Current sensor having structure configured to improve hardening

Abstract

To provide a current sensing system.SOLUTION: The current sensing system can include a housing having a chamber configured to contain the epoxy, the housing further comprising a magnetic core having a gap configured to surround the chamber, and a spacer structure mechanically coupled to the magnetic core configured to stabilize the gap of the magnetic core. The current sensing system may further include a Hall sensing element contained within the chamber and surrounded by the epoxy. The spacer structure may be further configured to allow the epoxy to fully cure at a temperature at or above a predetermined threshold.SELECTED DRAWING: None

Description

[Technical Field]

[0001] SUMMARY OF THE INVENTION Embodiments of the present disclosure generally relate to current sensors having structures configured to improve cure. [Background technology]

[0002] For example, current sensors, such as Hall current sensors, are configured to measure current in various environments using a Hall sensing element. In some examples, the Hall current sensor includes a material configured to protect the Hall sensing element from contaminants. However, in some examples, the protective material may not sufficiently harden. Applicant has identified many technical challenges and difficulties associated with such current sensors. Through exerted effort, ingenuity, and innovation, many of these identified problems have been resolved by developing solutions included in embodiments of the present disclosure, many examples of which are described in detail herein. Summary of the Invention

[0003] Various exemplary embodiments described herein relate to vacuum pressure sensors and methods of making same.

[0004] According to various embodiments of the present disclosure, a system is provided, in some embodiments, the system includes a housing having a chamber configured to contain epoxy, the housing further includes a magnetic core having a gap configured to surround the chamber, a spacer structure mechanically coupled to the magnetic core configured to stabilize the gap of the magnetic core, and a Hall sensing element contained within the chamber and surrounded by the epoxy.

[0005] In some embodiments, the housing is constructed from plastic, and the housing comprises a first housing component and a second housing component.

[0006] In some embodiments, the magnetic core is configured in a C-shape.

[0007] In some embodiments, the spacer structure comprises at least one protruding feature configured to protect the epoxy from contaminants on the magnetic core, and the spacer structure is constructed from metal.

[0008] In some embodiments, the at least one protruding feature extends at least a portion of the height of the housing.

[0009] In some embodiments, the epoxy is configured to surround the Hall sensing element, and the epoxy is configured to protect the Hall sensing element from contaminants and temperatures up to, at, or above 125 degrees Celsius.

[0010] In some embodiments, the epoxy is configured to cure at 125 degrees Celsius or greater.

[0011] According to various embodiments of the present disclosure, an apparatus is provided, in some embodiments, the apparatus includes a housing having a chamber configured to contain an epoxy, a magnetic core having a gap configured to surround the chamber, and a spacer structure mechanically coupled to the magnetic core configured to stabilize the gap of the magnetic core.

[0012] In some embodiments, the housing is constructed from plastic, and the housing comprises a first housing component and a second housing component.

[0013] In some embodiments, the magnetic core is configured in a C-shape.

[0014] In some embodiments, the spacer structure comprises at least one protruding feature configured to protect the epoxy from contaminants on the magnetic core, and the spacer structure is constructed from metal.

[0015] In some embodiments, the at least one protruding feature extends at least a portion of the height of the housing.

[0016] In some embodiments, the epoxy is configured to surround the Hall sensing element, and the epoxy is configured to protect the Hall sensing element from contaminants and temperatures up to, at, or above 125 degrees Celsius.

[0017] In some embodiments, the epoxy is configured to cure at 125 degrees Celsius or greater.

[0018] According to various embodiments of the present disclosure, a method is provided, in some embodiments, the method includes configuring a housing having a chamber for containing epoxy, the housing including a first housing component and a second housing component, disposing a magnetic core within the housing having a gap configured to surround the chamber, and mechanically coupling a spacer structure to the magnetic core, the spacer structure configured to stabilize the gap of the magnetic core.

[0019] In some embodiments, the method further includes coupling a circuit board comprising at least one Hall sensing element to the housing such that the circuit board is proximate to the magnetic core, and coupling a coil winding to the housing such that the coil winding is proximate to the circuit board and the second housing component.

