 6, so the difference in the thermal expansion amount of the two boards is about "approximately 45 um".

[0075] Due to this relationship, by using the cooling element 13 to lower the temperature of the connection wiring board 14 by 40° C., the difference in the amount of thermal expansion between the connection wiring board 14 and the probe board 15 can be reduced.

[0076] For example, the amount of heat absorption by cooling element 13 changes depending on the value of the applied DC current. Therefore, the amount of heat absorption required to lower the temperature of connection wiring board 14 by 40°C is calculated and the operation of cooling element 13 is controlled. This makes it possible to lower the temperature of connection wiring board 14. Note that the heat dissipation surface of cooling element 13 is on the support member 11 side, so heat is dissipated to the support member 11 side.

[0077] In this way, the positional deviation of the probe 151 relative to the connection terminal 141 is suppressed, and the probe 151 can be positioned at the center of the connection terminal 141 of the connection wiring board 14 .

[0078] (A-3) Effects of the embodiment As described above, according to this embodiment, by using a cooling element to lower the temperature of the connection wiring board, the difference in the amount of thermal expansion between the connection wiring board and the probe board can be reduced, and misalignment between the terminals and the probes can be suppressed. [Explanation of symbols]

[0079] 1: prober, TE: tester, 10: electrical connection device, 11: support member, 12: wiring board, 13: cooling element, 14: connection wiring board, 15: probe board, 16: conductive connector, 21: cushion material, 22: cushion material, 23: terminal, 24: terminal, 25: connection terminal, 32: terminal, 33: terminal, 41: terminal, 141: terminal, 80: wafer drive mechanism, 81: drive unit, 82: chuck, 83: object under test, 84: electrode terminal, 111: cooling element fixing part, 112: spoke, 113: outer frame member, 121: opening, 151: probe.

Claims

1. An electrical connection device that electrically connects an electrode terminal of a device under test with an electrical contact to electrically connect a testing device and the device under test, a wiring board for wiring and connecting to the inspection device; a contactor substrate having a plurality of the electrical contactors each having an end capable of coming into contact with the electrode terminal of the device under test; a connection wiring board having connection terminals electrically connectable to the wiring board; a cooling unit that cools the connection wiring board; An electrical connecting device comprising:

2. 2. The electrical connecting device according to claim 1, wherein the cooling section is provided on the connection wiring board.

3. 3. The electrical connecting device according to claim 2, wherein the cooling section is provided in an area of ​​the connection wiring board excluding an area where the electrical connection terminals of the connection wiring board are arranged.

4. 2. The electrical connecting device according to claim 1, wherein the cooling section is provided in a central portion of the connection wiring board.

5. the wiring substrate has an opening, 2. The electrical connecting device according to claim 1, wherein the cooling portion is positioned in the opening of the wiring board.

6. 6. The electrical connecting device according to claim 5, wherein the opening is formed in the center of the wiring board.

7. 2. The electrical connecting device according to claim 1, wherein the cooling section is fixed by a support member provided on the wiring board.

8. 2. The electrical connecting device according to claim 1, wherein the cooling section has a Peltier element, and the heat absorbing surface of the Peltier element is provided facing the connection wiring board.

9. the connection wiring board has a terminal disposed between the connection wiring board and the wiring board; 2. The electrical connecting device according to claim 1, wherein the cooling section cools the terminals.

10. 9. The electrical connecting device according to claim 8, wherein the cooling unit is a Peltier module formed by the Peltier element, and the Peltier module is arranged in accordance with the arrangement of the electrical connection terminals of the connection wiring board.

11. 2. The electrical connection device according to claim 1, wherein the cooling section cools the connection wiring board, thereby enabling the electrical contact to be positioned approximately at the center of the connection terminal of the connection wiring board.

12. 2. The electrical connecting device according to claim 1, wherein the connecting wiring board is an organic board.

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