[0020] In some embodiments, the magnetic core is configured in a C-shape.

[0021] In some embodiments, the spacer structure comprises at least one protruding feature configured to protect the epoxy from contaminants on the magnetic core, and the spacer structure is constructed from metal.

[0022] In some embodiments, the at least one protruding feature extends at least a portion of the height of the housing.

[0023] In some embodiments, the epoxy is configured to surround the Hall sensing element, the epoxy is configured to protect the Hall sensing element from contaminants and temperatures up to or exceeding 125 degrees Celsius, and the epoxy is configured to cure at or above 125 degrees Celsius. [Brief explanation of the drawings]

[0024] The description of the illustrated embodiments may be read in conjunction with the accompanying figures. Unless otherwise noted, it will be understood that for simplicity and clarity of illustration, elements shown in the figures have not necessarily been drawn to scale. For example, unless otherwise noted, the dimensions of some of the elements may be exaggerated relative to other elements. Embodiments incorporating the teachings of the present disclosure are shown and described in connection with the figures presented herein. [Figure 1] FIG. 1 is a perspective view of an exemplary current sensor. [Figure 2] FIG. 2 is a perspective view of a housing of an exemplary current sensor. [Figure 3A] FIG. 1 is a perspective view of an exemplary magnetic core. [Figure 3B] 1 is a perspective view of an exemplary magnetic core and an exemplary spacer structure. [Figure 4A] 1 is a perspective view of an exemplary spacer structure. [Figure 4B] FIG. 10 is a bottom view of an exemplary spacer structure. [Figure 5] 1 is a cross-sectional view of an exemplary current sensor. [Figure 6] 1 is a series of perspective views of components of an exemplary current sensor; [Figure 7] 1 is a flowchart of an exemplary method for manufacturing a current sensor according to some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0025] Certain embodiments of the present disclosure will now be described in more detail below with reference to the accompanying drawings, in which some, but not all, embodiments of the disclosure are shown. Indeed, these disclosures may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. Like numbers refer to like elements throughout.

[0026] As used herein, terms such as "front," "rear," "top," "bottom," "left," "right," etc. are used for explanatory purposes to describe the relative positions of particular components or portions of components in the examples provided below. Additionally, as will be apparent to those skilled in the art in view of this disclosure, the terms "substantially" and "approximately" indicate that the referenced element or associated description is accurate to within applicable engineering tolerances.

[0027] As used herein, the term "comprising" means including but not limited to, and should be interpreted as typically used in patent contexts. The use of broader terms such as "comprises," "includes," and "having" should be understood to support narrower terms such as "consisting of," "consisting essentially of," and "comprised substantially of."

[0028] The phrases "in one embodiment," "according to one embodiment," "in some embodiments," and similar phrases generally mean that the particular feature, structure, or characteristic that follows the phrase may be included in at least one embodiment of the present disclosure, and may be included in more than one embodiment of the present disclosure (importantly, such phrases do not necessarily refer to the same embodiment).

[0029] The phrases "in one embodiment," "according to one embodiment," "in some embodiments," and similar phrases generally mean that the particular feature, structure, or characteristic that follows the phrase may be included in at least one embodiment of the present disclosure, and may be included in more than one embodiment of the present disclosure (importantly, such phrases do not necessarily refer to the same embodiment).

[0030] When a component or feature is described herein as being included or having a characteristic and "may," "can," "could," "should," "would," "preferably," "possibly," "typically," "optionally," "for example," "in one embodiment," "in some embodiments," "in many cases," or "might" (or other such phrases), that particular component or feature is not required to be included or have that characteristic. Such component or feature may be optionally included in or excluded from some embodiments.

[0031] As used herein, the word "example" or "exemplary" means "serving as an example, instance, or illustration." Any embodiment described herein as "example" or "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.

[0032] The terms "electrically coupled," "electrically coupled," "electrically coupled," "electrically connected," "electrically connecting," "electrically connecting," "communicate," or "electronically communicate" in this disclosure refer to two or more elements or components that are connected via wired and / or wireless means such that signals, voltage / current, data and / or information can be sent to and / or received from those elements or components.

[0033] In this disclosure, the term "in fluid communication with" refers to two or more elements or components that are connected via one or more pathways or passages such that a fluid or other flow medium can enter and / or exit those elements or components.

[0034] The term "component" may refer to an article, device, or apparatus that may comprise one or more surfaces, portions, layers, and / or elements. For example, an exemplary component may comprise one or more substrates that may provide an underlying layer(s) for the component, may form part of the substrate, and / or may comprise one or more elements disposed on the substrate. In this disclosure, the term "element" may refer to an article, device, or apparatus that may provide one or more functions.

[0035] The term "sensor" refers to a component that can detect, measure, and / or identify any one or more attributes or characteristics of an environment or medium, including, but not limited to, electrical current(s).

[0036] In some examples, current sensors that rely on Hall sensing elements are configured to measure current by measuring magnetic field strength and converting the magnetic field strength into an electrical output. For example, such current sensors may include a magnetic core configured to amplify the magnetic field strength. The current sensors may further include Hall sensing elements in one or more gaps in the magnetic core, suitable for various applications.

[0037] In some examples, the position of the Hall sensing element is dependent upon during measurement. In some examples, the Hall sensing element is vulnerable to humidity, stress, pressure, and the like. A protective material, such as epoxy, can be used to surround the Hall sensing element and protect it from various contaminants (e.g., moisture, air, and the like) and / or environmental influences (e.g., stress, pressure, and the like). For example, the accuracy of measurements performed by the Hall sensing element may be affected by various contaminants and / or environmental influences. However, using a protective material to surround the Hall sensing element may result in additional problems, such as the possibility of insufficient curing of the protective material, resulting in insufficient protection of the Hall sensing element. In some examples, high curing temperatures (e.g., above approximately 125 degrees Celsius) may damage the electrical components of the Hall sensing element. In other examples, low curing temperatures may not fully cure the material, resulting in insufficient protection of the Hall sensing element. In some examples, bubbles and / or air within the protective material may result in insufficient curing of the protective material. Contaminants, such as oil and / or dust, present on the magnetic core may further prevent the material from fully curing.

[0038] In some examples, embodiments of the present disclosure provide a current sensor having a structure configured to improve the curing of a material (e.g., an epoxy) surrounding a Hall sensing element. The current sensor may include a housing (e.g., a plastic housing) configured with one or more cavities, including (i) a first cavity configured to accommodate a magnetic core, (ii) a second cavity disposed within a gap defined by the shape of the magnetic core, and / or other cavities. The current sensor may include a magnetic core disposed within the first cavity of the housing, which may be C-shaped, substantially C-shaped, or curved through at least a portion of its structure. Because the Hall sensing element is sensitive to the size of the gap, the magnetic core may be mechanically coupled to a spacer structure configured to stabilize (e.g., maintain) the gap of the magnetic core. The spacer structure may be further configured to prevent oil, dust, etc. present on the magnetic core from contaminating the epoxy. The combined structure comprising the housing, magnetic core, and spacer structure may allow sufficient curing (e.g., full curing) of the epoxy at high temperatures (e.g., 125 degrees Celsius or higher) while protecting the Hall sensing element from heat.

[0039] As described herein, embodiments of the present disclosure provide, in some examples, methods for manufacturing current sensors having structures configured to improve stiffening.

[0040] To address challenges and limitations associated with current sensors and methods of manufacturing the same, various examples of the present disclosure may be provided. For example, various examples of the present disclosure may provide exemplary systems, devices, and / or methods for current sensors having structures configured to improve curing and / or manufacturing.

[0041] Referring now to FIG. 1 , a perspective view of an exemplary current sensor 100 is shown. The current sensor 100 may be a Hall current sensor including a Hall sensing element configured to measure magnetic field strength and convert the measurement into an electrical output representing a measurement of current. The current sensor 100 may comprise a housing 102, a chamber 104, a magnetic core 106, and a spacer structure 108. While the example of FIG. 1 shows one housing, one chamber, one magnetic core, and one spacer structure, any number of such components may be present in the current sensor.

[0042] The housing 102 may be constructed of plastic and / or other materials. In some examples, the housing 102 may include multiple housing components, such as, for example, a first housing component (e.g., a "bottom" housing component) and a second housing component (e.g., a "top" housing component). In the example of FIG. 1, only a first housing component, the so-called "bottom" housing component, is shown, but both a first housing component and a second housing component may be present within the housing of the current sensor. Exemplary methods of manufacturing and / or assembling the current sensor are further described herein with respect to FIG. 7.

[0043] The chamber 104 may be defined by the housing 102. For example, the housing 102 may define one or more cavities. The one or more cavities defined by the housing 102 may include a first cavity configured to accommodate the magnetic core 106 and / or a second cavity disposed within a gap defined by the shape of the magnetic core 106 (as described further herein). The chamber 104 may be the second cavity defined by the housing 102. The chamber 104 may be configured to include at least a portion of the Hall sensing element and / or a material (e.g., epoxy) surrounding at least a portion of the Hall sensing element. The material surrounding at least a portion of the Hall sensing element may fill at least a portion of the chamber 104.

[0044] The magnetic core 106 may be constructed of metal and / or other materials. The magnetic core 106 may be C-shaped, substantially C-shaped, curved through at least a portion of its structure, and / or the like. For example, the magnetic core 106 may be substantially circular and may include a gap that extends around at least a portion of the circumference of the magnetic core 106. The size of the gap may be adjustable to suit various applications. In some examples, a Hall sensing element is disposed within the gap of the magnetic core 106. The magnetic core 106 may be mechanically coupled to the housing 102 via a first cavity defined by the housing 102. For example, the magnetic core 106 may be snap-fit ​​into the first cavity defined by the housing 102.

[0045] The spacer structure 108 may be constructed from metal and / or other materials. In some examples, the spacer structure 108 is constructed from a rigid material so that it does not easily deform in response to applied force and / or pressure. The spacer structure 108 may be mechanically coupled to the magnetic core 106. For example, the spacer structure 108 may snap-fit ​​into a gap defined by the shape of the magnetic core 106. In some examples, the spacer structure 108 includes one or more protruding features (described further herein with respect to FIG. 4B ) configured to protect the material surrounding the Hall sensing element from contaminants. The spacer structure 108 may be further configured to stabilize the magnetic core 106 (e.g., to cause the gap defined by the shape of the magnetic core 106 to retain its size and / or shape) because the Hall sensing element may be sensitive to gap variations. In some examples, the spacer structure 108 is further configured to prevent air and / or bubbles from forming in the material surrounding the Hall sensing element.

[0046] The current sensor 100 may have a structure configured to improve the cure of a material (e.g., epoxy) surrounding the Hall sensing element and filling at least a portion of a chamber containing the Hall sensing element. The current sensor 100 may include a housing (e.g., housing 102) configured with one or more cavities, including (i) a first cavity configured to accommodate a magnetic core (e.g., magnetic core 106), (ii) a second cavity (e.g., chamber 104) disposed within a gap defined by the shape of the magnetic core, and / or other cavities. The current sensor 100 may include a substantially circular magnetic core including a gap, the substantially circular magnetic core disposed within the first cavity of the housing. The substantially circular magnetic core may be mechanically coupled to a spacer structure (e.g., spacer structure 108) configured to stabilize (e.g., maintain) the gap of the substantially circular magnetic core. The spacer structure may be further configured to prevent oil, dust, and / or the like present on the magnetic core from contaminating the material surrounding the Hall sensing element. The combined structure comprising the housing, the substantially circular magnetic core, and the spacer structure may surround the Hall sensing element while protecting the Hall sensing element from heat and allowing sufficient hardening (e.g., complete hardening) of the material filling at least a portion of the second cavity at high temperatures (e.g., above about 125 degrees Celsius).

[0047] 2, a perspective view of the housing 102 of the example current sensor 100 is shown. In some examples, the housing 102 may include multiple housing components, such as, for example, a first housing component (e.g., a "bottom" housing component) and a second housing component (e.g., a "top" housing component). In the example of FIG. 2, only the first housing component, the so-called "bottom" housing component, is shown, although both the first and second housing components may be present within the housing of the current sensor.

[0048] 2 shows a chamber 104. The chamber 104 may be defined by one or more walls (e.g., surfaces, planes, etc.) of the housing 102. In some examples, the chamber is rectangular, square, oval, and / or any other shape suitable for various applications. In some examples, the chamber 104 is configured to contain at least a portion of the Hall sensing element and / or a material surrounding at least a portion of the Hall sensing element.

[0049] The first cavity defined by the housing 102 may include the remainder of the periphery of the magnetic core 106 (e.g., excluding a portion of the periphery of the magnetic core 106 that defines the gap). In some examples, the first cavity defined by the housing is configured to accommodate the magnetic core 106.

[0050] 3A-3B show various views of the magnetic core 106. Referring now to FIG. 3A, a perspective view of an exemplary magnetic core is shown. The magnetic core 106 may be "C-shaped" such that it is substantially circular with a gap 300 that corresponds to a portion of the circumference of the magnetic core 106. The gap 300 may be adjustable to suit various applications. For example, a Hall sensing element may be sensitive to the size (e.g., width, length, height, etc.) of the gap 300.

[0051] 3B, a perspective view of an exemplary magnetic core and an exemplary spacer structure is provided. The magnetic core 106 may be coupled to the spacer structure 108. For example, the magnetic core 106 may be mechanically coupled to the spacer structure 108 so that they snap together (e.g., at least one portion of the spacer structure 108 fits into the gap 300 of the magnetic core 106).

[0052] 4A-4B show various views of the spacer structure 108. Referring now to FIG. 4A, a perspective view of an exemplary spacer structure is shown. The spacer structure 108 may comprise at least one side feature 400a,...,N (collectively "400"). The at least one side feature 400 may be configured to stabilize the magnetic core 106. For example, the at least one side feature may be configured to maintain the dimension of the gap 300.

[0053] 4B, a bottom view of an exemplary spacer structure 108 is shown. The spacer structure 108 may include at least one bending feature 402a,...,N (collectively "402"). The at least one bending feature 402 may be configured to prevent contaminants (e.g., oil, dust, etc.) from contaminating the material surrounding at least a portion of the Hall sensing element and filling at least a portion of the chamber 104. The at least one bending feature 402 may be further configured to extend only a portion of the height of the magnetic core so as not to interfere with operation of the current sensor.

[0054] 5, a cross-sectional view of an exemplary current sensor is shown. The exemplary current sensor may be current sensor 100. Current sensor 100 may include a housing 102 defining a chamber 104, a magnetic core 108, at least one bending feature 402 of spacer structure 108, a Hall sensing element 500, and a gap 502. In some examples, gap 502 is configured to extend only a portion of the height of the magnetic core such that at least one bending feature 402 does not interfere with operation of current sensor 100. For example, at least one bending feature 402 and Hall sensing element 500 may be configured such that gap 502 separates at least one bending feature 402 and Hall sensing element 500.

[0055] 6, a series of perspective views 600 of components of an exemplary current sensor are provided. The series of perspective views 600 show exploded views of an exemplary current sensor (e.g., current sensor 100). The series of perspective views 600 includes views 602, 604, 606, 608, and 610.

[0056] Diagram 602 shows a portion of the housing 102. The portion of the housing 102 shown in diagram 602 may be a second housing component (the "top" housing component). The second housing component may be constructed of plastic and / or other materials. In some examples, the second housing component may be configured to cover and / or contain one or more components of the current sensor 100.

[0057] Diagram 604 shows the coil winding. In some examples, the current sensor 100 may omit the coil winding. In other examples, the coil winding is included in the current sensor 100. The coil winding may be configured as follows: The coil winding may be disposed between the second housing component and the circuit board.

[0058] Diagram 606 shows a circuit board. The circuit board may include at least one Hall sensing element. The at least one Hall sensing element may be arranged so that it can be positioned within the gap 300 of the magnetic core 106 and / or within the chamber 104. The circuit board may further include other electrical components such as an application specific integrated circuit (ASIC), a controller element, etc. The circuit board may be disposed between the coil windings and the magnetic core 106.

[0059] Diagram 608 shows the magnetic core 106 and the spacer structure 108. The magnetic core 106 and the spacer structure 108 may be mechanically coupled such that at least one bend feature 402 of the spacer structure 108 snaps into the gap 300 of the magnetic core 106. The spacer structure 108 may be configured to stabilize the gap 300, allowing for consistent operation of the current sensor. The magnetic core 106 and the spacer structure 108 may be disposed between a circuit board and a first housing component.

[0060] Diagram 610 illustrates a portion of the housing 102. The portion of the housing 102 illustrated in Diagram 610 may be the first housing component (the "bottom" housing component). The first housing component may define one or more cavities for accommodating one or more components. For example, the first housing component may define a cavity configured to accommodate the magnetic core 106 and the spacer structure 108. For example, the first housing component may define a cavity configured to accommodate a material that at least partially surrounds the Hall sensing element. In some examples, the cavity configured to accommodate the material is the chamber 104.

[0061] The components of FIGS. 602-610 may be coupled to one another. For example, the magnetic core 106 and the spacer structure 108 may be mechanically coupled (e.g., snap-fit) with a cavity defined by the first housing component. A circuit board may be positioned proximate to the magnetic core 106. For example, a portion of the circuit board including the Hall sensing element may be snap-fit ​​into the gap 300 and / or chamber 104. The coil windings may be electrically coupled to the circuit board. The second housing component may be mechanically coupled to the first housing component via at least one snap feature included in the second housing component and / or the first housing component.

[0062] 7, a flow chart of an exemplary method 700 for manufacturing a current sensor is shown. The current sensor may be current sensor 100.

[0063] In step / operation 702, a housing (e.g., housing 102) may be configured with a chamber (e.g., chamber 104) for containing epoxy. The housing may include a first housing component (e.g., a "bottom" housing component) and / or a second housing component (e.g., a "top" housing component).

[0064] In step / operation 704, a generally circular magnetic core (eg, magnetic core 106) having a gap (eg, gap 300) configured to surround the chamber may be disposed within the housing.

[0065] In step / operation 706, a spacer structure (e.g., spacer structure 108) may be coupled to the generally circular magnetic core. The spacer structure may be constructed of metal. The spacer structure may be configured to stabilize a gap in the generally circular magnetic core.

[0066] In step / operation 708, a circuit board comprising at least one Hall sensing element may be coupled to the housing such that the circuit board is in close proximity to the generally circular magnetic core.

[0067] In step / action 710, the coil winding may be coupled to the housing such that the coil winding is proximate to the circuit board and the second housing component.

[0068] The operations and processes described herein support combinations of means for performing the specified functions and combinations of operations for performing the specified functions. It will be understood that one or more operations and combinations of operations may be implemented by a dedicated hardware-based computer system that performs the specified functions, or a combination of dedicated hardware and computer instructions.

[0069] In some exemplary embodiments, certain of the operations herein may be modified or further extended as described below. Furthermore, in some embodiments, additional optional operations may also be included. It should be understood that each of the modifications, optional additions, or extensions described herein may be included with the operations herein, either alone or in combination with any other of the features described herein.

[0070] The foregoing method and process descriptions are provided merely as examples and are not intended to require or imply that the steps of the various embodiments must be performed in the order presented. As will be understood by one of ordinary skill in the art, the order of steps in the foregoing embodiments may be performed in any order. Words such as "then," "then," "next," and similar words are not intended to limit the order of the steps. These words are merely used to guide the reader through the method descriptions. Furthermore, any reference to claim elements in the singular, for example, using the articles "a," "an," or "the," should not be construed as limiting the element to the singular but may, in some cases, be construed in the plural.

[0071] While various embodiments according to the principles disclosed herein have been shown and described above, modifications thereof can be made by those skilled in the art without departing from the teachings of the present disclosure. The embodiments described herein are merely representative and are not intended to be limiting. Many variations, combinations, and modifications are possible and fall within the scope of the present disclosure. Alternative embodiment(s) resulting from combining, integrating, and / or omitting features of the embodiments are also within the scope of the present disclosure. Accordingly, the scope of protection is not limited by the above description, but is defined by the claims that follow, including all equivalents of the subject matter of the claims. Each and every claim is incorporated herein as further disclosure, and the claims are embodiment(s) of the present disclosure. Furthermore, while any advantages and features described above may relate to particular embodiments, application of such issued claims is not limited to processes and structures achieving any or all of the above advantages or having any or all of the above features.

[0072] Additionally, the section headings used herein are provided to conform to the proposition under Title 37, Code of Federal Regulations, Section 1.77, or to otherwise provide organizational guidance. These headings do not limit or characterize the disclosure set forth in any claims that may issue from this disclosure. For example, the description of a technology in the "Background" section should not be construed as an admission that a particular technology is prior art to any disclosure in this disclosure. The "Summary" section should also not be considered a limiting feature of the disclosure that will be set forth in the claims to be issued. Furthermore, any reference in this disclosure to the singular "disclosure" or "embodiments" should not be used to assert a single point of novelty in the disclosure. Multiple embodiments of the disclosure may be set forth according to the limitations of the multiple claims that issue from this disclosure, and such claims therefore define the disclosure and their equivalents protected thereby. In all cases, the scope of the claims should be considered on their own merits in light of this disclosure, but should not be constrained by the headings set forth herein.

[0073] Additionally, the systems, subsystems, devices, techniques, and methods described and illustrated in various embodiments, individually or separately, may be combined or integrated with other systems, modules, techniques, or methods without departing from the scope of the present disclosure. Other devices or components shown or described as coupled or in communication with each other may be indirectly coupled through some intermediate device or component, whether electrical, mechanical, or otherwise. Other examples of changes, substitutions, and alterations will be ascertainable by those skilled in the art and may be made without departing from the scope disclosed herein.

[0074] Many modifications and other embodiments of the disclosure described herein will come to mind to one skilled in the art to which these embodiments pertain having the benefit of the teachings presented in the foregoing descriptions and the associated figures. While the figures illustrate only certain components of the devices and systems described herein, various other components may be used in conjunction with the components and structures disclosed herein. It is to be understood, therefore, that the disclosure is not limited to the particular embodiments disclosed, and that modifications and other embodiments are intended to be included within the scope of the appended claims. For example, various elements or components may be combined, rearranged, or integrated in another system, or certain features may be omitted, or not implemented. Moreover, the steps in any method described above need not necessarily occur in the order depicted in the accompanying figures; in some cases, one or more of the depicted steps may occur substantially concurrently or may involve additional steps. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

Claims

1. A device, A housing constructed from plastic, the housing comprising a first housing component and a second housing component, the housing comprising: a chamber configured to contain the epoxy; a magnetic core configured in a C-shape, the magnetic core defining a gap configured to surround the chamber; and a spacer structure mechanically coupled to the magnetic core, the spacer structure configured to stabilize the gap of the magnetic core; and a Hall sensing element contained within the chamber and surrounded by the epoxy.

2. 10. The device of claim 1, wherein the spacer structure comprises at least one protruding feature extending at least a portion of a height of the housing, the at least one protruding feature configured to protect the epoxy from contaminants on the magnetic core, and the spacer structure is constructed from metal.

3. 10. The device of claim 1, wherein the epoxy is configured to cure at or above 125 degrees Celsius, the epoxy is configured to surround the Hall sensing element, and the epoxy is configured to protect the Hall sensing element from contaminants and temperatures up to, at, or above 125 degrees Celsius.

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